JP6931625B2 - Conductive particles, bonding composition, bonding structure and method for manufacturing the bonding structure - Google Patents

Description

The present invention relates to conductive particles dispersed in a bonding material containing metal atom-containing particles and used by sintering the metal atom-containing particles. The present invention also relates to a bonding composition, a bonding structure, and a method for producing a bonding structure using the conductive particles.

In a non-insulated semiconductor device, which is one of power semiconductor devices used in an inverter or the like, a member for fixing a semiconductor element is also one of the electrodes of the semiconductor device. For example, in a semiconductor device in which a power transistor is mounted on a fixing member using a Sn—Pb-based soldering material, the fixing member (base material) serves as a collector electrode portion of the power transistor. In this collector electrode section, a current of several amperes or more flows during operation of the semiconductor device, and the transistor chip generates heat. In order to avoid destabilization of characteristics and shortening of life due to this heat generation, it is necessary to sufficiently secure heat dissipation and heat resistance of the soldered portion. In order to sufficiently secure the heat dissipation and heat resistance of the soldered portion, it is necessary to use a material having excellent heat dissipation.

Even in an insulated semiconductor device, in order to operate the semiconductor element safely and stably, it is necessary to efficiently dissipate the heat generated during the operation of the semiconductor device to the outside of the semiconductor device. Further, in this case, it is also necessary to ensure the joining reliability of the soldered portion.

As a bonding material having high heat dissipation and high bonding reliability, Patent Document 1 below discloses a conductive adhesive containing a particulate silver compound. However, when this conductive adhesive is used, the bonding is performed by a cured product obtained by curing a thermosetting resin, which is a binder resin. There is a problem that the sex becomes low.

On the other hand, when the particle size of the metal particles is reduced to a size of 100 nm or less and the number of constituent atoms is reduced, the specific surface area ratio to the volume of the particles increases sharply, and the melting point or sintering temperature is significantly higher than that in the bulk state. It is known to decrease. A method of bonding by using this low-temperature sintering function, using metal particles whose surface is coated with an organic substance and having an average particle size of 100 nm or less as a bonding material, decomposing the organic substance by heating, and sintering the metal particles with each other. It has been known. In this bonding method, metal particles after bonding are changed to bulk metal, and at the same time, bonding by metal bonding is obtained at the bonding interface, so that heat resistance, bonding reliability, and heat dissipation are extremely high. A bonding material for performing such bonding is disclosed in, for example, Patent Document 2 below.

In Patent Document 2, one or more metal particle precursors having an average particle size of 1 nm or more and 50 μm or less, which are selected from particles of metal oxides, metal carbonates, and carboxylic acid metal salts, and organic substances. A bonding material containing a reducing agent is disclosed. In the total mass part in the bonding material, the content of the metal particle precursor exceeds 50 parts by mass and is 99 parts by mass or less.

Further, Patent Document 3 below discloses a bonding material containing a bonding main material containing metal atom-containing particles and conductive particles having a particle diameter CV value of 10% or less. The bonding main material is a bonding main material containing silver particles having an average particle size of 1 nm or more and 100 nm or less or copper particles having an average particle size of 1 nm or more and 100 nm or less, or an average particle size of 1 nm or more. Examples of the bonding main material include silver oxide particles having an average particle size of 50 μm or less, copper oxide particles having an average particle size of 1 nm or more and 50 μm or less, and a reducing agent.

Japanese Unexamined Patent Publication No. 2003-309352 Japanese Unexamined Patent Publication No. 2008-178911 Japanese Unexamined Patent Publication No. 2013-055046

The conventional joining material has a problem that voids are likely to occur in the joining portion of the first and second joining target members after joining the first and second joining target members. Therefore, there is a problem that the joining reliability is lowered. Further, after joining, the heat dissipation may not be sufficiently high.

An object of the present invention is that when a member to be bonded is bonded by sintering the metal atom-containing particles, which is dispersed in a bonding material containing metal atom-containing particles, a bonded structure is obtained. It is an object of the present invention to provide conductive particles which are less likely to generate voids in a bonded portion, can improve bonding reliability, and can improve heat dissipation. Another object of the present invention is to provide a bonding composition, a bonding structure, and a method for producing a bonding structure using the conductive particles.

According to a broad aspect of the present invention, conductive particles dispersed in a bonding material containing metal atom-containing particles and used by sintering the metal atom-containing particles, wherein the base material particles and the base material are used. It is provided with a conductive layer arranged on the surface of the particles, the thermal decomposition temperature of the base particles is 200 ° C. or higher, and the compressive elasticity when the conductive particles are compressed by 10% is 300 N / mm ² or higher. Conductive particles of 3500 N / mm ² or less are provided.

In certain aspects of the conductive particles according to the present invention, the substrate particles are silicone particles.

In certain aspects of the conductive particles according to the present invention, the conductive layer has a copper layer.

In certain aspects of the conductive particles according to the invention, the conductive particles are on the substrate particles, a copper layer disposed on the surface of the substrate particles, and on the outer surface of the copper layer. It is provided with a second conductive layer arranged, or has a base particle and a copper layer arranged on the surface of the base particle, and the outer surface of the copper layer is rust-proofed. Has been done.

In certain aspects of the conductive particles according to the present invention, the second conductive layer comprises nickel, gold, silver or tin.

Whether the bonding material in which the conductive particles according to the present invention are dispersed is a bonding material containing silver particles having an average particle size of 1 nm or more and 100 nm or less or copper particles having an average particle size of 1 nm or more and 100 nm or less. , Or a bonding material containing silver oxide particles having an average particle size of 1 nm or more and 50 μm or less, or copper oxide particles having an average particle size of 1 nm or more and 50 μm or less, and a reducing agent. It is preferable that the metal atom-containing particles contained in the bonding material in which the conductive particles according to the present invention are dispersed are sintered by heating at less than 400 ° C.

According to a broad aspect of the present invention, there is provided a bonding composition containing the above-mentioned conductive particles and a bonding material containing metal atom-containing particles.

According to a broad aspect of the present invention, the first joining target member, the second joining target member, and the joining portion for joining the first and second joining target members are provided, and the joining portion is provided. It is formed by using a bonding composition containing the above-mentioned conductive particles and a bonding material containing metal atom-containing particles, and the bonding portion heats the bonding composition to contain the metal atom. It is formed by sintering the particles, and the first and second joining target members are joined by the sintered product obtained by sintering the metal atom-containing particles, and the first and second joinings are joined. A bonded structure is provided in which the conductive particles are arranged between the target members.

According to a broad aspect of the present invention, a step of arranging a bonding composition containing the above-mentioned conductive particles and a bonding material containing metal atom-containing particles between the first and second bonding target members, and the above-mentioned step. A step of forming a bonding portion by heating the bonding composition and sintering the metal atom-containing particles to join the first and second bonding target members is provided, and the metal atom-containing Manufacture of a bonding structure in which the first and second bonding target members are bonded by a sintered product in which particles are sintered, and the conductive particles are arranged between the first and second bonding target members. A method is provided.

In the conductive particles according to the present invention, when a conductive layer is arranged on the surface of the base material particles, the thermal decomposition temperature of the base material particles is 200 ° C. or higher, and the conductive particles are compressed by 10%. compression modulus 300N / mm ² or more, because it is 3500 N / mm ² or less, the conductive particles according to the present invention, by using the bonding composition dispersed in the bonding material containing a metal atom-containing particles, the When the members to be joined are joined by sintering the metal atom-containing particles to obtain a joined structure, voids are less likely to occur in the joined portion, the joining reliability can be improved, and the heat dissipation is improved. be able to.

FIG. 1 is a cross-sectional view schematically showing conductive particles according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing the conductive particles according to the second embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing the conductive particles according to the third embodiment of the present invention. FIG. 4 is a cross-sectional view schematically showing a bonding structure using the bonding composition containing the conductive particles shown in FIG.

Hereinafter, the present invention will be described in detail.

The conductive particles according to the present invention are dispersed in a bonding material containing metal atom-containing particles, and the metal atom-containing particles are sintered and used. The conductive particles according to the present invention include base particles and a conductive layer arranged on the surface of the base particles. The thermal decomposition temperature of the base particles is 200 ° C. or higher. Compression modulus when the conductive particles according to the present invention was compressed 10% (10% K value) is 300N / mm ² or more and 3500 N / mm ² or less.

Such conductive particles are dispersed in a bonding material containing metal atom-containing particles to obtain a bonding composition. Using the obtained bonding composition, the members to be bonded are bonded by sintering the metal atom-containing particles to obtain a bonded structure. In the obtained joint structure, it is possible to make it difficult for voids to occur in the joint portion, and it is possible to improve the joint reliability. Further, the heat dissipation of the obtained bonded structure can be enhanced. Further, the distance between the first and second members to be joined can be controlled with high accuracy by the conductive particles arranged between the members to be joined. In the bonding structure, a bonding portion is formed by the bonding composition. By controlling the distance between the members to be joined with high accuracy, it is possible to prevent the thickness of the joint portion from being partially reduced, and as a result, it is possible to suppress the heat dissipation of the joint portion from being partially reduced. ..

Further, when joining the members to be joined using the above-mentioned joining composition, crimping is generally performed. If the first and second members to be joined are joined using the joining composition containing the conductive particles according to the present invention, even if crimping is performed at a relatively low pressure, the joining is performed while suppressing the generation of voids. It is possible to improve the joining reliability between the portion and the first and second joining target members. Furthermore, if the members to be joined are joined using the bonding composition containing the conductive particles according to the present invention, the conductive layer can be made less likely to crack. Therefore, the joining reliability and the conduction reliability are effectively increased.

The thermal decomposition temperature of the base particles is 200 ° C. or higher. The thermal decomposition temperature is preferably 250 ° C. or higher. When the thermal decomposition temperature is at least the above lower limit, the joining reliability and conduction reliability become even better. The upper limit of the thermal decomposition temperature is not particularly limited. The thermal decomposition temperature may be 600 ° C. or lower.

The thermal decomposition temperature can be measured using a differential thermogravimetric simultaneous measuring device (“TG / DTA320” manufactured by Seiko II). The temperature at which the weight is reduced by 10% in the measurement result is defined as the thermal decomposition temperature.

The 10% K value of the conductive particles is 300N / mm ² or more and 3500 N / mm ² or less. The 10% K value is preferably 500 / mm ² or more, preferably 3000 N / mm ² or less. When the 10% K value is at least the above lower limit, the thickness uniformity of the joint portion becomes even better. When the 10% K value is not more than the upper limit, the effect of suppressing voids becomes even better. The 10% K value of the conductive particles can be appropriately adjusted by selecting the base particles.

The compressive elastic modulus (10% K value) of the conductive particles can be measured as follows.

Using a microcompression tester, conductive particles are compressed on a smoothing indenter end face of a cylinder (diameter 100 μm, made of diamond) under the conditions of 25 ° C., a compression rate of 0.3 mN / sec, and a maximum test load of 20 mN. At this time, the load value (N) and the compressive displacement (mm) are measured. From the obtained measured values, the compressive elastic modulus can be calculated by the following formula. As the microcompression tester, for example, "Fisherscope H-100" manufactured by Fisher Co., Ltd. is used.

10% K value (N / mm ² ) = (3/2 ^1/2 ) ・ F ・ S ^-3/2・ R- ^{1 / 2}
F: Load value (N) when conductive particles are compressed and deformed by 10%
S: Compressive displacement (mm) when conductive particles are compressed and deformed by 10%
R: Radius of conductive particles (mm)

The compressive elastic modulus universally and quantitatively represents the hardness of conductive particles. By using the compressive elastic modulus, the hardness of the conductive particles can be expressed quantitatively and uniquely.

Hereinafter, the present invention will be clarified by explaining specific embodiments and examples of the present invention with reference to the drawings.

FIG. 1 schematically shows a sectional view of the conductive particles according to the first embodiment of the present invention.

As shown in FIG. 1, the conductive particle 21 has a base particle 22 and a conductive layer 23 arranged on the surface 22a of the base particle 22. The conductive layer 23 is laminated on the surface 22a of the base particle 22. The conductive layer 23 covers the surface 22a of the base particle 22. The conductive layer 23 is a single layer. The conductive layer 23 is preferably a copper layer.

FIG. 2 schematically shows a sectional view of the conductive particles according to the second embodiment of the present invention.

The conductive particles 31 shown in FIG. 2 have a base particle 22 and a conductive layer 32 arranged on the surface 22a of the base particle 22. The conductive layer 32 is laminated on the surface 22a of the base particle 22. The conductive layer 32 covers the surface 22a of the base particle 22. The conductive layer 32 is multi-layered and has a two-layer laminated structure. The conductive layer 32 includes a first conductive layer 32A which is an inner layer and a second conductive layer 32B which is an outer layer. The conductive particles 31 are the base particles 22, the first conductive layer 32A arranged on the surface 22a of the base particles 22, and the second conductive layer 32A arranged on the outer surface of the first conductive layer 32A. It has a conductive layer 32B. The second conductive layer 32B, which is an outer layer, is arranged on the outer surface of the first conductive layer 32A, which is an inner layer, and covers the outer surface of the first conductive layer 32A. The first conductive layer 32A is preferably a copper layer. The second conductive layer 32B preferably contains nickel, gold, silver or tin. In the conductive particles 31, core-shell type base particles may be used instead of the base particles 22.

FIG. 3 schematically shows a cross-sectional view of the conductive particles according to the third embodiment of the present invention.

As shown in FIG. 3, the conductive particle 41 has a core-shell type base particle 42 and a conductive layer 23 arranged on the surface 42a of the base particle 42. The base particle 42 has a core 42A and a shell 42B disposed on the surface of the core 42A. The conductive layer 23 is laminated on the surface 42a of the base particle 42 and on the outer surface of the shell 42B. The conductive layer 23 covers the surface 42a of the base particle 42 and the outer surface of the shell 42B. The conductive layer 23 is a single layer. The conductive layer 23 is preferably a copper layer. The base particle 42 may be an organic-inorganic hybrid particle. The core 42A may be an organic core. The shell 42B may be an inorganic shell.

Examples of the base material particles include resin particles, inorganic particles other than metal particles, organic-inorganic hybrid particles, and metal particles. The base material particles may have a core and a shell arranged on the surface of the core, or may be core-shell particles. The base material particles are preferably base particles excluding metal particles, and more preferably resin particles, inorganic particles excluding metal particles, or organic-inorganic hybrid particles.

The conductive particles according to the present invention are conductive particles having a base material particles and a conductive layer arranged on the surface of the base material particles. From the viewpoint of increasing the flexibility of the joint, increasing the flexibility of the conductive particles, making it possible to appropriately compress and deform the conductive particles, and further enhancing the impact resistance of the joint structure, the conductive particles are described above. Is preferably provided with base material particles, and the base material particles are silicone particles.

The base material particles are preferably resin particles formed of a resin. When connecting the electrodes using the conductive particles, the conductive particles are placed between the electrodes and then crimped to compress the conductive particles. When the base material particles are resin particles, the conductive particles are easily deformed during the crimping, and the contact area between the conductive particles and the electrode becomes large. Therefore, the conduction reliability between the electrodes is further increased.

Various organic substances are preferably used as the resin for forming the resin particles. Examples of the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene and polybutadiene; acrylic resins such as polymethylmethacrylate and polymethylacrylate; poly. Alkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, silicone resin, A polymer obtained by polymerizing one or more kinds of polysulfone, polyphenylene oxide, polyacetal, polyimide, polyamideimide, polyether ether ketone, polyether sulfone, and various polymerizable monomers having an ethylenically unsaturated group. Etc. are used. By polymerizing one or more of various polymerizable monomers having an ethylenically unsaturated group, resin particles having arbitrary physical characteristics at the time of compression suitable for bonding can be designed and synthesized.

When the resin particles are obtained by polymerizing a monomer having an ethylenically unsaturated group, the monomer having an ethylenically unsaturated group includes a non-crosslinkable monomer and a crosslinkable simple monomer. Quantities can be mentioned.

Examples of the non-crosslinkable monomer include styrene-based monomers such as styrene and α-methylstyrene; carboxyl group-containing monomers such as (meth) acrylic acid, maleic acid, and maleic anhydride; and methyl ( Meta) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) Alkyl (meth) acrylates such as meta) acrylates and isobornyl (meth) acrylates; oxygen atoms such as 2-hydroxyethyl (meth) acrylates, glycerol (meth) acrylates, polyoxyethylene (meth) acrylates and glycidyl (meth) acrylates. Contains (meth) acrylates; nitrile-containing monomers such as (meth) acrylonitrile; vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether; acid vinyl esters such as vinyl acetate, vinyl butyrate, vinyl laurate, vinyl stearate, etc. Classes: unsaturated hydrocarbons such as ethylene, propylene, isoprene, and butadiene; halogen-containing monomers such as trifluoromethyl (meth) acrylate, pentafluoroethyl (meth) acrylate, vinyl chloride, vinyl fluoride, and chlorostyrene. Can be mentioned.

Examples of the crosslinkable monomer include tetramethylol methanetetra (meth) acrylate, tetramethylol methanetri (meth) acrylate, tetramethylol methanedi (meth) acrylate, trimethyl propanetri (meth) acrylate, and dipenta. Elythritol hexa (meth) acrylate, dipenta erythritol penta (meth) acrylate, glycerol tri (meth) acrylate, glycerol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) Polyfunctional (meth) acrylates such as acrylates, (poly) tetramethylene glycol di (meth) acrylates, 1,4-butanediol di (meth) acrylates; triallyl (iso) cyanurate, triallyl trimellitate, divinylbenzene, Examples thereof include silane-containing monomers such as diallyl phthalate, diallyl acrylamide, diallyl ether, γ- (meth) acryloxipropyltrimethoxysilane, trimethoxysilylstyrene, and vinyltrimethoxysilane.

The resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of this method include a method of suspension polymerization in the presence of a radical polymerization initiator, a method of swelling a monomer together with a radical polymerization initiator using non-crosslinked seed particles, and the like.

With respect to the composition of the resin particles, a tetrafunctional or trifunctional (meth) acrylate, a copolymer of divinylbenzene, and a silicone resin are suitable because of their good heat resistance.

When the base material particles are inorganic particles other than metal particles or organic-inorganic hybrid particles, the inorganic substances for forming the base material particles include silica, alumina, barium titanate, zirconia, carbon black, and titanium oxide. Examples thereof include boron nitride, aluminum nitride, zinc oxide and diamond. It is preferable that the inorganic substance is not a metal. The particles formed of the silica are not particularly limited, but for example, after hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups to form crosslinked polymer particles, firing is performed if necessary. Examples include particles obtained by doing so. Examples of the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.

The organic-inorganic hybrid particles are preferably core-shell type organic-inorganic hybrid particles having a core and a shell arranged on the surface of the core. It is preferable that the core is an organic core. It is preferable that the shell is an inorganic shell. From the viewpoint of effectively reducing the connection resistance between the electrodes, the base particle is preferably an organic-inorganic hybrid particle having an organic core and an inorganic shell arranged on the surface of the organic core.

Examples of the material for forming the organic core include the resin for forming the resin particles described above.

Examples of the material for forming the inorganic shell include the above-mentioned inorganic substances for forming the base particle. The material for forming the inorganic shell is preferably silica. The inorganic shell is preferably formed by forming a metal alkoxide into a shell-like material by a sol-gel method on the surface of the core and then sintering the shell-like material. The metal alkoxide is preferably a silane alkoxide. The inorganic shell is preferably formed of silane alkoxide.

Examples of the metal for forming the conductive layer include gold, silver, palladium, copper, platinum, zinc, iron, lead, tin, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, germanium, and cadmium. Examples thereof include bismuth, tarium, tungsten, molybdenum, tin-lead alloy, tin-copper alloy, tin-silver alloy and tin-lead-silver alloy. Further, tin-doped indium oxide (ITO) may be used as the metal. As the metal, only one kind may be used, two or more kinds may be used in combination, or an alloy may be used.

The method for forming the conductive layer on the surface of the base particle is not particularly limited. Examples of the method for forming the conductive layer include a method by electroless plating, a method by electroplating, a method by physical vapor deposition, and a method of coating a metal powder or a paste containing the metal powder and a binder on the surface of the substrate particles. And so on. Of these, the electroless plating method is preferable because the conductive layer can be easily formed. Examples of the method by physical vapor deposition include methods such as vacuum deposition, ion plating, and ion sputtering.

The particle size of the conductive particles is 8 μm or more and 200 μm or less. The particle size of the conductive particles is preferably 10 μm or more, preferably 150 μm or less, and more preferably 100 μm or less. The particle size of the conductive particles may be 60 μm or less. When the particle size of the conductive particles is not less than the above lower limit and not more than the above upper limit, the joining reliability of the members to be joined is further increased, and the variation in the spacing between the members to be joined is further reduced. Further, when the particle size of the conductive particles is equal to or larger than the above lower limit, the thickness of the joint portion arranged between the first and second members to be joined can be further increased, and the heat dissipation property and heat dissipation of the joint portion can be increased. Joining reliability can be further improved. When the particle size of the conductive particles is not more than the above upper limit, the distance between the electrodes can be further reduced, and the bonded structure can be made smaller and thinner. The particle size of the conductive particles indicates the diameter when the conductive particles are spherical, and indicates the maximum diameter when the conductive particles are not spherical. The particle size of the resin particles and the organic core also indicates the diameter when the resin particles and the organic core are spherical, and is maximum when the resin particles and the organic core are not spherical. Indicates the diameter.

The thickness of the entire conductive layer is preferably 5 nm or more, more preferably 10 nm or more, further preferably 50 nm or more, preferably 5000 nm or less, more preferably 1000 nm or less, still more preferably 500 nm or less, and particularly preferably 300 nm or less. When the thickness of the entire conductive layer is at least the above lower limit, the conductivity of the conductive particles can be sufficiently increased, and excessive cracking of the conductive layer can be suppressed. As a result of suppressing the cracking of the conductive layer, the thickness of the joint can be made more uniform, so that it is possible to prevent the heat dissipation of the joint from being partially lowered. When the thickness of the entire conductive layer is not more than the above upper limit, the stress at the interface due to the difference in the coefficient of thermal expansion between the base particles and the conductive layer is relaxed, and the conductive layer is less likely to be peeled from the base particles.

The ratio of the particle size of the base material particles to the thickness of the entire conductive layer (particle size of the base material particles / thickness of the entire conductive layer) is preferably 10 or more, more preferably 30 or more, preferably 3000 or less, and more preferably. It is 500 or less. The thickness of the entire conductive layer is the average thickness of the entire conductive layer.

When the conductive layer is formed of a plurality of layers, the thickness of the outermost conductive layer and the second conductive layer is preferably 10 nm or more, more preferably 50 nm or more, preferably 500 nm or less, more preferably. Is 100 nm or less. When the thickness of the outermost conductive layer and the second conductive layer is equal to or greater than the lower limit and equal to or lower than the upper limit, the coating of the outermost conductive layer and the second conductive layer becomes uniform and corrosion resistant. The sex is high enough.

The conductive layer preferably has a copper layer. The first conductive layer is preferably a copper layer. The conductive particles preferably include base particles and a copper layer arranged on the surface of the base particles. The copper layer is preferably in contact with the base particles. When the conductive layer has a copper layer, the heat dissipation is further improved. From the viewpoint of enhancing corrosion resistance, it is preferable that the outer surface of the copper layer is rust-proofed.

From the viewpoint of further enhancing the heat dissipation property, the conductive particles include the base material particles, the copper layer arranged on the surface of the base material particles, and the second conductive particles arranged on the outer surface of the copper layer. The conductive particles are provided with a layer, or the conductive particles include a base material particle and a copper layer arranged on the surface of the base material particle, and the outer surface of the copper layer is rust-proofed. Is preferable. The conductive layer may include base particles, a copper layer arranged on the surface of the base particles, and a second conductive layer arranged on the outer surface of the copper layer. It is preferable that the conductive particles include base particles and a copper layer arranged on the surface of the base particles, and the outer surface of the copper layer is rust-proofed. From the viewpoint of further enhancing conductivity, heat dissipation, corrosion resistance, etc., the second conductive layer preferably contains nickel, gold, silver, or tin.

Examples of the material used for the rust preventive treatment include benzotriazole compounds and the like. Examples of the benzotriazole compound include benzotriazole, 1- [N, N-di (2-ethylhexyl) amino] methyl-1H-benzotriazole and 1- [N, N-di (2-ethylhexyl) amino] methyl-1H. -Methylbenzotriazole and the like can be mentioned. Among them, rust preventive treatment using a benzotriazole compound is preferable, and rust preventive treatment using benzotriazole is more preferable, because the corrosion resistance is further enhanced and a further excellent rust preventive effect is obtained. ..

The outer surface of the conductive layer is preferably a copper layer or a second conductive layer containing nickel, gold, silver or tin. The outer surface of the conductive layer is more preferably a second conductive layer containing nickel, gold, silver or tin. When the outer surface of the conductive layer contains copper, nickel, gold, silver or tin, the conductivity and heat dissipation are further improved.

It is preferable that the outer surface of the conductive layer does not melt at 400 ° C. It is preferable that the surface of the conductive particles and the outer surface of the conductive layer do not melt when the members to be joined are joined. It is preferable that the surface of the conductive particles and the outer surface of the conductive layer do not melt at the sintering temperature of the metal atom-containing particles. In this case, it is possible to prevent the conductive particles from being deformed after joining. Therefore, the distance between the first and second members to be joined can be controlled with higher accuracy after joining. Further, since the thickness of the joint can be made more uniform, it is possible to prevent the heat dissipation of the joint from being partially lowered.

The melting point of the conductive layer is preferably higher than the sintering temperature of the metal atom-containing particles. The melting point of the conductive layer is preferably 5 ° C. or higher, more preferably 10 ° C. or higher, further preferably 20 ° C. or higher, and 50 ° C. or higher than the sintering temperature of the metal atom-containing particles. Especially preferable.

The temperature at which the metal atom-containing particles are sintered is preferably lower than the temperature at which the surface of the conductive particles is melted. The temperature at which the metal atom-containing particles are sintered is preferably 5 ° C. or higher, more preferably 10 ° C. or higher, lower than the temperature at which the surface of the conductive particles is melted. When the temperature at which the metal atom-containing particles are sintered and the temperature at which the surface of the conductive particles are melted satisfies the above relationship, it is possible to suppress the deformation of the conductive particles during sintering of the metal atom-containing particles. Therefore, the distance between the first and second members to be joined can be controlled with higher accuracy after joining. Further, since the thickness of the joint can be made more uniform, it is possible to prevent the heat dissipation of the joint from being partially lowered.

The CV value (coefficient of variation of the particle size distribution) of the particle size of the conductive particles is preferably 10% or less, more preferably 5% or less, still more preferably 3% or less. When the CV value is not more than the upper limit, the distance between the first and second members to be joined can be controlled with higher accuracy after joining. Further, since the thickness of the joint can be made more uniform, it is possible to prevent the heat dissipation of the joint from being partially lowered.

The CV value is expressed by the following formula.

CV value (%) = (ρ / Dn) × 100
ρ: Standard deviation of particle size of conductive particles Dn: Average particle size

The content of the conductive particles in 100% by weight of the bonding composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, still more preferably 0.5% by weight or more, and particularly preferably. It is 1% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, still more preferably 15% by weight or less. When the content of the conductive particles is at least the above lower limit, the conductive particles can be sufficiently present between the first and second members to be joined, and the conductive particles make the first and second conductive particles. It is possible to further suppress the partial narrowing of the distance between the members to be joined. Therefore, it is possible to prevent the heat dissipation of the joint from being partially lowered.

Examples of the metal atom-containing particles contained in the bonding material include metal particles and metal compound particles. The metal compound particles include a metal atom and an atom other than the metal atom. Specific examples of the metal compound particles include metal oxide particles, metal carbonate particles, metal carboxylate particles, and metal complex particles. The metal compound particles are preferably metal oxide particles. For example, the metal oxide particles are sintered after being converted into metal particles by heating at the time of joining in the presence of a reducing agent. The metal oxide particles are precursors of the metal particles. Examples of the metal carboxylate particles include metal acetate particles.

The bonding material containing the metal atom-containing particles is a bonding material containing metal particles having an average particle diameter of 1 nm or more and 100 nm or less, or reduced with metal oxide particles having an average particle diameter of 1 nm or more and 50 μm or less. It is preferably a bonding material containing an agent. When such a bonding material is used, the metal atom-containing particles can be satisfactorily sintered by heating at the time of bonding. The average particle size of the metal oxide particles is preferably 5 μm or less. The particle diameter of the metal atom-containing particles indicates the diameter when the metal atom-containing particles are spherical, and indicates the maximum diameter when the metal atom-containing particles are not spherical.

Examples of the metal constituting the metal particles and the metal oxide particles include silver, copper and gold. Of these, silver or copper is preferable, and silver is particularly preferable. Therefore, the metal particles are preferably silver particles or copper particles, and more preferably silver particles. The metal oxide particles are preferably silver oxide particles or copper oxide particles, and more preferably silver oxide particles. When silver particles and silver oxide particles are used, there is little residue after bonding and the volume reduction rate is very small. Examples of silver oxide in the silver oxide particles include Ag ₂ O and Ag O.

The metal atom-containing particles are preferably sintered by heating at less than 400 ° C. The temperature at which the metal atom-containing particles are sintered (sintering temperature) is more preferably 350 ° C. or lower, preferably 300 ° C. or higher. When the temperature at which the metal atom-containing particles are sintered is not more than the above upper limit, sintering can be performed efficiently, the energy required for sintering can be reduced, and the environmental load can be reduced.

The content of the metal atom-containing particles in 100% by weight of the bonding material is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, 100% by weight or less, preferably 99% by weight. Below, it is more preferably 90% by weight or less. The total amount of the bonding material may be the metal atom-containing particles. When the content of the metal atom-containing particles is at least the above lower limit, the metal atom-containing particles can be sintered more densely. As a result, the heat dissipation and heat resistance at the joint are also improved.

When the metal atom-containing particles are metal oxide particles, it is preferable to use a reducing agent. Examples of the reducing agent include alcohols (compounds having an alcoholic hydroxyl group), carboxylic acids (compounds having a carboxy group), amines (compounds having an amino group) and the like. Only one kind of the reducing agent may be used, or two or more kinds thereof may be used in combination.

Examples of the alcohols include alkyl alcohols. Specific examples of the above alcohols include, for example, ethanol, propanol, butyl alcohol, pentyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, nonyl alcohol, decyl alcohol, undecyl alcohol, dodecyl alcohol, tridecyl alcohol, and tetradecyl alcohol. , Pentadecyl alcohol, hexadecyl alcohol, heptadecyl alcohol, octadecyl alcohol, nonadecil alcohol, icosyl alcohol and the like. Further, the alcohols are not limited to the primary alcohol type compound, but a secondary alcohol type compound, a tertiary alcohol type compound, an alkanediol and an alcohol compound having a cyclic structure can also be used. Further, as the alcohols, a compound having a large number of alcohol groups such as ethylene glycol and triethylene glycol may be used. Further, as the alcohols, compounds such as citric acid, ascorbic acid and glucose may be used.

Examples of the carboxylic acids include alkylcarboxylic acids and the like. Specific examples of the above carboxylic acids include butanoic acid, pentanoic acid, hexanoic acid, heptanic acid, octanoic acid, nonanoic acid, decanoic acid, undecanoic acid, dodecanoic acid, tridecanoic acid, tetradecanoic acid, pentadecanoic acid, hexadecanoic acid and heptadecanoic acid. , Octadecanic acid, nonadecanic acid, icosanoic acid and the like. Further, the carboxylic acids are not limited to the primary carboxylic acid type compound, and secondary carboxylic acid type compounds, tertiary carboxylic acid type compounds, dicarboxylic acids and carboxyl compounds having a cyclic structure can also be used.

Examples of the amines include alkylamines and the like. Specific examples of the above amines include butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, and hexadecylamine. Examples thereof include heptadecylamine, octadecylamine, nonadecilamine and icodecylamine. Moreover, the above-mentioned amines may have a branched structure. Examples of amines having a branched structure include 2-ethylhexylamine and 1,5-dimethylhexylamine. The amines are not limited to primary amine compounds, but secondary amine compounds, tertiary amine compounds and amine compounds having a cyclic structure can also be used.

Further, the reducing agent may be an organic substance having an aldehyde group, an ester group, a sulfonyl group, a ketone group, or the like, or may be an organic substance such as a carboxylic acid metal salt. While the carboxylic acid metal salt is also used as a precursor of metal particles, it is also used as a reducing agent for metal oxide particles because it contains an organic substance.

If a reducing agent having a melting point lower than the sintering temperature (bonding temperature) of the metal atom-containing particles is used, it tends to aggregate at the time of bonding and voids are likely to occur at the bonded portion. By using the carboxylic acid metal salt, the carboxylic acid metal salt is not melted by heating at the time of joining, so that the formation of voids can be suppressed. In addition to the carboxylic acid metal salt, a metal compound containing an organic substance may be used as the reducing agent.

When the reducing agent is used, the content of the reducing agent in 100% by weight of the bonding material is preferably 1% by weight or more, more preferably 10% by weight or more, preferably 90% by weight or less, more preferably. Is 70% by weight or less, more preferably 50% by weight or less. When the content of the reducing agent is at least the above lower limit, the metal atom-containing particles can be sintered more densely. As a result, the heat dissipation and heat resistance at the joint are also improved.

The content of the bonding material in 100% by weight of the bonding composition is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 60% by weight or more, preferably 99.99% by weight or less. It is preferably 99.9% by weight or less, even more preferably 99.5% by weight or less, still more preferably 99% by weight or less, particularly preferably 90% by weight or less, and most preferably 80% by weight or less.

When the bonding composition is a paste, the binder used for the paste is not particularly limited. The binder preferably disappears when the metal atom-containing particles are sintered. Only one kind of the binder may be used, or two or more kinds may be used in combination.

Specific examples of the binder include aliphatic solvents, ketone solvents, aromatic solvents, ester solvents, ether solvents, alcohol solvents, paraffin solvents, petroleum solvents and the like.

Examples of the aliphatic solvent include cyclohexane, methylcyclohexane and ethylcyclohexane. Examples of the ketone solvent include acetone, methyl ethyl ketone and the like. Examples of the aromatic solvent include toluene, xylene and the like. Examples of the ester solvent include ethyl acetate, butyl acetate and isopropyl acetate. Examples of the ether solvent include tetrahydrofuran (THF), dioxane and the like. Examples of the alcohol solvent include ethanol, butanol and the like. Examples of the paraffin-based solvent include paraffin oil and naphthenic oil. Examples of the petroleum-based solvent include mineral tarpen and naphtha.

FIG. 4 schematically shows a cross-sectional view of a bonding structure using the bonding composition containing the conductive particles 21 shown in FIG.

The joining structure 1 shown in FIG. 4 joins the first joining target member 2, the second joining target member 3 and 4, and the first joining target member 2 and the second joining target member 3 and 4. The joints 5 and 6 are provided. The bonding portions 5 and 6 are formed by using a bonding material containing metal atom-containing particles and a bonding composition containing conductive particles 21.

The joining portion 5 and the second joining target member 3 are arranged on the first surface 2a (one surface) side of the first joining target member 2. The joining portion 5 joins the first joining target member 2 and the second joining target member 3.

The joining portion 6 and the second joining target member 4 are arranged on the second surface 2b (the other surface) side opposite to the first surface 2a of the first joining target member 2. The joining portion 6 joins the first joining target member 2 and the second joining target member 4.

Conductive particles 21 are arranged between the first joining target member 2 and the second joining target members 3 and 4, respectively. The joint portion 5 contains the sintered product 11, and the joint portion 6 contains the sintered product 12. The sintered products 11 and 12 are sintered products obtained by sintering the bonding material containing the metal atom-containing particles. Sintered products 11 and 12 are arranged between the first joining target member 2 and the second joining target members 3 and 4. The first members 2 to be joined and the second members 3 and 4 to be joined are joined by the sintered objects 11 and 12.

The heat sink 7 is arranged on the surface of the second member to be joined 3 opposite to the joint portion 5 side. The heat sink 8 is arranged on the surface of the second member 4 to be joined, which is opposite to the joint portion 6 side. Therefore, in the joint structure 1, the heat sink 7, the second joint target member 3, the joint portion 5, the first joint target member 2, the joint portion 6, the second joint target member 4, and the heat sink 8 are laminated in this order. Has a part that has been removed.

Examples of the first member 2 to be joined include power semiconductor elements used in inverters, converters, and the like. In the joining structure 1 provided with such a first joining target member 2, a large amount of heat is likely to be generated in the first joining target member 2 when the joining structure 1 is used. Therefore, it is necessary to efficiently dissipate the amount of heat generated from the first member to be joined 2 to the heat sinks 7, 8 and the like. Therefore, the joint portions 5 and 6 arranged between the first member to be joined 2 and the heat sinks 7 and 8 are required to have high heat dissipation.

Examples of the second member to be joined 3 and 4 include a substrate made of ceramic, plastic, or the like.

The bonding portions 5 and 6 are formed by heating the bonding composition and sintering the metal atom-containing particles.

When the average thickness of the joint portions 5 and 6 is T, the average diameter of the conductive particles 21 after the joint in the thickness direction of the joint portions 5 and 6 is preferably 0.6 T or more, more preferably 0.8 T or more. It is more preferably 0.9T or more, particularly preferably 0.95T or more, and preferably 1T or less. If such a thickness relationship is satisfied, the distance between the first and second members to be joined can be controlled with high accuracy. The average thickness of the joint portions 5 and 6 may be equal to the average diameter of the conductive particles 21 after the joint.

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited to the following examples.

(Joining material (metal atom-containing particles))
(1) Silver particles with an average particle size of 15 nm (2) Copper particles with an average particle size of 12 nm (3) Silver oxide (Ag ₂ O) particles with an average particle size of 5 μm (4) Average particle size of 6 μm Copper oxide (CuO) particles (5) Silver particles with an average particle size of 1 nm (6) Silver particles with an average particle size of 100 nm (7) Copper particles with an average particle size of 1 μm (8) Copper particles with an average particle size of 100 nm (9) average particle diameter 1nm a is silver oxide _(Ag 2 O) particles (10) average particle diameter 50μm at a silver oxide _(Ag 2 O) particles (11) average copper oxide particle size 1nm (CuO) particles ( 12) Copper oxide (CuO) particles having an average particle size of 50 μm

(Conductive particles)
In the following Examples , Reference Examples and Comparative Examples, the particle size of the conductive particles was determined by the following method.

For conductive particles, a 3000 times particle image was taken with a scanning electron microscope (“S-3500N” manufactured by Hitachi High Technology Co., Ltd.), and the particle size of 50 particles in the obtained image was measured with a nogis. The particle size of the conductive particles was determined by calculating the number average.

(1) A silver layer having a thickness of 300 nm is formed on the surface of conductive particles A (average particle diameter 10 μm, resin particles formed of divinylbenzene and isobornyl acrylate (pyrolysis temperature 250 ° C.), CV value 4). %, 10% K value 3100N / mm ² )
(2) A silver layer having a thickness of 600 nm is formed on the surface of conductive particles B (average particle diameter 10 μm, resin particles formed of divinylbenzene and isobornyl acrylate (pyrolysis temperature 250 ° C.), CV value 4). %, 10% K value 3100N / mm ² )
(3) A silver layer having a thickness of 300 nm is formed on the surface of conductive particles C (average particle diameter 10 μm, resin particles formed of silicone (pyrolysis temperature 520 ° C.), CV value 4%, 10% K value. 450N / mm ² )
(4) A silver layer having a thickness of 600 nm is formed on the surface of conductive particles D (average particle diameter 10 μm, resin particles formed of silicone (pyrolysis temperature 520 ° C.), CV value 4%, 10% K value. 450N / mm ² )
(5) A copper-palladium alloy layer having a thickness of 300 nm is formed on the surface of conductive particles E (average particle diameter 10 μm, resin particles formed of silicone (pyrolysis temperature 520 ° C.), CV value 4%, 10). % K value 450N / mm ² )
(6) A nickel layer having a thickness of 300 nm is formed on the surface of conductive particles F (average particle diameter 10 μm, resin particles formed of silicone (pyrolysis temperature 520 ° C.)), and a silver layer having a thickness of 300 nm is formed on the surface of the nickel layer. CV value 4%, 10% K value 450N / mm ² )
(7) A silver layer having a thickness of 3 nm is formed on the surface of conductive particles G (average particle diameter 10 μm, resin particles formed of silicone (pyrolysis temperature 520 ° C.), CV value 12%, 10% K value. 450N / mm ² )
(8) A silver layer having a thickness of 300 nm is formed on the surface of conductive particles H (average particle diameter 10 μm, resin particles formed of ethylene glycol diacrylate (pyrolysis temperature 220 ° C.), CV value 10%, 10). % K value 2100N / mm ² )
(9) A silver layer having a thickness of 300 nm is formed on the surface of conductive particles 1 (average particle diameter 10 μm, resin particles formed of divinylbenzene (pyrolysis temperature 360 ° C.), CV value 4%, 10% K. Value 4800N / mm ² )
(10) A silver layer having a thickness of 300 nm is formed on the surface of conductive particles 2 (average particle diameter 10 μm, resin particles formed of ethylene glycol diacrylate and methyl methacrylate (pyrolysis temperature 160 ° C.), CV value 4). %, 10% K value 2900N / mm ² )
(11) A silver layer having a thickness of 300 nm is formed on the surface of conductive particles 3 (average particle diameter 10 μm, resin particles formed of ethylene glycol diacrylate and octyl acrylate (pyrolysis temperature 140 ° C.), CV value 4). %, 10% K value 1200N / mm ² )

(Reducing agent)
(1) Ethanol (2) Butyric acid

(solvent)
(1) Toluene (2) Ethyl acetate

(Example 1)
40 parts by weight of silver particles having an average particle diameter of 15 nm, 1 part by weight of conductive particles A, and 40 parts by weight of toluene as a solvent were mixed and mixed to obtain a bonding composition.

(Examples 2 , 8, 9, 11 , 13, 14, 19, Reference Examples 3 to 7 , 10, 12, 15 to 18 and Comparative Examples 1 to 5)
A bonding composition was obtained in the same manner as in Example 1 except that the types and contents of the compounding components were set as shown in Table 1 below.

(evaluation)
(0) Preparation of Bonded Structure A power semiconductor element was prepared as the first member to be joined. An aluminum nitride substrate was prepared as the second member to be joined.

The bonding composition was applied onto the second member to be bonded so as to have a thickness of about 30 μm to form a bonding composition layer. Then, the first member to be joined was laminated on the bonding composition layer to obtain a laminated body. By heating the obtained laminate at 300 ° C. for 10 minutes under a pressure of 3 MPa, the metal atom-containing particles contained in the bonding composition are sintered, and the sintered body and the conductive particles are obtained. A joint portion containing the above was formed, and the first and second members to be joined were joined with the sintered product to obtain a joined structure.

(1) Variation in Void Generation State The cross-section of the obtained joint structure was observed, and it was observed whether or not voids were generated in the joint portion formed by the solder sheet. The state of void generation was determined according to the following criteria.

[Criteria for determining variation in void generation state]
○ ○: Voids are not generated ○: Voids are generated but the maximum diameter of the voids is 2.5 μm or less Δ: Voids are generated but the maximum diameter of the voids exceeds 2.5 μm and 5 μm Below ×: Voids are generated, and the maximum diameter of the voids exceeds 5 μm.

(2) Thickness variation The end portion of the obtained joint structure was observed by SEM to evaluate the minimum thickness and the maximum thickness of the joint portion. The thickness variation was judged according to the following criteria. It should be noted that the smaller the thickness variation, the more it tends to be possible to prevent the heat dissipation of the joint from being partially lowered.

[Criteria for determining thickness variation]
○ ○: Maximum thickness is less than 1.2 times the minimum thickness ○: Maximum thickness is 1.2 times or more and less than 1.5 times the minimum thickness ×: Maximum thickness is 1.5 times or more the minimum thickness

(3) Heat dissipation The heat dissipation was evaluated by measuring the thermal resistance of the bonded structure obtained by the thermal resistance measuring device. The heat dissipation was judged according to the following criteria.

[Criteria for heat dissipation]
○ ○: Less than 0.10 ° C / W ○: 0.10 ° C / W or more, less than 0.30 ° C / W ×: 0.30 ° C / W or more

(4) Joint strength The joint strength was evaluated by measuring the shear strength of the obtained joint structure. The joint strength was judged according to the following criteria.

[Criteria for determining joint strength]
○○: 10 MPa or more ○: 5 MPa or more and less than 10 MPa ×: less than 5 MPa

(5) Joining reliability The obtained joint structure was left at 250 ° C. for 500 hours, and then the shear strength was measured by the same method as the joining strength to evaluate the joining reliability. The joining reliability was judged according to the following criteria.

[Criteria for joint reliability]
○○: Sheep strength is 0.90 times or more of the joint strength ○: Sheep strength is 0.60 times or more and less than 0.90 times of the joint strength ×: Sheep strength is less than 0.60 times the joint strength

(6) Relationship between the average thickness of the joint and the average diameter of the conductive particles By observing the cross section of the obtained joint structure, the average thickness T of the joint and the joint of the conductive particles after joining are observed. The average diameter in the thickness direction of was evaluated.

(7) Compressive elastic modulus of conductive particles (10% K value)
The 10% K value of the conductive particles was measured under the condition of 23 ° C. by the above-mentioned method using a microcompression tester (“Fisherscope H-100” manufactured by Fisher Co., Ltd.).

The results are shown in Table 1 below. In addition, in the evaluation of the thickness variation in (2) above, when the thickness variation of the cross section of the obtained joint structure was also evaluated , the judgment results of the thickness variation of Examples, Reference Examples and Comparative Examples are the same as the results shown in Table 1. Met.

1 ... Joining structure 2 ... First joining target member 2a ... First surface 2b ... Second surface 3,4 ... Second joining target member 5,6 ... Joining portion 7,8 ... Heat sink 11,12 ... Sintered material 21 ... Conductive particles 22 ... Base particles 22a ... Surface 23 ... Conductive layer 31 ... Conductive particles 32 ... Conductive layer 32A ... First conductive layer 32B ... Second conductive layer 41 ... Conductive particles 42 ... Base particle 42A ... Core 42B ... Shell 42a ... Surface

Claims (9)

Conductive particles dispersed in a bonding material containing metal atom-containing particles and used by sintering the metal atom-containing particles.
A base particle and a conductive layer arranged on the surface of the base particle are provided.
The base particle is a resin particle, and the base particle is a resin particle.
The resin particles contain a tetrafunctional or trifunctional (meth) acrylate, or a copolymer of divinylbenzene.
The thermal decomposition temperature of the base particles is 200 ° C. or higher.
The compressive modulus upon compression of 10% conductive particles 300N / mm ² or more, 3500 N / mm ² or less, the conductive particles. The conductive particle according to claim 1, wherein the conductive layer has a copper layer. The base material particles, a copper layer arranged on the surface of the base material particles, and a second conductive layer arranged on the outer surface of the copper layer are provided or are provided.
The conductive particles according to claim 1 or 2 , further comprising the base particles and a copper layer arranged on the surface of the base particles, and the outer surface of the copper layer is rust-proofed. .. The conductive particles according to claim 3 , wherein the second conductive layer contains nickel, gold, silver or tin. The bonding material is a bonding material containing silver particles having an average particle diameter of 1 nm or more and 100 nm or less or copper particles having an average particle diameter of 1 nm or more and 100 nm or less, or an average particle diameter of 1 nm or more and 50 μm or less. The conductive particle according to any one of claims 1 to 4 , which is a bonding material containing silver oxide particles or copper oxide particles having an average particle diameter of 1 nm or more and 50 μm or less and a reducing agent. The conductive particle according to any one of claims 1 to 5 , wherein the metal atom-containing particles are sintered by heating at 350 ° C. or lower. A bonding composition containing the conductive particles according to any one of claims 1 to 6 and a bonding material containing metal atom-containing particles. The first member to be joined and
The second member to be joined and
A joint portion for joining the first and second members to be joined is provided.
The joint portion is formed by using a bonding composition containing the conductive particles according to any one of claims 1 to 6 and a bonding material containing metal atom-containing particles.
The bonding portion is formed by heating the bonding composition and sintering the metal atom-containing particles.
The first and second members to be bonded are bonded by a sintered body obtained by sintering the metal atom-containing particles, and the conductive particles are arranged between the first and second members to be bonded. The joint structure. A step of arranging a bonding composition containing the conductive particles according to any one of claims 1 to 6 and a bonding material containing metal atom-containing particles between the first and second bonding target members. ,
A step of forming a joint portion by heating the bonding composition and sintering the metal atom-containing particles to join the first and second members to be joined is provided.
The first and second members to be joined are joined by a sintered body obtained by sintering the metal atom-containing particles, and the conductive particles are arranged between the first and second members to be joined. Method of manufacturing the structure.

Images