JP6930160B2 - Development cartridge and its manufacturing method - Google Patents

Description

The present invention relates to a developing cartridge including an IC chip and a method for manufacturing the same.

Conventionally, as a cartridge of an image forming apparatus, one having an IC chip having a storage medium and an electrical contact surface and a holder for holding the IC chip is known. (See Patent Document 1). In this technique, the surface of the IC chip opposite to the electrical contact surface is adhered to the adhesive surface of the holder by an adhesive.

Japanese Unexamined Patent Publication No. 2006-82313

However, in the prior art, since the adhesive is interposed between the entire surface of the IC chip opposite to the electrical contact surface and the adhesive surface, the IC chip cannot be brought into contact with the adhesive surface and is adhered. The position of the IC chip with respect to the holder may vary depending on the amount of the agent applied and the position where the adhesive is applied.

Therefore, an object of the present invention is to provide a developing cartridge capable of accurately positioning an IC chip with respect to a holder and a method for manufacturing the same.

In order to solve the above problems, the developing cartridge according to the present invention holds an IC chip extending in the first direction and having a housing for accommodating toner, a storage medium, an electrical contact surface, and the IC chip. The holder is provided with a holder located at one end of the housing in the first direction.
The IC chip has a first surface located on the opposite side of the electrical contact surface in the second direction intersecting the electrical contact surface and a second surface located on the opposite side of the electrical contact surface in the second direction. The second surface, which is two surfaces and is located at a distance from the first surface, and the third surface, which is located on the opposite side of the electrical contact surface in the second direction, is the first surface. It has a third surface located between the second surface and the second surface.
The holder faces the first contact surface in contact with the first surface, the second contact surface in contact with the second surface, and the third surface in the second direction, and the first contact surface and the said. It has an adhesive surface that is farther from the third surface than the second contact surface and is located between the first contact surface and the second contact surface.
Further, the developing cartridge includes an adhesive that adheres the adhesive surface and the third surface.

According to this configuration, the third surface and the adhesive surface can be adhered with an adhesive in a state where the first surface and the first contact surface and the second surface and the second contact surface are in contact with each other. Therefore, the IC chip can be accurately positioned with respect to the holder in the second direction. Further, an adhesive surface is provided at a position farther from the third surface than the first contact surface and the second contact surface. Therefore, due to the contact portion between the first surface and the first contact surface and the contact portion between the second surface and the second contact surface, the surface opposite to the adhesive surface and the electrical contact surface of the IC chip during the manufacture of the developing cartridge. It is possible to prevent the adhesive that is crushed and spread between the adhesive surface and the IC chip from being discharged from between the adhesive surface and the surface opposite to the electrical contact surface of the IC chip.

Further, the developing cartridge may include a developing roller that is rotatable about a first axis extending in the first direction, and the adhesive surface may have a hole into which the storage medium enters.

Further, the holder may have a first side wall that constitutes a first wall that surrounds the first contact surface, and may have a first side wall that comes into contact with the IC chip.

According to this, the IC chip can be positioned by the first side wall.

Further, the first wall surrounds the second contact surface, and the holder is a second side wall constituting the first wall, and a second side wall located at a distance from the first side wall. It may have a holding portion extending from the second side wall toward the first side wall and sandwiching the IC chip with the first side wall.

According to this, the IC chip can be pressed against the first side wall by the holding portion. Therefore, the IC chip can be accurately positioned with respect to the holder. In addition, it is possible to suppress the displacement of the IC chip with respect to the holder until the adhesive hardens.

Further, the electrical contact surface has a first electrical contact surface and a second electrical contact surface that is aligned with the first electrical contact surface in the first direction, and the holding portion is the holding portion. It may be in contact with the IC chip in the first direction.

According to this, a plurality of electrical contact surfaces can be accurately positioned in the first direction. As a result, it is possible to prevent the plurality of electrical contact surfaces from being displaced in the first direction from the plurality of main body side electrical contact surfaces provided in the main body housing and coming into contact with the main body side electrical contact surfaces unintentionally. be able to.

Further, the holding portion may come into contact with the IC chip in the first direction and the third direction intersecting the second direction.

According to this, the electrical contact surface can be accurately positioned in the third direction. As a result, it is possible to prevent the electrical contact surface from being displaced in the third direction from the main body side electrical contact surface provided in the main body housing.

Further, the holding portion may be configured to be more easily deformed than the first side wall.

According to this, when the IC chip is attached to the holder, the holding portion can be deformed, so that the IC chip can be pressed against the first side wall by the deformed holding portion.

Further, the holding portion may be located between the first contact surface and the second contact surface and may face the adhesive surface in the second direction.

According to this, it is possible to prevent the crushed portion of the holding portion from being placed on the first contact surface and the second contact surface. Therefore, it is possible to prevent the crushed portion of the holding portion from interposing between the first surface and the first contact surface and between the second surface and the second contact surface.

Further, the holding portion has a first holding surface facing the adhesive surface in the second direction and a second holding surface located on the opposite side of the first holding surface in the second direction. The second holding surface may be inclined so as to approach the adhesive surface as it approaches the first side wall from the second side wall.

According to this, the IC chip can be guided to the adhesive surface side by the second holding surface, and the corner portion of the holding portion is easily crushed during the guidance. As a result, the work of holding the IC chip in the holder can be easily performed.

Further, the IC chip may have a convex portion located closer to the other end of the IC chip in the first direction than the one end of the IC chip in the first direction. .. Further, the first side wall may have a concave portion into which the convex portion enters.

According to this, it is possible to prevent the IC chip from being attached in the wrong direction.

Further, the first side wall may have an opening for exposing the adhesive to the outside.

According to this, the presence or absence of the adhesive can be confirmed from the outside through the opening.

Further, the opening may be located on the opposite side of the housing with the IC chip sandwiched in the first direction.

According to this, the presence or absence of the adhesive can be easily confirmed.

Further, the adhesive surface may have a mark portion formed so as to be recessed in the second direction.

According to this, it is possible to inform the operator of the proper position for applying the adhesive by the mark portion.

Further, there may be a plurality of the mark portions.

According to this, the thickness of the adhesive can be made substantially uniform as compared with the case where the adhesive is applied to one place.

Further, the holder may have a connecting surface for connecting the first contact surface and the adhesive surface, and the connecting surface may have a curved surface having an arc shape when viewed from the second direction. ..

According to this, the adhesive applied to the adhesive surface easily spreads over the entire adhesive surface. As a result, the thickness of the adhesive can be made more uniform.

Further, the adhesive surface may have a first adhesive surface and a second adhesive surface that is farther from the third surface than the first adhesive surface.

Further, the second adhesive surface may have the mark portion.

According to this, the movement of the adhesive toward the first contact surface and the second contact surface can be suppressed by the stepped surface between the first adhesive surface and the second adhesive surface.

Further, the method for manufacturing a development cartridge according to the present invention is an IC chip extending in the first direction and having a housing for accommodating toner, a storage medium, an electrical contact surface, and a holder for holding the IC chip. The IC chip includes a holder located at one end of the housing in the first direction, and the IC chip is located on the opposite side of the electrical contact surface in the second direction intersecting the electrical contact surface. A first surface located, a second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface, and the second direction. A third surface located on the opposite side of the electrical contact surface, the third surface located between the first surface and the second surface, and the holder is the first surface. The first contact surface in contact with the surface, the second contact surface in contact with the second surface, face the third surface in the second direction, and the first contact surface and the second contact surface are more than the first contact surface and the second contact surface. An adhesive surface that is separated from the third surface and has an adhesive surface located between the first contact surface and the second contact surface, and adheres the adhesive surface and the third surface to each other. It is a method of manufacturing a development cartridge provided with an agent.
The manufacturing method includes a first step of applying the adhesive to the adhesive surface, and a state in which the first surface and the second surface are in contact with the first contact surface and the second contact surface. A second step of bringing the three surfaces into contact with the adhesive is provided.

According to this, the third surface and the adhesive surface can be adhered with an adhesive in a state where the first surface and the first contact surface and the second surface and the second contact surface are in contact with each other. As a result, the IC chip can be accurately positioned with respect to the holder in the second direction.

Further, in the above-mentioned manufacturing method, the holder of the developing cartridge to be manufactured constitutes the first side wall forming the first wall surrounding the first contact surface and the second contact surface, and the second wall forming the first wall. Further, a second side wall which is a side wall and is located at a distance from the first side wall, and a holding portion which extends from the second side wall to the first side wall and sandwiches the IC chip between the first side wall and the first side wall. When the third surface is brought into contact with the adhesive in the second step, the first surface and the second surface are brought into contact with the first contact surface and the first surface while crushing the holding portion. 2 It may be brought into contact with the contact surface.

According to this, the IC chip can be accurately positioned between the first side wall and the holding portion.

Further, in the above-mentioned manufacturing method, when the first side wall of the holder of the developing cartridge to be manufactured further has an opening for exposing the adhesive to the outside, after the second step, the adhesion is made from the opening. A third step of confirming the agent may be provided.

According to this, it is possible to prevent the developing cartridge from being shipped without applying the adhesive to the adhesive surface.

Further, the developing cartridge according to the present invention includes an IC chip having a storage medium and a substrate, and a holder for holding the substrate.
The holder has a contact surface that contacts the holder-side surface of the substrate, an adhesive surface that faces the holder-side surface of the substrate and is farther from the substrate than the contact surface, and the adhesive surface and the above. A connecting surface for connecting the contact surface and an adhesive for adhering the IC chip and the adhesive surface are provided.

According to this configuration, the contact surface and the IC chip can be brought into close contact with each other as compared with the conventional structure in which an adhesive is applied to the support surface and the IC chip is attached, so that the contact surface and the IC chip can be brought into close contact with each other. The IC chip can be accurately positioned in the direction.

Further, the IC chip has an electrical contact surface, and the substrate has a first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface, and the second surface. A second surface located on the opposite side of the electrical contact surface in the direction, the second surface located at a distance from the first surface, and the opposite side of the electrical contact surface in the second direction. A third surface to be located, which has a third surface located between the first surface and the second surface, the contact surface is in contact with the third surface, and the adhesive surface is In the second direction, the first adhesive surface facing the first surface and away from the first surface than the contact surface, and in the second direction, facing the second surface and more than the contact surface. It may have a second adhesive surface that is separated from the second surface and is located on the opposite side of the first adhesive surface with respect to the contact surface.

According to the present invention, the IC chip can be accurately positioned with respect to the holder.

It is a perspective view which shows the development cartridge which concerns on 1st Embodiment. It is an exploded perspective view which shows a holder and an IC chip. It is a perspective view which looked at the substrate from the back side. It is a plan view (a) of the part where the IC chip of a holder is attached seen from the vertical direction, and the I-I cross-sectional view (b) of FIG. 4 (a). It is sectional drawing (a)-(c) which shows the method of attaching a substrate to a contact surface. It is a plan view (a) which shows the state which the adhesive is applied to the adhesive surface, and is the plan view (b) which shows the state which the adhesive is crushed and spread between the substrate and the adhesive surface. It is a perspective view which shows the development cartridge which concerns on 2nd Embodiment. It is an exploded perspective view which shows the cover member, a holder and a base member. It is an exploded perspective view which shows by disassembling an IC chip, a holder and the like. It is a perspective view which shows the structure of the back surface side of a substrate while enlarging the part where the IC chip of a holder is attached. FIG. 8 is a sectional view taken along line II-II of FIG. It is a plan view (a) which shows the state which the adhesive is applied to the adhesive surface, and is the plan view (b) which shows the state which the adhesive is crushed and spread between the substrate and the adhesive surface. It is sectional drawing which shows the 3rd process. FIG. 3A is a plan view showing a holder according to a third embodiment, FIG. 14A is a sectional view taken along line III-III (b), and FIG. 14A is a sectional view taken along line IV-IV (c).

[First Embodiment]
Next, the first embodiment of the present invention will be described in detail with reference to the drawings as appropriate.
As shown in FIG. 1, the developing cartridge 1 includes a resin housing 10 that houses toner, a developing roller 11 and the like provided in the housing 10, and a resin holder that covers a gear that drives the developing roller 11 and the like. 20 and an IC chip 30 are provided. The developing roller 11 is arranged at one end of the housing 10 and can rotate around the first axis X1. A handle portion 12 gripped by a user is provided at the other end opposite to one end of the housing 10. The IC chip 30 includes four electrical contact surfaces 32 and a storage medium 33 (see FIG. 3).

In the following description, for convenience, the first direction along the first axis X1 of the developing roller 11 is also referred to as an axial direction or a left-right direction. Further, the second direction that intersects the electrical contact surface 32 is also referred to as a vertical direction. Further, the third direction from one end to the other end of the housing 10 is also referred to as a front-rear direction. In the present embodiment, the second direction refers to the direction perpendicular to the electrical contact surface 32.

The developing cartridge 1 has the longest length in the left-right direction. The housing 10 extends in the first direction. The housing 10 has the longest length in the first direction. A holder 20 is provided at one end of the housing 10 in the first direction.

The IC chip 30 is provided in the holder 20. The IC chip 30 is arranged closer to the developing roller 11 than the handle portion 12 in the front-rear direction. The IC chip 30 has the longest length in the left-right direction.

As shown in FIG. 2, the IC chip 30 includes a rectangular substrate 31 long in the first direction, four electrical contact surfaces 32, and a storage medium 33 (see FIG. 3). The substrate 31 is made of, for example, resin. The substrate 31 has a front surface 31A that faces the opposite side of the holder 20 and is exposed to the outside, and a back surface 31B that faces the holder 20 side. The substrate 31 has four convex portions 31C protruding outward in the front-rear direction at each end in the front-rear direction. Each convex portion 31C is arranged closer to the outer end in the left-right direction than the inner end (on the side of the housing 10) in the left-right direction of the substrate 31. In other words, each convex portion 31C is arranged offset to the outer end in the left-right direction of the substrate 31. That is, the substrate 31 has an asymmetrical shape in the first direction.

Each electrical contact surface 32 is an electrode that contacts each of the four main body side electrodes provided in the main body housing when the developing cartridge 1 is mounted on the main body housing of the image forming apparatus. In a state where each electrical contact surface 32 and each main body side electrode are in contact with each other, the control device provided in the main body housing and the IC chip 30 are electrically connected. Each electrical contact surface 32 is formed in the shape of a rectangular plate long in the front-rear direction. The electrical contact surfaces 32 are arranged in the first direction, specifically in the left-right direction. In other words, each electrical contact surface 32 has a first electrical contact surface 32A, a second electrical contact surface 32B, a third electrical contact surface 32C, and a fourth electrical contact surface 32D. The second electrical contact surface 32B is aligned with the first electrical contact surface in the first direction.
As shown in FIG. 3, the storage medium 33 is provided so as to project from a substantially central portion of the back surface 31B of the substrate 31.
The back surface 31B has a first surface B1, a second surface B2, and a third surface B3. The second surface B2 is located at a distance from the first surface B1 in the third direction. The third surface B3 is located between the first surface B1 and the second surface B2 in the third direction.
The first surface B1, the second surface B2, and the third surface B3 are located on opposite sides of the electrical contact surface 32 in the second direction.
As shown in FIG. 3, the storage medium 33 is provided so as to project from the substantially central portion of the third surface B3 of the IC chip 30 in the second direction.

Returning to FIG. 2, the holder 20 connects the two contact surfaces 21 that support the substrate 31, the adhesive surface 22 that is farther from the substrate 31 than the contact surface 21, and the adhesive surface 22 and each contact surface 21. It is provided with two connecting surfaces 23, a first wall 24 surrounding the contact surface 21, and an adhesive 25 (see FIG. 5C) for adhering the third surface B3 of the IC chip 30 and the adhesive surface 22.

Any adhesive 25 may be used. For example, as the adhesive 25, a modified silicone-based adhesive or the like can be used. Specifically, a modified silicone resin, an epoxy modified silicone resin, an acrylic modified silicone resin, or the like can be used.

The contact surface 21 has a first contact surface 21A that contacts the first surface B1 and a second contact surface 21B that contacts the second surface B2.
The first contact surface 21A contacts the first surface B1 of the IC chip 30. As shown in FIG. 4A, the first contact surface 21A has a substantially rectangular first portion 21A1 long in the first direction and a second portion 21A1 extending in the third direction from one end in the first direction. It has a portion 21A2 and a third portion 21A3 extending in a third direction from the other end of the first portion 21A1 in the first direction.
The second contact surface 21B contacts the second surface B2 of the IC chip 30. The second contact surface 21B is located at a distance from the first contact surface 21A in the third direction. The second contact surface 21B includes a first portion 21B1 having a substantially rectangular shape long in the first direction, a second portion 21B2 extending in the third direction from one end of the first portion 21B1 in the first direction, and a first portion 21B1. It has a third portion 21B3 extending in the third direction from the other end in one direction.

The adhesive surface 22 faces the third surface B3 in the second direction, and is located farther from the third surface B3 than the first contact surface 21A and the second contact surface 21B. The adhesive surface 22 is located between the first contact surface 21A and the second contact surface 21B in the third direction.
As shown in FIG. 2, the adhesive surface 22 is a surface that faces the back surface 31B of the substrate 31 at intervals. As shown in FIG. 4A, the adhesive surface 22 has a wide portion 22A, two narrow portions 22B, and four marks that serve as marks when the adhesive 25 (see FIG. 5A) is applied. It has a portion 22C and a hole 22D into which the storage medium 33 enters. The wide portion 22A is arranged between the two first portions 21A in the front-rear direction. The width of each narrow portion 22B in the front-rear direction is smaller than the width of the wide portion 22A in the front-rear direction. Each narrow portion 22B projects outward in the left-right direction from each end in the left-right direction of the wide portion 22A. Each narrow portion 22B is arranged at a substantially central portion in the front-rear direction at each end in the left-right direction of the wide portion 22A. Each narrow portion 22B is arranged between two second portions 21B in the front-rear direction.

Each mark portion 22C is arranged at a position corresponding to the four corners of the wide portion 22A. Each mark portion 22C is formed in a circular shape when viewed from the vertical direction. Each mark portion 22C is arranged so that a virtual line connecting the centers of each mark portion 22C forms a long rectangle in the left-right direction. Each mark portion 22C is arranged so that the shortest distance to the connecting surface 23 is the same.

Each mark portion 22C is arranged in the front-rear direction in the vicinity of the notch portion W11 described later. Specifically, the distance between the two mark portions 22C arranged in the front-rear direction is equal to the width of the notch portion W11 in the front-rear direction. Further, the inner end portions of the two mark portions 22C arranged in the front-rear direction in the front-rear direction are arranged at the same positions in the front-rear direction as the side surfaces of the cutout portion W11 facing each other in the front-rear direction. As shown in FIG. 4B, each mark portion 22C is formed so as to be recessed in the second direction from the adhesive surface 22.

The hole 22D is a through hole that penetrates the wall of the holder 20, specifically, the wall 13 (see FIG. 5A) on which the adhesive surface 22 is formed. The hole 22D is formed in a substantially central portion of the wide portion 22A. The hole 22D is located between the two mark portions 22C arranged in the left-right direction among the four mark portions 22C in the left-right direction, that is, the longitudinal direction of the substrate 31.
The connecting surface 23 has a first connecting surface 23A that connects the adhesive surface 22 and the first contact surface 21A, and a second connecting surface 23B that connects the adhesive surface 22 and the second contact surface 21B. The connecting surface 23 has a curved surface 23R having an arc shape when viewed from the second direction.
The length of the connecting surface 23 in the second direction can be, for example, 0.5 mm. The length of the storage medium 33 in the second direction can be, for example, 0.7 mm. That is, the length of the storage medium 33 in the second direction is larger than the length of the connecting surface 23 in the second direction.
The first wall 24 surrounds the first contact surface 21A and the second contact surface 21B.

As shown in FIG. 2, the first wall 24 is formed in a rectangular tubular shape that surrounds the contact surface 21 and the adhesive surface 22. The first wall 24 projects outward in the vertical direction from the contact surface 21. Specifically, the first wall 24 projects outward in the vertical direction from the surface 31A (specifically, the electrical contact surface 32) of the substrate 31 attached so as to come into contact with the contact surface 21 (see FIG. 5C). ). The first wall 24 has a first side wall W1 as an example of a positioning portion, a second side wall W2, a third side wall W3, and a fourth side wall W4.

The first side wall W1 is a wall for positioning the substrate 31 in the left-right direction. The first side wall W1 is located outside the contact surface 21 in the left-right direction. The first side wall W1 contacts the end portion of the substrate 31 in the direction along the contact surface 21, more specifically, in the left-right direction. The first side wall W1 has a notch W11 as an example of the opening.

The cutout portion W11 is an opening for exposing the adhesive 25 applied to the adhesive surface 22 to the outside. The cutout portion W11 is formed so as to be recessed inward in the vertical direction from the outer end portion in the vertical direction of the first side wall W1. The cutout portion W11 penetrates in the left-right direction and faces the space between the adhesive surface 22 and the substrate 31.

The cutout portion W11 is located outside the IC chip 30 in the left-right direction, that is, in the longitudinal direction of the developing cartridge 1. In other words, the notch W11 is located on the opposite side of the housing 10 with the IC chip 30 in between in the first direction. As shown in FIG. 4B, the inner portion of the bottom surface W12 of the notch portion W11 in the left-right direction is arranged at a position flush with the adhesive surface 22. The outer portion of the bottom surface W12 in the left-right direction is inclined so as to be located inward in the vertical direction toward the outside in the left-right direction.

As shown in FIG. 2, the second side wall W2 is located on the opposite side of the first side wall W1 with the substrate 31 interposed therebetween. The second side wall W2 has a holding portion W21 that sandwiches and holds the substrate 31 with the first side wall W1. The holding portion W21 contacts the end portion of the substrate 31 in the left-right direction, that is, in the first direction which is the arrangement direction of the plurality of electrical contact surfaces 32.

The holding portion W21 projects from the second side wall W2 toward the first side wall W1. The holding portion W21 is formed in a triangular columnar shape having a pointed tip portion, which is an end portion on the first side wall W1 side. The tip of the holding portion W21, which is sharp as described above, is more easily deformed than the first side wall W1. The distance from the tip of the holding portion W21 to the first side wall W1 is smaller than the length of the substrate 31 in the left-right direction.
The holding portion W21 has a first holding surface W23 facing the adhesive surface 22 in the second direction, and a second holding surface W22 located on the opposite side of the first holding surface W23 in the second direction. The second holding surface W22 is inclined so as to approach the adhesive surface 22 as it approaches the first side wall W1 from the second side wall W2.

As shown in FIG. 4A, the holding portion W21 is separated from each contact surface 21 in the direction along the contact surface 21. Specifically, the holding portion W21 is arranged at a substantially central portion in the front-rear direction of the narrow portion 22B of the adhesive surface 22. As shown in FIG. 4B, the holding portion W21 extends outward from the adhesive surface 22 in the vertical direction. The outer surface of the holding portion W21 in the vertical direction, that is, the surface opposite to the adhesive surface 22, the second holding surface W22 becomes an inclined surface that inclines so as to approach the adhesive surface 22 as it approaches the first side wall W1. There is. The holding portion W21 is located between the first contact surface 21A and the second contact surface 21B. The holding portion W21 faces the adhesive surface 22 in the second direction.

As shown in FIG. 2, the third side wall W3 connects one ends of the first side wall W1 and the second side wall W2 in the front-rear direction. The third side wall W3 has a recess W31 into which two convex portions 31C provided at one end in the front-rear direction of the substrate 31 enter. The recess W31 is formed so as to be recessed from the outer end of the third side wall W3 in the vertical direction. The recess W31 penetrates in the front-rear direction. The recess W31 is arranged closer to the other end on the outer side in the left-right direction than the one end on the inner side in the left-right direction of the third side wall W3.

The fourth side wall W4 connects the other ends of the first side wall W1 and the second side wall W2 in the front-rear direction. The fourth side wall W4 has a recess W41 into which two convex portions 31C provided at the other end of the substrate 31 in the front-rear direction enter. The recess W41 is formed so as to be recessed from the outer end in the vertical direction of the fourth side wall W4. The recess W41 penetrates in the front-rear direction. The recess W41 is arranged closer to the other end on the outer side in the left-right direction than the one end on the inner side in the left-right direction of the fourth side wall W4.

Next, a method of manufacturing the developing cartridge 1, particularly a method of attaching the IC chip 30 to the holder 20 will be described.
As shown in FIG. 1, first, the holder 20 is attached to the housing 10. After that, as shown in FIG. 5A, the adhesive 25 is applied to each mark portion 22C of the adhesive surface 22 (first step). Specifically, the adhesive 25 is applied so that the adhesive 25 projects outward in the vertical direction from the contact surface 21.

Next, as shown in FIG. 5B, the IC chip 30 is tilted obliquely so that one end of the substrate 31 in the left-right direction is brought into contact with the first side wall W1. After that, the other end of the substrate 31 in the left-right direction is pressed against the second holding surface W22 of the holding portion W21, and the holding portion W21 is crushed and pushed toward the contact surface 21. While pushing the other end of the substrate 31 in this way, as shown in FIG. 5C, the substrate 31 is brought into contact with the adhesive 25 on the adhesive surface 22 while being in contact with the contact surface 21 (No. 1). 2 steps). At this time, the portion of the holding portion W21 crushed by the substrate 31 is extruded onto the adhesive surface 22 arranged at a position one step lower than the contact surface 21.

When the substrate 31 is brought into contact with the contact surface 21, the adhesive 25 is crushed between the substrate 31 and the adhesive surface 22, and as shown in FIGS. 6A and 6B, the adhesive 25 is attached to the mark portion 22C. It spreads radially outward of. As a result, a large amount of the adhesive 25 enters the width of the notch W11 in the front-rear direction. Therefore, the operator can confirm the adhesive 25 from the notch W11 after the second step (third step).

The step of drying the adhesive 25 may be performed before the third step or after the third step.

Based on the above, the following effects can be obtained in the present embodiment.
Since the contact surface 21 and the substrate 31 can be brought into contact with each other, it is possible to prevent the substrate 31 from floating from the contact surface 21 as compared with the conventional structure in which an adhesive is applied to the adhesive surface to attach the substrate. The IC chip 30 can be accurately positioned in the direction orthogonal to the contact surface 21.
Specifically, the third surface 31C and the adhesive surface 22 can be adhered by the adhesive 25 in a state where the first surface 31A and the first contact surface 21A and the second surface 31B and the second contact surface 21B are in contact with each other. Therefore, the IC chip 30 can be accurately positioned with respect to the holder 20 in the second direction.

Since the adhesive surface 22 is provided at a position one step lower than the contact surface 21 that contacts the substrate 31, the adhesive 25 that spreads by being crushed between the adhesive surface 22 and the substrate 31 during manufacturing is the contact surface. Even when approaching 21, the adhesive 25 can be prevented from reaching the contact surface 21 by the connecting surface 23 which is a stepped surface.
Specifically, the adhesive surface 22 is provided at a position one step lower than the first contact surface 21A and the second contact surface 21B that come into contact with the substrate 31. That is, the adhesive surface 22 is provided at a position farther from the first surface 31A and the second surface 31B than the first contact surface 21A and the second contact surface 21B. Therefore, at the time of manufacture, the adhesive 25 that is crushed and spreads between the adhesive surface 22 and the third surface 31C is in contact with the first surface 31A and the first contact surface 21A and the second contact with the second surface 31B. It is possible to prevent the adhesive 25 from reaching the first contact surface 21A and the second contact surface 21B even when the adhesive 25 approaches the contact portion of the surface 21B.

Since the substrate 31 contacts the first side wall W1 in the left-right direction, the substrate 31 can be positioned in the left-right direction by the first side wall W1.

Since the substrate 31 can be pressed against the first side wall W1 by the holding portion W21, the IC chip 30 can be accurately positioned in the left-right direction. Further, the IC chip 30 can be held by the holding portion W21 and the first side wall W1 until the adhesive 25 hardens.

Further, since the holding portion W21 is brought into contact with the substrate 31 in the left-right direction, which is the arrangement direction of the plurality of electrical contact surfaces 32, the plurality of electrical contact surfaces 32 can be accurately positioned in the left-right direction. Therefore, it is possible to prevent the plurality of electrical contact surfaces 32 from being displaced in the left-right direction from the plurality of main body side electrodes provided in the main body housing and coming into contact with the main body side electrodes unintentionally.

By configuring the holding portion W21 so as to be more easily deformed than the first side wall W1, the holding portion W21 can be deformed when the substrate 31 is attached. It can be pressed against the side wall W1.

By separating the holding portion W21 from the contact surface 21, it is possible to prevent the crushed portion of the holding portion W21 from being placed on the contact surface 21, so that the substrate 31 can be brought into contact with the contact surface 21.
Specifically, since the holding portion W21 is located between the first contact surface 21A and the second contact surface 21B, it is possible to prevent the crushed portion of the holding portion W21 from being placed on the contact surface 21. The first surface 31A can be brought into contact with the first contact surface 21A, and the second surface 31B can be brought into contact with the second contact surface 21B.

The second holding surface W22 of the holding portion W21 can guide the IC chip 30 to the adhesive surface 22 side, and the corner portion of the holding portion W21 is easily crushed during the guidance. Therefore, the IC chip 30 is held in the holder 20. The work of holding the IC can be easily performed.

Since the mark portion 22C serving as a mark when applying the adhesive 25 is provided on the adhesive surface 22, it is possible to inform the operator of an appropriate position for applying the adhesive 25.

Since a plurality of mark portions 22C are provided, the thickness of the adhesive 25 can be made substantially uniform as compared with the case where the adhesive is applied to one place, for example.

Since the concave portion W31 into which the convex portion 31C arranged near the other end of the substrate 31 is inserted is provided in the third side wall W3, it is possible to prevent the IC chip 30 from being attached in the wrong direction.

Since the notch W11 is provided on the first side wall W1, the presence or absence of the adhesive 25 can be confirmed from the outside through the notch W11. Therefore, it is possible to prevent the IC chip 30 from being attached without applying the adhesive 25.

Since the notch W11 is located outside the IC chip 30 in the longitudinal direction, the presence or absence of the adhesive 25 can be easily confirmed from the outside in the longitudinal direction of the developing cartridge 1.
Specifically, since the notch W11 is located on the opposite side of the housing 10 with the IC chip 30 in the first direction, the presence or absence of the adhesive 25 can be easily confirmed.

[Second Embodiment]
Next, the second embodiment of the present invention will be described in detail with reference to the drawings as appropriate. Since this embodiment is a modification of a part of the structure of the first embodiment described above, the same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be described. It will be omitted.

As shown in FIG. 7, the developing cartridge 2 according to the second embodiment includes a resin housing 40 for accommodating toner, a developing roller 41 and the like provided in the housing 40, and a resin cover member 50. , IC chip 230 is provided. The developing roller 41 is arranged at one end of the housing 40 and can rotate around the first axis X1. A handle portion 42 gripped by the user is provided at the other end opposite to one end of the housing 40. The IC chip 230 includes four electrical contact surfaces 32 and a storage medium 33 (see FIG. 10).

In the following description, for convenience, the first direction along the first axis X1 of the developing roller 41 is also referred to as an axial direction or a left-right direction. Further, the second direction that intersects the electrical contact surface 32 is also referred to as a vertical direction. Further, the third direction from one end to the other end of the housing 40 is also referred to as a front-rear direction. In the present embodiment, the second direction refers to the direction perpendicular to the electrical contact surface 32.

As shown in FIG. 8, the cover member 50 includes a first cover 51 that covers a gear that drives the developing roller 41 and the like, and a second cover 52. The second cover 52 holds a resin holder 60 that supports the IC chip 230 with the first cover 51.

As shown in FIG. 9, the holder 60 is supported by a base member 70 fixed to the cover member 50 so as to be movable in a substantially perpendicular direction to the substrate 31 of the IC chip 230. A compression coil spring SP is provided between the holder 60 and the base member 70. The IC chip 230 is constantly urged outward in the vertical direction by the compression coil spring SP.

The IC chip 230 has substantially the same structure as the IC chip 30 according to the first embodiment. Specifically, the IC chip 230 includes a substrate 31, an electrical contact surface 32, and a storage medium 33 (see FIG. 10) which are substantially the same as those in the first embodiment, and the shape of the substrate 31 is slightly different from that of the first embodiment. Is different. Specifically, the substrate 31 has two convex portions 231C and 231D that are different from those in the first embodiment.

The convex portions 231C and 231D project from each end of the substrate 31 in the front-rear direction toward the outside in the front-rear direction. The amount of protrusion of the convex portion 231D from the end of the substrate 31 is larger than the amount of protrusion of the convex portion 231C from the end of the substrate 31. The convex portions 231C and 231D are arranged closer to the inner end in the left-right direction than the outer end in the left-right direction of the substrate 31.
Further, the back surface 31B of the substrate 31 has a first surface B1, a second surface B2, and a third surface B3. The second surface B2 is located at a distance from the first surface B1 in the first direction. The third surface B3 is located between the first surface B1 and the second surface B2 in the first direction.
The first surface B1, the second surface B2, and the third surface B3 are located on opposite sides of the electrical contact surface 32 in the second direction.

As shown in FIG. 10, the holder 60 has a contact surface 61 that supports the substrate 31, an adhesive surface 62 that is farther from the substrate 31 than the contact surface 61, and a connecting surface 63 that connects the adhesive surface 62 and the contact surface 61. A first wall 64 surrounding the contact surface 61, and an adhesive 65 (see FIG. 13) for adhering the IC chip 230 and the adhesive surface 62 are provided.

The contact surface 61 is a surface that contacts the back surface 31B of the substrate 31. An adhesive surface 62 is arranged substantially at the center of the contact surface 61.
The contact surface 61 has a first contact surface 61A that contacts the first surface B1 and a second contact surface 61B that contacts the second surface B2.

The adhesive surface 62 is a surface that faces the back surface 31B of the substrate 31 at intervals. The adhesive surface 62 faces the third surface B3 in the second direction. The adhesive surface 62 is farther from the third surface B3 than the first contact surface 61A and the second contact surface 61B. The adhesive surface 62 is located between the first contact surface 61A and the second contact surface 61B in the second direction.
The adhesive surface 62 includes a first adhesive surface 62A that is separated from the third surface B3 by a predetermined distance, a second adhesive surface 62B that is farther from the third surface B3 than the first adhesive surface 62A, and a first adhesive surface 62A. It has a connecting surface 62C that connects the second adhesive surface 62B.

The outer shape of the first adhesive surface 62A is a rounded rectangle in which both ends of a rectangle long in the horizontal direction are semicircular when viewed from the vertical direction. A bottomed hole 62D that is recessed inward in the vertical direction is formed at a substantially central portion of the first adhesive surface 62A. The hole 62D is a hole into which the storage medium 33 enters (see FIG. 11). The shape of the hole 62D is a rectangle that is long in the horizontal direction when viewed from the vertical direction. The bottom surface of the hole 62D is a second adhesive surface 62B.

The second adhesive surface 62B is provided with two mark portions 22C and a through hole 62E as an example of the opening. Each mark portion 22C has a structure substantially similar to that of the first embodiment. The mark portions 22C are arranged at intervals in the left-right direction.

The through hole 62E penetrates the wall of the holder 60, specifically, the wall 66 (see FIG. 11) forming the second adhesive surface 62B. The shape of the through hole 62E is rectangular when viewed from the vertical direction. The through holes 62E are arranged between the mark portions 22C in the left-right direction.

The connecting surface 63 has two curved surfaces 63A having an arc shape centered on the mark portion 22C when viewed in the vertical direction, that is, in a direction orthogonal to the contact surface 61, so as to correspond to each mark portion 22C. ..
The length of the connecting surface 63 in the second direction can be, for example, 0.5 mm. The length of the storage medium 33 in the second direction can be, for example, 0.7 mm. That is, the length of the storage medium 33 in the second direction is larger than the length of the connecting surface 63 in the second direction.
Further, the length of the connecting surface 62C connecting the first adhesive surface 62A and the second adhesive surface 62B in the second direction can be, for example, 0.8 mm. That is, the distance from the contact surface 61 to the second adhesive surface 62B in the second direction is larger than the length of the storage medium 33 in the second direction.

The first wall 64 is formed in a rectangular tubular shape so as to surround the contact surface 61. The first wall 64 projects outward in the vertical direction from the contact surface 61. Specifically, the first wall 64 projects outward in the vertical direction from the surface 31A (specifically, the electrical contact surface 32) of the substrate 31 attached so as to come into contact with the contact surface 61 (see FIG. 11). The first wall 64 has a third side wall 610, a fourth side wall 620, a first side wall 630, and a second side wall 640.

The third side wall 610 is located on the lateral side of the contact surface 61 in the left-right direction. The fourth side wall 620 is located on the opposite side of the third side wall 610 with the substrate 31 interposed therebetween.

The first side wall 630 connects one ends of the third side wall 610 and the fourth side wall 620 in the front-rear direction. The first side wall 630 has a first positioning portion 631, a second positioning portion 632, and a protruding portion 633. The first positioning portion 631, the second positioning portion 632, and the protruding portion 633 project from the inner surface of the first side wall 630 in the front-rear direction toward the second side wall 640. The first positioning portion 631, the second positioning portion 632, and the protruding portion 633 are arranged at intervals in the left-right direction. The protruding portion 633 is arranged between the first positioning portion 631 and the second positioning portion 632 in the left-right direction. The first positioning portion 631 is separated from the fourth side wall 620 in the left-right direction. The second positioning portion 632 is separated from the third side wall 610 in the left-right direction.

As shown in FIG. 12A, the first positioning portion 631 and the second positioning portion 632 project inward in the front-rear direction with respect to the protruding portion 633. Further, the tips of the first positioning unit 631 and the second positioning unit 632 on the inner side in the front-rear direction are arranged at the same positions in the front-rear direction. As a result, as shown in FIG. 12B, the first positioning unit 631 and the second positioning unit 632 come into contact with the end portion of the substrate 31 in the direction along the contact surface 61, specifically in the front-rear direction.

Further, the first side wall 630 has a recess 634 into which the convex portion 231D provided at one end in the front-rear direction of the substrate 31 enters. The recess 634 is located between the second positioning portion 632 and the protrusion 633. The recess 634 is formed so as to be recessed outward in the front-rear direction from the respective tips of the second positioning portion 632 and the protrusion 633. The recess 634 is open toward the inside in the front-rear direction and the outside in the up-down direction.

The second side wall 640 connects the other ends of the third side wall 610 and the fourth side wall 620 in the front-rear direction. The second side wall 640 has a first protruding portion 641, a second protruding portion 642, a third protruding portion 643, and a holding portion 644. Each of the projecting portions 641 to 643 projects from the inner surface of the second side wall 640 in the front-rear direction toward the first side wall 630. The protrusions 641 to 643 are arranged so as to be spaced apart from each other in the left-right direction. The second protruding portion 642 is arranged between the first protruding portion 641 and the third protruding portion 643 in the left-right direction. The first protruding portion 641 is separated from the fourth side wall 620 in the left-right direction. The third protrusion 643 is separated from the third side wall 610 in the left-right direction.

The holding portion 644 is a portion that sandwiches and holds the substrate 31 between the positioning portions 631 and 632. The holding portion 644 contacts the end portion of the substrate 31 in the third direction, that is, in the lateral direction of the substrate 31.

The holding portion 644 projects from the tip inside the second protruding portion 642 in the front-rear direction toward the first side wall 630. The holding portion 644 is formed in a triangular columnar shape having a pointed tip portion, which is an end portion on the first side wall 630 side. The tip of the holding portion 644 sharpened in this way is more easily deformed than the positioning portions 631 and 632.

The tip of the holding portion 644 is arranged inside the contact surface 61 in the front-rear direction. That is, the tip end portion of the holding portion 644, that is, the portion in contact with the substrate 31, is separated from the contact surface 61.

Further, the second side wall 640 has a recess 645 into which the convex portion 231C provided at the other end of the substrate 31 in the front-rear direction enters. The recess 645 is located between the second protrusion 642 and the third protrusion 643. The recess 645 is formed so as to be recessed outward in the front-rear direction from the respective tips of the second protrusion 642 and the third protrusion 643. The recess 645 is open toward the inside in the front-rear direction and the outside in the up-down direction.

Next, a method of manufacturing the developing cartridge 2, particularly a method of attaching the IC chip 230 to the holder 60 will be described.
As shown in FIG. 12A, first, the adhesive 25 is applied to each mark portion 22C of the second adhesive surface 62B (first step). Specifically, the adhesive 25 is applied so that the adhesive 25 projects outward in the vertical direction from the contact surface 61. At this time, as shown in the figure, the adhesive 25 may be applied onto the first adhesive surface 62A.

Next, the IC chip 230 is tilted obliquely so that one end of the substrate 31 in the front-rear direction is brought into contact with each of the positioning portions 631, 632. After that, the other end of the substrate 31 in the front-rear direction is pressed against the holding portion 644, and the holding portion 644 is crushed and pushed toward the contact surface 61. While pushing the other end of the substrate 31 in this way, as shown in FIG. 12B, the substrate 31 is brought into contact with the adhesive 25 on the adhesive surface 62 while being in contact with the contact surface 61 (No. 1). 2 steps). At this time, the portion of the holding portion 644 crushed by the substrate 31 is extruded onto the first adhesive surface 62A arranged at a position one step lower than the contact surface 61.

When the substrate 31 is brought into contact with the contact surface 61, the adhesive 25 is crushed between the substrate 31 and the adhesive surface 62, and the adhesive 25 spreads radially outward of the mark portion 22C. As a result, a part of the adhesive 25 enters the through hole 62E. Therefore, as shown in FIG. 13, the operator can confirm the adhesive 25 from the through hole 62E after the second step (third step).

After that, as shown in FIG. 9, the holder 60 to which the IC chip 230 is fixed and the compression coil spring SP are assembled to the base member 70. Then, as shown in FIG. 8, the unit composed of the holder 60 and the like is assembled to the cover member 50 so as to be sandwiched between the first cover 51 and the second cover 52.

As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained, and the following effects can be obtained.
Since the holding portion 644 is brought into contact with the substrate 31 in the lateral direction of the substrate 31, the maximum length of the portion to which the substrate 31 is attached is shortened as compared with a structure in which the holding portion is brought into contact with the substrate in the longitudinal direction, for example. Can be done.

The connecting surface 63 has a curved surface 63A having an arc shape when viewed from the second direction. Therefore, the adhesive 25 applied to the first adhesive surface 62A and the second adhesive surface 62B easily spreads over the entire first adhesive surface 62A and the second adhesive surface 62B. As a result, the thickness of the adhesive 25 can be made more uniform.
Further, since the connecting surface 63 has a curved surface 63A having an arc shape centered on the mark portion 22C when viewed from a direction orthogonal to the contact surface 61, the distance between the curved surface 63A of the connecting surface 63 and the mark portion 22C is equalized. Can be. Therefore, it is possible to prevent the adhesive 25 applied to the mark portion 22C from spreading and reaching the contact surface 61, and it is possible to increase the area of the contact surface 61.

Since the mark portion 22C is provided on the second adhesive surface 62B arranged at a position one step lower than the first adhesive surface 62A, the adhesive 25 spreads toward the contact surface 61 so that the first adhesive surface 62A It can be suppressed by the stepped surface between the surface and the second adhesive surface 62B.

[Third Embodiment]
Next, the third embodiment of the present invention will be described in detail with reference to the drawings as appropriate. Since this embodiment is a modification of a part of the structure of the first embodiment described above, the same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be described. It will be omitted.

As shown in FIGS. 14A and 14B, the holder 320 according to the third embodiment has a contact surface 321 and an adhesive surface 322. The adhesive surface 322 has a first adhesive surface 322A and a second adhesive surface 322B.

The contact surface 321 comes into contact with the third surface B3 of the substrate 31. The contact surface 321 has a hole 22D into which the storage medium 33 enters.

The first adhesive surface 322A faces the first surface B1 of the substrate 31 in the second direction. The first adhesive surface 322A is farther from the first surface B1 of the substrate 31 than the contact surface 321. The first adhesive surface 322A has two mark portions 22C that serve as marks when the adhesive 25 is applied. The adhesive 25 adheres the first adhesive surface 332A and the first adhesive surface B1.

The second adhesive surface 322B faces the second surface B2 in the second direction. The second adhesive surface 322B is farther from the second surface B2 than the contact surface 321. The second adhesive surface 322B is located on the opposite side of the first adhesive surface 322A with respect to the contact surface 321. The second adhesive surface 322B has two mark portions 22C that serve as marks when the adhesive 25 is applied. The adhesive 25 adheres the second adhesive surface 332B and the second adhesive surface B2.

The holder 320 has a first side wall W1, a second side wall W2, a third side wall W3, and a fourth side wall W4, which are substantially the same as those in the first embodiment. The third side wall W3 has a recess W31 substantially similar to that of the first embodiment. The recess W31 communicates the space between the second adhesive surface 322B and the second surface B2 with the outside of the third side wall W3. As a result, the adhesive 25 applied between the second adhesive surface 322B and the second adhesive surface B2 can be visually recognized from the outside.

The fourth side wall W4 has a recess W41 substantially similar to that of the first embodiment. The recess W41 communicates the space between the first adhesive surface 322A and the first surface B1 with the outside of the fourth side wall W4. As a result, the adhesive 25 applied between the first adhesive surface 322A and the first adhesive surface B1 can be visually recognized from the outside.

The second side wall W2 has a holding portion W21 substantially similar to that of the first embodiment. The contact surface 321 has a recess 321A recessed in a direction away from the substrate 31 at a position facing the holding portion W21 in the second direction. As a result, when the substrate 31 is attached, a part of the holding portion W21 crushed by the substrate 31 can be accommodated in the recess 321A.

The present invention is not limited to the above embodiment, and can be used in various forms as illustrated below.

In the above embodiment, as the IC chip, a contact type IC chip having an electrical contact surface 32 is exemplified, but the present invention is not limited to this, and the IC chip may be, for example, a non-contact type IC chip. good.

Each element described in the above-described embodiment and modification may be arbitrarily combined and implemented.

1 Development cartridge 20 Holder 21 Contact surface 22 Adhesive surface 23 Connecting surface 25 Adhesive 30 IC chip 31 Substrate 31B Back side

Claims (23)

A housing that extends in the first direction and houses toner,
An IC chip having a storage medium and an electrical contact surface,
A holder for holding the IC chip, including a holder located at one end of the housing in the first direction.
The IC chip is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The holder
With the first contact surface in contact with the first surface,
With the second contact surface in contact with the second surface,
An adhesive surface that faces the third surface in the second direction and is separated from the first contact surface and the third surface by the second contact surface, and is the first contact surface and the second contact surface. Adhesive surface located between and
A first side wall that constitutes a first wall that surrounds the first contact surface and the second contact surface, and is a first side wall that comes into contact with the IC chip.
A second side wall that constitutes the first wall, and a second side wall that is located at a distance from the first side wall.
It has a holding portion extending from the second side wall toward the first side wall and sandwiching the IC chip with the first side wall.
A developing cartridge comprising an adhesive for adhering the adhesive surface and the third surface. The electrical contact surface is
With the first electrical contact surface,
It has a second electrical contact surface that is aligned with the first electrical contact surface in the first direction.
The holding portion includes a developing cartridge according to claim 1, characterized in that contact with the IC chip in the first direction. The electrical contact surface is
With the first electrical contact surface,
It has a second electrical contact surface that is aligned with the first electrical contact surface in the first direction.
The holding portion, in a third direction crossing the first direction and the second direction, the developing cartridge according to claim 1, characterized in that contact with the IC chip. The holding portion includes a developing cartridge as claimed in any one of claims 3, characterized in that easily deformed than the first side wall. The developing cartridge according to claim 4 , wherein the holding portion is located between the first contact surface and the second contact surface and faces the adhesive surface in the second direction. The holding part is
A first holding surface facing the adhesive surface in the second direction,
It has a second holding surface located on the opposite side of the first holding surface in the second direction.
Developing the second holding surface, as approaching from the second side wall to said first side wall, according to claims 1, characterized in that inclined so as to approach the said adhesive surface to one of the claims 5 cartridge. A housing that extends in the first direction and houses toner,
An IC chip having a storage medium and an electrical contact surface,
A holder for holding the IC chip, including a holder located at one end of the housing in the first direction.
The IC chip is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The holder
With the first contact surface in contact with the first surface,
With the second contact surface in contact with the second surface,
An adhesive surface that faces the third surface in the second direction and is separated from the first contact surface and the third surface by the second contact surface, and is the first contact surface and the second contact surface. Adhesive surface located between and
It is a first side wall that constitutes a first wall that surrounds the first contact surface, and has a first side wall that comes into contact with the IC chip.
The IC chip is
It has a convex portion located closer to the other end of the IC chip in the first direction than the one end of the IC chip in the first direction.
The first side wall is
It has a concave portion into which the convex portion enters, and has a concave portion.
A developing cartridge comprising an adhesive for adhering the adhesive surface and the third surface. A housing that extends in the first direction and houses toner,
An IC chip having a storage medium and an electrical contact surface,
Wherein a holder for holding the IC chip, and the holder located at one end portion of the housing in the first direction, a developing cartridge Ru provided with,
The IC chip is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The holder
With the first contact surface in contact with the first surface,
With the second contact surface in contact with the second surface,
An adhesive surface that faces the third surface in the second direction and is separated from the first contact surface and the third surface by the second contact surface, and is the first contact surface and the second contact surface. Adhesive surface located between and
It is a first side wall that constitutes a first wall that surrounds the first contact surface, and has a first side wall that comes into contact with the IC chip.
The developing cartridge includes an adhesive that adheres the adhesive surface to the third surface.
The first side wall is a developing cartridge having an opening for exposing the adhesive to the outside. The IC chip is
It has a convex portion located closer to the other end of the IC chip in the first direction than the one end of the IC chip in the first direction.
The first side wall is
The developing cartridge according to any one of claims 1 to 6 and 8 , wherein the convex portion has a concave portion into which the convex portion enters. It said first side wall, the developing cartridge according to any one of claims 1 to 9, characterized in that it comprises an opening exposing the adhesive to the outside. The developing cartridge according to claim 10 , wherein the opening is located on the opposite side of the housing with the IC chip sandwiched in the first direction. A housing that extends in the first direction and houses the toner,
An IC chip having a storage medium and an electrical contact surface,
A holder for holding the IC chip, including a holder located at one end of the housing in the first direction.
The IC chip is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The holder
With the first contact surface in contact with the first surface,
With the second contact surface in contact with the second surface,
An adhesive surface that faces the third surface in the second direction and is separated from the first contact surface and the third surface by the second contact surface, and is the first contact surface and the second contact surface. Adhesive surface located between and
It has a connecting surface that connects the first contact surface and the adhesive surface.
The connecting surface has a curved surface having an arc shape when viewed from the second direction.
A developing cartridge comprising an adhesive for adhering the adhesive surface and the third surface. The developing cartridge according to any one of claims 1 to 12, wherein a developing roller that is rotatable about a first axis extending in the first direction is provided. The developing cartridge according to any one of claims 1 to 13, wherein the adhesive surface has a hole into which the storage medium enters. The adhesive surface is
The developing cartridge according to any one of claims 1 to 14 , wherein the developing cartridge has a mark portion formed so as to be recessed in the second direction. The developing cartridge according to claim 15 , wherein the mark portion is a plurality. The holder has a connecting surface that connects the first contact surface and the adhesive surface.
The developing cartridge according to any one of claims 1 to 11 and 13 to 16 , wherein the connecting surface has a curved surface having an arc shape when viewed from the second direction. .. The adhesive surface is
The first adhesive surface and
The developing cartridge according to any one of claims 1 to 17 , wherein the developing cartridge has a second adhesive surface that is farther from the third surface than the first adhesive surface. The second adhesive surface is
The developing cartridge according to claim 18 , further comprising a mark portion formed so as to be recessed in the second direction. A housing that extends in the first direction and houses toner,
An IC chip having a storage medium and an electrical contact surface,
A holder for holding the IC chip, including a holder located at one end of the housing in the first direction.
The IC chip is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The holder
With the first contact surface in contact with the first surface,
With the second contact surface in contact with the second surface,
An adhesive surface that faces the third surface in the second direction and is separated from the first contact surface and the third surface by the second contact surface, and is the first contact surface and the second contact surface. Adhesive surface located between and
The first side wall forming the first contact surface and the first wall surrounding the second contact surface, and
A second side wall that constitutes the first wall, and a second side wall that is located at a distance from the first side wall.
It has a holding portion extending from the second side wall to the first side wall and sandwiching the IC chip between the first side wall and the first side wall.
A method for manufacturing a developing cartridge provided with an adhesive for adhering the adhesive surface and the third surface.
The first step of applying the adhesive to the adhesive surface and
A second step of bringing the third surface into contact with the adhesive while the first surface and the second surface are in contact with the first contact surface and the second contact surface is provided.
In the second step, when the third surface is brought into contact with the adhesive, the first surface and the second surface are brought into contact with the first contact surface and the second contact surface while crushing the holding portion. A method for manufacturing a developing cartridge, which is characterized in that the film is processed. A housing that extends in the first direction and houses toner,
An IC chip having a storage medium and an electrical contact surface,
Wherein a holder for holding the IC chip, said a holder positioned at one end of the housing, a manufacturing method of the developing cartridge Ru with a in the first direction,
The IC chip is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The holder
With the first contact surface in contact with the first surface,
With the second contact surface in contact with the second surface,
An adhesive surface that faces the third surface in the second direction and is separated from the first contact surface and the third surface by the second contact surface, and is the first contact surface and the second contact surface. Adhesive surface located between and
It has a first contact surface and a first side wall forming a first wall surrounding the second contact surface .
The developing cartridge includes an adhesive that adheres the adhesive surface to the third surface .
The first side wall is a method for manufacturing a developing cartridge further having an opening for exposing the adhesive to the outside.
The first step of applying the adhesive to the adhesive surface and
A second step of bringing the third surface into contact with the adhesive while the first surface and the second surface are in contact with the first contact surface and the second contact surface.
A method for manufacturing a developing cartridge , which comprises, after the second step, a third step of confirming the adhesive from the opening. An IC chip having a storage medium and a substrate, and a holder for holding the substrate are provided.
The holder
A contact surface that contacts the holder-side surface of the substrate,
An adhesive surface that faces the holder-side surface of the substrate and is farther from the substrate than the contact surface.
A connecting surface that connects the adhesive surface and the contact surface and has a curved surface having an arc shape when viewed from a second direction intersecting with the substrate .
A developing cartridge comprising an adhesive for adhering the IC chip and the adhesive surface. The IC chip has an electrical contact surface and has an electrical contact surface.
The substrate is
A first surface located on the opposite side of the electrical contact surface in a second direction intersecting the electrical contact surface,
A second surface located on the opposite side of the electrical contact surface in the second direction, and a second surface located at a distance from the first surface.
It has a third surface located on the opposite side of the electrical contact surface in the second direction, and has a third surface located between the first surface and the second surface.
The contact surface is in contact with the third surface,
The adhesive surface is
With the first adhesive surface facing the first surface and away from the first surface than the contact surface in the second direction.
In the second direction, it is a second adhesive surface facing the second surface and away from the second surface from the contact surface, and is located on the opposite side of the first adhesive surface with respect to the contact surface. The developing cartridge according to claim 22, wherein the developing cartridge has a second adhesive surface.

Images