JP6907298B2 - Fluid propulsion device including heat sink - Google Patents

Description

Precision fluid propulsion devices include, among other things, labs-on-a-chips, printheads, and digital titrators. Fluid propulsion devices can include MEMS configured to move fluid through small (eg, micron-sized) fluid channels. Such a MEMS can include a silicon substrate and a thin film layer circuit deposited on the silicon substrate. For example, it may be advantageous to reduce the amount of silicon in the fluid propulsion device by reducing the thickness, width, and / or length and the like. By reducing the width and / or length of the silicon substrate, it becomes easier to take out more MEMS substrates from a single wafer. By reducing the thickness of the silicon substrate, it becomes possible to obtain a more inexpensive wafer. In general, reducing the amount of silicon in a MEMS makes it possible to reduce costs.

It is a figure which shows one Embodiment of a fluid propulsion apparatus. It is a figure which shows another embodiment of a fluid propulsion device. It is a figure which shows the cross section in the plan view of still another embodiment of a fluid propulsion apparatus. It is a figure which shows the cross section in the side view of a part of an exemplary fluid propulsion device. It is a figure which shows the cross section in the side view of a part of another exemplary fluid propulsion apparatus. FIG. 5 is a plan view showing an exemplary layout of a plurality of MEMS and corresponding heat sinks in a fluid propulsion device. FIG. 5 is a plan view showing different exemplary layouts of a plurality of MEMS and corresponding heat sinks in a fluid propulsion device. FIG. 5 is a plan view showing different exemplary layouts of a plurality of MEMS and corresponding heat sinks in a fluid propulsion device. FIG. 5 is a plan view showing different exemplary layouts of a plurality of MEMS and corresponding heat sinks in a fluid propulsion device. It is a figure which shows one Embodiment of the manufacturing method of a fluid propulsion apparatus. It is a figure which shows another embodiment of the manufacturing method of a fluid propulsion apparatus. It is a figure which shows still another embodiment of the manufacturing method of a fluid propulsion apparatus. It is a figure which shows each stage of one Embodiment of the manufacturing method of a fluid propulsion apparatus. It is a figure which shows each stage of one Embodiment of the manufacturing method of a fluid propulsion apparatus. It is a figure which shows each stage of one Embodiment of the manufacturing method of a fluid propulsion apparatus.

FIG. 1 shows an embodiment of the fluid propulsion device 1. The fluid propulsion device includes fluid channels 3 and 7 through which the fluid is propelled. In different embodiments, the fluid propulsion device 1 can include, or be a component of, a lab-on-a-chip, printhead, or digital titrator. The lab-on-a-chip or digital titrator can be optimized for relatively high precision laboratory applications. The printhead can be a precision inkjet printhead or a precision fluid dispensing head for 2D or 3D printing. A particular embodiment of the fluid propulsion device 1 can be configured to inject fluid from a nozzle, such as the printhead or digital titrator, and in other embodiments it is not always necessary to inject the fluid. Instead, for example, it is possible to move the fluid along a particular sensor or reaction chamber within said channel. Applications suitable for the fluid propulsion device 1 include, but are not limited to, inkjet printing, 3D printing, digital titration, diagnostics, chemical reactors, and the like. In different embodiments, the fluid can be a liquid or a liquid mixed with a gas. Examples of suitable liquids include 3D printing agents such as inks, drugs, inhibitors or fluxes.

In one embodiment, the fluid propulsion device 1 includes a MEMS (Micro-Electro-Mechanical System) 5. The MEMS 5 includes at least one second fluid channel 7. The MEMS 5 includes an actuator 13 that moves a fluid through the second channel 7.

The fluid propulsion device 1 can include a structure of plastic compound 9 (for example, a structure having substantially rigidity). The plastic compound 9 can be an epoxy molding compound (for example, CEL400ZHF40WG commercially available from Hitachi Chemical®). It is possible to use a filler such as silica or metal oxide. MEMS 5 is embedded within the plastic compound structure 9. In the present disclosure, it can be understood that the implant is at least partially surrounded by the compound so that it is anchored within the compound. For example, most of the outer surface of MEMS 5 comes into contact with compound 9. In the illustrated embodiment, the MEMS 5 is surrounded by the plastic compound 9, except for the front surface 11 of the MEMS 5 exposed to the atmosphere and the back surface 12 of the MEMS 5 exposed to the first fluid channel 3. There is. In one embodiment, the embedding can be achieved by overmolding the MEMS with a compound using compression molding techniques.

The plastic compound structure 9 includes a first fluid channel 3 fluidly connected to the second fluid channel of the MEMS 5 and fluids into the second fluid channel 7 via the first fluid channel 3. Can be supplied. In one embodiment, the first fluid channel 3 has a minimum cross-sectional diameter D1 between the opposing walls of the first fluid channel 3, and the second fluid channel 7 is the second fluid channel 7. It has a minimum cross-sectional diameter D2 between the opposing walls of the second fluid channel 7, and the minimum cross-sectional diameter D2 of the second fluid channel 7 is smaller than the minimum cross-sectional diameter D1 of the first fluid channel 3. The minimum diameter D2 of the second fluid channel 7 can be less than 40 microns, less than 20 microns, less than 10 microns, or less than 7 microns in certain places. The second fluid channel 7 can include a network of multiple fluid channels, for example, at least one single fluid channel can branch into multiple fluid channels of smaller diameters. be. For example, the second fluid channel, in a single row, has a density higher than 300 nozzles / inch, a density higher than 600 nozzles / inch, a density higher than 900 nozzles / inch, or a density higher than 1200 nozzles / inch. It is possible to supply a fluid to the nozzle array having the nozzle array.

Here, the number of nozzles per inch should be understood as a relative density, i.e., in certain embodiments, the length of MEMS 5 is less than 1 inch. For example, a MEMS 5 with a density of about 1200 nozzles / inch and a nozzle array length of 3 mm would have about 142 nozzles.

In one embodiment, the majority of MEMS consists of silicon. For example, MEMS includes a silicon substrate with a thin film layer (eg, a SU8-based layer or a polymer-type layer) deposited on top. For example, the silicon substrate is made of single crystal silicon.

In one embodiment, MEMS 5 has a flaky (sliver) shape. MEMS 5 can have a length of a few mm or a few centimeters (eg, at least 0.2 cm, at least 0.5 cm, or at least 1 cm) (extending to the front of FIG. 1). MEMS 5 can have a width W of less than 2.3 mm (eg, less than 1.5 mm, eg, less than about 1 mm). MEMS 5 can have a thickness T of less than 0.8 mm (eg, less than 0.5 mm, less than 0.3 mm, less than about 0.2 mm, or less than about 0.15 mm). MEMS 5 includes an actuator array 13 that acts on the fluid. The actuator array 13 is disposed in the second fluid channel 7. For example, the actuator array 13 consists of a plurality of actuators arranged along the length of MEMS 5. The actuator can be a thermal resistor or a piezoelectric actuator.

The heat sink 15 can be arranged adjacent to the MEMS 5. The heat sink 15 is embedded in the plastic compound structure 9 adjacent to the MEMS 5. The heat sink 15 can be partially or completely surrounded by the plastic compound 9. In one embodiment, the heat sink 15 is overmolded with the plastic compound at the same time as the MEMS 5, using, for example, a compression molding process.

The heat sink 15 is capable of dissipating heat from the MEMS 5. Depending on the embodiment, the actuator 13 in the MEMS 5 may generate heat. In embodiments where the thermal actuators 13 are arranged at a relatively short pitch (eg, with a resolution of at least about 300, 600, 900, 1200, or 1800 actuators / inch), heat can be generated. MEMS 5 can heat up when a large number of actuators 13 are driven in a relatively short time frame. The heat generated by the actuator 13 will be propagated by the silicon substrate, the fluid, and possibly the thin film layer of MEMS 5. When MEMS 5 has a relatively thin thickness and / or width (as in some embodiments of the present disclosure), sufficient silicon to cope with excessive heat generation under certain operating conditions. Or the fluid may not be present. In another embodiment, the thermal resistor can include both an ejector resistor and a pump resistor in the thin film layer, eg, a row of at least 600 ink ejector resistors per inch. And can include at least 300 rows of pump resistors. In such a configuration, pump resistance may be added to the heat generation as compared to a MEMS having only an injection resistor.

Another solution relies on a MEMS substrate to act as a heatsink 15, but in the present disclosure, it has suitable thermal conductivity properties and is more cost effective than a silicon substrate (eg, a single crystal). Heat sink 15 is used. A separate heatsink 15 along the MEMS 5 can help dissipate heat from the MEMS 5. The separate heat sink 15 can facilitate the miniaturization of the MEMS 5 by increasing the amount and / or density of the thermal resistors and using a relatively small amount of silicon that has undergone the necessary treatment.

In one embodiment, the total volume of one (or more) heat sinks 15 in the fluid propulsion device 1 can be greater than the total volume of at least one MEMS 5 in the fluid propulsion device 1. Therefore, while reducing the silicon in MEMS 5, it is possible to counter the risk of heat generation with a relatively large heat sink 15 that can conduct and store sufficient heat. The material cost of the additional heat sink 15 can be relatively low compared to the material cost of silicon.

FIG. 2 shows another embodiment of the fluid propulsion device 101. The fluid propulsion device 101 is a fluid injection device. The fluid propulsion device 101 includes a plastic compound structure 109. MEMS 105, which consists mostly of silicon, is embedded within compound 109. The MEMS 105 can have a shape in the length direction. In FIG. 2, the length extends in the plane of the drawing. The heat sinks 115A and 115B are arranged along the MEMS 105 so as to conduct and release heat from the MEMS 105.

MEMS 105 includes a substrate 117 that supports a thin film structure 119 with a film as thick as a few microns. For example, the total thickness T of MEMS 105 can be about 0.5 mm or less, about 0.3 mm or less, about 0.2 mm or less, or about 0.15 mm or less, and the thickness of the thin film structure 119 is several tens. It can be micron (eg, 50 microns or less, 40 microns or less, 30 microns or less, 20 microns or less, or 15 microns or less). The thin film structure 119 can include SU8. The thin film structure 119 includes a nozzle plate 120, and a nozzle 127 extends to a front surface 111 thereof via the nozzle plate 120. The thin film structure 119 can include an ink injection chamber 123, and an ink injection actuator 125 for injecting ink via a nozzle 127 is provided in the ink injection chamber 123. The length of the array of ink jet actuators 125 can extend along the length of the MEMS 105, along both sides of the second fluid supply hole 107, into the surface of the drawing. The ink injection actuator 125 can be a thermal resistor.

Compound 109 includes a first fluid supply slot 103 along the length of MEMS 105. The MEMS 105 includes a second fluid supply slot 107 downstream of the first fluid supply slot 103. The second fluid supply slot 107 is capable of supplying fluid to each of the plurality of fluid injection chambers in the thin film structure 119.

As mentioned above, the first and second fluid supply slots can extend along the length of the MEMS 105. In another embodiment, the first and / or second fluid supply slots 103,107 include a plurality of separate fluid supply holes. In one embodiment, the separate fluid supply holes can be interconnected via at least one longitudinal manifold channel. The design of the fluid supply slot or channel can be determined according to the formation and / or machining method selected.

The fluid propulsion device 101 includes a plurality of heat sinks 115A and 115B for conducting and releasing heat from the MEMS 105. The heat sinks 115A and 115B extend at least partially adjacent to the MEMS 105 when viewed from the direction L perpendicular to the front surface 111.

The first heat sink 115A extends so as to be partially adjacent to the MEMS 105 in the direction L perpendicular to the front 111, partially above the MEMS 105, and surrounded by the compound 109 and / or the MEMS 105. ing. In one embodiment, the first heat sink 115A contacts the MEMS 105 or is connected to the MEMS 105 with a thermally conductive line and / or an adhesive. In another embodiment, the heat sink 115A extends away from the MEMS 105 by a short distance (eg, 0.5 mm or more, or 1 mm or more) sufficient to conduct heat from the MEMS 105. A layer of adhesive or a layer of plastic compound can extend between the heat sink 115A and the MEMS 105. For example, the first heat sink 115A is adhered to the MEMS 105 prior to the molding process in order to position the heat sink 115A relative to the MEMS 105 within the molded compound 109. In one embodiment, the adhesive is capable of substantially dissolving during production as the heated plastic compound surrounds the MEMS 105 and heat sink 115A. In another embodiment, the plastic compound can extend between the MEMS 105 and the heat sink 115A so that the heat sink 115A is completely surrounded by the plastic compound 109. Such fully embedded heat sink 115A is protected from being affected by fluid flowing through slots 103, 107 and nozzle 127. This can facilitate the use of a relatively wide range of heat sink materials and thus facilitate the implementation of a relatively cost effective heat sink 115A.

In another embodiment, one side of the first heat sink 115A can extend adjacent to the first fluid slot 103. The heat sink 115A can be directly exposed to the first fluid slot 103 or can extend a short distance from the fluid slot 103, the short distance via the first fluid slot 103. The distance is short enough to allow heat exchange with the flowing fluid. During operation, fluid cooling of heatsink 115A improves the cooling of MEMS 105.

The second heat sink 115B extends, for example, along at least a portion of the length of the MEMS 105 to the immediate vicinity of the MEMS 105. Like the first heatsink 115A, the second heatsink 115B is (i) adhered to the MEMS 105, (ii) extends from the MEMS 105 to a short distance via the plastic compound 109, and (iii) comes into direct contact with the MEMS 105. Alternatively, (iv) it is possible to indirectly contact the MEMS 105 via a thermally conductive lead wire or the like. In a further embodiment, the second heat sink 115B can extend adjacent to the front 111 to allow cooling by the atmosphere. In one embodiment, the second heat sink 115B is directly exposed to the atmosphere. In another embodiment, the second heatsink 115B extends a short distance from the front 111 to allow indirect air cooling, but not to be directly exposed to air or fluid droplets. The second heat sink 115B extends adjacent to the MEMS 105 and the front 111 to allow heat exchange with their components, while being completely surrounded by the plastic compound 109. In a further embodiment, only the first heat sink 115A or only the second heat sink 115B is disposed along a single MEMS 105 or along two opposing MEMS 105s.

FIG. 3 is a diagram showing a part of an exemplary fluid propulsion device 201. Device 201 includes a MEMS 205 and a heat sink 215 that are partially or completely embedded within compound 209. In the illustrated embodiment, the MEMS 205 includes a second fluid channel 207A, 207B, 207C, and a specific chamber 233 or a wider channel portion. The second fluid channels 207A, 207B, 207C are directly or indirectly connected to the first fluid channel within compound 209. The thermal resistance actuators 225A and 225B are arranged in the second fluid channel 207C and the chamber 233. The thermal resistance actuators 225A and 225B generate steam bubbles that propel the fluid in a desired direction by locally heating the fluid. In one embodiment, the second fluid channel comprises a second fluid supply slot 207A, a fluid supply channel 207B that supplies fluid from the second fluid supply slot 207A to the chamber 233, and a circulation channel 207C. In the example, the circulation channel 207C is connected to chamber 233 and fluid supply slot 207A to facilitate fluid circulation. In a further embodiment, the chamber 233 is disposed adjacent to the nozzle 227 (shown by the dotted line), and the thermal resistance actuator 225A in the chamber 233 discharges fluid from the chamber 233 via the nozzle 227. The second thermal resistance actuator 225B is disposed in the circulation channel 207C. The second thermal resistance actuator 225B is capable of circulating fluid in various parts of the second channels 207A, 207B, 207C. The second thermal resistance actuator 225B can be triggered by receiving less energy than the first thermal resistance actuator 225A but sufficient energy to pump the fluid through the circulation flow path 207C. In the embodiment, the fluidly interconnected chamber 233, nozzle 227, fluid supply channel 207B, fluid circulation channel 207C, and actuators 225A, 225B together form a droplet generator. It is possible to dispose at least one droplet generator array over the length of the MEMS 205 (eg, along the length of the second fluid slot 207A). For example, the droplet generator array can be disposed along both sides of the second fluid slot 207A.

In the illustrated embodiment, one fluid recirculation channel 207C is provided for each launch chamber 233. In another embodiment, one fluid recirculation channel 207C with thermal resistance actuators can be connected to multiple chambers 233. Therefore, the ratio of the amount of the injection actuator 225A to the amount of the circulation actuator 225B can be 1: 1, 2: 1, or 3: 1. Therefore, the ratio of the amount of launch chamber 233 to the amount of fluid circulation channel 207C in MEMS 205 can be 1: 1, 2: 1 or 3: 1. A first row that can be fluidly connected to a single second fluid slot 207A (eg, along one side of the second fluid slot 207A or above the second fluid slot 207A). The droplet generator can have an actuator density of about 300, 600, 900, 1200, or 1800 actuators / inch and can include both a thermal resistance injection actuator 225A and a thermal circulation actuator 225B. .. Another row of similar droplet generators can extend opposite and / or next to the first row of droplet generators fluidly connected to the same second fluid slot 207A. Actuators 225A and / or 225B in the same row can be staggered with respect to each other, i.e., can have different distances or slightly different positions from the second fluid supply slot 207A. For clarity, in the present disclosure, the density of actuators can include both injection (launch) actuators and circulation (pump) actuators in the same row, within which the actuators It is possible to have different positions with respect to the fluid slot 207A.

The circulation actuator 225B can facilitate fluid mixing and then prevent channel clogging and other damage to the MEMS 205. The circulation actuator 225B allows the thermal resistance density to be higher than that of a MEMS equipped with only the thermal resistance injection actuator 225A. During operation, the circulation actuator 225 is capable of further heating the MEMS 205. A relatively thin MEMS 205 with a relatively high density thermal resistance actuator with both types of thermal resistance actuators 225A, 225B can be used, for example, during operation (eg, with a relatively large amount of thermal resistance on a relatively small surface). It can run the risk of becoming relatively hot (when driven at the same time and / or relatively frequently). Within the thin MEMS 205, there may not be enough thermally conductive material, such as silicon, to conduct and dissipate heat from the area of the resistor within the desired time frame. In addition, compound 209 may not be able to dissipate heat sufficiently fast, at least because it has adiabatic properties compared to silicon. In certain embodiments, compound 209 is relatively thermally conductive, such as silicon, even when the composition of compound 209 is modified to improve thermal conductivity, such as by adding a thermally conductive component. It can still be relatively insulating compared to expensive materials. Even the thermally conductive compound 209 may not sufficiently conduct heat.

The exemplary fluid propulsion device 201 of FIG. 3 includes a heat sink 215 disposed away from and adjacent to the MEMS 205. The heat sink 215 can have a longitudinal shape (eg, be rectangular) and along the length of the MEMS 205 (eg, at least 50%, 60%, 80% of the length of the MEMS 205). , Or at least along 100%). Heat sink 215 can include thermally conductive materials such as ceramic, untreated silicon, and copper. The total volume occupied by the heat sink 215 can be larger than the volume occupied by the MEMS 205. In one embodiment, the heat sink 215 can have a relatively uniform thermal conductivity (eg, by having relatively uniform material properties). In another embodiment, the heat sink 215 has a higher thermal conductivity as it is closer to the MEMS 205. In various embodiments, the heat sink 215 can extend at least partially adjacent to and / or at least partially on the MEMS 205.

In one embodiment, both heat sink 215 and MEMS 205 are overmolded with compound 209. For example, the heat sink 215 is almost or completely surrounded by compound 209. For example, the space 241 between the heat sink 215 and the MEMS 205 can be filled with the molded plastic compound 209 and / or an adhesive (eg, an epoxy compound). The distance between the heat sink 215 and the MEMS 205 can be about 0.1-10 mm, or about 0.1-3 mm. For this reason, the fluid propulsion device 201 can include compound 209 in which a relatively thin elongated MEMS 205 with a high density circuit including a resistor array and at least one heat sink 215 are embedded. The heat sink 215 can have a longitudinal, rod-like, strip-like, and / or cubic shape.

FIG. 4 is a diagram showing another embodiment of the cross section of the fluid propulsion device 301. The fluid propulsion device 301 contains a molded plastic compound 309. Compound 309 includes a first fluid channel 303 leading to MEMS 305 embedded within the compound 309, the first fluid channel 303 supplying fluid to a second fluid channel within the MEMS 305. Heat sink 315 is embedded in compound 309 adjacent to MEMS 305.

MEMS 305 can include silicon, thin film layers, and thermal resistors. The MEMS 305 further includes a second fluid channel fluidly connected to the first fluid channel 303, the thermal resistor being disposed within the second channel. In one embodiment, a plurality of chambers are arranged in the second channel, and a thermal resistor is arranged in the plurality of chambers.

The heat sink 315 extends adjacent to the MEMS 305. In the illustrated embodiment, the heat sink 315 extends next to and above the MEMS 305. In the illustrated embodiment, one side surface of the heat sink 315 extends adjacent to the first fluid channel 303, and the other side surface of the heat sink 315 extends adjacent to the front surface 311 of the fluid propulsion device 301. In one embodiment, the heat sink 315 includes a lower portion 315A extending next to the MEMS 305 and a cantilever portion 315B overhanging the MEMS 305. In another embodiment, the heat sink 315 can include two separate blocks or bars, one block or bar extending adjacent to the front 311 and the other block or bar being the first. Extends adjacent to the fluid channel 303 of.

For example, during operation, the heat sink 315 exchanges heat with the fluid flowing through the second fluid slot 303 and / or the air at the front 311. In one embodiment, the heat sink 315 comes into direct contact with fluid or air to improve cooling. In another embodiment, a protective layer (eg, a layer of plastic compound 309) can extend between the heat sink 315 and the fluid or air, which is thin enough to facilitate cooling and is corroded, damaged. It has a thickness that protects the heat sink 315 from wear and the like.

FIG. 5 is a diagram showing still another embodiment of the cross section of the fluid propulsion device 401. The fluid propulsion device 401 contains at least one molded plastic compound 409A, 409B. The compounds 409A, 409B include a first fluid channel 403 leading to a MEMS 405 embedded in the compound 409, the first fluid channel 403 delivering fluid to a second fluid channel within the MEMS 405. Further, a heat sink 415 is embedded in the compound 409.

MEMS405 can have the same characteristics as the aforementioned MEMS 5,105,205,305. The heat sink 415 extends adjacent to the MEMS 405 (eg, next to the MEMS 405). In the illustrated embodiment, one side of the heat sink 415 extends adjacent to the front surface 411 of the fluid propulsion device 401. For example, during operation, the heat sink 415 exchanges heat with air at the front 311 to promote cooling. In one embodiment, the heat sink 415 is in direct contact with air. In another embodiment, a protective layer (eg, a layer of plastic compound 409) can extend between the heat sink 415 and the air, in which case the protective layer is thin enough to facilitate cooling and the heat sink. It will be thick enough to protect the 315 from corrosion, damage, wear, etc.

Compounds 409A, 409B can include a second compound layer 409B, which has improved thermal conductivity with respect to the first compound layer 409A of the compounds 409A, 409B. For example, MEMS405 can be implanted in a second compound 409B with improved thermal conductivity. For example, the heat sink 415 can be at least partially embedded in the second compound 409B. For example, the second compound can extend between the MEMS 405 and the heat sink 415 to increase the thermal conductivity between the MEMS 405 and the heat sink 415. This improvement in thermal conductivity can be achieved by the additive contained in the second plastic compound 409B. In different embodiments, the additive can include metals, metal oxides, copper, aluminum oxide, silica particles, carbon nanoparticles, ceramics and the like. The plastic compound carrier material can include epoxies. Prior to overmolding the heatsink 415 and MEMS 405, the additive is a predetermined grain of plastic compound (so that the thermally conductive additive is more present near the front 411 of the device than near the rear 412 on the opposite side). It can be contained in granulates) or layers. In one embodiment, the plastic compounds 409A, 409B can include multiple layers of plastic compounds 409A, 409B having different compositions. In a further embodiment, the composition of compounds 409A, 409B can be such that the gradient of thermal conductivity is achieved from back to front.

6-9 show cross-sectional views perpendicular to the front of various exemplary fluid propulsion devices 501,601,701,801. 6-9 show various exemplary patterns of heat sinks and MEMS.

FIG. 6 shows a fluid propulsion device 501 in which a plurality of parallel, laterally spaced MEMS 505s are embedded in a compound. Along a substantial portion of the length of the MEMS 505, multiple heat sinks 515 are embedded and extend parallel to the MEMS 505 next to each other. In the illustrated embodiment, one heat sink 515 extends along each MEMS 505. In this exemplary embodiment, the length of the heat sink 515 is shorter than the length of the MEMS 505. In one embodiment, this can be due to space efficiency. In another embodiment, the end of the MEMS 505 does not include a thermal resistor and it is possible to better concentrate the heat exchange on the densest part of the thermal resistor. In one embodiment, the shorter heat sink 515 can facilitate the space of the compound near the end of the MEMS 505, allowing the electrical circuit to be conveniently connected to the end of the MEMS 505. Is. In another embodiment, a slightly shorter heat sink 515 or a heat sink 515 near the central portion of the MEMS 515 allows the ends of the MEMS to overlap between the MEMS 505, 505B spaced longitudinally and laterally. do. In one embodiment, a portion of the MEMS 505B spaced longitudinally and laterally is shown by the dotted line in FIG.

FIG. 7 shows a fluid propulsion device 601 in which a plurality of parallel, laterally spaced MEMS 605s are embedded in a compound. At least one heat sink 615 is embedded and extended near the end of the MEMS 605. In the illustrated embodiment, one heat sink 615 extends along the ends of the plurality of MEMS 605s. For example, heat sink 615 overlaps the edges of laterally spaced MEMS 605s (eg, two or four MEMS 605s). In one embodiment, the heatsink 615 at the end of the MEMS allows a second fluid slot to extend along the heatsink 615 through the compound and connect to the first fluid channel of the MEMS 605. In the illustrated embodiment, one heatsink 615 extends adjacent to each first end of the MEMS 605 and another heatsink 615 adjacent to each opposite second end of the MEMS 605. It extends. For example, it is possible to connect an electrical circuit to the central part of MEMS 605.

8 and 9 show fluid propulsion devices 701,801 in which a plurality of parallel, laterally spaced MEMS 705,805 are embedded in a compound. At least one heat sink 715,815 is also embedded and extends longitudinally along the plurality of MEMS 705,805, at least partially next to the MEMS 705,805. In the illustrated embodiment, one heat sink 715,815 extends between two laterally spaced MEMS 705,805 over a substantial portion of the length of each MEMS 705,805. For example, in FIG. 8, the length of the heat sink 715 is shorter than the length of the MEMS 705. For example, in FIG. 9, the heat sink 815 is longer than the MEMS 805 and extends beyond the end of each MEMS 805.

In different embodiments of the fluid propulsion device, the amount of heat sink and the amount of MEMS can be 1: 4, 1: 3, 1: 2, 1: 1, 2: 1, etc. In certain embodiments, the heat sink can be shorter than the length of the MEMS, longer than the length of the MEMS, or approximately equal to the length of the MEMS.

FIG. 10 shows an embodiment of a method for manufacturing a fluid propulsion device. The method is (i) a MEMS composed mostly of silicon and containing fluid channels, (ii) a heat sink adjacent to the MEMS and dissipating heat from the MEMS, and (iii) at least partially in a molten state. It is possible to include placing the plastic compound in a mold (block 100). The MEMS can further include an actuator that propels the fluid. The method can further be included in curing the compound (block 110) such that the MEMS and heat sink are anchored in place within the cured compound. For example, after curing, the front of the MEMS is exposed.

FIG. 11 shows another embodiment of a method of manufacturing a fluid propulsion device. The method can include gluing the heat sink to the MEMS (block 200). In one embodiment, the MEMS is composed mostly of silicon and includes fluid circuits and actuators. The method can further include (i) MEMS and heat sinks, and (ii) placement of at least partially melted plastic compounds in the mold (block 210). The method can further include curing the compound (block 220) such that the MEMS and heat sink are fixed in place within the cured compound and the MEMS is partially exposed.

FIG. 12 shows yet another embodiment of a method of manufacturing a fluid propulsion device. The method can include placing the MEMS and heat sink against the release tape in the mold (block 300). The release tape can be a thermal release tape. The method can include depositing a plastic compound in the mold (block 310). It is possible to heat the plastic compound and / or the mold to at least partially melt the compound. The method can further include compressing the compound in the mold so that it at least partially surrounds both the MEMS and the heat sink (block 320). The method can further include curing the compound (block 330) such that the heat sink and MEMS are fixed in place within the cured compound. The method can further include stripping the release tape from the MEMS (block 340) and removing the fluid propulsion device from the mold.

13 to 15 show, for example, different states of the manufacturing method of the fluid propulsion device corresponding to the exemplary methods of FIGS. 10 to 12 in chronological order. FIG. 13 shows a partially open mold, in which a hot partially melted compound 909, a MEMS 905, and a heat sink 915 are disposed. The MEMS 905 and heat sink 915 are adhered to the release tape 951. The MEMS 905 and heat sink 915 can also be glued together via an adhesive 929. Mold 953 can be part of a compression molding machine. Mold 953 can include a first shell 955 and carrier 957. The carrier 957 can support the release tape 951 together with the MEMS 905 and the heat sink 915. The first shell 955 can include a first fluid channel projection 957 for forming a first fluid channel in compound 909. The MEMS 905 can include a substrate and a thin film layer having a second fluid channel 907 of micron size. The first fluid channel projection 957 can be aligned with the second fluid channel 907 so as to align with the second fluid channel 907 on the back surface of the MEMS 905.

In one embodiment, the protrusion can be included in the design of the first mold of the mold. In another embodiment, the protrusion can be a mold insert. In yet another embodiment, the first fluid channel can be finished using a machining method. In yet another embodiment, the first fluid channel can be fully machined after molding (without molding).

In FIG. 14, the first mold shell 955 and carrier 957 move toward each other to compress compound 909 in the mold, which overmolds the MEMS 905 and the heat sink 915. After compressing the hot compound 909 into the shape of a molded cavity, the compound 909 can be passively cooled to secure the heat sink 915 and MEMS 905 in place within the cured compound 909. After opening the mold 953, the release tape 951 can be easily removed from the heat sink 915 and MEMS 905.

FIG. 15 shows an embodiment of the fluid propulsion device 901 obtained as a result of the steps of FIGS. 13 and 14. The fluid propulsion device 901 can include a heat sink 915 and a MEMS 905 embedded in compound 909. Compound 909 comprises a first fluid channel 903 that is at least partially formed by a molding process and / or at least partially formed by a machining process. The first fluid channel 903 is aligned with and fluidly connected to the second fluid channel 907 in the MEMS 905. The heat sink 915 extends adjacent to the MEMS 905 to dissipate heat from the MEMS 905, at least during operation of the MEMS 905.

The fluid propulsion devices of the present disclosure can have different uses. One application can be 2D printing, 3D printing, or distribution of fluid by high precision digital control such as digital titration, in which case the fluid is ejected from a nozzle in front of the MEMS. .. Other embodiments of fluid propulsion devices, such as lab-on-a-chip, do not necessarily have to include nozzles. The MEMS can be configured to allow the fluid to flow through the harm device without necessarily injecting the fluid. The MEMS can include a thermal actuator or a piezoelectric actuator that acts as an ejection device and / or a pump to propel the fluid through a second fluid channel.

In different embodiments, the compound can be an epoxy molded compound, a thermal plastic, or the like. The heat sink can have any shape and / or size. The heat sink can be made from a relatively inexpensive thermally conductive material that can be embedded in a plastic compound. Suitable heat sink materials include copper, ceramics, semi-processed (bulk) silicon, aluminum, ferroalloys, carbon nanoparticles and the like. Suitable heat sink shapes can include block or rectangular heat sinks, but can also include fins, threads, etc. that can be applied to increase thermal conductivity. ..

The fluid propulsion device can be a subcomponent of a larger device. References to specific aspects or directions in this disclosure should be construed as exemplary and not limiting. The presented device can have any orientation. The dimensions and ratios shown in the drawings are diagrams of one embodiment and should not be described as limitations.

Although the drawings show a limited amount of actuators and fluid channels, each MEMS can include high density actuator arrays, high density fluid channel arrays, high density chamber arrays, and / or high density nozzle arrays, etc. Is. In addition, each fluid propulsion device can be provided with at least two longitudinally stacked MEMS in which the ends of a plurality of rows of MEMS laterally adjacent to each other overlap. An exemplary fluid propulsion device can be a medium width fluid distributor for 2D or 3D printing. Within each MEMS, each fluid channel can actually contain multiple fluid channels. In certain embodiments, the smallest fluid channel in the MEMS can have a cross-sectional diameter of about 1-40 microns.

The heat sink of the present disclosure can be a single solid material that is both cost efficient and thermally conductive. For example, the material can be any bulk material or alloy. The heat sink can be longitudinal, rod-shaped, strip-shaped, and / or block-shaped. In other embodiments, the heat sink can have protruding fins or wires to improve cooling.

In the following, an exemplary embodiment consisting of a combination of various constituent elements of the present invention will be shown.
1. 1. A plastic compound structure having a first fluid channel,
A MEMS embedded in the compound, comprising a substrate, a second fluid channel fluidly connected to the first fluid channel, and a fluid propulsion actuator in the second fluid channel. With MEMS
A fluid propulsion device with a heat sink next to the MEMS to dissipate heat from the MEMS.
The heat sink is at least partially surrounded by the compound.
The MEMS has a width of less than 2.3 mm and a thickness of less than 0.8 mm.
A fluid propulsion device in which the MEMS has an average density of at least 300 pieces / inch per row of actuators.
2. The fluid propulsion device according to item 1 above, wherein the heat sink extends along at least half the length of the MEMS.
3. 3. The fluid propulsion device according to item 1, wherein the total volume of the heat sink is larger than the total volume of the MEMS.
4. The substrate contains silicon, the second fluid channel extends through the substrate and connects to the first fluid channel.
The MEMS comprises a thin film structure on the substrate in the vicinity of the front surface and has a nozzle for discharging a fluid connected to the second fluid channel.
The heat sink extends next to the MEMS when viewed in a direction perpendicular to the front surface.
The fluid propulsion device according to item 1 above.
5. The fluid propulsion device according to item 4, wherein the actuator includes an injection actuator for discharging a fluid from the nozzle in the thin film structure near the nozzle.
6. The fluid propulsion device according to item 1 above, wherein the actuator comprises a thermal resistor that acts as a pump that circulates fluid through the second channel.
7. The fluid propulsion device according to item 1, wherein the compound extends between the MEMS and the heat sink.
8. The compound comprises a first compound and a second compound having a different composition having a higher thermal conductivity than the first compound, and the MEMS and the heat sink are at least partially contained within the second compound. The fluid propulsion device according to item 1 above, which is embedded in a device.
9. The fluid propulsion device according to item 1 above, which includes MEMS having a plurality of longitudinal shapes arranged in parallel.
10. The fluid propulsion device according to item 9, wherein one heat sink extends next to at least two MEMS and dissipates heat from the two MEMS.
11. The fluid propulsion device according to item 1 above, which includes the heat sink more than the MEMS.
12. The fluid propulsion device according to item 1, wherein the heat sink is completely surrounded by the compound.
13. The fluid propulsion device according to item 1 above, wherein the heat sink is embedded in the compound and is at least partially exposed to the atmosphere or fluid during operation.
14. A MEMS containing a fluid channel and at least one actuator in the fluid channel,
A heat sink adjacent to the MEMS to dissipate heat from the MEMS,
A plastic compound that is at least partially melted is placed in the mold and
After curing, the compound in the mold is compressed and cured so that the MEMS and the heat sink are fixed in place in the compound.
A method of manufacturing a fluid propulsion device comprising aligning a fluid channel in the compound with the fluid channel in the MEMS.
15. 14. The method of item 14, comprising adhering the heat sink to the MEMS before placing it in the mold.
16. A fluid propulsion MEMS and heat sink are placed against the release tape in the mold, the MEMS having a width of less than 2.3 mm and a thickness of less than 0.8 mm, most of which is composed of silicon, and the fluid. Includes a channel and a thermal resistor array within the fluid channel
A plastic compound is deposited in the mold so as to cover at least one of the MEMS and the heat sink.
The compound in the mold is compressed so as to at least partially surround the MEMS and the heat sink.
By curing the compound, the heat sink and the MEMS are fixed in a predetermined position in the compound.
A method for manufacturing a fluid propulsion device, which comprises peeling the release tape.

Claims (15)

A plastic compound structure having a first fluid channel,
A MEMS embedded in the plastic compound, including a substrate, a second fluid channel fluidly connected to the first fluid channel, and a fluid propulsion actuator in the second fluid channel. , MEMS and
A fluid propulsion device with a heat sink next to the MEMS to dissipate heat from the MEMS.
The heat sink is completely surrounded by the plastic compound and has a first portion extending adjacent to the first fluid channel.
Fluid propulsion device. It said first portion of said heat sink, through the thin protective layer of the plastic compound has come in contact with the fluid in the first fluid channel, a fluid propulsion apparatus according to claim 1. The fluid propulsion device according to claim 1 or 2, wherein the heat sink has a second portion extending adjacent to the front surface of the fluid propulsion device. The second portion of the heat sink, through a thin yet protective layer of the plastic compound by the front of the fluid propulsion system in contact with air, a fluid propulsion system of claim 3. The invention of any one of claims 1 to 4, wherein the MEMS has a longitudinal shape, the heat sink has a longitudinal shape, and extends along at least half the length of the MEMS. The described fluid propulsion device. The substrate contains silicon, the second fluid channel extends through the substrate and connects to the first fluid channel.
The MEMS comprises a thin film structure on the substrate in the vicinity of the front surface and has a nozzle for discharging a fluid connected to the second fluid channel.
The fluid propulsion device according to any one of claims 1 to 5. The fluid propulsion actuator comprises an injection actuator in the thin film structure near the nozzle for discharging the fluid from the nozzle and an actuator acting as a pump for circulating the fluid through the second fluid channel. The fluid propulsion device according to claim 6, which includes one or both. The fluid propulsion device according to any one of claims 1 to 7, wherein the actuator includes a thermal resistor or a piezoelectric actuator. It said heat sink, pre-Symbol contacting the MEMS through a thin film layer of the plastic compound, a fluid propulsion device according to any one of claims 1 to 8. The plastic compound comprises a first compound and a second compound having a different composition having a higher thermal conductivity than the first compound, and the MEMS and the heat sink are at least in the second compound. The fluid propulsion device according to any one of claims 1 to 9, which is partially embedded. The fluid propulsion device according to any one of claims 1 to 10, which has a shape in the longitudinal direction and includes a plurality of MEMS arranged in parallel. The fluid propulsion device of claim 11, wherein one heat sink extends next to at least two MEMS and dissipates heat from the two MEMS. The fluid propulsion device according to any one of claims 1 to 12, which includes the heat sink in an amount larger than that of the MEMS. A fluid propulsion MEMS and heat sink are placed against the release tape in the mold, the MEMS being composed mostly of silicon and containing a fluid channel and a thermal resistor array within the fluid channel.
The MEM S at least partially have covered the, and to completely cover the heat sink, depositing plastic compound into the mold,
The MEM S only at least partially taken circumference, and to surround the heat sink completely compressing the plastic compound in said mold,
By curing the plastic compound, the heat sink and the MEMS are fixed in a predetermined position in the plastic compound.
Including peeling the release tape
A method of manufacturing a fluid propulsion device, wherein said position comprises a position where a portion of the heat sink extends adjacent to a fluid channel in the plastic compound. The portion of the heat sink, the plastic compound thin through the protective layer of being曝the fluid channel in the plastic compound, the production method of a fluid propulsion system of claim 14.

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