JP6982050B2 - Recirculating board container parsing system and method - Google Patents

Description

Priority Claim This patent application is filed on December 13, 2013 in US Provisional Patent Application No. 61/916701, "Recyclation Substrate Contacter Purgi.
Claim priority from "ng Systems and Methods".

The present disclosure generally relates to parsing of substrate containers, and more particularly to systems and / or methods of reducing purge gas consumption, according to one or more embodiments.

The carrier can protect the semiconductor substrate from, for example, foreign matter and chemical contamination in the air by holding the substrate in the sealing space. FOUP (front opening uni)
fied pod: front open integrated pod) or SMIF (standard mec)
Sealed carriers such as manual interface) pods are generally made of high performance plastic material. However, due to the moisture permeability of the plastic material or the dispersion of oxygen molecules, the humidity and oxygen content tend to increase over time, and for safety and operability, the carriers are generally configured to be hermetically sealed. Not done.

Further, the organic solvent evaporated from the substrate coating such as a photoresist substrate may adhere to the inner wall of the carrier. Therefore, the atmosphere in the carrier may be contaminated with organic compounds.

As a means of combating moisture, oxygen and organic pollutants in the carrier, dry air or nitrogen may be introduced into the sealed carrier to purge and replace the atmosphere in the carrier. Using a high purge gas stream, such as a flow of up to 150 l / min, with a large volume container, eg, for a 450 mm substrate, may require a significant amount of consumable purge gas.

Therefore, there is a demand for container parsing systems and methods to reduce the consumption of purge gas while maintaining a clean storage environment for semiconductor substrates.

In some embodiments, the invention discloses methods and systems for reducing the consumption of purge gas for semiconductor substrate containers. The recirculation type parsing system can be recirculated so that the purge gas is returned to the container, for example, through a filter. A moisture sensor may be included to monitor the humidity of the recirculated purge gas and allow the purge gas to maintain a dry state level within the container.

In some embodiments, the recirculation parsing system may accept a gas stream from the container, followed by optionally filtering and refining the gas stream before returning it to the container. Moisture sensors may be installed in the container or in the recirculation line to monitor the level of moisture.
This may be used to adjust the moisture level in the container. For example, when the moisture level exceeds a predetermined level, fresh dry air or nitrogen may be added to the recirculation line to reduce the humidity level. The recirculating parsing system maintains the required clean environment inside the container while maintaining the required clean environment.
A large amount of equipment gas such as clean dry air or nitrogen can be saved significantly.

In some embodiments, the recirculation parsing system may receive gas flow from the loading port where the container is located. The recirculation type purging system may then optionally filter and purify the gas stream before directing it to the container. Since the container is not airtightly sealed, the purge gas can escape to the loading port and recirculate. A moisture sensor may be installed to adjust the moisture level in the container.

In some embodiments, the recirculation parsing system may include a recirculator tank, which provides a purge gas flow to the container and also receives a return flow from the container.
The gas in the recirculator tank may be recirculated through the purifier to reduce the humidity level. Therefore, this refiner can capture contaminants and moisture from the return stream from the container.
A clean and dry recirculated gas can be supplied to the container.

1A-1B show FOUP containers according to some embodiments. 2A-2B show configurations for recirculating parsing of containers according to some embodiments. 3A-3B show a loading port system with recirculating parsing according to some embodiments. 4A-4B are flowcharts relating to recirculating parsing of semiconductor containers according to some embodiments. FIG. 5 shows a loading port system with recirculating parsing according to some embodiments. FIG. 6 is a flowchart relating to the recirculation type parsing of the semiconductor container according to some embodiments. FIG. 7 shows a loading port system with recirculating parsing according to some embodiments. FIG. 8 shows a loading port system with recirculating parsing according to some embodiments. FIG. 9 is a flowchart relating to the recirculation type parsing of the semiconductor container according to some embodiments. FIG. 10 shows a loading port system with recirculating parsing according to some embodiments. 11A-11B are flowcharts relating to recirculation type parsing of a semiconductor container according to some embodiments. FIG. 12 shows a loading port system with recirculating parsing according to some embodiments. FIG. 13 is a flowchart relating to the recirculation type parsing of the semiconductor container according to some embodiments.

In some embodiments, the present invention relates to parsing a container for substrates such as semiconductor wafers, flat panel displays and other products, wherein the product is stored in a storage chamber or processed by the container. It requires a clean environment while interfaced with a tool or other sealed chamber.

In some embodiments, the present invention discloses improved parsing methods and systems for semiconductor substrate containers to ensure a clean environment for lines while reducing equipment gas consumption. Semiconductor substrate containers include wafer boxes (eg, separate wafer boxes, cassette-type wafer boxes, FOUPs and SMIF pods), reticle boxes (eg, separate reticle boxes, reticle boxes for multiple substrates), stockers (wafer boxes or reticle boxes). Storage, bare wafer or bare reticle storage). In some embodiments, the recirculating parsing system may be used to purge the semiconductor substrate container, for example when it is located in the loading port for storage or waiting for processing. The quality of the purge gas may be assured by a filtration and purification system, which is configured to remove particles, organic and moisture contaminants from the recirculated purge gas stream. In addition, to monitor the quality of the purge gas and allow the recirculated purge gas to be replaced or regenerated with fresh dry gas.
A sensor such as a moisture sensor may be used.

SMIF to control the environment of delicate semiconductor substrates during storage and transportation within manufacturing equipment
And by using sealed containers such as FOUP systems, process control has been significantly improved and device contamination has been reduced. The container can be continuously purged to maintain a clean and dry environment, which can prevent contamination of the substrate, for example, from around the container or from degassing the container.

Although embodiments of the present invention have been described with respect to parsing of containers such as FOUPs and other SMIF pods, it should be understood that the present invention may be applied to any type of substrate container.

1A-1B show FOUP containers according to some embodiments. FIG. 1A shows a FOUP container 100 that may be used for storing a semiconductor substrate 117 such as a silicon wafer.
1B shows a perspective view of the above, and FIG. 1B shows a cross-sectional view of the FOUP container 100. FOUP10
0 may include the FOUP door 115 connected to the FOUP body 110. FOUP10
0 may have several inlets 125 for receiving purge gas 120 such as clean dry air or nitrogen. The FOUP 100 may have a filter 127, which filter 12
7 allows the escape of the purge gas to equilibrate the inside and outside of the FOUP. Alternatively, a one-way valve (one-way flap, etc.) may be provided to prevent the purge gas from entering while preventing the outside air from entering.

2A-2B show configurations for recirculating parsing of containers according to some embodiments. The gas atmosphere in the container may be replaced by purging the gas in the container, for example, supplying the purge gas to the inside of the container. The purge module may include a gas tank that supplies purge gas to one or more purge nozzles in the container.
Either clean dry air or purge gas such as nitrogen may be used. Other purge gases such as argon, oxygen and mixtures thereof may be used.

High purge gas flow may be required, especially for advanced semiconductor devices. For example 45
Purging a 0 mm container may require a purge gas flow of 150 l / min. 3
Other purge gas streams, such as less than 00 l / min or less than 200 l / min, may be used.

Recirculating parsing systems can significantly reduce purge gas consumption while maintaining the required cleanliness level. For example, if contamination in the container or in the recirculated purge gas exceeds acceptable levels, the recirculated purge gas can be replaced with fresh purge gas. Alternatively, the pollution level can be reduced by adding fresh purge gas to the recirculated purge gas. Sensors may be included to automatically maintain the desired cleanliness level of the recirculated purge gas.

In FIG. 2A, the purge gas 220 may be supplied to the container 210, and the container 210 may be supplied.
May be configured to store a plurality of substrates 217. The container 210 may be sealed,
For example, it may be isolated from the outside environment. In some embodiments, the container is not airtightly sealed and, for example, a filter (not shown) can be used to allow the gas in the container to escape. The pressure inside the container may be higher than the outside air pressure, thus minimizing the gas entering the container. The container may include a one-way valve, which is configured to allow the inner gas to escape but not the outer gas.

The gas in the container 210 may be received 230 and recirculated 220 so as to return to the container. The recirculation path may include any component such as a pump 240 for extracting the gas stream 230 from the container and a filter / purifier 250 for cleaning the exhaust gas before it returns to the container. Particles may be removed from the flow stream using a filter, for example particles in a container. Purifiers may be used to remove water or other organic contaminants from the flow stream. Other configurations may be used, such as those in which the filter is placed in front of the pump.

In FIG. 2B, the recirculation parsing system may include a recirculation route and a regeneration route for adding a fresh purge gas supply. The recirculation route is the purge gas flow 22 to the container.
0, Exhaust gas flow from container 230, Pump system 240, Filter / refiner 250
May include. The regeneration path may include a fresh purge gas supply 280, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas. The switch mechanism 260 may be configured to receive the recirculated purge gas, for example, from the recirculation path, or to receive the fresh dry purge gas from the fresh purge gas supply 280. The switch mechanism 260 may be controlled by a sensor 270 such as a moisture sensor. For example, if the moisture sensor 270 detects a high level of moisture, the switch mechanism 260 is switched to receive fresh purge gas from the supply 280. After the water level has dropped to, for example, an acceptable level, the purge gas recirculation may be resumed, eg, the switch mechanism 260 may be switched again to receive the recirculated purge gas from the recirculation pathway. Sensor 270 may be located anywhere in which the level of contamination of the purge gas can be detected, eg, in a container (as shown) or in a recirculation path.

The switch mechanism 260 may be configured to replace the recirculated purge gas with fresh purge gas. The switch may be configured to receive recirculated purge gas or fresh purge gas, for example, the switch is a toggle switch that switches between recirculated purge gas and fresh purge gas. The switch mechanism 260 may be configured to add fresh purge gas to the recirculated purge gas. The switch may be configured to maintain a recirculated purge gas flow at all times and to turn on or off additional flow from a fresh purge gas supply.

3A-3B show a loading port system with recirculating parsing according to some embodiments. The recirculating parsing system may be connected to the loading port so that the recirculating parsing system can be activated when the container is placed on the support of the loading port. By supplying the recirculated purge gas to the container, the container can be kept clean and dry.

The nozzle 395 may be placed on the support 390 of the loading port 300. This nozzle
The container 310 may be configured to supply purge gas. Nozzles may be normally closed and may be opened during meshing, eg, when the container is placed on a support. For example, the nozzle may include a spring system that pushes the nozzle plug upwards to close the gas path. If the container is on the nozzle plug, the container pushes the plug down to open the gas path,
You may receive the purge gas flow to the container.

Any manifold may be included to control parsing, which allows the container to be purged periodically or continuously. An alignment sensor may be included to ensure that the container is properly aligned with the nozzle. In addition, other configurations such as a flow controller to control the flow rate of the purge gas, or a purifier or filter to remove any contaminants in the purge gas flow before the purge gas flow can enter the container. Parts may be included.

The support 390 may include a plurality of nozzles 395. Some nozzles may be configured to receive the purge gas to the container, and some nozzles may be configured to exhaust the purge gas from the container. The recirculation type parsing system may be coupled to a support 390 containing a recirculation path and a regeneration path. The recirculation path is the purge gas flow to the nozzle towards the container,
Exhaust purge gas flow from another nozzle from the container, pump system 340, filter / refiner 350 may be included. The regeneration path may include a fresh purge gas supply 380, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas. The switch mechanism 360 may be configured to switch between a recirculated purge gas stream and a regenerated purge gas stream, whereby the recirculated purge gas can be replaced with fresh purge gas. The switch mechanism 360 may be configured to switch the connection of the regenerated purge gas stream to the recirculated purge gas stream, which allows fresh purge gas to be added to the recirculated purge gas.

The switch mechanism 360 may be controlled by a sensor 370 such as a moisture sensor. For example, if the moisture sensor 370 detects a high level of moisture in the recirculated purge gas stream, the switch mechanism 360 is switched to receive fresh purge gas from the supply 380.
After the water level has dropped to, for example, an acceptable level, the purge gas recirculation may be resumed, eg, the switch mechanism 360 may be switched again to receive the recirculated purge gas from the recirculation pathway. Additional sensors or analytical devices may be added to monitor the concentration of contaminants in the recirculated purge gas stream.

The loading port may be an open loading port, for example the container is exposed to the open air (
FIG. 3A). The loading port may be a sealed loading port, for example the container is located in a controlled environment 307 such as a vacuum environment (FIG. 3B). For example, the loading port may have an opening for receiving the container. For example, after closing the opening with the loading port door, the area around the loading port is exhausted. The exhausted loading port can allow the container to be connected to a processing system 397 such as a vacuum processing chamber.

4A-4B show flowcharts for recirculating parsing of semiconductor containers according to some embodiments. In FIG. 4A, the recirculated purge gas is applied to the container to purge the container. A purge gas stream may be supplied to the container. The gas in the container may be optionally filtered and / or purified in the gas stream and then exhausted to a recirculation system where the gas can be returned to the container. The operation 400 receives the flow from the container arranged on the support such as the support of the loading port. Operation 410 recirculates the flow back to the container after any filtration and / or purification operation. Nozzles may be connected to the container to supply the recirculated purge gas stream to the container. Another nozzle may be attached to the container, for example to receive the flow from the container to exhaust the gas from the container.

In FIG. 4B, the recirculated purge gas flow may be monitored, for example to assess moisture levels, organic pollutant levels or particle levels. If contamination is below acceptable levels
If the moisture level is below an acceptable level, such as less than 1 ppb or less than 100 ppt, the purge gas stream evacuated from the container is recirculated back to the container, for example to save equipment gas consumption. .. If the pollution level exceeds an acceptable value, the exhausted purge gas is replaced with a fresh and clean dry gas, for example a fresh and clean dry gas.
It is supplied to the container instead of the exhausted purge gas. Alternatively, a fresh and clean dry gas may be added to the exhausted purge gas, and a combination of the fresh and clean dry gas and the exhausted purge gas is supplied to the container.

Operation 430 accepts flow from a container located on the loading port, eg, on the support of an open loading port or on the support of a sealed loading port. A pump system may be used to draw the gas stream out of the container. Operation 440 measures the humidity level of the gas in the stream or the gas in the container. In operation 450, the humidity level is less than 1 ppb or less than 100 ppt, etc.
If it is less than an acceptable value, recirculate the flow back to the container. If the humidity level is as high as> 1 ppb or> 100 pt, for example, use a fresh, clean dry gas.
The above flow may be replaced or added to the above flow.

In some embodiments, a periodically recirculated purge gas stream may be used. In some cases, the nozzle configuration may not be optimized for continuously recirculating purge gas flows.
For example, the input purge gas may be diverted directly to the output exhaust gas without spending sufficient time in the container to remove water or other contaminants. Periodically recirculating purge gas streams can improve the pollutant removal process. For example, the input purge gas may be closed while the output purge gas exhaust can be performed and the gas in the container can be exhausted. Then turn on the input purge gas and let the purge gas flow into the container. During the input purge gas flow, the output purge gas exhaust may be shut off or continued to flow.

FIG. 5 shows a loading port system with recirculating parsing according to some embodiments. The recirculation parsing system may be coupled to a sealed loading port, which allows the container to be placed on the support of the loading port to activate the recirculation parsing system. The nozzle may be placed on the support 590 of the loading port 500. The nozzle may be configured to supply purge gas to the container.

The recirculation type parsing system may be coupled to a support 590 that includes a recirculation path and a regeneration path. The recirculation path may include a purge gas flow to a nozzle towards the container, an exhaust purge gas flow from another nozzle from the container, a pump system 540, a filter / refiner 550.
The regeneration path may include a fresh purge gas supply 580, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas. The switch mechanism 560 may be configured to switch between the recirculated purge gas flow and the regenerated purge gas flow, or to close the conduit to shut off the purge gas flow.

The switch mechanism 560 may be controlled by a sensor 570 such as a moisture sensor. This may allow the switch 560 to switch between fresh, clean dry gas and recirculated purge gas. Further, the switch 560 may be controlled by the controller 575, which can realize a cyclically recirculated purge gas flow. For example, if the moisture level is low, eg, below an acceptable level, the controller may periodically toggle the input purge gas flow between the closed state and the recirculated purge gas flow. This makes it possible to enable periodic pumping and container parsing using the recirculated purge gas. If the moisture level is high, eg, above acceptable levels, the controller may periodically toggle between closed and fresh purge gas. This makes it possible to enable periodic pumping and container parsing with fresh purge gas. Alternatively, the controller may toggle the input purge gas flow between the fresh purge gas and the recirculated purge gas, or between the closed state and the fresh purge gas and the recirculated purge gas.

FIG. 6 shows a flowchart regarding recirculation type parsing of a semiconductor container according to some embodiments. The container may be purged with a purge gas that is periodically recirculated. The operation 600 applies the flow to a container arranged on a support such as a support of a loading port. Operation 610 stops the above flow. The operation 620 exhausts the gas in the container by, for example, a pump system. Operation 630 repeats the above operation, for example, reapplying the flow to the container. In operation 640, the above flow depends on the humidity level being monitored, depending on the humidity level being monitored.
It may be a recirculated purge gas stream, a fresh purge gas stream, or a mixture of a recirculated purge gas stream and a fresh purge gas stream.

In some embodiments, a recirculation tank may be used to recirculate the purge gas within the container. For example, the recirculation tank may be placed in the recirculation path of the purge gas, whereby the purge gas can be continuously recirculated, for example, continuously purified and filtered.

FIG. 7 shows a loading port system with recirculating parsing according to some embodiments. The recirculation parsing system may be coupled to a sealed loading port, which allows the container to be placed on the support of the loading port to activate the recirculation parsing system. The nozzle may be placed on the support 790 of the loading port 700. The nozzle may be configured to supply purge gas to the container.

The recirculation type parsing system may be coupled to a support 790 including a recirculation path and a regeneration path. The recirculation path may include a purge gas flow to a nozzle towards the container, an exhaust purge gas flow from another nozzle from the container, a pump system 740, a recirculation / purifier assembly, the recirculation / purifier assembly described above. Includes recirculation tank 720 and filter / refiner 750.

The recirculator / purifier assembly may be configured to purify the exhausted purge gas, eg, the gas in the container. After leaving the container, the purge gas may be continuously and repeatedly purified through the refiner 750. After purification, the exhaust gas may be recirculated back to the container.

The regeneration path may include a fresh purge gas supply 780, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas. The switch mechanism 760 may be configured to switch between the recirculated purge gas flow and the regenerated purge gas flow, or to close the conduit to shut off the purge gas flow. The switch mechanism 760 may be controlled by a sensor 770 such as a moisture sensor. This may allow the switch 760 to switch between fresh, clean dry gas and recirculated purge gas. Further, the switch 760 may be controlled by the controller 775, which can realize a cyclically recirculated purge gas flow.

In some embodiments, the refiner may include a refiner and may be configured to purify the gas flowing into the recirculation tank. A pump system, which may include a pump or fan, may be used to purify the gas flow through the purifier. The refined material may include a desicmate material, which is configured to remove water from the recirculated gas stream. The refined material may include activated carbon fiber.

Multiple refiners may be used. For example, the first refiner removes water or carbon dioxide.
The second refiner removes water, carbon monoxide, sulfur oxides, nitrogen oxides or other contaminants. A molecular sieve purifier and a catalyst purifier may be used as the purifier.

Particle filter for removing particles (HEPA or ULPA filter, etc.), water purifier for removing water (molecular sieve water purifier, etc.), volatile organic compound (volatile)
Other configurations may be used, such as an organic pollutant filter (activated carbon filter, or TiO2 photocatalytic filter and UV lamp) for removing organic pollutants such as organic comund (VOC). An ionizer may be optionally added to remove static electricity.

FIG. 8 shows a loading port system with recirculating parsing according to some embodiments. The recirculation parsing system may be coupled to a sealed loading port, which allows the container to be placed on the support of the loading port to activate the recirculation parsing system. The nozzle may be placed on the support 890 of the loading port 800. The nozzle may be configured to supply purge gas to the container.

The recirculation parsing system may be coupled to a support 890 including any pump system 840 and a recirculation / purifier assembly, wherein the recirculation / purifier assembly is the recirculation tank 8.
20, filter / refiner 850, pump system 865. The pump system 865 is a refiner 85.
The purge gas in the recirculation tank 820 may be recirculated through 0, thereby continuously and repeatedly purifying the gas in the recirculation tank, such as continuously removing water from the recirculated gas. good. After purification, the exhaust gas may be recirculated back to the container.

The regeneration path may include a fresh purge gas supply 880, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas. The switch mechanism 860 may be configured to switch between the recirculated purge gas flow and the regenerated purge gas flow. The switch mechanism 860 may be controlled by a sensor 870 such as a moisture sensor that may be located in the recirculation tank 820 (or any other position such as in the recirculation path). This may allow the switch 860 to switch between fresh, clean dry gas and recirculated purge gas. Further, the switch 860 may be controlled by a controller, which can realize a cyclically recirculated purge gas flow. Other configurations, such as a periodic recirculation parsing system, may also be used, in which the periodic recirculation purging system exhausts the exhaust gas from the container and then drains the purge gas into the container. One stream may recirculate while another stream is flowing. For example, after turning off the purge gas flow, it may be turned on while the exhaust gas is being exhausted. The exhaust gas may be exhausted continuously, or the exhaust gas may be stopped when the purge gas is turned on. Alternatively, the exhaust gas may be turned on / off periodically while the purge gas is flowing.

FIG. 9 shows a flowchart regarding recirculation type parsing of a semiconductor container according to some embodiments. A tank of recirculated purge gas may be placed within the recirculation gas path to purge the container. The operation 900 flows gas from a container arranged on a support such as a support of a loading port. This gas may be exhaust gas from a container that can be operated by the pump system. This gas may flow into the recirculation tank. Operation 910 regulates the humidity level by recirculating the gas in the recirculation tank through the refiner. Operation 920 causes gas to flow from the recirculation tank back to the container, for example by a pump system. Operation 9
30 regenerates the gas in the recirculation tank, depending on the humidity level in the recirculation tank, container or recirculation gas path. The gas in the recirculation tank may be replaced with fresh gas from a clean dry gas source. Fresh gas from a clean dry gas source may be added to the gas in the recirculation tank.

In some embodiments, the recirculation parsing system may be implemented with respect to the gas in the container and / or the gas in the loading port. For example, since the container is not airtightly sealed, the purge gas introduced into the container may be released to the outside environment such as the internal volume of the loading port in which the container is located. Capture the purge gas from the container or from the loading port and
After filtration and / or purification, it may be recirculated back to the container.

FIG. 10 shows a loading port system with recirculating parsing according to some embodiments. The recirculation parsing system may be connected to the loading port so that the container can be placed on the support of the loading port to activate the recirculation parsing system. The loading port may be sealed and may be connected to, for example, a vacuum pump for exhausting the gas in the loading port. The recirculated purge gas may be supplied to the container to keep it clean and dry.

Nozzle 1095 may be placed on support 1090 of loading port 1000. This nozzle may be configured to supply purge gas to container 1010. The support 1090 may include a plurality of nozzles 1095, which may be configured to supply the recirculated purge gas to the container. Alternatively, some nozzles may be configured to receive the purge gas to the container, and some nozzles may be configured to exhaust the purge gas from the container. The recirculation type parsing system may be coupled to a support 1090 including a recirculation path and a regeneration path. The recirculation path may include a purge gas flow to a nozzle towards the container, an exhaust purge gas flow from a loading port (or from another nozzle from a container not shown), a pump system 1040, a filter / refiner 1050. The regeneration path may include a fresh purge gas supply 1080, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas.

In some embodiments, the pump system 1040 may be used to exhaust the gas in the loading port and then discard the exhaust gas. After a period of time, the gas in the loading port may be switched towards the recirculation tank and recirculated back to the container. Alternatively, sensors may be used to monitor the gas in the loading port to ensure that the gas in the loading port is clean, for example before injecting gas into the recirculation tank. For example, the loading port may be exposed to the outside air, for example the loading port door is open. The container may be placed on the support of the loading port. The loading port may be sealed, for example the door is closed. For example, the pump system exhausts the gas in the loading port.

After exhausting the loading port, for example after removing all gas, purge gas may be supplied to the container. The gas in the loading port (and optionally in the container) may be squeezed into the recirculation tank and this gas may be returned to the container after purification.

Alternatively, the purge gas may be supplied to the container while exhausting the loading port. Exhaust gas may be discarded as the gas in the loading port may contain ambient air. After a certain exhaust time,
Alternatively, after the sensor indicates that the gas in the loading port is clean, the exhaust gas may be switched towards the recirculation tank, refined and recirculated back to the container.

The switch mechanism 1060 may be configured to switch between a recirculated purge gas stream and a regenerated purge gas stream, whereby the recirculated purge gas can be replaced with fresh purge gas. The switch mechanism 1060 may be configured to switch the connection of the regenerated purge gas stream to the recirculated purge gas stream, which allows fresh purge gas to be added to the recirculated purge gas.

The switch mechanism 1060 may be controlled by a sensor 1070 such as a moisture sensor. For example, if the moisture sensor 1070 detects a high level of moisture in the recirculated purge gas stream, the switch mechanism 1060 is switched to receive fresh purge gas from the supply 1080. After the water level has dropped to, for example, an acceptable level, the purge gas recirculation may be resumed, eg, the switch mechanism 1060 may be switched again to receive the recirculated purge gas from the recirculation pathway. Additional sensors or analytical devices may be added to monitor the concentration of contaminants in the recirculated purge gas stream.

11A-11B show flowcharts of recirculating parsing of semiconductor containers according to some embodiments. In FIG. 11A, the recirculated purge gas is applied to the container to purge the container. A purge gas stream may be supplied to a container located within the sealed loading port. The gas in the loading port (and optionally in the container) may be optionally filtered and / or purified in the gas stream and then exhausted into a recirculation system capable of returning the gas to the container. Operation 1100 causes purge gas to flow into a container arranged on a support such as a support of a loading port. The purge gas may be from the recirculation tank. Operation 1110
Exhausts the gas in the loading port (and optionally in the container) to the recirculation tank. The gas in the recirculation tank may be continuously purified, for example through a refiner, to remove water and / or other organic pollutants.

In FIG. 11B, the gas in the recirculation tank may be monitored, for example to assess moisture levels, organic pollutant levels or particle levels. If the contamination is below an acceptable level, for example if the moisture level is below an acceptable value, such as less than 1 ppb or less than 100 pt.
The recirculation tank returns the purge gas to the container. If the contamination level exceeds an acceptable level, the gas in the recirculation tank may be replaced with a fresh and clean dry gas, for example a fresh and clean dry gas of the recirculated gas from the recirculation tank. Instead, supply to the recirculation tank. Alternatively, fresh and clean dry gas may be added to the recirculation tank to reduce contamination levels, eg dilute.

Operation 1130 accepts flow from the loading port where the container is located. The above flow may be supplied to the recirculation tank. A pump system may be used to draw gas flow from the loading port. Operation 1140 measures the humidity level of gas in a loading port, in a stream or in a container. Operation 1150 recirculates the flow back from the recirculation tank to the container when the humidity level is less than an acceptable value, such as less than 1 ppb or less than 100 ppt. If the humidity level is as high as> 1 ppb or> 100 ppt, fresh and clean dry gas may be used to replace or add to the recirculation tank.

FIG. 12 shows a loading port system with recirculating parsing according to some embodiments. A recirculating parsing system may be connected to a sealed loading port, thereby
Placing the container on the support of the loading port can activate the recirculating parsing system. Nozzles may be placed on the support 1290 of the loading port 1200. The nozzle may be configured to supply purge gas to the container.

The recirculation parsing system may be coupled to a support 1290 and a loading port that includes any pump system 1240 and recirculation / purifier assembly. Gas from the loading port and / or optionally from the container may be exhausted by the pump system and delivered to the recirculation tank.

The recirculation / purifier assembly includes a recirculation tank 1220, a filter / purifier 1250.
, Pump system 1265 may be included. Pump system 1265 (may include pump or fan)
May recirculate the purge gas in the recirculation tank 1220 through the refiner 1250.
Thereby, the gas in the recirculation tank may be continuously and repeatedly purified, such as continuously removing water from the recirculated gas.

The regeneration path may include a fresh purge gas supply 1280, which may be configured to replace the recirculated purge gas or to add to the recirculated purge gas. The switch mechanism 1260 may be configured to switch between the recirculated purge gas flow and the regenerated purge gas flow. The switch mechanism 1260 may be controlled by a sensor 1270 such as a moisture sensor that may be located in the recirculation tank 1220 (or any other position such as in the recirculation path). This may allow the switch 1260 to switch between fresh, clean dry gas and recirculated purge gas. Further, the switch 1260 may be controlled by a controller, which can realize a cyclically recirculated purge gas flow.

FIG. 13 shows a flowchart regarding recirculation type parsing of a semiconductor container according to some embodiments. A tank of recirculated purge gas may be placed in the recirculated gas path to purge the container. Operation 1300 may flow gas from the loading port and place a container on the support of the loading port at the loading port. The gas may be exhaust gas from a loading port operated by the pump system. This gas may flow into the recirculation tank. Operation 1310 regulates the humidity level by recirculating the gas in the recirculation tank through the refiner. Operation 1320 causes gas to flow from the recirculation tank back to the container, for example by a pump system. Operation 1330 regenerates the gas in the recirculation tank depending on the humidity level in the recirculation tank, container or recirculation gas path. The gas in the recirculation tank may be replaced with fresh gas from a clean dry gas source. For the gas in the recirculation tank,
Fresh gas from a clean dry gas source may be added.

Claims (19)

A recirculating parsing system:
Sealed loading port;
Sealed loading port support;
Board container;
A recirculation tank for purging the substrate container is included so that the purge gas can flow from the substrate container to the recirculation tank and the purge gas can return from the recirculation tank to the substrate container. Constructed recirculation pathway;
Equipped with a regeneration path and switch mechanism including a fresh purge gas supply,
The sealed loading port support includes a nozzle and
The switch mechanism adds fresh purge gas from the fresh purge gas supply to the recirculated purge gas in the recirculation tank, or uses the fresh purge gas to drive the recirculated purge gas in the recirculation tank. A recirculating parsing system configured to allow replacement. The substrate container, said to start the recirculating Pajin Gushi stem, further characterized in that disposed in the sealed type load port support on, the system according to claim 1. The system of claim 1, wherein the nozzle is opened when the substrate container is placed on the sealed loading port support. The system of claim 1, wherein the nozzle further comprises a spring system that pushes the nozzle plug upward to close the gas path. Wherein the substrate container is located on the plug of the nozzle, the substrate container opening the recirculation path by pressing the front Kipu lugs downwardly, further characterized in that to receive the purge gas flow to the substrate container, The system according to claim 1. The sealed type load port support is further characterized by being connected to the recirculating Pajin Gushi stem comprising recirculation path and the playback path, the system according to claim 1. The recirculation path is further characterized in that it comprises the flow of purge gas which the recirculated to the nozzles of the substrate container, according to claim 1 system. The system of claim 1, further characterized in that the exhaust purge gas flows from a second nozzle of the substrate container through a pump system as well as a filtration and purification system. The system of claim 1, wherein the regeneration path further comprises fresh purge gas configured to replace or add to the recirculated purge gas. It said switch mechanism, the so as to switch the the flow of recycled purge gas and flow of the fresh purge gas, or be configured to a conduit closed to cut off the flow of purge gas which the recirculated The system according to claim 1, further characterized. The switch mechanism is further characterized in that can be controlled by sensor system of claim 1. The system according to claim 1, wherein the switch mechanism is capable of switching between the fresh purge gas and the recirculated purge gas. The system according to claim 1, wherein the switch mechanism can be controlled by a controller that realizes a purge gas flow that periodically recirculates. Said Re fresh flow of purge gas, characterized by further flowing into the disposed sealing type load port support on the substrate container according to claim 1 system. To adjust the humidity level, the fresh purge gas is further characterized in that recirculating Filtration and in the recirculation tank through a purification system, the system according to claim 1. The system according to claim 1, wherein the recirculated purge gas flows back from the recirculation tank to the substrate container by a pump system. Said recycled purge gas, the recirculation tank, in response to said humidity level of the substrate or in the recirculation route within the container, wherein at the recirculation tank by fresh purge gas is added The system according to claim 1, further characterized in that the recirculated purge gas is regenerated into a clean and dry purge gas. The system of claim 1, further characterized in that the recirculated purge gas in the recirculation tank can be replaced by the fresh purge gas from the regeneration path. The system according to claim 1, further comprising the ability to add the fresh purge gas from the regeneration path to the recirculated purge gas in the recirculation tank.

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