JP6930707B2 - セル内バイパスダイオード - Google Patents
セル内バイパスダイオード Download PDFInfo
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- JP6930707B2 JP6930707B2 JP2016558210A JP2016558210A JP6930707B2 JP 6930707 B2 JP6930707 B2 JP 6930707B2 JP 2016558210 A JP2016558210 A JP 2016558210A JP 2016558210 A JP2016558210 A JP 2016558210A JP 6930707 B2 JP6930707 B2 JP 6930707B2
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- 239000000758 substrate Substances 0.000 claims description 133
- 229910052751 metal Inorganic materials 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 76
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 30
- 229920005591 polysilicon Polymers 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 39
- 239000004065 semiconductor Substances 0.000 description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 24
- 238000012545 processing Methods 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 23
- 239000010703 silicon Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 22
- 238000000926 separation method Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000059 patterning Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 238000000608 laser ablation Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007514 turning Methods 0.000 description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 2
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/044—PV modules or arrays of single PV cells including bypass diodes
- H01L31/0443—PV modules or arrays of single PV cells including bypass diodes comprising bypass diodes integrated or directly associated with the devices, e.g. bypass diodes integrated or formed in or on the same substrate as the photovoltaic cells
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- H01L27/142—Energy conversion devices
- H01L27/1421—Energy conversion devices comprising bypass diodes integrated or directly associated with the device, e.g. bypass diode integrated or formed in or on the same substrate as the solar cell
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- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
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- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0368—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
- H01L31/03682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors including only elements of Group IV of the Periodic Table
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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Description
本出願は、Harleyらによる、「In−Cell Bypass Diode for Multi−diode Solar Cell」と題された2014年5月29日出願の米国仮出願第62/004,808号の利益を主張するものであり、その全容は、参照により本明細書に組み込まれる。
[項目1]
太陽電池であって、
上記太陽電池の基板と、
上記基板の第1部分内又は上記第1部分の上方に配置された活性領域と、
上記基板の第2部分内又は上記第2部分の上方に配置されたバイパスダイオードと、
上記バイパスダイオードに上記活性領域を結合させる金属被覆構造体と、を備え、上記基板の上記第1部分と上記第2部分とは、第1の溝で物理的に隔てられている、太陽電池。
[項目2]
上記バイパスダイオードは、P型ドープポリシリコン及びN型ドープポリシリコンを含むP−N接合を有している、項目1に記載の太陽電池。
[項目3]
上記基板はN型ドープ基板であり、上記バイパスダイオードは、上記N型ドープ基板内に配置されたP型ドープ領域を含むP−N接合を有している、項目1に記載の太陽電池。
[項目4]
上記バイパスダイオードは、上記太陽電池の縁部に配置されている、項目1に記載の太陽電池。
[項目5]
上記基板の上記第1部分と上記第2部分とは、上記第1の溝及び第2の溝で物理的に隔てられている、項目1に記載の太陽電池。
[項目6]
上記金属被覆構造体はまた、上記活性領域の複数のn型ドープ領域のそれぞれも互いに結合させ、上記活性領域の複数のp型ドープ領域のぞれぞれも互いに結合させる、項目1に記載の太陽電池。
[項目7]
太陽電池用のバイパスダイオードであって、上記バイパスダイオードは、
上記太陽電池の基板の第1部分内又は上記第1部分の上方に配置されたP−N接合を備え、上記P−N接合は、上記基板の第2部分内又は上記第2部分の上方に配置されたドープ領域に金属被覆構造体を介して結合され、
上記基板の上記第1部分と上記第2部分とは、第1の溝で隔てられ、上記第1の溝は、上記金属被覆構造体の一部分を露出させている、バイパスダイオード。
[項目8]
上記基板の上記第1部分と上記第2部分とはまた、第2の溝でも隔てられている、項目7に記載のバイパスダイオード。
[項目9]
上記P−N接合は、上記基板の上記第1部分の上方に配置された、当接する複数のドープP型ポリシリコン領域及び複数のドープN型ポリシリコン領域を備えている、項目7に記載のバイパスダイオード。
[項目10]
上記基板はN型ドープ基板であり、上記P−N接合は、上記N型ドープ基板内に配置されたP型ドープ領域を備えている、項目7に記載のバイパスダイオード。
[項目11]
項目7に記載のバイパスダイオードを備えている、太陽電池。
[項目12]
太陽電池用のバイパスダイオードを製造する方法であって、
半導体基板の第1部分の上方に、P−N接合を形成する段階と、
上記半導体基板の第2部分内又は上記第2部分の上方に配置されたドープ領域に、上記P−N接合を結合させるべく、半導体基板の第1表面の上方に、金属被覆構造体を形成する段階と、
上記半導体基板の上記第1部分を、上記第2部分から分離する段階と、を含む、方法。
[項目13]
スクライブ加工する上記段階は、第1の方向及び第2の方向で、上記半導体基板をスクライブ加工する段階を含む、項目12に記載の方法。
[項目14]
スクライブ加工する上記段階は、レーザでスクライブ加工する段階を含む、項目12に記載の方法。
[項目15]
上記第1部分の上方に上記P−N接合を形成する上記段階は、当接する複数のP型ポリシリコン領域及びN型ポリシリコン領域を形成する段階を含む、項目12に記載の方法。
[項目16]
上記P−N接合を形成する上記段階を実行するために使用される1又は複数の同じ処理段階の一部として、上記ドープ領域と、上記半導体基板の上記第2部分内又は上記第2部分の上方の他のドープ領域とを形成する段階を更に含む、項目12に記載の方法。
[項目17]
上記金属被覆構造体を形成する上記段階は、金属をめっきする段階及びパターニングする段階を含む、項目12に記載の方法。
[項目18]
上記半導体基板の第3部分の上方に、別のP−N接合を形成する段階であって、
上記金属被覆構造体を形成する上記段階はまた、上記別のP−N接合を、上記半導体基板の第4部分内又は上記第4部分の上方に配置された別のドープ領域にも結合させる、段階と、
上記半導体基板の上記第3部分を上記第4部分から分離するために、上記半導体基板をスクライブ加工する段階と、
上記半導体基板の上記第3部分及び上記第4部分を上記第1部分及び上記第2部分から分離する段階とを更に含む、項目12に記載の方法。
[項目19]
上記半導体基板の上記第3部分及び上記第4部分に対応する上記金属被覆構造体の一部分を、上記半導体基板の上記第1部分及び上記第2部分に対応する上記金属被覆構造体の一部分から分離する段階を更に含む、項目18に記載の方法。
[項目20]
上記P−N接合の一部分を備えるそれぞれのバイパスダイオードをそれぞれが有する、2つのサブセルを形成するべく、上記太陽電池をダイシングする段階を更に含む、項目12に記載の方法。
Claims (6)
- 太陽電池であって、
前記太陽電池の基板と、
前記基板の第1部分内又は前記第1部分よりも上方に配置されたドープ領域を有する活性領域と、
前記基板の第2部分外でかつ前記第2部分よりも上方に配置されたP−N接合を有するバイパスダイオードと、
前記バイパスダイオードに前記活性領域を結合させる金属被覆構造体と、を備え、前記基板の前記第1部分と前記第2部分とは、第1の溝で物理的に隔てられていて、前記活性領域と前記バイパスダイオードとは、前記第1の溝で物理的に隔てられている太陽電池。 - 前記バイパスダイオードは、P型ドープポリシリコン及びN型ドープポリシリコンを含むP−N接合を有している、請求項1に記載の太陽電池。
- 前記バイパスダイオードは、前記太陽電池の縁部に配置されている、請求項1又は2に記載の太陽電池。
- 前記基板の前記第1部分と前記第2部分とは、前記第1の溝及び第2の溝で物理的に隔てられていて、前記活性領域と前記バイパスダイオードとは、前記第1の溝及び前記第2の溝で物理的に隔てられている請求項1から3のいずれか一項に記載の太陽電池。
- 前記金属被覆構造体はまた、前記活性領域の複数のn型ドープ領域のそれぞれも互いに結合させ、前記活性領域の複数のp型ドープ領域のそれぞれも互いに結合させる、請求項1から4のいずれか一項に記載の太陽電池。
- 前記P型ドープポリシリコンは、前記バイパスダイオードから前記基板に向かう方向から見て、第一突出部を複数有し、
前記N型ドープポリシリコンは、前記バイパスダイオードから前記基板に向かう方向から見て、前記第一突出部の間に交互に配置された第二突出部を複数有する、請求項2に記載の太陽電池。
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US201462004808P | 2014-05-29 | 2014-05-29 | |
US62/004,808 | 2014-05-29 | ||
US14/472,232 | 2014-08-28 | ||
US14/472,232 US9425337B2 (en) | 2014-05-29 | 2014-08-28 | In-cell bypass diode |
PCT/US2015/032317 WO2015183760A1 (en) | 2014-05-29 | 2015-05-22 | In-cell bypass diode |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9425337B2 (en) | 2014-05-29 | 2016-08-23 | Sunpower Corporation | In-cell bypass diode |
DE102016118177A1 (de) | 2016-09-26 | 2018-03-29 | Heliatek Gmbh | Organisches Bauelement zur Umwandlung von Licht in elektrische Energie mit verbesserter Effizienz und Lebensdauer bei Teilverschattung |
CN108171441A (zh) * | 2018-01-17 | 2018-06-15 | 盐城工学院 | 一种地铁车站安全状态评估方法及系统 |
CN110165006B (zh) * | 2019-06-17 | 2020-10-20 | 苏州亚傲鑫企业管理咨询有限公司 | 一种极性互补的晶体硅光伏电池连接组 |
DE102019129355A1 (de) | 2019-10-30 | 2021-05-06 | Heliatek Gmbh | Photovoltaisches Element mit verbesserter Effizienz bei Verschattung und Verfahren zur Herstellung eines solchen photovoltaischen Elements |
DE102019129349A1 (de) * | 2019-10-30 | 2021-05-06 | Heliatek Gmbh | Photovoltaisches Element mit verbesserter Effizienz bei Verschattung, und Verfahren zur Herstellung eines solchen photovoltaischen Elements |
CN114122173B (zh) * | 2020-08-27 | 2022-11-11 | 中国科学院半导体研究所 | 石墨烯旁路二极管与晶硅太阳电池的集成结构及制备方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138184A (en) * | 1981-02-20 | 1982-08-26 | Matsushita Electric Ind Co Ltd | Solar cell device |
AU570309B2 (en) * | 1984-03-26 | 1988-03-10 | Unisearch Limited | Buried contact solar cell |
US4612408A (en) * | 1984-10-22 | 1986-09-16 | Sera Solar Corporation | Electrically isolated semiconductor integrated photodiode circuits and method |
JPH0964397A (ja) * | 1995-08-29 | 1997-03-07 | Canon Inc | 太陽電池および太陽電池モジュール |
GB2341721B (en) * | 1998-09-04 | 2003-08-27 | Eev Ltd | Manufacturing method for solar cell arrangements |
TW501286B (en) * | 2001-06-07 | 2002-09-01 | Ind Tech Res Inst | Polysilicon thin film solar cell substrate |
EP1636857B1 (en) * | 2003-05-19 | 2010-07-14 | Solar Systems Pty Ltd | Bypass diode for photovoltaic cells |
US7732705B2 (en) * | 2005-10-11 | 2010-06-08 | Emcore Solar Power, Inc. | Reliable interconnection of solar cells including integral bypass diode |
US7842881B2 (en) * | 2006-10-19 | 2010-11-30 | Emcore Solar Power, Inc. | Solar cell structure with localized doping in cap layer |
DE102007011403A1 (de) | 2007-03-08 | 2008-09-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Frontseitig serienverschaltetes Solarmodul |
TW201017900A (en) * | 2008-08-11 | 2010-05-01 | Tg Solar Corp | Solar cell and method for fabricating the same |
EP3621123A1 (en) | 2009-05-04 | 2020-03-11 | Microlink Devices, Inc. | Assembly techniques for solar cell arrays and solar cells formed therefrom |
US20120298168A1 (en) | 2010-11-17 | 2012-11-29 | E. I. Du Pont De Nemours And Company | Thin-film photovoltaic cell having an etchant-resistant electrode and an integrated bypass diode and a panel incorporating the same |
US8134217B2 (en) * | 2010-12-14 | 2012-03-13 | Sunpower Corporation | Bypass diode for a solar cell |
CN103378211B (zh) * | 2012-04-19 | 2017-02-15 | 聚日(苏州)科技有限公司 | 太阳能电池单元及其制造方法 |
CN104904021A (zh) | 2012-11-05 | 2015-09-09 | 索莱克赛尔公司 | 用于单片岛型太阳能光伏电池和模块的系统和方法 |
US9130076B2 (en) | 2012-11-05 | 2015-09-08 | Solexel, Inc. | Trench isolation for monolithically isled solar photovoltaic cells and modules |
US9525097B2 (en) * | 2013-03-15 | 2016-12-20 | Nthdegree Technologies Worldwide Inc. | Photovoltaic module having printed PV cells connected in series by printed conductors |
US20150155398A1 (en) | 2013-08-30 | 2015-06-04 | Mehrdad M. Moslehi | Photovoltaic monolithic solar module connection and fabrication methods |
KR20160134650A (ko) | 2014-01-13 | 2016-11-23 | 솔렉셀, 인크. | 배면 접촉 솔라 셀을 위한 불연속적인 에미터 및 베이스 아일랜드 |
US9425337B2 (en) | 2014-05-29 | 2016-08-23 | Sunpower Corporation | In-cell bypass diode |
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