JP6937409B2 - Heat dissipation structure and Ethernet power access point including it - Google Patents

Description

The present invention relates to a heat dissipation structure and an Ethernet power access point including the heat dissipation structure.

In apartment buildings or offices, APs (Access Points) can be connected to control switches connected to the external Internet so that users can use communication services using the ultra-high-speed Internet. do. A variety of communication equipment is used to provide users with ultra-high-speed Internet communication services.

In order to supply power to the communication equipment, an external power cable and an adapter, which are external power supply devices, are required, so a large space was required when installing the communication equipment. Therefore, in order to supply power to communication equipment without a separate external power supply device, an Ethernet cable installed inside the wall surface of a house or office is used.

Since the power supply terminal is built in the wall surface and the communication equipment is installed in a narrow space to supply power to the communication equipment, miniaturization of the communication equipment is indispensable. However, while the CPU performance of the miniaturized communication equipment is improved, the heat generation becomes intense, which causes a problem in the communication equipment performance.

Therefore, the present invention is a technique applicable to small communication equipment that operates based on a power supply applied through an Ethernet cable, and is a pipe-shaped heat dissipation structure into which a power supply board or a communication board can be fitted, and a heat dissipation structure in the form of a pipe. , Provide an Ethernet power access point including this.

An Ethernet power access point, which is one of the features of the present invention for achieving the technical object of the present invention, includes a first board, a second board, and a heat radiation structure in the form of a pipe having at least one flat surface. The first board is fitted inside the heat-dissipating structure in the form of a pipe, and one surface of the heat-dissipating structure to which the first board is fitted is attached to one surface of the second board.

In the heat radiating structure, at least one ventilation port may be formed on the wall surface of the heat radiating structure in the form of a pipe.

The heat radiating structure has a length shorter than the length of the first board and the second board, and may be embodied by a square pipe.

The heat radiating structure may be embodied in either an aluminum plate or a carbon-graphite material.

The second board may further include a plurality of antennas that output data processed by the plurality of data processing components to the power consuming device on the opposite side surface of the surface to which the heat radiating structure is attached.

Each of the plurality of antennas may be embodied in a curved three-dimensional antenna.

The plurality of antennas may be designed to have different patterns.

The second board may further include a heat conductive pad attached between the surface to which the heat radiating structure is attached and the heat radiating structure.

The heat conductive pad further includes one heat conductive pad attached between the opposite side surface of the second board and the heat radiating structure so as to include all the positions to which the plurality of data processing components are attached. be able to.

Includes an upper surface provided at the upper end of the second board, a lower surface provided at the lower end of the heat dissipation structure, and a plurality of side surfaces connected to one side of the upper surface and the lower surface, respectively. Each of the plurality of sides including the case may include a plurality of vents for discharging heat radiated through the heat dissipation structure to the outside of the Ethernet power supply device.

The heat dissipation structure inserted into the Ethernet power supply access point, which is another feature of the present invention for achieving the technical object of the present invention, includes an upper end surface and two side surfaces having one end connected to the upper end surface. The inside of the heat dissipation structure includes a lower end surface to which the other ends of the two side surfaces are connected to each other, and the front surface and the rear surface are embodied in the form of an open square pipe, and the inside of the heat radiation structure is passed through the front surface where the first board is open. The lower end surface includes a plurality of connecting grooves formed to a certain length on the side surface so as to be fitted to the lower end surface, and one surface of the second board is attached to the lower end surface. Includes vents provided separated from the ditch for a period of time.

The heat radiating structure may be any one of an aluminum plate and a carbon-graphite material.

A heat conductive pad located between the lower end surface and the second board and attached to the second board can be included.

The heat conductive pad may be attached to the second board in a size that transfers all the heat generated by the plurality of data processing components attached to the second board to the heat radiating structure.

According to the present invention, by fitting the board to the heat dissipation structure in the form of a pipe, it is possible to secure a wider heat dissipation area than the heat dissipation plate of the existing Ethernet power supply access point, so that deterioration of parts due to high heat can be prevented. Therefore, the stability and reliability of the communication equipment can be ensured.

Further, by cutting the heat-dissipating structure into an aluminum plate or carbon-graphite (Carbib-Graphite), which is light and has excellent thermal conductivity, the heat-dissipating effect can be obtained without interference with the power supply board.

Further, by adding a sufficient ventilation port to the case of the Ethernet power supply access point, the heat dissipation effect can be maximized by the smooth air flow.

In addition, it can be applied to various equipment such as small equipment for wireless communication, equipment with a case made of metal that makes it difficult to dissipate heat, and equipment that causes heat generation problems due to high-performance chips, minimizing damage to the main chip due to heat. The life of the equipment can be extended for a long time.

In addition, the stability and reliability of the equipment can be improved to increase user satisfaction.

It is a figure which illustrated the environment to which the Ethernet power access point was applied. It is a figure exemplifying a general communication board. It is a figure exemplifying a general communication board. It is a figure which illustrated the structure of the Ethernet power supply access point by the Example of this invention. It is a figure which illustrated the communication board by the Example of this invention. It is a figure which illustrated the heat dissipation structure by the Example of this invention. It is a figure which illustrated the antenna embodied in the communication board by the Example of this invention. It is a figure which illustrated the inside of the power-source board by an Example of this invention. It is a figure which illustrated the upper surface part of the Ethernet power supply access point by the Example of this invention. It is a figure which illustrated the rear part of the Ethernet power supply access point by the Example of this invention.

Hereinafter, examples of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention belongs can easily carry out the examples. However, the present invention can be realized in a variety of different forms and is not limited to the examples described herein. Then, in order to clearly explain the present invention in the drawings, parts unnecessary for explanation are omitted, and similar drawing reference numerals are given to similar parts throughout the specification.

When we say that a part "contains" a component in the entire specification, this means that other components can be included without excluding other components unless otherwise stated. do.

Hereinafter, a PoE AP including a heat sink according to an embodiment of the present invention (hereinafter, referred to as an “Ethernet power access point” for convenience of explanation) will be described in detail with reference to the drawings.

FIG. 1 is a diagram illustrating an environment in which an Ethernet power access point is applied.

As shown in FIG. 1, when the router 10 transmits data over the external network 20, the Ethernet power switch 30 provides the received data and power (Power) to the Ethernet power access point 40 through an Ethernet (LAN) cable. .. The Ethernet power access point 40 drives the communication chip of the communication board with the power supplied from Ethernet.

As a result, the wired communication service through the Ethernet cable on the upper surface of the Ethernet power supply access point 40 and the wireless communication service through the antenna are provided to each terminal 50.

The terminal 50 provides the user with a wired Internet service or a wireless communication service based on the data supplied from the Ethernet power access point 40. Here, the terminal 50 includes various types of devices such as a notebook computer, a PDA, and a smartphone.

The Ethernet power switch 30, which is a kind of network switch, includes a plurality of PoE connection ports that support the PoE function. The Ethernet power switch 30 is connected to the Ethernet power access point 40 through a UTP (Unshielded Twisted Pairair) cable to provide the Ethernet power access point 40 with data and power contained in a network signal.

When the Ethernet power access point 40 receives the data and the power supply through the UTP cable, the Ethernet power supply access point 40 separates the data and the power supply. Then, the separated data and the power supply are applied to the wireless chip through the internal circuit, and are provided to each terminal 50 by the wired communication service through LAN and the wireless communication service through Wi-Fi. At this time, prior to explaining the embodiment of the present invention, a communication board that separates data and power from a general Ethernet power access point will be described first with reference to FIG.

2 and 3 are diagrams illustrating a general communication board.

As shown in FIG. 2, the communication board 60 constituting the Ethernet power access point 40 supplies power and data from the power supply board (not shown) to the rear surface of the communication board 60 through a BTB (Board To Board) connector. Receive. Then, the power supply is changed so that the three main chips 61, 62, 63 provided in the communication board 60 operate. Here, the main chips 61, 62, 63 can include an RF chip, a CPU, a switch, and the like.

Further, the communication board 60 processes the data and provides the data to the terminal 50 through the two antennas 64 and 65.

At this time, the three main chips 61, 62, 63 provided on the communication board 60 operate, and a large amount of heat is generated. Therefore, when the Ethernet power access point 40 is operated for a long time, performance deterioration, component deterioration, and operation error due to high heat occur.

In order to overcome this, as shown in FIG. 3 (a), a heat conductive pad 66 is attached to the upper part of the main chips 61, 62, 63, and as shown in FIG. 3 (b). A heat sink 67 was added on the heat conductive pad to disperse the heat generated by the main chips 61, 62, 63.

However, since the size of the Ethernet power access point 40 is small and the space where the heat conduction pad 66 and the heat sink 67 are installed is limited, it is necessary to disperse all the heat generated by the main chips 61, 62, 63. There is a limit. Further, as the performance of the CPU, which is one of the main chips 61, 62, and 63, is improved, there is a disadvantage that the heat generated while processing the data by the CPU cannot be sufficiently dispersed.

Therefore, in the embodiment of the present invention, the internal space of the Ethernet power supply access point is fully utilized to expand the heat dissipation area and prevent the deterioration of parts due to high heat. It also attempts to adjust the structure of the Ethernet power access point so that the heat generated by the communication board is not transferred to the power board.

The structure of the Ethernet power supply access point according to the embodiment of the present invention will be described with reference to FIG.

FIG. 4 is a structural diagram of an Ethernet power supply access point according to an embodiment of the present invention.

As shown in FIG. 4, the Ethernet power access point 100 includes two boards (first board and second board), a communication board 110 and a power board 120.

The power supply board 120 is fitted to the heat dissipation structure 130 in the form of a pipe, and the heat dissipation structure 130 to which the power supply board 120 is fitted is attached to one side surface of the communication board 110. The communication board 110 and the power supply board 120 are separated by a heat radiating structure 130 for a certain period of time.

In the embodiment of the present invention, the power supply board 120 is fitted to the heat radiating structure 130 as an example, but the communication board 110 can be realized so as to be fitted to the heat radiating structure 130. Further, the heat radiating structure 130 can be realized so as to be located between the communication board 110 and the power supply board 120.

Further, all of the communication board 110 and the power supply board 120 can be fitted to the heat dissipation structure 130, and even if the communication board 110, the power supply board 120, and the heat dissipation structure 130 are realized in various forms other than the illustrated method. good. In such a structure of the Ethernet power supply access point 100, the communication board 110 will be described with reference to FIG.

FIG. 5 is a diagram illustrating a communication board according to an embodiment of the present invention.

As shown in FIG. 5, when a main chip (for example, an RF chip, a CPU, a switch, etc.), which is a data processing component, is installed on the first surface of the communication board 110, the second surface of the communication board 110 is covered. The heat conductive pad 112 is attached. Conventionally, as described in FIG. 2, heat conductive pads are attached to the upper ends of the main chips, but the heat generated by the main chip causes the heat conductive pads to separate from the main chip and cannot transfer heat to the heat dissipation pads. Sometimes.

Therefore, in the embodiment of the present invention, in addition to the heat conductive pad to which the main chip is directly adhered, the heat conductive pad 112 is also adhered to the second surface of the communication board 110 to rapidly dissipate the heat generated by the main chip. To radiate into the air. At this time, the heat conductive pad 112 does not adhere to the second surface by the size of each of the main chips, but adheres the heat conductive pad 112 over a wide area so as to include all of the plurality of main chips.

The heat radiating structure 130 in the form of a pipe is adhered on the heat conductive pad 112. At this time, the form of the heat radiating structure 130 will be described with reference to FIG.

FIG. 6 is a diagram illustrating a heat radiating structure according to an embodiment of the present invention.

As shown in FIG. 6, the heat dissipation structure 130 is embodied in the form of a pipe so that the power supply board 120 can be fitted. In the embodiment of the present invention, the heat radiating structure 130 is shown in the form of a straight hexahedron square pipe for convenience of explanation, but the power supply board 120 can be fitted and one surface can be attached to the communication board 110. It may be embodied in the form of a pipe.

For example, the surface attached to the communication board 110 may be embodied as a flat surface, and the space into which the power supply board 120 may be fitted may be embodied as a circle or a polygon. In the embodiment of the present invention, the heat radiating structure 130 is referred to as a pipe form for convenience of explanation, but it can also be referred to by various terms such as an empty pipe, a square pipe and a tube.

The heat radiating structure 130 is embodied in a size that allows the entire inside of the rear case of the Ethernet power supply access point 100 to be used.

Further, in the embodiment of the present invention, the length of the heat radiating structure 130 is realized to be shorter than the length of the power supply board 120. This is because the parts attached to the power supply board 120 or the interface parts for connecting the communication board 110 and the power supply board 120 (for example, a BTB (Board To Board) connector) do not interfere with each other due to the heat dissipation structure 130. To do so. For this reason, the heat radiating structure 130 is formed with grooves 131 having various patterns depending on the positions of the parts attached to the power supply board 120.

The pipe-shaped heat radiating structure 130 has an insertion groove into which the structure provided in the power supply board 120 is fitted so that the power supply board 120 does not easily come off or move even if the power supply board 120 is fitted inside. 132 and 133 are formed.

The insertion grooves 132 and 133 are formed at positions raised from the lowermost end of the heat radiating structure 130 to the upper end at regular intervals. This is because when the power supply board 120 is fitted to the heat dissipation structure 130, it is separated from the communication board 110 for a certain period of time so that the heat generated by the communication board 110 does not directly affect the power supply board 120. Is.

Ventilation ports 134 and 135 are provided on the opposite side surfaces of the heat radiating structure 130 in the form of a pipe so that heat can be easily radiated into the air. In the embodiment of the present invention, one ventilation port 134, 135 is provided on one side as an example, but a plurality of ventilation ports are provided on one side, or the size of the ventilation port occupies most of the side surface. It can also be embodied in this way, and is not necessarily limited in this way.

At the lower end of the heat radiating structure 130, a heat conductive pad attachment groove 136 is formed so as to be attached to the heat conductive pad 112 attached to the second surface of the communication board 110.

Common heat sinks are embodied in metal materials such as aluminum for price, heat conduction and radiation. However, metal materials block radio waves and cause many restrictions on wireless communication. Therefore, the heat radiating structure 130 according to the embodiment of the present invention will be described by using an aluminum plate or a carbon-graphite material as an example so as to minimize radio interference, but this is not always the case. It is not limited to.

Next, an antenna embodied on the first surface of the communication board 110 together with the main chip will be described with reference to FIG. 7.

FIG. 7 is a diagram illustrating an antenna embodied in a communication board according to an embodiment of the present invention.

As shown in FIG. 7, dual band internal antennas 113 and 114 are mounted on both sides of the first surface of the communication board 110 in order to provide a Wi-Fi communication service to the user. In the embodiment of the present invention, since the antennas 113 and 114 are directly mounted on the communication board 110, the loss can be reduced and the size of the antenna can be maximized in a small space.

Conventionally, due to the size limit of the Ethernet power access point, a flat antenna was inserted, and the antenna gain and efficiency were impaired. However, in the embodiment of the present invention, the antennas 113 and 114 are realized in a three-dimensional form in which at least one surface is bent.

In the embodiment of the present invention, the antennas 113 and 114 are embodied in a bent form like a “┐”, but the antennas 113 and 114 are not necessarily limited in this way. Then, the distance between the two antennas 113 and 114 is separated as much as possible to minimize the interference between the antennas 113 and 114 and maximize the gain and efficiency.

In addition, the patterns of the two antennas 113 and 114 are designed to be different to minimize the superposition of the patterns in which radio waves are radiated. This can improve coverage. Since such a method can make the best use of the internal space even between complicated circuit parts, it becomes easy to realize an antenna of a communication product having a high density or a limited size.

Next, the power supply board 120 according to the embodiment of the present invention will be described with reference to FIG.

FIG. 8 is a diagram illustrating a power supply board according to an embodiment of the present invention.

As shown in FIG. 8, the power supply board 120 receives data and 48V power supply from the LAN switch and the external power supply through the LAN connector. The power supply board 120 includes a first circuit that separates data from the supplied 48V power supply, and a second circuit that drops the voltage of the 48V power supply to 12V.

Here, the power supply provided to the Ethernet power supply access point 100 corresponds to about 48 V in direct current, which corresponds to a standard power supply. Therefore, even in the embodiment of the present invention, the one that receives the supply of the 48V power supply will be described as an example.

Further, the power supply board 120 transmits the data separated through the BTB connector and the 12V voltage to the communication board 110. Here, since the method in which the first circuit separates the 48V power supply and the data and the method in which the second circuit drops the 48V power supply to the 12V voltage can be executed in various ways, one method which is an embodiment of the present invention. Not limited to.

The power supply board 120 is formed with two connecting structures 121 and 122 so as to be fitted in the insertion grooves 132 and 133 provided in the heat radiating structure 130. The respective connecting structures 121 and 122 are inserted into the insertion grooves 132 and 133 of the heat radiating structure 130, and the power supply board 120 is easily separated from the heat radiating structure 130 or fixed so as not to move.

As described above, the appearance of the Ethernet power supply access point 100 including the heat radiating structure 130 will be described with reference to FIGS. 9 and 10.

FIG. 9 is a diagram illustrating an upper surface portion of an Ethernet power supply access point according to an embodiment of the present invention. FIG. 10 is a diagram illustrating a rear surface portion of the Ethernet power supply access point according to the embodiment of the present invention.

As shown in FIGS. 9 and 10, the Ethernet power access point 100 protects components inside the Ethernet power access point 100 through the top case 140, the bottom case 150, and the side case 160s on both sides.

A LAN port can be added to the upper surface of the Ethernet power supply access point 100 to connect a wired terminal capable of LAN communication such as a laptop computer to provide a wired Internet service.

A WAN (Wide Area Network) communication connector 180 is provided on the rear surface of the Ethernet power access point 100 so that the Ethernet power access point 100 is connected to an external network through an Ethernet power switch.

When the power board 120 of the Ethernet power access point 100 receives power and data through the WAN communication connector 180, it separates the power and data. Then, after the voltage of the power supply is dropped, the adjusted power supply and data are transmitted to the communication board 110 through the BTB connector 170. In the embodiment of the present invention, an example in which an RJ (Registered Jack) -45 is used for the WAN communication connector 180 will be described as an example, but the present invention is not necessarily limited to this.

The side case 160 provided on the side surface of the Ethernet power access point 100 radiates the heat generated inside the Ethernet power access point 100 into the air, and a plurality of ventilation ports 190 so that the air can flow smoothly. Is embodied.

Although the examples of the present invention have been described in detail above, the scope of rights of the present invention is not limited to this, and a variety of persons skilled in the art using the basic concept of the present invention defined in the claims. Modifications and improvements also belong to the scope of the present invention.

The present invention can be used for Ethernet power access points.

100 Ethernet power access point 110 Communication board 120 Power board 130 Heat dissipation structure 134,135 Ventilation port 112 Heat conduction pad 113,114 Antenna 132, 133 Insert groove 140 Top case 150 Bottom case 160 Side case 190 Ventilation port

Claims (14)

Includes a first board, a second board, and a heat dissipation structure in the form of a pipe with at least one flat surface.
Ethernet power supply access in which the first board is fitted inside the heat radiating structure in the form of a pipe, and one side of the heat radiating structure to which the first board is fitted is attached to one side of the second board. point. The Ethernet power access point according to claim 1, wherein the heat radiating structure has at least one ventilation port formed on a wall surface of the pipe-shaped heat radiating structure. The Ethernet power access point according to claim 2, wherein the heat radiating structure has a length shorter than the length of the first board and the second board, and is embodied by a square pipe. The Ethernet power access point according to claim 3, wherein the heat radiating structure is made of either an aluminum plate or a carbon-graphite material. The Ethernet according to claim 1, wherein the second board further includes a plurality of antennas that output data processed by a plurality of data processing components to a power consuming device on the opposite side surface of the surface to which the heat radiation structure is attached. Power access point. The Ethernet power access point according to claim 5, wherein each of the plurality of antennas is a three-dimensional antenna having a bent shape. The Ethernet power access point according to claim 6, wherein the plurality of antennas are each designed to have a different pattern. The Ethernet power access point according to claim 5, wherein the second board further includes a heat conductive pad attached between the surface to which the heat radiating structure is attached and the heat radiating structure. The heat conductive pad further includes one heat conductive pad attached between the opposite side surface of the second board and the heat radiating structure so as to include all the positions to which the plurality of data processing components are attached. The Ethernet power access point according to claim 8. Includes an upper surface provided at the upper end of the second board, a lower surface provided at the lower end of the heat radiating structure, and a plurality of side surfaces connected to one side of the upper surface and the lower surface, respectively. Including the case
The Ethernet power access point according to claim 1, wherein each of the plurality of sides includes a plurality of ventilation holes for discharging heat radiated through the heat dissipation structure to the outside of the Ethernet power supply device. A heat dissipation structure that is inserted into an Ethernet power access point.
The front and rear surfaces are embodied in the form of an open square pipe, including an upper end surface, two side surfaces having one end connected to the upper end surface, and a lower end surface to which the other ends of the two side surfaces are connected to each other. Being done
Includes a plurality of connecting grooves formed to a certain length on the side surface so that the first board is fitted inside the heat dissipation structure through the open front surface.
One surface of the second board is attached to the lower end surface.
A heat-dissipating structure including a ventilation port provided at least one of the side surfaces at a certain distance from the connecting groove. The heat-dissipating structure according to claim 11, wherein the heat-dissipating structure is any one of an aluminum plate and a carbon-graphite material. The heat radiating structure according to claim 12, which is located between the lower end surface and the second board and includes a heat conductive pad attached to the second board. The thirteenth aspect of the present invention, wherein the heat conductive pad is attached to the second board in a size that transfers all the heat generated by the plurality of data processing components attached to the second board to the heat radiating structure. Heat dissipation structure.

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