JP6855994B2 - Manufacturing method of film forming equipment, film forming system and plastic container - Google Patents

Manufacturing method of film forming equipment, film forming system and plastic container Download PDF

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JP6855994B2
JP6855994B2 JP2017188949A JP2017188949A JP6855994B2 JP 6855994 B2 JP6855994 B2 JP 6855994B2 JP 2017188949 A JP2017188949 A JP 2017188949A JP 2017188949 A JP2017188949 A JP 2017188949A JP 6855994 B2 JP6855994 B2 JP 6855994B2
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plastic container
film forming
dielectric member
recess
dielectric
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JP2019065318A (en
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久美子 長谷川
久美子 長谷川
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Mitsubishi Chemical Corp
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本願はプラスチック容器の内面にガスバリア性の炭素膜を成膜するための装置等を開示する。 The present application discloses an apparatus for forming a gas barrier carbon film on the inner surface of a plastic container.

特許文献1〜3に開示されているように、プラスチック容器の内面にガスバリア性の炭素膜を成膜する技術が知られている。特許文献1には、底部が平坦なプラスチック容器に対して平らな底面を有する外部電極を用いてプラスチック容器の内面にガスバリア膜を成膜する技術が開示されており、成膜時においてプラスチックボトルの底部と外部電極の底面とを直接接触させている。特許文献2には、底部に凹状空間を有するプラスチック容器の内面にガスバリア膜を成膜する技術が開示されており、成膜時において(1)花弁形をなす誘電体をボトル底部に密着させるか、(2)花弁形をなす導電体をボトル底部に対して隙間を空けて設置している。特許文献3には、底部が平坦なプラスチック容器に対して平らな底面を有する外部電極を用いてプラスチック容器の内面にガスバリア膜を成膜する技術が開示されており、プラスチック容器と外部電極との間に平らな底面を有する誘電体部材を配置し、成膜時においてプラスチックボトルの底部と誘電体部材の底面とを直接接触させている。 As disclosed in Patent Documents 1 to 3, a technique for forming a gas barrier carbon film on the inner surface of a plastic container is known. Patent Document 1 discloses a technique for forming a gas barrier film on the inner surface of a plastic container using an external electrode having a flat bottom surface with respect to a plastic container having a flat bottom. The bottom is in direct contact with the bottom of the external electrode. Patent Document 2 discloses a technique for forming a gas barrier film on the inner surface of a plastic container having a concave space at the bottom. At the time of film formation, (1) whether a petal-shaped dielectric is brought into close contact with the bottom of the bottle. , (2) Petal-shaped conductors are installed with a gap from the bottom of the bottle. Patent Document 3 discloses a technique for forming a gas barrier film on the inner surface of a plastic container using an external electrode having a flat bottom surface with respect to a plastic container having a flat bottom. A dielectric member having a flat bottom surface is arranged between them, and the bottom portion of the plastic bottle and the bottom surface of the dielectric member are in direct contact with each other at the time of film formation.

特許第3746725号公報Japanese Patent No. 3746725 特許第4467989号公報Japanese Patent No. 4467989 特許第5897998号公報Japanese Patent No. 5897998

特許文献1〜3に開示された技術によれば、プラスチック容器の内面にガスバリア性の炭素膜をある程度均一に成膜することができる。しかしながら、本発明者らの新たな知見によれば、特許文献1〜3に開示された技術によってプラスチック容器の内面にガスバリア性の炭素膜を成膜する場合、特に、プラスチック容器の底部において成膜ムラが発生し、プラスチック容器の胴部に比べて底部の色が濃くなるという課題がある。また、特許文献2の場合は、ボトル底部の形状に合わせた誘電体または導電体からなる花弁形の部材を作製する必要があり、底部形状が異なるボトルに応じて花弁形部材を作る準備と費用を要し、成膜ボトルの商業生産には大きな負荷がかかるものであった。 According to the techniques disclosed in Patent Documents 1 to 3, a gas barrier carbon film can be uniformly formed on the inner surface of the plastic container to some extent. However, according to the new findings of the present inventors, when a gas barrier carbon film is formed on the inner surface of the plastic container by the technique disclosed in Patent Documents 1 to 3, the film is formed especially on the bottom of the plastic container. There is a problem that unevenness occurs and the color of the bottom is darker than that of the body of the plastic container. Further, in the case of Patent Document 2, it is necessary to produce a petal-shaped member made of a dielectric or a conductor matching the shape of the bottom of the bottle, and preparation and cost for producing the petal-shaped member according to the bottles having different bottom shapes. This required a large load on the commercial production of film-forming bottles.

本願は上記課題を解決するための手段の一つとして、プラスチック容器の内部に原料ガスを供給しながらプラズマを発生させて前記プラスチック容器の内面に炭素膜を成膜する装置であって、側部及び底部を有する、有底筒状の外部電極と、前記外部電極の内側に設置され、側部及び底部を有する、有底筒状の誘電体部材と、を備え、前記誘電体部材の前記底部の上面は、その略中央に凹部を有する、成膜装置を開示する。 The present application is an apparatus for forming a carbon film on the inner surface of the plastic container by generating plasma while supplying a raw material gas to the inside of the plastic container as one of means for solving the above-mentioned problems. A bottomed tubular external electrode having a bottom and a bottom, and a bottomed tubular dielectric member installed inside the external electrode and having a side and a bottom, the bottom of the dielectric member. The upper surface of the film discloses a film forming apparatus having a recess substantially in the center thereof.

「プラスチック容器」とは、有底、且つ、胴部に比べて縮径した口部を有するプラスチック製の容器を意味する。
「炭素膜」とは、炭素を主体とするガスバリア性の膜であればよく、DLC膜(ダイアモンドライクカーボン膜)やアモルファスカーボン膜等のいずれであってもよい。
「前記誘電体部材の前記底部の上面」とは、誘電体部材の底の内側面を意味する。
「凹部」とは、下方に窪んだ部分をいう。すなわち、誘電体部材の底部の上面は、中央部が他の部分と比較して下方に窪んでいる。
The "plastic container" means a plastic container having a bottom and a mouth portion whose diameter is smaller than that of the body portion.
The "carbon film" may be any gas barrier film mainly composed of carbon, and may be any of a DLC film (diamond-like carbon film), an amorphous carbon film, and the like.
"The upper surface of the bottom portion of the dielectric member" means the inner surface of the bottom of the dielectric member.
The "recess" means a portion that is recessed downward. That is, the upper surface of the bottom portion of the dielectric member has a central portion recessed downward as compared with other portions.

本開示の成膜装置においては、前記誘電体部材の前記底部の上面の略中央に誘電体からなる固定部材が設けられ、前記固定部材の上面が前記凹部の表面の少なくとも一部を構成していることが好ましい。 In the film forming apparatus of the present disclosure, a fixing member made of a dielectric is provided substantially in the center of the upper surface of the bottom portion of the dielectric member, and the upper surface of the fixing member constitutes at least a part of the surface of the recess. It is preferable to have.

本開示の成膜装置においては、前記固定部材が前記誘電体部材側に頭部を有するとともに前記外部電極側にネジ部を有し、前記固定部材を介して前記誘電体部材と前記外部電極とが互いに固定されていることが好ましい。 In the film forming apparatus of the present disclosure, the fixing member has a head on the dielectric member side and a screw portion on the external electrode side, and the dielectric member and the external electrode are provided via the fixing member. Are preferably fixed to each other.

本開示の成膜装置においては、前記固定部材は比誘電率が1.5以上20以下の誘電体からなることが好ましい。 In the film forming apparatus of the present disclosure, the fixing member is preferably made of a dielectric having a relative permittivity of 1.5 or more and 20 or less.

本開示の成膜装置においては、前記誘電体部材は比誘電率が1.5以上20以下の誘電体からなることが好ましい。 In the film forming apparatus of the present disclosure, the dielectric member is preferably made of a dielectric having a relative permittivity of 1.5 or more and 20 or less.

本開示の成膜装置においては、上面視において、前記誘電体部材の前記底部の上面全体の面積に対する前記凹部の面積の割合((凹部面積/全体面積)×100%)が、0.2%以上10%以下であるであることが好ましい。 In the film forming apparatus of the present disclosure, the ratio of the area of the concave portion to the total area of the upper surface of the bottom portion of the dielectric member ((recessed area / total area) × 100%) is 0.2% in top view. It is preferably 10% or more and 10% or less.

本願は上記課題を解決するための手段の一つとして、本開示の成膜装置の前記誘電体部材の内側にプラスチック容器を設置して、前記プラスチック容器の内面に炭素膜を成膜するシステムであって、前記プラスチック容器の底中央の下側の面と、前記誘電体部材の前記底部の凹部の表面との距離を3.0mm以上25mm以下とする、成膜システムを開示する。 The present application is a system in which a plastic container is installed inside the dielectric member of the film forming apparatus of the present disclosure to form a carbon film on the inner surface of the plastic container as one of means for solving the above problems. The present invention discloses a film forming system in which the distance between the lower surface of the center of the bottom of the plastic container and the surface of the concave portion of the bottom of the dielectric member is 3.0 mm or more and 25 mm or less.

「凹部の表面」とは、凹部が略水平な底面を有する場合は当該略水平な底面をいう。一方、凹部が略水平な底面を有さずに側面のみからなる場合(例えば、逆円錐形のように底面ではなく底点となる場合)、凹部のうち最も深い部分をいう。 The “surface of the recess” means the substantially horizontal bottom surface when the recess has a substantially horizontal bottom surface. On the other hand, when the recess does not have a substantially horizontal bottom surface and consists only of the side surface (for example, when the recess is not the bottom surface but the bottom point such as an inverted cone), it means the deepest part of the recess.

本開示の成膜システムにおいては、上面視において、前記凹部の直径を、前記プラスチック容器の接地径の2%以上40%以下とすることが好ましい。 In the film forming system of the present disclosure, it is preferable that the diameter of the recess is 2% or more and 40% or less of the ground contact diameter of the plastic container in the top view.

本願は上記課題を解決するための手段の一つとして、本開示の成膜装置の前記誘電体部材の内側にプラスチック容器を設置して、前記プラスチック容器の内面に炭素膜を成膜してプラスチック容器を製造する方法であって、前記プラスチック容器の底中央の下側の面と、前記誘電体部材の前記底部の凹部の表面との距離を3.0mm以上25mm以下とする、製造方法を開示する。 In the present application, as one of the means for solving the above problems, a plastic container is installed inside the dielectric member of the film forming apparatus of the present disclosure, and a carbon film is formed on the inner surface of the plastic container to form a plastic. Disclosed is a method for manufacturing a container, wherein the distance between the lower surface of the bottom center of the plastic container and the surface of the concave portion of the bottom of the dielectric member is 3.0 mm or more and 25 mm or less. To do.

本開示の製造方法においては、上面視において、前記凹部の直径を、前記プラスチック容器の接地径の0.2%以上20%以下とすることが好ましい。 In the manufacturing method of the present disclosure, it is preferable that the diameter of the recess is 0.2% or more and 20% or less of the ground contact diameter of the plastic container in the top view.

本発明者らの新たな知見によれば、外部電極の内側に誘電体部材を配置し、当該誘電体部材の内側にプラスチック容器を配置して炭素膜のプラズマ成膜を行う場合において、誘電体部材の底部上面とプラスチック容器の底部中央との距離が近過ぎると、プラスチック容器の底部中央にプラズマが集中し、結果としてプラスチック容器の底部において炭素膜の色が濃くなる。特に、固定部材を用いて誘電体部材を外部電極に固定する場合において、当該固定部材の頭が誘電体部材の底部上面から突出している場合にプラズマが集中し易い。これに対し、本開示の成膜装置等においては、誘電体部材の底部上面の中央部に凹部を設けており、誘電体部材の底部上面とプラスチック容器の底部中央との間に間隔が設けられている。これにより、プラズマの集中を抑制でき、プラスチック容器の底部における成膜ムラや色の濃化を抑制することができる。更には、容器の底形状ごとに特注の部材を作製することなく良質な成膜ボトルを製造できるので、そのような部材を作製する準備期間や費用がかからず、また外部電極と誘電部材等を組み立てる作業数も減り、商業的生産効率が大いに向上する。 According to the new findings of the present inventors, when a dielectric member is arranged inside the external electrode and a plastic container is arranged inside the dielectric member to perform plasma film formation of a carbon film, the dielectric material is formed. If the distance between the upper surface of the bottom of the member and the center of the bottom of the plastic container is too close, plasma concentrates in the center of the bottom of the plastic container, and as a result, the color of the carbon film becomes darker at the bottom of the plastic container. In particular, when the dielectric member is fixed to the external electrode using the fixing member, plasma tends to concentrate when the head of the fixing member protrudes from the upper surface of the bottom of the dielectric member. On the other hand, in the film forming apparatus and the like of the present disclosure, a recess is provided in the center of the upper surface of the bottom of the dielectric member, and a space is provided between the upper surface of the bottom of the dielectric member and the center of the bottom of the plastic container. ing. As a result, the concentration of plasma can be suppressed, and uneven film formation and color darkening at the bottom of the plastic container can be suppressed. Furthermore, since a high-quality film-forming bottle can be manufactured without manufacturing a custom-made member for each bottom shape of the container, there is no preparation period or cost for manufacturing such a member, and an external electrode, a dielectric member, etc. The number of work to assemble is also reduced, and the commercial production efficiency is greatly improved.

成膜装置100の構成を説明するための概略図である。It is the schematic for demonstrating the structure of the film forming apparatus 100. 凹部22aの好ましい大きさについて説明するための概略図である。It is the schematic for demonstrating the preferable size of the recess 22a. 凹部22aの好ましい深さについて説明するための概略図である。It is the schematic for demonstrating the preferable depth of the recess 22a. 成膜装置200の構成を説明するための概略図である。It is the schematic for demonstrating the structure of the film forming apparatus 200. 固定部材30の好ましい形態を説明するための概略図である。固定部材30と誘電体部材20との関係のみ拡大して示しており、それ以外の部材を省略している。It is the schematic for demonstrating the preferable form of the fixing member 30. Only the relationship between the fixing member 30 and the dielectric member 20 is shown in an enlarged manner, and other members are omitted. 成膜システムにおいて成膜装置100にプラスチック容器1を設置した形態について説明するための概略図である。プラスチック容器1の胴部上部周辺や口部周辺の構成については省略している。It is a schematic diagram for demonstrating the form in which the plastic container 1 is installed in the film forming apparatus 100 in the film forming system. The configuration around the upper part of the body and the mouth of the plastic container 1 is omitted. 成膜システムにおける凹部22aの好ましい大きさについて説明するための概略図である。It is the schematic for demonstrating the preferable size of the recess 22a in a film forming system. 成膜システムにおけるプラスチック容器1の接地径と凹部22aの直径との好ましい関係を説明するための概略図である。It is a schematic diagram for demonstrating the preferable relationship between the ground contact diameter of a plastic container 1 and the diameter of a recess 22a in a film forming system. 比較例1に係る成膜条件について説明するための図である。It is a figure for demonstrating the film formation condition which concerns on Comparative Example 1. 実施例1に係る成膜条件について説明するための図である。It is a figure for demonstrating the film formation condition which concerns on Example 1. FIG.

1.成膜装置(第1実施形態)
図1に成膜装置100の構成を概略的に示す。成膜装置100は、プラスチック容器1の内部に原料ガスを供給しながらプラズマを発生させて前記プラスチック容器1の内面に炭素膜を成膜する装置である。成膜装置100は、側部11及び底部12を有する、有底筒状の外部電極10と、前記外部電極10の内側に設置され、側部21及び底部22を有する、有底筒状の誘電体部材20と、を備えている。ここで、成膜装置100においては、前記誘電体部材20の前記底部22の上面が、その略中央に凹部22aを有する点に一つの特徴がある。
1. 1. Film forming apparatus (first embodiment)
FIG. 1 schematically shows the configuration of the film forming apparatus 100. The film forming apparatus 100 is an apparatus for forming a carbon film on the inner surface of the plastic container 1 by generating plasma while supplying a raw material gas to the inside of the plastic container 1. The film forming apparatus 100 has a bottomed tubular external electrode 10 having a side portion 11 and a bottom portion 12, and a bottomed tubular dielectric having a bottomed tubular outer electrode 10 installed inside the external electrode 10 and having a side portion 21 and a bottom portion 22. It includes a body member 20 and. Here, one feature of the film forming apparatus 100 is that the upper surface of the bottom portion 22 of the dielectric member 20 has a recess 22a at a substantially center thereof.

1.1.プラスチック容器
成膜装置100は、プラスチック容器1の内部に原料ガスを供給しながらプラズマを発生させてプラスチック容器1の内面に炭素膜を成膜する装置である。すなわち、成膜装置100の内部形状は、成膜処理すべきプラスチック容器1の外形に応じて決定される。プラスチック容器1は、有底、且つ、口部を有するプラスチック製の容器であればよい。
プラスチック容器1の底部の形状は、特に限定されるものではない。底面において円周状に連続的又は断続的に接地部(脚)を有するものや、底面が平坦とされたもの(脚の無いもの)等、種々の形状を採用可能である。成膜装置100においては、後述のように誘電体部材20の底部に凹部22aが設けられていることから、プラスチック容器1の底部の形状によらず、誘電体部材20の底部とプラスチック容器1の底部中央との間に間隔を設けることができる。そのため、成膜時のプラズマの集中を抑制でき、プラスチック容器10の底部における過度な着色の発生を抑制できる。
プラスチック容器1の胴部の形状も、特に限定されるものではない。胴部の断面形状が円状、楕円状のものや角型(多角形状)のもの等、種々の形状を採用可能である。特に胴部の断面形状が円状であることが好ましい。
プラスチック容器1の口部の形状も特に限定されるものではなく、胴部に比べて縮径していてもよい。特に口部内径と胴部内径との比(口部内径/胴部内径)が0.35以下であることが好ましく、0.30以下がより好ましく、0.25以下が更に好ましい。当該比(口部内径/胴部内径)の下限は例えば0.15以上であることが好ましい。このような内径比を有するプラスチック容器1の場合、口部が胴部に比べ縮径した容器の内面に化学蒸着法で炭素膜の形成において、容器内部へ導入するガスと容器内部から排出するガスの流れバランスが良好となり、容器の口部〜胴部〜底部の膜厚が均等になり易いという有利な効果を発揮する。
プラスチック容器1の容積についても特に限定されるものではない。例えば数10ml以上2L以下の一般消費者向けに多用される容積のプラスチック容器でもよいし、3L以上30L以下の例えば業務用などの大型プラスチック容器へも適用できる。
プラスチック容器1の材質についても特に限定されるものではない。汎用の樹脂によってプラスチック容器1を構成すればよい。好ましくはポリエチレンテレフタレート(PET)樹脂、ポリプロピレン(PP)樹脂、環状ポリオレフィン(CPO)樹脂等である。
1.1. The plastic container film forming apparatus 100 is an apparatus for forming a carbon film on the inner surface of the plastic container 1 by generating plasma while supplying a raw material gas to the inside of the plastic container 1. That is, the internal shape of the film forming apparatus 100 is determined according to the outer shape of the plastic container 1 to be film-formed. The plastic container 1 may be a plastic container having a bottom and a mouth.
The shape of the bottom of the plastic container 1 is not particularly limited. Various shapes can be adopted, such as those having a ground contact portion (legs) continuously or intermittently on the bottom surface, and those having a flat bottom surface (those without legs). In the film forming apparatus 100, since the recess 22a is provided at the bottom of the dielectric member 20 as described later, the bottom of the dielectric member 20 and the plastic container 1 are provided regardless of the shape of the bottom of the plastic container 1. A space can be provided between the center of the bottom and the center. Therefore, the concentration of plasma at the time of film formation can be suppressed, and the occurrence of excessive coloring at the bottom of the plastic container 10 can be suppressed.
The shape of the body of the plastic container 1 is also not particularly limited. Various shapes such as a circular, elliptical, and square (polygonal) cross-sectional shape of the body can be adopted. In particular, it is preferable that the cross-sectional shape of the body portion is circular.
The shape of the mouth portion of the plastic container 1 is not particularly limited, and the diameter may be reduced as compared with the body portion. In particular, the ratio of the inner diameter of the mouth to the inner diameter of the body (inner diameter of the mouth / inner diameter of the body) is preferably 0.35 or less, more preferably 0.30 or less, still more preferably 0.25 or less. The lower limit of the ratio (inner diameter of the mouth / inner diameter of the body) is preferably 0.15 or more, for example. In the case of the plastic container 1 having such an inner diameter ratio, the gas introduced into the container and the gas discharged from the inside of the container are formed by the chemical vapor deposition method on the inner surface of the container whose mouth has a smaller diameter than the body. The flow balance of the container is improved, and the thickness of the mouth, body, and bottom of the container tends to be uniform, which is an advantageous effect.
The volume of the plastic container 1 is also not particularly limited. For example, a plastic container having a volume of several tens of ml or more and 2 L or less, which is often used for general consumers, may be used, or a large plastic container of 3 L or more and 30 L or less, for example, for commercial use can be applied.
The material of the plastic container 1 is also not particularly limited. The plastic container 1 may be constructed of a general-purpose resin. Preferably, it is polyethylene terephthalate (PET) resin, polypropylene (PP) resin, cyclic polyolefin (CPO) resin or the like.

1.2.外部電極
外部電極10は、側部11と底部12とを有しており、プラスチック容器1や誘電体部材20と対応する内部形状を有している。導電材料からなる外部電極10の構造やメカニズムについては公知であり、当業者にとって自明である。例えば、特許文献1〜3に開示されているような構造やメカニズムとすればよい。
1.2. External electrode The external electrode 10 has a side portion 11 and a bottom portion 12, and has an internal shape corresponding to the plastic container 1 and the dielectric member 20. The structure and mechanism of the external electrode 10 made of a conductive material are known and are obvious to those skilled in the art. For example, the structure or mechanism as disclosed in Patent Documents 1 to 3 may be used.

1.3.誘電体部材
成膜装置100において外部電極10とプラスチック容器1との間に誘電体部材20を設けることで、プラズマ成膜時の異常放電等を抑制でき、成膜ムラ等を抑制できる。成膜装置100においては、誘電体部材20の底部22の構造に特徴がある。すなわち、誘電体部材20は、側部21及び底部22を有する有底筒状の誘電体部材であって、底部22の上面の略中央に凹部22aを有することが重要である。言い換えれば、誘電体部材20の底部22の上面は、中央部が他の部分と比較して下方に窪んでいる。例えば、図1に示すように、誘電体部材20の底部22の上面は、凹部22aと平坦部22bとを有する。
1.3. Dielectric member By providing the dielectric member 20 between the external electrode 10 and the plastic container 1 in the film forming apparatus 100, abnormal discharge or the like during plasma film forming can be suppressed, and uneven film forming or the like can be suppressed. The film forming apparatus 100 is characterized by the structure of the bottom portion 22 of the dielectric member 20. That is, it is important that the dielectric member 20 is a bottomed tubular dielectric member having a side portion 21 and a bottom portion 22 and has a recess 22a substantially in the center of the upper surface of the bottom portion 22. In other words, the upper surface of the bottom portion 22 of the dielectric member 20 has a central portion recessed downward as compared with other portions. For example, as shown in FIG. 1, the upper surface of the bottom portion 22 of the dielectric member 20 has a recess 22a and a flat portion 22b.

凹部22aは、誘電体部材22を1枚の板状誘電体を切削加工して凹部を形成してもよいし、複数の誘電体を密接に組み合わせて凹部を形成してもよい。例えば、後述の誘電体からなる固定部材30と凹部を形成した板状誘電体とを組み合わせても良い。その場合、固定部材30の上面(頭頂面)が凹部22aの表面となる。 The recess 22a may be formed by cutting a single plate-shaped dielectric from the dielectric member 22 to form a recess, or a plurality of dielectrics may be closely combined to form a recess. For example, a fixing member 30 made of a dielectric material described later and a plate-shaped dielectric material having a concave portion may be combined. In that case, the upper surface (top surface) of the fixing member 30 becomes the surface of the recess 22a.

凹部22aの大きさ(底部22の上面に占める面積率)は特に限定されるものではないが、図2に示すように、上面視において、誘電体部材20の底部22の上面全体の面積(A=a+a)に対する凹部22aの面積(a)の割合((a/A)×100%)が、0.2%以上10%以下であることが好ましい。下限がより好ましくは0.5%以上であり、更に好ましくは0.8%以上であり、上限がより好ましくは8%以下であり、更に好ましくは5%以下である。凹部22aの大きさをこのような範囲とすることで、成膜時、プラスチック容器底部における炭素膜の色ムラを一層低減することができる。 The size of the recess 22a (the area ratio of the bottom portion 22 to the upper surface) is not particularly limited, but as shown in FIG. 2, the area of the entire upper surface of the bottom portion 22 of the dielectric member 20 (A) is as shown in FIG. The ratio ((a 1 / A 1 ) × 100%) of the area (a 1 ) of the recess 22a to 1 = a 1 + a 2 ) is preferably 0.2% or more and 10% or less. The lower limit is more preferably 0.5% or more, further preferably 0.8% or more, and the upper limit is more preferably 8% or less, still more preferably 5% or less. By setting the size of the recess 22a within such a range, it is possible to further reduce the color unevenness of the carbon film at the bottom of the plastic container during film formation.

凹部22aの上面視における形状については、特に限定されるものではない。プラスチック容器1の胴部の断面形状(誘電体部材20の側部21の水平断面形状)と略相似の形状が好ましい。すなわち、プラスチック容器1の胴部断面形状が円状である場合、凹部22aの上面視における形状についても円状であることが好ましい。上面視における凹部22aの直径(凹部22aの上面視における形状が非円形である場合は、凹部22aと同様の面積を有する円に換算した場合の直径)は3mm以上30mm以下であることが好ましい。下限がより好ましくは5mm以上であり、更に好ましくは8mm以上であり、上限がより好ましくは20mm以下であり、更に好ましくは15mm以下である。凹部22aの径をこのような範囲とすることで、成膜時、プラスチック容器底部における炭素膜の色ムラを一層低減することができる。 The shape of the recess 22a in a top view is not particularly limited. A shape substantially similar to the cross-sectional shape of the body of the plastic container 1 (horizontal cross-sectional shape of the side portion 21 of the dielectric member 20) is preferable. That is, when the cross-sectional shape of the body of the plastic container 1 is circular, it is preferable that the shape of the recess 22a in the top view is also circular. The diameter of the recess 22a in the top view (when the shape of the recess 22a in the top view is non-circular, the diameter when converted into a circle having the same area as the recess 22a) is preferably 3 mm or more and 30 mm or less. The lower limit is more preferably 5 mm or more, further preferably 8 mm or more, and the upper limit is more preferably 20 mm or less, still more preferably 15 mm or less. By setting the diameter of the recess 22a within such a range, it is possible to further reduce the color unevenness of the carbon film at the bottom of the plastic container during film formation.

凹部22aの深さ(底部22の平坦面22bを基準高さとして、当該基準高さから凹部22aの表面に至るまでの距離)は特に限定されるものではない。
図3に示すように、側面視において、誘電体部材20の底部22の上面と凹部22aの表面との間の距離L1が1mm以上5mm以下であることが好ましい。下限がより好ましくは1.5mm以上であり、上限がより好ましくは3mm以下である。なお、凹部22aの表面が略平面でない場合は、凹部22aの最深部の上端までの距離を意味する。
凹部22aの深さをこのような範囲とすることで、成膜時、プラスチック容器底部における炭素膜の色ムラを一層低減することができる。
The depth of the recess 22a (the distance from the reference height to the surface of the recess 22a with the flat surface 22b of the bottom 22 as the reference height) is not particularly limited.
As shown in FIG. 3, when viewed from the side, the distance L1 between the upper surface of the bottom portion 22 of the dielectric member 20 and the surface of the recess 22a is preferably 1 mm or more and 5 mm or less. The lower limit is more preferably 1.5 mm or more, and the upper limit is more preferably 3 mm or less. When the surface of the recess 22a is not substantially flat, it means the distance to the upper end of the deepest portion of the recess 22a.
By setting the depth of the recess 22a within such a range, it is possible to further reduce the color unevenness of the carbon film at the bottom of the plastic container during film formation.

誘電体部材20の底部22の上面は、凹部22aを除いて平坦部22bによって構成されることが好ましい。尚、誘電体部材20の底部22の下面は、外部電極10の底部12の上面の形状と対応する。 The upper surface of the bottom portion 22 of the dielectric member 20 is preferably formed by a flat portion 22b except for the recess 22a. The lower surface of the bottom portion 22 of the dielectric member 20 corresponds to the shape of the upper surface of the bottom portion 12 of the external electrode 10.

誘電体部材20の側部21は外部電極10の側部11の形状(プラスチック容器1の胴部の形状)と対応している。すなわち、外部電極10の側部11の内面と誘電体部材20の側部21の外面とが略一致するような形状であればよい。誘電体部材20の形状は、底部22の形状を除いて従来と同様とすることができる。 The side portion 21 of the dielectric member 20 corresponds to the shape of the side portion 11 of the external electrode 10 (the shape of the body portion of the plastic container 1). That is, the shape may be such that the inner surface of the side portion 11 of the external electrode 10 and the outer surface of the side portion 21 of the dielectric member 20 substantially coincide with each other. The shape of the dielectric member 20 can be the same as the conventional one except for the shape of the bottom portion 22.

誘電体部材20の厚みは特に限定されるものではない。例えば、底部22の厚み(凹部22aを除いた平坦部22bにおける厚み)が1mm以上20mm以下であることが好ましい。下限がより好ましくは3mm以上であり、上限がより好ましくは10mm以下である。また、側部21の厚みが1mm以上20mm以下であることが好ましい。下限がより好ましくは3mm以上であり、上限がより好ましくは10mm以下である。誘電体部材20の厚みをこのような範囲とすることで、誘電体部材の加工、組合せ、繰り返し使用等の点で十分な強度となり、また成膜時の成膜ムラ等を一層低減することができる。 The thickness of the dielectric member 20 is not particularly limited. For example, the thickness of the bottom portion 22 (thickness of the flat portion 22b excluding the recess 22a) is preferably 1 mm or more and 20 mm or less. The lower limit is more preferably 3 mm or more, and the upper limit is more preferably 10 mm or less. Further, the thickness of the side portion 21 is preferably 1 mm or more and 20 mm or less. The lower limit is more preferably 3 mm or more, and the upper limit is more preferably 10 mm or less. By setting the thickness of the dielectric member 20 within such a range, it is possible to obtain sufficient strength in terms of processing, combination, repeated use, etc. of the dielectric member, and further reduce film formation unevenness during film formation. it can.

誘電体部材20は、比誘電率が1.5以上20以下の誘電体からなることが好ましい。下限はより好ましくは2以上、上限はより好ましくは10以下である。誘電体部材20を構成し得る誘電体の具体例としては、ポリテトラフルオロエチレン、ポリクロロトリフルオロエチレン、ポリフッ化ビニリデン等のフッ素樹脂や、ポリエーテルエーテルケトン、ポリフェニレンサルファイド、ポリエーテルイミド、ポリアリレート等のエンジニアリングプラスチック樹脂や、アルミナ、ガラス等のセラミックス等が挙げられる。特に誘電体部材20は耐薬品性の点からフッ素樹脂からなることが好ましく、特に高耐熱性、低摩擦性であるポリテトラフルオロエチレン骨格を有する重合体又は共重合体からなることがより好ましい。誘電体部材20の材質をこのようなものとすることで、成膜時、プラスチック容器底部における炭素膜の色ムラを一層低減することができる。 The dielectric member 20 is preferably made of a dielectric having a relative permittivity of 1.5 or more and 20 or less. The lower limit is more preferably 2 or more, and the upper limit is more preferably 10 or less. Specific examples of the dielectric material that can form the dielectric member 20 include fluororesins such as polytetrafluoroethylene, polychlorotrifluoroethylene, and polyvinylidene fluoride, polyetheretherketone, polyphenylene sulfide, polyetherimide, and polyallylate. Examples thereof include engineering plastic resins such as, and ceramics such as alumina and glass. In particular, the dielectric member 20 is preferably made of a fluororesin from the viewpoint of chemical resistance, and more preferably made of a polymer or copolymer having a polytetrafluoroethylene skeleton having high heat resistance and low friction. By using such a material for the dielectric member 20, it is possible to further reduce the color unevenness of the carbon film at the bottom of the plastic container during film formation.

1.4.その他の部材
プラスチック容器1の容積にもよるが、成膜装置100は、プラスチック容器1の口部から内部へと挿入される内部電極を備えることが好ましい。内部電極は、原料ガスをプラスチック容器1の内部へと供給するための供給手段としても機能し得る。内部電極の構造やメカニズムについては公知であり、当業者にとって自明である。例えば、特許文献1〜3に開示されているような構造やメカニズムとすればよい。成膜装置100は、誘電体部材20の底部22の構造以外は従来の成膜装置と同様の構成とすることができる。成膜装置100は上記以外の部材として通常の部材を当然に備える。プラズマ成膜に必要な部材は当業者にとって自明であることから(特許文献1〜3等)、ここではさらなる説明を省略する。
1.4. Other Members Although it depends on the volume of the plastic container 1, the film forming apparatus 100 preferably includes an internal electrode that is inserted into the inside from the mouth of the plastic container 1. The internal electrode can also function as a supply means for supplying the raw material gas to the inside of the plastic container 1. The structure and mechanism of the internal electrode are known and are obvious to those skilled in the art. For example, the structure or mechanism as disclosed in Patent Documents 1 to 3 may be used. The film forming apparatus 100 can have the same configuration as the conventional film forming apparatus except for the structure of the bottom portion 22 of the dielectric member 20. The film forming apparatus 100 naturally includes a normal member as a member other than the above. Since the members required for plasma film formation are obvious to those skilled in the art (Patent Documents 1 to 3 and the like), further description will be omitted here.

以上の通り、成膜装置100においては、誘電体部材20の底部22の上面の中央部に凹部22aを設けており、誘電体部材20の底部22の上面とプラスチック容器1の底部中央との間に間隔が設けられている。これにより、プラズマ成膜時、プラズマの集中を抑制でき、プラスチック容器1の底部における成膜ムラや色の濃化を抑制することができる。 As described above, in the film forming apparatus 100, the recess 22a is provided in the center of the upper surface of the bottom 22 of the dielectric member 20, and is between the upper surface of the bottom 22 of the dielectric member 20 and the center of the bottom of the plastic container 1. There is an interval in. As a result, it is possible to suppress the concentration of plasma during plasma film formation, and it is possible to suppress film formation unevenness and color darkening at the bottom of the plastic container 1.

2.成膜装置(第2実施形態)
図4に成膜装置200の構成を概略的に示す。成膜装置200において、成膜装置100と同様の部材については同様の符号を付している。図4に示すように、成膜装置200においては、誘電体部材20の底部22の上面の略中央に誘電体からなる固定部材30が設けられ、固定部材30の上面(頭頂面)が凹部22aの表面の少なくとも一部を構成している。
2. Film forming apparatus (second embodiment)
FIG. 4 schematically shows the configuration of the film forming apparatus 200. In the film forming apparatus 200, the same members as those of the film forming apparatus 100 are designated by the same reference numerals. As shown in FIG. 4, in the film forming apparatus 200, a fixing member 30 made of a dielectric is provided substantially in the center of the upper surface of the bottom portion 22 of the dielectric member 20, and the upper surface (top surface) of the fixing member 30 is a recess 22a. It constitutes at least a part of the surface of the.

固定部材30は、外部電極10と誘電体部材20とを固定するものである。固定部材30がなくとも、外部電極10の内側に誘電体部材20を嵌め合わせて固定することは可能である。しかしながら、装置組み立ての容易さ、位置決めの容易さやガタツキの抑制等を考慮した場合、固定部材30によって、外部電極10と誘電体部材20とを固定することが好ましい。特に、図4に示すように、固定部材30は、誘電体部材側に頭部を有するとともに外部電極側にネジ部を有し、固定部材30を介して誘電体部材20と外部電極10とが互いに固定されていることが好ましい。 The fixing member 30 fixes the external electrode 10 and the dielectric member 20. Even without the fixing member 30, it is possible to fit and fix the dielectric member 20 inside the external electrode 10. However, considering the ease of assembling the device, the ease of positioning, the suppression of rattling, and the like, it is preferable to fix the external electrode 10 and the dielectric member 20 by the fixing member 30. In particular, as shown in FIG. 4, the fixing member 30 has a head on the dielectric member side and a screw portion on the external electrode side, and the dielectric member 20 and the external electrode 10 are connected to each other via the fixing member 30. It is preferable that they are fixed to each other.

上述したように、固定部材30は、凹部22aの表面の少なくとも一部を構成している。言い換えれば、図5に拡大して示すように、固定部材30の上端は、誘電体部材20の底部22の平坦部22bよりも低い位置に存在する。固定部材30の頭部(ネジ頭)が大き過ぎると、誘電体部材20の底面22から頭部(ネジ頭)が突出してしまい、適切に凹部22aを構成できない。この観点から、固定部材30は、例えば、低頭のネジとすることが好ましい。具体的には、頭部(ネジ頭)の厚みが1mm以上5mm以下のネジとすることが好ましく、上限は3mm以下がより好ましい。一方、固定部材30のネジ部の長さは特に限定されるものではない。誘電体部材20の厚み等に応じて適宜決定すればよい。 As described above, the fixing member 30 constitutes at least a part of the surface of the recess 22a. In other words, as shown enlarged in FIG. 5, the upper end of the fixing member 30 exists at a position lower than the flat portion 22b of the bottom portion 22 of the dielectric member 20. If the head (screw head) of the fixing member 30 is too large, the head (screw head) protrudes from the bottom surface 22 of the dielectric member 20, and the recess 22a cannot be properly formed. From this point of view, the fixing member 30 is preferably a low-head screw, for example. Specifically, the thickness of the head (screw head) is preferably 1 mm or more and 5 mm or less, and the upper limit is more preferably 3 mm or less. On the other hand, the length of the screw portion of the fixing member 30 is not particularly limited. It may be appropriately determined according to the thickness of the dielectric member 20 and the like.

固定部材30は比誘電率が1.5以上20以下の誘電体からなることが好ましい。下限はより好ましくは2以上、さらに好ましくは3以上、上限はより好ましくは10以下である。固定部材30は誘電体部材20と同じ材質からなっていてもよいし、異なる材質からなっていてもよい。特に、固定部材30は、切削加工性が良く、機械的強度の高い材質からなることが好ましい。固定部材30を構成し得る誘電体の具体例としては、ポリエーテルエーテルケトン(PEEK)、ポリフェニレンサルファイド(PPS)、ポリエーテルイミド(PEI)、ポリアリレート(PAR)等のエンジニアリングプラスチック樹脂等が挙げられる。特に固定部材30は高耐熱性、機械強度、電気絶縁性の点からPEEK樹脂からなることが好ましい。これにより、固定部材30が誘電体部材20と同等の機能を発揮するとともに、固定部材30に十分な機械的強度を確保できる。 The fixing member 30 is preferably made of a dielectric having a relative permittivity of 1.5 or more and 20 or less. The lower limit is more preferably 2 or more, further preferably 3 or more, and the upper limit is more preferably 10 or less. The fixing member 30 may be made of the same material as the dielectric member 20, or may be made of a different material. In particular, the fixing member 30 is preferably made of a material having good machinability and high mechanical strength. Specific examples of the dielectric material that can form the fixing member 30 include engineering plastic resins such as polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyetherimide (PEI), and polyarylate (PAR). .. In particular, the fixing member 30 is preferably made of PEEK resin from the viewpoint of high heat resistance, mechanical strength, and electrical insulation. As a result, the fixing member 30 exhibits the same function as the dielectric member 20, and sufficient mechanical strength can be ensured for the fixing member 30.

以上の通り、成膜装置200においても、誘電体部材20の底部22の上面の中央部に固定部材30を含む凹部22aを設けており、固定部材30の上面とプラスチック容器1の底部中央との間に間隔が設けられている。これにより、プラズマ成膜時、プラズマの集中を抑制でき、プラスチック容器1の底部における成膜ムラや色の濃化を抑制することができる。 As described above, also in the film forming apparatus 200, the recess 22a including the fixing member 30 is provided in the center of the upper surface of the bottom 22 of the dielectric member 20, and the upper surface of the fixing member 30 and the center of the bottom of the plastic container 1 are formed. There is an interval between them. As a result, it is possible to suppress the concentration of plasma during plasma film formation, and it is possible to suppress film formation unevenness and color darkening at the bottom of the plastic container 1.

3.成膜システム
上述の通り、本開示の成膜装置100、200を用いてプラスチック容器1の内面にガスバリア膜として炭素膜を成膜することができる。ここで本発明者らの知見によれば、誘電体部材20の底部22の上面とプラスチック容器1の底部との距離を所定の範囲とすることで、成膜時、プラスチック容器1の底部における成膜ムラ等を一層抑制することができる。
3. 3. Film formation system As described above, a carbon film can be formed as a gas barrier film on the inner surface of the plastic container 1 by using the film forming devices 100 and 200 of the present disclosure. Here, according to the findings of the present inventors, by setting the distance between the upper surface of the bottom 22 of the dielectric member 20 and the bottom of the plastic container 1 within a predetermined range, the film is formed at the bottom of the plastic container 1 at the time of film formation. It is possible to further suppress film unevenness and the like.

具体的には、図6に示すように、本開示の成膜装置100、200誘電体部材20の内側にプラスチック容器1を設置して、プラスチック容器1の内面に炭素膜を成膜するシステムにおいては、プラスチック容器1の底中央の下側の面と、誘電体部材20の底部の凹部22aの表面との距離(L)を3.0mm以上25mm以下とすることが好ましい。下限がより好ましくは5mm以上であり、上限がより好ましくは20mm以下である。
なお、「凹部22aの表面」とは、図6に示すように凹部22aが略水平な底面を有する場合、当該略水平な底面をいう。凹部22aが略水平な底面を有さない場合は、凹部22aの最深部を「凹部22aの表面」とする。また、固定部材30の頭頂面が凹部22aの底面となる場合(図10参照)は、固定部材30の頭頂面が「凹部22aの表面」となる。
Specifically, as shown in FIG. 6, in a system in which a plastic container 1 is installed inside the film forming apparatus 100 and 200 dielectric member 20 of the present disclosure to form a carbon film on the inner surface of the plastic container 1. The distance (L 2 ) between the lower surface of the bottom center of the plastic container 1 and the surface of the recess 22a at the bottom of the dielectric member 20 is preferably 3.0 mm or more and 25 mm or less. The lower limit is more preferably 5 mm or more, and the upper limit is more preferably 20 mm or less.
The “surface of the recess 22a” refers to the substantially horizontal bottom surface when the recess 22a has a substantially horizontal bottom surface as shown in FIG. When the recess 22a does not have a substantially horizontal bottom surface, the deepest portion of the recess 22a is referred to as the “surface of the recess 22a”. When the top surface of the fixing member 30 is the bottom surface of the recess 22a (see FIG. 10), the top surface of the fixing member 30 is the “surface of the recess 22a”.

また、プラスチック容器1の底部の接地径を基準として凹部22aの好ましい大きさを特定することもできる。例えば、図7(A)に示すように、プラスチック容器1の底部の中央部が略水平の場合は、凹部22aをその略水平部を投影した大きさ又はそれよりも小さな大きさにしたり、図7(B)に示すように、プラスチック容器1の底部が椀状や略円錐状に容器内容物側へ窪んでいる場合は、その窪みの半分高さの水平位置を投影した大きさ又はそれよりも小さな大きさにしたりすることが好ましい。
具体的には、プラスチック容器1が円筒形のボトルである場合の成膜システムにおいては、図8に示すように、上面視において、凹部22aの直径(D)を、プラスチック容器1の接地径(D)の2%以上40%以下とすることが好ましい。下限がより好ましくは5%以上であり、更に好ましくは10%以上であり、上限がより好ましくは30%以下であり、更に好ましくは20%以下である。
尚、プラスチック容器1の接地径とは、プラスチック容器1を平板に立てた場合に当該平板とプラスチック容器1の底部とが接地している少なくとも3点を結ぶようにして円を描いた場合における、当該円の直径をいう。
Further, the preferable size of the recess 22a can be specified with reference to the ground contact diameter of the bottom of the plastic container 1. For example, as shown in FIG. 7 (A), when the central portion of the bottom of the plastic container 1 is substantially horizontal, the recess 22a may be made to have a size obtained by projecting the substantially horizontal portion or a size smaller than that. As shown in 7 (B), when the bottom of the plastic container 1 is recessed toward the container contents in a bowl shape or a substantially conical shape, the size is the projected horizontal position of half the height of the recess or more. It is preferable to make the size small.
Specifically, in the film forming system when the plastic container 1 is a cylindrical bottle, as shown in FIG. 8, the diameter (D 2 ) of the recess 22a is set to the ground contact diameter of the plastic container 1 in the top view. It is preferably 2% or more and 40% or less of (D 1). The lower limit is more preferably 5% or more, further preferably 10% or more, and the upper limit is more preferably 30% or less, still more preferably 20% or less.
The ground contact diameter of the plastic container 1 is a case where a circle is drawn so as to connect at least three points where the flat plate and the bottom of the plastic container 1 are in contact with each other when the plastic container 1 is erected on a flat plate. The diameter of the circle.

成膜システムにおいて、プラズマ化学蒸着のプラズマ出力(W)や原料ガスの流速(sccm)等の諸条件は特に限定されるものではない。どのような条件であったとしても、凹部22aによる一定の効果が確保できる。プラスチック容器1の容積にもよるが、例えば、プラスチック容器1の容積が数10ml以上2L以下である場合、高周波プラズマ出力を100W以上2000W程度以下とすることが好ましく、原料ガスの流速を数10sccm以上200sccm程度以下とすることが好ましい。プラスチック容器1の容積が2L以上30L以下である場合は、高周波プラズマ出力を2000W程度以上5000W程度以下とすることが好ましく、原料ガスの流速を200sccm程度以上500sccm程度以下とすることが好ましい。
また、本発明者らの新たな知見によれば、容器が胴部に比べて口部が縮径した形状の場合は、容積(ml)に対する原料ガスの流速(sccm)の比(sccm/ml)を0.10以下とした場合、上記の成膜ムラ等を一層抑制し易く、更にはプラスチック容器1の口部内径と胴部内径との比(口部内径/胴部内径)が0.25以下の場合においては容積に対するガス流速の比(sccm/ml)が0.08以下であると上記の成膜ムラの抑制に有効である。
In the film forming system, various conditions such as the plasma output (W) of plasma chemical vapor deposition and the flow velocity (sccm) of the raw material gas are not particularly limited. Regardless of the conditions, a certain effect can be ensured by the recess 22a. Although it depends on the volume of the plastic container 1, for example, when the volume of the plastic container 1 is several tens of ml or more and 2 L or less, the high frequency plasma output is preferably 100 W or more and 2000 W or less, and the flow velocity of the raw material gas is several tens of sccm or more. It is preferably about 200 sccm or less. When the volume of the plastic container 1 is 2 L or more and 30 L or less, the high frequency plasma output is preferably about 2000 W or more and about 5000 W or less, and the flow velocity of the raw material gas is preferably about 200 sccm or more and about 500 sccm or less.
Further, according to a new finding of the present inventors, when the container has a shape in which the mouth portion has a smaller diameter than the body portion, the ratio (sccm / ml) of the flow velocity (sccm) of the raw material gas to the volume (ml). ) Is 0.10 or less, it is easier to suppress the above-mentioned uneven film formation, and the ratio of the inner diameter of the mouth to the inner diameter of the body (inner diameter of the mouth / inner diameter of the body) of the plastic container 1 is 0. In the case of 25 or less, if the ratio of the gas flow velocity to the volume (sccm / ml) is 0.08 or less, it is effective in suppressing the above-mentioned film formation unevenness.

成膜システムにおける成膜の手順は特許文献1〜3等に開示されているように公知である。一般的な手順としては例えば以下の通りである。
(1)外部電極10内に誘電体部材20を設置しプラスチック容器1を挿入する。
(2)排気手段等によって系内のガスを排気して所定の真空度に到達させる。
(3)内部電極等からプラスチック容器1内へと原料ガスを供給しつつ、外部電極10に高周波電力を印加し、外部電極と内部電極との間にプラズマを発生させる。
(4)発生させたプラズマによって原料ガスをイオン化して化学反応させ、プラスチック容器1の内面に堆積させることで、炭素膜を形成する。この場合に成膜される炭素膜としては、ガスバリア性の膜であればよく、DLC膜やアモルファスカーボン膜等、種々の炭素膜のいずれであってもよい。
炭素膜の厚みは5nm以上200nm以下の範囲とすることが好ましく、下限は10nm以上が好ましく上限は100nm以下がより好ましく、ガスバリア性、透明性や色目に応じて選択できる。
The procedure for forming a film in a film forming system is known as disclosed in Patent Documents 1 to 3 and the like. The general procedure is as follows, for example.
(1) A dielectric member 20 is installed in the external electrode 10 and the plastic container 1 is inserted.
(2) Exhaust the gas in the system by an exhaust means or the like to reach a predetermined degree of vacuum.
(3) While supplying the raw material gas from the internal electrode or the like into the plastic container 1, high-frequency power is applied to the external electrode 10 to generate plasma between the external electrode and the internal electrode.
(4) A carbon film is formed by ionizing the raw material gas with the generated plasma, chemically reacting it, and depositing it on the inner surface of the plastic container 1. The carbon film formed in this case may be any gas barrier film, and may be any of various carbon films such as a DLC film and an amorphous carbon film.
The thickness of the carbon film is preferably in the range of 5 nm or more and 200 nm or less, the lower limit is preferably 10 nm or more, and the upper limit is more preferably 100 nm or less, which can be selected according to the gas barrier property, transparency and color.

4.プラスチック容器の製造方法
本開示の技術思想は、プラスチック容器の製造方法として表現することもできる。すなわち、本開示の成膜装置100、200の誘電体部材20の内側にプラスチック容器1を設置して、プラスチック容器1の内面に炭素膜を成膜してプラスチック容器を製造する方法であって、プラスチック容器1の底中央の下側の面と、誘電体部材20の底部22の凹部22aの表面との距離を3.0mm以上25mm以下とする、製造方法である。本開示の製造方法においても、上面視において、凹部22aの直径を、プラスチック容器1の接地径の0.2%以上20%以下とすることが好ましい。製造方法における好ましい諸条件については、上記の成膜システムにて説明した通りであり、ここでは詳細な説明を省略する。
4. Manufacturing Method of Plastic Container The technical concept of the present disclosure can also be expressed as a manufacturing method of a plastic container. That is, it is a method of manufacturing a plastic container by installing a plastic container 1 inside the dielectric members 20 of the film forming apparatus 100 and 200 of the present disclosure and forming a carbon film on the inner surface of the plastic container 1. This is a manufacturing method in which the distance between the lower surface of the bottom center of the plastic container 1 and the surface of the recess 22a of the bottom portion 22 of the dielectric member 20 is 3.0 mm or more and 25 mm or less. Also in the manufacturing method of the present disclosure, it is preferable that the diameter of the recess 22a is 0.2% or more and 20% or less of the ground contact diameter of the plastic container 1 in the top view. The preferable conditions in the manufacturing method are as described in the above-mentioned film forming system, and detailed description thereof will be omitted here.

以上の通り、本開示の成膜システムや製造方法においても、底部22に凹部22aを有する誘電体部材20を用いることで、固定部材30の上面とプラスチック容器1の底部中央との間に間隔が設けられる。これにより、プラズマ成膜時、プラズマの集中を抑制でき、プラスチック容器1の底部における成膜ムラや色の濃化を抑制することができる。 As described above, also in the film forming system and the manufacturing method of the present disclosure, by using the dielectric member 20 having the recess 22a in the bottom portion 22, the space between the upper surface of the fixing member 30 and the center of the bottom portion of the plastic container 1 is separated. Provided. As a result, it is possible to suppress the concentration of plasma during plasma film formation, and it is possible to suppress film formation unevenness and color darkening at the bottom of the plastic container 1.

以下、実施例を示しつつ、本開示の成膜装置等についてより詳細に説明する。 Hereinafter, the film forming apparatus and the like of the present disclosure will be described in more detail while showing examples.

1.成膜条件
(比較例1、実施例1)
図4に示すような外部電極10と誘電部材20を固定ネジ30で組合せた中に、プラスチック容器を装填し、容器内部に容器の全高2分の1の高さにガス供給部材を兼ねた内部電極を配置し、高周波プラズマ化学蒸着法でダイアモンド・ライク・カーボン膜を容器内側全面に形成した。
誘電部材20には、ポリテトラフルオロエチレン(PTFE、比誘電率2.1)を用いた。固定ネジには、ポリエーテルエーテルケトン(PEEK、比誘電率3.3)を用いた。
プラスチック容器には、ポリエチレンテレフタレート樹脂製の容積1L、口部内径29mm、胴部内径106mm、口部内径/胴部内径の比0.27の容器を用いた。また、容器の底部は、5本脚で接地径(D)63mmで接地し、底中央部は直径約40mmの略水平部を有し、誘電部材底部の平坦部(22b)から容器底中央部までの底高さは5.6mmであった。
プラズマ化学蒸着は、原料ガスにアセチレンを用い、ガス流速95sccm、容器容積(ml)に対するガス流速(sccm)の比0.091、高周波13.56MHz、プラズマ出力1600Wの条件で行った。
その他の条件は、表1に示した。
1. 1. Film formation conditions (Comparative Example 1, Example 1)
A plastic container is loaded in a combination of an external electrode 10 and a dielectric member 20 as shown in FIG. 4 with a fixing screw 30, and the inside of the container also serves as a gas supply member at a height of half the total height of the container. Electrodes were arranged and a diamond-like carbon film was formed on the entire inside of the container by a high-frequency plasma chemical vapor deposition method.
Polytetrafluoroethylene (PTFE, relative permittivity 2.1) was used for the dielectric member 20. Polyetheretherketone (PEEK, relative permittivity 3.3) was used as the fixing screw.
As the plastic container, a container made of polyethylene terephthalate resin having a volume of 1 L, an inner diameter of the mouth of 29 mm, an inner diameter of the body of 106 mm, and an inner diameter of the mouth / inner diameter of the body of 0.27 was used. The bottom of the container is grounded with five legs with a grounding diameter (D 1 ) of 63 mm, the center of the bottom has a substantially horizontal portion with a diameter of about 40 mm, and the flat portion (22b) of the bottom of the dielectric member is the center of the bottom of the container. The bottom height to the part was 5.6 mm.
Plasma chemical vapor deposition was carried out using acetylene as the raw material gas under the conditions of a gas flow rate of 95 sccm, a ratio of the gas flow rate (sccm) to the container volume (ml) of 0.091, a high frequency of 13.56 MHz, and a plasma output of 1600 W.
Other conditions are shown in Table 1.

比較例1においては、図9に示すような頭部直径9.5mm、頭部厚み6mmの一般的な形状のネジを用いて誘電体部材と外部電極とを固定するものとした。比較例1においては、誘電体部材の底部の中央から上方にネジ頭が突出し、凹部が形成されなかった。
一方、実施例1においては、図10に示すような頭部直径9.5mm、頭部厚み1.5mmの低頭のネジを用いて誘電体部材と外部電極とを固定するものとした。これにより、実施例1においては、誘電体部材の底部の中央に深さ約1.5mmの凹部を形成するものとした。誘電体部材の底面全体面積に対する凹部面積の比(凹部面積/全体面積、a1/A1)は1.0%、容器の接地径に対する凹部直径の比は15.0%であった。
In Comparative Example 1, the dielectric member and the external electrode were fixed by using a screw having a general shape having a head diameter of 9.5 mm and a head thickness of 6 mm as shown in FIG. In Comparative Example 1, the screw head protruded upward from the center of the bottom of the dielectric member, and no recess was formed.
On the other hand, in Example 1, the dielectric member and the external electrode were fixed by using a low-head screw having a head diameter of 9.5 mm and a head thickness of 1.5 mm as shown in FIG. As a result, in Example 1, a recess having a depth of about 1.5 mm is formed in the center of the bottom of the dielectric member. The ratio of the recessed area to the total bottom surface area of the dielectric member (recessed area / total area, a1 / A1) was 1.0%, and the ratio of the recessed diameter to the ground contact diameter of the container was 15.0%.

(参考例1)
特許文献2に開示されているように、成膜時において、誘電体であるポリテトラフルオロエチレン(PTFE、比誘電率2.1)を用いて、容器の底部形状(外形)と対応する形状の部材を作製し、容器の底部に密着させた場合を参考例1とした。その他の諸条件は実施例1や比較例1と同様とした。
(Reference example 1)
As disclosed in Patent Document 2, at the time of film formation, polytetrafluoroethylene (PTFE, relative permittivity 2.1), which is a dielectric, is used to form a shape corresponding to the bottom shape (outer shape) of the container. Reference Example 1 was a case where a member was produced and brought into close contact with the bottom of the container. Other conditions were the same as in Example 1 and Comparative Example 1.

2.評価結果
(底部の色)
成膜後のプラスチック容器に対し目視で炭素膜による着色を確認した。その結果、比較例1や参考例1の条件にて得られたプラスチック容器については、胴部に対して底部の色が濃く、底部に分厚い炭素膜が形成される結果となった。
比較例1においては、成膜時、ネジ頭が誘電体部材の底部から突出し、ここにプラズマが集中したことで、成膜ムラが発生したものと考えられ、特に底面中央部の色が局所的に濃かった。また、成膜を300本行い、そのうち3本に色むらが発生し、その不良発生確率は1.0%であり、製造歩留りを大幅に低下させるものであった。
参考例1においては、ボトル底部に密着した誘電体によってプラズマが容器下部側に集中したことで、成膜ムラが発生したものと考えられ、底面の全体が胴部より色が濃かった。
一方、実施例1の条件にて得られたプラスチック容器については、底部と胴部とで成膜ムラがほとんどなく、底部と胴部とが略同じ色であり、成膜を2000本行っても色むらは1本も発生せず、不良発生確率は0.0%であった。成膜時、ネジ頭を下方に引っ込めたことで、上記のプラズマの集中を抑制できたものと考えられる。
2. Evaluation result (bottom color)
Coloring due to the carbon film was visually confirmed on the plastic container after the film formation. As a result, in the plastic containers obtained under the conditions of Comparative Example 1 and Reference Example 1, the color of the bottom was darker than that of the body, and a thick carbon film was formed on the bottom.
In Comparative Example 1, it is considered that the screw head protruded from the bottom of the dielectric member during film formation and plasma was concentrated there, resulting in uneven film formation. In particular, the color at the center of the bottom surface was local. It was dark. In addition, 300 film formations were performed, and color unevenness occurred in 3 of them, and the probability of occurrence of defects was 1.0%, which significantly reduced the manufacturing yield.
In Reference Example 1, it is considered that the plasma was concentrated on the lower side of the container due to the dielectric material in close contact with the bottom of the bottle, which was considered to have caused uneven film formation, and the entire bottom surface was darker than the body.
On the other hand, in the plastic container obtained under the condition of Example 1, there is almost no film formation unevenness between the bottom and the body, the bottom and the body have substantially the same color, and even if 2000 films are formed. No color unevenness occurred, and the probability of defect occurrence was 0.0%. It is probable that the above-mentioned plasma concentration could be suppressed by retracting the screw head downward during film formation.

(ガスバリア性)
MOCON社製OX−TRAN2/61機を用い、成膜前後のプラスチック容器の開口部に当該装置用のアダプターヘッドを装着して、23℃相対湿度50%条件下で、容器当たりの酸素透過率(cc/pkg/24h・atm)を測定した。
その結果、実施例1、比較例1、参考例1は、何れも0.003cc/pkg/24h・atmであった。また、成膜前の容器は、0.06cc/pkg/24h・atmだったので、成膜による酸素透過率の良化率は20倍であった。
(Gas barrier property)
Using an OX-TRAN2 / 61 machine manufactured by MOCON, the adapter head for the device was attached to the opening of the plastic container before and after film formation, and the oxygen permeability per container (oxygen permeability per container) under the condition of 23 ° C. and 50% relative humidity ( cc / pkg / 24h · atm) was measured.
As a result, Example 1, Comparative Example 1, and Reference Example 1 were all 0.003 cc / pkg / 24 h · atm. Further, since the container before the film formation was 0.06 cc / pkg / 24 h · atm, the improvement rate of the oxygen permeability by the film formation was 20 times.

Figure 0006855994
Figure 0006855994

本開示の成膜装置はプラスチック容器の内面にガスバリア性の炭素膜を成膜する場合に好適に利用することができる。本開示の成膜装置を用いて製造されるプラスチック容器は、ガスバリア性に優れ、炭酸ガスや香味成分が抜けることなく、また内容物の酸化も起き難い。そのため、飲料や食品を保管するための容器や医療用の容器等、あらゆる分野において利用可能である。更に、容器の底形状ごとに特注の部材の作製や組み付けが必要なく、コスト削減、生産効率向上に大変有効である。 The film forming apparatus of the present disclosure can be suitably used when forming a gas barrier carbon film on the inner surface of a plastic container. The plastic container manufactured by using the film forming apparatus of the present disclosure has excellent gas barrier properties, does not allow carbon dioxide and flavor components to escape, and is unlikely to cause oxidation of the contents. Therefore, it can be used in all fields such as containers for storing beverages and foods and containers for medical use. Furthermore, it is not necessary to manufacture or assemble a custom-made member for each bottom shape of the container, which is very effective in reducing costs and improving production efficiency.

1 プラスチック容器
10 外部電極
11 側部
12 底部
20 誘電体部材
21 側部
22 底部
22a 凹部
22b 平坦部
30 固定部材
100、200 成膜装置
1 Plastic container 10 External electrode 11 Side 12 Bottom 20 Dielectric member 21 Side 22 Bottom 22a Recess 22b Flat part 30 Fixing member 100, 200 Film deposition equipment

Claims (10)

プラスチック容器の内部に原料ガスを供給しながらプラズマを発生させて前記プラスチック容器の内面に炭素膜を成膜する装置であって、
側部及び底部を有する、有底筒状の外部電極と、
前記外部電極の内側に設置され、側部及び底部を有する、有底筒状の誘電体部材と、
を備え、
前記誘電体部材の前記底部の上面は、その略中央に凹部を有する、
成膜装置。
A device that generates plasma while supplying raw material gas to the inside of a plastic container to form a carbon film on the inner surface of the plastic container.
With a bottomed tubular external electrode with sides and bottom,
A bottomed tubular dielectric member installed inside the external electrode and having a side portion and a bottom portion.
With
The upper surface of the bottom portion of the dielectric member has a recess substantially in the center thereof.
Film forming equipment.
前記誘電体部材の前記底部の上面の略中央に誘電体からなる固定部材が設けられ、
前記固定部材の上面が前記凹部の表面の少なくとも一部を構成している、
請求項1に記載の成膜装置。
A fixing member made of a dielectric is provided at substantially the center of the upper surface of the bottom of the dielectric member.
The upper surface of the fixing member constitutes at least a part of the surface of the recess.
The film forming apparatus according to claim 1.
前記固定部材が前記誘電体部材側に頭部を有するとともに前記外部電極側にネジ部を有し、
前記固定部材を介して前記誘電体部材と前記外部電極とが互いに固定されている、
請求項2に記載の成膜装置。
The fixing member has a head on the dielectric member side and a screw portion on the external electrode side.
The dielectric member and the external electrode are fixed to each other via the fixing member.
The film forming apparatus according to claim 2.
前記固定部材は比誘電率が1.5以上20以下の誘電体からなる、
請求項2又は3に記載の成膜装置。
The fixing member is made of a dielectric having a relative permittivity of 1.5 or more and 20 or less.
The film forming apparatus according to claim 2 or 3.
前記誘電体部材は比誘電率が1.5以上20以下の誘電体からなる、
請求項1〜4のいずれか1項に記載の成膜装置。
The dielectric member is made of a dielectric having a relative permittivity of 1.5 or more and 20 or less.
The film forming apparatus according to any one of claims 1 to 4.
上面視において、前記誘電体部材の前記底部の上面全体の面積に対する前記凹部の面積の割合((凹部面積/全体面積)×100%)が、0.2%以上10%以下である、
請求項1〜5のいずれか1項に記載の成膜装置。
In top view, the ratio of the area of the recess to the total area of the top surface of the bottom of the dielectric member ((recess area / total area) × 100%) is 0.2% or more and 10% or less.
The film forming apparatus according to any one of claims 1 to 5.
請求項1〜6のいずれか1項に記載の成膜装置の前記誘電体部材の内側にプラスチック容器を設置して、前記プラスチック容器の内面に炭素膜を成膜するシステムであって、
前記プラスチック容器の底中央の下側の面と、前記誘電体部材の前記底部の凹部の表面との距離を3.0mm以上25mm以下とする、
成膜システム。
A system in which a plastic container is installed inside the dielectric member of the film forming apparatus according to any one of claims 1 to 6 to form a carbon film on the inner surface of the plastic container.
The distance between the lower surface of the center of the bottom of the plastic container and the surface of the concave portion of the bottom of the dielectric member shall be 3.0 mm or more and 25 mm or less.
Film formation system.
上面視において、前記凹部の直径を、前記プラスチック容器の接地径の2%以上40%以下とする、
請求項7に記載の成膜システム。
In top view, the diameter of the recess is set to 2% or more and 40% or less of the ground contact diameter of the plastic container.
The film forming system according to claim 7.
請求項1〜6のいずれか1項に記載の成膜装置の前記誘電体部材の内側にプラスチック容器を設置して、前記プラスチック容器の内面に炭素膜を成膜してプラスチック容器を製造する方法であって、
前記プラスチック容器の底中央の下側の面と、前記誘電体部材の前記底部の凹部の表面との距離を3.0mm以上25mm以下とする、
製造方法。
A method for manufacturing a plastic container by installing a plastic container inside the dielectric member of the film forming apparatus according to any one of claims 1 to 6 and forming a carbon film on the inner surface of the plastic container. And
The distance between the lower surface of the center of the bottom of the plastic container and the surface of the concave portion of the bottom of the dielectric member shall be 3.0 mm or more and 25 mm or less.
Production method.
上面視において、前記凹部の直径を、前記プラスチック容器の接地径の0.2%以上20%以下とする、
請求項9に記載の製造方法。
In top view, the diameter of the recess is set to 0.2% or more and 20% or less of the ground contact diameter of the plastic container.
The manufacturing method according to claim 9.
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