JP7064524B2 - Oscillator modules, electronic devices and mobiles - Google Patents

Description

The present invention relates to oscillation modules, electronic devices and mobile objects.

Patent Document 1 describes a differential amplifier for oscillation composed of an ECL line receiver, a differential amplifier for a feedback buffer composed of an ECL line receiver and whose output terminal is terminated by an emitter termination resistor, a switch circuit, and a voltage. It is composed of a controlled phase shift circuit, a SAW resonator having a predetermined resonance frequency, and an impedance circuit, and at least a differential amplifier for oscillation, a differential amplifier for a feedback buffer, a voltage controlled phase shift circuit, and a SAW resonator. Discloses an oscillation circuit in which a positive feedback oscillation loop is formed. According to this oscillation circuit, by changing the emitter termination resistance of the differential amplifier for feedback buffer to increase the drive level of the SAW resonator, the amplitude of the signal from the SAW resonator is compared with the noise superimposed on it. It becomes relatively large. In other words, since the SN ratio can be large, it is possible to reduce the jitter caused by the noise superimposed on the signal from the SAW resonator.

Japanese Unexamined Patent Publication No. 2004-040509

This oscillation circuit outputs an oscillation signal with a frequency (fundamental frequency) near the resonance frequency of the SAW resonator, but it is also possible to generate a signal with a frequency of N times by providing a multiplication circuit in the subsequent stage. The oscillation signal output by this multiplication circuit includes a fundamental frequency component in addition to the N times frequency component, but by providing a filter circuit after the multiplication circuit, the fundamental frequency component can be reduced. In such a case, the coil included in the oscillation circuit and the coil included in the filter circuit may be magnetically coupled to deteriorate the oscillation signal.

The present invention has been made in view of the above problems, and according to some aspects of the present invention, the deterioration of the oscillating signal due to the influence of the magnetic field coupling generated between the oscillating circuit and the filter circuit is deteriorated. It is possible to provide an oscillation module that can be reduced. Further, according to some aspects of the present invention, it is possible to provide an electronic device and a mobile body using the oscillation module.

The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following aspects or application examples.

[Application Example 1]
The oscillation module according to this application example includes an oscillation circuit having a first coil and a second coil, and a filter circuit provided after the oscillation circuit and having a third coil. The first coil, the second coil, and the third coil are a part of the integrated circuit, and in the plan view of the integrated circuit, the third coil is the center of the first coil. It is arranged so as to intersect a virtual straight line at an equal distance from the center of the second coil.

In the oscillation module according to this application example, the direction of the magnetic field generated by the first coil and the second coil are generated on a virtual straight line equidistant from the center of the first coil and the center of the second coil. The directions of the magnetic fields are reversed and they weaken each other. Therefore, according to the oscillation module according to this application example, deterioration of the oscillation signal due to the influence of the magnetic field coupling between the first coil and the second coil of the oscillation circuit and the third coil of the filter circuit can be reduced. Can be done.

[Application example 2]
In the oscillation module according to the above application example, the oscillation circuit includes a variable capacitance element, the variable capacitance element is a part of the integrated circuit, and in a plan view of the integrated circuit, the variable capacitance element is the said. It may be arranged between the first coil and the second coil.

According to the oscillation module according to this application example, when the third coil is brought close to the first coil and the second coil, it is affected by the magnetic field generated by the first coil and the magnetic field generated by the second coil. Although it becomes easier, by arranging a variable capacitance element that is not easily affected by the magnetic field between the first coil and the second coil, deterioration of the oscillation signal is reduced while suppressing an unnecessary increase in the layout area. Can be made to.

[Application example 3]
In the oscillation module according to the above application example, the oscillation circuit includes a differential amplifier, the differential amplifier is a part of the integrated circuit, and in a plan view of the integrated circuit, the differential amplifier is the said. It may be arranged between the variable capacitance element and the third coil.

According to the oscillation module according to this application example, a variable capacitance element is arranged between the first coil and the second coil, and a differential amplifier is provided between the variable capacitance element and the third coil. Since they are arranged, the distance between the first coil and the second coil and the third coil can be increased while suppressing an unnecessary increase in the layout area. Therefore, according to the oscillation module according to this application example, the magnetic field coupling between the first coil and the second coil and the third coil of the filter circuit becomes smaller, so that the oscillation signal is deteriorated due to the influence of the magnetic field coupling. Can be further reduced.

[Application example 4]
In the oscillation module according to the above application example, the integrated circuit includes a first pad connected to the first coil and a second pad connected to the second coil. The distance between the first coil and the first pad is shorter than the distance between the third coil and the first pad, and the distance between the second coil and the second pad is , It may be shorter than the distance between the third coil and the second pad.

According to the oscillation module according to this application example, the length of the wiring connecting the first pad and the first coil and the length of the wiring connecting the second pad and the second coil can be shortened. can. Further, according to the oscillation module according to this application example, since the first pad and the second pad can be separated from the third coil, the frequency component of the current flowing through the first coil and the second coil can be separated. However, it is possible to reduce the possibility of being coupled to the current flowing through the third coil via the first pad and the second pad. Therefore, according to the oscillation module according to this application example, the deterioration of the oscillation signal can be further reduced.

[Application Example 5]
In the oscillation module according to the above application example, the oscillation circuit has a SAW filter having a first input port, a second input port, a first output port, and a second output port. The first pad may be connected to the first output port, and the second pad may be connected to the second output port.

According to this application example, it is possible to reduce the deterioration of the oscillation signal due to the influence of the magnetic field coupling.
An AW oscillator can be realized.

[Application example 6]
In the oscillation module according to the above application example, the signal propagating from the first output port to the first input port and the signal propagating from the second output port to the second input port are in opposite phase to each other. It may be.

According to the oscillation module according to this application example, since the pair of signals propagating on the feedback path in the oscillation circuit is a differential signal, the first differential amplifier causes the pair of signals (differential signal). Is amplified, and the power supply noise superimposed as common mode noise is greatly reduced. Therefore, according to the oscillation module according to this application example, the frequency accuracy and S / N of the oscillation signal can be improved.

[Application 7]
In the oscillation module according to the above application example, the oscillation circuit may operate differentially.

According to the oscillation module according to this application example, since the oscillation circuit operates differentially, the power supply noise superimposed as common mode noise on the pair of signals (oscillation signal) propagating on the feedback path in the oscillation circuit is large. It will be reduced. Therefore, according to the oscillation module according to this application example, the frequency accuracy and S / N of the oscillation signal can be improved.

[Application Example 8]
The oscillation module according to the above application example includes an output circuit provided after the filter circuit, and the oscillation circuit outputs a differential signal and is on a signal path from the oscillation circuit to the output circuit. Some circuits may operate differentially.

According to the oscillation module according to this application example, the power supply noise generated by the operation of the oscillation circuit is superimposed as the common mode noise on the differential signal input to each circuit provided in the subsequent stage of the oscillation circuit. Each circuit can output a differential signal with greatly reduced power supply noise by operating differentially. Therefore, according to the oscillation module according to this application example, it is possible to output an oscillation signal with high frequency accuracy with reduced deterioration due to the influence of power supply noise.

[Application 9]
The electronic device according to this application example includes any of the above oscillation modules.

[Application Example 10]
The moving body according to this application example includes any of the above oscillation modules.

According to these application examples, since the oscillation module capable of reducing the deterioration of the oscillation signal due to the influence of the magnetic field coupling generated between the oscillation circuit and the filter circuit is provided, for example, a highly reliable electronic device is provided. And it is also possible to realize a moving body.

The perspective view of the oscillation module 1 of this embodiment. FIG. 3 is a cross-sectional view of the oscillation module 1 cut at AA'in FIG. FIG. 3 is a cross-sectional view of the oscillation module 1 cut at BB'in FIG. The plan view of the SAW filter 2 and the integrated circuit 3. The explanatory view of the effect of the oscillation module 1 of this embodiment. The block diagram which shows an example of the functional structure of the oscillation module 1 of this embodiment. The figure which shows an example of the circuit structure of a differential amplifier 20. The figure which shows an example of the input / output waveform of SAW filter 2. The figure which shows an example of the circuit structure of a differential amplifier 40. The figure which shows an example of the circuit structure of the multiplication circuit 60. The figure which shows an example of the circuit structure of a high-pass filter 70. The figure which shows an example of the frequency characteristic of a high-pass filter 70. The figure which shows an example of the circuit structure of an output circuit 80. The figure which shows an example of the layout arrangement of an integrated circuit 3. Enlarged view of a part of the layout arrangement of the integrated circuit 3. The figure which shows the arrangement example of the coil 74 in the modification. The figure which shows the arrangement example of the coil 74 in another modification. The functional block diagram which shows an example of the structure of the electronic device 300 of this embodiment. The figure which shows an example of the moving body 400 of this embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unreasonably limit the content of the present invention described in the claims. Moreover, not all of the configurations described below are essential constituent requirements of the present invention.

1. 1. Oscillation module 1-1. Structure of Oscillation Module FIG. 1 is a diagram showing an example of the structure of the oscillation module 1 of the present embodiment, and is a perspective view of the oscillation module 1. Further, FIG. 2 is a cross-sectional view of the oscillation module 1 cut at AA'of FIG. 1, and FIG. 3 is a cross-sectional view of the oscillation module 1 cut at BB'of FIG. Although FIGS. 1 to 3 show the oscillation module 1 without a lid, the oscillation module 1 is actually covered with a lid (lid) (not shown) to open the package 4. Is configured.

As shown in FIG. 1, the oscillation module 1 of the present embodiment is a SAW (Surface Acoustic Wave) oscillator, and includes a SAW filter (surface acoustic wave filter) 2, an integrated circuit (IC) 3, and a package 4. It is composed of.

The package 4 is a laminated package such as a ceramic package, and accommodates the SAW filter 2 and the integrated circuit 3 in the same space. Specifically, an opening is provided in the upper part of the package 4, and a storage chamber is formed by covering the opening with a lid (lid) (not shown), and the SAW filter 2 and the integrated are stored in the storage chamber. Circuit 3 is housed.

As shown in FIG. 2, the lower surface of the integrated circuit 3 is adhesively fixed to the upper surface of the first layer 4A of the package 4. Then, each electrode (pad) 3B provided on the upper surface of the integrated circuit 3 and each electrode 6B provided on the upper surface of the second layer 4B of the package 4 are bonded by a wire 5B, respectively.

One end of the SAW filter 2 is fixed to the package 4. More specifically, in the SAW filter 2, the lower surface of one end (first end) 2A in the longitudinal direction is adhesively fixed to the upper surface of the third layer 4C of the package 4 by the adhesive 7. Further, the other end portion (second end portion) 2B in the longitudinal direction of the SAW filter 2 is not fixed, and a gap is provided between the second end portion 2B and the inner surface of the package 4. That is, the SAW filter 2 is cantilevered and fixed to the package 4.

As shown in FIG. 1, the upper surface of the SAW filter 2 functions as a first input port IP1, a second input port IP2, a first output port OP1 and a second output port OP2 at the first end 2A. Four electrodes are provided. Then, as shown in FIGS. 1 and 3, the first input port IP1 of the SAW filter 2, the second input port IP2, the first output port OP1, the second output port OP2, and the third layer of the package 4. The four electrodes 6A provided on the upper surface of the 4C are bonded by the wire 5A, respectively.

Inside the package 4, wiring (not shown) for electrically connecting the four electrodes 6A and the predetermined four electrodes 6B is provided. That is, the first input port IP1, the second input port IP2, the first output port OP1 and the second output port OP2 of the SAW filter 2 pass through the wire 5A, the wire 5B, and the internal wiring of the package 4. It is connected to each of four different electrodes (pads) 3B of the integrated circuit 3.

Further, a plurality of external electrodes (not shown) that function as a power supply terminal, a ground terminal, or an output terminal are provided on the surface (outer surface) of the package 4, and each of the plurality of external electrodes is provided inside the package 4. Wiring (not shown) is also provided for electrically connecting the and each of the predetermined plurality of electrodes 6B.

FIG. 4 is a plan view of the SAW filter 2 and the integrated circuit 3 when the oscillation module 1 of FIG. 1 is viewed in a plan view from the upper surface thereof.

As shown in FIG. 4, the SAW filter 2 includes a first IDT (Interdigital Transducer) 201, a second IDT 202, a first reflector 203, and a second IDT (Interdigital Transducer) 201 provided on the surface of the piezoelectric substrate 200. It has a reflector 204.

The piezoelectric substrate 200 may be a single crystal material such as a crystal, lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ , LBO), zinc oxide (ZnO), or the like. , A piezoelectric thin film such as aluminum nitride (AlN), a piezoelectric ceramic material, or the like can be used for production.

The first IDT 201 and the second IDT 202 are located between the first reflector 203 and the second reflector 204, and are two comb-shaped electrodes each having a plurality of electrode fingers provided at regular intervals. Are arranged facing each other so as to be interleaved with each other. Then, as shown in FIG. 2, the electrode finger pitch of the first IDT 201 and the electrode finger pitch of the _second IDT 202 are both constant values d1.

Further, the SAW filter 2 includes a first input port IP1 connected to the first IDT201 and a second input port IP2 connected to the first IDT201 provided on the surface of the piezoelectric substrate 200. It has a first output port OP1 connected to the second IDT202 and a second output port OP2 connected to the second IDT202.

Specifically, a first wiring 205 and a second wiring 206 are provided on the surface of the piezoelectric substrate 200, and the first input port IP1 is connected to the first IDT 201 by the first wiring 205. It is connected to one electrode (upper electrode in FIG. 4) and the second input port IP2 is connected to the other electrode of the first IDT 201 (lower electrode in FIG. 4) by a second wire 206. There is. Further, a third wiring 207 and a fourth wiring 208 are provided on the surface of the piezoelectric substrate 200, and the first output port OP1 is connected to one electrode of the second IDT 202 by the third wiring 207. It is connected to (upper electrode in FIG. 4) and the second output port OP2 is connected to the other electrode of the second IDT 202 (lower electrode in FIG. 4) by a fourth wire 208.

In the SAW filter 2 configured as described above, f = v / (2d ₁ ) (v is the speed at which the surface acoustic wave propagates on the surface of the piezoelectric substrate 200) from the first input port IP1 and the second input port IP2. When an electric signal having a frequency in the vicinity is input, a surface acoustic wave having a wavelength equal to 2d1 is excited by the _first IDT201. Then, the surface acoustic wave excited by the first IDT 201 is reflected between the first reflector 203 and the second reflector 204 to become a standing wave. This standing wave is converted into an electric signal in the second IDT202 and output from the first output port OP1 and the second output port OP2. That is, the SAW filter 2 functions as a narrow band bandpass filter having a center frequency of f = v / (2d ₁ ).

In this embodiment, as shown in FIG. 4, at least a part of the SAW filter 2 overlaps with the integrated circuit 3 in a plan view. Further, in a plan view, the first end portion 2A of the SAW filter 2 (the portion shaded in FIG. 4) does not overlap with the integrated circuit 3. As described above, in the present embodiment, the SAW filter 2 is cantilevered by fixing the first end portion 2A to the package 4, and the integrated circuit 3 is arranged in the space formed below the SAW filter 2. , The size of the oscillation module 1 has been reduced.

Further, according to the oscillation module 1 of the present embodiment, since the first end portion 2A which is a part of the SAW filter 2 is fixed to the package 4 instead of the entire surface, the area of the fixed portion is small. There are few parts that are easily deformed by the stress applied from the package 4. Therefore, according to the oscillation module 1 of the present embodiment, it is possible to reduce the deterioration of the oscillation signal due to the stress applied to the SAW filter 2.

Further, since the back surface of the piezoelectric substrate 200 in the first end 2A of the SAW filter 2 is fixed to the package 4 by the adhesive 7, the first end 2A is easily deformed by the shrinkage of the adhesive 7. Therefore, in the present embodiment, as shown in FIG. 4, the first IDT201, the second IDT202, the first reflector 203, and the second reflector 204 are the surfaces of the piezoelectric substrate 200 at the first end portion 2A. Not provided in. As a result, the deformation of the first IDT201 and the second IDT202 is greatly alleviated. Therefore, according to the present embodiment, it is possible to reduce the error with respect to the target value of the electrode finger pitch d1 caused by the deformation of the _first IDT 201 and the second IDT 202 due to the stress due to the shrinkage of the adhesive 7. An oscillation module 1 with high frequency accuracy can be realized.

Further, in the present embodiment, by cantilevering the SAW filter 2, stress due to contact with the package 4 is not applied to the second end portion 2B which is a free end. Therefore, according to the present embodiment, the first IDT 201 and the second IDT 202 are not deformed due to the stress caused by the contact with the package 4, so that the oscillation module 1 with high frequency accuracy can be realized.

Further, in the present embodiment, the first input port IP1, the second input port IP2, the first output port OP1 and the second output port OP2 whose characteristics do not change due to deformation are the first end portions of the SAW filter 2. It is provided on the surface of the piezoelectric substrate 200 in 2A. This prevents the SAW filter 2 from becoming unnecessarily large, and makes it possible to reduce the size of the oscillation module 1.

Further, in the present embodiment, as shown in FIG. 4, the SAW filter 2 has a rectangular shape having a long side 2X and a short side 2Y, and has a first input port IP1 and a second input port IP2 in a plan view. The first output port OP1 and the second output port OP2 are arranged along the long side 2X of the SAW filter 2. Therefore, according to the present embodiment, as shown in FIG. 1, outside the SAW filter 2, the first input port IP1, the second input port IP2, the first output port OP1, and the second output port Since all four wires 5A connected to each of OP2 can be provided on the long side 2X side, the space on the long side of the SAW filter 2 inside the package 4 can be efficiently used, and the space on the short side can be used. Since it can be made smaller, the oscillation module 1 can be made smaller.

Further, in the present embodiment, as shown in FIG. 4, in a plan view, the first input port IP1 and the second input port IP2 are arranged equidistantly from the long side 2X, and the first output port. OP1 and the second output port OP2 are arranged equidistant from the long side 2X. Therefore, according to the present embodiment, it is easy to align the length of the wiring (wire 5A and the board wiring) connected to the first input port IP1 and the length of the wiring connected to the second input port IP2, and the first. It is easy to match the length of the wiring connected to the output port OP1 of the above and the length of the wiring connected to the second output port OP2, and the phase difference of the differential signal input or output to the SAW filter 2 is from 180 °. The deviation can be reduced.

Further, in the present embodiment, as shown in FIG. 4, in a plan view, the first input port IP1, the second input port IP2, the first output port OP1 and the second output port OP2 are from the long side 2X. They are located equidistantly. Therefore, it is easy to align the heights of the four wires 5A connected to each of the first input port IP1, the second input port IP2, the first output port OP1, and the second output port OP2. In particular, in the present embodiment, the first input port IP1, the second input port IP2, the first output port OP1 and the second output port OP2 are provided at positions close to the long side 2X along the long side 2X. Therefore, as shown in the cross-sectional view on the left side of FIG. 5 (cross-sectional view in which a part of FIG. 3 is illustrated), the height H1 from the upper surface of the SAW filter 2 to the highest portion of the wire 5A can be reduced. can. On the right side of FIG. 5, a cross section when the first input port IP1, the second input port IP2, the first output port OP1 and the second output port OP2 are provided at positions farther from the long side 2X. The figure is shown, and the height H2 from the upper surface of the SAW filter 2 to the highest portion of the wire 5A is larger than that of H1. As described above, according to the present embodiment, since the wire 5A can be lowered, the size of the package 4 in the height direction can be reduced, and the oscillation module 1 can be miniaturized.

Further, in the present embodiment, as shown in FIG. 4, in a plan view, in the direction along the long side 2X, the first input port IP1, the first output port OP1, the second output port OP2, and the second They are arranged in the order of input port IP2. As a result, when the first IDT 201 and the second IDT 202 are arranged in the direction along the long side 2X, the first wiring 205, the second wiring 206, the third wiring 207, and the fourth wiring 208 Can be easily provided without intersecting each other, and the length of these wirings can be shortened.

The SAW filter 2 is not limited to the configuration shown in FIG. 4, and is, for example, a transversal SAW filter that does not have a reflector and in which a surface acoustic wave propagates between an IDT for input and an IDT for output. May be good.

1-2. Functional Configuration of Oscillation Module FIG. 6 is a block diagram showing an example of the functional configuration of the oscillation module 1 of the present embodiment. As shown in FIG. 6, the oscillation module 1 of the present embodiment includes a SAW filter 2, a phase shift circuit 10, a differential amplifier 20 (first differential amplifier), a capacitor 32, a capacitor 34, and a differential amplifier 40 (first differential amplifier). 2 differential amplifier), a capacitor 52, a capacitor 54, a multiplication circuit 60, a high-pass filter 70 (filter circuit), and an output circuit 80. The oscillation module 1 of the present embodiment may be configured such that a part of these elements is omitted or changed, or another element is added as appropriate.

The phase shift circuit 10, the differential amplifier 20, the capacitor 32, the capacitor 34, the differential amplifier 40, the capacitor 52, the capacitor 54, the multiplication circuit 60, the high-pass filter 70, and the output circuit 80 are included in the integrated circuit 3. That is, each of these circuits is a part of the integrated circuit 3.

The first output port OP1 of the SAW filter 2 is connected to the input terminal T1 of the integrated circuit 3. Further, the second output port OP2 of the SAW filter 2 is connected to the input terminal T2 of the integrated circuit 3. Further, the first input port IP1 of the SAW filter 2 is connected to the output terminal T3 of the integrated circuit 3. Further, the second input port IP2 of the SAW filter 2 is connected to the output terminal T4 of the integrated circuit 3.

The power supply terminal T7 of the integrated circuit 3 is connected to a VDD terminal which is an external terminal (external electrode provided on the surface of the package 4) of the oscillation module 1, and a desired power supply is connected to the power supply terminal T7 via the VDD terminal. An electric potential is supplied. Further, the ground terminal T8 of the integrated circuit 3 is connected to a VSS terminal which is an external terminal of the oscillation module 1, and a ground potential (0V) is supplied to the ground terminal T8 via the VSS terminal. The phase shift circuit 10, the differential amplifier 20, the capacitor 32, the capacitor 34, the differential amplifier 40, the capacitor 52, the capacitor 54, the multiplication circuit 60, the high pass filter 70, and the output circuit 80 are the power supply terminal T7 and the ground terminal T8. It operates with the potential difference between them as the power supply voltage. The power supply terminals and the ground terminals of the differential amplifier 20, the differential amplifier 40, the multiplication circuit 60, the high-pass filter 70, and the output circuit 80 are connected to the power supply terminal T7 and the ground terminal T8, respectively. The illustration is omitted in.

The phase shift circuit 10 and the differential amplifier 20 are provided on the feedback path from the first output port OP1 and the second output port OP2 of the SAW filter 2 to the first input port IP1 and the second input port IP2. ing.

The phase shift circuit 10 has a coil 11 (first coil), a coil 12 (second coil), and a variable capacitance element 13. The inductance of the coil 11 and the inductance of the coil 12 may be the same (differences due to manufacturing variations are acceptable) or the same.

One end of the coil 11 is connected to the input terminal T1 of the integrated circuit 3, and the other end of the coil 11 is connected to one end of the variable capacitance element 13 and the non-inverting input terminal of the differential amplifier 20. Further, one end of the coil 12 is connected to the input terminal T2 of the integrated circuit 3, and the other end of the coil 12 is connected to the other end of the variable capacitance element 13 and the inverting input terminal of the differential amplifier 20.

The variable capacitance element 13 may be, for example, a varicap (also referred to as a varicap or a variable capacitance diode) whose capacitance value changes according to an applied voltage, a plurality of capacitors, and at least one of the plurality of capacitors. The circuit may include a plurality of switches for selecting a unit, and the capacitance value may be switched according to the selected capacitor by opening and closing the plurality of switches according to the selection signal.

The differential amplifier 20 amplifies the potential difference between the pair of signals input to the non-inverting input terminal and the inverting input terminal, and outputs the pair of signals from the non-inverting output terminal and the inverting output terminal. The non-inverting output terminal of the differential amplifier 20 is connected to the output terminal T3 of the integrated circuit 3 and one end of the capacitor 32. Further, the inverting output terminal of the differential amplifier 20 is connected to the output terminal T4 of the integrated circuit 3 and one end of the capacitor 34.

FIG. 7 is a diagram showing an example of the circuit configuration of the differential amplifier 20. In the example of FIG. 7, the differential amplifier 20 has a resistor 21, a resistor 22, and an IGMP (Negative-channel Metal Oxide Semiconductor).
) Transistor 23, an OSPF transistor 24, a constant current source 25, an IGMP transistor 26, an MIMO transistor 27, a resistor 28 and a resistor 29 are included. In FIG. 7, for example, the input terminal IP20 is a non-inverting input terminal, and the input terminal IN20 is an inverting input terminal. Further, the output terminal OP20 is a non-inverting output terminal, and the output terminal ON20 is an inverting output terminal.

In the MIMO transistor 23, the gate terminal is connected to the input terminal IP20, the source terminal is connected to one end of the constant current source 25, and the drain terminal is connected to the power supply terminal T7 (see FIG. 6) via the resistor 21.

The OFDM transistor 24 has a gate terminal connected to an input terminal IN20, a source terminal connected to one end of a constant current source 25, and a drain terminal connected to a power supply terminal T7 (see FIG. 6) via a resistor 22.

The other end of the constant current source 25 is connected to the ground terminal T8 (see FIG. 6).

In the MIMO transistor 26, the gate terminal is connected to the drain terminal of the MIMO transistor 23, the source terminal is connected to the ground terminal T8 (see FIG. 6) via the resistor 28, and the drain terminal is connected to the power supply terminal T7 (see FIG. 6). It is connected.

In the MIMO transistor 27, the gate terminal is connected to the drain terminal of the MIMO transistor 24, the source terminal is connected to the ground terminal T8 (see FIG. 6) via the resistor 29, and the drain terminal is connected to the power supply terminal T7 (see FIG. 6). It is connected.

Further, the source terminal of the nanotube transistor 26 is connected to the output terminal OP20, and the source terminal of the nanotube transistor 27 is connected to the output terminal ON20.

The differential amplifier 20 configured in this way amplifies a pair of signals input to the input terminal IP20 and the input terminal IN20 in a non-inverting manner, and outputs the signals from the output terminal OP20 and the output terminal ON20.

Returning to FIG. 6, in the present embodiment, the SAW filter 2, the phase shift circuit 10, and the differential amplifier 20 are used to provide the first output port OP1 and the second output port OP2 to the first input port IP1 of the SAW filter 2. A pair of signals propagates on the signal path leading to the second input port IP2 to form a closed loop of positive feedback, and the pair of signals becomes an oscillation signal. That is, the oscillation circuit 100 is configured by the SAW filter 2, the phase shift circuit 10, and the differential amplifier 20. The oscillation circuit 100 may be configured such that a part of these elements is omitted or changed, or another element is added as appropriate.

The waveform of the signal (frequency f ₀ ) output from the first output port OP1 of the SAW filter 2 is shown by a solid line in the upper part of FIG. 8, and the signal (frequency) output from the second output port OP2 of the SAW filter 2 is shown by a solid line. The waveform of f ₀ ) is shown by a broken line. Further, in the lower part of FIG. 8, the waveform of the signal (frequency f ₀ ) input to the first input port IP1 of the SAW filter 2 is shown by a solid line, and the signal input to the second input port IP2 of the SAW filter 2 is shown. The waveform of (frequency f ₀ ) is shown by a broken line.

As shown in FIG. 8, the signal (solid line) propagating from the first output port OP1 of the SAW filter 2 to the first input port IP1 and the second output port OP2 to the second input port IP2 of the SAW filter 2 The signals propagating to (broken line) are out of phase with each other. Here, "opposite to each other" is not limited to the case where the phase difference is exactly 180 °, for example, the SAW filter 2
The length of the wiring of the feedback path from the first output port OP1 to the first input port IP1 of the SAW filter 2 and the wiring of the feedback path from the first output port OP1 of the SAW filter 2 to the first input port IP1. The concept includes the case where the phase difference is different from 180 ° due to the difference in resistance and capacitance, the difference in the characteristics of the element of the differential amplifier 20 caused by the manufacturing error, and the like.

As described above, the oscillation circuit 100 of the present embodiment differentially differentials the differential signals (a pair of signals having opposite phases) output from the first output port OP1 and the second output port OP2 of the SAW filter 2. By amplifying it with the amplifier 20 and feeding it back to the first input port IP1 and the second input port IP2 of the SAW filter 2, a closed loop feedback path is configured and oscillation is performed. That is, the oscillation circuit 100 operates differentially and oscillates at a frequency f ₀ corresponding to the electrode finger pitch d ₁ of the first IDT 201 and the second IDT 202.

Then, a differential signal propagating on the feedback path from the first output port OP1 and the second output port OP2 of the SAW filter 2 to the first input port IP1 and the second input port IP2 is transmitted via the power supply line. Since the superimposed power supply noise is common mode noise, it is greatly reduced by the differential amplifier 20. Therefore, according to the oscillation circuit 100, deterioration of the oscillation signal due to the influence of power supply noise can be reduced, and the frequency accuracy and S / N of the oscillation signal can be improved.

Further, the oscillation circuit 100 of the present embodiment responds to the inductance of the coil 11 and the inductance of the coil 12 in the pass band of the SAW filter 2 by changing the capacitance value of the variable capacitance element 13 of the phase shift circuit 10. The frequency f ₀ of the oscillation signal can be changed with a variable width. The larger the inductance of the coil 11 and the inductance of the coil 12, the larger the variable width of the frequency f ₀ .

Further, in the oscillation circuit 100 of the present embodiment, currents having opposite phases flow through the coil 11 and the coil 12. Therefore, the direction of the magnetic field generated by the coil 11 and the direction of the magnetic field generated by the coil 12 are opposite to each other and weaken each other, so that deterioration of the oscillation signal due to the influence of the magnetic field can be reduced.

Further, the SAW resonator has a steep frequency characteristic with respect to the reactance, whereas the SAW filter 2 has a linear (gentle) frequency characteristic with respect to the reactance. Therefore, the oscillation circuit 100 of the present embodiment has a SAW resonator. It has an advantage that the variable range of the frequency _f0 can be easily controlled as compared with the oscillation circuit using the above.

Returning to FIG. 6, the oscillation module 1 is provided with a capacitor 32, a capacitor 34, a differential amplifier 40, a capacitor 52, a capacitor 54, a multiplication circuit 60, a high-pass filter 70, and an output circuit 80 after the oscillation circuit 100. There is.

One end of the capacitor 32 is connected to the non-inverting output terminal of the differential amplifier 20 (output terminal OP20 in FIG. 7), and the other end is connected to the non-inverting input terminal of the differential amplifier 40. Further, one end of the capacitor 34 is connected to the inverting output terminal of the differential amplifier 20 (output terminal ON20 in FIG. 7), and the other end is connected to the inverting input terminal of the differential amplifier 40. The capacitor 32 and the capacitor 34 function as capacitors for DC cutting, and are output from the non-inverting output terminal (output terminal OP20 in FIG. 7) and the inverting output terminal (output terminal ON20 in FIG. 7) of the differential amplifier 20. The DC component of each signal is removed.

The differential amplifier 40 is provided on the signal path from the oscillation circuit 100 to the multiplication circuit 60. The differential amplifier 40 outputs a differential signal obtained by amplifying a differential signal input to the non-inverting input terminal and the inverting input terminal from the non-inverting output terminal and the inverting output terminal.

FIG. 9 is a diagram showing an example of the circuit configuration of the differential amplifier 40. In the example of FIG. 9, the differential amplifier 40 includes a resistor 41, a resistor 42, an NaCl transistor 43, an NaCl transistor 44, and a constant current source 45. In FIG. 9, for example, the input terminal IP40 is a non-inverting input terminal, and the input terminal IN40 is an inverting input terminal. Further, the output terminal OP40 is a non-inverting output terminal, and the output terminal ON40 is an inverting output terminal.

In the MIMO transistor 43, the gate terminal is connected to the input terminal IP40, the source terminal is connected to one end of the constant current source 45, and the drain terminal is connected to the power supply terminal T7 (see FIG. 6) via the resistor 41.

The OFDM transistor 44 has a gate terminal connected to an input terminal IN40, a source terminal connected to one end of a constant current source 45, and a drain terminal connected to a power supply terminal T7 (see FIG. 6) via a resistor 42.

The other end of the constant current source 45 is connected to the ground terminal T8 (see FIG. 6).

Further, the drain terminal of the HCl transistor 43 is connected to the output terminal OP40, and the drain terminal of the nanotube transistor 44 is connected to the output terminal ON40.

The differential amplifier 40 configured in this way inverting and amplifies the differential signal input to the input terminal IP40 and the input terminal IN40, and outputs the amplified differential signal from the output terminal OP40 and the output terminal ON40. ..

Returning to FIG. 6, one end of the capacitor 52 is connected to the non-inverting output terminal of the differential amplifier 40 (output terminal OP40 of FIG. 9), and the other end is connected to the non-inverting input terminal of the multiplication circuit 60. Further, one end of the capacitor 54 is connected to the inverting output terminal of the differential amplifier 40 (output terminal ON40 in FIG. 9), and the other end is connected to the inverting input terminal of the multiplication circuit 60. The capacitor 52 and the capacitor 54 function as capacitors for DC cutting, and are output from the non-inverting output terminal (output terminal OP40 in FIG. 9) and the inverting output terminal (output terminal ON40 in FIG. 9) of the differential amplifier 40. The DC component of each signal is removed.

The multiplication circuit 60 operates differentially, and outputs a differential signal obtained by multiplying the frequency f ₀ of the differential signal input to the non-inverting input terminal and the inverting input terminal from the non-inverting output terminal and the inverting output terminal. ..

FIG. 10 is a diagram showing an example of the circuit configuration of the multiplication circuit 60. In the example of FIG. 10, the multiplying circuit 60 is configured to include a resistor 61, a resistor 62, an MIMO transistor 63, an IGMP transistor 64, an IGMP transistor 65, an IGMP transistor 66, an IGMP transistor 67, an SOI transistor 68 and a constant current source 69. ing. In FIG. 10, for example, the input terminal IP60 is a non-inverting input terminal, and the input terminal IN60 is an inverting input terminal. Further, the output terminal OP60 is a non-inverting output terminal, and the output terminal ON60 is an inverting output terminal.

In the MIMO transistor 63, the gate terminal is connected to the input terminal IP60, the source terminal is connected to the drain terminal of the MIMO transistor 65, and the drain terminal is connected to the power supply terminal T7 (see FIG. 6) via the resistor 61.

In the MIMO transistor 64, the gate terminal is connected to the input terminal IN60, the source terminal is connected to the drain terminal of the MIMO transistor 65, and the drain terminal is connected to the power supply terminal T7 (see FIG. 6) via the resistor 62.

In the MIMO transistor 65, the gate terminal is connected to the input terminal IP60, the source terminal is connected to one end of the constant current source 69, and the drain terminal is connected to the source terminal of the Now's transistor 63 and the source terminal of the nanotube transistor 64.

The nanotube transistor 66 has a gate terminal connected to an input terminal IN60, a source terminal connected to a drain terminal of the MIMO transistor 68, and a drain terminal connected to a power supply terminal T7 (see FIG. 6) via a resistor 61.

The nanotube transistor 67 has a gate terminal connected to an input terminal IP60, a source terminal connected to a drain terminal of the Now's transistor 68, and a drain terminal connected to a power supply terminal T7 (see FIG. 6) via a resistor 62.

In the NaCl transistor 68, the gate terminal is connected to the input terminal IN60, the source terminal is connected to one end of the constant current source 69, and the drain terminal is connected to the source terminal of the NaCl transistor 66 and the source terminal of the Now transistor 67.

The other end of the constant current source 69 is connected to the ground terminal T8 (see FIG. 6).

Further, the drain terminal of the MIMO transistor 63 and the drain terminal of the MIMO transistor 66 are connected to the output terminal OP60, and the drain terminal of the MIMO transistor 64 and the drain terminal of the MIMO transistor 67 are connected to the output terminal ON60.

The multiplying circuit 60 configured in this way generates a differential signal having a frequency of 2f ₀ , which is twice the frequency f ₀ of the differential signal input to the input terminal IP60 and the input terminal IN60, and and the output terminal OP60. Output from the output terminal ON60. In particular, the multiplication circuit 60 is a balanced modulation circuit, and in principle, a differential signal (f ₀ signal) input to the input terminal IP60 and the input terminal IN60 is output from the output terminal OP60 and the output terminal ON60. It is a configuration that is not done. According to this multiplication circuit 60, the signal component of _f0 output from the output terminal OP60 and the output terminal ON60 can be reduced, and the purity is high, even if the manufacturing variation of each HCl transistor and each resistor is taken into consideration. A 2f ₀ differential signal (high frequency accuracy) can be obtained, and the circuit area is relatively small.

Returning to FIG. 6, the non-inverting output terminal (output terminal OP60 in FIG. 10) of the multiplication circuit 60 is connected to the non-inverting input terminal of the high-pass filter 70. Further, the inverting output terminal of the multiplication circuit 60 (output terminal ON60 in FIG. 10) is connected to the inverting input terminal of the high-pass filter 70.

The high-pass filter 70 is provided on the signal path from the multiplication circuit 60 to the output circuit 80. The high-pass filter 70 operates differentially, and outputs a differential signal whose low frequency component is attenuated from the differential signal input to the non-inverting input terminal and the inverting input terminal from the non-inverting output terminal and the inverting output terminal. do.

FIG. 11 is a diagram showing an example of the circuit configuration of the high-pass filter 70. In the example of FIG. 11, the high-pass filter 70 includes a resistor 71, a capacitor 72, a capacitor 73, a coil 74 (third coil), a capacitor 75, a capacitor 76, and a resistor 77. In FIG. 11, for example, the input terminal IP70 is a non-inverting input terminal, and the input terminal IN70 is an inverting input terminal. Further, the output terminal OP70 is a non-inverting output terminal, and the output terminal ON70 is an inverting output terminal.

One end of the resistor 71 is connected to one end of the input terminal IP70 and the capacitor 72, and the other end is connected to one end of the input terminal IN70 and the capacitor 73.

One end of the capacitor 72 is connected to one end of the input terminal IP70 and the resistance 71, and the other end is connected to one end of the coil 74 and one end of the capacitor 75.

One end of the capacitor 73 is connected to the other end of the input terminal IN70 and the resistor 71, and the other end is connected to the other end of the coil 74 and one end of the capacitor 76.

One end of the coil 74 is connected to the other end of the capacitor 72 and one end of the capacitor 75, and the other end is connected to the other end of the capacitor 73 and one end of the capacitor 76.

One end of the capacitor 75 is connected to the other end of the capacitor 72 and one end of the coil 74, and the other end is connected to one end of the resistor 77.

One end of the capacitor 76 is connected to the other end of the capacitor 73 and the other end of the coil 74, and the other end is connected to the other end of the resistor 77.

One end of the resistor 77 is connected to the other end of the capacitor 75, and the other end is connected to the other end of the capacitor 76.

Further, the other end of the capacitor 75 and one end of the resistor 77 are connected to the output terminal OP70, and the other end of the capacitor 76 and the other end of the resistor 77 are connected to the output terminal ON70.

The high-pass filter 70 configured in this way generates a differential signal in which low-frequency components are attenuated from the differential signal input to the input terminal IP70 and the input terminal IN70, and the output terminal OP70 and the output terminal ON70 Output from.

FIG. 12 is a diagram showing an example of the frequency characteristics of the high-pass filter 70. In FIG. 12, the frequency spectrum of the output signal of the multiplication circuit 60, which is the input signal of the high-pass filter 70, is also shown by a broken line. In FIG. 12, the horizontal axis is frequency, and the vertical axis is gain (in the case of the frequency characteristic of the high-pass filter 70) or power (in the case of the frequency spectrum of the output signal of the multiplication circuit 60). As shown in FIG. 12, the resistance value of each resistor, the capacitance value of each capacitor, and the inductance value of the coil 74 are set so that the cutoff frequency f _c of the high-pass filter 70 is between f ₀ and 2 f ₀ . There is. As described above, the multiplication circuit 60 outputs a 2f ₀ differential signal having a small signal component of f ₀ and high purity (high frequency accuracy). Since the signal component of f ₀ lower than the cutoff frequency f _c is attenuated, a differential signal of 2 f ₀ with higher purity (high frequency accuracy) can be obtained.

Returning to FIG. 6, the non-inverting output terminal (output terminal OP70 in FIG. 11) of the high-pass filter 70 is connected to the non-inverting input terminal of the output circuit 80. Further, the inverting output terminal of the high-pass filter 70 (output terminal ON70 in FIG. 11) is connected to the inverting input terminal of the output circuit 80.

The output circuit 80 is provided after the multiplication circuit 60 and the high-pass filter 70. The output circuit 80 operates differentially, generates a differential signal obtained by converting a differential signal input to the non-inverting input terminal and the inverting input terminal into a signal having a desired voltage level (or current level), and generates a non-inverting signal. Output from the inverting output terminal and the inverting output terminal. The non-inverting output terminal of the output circuit 80 is connected to the output terminal T5 of the integrated circuit 3, and the inverting output terminal of the output circuit 80 is connected to the output terminal T6 of the integrated circuit 3. The output terminal T5 of the integrated circuit 3 is connected to the CP terminal which is an external terminal of the oscillation module 1, and the output terminal T6 of the integrated circuit 3 is connected to the CN terminal which is an external terminal of the oscillation module 1. Then, the differential signal (oscillation signal) converted by the output circuit 80 is output to the outside from the CP terminal and the CN terminal of the oscillation module 1 via the output terminal T5 and the output terminal T6 of the integrated circuit 3.

FIG. 13 is a diagram showing an example of the circuit configuration of the output circuit 80. In the example of FIG. 13, the output circuit 80 includes a differential amplifier 81, an NPN transistor 82, and an NPN transistor 83. In FIG. 13, for example, the input terminal IP80 is a non-inverting input terminal, and the input terminal IN80 is an inverting input terminal. Further, the output terminal OP80 is a non-inverting output terminal, and the output terminal ON80 is an inverting output terminal.

In the differential amplifier 81, the non-inverting input terminal is connected to the input terminal IP80, the inverting input terminal is connected to the input terminal IN80, the non-inverting output terminal is connected to the base terminal of the NPN transistor 82, and the inverting output terminal is an NPN transistor. It is connected to the base terminal of 83 and operates at the power supply voltage VDD supplied from the power supply terminal T7 (see FIG. 6) and the ground terminal T8.

In the NPN transistor 82, the base terminal is connected to the non-inverting output terminal of the differential amplifier 81, the collector terminal is connected to the power supply terminal T7 (see FIG. 6), and the emitter terminal is connected to the output terminal OP80.

In the NPN transistor 83, the base terminal is connected to the inverting output terminal of the differential amplifier 81, the collector terminal is connected to the power supply terminal T7 (see FIG. 6), and the emitter terminal is connected to the output terminal ON80.

The output circuit 80 configured in this way is a PECL (Positive Emitter Coupled Logic) circuit or an LV-PECL (Low-Voltage Positive Emitter Coupled Logic) circuit, and the output terminal OP80 and the output terminal ON80 are set to a predetermined potential V1. By pulling down, the differential signal input from the input terminal IP80 and the input terminal IN80 is converted into a differential signal with the high level set to VDD-VCE and the low level set to V1, and the output terminal _OP80 and the output terminal are displayed. Output from ON80. The _VCE is the collector-emitter voltage of the NPN transistor 82 or the NPN transistor 83.

According to the oscillation module 1 of the present embodiment described above, due to the operation of the oscillation circuit 100, each circuit (differential amplifier 40, multiplication circuit 60, high-pass filter 70, output circuit) after the oscillation circuit 100 Even if noise is superimposed on the power supply supplied to 80), all the circuits concerned operate differentially, so the power supply noise superimposed on the differential signal (oscillation signal) output by each circuit is called common mode noise. Become. Therefore, according to the oscillation module 1 of the present embodiment, it is possible to output an oscillation signal with reduced deterioration due to the influence of power supply noise generated by the operation of the oscillation circuit 100.

Further, according to the oscillation module 1 of the present embodiment, since the multiplication circuit 60 is provided after the oscillation circuit 100, the oscillation signal having the frequency obtained by multiplying the frequency of the oscillation signal output by the oscillation circuit 100 is output. can do.

Further, according to the oscillation module 1 of the present embodiment, since the oscillation circuit 100 operates differentially, the power supply superimposed as common mode noise on the differential signal (oscillation signal) propagating on the feedback path in the oscillation circuit 100. Noise is greatly reduced. Therefore, according to the oscillation module 1 of the present embodiment, the frequency accuracy and S / N of the oscillation signal can be improved.

Further, according to the oscillation module 1 of the present embodiment, since the multiplication circuit 60 is a balanced modulation circuit, in principle, a signal having the same frequency as the signal input to the multiplication circuit 60 is not output from the multiplication circuit 60 ( Only the signal obtained by multiplying the frequency of the input signal is output). Therefore, according to the oscillation module 1 of the present embodiment, an oscillation signal having a multiplied frequency with high frequency accuracy can be obtained.

Further, in the oscillation module 1 of the present embodiment, the oscillation circuit 100 outputs a differential signal, and the circuit on the signal path from the oscillation circuit 100 to the output circuit 80 (differential amplifier 40, multiplication circuit 60, and high-pass filter). 70) operates differentially. The power supply noise generated by the operation of the oscillation circuit 100 is superimposed as common mode noise on the differential signal input to each circuit via the power supply line. Therefore, each circuit operates differentially to supply power. It is possible to output a differential signal with greatly reduced noise. Similarly, the power supply noise (common mode noise) superimposed on the input signal of the output circuit 80 via the power supply line is also greatly reduced by operating the output circuit 80 differentially. As described above, the oscillation module 1 of the present embodiment can output an oscillation signal with high frequency accuracy in which deterioration due to the influence of power supply noise generated by the operation of the oscillation circuit 100 is reduced.

Further, according to the oscillation module 1 of the present embodiment, the amplification factor of the differential amplifier 20 provided in the oscillation circuit 100 and the amplification factor of the differential amplifier 40 provided in the subsequent stage of the oscillation circuit 100 are appropriately selected. By doing so, the frequency accuracy of the oscillation signal can be optimally designed. Further, according to the oscillation module 1 of the present embodiment, the signal of an unnecessary frequency component included in the oscillation signal output by the multiplication circuit 60 can be reduced by the high-pass filter 70, so that the frequency accuracy of the oscillation signal is improved. be able to.

1-3. Layout of integrated circuit In the oscillation module 1 of this embodiment, the layout of the integrated circuit 3 is devised in order to improve the frequency accuracy of the differential signal output from the integrated circuit 3. FIG. 14 is a diagram showing an example of layout arrangement of each circuit (excluding a part) included in the integrated circuit 3. FIG. 14 is a plan view of the integrated circuit 3 from a direction orthogonal to the plane on which various elements (transistors, resistors, etc.) are laminated on the semiconductor substrate. Further, FIG. 15 is an enlarged view of the input terminal T1, the input terminal T2, the phase shift circuit 10, the differential amplifier 20, and the high-pass filter 70 in the layout layout diagram of FIG. FIG. 15 also shows the layout arrangement and some wiring patterns of the coil 11, the coil 12, the variable capacitance element 13, and the coil 74 included in the high-pass filter 70 included in the phase shift circuit 10.

In FIG. 15, the virtual straight line VL is a straight line that passes through the midpoint P between the center O1 of the coil 11 and the center O2 of the coil 12 and is equidistant to the line segment L connecting the center O1 of the coil 11 and the center O2 of the coil 12, in other words. Then, it is a straight line equidistant from the center O1 of the coil 11 and the center O2 of the coil 12.

In the present embodiment, as shown in FIG. 15, in the plan view of the integrated circuit 3, the coil 74 is arranged so as to intersect the virtual straight line VL equidistant from the center O1 of the coil 11 and the center O2 of the coil 12. Has been done. As shown in FIG. 15, the coil 74 may be arranged so that its center O3 is on the virtual straight line VL. Assuming that the wiring pattern of the coil 11 and the wiring pattern of the coil 12 are the same, the current I1 flowing through the coil 11 and the current I2 flowing through the coil 12 are in opposite directions (opposite phases). That is, when the clockwise current I1 flows through the coil 11, the counterclockwise current I2 flows through the coil 12, and when the counterclockwise current I1 flows through the coil 11, the clockwise current I2 flows through the coil 12. Therefore, on the virtual straight line VL, the direction of the magnetic field generated by the coil 11 and the direction of the magnetic field generated by the coil 12 are opposite to each other and weaken each other. If the wiring pattern of the coil 11 and the wiring pattern of the coil 12 are the same, ideally, the inductance of the coil 11 and the inductance of the coil 12 are the same, and the currents I1 and the currents I2 are also the same. Actually, even if the wiring and the manufacturing variation of various elements are taken into consideration, the difference between the inductance of the coil 11 and the inductance of the coil 12 and the difference between the current I1 and the current I2 are small. The strength of the magnetic field generated by the coil 11 and the strength of the magnetic field generated by the coil 12 are substantially equal to each other and almost cancel each other out. Therefore, the level of the _f0 signal superimposed on the _2f0 signal output by the high-pass filter 70 is reduced by the magnetic field coupling between the coil 74 arranged so as to intersect the virtual straight line VL and the coil 11 and the coil 12. The oscillation module 1 can output an oscillation signal with high frequency accuracy.

Further, in the present embodiment, as shown in FIG. 15, the variable capacitance element 13 is arranged between the coil 11 and the coil 12 in the plan view of the integrated circuit 3. In this way, a variable capacitance element that is close to the coil 11 and the coil 12 and is easily affected by the magnetic field generated by the coil 11 and the magnetic field generated by the coil 12 and is not easily affected by the magnetic field between the coil 11 and the coil 12. By arranging 13, it is possible to suppress an unnecessary increase in the layout area. Further, since the wiring connecting the other end of the coil 11 and one end of the variable capacitance element 13 and the wiring connecting the other end of the coil 12 and the other end of the variable capacitance element 13 are both shortened, the layout area is reduced. At the same time, the parasitic capacitance and the parasitic resistance of these wirings can be reduced.

Further, in the present embodiment, as shown in FIG. 15, the differential amplifier 20 is arranged between the variable capacitance element 13 and the coil 74 in the plan view of the integrated circuit 3. With such a layout arrangement, the distance between the coil 11 and the coil 74 and the distance between the coil 12 and the coil 74 can be increased by the amount of the differential amplifier 20 while suppressing an unnecessary increase in the layout area. The strength of the magnetic field from the coil 11 and the strength of the magnetic field from the coil 12 received by the 74 become smaller. Therefore, the level of the signal of _f0 superimposed on the signal of _2f0 output by the high-pass filter 70 by the magnetic field coupling between the coil 11 and the coil 12 and the coil 74 can be further reduced, and the oscillation module 1 further reduces the level of the signal of f0. It is possible to output an oscillation signal with high frequency accuracy.

Further, by shortening the distance between the variable capacitance element 13 and the differential amplifier 20, as a result, the wiring for connecting the other end of the coil 11 and the non-inverting input terminal of the differential amplifier 20 and the coil 12 and others. Both the wiring connecting the end and the inverting input terminal of the differential amplifier 20 is shortened. Therefore, the layout area can be reduced, and the parasitic capacitance and resistance of the signal path from the other end of the coil 11 to the non-inverting input terminal of the differential amplifier 20 and the inverting of the differential amplifier 20 from the other end of the coil 12 Both the parasitic capacitance and the parasitic resistance of the signal path leading to the input terminal are reduced, and the deviation of the phase difference of the differential signal propagating through these two signal paths from 180 ° and the noise level superimposed on the differential signal are reduced. can do.

Further, in the present embodiment, as shown in FIG. 15, the distance (for example, the distance between the centers) between the coil 11 and the input terminal T1 (first pad) connected to the coil 11 by wiring is the coil 74. Is shorter than the distance between and the input terminal T1 (for example, the distance between the centers). Further, the distance between the coil 12 and the input terminal T2 (second pad) connected to the coil 12 by wiring (for example, the distance between the centers) is the distance between the coil 74 and the input terminal T2 (for example, between the centers). Distance) is shorter. With such a layout arrangement, the wiring connecting the input terminal T1 and the coil 11 and the wiring connecting the input terminal T2 and the coil 12 are shortened, so that the layout area can be reduced and the parasitic of these wirings can be reduced. The capacitance and parasitic resistance can be reduced. Therefore, both the parasitic capacitance and the parasitic resistance of the signal path from the input terminal T1 to one end of the coil 11 and the parasitic capacitance and the parasitic resistance of the signal path from the input terminal T2 to one end of the coil 12 become small, and these two signal paths are used. It is possible to reduce the deviation of the phase difference of the propagating differential signal from 180 ° and the noise level superimposed on the differential signal.

Further, due to such a layout arrangement, the distance between the input terminal T1 and the coil 74 and the distance between the input terminal T2 and the coil 74 (in other words, the distance between the output terminal of the high-pass filter 70) become long. Therefore, it is possible to reduce the possibility that the frequency component f ₀ of the current flowing through the coil 11 and the coil 12 is coupled to the current of the frequency 2f ₀ flowing through the coil 74 via the input terminal T1 and the input terminal T2. That is, the f ₀ signal input to the input terminal T1 and the input terminal T2 is unlikely to be superimposed on the 2f ₀ signal output by the high-pass filter 70, and the oscillation module 1 can output an oscillation signal with high frequency accuracy. can.

Further, in the present embodiment, as shown in FIG. 15, in the plan view of the integrated circuit 3, the differential amplifier 20 and the variable capacitance element 13 are equidistant from the center O1 of the coil 11 and the center O2 of the coil 12. It is arranged so as to intersect the virtual straight line VL. With such a layout arrangement, the length of the wiring connecting the other end of the coil 11 and the non-inverting input terminal of the differential amplifier 20 and the wiring connecting the other end of the coil 12 and the inverting input terminal of the differential amplifier 20. The difference from the length of the can be reduced. Similarly, the length of the wiring connecting one end of the variable capacitance element 13 and the non-inverting input terminal of the differential amplifier 20, and the wiring connecting the other end of the variable capacitance element 13 and the inverting input terminal of the differential amplifier 20. The difference from the length can be reduced. Therefore, there is a difference in parasitic capacitance and resistance between the signal path from the other end of the coil 11 to the non-inverting input terminal of the differential amplifier 20 and the signal path from the other end of the coil 12 to the inverting input terminal of the differential amplifier 20. It becomes smaller, and it is possible to reduce the deviation of the phase difference of the differential signal propagating in these two signal paths from 180 ° and the difference in the noise level superimposed on the differential signal. Therefore, the frequency accuracy and S / N of the oscillation signal output by the oscillation circuit 100 can be improved.

Further, in the present embodiment, as shown in FIG. 14, a differential amplifier 40 is provided near the differential amplifier 20, and a multiplication circuit 60 is provided near both the differential amplifier 40 and the high-pass filter 70. An output circuit 80 is provided near the high-pass filter 70, and an output terminal T5 and an output terminal T6 are provided near the output circuit 80. With such a layout arrangement, the wiring connecting each circuit can be shortened. Therefore, the layout area of the integrated circuit 3 can be reduced, and the phase difference of the differential signal propagating from the input terminal T1 and the input terminal T2 to the output terminal T5 and the output terminal T6 is deviated from 180 ° and the differential is concerned. The noise level superimposed on the signal can be reduced.

As described above, according to the oscillation module 1 of the present embodiment, by adopting the layout arrangement shown in FIGS. 14 and 15, the layout area of the integrated circuit 3 can be reduced (size reduction) and the frequency accuracy can be reduced. It is possible to achieve both high differential signal output.

1-4. Modification Example In the above embodiment, as shown in FIG. 15, the coil 74 is arranged so that its center O3 is on the virtual straight line VL, but the coil 74 is arranged so as to intersect the virtual straight line VL. As shown in FIGS. 16 and 17, the center O3 does not have to be on the virtual straight line VL.

Further, in the above embodiment, a member having an inductance on the feedback path from the first output port OP1 and the second output port OP2 of the SAW filter 2 to the first input port IP1 and the second input port IP2. By providing the coil 11 and the coil 12 as the above, the variable width of the oscillation frequency is widened. On the other hand, a member having another inductance may be provided on the feedback path in place of the coil 11 and the coil 12, or together with the coil 11 and the coil 12. Examples of the member having an inductance other than the coil include a bonding wire and a substrate wiring, and the oscillation circuit 100 can change the oscillation frequency with a variable width according to the inductance value of the bonding wire and the substrate wiring.

Further, in the oscillation module 1 of the present embodiment, a high-pass filter 70 having a cutoff frequency f _c higher than the frequency f ₀ and having a frequency 2 f ₀ in the pass band is provided after the multiplication circuit 60. , The cutoff frequency on the low frequency side may be higher than the frequency f ₀ , and may be replaced with a band pass filter containing the frequency 2 f ₀ in the pass band.

2. 2. Electronic device FIG. 18 is a functional block diagram showing an example of the configuration of the electronic device of the present embodiment. The electronic device 300 of the present embodiment includes an oscillation module 310, a CPU (Central Processing Unit) 320, an operation unit 330, a ROM (Read Only Memory) 340, a RAM (Random Access Memory) 350, a communication unit 360, and a display unit 370. It is composed of. The electronic device of the present embodiment may be configured such that a part of the component (each part) of FIG. 18 is omitted or changed, or another component is added.

The oscillation module 310 includes an oscillation circuit 312. The oscillation circuit 312 includes a SAW filter (not shown), and generates an oscillation signal having a frequency based on the resonance frequency of the SAW filter.

Further, the oscillation module 310 may include a multiplication circuit 314 and an output circuit 316 located after the oscillation circuit 312. The multiplication circuit 314 generates an oscillation signal obtained by multiplying the frequency of the oscillation signal generated by the oscillation circuit 312. Further, the output circuit 316 outputs the oscillation signal generated by the multiplication circuit 314 or the oscillation signal generated by the oscillation circuit 312 to the CPU 320. The oscillation circuit 312, the multiplication circuit 314, and the output circuit 316 may each operate differentially.

The CPU 320 performs various calculation processes and control processes using the oscillation signal input from the oscillation module 310 as a clock signal according to a program stored in the ROM 340 or the like. Specifically, the CPU 320 performs various processes according to the operation signal from the operation unit 330, processes for controlling the communication unit 360 for data communication with the external device, and causes the display unit 370 to display various information. Performs processing such as transmitting the display signal of.

The operation unit 330 is an input device composed of operation keys, button switches, and the like, and outputs an operation signal corresponding to the operation by the user to the CPU 320.

The ROM 340 stores programs, data, and the like for the CPU 320 to perform various calculation processes and control processes.

The RAM 350 is used as a work area of the CPU 320, and temporarily stores programs and data read from the ROM 340, data input from the operation unit 330, calculation results executed by the CPU 320 according to various programs, and the like.

The communication unit 360 performs various controls for establishing data communication between the CPU 320 and the external device.

The display unit 370 is a display device composed of an LCD (Liquid Crystal Display) or the like, and displays various information based on a display signal input from the CPU 320. The display unit 370 may be provided with a touch panel that functions as an operation unit 330.

By applying, for example, the oscillation circuit 100 of the above-described embodiment as the oscillation circuit 312, or by applying, for example, the oscillation module 1 of the above-described embodiment as the oscillation module 310, a highly reliable electronic device can be realized. ..

Various electronic devices can be considered as such electronic devices 300, for example, network devices such as optical transmission devices using optical fibers, broadcasting devices, communication devices used in artificial satellites and base stations, and GPS (Global Positioning). System) modules, personal computers (eg mobile personal computers, laptop personal computers, tablet personal computers), mobile terminals such as smartphones and mobile phones, digital cameras, inkjet ejection devices (eg inkjet printers), Storage area network equipment such as routers and switches, local area network equipment, mobile terminal base station equipment, televisions, video cameras, video recorders, car navigation devices, real-time clock devices, pagers, electronic notebooks (including those with communication functions) , Electronic dictionaries, calculators, electronic game devices, game controllers, word processors, workstations, videophones, security TV monitors, electronic binoculars, POS (Point Of Sale) terminals, medical devices (eg electronic thermometers, blood pressure monitors, blood glucose meters) , Electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish finder, various measuring devices, instruments (for example, vehicle, aircraft, ship instruments), flight simulator, head mount display, motion trace, motion Tracking, motion controller, PDR (pedestrian position and orientation measurement) and the like can be mentioned.

As an example of the electronic device 300 of the present embodiment, there is a transmission device that uses the above-mentioned oscillation module 310 as a reference signal source and functions as, for example, a device for a terminal base station that communicates with a terminal by wire or wirelessly. By applying the oscillation module 1 of the above embodiment as the oscillation module 310, for example, an electron that can be used for a communication base station or the like and is desired to have higher frequency accuracy, higher performance, and higher reliability than before. It is also possible to realize the device 300.

Further, as another example of the electronic device 300 of the present embodiment, the communication unit 360 receives the external clock signal, and the CPU 320 (processing unit) oscillates based on the external clock signal and the output signal of the oscillation module 310. It may be a communication device including a frequency control unit that controls the frequency of the module 310.

3. 3. The moving body FIG. 19 is a diagram (top view) showing an example of the moving body of the present embodiment. The moving body 400 shown in FIG. 19 includes a controller 420, 430, 440, a battery 450, and a backup battery 460 that perform various controls such as an oscillation module 410, an engine system, a brake system, and a keyless entry system. .. The moving body of the present embodiment may be configured by omitting a part of the constituent elements (each part) of FIG. 19 or adding other constituent elements.

The oscillation module 410 includes an oscillation circuit (not shown) including a SAW filter (not shown), and generates an oscillation signal having a frequency based on the resonance frequency of the SAW filter.

Further, the oscillation module 410 may include a multiplication circuit or an output circuit located after the oscillation circuit. The multiplication circuit generates an oscillation signal obtained by multiplying the frequency of the oscillation signal generated by the oscillation circuit. Further, the output circuit outputs an oscillation signal generated by the multiplication circuit or an oscillation signal generated by the oscillation circuit. The oscillation circuit, the multiplication circuit, and the output circuit may each operate differentially.

The oscillation signal output by the oscillation module 410 is supplied to the controllers 420, 430, 440 and used as, for example, a clock signal.

The battery 450 supplies power to the oscillation module 410 and the controllers 420, 430, 440. The backup battery 460 supplies power to the oscillation module 410 and the controllers 420, 430, 440 when the output voltage of the battery 450 drops below the threshold value.

By applying, for example, the oscillation circuit 100 of each of the above-described embodiments as the oscillation circuit included in the oscillation module 410, or by applying, for example, the oscillation module 1 of each of the above-described embodiments as the oscillation module 410, a highly reliable mobile body is used. Can be realized.

As such a moving body 400, various moving bodies can be considered, and examples thereof include automobiles (including electric vehicles), aircraft such as jet aircraft and helicopters, ships, rockets, artificial satellites, and the like.

The present invention is not limited to the present embodiment, and various modifications can be carried out within the scope of the gist of the present invention.

The above-described embodiments and modifications are merely examples, and the present invention is not limited thereto. For example, it is also possible to appropriately combine each embodiment and each modification.

The present invention includes substantially the same configurations as those described in the embodiments (eg, configurations with the same function, method and result, or configurations with the same purpose and effect). The present invention also includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the present invention includes a configuration having the same action and effect as the configuration described in the embodiment or a configuration capable of achieving the same object. Further, the present invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

1 ... Oscillation module, 2 ... SAW filter, 2A ... 1st end, 2B ... 2nd end, 2X ... Long side, 2Y ... Short side, 3 ... Integrated circuit, 3B ... Electrode (pad), 4 ... Package, 4A ... Package 1st layer, 4B ... Package 2nd layer, 4C ... Package 3rd layer, 4D ... Package 4th layer, 5A ... Wire, 5B ... Wire, 6A ... Electrode, 6B ... Electrode, 7 ... Adhesive, 10 ... Phase shift circuit, 11 ... Coil, 12 ... Coil, 13 ... Variable capacitance element, 20 ... Differential amplifier, 21 ... Resistance, 22 ... Resistance, 23 ... Current source, 26 ... NOTE transistor, 27 ... NOTE transistor, 28 ... Resistance, 29 ... Resistance, 32 ... Condenser, 34 ... Condenser, 40 ... Differential amplifier, 41 ... Resistance, 42 ... Resistance, 43 ... NMOS transistor, 44 ... NaCl Transistor, 45 ... Constant Current Source, 52 ... Condenser, 54 ... Condenser, 60 ... Multiplying Circuit, 61 ... Resistance, 62 ... Resistance, 63 ... NaCl Transistor, 64 ... 67 ... NMOS transistor, 68 ... NMOS transistor, 69 ... Constant current source, 70 ... High pass filter, 71 ... Resistance, 72 ... Condenser, 73 ... Condenser, 74 ... Coil, 75 ... Condenser, 76 ... Condenser, 77 ... Resistance, 80 ... output circuit, 81 ... differential amplifier, 82 ... NPN transistor, 83 ... NPN transistor, 100 ... oscillation circuit, 200 ... piezoelectric substrate, 201 ... first IDT, 202 ... second IDT, 203 ... first reflection Instrument, 204 ... second reflector, 205 ... first wiring, 206 ... second wiring, 207 ... third wiring, 208 ... fourth wiring, 300 ... electronic equipment, 310 ... oscillation module, 312 ... Oscillation circuit, 314 ... Multiplying circuit, 316 ... Output circuit, 320 ... CPU, 330 ... Operation unit, 340
ROM, 350 ... RAM, 360 ... communication unit, 370 ... display unit, 400 ... mobile body, 410 ... oscillation module, 420 ... controller, 430 ... controller, 440 ... controller, 450 ... battery, 460 ... backup battery, IP1 ... 1st input port, IP2 ... 2nd input port, OP1 ... 1st output port, OP2 ... 2nd output port, IP20 ... input terminal, IP40 ... input terminal, IP60 ... input terminal, IP70 ... input terminal , IP80 ... Input terminal, IN20 ... Input terminal, IN40 ... Input terminal, IN60 ... Input terminal, IN70 ... Input terminal, IN80 ... Input terminal, OP20 ... Output terminal, OP40 ... Output terminal, OP60 ... Output terminal, OP70 ... Output terminal , OP80 ... output terminal, ON20 ... output terminal, ON40 ... output terminal, ON60 ... output terminal, ON70 ... output terminal, ON80 ... output terminal, O1 ... center of coil 11, O2 ... center of coil 12, P ... O1 and O2 Midpoint, L ... Line segment connecting O1 and O2, VL ... Virtual straight line passing through midpoint P and orthogonal to line segment L (straight line at equal distances from O1 and O2), I1 ... Current flowing through coil 11. I2 ... Current flowing through the coil 12, T1 ... Input terminal, T2 ... Input terminal, T3 ... Output terminal, T4 ... Output terminal, T5 ... Output terminal, T6 ... Output terminal, T7 ... Power supply terminal, T8 ... Ground terminal

Claims (9)

With SAW resonators,
An integrated circuit that is electrically connected to the SAW resonator and forms an oscillation circuit is provided.
The integrated circuit is
The first pad electrically connected to the SAW resonator and
A second pad electrically connected to the SAW resonator and
A first coil through which a current flows through the first pad,
A second coil through which a current flows through the second pad, and
A first wiring that electrically connects the first pad and the first coil,
A second wiring that electrically connects the second pad and the second coil,
Including the third coil,
The first coil, the second coil, and the third coil are spiral inductors formed in the integrated circuit.
In the plan view of the integrated circuit
The distance between the first coil and the first pad is shorter than the distance between the third coil and the first pad.
The distance between the second coil and the second pad is shorter than the distance between the third coil and the second pad.
The third coil is arranged so as to intersect a virtual straight line equidistant from the center of the first coil and the center of the second coil.
The first wiring extends from the outer peripheral side of the first coil in a direction along the virtual straight line.
The second wiring extends from the outer peripheral side of the second coil in a direction along the virtual straight line .
Since the current flowing through the first coil and the current flowing through the second coil are opposite to each other, the direction of the magnetic field generated by the first coil and the second coil on the virtual straight line Oscillation module that reverses the direction of the magnetic field generated by and weakens each other . The oscillation circuit includes a variable capacitance element.
The variable capacitance element is a part of the integrated circuit and
The oscillation module according to claim 1, wherein the variable capacitance element is arranged between the first coil and the second coil in a plan view of the integrated circuit. The oscillator circuit includes a differential amplifier.
The differential amplifier is part of the integrated circuit.
The oscillation module according to claim 2, wherein the differential amplifier is arranged between the variable capacitance element and the third coil in a plan view of the integrated circuit. The SAW resonator has a first input port, a second input port, a first output port, and a second output port.
The oscillation module according to any one of claims 1 to 3, wherein the first pad is connected to the first output port, and the second pad is connected to the second output port. The fourth aspect of claim 4, wherein the signal propagating from the first output port to the first input port and the signal propagating from the second output port to the second input port are opposite to each other. Oscillation module. The oscillation module according to any one of claims 1 to 5, wherein the oscillation circuit operates differentially. A filter circuit provided after the oscillation circuit and having the third coil, and a filter circuit.
Including an output circuit provided after the filter circuit,
The oscillation circuit outputs a differential signal and outputs a differential signal.
The oscillation module according to any one of claims 1 to 6, wherein the circuit on the signal path from the oscillation circuit to the output circuit operates differentially. An electronic device comprising the oscillation module according to any one of claims 1 to 7. A mobile body comprising the oscillation module according to any one of claims 1 to 7.

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