JP6859754B2 - How to make an optical transceiver - Google Patents

Description

The present invention relates to a method for manufacturing an optical transceiver.

Patent Document 1 describes an optical transceiver in which a flat printed circuit board, ROSA, and TOSA are arranged inside a housing. This optical transceiver includes four TOSAs arranged in parallel with each other and one ROSA. A printed circuit board is provided behind the four TOSAs and one ROSA. The connection between each of TOSA and ROSA and the printed circuit board is made by soldering the FPC.

Japanese Unexamined Patent Publication No. 2016-57567

In the above-mentioned optical transceiver, the number of parts arranged inside the optical transceiver is increasing, and the parts and the wiring connecting the parts are complicated. Along with this, it is required to efficiently assemble each part.

An object of the present invention is to provide a method for manufacturing an optical transceiver capable of efficiently assembling each component.

A method of manufacturing an optical transceiver according to an embodiment of the present invention includes a circuit board, an optical subassembly (OSA), a holding member supported by the circuit board to hold the OSA, and an internal fiber for optically connecting the OSA and an optical component. A method of manufacturing an optical transceiver, the first step of electrically connecting a circuit board and an OSA to each other, the second step of connecting an OSA and an internal fiber with a simple connector attached to the OSA, and supporting the OSA. It includes a third step of assembling the circuit board and the holding member, a fourth step of arranging the internal fiber in a groove provided in the holding member, and a fifth step of supporting the optical component by the holding member.

According to the present invention, each component can be efficiently assembled.

FIG. 1 is a perspective view showing an optical transceiver according to an embodiment. FIG. 2 is a perspective view showing the internal structure of the optical transceiver of FIG. FIG. 3 is an exploded perspective view of the optical transceiver of FIG. FIG. 4 is a side view showing an OSA, an FPC, and a circuit board. FIG. 5 is a perspective view showing a first holding member of the optical transceiver of FIG. FIG. 6 is a perspective view of the first holding member of FIG. 5 as viewed from the opposite side of FIG. FIG. 7 is a perspective view showing a second holding member of the optical transceiver of FIG. FIG. 8 is a perspective view of the second holding member of FIG. 7 as viewed from the opposite side of FIG. 7. FIG. 9 is a plan view showing each component of the optical transceiver of FIG. FIG. 10 is a perspective view showing the OSA, the circuit board, and the first holding member. FIG. 11A is a perspective view showing a duplexer (branching filter). FIG. 11B is a diagram schematically showing the internal structure of the demultiplexer (multiplexer). FIG. 12 is a perspective view showing a duplexer (demultiplexer), an internal fiber, and a simple connector. FIG. 13 is a cross-sectional view showing an OSA, a circuit board, and a circuit mounted on the circuit board inside the housing. FIG. 14 is a perspective view showing an OSA, an FPC, and a circuit board. FIG. 15 is a perspective view showing a state in which a simple connector is attached to the OSA of FIG. FIG. 16 is a perspective view showing a state in which a simple connector, a demultiplexer (demultiplexer), and a first holding member are attached to the OSA. FIG. 17 is a perspective view showing a state in which the first holding member is attached to the OSA of FIG. FIG. 18 is a perspective view showing a state in which a demultiplexer (demultiplexer) and a second holding member are attached to each component of FIG. FIG. 19 is a perspective view showing a state in which a duplexer (demultiplexer) is temporarily fixed to the first holding member to assemble the intermediate assembly. FIG. 20 is a perspective view showing a state in which the intermediate assembly of FIG. 19 is incorporated in the upper housing. FIG. 21 is a perspective view showing a state in which the receptacle is mounted on the upper housing of FIG. 20. FIG. 22 is a perspective view showing an example in which each component of FIG. 15 is previously incorporated into the upper housing. FIG. 23 is a perspective view showing a state in which the internal fiber is wired on the OSA and the circuit board of FIG. 22.

Hereinafter, embodiments of an optical transceiver and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and duplicate description will be omitted as appropriate.

FIG. 1 is a perspective view showing an optical transceiver 1 according to an embodiment. The optical transceiver 1 is a so-called CFP8 module whose standard specifications have been determined in the industry. The optical transceiver 1 drives an NRZ signal having a communication speed of 25 Gbps with a PAM4 (Pulse Amplitude Modulation: quadrature modulation [multiplicity 2]) signal on both the transmitting side and the receiving side, thereby driving 50 Gbps per wavelength. By mounting two 50 Gbps x 4 wavelength optical subassemblies (OSA) each, a total transmission capacity of 400 Gbps for 8 lanes will be achieved.

The optical transceiver 1 includes a housing 2, which includes an upper housing 7 and a lower housing 8. The outer dimensions of the housing 2 comply with the CFP8 standard. For example, the length of the housing 2 is 106 mm, the width of the housing 2 is 40 mm, and the height of the housing 2 is 9.5 mm.

The housing 2 is provided with a receptacle 4 that receives an external optical connector that is an LC connector. In the following, the terms "front-back direction", "vertical direction", and "left-right direction" are used in the drawings, but these terms are for convenience based on the illustrated state. In the following description, the upward direction is the direction in which the upper housing 7 is provided when viewed from the lower housing 8, the front direction is the direction in which the receptacle 4 is provided when viewed from the housing 2, and the left-right direction is the width direction of the housing 2. is there.

The receptacle 4 is formed in the center of the housing 2 in the left-right direction. Pull tabs 5 extend forward from both the left and right sides of the housing 2. The left and right sides of the housing 2 are provided with sliders 6 that slide in conjunction with the movement of the pull tab 5 in the front-rear direction, and the rear end of the slider 6 is provided with protrusions 6a for expanding the tab formed in the cage of the host system. .. The protrusion 6a pushes the tab apart in synchronization with the slide of the slider 6 to the front side, so that the tab can be disengaged from the housing 2 and the optical transceiver 1 can be removed from the cage. Further, as described above, the height of the housing 2 is about 10 mm, which is slightly larger than the width of the slider 6. This makes it possible to increase the mounting density of the optical transceiver 1 in the host system.

FIG. 2 is a perspective view showing the internal structure of the optical transceiver 1 in which a part of the upper housing 7 is cut out. FIG. 3 is an exploded perspective view of the optical transceiver 1. Inside the optical transceiver 1, the above-mentioned receptacle 4, a duplexer (Optical-Multiplexer: O-Mux) 9 and a demultiplexer (Optical-De-Multiplexer: O-DeMux) 10 located on the left and right sides of the receptacle 4 are located. , TOSA11, ROSA12, circuit board 13, and FPC14 are arranged.

The optical transceiver 1 transmits and receives signal light having different wavelengths in eight lanes on both the transmitting side and the receiving side. The combiner 9 and the demultiplexer 10 separate the optical signal of 8 lanes into 4 lanes on the long wavelength side and 4 lanes on the short wavelength side, respectively, and photocouple them to each of TOSA 11 and ROSA 12. In the following description, each of TOSA11 and ROSA12 may be referred to as OSA (optical subassembly) 50.

The receptacle 4 is optically connected to the OSA 50 via the internal fiber F and the simple connector C. One internal fiber F extending from the receptacle 4 and two internal fibers F facing the TOSA 11 are connected to the combiner 9. Two internal fibers F extending from the ROSA 12 and one internal fiber F facing the receptacle 4 are connected to the duplexer 10.

Two TOSA 11s and two ROSA 12s are arranged behind the combiner 9 and the demultiplexer 10. These OSA 50s perform photoelectric conversion of optical signals and electric signals. Two internal fibers F extending from each of the duplexer 9 and the duplexer 10 are connected to each OSA 50 via a simple connector C. Each internal fiber F is connected to an optical connection unit of each OSA50. Optical components such as a lens and an isolator are built in the optical connection unit of the OSA50.

The combiner 9 and the demultiplexer 10 have, for example, the same shape and the same size as each other. The combiner 9 and the demultiplexer 10 have protrusions 9a and 10a projecting rearward at the bottoms 9b and 10b, respectively. Three internal fibers F are drawn out from each of the combiner 9 and the demultiplexer 10 by a pigtail method.

The internal fiber F includes a first internal fiber F1 and a second internal fiber F2, and each of the combiner 9 and the demultiplexer 10 is connected to the receptacle 4 via the first internal fiber F1. Further, each of the duplexer 9 and the duplexer 10 is connected to the simple connector C via the second internal fiber F2.

Each OSA 50 is mounted on the circuit board 13 via the first holding member 30 and the second holding member 40, which will be described later. As a result, it is possible to protect (reinforce) the connection portion between the FPC 14 and the circuit board 13 extending from each OSA 50. Therefore, the reliability of the connection can be improved. The circuit board 13 mounts a circuit that is electrically connected to the OSA 50 via the FPC 14. The circuit board 13 is arranged behind the OSA 50. The circuit board 13 includes a first circuit board 15 located on the upper side and a second circuit board 16 located on the lower side. On the first circuit board 15, two LD drivers 17 facing two TOSA 11s, a DSP (Digital Signal Processor) 18, a preamplifier IC, and the like are mounted. The DSP 18 is mounted in the center of the first circuit board 15. The DSP 18 is a signal conversion IC that converts a 25 Gbps binary signal into a quadrature modulated signal, and executes signal processing on the transmitting side 8 signal and the receiving side 8 signal.

The second circuit board 16 is connected to the first circuit board 15 located above the second circuit board 16 by a stack connector. By using the stack connector, it is possible to realize the connection in a space-saving manner as compared with the FPC, and it is also possible to correspond to a high frequency signal. The first circuit board 15 mounts circuit components on both sides thereof, and the second circuit board 16 mounts circuit components only on its upper surface.

Further, the optical transceiver 1 has a plug board 23 that is separate from the circuit board 13 behind the circuit board 13. The plug board 23 engages with an electrical connector provided in the cage of the host system. More than 100 electrodes are densely arranged on the electric connector and the plug substrate 23.

Therefore, in order to ensure the accuracy of the relative positions of the electric connector and the plug board 23, it is necessary to increase the engaging force between the electric connector and the plug board 23, and the insertion / removal force of the optical transceiver 1 with respect to the electric connector is large. The plug board 23 is separated from the circuit board 13 in order to prevent the stress applied to the plug board 23 when the optical transceiver 1 is inserted and removed from spreading to the circuit board 13 and to firmly engage the plug board 23 with the electric connector. It is a body.

As shown in FIG. 4, each OSA50 has rectangular packages 11a, 12a and terminals 11b, 12b drawn only from the rear side. The packages 11a and 12a have terminals 11b and 12b in the longitudinal direction of the optical transceiver 1 and only on the opposite side of the receptacle 4. The bottom surfaces 11c and 12c of the packages 11a and 12a abut on the inner surface of the upper housing 7. That is, each OSA 50 is mounted inside the upper housing 7 in a state where it is turned upside down.

5 and 6 are perspective views showing the first holding member 30. The first holding member 30 has a rectangular appearance. The first holding member 30 has a protruding portion 31, a groove 32, 33, a hole portion 34, 35, an engaging portion 36, a protrusion 37, and a protruding portion 38 in this order from the front side. The protrusions 31 are provided on both the left and right sides.

The grooves 32 and 33 are guide grooves for arranging the internal fiber F. The grooves 32 are provided on the left and right inside of the first holding member 30, and the grooves 33 are provided on the left and right outside of the first holding member 30. The grooves 32 and 33 are provided on the inner surface of the first holding member 30. In the grooves 32 and 33, an internal fiber F that is pulled out from each of the combiner 9 and the demultiplexer 10 and is largely expanded at the rear portion, and then extends to the simple connector C is inserted.

The hole 34 is a hole for engaging the first holding member 30 with the second holding member 40. The hole 34 has a circular cross section. The hole 35 exposes the bottom surfaces 11c and 12c of each OSA 50. The engaging portion 36 is a portion that engages the first holding member 30 with the second holding member 40. The engaging portion 36 is provided at each of the rear portions of the left and right side walls of the first holding member 30. The protrusion 37 is a portion for engaging the first holding member 30 with the circuit board 13, and is provided on the protrusion 38 extending rearward from both the left and right ends of the first holding member 30.

When assembling the optical transceiver 1, the combiner 9 and the demultiplexer 10 are temporarily fixed on the protrusion 31 so that the assembly can be performed efficiently. A recess 31a is formed at the base of the protrusion 31. By inserting the protrusions 9a and 10a of the combiner 9 and the demultiplexer 10 into the recess 31a, the combiner 9 and the demultiplexer 10 are temporarily fixed on the protrusion 31.

When assembling the optical transceiver 1, the combiner 9, the demultiplexer 10, and the OSA 50 are temporarily held integrally with the first holding member 30. That is, the efficiency of assembly is improved by assembling the intermediate assembly including the combiner 9, the demultiplexer 10 and the OSA 50 by the first holding member 30.

Among the components mounted inside the OSA 50, those that require heat dissipation include a TEC (Thermo Electric Cooler) that maintains the temperature of the semiconductor optical element at a predetermined temperature. In particular, the bottom surface of the TEC has a high need for heat dissipation. Therefore, the heat dissipation effect of the OSA 50 can be enhanced by physically contacting the bottom surfaces 11c and 12c of the OSA 50 where the bottom surface of the TEC is located with the inner surface of the upper housing 7 through the hole 35.

Further, the area of the bottom surfaces 11c and 12c of the OSA 50 may be smaller than the area of each hole 35, and in this case, the OSA 50 is prevented from falling out of the hole 35. However, in this state, a gap is formed between the bottom surfaces 11c and 12c and the inner surface of the upper housing 7. Therefore, by filling the gap with a gel-like heat radiating member and making the thickness of the heat radiating member thicker than the thickness of the first holding member 30, the OSA 50 contacts the inner surface of the upper housing 7 via the heat radiating member. To do. Therefore, a heat dissipation path from the OSA 50 to the upper housing 7 is secured.

7 and 8 are perspective views showing the second holding member 40. The second holding member 40 has a rectangular appearance. The second holding member 40 includes protrusions 41, grooves 42, 43, protrusions 45, 46, and protrusions 49. The protrusion 41 is provided on a portion on which the OSA 50 is mounted. The protrusion 41 has an elastic force that presses the OSA 50 against the upper housing 7.

The protruding portion 41 is a stress applying portion that presses the OSA 50 against the inner surface of the upper housing 7. The protrusion 41 has a protrusion 41a having a triangular cross section at its tip. The protrusion 41a can increase the elastic force of the protrusion 41 against the OSA 50, and the bottom surfaces 11c and 12c of each OSA 50 can be reliably brought into contact with the inner surface of the upper housing 7.

Further, when the second holding member 40 is assembled to the first holding member 30, the total height of the first holding member 30 and the second holding member 40 is slightly lower than the total height of the OSA 50. As a result, the bottom surfaces 11c and 12c of the OSA 50 surely protrude from the hole 35 toward the upper housing 7, and a mechanism is realized in which the OSA 50 surely abuts on the inner surface of the upper housing 7.

The engaging portion 36 of the first holding member 30 engages with each protruding portion 45. The protrusion 49 engages with the hole 34 of the first holding member 30. Therefore, the second holding member 40 secures engagement with the first holding member 30 at three points, the protrusion 49 and the pair of protrusions 45. A hole 45a is formed on the protrusion 45, and a protrusion 36a is formed on the engaging portion 36. By fitting the protrusion 36a into the hole 45a, the rear side engagement of the first holding member 30 and the second holding member 40 is ensured.

The protrusion 49 has a columnar shape. The diameter of the tip of the protrusion 49 is larger than the diameter of the root. That is, the protrusion 49 has a diameter-expanded portion 49a at its tip, and when the protrusion 49 is inserted into the hole 34, the diameter-expanded portion 49a is prevented from coming off. Therefore, since the protrusion 49 can be firmly engaged with the hole 34, the front side engagement of the first holding member 30 and the second holding member 40 is ensured.

The grooves 42 and 43 are guide grooves for guiding the internal fiber F. Three grooves 42 are formed on the front side and the left and right outer sides of the second holding member 40, and two grooves 43 are formed on the front side and the left and right inner sides of the second holding member 40. The groove 43 faces the receptacle 4 and accommodates the first internal fiber F1 extending from the receptacle 4. The groove 42 faces each of the combiner 9 and the demultiplexer 10. One first internal fiber F1 and two second internal fibers F2 facing each of the combiner 9 and the demultiplexer 10 are inserted into the groove 42. Two first internal fibers F1 facing the receptacle 4 are inserted into the groove 43.

Both the grooves 42 and 43 are formed on the bottom surface 47 of the second holding member 40. The three grooves 42 go straight toward the rear as they are, and then merge. The two grooves 43 travel straight toward the rear, intersect each other at the rear portion of the second holding member 40, and then extend in opposite directions. Therefore, of the four protrusions 41 described above, the two protrusions 41 on the left and right outer sides are narrower in width than the two protrusions 41 on the left and right inner sides. A plurality of projecting portions 46 are provided in each of the grooves 42 and 43, and the projecting portions 46 prevent the internal fiber F inserted in the grooves 42 and 43 from jumping out. The OSA 50 is sandwiched between the first holding member 30 and the second holding member 40.

FIG. 9 is a diagram for explaining the routing of the internal fiber F. In FIG. 9, the first holding member 30 and the second holding member 40 are not shown. The first internal fiber F1 pulled out from the receptacle 4 goes straight to the rear as it is, curves to the left and right opposite sides on the OSA 50 (outer surface of the second holding member 40), and remains on the circuit board 13 while maintaining the curvature. It curves largely to the opposite side, passes through the left and right outside of the OSA 50, and connects to each of the duplexer 9 and the duplexer 10.

The two second internal fibers F2 drawn from each of the combiner 9 and the demultiplexer 10 are arranged in the left and right inner grooves 42 of the three grooves 42, and go straight toward the rear as they are, and the circuit It is largely curved in the opposite direction on the substrate 13 and is pulled out to the front side along the wall portion of the engaging portion 36 at the rear end of the first holding member 30, and is provided on the outermost side of the groove 33 of the first holding member 30. It bends further outward from the wall and faces the rear side, and is housed in the grooves 32 and 33, respectively, and is connected to the simple connector C. By bending the second internal fiber F2 along the outermost wall portion of the groove 33, it is possible to suppress the bending curvature of the second internal fiber F2. The curvature of the second internal fiber F2 is smaller than, for example, 20 mm.

Next, the connection between the OSA 50 and the circuit board 13 by the FPC 14 will be described. FIG. 10 shows a state in which the first holding member 30 is assembled to the circuit board 13 after the OSA 50 and the circuit board 13 are assembled. As shown in FIGS. 4 and 10, the FPC 14 includes a first FPC 14a that connects the front surfaces of the terminals 11b and 12b and the front surface of the circuit board 13, and a second FPC 14b that connects the back surfaces of the terminals 11b and 12b and the back surface of the circuit board 13. Including. In TOSA 11 and ROSA 12, the positions in the vertical direction in which the terminals 11b and 12b are pulled out are different from each other. Therefore, either the FPC 14 connected to the TOSA 11 or the FPC 14 connected to the ROSA 12 must be formed after applying a large stress.

In the example of FIG. 10, since the height difference between the surface of the terminal 12b and the surface of the circuit board 13 is large, a large stress is applied to the FPC 14 connected to the ROSA 12. If various handlings are performed for assembling the optical transceiver 1 in this state, it is assumed that a large moment is particularly applied to the FPC 14 connected to the ROSA 12. Therefore, in the optical transceiver 1, the stress exerted on the FPC 14 (moment due to the weight of the TOSA 11 and ROSA 12) is relaxed by temporarily mounting the OSA 50 on the first holding member 30 at the time of assembly.

FIG. 11A is a perspective view showing the appearance of the combiner 9. FIG. 11B is a diagram for explaining the function of the demultiplexer 10. Since the appearance of the demultiplexer 10 is the same as the appearance of the demultiplexer 9, the description regarding the appearance of the demultiplexer 10 will be omitted as appropriate. The combiner 9 is mounted inside the optical transceiver 1 with its bottom 9b facing up. The circuit board 13, the OSA 50, the first holding member 30, and the second holding member 40 are assembled while temporarily fixing the bottom portion 9b to the protruding portion 31 of the first holding member 30.

Since the thickness of the protrusion 9a is slightly thicker than the thickness of the recess 31a of the protrusion 31 described above, the insertion of the protrusion 9a into the recess 31a is due to press-fitting depending on the elastic force of the resin. Therefore, it is possible to prevent the combiner 9 from slipping off the protrusion 31 when the optical transceiver 1 is assembled. Further, even after the upper housing 7 and the lower housing 8 are assembled, the rattling of the combiner 9 can be suppressed.

In the present embodiment, the combiner 9 is temporarily fixed to the first holding member 30 by the protrusion 9a and the recess 31a, but the combiner 9 is temporarily fixed to the first holding member 30 by a configuration other than the protrusion 9a and the recess 31a. It may be temporarily fixed to. For example, a ring member surrounding the combiner 9 is provided at the base of the protrusion 31, and the combiner 9 is temporarily fixed to the first holding member 30 by fitting the combiner 9 to the ring member. May be good.

As shown in FIG. 11B, the demultiplexer 10 has a wavelength selection filter 10c. The optical transceiver 1 targets signal light having eight kinds of wavelengths set at intervals of 4 to 5 nm in the range of 1274 nm to 1310 nm. The wavelength selection filter 10c has four signal lights on the long wavelength side (1310 nm, 1305 nm, 1300 nm, 1295 nm) and four signal lights on the short wavelength side (1274 nm, 1278 nm, 1282 nm) among the signal lights of these eight types of wavelengths. 1286 nm) signal light is separated.

The wavelength selection filter 10c has a cutoff wavelength between 1286 nm and 1295 nm (1290 nm as an example). The wavelength selection filter 10c is obtained by forming a dielectric multilayer film for this wavelength on a substantially transparent base material. The wavelength selection function of the wavelength selection filter 10c depends on the incident angle of light, that is, the angle formed by the normal line of the wavelength selection filter 10c and the optical axis of the incident light. The best wavelength selection function is obtained when the incident angle of light is 0 °, and the wavelength selection function decreases as the incident angle of light increases.

In the demultiplexer 10, eight multiple wavelength division light having each wavelength described above is incident from the port 10d of the demultiplexer 10, is totally reflected by the mirror 10e, and then is incident on the wavelength selection filter 10c. Of the eight multiple wavelength multiplex lights, the four long wavelength side (or four short wavelength side) lights pass through the wavelength selection filter 10c and are output from the port 10f, and the four short wavelength side (or long wavelength side) lights are output. The light is reflected by the wavelength selection filter 10c. The four signal lights reflected by the wavelength selection filter 10c are totally reflected by the mirror 10g and output from the port 10h. Further, a collimating lens is provided in each of the ports 10d, 10f, and 10h, and a collimating optical system is adopted inside the demultiplexer 10.

Although the demultiplexer 10 has been described above, the input / output of the demultiplexer 10 is reversed for the duplexer 9. That is, four signal lights on the long wavelength side (or four on the short wavelength side) are incident from the port 9h, totally reflected by the mirror 9g, and then reflected again by the wavelength selection filter 9c. On the other hand, the four short wavelength side (or four long wavelength side) signal lights enter from the port 9f and pass through the wavelength selection filter 9c. The four signal lights reflected by the wavelength selection filter 9c and the four signal lights transmitted through the wavelength selection filter 9c are totally reflected by the mirror 9e and then output from the port 9d. From the above, the optical component mounted inside the duplexer 9 can be the same as the optical component mounted inside the duplexer 10.

FIG. 12 is a perspective view showing a demultiplexer 9 (demultiplexer 10), a receptacle 4, a simple connector C, and an internal fiber F. The connection between the combiner 9 and the internal fiber F and the connection between the receptacle 4 and the internal fiber F are so-called pigtail connections (permanent connections). Further, the simple connector C is attached to the OSA 50, and the connection between the OSA 50 and the internal fiber F is performed via the simple connector C. The simple connector C has hooks C1 on both sides thereof, and is connected to the OSA 50 via the hooks C1.

Since the demultiplexer 9 (demultiplexer 10) and the receptacle 4 are so-called passive components, the variation in the performance of each component is relatively small. On the other hand, since the OSA50 is equipped with a semiconductor optical element such as LD or PD inside, the variation in the performance of each component is relatively large. Therefore, the OSA 50 is replaced more frequently than the passive component. Therefore, by making the connection of the OSA 50 a connector type using the simple connector C, each OSA 50 can be exchanged independently.

The circuit components mounted on the circuit board 13, such as the OSA50, LD driver 17, and DSP18 described above, are heating elements. Therefore, as shown in FIG. 13, the heat radiating surfaces of the OSA 50, the LD driver 17, the DSP 18, and the like are arranged on the upper housing 7 side in contact with the heat sink H. As a result, the thermal connection of the OSA 50, the LD driver 17, the DSP 18, etc. to the upper housing 7 is maintained.

Further, the circuit board 13 has a slight inclination with respect to a horizontal plane (a plane extending from front to back, left and right). However, by applying an elastic and heat-transmitting sheet or gel as the heat sink H between the upper housing 7 and the LD driver 17 and the DSP 18, the tolerance of the circuit board 13 due to the inclination is absorbed.

Next, the assembly of the optical transceiver 1 will be described. FIG. 14 shows the back surface of the first circuit board 15 and the ceiling surface of the OSA 50. First, as shown in FIG. 14, the first circuit board 15 and the OSA 50 are electrically connected to each other (first step). The first circuit board 15 on which circuit components are mounted on both sides and each of the OSA 50 are connected by an FPC 14.

At this time, forming is performed on each FPC 14. Specifically, the FPC 14 connected to the ROSA 12 is bent more than the FPC 14 connected to the TOSA 11 to perform forming. After that, the FPC 14 is soldered to the terminals 11b and 12b of the OSA 50 and the pads of the first circuit board 15 to fix the FPC 14.

As shown in FIG. 15, a simple connector C is connected to each sleeve of the OSA 50 (second step). Although not shown in FIG. 15, an internal fiber F is connected to each simple connector C. Next, as shown in FIG. 16, the first circuit board 15 and the first holding member 30 are assembled while supporting the OSA 50 (third step).

At this time, the protrusion 37 at the rear end of the first holding member 30 is inserted into the opening hole 15a formed in the first circuit board 15. Since the diameter of the tip of the protrusion 37 is larger than the diameter of the opening 15a, the protrusion 37 is prevented from coming off from the opening 15a after the protrusion 37 is engaged with the opening 15a. Further, an internal fiber F extends from each simple connector C mounted on the OSA 50.

Next, in the state shown in FIGS. 16 and 17, the internal fiber F drawn forward from the simple connector C is arranged in the grooves 32 and 33 of the first holding member 30 (fourth step). Specifically, as shown in FIG. 18, each of the left and right inner inner fibers F is inserted into the groove 32 (first groove), each of the left and right outer inner fibers F is inserted into the groove 33, and the left and right sides are reversed from each other. Bend in the direction. Then, each of the duplexer 9 and the duplexer 10 is moved to the portion of the circuit board 13.

Next, the second holding member 40 is assembled to the first holding member 30. At this time, as shown in FIG. 19, the internal fiber F is largely curved in the opposite direction on the circuit board 13. Then, the internal fiber F connected to the receptacle 4 is inserted into the groove 43, and the internal fiber F connected to each of the duplexer 9 and the demultiplexer 10 is inserted into the groove 42 (second groove) (fifth step). ..

Further, each of the combiner 9 and the demultiplexer 10 is temporarily fixed to the protrusion 31, and the combiner 9 and the demultiplexer 10 are supported by the first holding member 30 (sixth step). At this time, the protrusions 9a and 10a are inserted into the recesses 31a, respectively, and the combiner 9 and the demultiplexer 10 are temporarily fixed on the protrusions 31.

The above assembly is performed outside the housing 2. As a result, the intermediate assembly M including the circuit board 13, OSA50, simple connector C, first holding member 30, second holding member 40, duplexer 9, and demultiplexer 10 can be efficiently assembled outside the housing 2. Yes (the process of assembling the intermediate assembly).

According to this assembly method, the internal fiber F can be routed outside the housing 2 with a high degree of freedom, and it is possible to prevent the internal fiber F from being routed by the housing 2. Further, when the internal fiber F is routed, the internal fiber F can be efficiently arranged in the grooves 32, 33, 42, 43 of the first holding member 30 and the second holding member 40, respectively.

Further, since a plurality of protrusions 46 are provided in each of the grooves 42 and 43, it is possible to prevent the internal fiber F once arranged from coming off from the grooves 42 and 43. Further, since the combiner 9 and the demultiplexer 10 having a large own weight are temporarily fixed to the first holding member 30, the stress applied to the root of the internal fiber F connected to each of the combiner 9 and the demultiplexer 10 is relaxed. can do.

After assembling the intermediate assembly M, the intermediate assembly M is installed in the upper housing 7 as shown in FIG. Subsequently, as shown in FIG. 21, the receptacle 4 is installed at the front end of the upper housing 7 and at the center of the left and right sides (7th step). The inner surface of the upper housing 7 does not have a structure that defines the mounting position of the receptacle 4. The structure is provided on the inner surface of the lower housing 8, and the position of the receptacle 4 is defined by assembling the lower housing 8 to the upper housing 7.

In assembling the receptacle 4 to the lower housing 8, the sleeve of the receptacle 4 is passed through the hole formed in the lower housing 8. At this time, the sleeve is incorporated into the lower housing 8 by moving the entire unit including the receptacle 4 forward. Parts including the upper housing 7, the lower housing 8, the duplexer 9, the demultiplexer 10, the receptacle 4, the first holding member 30, the second holding member 40, the OSA 50, and the circuit board 13 obtained by the above assembly. The group is unitized, and even if the front and back (upper and lower) positions are changed, the positional relationship between the parts is maintained, so that it is easy to handle.

Although the embodiment of the optical transceiver and the method for manufacturing the optical transceiver has been described above, the present invention is not limited to the above-described embodiment. That is, it is easily recognized by those skilled in the art that various modifications and changes can be made within the scope of the gist of the present invention described in the claims.

For example, the shapes of the first holding member 30 and the second holding member 40 can be changed as appropriate. Further, one holding member may be provided instead of the first holding member 30 and the second holding member 40. Further, the order of assembling the above-mentioned optical transceiver can be changed as appropriate. The first holding member 30 and the upper housing 7 may be assembled as shown in FIG. 22 from the state in which the simple connector C is attached to each OSA 50 as shown in FIG.

In this case, as shown in FIG. 23, after performing the above-mentioned first to fourth steps and arranging the four internal fibers F in the grooves 32 and 33, the four internal fibers F are placed on the front side of the upper housing 7. Cross two by two. Then, the four internal fibers F are stretched toward the side walls of the upper housing 7 located on the left and right opposite sides of each other.

After that, the internal fiber F is wired on the left and right outer sides of the upper housing 7, and the internal fiber F is expanded to the position of the circuit board 13. At this time, the bending curvature of the internal fiber F is suppressed to a specified value or less by passing the internal fiber F outside the wall portion located on the outermost side of the groove 33 of the first holding member 30.

After the internal fiber F is stretched onto the circuit board 13, the second holding member 40 is assembled to the first holding member 30 as shown in FIG. As described above, after mounting the circuit board 13, the OSA 50, the simple connector C, the first holding member 30 and the second holding member 40 in the upper housing 7, the first holding member 30 causes the duplexer 9 (demultiplexer). In support of 10), the above-mentioned fifth step is performed. After that, the assembly of the optical transceiver 1 can be completed by going through the same procedure as described above.

1 ... optical transceiver, 2 ... housing, 4 ... receptacle, 5 ... pull tab, 6 ... slider, 6a ... protrusion, 7 ... upper housing, 8 ... lower housing, 9 ... combiner (optical component), 10 ... demultiplexer (Optical components), 9a, 10a ... Projection, 9b, 10b ... Bottom, 9c, 10c ... Wavelength selection filter, 9d, 9f, 9h, 10d, 10f, 10h ... Port, 9e, 9g, 10e, 10g ... Mirror, 11 ... TOSA, 11a, 12a ... Package, 11b, 12b ... Terminals, 12 ... ROSA, 13 ... Circuit board, 14 ... FPC, 15 ... First circuit board, 15a ... Open holes, 16 ... Second circuit board, 17 ... LD driver, 23 ... plug substrate, 30 ... first holding member, 31 ... protruding part, 31a ... recessed part, 32, 33, 42, 43 ... groove, 34, 35 ... hole part, 36 ... engaging part, 36a, 37 ... Projection, 40 ... Second holding member, 41 ... Projection, 41a ... Projection, 42, 43 ... Groove, 45, 46 ... Projection, 45a ... Hole, 47 ... Bottom surface, 49 ... Projection, 49a ... Diameter expansion , 50 ... OSA, C ... simple connector, C1 ... hook, F ... internal fiber, H ... heat sink, M ... intermediate assembly.

Claims (5)

A circuit board, an optical subassembly (OSA) that performs photoelectric conversion of optical signals and electrical signals , a combiner, a demultiplexer, a holding member that is supported by the circuit board and holds the OSA, the OSA and the combiner. And light having an internal fiber that optically connects each of the demultiplexers to each other, and a housing that accommodates the circuit board, the OSA, the demultiplexer, the demultiplexer, the holding member, and the internal fiber. It ’s a method of manufacturing transceivers.
The first step of electrically connecting the circuit board and the OSA to each other,
A second step of connecting the OSA and the internal fiber with a simple connector attached to the OSA, and
A third step of assembling the circuit board and the holding member while holding the OSA on the holding member, and
A fourth step of arranging the internal fiber in a groove provided in the holding member, and
A fifth step of supporting each of the combiner and the demultiplexer by the holding member, and
How to make an optical transceiver with. Before Symbol first step includes a step of assembling the intermediate assembly by performing the second step, the third step, the fourth step and the fifth step,
The step of assembling the intermediate assembly is performed outside the housing.
The method for manufacturing an optical transceiver according to claim 1. Before Symbol first step, the second step, by performing the third step and the fourth step, performs the assembly of the circuit board, the OSA, the inner fiber, the quick connector and the holding member,
After mounting the circuit board, the OSA, the internal fiber, the simple connector, and the holding member in the housing, the fifth step is performed.
The method for manufacturing an optical transceiver according to claim 1. The optical transceiver may further comprise a receptacles,
The internal fiber includes a first internal fiber and a second internal fiber.
The groove includes a first groove and a second groove.
In the fourth step, the first internal fiber is arranged in the first groove, and the first internal fiber is arranged in the first groove.
After the fourth step, a sixth step of arranging the second internal fiber in the second groove and
The seventh step of installing the receptacle in the housing, and
The method for manufacturing an optical transceiver according to any one of claims 1 to 3. The holding member includes a first holding member and a second holding member.
The first groove is provided in the first holding member, and the second groove is provided in the second holding member.
The method for manufacturing an optical transceiver according to claim 4.

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