JP7017004B2 - Sensor system - Google Patents

Description

The present invention relates to a sensor module and a sensor system.

One of the sensors for detecting the state of the object to be measured is a sensor for detecting capacitance. Patent Document 1 discloses a technique relating to a sensor for detecting a capacitance and a load measuring device.

Japanese Unexamined Patent Publication No. 2017-203691

Since the capacitance sensor detects the state of the object to be measured by detecting the capacitance, it is necessary to arrange an electrode for measuring the capacitance value in the vicinity of the object to be measured. Here, since the object to be measured has various shapes, it is necessary to arrange electrodes according to the shape and size of the object to be measured. Therefore, there is a need for a sensor module and a sensor system that can flexibly arrange electrodes according to the object to be measured.

The sensor module according to one aspect of the present invention includes a main module including a plate-shaped sensor unit capable of detecting capacitance, a main board connected to the sensor unit, and a plate capable of detecting capacitance. It is provided with a submodule including a sensor unit having a shape and a relay board connected to the sensor unit. Each of the sensor portions includes an insulating layer, a detection electrode which is an electrode layer formed on the first surface of the insulating layer, and a shield electrode which is an electrode layer formed on the second surface of the insulating layer. , And the relay board of the submodule is connected to the main board of the main module by using a coaxial cable, and the main board has a detection signal detected by the sensor unit of the main module. A processing circuit for processing the detection signal detected by the sensor unit of the submodule is provided.

The sensor system according to one aspect of the present invention includes the above-mentioned sensor module and a position specifying unit for specifying the position of the object to be measured by using the information acquired by the sensor module. The position specifying unit identifies the position of the object to be measured by using the capacitance value detected by the detection electrode of the main module and the capacitance value detected by the detection electrode of the submodule. ..

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a sensor module and a sensor system in which electrodes can be flexibly arranged according to an object to be measured.

It is a figure which shows an example of the sensor module which concerns on embodiment. It is a figure for demonstrating the details of a main module. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. It is a block diagram which shows an example of the main board provided with a main module. It is a block diagram which shows an example of a relay board provided in a sub-module. It is a figure for demonstrating the measurement example using the sensor module which concerns on embodiment. It is sectional drawing which shows the arrangement example of the sensor part of the sensor module which concerns on embodiment. It is a figure for demonstrating the sensor system which used the sensor module which concerns on embodiment. It is a figure for demonstrating the sensor system which used the sensor module which concerns on embodiment. It is a figure for demonstrating the sensor system which used the sensor module which concerns on embodiment. It is a figure for demonstrating the sensor system which used the sensor module which concerns on embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing an example of a sensor module according to an embodiment. As shown in FIG. 1, the sensor module 1 according to the present embodiment includes a main module 2 and sub-modules 3_1 to 3_3.

In the configuration example shown in FIG. 1, an example in which the sensor module 1 is configured by one main module 2 and three sub-modules 3_1 to 3_3 is shown. However, the sensor module 1 according to the present embodiment can be composed of one main module 2 and one or more submodules 3, and the number of submodules 3 depends on the size and shape of the object to be measured. It can be changed as appropriate. In this specification, submodules 3_1 to 3_3 are collectively referred to as submodule 3.

The main module 2 includes a plate-shaped sensor unit 10 capable of detecting a capacitance, and a main board 11 connected to the sensor unit 10. The sub-modules 3_1 to 3_3 include a plate-shaped sensor unit 10 capable of detecting capacitance and a relay board 12 connected to the sensor unit 10. Since the sensor unit 10 included in the sub-modules 3_1 to 3_3 has the same configuration as the sensor unit 10 included in the main module 2, they are designated by the same reference numerals.

Each of the relay boards 12 of the sub-modules 3_1 to 3_3 is connected to the main board 11 of the main module 2 by using coaxial cables 13_1 to 13_3.

The main board 11 of the main module 2 has a processing circuit 31 (FIG. 4) that processes the detection signal detected by the sensor unit 10 of the main module 2 and the detection signal detected by the sensor unit 10 of the sub-modules 3_1 to 3_3 (FIG. 4). See). The main board 11 is configured to be connectable to an external device via the external wiring 15. For example, the data processed by the processing circuit of the main board 11 is supplied to an external device via the external wiring 15.

FIG. 2 is a diagram for explaining the details of the main module. As shown in FIG. 2, the main module 2 includes a sensor unit 10 and a main board 11. The main board 11 is provided at the end of the sensor unit 10 (that is, one side of the plate-shaped sensor unit 10). The sensor unit 10 includes a detection electrode 21 and a shield electrode 22. The detection electrode 21 and the shield electrode 22 use lead wires 25 and 26 (metal foil such as copper foil, metal foil protected by a resin layer, flexible printed circuit, etc.) and electrode pads 34d and 34s of the main substrate 11, respectively. It is connected to (see FIG. 4).

FIG. 3 is a cross-sectional view taken along the cutting line III-III of FIG. As shown in FIG. 3, the sensor unit 10 includes an insulating layer 20, a detection electrode 21 which is an electrode layer formed on one surface (upper surface) of the insulating layer 20, and the other surface (lower surface) of the insulating layer 20. It has a shield electrode 22 which is an electrode layer formed in the above. For example, the insulating layer 20 can be configured by using a flexible resin sheet. Further, the detection electrode 21 and the shield electrode 22 can be configured by using a conductive sheet. The conductive sheet can be constructed by using a metal foil. Further, the conductive sheet may be formed by using a flexible resin sheet containing conductive particles.

An insulating layer 23 for protecting the detection electrode 21 is formed on the upper surface of the detection electrode 21. An insulating layer 24 for protecting the shield electrode 22 is formed on the lower surface of the shield electrode 22. The insulating layers 23 and 24 can be configured by using a flexible resin sheet. Further, an adhesive layer may be provided to provide ease of installation.

As shown in FIG. 2, the outer edge of the detection electrode 21 is formed so as to be inside the outer edge of the shield electrode 22 when viewed in a plan view. With such a configuration, it is possible to control the directivity of the detection range and reduce the noise when the detection electrode 21 detects the capacitance.

In the configuration example shown in FIG. 2, the shapes of the insulating layers 20, 23, and 24 (see FIG. 3) constituting the sensor unit 10 are rectangular, and the shapes of the detection electrode 21 and the shield electrode 22 are circular. However, the shapes of the insulating layers 20, 23, and 24, and the shapes of the detection electrode 21 and the shield electrode 22 are not limited to these, and can be any shape. For example, the shapes of the detection electrode 21 and the shield electrode 22 may be rectangular or elliptical.

Further, the insulating layer 20 sandwiched between the detection electrode 21 and the shield electrode 22 is provided with an optimum film thickness and dielectric constant according to the shape and area of the detection electrode 21 and the shield electrode 22 so that the detection electrode is provided. The parasitic capacitance of 21 can be reduced.

In the present embodiment, when the main module 2 is configured, the area of the sensor unit 10 in the plan view is made larger than the area of the main substrate 11 in the plan view. A rigid main board 11 is provided at the end of the flexible sensor unit 10. Similarly, when the sub-module 3 is configured, the area of the sensor unit 10 in the plan view is made larger than the area of the relay board 12 in the plan view. A rigid relay board 12 is provided at the end of the flexible sensor unit 10. With such a configuration, most of the main module 2 and the sub module 3 can be flexibly configured. Therefore, it is possible to improve the flexibility when arranging the main module 2 and the sub module 3 on the object to be measured.

Further, as shown in the cross-sectional view of FIG. 3, the shield electrode 22 is configured to apply a shield voltage so as to have the same potential as the potential of the detection electrode 21. Such a shield voltage is generated using the buffer circuit 32. By applying a shield voltage to the shield electrode 22, it is possible to suppress the generation of a large parasitic capacitance between the detection electrode 21 and the shield electrode 22, so that it is possible to suppress a decrease in the detection range in the sensor unit 10. can.

The buffer circuit 32 is provided on the main board 11 shown in FIG. 2, and a shield voltage is supplied from the main board 11 to the shield electrode 22 via the lead wire 26. Further, the detection signal detected by the detection electrode 21 is supplied to the main substrate 11 via the lead wire 25.

FIG. 4 is a block diagram showing an example of a main board included in the main module. As shown in FIG. 4, the main board 11 is provided with a circuit element 30, connectors 33_1 to 33_3, and electrode pads 34d and 34s. The circuit element 30 is provided with a processing circuit 31 and a buffer circuit 32. For example, an integrated circuit (IC) for a sensor module can be used for the circuit element 30.

The electrode pad 34d is connected to the detection electrode 21 via a lead wire 25 (see FIG. 2), and supplies the detection signal dct_0 supplied from the detection electrode 21 to the processing circuit 31. The processing circuit 31 calculates the capacitance value detected by the sensor unit 10 of the main module 2 based on the detection signal dct_0 supplied from the detection electrode 21.

The electrode pad 34s is connected to the shield electrode 22 via a lead wire 26 (see FIG. 2), and supplies the shield voltage sld_0 supplied from the buffer circuit 32 to the shield electrode 22. At this time, the buffer circuit 32 generates a shield voltage sld_0 having the same potential as the potential of the detection signal dct_0 supplied from the detection electrode 21, and transfers the generated shield voltage sld_0 to the shield electrode 22 via the electrode pad 34s. Supply.

Further, the main board 11 is provided with connectors 33_1 to 33_3 connected to the coaxial cables 13_1 to 13_3. The main board 11 is connected to each of the submodules 3_1 to 3_3 via the coaxial cables 13_1 to 13_3 connected to the connectors 33_1 to 33_3. For example, the coaxial cables 13_1 to 13_3 are configured to be detachably attached to the connectors 33_1 to 33_3.

The connector 33_1 is connected to the submodule 3_1 (see FIG. 1) via the coaxial cable 13_1, and supplies the detection signal dct_1 supplied from the submodule 3_1 to the processing circuit 31. The processing circuit 31 calculates the capacitance value detected by the sensor unit 10 of the sub-module 3_1 based on the detection signal dct_1 supplied from the sub-module 3_1. Further, the buffer circuit 32 generates a shield voltage sld_1 having the same potential as the potential of the detection signal dct_1 supplied from the submodule 3_1, and the generated shield voltage sld_1 is passed through the connector 33_1 and the coaxial cable 13_1 to the submodule. It is supplied to the shield electrode 22 of 3_1.

The connector 33_1 is connected to the submodule 3_2 (see FIG. 1) via the coaxial cable 13_2, and supplies the detection signal dct_1 supplied from the submodule 3_2 to the processing circuit 31. The processing circuit 31 calculates the capacitance value detected by the sensor unit 10 of the sub-module 3_2 based on the detection signal dct_2 supplied from the sub-module 3_2. Further, the buffer circuit 32 generates a shield voltage sld_2 having the same potential as the potential of the detection signal dct_2 supplied from the submodule 3_2, and the generated shield voltage sld_2 is passed through the connector 33_2 and the coaxial cable 13_2 to the submodule. It is supplied to the shield electrode 22 of 3_2.

The connector 33_3 is connected to the sub-module 3_3 (see FIG. 1) via the coaxial cable 13_3, and supplies the detection signal dct_3 supplied from the sub-module 3_3 to the processing circuit 31. The processing circuit 31 calculates the capacitance value detected by the sensor unit 10 of the sub-module 3_3 based on the detection signal dct_3 supplied from the sub-module 3_3. Further, the buffer circuit 32 generates a shield voltage sld_3 having the same potential as the potential of the detection signal dct_3 supplied from the submodule 3_3, and the generated shield voltage sld_3 is passed through the connector 33_3 and the coaxial cable 13_3 to the submodule. It is supplied to the shield electrode 22 of 3_3.

For example, the main board 11 may be provided with a main module 2 and a number of buffer circuits 32 (four in the present embodiment) corresponding to the respective sub-modules 3_1 to 3_3. As a result, each buffer circuit 32 can independently generate shield voltages sld_0 to sld_3 corresponding to the respective detection signals dct_0 to dct_3. Then, the shield voltages sld_0 to sld_3 independently generated are supplied to the shield electrodes 22 of the respective submodules 3_1 to 3_3 via the coaxial cables 13_1 to 13_3. With such a configuration, the buffer circuit 32 can be integrated and provided on the main board 11.

As shown in FIG. 2, the main board 11 is configured to be connectable to an external device via the external wiring 15. For example, the data processed by the processing circuit of the main board 11 is supplied to an external device as a digital signal via the external wiring 15.

Next, the relay boards 12_1 to 12_3 included in the submodules 3_1 to 3_3 will be described. FIG. 5 is a block diagram showing an example of a relay board included in the sub module. In FIG. 5, the relay board 12_1 included in the submodule 3_1 will be described as an example, but the relay boards 12_2 and 12_3 included in the other submodules 3_2 and 3_3 have the same configuration.

As shown in FIG. 5, the relay board 12_1 included in the submodule 3_1 includes electrode pads 41d, 41s, and a connector 42_1.

The connector 42_1 of the relay board 12_1 is connected to the connector 33_1 (see FIG. 4) of the main board 11 via the coaxial cable 13_1. As a result, the relay board 12_1 of the sub-module 3_1 and the main board 11 of the main module 2 are connected. For example, the coaxial cable 13_1 is configured to be detachably attached to the connector 42_1 of the relay board 12_1.

The electrode pad 41d shown in FIG. 5 is connected to the detection electrode of the submodule 3_1, and the detection signal dct_1 supplied from the detection electrode is supplied to the main board 11 via the connector 42_1 and the coaxial cable 13_1.

The electrode pad 41s is connected to the shield electrode of the sub-module 3_1, and supplies the shield voltage sld_1 supplied from the main board 11 via the coaxial cable 13_1 and the connector 42_1 to the shield electrode. As described above, the shield voltage sld_1 is generated by the buffer circuit 32 provided on the main board 11.

FIG. 6 is a diagram for explaining a measurement example (configuration example of the sensor system) using the sensor module according to the present embodiment. As shown in FIG. 6, the sensor module 1 according to the present embodiment constitutes the sensor module 1 by one main module 2 and three sub-modules 3_1 to 3_3. The main module 2 and the three sub-modules 3_1 to 3_3 are connected by using coaxial cables 13_1 to 13_3 (not shown in FIG. 6).

In the present embodiment, each of the main module 2 and the sub-modules 3_1 to 3_3 (hereinafter, these are omitted and also referred to as modules 2, 3_1 to 3_3) is used, and the capacitance between the object to be measured 50 and the object to be measured 50 is used. The value is being measured. This makes it possible to detect the position and size of the object to be measured 50. That is, the capacitance value between the object to be measured 50 changes according to the distance between each of the modules 2, 3_1 to 3_3 and the object to be measured 50, and the like. Specifically, the capacitance value detected by the modules 2, 3_1 to 3_3 increases as the distance from the object to be measured 50 decreases. Therefore, by using the capacitance value between each module 2, 3_1 to 3_3 and the object to be measured 50 and the position information of each module 2, 3_1 to 3_3, the position of the object to be measured 50 and the position of the object to be measured 50 can be determined. The size can be specified.

When the sensor system is configured by using the sensor module 1 shown in FIG. 6, a position specifying portion (not shown) may be further provided. The position specifying unit is configured to specify the position of the object to be measured 50 by using the information acquired by the sensor module. That is, the position specifying portion uses the capacitance value detected by the detection electrode of the main module 2 and the capacitance value detected by the detection electrodes of the sub-modules 3_1 to 3_3, and uses the capacitance value of the object to be measured 50. Identify the location. The position specifying unit can be configured by using, for example, a computer or the like.

Specifically, the main board 11 of the sensor module 1 is connected to a computer, which is an external device, via an external wiring 15 (see FIG. 4). The computer can specify the position of the object to be measured 50 by performing the position specifying process on the capacitance values of the modules 2, 3_1 to 3_3 supplied from the sensor module 1.

As explained in the column of "Problems to be solved by the invention", since the capacitance sensor detects the state of the object to be measured by using the capacitance, the capacitance is located in the vicinity of the object to be measured. It is necessary to place electrodes to measure the value. Here, since the object to be measured has various shapes, it is necessary to arrange electrodes according to the shape and size of the object to be measured. Therefore, a sensor module and a sensor system capable of flexibly arranging electrodes according to the object to be measured have been required.

Therefore, in the present embodiment, the sensor module 1 is configured by using the main module 2 and the sub-modules 3_1 to 3_3. In this way, by forming the sensor module 1 by combining a plurality of modules 2, 3_1 to 3_3, the positions of the respective modules (electrodes) can be flexibly arranged according to the object to be measured. Therefore, according to the invention according to the present embodiment, it is possible to provide a sensor module and a sensor system in which electrodes can be flexibly arranged according to an object to be measured.

Further, conventionally, when the object to be measured is large, it has been necessary to use a capacitance sensor having a large electrode area. On the other hand, when the sensor module 1 is configured by combining a plurality of modules 2, 3_1 to 3_3 as in the invention according to the present embodiment, the plurality of modules 2, 3_1 to 3_3 are separated from each other and partially measured. Can be placed on an object. Therefore, even when the object to be measured is large, the total area of the electrodes to be used can be suppressed while arranging the electrodes on the entire object to be measured.

Further, in the present embodiment, the main module 2 and the sub modules 3_1 to 3_3 are connected by using the coaxial cables 13_1 to 13_3. Therefore, it is possible to suppress the generation of noise in the detection signals dct_1 to dct_3 transmitted from each of the submodules 3_1 to 3_3 to the main module 2.

Further, in the present embodiment, the sensor unit 10 included in each of the modules 2, 3_1 to 3_3 can be configured by using a flexible material. With such a configuration, as shown in FIG. 7, each module 2, 3_1 to 3_3 (sensor unit) can be arranged on the member 51 having a curved surface.

Further, in the present embodiment, the detection electrode 21 (see FIGS. 2 and 3) of the sensor unit 10 included in each of the modules 2 and 3_1 to 3_3 may be partially hollowed out. That is, the detection electrode 21 may have a structure that is partially hollowed out when viewed in a plan view. With such a configuration, the parasitic capacitance of the detection electrode 21 can be effectively reduced.

Further, in the present embodiment, an acceleration sensor may be further provided on at least one of the main board 11 and the relay boards 12_1 to 12_3. In this case, the position of the object to be measured 50 can be specified by further using the acceleration information acquired from the acceleration sensors provided on at least one of the main board 11 and the relay boards 12_1 to 12_3.

That is, by providing the acceleration sensor on the main board 11 and the relay boards 12_1 to 12_3, it is possible to detect the change in the position (posture) of each module 2, 3_1 to 3_3. Therefore, by correcting the capacitance value detected in each module 2, 3_1 to 3_3 by using the change in the position (posture) of each module 2, 3_1 to 3_3, the position of the object to be measured 50 can be further adjusted. It can be specified with high accuracy.

Next, a sensor system (method of using the sensor module) using the sensor module according to the present embodiment will be described with reference to FIGS. 8 to 11. Although only one sensor unit 10 is shown in FIGS. 8 to 11, the sensor system according to the present embodiment includes a plurality of sensor units 10, and the other sensor units 10 also have FIG. It has the same configuration as that shown in FIG.

As described above, in the present embodiment, the sensor system can be configured by using a plurality of modules 2, 3_1 to 3_3. At this time, as shown in FIG. 8, the measured object 50 may be detected by measuring the capacitance value generated between the detection electrode 21 of the sensor unit 10 and the measured object 50. For example, in this case, the position of the object to be measured 50 with respect to the sensor unit 10, the distance between the sensor unit 10 and the object to be measured 50, the size and shape of the object to be measured 50, and the like can be obtained.

Further, as shown in FIG. 9, the insulating member 52 may be arranged on the detection electrode 21 side of the sensor unit 10. That is, the sensor unit 10 may be attached to one side of the insulating member 52 to detect the object to be measured 50 existing on the other side of the insulating member 52. Also in this case, the measured object 50 is measured by measuring the capacitance value generated between the detection electrode 21 of the sensor unit 10 and the measured object 50 (in this case, it is necessary to consider the insulating member 52). Can be detected. Also in the configuration shown in FIG. 9, the position of the object to be measured 50 with respect to the sensor unit 10, the distance between the sensor unit 10 and the object to be measured 50, the size and shape of the object to be measured 50, and the like can be obtained.

Further, as shown in FIG. 10, the ground electrode 55 is arranged so as to face the detection electrode 21 of the sensor unit 10, and the deforming member 53 is arranged between the detection electrode 21 and the ground electrode 55 to form a sensor system. It may be configured. In this case, when the stress F acts on the shield electrode 22 side, the deforming member 53 is compressed and deformed. At this time, the distance between the detection electrode 21 and the ground electrode 55 changes, and the capacitance value detected by the detection electrode 21 changes. Therefore, by measuring the capacitance value detected by the detection electrode 21, it is possible to detect the object to be measured (that is, the stress F received from the object to be measured) existing on the shield electrode 22 side. Similarly, when the stress F acts from the ground electrode 55 side, the object to be measured existing on the ground electrode 55 side (that is, the stress F received from the object to be measured) can be detected.

For example, one ground electrode 55 is arranged on one surface of one deformation member 53, and a plurality of sensor units 10 are arranged on the other surface of one deformation member 53 to form a sensor system. May be good. With this configuration, the position of the object to be measured 50 with respect to the sensor unit 10, the size and shape of the object to be measured 50, and the like can be obtained.

Further, as shown in FIG. 11, the ground electrode 55 is arranged so as to face the detection electrode 21 of the sensor unit 10, the deformation member 53 is arranged between the detection electrode 21 and the ground electrode 55, and the sensor unit 10 is further arranged. The deforming member 56 may be arranged on the shield electrode 22 side of the above. In this case, when the stress F is applied to the deforming member 56, the deforming member 56 is compressed and deformed, and the deforming member 53 is further compressed and deformed. As a result, the distance between the detection electrode 21 and the ground electrode 55 changes, and the capacitance value detected by the detection electrode 21 changes. Therefore, by measuring the capacitance value detected by the detection electrode 21, the object to be measured (that is, the stress F applied from the object to be measured to the deformable member 56) is detected. be able to. In the configuration shown in FIG. 11, even when the sensor electrode 10 and the ground electrode 55 are exchanged to form the sensor system, the object to be measured (that is, the object to be measured to the member to be deformed) arranged on the deformable member 56 is similarly configured. The stress F) applied to 56 can be detected.

For example, one ground electrode 55 is arranged on one surface of one deformation member 53, a plurality of sensor units 10 are arranged on the other surface of one deformation member 53, and a shield electrode of the sensor unit 10 is further arranged. One deforming member 56 may be arranged on the 22 side. With this configuration, the position of the object to be measured 50 on the surface of the deformable member 56, the size and shape of the object to be measured 50, and the like can be obtained.

In the invention according to the present embodiment, the arrangement of the plurality of sensor units (electrodes) 10 is not limited to the above configuration, and can be appropriately changed according to the size and shape of the object to be measured.

Further, in the above-described embodiment, the case where the main module 2 and the sub-module 3 are connected to form the sensor module 1 has been described. However, depending on the size and shape of the object to be measured, the installation environment of the sensor module, and the like, the sensor module 1 may be configured only by the main module 2 without connecting the sub module 3.

For example, in the present embodiment, a plurality of sets of sensor modules 1 configured by connecting the main module 2 and the sub module 3 may be used according to the size and shape of the object to be measured, the installation environment of the sensor system, and the like. At this time, the sensor module 1 composed of only the main module 2 without connecting the sub-module 3 may be included in the plurality of sets of sensor modules 1.

Although the present invention has been described above in accordance with the above-described embodiment, the present invention is not limited to the configuration of the above-described embodiment, and is within the scope of the claimed invention within the scope of the claims of the present application. Of course, it includes various modifications, corrections, and combinations that can be made by a person skilled in the art.

1 Sensor module 2 Main module 3_1, 3_2, 3_3 Submodule 10 Sensor unit 11 Main board 12 Relay board 13_1, 13_2, 13_3 Coaxial cable 15 External wiring 20 Insulation layer 21 Detection electrode 22 Shield electrode 23, 24 Insulation layer 30 Integrated circuit ( IC)
31 Processing circuit 32 Buffer circuit 33 Connector 34 Bad 41 Bad 42 Connector 50 Measured object 51 Member 52 Insulation member 53, 56 Deformation member 55 Ground electrode

Claims (11)

A main module including a plate-shaped sensor unit capable of detecting capacitance and a main board connected to the sensor unit.
A submodule including a plate-shaped sensor unit capable of detecting capacitance and a relay board connected to the sensor unit is provided.
Each of the sensor portions includes an insulating layer, a detection electrode which is an electrode layer formed on the first surface of the insulating layer, and a shield electrode which is an electrode layer formed on the second surface of the insulating layer. , Has,
The relay board of the sub-module is connected to the main board of the main module by using a coaxial cable, and the arrangement of the main module and the sub-module can be changed according to the object to be measured.
The main board is provided with a processing circuit for processing the detection signal detected by the sensor unit of the main module and the detection signal detected by the sensor unit of the sub module.
The rigid main board or relay board is directly provided at the end of the flexible sensor unit.
With the sensor module
A ground electrode arranged so as to face the plurality of detection electrodes,
A first deforming member arranged between the plurality of detection electrodes and the ground electrode is provided.
The ground electrode is arranged on one surface of the first deformable member, and each of the sensor portions is arranged on the other surface of the first deformable member.
In each of the sensor units, the detection electrode is provided on the ground electrode side, and the shield electrode is provided on the object to be measured side.
By detecting the change in the distance between each of the detection electrodes and the ground electrode using the capacitance value detected by each of the detection electrodes, the object to be measured on the shield electrode side is detected. ,
Sensor system. Further, a second deformable member arranged on the side of the plurality of shield electrodes is provided.
By detecting the change in the distance between each of the detection electrodes and the ground electrode using the capacitance value detected by each of the detection electrodes, the cover placed on the second deformation member is detected. Detect the object to be measured,
The sensor system according to claim 1. The main board includes a buffer circuit for applying a shield voltage having the same potential as the potential of the detection electrode of each sensor unit to the shield electrode of each of the sensor units, according to claim 1 or 2. Described sensor system. The sensor system according to claim 3, wherein the shield voltage is supplied to the shield electrode of the sub-module from the buffer circuit included in the main board via the coaxial cable. Claims 1 to 4, wherein the insulating layer constituting the sensor unit is configured by using a flexible resin sheet, and the detection electrode and the shield electrode are configured by using a conductive sheet. The sensor system according to any one. The area of the sensor unit in a plan view is larger than the area of each of the main board and the relay board in a plan view.
The sensor system according to any one of claims 1 to 5. Each of the main board and the relay board is provided with a connector connected to the coaxial cable.
The coaxial cable is configured to be detachable from the connector.
The sensor system according to any one of claims 1 to 6. The sensor system according to any one of claims 1 to 7, wherein the detection electrode included in the sensor unit has a structure that is partially hollowed out when viewed in a plan view. The sensor system according to any one of claims 1 to 8, wherein an acceleration sensor is provided on at least one of the main board and the relay board. A position specifying unit for specifying the position of the object to be measured by using the information acquired by the sensor module is provided.
The position specifying unit identifies the position of the object to be measured by using the capacitance value detected by the detection electrode of the main module and the capacitance value detected by the detection electrode of the submodule. ,
The sensor system according to any one of claims 1 to 9. The sensor system according to claim 10, wherein the position specifying unit further uses acceleration information acquired from acceleration sensors provided on the main board and the relay board to specify the position of the object to be measured.

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