JP6772732B2 - Electronic device manufacturing methods, electronic devices, electronic devices and mobiles - Google Patents

Description

The present invention relates to a method for manufacturing an electronic device, an electronic device, an electronic device, and a mobile body.

In recent years, electronic devices manufactured using silicon MEMS (Micro Electro Mechanical System) technology have been developed.

As an example of such an electronic device, for example, a semiconductor element, a base provided with the semiconductor element, a cap provided on the base, a glass frit for joining the base and the cap, and a glass frit for joining the base and the cap are connected to the semiconductor element. A microrelay having a wiring having a portion overlapping the cap in a plan view and a connection pad connected to the wiring and provided outside the cap is disclosed. Further, Patent Document 1 discloses that the glass frit forms an annular shape provided so as to surround the semiconductor element in a plan view, and the width of the glass frit is constant over the entire area.

Japanese Unexamined Patent Publication No. 2000-311961

Here, in the region where the cap overlaps the wiring in a plan view, the joint strength between the base and the cap tends to decrease due to the presence of the wiring. Therefore, in order to increase the bonding strength in the region where the cap overlaps the wiring, it is conceivable to increase the bonding area in this region. However, as in Patent Document 1, if the joint area of other regions is similarly increased in accordance with the region where the cap overlaps the wiring, there is a problem that the micro relay becomes large. Also, if the amount of glass frit applied to the area where the cap overlaps the wiring is larger than in other areas, the cap will tilt when joining the cap to the base, and as a result, there will be a portion where the joining strength is insufficient. There is a problem that it occurs.

An object of the present invention is a method for manufacturing an electronic device capable of easily and appropriately manufacturing an electronic device capable of miniaturization while maintaining the required bonding strength between the substrate and the lid, and a substrate and a lid. It is an object of the present invention to provide an electronic device capable of miniaturization while maintaining the required bonding strength with the body, and to provide an electronic device and a moving body provided with such an electronic device.

Such an object is achieved by the following invention.
The method for manufacturing an electronic device of the present invention is a plurality of wiring groups having a plurality of functional elements, a plurality of terminal groups having a plurality of terminals, and a plurality of wirings connecting the plurality of the functional elements and the plurality of the terminals. And the process of providing the first member
A second member is joined onto the first member via a joining material, and the first member and the functional element are surrounded by the joining material in a plan view from an overlapping direction, and at least one of the functional elements. The process of forming a structure having a plurality of accommodating portions for accommodating
In the plan view, the structure includes a step of cutting the structure into pieces between two adjacent housing portions.
In the step of forming the structure, the second member is arranged so that a plurality of the terminal groups are located outside the second member in the plan view.
The joining material overlaps with the wiring group in the plan view, and has a first portion located between the terminal group and the accommodating portion and an intermediate portion located between two adjacent accommodating portions. Have,
In the step of individualizing, in the plan view, the intermediate portion is cut along with the cutting of the structure to form a second portion having a width smaller than that of the first portion. ..

According to such a method for manufacturing an electronic device of the present invention, the width of the first portion of the bonding material can be formed to be relatively large, so that the region where the second member overlaps the wiring group in a plan view (with the accommodating portion). It is possible to reduce a decrease in the joint strength between the first member and the second member (between the terminal group). Further, since the second portion having a width smaller than that of the first portion can be formed by cutting the intermediate portion of the bonding material, the base obtained from the first member and the lid obtained from the second member can be formed. The joint area with and can be made smaller than before. From this, it is possible to manufacture an electronic device capable of miniaturization while maintaining the required bonding strength between the substrate obtained from the first member and the lid body obtained from the second member.

In the method for manufacturing an electronic device of the present invention, the width of the intermediate portion is preferably 0.9 to 1.1 times the width of the first portion in the plan view.

As a result, the work of providing the joint material can be easily performed, and the second portion having a width smaller than that of the first portion can be easily and appropriately formed.

In the method for manufacturing an electronic device of the present invention, in the step of forming the structure, the accommodating portion includes a first accommodating portion accommodating at least one said functional element and a second accommodating portion accommodating at least one said functional element. Has a housing and
The joining material has a third portion located between the first accommodating portion and the second accommodating portion in the plan view.
In the step of individualizing, the width of the second portion may be made smaller than the width of the third portion by cutting the intermediate portion in accordance with the cutting of the structure in the plan view. preferable.

As a result, it is possible to manufacture an electronic device in which the airtightness of the first accommodating portion and the second accommodating portion is sufficiently maintained.

In the method for manufacturing an electronic device of the present invention, in the step of forming the structure, it is preferable to apply the bonding material to at least one of the first member and the second member by screen printing.

Thereby, the bonding material can be applied more easily and quickly in a desired plan view shape. Further, it is possible to easily and appropriately form the first portion having a width of an appropriate size that can sufficiently secure the required joint strength.

In the method for manufacturing an electronic device of the present invention, the bonding material preferably contains low melting point glass.

Such a bonding material containing low melting point glass tends to be larger than the designed bonding area in the process of applying and bonding to the first member and the second member. However, according to the present invention described above. Even if such a bonding material is used, the bonding area can be easily reduced. Further, in such a joining material, even if the first member and the second member are made of different materials, it is possible to sufficiently secure the required joining strength between the first member and the second member.

The electronic device of the present invention includes a substrate and
The functional element provided on the substrate and
A lid provided on the substrate and forming an accommodating portion for accommodating the functional element together with the substrate.
A joining material that joins the substrate and the lid,
A group of terminals provided on the substrate and having a plurality of terminals located outside the lid in a plan view from the direction in which the functional element and the substrate overlap.
It has a wiring group provided on the substrate and having a plurality of wirings connecting the functional element and the plurality of terminals.
The joining material has a first portion located between the accommodating portion and the terminal group in the plan view, and a second portion different from the first portion.
In the plan view, the width of the first portion is larger than the width of the second portion.

According to such an electronic device of the present invention, since the width of the first portion of the bonding material is relatively large, the lid can be used as a substrate in a region where the lid overlaps the wiring group (between the accommodating portion and the terminal group) in a plan view. It is possible to reduce a decrease in joint strength with the lid. Further, since the bonding material has the second portion, the bonding area between the substrate and the lid can be made smaller than before. From such a thing, it is possible to realize an electronic device which can be miniaturized while maintaining the required bonding strength between the substrate and the lid.

In the electronic device of the present invention, the accommodating portion includes a first accommodating portion having at least one said functional element and a second accommodating portion having at least one said functional element.
The joining material has a third portion located between the first accommodating portion and the second accommodating portion in the plan view.
In the plan view, the width of the third portion is preferably larger than the width of the second portion.

As a result, since the width of the third portion is larger than the width of the second portion, the airtightness of the first accommodating portion and the second accommodating portion can be sufficiently maintained in an independent state.

In the electronic device of the present invention, the bonding material preferably contains low melting point glass.

As a result, even if the substrate and the lid are made of different materials, it is possible to sufficiently secure the required bonding strength between the substrate and the lid.

The electronic device of the present invention is characterized by having the electronic device of the present invention.
As a result, an electronic device that can be miniaturized while maintaining the required bonding strength between the substrate and the lid is provided, so that the degree of freedom in arranging the electronic device is high and a highly reliable electronic device can be obtained. Be done.

The mobile body of the present invention is characterized by having the electronic device of the present invention.
As a result, an electronic device that can be miniaturized while maintaining the required bonding strength between the substrate and the lid is provided, so that the degree of freedom in arranging the electronic device is high and a highly reliable moving body can be obtained. Be done.

It is a top view which shows the electronic device which concerns on 1st Embodiment of this invention. It is sectional drawing of the electronic device shown in FIG. It is sectional drawing of the electronic device shown in FIG. It is a top view which omitted the illustration of the lid body of the electronic device shown in FIG. It is a flowchart explaining the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the process of providing the wiring group and the terminal group in the 1st member shown in FIG. It is sectional drawing for demonstrating the process of providing the angular velocity sensor element in the 1st member shown in FIG. It is sectional drawing for demonstrating the process of providing the angular velocity sensor element in the 1st member shown in FIG. It is sectional drawing for demonstrating the process of forming the structure shown in FIG. It is sectional drawing for demonstrating the process of forming the structure shown in FIG. It is sectional drawing for demonstrating the process of forming the structure shown in FIG. It is a top view for demonstrating the process of forming the structure shown in FIG. It is sectional drawing for demonstrating the process of individualizing shown in FIG. It is a top view for demonstrating the process of individualizing shown in FIG. It is a top view which shows the electronic device which concerns on 2nd Embodiment of this invention. It is sectional drawing of the electronic device shown in FIG. It is a top view for demonstrating the acceleration sensor element shown in FIG. It is a top view for demonstrating the process of forming a structure in the manufacturing method of the electronic device shown in FIG. It is a top view for demonstrating the step of individualizing in the manufacturing method of the electronic device shown in FIG. It is a perspective view which shows the structure of the mobile type (or notebook type) personal computer which applied the electronic device of this invention. It is a perspective view which shows the structure of the mobile phone (including a smartphone, PHS, etc.) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. It is a perspective view which shows the automobile to which the moving body of this invention is applied.

Hereinafter, the method for manufacturing the electronic device of the present invention, the electronic device, the electronic device, and the mobile body will be described in detail based on the embodiments shown in the accompanying drawings.

1. 1. Electronic device and manufacturing method of electronic device <First embodiment>
FIG. 1 is a plan view showing an electronic device according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of the electronic device shown in FIG. FIG. 3 is a cross-sectional view of the electronic device shown in FIG. FIG. 4 is a plan view in which the lid of the electronic device shown in FIG. 1 is not shown. In the following description, the three axes orthogonal to each other will be referred to as an X-axis, a Y-axis, and a Z-axis. Further, the direction along the X-axis is also referred to as "X-axis direction", the direction along the Y-axis direction is also referred to as "Y-axis direction", and the direction along the Z-axis is also referred to as "Z-axis direction". In each drawing, for convenience of explanation, the dimensions of each part are exaggerated as necessary, and the dimensional ratio between the parts does not always match the actual dimensional ratio. Further, in the present specification, "equal to" two parts (regions) means that they are substantially equal, and that the difference between the two is approximately 10% or less.

[Electronic device]
The electronic device 1 shown in FIG. 1 is an angular velocity sensor capable of detecting an angular velocity in the X-axis direction.

As shown in FIGS. 2 and 3, the electronic device 1 is provided on the base 2 so as to cover the base 2, the angular velocity sensor element 4 as a functional element provided on the base 2, and the angular velocity sensor element 4. It has a lid 3 and a bonding material 7 for joining the substrate 2 and the lid 3. Further, as shown in FIGS. 1 and 4, the electronic device 1 has a wiring group L4 having a plurality of wirings L41, L42, L43, L44, and L45, and a plurality of terminals T41, T42, T43, T44, and T45. A terminal group T4 is provided.

Hereinafter, each part constituting the electronic device 1 will be described in detail in order.
(Hypokeimenon)
The substrate 2 has a function of supporting the angular velocity sensor element 4.

As shown in FIG. 1, the substrate 2 has a plate shape that forms a quadrangle (rectangle in the present embodiment) in a plan view (hereinafter, simply referred to as “plan view”) viewed from the direction in which the substrate 2 and the angular velocity sensor element 4 overlap. It is a member. Further, as shown in FIGS. 2 and 3, a recess 21 that opens upward is formed on the upper surface 22 (the surface on the lid 3 side) of the substrate 2. In the present embodiment, the plan view shape of the recess 21 is a quadrangle, but the shape is not limited to this.

Further, the upper surface 22 of the substrate 2 has grooves 221, 222, 223, 224, and 225 that are open upward (see FIG. 4). The grooves 221 to 225 are provided on the outside of the recess 21 and are formed along the outer periphery of the substrate 2. Further, the groove portions 221 to 225 have a shape corresponding to the wiring group L4 and the terminal group T4 in a plan view. Specifically, the groove portion 221 has a shape corresponding to the wiring L41 and the terminal T41, the groove portion 222 has a shape corresponding to the wiring L42 and the terminal T42, and the groove portion 223 has a shape corresponding to the wiring L43 and the terminal T43. The groove portion 224 has a shape corresponding to the wiring L44 and the terminal T44, and the groove portion 225 has a shape corresponding to the wiring L45 and the terminal T45.

The constituent material of such a substrate 2 is not particularly limited, but for example, various ceramic materials such as alumina, silica, titania, and zirconia, insulating materials such as glass, quartz, and crystal, and various resin materials may be used. Among these, it is preferable to use a glass material containing alkali metal ions (movable ions) (for example, borosilicate glass such as Pyrex glass (registered trademark)). By using the glass material, the substrate 2 having high shape accuracy can be manufactured more easily.

(Angular velocity sensor element)
The angular velocity sensor element 4 shown in FIG. 4 has two structures 40 (40a, 40b) arranged in the Y-axis direction and two fixed detection electrodes 49.

Each structure 40 includes a vibrating portion 41, a plurality of drive spring portions 42, a plurality of fixed portions 43, a plurality of movable drive electrodes 44, a plurality of fixed drive electrodes 45 and 46, and a detection flap plate 47. , And a plurality of beam portions 48. The vibrating portion 41, the drive spring portion 42, the fixing portion 43, the movable drive electrode 44, the detection flap plate 47, and the beam portion 48 are integrally formed.
The vibrating portion 41 has a quadrangular frame in a plan view.

Four fixing portions 43 are provided for one structure 40, and each fixing portion 43 is fixed to the upper surface 22 of the above-mentioned substrate 2. Further, each fixing portion 43 is arranged outside the vibrating portion 41 in a plan view, and is provided at a position corresponding to each corner portion of the vibrating portion 41 in the present embodiment. In the figure, the fixing portion 43 located on the −Y axis side of the structure 40a and the fixing portion 43 located on the + Y axis side of the structure 40b are common fixing portions.

Four drive spring portions 42 are provided for one structure 40, and each drive spring portion 42 is provided corresponding to each corner portion of the vibrating portion 41, and each corner portion of the corresponding vibrating portion 41 is provided. And the fixed portion 43 are connected. Further, the drive spring portion 42 connects the vibrating portion 41 to the fixed portion 43 so as to be displaceable, and in the present embodiment, the vibrating portion 41 is configured to be displaceable in the Y-axis direction.

Four movable drive electrodes 44 are provided for one structure 40, and each movable drive electrode 44 is connected to a vibrating portion 41. Specifically, the two movable drive electrodes 44 are located on the + X side of the vibrating portion 41, and the remaining two movable drive electrodes 44 are located on the −X side of the vibrating portion 41. Further, each movable drive electrode 44 has a comb-tooth shape.

Four fixed drive electrodes 45 and 46 are provided for each structure 40, and each of the fixed drive electrodes 45 and 46 is fixed to the upper surface 22 of the substrate 2 described above. Further, each of the fixed drive electrodes 45 and 46 has a comb-like shape corresponding to the movable drive electrode 44, and is provided with the movable drive electrode 44 interposed therebetween.

The detection flap plate (displacement plate for detection) 47 is a plate-shaped member having a rectangular shape in a plan view, is arranged inside the vibrating portion 41, and is connected to the vibrating portion 41 by a beam portion 48. The detection flap plate 47 can rotate (displace) around the rotation shaft J4.

Further, the fixed detection electrode 49 is provided on the bottom surface of the recess 21 of the substrate 2 (see FIGS. 2 and 3). The fixed detection electrode 49 has a rectangular shape in a plan view and faces the detection flap plate 47. Further, the fixed detection electrode 49 is separated from the detection flap plate 47.

Further, the above-mentioned drive spring portion 42, fixed portion 43, movable drive electrode 44, one end portion of the fixed drive electrode 45, one end portion of the fixed drive electrode 46, the detection flap plate 47 and the beam portion 48 are recesses 21 of the base 2. It is provided above the base 2 and is separated from the base 2.

Such a structure 40 is collectively formed by, for example, patterning a conductive silicon substrate doped with impurities such as phosphorus and boron by etching.

Further, as the constituent material of the fixed detection electrode 49, for example, aluminum, gold, platinum, ITO (Indium Tin Oxide), ZnO (zinc oxide) and the like can be used.

(Wiring group and terminal group)
As shown in FIG. 4, the wiring group L4 and the terminal group T4 are provided on the substrate 2.

Specifically, the wiring L41 and the terminal T41 are provided in the groove portion 221 of the base 2 described above, the wiring L42 and the terminal T42 are provided in the groove portion 222, and the wiring L43 and the terminal T43 are provided in the groove portion 223 for wiring. The L44 and the terminal T44 are provided in the groove portion 224, and the wiring L45 and the terminal T45 are provided in the groove portion 225.

The wiring L41 is electrically connected to the fixing portion 43 of the above-mentioned angular velocity sensor element 4 via the conductive bump B41. The wiring L42 is electrically connected to the fixed drive electrode 45 via a plurality of conductive bumps B42. The wiring L43 is electrically connected to the fixed drive electrode 46 via a plurality of conductive bumps B43. The wiring L44 is electrically connected to the fixed detection electrode 49 of the structure 40a, and the wiring L45 is electrically connected to the fixed detection electrode 49 of the structure 40b. Further, one end of the wiring L41 is connected to the terminal T41, one end of the wiring L42 is connected to the terminal T42, one end of the wiring L43 is connected to the terminal T43, and one end of the wiring L44 is connected to the terminal T44. One end of the wiring L45 is connected to the terminal T45.

The wiring group L4 having such wirings L41 to L45 is provided on the outside of the recess 21 and is provided along the outer periphery of the substrate 2. Further, the terminal group T4 having the terminals T41 to T45 is arranged on the outer peripheral portion of the upper surface 22 of the substrate 2, and in the present embodiment, it is arranged on one short side side (lower side in FIG. 4) of the upper surface 22. Has been done. Further, the terminals T41 to T45 are provided side by side in a row along the X-axis direction. As a result, the length of the substrate 2 in the Y-axis direction can be suppressed, so that the electronic device 1 can be miniaturized. Further, since the plurality of terminals T41 to T45 are gathered on one side of the upper surface 22 of the substrate 2, for example, it is possible to facilitate connection with an IC chip or the like (not shown).

Further, the constituent materials of the wirings L41 to L45, the terminals T41 to T45 and the conductive bumps B41 to B43 are not particularly limited as long as they have conductivity, and for example, ITO, IZO (Indium Zinc Oxide), and the like. Oxides (transparent electrode materials) such as In ₃ O ₃ , SnO ₂ , Sb-containing SnO ₂ , Al-containing ZnO, Au, Pt, Ag, Cu, Al, etc. or alloys containing these can be mentioned. One type or a combination of two or more types can be used.

(Lid)
The lid 3 has a function of protecting the above-mentioned angular velocity sensor element 4.
As shown in FIG. 1, the lid 3 is a plate-shaped member forming a quadrangle (rectangle in the present embodiment) in a plan view. Further, as shown in FIGS. 2 and 3, a recess 31 is provided on the lower surface (the surface on the substrate 2 side) thereof. The portion (joining surface 32) outside the recess 31 on the lower surface of the lid 3 is joined to the upper surface 22 of the substrate 2 described above via the joining material 7. As a result, the recess 31 and the recess 21 form an accommodating portion S for accommodating the angular velocity sensor element 4. This accommodating portion S is an airtight space, and in the present embodiment, it is in a decompressed state (for example, about 5 × 10 ^{-2 to} 5 × 10 ^-4 Pa). When the accommodating portion S is in the decompressed state, the detection accuracy of the angular velocity can be improved. Further, the accommodating portion S is formed of recesses 21 and 31 forming a quadrangle (rectangle in the present embodiment) in a plan view, thereby forming a quadrangle (rectangle in the present embodiment).

Further, a through hole 34 communicating with the inside and outside of the recess 31 is formed in the upper part of the lid 3. The through hole 34 is filled with a sealing member 35 made of various metal materials or the like. For example, after evacuation or introduction of the inert gas through the through hole 34, the through hole 34 is sealed with the sealing member 35, so that the accommodating portion S is in a depressurized state as described above. Can be done.

Further, as shown in FIG. 1, the outer shape of the lid 3 is configured such that the length along the X-axis direction in the plan view is equal to that of the base 2, and the length along the Y-axis direction is shorter than that of the base 2. There is. The lid 3 is arranged so that three of its outer edges, excluding the lower side in FIG. 1, coincide with the outer edge of the substrate 2 in a plan view. As a result, by arranging the terminal group T4 described above in the region on the upper surface of the substrate 2 where the lid 3 is not provided, the terminal group T4 can be exposed to the outside of the lid 3.

Further, the portion outside the recess 31 on the lower surface of the lid 3, that is, the joint surface 32 which is the surface bonded to the substrate 2, has a quadrangular (rectangular in this embodiment) frame shape in a plan view. (See FIGS. 1, 2 and 3). Specifically, as shown in FIG. 1, the joint surface 32 has a pair of joint portions 321 and 322 extending along the X-axis direction and ends of the pair of joint portions 321 and 322. It is composed of a pair of joint portions 323 and 324 that are connected and extend along the Y-axis direction. In the present embodiment, the width of the joint portion 321 (joint portion on the terminal group T4 side) is configured to be larger than the width of each of the joint portions 322, 323, 324 (other joint portions). The widths of the joint portions 322, 323, and 324 are equally configured.

Here, of the pair of joint portions 321 and 322, the joint portion 321 located on the terminal group T4 side constitutes the "first joint portion", and the other joint portion 322 is smaller in width than the first joint portion. It constitutes the "second joint portion". Further, the joint portions 323 and 324 also form a "second joint portion" having a width smaller than that of the first joint portion, similarly to the joint portion 322.

A silicon material can be preferably used as the constituent material of such a lid 3. However, the constituent material of the lid 3 is not limited to the silicon material, and for example, a glass material, a ceramic material, or the like can be used.

(Joint material)
As shown in FIGS. 2 and 3, the joining material 7 is arranged between the upper surface 22 of the substrate 2 and the joining surface 32 of the lid 3 and joins them. Further, in the present embodiment, the joining material 7 is provided over the entire area of the joining surface 32, and its plan view shape is the same as that of the joining surface 32. Therefore, the joining material 7 is provided so as to surround the accommodating portion S in a plan view, and has a quadrangular frame shape in the drawing.

Specifically, as shown in FIGS. 1 and 4, the joining material 7 has a pair of portions 71 and 72 extending along the X-axis direction and end portions of the pair of portions 71 and 72. It is composed of a pair of portions 73 and 74 extending along the Y-axis direction. In the present embodiment, the width W1 of the portion 71 (the portion on the terminal group T4 side) is configured to be larger than the width W2 of the portions 72, 73, 74 (other portions). Further, the widths W2 of the portions 72, 73, and 74 are equal.

Here, of the pair of portions 71 and 72, the portion 71 located on the terminal group T4 side constitutes the "first portion", and the other portion 72 is the "second portion" having a width smaller than that of the first portion. Consists of. Further, the portions 73 and 74, like the portion 72, also constitute a "second portion" having a width smaller than that of the first portion.

Further, grooves 221 to 225 are provided in the region where the lid 3 overlaps the wiring group L4 in the plan view of the substrate 2 (see FIG. 2). Therefore, in the absence of the joining material 7, the inside and outside of the accommodating portion S communicate with each other through the grooves 221 to 225, but since the joining material 7 is arranged between the base 2 and the lid 3, this Grooves 221 to 225 can be filled with the bonding material 7.
Further, the bonding material 7 is provided with substantially the same thickness over the entire area.

The constituent material of such a bonding material 7 is not particularly limited as long as the substrate 2 and the lid 3 can be bonded, but for example, various resin materials such as epoxy resin, phenol resin, silicone resin, and acrylic resin. , Various glass materials of low melting point glass (for example, borate glass, etc.), Pt (platinum), Ag (silver), Pd (lead), Au (gold), etc., or alloys containing these, and the like, and one of them Species or a combination of two or more can be used. Among these, the bonding material 7 preferably contains low melting point glass. As a result, even if the substrate 2 and the lid 3 are made of different materials, the required bonding strength between the substrate 2 and the lid 3 can be ensured. For example, when the substrate 2 is made of a glass material and the lid 3 is made of a silicon material, the bonding strength thereof can be particularly increased.

Further, as a specific example of the bonding material 7 containing such a constituent material, for example, an adhesive containing various resin materials such as glass frit, glass paste, glass seal, solder paste, conductive paste, and epoxy resin is used. be able to.

As described above, the electronic device 1 which is an example of the electronic device of the present invention as described above includes the base 2, the angular velocity sensor element 4 as a "functional element" provided on the base 2, and the base 2. The lid 3 is provided on the base 2 to form an accommodating portion S for accommodating the angular velocity sensor element 4 together with the base 2, and the bonding material 7 for joining the base 2 and the lid 3 is provided on the base 2. In a plan view from the direction in which the angular velocity sensor element 4 and the substrate 2 overlap, the terminal group T4 having a plurality of terminals T41 to T45 located outside the lid 3 and the terminal group T4 provided on the substrate 2 are provided with an angular velocity. It has a wiring group L4 having a plurality of wirings L41 to L45 connecting the sensor element 4 and the plurality of terminals T41 to T45. Further, in the plan view, the joining material 7 has a portion 71 as a "first portion" located between the accommodating portion S and the terminal group T4, and a portion 72 as a "second portion" different from the portion 71. It has 73 and 74. Then, in a plan view, the width W1 of the portion 71 (first portion) is larger than the width W2 of the portions 72, 73, 74 (second portion). According to such an electronic device 1, since the width W1 of the portion 71 is relatively large, the lid 2 and the substrate 2 in the region where the lid 3 overlaps the wiring group L4 (between the accommodating portion S and the terminal group T4) in a plan view. It is possible to reduce a decrease in the bonding strength with the lid 3. Further, since the bonding material 7 has the portions 72, 73, 74, the bonding area between the substrate 2 and the lid 3 can be made smaller than before. Therefore, it is possible to realize the electronic device 1 that can be miniaturized while maintaining the required bonding strength between the substrate 2 and the lid 3.

In particular, as in the present embodiment, since all the portions 72, 73, and 74 other than the portion 71 of the bonding material 7 each constitute the "second portion", it is particularly effective to increase the size of the electronic device 1. Can be reduced to. In the present embodiment, all of the portions 72, 73, and 74 constitute the "second portion", but only one of these may constitute the "second portion".

Further, the width W1 and the width W2 preferably satisfy, for example, the relationship of 0.2 ≦ W2 / W1 ≦ 0.6, and satisfy the relationship of 0.25 ≦ W2 / W1 ≦ 0.55. It is more preferable, and it is further preferable to satisfy the relationship of 0.3 ≦ W2 / W1 ≦ 0.5. As a result, the effect of reducing the size can be more remarkable while maintaining the required bonding strength between the substrate 2 and the lid 3.

The configuration of the electronic device 1 has been described above. The electronic device 1 having such a configuration can detect the angular velocity ωx as follows.

First, a drive voltage is applied between the movable drive electrode 44 and the fixed drive electrodes 45 and 46 of the angular velocity sensor element 4, and the two vibrating portions 41 are vibrated in opposite phases in the Y-axis direction. When the angular velocity ωx is applied to the electronic device 1 in this state, a Coriolis force acts and the two detection flap plates 47 are displaced around the rotation axis J4 in opposite phases. When the detection flap plate 47 is displaced, the gap between the detection flap plate 47 and the fixed detection electrode 49 changes, and the capacitance between them changes accordingly. Thereby, the angular velocity ωx can be detected based on the amount of change in the capacitance.

[Manufacturing method of electronic devices]
Next, a method for manufacturing the electronic device of the present invention will be described. In the following, an example of manufacturing the above-mentioned electronic device 1 will be described.

FIG. 5 is a flowchart illustrating a method of manufacturing the electronic device shown in FIG. FIG. 6 is a cross-sectional view for explaining a process of providing a wiring group and a terminal group on the first member shown in FIG. 7 and 8 are cross-sectional views for explaining a step of providing an angular velocity sensor element on the first member shown in FIG. 5, respectively. 9, 10 and 11 are cross-sectional views for explaining the process of forming the structure shown in FIG. 5, respectively. FIG. 12 is a plan view for explaining a process of forming the structure shown in FIG. FIG. 13 is a cross-sectional view for explaining the step of individualizing shown in FIG. FIG. 14 is a plan view for explaining the step of individualizing shown in FIG. In addition, in FIG. 12 and FIG. 14, the through hole 34 and the sealing member 35 are not shown.

As shown in FIG. 5, the manufacturing method of the electronic device 1 includes [1] a step of providing the wiring group L4 and the terminal group T4 on the first member 20 (step S11), and [2] an angular velocity sensor element on the first member 20. It has a step of providing 4 (step S12), a step of [3] forming the structure 10a (step S13), and a step of [4] fragmenting the structure (step S14). Hereinafter, each step will be described in sequence.

In the following, the first member 20 to be the plurality of substrates 2 is made of a glass material containing alkali metal ions, the substrate 4a to be the plurality of angular velocity sensor elements 4 is made of a silicon material, and the plurality of lids 3 The case where the second member 30 is made of a silicon material will be described as an example. Further, in the following, a plurality of electronic devices 1 are formed.

[1] A step of providing the wiring group L4 and the terminal group T4 on the first member 20 (step S11).
First, a first member 20 having a plurality of recesses 21 and a plurality of groove portions 221 to 225 is prepared, and a wiring group L4 having a plurality of wirings L41 to L45 and a plurality of terminals T41 to T45 are placed on the first member 20. The terminal group T4 to be provided is provided (see FIG. 6).

The wirings L41 to L45 and the terminals T41 to T45 are formed in the corresponding grooves 221 to 225, respectively.

The method for forming the wirings L41 to L45 and the terminals T41 to T45 (deposition method) is not particularly limited, but for example, the above-mentioned material is deposited by using a vapor deposition method such as a sputtering method or a vapor deposition method. The formed films can be collectively formed by patterning by photolithography and etching.

[2] Step of providing the angular velocity sensor element 4 on the first member 20 (step S12)
Next, a plurality of angular velocity sensor elements 4 are provided on the first member 20 (see FIGS. 7 and 8).

Specifically, first, a substrate 4a is prepared, and the substrate 4a is joined onto the first member 20 by, for example, an anode joining method (see FIG. 7). Next, the substrate 4a is thinned by polishing, for example, and then the thinned substrate 4a is patterned by photolithography and etching to form a plurality of angular velocity sensor elements 4 (see FIG. 8). A dry etching method is particularly used for etching the substrate 4a. Further, as a high-precision dry etching process, it is preferable to use a Bosch method in which etching and deposition (protective film deposition) are alternately repeated.
The thinning of the substrate 4a may be omitted as appropriate.

[3] Step of forming structure 10a (step S13)
Next, the second member 30 is joined onto the first member 20 via the joining member 70 to form a structure 10a having a plurality of accommodating portions S (see FIGS. 9 to 12).

Specifically, first, for example, a second member 30 in which a plurality of recesses 31 and a plurality of through holes 34 are formed by performing anisotropic etching on a silicon wafer is prepared. Next, the bonding material 70 is applied to the surface of the second member 30 where the recess 31 is formed (specifically, the portion of the surface excluding the recess 31). Next, as shown in FIG. 9, the second member 30 is arranged on the first member 20 so that the joining member 70 is located between the first member 20 and the second member 30. At this time, the second member 30 is arranged so that one angular velocity sensor element 4 is located with respect to one recess 31. Next, as shown in FIG. 10, the first member 20 and the second member 30 are joined. Next, after evacuation and introduction of the inert gas through the through hole 34, the through hole 34 is sealed with the sealing member 35 as shown in FIG. As a result, a structure 10a having a plurality of accommodating portions S provided apart from each other can be obtained (see FIGS. 11 and 12).

As shown in FIG. 12, the structure 10a has four regions C partitioned by lines 850 and 860 indicated by the alternate long and short dash line. The region C is a region that becomes the electronic device 1 in a later process. In this embodiment, the plurality of regions C and the accommodating portions S are provided in a matrix in a plan view.

As a method of applying the bonding material 70, for example, a screen printing method can be preferably used. However, the method of applying the bonding material 70 is not limited to the screen printing method, and various methods such as a spray coating method and an inkjet method can be used.

As the constituent material of the joining material 70, for example, a material including the materials listed in the above-mentioned constituent materials of the joining material 7 can be used. In this embodiment, for example, a bonding material 70 containing boric acid glass (B ₂ O ₃ ) as a main component is used, and by heating and pressurizing the bonding material 70 after applying the bonding material 70, the first member 20 and the first member 20 are used. It is joined to the second member 30 (see FIGS. 9 and 10). The bonding material 70 in the state before bonding may be in a liquid state or a solid state.

Further, as shown in FIG. 12, in this step, the joining material 70 is provided so as to surround the accommodating portion S in a plan view. The joining member 70 overlaps the wiring group L4 in a plan view, and has a plurality of portions 71 located between the terminal group T4 and the accommodating portion S and an intermediate portion 721 located between two adjacent accommodating portions S. And a plurality of boundary portions 722 located at the boundary portion of the adjacent region C.

Further, the bonding material 70 is applied so that the widths of the applied bonding materials 70 are equal over the entire area. Therefore, the width W1 of the portion 71, the width W21 of the intermediate portion 721, and the width W22 of the boundary portion 722 are equal.

Further, the sealing by the sealing member 35 of the through hole 34 is performed by arranging a solder ball such as AuGe in the through hole 34 and then melting the solder ball using a processing laser such as a YAG laser or a CO ₂ laser. Will be done.

[4] Step of individualizing (step S14)
Next, the structure 10a is separated into individual pieces by cutting between two adjacent housing portions S in a plan view (see FIGS. 13 and 14).

The structure 10a is cut using, for example, a dicing blade 80. In the present embodiment, the structure 10a is divided into regions C by cutting at the planned cutting portions 85 and 86 shown by hatching in FIG. The planned cutting portion 85 is a portion that overlaps the intermediate portion 721 in a plan view, and the planned cutting portion 86 is a portion that overlaps the boundary portion 722 in a plan view.

By cutting the intermediate portion 721 with the cutting of the structure 10a, the portions 73 and 74 are formed. Further, the boundary portion 722 is cut to form the portion 72. Here, in the present embodiment, as described above, since the width W1, the width W21, and the width W22 are equal to each other, the width is smaller than the width W1 of the portion 71 by cutting the intermediate portion 721 and the boundary portion 722. The portions 72, 73, 74 having W2 can be easily formed. Further, by cutting the first member 20, a plurality of substrates 2 are formed, and by cutting the second member 30, a plurality of lids 3 are formed.
As described above, a plurality of electronic devices 1 as shown in FIG. 1 can be obtained at once.

As described above, the manufacturing method of the electronic device 1 which is an example of the manufacturing method of the electronic device of the present invention as described above is the step (step) of providing the wiring group L4 and the terminal group T4 on the first member 20. S11), [2] a step of providing the angular velocity sensor element 4 on the first member 20 (step S12), [3] a step of forming the structure 10a (step S13), and [4] a step of separating the pieces (4). Step S14) and. In other words, a plurality of angular velocity sensor elements 4 as a plurality of "functional elements", a plurality of terminal groups T4 having a plurality of terminals T41 to T45, and a plurality of connecting the plurality of angular velocity sensor elements 4 and the plurality of terminals T41 to T45. The step of providing the first member 20 with a plurality of wiring groups L4 having the wirings L41 to L45 of the above, and joining the second member 30 on the first member 20 via the joining member 70, and the angular velocity with the first member 20. A step of forming a structure 10a surrounded by a bonding material 70 in a plan view from a direction in which the sensor element 4 overlaps and having a plurality of accommodating portions S accommodating at least one angular velocity sensor element 4, and adjacent in a plan view. It has a step of cutting the structure 10a between the two fitting portions S and separating them into individual pieces. Further, in the step of forming the structure 10a, the second member 30 is arranged so that a plurality of terminal groups T4 are located outside the second member 30 in a plan view, and the joining member 70 is arranged in a plan view. It has a portion 71 as a first portion that overlaps with the wiring group L4 and is located between the terminal group T4 and the accommodating portion S, and an intermediate portion 721 that is located between two adjacent accommodating portions S. There is. Further, in the step of individualizing, in a plan view, the intermediate portion 721 is cut along with the cutting of the structure 10a, so that the portion 73 as a second portion having a width smaller than that of the portion 71 (first portion), Form 74. Further, in the present embodiment, the boundary portion 722 is cut to form the portion 72 as the second portion.

According to such a manufacturing method of the electronic device 1, the width W1 of the portion 71 can be formed to be relatively large, so that the region where the second member 30 overlaps the wiring group L4 in a plan view (accommodation portion S and terminal group). It is possible to reduce a decrease in the joint strength between the first member 20 and the second member 30 (between T4). Therefore, it is possible to manufacture the electronic device 1 in which the decrease in the bonding strength between the substrate 2 and the lid 3 is reduced. Further, by cutting the intermediate portion 721 of the bonding material 70, the portions 73 and 74 having a width W2 smaller than the width W1 of the portion 71 can be formed, so that the bonding area between the substrate 2 and the lid 3 can be increased. An electronic device 1 smaller than the conventional one can be manufactured. Therefore, it is possible to manufacture the electronic device 1 that can be miniaturized while maintaining the required bonding strength between the substrate 2 and the lid 3. Further, since the first member 20 and the second member 30 are cut together with the joining member 70, chipping is less likely to occur as compared with the case where the first member 20 and the second member 30 are cut without the joining member 70, which is preferable. ..

Further, it is preferable that the width W1 of the portion 71 and each width W2 of the portions 72, 73, 74 satisfy the numerical range as described above, and when it is desired to make the width W2 smaller, for example, the width W80 is used. It is preferable to use a relatively large dicing blade 80. Thereby, the portions 72, 73, 74 having a relatively small width W2 can be easily formed. As described above, it is preferable to set the width W80 of the dicing blade 80 according to the size of the width W2 (ratio to the width W1) (see FIG. 13).

For example, the width W1 of the portion 71 is set to 200 um, and the width W80 of the dicing blade 80 is set to 40 um. As a result, each width W2 of the portions 72, 73, and 74 was 80 um, and W2 / W1 = 0.4. The present invention can be realized by using a dicing blade having a width W80 smaller than the width W1 of the portion 71 in this way.

In the present embodiment, one angular velocity sensor element 4 is provided in one accommodating portion S, but a plurality of functional elements may be provided in the accommodating portion S.

Further, in the present embodiment, as described above, the joining material 70 is provided so that the width W21 of the intermediate portion 721 is equal to the width W1 of the portion 71. Here, in the present specification, the fact that the width W21 of the intermediate portion 721 and the width W1 of the portion 71 are "equal" means that they are substantially equal, that is, the difference between the two satisfies a range of 10% or less. Means that. In other words, in a plan view, the width W21 of the intermediate portion 721 is 0.9 to 1.1 times the width W1 of the portion 71 as the "first portion". As a result, the work of providing the bonding material 70 can be easily performed. Further, by making the widths W21 and the width W1 on which the joining member 70 is provided substantially equal to each other, when the first member 20 and the second member 30 are joined, the inclination due to the variation of the joining member 70 is reduced. be able to. Further, the portions 72, 73, 74 having a width W2 smaller than the width W1 of the portion 71 can be easily and appropriately formed.

Further, the width W21 of the intermediate portion 721 is more preferably 0.92 to 1.08 times the width W1 of the portion 71, and further preferably 0.95 to 1.05 times. As a result, the above-mentioned effect can be remarkably exhibited.

Further, as described above, in the step of forming the structure 10a, it is preferable to apply the bonding material 70 to at least one of the first member 20 and the second member 30 by screen printing. In this embodiment, the bonding material 70 is applied to the second member 30 as described above. By using screen printing, the bonding material 70 can be applied more easily and quickly in a desired plan view shape. Further, the portion 71 having a width W1 having an appropriate size that can sufficiently secure the required joint strength can be easily and appropriately formed.

Further, as described above, the bonding material 70 preferably contains low melting point glass. Examples of the low melting point glass include boric acid type, silicic acid type, phosphoric acid type, arsenic acid type, germanium type, vanadate type, telluride type and the like. The melting point of the low melting point glass is preferably 700 ° C. or lower, more preferably 500 ° C. or lower. In this embodiment, in particular, as the low melting point glass, a bonding material 70 containing boric acid glass (B ₂ O ₃ ) as a main component is preferably used. The bonding material 70 containing such a low melting point glass tends to be larger than the designed bonding area in the process of applying and bonding to the first member 20 or the second member 30, but the above-mentioned manufacturing of the electronic device 1 According to the method, the bonding area can be easily reduced even by using such a bonding material 70. Further, in the bonding material 70 including the low melting point glass, even if the first member 20 and the second member 30 are made of different materials, the required bonding strength between the first member 20 and the second member 30 is sufficiently sufficient. It is preferable because it can be secured.

For example, the substrate 2 and the lid 3 were bonded using a boric acid glass paste printed from a screen printing mask having a uniform opening of 140 um as a bonding material. At this time, since a load of about 100 kPa was applied to the lid 3 in the joining, the width W1 of the portion 71 became 200 um. By applying a load to the bonding material 70 formed by screen printing in this way and pressing the bonding material 70, the width W1 of the portion 71 is enlarged from that at the time of printing, and the airtightness can be kept good. Further, chipping can be suppressed when dicing each width W2 of the portions 72, 73, and 74 with a dicing blade.

<Second Embodiment>
Next, the second embodiment of the present invention will be described.
FIG. 15 is a plan view showing an electronic device according to a second embodiment of the present invention. FIG. 16 is a cross-sectional view of the electronic device shown in FIG. FIG. 17 is a plan view for explaining the acceleration sensor element shown in FIG. FIG. 18 is a plan view for explaining a process of forming a structure in the method of manufacturing an electronic device shown in FIG. FIG. 19 is a plan view for explaining a step of individualizing in the method of manufacturing the electronic device shown in FIG. In addition, in FIGS. 17 and 18, the through hole 34 and the sealing member 35 are not shown.

In the following description, the present embodiment will be mainly described with respect to the differences from the first embodiment described above, and the description of the same matters will be omitted. Further, in FIGS. 15 to 19, the same reference numerals are given to the same configurations as those in the above-described embodiment.

[Electronic device]
The electronic device 1A shown in FIG. 15 is a composite sensor having an angular velocity sensor element 4 and an acceleration sensor element 5 as functional elements and capable of detecting an angular velocity around the X-axis and acceleration in the X-axis direction.

As shown in FIG. 16, the electronic device 1A includes a base 2A, a lid 3A, an acceleration sensor element 5, and a bonding material 7A. Further, as shown in FIGS. 15 and 17, the electronic device 1A includes a wiring group L5 having a plurality of wirings L51, L52, and L53, and a terminal group T5 having a plurality of terminals T51, T52, and T53.

(Hypokeimenon)
The base 2A has a recess 23 and grooves 241, 242, 243. The grooves 241 to 243 are provided on the outside of the recess 23, respectively. Further, the groove portions 241 to 243 have a shape corresponding to the wiring group L5 and the terminal group T5 in a plan view.

(Accelerometer element)
As shown in FIG. 17, the acceleration sensor element 5 includes support portions 51 and 52, movable portions 53, connecting portions 54 and 55, a plurality of first fixed electrode portions 58, and a plurality of second fixed electrode portions 59. And have. The support portions 51 and 52, the movable portion 53 and the connecting portions 54 and 55 are integrally formed.

The support portions 51 and 52 are fixed to the upper surface 22A of the above-mentioned substrate 2A, and are arranged so as to face each other in the Y-axis direction via the recess 23.

The movable portion 53 is located between the support portions 51 and 52 in a plan view. The movable portion 53 is connected to the support portion 51 via the connecting portion 54 on the −Y axis side, and is connected to the support portion 52 via the connecting portion 55 on the + Y axis side. As a result, the movable portion 53 can be displaced in the Y-axis direction with respect to the support portions 51 and 52 while elastically deforming the connecting portions 54 and 55. Further, the movable portion 53 has a base portion 531 extending in the Y-axis direction, and a plurality of movable electrode portions 532 projecting from the base portion 531 in the X-axis direction and arranged in the Y-axis direction. The plurality of movable electrode portions 532 are separated from each other.

Further, the plurality of first fixed electrode portions 58 and the plurality of second fixed electrode portions 59 each extend in the X-axis direction and are provided corresponding to the movable electrode portion 532. The plurality of first fixed electrode portions 58 are arranged on one side of the movable electrode portion 532 in the Y-axis direction, and are provided at intervals with respect to the corresponding movable electrode portions 532. On the other hand, the plurality of second fixed electrode portions 59 are arranged on the other side of the movable electrode portion 532 in the Y-axis direction, and are provided at intervals with respect to the corresponding movable electrode portions 532.

Further, the movable portion 53, the connecting portions 54, 55, one end portion of the first fixed electrode portion 58, and one end portion of the second fixed electrode portion 59 having the above-described configuration are provided above the recess 23 of the base 2A. It is separated from the base 2A.

As the constituent material of the acceleration sensor element 5, the same material as that of the above-mentioned angular velocity sensor element 4 can be used.

(Wiring group and terminal group)
As shown in FIG. 17, the wiring group L5 and the terminal group T5 are provided on the substrate 2A.
Specifically, the wiring L51 and the terminal T51 are provided in the groove portion 241 described above, the wiring L52 and the terminal T52 are provided in the groove portion 242, and the wiring L53 and the terminal T53 are provided in the groove portion 243.

Further, the wiring L51 is electrically connected to the support portion 51 of the acceleration sensor element 5 described above via the conductive bump B51. The wiring L52 is electrically connected to each of the first fixed electrode portions 58 via a plurality of conductive bumps B52. The wiring L53 is electrically connected to each of the second fixed electrode portions 59 via a plurality of conductive bumps B53. Further, one end of the wiring L51 is connected to the terminal T51, one end of the wiring L52 is connected to the terminal T52, and one end of the wiring L53 is connected to the terminal T53.

As the constituent materials of the wirings L51 to L53, the terminals T51 to T53, and the conductive bumps B51, B52, and B53, the same materials as those of the wirings L41 to L45 described above can be used, respectively.

Further, the wiring group L5 is provided on the outside of the recess 23. Further, the terminal group T5 is provided on the outer peripheral portion of the substrate 2A and is located outside the lid 3A in a plan view. In the present embodiment, as shown in FIG. 15, the terminal group T4 and the terminal group T5 are located on the −Y axis side of the upper surface 22A of the substrate 2A, and are provided side by side in a row along the X-axis direction.

(Lid)
The lid 3A has a recess 31 corresponding to the recess 21 and a recess 33 corresponding to the recess 23. The recess 21 and the recess 31 form the first accommodating portion S1, and the recess 23 and the recess 33 form the second accommodating portion S2. Here, in the present embodiment, the accommodating portion S10 is composed of the first accommodating portion S1 and the second accommodating portion S2.

Further, the first accommodating portion S1 and the second accommodating portion S2 are independent of each other, and the angular velocity sensor element 4 is accommodated in the first accommodating portion S1 and the acceleration sensor element 5 is accommodated in the second accommodating portion S2. .. Further, the second accommodating portion S2 is formed of recesses 23 and 33 that form a quadrangle (rectangle in the present embodiment) in a plan view, so that the second accommodating portion S2 forms a quadrangle (rectangle in the present embodiment) in a plan view. The same applies to the first accommodating portion S1. In the present embodiment, the first accommodating portion S1 and the second accommodating portion S2 are provided side by side in the X-axis direction with their longitudinal directions along the Y-axis direction.

Here, it is preferable that the second accommodating portion S2 is filled with an inert gas such as nitrogen, helium, or argon, and has an operating temperature (about −40 ° C. to 80 ° C.) of approximately atmospheric pressure. By setting the second accommodating portion S2 to atmospheric pressure, the viscous resistance is increased and the damping effect is exhibited, and the vibration of the movable portion 53 can be quickly converged (stopped). Therefore, the acceleration detection accuracy is improved.

Further, the lid 3A is formed with a through hole 34 that communicates the inside and outside of the recess 33. The through hole 34 is filled with a sealing member 35 made of various metal materials or the like.

Further, as shown in FIG. 15, the joint surface 32A of the lid 3A has a frame shape in a plan view, is located between the first accommodating portion S1 and the second accommodating portion S2, and is located along the Y-axis direction. It has an extending joint portion 325 (third joint portion). The width of the joint portion 321 (joint portion on the terminal groups T4 and T5 sides) and the width of the joint portion 325 are larger than the widths of the joint portions 322, 323, and 324 (other joint portions). The widths of the joint portions 321 and 325 are equally configured.

(Joint material)
As shown in FIG. 15, the joining member 7A is provided so as to surround the accommodating portion S10 in a plan view, and has a frame shape in the drawing. Further, the joining material 7A is provided so as to surround the first accommodating portion S1 and the second accommodating portion S2 in a plan view.

Specifically, the joining material 7A has a frame shape in a plan view, is located between the first accommodating portion S1 and the second accommodating portion S2, and has a portion 75 extending along the Y-axis direction. The width W1 of the portion 71 (the portion on the terminal group T4 and T5 side) and the width W3 of the portion 75 are configured to be larger than the width W2 of the portions 72, 73, 74 (other portions). The width W1 of the portion 71 and the width W3 of the portion 75 are equal to each other. Further, the portion 75 constitutes a "third portion".

In the electronic device 1A as described above, the accommodating portion S10 includes a first accommodating portion S1 having an angular velocity sensor element 4 as at least one "functional element" and an acceleration sensor element 5 as at least one "functional element". It has a second accommodating portion S2 having the above. Further, the joining material 7A has a portion 75 as a "third portion" located between the first accommodating portion S1 and the second accommodating portion S2 in a plan view. Further, in a plan view, the width W3 of the portion 75 is larger than the width W2 of the portions 72, 73, and 74 as the "second portion". As a result, since the width W3 of the portion 75 is larger than the width W2 of the portions 72, 73, and 74, the airtightness of the first accommodating portion S1 and the second accommodating portion S2 can be sufficiently maintained in an independent state. ..

For example, the width W1 of the portion 71 and the width W3 of the portion 75 are set to 200 um, and the width W80 of the dicing blade 80 is set to 40 um. As a result, each width W2 of the portions 72, 73, and 74 became 80 um, and the miniaturization of the electronic device 1A was achieved. However, since the portion 75 of the first accommodating portion S1 and the second accommodating portion S2 remains at 200 um, the first accommodating portion S1 and the second accommodating portion S2 can maintain the atmosphere independently without communicating with each other. Further, since the wirings L41 to L45 and the wirings L51 to L53 have a width W1 of the portion 71 of 200 um and are isolated from the outside, good airtightness can be ensured. The present invention can be realized by using a dicing blade having a width W80 smaller than the width W1 of the portion 71 and the width W3 of the portion 75 as described above.

Further, for example, the substrate 2 and the lid 3 were bonded using a boric acid glass paste printed from a screen printing mask having a uniform opening of 140 um as a bonding material. At this time, since a load of about 100 kPa was applied to the lid 3 in the joining, the width W1 of the portion 71 and the width W3 of the portion 75 became 200 um. By applying a load to the bonding material 70 formed by screen printing in this way and pressing the bonding material 70, the width W1 and the width W3 of the portion 71 are enlarged from those at the time of printing, and the airtightness can be maintained well. Further, chipping can be suppressed when dicing each width W2 of the portions 72, 73, and 74 with a dicing blade.

In the present embodiment, one angular velocity sensor element 4 is provided in one first accommodating portion S1 and one acceleration sensor element 5 is provided in one second accommodating portion S2, but the first accommodating unit is provided. A plurality of functional elements may be provided in S1 and the second accommodating portion S2, respectively.

[Manufacturing method of electronic devices]
The acceleration sensor element 5 can be formed by the same manufacturing method as the angular velocity sensor element 4, and the wiring group L5 and the terminal group T5 can be formed by the same manufacturing method as the wiring group L4 and the terminal group T4. Then, the acceleration sensor element 5, the wiring group L5, and the terminal group T5 can be provided on the first member 20 in the same manner as in the first embodiment.

[3] Step of forming structure 10aA (step S13)
The second member 30A is joined onto the first member 20A via the joining member 70A. At this time, in the present embodiment, the first member 20A and the first member 20A and the first member 20A are located so that one angular velocity sensor element 4 is located in one recess 31 and one acceleration sensor element 5 is located in one recess 33. 2 Join the member 30A. Next, the first accommodating portion S1 and the second accommodating portion S2 are brought into a desired atmosphere through the corresponding through holes 34, and the through holes 34 are sealed with the sealing member 35. As a result, a structure 10aA including a plurality of accommodating portions S10 having a first accommodating portion S1 and a second accommodating portion S2 is obtained (see FIG. 18).

In this step, the joining material 70A is provided so as to surround the accommodating portion S10 in a plan view. Further, the joining material 70A surrounds each of the first accommodating portion S1 and the second accommodating portion S2 in a plan view. The joining material 70A has a portion 75 located between the first accommodating portion S1 and the second accommodating portion S2 in a plan view. Further, the width W1 of the portion 71, the width W21 of the intermediate portion 721, the width W22 of the boundary portion 722, and the width W3 of the portion 75 are equal.

[4] Step of individualizing (step S14)
Next, the structure 10aA is separated into individual pieces by cutting between two adjacent housing portions S10 in a plan view (see FIG. 19). As a result, the intermediate portion 721 is cut to form the portions 73 and 74 having a width W2 smaller than the portions 71 and 75. Here, in the present embodiment, as described above, since the width W1, the width W21, the width W22, and the width W3 are equal to each other, the widths of the portions 71 and 75 are formed by cutting the intermediate portion 721 and the boundary portion 722. The portions 72, 73, 74 having a width W2 smaller than W1 and W3 can be easily formed.

In the method for manufacturing the electronic device 1A as described above, in the step of forming the structure 10aA, the accommodating portion S10 includes the first accommodating portion S1 accommodating the angular velocity sensor element 4 as at least one "functional element". It has a second accommodating portion S2 accommodating the acceleration sensor element 5 as at least one "functional element". Further, the joining material 70A has a portion 75 as a "third portion" located between the first accommodating portion S1 and the second accommodating portion S2 in a plan view. Further, in the step of individualizing, the width W2 of the portions 73 and 74 as the "second portion" is changed to the width W3 of the portion 75 by cutting the intermediate portion 721 with the cutting of the structure 10aA in a plan view. Form smaller than. As a result, it is possible to manufacture the electronic device 1A in which the airtightness of the first accommodating portion S1 and the second accommodating portion S2 are independently sufficiently maintained.

Further, in the present embodiment, as described above, the joining material 70A is provided so that the width W21 of the intermediate portion 721 is equal to the width W3 of the portion 75. Here, in the present specification, the fact that the width W21 of the intermediate portion 721 and the width W3 of the portion 75 are "equal" means that the difference between the two satisfies the range of 10% or less. In other words, in plan view, the width W21 of the intermediate portion 721 is 0.9 to 1.1 times the width W3 of the portion 75 as the "third portion". As a result, the work of providing the bonding material 70A can be facilitated, and the portions 72, 73, 74 having a width W2 smaller than the width W3 of the portion 75 can be easily and appropriately formed.

Further, the width W21 of the intermediate portion 721 is more preferably 0.92 to 1.08 times the width W3 of the portion 75, and further preferably 0.95 to 1.05 times. As a result, the above-mentioned effect can be remarkably exhibited.

2. Electronic device Next, the electronic device of the present invention will be described.
FIG. 20 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of the present invention is applied. In this figure, the personal computer 1100 is composed of a main body 1104 having a keyboard 1102 and a display unit 1106 having a display 1108, and the display unit 1106 is connected to the main body 1104 via a hinge structure. It is rotatably supported. An electronic device 1 (or an electronic device 1A) is built in such a personal computer 1100.

FIG. 21 is a perspective view showing the configuration of a mobile phone (including a smartphone, PHS, etc.) to which the electronic device of the present invention is applied. In this figure, the mobile phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and a display unit 1208 is provided between the operation buttons 1202 and the earpiece 1204. Have been placed. An electronic device 1 (or an electronic device 1A) is built in such a mobile phone 1200.

FIG. 22 is a perspective view showing a configuration of a digital steel camera to which the electronic device of the present invention is applied. In this figure, a display unit 1310 is provided on the back surface of the case (body) 1302 of the digital still camera 1300, and the display unit 1310 displays the subject based on the image pickup signal by the CCD. Functions as a finder to display as an image. Further, on the front side (back side in the drawing) of the case 1302, a light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided. Then, when the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the imaging signal of the CCD at that time is transferred and stored in the memory 1308. An electronic device 1 (or an electronic device 1A) is built in such a digital still camera 1300.

Such electronic devices include electronic device 1 (or electronic device 1A). Therefore, the actions and effects of the above-mentioned electronic device 1 (or electronic device 1A) can be enjoyed, the degree of freedom of arrangement thereof is high, and the reliability is high.

3. 3. Mobile body Next, the mobile body of the present invention will be described.
FIG. 23 is a perspective view showing an automobile to which the moving body of the present invention is applied. In this figure, the automobile 1500 has an electronic device 1 built-in, and for example, the posture of the vehicle body 1501 can be detected by the electronic device 1 (or the electronic device 1A). The detection signal of the electronic device 1 (or the electronic device 1A) is supplied to the vehicle body attitude control device 1502, and the vehicle body attitude control device 1502 detects the attitude of the vehicle body 1501 based on the signal, and the suspension of the suspension according to the detection result. It is possible to control the hardness and softness, and control the brakes of individual wheels 1503.

Such a mobile body comprises an electronic device 1 (or electronic device 1A). Therefore, the actions and effects of the above-mentioned electronic device 1 (or electronic device 1A) can be enjoyed, the degree of freedom of arrangement thereof is high, and the reliability is high.

In addition, the electronic device 1 (or electronic device 1A) also includes a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an airbag, and a tire pressure monitoring system (TPMS: Tire). It can be widely applied to electronic control units (ECUs) such as Pressure Monitoring Systems), engine controls, and battery monitors for hybrid and electric vehicles.

Although the method for manufacturing the electronic device, the electronic device, the electronic device, and the mobile body of the present invention have been described above based on the illustrated embodiments, the present invention is not limited to this, and the configurations of each part are the same. It can be replaced with any configuration having the function of. Further, any other constituents may be added to the present invention. Moreover, each embodiment may be combined appropriately.

Further, in the above-described embodiment, the configuration using the acceleration sensor element and the angular velocity sensor element as the functional element has been described, but the configuration of the acceleration sensor element and the angular velocity sensor element is not particularly limited. Further, the functional element is not limited to the acceleration sensor element and the angular velocity sensor element, and may be, for example, a pressure sensor element or a vibration element used for an oscillator or the like.

1 ... electronic device, 1A ... electronic device, 2 ... substrate, 2A ... substrate, 3 ... lid, 3A ... lid, 4 ... angular velocity sensor element, 4a ... substrate, 5 ... acceleration sensor element, 7 ... bonding material, 7A ... Joining material, 10a ... Structure, 10aA ... Structure, 20 ... First member, 20A ... First member, 21 ... Recess, 22 ... Top surface, 22A ... Top surface, 23 ... Recession, 30 ... Second member, 30A ... Second member, 31 ... recess, 32 ... joint surface, 32A ... joint surface, 33 ... recess, 34 ... through hole, 35 ... sealing member, 40 ... structure, 40a ... structure, 40b ... structure, 41 ... Vibration part, 42 ... Drive spring part, 43 ... Fixed part, 44 ... Movable drive electrode, 45 ... Fixed drive electrode, 46 ... Fixed drive electrode, 47 ... Detection flap plate, 48 ... Beam part, 49 ... Fixed detection electrode, 51 ... Support part, 52 ... Support part, 53 ... Movable part, 54 ... Connecting part, 55 ... Connecting part, 58 ... First fixed electrode part, 59 ... Second fixed electrode part, 70 ... Joining material, 70A ... Joining material , 71 ... part, 72 ... part, 73 ... part, 74 ... part, 75 ... part, 80 ... dicing blade, 85 ... part, 86 ... part, 221 ... groove part, 222 ... groove part, 223 ... groove part, 224 ... groove part, 225 ... groove part, 241 ... groove part, 242 ... groove part, 243 ... groove part, 321 ... joint part, 322 ... joint part, 323 ... joint part, 324 ... joint part, 325 ... joint part, 513 ... base part, 532 ... movable electrode part , 721 ... Intermediate part, 722 ... Boundary part, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Main body part, 1106 ... Display unit, 1108 ... Display part, 1200 ... Mobile phone, 1202 ... Operation button, 1204 ... Earpiece, 1206 ... Mouthpiece, 1208 ... Display, 1300 ... Digital steel camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display, 1500 ... Automobile, 1501 ... Body, 1502 ... Body posture control device, 1503 ... Wheels, B41 ... Conductive bumps, B42 ... Conductive bumps, B43 ... Conductive bumps, B51 ... Conductive bumps, B52 ... Conductive bumps, B53 ... Conductive bumps, J4 ... Rotating shaft , L4 ... Wiring group, L41 ... Wiring, L42 ... Wiring, L43 ... Wiring, L44 ... Wiring, L45 ... Wiring, L5 ... Wiring group, L51 ... Wiring, L52 ... Wiring, L53 ... Wiring, S ... Containment part, S1 ... 1st accommodating part, S10 ... accommodating part, S2 ... 2nd accommodating part, S11 ... step, S12 ... step, S13 ... step, S14 ... step, T4 ... end Subgroup, T41 ... terminal, T42 ... terminal, T43 ... terminal, T44 ... terminal, T45 ... terminal, T5 ... terminal group, T51 ... terminal, T52 ... terminal, T53 ... terminal, ωx ... angular velocity, W1 ... width, W2 ... Width, W3 ... width, W21 ... width, W22 ... width, W80 ... width, 850 ... line, 860 ... line, C ... area

Claims (8)

A step of providing a first member with a plurality of functional elements, a plurality of terminal groups having a plurality of terminals, and a plurality of wiring groups having a plurality of wirings connecting the plurality of the functional elements and the plurality of the terminals.
A second member is joined onto the first member via a joining material, and the first member and the functional element are surrounded by the joining material in a plan view from an overlapping direction, and at least one of the functional elements. The process of forming a structure having a plurality of accommodating portions for accommodating
In the plan view, the structure includes a step of cutting the structure into individual pieces between two adjacent housing portions.
In the step of forming the structure, the second member is arranged so that a plurality of the terminal groups are located outside the second member in the plan view.
In the plan view, the joining material overlaps with the wiring group, and has a first portion located between the terminal group and the accommodating portion and an intermediate portion located between two adjacent accommodating portions. Have,
In the plan view, the width of the intermediate portion is 0.9 to 1.1 times the width of the first portion.
In the process of the individual pieces, wherein in a plan view, a method for fabricating an electronic device characterized by the Turkey to cut the intermediate portion with the cutting of the structure. A step of providing a first member with a plurality of functional elements, a plurality of terminal groups having a plurality of terminals, and a plurality of wiring groups having a plurality of wirings connecting the plurality of the functional elements and the plurality of the terminals.
A second member is joined onto the first member via a joining material, and the first member and the functional element are surrounded by the joining material in a plan view from an overlapping direction, and at least one of the functional elements. The process of forming a structure having a plurality of accommodating portions for accommodating
In the plan view, the structure includes a step of cutting the structure into individual pieces between two adjacent housing portions.
In the step of forming the structure, the second member is arranged so that a plurality of the terminal groups are located outside the second member in the plan view.
In the step of forming the structure, the accommodating portion includes a first accommodating portion accommodating at least one said functional element and a second accommodating portion accommodating at least one said functional element.
In the plan view, the joining material overlaps with the wiring group, and has a first portion located between the terminal group and the accommodating portion and an intermediate portion located between two adjacent accommodating portions. , A third portion located between the first accommodating portion and the second accommodating portion .
In the step of individualizing, in the plan view, the intermediate portion is cut along with the cutting of the structure to form the first portion and the second portion having a width smaller than that of the third portion. A method of manufacturing an electronic device, characterized in that. The method for manufacturing an electronic device according to claim 1 or 2 , wherein in the step of forming the structure, the bonding material is applied to at least one of the first member and the second member by screen printing. The method for manufacturing an electronic device according to any one of claims 1 to 3 , wherein the bonding material includes low melting point glass. With the base
A plurality of functional elements provided on the substrate and
A lid provided on the substrate and forming an accommodating portion for accommodating a plurality of the functional elements together with the substrate.
A joining material that joins the substrate and the lid,
A group of terminals provided on the substrate and having a plurality of terminals located outside the lid in a plan view from the direction in which the functional element and the substrate overlap.
Wherein provided on a substrate, having a wiring group having a plurality of wirings connecting a plurality of said functional elements and a plurality of said terminals,
The accommodating portion includes a first accommodating portion accommodating at least one said functional element and a second accommodating portion accommodating at least one said functional element.
In the plan view, the joining material has a first portion located between the accommodating portion and the terminal group, a second portion different from the first portion, and the first accommodating portion and the second accommodating material. Has a third part located between the parts ,
In the plan view, the width of the first portion is much larger than the width of said second portion,
An electronic device characterized in that, in the plan view, the width of the third portion is larger than the width of the second portion . The electronic device according to claim 5 , wherein the bonding material includes low melting point glass. An electronic device comprising the electronic device according to claim 5 or 6 . A mobile body comprising the electronic device according to claim 5 or 6 .

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