JP7016995B1 - Plating equipment and plating method - Google Patents

Abstract

A plating tank, a diaphragm that divides the plating tank into upper and lower parts, an anode arranged in the anode chamber partitioned below the anode chamber, and a substrate as a cathode arranged above the anode chamber. A substrate holder to be held, a supply port for introducing the plating solution into the anode chamber, a discharge port for discharging the plating solution from the anode chamber, and a plating solution provided in the anode chamber and directed from the supply port to the discharge port. A plating apparatus comprising one or more streams swaying by the flow of a plating solution, the stream having one end fixed adjacent to the diaphragm on the upstream side of the flow of plating solution.

Description

The present application relates to a plating apparatus and a plating method.

In a face-down type plating device that performs plating with the plating surface of the substrate (wafer) facing downward, a configuration is adopted in which a diaphragm is installed between the anode and the substrate to separate the plating solution on the anode side and the cathode side. In some cases. This is to prevent decomposition products that are harmful to the plating performance generated by the electrochemical reaction on the surface of the insoluble anode from reaching the substrate. In the plating apparatus having this configuration, bubbles of the anode gas (for example, oxygen) generated at the anode during plating float up, and the bubbles adhere to and stagnate on the lower surface of the diaphragm. When a large amount of bubbles adhere to the lower surface of the diaphragm, no current flows through that portion, so that the distribution of the electric field (current) may become uneven. As a result, a partial film thickness shortage may occur, resulting in a defective product on the substrate.

On the other hand, in a plating apparatus using a dissolution anode, there is no problem of bubbles because the anode metal dissolves instead of generating oxygen at the anode due to the oxidation reaction by electrolysis. On the other hand, the dissolution anode has the following problems. Since the anode itself is consumed by plating, frequent replacement work of the anode is required. In addition, it takes time to stabilize the surface condition of the anode (black film formation by Cu plating). In addition, the black film may peel off and adhere to the plating film, causing defects. In addition, the anode becomes thinner with use, and the distance between the electrodes between the substrate and the anode increases, so that the in-plane uniformity of the substrate plating film changes. Further, in the face-down type, since the dissolution anode is located at the bottom of the plating tank, workability at the time of replacement is poor. Specifically, there is a problem that it is necessary to remove all the plating solution and lift a heavy anode plate.

Further, the following plating devices are known. U.S. Patent Application Publication No. 2019-0055665 (Patent Document 1) describes a plating apparatus in which a diaphragm is fixed in a mortar shape above an insoluble anode. In this device, the bubbles generated at the insoluble anode flow along the diaphragm toward the outer periphery of the plating tank, and are discharged from there to the outside of the plating tank. U.S. Patent Application Publication No. 2018-0237933 (Patent Document 2) describes a plating apparatus in which a diaphragm is provided above an insoluble anode and a plating solution in an anode chamber is circulated by a pump. Bubbles generated at the insoluble anode are sent to a gas-liquid separation tank outside the tank by circulation by a pump, where they are separated from the plating solution. U.S. Patent Application Publication No. 2017-0121842 (Patent Document 3) describes a plating apparatus in which a substrate is installed face-up and a plating solution flows down from above the substrate. In this device, bubbles generated from the anode are discharged to the upper part, so that the substrate is not affected by the bubbles. In U.S. Patent Application Publication No. 2016-0047058 (Patent Document 4), a diaphragm is installed above the anode and a mechanism for stirring the plating solution is installed near the surface of the substrate to remove air bubbles adhering to the surface of the substrate. The plating equipment to be removed is described.

U.S. Patent Application Publication No. 2019-0055665 U.S. Patent Application Publication No. 2018-0237933 U.S. Patent Application Publication No. 2017-0121842 U.S. Patent Application Publication No. 2016-0047058

In the plating apparatus of Patent Document 1, a distance for obtaining an inclination between the anode and the diaphragm is required, and a large amount of plating solution (anode solution) in the anode chamber is required. It also causes an increase in the size of the device and the amount of liquid used. Fine bubbles of oxygen adhering to the surface of the septum are not easily desorbed by surface tension and remain in place. This can cause a partial film thickness abnormality. In the plating apparatus of Patent Document 2, bubbles generated from the anode are not positively removed and are likely to remain in the plating tank. In the plating apparatus of Patent Document 3, since it is difficult to store the plating solution, there is a problem that it is difficult to uniformly agitate the plating solution in the vicinity of the substrate. The plating apparatus of Patent Document 4 is considered to be a system assuming a melting anode, and no particular measures have been taken regarding bubbles on the anode side.

The present invention has been made in view of the above, and an object of the present invention is to provide a technique capable of suppressing deterioration of the plating quality of a substrate due to an anode gas staying on the lower surface of a diaphragm. Make it one.

According to one aspect of the present invention, a plating tank, a diaphragm that divides the plating tank into upper and lower parts, an anode arranged in the anode chamber partitioned below the anode chamber, and above the anode chamber. A substrate holder that is arranged and holds a substrate as a cathode, a supply port for introducing a plating solution into the anode chamber, a discharge port for discharging the plating solution from the anode chamber, and a supply port provided in the anode chamber. It comprises one or more streams that are swayed by the flow of plating solution from the mouth to the outlet, one end of which is fixed adjacent to the diaphragm on the upstream side of the flow of plating solution. Plating equipment is provided.

It is a perspective view which shows the whole structure of the plating apparatus which concerns on 1st Embodiment. It is a top view which shows the whole structure of the plating apparatus which concerns on 1st Embodiment. It is sectional drawing for demonstrating the structure of the plating module which concerns on 1st Embodiment. It is a top view for demonstrating the structure of the plating module which concerns on 1st Embodiment. This is an example of a windsock configuration. This is an example of a windsock configuration. This is an example of a windsock configuration. This is an example of a windsock configuration. This is an example of a windsock configuration. It is sectional drawing for demonstrating the structure of the plating module which concerns on 2nd Embodiment. It is a top view for demonstrating the structure of the plating module which concerns on 2nd Embodiment. It is sectional drawing for demonstrating the generation of a vortex by a shielding member. This is a configuration example of a shielding member. This is a configuration example of a shielding member.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments and modifications of the embodiments, the same or corresponding configurations may be designated by the same reference numerals and description thereof may be omitted as appropriate. In addition, the features shown in each embodiment can be applied to other embodiments as long as they do not contradict each other. Further, the drawings are schematically shown in order to facilitate understanding of the features of the embodiments and modifications, and the dimensional ratios and the like of each component are not always the same as those of the actual ones.

In the present specification, the "board" is not only a semiconductor substrate, a glass substrate, a liquid crystal substrate, and a printed circuit board, but also a magnetic recording medium, a magnetic recording sensor, a mirror, an optical element, a micromechanical element, or a partially manufactured element. Includes integrated circuits and any other object to be processed. The substrate includes any shape including polygons and circles. Further, in this specification, expressions such as "front", "rear", "front", "back", "top", "bottom", "left", and "right" are used, but these are for convenience of explanation. The above shows the position and direction of the illustrated drawings on the paper, and may differ from the actual arrangement when the device is used.

(First Embodiment)
FIG. 1 is a perspective view showing the overall configuration of the plating apparatus 1000. FIG. 2 is a plan view showing the overall configuration of the plating apparatus 1000. As shown in FIGS. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, and a transfer. It includes a device 700 and a control module 800.

The load port 100 is a module for carrying in a substrate housed in a cassette such as FOUP (not shown in the plating apparatus 1000) or for carrying out the substrate from the plating apparatus 1000 to the cassette. In the present embodiment, four load ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transport robot 110 is a robot for transporting the substrate, and is configured to transfer the substrate between the load port 100, the aligner 120, and the transport device 700. When the transfer robot 110 and the transfer device 700 transfer the substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporary stand (not shown).

The aligner 120 is a module for aligning the positions of the orientation flat and the notch of the substrate in a predetermined direction. In the present embodiment, the two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 replaces the air inside the pattern formed on the surface of the substrate with the treatment liquid by wetting the surface to be plated of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water. The pre-wet module 200 is configured to perform a pre-wet treatment that facilitates supply of the plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with the plating liquid at the time of plating. In the present embodiment, the two pre-wet modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wet modules 200 are arbitrary.

The pre-soak module 300 cleans the surface of the plating base by, for example, etching and removing an oxide film having a large electric resistance existing on the surface of the seed layer formed on the surface to be plated of the substrate before the plating treatment with a treatment liquid such as sulfuric acid or hydrochloric acid. Alternatively, it is configured to be subjected to a pre-soak treatment that activates it. In the present embodiment, the two pre-soak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 applies a plating process to the substrate. In the present embodiment, there are two sets of 12 plating modules 400 arranged three in the vertical direction and four in the horizontal direction, and a total of 24 plating modules 400 are provided. However, the plating module 400 is provided. The number and arrangement of are arbitrary.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating process. In the present embodiment, the two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for rotating the substrate after the cleaning treatment at high speed to dry it. In the present embodiment, two spin rinse dryers 600 are arranged side by side in the vertical direction, but the number and arrangement of the spin rinse dryers 600 are arbitrary. The transport device 700 is a device for transporting a substrate between a plurality of modules in the plating device 1000. The control module 800 is configured to control a plurality of modules of the plating apparatus 1000, and can be configured from a general computer or a dedicated computer having an input / output interface with an operator, for example.

An example of a series of plating processes by the plating apparatus 1000 will be described. First, the substrate housed in the cassette is carried into the load port 100. Subsequently, the transfer robot 110 takes out the board from the cassette of the load port 100 and transfers the board to the aligner 120. The aligner 120 aligns the orientation flats, notches, and the like of the substrate in a predetermined direction. The transfer robot 110 transfers the substrate aligned with the aligner 120 to the transfer device 700.

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wet module 200. The pre-wet module 200 applies a pre-wet treatment to the substrate. The transport device 700 transports the pre-wet-treated substrate to the pre-soak module 300. The pre-soak module 300 applies a pre-soak treatment to the substrate. The transport device 700 transports the pre-soaked substrate to the plating module 400. The plating module 400 applies a plating process to the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the cleaned substrate to the spin rinse dryer 600. In the spin rinse dryer 600, the substrate is dried. The transfer device 700 transfers the dried substrate to the transfer robot 110. The transfer robot 110 transfers the board received from the transfer device 700 to the cassette of the load port 100. Finally, the cassette containing the substrate is carried out from the load port 100.

The configuration of the plating apparatus 1000 described with reference to FIGS. 1 and 2 is only an example, and the configuration of the plating apparatus 1000 is not limited to the configuration of FIGS. 1 and 2.

The control module 800 has a memory for storing a predetermined program and a CPU for executing the program of the memory. The storage medium constituting the memory stores various setting data, various programs including a program for controlling the plating apparatus 1000, and the like. The storage medium can include non-volatile and / or volatile storage media. As the storage medium, for example, a memory such as a computer-readable ROM, RAM, or flash memory, or a known storage medium such as a hard disk, a CD-ROM, a DVD-ROM, or a disk-shaped storage medium such as a flexible disk can be used. .. Some or all the functions of the control module 800 can be configured by hardware such as ASIC. Some or all the functions of the control module 800 may be configured by a sequencer. A part or all of the control module 800 can be arranged inside and / or outside the housing of the plating apparatus 1000. A part or all of the control module 800 is communicably connected to each part of the plating apparatus 1000 by wire and / or wirelessly.

(Plating module)
Subsequently, the plating module 400 will be described. Since the plurality of plating modules 400 included in the plating apparatus 1000 according to the present embodiment have the same configuration, one plating module 400 will be described.

FIG. 3 is a cross-sectional view for explaining the configuration of the plating module 400 of the plating apparatus 1000 according to the present embodiment. FIG. 4 is a top view for explaining the configuration of the plating module 400. The plating apparatus 1000 according to the present embodiment is a so-called cup-type plating apparatus. The plating module 400 of the plating apparatus 1000 according to the present embodiment mainly includes a plating tank 10, an anode 30, and a substrate holder 20. In this plating module 400, the anode 30 is electrically connected to the positive electrode of the power supply 40, the substrate W (cathode) held by the substrate holder 20 is electrically connected to the negative electrode of the power supply 40, and the substrate holder 20 is rotated. However, a plating current is passed from the anode 30 to the substrate W to form a plating film on the substrate W.

The plating tank 10 according to the present embodiment is composed of a bottomed container having an opening at the top. Specifically, the plating tank 10 has a bottom wall portion 10a and an outer peripheral wall portion 10b extending upward from the outer peripheral edge of the bottom wall portion 10a, and the upper portion of the outer peripheral wall portion 10b is open. is doing. The shape of the outer peripheral wall portion 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall portion 10b according to the present embodiment has a cylindrical shape as an example.

A plating solution is stored inside the plating tank 10. The plating solution may be a solution containing ions of metal elements constituting the plating film, and specific examples thereof are not particularly limited. In this embodiment, the copper plating treatment is used as an example of the plating treatment, and the copper sulfate solution is used as an example of the plating solution. Further, in the present embodiment, the plating solution contains a predetermined additive. However, the configuration is not limited to this, and the plating solution may have a configuration that does not contain additives.

An anode 30 is arranged inside the plating tank 10. Although not particularly limited, in the present embodiment, an insoluble anode is used as a specific example of the anode 30. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like can be used.

As shown in FIG. 3, inside the plating tank 10, the diaphragm 12 is arranged above the anode 30. Specifically, the diaphragm 12 is arranged at a position between the anode 30 and the substrate W (cathode). The outer peripheral portion of the diaphragm 12 according to the present embodiment is connected to the outer peripheral wall portion 10b of the plating tank 10. Further, the diaphragm 12 according to the present embodiment is arranged so that the plane direction of the diaphragm 12 is horizontal, that is, substantially parallel to the substrate.

The inside of the plating tank 10 is divided into two in the vertical direction by the diaphragm 12. The region defined below the diaphragm 12 is referred to as an anode chamber 13. The region above the diaphragm 12 is referred to as the cathode chamber 14. The anode 30 described above is arranged in the anode chamber 13.

The diaphragm 12 is composed of a film that allows the passage of ions and suppresses the passage of additives contained in the plating solution. That is, in the present embodiment, the plating solution in the cathode chamber 14 contains an additive, but the plating solution in the anode chamber 13 does not contain an additive. However, the configuration is not limited to this, and for example, the plating solution in the anode chamber 13 may also contain an additive. The specific type of the diaphragm 12 is not particularly limited, and a known diaphragm can be used. As a specific example of the diaphragm 12, for example, an electrolytic diaphragm can be used, and as a specific example of the electrolytic diaphragm, for example, an electrolytic diaphragm for plating manufactured by Yuasa Membrane System Co., Ltd. may be used, or an ion exchange membrane may be used. Etc. can be used.

By providing the diaphragm 12 in the plating apparatus 1000 as in the present embodiment, it is possible to suppress the decomposition or reaction of the components of the additive contained in the plating solution due to the reaction on the anode side, and the addition thereof. It is possible to suppress the movement of components that adversely affect plating to the substrate side due to the decomposition or reaction of the components of the agent.

The plating tank 10 is provided with an anode supply port 15 for supplying a plating solution to the anode chamber. Further, the plating tank 10 is provided with an anode discharge port 16 for discharging the plating solution of the anode chamber 13 from the anode chamber 13. The plating solution Ps discharged from the anode discharge port 16 is then stored in a reservoir tank for the anode (not shown), and then is supplied again from the anode supply port 15 to the anode chamber 13.

The plating tank 10 is provided with a cathode supply port (not shown) for supplying the plating solution to the cathode chamber 14. For example, a cathode supply port (not shown) is provided in a portion of the outer peripheral wall portion 10b of the plating tank 10 according to the present embodiment corresponding to the cathode chamber 14.

Further, an overflow tank (not shown) composed of a bottomed container is provided on the outside of the outer peripheral wall portion 10b at a position corresponding to the cathode chamber 14 of the plating tank 10. The overflow tank is a tank provided for storing the plating liquid (that is, the plating liquid overflowing from the plating tank 10) beyond the upper end of the outer peripheral wall portion 10b of the plating tank 10. The plating solution supplied from the cathode supply port to the cathode chamber 14 flows into the overflow tank, and then is discharged from the overflow tank discharge port (not shown) to the cathode reservoir tank (not shown). It is stored. After that, the plating solution is supplied again to the cathode chamber from the cathode supply port.

A porous resistor (not shown) may be arranged in the cathode chamber 14 in the present embodiment. The resistor is composed of a porous plate member having a plurality of pores (pores). However, the resistor is not an essential configuration in this embodiment, and the plating apparatus 1000 may be configured without the resistor. Further, a paddle (not shown) may be arranged in the vicinity of the substrate holder 20 between the resistor and the substrate W to stir the plating solution.

In this embodiment, as shown in FIGS. 3 and 4, a windsock 50 is provided in the vicinity of the diaphragm 12 in the anode chamber 13. In other words, the windsock 50 is provided adjacent to the diaphragm 12 at a predetermined distance from the diaphragm 12 or in contact with the diaphragm 12. The windsock 50 has an elongated member (slender member) 51 that swings as shown by an arrow 70 in FIG. 4 due to the flow of the plating solution supplied from the anode supply port 15 and discharged from the anode discharge port 16. A fixed end 60 is attached to one end of the elongated member 51. The fixed end 60 can be fixed to the diaphragm 12 as shown in FIG. Further, the fixed end 60 may be fixed to the outer peripheral wall portion 10b of the plating tank 10 by, for example, an L-shaped bracket. As shown in FIG. 3, the fixed end 60 has a slightly higher dimension than the elongated member 51 so that the elongated member 51 can swing in a state of being separated by a predetermined distance in the vicinity of the lower surface of the diaphragm 12. The other end of the elongated member 51 is a free end. Further, the fixed end 60 of the windsock 50 (slender member 51) is fixed at a position facing the anode supply port 15, so that the slender member 51 is susceptible to the flow of the plating solution.

The windsock 50 may or may not come into contact with the lower surface of the diaphragm 12 when it is shaken by the flow of the plating solution. When the windsock 50 does not come into contact with the lower surface of the diaphragm 12, an external force is applied to the bubbles adhering to the lower surface of the diaphragm 12 by the vibration of the plating solution due to the swing of the windsock 50 in the vicinity of the diaphragm 12, and the bubbles are enlarged. It has the effect of being discharged by being placed on the flow of plating solution. When the windsock 50 comes into contact with the lower surface of the diaphragm 12, in addition to the effect of enlarging the air bubbles due to the vibration of the plating solution due to the vibration of the windsock 50, the elongated member 51 comes into contact with the air bubbles and applies an external force to generate the air bubbles. It also has the effect of enlarging it and putting it on the flow of the plating solution and discharging it.

The windsock 50 is made of a material that satisfies the following conditions.
(1) Being flexible to swing due to the flow of the plating solution (including the case where the elongated member itself has flexibility and the case where a plurality of elongated members (for example, rod-shaped members) are movably connected to each other).
(2) The specific gravity is not too high and not too low compared to the plating solution (if the specific gravity is too high, it sinks and the lower surface of the diaphragm 12 is patted with the windsock 50 (or the vibration of the plating solution due to the shaking of the windsock 50). This is because it is not possible to apply a sufficient external force to the bubbles), and if the specific gravity is too low, sufficient force to move the bubbles cannot be transmitted).
(3) Resistant to the plating solution and usage environment (temperature, flow). For example, it can be made of a resin such as vinyl chloride.

The windsock 50 removes bubbles Bu of the anode gas (for example, oxygen) generated at the anode 30 and adhering to the lower surface of the diaphragm 12 from the diaphragm 12. That is, the windsock 50 sways in the vicinity of the lower surface of the diaphragm 12 due to the force of the flow of the plating solution in the anode chamber 13, and the vibration beats the bubble Bu adhering to the lower surface of the diaphragm 12, and applies an external force to the bubbles to make them fine. Make sure that large bubbles are removed. The bubble Bu removed from the lower surface of the diaphragm 12 is discharged from the anode discharge port 16 by the flow of the plating solution. Then, for example, it is separated from the plating solution in a gas-liquid separation tank (not shown) outside the plating tank 10.

Bubbles of anode gas (for example, oxygen) generated from the anode 30 which is an insoluble anode are as small as about 0.5 mm in diameter, and while the bubbles are small, the buoyancy is small and they float in the liquid for a long time. Once the bubbles adhere to the lower surface of the diaphragm 12, they are difficult to flow because the force of adhesion to the diaphragm 12 is greater than the force received by the flow of the plating solution. Further, since the bubbles are stabilized by the effect of the surfactant component contained in the additive in the plating solution, the fine bubbles are larger and more difficult to collect than in pure water. On the other hand, when an external force is applied to a bubble, it has the property of easily growing into a large bubble. When the bubbles grow to a diameter of about 3 to 5 mm, the force received by the flow of the plating solution becomes larger than the force of adhesion to the diaphragm, so that the bubbles are discharged along with the flow. Therefore, in the present embodiment, an external force is applied to the bubbles adhering to the lower surface of the diaphragm 12 by the windsock 50 to grow them into large bubbles, so that the bubbles are put on the flow of the plating solution and discharged.

The windsock 50 according to the present embodiment has a simple structure and does not require maintenance. Further, since the windsock 50 sways due to the flow of the plating solution in the anode chamber 13, no dedicated power is required. Further, the windsock 50 does not need to be electrically or mechanically connected to the outside of the plating tank, and it is not necessary to make a hole in the wall of the plating tank 10. Further, the installation of the windsock 50 does not require a large space, and the amount of plating solution used and the height of the device can be saved.

5A to 5E show a configuration example of the windsock 50. The windsock 50 of FIG. 5A is composed of a ribbon-shaped elongated member 51. The windsock 50 in FIG. 5B is composed of a string-shaped (rope-shaped) elongated member 51. The string-shaped (rope-shaped) elongated member 51 can have a cross section of any shape. In the windsock 50 of FIG. 5C, the elongated member 51 has a plurality of rod-shaped members 51a and a hinge 51b that swingably connects the plurality of rod-shaped members 51a to each other. The hinge 51b is configured such that a plurality of rod-shaped members 51a are easy to move in the horizontal direction and difficult to move in the vertical direction. As a result, the effect of removing air bubbles by the plurality of rod-shaped members 51a is improved. If the windsock 50 or the elongated member 51 as a whole has the flexibility to sway due to the flow of the plating solution, the rod-shaped member 51a itself does not have to have the flexibility to sway due to the flow of the plating solution (ribbon shape, string). Less flexible than the elongated member 51).

In the windsock 50 of FIG. 5D, balloon-shaped floats 53 are provided at a plurality of positions of the string-shaped elongated member 51. By making the balloon-shaped float 53 hollow or by using a material having a density lower than that of the plating solution, buoyancy is given to the elongated member 51, and the elongated member 51 easily floats in the plating solution. This makes it possible to improve the effect of removing air bubbles with the windsock 50.

In the windsock 50 of FIG. 5E, spoon-shaped floats 53 are provided at a plurality of positions of the string-shaped elongated member 51. The spoon-shaped float 53 is composed of a curved sheet-shaped member, and has a small area on the side fixed to the elongated member 51 and a large area on the free end side. In this configuration, the spoon-shaped float 53 floats in the plating solution while repeating ups and downs due to the flow of the plating solution, and the effect of removing air bubbles by the windsock 50 can be improved. One or a plurality of windsocks shown in FIGS. 5A to 5E may be combined and arranged in the plating tank 10.

(Second Embodiment)
FIG. 6 is a cross-sectional view for explaining the configuration of the plating module 400 according to the second embodiment. FIG. 7 is a top view for explaining the configuration of the plating module 400 according to the second embodiment. FIG. 8 is a cross-sectional view for explaining the generation of a vortex by the shielding member 80. In the following description, the differences from the above-described embodiment will be mainly described, the same components as those in the above-described embodiment will be designated by the same reference numerals, and the description thereof will be omitted.

In this embodiment, the shielding member 80 is arranged in the anode chamber 13 instead of the windsock 50. The shielding member 80 is a rod-shaped member, and is arranged in the anode chamber 13 so as to cross / block the flow of the plating solution from the anode supply port 15 to the anode discharge port 16. In this embodiment, the shielding member 80 has a substantially circular cross section, as shown in FIG. The cross section of the shielding member 80 may have another shape such as an ellipse. As shown in FIG. 7, both ends of the shielding member 80 are fixed to the outer peripheral wall portion of the plating tank 10. As shown in FIG. 6, the shielding members 80 are arranged in a staggered manner so that adjacent shielding members 80 are arranged at different heights. In the example of the figure, the shielding member 80 is arranged at two different heights. In another example, the shielding members 80 may be staggered so as to be arranged at three or more different heights. Further, the plurality of shielding members 80 may be arranged in a matrix rather than being staggered.

If there is an obstacle (shielding member 80) in the liquid flow path, a Karman vortex is generated downstream of the obstacle (shielding member 80). The Karman vortex causes the flow to become turbulent, and the peeling effect of the vortex causes bubbles to be peeled off from the diaphragm 12, making it easier to flow downstream. It also has the effect of collecting bubbles by stirring the plating solution with a vortex and collecting them into large bubbles. As described above, when the bubbles become large, the force received by the flow of the plating solution becomes large and the bubbles are easily flown. The diameter and spacing of the shielding members 80 are selected to amplify the amplitude of the Karman vortex. By providing the shielding members 80 having an appropriate diameter in a staggered arrangement at appropriate intervals, the amplitude of the Karman vortex can be amplified, the flow of the plating solution is more disturbed, and the effect of peeling bubbles from the diaphragm 12 is improved. can.

The conditions for obtaining the bubble removal effect by the Karman vortex are as follows.
(1) Since the position and strength of Karman vortices change depending on the flow velocity of the plating solution and the size (diameter), shape, and arrangement of the shielding member 80, the type of shielding member 80 depends on the usage conditions (configuration of the plating module). Adjust the position appropriately.
(2) The distance between the shielding member 80 and the diaphragm 12 is set to a distance at which Karman vortices reach the surface of the diaphragm 12 and air bubbles easily pass over the shielding member 80.
(If the distance between the shielding member 80 and the diaphragm 12 is too long, the downstream Karman vortex may not reach the diaphragm surface, and the effect of separating air bubbles may not be obtained. On the contrary, the shielding member 80 and the diaphragm 12 may not have the effect. If the distance between them is too close, it becomes difficult for air bubbles to pass over the shielding member 80, and air bubbles may stay on the upstream side of the shielding member 80.)
(3) Since the electric field during plating is shielded by the shielding member 80 and may affect the film thickness distribution of the substrate plating film, the thickness and number of shielding members 80 (projected area on the substrate surface) are the minimum necessary. Adjust the arrangement so that the distribution is uniform.

9 and 10 are cross-sectional views showing another configuration example of the shielding member 80. The shielding member 80 of FIG. 9 has a C-shape that opens on the upstream side of the flow of the plating solution in a cross-sectional view. By forming the shielding member 80 into a C-shape that opens upstream of the flow of the plating solution so as to have a high resistance to the flow of the plating solution, the efficiency of generating Karman vortices can be improved. The shielding member 80 of FIG. 10 is convex toward the diaphragm in a cross-sectional view, and has a blade shape in which the cross-sectional peripheral length on the diaphragm side is longer than the cross-sectional peripheral length on the anode side. According to this configuration, by forming the cross section of the shielding member 80 into a blade shape, a Karman vortex is generated on the downstream side of the blade shape, and the flow velocity of the plating solution is increased in the vicinity of the diaphragm 12 to adhere to the diaphragm 12. It is possible to promote the separation of air bubbles. The shielding members of one or a plurality of forms shown in FIGS. 8 to 10 may be combined and arranged in the plating tank 10.

(Other embodiments)
(1) In the above embodiment, the anode 30 is an insoluble anode, but it may be a dissolved anode.
(2) In the above embodiment, the case where a plurality of windsocks 50 are provided has been described, but a single windsock may be provided. By appropriately setting the size of the windsock, even a single windsock can exert a certain effect in removing air bubbles adhering to the diaphragm.
(3) In the above embodiment, the case where a plurality of shielding members 80 are provided has been described, but a single shielding member may be provided. By appropriately setting the size of the shielding member, even a single shielding member can exert a certain effect in removing air bubbles adhering to the diaphragm.
(4) A part or all of the shielding member 80 may be configured such that one end is fixed to the outer peripheral wall portion of the plating tank 10 and the other end is not fixed to the outer peripheral wall portion and extends to the middle of the anode chamber. Further, both ends of the shielding member 80 are fixed to the outer peripheral wall portion of the plating tank 10, but the structure is interrupted in the middle (the rod-shaped member is divided into two and a space is provided between the two portions. It may be a configuration having. A windsock may be arranged at a portion where the shielding member 80 is interrupted in a plan view. One or more streamers 50 and one or more shield members 80 may be combined.

The present invention can also be described as the following forms.
According to the first embodiment, a plating tank, a diaphragm that divides the plating tank into upper and lower parts, an anode arranged in the anode chamber partitioned below the anode chamber, and an anode arranged above the anode chamber are arranged. A substrate holder that holds the substrate as a cathode, a supply port for introducing the plating solution into the anode chamber, a discharge port for discharging the plating solution from the anode chamber, and a discharge port provided in the anode chamber, from the supply port to the above. The plating apparatus comprises one or more streams that are swayed by the flow of the plating solution toward the discharge port, one end of which is fixed adjacent to the diaphragm on the upstream side of the flow of the plating solution. Will be provided. The supply port and the discharge port of the anode chamber are provided so as to face each other, for example.

According to this form, the windsock installed in the vicinity of the diaphragm is shaken by the force of the flow of the plating solution, and the vibration causes an external force to be applied to the fine bubbles adhering to the lower surface of the diaphragm, so that the fine bubbles become large. Collectively removed from the diaphragm by the flow of plating solution. As a result, the fine bubbles adhering to the lower surface of the diaphragm can be largely collected and discharged from the discharge port by the flow of the plating solution. As a result, it is possible to prevent the distribution of the electric field (current) from becoming non-uniform due to the bubbles adhering to the lower surface of the diaphragm and the distribution of the plating film thickness of the substrate from becoming non-uniform.

According to the second embodiment, in the plating apparatus of the first embodiment, at least one stream of the one or a plurality of streamers is a ribbon-shaped member. According to this form, by adjusting the width and thickness of the ribbon-shaped member, fine bubbles adhering to the diaphragm can be efficiently beaten.

According to Form 3, in the plating apparatus of Form 1, at least one stream of the one or more stream is a string-shaped member. According to this form, by adjusting the diameter of the string-shaped member, fine bubbles adhering to the diaphragm can be efficiently beaten.

According to the fourth embodiment, in the plating apparatus of the first embodiment, at least the windsocks of the one or the plurality of windsocks have a configuration in which a plurality of rod-shaped members are connected to each other by hinges and sway in the horizontal direction. According to this form, since the plurality of rod-shaped members are easy to move in the horizontal direction and difficult to move in the vertical direction, the effect of removing air bubbles can be improved.

According to the fifth embodiment, in the plating apparatus of the first embodiment, at least one of the windsocks has a balloon-like float. According to this form, by making the balloon-shaped float hollow or by using a material having a density lower than that of the plating solution, the windsock easily floats in the plating solution. This makes it possible to improve the effect of removing air bubbles by the windsock.

According to Form 6, in the plating apparatus of Form 1, at least the stream of the one or more stream has a spoon-like float. According to this form, the spoon-shaped float floats in the plating solution while repeating ups and downs due to the flow of the plating solution, and the effect of removing air bubbles by the windsock can be improved.

According to the seventh embodiment, the plating tank, the diaphragm that divides the plating tank into upper and lower parts, the anode arranged in the anode chamber partitioned below the anode chamber, and the anode arranged above the anode chamber are arranged. A substrate holder that holds the substrate as a cathode, a supply port for introducing the plating solution into the anode chamber, a discharge port for discharging the plating solution from the anode chamber, and a supply port to the discharge port in the anode chamber. Provided is a plating apparatus including one or a plurality of shielding members arranged so as to generate a Kalman vortex downstream of the shielding member, which is a rod-shaped shielding member arranged so as to cross the flow of the plating solution toward the plating solution. Will be done.

According to this form, a Karman vortex is generated downstream of the shielding member by the shielding member that blocks the flow of the plating solution. The Karman vortex causes the flow to become turbulent, and the peeling effect of the vortex causes bubbles to separate from the septum, making it easier to flow downstream. As a result, fine bubbles adhering to the lower surface of the diaphragm can be discharged from the discharge port by the flow of the plating solution. It also has the effect of collecting bubbles by stirring the plating solution with a vortex and collecting them into large bubbles. When the bubbles become large, the force received by the flow of the plating solution becomes large, and the bubbles are easily flown. As a result, it is possible to prevent the distribution of the electric field (current) from becoming non-uniform due to the bubbles adhering to the lower surface of the diaphragm and the distribution of the plating film thickness of the substrate from becoming non-uniform.

According to the eighth aspect, in the plating apparatus of the seventh aspect, the one or a plurality of shielding members are arranged in parallel with the diaphragm. According to this form, it is possible to make it easy to generate Karman vortices uniformly over the entire lower surface of the diaphragm.

According to Form 9, in the plating apparatus of Form 7 or 8, the one or more shielding members have a plurality of shielding members, and the plurality of shielding members are arranged in a staggered manner in a cross-sectional view. There is.

According to this form, the amplitude of the Karman vortex can be amplified by installing the shielding members of appropriate thickness in a staggered arrangement at appropriate intervals, thereby disturbing the flow of the plating solution more strongly. The effect of peeling off air bubbles can be enhanced.

According to the tenth aspect, in the plating apparatus according to any one of the seventh to nine forms, at least one shielding member of the one or a plurality of shielding members is a C-shaped opening on the upstream side of the flow of the plating solution in a cross-sectional view. Has a shape.

According to this form, the efficiency of Karman vortex generation is improved by forming the shielding member into a C-shape that opens upstream of the plating solution flow so as to have high resistance to the plating solution flow. Can be done.

According to the eleventh aspect, in the plating apparatus according to any one of the seventh to nine aspects, at least one of the shielding members of the one or the plurality of shielding members is convex toward the diaphragm side and has a cross-sectional peripheral length on the diaphragm side in a cross-sectional view. Has a blade shape longer than the cross-sectional circumference on the anode side.

According to this form, by forming the cross section of the shielding member into a blade shape, the flow velocity of the plating solution can be increased in the vicinity of the diaphragm, and the separation of bubbles adhering to the diaphragm can be promoted.

According to Form 12, the plating solution is formed from the supply port to the discharge port of the plating solution provided in the anode chamber partitioned on the lower side of the diaphragm in the plating tank, and the diaphragm is formed by the flow of the plating solution. A plating method comprising swinging a blower at a position adjacent to the plating solution, smashing bubbles adhering to the surface of the diaphragm on the anode chamber side to collect them into large bubbles, and discharging them from the outlet by the flow of the plating solution. Is provided.
According to this form, the same action and effect as described in the first form are obtained.

According to the thirteenth aspect, forming a flow of the plating solution from the supply port of the plating solution provided in the anode chamber partitioned on the lower side of the diaphragm in the plating tank to the discharge port, from the supply port in the anode chamber. A rod-shaped shielding member arranged so as to cross the flow of the plating solution toward the discharge port generates a Karman vortex on the downstream side of the shielding member and attracts air bubbles adhering to the surface of the diaphragm on the anode chamber side. A plating method including peeling and discharging from the discharge port is provided.
According to this form, the same action and effect as described in the form 7 can be obtained.

Although the embodiments of the present invention have been described above, the embodiments of the invention described above are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination of embodiments and modifications is possible within a range that can solve at least a part of the above-mentioned problems, or a range that exhibits at least a part of the effect, and is described in the claims and the specification. Any combination of each component or omission is possible.

10 Plating tank 12 Diaphragm 15 Anode supply port 16 Anode discharge port 20 Board holder 30 Anode 40 Power supply 50 Windsock 51 Elongated member 51a Rod-shaped member 51b Butterfly 53 Balloon-shaped float 54 Spoon-shaped float 60 Fixed end 80 Shielding member 400 Plating Module 1000 plating equipment

Claims (13)

With the plating tank,
The diaphragm that divides the plating tank up and down,
An anode arranged in the anode chamber partitioned below the diaphragm, and
A substrate holder that is arranged above the anode chamber and holds the substrate as a cathode,
A supply port for introducing the plating solution into the anode chamber and
An outlet for discharging the plating solution from the anode chamber and a discharge port
One or more windsocks provided in the anode chamber and swayed by the flow of the plating solution from the supply port to the discharge port.
Equipped with
One end of the windsock is fixed adjacent to the diaphragm on the upstream side of the flow of the plating solution.
Plating equipment. In the plating apparatus according to claim 1,
At least one stream of the one or more stream is a ribbon-shaped member, a plating apparatus. In the plating apparatus according to claim 1,
A plating device in which at least one stream of the one or more stream is a string-like member. In the plating apparatus according to claim 1,
At least the windsock of the one or more windsocks is a plating apparatus having a structure in which a plurality of rod-shaped members are connected to each other by hinges and swing in the horizontal direction. In the plating apparatus according to claim 1,
A plating apparatus in which at least one of the above-mentioned one or a plurality of windsocks has a balloon-like float. In the plating apparatus according to claim 1,
A plating device, wherein at least one of the one or more streamers has a spoon-like float. With the plating tank,
The diaphragm that divides the plating tank up and down,
An anode arranged in the anode chamber partitioned below the diaphragm, and
A substrate holder that is arranged above the anode chamber and holds the substrate as a cathode,
A supply port for introducing the plating solution into the anode chamber and
An outlet for discharging the plating solution from the anode chamber and a discharge port
A rod-shaped shielding member arranged so as to cross the flow of the plating solution from the supply port to the discharge port in the anode chamber, and is configured to generate a Karman vortex downstream of the shielding member. With multiple shielding members,
A plating device equipped with. In the plating apparatus according to claim 7,
The plating apparatus in which the one or a plurality of shielding members are arranged in parallel with the diaphragm. In the plating apparatus according to claim 7 or 8.
The one or more shielding members have a plurality of shielding members, and the shielding member has a plurality of shielding members.
A plating device in which the plurality of shielding members are arranged in a staggered manner in a cross-sectional view. In the plating apparatus according to any one of claims 7 to 9.
The plating apparatus having at least one shielding member of the one or a plurality of shielding members having a C-shape opening on the upstream side of the flow of the plating solution in a cross-sectional view. In the plating apparatus according to any one of claims 7 to 9.
The plating apparatus having at least one shielding member of the one or a plurality of shielding members having a blade shape that is convex toward the diaphragm side and has a cross-sectional peripheral length on the diaphragm side longer than the cross-sectional peripheral length on the anode side in a cross-sectional view. .. Forming a flow of plating solution from the supply port to the discharge port of the plating solution provided in the anode chamber partitioned on the lower side of the diaphragm in the plating tank.
The stream is swung at a position adjacent to the diaphragm by the flow of the plating solution, and bubbles adhering to the surface of the diaphragm on the anode chamber side are beaten to form large bubbles, and the flow of the plating solution is used from the outlet. To discharge,
Plating method including. Forming a flow of plating solution from the supply port to the discharge port of the plating solution provided in the anode chamber partitioned on the lower side of the diaphragm in the plating tank.
A rod-shaped shielding member arranged so as to cross the flow of the plating solution from the supply port to the discharge port in the anode chamber generates a Karman vortex on the downstream side of the shielding member, and the anode chamber side of the diaphragm. Peel off the air bubbles adhering to the surface of the surface and discharge it from the outlet.
Plating method including.

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