JP6956058B2 - Temperature sensor, temperature detection device and temperature detection system - Google Patents

Description

The present invention relates to a temperature sensor, a temperature detection device and a temperature detection system.

In recent years, there has been a demand for a temperature sensor, a temperature detection device, and a temperature detection system having a simple structure.

Japanese Unexamined Patent Publication No. 2008-164587

An object of the present embodiment of the present invention is to provide a temperature sensor, a temperature detection device, and a temperature detection system having a simple structure.

In order to solve the above problems, in the temperature sensor of the present embodiment, the resonance circuit, the first covering member covering the front surface of the resonance circuit, the second covering member covering the back surface of the resonance circuit, and the resonance circuit are used. It has first and second solid organic materials in contact.

It is sectional drawing of the temperature sensor which concerns on this embodiment. It is a top view of the temperature sensor which concerns on this embodiment. It is a top view of the resonance circuit which concerns on this embodiment. It is a top view of the resonance circuit which concerns on this embodiment. It is a top view of the resonance circuit which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the plan view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the plan view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the plan view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the cross-sectional view of the temperature sensor which concerns on this embodiment. It is another example of the plan view of the temperature sensor which concerns on this embodiment. It is a characteristic diagram of the frequency and the signal strength of the temperature sensor which concerns on this embodiment. It is a block diagram which shows the structure of the temperature detection apparatus which concerns on this embodiment. It is a block diagram which shows the structure of the temperature detection system which concerns on this embodiment.

Hereinafter, the present embodiment for carrying out the invention will be described.

Hereinafter, embodiments will be illustrated with reference to the drawings. It should be noted that each drawing is schematic or conceptual, and the relationship between the thickness and width of each part, the size and ratio between the parts, and the like are not necessarily the same as those in reality. Further, even when the same parts are represented, the dimensions and ratios may be different from each other depending on the drawings.

In the specification of the present application and the drawings, the same elements as those described above with respect to the above-described drawings are designated by the same reference numerals, and detailed description thereof will be omitted as appropriate.

(First Embodiment) FIGS. 1a and 1b are a cross-sectional view and a plan view of a temperature sensor 10 according to the present embodiment. FIG. 1a is a cross-sectional view taken along the broken line A of FIG. 1b. As shown in FIGS. 1a and 1b,
The temperature sensor 10 includes a resonance circuit 11, a first covering member 12a that covers the surface of the resonance circuit 11, and a first covering member 12a.
A second covering member 12b, a first, and a second solid organic material 13a covering the back surface of the resonant circuit 11.
, It possesses 13b, and dielectric material 14, dielectric material 14, first and second cover members 12a, located between 12b, dielectric material 14, first and second solid organic The dielectric material 14 is in contact with the materials 13a and 13b, and the dielectric material 14 is in contact with the resonance circuit 11 via the first and second solid organic materials 13a and 13b.

2a, 2b, and 2c are plan views of the resonance circuit 21 according to the present embodiment. Figures 2a, 2b, 2
As shown in c, the resonance circuit 21 is a square or rectangular thin metal plate in which a groove is dug, or a circuit printed on paper, plastic, film, or the like with a printer. In either of the above cases, as the material of the resonance circuit 21, for example, a conductive metal such as Cu, Al, or Fe can be used. Especially, Cu with high conductivity or easy to process
Al is preferred.

When the resonant circuit 11 receives an electromagnetic wave, the resonant circuit 11 causes at least either reflection or resonance. The behavior of the resonant circuit 11 depends on the frequency of the received electromagnetic wave.

When an electromagnetic wave having a frequency in a preset range is received by the resonance circuit 11 and the signal strength with respect to the frequency of the electromagnetic wave becomes the minimum, this frequency is defined as the resonance frequency. Resonant circuit 11
Not only does the shape of the metal plate used in the above change, but the resonance frequency also changes when it comes into contact with another substance.

The resonant circuit 11 is located between the first and second covering members 12a and 12b. The first and second solid organic materials 13a and 13b are in contact with the resonance circuit 11, and the dielectric material 14 is the first,
And are provided adjacent to the second solid organic materials 13a, 13b. When at least one of the first and second solid organic materials 13a and 13b is melted, the first and second solid organic materials 13a and 13b and the first and second solid organic materials 13a and 13b The dielectric material 14 adjacent to the mixture is mixed, and the mixture comes into contact with the resonance circuit 11.

At least one of the first and second covering members 12a and 12b is a thin plate-like substance, and examples of the material include polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), and glass. Materials having a relative permittivity of 10 or less at normal temperature and pressure, such as epoxy resin, mica, quartz, cellophane, and rubber, can be used.

In the present embodiment, when another substance comes into contact with the resonance circuit 11, the resonance frequency changes. When the dielectric material 14 comes into contact with the resonance circuit 11, the resonance frequency of the resonance circuit 11 changes, and it can be detected that at least one of the first and second solid organic materials 13a and 13b has melted.

When a substance that shields electromagnetic waves is used as the first and second covering members 12a and 12b, the resonance frequency may not be detected correctly. Therefore, the first and second covering members 12a and 12b are thin plate-like substances, and the material has a relative permittivity of 10 at normal temperature and pressure.
It is preferable to use the following substances.

The first and second solid organic materials 13a and 13b are in contact with the resonance circuit 11, and the dielectric material 14
Is provided adjacent to the first and second solid organic materials 13a, 13b. As the first and second solid organic materials 13a and 13b, different substances having different melting points can be used. 1st
The materials of the second solid organic materials 13a and 13b include, for example, aliphatic hydrocarbons such as pentadecane, hexadecane and 1-heptadecane, ethyl myristate, butyl myristate, methyl caproate, methyl caproate and lauric acid. Substances that are liquid or solid at normal temperature and pressure, such as esters such as ethyl, can be used. (In particular, the first and second solid organic materials 13a and 13b are preferably pure substances without impurities so that the melting point can be determined.)

When at least one of the first and second solid organic materials 13a and 13b is melted, the dielectric material 14 comes into contact with the resonance circuit 11, and the resonance frequency of the resonance circuit 11 changes. The melting point is a value peculiar to the substance, and the temperature of the temperature sensor 10 is at least the first and second solid organic materials 13.
When it exceeds the melting point of either a or 13b, it melts. First and second solid organic materials 13a,
13b is a temperature sensor 10 having a different temperature by using another substance having a different melting point instead.
Can be used as.

When a mixture of at least one of the first and second solid organic materials 13a and 13b and the dielectric material 14 comes into contact with the resonance circuit 11, the resonance frequency of the resonance circuit 11 changes. Further, the amount of change in the resonance frequency differs depending on the substance contained in the mixture in contact with the resonance circuit 11. When at least one of the first and second solid organic materials 13a and 13b melts and mixes with the dielectric material 14 and then touches the resonant circuit 11, at least the first and second solid organic materials 13
The amount of change in the resonance frequency of the resonance circuit 11 changes depending on the mixture of either a or 13b and the dielectric material 14. That is, by observing the resonance frequency of the resonance circuit 11, the first and second
It can be determined whether only one of the solid organic materials 13a and 13b of the above is melted or both are melted.

It can be seen that when the first and second solid organic materials 13a and 13b did not melt, the temperature sensor 10 did not rise to a temperature exceeding the melting points of the first and second solid organic materials 13a and 13b. .. When only the lower melting point of the first and second solid organic materials 13a and 13b is melted, the temperature sensor 10 determines the temperature between the melting points of the first and second solid organic materials 13a and 13b, respectively. It can be seen that it has risen to. First and second solid organic materials 13a, 1
When both 3b are melted, the temperature sensor 10 determines the first and second solid organic materials 13a, 13
It can be seen that the temperature has risen beyond the melting points of both b. Resonant circuit 1 in any of the above cases
The resonance frequency of 1 changes, and the amount of change is different.

At this time, in the present embodiment, there are two types of solid organic materials, but even when there are other types such as three types and four types, the volumes of the solid organic materials used are equal regardless of the types of the solid organic materials. Alternatively, it is preferable to keep it in a known amount.

Further, the solid organic material is not limited to two types, and three or more types of substances having different melting points may be used. When the resonance frequency changes and the amount of change can be determined, an arbitrary temperature rise can be detected within the range of the melting point of the solid organic material by selecting solid organic materials having different melting points. When a plurality of solid organic materials having different melting points are used, the number of resonance frequencies that change due to melting of each solid organic material depends on the type of solid organic material used.

For example, solid organic materials A, B, C, and D having different melting points are used, and their respective melting points are a, b, and c.
, D, and when a <b <c <d, the resonance frequency changes due to the melting of each of the solid organic materials A, B, C, and D. Assuming that the temperature T actually detected is t, when t <a, the solid organic materials A, B, C, and D do not melt and the resonance frequency does not change. When a <t <b,
Only the solid organic material A melts and the resonance frequency changes accordingly. When b <t <c,
The solid organic materials A and B melt, and the resonance frequency changes accordingly. When c <t <d,
Only the solid organic materials A, B and C are melted and the resonance frequency changes accordingly. When d <t, the solid organic materials A, B, C, and D are all melted, and the resonance frequency changes accordingly. From the above, as the types of solid organic materials having different melting points are increased, a wide range or detailed temperature detection becomes possible.

That is, by using a plurality of solid organic materials having different melting points, the range in which the temperature can be detected can be expanded.

The dielectric material 14 is provided adjacent to the first and second solid organic materials 13a and 13b. As the material of the dielectric material 14, for example, a substance such as water or ethanol which is a liquid or a solid at normal temperature and pressure and has a relative permittivity of 10 or more at normal temperature and pressure can be used. In particular, it is preferable to use a substance having a relative permittivity of 20 or more at normal temperature and pressure.

In general, the resonance frequency of a substance is greatly affected by the material and shape. The metal plate used in the resonance circuit 11 not only changes its shape, but also changes its resonance frequency even when it comes into contact with another substance. When in contact with a dielectric, the higher the relative permittivity of the contacting substance, the larger the resonance frequency of the resonance circuit 11, and typical substances having a high relative permittivity include water and ethanol.

First and second solid organic materials 13a, 13b in contact with the resonant circuit 11 and the dielectric material 14.
Melts when it reaches the melting point. When the first and second solid organic materials 13a and 13b are melted by mixing a surfactant (such as an emulsifier) with the dielectric material 14 in advance,
The first and second solid organic materials 13a and 13b and the dielectric material 14 are easily mixed. By melting at least one of the first and second solid organic materials 13a and 13b and mixing at least one of the first and second solid organic materials 13a and 13b with the dielectric material 14, the mixture resonates. It will come into contact with 11.

FIG. 8 is a block diagram showing the configuration of the temperature detection device 100 according to the present embodiment. As shown in FIG. 8, the temperature detection device 100 includes a transmission unit 101, a control unit 102, a reception unit 103, and a detection unit 1.
04, has a determination unit 105.

The transmission unit 101 transmits an electromagnetic wave having a frequency in a certain range. In this case, the control unit 102 instructs the transmission unit 101 to transmit the electromagnetic wave at regular intervals. Transmitter 10 of this electromagnetic wave
When transmitted by 1, the resonant circuit 11 causes at least either reflection or resonance. The receiving unit 103 receives the electromagnetic wave reflected from the resonance circuit 11. The received electromagnetic wave is detected by the detection unit 10.
When the signal strength with respect to the frequency of the electromagnetic wave in a certain range is the minimum value transmitted to No. 4, the detection unit 104 detects that the frequency is the resonance frequency. When the detected resonance frequency changes beyond the range of the predetermined threshold value as compared with the previous resonance frequency, at least one of the first and second solid organic materials 13a and 13b melts, and the first and second solid organic materials 13a and 13b are melted. The determination unit 105 determines that it has detected that the dielectric material 14 is in contact with the resonance circuit 11. At least one of the first and second solid organic materials 13a and 13b is melted, and the dielectric material 14 is connected to the resonance circuit 11.
The control unit 102 issues a detection signal in order to notify the control unit 102 that the contact has been detected and notify the user of the temperature detection device 100. As the detection signal, for example, at least light or sound, screen display, or vibration can be used.

FIG. 9 is a block diagram showing the configuration of the temperature detection system 200 according to the present embodiment. Figure 9
As shown in, the temperature detection system 200 includes a temperature sensor 10 and a temperature detection device 100. The temperature sensor 10 and the temperature detection device 100 can communicate with each other via electromagnetic waves.
In this case, the control unit 102 of the temperature detection device 100 instructs the transmission unit 101 to transmit the electromagnetic wave at regular intervals. According to the instruction from the control unit 102, the transmission unit 101 of the temperature detection device 100 transmits an electromagnetic wave. The resonant circuit 11 causes at least either reflection or resonance depending on the frequency of the transmitted electromagnetic wave in a certain range. Temperature detection device 1 for reflected electromagnetic waves
When the receiving unit 103 of 00 receives and the signal strength with respect to the frequency of the electromagnetic wave in a certain range takes a minimum value, the detecting unit 104 detects the frequency as the resonance frequency. A range is, for example,
The range of frequencies that can be the resonance frequency is measured in advance, and refers to the frequency in the range that includes the resonance frequency. When the detected resonance frequency changes beyond the predetermined threshold range compared to the previous resonance frequency, at least the first and second solid organic materials 13
The determination unit 105 determines that it has been detected that either a or 13b has melted and the dielectric material 14 has come into contact with the resonance circuit 11. The determination unit 105 is at least the first and second solid organic materials 1
It is transmitted to the control unit 102 that it has been detected that either 3a or 13b has melted and the dielectric material 14 has come into contact with the resonance circuit 11, and the control unit 102 controls to notify the user of the temperature detection device 100. The unit 102 emits a detection signal. As the detection signal, for example, at least light or sound, screen display, or vibration can be used.

When the resonant circuit 11 receives an electromagnetic wave, the resonant circuit 11 causes at least either reflection or resonance. The behavior of the resonant circuit 11 depends on the frequency of the received electromagnetic wave. Resonant circuit 11
Electromagnetic waves having different frequencies are transmitted from the transmission unit 101. The electromagnetic wave transmitted to the resonance circuit 11 is reflected, and the signal strength with respect to the frequency of the reflected electromagnetic wave is received by the receiving unit 103. When the frequency of the electromagnetic wave reflected from the resonance circuit 11 is the resonance frequency, the signal strength with respect to the frequency of the electromagnetic wave received by the receiving unit 103 decreases. If the electromagnetic waves having different frequencies are continuously transmitted even after the electromagnetic waves having the resonance frequency are transmitted, the signal strength with respect to the frequency of the electromagnetic waves transmitted to the resonance circuit 11 again increases. That is, when electromagnetic waves having different frequencies are transmitted to the resonance circuit 11 from the transmission unit 101, the signal strength with respect to the frequency of the electromagnetic wave decreases at the resonance frequency. Therefore, the signal strength with respect to the frequency of the electromagnetic wave is observed to resonate. Circuit 11
Resonance frequency can be specified.

FIG. 7 is a characteristic diagram of the frequency and signal strength of the temperature sensor 10 according to the present embodiment. FIG. 7 shows the relationship of the signal strength with respect to the frequency of the electromagnetic wave transmitted to the resonance circuit 11. The solid line is the resonant circuit 11
The relationship when the dielectric material 14 is not in contact with the resonance circuit 11 and the broken line show the characteristics when the dielectric material 14 is in contact with the resonance circuit 11. In both cases, the signal strength with respect to the frequency of the electromagnetic wave decreases at the resonance frequency. The resonance frequency when the dielectric material 14 is in contact with the resonance circuit 11 and the resonance frequency when the dielectric material 14 is not in contact with the resonance circuit 11 are different. Therefore, by observing the resonance frequency, it is possible to determine whether or not the dielectric material 14 is in contact with the resonance circuit 11.

According to this embodiment, the resonance circuit 11 is observed by observing the resonance frequency using the resonance circuit 11.
It is possible to determine whether or not the dielectric material 14 is in contact with the material. That is, the temperature rise can be detected. Further, since the resonance circuit 11 of the temperature sensor 10 does not use a power source or the like for communicating with an external device, the temperature sensor 10 having a simple structure can be provided.

(Second Embodiment) In the first embodiment, the temperature sensor 30 using two kinds of solid organic materials
However, in the second embodiment, the temperature sensor 30 using four kinds of solid organic materials will be described. 3a, 3b, and 3c are other examples of a cross-sectional view and a plan view of the temperature sensor 30 according to the present embodiment. 3a is a cross-sectional view taken along the broken line B of FIG. 3c, and FIG. 3b is a broken line C of FIG. 3c.
It is a cross-sectional view in.

As shown in FIGS. 3a, 3b and 3c, the temperature sensor 30 is a resonance circuit 31, the first and second covering members 32a, 32b, the first and the second, and the third and fourth solid organic matter. Material 33a,
It has 33b, 33c, 33d and a dielectric material 34. Resonant circuit 31, first and second covering members 32a, 32b, first and second solid organic materials 33a, 33b, dielectric material 34
, The resonant circuits 11, the first, and the second covering members 12a, 12b of the first embodiment.
, 1st and 2nd solid organic materials 13a, 13b and dielectric material 14. The difference from the temperature sensor 10 according to the first embodiment is that the temperature sensor 30 of the present embodiment has the third and fourth solid organic materials 33c and 33d. The first, second, third, and fourth solid organic materials 33a, 33b, 33c, 33d are provided in contact with the resonant circuit 11.

In the temperature sensor 30 of the present embodiment, the metal plate used for the resonance circuit 31 not only changes its shape but also changes its resonance frequency even if it comes into contact with another substance. When in contact with a dielectric, the higher the relative permittivity of the contacting substance, the greater the change in the resonance frequency of the resonant circuit 11. At least the first, second, third, and fourth solid organic materials 33a, 33b, 3
When either 3c or 33d is melted and mixed with the dielectric material 34, the amount of change in the resonance frequency differs depending on the mixture, and the larger the relative permittivity of the mixture in contact with the resonance circuit 31, the larger the amount of change in the resonance frequency.

When the first, second, third, and fourth solid organic materials 33a, 33b, 33c, and 33d are mixed with the dielectric material 34, the relative permittivity of the mixture is the first, second, and second. It depends not only on the relative permittivity of each of the third and fourth solid organic materials 33a, 33b, 33c, 33d and the dielectric material 34, but also on the mixing ratio of the mixture.

When the temperature sensor 30 is used for the first, second, third, and fourth solid organic materials 33a, 33b, 33c, 33d using substances having different melting points, the first, second, and third , And the amount of the fourth solid organic material 33a, 33b, 33c, 33d mixed with the dielectric material 34,
That is, the first, second, third, and fourth solid organic materials 33a, 33b, 33c,
It is preferable that the respective volumes of 33d are equalized or set to a known amount.

At this time, in the present embodiment, there are four types of solid organic materials, but even when there are other types such as three types and five types, the volumes of the solid organic materials used are equal regardless of the types of the solid organic materials. Alternatively, it is preferable to keep it in a known amount.

In this embodiment, the first, second, third, and fourth solid organic materials 33a, 33b,
For 33c and 33d, substances having different melting points can be used. At least the first and second,
And when any of the third and fourth solid organic materials 33a, 33b, 33c, 33d melts, the first, second, and third, and fourth solid organic materials 33a, 33b, 33c,
33d and the first, second, third, and fourth solid organic materials 33a, 33b, 33c
, The dielectric material 34 adjacent to 33d is mixed, and the mixture comes into contact with the resonant circuit 31. When another substance comes into contact with the resonance circuit 31, the resonance frequency changes. When the mixture comes into contact with the resonant circuit 31, the resonant frequency of the resonant circuit 31 changes, and at least one of the first, second, third, and fourth solid organic materials 33a, 33b, 33c, 33d It can detect that it has melted.

Further, the first, second, third, and fourth solid organic materials 33a, 33b, 33c, 3
When 3d is melted, each is mixed with a dielectric material, and each mixture is in contact with a resonance circuit, the amount of change in resonance frequency is different. By observing the resonance frequency of the resonance circuit 31, the first
And of the second, third, and fourth solid organic materials 33a, 33b, 33c, 33d
It is possible to determine which or more have melted.

In the temperature sensor 30 of the present embodiment, the temperature range that can be detected increases according to the type of solid organic material within the range in which the resonance frequency changes and the amount of change can be determined, and the temperature range is detected in a more detailed and wide range. be able to.

(Third Embodiment) FIGS. 4a, 4b, and 4c are other examples of a cross-sectional view and a plan view of the temperature sensor 40 according to the present embodiment. 4a is a cross-sectional view taken along the broken line D of FIG. 4c, and FIG. 4b is a cross-sectional view of FIG. 4b.
It is sectional drawing in the broken line E of c.

In the present embodiment, the types of the solid organic material are the same as those in the first embodiment, but the arrangement is different. As shown in FIGS. 4a, 4b, and 4c, the temperature sensor 40 includes resonance circuits 41, first, and second covering members 42a, 42b, first, and second solid organic materials 43a, 43b, and a dielectric material. Has 44. Resonant circuit 41, first and second covering members 42a, 42b, first,
With respect to the second solid organic materials 43a, 43b and the dielectric material 44, the resonant circuits 11, the first, and the second covering members 12a, 12b, the first, and the second solid organic of the first embodiment. This is the same as the materials 13a and 13b and the dielectric material 14. The temperature sensor 40 of the present embodiment is the first
The difference from the temperature sensor 10 according to the embodiment is that the first and second solid organic materials 43a,
43b are located alternately or diagonally. When at least one of the first and second solid organic materials 43a and 43b is melted, at least one of the first and second solid organic materials 43a and 43b and the first and second solid organic materials 43a, 43b and the adjacent dielectric material 44 are mixed, and the mixture comes into contact with the resonant circuit 41.

The temperature sensor 40 of the present embodiment can detect a temperature rise by changing the resonance frequency when the mixture and the resonance circuit 41 come into contact with each other.

When the temperature sensor 40 is used, the molten solid organic material is mixed with the dielectric material, and the mixture is in contact with the resonant circuit. In this case, it is preferable to install the temperature sensor 40 so as to be parallel to the ground so that the mixture can easily touch the resonance circuit 41 regardless of the position of the solid organic material. When it is difficult to install and use the temperature sensor 40 parallel to the ground, for example, even when the temperature sensor 40 is perpendicular to the ground, the first and second solid organic materials 43a
, 43b are alternately or diagonally located so that the mixture can easily touch the resonant circuit 41 regardless of the position of the solid organic material. That is, the dependence of the inclination on the plane when using the temperature sensor 40 is eliminated, and the detection accuracy is improved.

(Fourth Embodiment) FIGS. 5a, 5b, and 5c are other examples of a cross-sectional view and a plan view of the temperature sensor 50 according to the present embodiment. 5a is a cross-sectional view taken along the broken line F of FIG. 5c, and FIG. 5b is a cross-sectional view of FIG.
It is sectional drawing in the broken line G of c.

As shown in FIGS. 5a, 5b, and 5c, the temperature sensor 50 includes a resonant circuit 51, first, and second covering members 52a, 52b, first, and second solid organic materials 53a, 53b, and a dielectric material. 5
It has 4, 1st, 2nd, 3rd, and 4th separators 55a, 55b, 55c, 55d. Regarding the resonance circuit 51, the first and second covering members 52a and 52b, the first and second solid organic materials 53a and 53b, and the dielectric material 54, the resonance circuit 11 of the first embodiment,
First and second covering members 12a, 12b, first and second solid organic materials 13a, 13
b, the same as the dielectric material 14. The difference from the temperature sensor 10 according to the first embodiment is that
The temperature sensor 50 of the present embodiment is the first, second, third, and fourth separators 55a, 5
To have 5b, 55c, 55d.

The first, second, third, and fourth separators 55a, 55b, 55c, 55d are the first.
, And between the second covering members 52a, 52b. Further, the first separator 55a is located between the resonant circuit 51 and the first and second solid organic materials 53a and 53b, and the second separator 55b is the first and second solid organic materials. Located between 53a, 53b and the dielectric material 54, the third separator 55c is in contact with the dielectric material 54. The fourth separator 55d is located between the first and second solid organic materials 53a, 53b. First and second separators 55a, 5
5b can be removed from the resonant circuit 51. The first, second, third, and fourth separators 55a, 55b, 55c, 55d are made of, for example, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), glass, and the like. Materials having a relative permittivity of 10 or less at normal temperature and pressure, such as epoxy resin, mica, quartz, cellophane, and rubber, can be used.

In the present embodiment, when another substance comes into contact with the resonance circuit 51, the resonance frequency changes. When the dielectric material 54 comes into contact with the resonance circuit 51, the resonance frequency of the resonance circuit 51 changes, and it can be detected that at least one of the first and second solid organic materials 53a and 53b has melted.

Substances that shield electromagnetic waves are the first, second, third, and fourth separators 55a, 5
When used as 5b, 55c, 55d, the resonance frequency may not be detected correctly.
Therefore, the first, second, third, and fourth separators 55a, 55b, 55c, 55
As the material, it is preferable to use a substance having a relative permittivity of 10 or less at normal temperature and pressure.

The temperature sensor 50 of the present embodiment has a temperature of at least the first and second solid organic materials 53a.
, 53b, at least the first and second solid organic materials 53
It is determined that either a or 53b has melted and the temperature sensor 50 has detected a temperature rise exceeding the threshold value.

When the temperature sensor 50 is used, a liquid may be used at normal temperature and pressure in order to select at least one of the first and second solid organic materials 53a and 53b according to the temperature of the environment in which it is used. First, second, third, and fourth separators 55a, 55b, 55c
When using the temperature sensor 50 that does not have 55d, it is necessary to keep the temperature below the melting point of the first and second solid organic materials 53a and 53b at all times, and it takes time and effort. Not preferable. Further, if the temperature reaches at least one of the melting points of the first and second solid organic materials 53a and 53b before use, the temperature of at least the first and second solid organic materials 53a and 53b is reached. Since either of them melts and the resonance circuit 51 and the dielectric material 54 come into contact with each other, the temperature sensor 50 cannot be used. In order to prevent these, in the present embodiment, before using the temperature sensor 50, the resonance circuit 51, the first,
And the first, second, and fourth separators 55a, 55b, 55d are located between them so that the second solid organic materials 53a, 53b and the dielectric material 54 do not touch each other. Even when at least one of the first and second solid organic materials 53a and 53b uses a liquid at normal temperature and pressure, the presence of the first and second separators 55a and 55b causes the liquid to be liquid at normal temperature and pressure. The first and second solid organic materials 53a and 53b do not contact the resonance circuit 51 and the dielectric material 54, and do not mix with each other. That is, before using the temperature sensor 50, the first,
And it is not necessary to keep the temperature below the melting point of the second solid organic materials 53a and 53b, and just before use, cool to the temperature below the melting point of the first and second solid organic materials 53a and 53b. It can be used by removing the first and second separators 55a and 55b after cooling. When the first and second separators 55a and 55b are removed, the resonance circuit 51,
The first and second solid organic materials 53a and 53b and the dielectric material 54 can be in contact with each other. At temperatures below the melting point of the first and second solid organic materials 53a, 53b, the first and second solid organic materials 53a, 53b existing between the resonant circuit 51 and the dielectric material 54.
As a result, the resonant circuit 51 and the dielectric material 54 do not come into contact with each other. At least the first and second
At a temperature higher than the melting point of any of the solid organic materials 53a and 53b, at least one of the first and second solid organic materials 53a and 53b melts, and the resonance circuit 51 and the dielectric material 54 can come into contact with each other. It becomes. Further, when at least one of the first and second solid organic materials 53a and 53b is melted by mixing a surfactant (such as an emulsifier) with the dielectric material 54 in advance, at least the first and second solid organic materials 53a and 53b are melted. Any of the second solid organic materials 53a and 53b and the dielectric material 54 can be easily mixed. As described above, the dielectric is obtained by melting at least one of the first and second solid organic materials 53a and 53b and mixing at least one of the first and second solid organic materials 53a and 53b with the dielectric material 54. The body material 54 is in contact with the resonance circuit 51 and can be used as the temperature sensor 50.

For example, frozen foods, ethical drugs, etc. may need to be stored and transported below a certain temperature. However, even if the temperature rises for some reason and affects the quality of the above products, it is possible to distinguish from the appearance the products that had a temperature rise in the middle when cooled again and the products that kept the temperature below a certain level. May not be easy.

The temperature sensor 50 of the present embodiment has at least the first and second solid organic materials 53a, 53.
When any of b melts, it mixes with the dielectric material 54 and the dielectric material 54 comes into contact with the resonance circuit 51. Therefore, it is cooled again to bring the melting point of at least one of the first and second solid organic materials 53a and 53b. Even if it falls below the value, the resonance frequency of the resonance circuit 51 does not return to the value before the change. for that reason,
By observing the resonance frequency of the temperature sensor 50, it can be easily determined whether or not the temperature has risen beyond the threshold value.

Further, the temperature threshold sensor 50 of the present embodiment has at least the first and second solids by having the first, second, third and fourth separators 55a, 55b, 55c and 55d. Even when any of the organic materials 53a and 53b is a liquid at normal temperature and pressure, the temperature threshold sensor 50 can be used regardless of the storage environment.

Further, in the present embodiment, since a power source or the like for communicating with an external device is not required, the shape can be made compact, and the temperature of various products is controlled by using the temperature sensor 50. Can be done.

(Fifth Embodiment) FIGS. 6a, 6b, 6c are other examples of a cross-sectional view and a plan view of the temperature sensor 60 according to the present embodiment. 6a is a cross-sectional view taken along the broken line H in FIG. 6c, and FIG. 6b is a cross-sectional view taken along the line H.
It is sectional drawing in the broken line I of c.

As shown in FIGS. 6a, 6b, 6c, the temperature sensor 60 includes resonance circuits 61, first and second covering members 62a, 62b, first and second solid organic materials 63a, 63b, and a dielectric material. 6
It has 4, 1st, 2nd, 3rd, and 4th separators 65a, 65b, 65c, 65d. The resonance circuits 61, the first, and the second covering members 62a, 62b are the same as the resonance circuits 11, the first, and the second covering members 12a, 12b of the first embodiment. The difference from the temperature sensor 10 according to the first embodiment is that the temperature sensor 60 of the present embodiment has the first, second, third, and fourth separators 65a, 65b, 65c, and 65d. , 1st and 2nd solid organic materials 63a, 63b and dielectric material 64 do not surround the entire resonant circuit 61.
It is located only in part.

In the temperature sensor 60 of the present embodiment, since it is determined that the dielectric material 64 is in contact with the resonance circuit 61 when the resonance frequency changes, the first and second solid organic materials 63a, 6
Even if the amount of the dielectric material 64 adjacent to 3b is not sufficient to contact the surface of the resonance circuit 61, if the dielectric material 64 can contact the side surface of the resonance circuit 61, the temperature rise can be detected sufficiently. The resonance frequency changes.

Therefore, the first and second solid organic materials 63a and 63b and the dielectric material 64 do not necessarily surround the entire resonance circuit 61, and need only be partially located.

As described above, the present embodiment of the present invention has a simple structure of the temperature sensors 10, 30, 40, 50, and the like.
60, the temperature detection device 100 and the temperature detection system 200 can be provided.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, as long as they do not deviate from the gist of the invention.
Various omissions, replacements and changes can be made. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

11, 21, 31, 41, 51, 61 ... Resonant circuits 12a, 32a, 42a, 52a, 62a ... First covering members 12b, 22b, 32b, 42b, 52b, 62b ... Second Coating members 13a, 33a, 43a, 53a, 63a ... First solid organic material 13b, 33b, 43b, 53b, 63b ... Second solid organic material 33c ... Third solid organic material 33d. Fourth solid organic materials 14, 34, 44, 54, 64 ... Dielectric materials 55a, 65a ... First separators 55b, 65b ... Second separators 55c, 65c ... Third separators 55d, 65d ... Fourth separator 101 ... Transmitter 102 ... Control unit 103 ... Receiver 104 ... Detection unit 105 ... Judgment units 10, 30 , 40, 50, 60 ... Temperature sensor 100 ... Temperature detection device 200 ... Temperature detection system

Claims (5)

Resonant circuit and
A first covering member that covers the surface of the resonant circuit and
A second covering member that covers the back surface of the resonance circuit and
The first and second solid organic materials in contact with the resonant circuit,
Dielectric material and
Have,
The dielectric material is located between the first and second covering members.
The dielectric material is in contact with the first and second solid organic materials.
The dielectric material is a temperature sensor that comes into contact with the resonance circuit via the first and second solid organic materials. It has first, second, third, and fourth separators,
The first, second, third, and fourth separators are located between the first and second covering members.
Further, the first separator is located between the resonant circuit and the first and second solid organic materials.
The second separator is located between the first and second solid organic materials and the dielectric material.
The first and second separators have a removable structure.
The third separator is in contact with the dielectric material and
The temperature sensor according to claim 1, wherein the fourth separator is located between the first and second solid organic materials. The temperature sensor according to any one of claims 1 or 2, wherein the first and second solid organic materials are liquids or solids at normal temperature and pressure. The temperature sensor according to any one of claims 1 to 3, wherein the dielectric material is a substance having a relative permittivity of 20 or more at normal temperature and pressure. The temperature sensor according to any one of claims 1 to 4.
The transmitting unit that transmits electromagnetic waves, the receiving unit that receives electromagnetic waves reflected from the resonance circuit of the temperature sensor according to any one of claims 1 to 4, and the signal strength with respect to the frequency of the received electromagnetic waves are extremely small. A temperature detection device including a detection unit whose resonance frequency is a frequency that takes the value of, and a determination unit that determines that the temperature has risen when the resonance frequency changes beyond a predetermined threshold range. When,
Temperature detection system with.

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