JP6882757B2 - Ultrasonic bonding device - Google Patents

Description

The present invention relates to an ultrasonic bonding apparatus that bonds two superposed objects to be bonded by ultrasonic vibration.

Conventionally, a general ultrasonic bonding device is a state in which a horn having a bonding tip attached to the lower side and two panel-shaped bonded bodies made of a metal material, which are provided below the horn, are overlapped with each other. The horn is provided with a mountable amble, and the horn is lowered to sandwich the two objects to be bonded between the amble and the chip, and the horn is vibrated in the horizontal direction to perform ultrasonic bonding.

By the way, in the ultrasonic bonding apparatus as described above, when ultrasonic bonding is repeatedly performed, a phenomenon occurs in which a part of the object to be bonded becomes powdery and adheres to the chip surface. Then, if ultrasonic bonding is performed while a part of the object to be bonded is powdered and adhered to the surface of the chip, in the worst case, the object to be bonded is stuck to the chip and the chip rises after bonding. At the same time, the object to be bonded to the chip is pulled up, so that there is a problem that the bonding work cannot be continued.

In order to avoid this, for example, in Patent Document 1, an air flow passage through which air can flow is formed inside the horn and the chip. The air flow passage is open on the lower surface of the chip, and even if the material to be joined is stuck to the chip, the material to be bonded is chipped by the ejection force of air discharged from the opening of the air flow passage. It can be separated from.

Japanese Unexamined Patent Publication No. 2008-142738

However, in the ultrasonic bonding apparatus disclosed in Patent Document 1, when ultrasonic bonding is repeatedly performed, a part of the powdered object to be bonded gradually moves due to the vibration operation of the chip to open an air flow passage. There is a risk of getting into the part. Then, the air flow passage is narrowed or blocked, and even if the bonded body is fixed to the chip, the bonded body cannot be separated from the chip.

The present invention has been made in view of these points, and an object of the present invention is to provide an ultrasonic bonding apparatus capable of reliably separating an object to be bonded from a chip after bonding even if the bonding operation is repeated. To provide.

In order to achieve the above object, the present invention is characterized in that a slide member that can slide up and down is provided inside or outside the chip.

Specifically, a horn in which a bonding tip is located on the lower side, a vibrating means for vibrating the horn in the horizontal direction, an elevating means for raising and lowering the horn, and two coverings provided below the horn. It is provided with an amble on which the bonded bodies can be stacked and placed, and the horn is lowered by the elevating means to sandwich the two bonded bodies between the amble and the chip, and the horn is vibrated by the vibrating means. The following solutions were taken for ultrasonic bonding devices configured to perform ultrasonic bonding.

That is, in the first invention, a slide member provided inside or outside the chip and slidable in the vertical direction, and the lower end portion of the slide member is slid downward by pressing the slide member to form the lower end portion of the chip. The horn is provided with a pressing means for popping out from, and the horn has a plurality of the chips, and each of the chips is provided with the slide member and the pressing means, respectively. It is characterized in that it is configured to switch.

In the second invention, in the first invention, the chip is formed with an accommodating recess that opens on the lower surface and accommodates the slide member and the pressing means, and the lower end portion of the slide member is the slide. When the member slides downward, it is configured to pop out from the opening portion of the accommodating recess.

In the third invention, in the second invention, the pressing means is a coil spring that constantly urges the slide member downward, and the inner peripheral surface on the opening side of the accommodating recess is on the back end side of the accommodating recess. An annular overhanging portion is formed so as to have a smaller diameter than the inner peripheral surface, and the slide member is formed continuously with a head located on the inner end side of the accommodating recess and the head. The sliding member has a shaft portion located inside the annular overhanging portion of the accommodating recess, and the slide member is in a state where the head is in contact with the annular overhanging portion when sliding downward. The lower end portion of the shaft portion is configured to protrude below the lower end portion of the chip .

In the first invention, even if the object to be bonded is stuck to the tip when the horn is raised after the ultrasonic bonding work is completed, the slide member is pressed by the pressing means and slides downward. Since the lower end portion of the chip is pressed downward by the amount that the lower end portion of the chip protrudes from the lower end portion of the chip, the object to be bonded can be separated from the chip. Further, since it is not necessary to provide an air flow passage in the chip as in Patent Document 1, even if ultrasonic bonding work is repeated, a part of the object to be bonded enters the air flow passage and the air flow passage becomes narrow. Alternatively, it is possible to avoid being blocked and unable to press the bonded body downward, and the bonded body can be reliably separated from the chip.

In the second invention, since the slide member and the pressing means are surrounded by the chips, it is possible to reduce the failure of the device due to the adhesion of dust, dirt, etc. to the slide member and the pressing means.

In the third invention, when ultrasonically bonding is performed, the two bonded bodies are ultrasonically vibrated in a state where the portion corresponding to the slide member of the double bonded body is pressed against the slide member by the urging force of the coil spring. Become. Therefore, even if a mechanism for separating the object to be joined from the chip is provided inside the chip, it is possible to pressurize both the objects to be joined evenly with the amble in the entire region of contact with the object to be joined of the chip. It is possible to form a good joint between the objects to be joined.

It is a perspective view of the ultrasonic bonding apparatus which concerns on embodiment of this invention. FIG. 5 is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is a view taken along the line III of FIG. It is a figure which shows the state just before performing ultrasonic bonding after FIG. After FIG. 4, it is a figure which shows the state in the process of ultrasonic bonding. After FIG. 5, it is a figure which shows the state immediately after the ultrasonic bonding is completed.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following description of the preferred embodiment is essentially merely an example.

FIG. 1 shows an ultrasonic bonding device 1 according to an embodiment of the present invention. The ultrasonic bonding device 1 integrates two superposed aluminum alloy plates W1 (bonded bodies) by ultrasonic bonding, and is a device body 2 installed on the floor and a side of the device body 2. It is provided with an amble 3 which is arranged on the side and can be placed in a state where the two aluminum alloy plates W1 are overlapped with each other, and an uneven non-slip portion 3a is formed on the upper surface of the amble 3 (FIG. 2).

The apparatus main body 2 includes a processing unit 4 extending in the horizontal direction toward a position above the amble 3 and an elevator 5 (elevating means) for raising and lowering the processing unit 4. The amble 3 is the processing unit. It is located below the extension end side in 4.

The processing unit 4 includes an elongated rectangular parallelepiped storage case 6 having a storage space 6a inside, and the storage space 6a houses a substantially cylindrical vibration unit 7 (vibration means) and a rotary motor 8. Has been done.

The vibration unit 7 has a cylinder center line C1 in a posture along the longitudinal direction of the processing unit 4, and one end side of the vibration unit 7 faces the outside of the accommodation case 6.

The rotary motor 8 is arranged on the other end side of the vibration unit 7, and its rotation shaft 8a is located on the cylinder center line C1 of the vibration unit and protrudes inward of the vibration unit 7. ..

A horn 9 whose center line C2 coincides with the cylinder center line C1 of the vibration unit 7 is provided on one end side of the vibration unit 7.

The horn 9 includes a horn body 9a having an elongated round bar shape and a square plate-shaped processing head 9b having a thickness attached to one end of the horn body 9a, and the other end side of the horn body 9a is described above. It is fitted inside the vibration unit 7.

The other end of the horn body 9a is connected to the rotation shaft 8a of the rotation motor 8, and the horn 9 can rotate around the center line C2 by the rotation operation of the rotation shaft 8a in the rotation motor 8. ing.

Further, the other end side of the horn body 9a is connected to a vibration mechanism (not shown) provided inside the vibration unit 7, and the horn 9 is connected to the center line C2 by the vibration unit 7. It is possible to vibrate in the orthogonal horizontal direction (direction of arrow X1 in FIG. 5).

The processing head 9b is provided with four joining chips 10 having a rectangular plate shape at equal intervals around the center line C2, and when the horn 9 is rotated by the rotary motor 8, it is placed on the lower side of the horn 9. The positioned chips 10 are switched in order.

As shown in FIGS. 2 to 6, a pair of uneven surface portions 10a are formed on the lower surface of the chip 10 so as to be separated from each other on both sides in the vibration direction.

An accommodating recess 10b that opens on the lower surface of the chip 10 is formed in the central portion of the chip 10, and the opening portion of the accommodating recess 10b is located between the two uneven surface portions 10a.

An annular overhanging portion 10c is formed on the inner peripheral surface on the opening side of the accommodating recess 10b so as to have a smaller diameter than the inner peripheral surface on the inner end side of the accommodating recess 10b. It is visually T-shaped.

In the accommodation recess 10b, a slide member 11 whose central axis faces in the vertical direction is accommodated so as to be slidable in the vertical direction.

The slide member 11 is formed continuously with a disk-shaped head portion 11a located on the back end side of the accommodating recess 10b and the head portion 11a, and is inside the annular overhanging portion 10c of the accommodating recess 10b. It is composed of a shaft portion 11b located at.

When the slide member 11 slides downward, the head portion 11a comes into contact with the annular overhanging portion 10c and does not slide further downward, and the head portion 11a becomes the annular overhanging portion 10c. The lower end portion of the shaft portion 11b is configured to protrude below the lower end portion of the chip 10 in a state of contact.

A coil spring 12 (pressing means) that constantly urges the slide member 11 downward is accommodated in the inner end side of the accommodating recess 10b, and the coil spring 12 presses the slide member 11 downward to cause the slide member 11. The lower end portion of 11 is projected from the lower end portion of the chip 10.

Then, as shown in FIGS. 2 to 6, the ultrasonic bonding device 1 lowers the horn 9 by the elevator 5 and superimposes the two aluminum alloy plates W1 on the amble 3 with the amble 3 and the chip 10. The horn 9 is vibrated by the vibration unit 7 to perform ultrasonic bonding, and a solid phase bonding portion J1 is formed between the two aluminum alloy plates W1. There is.

Next, the ultrasonic bonding operation using the ultrasonic bonding device 1 according to the embodiment of the present invention will be described in detail.

First, as shown in FIG. 2, an industrial robot (not shown) superimposes two aluminum alloy plates W1 before joining on the amble 3.

When the work of placing the two aluminum alloy plates W1 on the amble 3 by the industrial robot is completed, the ultrasonic bonding device 1 is activated. Then, the elevator 5 starts lowering the horn 9.

After that, the lower end portion of the slide member 11 protruding downward from the lower end portion of the tip 10 comes into contact with the upper surface of the two aluminum alloy plates W1 placed on the amble 3, and the slide member 11 resists the urging force of the coil spring 12. And start sliding upwards. Then, as shown in FIG. 4, both uneven surface portions 10a of the chip 10 come into contact with the upper surfaces of the two aluminum alloy plates W1 placed on the amble 3, and the two aluminum alloy plates W1 are brought into contact with the amble 3. Pressurize by sandwiching.

After that, the vibration unit 7 starts to vibrate the horn 9. Then, as shown in FIG. 5, both the aluminum alloy plates W1 vibrate ultrasonically while the uneven surface portions 10a bite into the upper aluminum alloy plate W1 and the non-slip portion 3a bites into the lower aluminum alloy plate W1. A solid phase joint J1 is formed between the aluminum alloy plates W1 to integrate the two aluminum alloy plates W1. At this time, the slide member 11 presses both aluminum alloy plates W1 downward by the urging force of the coil spring 12, so that both aluminum alloy plates W1 are sandwiched between the ambles 3 and pressed.

When the ultrasonic bonding of both aluminum alloy plates W1 is completed, the horn 9 is raised by the elevator 5. At this time, as shown in FIG. 6, the lower end portion of the slide member 11 that slides downward due to the urging force of the coil spring 12 protrudes from the lower end portion of the tip 10, so that the slide member 11 presses both aluminum alloy plates W1 downward. Then, it is separated from the chip 10.

After that, the horn 9 raised by the elevator 5 stops when it rises by a predetermined distance.

After that, the horn 9 rotates around the center line C2 by the rotational operation of the rotation shaft 8a in the rotary motor 8 and switches the chip 10 located below the horn 9 to the chips 10 adjacent to each other around the center line C2.

Then, after both the bonded aluminum alloy plates W1 placed on the amble 3 are taken out by the industrial robot, the two aluminum alloy plates W1 before bonding are placed on the amble 3 by the industrial robot and super-superior again. It is ready for ultrasonic bonding.

From the above, according to the embodiment of the present invention, even if both aluminum alloy plates W1 are fixed to the chip 10 when the horn 9 is raised after the ultrasonic bonding work is completed, the coil spring 12 is attached. Since both aluminum alloy plates W1 are pressed downward by the amount that the lower end portion of the slide member 11 that is pressed and slides downward protrudes from the lower end portion of the chip 10, the two aluminum alloy plates W1 can be separated from the chip 10. ..

Further, since it is not necessary to provide the air flow passage in the chip 10 as in Patent Document 1, even if the ultrasonic joining work is repeated, the aluminum powder generated from the aluminum alloy plate W1 enters the air flow passage, so that the air flow passage is formed. It is possible to prevent the aluminum alloy plate W1 from being narrowed or blocked so that the aluminum alloy plate W1 cannot be pressed downward, and both aluminum alloy plates W1 can be reliably separated from the chip 10.

Further, since the slide member 11 and the coil spring 12 are housed in the accommodating recess 10b of the chip 10 and are surrounded by the chip 10, the slide member 11 and the coil spring 12 are super-adhered to dust and dirt. It is possible to reduce the failure of the ultrasonic bonding device 1.

Further, when ultrasonically bonding, both aluminum alloy plates W1 are ultrasonically vibrated in a state where the portion of both aluminum alloy plates W1 corresponding to the slide member 11 is pressed against the slide member 11 by the urging force of the coil spring 12. become. Therefore, even if a mechanism for separating both aluminum alloy plates W1 from the chip 10 is provided inside the chip 10, both aluminum alloy plates W1 are referred to as amble 3 in the entire region of contact with both aluminum alloy plates W1 of the chip 10. It is possible to pressurize evenly between the two aluminum alloy plates W1 and form a good solid phase joint J1 between the two aluminum alloy plates W1.

In the embodiment of the present invention, the accommodating recess 10b is formed in the center of the chip 10, but the present invention is not limited to this, and for example, it may be provided on both sides in the vibration direction.

Further, in the embodiment of the present invention, the slide member 11 is located inside the chip 10, but it may be provided along the outer peripheral surface of the chip 10.

Further, in the embodiment of the present invention, the slide member 11 is slid downward by the coil spring 12, but for example, it may be pressed downward by a cylinder or the like.

Further, in the embodiment of the present invention, four chips 10 are provided at equal intervals around the center line C2 of the horn 9, but two or three chips 10 are provided at equal intervals around the center line C2 of the horn 9. It may be provided, or five or more may be provided.

Further, in the ultrasonic bonding device 1 of the present invention, both aluminum alloy plates W1 are bonded by ultrasonic bonding, but other materials can also be bonded by ultrasonic bonding.

The present invention is suitable for an ultrasonic bonding apparatus that bonds two superposed objects to be bonded by ultrasonic vibration.

1 Ultrasonic bonding device 3 Amble 5 Elevator (elevator means)
7 Vibration unit (vibration means)
9 Horn 10 Tip 10b Storage recess 11 Slide member 12 Coil spring (pressing means)
W1 aluminum alloy plate (joint)

Claims (3)

The horn with the bonding tip located on the lower side,
A vibrating means that vibrates the horn in the horizontal direction,
Lifting means for raising and lowering the horn and
It is provided below the horn and has an amble on which two objects to be joined can be placed on top of each other.
An ultrasonic bonding device configured to lower the horn by the elevating means to sandwich the two objects to be bonded between the amble and the chip, and to vibrate the horn by the vibrating means to perform ultrasonic bonding. There,
A slide member provided inside or outside the chip and slidable in the vertical direction,
It is provided with a pressing means for pressing the slide member to slide it downward so that the lower end portion thereof protrudes from the lower end portion of the chip.
The horn has a plurality of the chips and
Each of the chips is provided with the slide member and the pressing means, respectively.
The horn is an ultrasonic bonding device characterized in that it is configured to switch the chip for each ultrasonic bonding. In the ultrasonic bonding apparatus according to claim 1,
The chip is formed with an opening on the lower surface and a storage recess for accommodating the slide member and the pressing means.
An ultrasonic bonding device characterized in that a lower end portion of the slide member is configured to pop out from an opening portion of the accommodating recess when the slide member slides downward. In the ultrasonic bonding apparatus according to claim 2,
The pressing means is a coil spring that constantly urges the slide member downward .
An annular overhanging portion is formed on the inner peripheral surface on the opening side of the accommodating recess so as to have a smaller diameter than the inner peripheral surface on the inner end side of the accommodating recess.
The slide member has a head located on the inner end side of the accommodating recess, and a shaft portion continuously formed on the head and located inside the annular overhanging portion of the accommodating recess. ,
Further, the slide member is configured such that when the slide member is slid downward, the lower end portion of the shaft portion protrudes below the lower end portion of the chip portion in a state where the head portion is in contact with the annular overhanging portion. An ultrasonic bonding device characterized by.

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