JP6918468B2 - Reinforcing film with separator - Google Patents

Description

The present invention relates to a reinforcing film with a separator.

In order to impart rigidity and impact resistance to an optical member or an electronic member, a reinforcing film with a separator may be previously attached to the exposed surface side of the optical member or the electronic member to reinforce the optical member or the electronic member (Patent Document). 1).

However, when the separator is peeled off from the reinforcing film with a separator attached to the exposed surface side of the optical member or the electronic member, there is a problem that the peeling charge is generated and the optical member or the electronic member is damaged.

Japanese Unexamined Patent Publication No. 2014-234460

An object of the present invention is a reinforcing film with a separator having a reinforcing film and a separator, which can suppress peeling charge that may occur when the separator is peeled off, and is previously attached to an exposed surface side of an optical member, an electronic member, or the like. It is an object of the present invention to provide a reinforcing film with a separator, which can reduce damage to the optical member and the electronic member even if the separator is peeled off from the combined reinforcing film with the separator.

The reinforcing film with a separator of the present invention
A reinforcing film with a separator having a reinforcing film P and a separator Q.
The reinforcing film P includes a base material layer A1 and an adhesive layer A2.
The separator Q contains a release layer B1 and a base material layer B2.
The pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated with each other.
When the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min, the peeling band voltage on the surface of the pressure-sensitive adhesive layer A2 is 5. It is 0.0 kV or less.

In one embodiment, the pressure-sensitive adhesive layer A2 is a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition a2, and the pressure-sensitive adhesive composition a2 is at least one selected from a silicone-based additive and a fluorine-based additive. including.

In one embodiment, the silicone-based additive is at least one selected from a siloxane bond-containing compound, a hydroxyl group-containing silicone-based compound, and a crosslinkable functional group-containing silicone-based compound.

In one embodiment, the fluorine-based additive is at least one selected from a fluorine-containing compound, a hydroxyl group-containing fluorine-based compound, and a crosslinkable functional group-containing fluorine-based compound.

In one embodiment, the pressure-sensitive adhesive composition a2 contains a conductive component.

In one embodiment, the pressure-sensitive adhesive layer A2 when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min. The surface resistance value of the surface is 1.0 × 10 ⁴ Ω to 1.0 × 10 ¹² Ω.

In one embodiment, the reinforcing film P includes an antistatic layer A3, a base material layer A1, and an adhesive layer A2 in this order.

In one embodiment, the separator Q includes a release layer B1, a substrate layer B2, and an antistatic layer B3 in that order.

In one embodiment, the pressure-sensitive adhesive to a glass plate after peeling the separator Q from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min. The initial adhesive strength of layer A2 at a temperature of 23 ° C., a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is 1.0 N / 25 mm or more.

In one embodiment, the peeling force when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 180 degrees and a tensile speed of 300 mm / min is 0.30 N / min. It is 25 mm or less.

According to the present invention, a reinforcing film with a separator having a reinforcing film and a separator can suppress peeling charge that may occur when the separator is peeled off, and is previously attached to an exposed surface side of an optical member, an electronic member, or the like. It is possible to provide a reinforcing film with a separator that can reduce damage to the optical member and the electronic member even if the separator is peeled off from the combined reinforcing film with the separator.

It is the schematic sectional drawing of one Embodiment of the reinforcing film P. It is the schematic sectional drawing of another embodiment of the reinforcing film P. It is the schematic sectional drawing of one Embodiment of separator Q. FIG. 5 is a schematic cross-sectional view of another embodiment of the separator Q. It is the schematic sectional drawing of one Embodiment of the reinforcing film with a separator of this invention. It is schematic cross-sectional view of another embodiment of the reinforcing film with a separator of this invention. It is schematic cross-sectional view of another embodiment of the reinforcing film with a separator of this invention. It is schematic cross-sectional view of another embodiment of the reinforcing film with a separator of this invention.

When the expression "mass" is used in the present specification, it may be read as "weight" which is generally used as a unit of weight in the past, and conversely, the expression "weight" in the present specification. If there is, it may be read as "mass" which is commonly used as an SI system unit indicating weight.

In the present specification, the expression "(meth) acrylic" means "acrylic and / or methacrolein", and the expression "(meth) acrylate" means "acrylate and / or methacrylate". When the expression "(meth) allyl" is used, it means "allyl and / or methacrolein", and when the expression "(meth) acrolein" is used, "acrolein and / or methacrolein" is used. It means "rain".

≪≪Reinforcing film with separator≫≫
The reinforcing film with a separator of the present invention is a reinforcing film with a separator having a reinforcing film P and a separator Q. The reinforcing film with a separator of the present invention may have any suitable other layer as long as it has the reinforcing film P and the separator Q, as long as the effect of the present invention is not impaired.

In the reinforcing film with a separator of the present invention, the reinforcing film P contains the base material layer A1 and the pressure-sensitive adhesive layer A2, the separator Q contains the release layer B1 and the base material layer B2, and the pressure-sensitive adhesive layer A2 and the mold release Layer B1 is directly laminated.

As the thickness of the reinforcing film with a separator of the present invention, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 9 μm to 1300 μm, more preferably 20 μm to 1050 μm, further preferably 35 μm to 900 μm, and particularly preferably 45 μm to 750 μm.

≪Reinforcing film P≫
As the thickness of the reinforcing film P, any appropriate thickness can be adopted depending on the intended purpose as long as the effect of the present invention is not impaired. Such a thickness is preferably 5 μm to 800 μm, more preferably 10 μm to 650 μm, further preferably 20 μm to 550 μm, and particularly preferably 25 μm to 450 μm.

The reinforcing film P includes a base material layer A1 and an adhesive layer A2. As long as the reinforcing film P contains the base material layer A1 and the pressure-sensitive adhesive layer A2, it may contain any other suitable layer depending on the purpose, as long as the effect of the present invention is not impaired.

As shown in FIG. 1, one embodiment of the reinforcing film P comprises a base material layer A1 and an adhesive layer A2.

The reinforcing film P may include the antistatic layer A3, the base material layer A1, and the pressure-sensitive adhesive layer A2 in this order.

Another embodiment of the reinforcing film P comprises an antistatic layer A3, a base material layer A1 and an adhesive layer A2, as shown in FIG.

<Base material layer A1>
As the base material layer A1, a base material formed from any suitable material can be adopted depending on the intended purpose, as long as the effects of the present invention are not impaired. Examples of such materials include resin sheets, non-woven fabrics, paper, metal foils, woven fabrics, rubber sheets, foam sheets, and laminates thereof (particularly, laminates including resin sheets).

Examples of the resin constituting the resin sheet include acrylic resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polymethyl methacrylate (PMMA), polycarbonate, and triacetyl cellulose (TAC). ), Polysulfone, polyallylate, polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), polyamide (nylon), total aromatic polyamide (aramid), polyimide ( PI), polyvinyl chloride (PVC), polyvinyl acetate, polyphenylene sulfide (PPS), fluororesin, polyether ether ketone (PEEK), cyclic olefin polymer and the like.

Examples of the non-woven fabric include non-woven fabrics made of natural fibers having heat resistance such as non-woven fabrics containing Manila hemp; synthetic resin non-woven fabrics such as polypropylene resin non-woven fabrics, polyethylene resin non-woven fabrics and ester resin non-woven fabrics.

The base material layer A1 may be only one layer or may be two or more layers.

As the thickness of the base material layer A1, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, further preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm.

The base material layer A1 may contain an antistatic agent. As the base material layer A1 containing the antistatic agent, for example, a resin sheet in which the antistatic agent is kneaded can be used. Such a resin sheet can be formed from a composition for forming a base material layer A1 containing a resin and an antistatic agent.

The base material layer A1 itself may act as an antistatic agent. For example, when a metal foil is used as the material of the base material layer A1, the base material layer A1 itself can act as an antistatic agent.

The base material layer A1 may be surface-treated. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, ionizing radiation treatment, coating treatment with an undercoat agent, and the like.

Examples of the organic coating material include the materials described in "Plastic Hard Coat Material II" (CMC Publishing, (2004)). Such organic coating materials preferably include urethane-based polymers, and more preferably polyacrylic urethane, polyester urethane, or precursors thereof. This is because coating / coating on the base material layer A1 is easy, and various types can be industrially selected and can be obtained at low cost. Examples of such urethane-based polymers include polymers composed of a reaction mixture of an isocyanato monomer and an alcoholic hydroxyl group-containing monomer (for example, a hydroxyl group-containing acrylic compound or a hydroxyl group-containing ester compound). The organic coating material may contain, as an optional additive, a chain extender such as polyamine, an antiaging agent, an oxidation stabilizer and the like.

The base material layer A1 may contain any other suitable additive, depending on the intended purpose, as long as the effects of the present invention are not impaired.

<Adhesive layer A2>
As the thickness of the pressure-sensitive adhesive layer A2, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 1 μm to 300 μm, more preferably 2 μm to 250 μm, further preferably 4 μm to 200 μm, and particularly preferably 5 μm to 150 μm.

The pressure-sensitive adhesive layer A2 may be only one layer or two or more layers.

The pressure-sensitive adhesive layer A2 is preferably formed from the pressure-sensitive adhesive composition a2. The pressure-sensitive adhesive layer A2 can be formed by any suitable method as long as the pressure-sensitive adhesive composition a2 can be formed in layers. For example, the pressure-sensitive adhesive layer A2 can be formed by applying the pressure-sensitive adhesive composition a2 on an arbitrary suitable base material and subjecting it to heating or the like or irradiation with active energy rays (ultraviolet rays or the like) as necessary. You can. The pressure-sensitive adhesive composition a2 preferably contains a polymer component.

The pressure-sensitive adhesive composition a2 preferably contains at least one selected from a silicone-based additive and a fluorine-based additive. By containing at least one selected from the silicone-based additive and the fluorine-based additive in the pressure-sensitive adhesive composition a2, the peeling charge that may occur when the separator is peeled off from the reinforcing film with a separator of the present invention is further suppressed. Even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side of the optical member or the electronic member, damage to the optical member or the electronic member can be further reduced.

When the pressure-sensitive adhesive composition a2 contains at least one selected from the silicone-based additive and the fluorine-based additive, the pressure-sensitive adhesive composition a2 contains at least one selected from the silicone-based additive and the fluorine-based additive. The ratio is preferably 0.01 parts by weight to 10 parts by weight, and more preferably 0.02 parts by weight to 5.0 parts by weight, based on 100 parts by weight of the polymer component (solid content) in the pressure-sensitive adhesive composition a2. Parts, more preferably 0.03 parts by weight to 4.0 parts by weight, and particularly preferably 0.04 parts by weight to 3.0 parts by weight. If the content ratio of at least one selected from the silicone-based additive and the fluorine-based additive in the pressure-sensitive adhesive composition a2 is within the above range, it occurs when the separator is peeled off from the reinforcing film with a separator of the present invention. The obtained peeling charge can be further suppressed, and even if the separator is peeled off from the reinforcing film with a separator previously attached to the exposed surface side of the optical member or the electronic member, the damage to the optical member or the electronic member can be further reduced. ..

The silicone-based additive is preferably at least one selected from a siloxane bond-containing compound, a hydroxyl group-containing silicone-based compound, and a crosslinkable functional group-containing silicone-based compound.

Examples of the siloxane bond-containing compound include polyether-modified polyorganosiloxane in which a polyether group is introduced into the main chain or side chain of a polyorganosiloxane skeleton (polydimethylsiloxane, etc.), and the main chain or side chain of a polyorganosiloxane skeleton. Polyester-modified polyorganosiloxane with a polyester group introduced, organic compound-introduced polyorganosiloxane with an organic compound introduced into the main or side chains of the polyorganosiloxane skeleton, and silicone-modified with polyorganosiloxane introduced into a (meth) acrylic resin ( Meta) Acrylic resin, silicone-modified organic compound in which polyorganosiloxane is introduced into an organic compound, silicone-containing organic compound obtained by copolymerizing an organic compound and a silicone compound, and the like can be mentioned. Commercially available products of siloxane bond-containing compounds include, for example, the brand name "LE-302" (manufactured by Kyoeisha Chemical Co., Ltd.) and the BYK series leveling agents ("BYK-300", "BYK-" manufactured by Big Chemie Japan Co., Ltd.). 301/302 ”,“ BYK-306 ”,“ BYK-307 ”,“ BYK-310 ”,“ BYK-315 ”,“ BYK-313 ”,“ BYK-320 ”,“ BYK-322 ”,“ BYK- 323 ”,“ BYK-325 ”,“ BYK-330 ”,“ BYK-331 ”,“ BYK-333 ”,“ BYK-337 ”,“ BYK-341 ”,“ BYK-344 ”,“ BYK-345 / 346 "," BYK-347 "," BYK-348 "," BYK-349 "," BYK-370 "," BYK-375 "," BYK-377 "," BYK-378 "," BYK-UV3500 " , "BYK-UV3510", "BYK-UV3570", "BYK-3550", "BYK-SILCLEAN3700", "BYK-SILCLEAN3720", etc.), AC series leveling agents manufactured by Algin Chemie ("AC FS180", "AC FS180", " AC FS360 ", AC S20", etc.), Polyflow series leveling agents manufactured by Kyoeisha Chemical Co., Ltd. ("Polyflow KL-400X", "Polyflow KL-400HF", "Polyflow KL-401", "Polyflow KL-" 402 ”,“ Polyflow KL-403 ”,“ Polyflow KL-404 ”, etc.), KP series leveling agents manufactured by Shin-Etsu Chemical Co., Ltd. (“KP-323”, “KP-326”, “KP-341” , "KP-104", "KP-110", "KP-112", etc.), Shin-Etsu Chemical's X22 series, KF series, etc., Toray Dow Corning Co., Ltd. leveling agent ("LP-7001" , "LP-7002", "8032ADDITIVE", "57ADDITIVE", "L-7604", "FZ-2110", "FZ-2105", "67ADDITIVE", "8618ADDITIVE", "3ADDITIVE", "56ADDITIVE", etc.) And so on. The siloxane bond-containing compound may be only one kind or two or more kinds.

Examples of the hydroxyl group-containing silicone compound include a polyether-modified polyorganosiloxane in which a polyether group is introduced into the main chain or side chain of a polyorganosiloxane skeleton (polydimethylsiloxane, etc.) and having a hydroxyl group, and a polyorganosiloxane. A polyester-modified polyorganosiloxane having a polyester group introduced into the main chain or side chain of the skeleton and having a hydroxyl group, or an organic compound-introduced polyorganosiloxane having an organic compound introduced into the main chain or side chain of the polyorganosiloxane skeleton. A silicone-modified (meth) acrylic resin in which polyorganosiloxane is introduced into a (meth) acrylic resin, which has a hydroxyl group, and a silicone-modified organic compound in which polyorganosiloxane is introduced into an organic compound. Examples thereof include those having a hydroxyl group, and silicone-containing organic compounds obtained by copolymerizing an organic compound and a silicone compound and having a hydroxyl group. Commercially available products of hydroxyl group-containing silicone compounds include, for example, trade names "X-22-4015", "X-22-4039", "KF6000", "KF6001", "KF6002", "KF6003", "X-". 22-170BX, "X-22-170DX", "X-22-176DX", "X-22-176F" (manufactured by Shin-Etsu Chemical Co., Ltd.), "BYK-370" manufactured by Big Chemie Japan Co., Ltd. , "BYK-SILCLEAN3700", "BYK-SILCLEAN3720" and the like. The hydroxyl group-containing silicone compound may be only one kind or two or more kinds.

The crosslinkable functional group-containing silicone compound is, for example, a polyether-modified polyorganosiloxane in which a polyether group is introduced into the main chain or side chain of a polyorganosiloxane skeleton (polydimethylsiloxane, etc.) and has a crosslinkable functional group. Those having, polyester-modified polyorganosiloxane in which a polyester group is introduced into the main chain or side chain of the polyorganosiloxane skeleton and having a crosslinkable functional group, organic compounds introduced into the main chain or side chain of the polyorganosiloxane skeleton Organic compound-introduced polyorganosiloxane having a crosslinkable functional group, silicone-modified (meth) acrylic resin in which polyorganosiloxane is introduced into a (meth) acrylic resin and having a crosslinkable functional group, A silicone-modified organic compound obtained by introducing polyorganosiloxane into an organic compound and having a crosslinkable functional group, a silicone-containing organic compound obtained by copolymerizing an organic compound and a silicone compound and having a crosslinkable functional group, and the like can be mentioned. Be done. Examples of the crosslinkable functional group include an amino group, an epoxy group, a mercapto group, a carboxyl group, an isocyanate group and a methacrylate group. Commercially available products of the crosslinkable functional group-containing silicone-based compound include, for example, "BY16-855", BY16-855 "," SF8413 "," BY16-839 "," SF8421 "manufactured by Toray Dow Corning Co., Ltd. "BY16-750", "BY16-880", "BY16-152C", "KF-868", "KF-865", "KF-864", "KF-859", "KF-859" manufactured by Shin-Etsu Chemical Co., Ltd. KF-393 "," KF-860 "," KF-880 "," KF-8004 "," KF-8002 "," KF-8005 "," KF-867 "," KF-8021 "," KF- 869 "," KF-861 "," X-22-343 "," KF-101 "," X-22-9002 "," X-22-3710 "," X-22-2000 "," X- 22-4471 "," KF-1002 "," KF-2001 "," X-22-3701E "," X-22-164 "," X-22-164A "," X-22-164B "," Examples thereof include "X-22-164AS" and "X-22-2445". The crosslinkable functional group-containing silicone compound may be only one kind or two or more kinds.

The fluorine-based additive is preferably at least one selected from a fluorine-containing compound, a hydroxyl group-containing fluorine-based compound, and a crosslinkable functional group-containing fluorine-based compound.

Examples of the fluorine-containing compound include a compound having a fluoroaliphatic hydrocarbon skeleton, a fluorine-containing organic compound obtained by copolymerizing an organic compound and a fluorine compound, and a fluorine-containing compound containing an organic compound. Examples of the fluoroaliphatic hydrocarbon skeleton include fluoroC1-C10 alkanes such as fluoromethane, fluoroethane, fluoropropane, fluoroisopropane, fluorobutane, fluoroisobutane, fluorot-butane, fluoropentane, and fluorohexane. Be done. Examples of commercially available fluorine-containing compounds include leveling agents of the Surflon series manufactured by AGC Seimi Chemical Co., Ltd. (“S-242”, “S-243”, “S-420”, “S-611”, etc. "S-651", "S-386", etc.), BYK series leveling agent manufactured by Big Chemie Japan Co., Ltd. ("BYK-340", etc.), AC series leveling agent manufactured by Algin Chemie ("AC 110a", etc.) , "AC 100a", etc.), DIC Co., Ltd. Megafuck series leveling agents ("Megafuck F-114", "Megafuck F-410", "Megafuck F-444", "Megafuck EXP" TP-2066 "," Mega Fuck F-430 "," Mega Fuck F-472SF "," Mega Fuck F-477 "," Mega Fuck F-552 "," Mega Fuck F-553 "," Mega Fuck F- 554 "," Mega Fuck F-555 "," Mega Fuck R-94 "," Mega Fuck RS-72-K "," Mega Fuck RS-75 "," Mega Fuck F-556 "," Mega Fuck EXP TF " -1367 ”,“ Megafuck EXP TF-1437 ”,“ Megafuck F-558 ”,“ Megafuck EXP TF-1537 ”, etc.), FC series leveling agent manufactured by Sumitomo 3M Co., Ltd. (“FC-4430” , "FC-4432", etc.), Fluorent series leveling agents manufactured by Neos Co., Ltd. , "Futagent AK", "Futagent 501", "Futagent 250", "Futagent 251", "Futagent 222F", "Futagent 208G", "Futagent 300", "Futagent 310" , "Fluorent 400SW", etc.), PF series leveling agents manufactured by Kitamura Chemical Industry Co., Ltd. ("PF-136A", "PF-156A", "PF-151N", "PF-636", "PF" -6320 ”,“ PF-656 ”,“ PF-6520 ”,“ PF-651 ”,“ PF-652 ”,“ PF-3320 ”, etc.) and the like. The fluorine-containing compound may be only one kind or two or more kinds.

As the hydroxyl group-containing fluoropolymer, for example, a conventionally known resin can be used. For example, International Publication No. 94/06870 Pamphlet, JP-A-8-12921, JP-A-10-72569, JP-A-4-275379 Examples thereof include hydroxyl group-containing fluororesins described in Japanese Patent Publication No. 97/11130 Pamphlet, International Publication No. 96/26254 Pamphlet and the like. Examples of other hydroxyl group-containing fluororesins include fluoroolefins described in JP-A-8-231919, JP-A-10-265731, JP-A-10-204374, and JP-A-8-12922. Examples include polymers. In addition, a copolymer of a compound having an alkyl group fluorinated in a hydroxyl group-containing compound, a fluorine-containing organic compound obtained by copolymerizing a fluorine-containing compound with a hydroxyl group-containing compound, a fluorine-containing compound containing a hydroxyl group-containing organic compound, and the like can be mentioned. Commercially available products of hydroxyl group-containing fluorine-based compounds include, for example, the product name "Lumiflon" (manufactured by Asahi Glass Co., Ltd.), the product name "Cefral Coat" (manufactured by Central Glass Co., Ltd.), and the product name "Zaflon" (Toa Synthetic Co., Ltd.). ), Product name "Zefle" (manufactured by Daikin Industries, Ltd.), product names "Mega Fuck F-562", "Mega Fuck F-571", "Fluoronate" (manufactured by DIC Co., Ltd.) and the like. The hydroxyl group-containing fluorine-based compound may be only one kind or two or more kinds.

Examples of the crosslinkable functional group-containing fluorine-based compound include a carboxylic acid compound having a fluorinated alkyl group such as perfluorooctanoic acid and a compound having a fluorinated alkyl group in the crosslinkable functional group-containing compound. Examples thereof include a polymer, a fluorine-containing organic compound obtained by copolymerizing a fluorine-containing compound with a crosslinkable functional group-containing compound, and a fluorine-containing compound containing a crosslinkable functional group-containing compound. Commercially available products of the crosslinkable functional group-containing fluorine-based compound include, for example, the trade names "Mega Fvck F-570", "Mega Fvck RS-55", "Mega Fvck RS-56", and "Mega Fvck RS-72-K". , "Mega Fvck RS-75", "Mega Fvck RS-76-E", "Mega Fvck RS-76-NS", "Mega Fvck RS-78", "Mega Fvck RS-90" (DIC Co., Ltd. (Made) and so on. The crosslinkable functional group-containing fluorine-based compound may be only one kind or two or more kinds.

The pressure-sensitive adhesive composition a2 preferably contains an acrylic polymer as a polymer component. As such an acrylic polymer, preferably, a (meth) acrylic acid alkyl ester having an alkyl group having 4 to 12 carbon atoms (sometimes referred to as "(meth) acrylic acid C4-C12 alkyl ester") is mainly used. It is an acrylic polymer obtained by polymerizing a monomer component containing 1 part by weight to 10 parts by weight of a carboxyl group-containing monomer as a component and 100 parts by weight of the total amount of the monomer component.

The content ratio of the acrylic polymer in the pressure-sensitive adhesive composition a2 is preferably 50% by weight or more, more preferably 50% by weight to 99.99% by weight, still more preferably 55% by weight in terms of solid content. It is ~ 99% by weight, particularly preferably 60% by weight to 95% by weight, and most preferably 70% by weight to 90% by weight.

The effect of the present invention as the (meth) acrylic acid C4-C12 alkyl ester as long as it is a (meth) acrylic acid alkyl ester (acrylic acid alkyl ester, methacrylic acid alkyl ester) having an alkyl group having 4 to 12 carbon atoms. Any suitable (meth) acrylic acid C4-C12 alkyl ester may be used, as long as it does not impair. Examples of such (meth) acrylic acid C4-C12 alkyl ester include (meth) acrylic acid n-butyl, (meth) acrylic acid isobutyl, (meth) acrylic acid s-butyl, and (meth) acrylic acid t-. Butyl, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, (meth) acrylic Nonyl acid acid, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate and the like can be mentioned. Among such (meth) acrylic acid C4-C12 alkyl esters, n-butyl (meth) acrylic acid is preferable.

The (meth) acrylic acid C4-C12 alkyl ester as the main component of the monomer component may be only one kind or two or more kinds.

The content of the (meth) acrylic acid C4-C12 alkyl ester in the total amount of the monomer components is preferably 50% by weight to 99% by weight, more preferably 80% by weight to 98% by weight, and further preferably 90% by weight. % To 97% by weight. When the content ratio of the (meth) acrylic acid C4-C12 alkyl ester is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be further suppressed, and the optical member and electrons can be further suppressed. Even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side of the member or the like, damage to the optical member or the electronic member can be further reduced.

The monomer component includes a carboxyl group-containing monomer. Examples of such a carboxyl group-containing monomer include (meth) acrylic acid (acrylic acid, methacrylic acid), itaconic acid, maleic acid, fumaric acid, crotonic acid and the like. Further, acid anhydrides of these carboxyl group-containing monomers (for example, acid anhydride group-containing monomers such as maleic anhydride and icotanic anhydride) can also be mentioned as carboxyl group-containing monomers.

The content ratio of the carboxyl group-containing monomer in the total amount of the monomer components is preferably 1% by weight to 10% by weight, more preferably 3% by weight to 10% by weight, and further preferably 3% by weight to 5% by weight. be. When the content ratio of the carboxyl group-containing monomer in the total amount of the monomer components is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be further suppressed, and the optical member and the electronic member can be further suppressed. Even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side such as, damage to the optical member or the electronic member can be further reduced.

The monomer component used to obtain the acrylic polymer by polymerization is, if necessary, a monomer (copolymerizable monomer) capable of copolymerizing with (meth) acrylic acid C4-C12 alkyl ester or a carboxyl group-containing monomer. It may be included. The content ratio of such a copolymerizable monomer is preferably less than 50% by weight with respect to the total amount of the monomer components. The content ratio of such a copolymerizable monomer is such that the glass transition temperature of the obtained acrylic polymer is more preferably −20 ° C. or lower in order to exhibit good adhesiveness, and further. The content ratio is preferably −70 ° C. to −35 ° C.

Examples of the copolymerizable monomer include (meth) acrylic acid C1-C3 alkyl esters such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and isopropyl (meth) acrylate; Tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecil (meth) acrylate, (meth) ) C13-C20 alkyl ester of (meth) acrylic acid such as eicosyl acrylate; containing non-aromatic ring such as cycloalkyl ester of (meth) acrylic acid (cyclohexyl (meth) acrylic acid) and isobornyl (meth) acrylic acid. (Meta) acrylic acid ester; (meth) acrylic acid aryl ester ((meth) acrylic acid phenyl, etc.), (meth) acrylic acid aryloxyalkyl ester ((meth) acrylic acid phenoxyethyl, etc.), (meth) acrylic acid Aromatic ring-containing (meth) acrylic acid ester such as arylalkyl ester ((meth) acrylic acid benzyl ester); epoxy group-containing acrylic monomer such as (meth) glycidyl acrylate and (meth) methyl glycidyl acrylate; acetic acid Vinyl ester-based monomers such as vinyl and vinyl propionate; styrene-based monomers such as styrene and α-methylstyrene; hydroxyls such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate. Group-containing monomer; (meth) acrylate alkyl-based monomer such as methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate; olefin-based monomer such as ethylene, propylene, isoprene, and butadiene; vinyl ether-based monomer such as vinyl ether ; Etc. can be mentioned.

Examples of the copolymerizable monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol. Di (meth) acrylate, glycerin di (meth) acrylate, trimethylolpropantri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, divinylbenzene , Butyldi (meth) acrylate, hexyldi (meth) acrylate and other polyfunctional monomers can also be mentioned.

Examples of the copolymerizable monomer include (meth) nitrogen atom-containing monomers (for example, (meth) aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate, and the like. Aminoalkyl acrylate monomers; (N-substituted) amide monomers such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxy (meth) acrylamide; acrylonitrile, Also included are cyanoacrylate-based monomers such as methacrylonitrile; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate). However, since such a nitrogen atom-containing monomer can cause yellowing of the pressure-sensitive adhesive under heating, it is preferable not to use it when it is not necessary to use it.

The acrylic polymer can be prepared by any suitable polymerization method as long as the effects of the present invention are not impaired. Examples of the polymerization method of the acrylic polymer include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by irradiation with ultraviolet rays, and the like, and the solution polymerization method is preferable in terms of transparency, water resistance, cost, and the like. ..

As the polymerization initiator, chain transfer agent, etc. that can be used in the polymerization of the acrylic polymer, any suitable one can be adopted as long as the effects of the present invention are not impaired.

As the amount of the polymerization initiator used, any appropriate amount can be adopted as long as the effect of the present invention is not impaired. As such an amount to be used, for example, 0.01% by weight to 1% by weight is preferable with respect to the total amount of the monomer components.

As the amount of the chain transfer agent used, any appropriate amount may be adopted as long as the effect of the present invention is not impaired. As such an amount to be used, for example, 0.01% by weight to 15% by weight is preferable with respect to the total amount of the monomer components.

In the solution polymerization method, various general solvents can be used. Examples of such a solvent include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methyl. Examples thereof include organic solvents such as alicyclic hydrocarbons such as cyclohexane; and ketones such as methyl ethyl ketone and methyl isobutyl ketone; The solvent may be only one type or two or more types.

The weight average molecular weight of the acrylic polymer is preferably 500,000 to 900,000, more preferably 550,000 to 850,000, and even more preferably 600,000 to 800,000. When the weight average molecular weight of the acrylic polymer is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be further suppressed, and the exposed surface side of the optical member, the electronic member, or the like can be further suppressed. Even if the separator is peeled off from the reinforcing film with a separator that has been previously bonded to the above, damage to the optical member and the electronic member can be further reduced.

The weight average molecular weight of the acrylic polymer can be controlled by the type and amount of the polymerization initiator and chain transfer agent, the temperature and time at the time of polymerization, the monomer concentration, the monomer dropping rate, and the like.

The pressure-sensitive adhesive composition a2 may contain an oligomer component.

As the oligomer component, preferably, an ethylenically unsaturated monomer having a cyclic structure and a glass transition temperature of 60 ° C. to 190 ° C. when forming a homopolymer (“Tg of 60 ° C. to 190 ° C.” A monomer component containing (sometimes referred to as "ring-containing ethylenically unsaturated monomer") as a main component and containing 1 part by weight to 10 parts by weight of a carboxyl group-containing monomer with respect to 100 parts by weight of the total amount of the monomer component. It is an oligomer component obtained by polymerization.

Examples of the oligomer component include an oligomer component obtained by polymerizing an ethylenically unsaturated monomer having a cyclic structure and having a glass transition temperature of 60 ° C. or higher when a homopolymer is formed.

In the oligomer component, the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. has a glass transition temperature (Tg) of 60 ° C. to 190 ° C. when a homopolymer is formed, and is contained in the molecule. Any suitable monomer component can be adopted as long as it is an ethylenically unsaturated monomer having a cyclic structure, as long as the effects of the present invention are not impaired. The ring in the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. may be either an aromatic ring or a non-aromatic ring, but the non-aromatic ring is used. preferable. Examples of the aromatic ring include an aromatic hydrocarbon ring (for example, a benzene ring, a condensed carbon ring in naphthalene and the like), and various aromatic heterocycles. Examples of the non-aromatic ring include a non-aromatic alicyclic ring (cycloalkane ring such as cyclopentane ring, cyclohexane ring, cycloheptane ring and cyclooctane ring; cycloalkene ring such as cyclohexene ring) and non-aromatic ring. Bi-cyclic hydrocarbon rings in sex bridging rings (eg, pinan, pinen, bornan, norbornane, norbornane, etc .; tricyclic hydrocarbon rings in adamantan, etc .; tetracyclic hydrocarbon rings; etc. Etc.) and so on.

Examples of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. include a (meth) acrylic acid cycloalkyl ester such as cyclohexyl (meth) acrylate and a non-aromatic such as isobornyl (meth) acrylate. Group ring-containing (meth) acrylic acid ester; (meth) acrylic acid aryl ester such as phenyl (meth) acrylic acid, (meth) acrylic acid aryloxyalkyl ester such as (meth) phenoxyethyl acrylate, and (meth) Aromatic ring-containing (meth) acrylic acid esters such as (meth) acrylic acid arylalkyl esters such as benzyl acrylate; styrene-based monomers such as styrene and α-methylstyrene; ethylene having a cyclic structure in the molecule. From the sex unsaturated monomers, those having a glass transition temperature of 60 ° C. to 190 ° C. when the homopolymer is formed can be appropriately selected.

Examples of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. include (meth) acrylic acid esters having a non-aromatic ring such as cyclohexyl methacrylate and isobornyl (meth) acrylate. Therefore, from the viewpoint of transparency, cyclohexyl methacrylate is more preferable.

The ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. may be only one kind or two or more kinds.

The content ratio of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. is preferably 50% by weight or more, more preferably 80% by weight to 99% by weight, based on the total amount of the monomer components. , More preferably 90% by weight to 97% by weight. When the content ratio of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. is within the above range, the peeling charge that may occur when the separator is peeled off from the reinforcing film with a separator of the present invention is further increased. It can be suppressed, and even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side of the optical member or the electronic member, damage to the optical member or the electronic member can be further reduced.

The oligomer component may contain a carboxyl group-containing monomer as a monomer component. Examples of such a carboxyl group-containing monomer include (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like, as in the case of the carboxyl group-containing monomer that can form an acrylic polymer. Further, acid anhydrides of these carboxyl group-containing monomers (for example, acid anhydride group-containing monomers such as maleic anhydride and icotanic anhydride) can also be mentioned as carboxyl group-containing monomers.

The content ratio of the carboxyl group-containing monomer that can constitute the oligomer component is preferably 1 part by weight to 10 parts by weight, preferably 3 parts by weight to 10 parts by weight, and further, based on 100 parts by weight of the total amount of the monomer components. It is preferably 3 parts by weight to 5 parts by weight. When the content ratio of the carboxyl group-containing monomer is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be further suppressed, and the exposed surface side of the optical member, the electronic member, or the like can be further suppressed. Even if the separator is peeled off from the reinforcing film with a separator that has been previously bonded to the above, damage to the optical member and the electronic member can be further reduced.

As the monomer component that can constitute the oligomer component, a monomer capable of copolymerizing with a ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. or a carboxyl group-containing monomer (copolymerization), if necessary. Sex monomer) may be contained. The content ratio of such a copolymerizable monomer is preferably less than 50% by weight with respect to 100 parts by weight of the total amount of the monomer components. The content ratio of such a copolymerizable monomer can set the glass transition temperature of the oligomer component to preferably 60 ° C. or higher, more preferably 65 ° C. to 180 ° C. in that good adhesiveness can be exhibited. It is preferable that the content ratio is as such.

Examples of the copolymerizable monomer include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and (meth) acrylic. Isobutyl acid, s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, ( Alkyl (meth) acrylates such as 2-ethylhexyl acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate. Esters; epoxy group-containing acrylic monomers such as glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate; vinyl ester monomers such as vinyl acetate and vinyl propionate; hydroxyethyl (meth) acrylate, (meth) acrylic Hydroxyl group-containing monomers such as hydroxypropyl acid and hydroxybutyl (meth) acrylate; (meth) alkoxyalkyl acrylate monomers such as methoxyethyl (meth) acrylate and ethoxyethyl (meth) acrylate; ethylene, propylene, isoprene , Olefin-based monomers such as butadiene; vinyl ether-based monomers such as vinyl ether; and the like.

Examples of the copolymerizable monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol di (poly). Meta) Acrylate, Glycerindi (Meta) Acrylate, Trimethylol Propanetri (Meta) Acrylate, Pentaerythritol Tri (Meta) Acrylate, Dipentaerythritol Hexa (Meta) Acrylate, Epoxy Acrylate, Polyester Acrylate, Urethane Acrylate, Divinylbenzene, Butyl Di Polyfunctional monomers such as (meth) acrylate and hexyldi (meth) acrylate can also be mentioned.

Examples of the copolymerizable monomer include (meth) nitrogen atom-containing monomers (for example, (meth) aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate, and the like. Aminoalkyl acrylate monomers; (N-substituted) amide monomers such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxy (meth) acrylamide; acrylonitrile, Also included are cyanoacrylate-based monomers such as methacrylonitrile; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate). However, since such a nitrogen atom-containing monomer can cause yellowing of the pressure-sensitive adhesive under heating, it is preferable not to use it when it is not necessary to use it.

The oligomer component can be prepared by any suitable polymerization method as long as the effects of the present invention are not impaired. Examples of the polymerization method of the acrylic polymer include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by irradiation with ultraviolet rays, and the like, and the solution polymerization method is preferable in terms of transparency, water resistance, cost, and the like. ..

As the polymerization initiator, chain transfer agent, etc. that can be used in the polymerization of the oligomer component, any suitable one can be adopted as long as the effects of the present invention are not impaired.

As the amount of the polymerization initiator used, any appropriate amount can be adopted as long as the effect of the present invention is not impaired. As such an amount to be used, for example, 0.1% by weight to 15% by weight is preferable with respect to the total amount of the monomer components.

As the amount of the chain transfer agent used, any appropriate amount may be adopted as long as the effect of the present invention is not impaired. As such an amount to be used, for example, 0.01% by weight to 15% by weight is preferable with respect to the total amount of the monomer components.

In the solution polymerization method, various general solvents can be used. Examples of such a solvent include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methyl. Examples thereof include organic solvents such as alicyclic hydrocarbons such as cyclohexane; and ketones such as methyl ethyl ketone and methyl isobutyl ketone; The solvent may be only one type or two or more types.

The oligomer component has a weight average molecular weight of preferably 3000 to 6000, more preferably 3300 to 5500, and even more preferably 3500 to 5000. When the weight average molecular weight of the oligomer component is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be further suppressed, and the surface side of the exposed surface such as an optical member or an electronic member can be further suppressed. Even if the separator is peeled off from the reinforcing film with the separator bonded in advance, the damage to the optical member and the electronic member can be further reduced.

The weight average molecular weight of the oligomer component can be controlled by the type and amount of the polymerization initiator and chain transfer agent, the temperature and time at the time of polymerization, the monomer concentration, the monomer dropping rate, and the like.

When the pressure-sensitive adhesive composition a2 contains an acrylic polymer and an oligomer component, excellent transparency can be exhibited, and floating and peeling are unlikely to occur at the adhesive interface, which is excellent floating / peeling prevention (foaming resistance). Can express transparency).

When the pressure-sensitive adhesive composition a2 contains an acrylic polymer and an oligomer component, the ratio of the acrylic polymer to the oligomer component is such that the oligomer component is preferably 10 parts by weight with respect to 100 parts by weight of the acrylic polymer. It is ~ 35 parts by weight, more preferably 15 parts by weight to 30 parts by weight. When the pressure-sensitive adhesive composition a2 contains an acrylic polymer and an oligomer component, and the ratio of the acrylic polymer to the oligomer component is within the above range, when the separator is peeled off from the reinforcing film with a separator of the present invention. The peeling charge that may occur in the film can be further suppressed, and even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side of the optical member or the electronic member, damage to the optical member or the electronic member is caused. It can be reduced more.

The pressure-sensitive adhesive composition a2 preferably contains a conductive component. As the conductive component that can be contained in the pressure-sensitive adhesive composition a2, any suitable conductive component can be adopted as long as the effects of the present invention are not impaired. Such a conductive component is preferably at least one compound selected from an ionic liquid, an ionic conductive polymer, an ionic conductive filler, and an electrically conductive polymer.

When the pressure-sensitive adhesive composition a2 contains an acrylic polymer and a conductive component, the ratio of the acrylic polymer to the conductive component is preferably 0.01 with respect to 100 parts by weight of the acrylic polymer. It is 10 parts by weight to 10 parts by weight, more preferably 0.05 parts by weight to 9.0 parts by weight, further preferably 0.075 parts by weight to 8.0 parts by weight, and particularly preferably 0.1 parts by weight. Parts to 7.0 parts by weight. When the pressure-sensitive adhesive composition a2 contains an acrylic polymer and a conductive component, and the ratio of the acrylic polymer and the conductive component is within the above range, when the separator is peeled off from the reinforcing film with a separator of the present invention. The peeling charge that may occur in the film can be further suppressed, and even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side of the optical member or the electronic member, damage to the optical member or the electronic member is caused. It can be reduced more.

As the ionic liquid, any suitable ionic liquid can be adopted as long as the effects of the present invention are not impaired. Here, the ionic liquid means a molten salt (ionic compound) that exhibits a liquid at 25 ° C. The ionic liquid may be only one kind or two or more kinds.

Such an ionic liquid is preferably an ionic liquid composed of a fluoroorganic anion and an onium cation. By adopting an ionic liquid composed of a fluoroorganic anion and an onium cation as the ionic liquid, the reinforcing film with a separator of the present invention can be peeled off when the separator is peeled off from the surface of the pressure-sensitive adhesive layer A2. The charge can be further suppressed, and the charge that may occur due to rubbing against equipment or other films can be further suppressed.

As the onium cation that can form an ionic liquid, any suitable onium cation can be adopted as long as the effect of the present invention is not impaired. The onium cation is preferably at least one selected from a nitrogen-containing onium cation, a sulfur-containing onium cation, and a phosphorus-containing onium cation. By selecting these onium cations, the reinforcing film with a separator of the present invention can further suppress the peeling charge that may occur when the separator is peeled from the surface of the pressure-sensitive adhesive layer A2, and can be used with equipment, other films, etc. The charge that can be generated by the rubbing of the film can be further suppressed.

As the onium cation that can constitute an ionic liquid, at least one selected from cations having structures represented by the general formulas (1) to (5) is preferable in that the effects of the present invention can be more exhibited. Is.

In the general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms and may contain a heteroatom, and Rb and Rc are the same or different, hydrogen or a hydrocarbon having 1 to 16 carbon atoms. It represents a hydrogen group and may contain a heteroatom. However, when the nitrogen atom contains a double bond, there is no Rc.

In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a heteroatom, and Re, Rf, and Rg are the same or different from hydrogen or 1 carbon atom. It represents 16 hydrocarbon groups and may contain heteroatoms.

In the general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a heteroatom, and Ri, Rj, and Rk are the same or different from hydrogen or 1 carbon atom. It represents 16 hydrocarbon groups and may contain heteroatoms.

In general formula (4), Z, a nitrogen atom, a sulfur atom or represents a phosphorus _atom,, R 1, Rm, Rn, and Ro are the same or different, represent a hydrocarbon group having 1 to 20 carbon atoms, It may contain heteroatoms. However, when Z is a sulfur atom, there is no Ro.

In the general formula (5), X represents a Li atom, a Na atom, or a K atom.

Examples of the cation represented by the general formula (1) include a pyridinium cation, a pyrrolidinium cation, a piperidinium cation, a cation having a pyrroline skeleton, and a cation having a pyrrole skeleton.

Specific examples of the cation represented by the general formula (1) include 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, and 1-butyl. Pyridinium cations such as -3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation; 1-ethyl-1-methylpyrroli Dinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidi Nium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation , 1-Ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation and other pyrrolidinium cations; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1 -To propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1- Petilpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpi Examples thereof include peridinium cations, 1-ethyl-1-heptylpiperidinium cations, piperidinium cations such as 1-propyl-1-butylpiperidinium cations; and more preferably 1-hexylpyridinium cations. , 1-Ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-propyl It is a piperidinium cation.

Examples of the cation represented by the general formula (2) include an imidazolium cation, a tetrahydropyrimidinium cation, and a dihydropyrimidinium cation.

Specific examples of the cation represented by the general formula (2) include 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, and 1-butyl. -3-Methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation It is an imidazolium cation such as a lium cation or a 1-tetradecyl-3-methylimidazolium cation, more preferably a 1-ethyl-3-methylimidazolium cation or a 1-hexyl-3-methylimidazolium cation.

Examples of the cation represented by the general formula (3) include a pyrazolium cation and a pyrazolinium cation.

Specific examples of the cation represented by the general formula (3) include 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, and 1-ethyl-. Pyrazolium cations such as 2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, 1-butyl-2,3,5-trimethylpyrazolium cation; Pila such as 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazolinium cation, 1-butyl-2,3,5-trimethylpyrazolinium cation Zolinium cation; and the like.

Examples of the cation represented by the general formula (4) include a tetraalkylammonium cation, a trialkylsulfonium cation, a tetraalkylphosphonium cation, and a part of the above alkyl group is replaced with an alkenyl group, an alkoxyl group, or an epoxy group. Examples include those that have been used.

Specific examples of the cation represented by the general formula (4) include triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, and triethylmethyl. Asymmetric tetraalkylammonium cations such as phosphonium cations, tributylethylphosphonium cations, trimethyldecylphosphonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and N, N-diethyl-N-methyl-N- (2-methoxyethyl) Ammonium cation, glycidyl trimethyl ammonium cation, diallyl dimethyl ammonium cation, N, N-dimethyl-N-ethyl-N-propyl ammonium cation, N, N-dimethyl-N-ethyl-N-butyl ammonium cation, N, N-dimethyl -N-ethyl-N-pentylammonary ammonium cation, N, N-dimethyl-N-ethyl-N-hexylammonary cation, N, N-dimethyl-N-ethyl-N-heptylammonary ammonium cation, N, N-dimethyl-N -Ethyl-N-nonylammonium cation, N, N-dimethyl-N, N-dipropylammonary cation, N, N-diethyl-N-propyl-N-butylammonary cation, N, N-dimethyl-N-propyl- N-pentylammonium cation, N, N-dimethyl-N-propyl-N-hexylammonary cation, N, N-dimethyl-N-propyl-N-heptylammonium cation, N, N-dimethyl-N-butyl-N- Hexylammonium cations, N, N-diethyl-N-butyl-N-heptylammonium cations, N, N-dimethyl-N-pentyl-N-hexylammonium cations, N, N-dimethyl-N, N-dihexylammonium cations, Trimethylheptylammonium cation, N, N-diethyl-N-methyl-N-propylammonary cation, N, N-diethyl-N-methyl-N-pentylammonium cation, N, N-diethyl-N-methyl-N-heptyl Ammonium cation, N, N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation, Triethylheptylammonium cation, N, N-dipropyl-N-methyl-N-ethylammonary cation, N, N-dipropyl-N-methyl-N-pentylammonary cation, N, N-dipropyl-N-butyl-N-hexyl Ammonium cations, N, N-dipropyl-N, N-dihexylammonary cations, N, N-dibutyl-N-methyl-N-pentylammonary cations, N, N-dibutyl-N-methyl-N-hexylammonium cations, tri Examples thereof include octylmethylammonium cations, N-methyl-N-ethyl-N-propyl-N-pentylammonium cations, and more preferably trimethylpropylammonium cations.

As the fluoroorganic anion that can form an ionic liquid, any suitable fluoroorganic anion can be adopted as long as the effects of the present invention are not impaired. Such fluoroorganic anions may be completely fluorinated (perfluoro) or partially fluorinated.

Examples of such fluoroorganic anions include perfluoroalkyl sulfonates, bis (fluorosulfonyl) imides, and bis (perfluoroalkanesulfonyl) imides, and more specifically, for example, trifluoromethanesulfonates and pentafluoroethane sulfonates. , Heptafluoropropane sulfonate, nonaflate butane sulfonate, bis (fluorosulfonyl) imide, bis (trifluoromethanesulfonyl) imide.

As a specific example of the ionic liquid, it can be appropriately selected and used from the combination of the above-mentioned cationic component and the above-mentioned anionic component. Specific examples of such an ionic liquid include 1-hexylpyridinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, and the like. 1-Ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutane sulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis (trifluoromethane) Sulfonyl) imide, 1-octyl-4-methylpyridinium bis (fluorosulfonyl) imide, 1-methyl-1-propylpyrrolidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propylpyrrolidinium bis (fluoro) Sulfonyl) imide, 1-methyl-1-propyl piperidinium bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propyl piperidinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylimidazolium trifluoromethane Sulfonate, 1-ethyl-3-methylimidazolium heptafluoropropane sulfonate, 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide, 1-ethyl-3-methylimidazolium bis (fluorosulfonyl) imide, 1 −Hexyl-3-methylimidazolium bis (fluorosulfonyl) imide, trimethylpropylammonbis (trifluoromethanesulfonyl) imide, lithium bis (trifluoromethanesulfonyl) imide, lithium bis (fluorosulfonyl) imide.

As the ionic liquid, a commercially available one may be used, but it can also be synthesized as described below. The method for synthesizing an ionic liquid is not particularly limited as long as the desired ionic liquid can be obtained, but in general, the document "Ionic liquid-the forefront and future of development-" (CMC Publishing Co., Ltd.) The halide method, hydroxide method, acid ester method, complex formation method, neutralization method and the like as described in (Issued) are used.

The halide method, hydroxide method, acid ester method, complex formation method, and neutralization method are shown below by taking a nitrogen-containing onium salt as an example, but other sulfur-containing onium salts and phosphorus-containing onium salts are shown below. Other ionic liquids such as, etc. can also be obtained by the same method.

The halide method is a method carried out by a reaction as shown in the reaction formulas (1) to (3). First, a halide is obtained by reacting a tertiary amine with an alkyl halide (reaction formula (1), chlorine, bromine, or iodine is used as the halogen).

An acid (HA) or salt (MA, M is ammonium, lithium, sodium, potassium, etc.) having ^{an anion structure (A −} ) of an ionic liquid intended for the obtained halide, and a cation forming a salt with the desired anion. ) is reacted with an objective ionic liquid (R 4 _NA) is obtained.

The hydroxide method is a method carried out by a reaction as shown in the reaction formulas (4) to (8). First halide _(R 4 NX) ion-exchange membrane method electrolysis (reaction equation (4)), OH-type ion exchange resin method (reaction equation (5)) or silver oxide _(Ag 2 O) and of the reaction (reaction formula ( In 6)), a hydroxide (R ₄ NOH) is obtained (chlorine, bromine, and iodine are used as halogens).

By using the reaction of reaction formula as above halogenation process (7) - (8) The obtained hydroxide, the ionic liquid (R 4 _NA) to obtain the objective.

The acid ester method is a method carried out by a reaction as shown in the reaction formulas (9) to (11). First tertiary amine (R 3 _N) to obtain the ester was reacted with ester (Scheme (9), as acid ester, sulfuric, sulfurous, phosphoric acid, phosphorous acid, an inorganic acid such as carbonic acid Esters and esters of organic acids such as methanesulfonic acid, methylphosphonic acid, and formic acid are used).

By using the reaction of as above halogenation process reaction formulas (10) to (11) The obtained ester product, the ionic liquid (R 4 _NA) to obtain the objective. Further, a direct ionic liquid can be obtained by using methyltrifluoromethanesulfonate, methyltrifluoroacetate or the like as the acid ester.

The neutralization method is a method performed by a reaction as shown in the reaction formula (12). Reacting tertiary amines with organic acids such as _{CF 3} COOH, CF ₃ SO ₃ H, (CF ₃ SO ₂ ) ₂ NH, (CF ₃ SO ₂ ) ₃ CH, (C ₂ F ₅ SO ₂ ) _{2 NH} Can be obtained by

R represented by the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, and may contain a hetero atom.

As the ionic conductive polymer, any suitable ionic conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such an ionic conductive polymer include an ionic conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium base); polythiophene, polyaniline, polypyrrole, polyethyleneimine, an allylamine-based polymer, and the like. Conductive polymers; and the like. The ionic conduction polymer may be only one kind or two or more kinds.

As the ion conductive filler, any suitable ion conductive filler may be adopted as long as the effect of the present invention is not impaired. Examples of such ion conductive fillers include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, and iron. , Cobalt, copper iodide, ITO (indium oxide / tin oxide), ATO (antimony oxide / tin oxide) and the like. The ion conduction filler may be only one type or two or more types.

As the electrically conductive polymer, any suitable electrically conductive polymer may be adopted as long as the effects of the present invention are not impaired. Examples of such an electrically conductive polymer include (3,4-ethylenedioxythiophene) -poly (styrene sulfonic acid).

The pressure-sensitive adhesive composition a2 contains, if necessary, a cross-linking agent, an ultraviolet absorber, an antioxidant, a light stabilizer, an anti-aging agent, an antistatic agent, a plasticizer, a softening agent, a filler, and a colorant (pigment or dye). Etc.), known additives such as surfactants and antistatic agents may be included. By cross-linking the acrylic polymer or the oligomer component with a cross-linking agent, the cohesive force as a pressure-sensitive adhesive can be further increased. Therefore, it is preferable that the pressure-sensitive adhesive composition a2 contains a cross-linking agent. The cross-linking agent may be only one kind or two or more kinds.

In addition to isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, and peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, metal salt-based cross-linking agents, and carbodiimide-based cross-linking agents. Examples thereof include agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, and amine-based cross-linking agents. Of these, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is preferable.

The content of the isocyanate-based cross-linking agent can be set to an arbitrary appropriate amount according to the desired adhesive strength, preferably 0.01 parts by weight to 20 parts by weight with respect to 100 parts by weight of the acrylic polymer. Yes, more preferably 0.01 parts by weight to 10 parts by weight, still more preferably 0.03 parts by weight to 5 parts by weight.

The content of the epoxy-based cross-linking agent can be set to an arbitrary appropriate amount depending on the desired adhesive strength, preferably 0.01 parts by weight to 20 parts by weight with respect to 100 parts by weight of the acrylic polymer. Yes, more preferably 0.01 parts by weight to 10 parts by weight, still more preferably 0.03 parts by weight to 5 parts by weight.

As the tackifier, any suitable tackifier is used.

The content of the tackifier is preferably 1 part by weight to 80 parts by weight, more preferably 5 parts by weight to 70 parts by weight, and further preferably 10 parts by weight to 100 parts by weight with respect to 100 parts by weight of the acrylic polymer. It is 50 parts by weight, and particularly preferably 10 parts by weight to 40 parts by weight. The adhesive strength can be increased by adding a tackifier.

The pressure-sensitive adhesive composition a2 contains, for example, an acrylic polymer, at least one selected from a silicone-based additive and a fluorine-based additive, a conductive component if necessary, an oligomer component if necessary, and an oligomer component if necessary. It can be prepared by mixing with other additives such as a cross-linking agent.

As a method for forming the pressure-sensitive adhesive layer A2 from the pressure-sensitive adhesive composition a2, any suitable method can be adopted as long as the effects of the present invention are not impaired. For example, the pressure-sensitive adhesive composition a2 is applied onto an arbitrary suitable base material (for example, PET base material) and heated, dried, or the like to form the pressure-sensitive adhesive layer A2. Preferably, the pressure-sensitive adhesive composition a2 is applied onto the base material layer A1 and heated, dried, or the like to form the pressure-sensitive adhesive layer A2. For applying the pressure-sensitive adhesive composition a2, for example, any suitable coating method can be used. Examples of such a coating method include a coating method using a conventional coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, and a direct coater. Can be mentioned.

<Antistatic layer A3>
As the thickness of the antistatic layer A3, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The antistatic layer A3 may be only one layer or two or more layers.

As the antistatic layer A3, any appropriate antistatic layer can be adopted as long as it is a layer capable of exerting an antistatic effect, as long as the effect of the present invention is not impaired. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on an arbitrary suitable base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a base material layer A1. Specific coating methods include a roll coating method, a bar coating method, and a gravure coating method.

As the conductive polymer, any suitable conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such a conductive polymer include a conductive polymer in which a π-conjugated conductive polymer is doped with a polyanion. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyanion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, ethyl sulfonic acid polyacrylate, polymethacrylcarboxylic acid and the like.

≪Separator Q≫
As the thickness of the separator Q, any appropriate thickness can be adopted depending on the intended purpose as long as the effect of the present invention is not impaired. Such a thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, further preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm.

The separator Q includes a release layer B1 and a base material layer B2. If the separator Q contains the release layer B1 and the base material layer B2, it may contain any other suitable layer depending on the purpose, as long as the effect of the present invention is not impaired.

The release layer B1 may be one layer or two or more layers.

The base material layer B2 may be one layer or two or more layers.

One embodiment of the separator Q comprises a release layer B1 and a base material layer B2, as shown in FIG.

The separator Q preferably contains a release layer B1, a base material layer B2, and an antistatic layer B3 in this order. When the separator Q contains the release layer B1, the base material layer B2, and the antistatic layer B3 in this order, the separator Q contains any other suitable layer depending on the purpose, as long as the effect of the present invention is not impaired. obtain.

As shown in FIG. 4, one embodiment of the separator Q includes a release layer B1, a base material layer B2, and an antistatic layer B3.

The antistatic layer B3 may be one layer or two or more layers.

<Release layer B1>
The release layer B1 is provided to enhance the releasability from the pressure-sensitive adhesive layer A2. As the material for forming the release layer, any suitable forming material can be adopted as long as the effects of the present invention are not impaired. Examples of such a forming material include a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl-based release agent, and a fatty acid amide-based release agent. Among these, a silicone-based release agent is preferable. The release layer B1 can be formed as a coating layer.

As the thickness of the release layer B1, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, further preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

The release layer B1 may be only one layer or two or more layers.

Examples of the silicone-based release layer include an addition reaction type silicone resin. For example, KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T manufactured by Shin-Etsu Chemical Co., Ltd .; TPR-6700, TPR-6710, TPR-6721 manufactured by Toshiba Silicone; Toray Dow -SD7220, SD7226; manufactured by Corning, etc. can be mentioned. The coating amount of the silicone-based release layer (after drying) is preferably from ^{0.01g / m 2 ~2g / m 2} , more preferably from ^{0.01g / m 2 ~1g / m 2} , more preferably it is ^{0.01g / m 2 ~0.5g / m 2} .

The release layer B1 is usually formed at 120 to 200 ° C. after the above-mentioned forming material is applied onto any suitable layer by a conventionally known coating method such as reverse gravure coating, bar coating, and die coating. It can be carried out by curing by applying heat treatment to the extent. Further, if necessary, heat treatment and active energy ray irradiation such as ultraviolet irradiation may be used in combination.

<Base material layer B2>
As the base material layer B2, a base material formed from any suitable material can be adopted depending on the intended purpose, as long as the effects of the present invention are not impaired. Examples of such a material include those exemplified in the item of <Base material layer A1>.

The base material layer B2 may be only one layer or may be two or more layers.

As the thickness of the base material layer B2, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, further preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm.

The base material layer B2 may contain an antistatic agent. As the base material layer B2 containing the antistatic agent, for example, a resin sheet in which the antistatic agent is kneaded can be used. Such a resin sheet can be formed from a composition for forming a base material layer B2 containing a resin and an antistatic agent.

The base material layer B2 itself may act as an antistatic agent. For example, when a metal foil is used as the material of the base material layer B2, the base material layer B2 itself can act as an antistatic agent.

The base material layer B2 may be surface-treated. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, ionizing radiation treatment, coating treatment with an undercoat agent, and the like.

Examples of the organic coating material include those exemplified in the item of <Base material layer A1>.

The base material layer B2 may contain any other suitable additive, depending on the intended purpose, as long as the effects of the present invention are not impaired.

<Antistatic layer B3>
As the thickness of the antistatic layer B3, any appropriate thickness can be adopted depending on the intended purpose as long as the effects of the present invention are not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The antistatic layer B3 may be only one layer or two or more layers.

As the antistatic layer B3, any appropriate antistatic layer can be adopted as long as it is a layer capable of exerting an antistatic effect, as long as the effect of the present invention is not impaired. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on an arbitrary suitable base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a base material layer B2. Specific coating methods include a roll coating method, a bar coating method, and a gravure coating method.

As the conductive polymer, any suitable conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such a conductive polymer include those exemplified in the item of <Antistatic layer A3>.

≪Reinforcing film with separator≫
The reinforcing film with a separator of the present invention can be obtained by laminating the reinforcing film P and the separator Q so that the pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated.

As shown in FIG. 5, one embodiment of the reinforcing film with a separator of the present invention includes a reinforcing film P composed of a base material layer A1 and an adhesive layer A2, a release layer B1 and a base material layer B2. The separator Q made of the above is in a form in which the pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated and bonded to each other.

Another embodiment of the reinforcing film with a separator of the present invention is, as shown in FIG. 6, a reinforcing film P composed of a base material layer A1 and an adhesive layer A2, a release layer B1 and a base material layer. The separator Q composed of B2 and the antistatic layer B3 is in a form in which the pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated so as to be laminated.

Another embodiment of the reinforcing film with a separator of the present invention is, as shown in FIG. 7, a reinforcing film P composed of an antistatic layer A3, a base material layer A1 and an adhesive layer A2, and a release layer. The separator Q composed of B1 and the base material layer B2 is in a form in which the pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated so as to be laminated.

Another embodiment of the reinforcing film with a separator of the present invention is, as shown in FIG. 8, a reinforcing film P composed of an antistatic layer A3, a base material layer A1 and an adhesive layer A2, and a release layer. A separator Q composed of B1, a base material layer B2, and an antistatic layer B3 is bonded so that the pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated.

The reinforcing film with a separator of the present invention has a pressure-sensitive adhesive layer A2 when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min. The peeling band voltage on the surface is 5.0 kV or less. When the peeling band voltage on the surface of the pressure-sensitive adhesive layer A2 is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be suppressed, and the optical member, the electronic member, or the like can be used. Even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side, damage to the optical member and the electronic member can be reduced.

The peeling band voltage on the surface of the pressure-sensitive adhesive layer A2 is preferably 0.01 kV to 4.9 kV, more preferably 0.02 kV to 4.8 kV, and further preferably 0.03 kV to 4.7 kV. Particularly preferably, it is 0.04 kV to 4.6 kV, and most preferably 0.05 kV to 4.5 kV.

The reinforcing film with a separator of the present invention has a pressure-sensitive adhesive layer A2 when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min. The surface resistance value of the surface is preferably 1.0 × 10 ^{4 Ω to 1.0 × 10 12} Ω, more preferably 5.0 × 10 ⁴ Ω to 7.5 × 10 ¹¹ Ω, and further preferably. Is 7.5 × 10 ⁴ Ω to 5.0 × 10 ¹¹ Ω, and particularly preferably 1.0 × 10 ⁵ Ω to 1.0 × 10 ^{11 Ω.} When the surface resistance value of the surface of the pressure-sensitive adhesive layer A2 is within the above range, the peeling charge that may occur when the separator is peeled from the reinforcing film with a separator of the present invention can be further suppressed, and the optical member, electronic member, etc. Even if the separator is peeled off from the reinforcing film with a separator that is previously attached to the exposed surface side of the above, damage to the optical member and the electronic member can be further reduced.

The reinforcing film with a separator of the present invention is an adhesive to a glass plate after peeling the separator Q from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min. The initial adhesive strength of layer A2 at a temperature of 23 ° C., a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is preferably 1.0 N / 25 mm or more, and more preferably 1.0 N / 25 mm to. It is 50 N / 25 mm, more preferably 1.0 N / 25 mm to 45 N / 25 mm, and particularly preferably 1.0 N / 25 mm to 40 N / 25 mm. If the initial adhesive force of the pressure-sensitive adhesive layer A2 to the glass plate is within the above range, good adhesion can be obtained and poor adhesion to the adherend can be reduced.

The reinforcing film with a separator of the present invention preferably has a peeling force when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 180 degrees and a tensile speed of 300 mm / min. It is 0.30N / 25mm or less, more preferably 0.005N / 25mm to 0.30N / 25mm, further preferably 0.0075N / 25mm to 0.30N / 25mm, and particularly preferably 0.01N /. It is 25 mm to 0.30 N / 25 mm. If the peeling force is within the above range, it is possible to prevent the separator from being accidentally peeled off from the reinforcing film when handling the reinforcing film with a separator, and when the separator is peeled off, the reinforcing film is adhered. It is possible to reduce the cohesive destruction or anchoring destruction of the agent layer.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. The tests and evaluation methods in the examples and the like are as follows. In addition, when it is described as "part", it means "part by weight" unless there is a special note, and when it is described as "%", it means "% by weight" unless there is a special note.

<Measurement of weight average molecular weight>
The weight average molecular weight was measured by gel permeation chromatography (GPC) method. Specifically, it was measured under the following conditions using the trade name "HLC-8220 GPC" (manufactured by Tosoh Corporation) as a GPC measuring device, and calculated by a standard polystyrene conversion value.
(Molecular weight measurement conditions)
-Sample concentration: 0.2% by weight (tetrahydrofuran solution)
-Sample injection volume: 10 μL
-Sample column: Product name "TSKguardcolum SuperHZ-H (1) + TSKgel SuperHZM-H (2)" (manufactured by Tosoh Corporation)
-Reference column: Product name "TSKgel SuperH-RC (1)" (manufactured by Tosoh Corporation)
-Eluent: tetrahydrofuran (THF)
・ Flow rate: 0.6 mL / min
・ Detector: Differential refractometer (RI)
-Column temperature (measurement temperature): 40 ° C

<Measurement of surface resistance>
The separator was peeled from the reinforcing film with a separator at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min. After that, the surface resistance values of the base material layer side surface and the adhesive layer side surface of the remaining reinforcing film portion and the base material layer side surface of the peeled separator portion were set to MODEL152-1 (152P-2P) manufactured by TREK. Measured with a probe). The measurement was carried out at a voltage of 10 V, a time of 10 sec, a temperature of 23 ° C., and a humidity of 50% RH.

<Measurement of peeling band voltage on the surface of the adhesive layer>
An electrostatic potential measuring instrument (electrostatic potential measuring instrument) in which a reinforcing film with a separator, which has been static-free in advance, is cut into a size of 70 mm in width and 130 mm in length, and the potential on the surface of the adhesive layer after the separator is peeled off is fixed at a position 30 mm away. It was measured by Sisid Electrostatic Co., Ltd., STAIRON DZ4). The measurement was performed in an environment of a temperature of 23 ° C. and a humidity of 50% RH. The separator was peeled off by fixing the separator to an automatic winder at a temperature of 23 ° C. and a humidity of 50% RH so that the peeling angle was 150 ° C. and the peeling speed was 10 m / min.

<Measurement of initial adhesive force of adhesive layer on glass plate>
The reinforcing film with a separator, which had been statically eliminated in advance, was cut into a width of 25 mm and a length of 150 mm to prepare a sample for evaluation. In an atmosphere of temperature 23 ° C. and humidity 50% RH, the surface of the adhesive layer of the evaluation sample is attached to a glass plate (manufactured by Matsunami Glass Ind. Co., Ltd., trade name: microslide glass S) by one reciprocating 2.0 kg roller. Attached. After curing for 30 minutes in an atmosphere of temperature 23 ° C. and humidity 50% RH, peeling is performed at a peeling angle of 180 degrees and a tensile speed of 300 mm / min using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB). Then, the adhesive strength was measured.

<Measurement of separator peeling force>
The reinforcing film with a separator, which had been statically eliminated in advance, was cut into a width of 25 mm and a length of 150 mm to prepare a sample for evaluation. The reinforcing film is fixed so that the base material layer surface of the reinforcing film is in contact with the acrylic plate, and a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) is used in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH. ) Was used to peel off the separator at a peeling angle of 180 degrees and a tensile speed of 300 mm / min, and the separator peeling force was measured.

[Production Example 1]: Production of (meth) acrylic polymer (1) Butyl acrylate (manufactured by Nippon Catalyst Co., Ltd.): 95 in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a cooler. By weight, acrylic acid (manufactured by Toa Synthetic Co., Ltd.): 5 parts by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator: 0.2 parts by weight, ethyl acetate: 156 parts by weight A (meth) acrylic polymer having a weight average molecular weight of 700,000 (1) was charged with a weight portion, introduced with nitrogen gas while gently stirring, and the polymerization reaction was carried out for 10 hours while keeping the liquid temperature in the flask at around 63 ° C. ) Was prepared (40% by weight).

[Production Example 2]: Production of Acrylic Adhesive Composition (1) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) is added. With respect to 100 parts by weight of the solid content of the solution, 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent in terms of solid content and X-22-9002 (Shinetsu Chemical Industry Co., Ltd.) as an epoxy group-containing silicone (Manufactured by Co., Ltd.) is added by 0.1 parts by weight in terms of solid content, diluted with ethyl acetate so that the total solid content is 25% by weight, stirred with a disper, and an acrylic pressure-sensitive adhesive containing an acrylic resin. The composition (1) was obtained.

[Production Example 3]: Production of Acrylic Adhesive Composition (2) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) is added. With respect to 100 parts by weight of the solid content of the solution, 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent in terms of solid content and X-22-3710 (Shinetsu Chemical Industry Co., Ltd.) as a carboxyl group-containing silicone (Manufactured by Co., Ltd.) is added by 0.1 parts by weight in terms of solid content, diluted with ethyl acetate so that the total solid content is 25% by weight, stirred with a disper, and an acrylic pressure-sensitive adhesive containing an acrylic resin. The composition (2) was obtained.

[Production Example 4]: Production of the acrylic pressure-sensitive adhesive composition (3) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) is added. For 100 parts by weight of the solid content of the solution, use TETRAD-C (manufactured by Mitsubishi Gas Chemicals Co., Ltd.) as a cross-linking agent at 0.075 parts by weight in terms of solid content, and use F-562 (manufactured by DIC Co., Ltd.) as a fluorine-containing polymer. Add 0.1 parts by weight in terms of solid content, dilute with ethyl acetate so that the total solid content is 25% by weight, stir with a disper, and make an acrylic pressure-sensitive adhesive composition containing an acrylic resin (3). Got

[Production Example 5]: Production of Acrylic Adhesive Composition (4) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) is added. For 100 parts by weight of the solid content of the solution, use TETRAD-C (manufactured by Mitsubishi Gas Chemicals Co., Ltd.) as a cross-linking agent at 0.075 parts by weight in terms of solid content, and use F-571 (manufactured by DIC Co., Ltd.) as a fluorine-containing polymer. Add 0.1 parts by weight in terms of solid content, dilute with ethyl acetate so that the total solid content is 25% by weight, stir with a disper, and make an acrylic pressure-sensitive adhesive composition containing an acrylic resin (4). Got

[Production Example 6]: Production of Acrylic Adhesive Composition (5) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) is added. With respect to 100 parts by weight of the solid content of the solution, 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent in terms of solid content and X-22-9002 (Shinetsu Chemical Industry Co., Ltd.) as an epoxy group-containing silicone Add 0.1 parts by weight of solid content (manufactured by Nippon Carlit Co., Ltd.) and 3.0 parts by weight of CIL-312 (manufactured by Nippon Carlit) as a conductive component, and the total solid content is 25% by weight. The composition was diluted with ethyl acetate and stirred with a disper to obtain an acrylic pressure-sensitive adhesive composition (5) containing an acrylic resin.

[Production Example 7]: Production of Acrylic Adhesive Composition (6) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) was added to the solution. With respect to 100 parts by weight of the solid content of the solution, 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent in terms of solid content and X-22-3710 (Shinetsu Chemical Industry Co., Ltd.) as a carboxyl group-containing silicone Add 0.1 parts by weight of solid content (manufactured by Nippon Carlit Co., Ltd.) and 3.0 parts by weight of CIL-312 (manufactured by Nippon Carlit) as a conductive component, and the total solid content is 25% by weight. The composition was diluted with ethyl acetate and stirred with a disper to obtain an acrylic pressure-sensitive adhesive composition (6) containing an acrylic resin.

[Production Example 8]: Production of Acrylic Adhesive Composition (7) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) was added to the solution. For 100 parts by weight of the solid content of the solution, use TETRAD-C (manufactured by Mitsubishi Gas Chemicals Co., Ltd.) as a cross-linking agent at 0.075 parts by weight in terms of solid content, and use F-562 (manufactured by DIC Co., Ltd.) as a fluorine-containing polymer. Add 0.1 parts by weight of solid content and 3.0 parts by weight of CIL-312 (manufactured by Nippon Carlit) as a conductive component to make the total solid content 25% by weight. The mixture was diluted with ethyl and stirred with a disper to obtain an acrylic pressure-sensitive adhesive composition (7) containing an acrylic resin.

[Production Example 9]: Production of Acrylic Adhesive Composition (8) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) was added to the solution. For 100 parts by weight of the solid content of the solution, use TETRAD-C (manufactured by Mitsubishi Gas Chemicals Co., Ltd.) as a cross-linking agent at 0.075 parts by weight in terms of solid content, and use F-571 (manufactured by DIC Co., Ltd.) as a fluorine-containing polymer. Add 0.1 parts by weight of solid content and 3.0 parts by weight of CIL-312 (manufactured by Nippon Carlit) as a conductive component to make the total solid content 25% by weight. The mixture was diluted with ethyl and stirred with a disper to obtain an acrylic pressure-sensitive adhesive composition (8) containing an acrylic resin.

[Production Example 10]: Production of Acrylic Adhesive Composition (9) In the solution of the (meth) acrylic polymer (1) obtained in Production Example 1, the (meth) acrylic polymer (1) is added. To 100 parts by weight of the solid content of the solution, add 0.075 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemicals, Inc.) as a cross-linking agent in terms of solid content so that the total solid content becomes 25% by weight. The composition was diluted with ethyl acetate and stirred with a disper to obtain an acrylic pressure-sensitive adhesive composition (9) containing an acrylic resin.

[Manufacturing Example 11]: Production of laminate (A) of [Release layer] / [Base material layer] Silicone mold release agent (manufactured by Shin-Etsu Chemical Co., Ltd., KS-847): 100 parts by weight, catalyst (Shin-Etsu Chemical) CAT PL-50T) manufactured by Kogyo Co., Ltd.): 1.0 part by weight was diluted with toluene to 1.0% by weight to obtain a Si release agent treatment liquid. The obtained Si mold release agent treatment liquid is applied to one surface of a base material "Lumirror S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin so that the thickness after drying is 100 nm with a wire bar. , The drying temperature was 130 ° C. and the drying time was 3 minutes, and the mixture was cured and dried to produce a laminate (A) of [release layer] / [base material layer].

[Production Example 12]: Production of a laminate (B) of [Release layer] / [Base material layer] / [Antistatic layer] As a conductive coating agent, S-948 (manufactured by Chukyo Yushi Co., Ltd.): 100 parts by weight , P-795 (manufactured by Chukyo Yushi Co., Ltd.): 10 parts by weight is diluted to 0.3% by weight with a mixed solution of pure water and Ekinen F6 (manufactured by Japan Alcohol Trading Co., Ltd.), and the conductive coating liquid (a) Got The obtained conductive coating liquid (a) was dried on the surface of the laminate (A) of the [release layer] / [base material layer] obtained in Production Example 11 on the base material layer side with a wire bar. The laminate (B) of [release layer] / [base material layer] / [antistatic layer] is coated by coating so as to have a thickness of 20 nm, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. Manufactured.

[Manufacturing Example 13]: Production of Laminated Body (C) of [Antistatic Layer] / [Base Material Layer] The conductive coating liquid (a) prepared in Production Example 12 is used as a base material "Lumirer S10" made of polyester resin. On one surface (thickness 38 μm, manufactured by Toray Industries, Inc.), apply with a wire bar so that the thickness after drying is 20 nm, cure under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dry. A laminated body (C) of [layer] / [base material layer] was produced.

[Example 1]
The acrylic pressure-sensitive adhesive composition (1) obtained in Production Example 2 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P1) of [base material layer] / [adhesive layer] was obtained. The obtained laminate (P1) of [base material layer] / [adhesive layer] and the laminate (A) of [release layer] / [base material layer] obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (1) with a separator. The obtained reinforcing film (1) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 2]
The acrylic pressure-sensitive adhesive composition (2) obtained in Production Example 3 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P2) of [base material layer] / [adhesive layer] was obtained. The obtained [base material layer] / [adhesive layer] laminate (P2) and the [release layer] / [base material layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (2) with a separator. The obtained reinforcing film (2) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 3]
The acrylic pressure-sensitive adhesive composition (3) obtained in Production Example 4 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P3) of [base material layer] / [adhesive layer] was obtained. The obtained [base material layer] / [adhesive layer] laminate (P3) and the [release layer] / [base material layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (3) with a separator. The obtained reinforcing film (3) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 4]
The acrylic pressure-sensitive adhesive composition (4) obtained in Production Example 5 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P4) of [base material layer] / [adhesive layer] was obtained. The obtained laminate (P4) of [base material layer] / [adhesive layer] and the laminate (A) of [release layer] / [base material layer] obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (4) with a separator. The obtained reinforcing film (4) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 5]
The acrylic pressure-sensitive adhesive composition (5) obtained in Production Example 6 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P5) of [base material layer] / [adhesive layer] was obtained. The obtained [base material layer] / [adhesive layer] laminate (P5) and the [release layer] / [base material layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (5) with a separator. The obtained reinforcing film (5) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 6]
The acrylic pressure-sensitive adhesive composition (6) obtained in Production Example 7 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P6) of [base material layer] / [adhesive layer] was obtained. The obtained [base material layer] / [adhesive layer] laminate (P6) and the [release layer] / [base material layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (6) with a separator. The obtained reinforcing film (6) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 7]
The acrylic pressure-sensitive adhesive composition (7) obtained in Production Example 8 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P7) of [base material layer] / [adhesive layer] was obtained. The obtained [base material layer] / [adhesive layer] laminate (P7) and the [release layer] / [base material layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (7) with a separator. The obtained reinforcing film (7) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 8]
The acrylic pressure-sensitive adhesive composition (8) obtained in Production Example 9 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P8) of [base material layer] / [adhesive layer] was obtained. The obtained [base material layer] / [adhesive layer] laminate (P8) and the [release layer] / [base material layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (8) with a separator. The obtained reinforcing film (8) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 9]
The acrylic pressure-sensitive adhesive composition (3) obtained in Production Example 4 was applied to the surface of the laminate (C) of the [antistatic layer] / [base material layer] obtained in Production Example 13 on the base material layer side. , A fountain roll was applied so that the thickness after drying was 25 μm, and the mixture was cured and dried under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes. In this way, a laminate (P9) of [antistatic layer] / [base material layer] / [adhesive layer] was obtained. The obtained laminate (P9) of [antistatic layer] / [base layer] / [adhesive layer] and the laminate of [release layer] / [base layer] obtained in Production Example 11 ( A) was laminated so that the pressure-sensitive adhesive layer and the release layer were directly laminated to obtain a reinforcing film (9) with a separator. The obtained reinforcing film (9) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Example 10]
The acrylic pressure-sensitive adhesive composition (3) obtained in Production Example 4 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminated body (P10) of [base material layer] / [adhesive layer] was obtained. The obtained laminate (P10) of [base material layer] / [adhesive layer] and the laminate of [release layer] / [base material layer] / [antistatic layer] obtained in Production Example 12 ( B) was laminated so that the pressure-sensitive adhesive layer and the release layer were directly laminated to obtain a reinforcing film (10) with a separator. The obtained reinforcing film (10) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Comparative Example 1]
The acrylic pressure-sensitive adhesive composition (9) obtained in Production Example 10 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminate (CP1) of [base material layer] / [adhesive layer] was obtained. The obtained [base layer] / [adhesive layer] laminate (CP1) and the [release layer] / [base layer] laminate (A) obtained in Production Example 11 are adhered to each other. The agent layer and the release layer were laminated so as to be directly laminated to obtain a reinforcing film (C1) with a separator. The obtained reinforcing film (C1) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Comparative Example 2]
The acrylic pressure-sensitive adhesive composition (9) obtained in Production Example 10 was applied to the surface of the laminate (C) of the [antistatic layer] / [base material layer] obtained in Production Example 13 on the base material layer side. , A fountain roll was applied so that the thickness after drying was 25 μm, and the mixture was cured and dried under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes. In this way, a laminate (CP2) of [antistatic layer] / [base material layer] / [adhesive layer] was obtained. The obtained laminate (CP2) of [antistatic layer] / [base layer] / [adhesive layer] and the laminate of [release layer] / [base layer] obtained in Production Example 11 ( A) was laminated so that the pressure-sensitive adhesive layer and the release layer were directly laminated to obtain a reinforcing film (C2) with a separator. The obtained reinforcing film (C2) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

[Comparative Example 3]
The acrylic pressure-sensitive adhesive composition (9) obtained in Production Example 10 is applied to a base material "Lumilar S10" (thickness 38 μm, manufactured by Toray Industries, Inc.) made of polyester resin with a fountain roll so that the thickness after drying is 25 μm. The coating was applied, cured under the conditions of a drying temperature of 130 ° C. and a drying time of 3 minutes, and dried. In this way, a laminate (CP3) of [base material layer] / [adhesive layer] was obtained. The obtained laminate (CP3) of [base material layer] / [adhesive layer] and the laminate of [release layer] / [base material layer] / [antistatic layer] obtained in Production Example 12 ( B) was laminated so that the pressure-sensitive adhesive layer and the release layer were directly laminated to obtain a reinforcing film (C3) with a separator. The obtained reinforcing film (C3) with a separator was aged at room temperature for 7 days, and then various evaluations were performed. The results are shown in Table 1.

The reinforcing film with a separator of the present invention can be used as a reinforcing film to be bonded to the back side of a substrate of a semiconductor element or the like.

1000 Reinforcing film with separator 100 Reinforcing film P
200 Separator Q
10 Base material layer A1
20 Adhesive layer A2
30 Release layer B1
40 Antistatic layer B3
50 Base material layer B2
60 Antistatic layer A3

Claims (7)

A method of using a reinforcing film with a separator having a reinforcing film P and a separator Q.
The reinforcing film P includes a base material layer A1 and an adhesive layer A2.
The separator Q contains a release layer B1 and a base material layer B2.
The pressure-sensitive adhesive layer A2 and the release layer B1 are directly laminated with each other.
The pressure-sensitive adhesive layer A2 is a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition a2, and the pressure-sensitive adhesive composition a2 contains at least one selected from a silicone-based additive and a fluorine-based additive.
The silicone-based additive is at least one selected from a siloxane bond-containing compound, a hydroxyl group-containing silicone-based compound, and a crosslinkable functional group-containing silicone-based compound.
The fluorine-based additive is at least one selected from a fluorine-containing compound, a hydroxyl group-containing fluorine-based compound, and a crosslinkable functional group-containing fluorine-based compound.
When the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min, the peeling band voltage on the surface of the pressure-sensitive adhesive layer A2 is 5. .0kV Ri der below,
You peel the separator Q a base material layer A1 reinforcing film with the separator after bonding the optical member or an electronic member,
How to use the reinforcing film with separator. The method for using a reinforcing film with a separator according to claim 1 , wherein the pressure-sensitive adhesive composition a2 contains a conductive component. When the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min, the surface resistance value of the surface of the pressure-sensitive adhesive layer A2 is 1. .0 × 10 ⁴ Ω to 1.0 × 10 ¹² Ω, the method of using the reinforcing film with a separator according to claim 2 . The method for using a reinforcing film with a separator according to any one of claims 1 to 3 , wherein the reinforcing film P includes an antistatic layer A3, a base material layer A1, and an adhesive layer A2 in this order. The method for using a reinforcing film with a separator according to any one of claims 1 to 4 , wherein the separator Q includes a release layer B1, a base material layer B2, and an antistatic layer B3 in this order. After peeling the separator Q from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min, the temperature of the pressure-sensitive adhesive layer A2 on the glass plate is 23 ° C. Use of the reinforcing film with a separator according to any one of claims 1 to 5 , wherein the humidity is 50% RH, the peeling angle is 180 degrees, and the initial adhesive force at a tensile speed of 300 mm / min is 1.0 N / 25 mm or more. Method . The claim that the peeling force when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 180 degrees and a tensile speed of 300 mm / min is 0.30 N / 25 mm or less. The method of using the reinforcing film with a separator according to any one of 1 to 6 .

Images