JP6888298B2 - Glass plate and its manufacturing method - Google Patents

Description

The present invention relates to a glass plate having through holes and a method for producing the glass plate.

For example, a glass interposer is known as an application of a glass plate having a through hole. In a glass interposer, a conductive substance is filled in a through hole of a glass plate and used.

_{Patent Document 1 below discloses a method of irradiating a glass plate with a CO 2} laser to form a through hole as a method of manufacturing a glass plate having a through hole. In Patent Document 1, a metal film having an opening is placed on a glass plate, and the glass plate exposed in the opening is irradiated with a _{CO 2 laser.} As a result, it is said that a through hole having a small degree of taper can be formed.

Japanese Unexamined Patent Publication No. 2016-78038

However, with the glass plate of Patent Document 1, the degree of taper of the through hole could not be sufficiently reduced. Therefore, when the glass plate of Patent Document 1 is used for a glass interposer or the like, the filling property of the conductive substance in the through hole is not sufficient.

In particular, in recent years, 2.5D-mounted and 3D-mounted glass interposers have been studied, and the hole diameter of the through hole tends to be smaller. Therefore, it is increasingly required to improve the filling property of the conductive substance in the through hole. ing.

An object of the present invention is to provide a glass plate having a through hole, which can enhance the filling property of a conductive substance in the through hole, and a method for producing the glass plate.

The glass plate according to the present invention is a glass plate having a through hole, the thickness of the glass plate is 50 μm or more and 2 mm or less, the hole diameter of the through hole is 500 μm or less, and the taper of the through hole. It is characterized by an angle of 86 degrees or more.

The glass plate according to the present invention preferably includes a glass plate main body and a resin layer provided on the glass plate main body.

In the glass plate according to the present invention, the thickness of the glass plate body is preferably 500 μm or less.

The glass plate according to the present invention preferably has a through hole having a hole diameter of 100 μm or less.

The glass plate according to the present invention is preferably used as an interposer.

The method for manufacturing a glass plate according to the present invention is a method for manufacturing a glass plate having a through hole, which is a step of placing and fixing the glass plate on a support base and fixing the glass plate on the support base. The glass plate is provided with a step of forming a through hole in the glass plate by irradiating the glass plate with a pulse laser, and when irradiating the pulse laser, the pulse is formed along a target shape of the through hole. It is characterized by scanning a laser.

In the method for producing a glass plate according to the present invention, the wavelength of the pulse laser is preferably 1000 nm or more.

In the method for producing a glass plate according to the present invention, it is preferable that the pulse laser is a femtosecond laser.

In the method for producing a glass plate according to the present invention, the glass plate includes a glass plate main body and a resin layer provided on the main surface of the glass plate main body, and a pulse laser is provided from the resin layer side of the glass plate. It is preferable to irradiate.

According to the present invention, it is possible to provide a glass plate having a through hole, which can enhance the filling property of a conductive substance in the through hole.

It is a schematic plan view which shows the glass plate which concerns on 1st Embodiment of this invention. It is a schematic cross-sectional view which shows the through hole part in the glass plate which concerns on 1st Embodiment of this invention in an enlarged manner. (A)-(d) are schematic cross-sectional views for explaining an example of the manufacturing method of the glass plate which concerns on 1st Embodiment of this invention. (A) and (b) are schematic cross-sectional views showing an enlarged through-hole portion in a glass plate in order to explain a method of scanning a pulse laser. It is a schematic cross-sectional view which shows the through hole part in the glass plate which concerns on 2nd Embodiment of this invention in an enlarged manner. It is a schematic cross-sectional view which shows the through hole part in the glass plate which concerns on 3rd Embodiment of this invention in an enlarged manner. It is a schematic cross-sectional view which shows an example of the device using a glass interposer.

Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. Further, in each drawing, members having substantially the same function may be referred to by the same reference numerals.

(First Embodiment)
FIG. 1 is a schematic plan view showing a glass plate according to the first embodiment of the present invention. Further, FIG. 2 is a schematic cross-sectional view showing an enlarged through-hole portion in the glass plate according to the first embodiment of the present invention.

As shown in FIG. 1, the glass plate 1 has a plurality of through holes 2. The through hole 2 is provided so as to extend from the first main surface 1a to the second main surface 1b of the glass plate 1 shown in FIG. The first and second main surfaces 1a and 1b of the glass plate 1 are provided so as to face each other.

In the present embodiment, the glass plate 1 includes a glass plate main body 3 and a first resin layer 4. A first resin layer 4 is provided on the glass plate main body 3. The glass plate main body 3 is provided on the second main surface 1b side of the glass plate 1. The first resin layer 4 is provided on the first main surface 1a side of the glass plate 1.

The thickness of the glass plate 1 is 50 μm or more and 2 mm or less. The hole diameter of the through hole 2 is 500 μm or less. The taper angle θ of the through hole 2 is 86 degrees or more. In FIG. 2, the taper angle θ is an angle formed by the second main surface 1b of the glass plate 1 and the inner side surface 1c. The inner side surface 1c is a side surface desired for the through hole 2 in the glass plate 1. Further, it is desirable that the hole diameter of the through hole 2 is within the above range for both the hole diameter D1 of the through hole 2 on the first main surface 1a and the hole diameter D2 of the through hole 2 on the second main surface 1b. ..

In the present embodiment, since the taper angle θ of the through hole 2 is 86 degrees or more, the filling property of the conductive substance can be improved when the through hole 2 is filled with the conductive substance. Since the filling property of the conductive substance in the through hole 2 can be improved, the glass plate 1 can be suitably used for applications such as a glass interposer. In particular, even when the hole diameter of the through hole 2 is as small as 500 μm or less, the filling property of the conductive substance can be improved, so that it can be more preferably used for a glass interposer for 2.5D mounting or 3D mounting.

The glass plate 1 of the present embodiment has 1000 or more ^{through holes 2 per 1 cm 2.} The glass plate 1 ^{preferably has 5,000 or more through holes 2 per 1 cm 2} , and more preferably 10,000 or more. The number of through holes 2 is generally 30,000 or less per ^{1 cm 2.}

The hole diameter of the through hole 2 is preferably 100 μm or less, more preferably 50 μm or less, and further preferably 20 μm or less. When the hole diameter of the through hole 2 is not more than the above upper limit, it can be more preferably used for applications such as a glass interposer. The hole diameter of the through hole 2 is generally 50 μm or more. The pitch of the through holes 2 is preferably 300 μm or less, more preferably 100 μm to 200 μm, and even more preferably 25 μm to 50 μm. In the present specification, the pitch of the through holes 2 is the distance between the centers of the through holes 2 adjacent to each other.

The taper angle θ of the through hole 2 is preferably 87 degrees or more, more preferably 88 degrees or more, still more preferably 89 degrees or more, and particularly preferably 90 degrees. When the taper angle θ of the through hole 2 is equal to or more than the above lower limit or 90 degrees, the filling property of the conductive substance in the through hole 2 can be further improved.

The thickness of the glass plate 1 is preferably 75 μm or more, more preferably 100 μm or more, preferably 600 μm or less, more preferably 400 μm or less, still more preferably 250 μm or less. When the thickness of the glass plate 1 is at least the above lower limit, it becomes more difficult to break. Further, when the thickness of the glass plate 1 is not more than the above upper limit, the height of the device using the glass plate 1 as a glass interposer can be further reduced.

In the present embodiment, the thickness of the glass plate body 3 is preferably 500 μm or less, more preferably 300 μm or less, still more preferably 150 μm or less. When the thickness of the glass plate main body 3 is not more than the above upper limit, the height of the device using the glass plate 1 as a glass interposer can be further reduced. The thickness of the glass plate body 3 is generally 10 μm or more.

The material of the glass plate main body 3 is not particularly limited, and examples thereof include soda-lime glass and non-alkali glass. Further, it may be aluminosilicate glass used as tempered glass.

The thickness of the first resin layer 4 is preferably 30 μm or more, more preferably 60 μm or more. When the thickness of the first resin layer 4 is equal to or greater than the above lower limit, the glass plate body 3 becomes more difficult to crack. The thickness of the first resin layer 4 is generally 150 μm or less.

As shown in FIG. 2, the first resin layer 4 is formed by laminating a PET film (polyethylene terephthalate film) 4b on the optical adhesive film 4a. However, another resin film may be used instead of the PET film 4b. Examples of other resin films include acrylic films. Another pressure-sensitive adhesive may be used instead of the optical pressure-sensitive adhesive film 4a, or the pressure-sensitive adhesive may not be used. Further, the first resin layer 4 may be a coating film.

Next, a method for manufacturing the glass plate 1 will be described.

Manufacturing method of glass plate;
FIG. 3 is a schematic cross-sectional view showing an example of a method for manufacturing a glass plate according to the first embodiment of the present invention.

First, as shown in FIG. 3A, a glass plate 1 having a first resin layer 4 provided on the glass plate main body 3 is prepared, and the glass plate 1 is placed on a support base 10. The glass plate 1 can be prepared by laminating the glass plate main body 3 and the PET film 4b via the optical adhesive film 4a. Further, when the glass plate 1 is placed on the support base 10, the glass plate 1 is placed with the liquid layer 11 interposed therebetween.

Next, as shown in FIG. 3B, the liquid layer 11 is cooled and solidified to form a solidified layer 12, so that the glass plate 1 is fixed on the support base 10 via the solidified layer 12. For example, when water is used as the liquid layer 11, the liquid layer 11 can be solidified by cooling the temperature of the liquid layer 11 to 0 ° C. or lower. When it is desired to solidify the liquid layer 11 at a temperature higher than 0 ° C., the liquid layer 11 may be formed using a liquid having a freezing point higher than 0 ° C. (for example, methyl anthranilate, methyl myristate, dimethyl sulfoxide, etc.). .. As a method for solidifying the liquid layer 11, for example, the liquid layer 11 may be cooled and solidified by using a Peltier element or the like as the support base 10.

Next, as shown in FIG. 3C, the glass plate 1 fixed on the support base 10 by the solidifying layer 12 is irradiated with the pulse laser 13 to form a through hole 2 in the glass plate 1. When irradiating the pulse laser 13, the pulse laser 13 is scanned and drawn along the plane shape of the target through hole 2. More specifically, the pulse laser 13 is operated from the position shown in FIG. 4 (a) along the planar shape of the target through hole 2, and is drawn from the position shown in FIG. 4 (b). Subsequently, the pulse laser 13 is scanned from the position shown in FIG. 4B along the planar shape of the target through hole 2 and drawn to the position shown in FIG. 4A. By performing this operation at least once, the through hole 2 is formed in the glass plate 1.

It is preferable to maintain the solidified state of the solidified layer 12 while irradiating the pulse laser 13.

The wavelength of the pulse laser 13 is preferably 1000 nm or more, more preferably 1300 nm or more, and further preferably 1500 nm or more. The upper limit of the wavelength of the pulse laser 13 is not particularly limited, but is generally about 2000 nm.

The pulse laser 13 is preferably a pulse laser of 10 picoseconds or less, more preferably an ultrashort pulse laser of 1 picosecond or less, and particularly preferably a femtosecond laser. By using a laser having such a small pulse width, a multiphoton absorption phenomenon can occur, and ablation processing can be performed without diffusing heat to the peripheral portion.

After forming a predetermined number of through holes 2 in the glass plate 1, as shown in FIG. 3D, the temperature of the solidifying layer 12 is raised to melt the solidifying layer 12 into a liquid layer 11. After forming the liquid layer 11, the glass plate 1 on which the through hole 2 is formed is removed from the support base 10. The thickness of the liquid layer 11 is appropriately adjusted according to the liquid used. The thickness may be such that the glass plate 1 can be fixed when the solidified layer 12 is formed, and the glass plate 1 can be removed when the liquid layer 11 is formed.

A feature of the manufacturing method of the present embodiment is that the through hole 2 is formed in the glass plate 1 by scanning the pulse laser 13 along the plane shape of the target through hole 2 and drawing the pulse laser 13. In the through hole 2 obtained by such a manufacturing method, the taper angle θ can be set to 86 degrees or more. Therefore, when the through hole 2 is filled with the conductive substance, the filling property of the conductive substance can be improved. Further, since the filling property of the conductive substance in the through hole 2 can be improved, the obtained glass plate 1 can be suitably used for a glass interposer or the like.

Further, in the manufacturing method of the present embodiment, it is preferable to irradiate the pulse laser 13 from the first resin layer 4 side of the glass plate 1. When the pulse laser 13 is irradiated from the glass plate 1 side, when the holes penetrate the glass plate 1, bubbles are generated in the first resin layer 4 due to the impact of the laser, and the holes may not be processed accurately. By irradiating the pulsed laser 13 from the resin layer 4 side of the above, it is possible to more reliably prevent bubbles from being generated in the first resin layer 4 due to the impact of the laser.

In the manufacturing method of the present embodiment, a method of fixing the glass plate 1 on the support base 10 by solidifying the liquid layer 11 has been described, but the method is not limited to this, and the glass plate is not limited to this method. 1 may be fixed to the support base 10. Further, the pulse laser 13 may be irradiated without fixing the glass plate 1 to the support base 10.

(Second Embodiment)
FIG. 5 is a schematic cross-sectional view showing an enlarged through-hole portion in the glass plate according to the second embodiment of the present invention.

As shown in FIG. 5, in the glass plate 21, the second resin layer 5 is laminated on the main surface 3a on the side opposite to the first resin layer 4 of the glass plate main body 3. The second resin layer 5 is formed by laminating a PET film (polyethylene terephthalate film) 5b on the optical adhesive film 5a. Other points are the same as those in the first embodiment.

Since the taper angle θ of the through hole 2 of the glass plate 21 is 86 degrees or more, the filling property of the conductive substance can be improved when the through hole 2 is filled with the conductive substance. Further, since the filling property of the conductive substance in the through hole 2 can be improved, the glass plate 21 can be suitably used for applications such as a glass interposer.

(Third Embodiment)
FIG. 6 is a schematic cross-sectional view showing an enlarged through-hole portion in the glass plate according to the third embodiment of the present invention.

As shown in FIG. 6, the glass plate 31 is not provided with the first resin layer 4. Other points are the same as those in the first embodiment.

Even in the glass plate 31, since the taper angle θ of the through hole 2 is 86 degrees or more, the filling property of the conductive substance can be improved when the through hole 2 is filled with the conductive substance. Further, since the filling property of the conductive substance in the through hole 2 can be improved, the glass plate 31 can be suitably used for applications such as a glass interposer.

As shown in the first to third embodiments, in the present invention, the resin layer may or may not be provided on one side or both sides of the glass plate main body. Even when the thickness of the glass plate body is reduced by providing the resin layer, the glass plate body can be made more difficult to break.

(Glass interposer)
FIG. 7 is a schematic cross-sectional view showing an example of a device using a glass interposer. As described above, the glass plate of the present invention can be used as a glass interposer. FIG. 7 shows an example of using the glass interposer 41. As shown in FIG. 7, a through electrode 51 is provided on the printed circuit board 50, and the through electrode 51 is passed through a through hole 42 of the glass interposer 41. The through electrode 51 passed through the through hole 42 is connected to the through electrode 61 of the laminated semiconductor 60 mounted on the glass interposer 41.

In the above embodiment, the use of the glass plate having a through hole in the present invention as a glass interposer has been described, but the use of the glass plate having a through hole in the present invention is not limited to this. It can also be used for other purposes.

Specifically, the glass plate of the present invention has a plurality of through holes formed with a desired size and pitch with high accuracy, has excellent heat resistance, and is repeatedly used even after being subjected to heat treatment such as dry heat sterilization. Therefore, for example, in medical applications, it can also be used as a filter for efficiently separating and extracting cells of a desired size from a cell suspension with high accuracy.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.

(Example)
In the embodiment, first, PET is applied to a glass film (manufactured by Nippon Electric Glass Co., Ltd., trade name "OA-10G", thickness: 150 μm) as the glass plate main body 3 via an optical adhesive film 4a (thickness: 25 μm). A film 4b (thickness: 38 μm) was laminated, a glass plate 1 was prepared, and fixed on a support base. Next, a through hole 2 was formed in the glass plate 1 by irradiating the femtosecond laser from the first resin layer 4 side of the glass plate 1 fixed on the support base. When irradiating the femtosecond laser, the femtosecond laser was scanned along the target shape of the through hole 2. In the obtained glass plate 1, the hole diameter D1 of the through hole 2 on the first main surface 1a, the hole diameter D2 of the through hole 2 on the second main surface 1b, and the taper angle θ were measured. The hole diameters D1 and D2 of the through holes 2 are the hole diameters of the ten through holes 2 randomly selected by observing the surface shapes of the first and second main surfaces 1a and 1b using a digital microscope. It was calculated from the average value. Further, the taper angle θ was calculated by the following formula (1) from the thickness t of the glass plate main body 3 and the hole diameters D1 and D2 of the through hole 2.

Taper angle θ = tan ^-1 [2t / (D1-D2)] ... Equation (1)

The results are shown in Table 1 below.

1,21,31 ... Glass plates 1a, 1b ... First and second main surfaces 1c ... Inner surface 2 ... Through holes 3 ... Glass plate body 3a ... Main surfaces 4, 5 ... First and second resin layers 4a , 5a ... Optical adhesive film 4b, 5b ... PET film 10 ... Support 11 ... Liquid layer 12 ... Solidification layer 13 ... Pulsed laser 41 ... Glass interposer 42 ... Through hole 50 ... Printed circuit board 51 ... Through electrode 60 ... Laminated semiconductor 61 … Through electrode

Claims (7)

A glass plate with through holes
The thickness of the glass plate is 50 μm or more and 2 mm or less.
The hole diameter of the through hole is 500 μm or less.
The taper angle of the through hole is 86 degrees or more.
The glass plate includes a glass plate main body and a resin layer provided on the glass plate main body.
The resin layer is provided on said glass plate body, it is possible to transmit more pulse laser wavelength 1000 nm, and chromatic optical adhesive film, a polyethylene terephthalate film in which the laminated on an optical adhesive film ,
A glass plate provided with a liquid layer on the glass plate for fixing the glass plate to a support base by solidification . The glass plate according to claim 1, wherein the thickness of the glass plate body is 500 μm or less. The glass plate according to claim 1 or 2, wherein the through hole has a hole diameter of 100 μm or less. The glass plate according to any one of claims 1 to 3, which is used for an interposer. An optical device having a glass plate main body and a resin layer provided on the glass plate main body, and the resin layer provided on the glass plate main body and capable of transmitting a pulse laser having a wavelength of 1000 nm or more. A method for producing a glass plate having an adhesive film and a polyethylene terephthalate film laminated on the optical adhesive film and having through holes.
A step of preparing a glass plate by laminating the glass plate main body and the polyethylene terephthalate film via the optical adhesive film.
The process of placing the prepared glass plate on the support base with a liquid layer interposed therebetween.
A step of fixing the placed glass plate on the support base by solidifying the liquid layer into a solidified layer, and
A step of forming a through hole in the glass plate fixed on the support base by irradiating the glass plate fixed on the support base with a pulse laser having a wavelength of 1000 nm or more.
With
A method for manufacturing a glass plate, which scans the pulsed laser along the shape of the target through hole when irradiating the pulsed laser. The method for manufacturing a glass plate according to claim 5, wherein the pulsed laser is a femtosecond laser. The method for producing a glass plate according to claim 5 or 6 , wherein the pulse laser is irradiated from the resin layer side of the glass plate fixed on the support base.

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