JP6777477B2 - Electric module manufacturing method and electric module manufacturing equipment - Google Patents

Description

The present invention relates to a method for manufacturing an electric module and an apparatus for manufacturing an electric module.

In recent years, as a clean power source, solar cells that can directly and immediately convert light energy into electric power and do not emit pollutants such as carbon dioxide have been attracting attention. Among them, dye-sensitized solar cells are expected as next-generation solar cells because they have high conversion efficiency, are manufactured by a relatively simple method, and the unit price of raw materials is low.

Recently, continuous production by introducing a roll-to-roll method (hereinafter referred to as RtoR method) has been studied for practical use of solar cells such as dye-sensitized solar cells. For example, Patent Document 1 includes a transparent conductive layer, a semiconductor electrode, a counter electrode substrate, a counter electrode, a sealing material, an electrolytic solution, and a current collecting electrode, which can be manufactured by the RtoR method. A dye-sensitized solar cell and a method for manufacturing the same are disclosed. In the dye-sensitized solar cell described in Patent Document 1, the transparent conductive layer and the current collecting electrode are electrically connected to each other via a counter electrode substrate and holes formed in a plurality of sealing materials.

The method for manufacturing a dye-sensitized solar cell described in Patent Document 1 includes a step of forming a porous semiconductor layer on at least a part of one main surface of a transparent conductive layer and a step of supporting a sensitizing dye on the porous semiconductor layer. , The step of forming the semiconductor electrode, the step of providing the counter electrode on at least a part of the main surface of the counter electrode substrate, the semiconductor electrode and the counter electrode are arranged to face each other, and a plurality of steps are provided between the semiconductor electrode and the counter electrode. A step of interposing individual sealing materials, a step of providing an electrolytic solution between the semiconductor electrode and the counter electrode, and a counter electrode substrate and a plurality of counter electrode substrates so as to communicate with each of the counter electrode substrate and the plurality of encapsulants. A step of integrally forming a current collecting electrode on a hole formed in each of the sealing materials and a main surface on the opposite side of the surface on which the counter electrode of the counter electrode is provided is provided.

Japanese Unexamined Patent Publication No. 2012-174596

However, in the manufacture of an electric module such as a dye-sensitized solar cell using the RtoR method, it takes a certain amount of time for the electrolytic solution to permeate into the semiconductor layer. In addition, it is considered important to take as much time as possible from the application of the electrolytic solution to the bonding of the base materials and the completion of the module, and the transport distance of the base materials. However, at present, there are devices such as a base material bonding part for completing an electric module immediately in front of the electrolytic solution coating device in the transfer direction of the base material, so that the electrolytic solution sufficiently permeates the semiconductor layer. First, the electric module is manufactured, and there is a problem that the electric module immediately after the manufacture does not fully exhibit its performance. At present, if the transport distance of the base material is increased in order to gain time and distance for impregnating the semiconductor layer with the electrolytic solution, another problem arises that the apparatus becomes large.

The present invention has been made in view of the above circumstances, and is a method for manufacturing an electric module and an electric module capable of fully exhibiting the performance of the electric module immediately after manufacturing and suppressing an increase in the size of the manufacturing apparatus. Providing manufacturing equipment for.

The method for manufacturing an electric module according to the present invention includes a semiconductor layer, an electrolytic solution, and a sealing material between two base materials, and is described along the surface of one of the two base materials. A method for manufacturing an electric module in which a semiconductor layer and the electrolytic solution are provided between the sealing materials, a step of forming the semiconductor layer on the surface and the electrolytic solution on the semiconductor layer. It is characterized by having an electrolytic solution coating step of applying the electrolytic solution and a sealing material coating step of applying the sealing material to the surface after applying the electrolytic solution.

According to the above configuration, by applying the electrolytic solution to the semiconductor layer before applying the sealing material to one of the base materials (hereinafter, may be simply referred to as “base material”), after the electric module is manufactured. By the time, the time and distance for the electrolytic solution to soak into the semiconductor layer are secured for a long time, and after manufacturing, the electrolytic solution is sufficiently soaked into the semiconductor layer, so that the electric module has sufficient performance even immediately after manufacturing. Demonstrate. In addition, it is not necessary to forcibly lengthen the transport time and distance of the base material from the application of the electrolytic solution to the completion of the electric module, and the increase in size of the apparatus can be suppressed.

In the method for manufacturing an electric module described above, while transporting one of the base materials in a predetermined direction, a transport distance between a position where the electrolytic solution coating step is performed and a position where the sealing material coating step is performed in the predetermined direction. The interval is preferably 50 cm or more.

According to the above configuration, since the sealing material is applied after the bubbles and the like generated in the electrolytic solution are removed, the electrolytic solution is covered with the sealing material before the bubbles and the like are completely removed. There is no risk that air bubbles will remain in the module and the quality of the electric module after production will deteriorate.

In the method for manufacturing an electric module described above, while transporting the one base material in a predetermined direction, the transport distance for transporting the one base material from the position where the encapsulant coating step is performed in the predetermined direction is 100 cm. It is preferable to do the above.

Encapsulant coating step According to the above configuration, the substrate is transported at a transport distance of 100 cm or more, so that a time for the electrolytic solution to sufficiently penetrate into the semiconductor layer is secured. Therefore, the electrolytic solution is sufficiently permeated into the semiconductor layer, and good operation of the semiconductor electrode is expected.

In the method for manufacturing an electric module described above, it is preferable to apply the electrolytic solution to the one base material from any direction in the range between the horizontal direction and the upward direction.

According to the above configuration, the electrolytic solution is applied from any direction in the range between the horizontal direction and the upward direction, so that even when an electrolytic solution having a viscosity lower than that of the encapsulant is used, for example. The electrolytic solution is applied in an appropriate amount without being excessively applied from the electrolytic solution coating device due to the weight of the electrolytic solution, so that the electrolytic solution is prevented from leaking and the electrolytic solution is well permeated into the semiconductor layer.

In the method for manufacturing an electric module described above, the electric module may be a dye-sensitized solar cell.

The electric module manufacturing apparatus according to the present invention is an electric module manufacturing apparatus for manufacturing the above-mentioned electric module, and includes an electrolytic solution coating device for applying the electrolytic solution to the one base material and the above-mentioned electrolytic solution coating device. A sealing material coating device for coating the sealing material on one of the base materials is provided.
The encapsulant coating device is characterized in that it is arranged at a position where the encapsulant can be applied in the vicinity of the electrolytic solution applied by the electrolytic solution coating device.

According to the above configuration, the electrolytic solution is applied to the semiconductor layer by the electrolytic solution coating device on the upstream side in the transport direction of the base material before the sealing material is applied to the base material by the sealing material coating device. Therefore, a long time is secured for the electrolytic solution to soak into the semiconductor layer by the time the electric module is manufactured, and the semiconductor layer is sufficiently soaked with the electrolytic solution after manufacturing. As a result, high performance of the electric module can be obtained even immediately after manufacturing. In addition, the increase in size of the electric module manufacturing apparatus can be suppressed.

In the electric module manufacturing apparatus according to the present invention, the one base material is conveyed in a predetermined direction, and the electrolytic solution coating apparatus and the sealing material are conveyed from the upstream side to the downstream side along the predetermined direction. It is preferable that the coating devices are arranged in this order, and the transport distance interval between the installation position of the electrolytic solution coating device and the installation position of the sealing material coating device in the predetermined direction is 50 cm or more.

According to the above configuration, since the sealing material is applied after the bubbles and the like generated in the electrolytic solution are removed, there is no possibility that the electrolytic solution is covered with the sealing material before the bubbles and the like are completely removed.

In the electric module manufacturing apparatus according to the present invention, one of the base materials is transported in a predetermined direction, and a transport distance of 100 cm or more is provided on the downstream side of the installation position of the encapsulant coating device in the predetermined direction. Is preferable.

According to the above configuration, by securing a transport distance of 100 cm or more, it is possible to obtain a time for the electrolytic solution to sufficiently permeate the semiconductor layer, so that the electrolytic solution sufficiently permeates the semiconductor layer and the semiconductor electrode. Good operation is expected.

In the electric module manufacturing apparatus according to the present invention, it is preferable that the coating port of the electrolytic solution coating apparatus is located in the range from the sideways direction to the upward direction.

According to the above configuration, similarly to the above-described method for manufacturing an electric module, even when an electrolytic solution having a viscosity lower than that of the encapsulant is used, the electrolytic solution is released from the electrolytic solution coating device due to the weight of the electrolytic solution. It is applied in an appropriate amount without being excessively applied to prevent leakage of the electrolytic solution, and the electrolytic solution soaks into the semiconductor layer well.

In the above-mentioned electric module manufacturing apparatus, the electric module may be a dye-sensitized solar cell.

According to the method for manufacturing an electric module and the manufacturing apparatus for an electric module according to the present invention, it is possible to easily obtain sufficiently high performance of the electric module immediately after manufacturing.

It is a top view which shows the structure of the battery sheet which can be manufactured using the manufacturing method of the electric module of one Embodiment to which this invention is applied. It is a figure which shows the structure of the battery sheet which can be manufactured by using the manufacturing method of the electric module of one Embodiment to which this invention is applied, and is the cross-sectional view seen by the XX line shown in FIG. It is a schematic side view of the manufacturing apparatus of the electric module of one Embodiment to which this invention was applied. It is a schematic side view which shows the 1st modification of the manufacturing apparatus of the electric module of one Embodiment to which this invention was applied. It is a schematic side view which shows the 2nd modification of the manufacturing apparatus of the electric module of one Embodiment to which this invention was applied. It is sectional drawing of the precursor of the battery sheet for demonstrating the manufacturing method of the electric module of one Embodiment to which this invention is applied. It is sectional drawing of the precursor of the battery sheet for demonstrating the manufacturing method of the electric module of one Embodiment to which this invention is applied.

Hereinafter, an electric module manufacturing method to which the present invention is applied and an embodiment of an electric module manufacturing apparatus will be described with reference to the drawings. The drawings used in the following description are schematic, and the length, width, thickness ratio, etc. are not always the same as the actual ones and can be changed as appropriate.

(Configuration of electrical module)
Hereinafter, as an example of an electric module manufactured by using the method for manufacturing an electric module described later, a film-type dye-sensitized solar cell (electric module) manufactured by using the RtoR method will be described. The dye-sensitized solar cell manufactured by using the RtoR method is, for example, a battery sheet 21 shown in FIGS. 1 and 2 cut out to a desired size and connected with wiring 7.

The electric module manufactured by using the method for manufacturing the electric module of the present embodiment is not limited to the dye-sensitized solar cell, and a semiconductor layer, an electrolytic solution, and a sealing material are placed between two base materials. All electric modules other than the dye-sensitized solar cell are provided as long as the semiconductor layer and the electrolytic solution are provided between the sealing materials along the surface of at least one of the two base materials. Includes. Further, the electric module manufactured by using the method for manufacturing an electric module of the present embodiment is manufactured by using the RtoR method, that is, a module manufactured continuously while transporting a base material in a predetermined direction. It is not limited to this, and includes those in which a cell structure is formed for each base material cut in advance.

As shown in FIGS. 1 and 2, the battery sheet (dye-sensitized solar cell) 21 is formed in a predetermined region of the first base material (one base material) 1 and one surface 1a of the first base material 1. The formed semiconductor electrode 5, the wiring 7, the sealing material 9, the second base material (base material) 6, and the catalyst layer 8 formed in a predetermined region on one surface 6a of the second base material 6. And have.

The first base material 1 is a member that serves as a base for the semiconductor electrode 5, the wiring 7, and the sealing material 9. The first base material 1 is not particularly limited as long as it has an appropriate flexibility applicable to continuous production of solar cells using the RtoR method and can be formed into a large area film. Examples of the first base material 1 include transparent resin materials such as polyethylene terephthalate (PET), acrylic, polycarbonate, polyethylene naphthalate (PEN), and polyimide.

The semiconductor electrode 5 is composed of a transparent conductive film 3, a semiconductor layer 10, and an electrolytic solution 15.
The transparent conductive film 3 is formed over the entire surface 1a of the first base material 1. Examples of the transparent conductive film 3 include tin oxide (ITO) and zinc oxide. Depending on the configuration of the dye-sensitized solar cell to be manufactured, the surface 1a of the first base material 1 may be appropriately insulated. Further, the transparent conductive film 3 and the above-mentioned insulation treatment may be formed discontinuously along the surface 1a of the first base material 1.

The semiconductor layer 10 is formed in a predetermined region R1 on the transparent conductive film 3 of the first base material 1. The regions R1 are provided at intervals from each other in the transport direction (predetermined direction) P1 of the first base material 1 and the width direction P2 of the first base material 1 orthogonal to the transport direction P1. Here, in the transport direction P1, the start point side will be the upstream side and the end point side will be the downstream side.

The semiconductor layer 10 is formed in a so-called dyed state by supporting the sensitizing dye on a porous layer made of a metal oxide having a function of receiving and transporting electrons from the sensitizing dye, for example. Examples of such metal oxides include titanium oxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), and the like.

The above-mentioned sensitizing dye is composed of an organic dye or a metal complex dye. Examples of the organic pigment include various organic pigments such as coumarin-based, polyene-based, cyanine-based, hemicyanine-based, and thiophene-based. Examples of the metal complex dye include a ruthenium complex and the like.

The semiconductor layer 10 is impregnated with the electrolytic solution 15. The electrolytic solution 15 is a solution in which a supporting electrolyte such as lithium iodide and iodine are mixed with a liquid component such as an ionic liquid such as acetonitrile, dimethylpropyl imidazolium iodide or butyl methyl imidazolium iodide (specifically). Examples thereof include non-aqueous solvents such as propionitrile).

The wiring 7 is formed in a region R2 on which the semiconductor layer 10 is not formed on the transparent conductive film 3 of the first base material 1, that is, a region R2 other than a predetermined region R1 on the transparent conductive film 3, and is formed on the semiconductor electrode 5 and the catalyst layer. It is a conductive structure for connecting the electrode structures C made of 8. The wiring 7 is not particularly limited as long as it is a conductive material, and examples thereof include known conductive materials, conductive pastes, and mixtures of conductive fine particles and adhesives. A binder made of the same material as the sealing material 9 described below may be used for the wiring 7.

The sealing material 9 is formed between the semiconductor layers 10 adjacent to each other in the width direction P2 in the region R2 on the transparent conductive film 3 of the first base material 1 and on both sides of the wiring 7, and the first base material 1 and the first base material 9 are formed. (Ii) Contains a resin or the like for adhering and adhering to the base material 6. Examples of the sealing material 9 include a resin material containing at least one of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin.

The second base material 6 is a member that serves as a base for the catalyst layer 8. The second base material 6 is not particularly limited as long as it has appropriate flexibility applicable to continuous production of solar cells using the RtoR method and can be formed into a large area film. Examples of the second base material 6 include the same materials as those of the first base material 1.

The catalyst layer 8 is formed over the entire surface 6a of the second base material 6. Examples of the catalyst layer 8 include platinum, ITO, polyaniline, polyethylene dioxythiophene (PEDOT), carbon and the like.

(Electrical module manufacturing equipment)
The electric module manufacturing apparatus 30 to which the present invention is applied (hereinafter, may be simply referred to as a “manufacturing apparatus”) is a battery sheet 21 (hereinafter, may be simply referred to as a “manufacturing apparatus”) using the battery sheet 21 described above using the method for manufacturing an electric module of the present embodiment described later. That is, it is an apparatus for manufacturing a dye-sensitized solar cell), and the electrolytic solution 15 is applied to a semiconductor layer 10 formed in at least a predetermined region (that is, region R1 shown in FIG. 1) of the first base material 1. The electrolytic solution coating device 32 to be coated and the electrolytic solution coating device 32 provided downstream of the electrolytic solution coating device 32 in a predetermined direction P1 and sealed in the uncoated region (that is, the region R2 shown in FIG. 1) of the electrolytic solution 15 in the first base material 1. A sealing material coating device 34 for coating the stopper 9 is provided.

As shown in FIG. 3, the manufacturing apparatus 30 of the present embodiment forms a semiconductor electrode in a predetermined region on the surface 1a of the first base material 1 in addition to the electrolytic solution coating apparatus 32 and the sealing material coating apparatus 34. A semiconductor electrode forming portion (not shown), a wiring forming device 36 for forming wiring between sealing materials, and a catalyst layer forming portion for forming a catalyst layer in a predetermined region on the surface 6a of the second base material 6 (not shown). (Not shown), the base material bonding portion 38 in which the second base material 6 having the catalyst layer formed on the surface 6a is bonded to the first base material 1, and the first base material bonding portion 38. A bonding portion (not shown) for fixing the adhesion between the base material 1 and the second base material 6 (that is, the bonding materials 11 and 12) is bonded to the first base material 1 and the second base material 6. It is provided with an insulation processing unit (not shown) that insulates a predetermined position of the battery sheet 21.

At the most upstream position in the manufacturing apparatus 30, a transparent conductive film and a semiconductor layer 10 in a state before being impregnated with the electrolytic solution 15 are formed by the semiconductor electrode forming portion, and the surface 1a is rolled in advance toward the outer side in the radial direction. The first base material 1R wound up in a shape is installed.

A transport roll 46 for folding back, winding up, and transporting the first base material 1 is arranged downstream from the installation position of the first base material 1R. The transport roll 46 is configured so as not to abut on the surface 1a of the surfaces 1a and 1b of the first base material 1 but to abut only on the surface 1b on which the semiconductor layer 10 is not formed.

The electrolytic solution coating device 32 is arranged at a position substantially horizontally facing the transport roll 46 via the first base material 1. Examples of the electrolytic solution coating device 32 include a die coater. The coating port 32p of the electrolytic solution coating device 32 is directed to a position where the electrolytic solution 15 can be applied to the semiconductor layer of the first base material 1 wound around the transport roll 44, and is spaced from the first base material 1. It is arranged with s32 open. That is, the coating port 32p is located sideways (direction facing the horizontal direction). The electrolytic solution 15 can be applied to the surface 1a of the first base material 1 from the horizontal direction. In consideration of the viscosity of the electrolytic solution 15, the height h32 of the coating port 32p of the electrolytic solution coating device 32 from the surface 1a of the first base material 1 is preferably 10 μm or more and 1000 μm or less.

A sealing material coating device 34 is arranged at a position downstream from the installation position of the transport roll 46. The coating material 9 of the sealing material coating device 34 can be coated with the sealing material 9 between the semiconductor layers 10 coated with the electrolytic solution 15 in the width direction of the first base material 1 in contact with the folded-back portion of the transport roll 46. It is oriented toward the position and is arranged with an interval s34 larger than the interval s32 with respect to the first base material 1. For example, the sealing material 9 having a viscosity higher than that of the electrolytic solution 15 can be applied to the surface 1a of the first base material 1 in a substantially vertical direction.

When the viscosity of the electrolytic solution 15 is lower than the viscosity of the sealing material 9, the height h34 of the coating port 34p of the sealing material coating device 34 from the surface 1a of the first base material 1 is the electrolytic solution coating device 32. It is preferable that the height of the coating port 32p is 10 μm or more and 1000 μm or less higher than the height h32.

Further, in FIG. 6, for the sake of clarity, the coating position of the sealing material 9 to be applied to the surface 1a of the first base material 1 and the position of the coating port 34p of the sealing material coating device 34 are shown by broken lines. .. In the width direction P2, the coating port 34p of the sealing material coating device 34 is arranged on both sides of the coating port 32p of the electrolytic solution coating device 32. In particular, considering the viscosity of the electrolytic solution 15, the width dimension w32 of the coating port 32p of the electrolytic solution coating device 32 is the coating port of the sealing material coating device 34 adjacent to each other in the width direction P2 as shown in FIGS. 6 and 7. It is preferably 10% or more and 90% or less of the gap s34 between 34p.

The transport distance interval ds1 between the installation position of the electrolytic solution coating device 32 and the installation position of the sealing material coating device 34 is preferably 50 cm or more, and more preferably 1 m or more. However, the transport distance interval ds1 may be appropriately set in consideration of the type of the electrolytic solution 15, the material of the component of the first base material 1, the transport speed of the first base material 1, and the like.

A wiring forming device 36 for forming wiring in the width direction P2 is arranged at a position downstream from the installation position of the sealing material coating device 34. The wiring material discharge port of the wiring forming device 36 is directed to a position where the material of the wiring 7 can be supplied to the first base material 1 which is conveyed along a substantially horizontal direction.

At a position downstream from the installation position of the wiring forming device 36, the semiconductor layer 10 coated with the electrolytic solution 15, the wiring and the first base material 1 on which the sealing material 9 is formed (hereinafter referred to as the bonding material 11). (See FIGS. 1 and 2) and a base material bonding portion for bonding the second base material 6 on which the catalyst layer is formed (hereinafter referred to as a bonding material 12, see FIGS. 1 and 2) to each other. 38 are arranged.

Examples of the base material bonding portion 38 include a pair of pressing rolls 60 and 62 arranged at predetermined intervals in the vertical direction. The distance between the first pressing roll 60 arranged above and the second pressing roll 62 arranged below is appropriately set in consideration of the thickness dimensions of the bonding materials 11 and 12 and the battery sheet 21. ..

A catalyst layer is formed by a counter electrode forming portion (not shown) diagonally above the upstream of the direction P1 from the installation position of the base material bonding portion 38, and the surface 6a is previously wound in a roll shape toward the inside in the radial direction. The second base material 6R is installed.

The first pressing roll 60 does not abut on the surface 6a of the surfaces 6a and 6b of the second base material 6 conveyed from diagonally above, but only on the surface 6b on which the catalyst layer is not formed. It is configured.
The second pressing roll 62 does not abut on the surface 1a of the surfaces 1a and 1b of the first base material 1 which is conveyed substantially horizontally, the sealing material 9 is not applied, and the electrolytic solution 15 is applied. It is configured to abut only on the surface 1b on which the including semiconductor layer 10 is not formed.

Slightly downstream in the direction P1 from the installation position of the base material bonding portion 38, the pressing region is irradiated with, for example, ultraviolet rays from the outside of the pressing region by the first pressing roll 60 and the second pressing roll 62 to form a sealing material. An adhesive portion for curing the ultraviolet curable resin contained in 9 is arranged.

Although not shown, at a desired position of the battery sheet 21 in which the bonding materials 11 and 12 are bonded by the base material bonding portion 38 downstream from the installation position of the base material bonding portion 38 in the direction P1. An insulation treatment unit for performing insulation treatment is arranged.

It is preferable that a transport distance d2 of 100 cm or more is secured on the downstream side of the installation position of the sealing material coating device 34. In the manufacturing apparatus 31A, the battery sheet 21 is manufactured from the installation position of the sealing material coating device 34, and the transport distance from the position where the dye-sensitized solar cell is completed is secured at least 100 cm or more. However, the transport distance d2 is appropriately set in consideration of the transport distance interval ds1, the type of the electrolytic solution 15, the material of the component of the first base material 1, the transport speed of the first base material 1, and the like. Just do it.

In the manufacturing apparatus 31A, which is the first modification of the manufacturing apparatus 30 of the present embodiment, as shown in FIG. 4, the first substrate 1 is moved upward between the installation position of the first substrate 1R and the transport roll 46. A transport roll 44 for starting up and transporting the product is arranged. The transport roll 44 is configured so as not to abut on the surface 1b of the surfaces 1a and 1b of the first base material 1 but to abut on the surface 1a. With such a configuration, the first base material 1R unwound in the substantially horizontal direction P1 is once bent in the substantially vertical direction by the transport roll 44, and immediately after the electrolytic solution coating step, the first base material 1R is oriented in the substantially horizontal direction by the transport roll 46. After being bent, it is conveyed in the substantially horizontal direction P1.

In the manufacturing apparatus 31A, the electrolytic solution coating apparatus 32 is arranged so that the coating port 32p is positioned sideways as shown by a solid line in FIG. Therefore, the electrolytic solution 15 can be applied to the surface 1a of the first base material 1 from the horizontal direction.

Further, as shown in FIG. 5, the manufacturing apparatus 31B, which is a second modification of the manufacturing apparatus 30 of the present embodiment, is composed of the same components as the manufacturing apparatus 30, but is coated with the electrolytic solution coating apparatus 32. The mouth 32p is located in the range from sideways to upwards. As the arrangement of the electrolytic solution coating device 32, for example, as shown by the broken line in FIG. 5, the axis of the electrolytic solution coating device 32 is inclined downward by about 45 degrees with respect to the horizontal direction, and the arrangement is obliquely upward. As shown by the alternate long and short dash line, an upward arrangement in which the axis of the electrolytic solution coating device 32 is in the vertical direction can be mentioned. In these arrangements, the electrolytic solution 15 can be applied to the surface 1a of the first base material 1 from below the horizontal direction.

(Manufacturing method of electric module)
In the method for manufacturing an electric module to which the present invention is applied, a semiconductor that is continuously conveyed along a predetermined direction P1 by using the above-mentioned manufacturing apparatus 30 or the like and the predetermined region of the surface 1a is not impregnated with the electrolytic solution 15. This is a method for manufacturing a dye-sensitized solar cell (see FIGS. 1 and 2) manufactured by laminating a second base material 6 to a first base material 1 on which a layer 10 is formed. The method for manufacturing the electric module is a method of applying the electrolytic solution 15 to the semiconductor layer (semiconductor electrode) 10 of the first base material 1 and after the electrolytic solution coating step, on the surface 1a of the first base material 1. It has a sealing material coating step of coating a sealing material on an uncoated region of the electrolytic solution 15.

In the method for manufacturing an electric module of the present embodiment, in addition to the electrolytic solution coating step and the sealing material coating step, a second base material 6 having a catalyst layer formed on the surface 6a is used after the sealing material coating step. It further includes a base material bonding step of bonding to the base material 1 and a wiring forming step of forming wiring on the first base material 1 between the sealing material coating step and the base material bonding step. There is. The wiring forming step may be performed after the electrolytic solution coating step and before the sealing material coating step.
Hereinafter, a method of manufacturing the battery sheet 21, which is a precursor of the dye-sensitized solar cell of the present embodiment, including each of the above-mentioned steps, will be described with reference to FIG.

Using a device using the RtoR method (not shown), the surface 1a of the first base material 1 is continuously conveyed along a predetermined direction by a known sputtering method, printing method, or the like. A transparent conductive film 3 is formed on the surface. Subsequently, a porous layer made of a metal oxide such as titanium oxide is formed in a predetermined region on the surface 1a of the first substrate 1 by a known aerosol deposition method (AD method) or the like. Further, the semiconductor layer 10 is formed by supporting the sensitizing dye on the porous layer. In this way, the first base material 1 on which the semiconductor layer 10 before impregnating the predetermined region of the surface 1a with the electrolytic solution 15 is formed is wound in a roll shape with the surface 1a facing outward, and the roll-shaped first base material 1 is wound. One base material is 1R.

A known sputtering method using an apparatus using an RtoR method (not shown) while continuously transporting the second base material 6 along a predetermined direction separately from the roll-shaped first base material 1R described above. A catalyst layer is formed on the surface 6a of the second base material 6 by a printing method or the like, and the surface 6a is wound inward in a roll shape to form a roll-shaped second base material 6R.

As shown in FIG. 3, a roll-shaped first base material 1R is installed in the manufacturing apparatus 30, the first base material 1 is unwound from the first base material 1R in a predetermined direction P1, and the unwound first base material is unwound. Insulation treatment is applied to 1 as necessary.

<Electrolyte coating process>
Next, the transport roll 46 is applied to the surface 1b of the first base material 1 and folded back, and the electrolytic solution 15 is placed from the coating port 32p of the electrolytic solution coating device 32 arranged so as to face the transport roll 46 substantially horizontally. The electrolytic solution 15 is discharged at an appropriate flow rate in consideration of the viscosity of the first base material 1 and the transport speed of the first base material 1, and the electrolytic solution 15 is applied to the semiconductor layer 10 from the surface 1a side of the first base material 1. When the viscosity of the electrolytic solution 15 is lower than the viscosity of the sealing material 9, the height hp15 of the electrolytic solution 15 from the surface 1a of the first base material 1 at the coating position of the electrolytic solution 15 is set to the viscosity of the electrolytic solution 15 and the first. In consideration of the transport speed of one base material 1, the height of the electrolytic solution 15 at the coating position of the sealing material 9 described later is set to be appropriately higher than h15 (see FIGS. 6 and 7). Further, the height (height dimension) hp15 of the electrolytic solution 15 is preferably 10 μm or more and 1000 μm or less. Further, in the electrolytic solution coating step, the width dimension wp15 of the electrolytic solution 15 is set to 10% or more and 90% or less of the gap s9 between adjacent sealing materials 9 in the width direction P2, and is appropriate in consideration of the viscosity of the electrolytic solution 15. It is preferable to set to.

<Encapsulant coating process>
Next, by folding back the first base material 1 from the transport roll 46, the first base material 1 is transported in a substantially horizontal direction P1. The sealing material 9 is discharged from the coating port 34p of the sealing material coating device 34 at an appropriate flow rate in consideration of the viscosity of the sealing material 9, the transport speed of the first base material 1, and the like, and the predetermined base material 1 is determined. The sealing material 9 is applied to the region of. For example, if the transport speed of the first base material 1 is within the range of 0.1 m / min or more and 10 m / min or less, the position where the above-mentioned electrolytic solution coating step is performed and the sealing material coating step are performed in the predetermined direction P1. The transport distance interval ds1 from the position is preferably 50 cm or more, and preferably 1 m or more. When it is difficult to secure the transport distance interval ds1 of 50 cm or more, it is preferable to perform the encapsulant coating step at intervals of 10 seconds or more after performing the electrolytic solution coating step.

When the viscosity of the electrolytic solution 15 is lower than the viscosity of the sealing material 9, the height of the electrolytic solution 15 while the first base material 1 is transported from the coating position of the electrolytic solution 15 to the coating position of the sealing material 9. The hp15 decreases to the height h15, and the width dimension wp15 of the electrolytic solution 15 expands to the width dimension w15. As described above, since the interval s34 is set to be larger than the interval s32, as shown in FIG. 6, the height h9 at the time of coating the sealing material 9 is the electrolytic solution 15 at the coating position of the sealing material 9. The height is higher than h15. In this way, at the position where the sealing material 9 is applied, as shown in FIG. 7, the height h9 of the sealing material 9 is made higher than the height h15 of the electrolytic solution 15 and applied. At this time, it is preferable that the height h9 of the sealing material 9 is made higher than the height h15 of the electrolytic solution 15 by 10 μm or more and 1000 μm or less.

<Wiring formation process>
Next, with respect to the first base material 1 transported along the predetermined direction P1, the viscosity of the wiring material, the transport speed of the first base material 1, and the like are appropriately taken into consideration from the wiring material discharge port of the wiring forming device 36. The wiring material is discharged at a high flow rate, and the wiring is formed in a predetermined region of the first base material 1.

Next, a roll-shaped second base material 6R is installed in the manufacturing apparatus 30, and the second base material 6 is unwound from the second base material 6R in a predetermined direction, which is necessary for the unwound second base material 6. Insulation is applied according to the above.

As described above, the first base material 1 on which the semiconductor electrode, the wiring, and the sealing material 9 are formed is used as the bonding material 11, and the second base material 6 on which the catalyst layer is formed is used as the bonding material 12.

<Base material bonding process>
Next, the laminating material 11 is introduced between the first pressing roll 60 and the second pressing roll 62 arranged below along the substantially horizontal direction P1, and the laminating material 12 is introduced from an obliquely upward direction. Is introduced, the first pressing roll 60 and the second pressing roll 62 are passed, and the bonding materials 11 and 12 are pressed against each other for bonding.

After that, if necessary, the precursor structure of the dye-sensitized solar cell formed by laminating the bonding materials 11 and 12 is irradiated with ultraviolet rays using a UV lamp or the like to cure the sealing material 9.

It is preferable to secure a transport distance d2 of 100 cm or more on the downstream side of the position where the sealing material coating step is performed. That is, in the manufacturing apparatus 31A, it is preferable that the battery sheet 21 is manufactured from the position where the encapsulant coating step is performed, and the transport distance to the position where the dye-sensitized solar cell is completed as described above is at least 100 cm or more.

Through the above steps, the battery sheet 21 shown in FIGS. 1 and 2 can be manufactured. After that, if necessary, the dye-sensitized solar cell is cut out from the battery sheet 21 in a desired pattern. As a result, a dye-sensitized solar cell is obtained.

In the method of manufacturing the electric module using the manufacturing apparatus 31A shown in FIG. 4, the first base material 1 is unwound from the roll-shaped first base material 1R in a substantially horizontal predetermined direction P1. The method is the same as that of the electric module manufacturing method using the manufacturing apparatus 30, except that the base material 1 is once folded back in the substantially vertical direction by the transport roll 44 and then rewound by the transport roll 46.
The method of manufacturing the electric module using the manufacturing apparatus 31B shown in FIG. 5 is the same as the method of manufacturing the electric module using the manufacturing apparatus 30.

According to the method for manufacturing an electric module of the present embodiment described above, the semiconductor layer 10 is first formed on the surface 1a of the first base material 1 through a semiconductor layer forming step, an electrolytic solution coating step, and a sealing material coating step. After applying the electrolytic solution 15 of the semiconductor layer 10, by applying the sealing material 9 to the surface 1a of the first base material 1 on which the semiconductor layer 10 is not formed, the electrolytic solution 15 is applied by the time the electric module is manufactured. Allows a long time to soak into the semiconductor layer 10 and allows the semiconductor layer 10 to be sufficiently soaked with the electrolytic solution 15 after manufacturing to obtain sufficiently high performance of the electric module even immediately after manufacturing. it can. Further, it is not necessary to forcibly lengthen the transport time and distance of the first base material 1 from the application of the electrolytic solution 15 to the completion of the dye-sensitized solar cell, and it is possible to suppress the increase in size of the apparatus.

Further, according to the method for manufacturing an electric module of the present embodiment, while transporting the first base material 1 in the predetermined direction P1, the position where the electrolytic solution coating step is performed and the sealing material coating step are performed in the predetermined direction P1. By setting the transport distance interval ds1 from the position to 50 cm or more, the sealing material 9 can be applied after the air bubbles or the like generated in the electrolytic solution 15 are removed, and for example, air bubbles or the like remain as in the conventional case. The electrolytic solution 15 in the present state is covered with the sealing material 9, and the bubbles are not completely removed from the electrolytic solution 15, and the bubbles remain in the semiconductor electrode 5 of the dye-sensitized solar cell after production, so that the dye-sensitized solar cell It is possible to prevent the quality from deteriorating.

Further, according to the method for manufacturing an electric module of the present embodiment, the first base material 1 is conveyed from a position where the encapsulant coating step is performed in the predetermined direction P1 while the first base material 1 is conveyed in the predetermined direction P1. By setting the transport distance to 100 cm or more, it is possible to more reliably secure the time for the electrolytic solution 15 to sufficiently permeate the semiconductor layer 10. Therefore, it is possible to manufacture a dye-sensitized solar cell in which the electrolytic solution 15 sufficiently permeates the semiconductor layer 10 and the semiconductor electrode 5 operates well.

Further, according to the method of manufacturing the electric module of the present embodiment, the electrolytic solution 15 is applied horizontally or below the horizontal toward the first base material 1 from the electrolytic solution coating device 32, so that the electrolytic solution 15 is applied more than the sealing material 9. The low-viscosity electrolytic solution 15 is applied in an appropriate amount without being excessively applied from the electrolytic solution coating device 32 due to the weight of the electrolytic solution 15, and the leakage of the electrolytic solution 15 can be reliably prevented.

Further, in the method for manufacturing the electric module of the present embodiment, if the height dimension h15 of the electrolytic solution 15 at the coating position of the sealing material 9 is lower than the height dimension h9 at the time of coating the sealing material, the sealing material It is possible to reliably prevent the electrolytic solution 15 from rubbing against the sealing material coating device 34 when the 9 is applied (see FIGS. 6 and 7).

According to the electric module manufacturing devices 30, 31A, and 31B of the present embodiment, the first base material 1 is conveyed before the sealing material 9 is applied to the first base material 1 by the sealing material coating device 34. Since the electrolytic solution 15 is applied to the semiconductor layer 10 by the electrolytic solution coating device 32 behind the direction (that is, on the upstream side), it takes time for the electrolytic solution 15 to soak into the semiconductor layer 10 by the time the electric module is manufactured. It can be secured for a long time. Therefore, the semiconductor layer 10 is sufficiently impregnated with the electrolytic solution 15 after manufacturing, and sufficiently high performance of the electric module can be easily obtained even immediately after manufacturing. Further, it is not necessary to forcibly extend the transport time and distance of the first base material 1 from the application of the electrolytic solution 15 to the completion of the dye-sensitized solar cell, and it is possible to suppress the increase in size of the apparatus.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the specific embodiments, and various aspects of the present invention are described within the scope of the claims. It can be transformed and changed.

1 ... 1st base material (base material), 6 ... 2nd base material (base material), 9 ... encapsulant, 10 ... semiconductor layer, 15 ... electrolytic solution, 30, 31A, 31B ... manufacturing equipment (electrical module) Manufacturing equipment), 32 ... Electrolyte coating equipment, 34 ... Encapsulant coating equipment, ds1 ... Transport distance interval, d2 ... Transport distance

Claims (8)

A semiconductor layer, an electrolytic solution, and a sealing material are provided between the two base materials, and the semiconductor layer and the electrolytic solution form the sealing material along the surface of one of the two base materials. It is a manufacturing method of the electric module provided between
A semiconductor layer forming step of forming the semiconductor layer on the surface,
An electrolytic solution coating step of applying the electrolytic solution on the semiconductor layer, and
Have a, a sealing material coating step of applying the sealing material on said surface after applying the electrolyte solution,
While transporting one of the base materials in a predetermined direction,
A method for manufacturing an electric module, characterized in that the transport distance interval between the position where the electrolytic solution coating step is performed and the position where the sealing material coating step is performed in the predetermined direction is 50 cm or more . While transporting one of the base materials in a predetermined direction,
The method for manufacturing an electric module according to claim 1, wherein the transport distance for transporting one of the base materials from the position where the encapsulant coating step is performed in the predetermined direction is 100 cm or more. In the electrolytic solution coating step
The method for manufacturing an electric module according to claim 1 or 2 , wherein the electrolytic solution is applied to the one base material from any direction in the range between the horizontal direction and the upward direction. The method for manufacturing an electric module according to any one of claims 1 to 3 , wherein the electric module is a dye-sensitized solar cell. A device for manufacturing an electric module for manufacturing the electric module according to any one of claims 1 to 4 .
An electrolytic solution coating device for applying the electrolytic solution to the one base material and a sealing material coating device for applying the sealing material to the one base material are provided.
The encapsulant coating device is arranged at a position where the encapsulant can be applied in the vicinity of the electrolytic solution applied by the electrolytic solution coating device .
One of the substrates is conveyed in a predetermined direction and
The electrolytic solution coating device and the sealing material coating device are arranged in this order from the upstream side to the downstream side along the predetermined direction.
Apparatus for producing electric modules conveying distance interval between the installation position of the installation position and the sealing material application device of the electrolyte coating apparatus in the predetermined direction, characterized in der Rukoto than 50 cm. One of the substrates is conveyed in a predetermined direction and
The electric module manufacturing apparatus according to claim 5 , wherein a transport distance of 100 cm or more is provided on the downstream side of the installation position of the encapsulant coating apparatus in the predetermined direction. The electric module manufacturing apparatus according to claim 5 or 6 , wherein the coating port of the electrolytic solution coating apparatus is located in a range from sideways to upward. The electric module manufacturing apparatus according to any one of claims 5 to 7 , wherein the electric module is a dye-sensitized solar cell.

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