JP7041091B2 - Temperature sensor mounting structure - Google Patents

Description

The present invention relates to a mounting structure of a temperature sensor that detects the temperature of a single battery in a battery pack.

For example, as a mounting structure of a temperature sensor for detecting the temperature of a single battery of a battery pack mounted on a vehicle such as an electric vehicle or a hybrid electric vehicle and used as a drive source, those shown in FIG. 17 and those shown in FIGS. 18 and 19 There is one disclosed in Patent Document 1 shown in.

The mounting structure 1 of the temperature sensor 3 shown in FIG. 17 comes into contact with one cell 2A of the battery pack 2 and detects the temperature by the temperature sensor 3. The temperature sensor 3 is formed by a printed wiring technique on a substrate 4 having an aluminum 4b on the lower surface of a resin substrate main body 4a on the contact surface side of the cell 2A and on the upper surface of the substrate main body 4a of the substrate 4. A chip-type temperature measuring element 5 soldered to a pattern 4d exposed from the insulating layer 4c, and two electric wires 6 having an exposed core wire 6a at one end soldered to a land portion 4e of the pattern 4d on the substrate body 4a. , 6 and a moisture-proof material 7 that covers the soldered portion H of the temperature measuring element 5 and the core wire 6a of the electric wire 6 by coating.

Then, the temperature sensor 3 is pressed downward by an elastic member held by a battery cover or the like (not shown) of the battery pack 2 to bring the substrate 4 into contact with the upper surface of the cell 2A.

Further, as shown in FIGS. 18 and 19, the mounting structure 1'of the temperature sensor 3'disclosed in Patent Document 1 comes into contact with one cell 2A of the battery pack 2 and measures the temperature of the temperature sensor 3'. It is detected by. The temperature sensor 3'is formed by a metal substrate 4'having a metal plate made of aluminum or the like and a conductive path (both) formed on the upper surface of the metal substrate'4 by a printed wiring technique and exposed from an insulating layer made of an alumite layer. A chip-type temperature measuring element 5 soldered to (not shown), two wires 6 and 6 having an exposed core wire 6a at one end soldered to a conductive path of a metal substrate 4', a temperature measuring element 5 and It includes a potting material 7 ′ made of synthetic resin that covers the soldered portion H of the core wire 6a of the electric wire 6, and a case 8 made of synthetic resin that covers the metal substrate 4 ′.

The case 8 that covers the metal substrate 4'of the temperature sensor 3 is attached to the battery cover 9 of the battery pack 2, and the temperature sensor 3 is lowered by a pair of urging members 8a, 8a integrally formed on both sides of the case 8. The metal substrate 4'is brought into close contact with the upper surface of the cell 2A.

JP-A-2015-69738A Japanese Unexamined Patent Publication No. 2017-27831

However, in the conventional mounting structures 1 and 1'of the temperature sensors 3 and 3', the core wires 6a of the two electric wires 6 and 6 are connected to the substrates 4 and 4'by soldering, and those portions are moisture-proof. Since it is covered with the material 7 and the potting material 7', the size of the substrates 4 and 4'is large, and the overall structure is large and thick, which may cause restrictions when mounted on the cell 2A.

In the battery wiring module disclosed in Patent Document 2, the current limiting element soldered to the voltage detection line of the FPC (flexible printed circuit board) is covered with an insulating resin material coated with the current limiting element at the time of coating. The spread of the insulating resin material could not be regulated.

Therefore, the present invention has been made to solve the above-mentioned problems, and provides a mounting structure of a temperature sensor that can be made thinner, smaller, and lighter, and can be mounted on the cell side in a space-saving manner. The purpose is to do.

The present invention is a structure for mounting a temperature sensor for detecting the temperature of the single battery of a battery pack attached to a flexible thin plate-shaped electric wire and to which a plurality of single batteries are connected, wherein the flexible thin plate-shaped electric wire and the said are described. A chip-shaped temperature measuring element mounted on the exposed conductor portion of the flexible thin plate-shaped electric wire and detecting the temperature of the cell, and the temperature measuring element mounted around the exposed conductor portion of the flexible thin plate-shaped electric wire. It is characterized in that the case is provided with a resin case surrounding the temperature measuring element, and the temperature measuring element is laminated and covered with a moisture-proof material and a resin material in the resin case.

According to the present invention, a flexible thin plate-shaped electric wire is used as an electric wire, and the temperature measuring element is made of a moisture-proof material and a resin material in a resin case surrounding the temperature measuring element mounted on the conductor exposed portion of the flexible thin plate-shaped electric wire. By laminating and covering with the above, it is possible to reduce the thickness, size and weight, and it can be attached to the unit cell side that detects the temperature in a space-saving manner.

It is a side view which shows the mounting structure of the temperature sensor of 1st Embodiment of this invention in a partial cross section. (A) is a perspective view showing a state before assembling the temperature sensor, and (b) is a cross-sectional view showing a state in which a temperature measuring element is mounted on a flexible printed wiring board of the same temperature sensor. It is sectional drawing which shows the state just before fixing the resin case around the area where the temperature measuring element of the flexible printed wiring board is mounted. It is sectional drawing which shows the state which filled the adhesive such as a moisture-proof material in the case made of resin fixed to the said flexible printed wiring board. It is a perspective view which shows the state before assembling the main part of the temperature sensor. It is a perspective view which shows the state after assembling the main part of the temperature sensor. It is a side view which shows the mounting structure of the temperature sensor of 2nd Embodiment of this invention in a partial cross section. It is a perspective view which shows the state before assembling the temperature sensor of the 2nd Embodiment. It is a side view which shows the mounting structure of the temperature sensor of 3rd Embodiment of this invention in a partial cross section. (A) is a perspective view showing a state before assembling the temperature sensor of the third embodiment, and (b) is a cross-sectional view showing a state in which a temperature measuring element is mounted on a flexible printed wiring board of the same temperature sensor. It is sectional drawing which shows the state just before fixing the resin case around the temperature measuring element of the flexible printed wiring board of the 3rd Embodiment. It is sectional drawing which shows the state which filled the adhesive such as the moisture-proof material in the case made of resin fixed to the flexible printed wiring board of the 3rd Embodiment. It is a side view which shows the mounting structure of the temperature sensor of 4th Embodiment of this invention in a partial cross section. It is a perspective view which shows the state before assembling the temperature sensor of the 4th Embodiment. It is a perspective view which shows the state before assembling the mounting structure of the temperature sensor of 5th Embodiment of this invention. It is a perspective view which shows the mounting structure of the temperature sensor of the said 5th Embodiment. It is sectional drawing of the mounting structure of the temperature sensor of the conventional example. It is a partial notch side view which shows the battery pack of another conventional example. It is sectional drawing of the temperature sensor of the other conventional example mentioned above.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a side view showing a partially cross-sectional view of the mounting structure of the temperature sensor according to the first embodiment of the present invention, FIG. 2A is a perspective view showing a state before assembling the temperature sensor, and FIG. 2B is a perspective view. A cross-sectional view showing a state in which a temperature measuring element is mounted on a flexible printed wiring board of the same temperature sensor, and FIG. 3 shows a state immediately before fixing a resin case around the temperature measuring element mounted on the flexible printed wiring board. A cross-sectional view, FIG. 4 is a cross-sectional view showing a state in which an adhesive such as a moisture-proof material is filled in a resin case fixed to the flexible printed wiring board, and FIG. 5 is a state before assembling the main part of the temperature sensor. FIG. 6 is a perspective view showing a state after assembling the main part of the temperature sensor.

As shown in FIG. 1, the mounting structure 10 of the temperature sensor 11 is mounted on a flexible thin plate-shaped electric wire 20, and a battery pack (battery cell) S such as a plurality of lithium batteries connected in series or in parallel (battery pack). It detects the temperature of one cell S of the battery module) M, and is a flexible printed wiring board 20 as a flexible thin plate-shaped electric wire and an exposed portion (conductor exposed portion) of the wiring pattern 22 of the flexible printed wiring board 20. ) 23, which is mounted by soldering (this part is indicated by reference numeral H in FIG. 1), and the wiring of the chip NTC thermistor (chip-shaped temperature measuring element) 12 for detecting the temperature of the cell S and the flexible printed wiring board 20. It is placed around the exposed portion 23 of the pattern 22 and includes a case 30 made of synthetic resin and having a square tubular shape surrounding the chip NTC thermistor 12.

As shown in FIGS. 2A and 2B, the flexible printed wiring board 20 has a wiring pattern made of a conductive metal such as copper foil on a thin and soft base film 21 having insulation such as polyimide. Two (conductors) 22 are formed in parallel, respectively, and are manufactured by adhering a film-like cover 24 such as polyimide on the two (conductors) 22 except for a part of the exposed portion 23.

Then, as shown in FIGS. 1 and 2B, the chip NTC thermistor 12 straddles the two wiring patterns 22 and 22 of the exposed portions 23 in the exposed portions 23 of the two wiring patterns 22 and 22. It is mounted by soldering (this part is indicated by reference numeral H in the figure). Further, as shown in FIGS. 3, 5, and 6, a square tubular case 30 made of synthetic resin is mounted on the surface 24a around the portion of the flexible printed wiring board 20 on which the chip NTC thermistor 12 is mounted. Will be placed. At the time of this mounting, a plurality of positioning pin portions 31 protruding from the bottom surface 30b of the square tubular case 30 are inserted into a plurality of positioning holes 25 of the flexible printed wiring board 20 and a plurality of positioning holes 51 of the holding member 50. In addition, both side piece portions 52 formed by bending from both end sides of the rectangular surface 50a of the holding member 50 on each pair of locking convex portions 32a, 32a protruding toward both end sides of the side wall portions 32, 32 of the case 30. By locking each pair of locking receiving portions 52a and 52a in the shape of a rectangle of 52, the periphery of the flexible printed wiring board 20 on which the chip NTC thermistor 12 is mounted is locked to the bottom surface 30b of the case 30 and the case 30. It is fixed so as to be sandwiched between the holding member 50 and the surface 50a.

Then, as shown in FIG. 4, the chip NTC thermistor 12 is covered with a moisture-proof material 27 in a case 30 made of synthetic resin and having a square cylinder shape, and an adhesive 28 as a resin material is filled therein by coating. .. At this time, the moisture-proof material 27 and the adhesive 28 must be reliably injected from above the square cylindrical case 30 placed on the surface 24a around the portion where the chip NTC thermistor 12 of the flexible printed wiring board 20 is mounted. Can be done. Further, since the moisture-proof material 27 and the adhesive 28 are surrounded by the square tubular case 30 and then injected, the spread of the moisture-proof material 27 and the adhesive 28 can be reliably regulated.

As shown in FIG. 1, the square tubular case 30 made of synthetic resin of the temperature sensor 11 configured in this way is pressed against the cell S side via the urging member 40, and the flexible printed wiring board 20 is used. The portion on which the chip NTC thermistor 12 is mounted comes into contact with the cell S.

The urging member 40 locks / detaches (engages / disengages) each locking portion 42 to each of the opposite concave-shaped locking receiving portions 61 of the pair of holding members 60, 60 on the cell S side. It is provided with a synthetic resin spring retainer 41 and a compression coil spring (elastic member) 43 that is held by the spring retainer 41 and presses and urges the synthetic resin square tubular case 30 toward the cell S side. ing.

The battery pack M is mounted on a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV) and used as a drive source. Further, the compression coil spring 43 is held by the holding shaft portion 41a of the spring retainer 41 so as not to come off. Further, a box-shaped spring accommodating holding portion 35 is integrally projected on the upper surface of the case 30.

According to the mounting structure 10 of the temperature sensor 11 of the first embodiment, the flexible printed wiring board is used as a voltage detection line (wire) connected to a battery monitoring unit (not shown) that monitors the voltage of the cell S of the battery pack M. The chip NTC thermistor 12 is made of synthetic resin and is made of synthetic resin and surrounds the chip NTC thermistor 12 mounted by soldering to the exposed portion 23 of the wiring pattern 22 of the flexible printed wiring plate 20 using (FPC) 20. By laminating and covering the moisture-proof material 27 and the resin material 28 of the adhesive, the entire structure can be made thinner, smaller and lighter, and can be attached to the cell S side that detects the temperature in a space-saving manner. Can be done.

When the flexible printed wiring board 20 is connected to the battery monitoring unit, the battery monitoring unit can be connected to the battery monitoring unit by the wiring pattern 22 of the flexible printed wiring board 20. Such a connector becomes unnecessary, and the number of parts can be reduced accordingly to reduce the cost.

Further, the compact and thin temperature sensor 11 has the elasticity of the compression coil spring 43 held by the spring retainer 41 in which the locking portion 42 is locked to the locking receiving portion 61 of the holding member 60 on the cell S side. Since it is made of synthetic resin and is pressed downward through a square tubular case 30 by force to come into contact with the upper surface of the cell S, the contact area can be minimized and the heat capacity can be reduced. As a result, the heat capacity can be reduced and the temperature measurement performance can be improved.

Further, by using the chip NTC thermistor 12 mounted by soldering to the wiring pattern 22 in the exposed portion 23 of the flexible printed wiring board 20, it is possible to easily improve the temperature measurement performance and ensure the insulation. In particular, the moisture-proof material 27 and the adhesive resin material 28 are applied without leakage by the synthetic resin-made square tubular case 30 in which the periphery of the soldered portion H of the chip NTC thermistor 12 is fixed via the holding member 50. It can be easily and surely prevented from spreading of the moisture-proof material 27 and the resin material 28 of the adhesive by soldering or filling. As a result, the periphery of the soldered portion H of the chip NTC thermistor 12 can be sealed to ensure insulation.

FIG. 7 is a side view showing a partially cross-sectional view of the mounting structure of the temperature sensor according to the second embodiment of the present invention, and FIG. 8 is a perspective view showing a state before assembling the temperature sensor.

The temperature sensor mounting structure 10 of the second embodiment is formed on the upper surfaces of the side wall portions 32, 32 of the square tubular case 30 made of synthetic resin, and is attached to the locking receiving portions 61 of the pair of holding members 60, 60. It differs from that of the first embodiment in that a pair of arm-shaped elastic portions (elastic members) 33, 33 to be locked are integrally projected. Since the other configurations are the same as those in the first embodiment, the same components are designated by the same reference numerals and detailed description thereof will be omitted.

That is, in the temperature sensor mounting structure 10 of the second embodiment, the tip portions 33a of the pair of arm-shaped elastic portions 33, 33 of the case 30 are locked to the locking receiving portion 61 of the holding member 60. As a result, the case 30 is pressed against the cell S side due to the bending deformation of the arm-shaped elastic portion 33, and the portion of the flexible printed wiring board 20 on which the chip NTC thermistor 12 is mounted comes into contact with the cell S. As a result, the same actions and effects as those of the first embodiment are obtained.

Further, since the arm-shaped elastic portion 33 of the case 30 has a function as an elastic member, the number of parts can be reduced by that amount, and the cost can be reduced. Further, since the case 30 has both the effects of fixing the flexible printed wiring board 20 and restricting the spread of the moisture-proof material 27 and the adhesive 28, the chip NTC thermistor 12 of the flexible printed wiring board 20 is mounted. It is possible to reduce the size and thickness of the part.

9 is a side view showing a partially cross-sectional view of the mounting structure of the temperature sensor according to the third embodiment of the present invention, FIG. 10A is a perspective view showing a state before assembling the temperature sensor, and FIG. 10B is a perspective view. A cross-sectional view showing a state in which a temperature measuring element is mounted on a flexible printed wiring board of the same temperature sensor, FIG. 11 shows a state immediately before fixing a resin case around the temperature measuring element mounted on the flexible printed wiring board. A cross-sectional view and FIG. 12 are cross-sectional views showing a state in which an adhesive such as a moisture-proof material is filled in a resin case fixed to the flexible printed wiring board.

As shown in FIG. 9, the mounting structure 10 of the temperature sensor 11 is mounted on a flexible thin plate-shaped electric wire 20, and a battery pack (battery cell) S such as a plurality of lithium batteries connected in series or in parallel (battery pack). It detects the temperature of one cell S of the battery module) M, and has a flexible printed wiring board 20 as a flexible thin plate-shaped electric wire and an exposed portion (conductor exposed portion) of the wiring pattern 22 of the flexible printed wiring board 20. ) 23 (this part is indicated by reference numeral H in FIG. 9), and the wiring of the chip NTC thermistor (chip-shaped temperature measuring element) 12 for detecting the temperature of the cell S and the flexible printed wiring board 20. It is placed around the exposed portion 23 of the pattern 22 and includes a case 30 made of synthetic resin and having a square tubular shape surrounding the chip NTC thermistor 12.

As shown in FIGS. 10A and 10B, the flexible printed wiring board 20 has a wiring pattern made of a conductive metal such as copper foil on a thin and soft base film 21 having insulation such as polyimide. Two (conductors) 22 are formed in parallel, respectively, and are manufactured by adhering a film-like cover 24 such as polyimide on the two (conductors) 22 except for a part of the exposed portion 23.

Then, as shown in FIGS. 9 and 10B, the chip NTC thermistor 12 straddles the two wiring patterns 22 and 22 of the exposed portions 23 in the exposed portions 23 of the two wiring patterns 22 and 22. It is mounted by soldering (this part is indicated by reference numeral H in the figure). Further, as shown in FIGS. 11 and 12, a square tubular case 30 made of synthetic resin is placed on the surface 24a around the portion of the flexible printed wiring board 20 on which the chip NTC thermistor 12 is mounted. The surface 24a of the flexible printed wiring board 20 and the bottom surface 30b of the square tubular case 30 made of synthetic resin are fixed with double-sided adhesive tape 26.

Further, as shown in FIG. 12, the chip NTC thermistor 12 is covered with a moisture-proof material 27 in a case 30 made of synthetic resin and having a square cylinder shape, and an adhesive 28 as a resin material is filled therein by coating. ..

As shown in FIG. 9, the square tubular case 30 made of synthetic resin of the temperature sensor 11 configured in this way is pressed against the cell S side via the urging member 40, and the flexible printed wiring board 20 is used. The portion on which the chip NTC thermistor 12 is mounted comes into contact with the cell S.

The urging member 40 is made of a synthetic resin that locks and disengages each locking portion 42 to each of the opposing inverted concave locking receiving portions 61 of the pair of holding members 60, 60 on the cell S side. The spring retainer 41 is provided with a compression coil spring (elastic member) 43 that is held by the spring retainer 41 and presses and urges a square tubular case 30 made of synthetic resin toward the cell S side.

The battery pack M is mounted on a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV) and used as a drive source. Further, the compression coil spring 43 is held by the holding shaft portion 41a of the spring retainer 41 so as not to come off. Further, a box-shaped spring accommodating holding portion 35 is integrally projected on the upper surface of the case 30.

According to the mounting structure 10 of the temperature sensor 11 of the third embodiment, the flexible printed wiring board is used as a voltage detection line (wire) connected to a battery monitoring unit (not shown) that monitors the voltage of the cell S of the battery pack M. The chip NTC thermistor 12 is made of synthetic resin and is made of synthetic resin and surrounds the chip NTC thermistor 12 mounted by soldering to the exposed portion 23 of the wiring pattern 22 of the flexible printed wiring plate 20 using (FPC) 20. By laminating and covering the moisture-proof material 27 and the resin material 28 of the adhesive, the entire structure can be made thinner, smaller and lighter, and can be attached to the cell S side that detects the temperature in a space-saving manner. Can be done.

When the flexible printed wiring board 20 is connected to the battery monitoring unit, the battery monitoring unit can be connected to the battery monitoring unit by the wiring pattern 22 of the flexible printed wiring board 20. Such a connector becomes unnecessary, and the number of parts can be reduced accordingly to reduce the cost.

Further, the compact and thin temperature sensor 11 has the elasticity of the compression coil spring 43 held by the spring retainer 41 in which the locking portion 42 is locked to the locking receiving portion 61 of the holding member 60 on the cell S side. Since it is made of synthetic resin and is pressed downward through a square tubular case 30 by force to come into contact with the upper surface of the cell S, the contact area can be minimized and the heat capacity can be reduced. As a result, the heat capacity can be reduced and the temperature measurement performance can be improved.

Further, by using the chip NTC thermistor 12 mounted by soldering to the wiring pattern 22 in the exposed portion 23 of the flexible printed wiring board 20, it is possible to easily improve the temperature measurement performance and ensure the insulation. In particular, the moisture-proof material 27 and the adhesive resin material 28 are not leaked by the synthetic resin case 30 made of synthetic resin in which the periphery of the soldered portion H of the chip NTC thermista 12 is fixed without gaps with the double-sided adhesive tape 26. It can be applied or filled to easily and surely prevent the moisture-proof material 27 and the resin material 28 of the adhesive from spreading. As a result, the periphery of the soldered portion H of the chip NTC thermistor 12 can be sealed to ensure insulation.

FIG. 13 is a side view showing a partially cross-sectional view of the mounting structure of the temperature sensor according to the fourth embodiment of the present invention, and FIG. 14 is a perspective view showing a state before assembling the temperature sensor.

The temperature sensor mounting structure 10 of the fourth embodiment is made of synthetic resin and is formed on the upper surfaces of both side wall portions 32, 32 of the square cylindrical case 30, and is attached to each of the locking receiving portions 61 of the pair of holding members 60, 60. It differs from that of the first embodiment in that a pair of arm-shaped elastic portions (elastic members) 33, 33 to be locked are integrally projected. Since the other configurations are the same as those in the third embodiment, the same components are designated by the same reference numerals and detailed description thereof will be omitted.

That is, in the temperature sensor mounting structure 10 of the fourth embodiment, the tip portions 33a of the pair of arm-shaped elastic portions 33, 33 of the case 30 are locked to the locking receiving portion 61 of the holding member 60. As a result, the case 30 is pressed against the cell S side due to the bending deformation of the arm-shaped elastic portion 33, and the portion of the flexible printed wiring board 20 on which the chip NTC thermistor 12 is mounted comes into contact with the cell S. As a result, the same actions and effects as those of the third embodiment are obtained.

Further, since the arm-shaped elastic portion 33 of the case 30 has a function as an elastic member, the number of parts can be reduced by that amount, and the cost can be reduced. Further, since the case 30 has both the effects of fixing the flexible printed wiring board 20 and restricting the spread of the moisture-proof material 27 and the adhesive 28, the chip NTC thermistor 12 of the flexible printed wiring board 20 is mounted. It is possible to reduce the size and thickness of the part.

According to each of the above embodiments, the case where the flexible printed wiring board (FPC) is used as the flexible thin plate-shaped electric wire has been described, but the flexible flat cable (FFC) or the like may be used as the flexible thin plate-shaped electric wire. ..

Further, according to each of the above-described embodiments, a chip NTC thermistor, which is an element having a negative temperature characteristic (the resistance value decreases as the temperature rises), is used as the chip-shaped temperature measuring element, but the positive temperature characteristic is obtained. A chip PTC thermistor or a chip CTR thermistor, which is an element having (the resistance value increases as the temperature rises), may be used as a chip-shaped temperature measuring element.

Further, according to each of the above-described embodiments, a compression coil spring is used as an elastic member to press the temperature sensor toward the cell to urge it, but the elastic member is not limited to the compression coil spring, but may be a leaf spring or the like. Other elastic members such as rubber may be used.

FIG. 15 is a perspective view showing a state before assembling the mounting structure of the temperature sensor according to the fifth embodiment of the present invention, and FIG. 16 is a perspective view showing the mounting structure of the temperature sensor.

The mounting structure 10 of the temperature sensor 11 of the fifth embodiment is placed around the exposed portion (conductor exposed portion) 23 of the two wiring patterns 22 and 22 of the flexible printed wiring plate 20, and the chip of the temperature sensor 11 is placed. A cylindrical case 30'that surrounds the NTC thermistor 12 and functions as a holder, a synthetic resin urging member 40'that presses the case 30'to the cell S side, and a case 30 that is located on the cell S. It is different from that of the third embodiment in that it includes a holding member 60'that locks the urging member 40'and a holding member 60'.

That is, as shown in FIGS. 15 and 16, the case body 32'of the case 30'is made of synthetic resin and is formed in a cylindrical shape, and locking recesses provided on both sides of the holding member 60'will be described later. It has a pair of L-shaped flexible locking projections 34, 34 that are locked / detached (engaged / disengaged) from 64a. The case body 32'of the case 30'is fixed around the exposed portion 23 of the flexible printed wiring board 20 via an adhesive, double-sided adhesive tape, or the like, and the moisture-proof material 27 is filled therein to fill the chip NTC thermistor. It is designed to cover 12.

Further, as shown in FIGS. 15 and 16, the urging member 40'is held by a spring retainer 41 engaged and disengaged by a locking projection 62a provided on the holding member 60'described later, and the spring retainer 41. It is provided with a compression coil spring (elastic member) 43 that urges the case 30'on the cell S side.

As shown in FIG. 15, the spring retainer 41 has a cylindrical holding shaft portion 41a having ribs 41b protruding from the circumferential surface on the lower side of the center. A compression coil spring 43 is attached to the holding shaft portion 41a, and is held by the rib 41b so as not to come off. Further, flexible and paired locking arm portions 42, 42 are provided on both sides of the spring retainer 41 so as to be parallel to the holding shaft portion 41a. Each locking arm portion 42 is formed with a locking hole (locked portion) 42a in which the locking projection 62a of the holding member 60'is locked.

As shown in FIG. 16, the holding member 60'is formed in a substantially square tubular shape by both side wall portions 62 and 62, a rear wall portion 63, and a front wall portion 64 having an opening 65 in the center. ing. Then, on both side wall portions 62, 62 of the holding member 60', L-shaped and flexible locking projections (engaged) fitted into the locking holes 42a of the pair of locking arm portions 42, 42 of the spring retainer 41. Stop portion) 62a is notched and formed. Further, on the outside of the upper ends of the wall portions 62 and 62 on both sides, a pair of mounting portions 62b and 62b are fastened and fixed to the terminals of the positive and negative electrodes (not shown) on both ends of the cell S via nuts. It extends to the side.

Further, on the inner surface sides of both sides of the opening 65 of the front wall portion 64 of the holding member 60', a pair of locking projections 34, 34 of the case 30'are engaged and disengaged (other locking portions). 64a is formed in a stepped shape. Since other configurations such as the flexible printed wiring board 20 are the same as those in the third embodiment, the same components are designated by the same reference numerals and detailed description thereof will be omitted.

In the mounting structure 10 of the temperature sensor 11 of the fifth embodiment, the compression coil spring 43 is first mounted on the holding shaft portion 41a of the spring holding 41 of the urging member 40', and the upper part of the rib 41b of the holding shaft portion 41a is mounted. The pedestal portion of the compression coil spring 43 is locked in the gap to hold the compression coil spring 43 so as not to come off from the holding shaft portion 41a. As a result, the spring retainer 41 and the compression coil spring 43 are integrated, and at the time of final assembly, the locking hole 42a of the locking arm portion 42 of the spring retainer 41 and the holding member 60'located on the cell S are engaged. The final assembly is completed by a simple action of locking the protrusion 62a.

In this way, by using a thin and small urging member 40'that can hold the compression coil spring 43 so as not to come off in the holding shaft portion 41a of the spring retainer 41, the temperature sensor 11 can be moved to the cell S side in a small space. It can be mounted, and the entire mounting structure can be made thinner, smaller, and lighter.

Further, the locking hole 42a of the flexible locking arm portion 42 of the spring retainer 41 is fitted into the inwardly locking projection 62a of the holding member 60'located on the cell S, and the urging member 40'. Since the holding member 60'is locked, it is possible to absorb the backlash in both sides (left and right direction) of the urging member 40' accommodated between the side wall portions 62 and 62 of the holding member 60', which is high. It is possible to provide the mounting structure 10 of the temperature sensor 11 with accuracy.

10 Temperature sensor mounting structure 11 Temperature sensor 12 Chip NTC thermistor (chip-shaped temperature measuring element)
20 Flexible printed wiring board (flexible thin plate-shaped electric wire)
22 Wiring pattern (conductor)
23 Exposed part of wiring pattern (exposed part of conductor)
24a Surface 26 Double-sided adhesive tape 27 Moisture-proof material
28 Adhesive (resin material)
30 Synthetic resin square cylinder case (resin case)
30b Bottom surface 33 Arm-shaped elastic part (elastic member)
30'Cylindrical case made of synthetic resin (resin case)
34 Locking protrusion 40, 40' Bouncer 41 Spring retainer 42a Locking hole (locked part)
43 Compression coil spring (elastic member)
50 Holding member 50a Surface 60,60 ′ Holding member 62a Locking protrusion (locking part)
64a Locking recess (other locking part)
M battery pack S single battery

Claims (9)

It is a mounting structure of a temperature sensor that detects the temperature of the cell in a battery pack that is mounted on a flexible thin plate-shaped electric wire and to which a plurality of cells are connected.
With the flexible thin plate-shaped electric wire,
A chip-shaped temperature measuring element mounted on the conductor exposed portion of the flexible thin plate-shaped electric wire and detecting the temperature of the cell, and
A resin case, which is placed around the exposed conductor portion of the flexible thin plate-shaped electric wire and surrounds the temperature measuring element, is provided.
A mounting structure for a temperature sensor, characterized in that the temperature measuring element is laminated and covered with a moisture-proof material and a resin material in the resin case. The temperature sensor mounting structure according to claim 1.
A temperature sensor mounting structure characterized in that the surface around the conductor exposed portion of the flexible thin plate-shaped electric wire and the bottom surface of the resin case are fixed with double-sided adhesive tape. The temperature sensor mounting structure according to claim 1.
It is characterized in that the peripheral portion of the conductor exposed portion of the flexible thin plate-shaped electric wire is fixed so as to be sandwiched between the bottom surface of the resin case and the surface of the holding member engaged with and detached from the resin case. Mounting structure of the temperature sensor. The temperature sensor mounting structure according to claim 1 or 2.
The temperature is characterized in that the resin case is pressed against the cell cell side via an urging member, and the portion of the flexible thin plate-shaped electric wire on which the temperature measuring element is mounted is brought into contact with the cell cell. Sensor mounting structure. The temperature sensor mounting structure according to claim 4.
The urging member includes a spring retainer that is engaged with and detached from the holding member on the cell cell side, and an elastic member that is held by the spring presser and urges the resin case to the cell cell side. The mounting structure of the temperature sensor is characterized by this. The temperature sensor mounting structure according to claim 1 or 2.
A temperature sensor characterized in that the resin case is pressed against the cell cell side via an elastic member, and a portion of the flexible thin plate-shaped electric wire on which the temperature measuring element is mounted is brought into contact with the cell cell. Mounting structure. The temperature sensor mounting structure according to claim 6.
The elastic member is a temperature sensor mounting structure characterized by being an arm-shaped elastic portion integrally protruding from the resin case. The temperature sensor mounting structure according to claim 1.
It has an urging member that presses the resin case against the cell side.
The urging member includes a spring presser having a locked portion engaged with and disengaged from a locking portion provided on the holding member on the cell, and the resin case held by the spring presser. A temperature sensor mounting structure characterized by having an elastic member that urges the battery side. The temperature sensor mounting structure according to claim 8.
The resin case has a mounting structure for a temperature sensor, which has a locking projection that is engaged with and disengaged from another locking portion provided on the holding member.

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