JP6938278B2 - Wiring board - Google Patents

Description

The present invention relates to a wiring board.

Conventionally, a wiring board includes a laminated board in which a wiring layer and a configuration related to power supply are laminated with an insulating layer interposed therebetween. In this wiring board, as the number of electrodes and the number of wirings related to input / output increase and the arrangement becomes denser, the demand for the diameter and arrangement interval of the through electrodes connecting between the wirings on both sides of the insulating layer has increased. There is. On the other hand, in Patent Document 1, four electrode pads for power supply are connected to a common penetrating conductor via one land, and the arrangement of the four electrode pads with respect to the penetrating conductor is adjacent to the penetrating conductor. Disclosed is a technique for widening the distance between through-conductors with respect to the number of electrodes and securing the width between electrodes by inclining relative to each other.

Japanese Patent No. 3847190

However, in the conventional technique, there is a problem that the space between the through conductors has a margin in comparison with the number of electrodes, and the electric resistance and the inductance cannot be reduced efficiently and sufficiently.

An object of the present invention is to provide a wiring board capable of more efficiently reducing electrical resistance and inductance in a through conductor.

In order to achieve the above object, the invention according to claim 1 is
With the core board
A plurality of power supply core through conductors and a plurality of grounding core through conductors that penetrate the core substrate and are alternately located on the vertical and horizontal grid points of the first square lattice.
A first connection position provided on the first surface of the core substrate and located at four vertices of the first square centered on the power supply core penetrating conductor, and
A second connection position provided on the first surface and located at four vertices of the second square centered on the grounding core penetrating conductor, and
A cross-shaped power supply conductor surface located on the first surface and extending from the power supply core penetrating conductor to the first connection position.
A grounding surface that surrounds the power supply conductor surface and is located on the first surface including the grounding core penetrating conductor and the second connection position.
An insulating layer laminated on the first surface and covering the power supply conductor surface and the ground plane,
A power supply through conductor that penetrates the insulating layer and is connected to the power supply conductor surface at the first connection position,
A grounding through conductor that penetrates the insulating layer and is connected to the grounding surface at the second connection position.
Equipped with
The power supply core penetrating conductors located diagonally in the first square lattice are at relative positions obtained by multiplying one diagonal of the first square by 1.5 and multiplying the other diagonal by 0.5. The grounding core through conductors that are arranged and diagonally located in the first square lattice are 1.5 times the diagonal line of one of the second squares and 0.5 diagonal lines of the other. It is a wiring board that is arranged at a doubled relative position.

The invention according to claim 2 is the wiring board according to claim 1.
On the second surface opposite to the first surface, a grounding conductor surface connected to the grounding core penetrating conductor is located in the same shape and at the same angle arrangement as the power supply conductor surface. The power supply conductor surface and the grounding conductor surface have an arrangement pattern in which the convex portion in one cross shape is at least partially combined with the concave portion in the other cross shape when projected in a plan view. It is provided .

The invention according to claim 3 is the wiring board according to claim 1 or 2.
When viewed by projecting flat face view, one of the power supply core through conductors, two of the the power supply through-conductors and one of the ground vias, one of the grounding core through conductors, 2 One of the grounding through conductors and one of the power supply through conductors, and two of the power supply through conductors and two of the grounding through conductors are arranged on the vertical and horizontal grid points of the second square lattice. that has been.

According to the present invention, there is an effect that the through conductor and the electrode pad can be arranged more efficiently on the wiring board.

It is sectional drawing which shows the laminated structure of the wiring board of embodiment of this invention. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a top view of the upper conductor layer and the insulating layer of a core substrate seen through from the upper surface side. It is a top view which saw through the lower conductor layer and the insulating layer of a core substrate from the upper surface side. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a top view which saw through the wiring layer and the insulation layer of a wiring board from the upper surface side. It is a bottom view when the wiring layer and the insulation layer are seen through from the lower surface side. It is a figure explaining the modification of the arrangement of the land provided in the supply voltage plane of the upper conductor layer, and the land provided in the ground plane of the lower conductor layer.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing a laminated structure of the wiring board 1 of the present embodiment.
Here, half of the cross section of the wiring board 1 passing through each electrode pad is shown.
The wiring board 1 is obtained by laminating a core substrate 30 with build-up layers 20 and 40 (at least insulating layers I4 and I5) sandwiching the upper and lower surfaces, and further covering both upper and lower end surfaces with solder resist layers 10 and 50.

In the build-up layers 20 and 40, a plurality of wiring layers L1 to L8 are laminated so as to be separated from each other by insulating layers I1 to I8. On the upper surface of the build-up layer 20 on the upper surface side connected to the semiconductor element (the surface opposite to the surface in contact with the core substrate 30), a plurality of flip chip pads (FC pads) used for connection with the semiconductor element are used. The electrode pads 211 of the above are provided and are each exposed from the openings of the solder resist layer 10.
The electrode pad 211 includes a signal pad 211a related to signal transmission, a power supply pad 211b related to power supply, and a ground pad 211c related to the supply of ground voltage. The installation range of the electrode pad 211 is set to be inside a square central region 200 (see also FIG. 2) on the upper surface of the build-up layer 20 depending on the semiconductor element to be connected.

The signal pad 211a, the power supply pad 211b, and the ground pad 211c are each provided on the lower surface of the build-up layer 40 (the surface opposite to the surface in contact with the core substrate 30) and are exposed from the openings of the solder resist layer 50, respectively. It is connected to the signal output pad 418a, the power supply output pad 418b, and the ground output pad 418c (collectively, the output pad 418; see FIG. 11).

Here, in the build-up layer 20, four wiring layers L1 to L4 are provided and laminated on the four insulating layers I1 to I4, respectively. The wiring layers L1 to L4 and the wiring layer L4 and the upper conductor layer L31 of the core substrate 30 are electrically connected by a through conductor (through via) provided through the insulating layers I1 to I4. The signal through conductors 221a to 224a related to signal transmission are individually connected to the signal core through conductor 320a of the core substrate 30. On the other hand, the power supply through conductors 221b to 224b related to the power supply are connected to the supply voltage surfaces 231 and 233 provided in the wiring layers L1 and L3, and the supply voltage surfaces 231 and 233 and the power supply core. It is connected to the through conductor 320b. Further, the grounding through conductors 221c to 224c related to grounding are connected to the grounding surfaces 232 and 234 provided in the wiring layers L2 and L4, and the grounding surfaces 232 and 234 are connected to the grounding core through conductor 320c. doing.

Here, in the build-up layer 40, four wiring layers L5 to L8 are provided and laminated on the lower surface side of each of the four insulating layers I5 to I8. The penetration between the wiring layers L5 to L8 and between the wiring layer L5 and the lower conductor layer L32 of the core substrate 30 is provided in the insulating layers I5 to I8 as well as between the wiring layer L1 and the upper conductor layer L31. It is electrically connected by conductors (signal through conductors 425a to 428a, power supply through conductors 425b to 428b, grounding through conductors 425c to 428c). The wiring layers L5 and L7 are provided with supply voltage surfaces 435 and 437, and the wiring layers L6 and L8 are provided with ground planes 436 and 438.

The core substrate 30 is a support substrate for the wiring substrate 1, and an upper conductor layer L31 (second surface) and a lower conductor layer L32 (first surface) are provided on the upper and lower surfaces of the insulating layer I31, respectively. Here, the upper conductor layer L31 on the upper surface side is provided with the supply voltage surface 331, and the lower conductor layer L32 is provided with the ground plane 332. Core penetrating conductors (signal core penetrating conductor 320a, power supply core penetrating conductor 320b, grounding core penetrating conductor 320c) are provided on the inner wall surface of the through hole that penetrates the insulating layer I31 in the vertical direction. The core through conductor connects the signal and voltage (supply voltage and ground voltage) paths between the build-up layer 20 and the build-up layer 40.

As the insulating layers I1 to I8, for example, various insulating resin materials are used, but various other organic compounds and inorganic materials (ceramics) may also be used. As the through conductor, a combination of tungsten, copper, or the like that is appropriate depending on the material of the insulating layer is used.
The thickness ratios of the insulating layers I1 to I8 and I31, the wiring layers L1 to L8, the upper conductor layer L31, and the lower conductor layer L32, and the shapes and sizes of the through conductor, the electrode pad 211, and the output pad 418 are described. It is emphasized or simplified for explanation and does not reflect a specific value or shape. Further, the upper and lower parts referred to here are for convenience of explanation and are not fixed. The orientation during storage and use can be changed as appropriate.

FIG. 2 is a plan view of the wiring layer L1 and the insulating layer I1 of the wiring board 1 of the present embodiment as viewed through from the upper surface side. Here, 1/4 including one vertex (upper right corner when viewed from the upper surface side) is shown.
Further, FIG. 3 is a plan view of the wiring layer L2 and the insulating layer I2 seen through from the upper surface side.

As described above, in the wiring layer L1, the signal pads 211a, the power supply pads 211b, and the ground pads 211c are arranged in a two-dimensional matrix (on the grid points of the square grid) inside the central region 200. The arrangement pattern of the three types of electrode pads 211 is not particularly limited, but here, the signal pad 211a is provided on the peripheral edge of the central region 200, and the power supply pad 211b and the ground pad 211c are mainly provided in the central region 200. It is arranged around the center of the signal pad 211a. The periphery of the central region 200 (the peripheral edge of the wiring layer L1) is the supply voltage surface 231.

Each of the power supply pads 211b is arranged so as to be connected to the supply voltage surface 231 in the wiring layer L1 either directly or via another power supply pad 211b. The signal pad 211a and the ground pad 211c are each isolated from the supply voltage surface 231 by an insulating portion. An insulating portion may be provided in common for a portion where the signal pad 211a and the ground pad 211c are arranged adjacent to each other. Here, except for the power supply pads 211b (six in FIG. 2) provided on the outermost periphery of the two-dimensionally arranged electrode pads 211, the through conductors 221 (for signals) penetrating the via holes of the insulating layer I1 respectively. It is connected to the wiring layer L2 by a through conductor 221a, a through conductor 221b for power supply, and a through conductor 221c for grounding).

In the wiring layer L2, from the connection position 212a (root) of the signal through conductors 221a connected to the plurality of signal pads 211a, the wiring 25 is projected from the plan view of the central region 200 in the wiring layer L2. It extends toward the outer edge. These wirings 25 extend to a position (hereinafter referred to as a plan view position) when the signal penetration conductor 222a that penetrates the insulating layer I2 and is connected to the wiring layer L3 is projected in a plan view and extends to the signal penetration. It is connected to the conductor 222a.

The position of the signal through conductor 222a in a plan view corresponds to the position of the signal output pad 418a in the wiring layer L8. The plan view position of the signal through conductor 222a (that is, the position of the signal output pad 418a) is outside the plan view projection range of the central region 200 in the wiring layer L2, that is, in the peripheral portion of the wiring layer L2 and in the central region 200. They are arranged in a two-dimensional matrix (on the grid points of a square lattice) at intervals wider than the arrangement of the electrode pads 211.

In the wiring layer L2, the ground plane is 232 except for the root position of each through conductor, the wiring 25, and the insulating portion around them. The connection positions 212c of the grounding through conductor 221c penetrating the insulating layer I1 at the positions of the plurality of ground pads 211c with the wiring layer L2 are all connected to the ground surface 232 directly or via other connection positions 212c.

Of the connection positions 212b and 212c of the power supply through conductor 221b penetrating the insulating layer I1 and the grounding through conductor 221c with the wiring layer L2, the grounding through conductor 221c provided on the outermost periphery of the two-dimensional arrangement (here, here). Except for the connection positions 212c (3), the wiring layer L3 is further connected by a power supply through conductor 222b and a grounding through conductor 222c that penetrate the insulating layer I2.

FIG. 4 is a plan view of the wiring layer L3 and the insulating layer I3 seen through from the upper surface side. Further, FIG. 5 is a plan view of the wiring layer L4 and the insulating layer I4 as seen through from the upper surface side.

The wiring layer L3 is provided with a supply voltage surface 233. The signal through conductor 222a penetrating the insulating layer I2 and the connection positions 213a and 213c between the grounding through conductor 222c and the wiring layer L3 are respectively insulated and separated from the supply voltage surface 233. These connection positions 213a and 213c are in contact with the signal through conductor 223a and the grounding through conductor 223c penetrating the insulating layer I3 on the lower surface side. On the other hand, the power supply through conductor 223b penetrating the insulating layer I3 is provided so as to be connected to the supply voltage surface 233 according to the arrangement (described later) of the through holes penetrating the core substrate 30. That is, at least a part of the power supply through conductor 222b (connection position 213b with the supply voltage surface 233) and the plan view position of 223b are not the same with respect to the supply voltage surface 233.

In the wiring layer L4, the signal penetrating conductor 223a and the power supply penetrating conductor 223b penetrating the insulating layer I3 and the signal penetrating conductor 224a and the power supply penetrating conductor 224b penetrating the insulating layer I4 are connected at connection positions 214a and 214b. Has been done. A ground plane 234 is provided around these connection positions 214a and 214b via an insulating portion.

As described above, the power supply through conductor 224b is arranged so as to align with the position of the through hole (power supply core through conductor 320b) (see FIGS. 1, 6, etc.) provided in the core substrate 30. It is provided at the same plan view position as the supply through conductor 223b. Here, four through conductors 224b for power supply form a set of group 24b, and the four positions are arranged so as to form four vertices of a square inclined by 45 degrees with respect to the outer circumference of the wiring layer L4. ing. That is, the two diagonal lines of the four vertices have a cross shape parallel to and orthogonal to the two adjacent sides of the outer circumference of the wiring layer L4. The intersection of these two diagonal lines of equal length (that is, the center position of the four vertices and the center of gravity position when the weights of the four vertices are equal) is the center position of the through hole. Further, the adjacent groups 24b are located at a position where the length of one diagonal line is multiplied by 1.5 and the length of the other diagonal line is multiplied by 0.5 from the center position of the through hole of one group 24b. It is arranged so that the center position of the through hole is provided.

On the lower surface side of the grounding surface 234, a grounding through conductor 224c is provided which penetrates the insulating layer I4 and connects the grounding surface 234 and the supply voltage surface 331 on the upper surface side of the core substrate 30. The grounding through conductor 224c is arranged in an arrangement pattern of the same shape so as to fit in the square gap of each group 24b of the power supply through conductor 224b. That is, the grounding through conductors 224c are arranged so as to form four vertices of a square inclined by 45 degrees with respect to the wiring layer L4 (wiring board 1), in which four of them form a set of groups 24c. The two diagonal lines of the four vertices each have a cross shape parallel to and orthogonal to the two adjacent sides of the wiring layer L4. The intersection of these two diagonal lines (the center position of the four vertices (the position of the center of gravity when the weights of the four vertices are equal) is the center position of the through hole (grounding core penetrating conductor 320c) provided in the core substrate 30. Further, in the adjacent group 24c, the length of one diagonal line is multiplied by 1.5 from the position of the through hole of one group 24c, and the length of the other diagonal line is multiplied by 0.5. They are arranged so that the center position of the through hole is provided. The plan view positions of the grounding through conductor 223c (connection position 214c with the grounding surface 234) and 224c with respect to the grounding surface 234 are not at least partially the same.

FIG. 6 is a plan view of the upper conductor layer L31 and the insulating layer I31 of the core substrate 30 as viewed through from the upper surface side. Further, FIG. 7 is a plan view of the lower conductor layer L32 and the insulating layer I5 of the core substrate 30 as viewed through from the upper surface side.

As described above, the upper conductor layer L31 is provided with a supply voltage surface 331, and the lower conductor layer L32 is provided with a ground plane 332. A through hole having a signal core through conductor 320a is provided and connected to the connection position 311a (root) of the signal through conductor 224a with the upper conductor layer L31 through the core substrate 30. A signal penetrating conductor 425a provided through the insulating layer I5 is connected to the connection position 312a (root) with the lower conductor layer L32 of the signal core penetrating conductor 320a.

In the upper conductor layer L31, the connection position 311c with the grounding through conductor 224c arranged for the group 24c of a set of four as described above and the range including these diagonal lines have a cross shape (grounding core through conductor 320c). A land 341c, which is a grounding conductor plane (grounding conductor surface) having a shape having irregularities according to the positional relationship of the grounding through conductor 224c arranged around the grounding conductor, is provided so as to be surrounded by the supply voltage surface 331. There is. At the intersection position (plan view) of the diagonal lines on the core substrate 30, one grounding core through conductor 320c common to the four grounding through conductors 224c penetrating the insulating layer I4 (second insulating layer) is provided. A through hole is provided and is connected to the ground contact surface 332 of the lower conductor layer L32. That is, here, four grounding through conductors 224c are arranged at equal angular intervals (90 degree intervals) around the plan view position of the grounding core through conductor 320c. On the lower surface side of the grounding surface 332, a grounding through conductor 425c penetrating the insulating layer I5 at the same plan view position as the grounding through conductor 224c (that is, around the connection position 312c with the grounding core through conductor 320c). It is provided and connects the grounding surface 332 (lower conductor layer L32) and the wiring layer L5.

The lower conductor layer L32 has a cross shape (unevenness corresponding to the positional relationship of a plurality of power supply through conductors 425b provided around the power supply core through conductor 320b) in a positional relationship complementary to the land 341c. A land 342b, which is a conductor plane for power supply (conductor surface for power supply) having a shape (having a shape), is provided so as to be surrounded by a ground plane 332. At each tip of the land 342b, that is, at the same plan view position as the connection position 311b between the power supply through conductor 224b and the upper conductor layer L31, the wiring layer L5 penetrates the insulating layer I5 (first insulating layer). A power supply through conductor 425b is provided to connect to the power supply. A through hole having one power supply core through conductor 320b is provided at a diagonal intersection position (plan view) of these four power supply through conductors 425b, and the upper end is a supply voltage surface in the upper conductor layer L31. It is connected to 331, and the base is the connection position 312b with the land 342b. That is, four power supply through conductors 425b are arranged at equal angular intervals (90 degree intervals) around the plan view position of the power supply core through conductor 320b.

In this way, the grounding land 341c and the power supply land 342b are projected from the position of the power supply core through conductor 320b to the position of each power supply through conductor 425b when projected in a plan view. The convex portion of the extending land 342b and the concave portion of the land 341c generated between the plurality of grounding through conductors 224c seen from the position of the grounding core penetrating conductor 320c are combined (here, the convex portion enters the inside of the concave portion). The convex portion of the land 341c extending from the position of the grounding core through conductor 320c to the position of each grounding through conductor 224c, and a plurality of power supplies viewed from the position of the power supply core through conductor 320b. It is provided in an arrangement pattern such that the concave portion of the land 342b generated between the through conductors 425b is combined (similarly, the convex portion enters the inside of the concave portion). Here, the lands 341c and 342b both have a cross shape (same shape), and by being provided at the same angle arrangement, the convex portion of the land 341c and the convex portion of the land 342b are combined in parallel. As a result, the lands 341c and 342b do not occupy more space than necessary, and the lands 341c and 342b do not generate more space than necessary. Further, a large number of power supply core through conductors 320b and grounding core through conductors 320c are arranged more efficiently.

Further, in the upper conductor layer L31 and the lower conductor layer L32, the arrangement of the power supply through conductor 425b, the power supply core through conductor 320b, the grounding through conductor 224c, and the grounding core through conductor 320c is continuous. One of them is arranged on the grid points of the square grid within the range defined in the above. That is, all of these through conductors are arranged at appropriate intervals, and the land 341c of the upper conductor layer L31 and the land 342b of the lower conductor layer L32 are appropriately provided according to these arrangements, so that the lands 342b of the lower conductor layer L32 are efficiently provided. A core penetrating conductor 320b for power supply and a core penetrating conductor 320c for grounding are arranged at high density.

FIG. 8 is a plan view of the wiring layer L5 and the insulating layer I6 seen through from the upper surface side. Further, FIG. 9 is a plan view of the wiring layer L6 and the insulating layer I7 seen through from the upper surface side.

From the lower conductor layer L32 to the wiring layer L6, all the through conductors are provided at the same plan view positions as the through conductors provided between the wiring layer L4 and the upper conductor layer L31. That is, the signal penetrating conductor 425a and the insulating layer I6 penetrating the insulating layer I5 are placed at the same plan view position as the signal penetrating conductor 224a (that is, the signal core penetrating conductor 320a in the core substrate 30) on the upper part of the core substrate 30. A penetrating conductor 426a for a penetrating signal is provided. Further, power supply through conductors 425b and 426b connected to the land 342b are provided at the same plan view positions as the four power supply through conductors 224b surrounding one power supply core through conductor 320b. Further, grounding through conductors 425c and 426c are provided at the same plan view positions as the four grounding through conductors 224c connected to the land 341c, respectively.

The wiring layer L5 is provided with a supply voltage surface 435 excluding a connection position 415a with the signal through conductor 425a, a connection position 415c with the grounding through conductor 425c, and an insulating portion around them. Connection positions 415b with the power supply through conductor 425b are arranged on the supply voltage surface 435. The wiring layer L6 is provided with a ground plane 436 excluding a connection position 416a with the signal through conductor 426a, a connection position 416b with the power supply through conductor 426b, and an insulating portion around them. Connection positions 416c with the grounding through conductor 426c are arranged on the grounding surface 436.

A grounding through conductor 427c penetrating the insulating layer I7 is connected to a part of the connection position 416c of the grounding through conductor 426c to the wiring layer L6 and is connected to the wiring layer L7.

FIG. 10 is a plan view of the wiring layer L7 and the insulating layer I8 as viewed through from the upper surface side. FIG. 11 is a bottom view when the wiring layer L8 and the insulating layer I8 are viewed through from the lower surface side.

In the insulating layer I7 between the wiring layers L6 and L7 and the insulating layer I8 between the wiring layers L7 and L8, the signal-through conductors 427a and 428a are located at the same plan-view positions as the signal-through conductors 426a, respectively. It is provided so as to sandwich the connection position 417a. That is, the signal path is provided so as to penetrate in the vertical direction from the position of the signal pad 211a in the wiring layer L2 to the position of the signal pad 211a drawn out of the central region 200 to the signal output pad 418a.

The grounding through conductors 427c and 428c penetrating the insulating layers I7 and I8 correspond to the grounding core through conductor 320c whose plan-viewing positions overlap with respect to the grid points of the square lattice related to the two-dimensional arrangement of the signal through conductors 427a and 428a. Four of them are provided at the positions of the group 24c with the connection position 417c on the wiring layer L7 interposed therebetween.

The power supply through conductor 427b penetrating the insulating layer I7 is provided at the same plan view position as the power supply through conductor 426b, and is connected to the supply voltage surface 437 at the connection position 417b of the wiring layer L7. The power supply through conductor 428b penetrating the insulating layer I8 is a group 24b corresponding to the power supply core through conductor 320b whose plan view position overlaps with the grid points of the square lattice related to the two-dimensional arrangement of the signal through conductor 428a. Four are provided at each position. The four power supply through conductors 428b of each group 24b are connected to one power supply output pad 418b in the wiring layer L8.

The lower surface side of the wiring layer L8 (the side opposite to the insulating layer I8) is covered with the solder resist layer 50. The solder resist layer 50 includes a signal output pad 418a, a power supply output pad 418b, and a grounding output pad 418c having a size corresponding to these pads and including the above-mentioned four sets of grounding through conductors 428c, respectively, in a square grid pattern. An opening is provided so as to be exposed to the air. These output pads 418 are sized and spaced according to the size of the solder balls as BGA pads (Ball Grid Array) to which the solder balls (not shown) can be connected (formed and adhered).

As described above, the wiring board 1 of the present embodiment includes the core board 30 and the insulating layers I4 and I5 laminated vertically with the core board 30 interposed therebetween. The lower conductor layer L32, which is the first surface of the core substrate 30, is provided with a plurality of power supply through conductors 425b penetrating the insulating layer I5 laminated on the surface side of the lower conductor layer L32. A power supply land 342b that is electrically connected to a common power supply core through conductor 320b that penetrates the 30 and a ground contact surface 332 that surrounds the land 342b are provided. Further, in the upper conductor layer L31 which is the second surface of the core substrate 30, a plurality of grounding through conductors 224c penetrating the insulating layer I4 laminated on the side of the upper conductor layer L31 penetrate the core substrate 30. A grounding land 341c that is electrically connected to the common grounding core penetrating conductor 320c and a supply voltage surface 331 that surrounds the grounding 341c are provided. The power supply core through conductor 320b is connected to the supply voltage surface 331 by the upper conductor layer L31, and the grounding core through conductor 320c is connected to the ground surface 332 by the lower conductor layer L32. The power supply land 342b has a shape having irregularities according to the positional relationship of a plurality of power supply through conductors 425b arranged around the power supply core through conductor 320b, and the grounding land 341c is grounded. It has a shape having irregularities according to the positional relationship of a plurality of grounding through conductors 224c provided around the core through conductor 320c. When the land 342b for power supply and the land 341c for grounding are projected from above in a plan view, at least a part of one convex portion and the other concave portion are combined, that is, The grounding core penetrating conductor 320c and the power supply core penetrating conductor 320b are provided in an arrangement pattern such that the distance between the grounding core penetrating conductor 320c and the power supply core penetrating conductor 320b is shortened by setting a particularly narrow interval in a part thereof. The narrow spacing may include zeros, or may be defined as the minimum insulation distance required between the grounding through conductor 224c (425c) and the power supply through conductor 224b (425b).
In this way, when projected in a plan view, the land 342b for power supply and the land 341c for grounding are effectively packed and arranged, so that the land 342b and 341c can be used for power supply. It is possible to increase the arrangement densities of the core through conductor 320b and the grounding core through conductor 320c reasonably and without causing problems so that a large number of them can be arranged. As a result, in the wiring board 1, the electric resistance and the inductance of the through conductor can be reduced more efficiently.

Further, the plurality of power supply through conductors 425b connected to the land 342b are provided around the power supply core through conductor 320b to be connected at equal angular intervals, and a plurality of grounds connected to the land 341c. The through-conductor 224c is provided around the grounding core through-conductor 320c to be connected at equal angular intervals. With such an arrangement, it is possible to easily and flexibly and efficiently arrange the power supply core through conductor 320b and the grounding core through conductor 320c densely.

Further, the land 342b for power supply and the land 341c for grounding are provided with the same shape and the same angle arrangement when projected in a plan view. By arranging the lands 341c and 342b in a uniform shape and angle in this way, it is possible to more easily arrange the power supply core penetrating conductor 320b and the grounding core penetrating conductor 320c densely.

Further, the grounding through conductor 224c, the grounding core through conductor 320c, the power supply through conductor 425b, and the power supply core through conductor 320b connected by the lands 342b and 341c are projected in a plan view. They are arranged on the grid points of a predetermined grid shape (here, a square grid). By arranging the connection positions of each terminal on the lattice points using the lattice structure in this way, the grounding core penetrating conductor 320c and the power supply core penetrating conductor 320b are packed at equal intervals and arranged in large numbers. Can be done. Further, while the grounding through conductor 224c and the power supply through conductor 425b connected to the lands 342b and 341c are arranged without unnecessary gaps, they do not have to be forcibly partially packed, so that they can be easily and efficiently packed. Lands 342b and 341c having appropriate shapes can be arranged two-dimensionally.

[Modification example]
FIG. 12 is a diagram illustrating a modified example of the arrangement of the land 341c provided in the supply voltage surface 331 of the upper conductor layer L31 and the land 342b provided in the ground plane 332 of the lower conductor layer L32 in the wiring board 1. be. Here, a plan view is shown when the upper conductor layer L31, the insulating layer I31, and the lower conductor layer L32 of the core substrate 30 are viewed through from the upper surface side.

The power supply core through conductor 320b and the grounding core through conductor 320c are alternately arranged vertically and horizontally in a two-dimensional matrix (on the grid points of a square lattice). The power supply through conductors 224b and 425b are provided at four vertices of a rectangle long in the left-right direction in the plane of FIG. 12, and the intersections of non-orthogonal diagonal lines are the center positions of the power supply core through conductor 320b. Further, the grounding through conductors 224c and 425c corresponding to one grounding core through conductor 320c are provided at four vertices of a rectangle long in the vertical direction in the plane of FIG. 12, and the diagonal intersections are the grounding core through conductors. It is the center position of 320c. That is, in this modification, two power supply through conductors (the other half with respect to half) are arranged line-symmetrically with respect to the axis of symmetry passing through the center position of the power supply core through conductor 320b for grounding. Two grounding through conductors are arranged line-symmetrically with respect to the axis of symmetry passing through the center position of the core through conductor 320c.

The land 341c1 for grounding and the land 342b1 for power supply have the same shape, and each has a recess according to the distance between the vertices, that is, the two recesses on the long side with a large distance are large recesses. Is formed with. By arranging the lands 342b1 with respect to the lands 341c1 in 90 degrees different directions so that the two convex portions forming both ends of the short sides are combined with respect to these two large concave portions, they are adjacent to each other in a plan view. The distance between the lands 341c1 and 342b1 is shortened. Here, the convex portion does not enter the inside of the concave portion, but by appropriately narrowing the distance between the concave portion and the convex portion related to the combination, the grounding core penetrating conductor 320c related to the land 341c1 and the power supply core related to the land 342b1. It is possible to narrow the distance from the penetrating conductor 320b without making it unnecessarily wide.
Here, the lands 341c1 and 342b1 are provided so as not to overlap each other in a plan view, but the lands 341c1 and 342b1 are provided in different planes (upper conductor layer L31 and lower conductor layer L32), respectively. If the power supply through conductors 224b and 425b and the grounding through conductors 224c and 425c can be appropriately arranged, the lands 341c1 and 342b1 may be in contact with each other or overlap with each other in a plan view.

As described above, in the wiring board 1 of the modified example, the power supply through conductor 425b commonly connected to the power supply core through conductor 320b and the grounding through conductor commonly connected to the grounding core through conductor 320c. When the number of 224c is even, half of the plurality of power supply through conductors 224b is the other half of the straight line passing through the center position of the power supply core through conductor 320b connected in the plane of the land 342b1. On the other hand, half of the plurality of grounding through conductors are provided at line-symmetrical positions with respect to the straight line passing through the center position of the grounding core through conductor 320c connected in the plane of the land 341c1 with respect to the other half. It is provided at a line-symmetrical position.
As described above, in the lands 341c1 and 342b1, a plurality of power supply through conductors 425b and grounding through conductors 224c are not completely provided at equal intervals with respect to the power supply core through conductor 320b and the grounding core through conductor 320c. However, when the halves are provided line-symmetrically, a large number of power supply core through conductors 320b and grounding core through conductors 320c can be provided in an array in the same manner.

Further, the land 342b1 for power supply and the land 341c1 for grounding are provided with the same shape and 90 degrees different directions when projected in a plan view. When four power supply through conductors 425b and grounding through conductors 224c are arranged line-symmetrically, lands 341c1 and 342b1 are efficiently arranged in a positional relationship rotated by 90 degrees with respect to the axis of symmetry. A plurality of lands can be packed and arranged, and many power supply core through conductors 320b and grounding core through conductors 320c can be arranged on the wiring board 1.

The present invention is not limited to the above embodiment, and various modifications can be made.
For example, in the above embodiment, an example in which each through conductor is arranged on the lattice points of a square lattice has been described, but each of them is on a lattice point of a rectangular lattice having different vertical and horizontal intervals of the lattice or on a lattice point of a hexagonal lattice. Land arrangements of the same shape and the same angular direction in which the through conductors are arranged may be made.

Further, in the above embodiment, four power supply through conductors 425b and a ground through conductor 224c are connected to one power supply core through conductor 320b and a grounding core through conductor 320c, respectively. It may be another number such as 6, or it may be an odd number such as 3. In these cases, an appropriate lattice shape may be selected, or the arrangement of each through conductor may not be limited to the arrangement on the lattice points as in the modified example.

Further, in the above embodiment, the power supply through conductor 425b connected to the power supply core through conductor 320b and the grounding through conductor 224c connected to the grounding core through conductor 320c have the same relative positional relationship or angle. Although it was decided to arrange only different shapes, different shapes may be used.

Further, in the above embodiment, when the signal pad 211a is arranged so as to substantially surround the power supply pad 211b and the ground pad 211c, the signal core on the signal path from the signal pad 211a to the signal output pad 418a. The case where the through conductor 320a is rearranged near the peripheral edge of the wiring board 1 and the space near the center of the wiring board 1 is used has been described as an example, but the signal path is not limited to this. Lands 341c and 342b, the power supply core penetrating conductor 320b, and the grounding core penetrating conductor 320c can be arranged at appropriate locations according to the number of signal pads 211a and the initial arrangement.

Further, in the above embodiment, the numbers of the wiring layers in the upper and lower build-up layers 20 and 40 of the core substrate 30 have been described equally, but different numbers depending on the number of signal pads 211a and the like, for example, in the build-up layer 20. The number of wiring layers may be larger than the number of wiring layers in the build-up layer 40.

Further, in the above embodiment, one convex portion is combined with each of the four concave portions, and in the modified example, two convex portions are combined with each of the two large concave portions. Do not have to be combined. That is, a part of the convex portion may be arranged without being combined with the concave portion. In the modified example, the small recesses are not combined with the protrusions.

Further, the combination here is not limited to the case where at least a part of the other convex portion is inserted (inserted) into the inside of one concave portion. Even if the concave part does not get inside when the concave part is narrow (thin), the shape is not always simple, or when the minimum insulating part is required between the convex part and the concave part in the plan view position. Here, the combination includes those that are arranged close to each other within a range in which they can be arranged relative to each other according to the uneven shape. Specifically, when at least a part of the uneven parts to be combined as compared with other parts of the lands has the narrowest distance between adjacent lands, or when the distance between the widest parts of the uneven parts is the same. By suppressing the ratio to a predetermined ratio or less compared to the minimum spacing portion, the arrangement spacing of the grounding core penetrating conductor 320c and the power supply core penetrating conductor 320b can be narrowed as compared with the case where no combination is performed. For example, in the case of a pattern. Whether or not the concave portion can enter the inside of the convex portion is determined by the size of the narrow interval (insulation width), the size of the uneven portion, the curvature, and the like.

Further, the arrangement pattern specifically shown in the above embodiment and the arrangement pattern specifically shown in the modified example may be used in any combination as long as they do not contradict each other or cancel the effects. ..
In addition, specific details such as the configuration, structure, and wiring shown in the above embodiment can be appropriately changed without departing from the spirit of the present invention.

1 Wiring board 10, 50 Solder resist layer 20, 40 Build-up layer 200 Central region 211 Electrode pad 211a Signal pad 211b Power supply pad 211c Ground pad 212a to 212c, 213a to 213c, 214a to 214c Connection position 221 Through conductor 221a to 224a 425a to 428a Signal penetrating conductors 221b to 224b, 425b to 428b Power supply penetrating conductors 221c to 224c, 425c to 428c Grounding through conductors 231, 233, 331, 435, 437 Supply voltage planes 232, 234, 332, 436 438 Ground plane 24b, 24c Group 25 Wiring 415a to 415c, 416a to 416c, 417a to 417c Connection position 418 Output pad 418a Signal output pad 418b Power supply output pad 418c Ground output pad 30 Core board 311a to 311c, 312a to 312c Connection Position 320a Signal core through conductor 320b Power supply core through conductor 320c Grounding core through conductor 341c, 341c1, 342b, 342b1 Lands I1 to I8, I31 Insulation layer L1 to L8 Wiring layer L31 Upper conductor layer L32 Lower conductor layer

Claims (3)

With the core board
A plurality of power supply core through conductors and a plurality of grounding core through conductors that penetrate the core substrate and are alternately located on the vertical and horizontal grid points of the first square lattice.
A first connection position provided on the first surface of the core substrate and located at four vertices of the first square centered on the power supply core penetrating conductor, and
A second connection position provided on the first surface and located at four vertices of the second square centered on the grounding core penetrating conductor, and
A cross-shaped power supply conductor surface located on the first surface and extending from the power supply core penetrating conductor to the first connection position.
A grounding surface that surrounds the power supply conductor surface and is located on the first surface including the grounding core penetrating conductor and the second connection position.
An insulating layer laminated on the first surface and covering the power supply conductor surface and the ground plane,
A power supply through conductor that penetrates the insulating layer and is connected to the power supply conductor surface at the first connection position,
A grounding through conductor that penetrates the insulating layer and is connected to the grounding surface at the second connection position.
Equipped with
The power supply core penetrating conductors located diagonally in the first square lattice are at relative positions obtained by multiplying one diagonal of the first square by 1.5 and multiplying the other diagonal by 0.5. The grounding core through conductors that are arranged and diagonally located in the first square lattice are 1.5 times the diagonal line of one of the second squares and 0.5 diagonal lines of the other. It is placed in a doubled relative position,
Wiring board. On the second surface opposite to the first surface, a grounding conductor surface connected to the grounding core penetrating conductor is located in the same shape and at the same angle arrangement as the power supply conductor surface. The power supply conductor surface and the grounding conductor surface have an arrangement pattern in which the convex portion in one cross shape is at least partially combined with the concave portion in the other cross shape when projected in a plan view. wiring board according to claim 1, wherein is provided. When viewed by projecting flat face view, one of the power supply core through conductors, two of the the power supply through-conductors and one of the ground vias, one of the grounding core through conductors, 2 One of the grounding through conductors and one of the power supply through conductors, and two of the power supply through conductors and two of the grounding through conductors are arranged on the vertical and horizontal grid points of the second square lattice. The wiring board according to claim 1 or 2.

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