JP6761494B2 - Component mounting line optimization device and component mounting line optimization method - Google Patents

Description

The present invention relates to a component mounting line in which a plurality of component mounting machines are arranged in series, and in particular, before starting production of a board on the component mounting line, an optimization process is performed based on processing conditions that can change settings. Regarding the optimization device and the optimization method.

Facilities for producing substrates on which a large number of components are mounted include solder printing machines, component mounting machines, reflow machines, and board inspection machines. It has become common to connect these facilities to form a substrate production line. Further, in many cases, a plurality of component mounting machines are arranged in series to form a component mounting line. In order to efficiently produce substrates by fully utilizing the original equipment performance of the component mounting line, a technology for performing optimization processing before the start of production has been developed. In the optimization process, a large number of components to be mounted on a board are allocated to a plurality of component mounting machines, and the cycle time required for each component mounting machine to mount the components on one board is shortened and equalized. A simulation is performed. At the time of simulation, changeable processing conditions are set in consideration of the properties of the substrate to be produced. Patent Documents 1 and 2 disclose technical examples of this type of optimization processing.

The production information automatic collection system of Patent Document 1 acquires the work time for each worker in a production line in which a plurality of workers are arranged in order, calculates and displays the line balance efficiency of the work time. According to this, it is possible to grasp the line balance efficiency in real time during production, grasp the factors that hinder production, and deal with the improvement of production efficiency in real time. That is, even if there is a difference between the worker and the component mounting machine, the purpose of improving the efficiency of the production line by equalizing the workload is common, and the line balance efficiency is used as an evaluation index.

Further, in the method of monitoring the mounting tact of Patent Document 2, the actual mounting tact value (actual value of cycle time) during operation is collected and monitored from the component mounting machine, and the actual mounting tact value and the component mounting machine are not lost. Calculate the tact loss based on the standard mounting tact when it operates, and analyze the cause of the decrease in the mounted tact actual value. Further, according to the description of the embodiment, it is disclosed that the theoretical calculation of the mounting tact and the tact loss is performed instead of the actual mounting tact value. Furthermore, the theoretical calculation of the mounting tact balance in the component mounting line is also disclosed, and the line balance efficiency is obtained by simulation.

Japanese Unexamined Patent Publication No. 2008-217451 Japanese Patent No. 3583121

By the way, the structure of some component mounting machines constituting the component mounting line may be different from the others, and parts of a specific component type may be allocated. For example, there is a line configuration in which many component mounting machines are equipped with a feeder device and some component mounting machines are equipped with a tray device. In this case, the large parts supplied from the tray device are exclusively allocated to some parts mounting machines. Further, for example, there is a line configuration in which only a specific component mounting machine has a special shape suction nozzle and only a special shape component is assigned.

In such a line configuration, a component mounting machine to which components of a specific component type are assigned tends to have a limited number of component mounting points and a short cycle time. This deteriorates the line balance efficiency and makes it difficult to evaluate the optimization process. Further, in a component mounting machine to which components of a specific component type are allocated, the allocation of components cannot be changed, and it is difficult to improve the line balance efficiency. Therefore, when evaluating the optimization result and the line balance efficiency, it is preferable to exclude the component mounting machine to which the component of the specific component type is allocated.

On the other hand, the processing conditions set during the optimization processing are not always optimally set. For example, the optimization time that can be spent in the optimization processing is set as a default value with a certain upper limit time so as not to be an excessive processing time. Due to this restriction, the optimization process is often discontinued before the excellent optimization result is obtained and the production is started, so that the original device performance of the component mounting line cannot be utilized. Further, as the processing conditions, the default conditions on the safe side that do not hinder the production of the substrate are initially set, and the harmful effects due to forgetting to set the operator are prevented. For this reason, the operator may set appropriate processing conditions according to the substrate type of the substrate to be produced, but the optimization processing may be performed with the default conditions.

Furthermore, even if the optimization result is obtained, it is difficult for the operator in the field to judge whether the optimization result is good or not because it is unknown whether or not the optimum processing conditions are set, and an improvement point is found. It's also difficult. As a result, the component mounting line cannot utilize the original device performance. Therefore, it is extremely important to set appropriate processing conditions, perform optimization processing, and properly evaluate the optimization results.

The present invention has been made in view of the above-mentioned problems of the background technology, and the result of the optimization process performed before the start of the production of the substrate on the component mounting line is appropriately evaluated, or the optimization process is performed. The problem to be solved is to clarify the setting status of the processing conditions that are variably set, and to provide an optimization device and an optimization method for a component mounting line that can utilize the original device performance.

The component mounting line optimization device of the present invention includes a board transfer device that carries in, positions, and carries out a board to a mounting implementation position, a component supply device that sequentially supplies components, and a component supply device that collects the component from the component supply device. When the board is produced on a component mounting line in which a plurality of component mounting machines equipped with a component transfer device to be mounted on the positioned board are arranged in series, a plurality of settings can be changed for each of the plurality of processing conditions. It is an optimization device of a component mounting line that performs an optimization process related to production by setting any of the set values of, and is a device for each of a plurality of the processing conditions set to perform the optimization process . An effective degree calculation unit that individually calculates the effective degree of optimization of the set value and obtains a scored calculation result, and an effective degree display unit that individually displays the calculation result of each of the plurality of processing conditions. To be equipped.

Further, the method for optimizing the component mounting line of the present invention includes a substrate transfer device that carries in, positions, and carries out a substrate at a mounting implementation position, a component supply device that sequentially supplies components, and a component supply device that collects the component. When the board is produced on a component mounting line in which a plurality of component mounting machines equipped with a component transfer device to be mounted on the locally positioned board are arranged in series, the settings can be changed for each of the plurality of processing conditions. It is an optimization method of a component mounting line that sets one of a plurality of set values and executes an optimization process related to production, and is a method of optimizing a plurality of the processing conditions set for executing the optimization process. An effective degree calculation step for individually calculating the effective degree of optimization of each of the set values and acquiring a scored calculation result, and an effective degree display step for individually displaying the calculation result of each of the plurality of processing conditions. And.

According to the above-mentioned optimization device and optimization method of the component mounting line, the effective degree of optimization of a plurality of set processing conditions is individually calculated and displayed. Therefore, the operator can check the degree of effectiveness and determine whether or not the optimization processing is performed under appropriate processing conditions. In addition, when the degree of effectiveness is low, the operator corrects the improper setting or forgetting to set the processing conditions that cause the problem, re-executes the optimization process, obtains excellent optimization results, and obtains the original component mounting line. The equipment performance can be utilized.

It is a top view which shows typically the configuration example of the component mounting line which is the object of the optimization apparatus of embodiment. It is a perspective view which showed two component mounting machines. It is a block diagram which shows the apparatus configuration and the functional configuration of the optimization apparatus of the component mounting line of an embodiment. It is a figure of the processing flow explaining the processing content of the line balance processing unit. It is a figure of the display example which illustrates and explains the processing result of the line balance processing part. It is a figure of the display example which illustrates and explains the processing result of the operation efficiency processing part. It is a figure of the display example which illustrates and explains the processing result of the effective degree processing part.

(1. Configuration example of component mounting line 1 and component mounting machine 2)
First, a configuration example of the component mounting line 1 and the component mounting machine 2 will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view schematically showing a configuration example of a component mounting line 1 which is a target of the optimization device 7 of the embodiment. As shown in the figure, the component mounting line 1 is configured by arranging 10 first to tenth component mounting machines 21 to 2A in series. The first component mounting machine 21 on the left side in the figure is on the upstream side, and the tenth component mounting machine 2A on the right side is on the downstream side. Further, as shown by the XY coordinate axes in the drawing, the direction in which the substrate K is sequentially conveyed to the first to tenth component mounting machines 21 to 2A is the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is Y. Axial direction. FIG. 2 is a perspective view showing two component mounting machines 2. The component mounting machine 2 is configured by assembling a board transfer device 3, a component supply device 4, a component transfer device 5, a component camera 61, a nozzle station 62, a control device, and the like on the machine base 69.

The substrate transfer device 3 is arranged near the center of the component mounting machine 2 in the longitudinal direction (Y-axis direction). The substrate transfer device 3 is a so-called double conveyor type device in which the first transfer device 31 and the second transfer device 32 are arranged side by side. The first and second transfer devices 31 and 32 each have a pair of guide rails, a pair of conveyor belts, a backup device, and the like (not shown). The pair of guide rails are arranged so as to extend in the transport direction (X-axis direction). A pair of endless annular conveyor belts are juxtaposed inside the pair of guide rails facing each other. In the pair of conveyor belts, the substrate K is placed on the conveyor transport surface and rotated, and the substrate K is carried in and out at the mounting implementation position. A backup device is arranged below the mounting position. The backup device pushes up the substrate K, clamps it in a horizontal posture, and positions it at the mounting implementation position.

The component supply device 4 is provided at the front portion (left front side in FIG. 2) of the component mounting machine 2 in the longitudinal direction. The component supply device 4 is configured by arranging a plurality of feeder devices 41 in a row. The feeder device 41 includes a main body 42, a supply reel 43 rotatably and detachably mounted at the rear of the main body 42, and a component supply 44 provided at the upper end of the main body 42. A carrier tape holding parts at regular intervals is wound around the supply reel 43. The tip of the carrier tape is pulled out to the component supply unit 44 to supply the component.

The component transfer device 5 is a so-called XY robot type device that can move in the X-axis direction and the Y-axis direction. The component transfer device 5 is arranged from the rear portion (right back side in FIG. 2) of the component mounting machine 2 in the longitudinal direction to the upper side of the component supply device 4. The component transfer device 5 includes a head drive mechanism 51, a mounting head 52, and the like. The mounting head 52 detachably holds one or a plurality of suction nozzles for sucking and mounting the parts. The head drive mechanism 51 drives the mounting head 52 in the X-axis direction and the Y-axis direction.

The parts camera 61 is provided upward on the upper surface of the machine base 69 between the parts supply device 4 and the first transfer device 31. The component camera 61 captures the state of the component sucked by the suction nozzle while the mounting head 52 is moving from the component supply device 4 onto the substrate K. Further, a nozzle station 62 is arranged on the machine base 69 adjacent to the component camera 61. The nozzle station 62 replaceably holds the suction nozzles in the plurality of nozzle holding holes.

The control device (not shown) holds a mounting sequence in which the types and mounting orders of the components to be mounted on the substrate K, the feeder device 41 for supplying the components, and the like are specified. The control device controls the component mounting operation according to the mounting sequence based on the imaging data of the component camera 61 and the detection data of the sensor shown in the figure. In addition, the control device sequentially collects and updates operating status data such as the number of boards K produced, the mounting time required for mounting the components, and the number of occurrences of the component adsorption error. The control device has a monitor device 63 arranged on the front upper portion of the upper cover 68. The monitor device 63 has a display unit for displaying information to the operator and an input unit for performing input setting by the operator.

The first to ninth component mounting machines 21 to 29 constituting the component mounting line 1 include a component supply device 4 including the plurality of feeder devices 41 described above. Only the tenth component supply device 2A on the most downstream side includes the component supply device 4A including the tray device 47 (FIG. 1). The tray device 47 mounts and supplies a large deformed part on a replaceable tray 48. Further, the mounting head 52 of the component transfer device 5 of the tenth component supply device 2A holds a dedicated deformation suction nozzle for sucking the deformed parts. Therefore, the number of types of parts and the number of parts assigned to the tenth parts supply device 2A are smaller than those of the other first to ninth parts mounting machines 21 to 29. Moreover, the assigned component types cannot be exchanged between the tenth component supply device 2A and the other first to ninth component mounting machines 21 to 29.

(2. Configuration of the component mounting line optimization device 7 of the embodiment)
Next, the configuration of the optimization device 7 for the component mounting line of the embodiment will be described. FIG. 3 is a block diagram showing a device configuration and a functional configuration of the component mounting line optimization device 7 of the embodiment. The optimization device 7 is composed of a computer device 71 and software running on the computer device 71. The computer device 71 includes an input unit 72, a display unit 73, a memory unit 74, and a communication unit 75. The input unit 72 is a part where an operator sets an input. The display unit 73 is a portion for displaying information to the operator. The memory unit 74 is a part that stores various software, processing conditions at the time of executing the software, processing results, and the like. The communication unit 75 is a portion that exchanges information with an external memory device or another computer device via communication.

In the present embodiment, the computer device 71 is connected to the job database 76 via the communication unit 75. Each of the monitoring devices 63 of the first to tenth component mounting machines 21 to 2A can also access the job database 76. The job database 76 holds information used when the computer device 71 executes the optimization process. For example, the job database 76 holds information on the board K to be produced, information on the components to be mounted, and information on the dimensional specifications and performance of the first to tenth component mounting machines 21 to 2A constituting the component mounting line 1. are doing. Not limited to this, the information used when performing the optimization process may be stored in the memory unit 74.

Functionally, the optimization device 7 includes a processing selection unit 81, an optimization processing unit 82, a line balance processing unit 83, an operation efficiency processing unit 84, an effective degree processing unit 85, and a common display unit 86. The processing selection unit 81 is a portion for selecting and executing any of the optimization processing unit 82, the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85. This selection can be made manually by the operator from the input unit 72. Further, the process selection unit 81 may automatically perform this selection. For example, each time the job to be optimized in the job database 76 is updated, the process selection unit 81 can select the optimization process unit 82 and execute the optimization process for the job. The processing selection unit 81 can select and execute a plurality of the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85, and in this case, the common display unit 86 functions.

The optimization processing unit 82 performs production-related optimization processing based on processing conditions whose settings can be changed before starting production of the substrate K on the component mounting line 1. Prior to performing the optimization process, the operator sets the process conditions. The set processing conditions are held in the memory unit 74. The memory unit 74 holds the default conditions from the beginning so that the optimization processing can be executed without delay even if the operator does not set the processing conditions. As the default condition, the condition on the safety side is initially set so that the production is not hindered regardless of the substrate type of the substrate K.

As the processing conditions whose settings can be changed, the handling conditions of the substrate K and the handling conditions of parts can be exemplified. The handling condition of the substrate K means a condition when the substrate transport device 3 of the first to tenth component mounting machines 21 to 2A handles the substrate K. As the handling conditions of the substrate K, the transfer speed and the transfer acceleration of the substrate K, the operating conditions at the time of positioning the substrate K by the backup device, and the like are applicable. The default values of the transfer speed and the transfer acceleration of the substrate K are set to some smaller values so that reliable transfer can be performed regardless of the substrate type. The default value of the operating conditions when positioning the substrate K is the maximum height Hmax so that there is no problem even if the substrate K is a double-sided mounting substrate and a component having a maximum height Hmax is already mounted on the lower surface. Is set in consideration of.

Further, the component handling condition means a condition when the component transfer device 5 of the first to tenth component mounting machines 21 to 2A handles the component. The handling conditions of the parts include the type of suction nozzle used to suck the parts, the vertical operating speed and acceleration when the suction nozzles suck and mount the parts, and the parts supply device with the suction nozzles sucking the parts. This corresponds to the operating speed and acceleration in the horizontal direction when moving from 4 to the substrate K at the mounting implementation position. The type of suction nozzle is set within the maximum range in which the target component can be sucked and held. As for the operating speed and acceleration in the vertical direction and the horizontal direction, the fastest value in the component transfer device 5 is set as the default value. However, there are cases where a setting value different from the default value is set according to the component transfer device of another model. Further, the appropriate operating speed and acceleration differ depending on the type of suction nozzle used by the component transfer device 5.

Here, the handling conditions of the substrate K and the parts are not necessarily fixed conditions, and the substrate K can be produced even if the settings are changed within a certain range. Therefore, if the handling conditions are changed according to the actual conditions of the substrate K to be actually produced and the components to be mounted, the chances of obtaining even better optimization results increase. As a result, the original device performance of the component mounting line 1 can be utilized.

Furthermore, the optimization time that can be spent on the optimization process is also included in the process conditions that can change the settings. The default value of optimization time is set to a short minimum time so that production can be smoothly transferred without spending a lot of processing time. However, when production is not urgent, it is preferable to change the setting for a long optimization time and perform the optimization process over a sufficient time.

As a target item for performing the optimization process, for example, there is an allocation method in which the component types and the number of components of a large number of components mounted on the substrate K are allocated to the first to tenth component mounting machines 21 to 2A. Here, in the tenth component mounting machine 2A, the structure of the component supply device 4A is different from the others, and the allocated components are limited to a specific component type supplied from the tray device 47. On the other hand, there is no limitation on the parts types assigned to the first to ninth component mounting machines 21 to 29. Therefore, the purpose of the optimization process is to appropriately allocate the majority of the remaining component types to the first to ninth component mounting machines 21 to 29, and to shorten and equalize the cycle times of each.

In addition, the order of mounting the parts assigned to the first to tenth component mounting machines 21 to 2A and the order of the feeder devices 41 of the first to ninth component mounting machines 21 to 29 are also optimized. This is the target item. The operating efficiency of the component transfer device 5 fluctuates depending on the mounting order of the components and the order of the feeder devices 41, which affects the cycle time.

The optimization result obtained by the optimization process is temporarily stored in the memory unit 74. When the optimization process is performed a plurality of times, the best optimization result is held in the memory unit 74. The final optimization result is transferred to the control devices of the first to tenth component mounting machines 21 to 2A via the communication unit 75 and used for the production of the substrate K. As for the specific method of performing the optimization process, various known methods can be appropriately applied.

(3. Function of line balance processing unit 83)
The line balance processing unit 83 calculates and displays the line balance efficiency LBE based on the optimization result obtained by the optimization processing unit 82, excluding some specific component mounting machines. The line balance processing unit 83 includes a cycle time calculation unit 831, an exclusion machine setting unit 832, a balance efficiency calculation unit 833, and a balance efficiency display unit 834. FIG. 4 is a diagram of a processing flow for explaining the processing contents of the line balance processing unit 83. Further, FIG. 5 is a diagram of a display example illustrating the processing result of the line balance processing unit 83.

In step S1 of FIG. 4, the cycle time calculation unit 831 sets the cycle time tc required for each component mounting machine 21 to 2A to mount the component of the component type allocated by the optimization process on one substrate K, respectively. Calculate. At this time, the cycle time calculation unit 831 uses the set processing conditions in addition to various information of the job database 76. As shown in the bar graph in the display example of FIG. 5, the cycle times tc of the first to ninth component mounting machines 21 to 29 are substantially equalized, although there are some differences. On the other hand, the cycle time ct of the tenth component mounting machine 2A is considerably shorter than the others.

In the next step S2, the exclusion machine setting unit 832 is set to exclude a specific part of the component mounting machine from the subsequent arithmetic processing. Specifically, the exclusion machine setting unit 832 includes a component mounting machine having a shorter cycle time tc, a component mounting machine having a smaller number of types or parts to be allocated, and a component supply device 4A and component transfer. Exclude any of the component mounting machines in which at least one structure of the device 5 is different from the others and components of a specific component type are assigned. The exclusion machine setting unit 832 excludes the tenth component mounting machine 2A that meets any of the exclusion conditions.

The number of excluded machines is not limited to one, and may be a plurality of machines. For example, the total number of parts mounted on the board K may be small, and the parts may not be allocated to the eighth component mounting machine 28. Then, the eighth component mounting machine 28 only conveys the substrate K through, and the cycle time tc becomes extremely short. In this case, the exclusion machine setting unit 832 excludes the eighth component mounting machine 28 and the tenth component mounting machine 2A.

In steps S3 to S5, the balance efficiency calculation unit 833 calculates the line balance efficiency LBE representing the degree to which the cycle times of the component mounting machines not excluded are equalized by the following equation 1.
LBE (%) = (Tsum ÷ Tmax) × 100 ………… (Equation 1)

Specifically, in step S3, the balance efficiency calculation unit 833 calculates the total value Tsum, which is the sum of the cycle times tc of the first to ninth component mounting machines 21 to 29 that are not excluded. In step S4, the balance efficiency calculation unit 833 calculates Tmax by multiplying the maximum value tmax of the cycle time tc by the number N of the component mounting machines not excluded. In the display example of FIG. 5, the maximum value tmax of the cycle time tc is generated in the third component mounting machine 23. The number N of the first to ninth component mounting machines 21 to 29 that were not excluded is N = 9. In step S5, the balance efficiency calculation unit 833 calculates the line balance efficiency LBE according to the equation 1.

The line balance efficiency LBE may be calculated by using the following equation 2 which is a modification of equation 1.
LBE (%) = (tav ÷ tmax) × 100 …………… (Equation 2)
However, it is an average value tab obtained by averaging the cycle times ct of the first to ninth component mounting machines 21 to 29 that are not excluded, and is the maximum value tmax of the cycle time ct (value of the third component mounting machine 23).

In the next step S6, the balance efficiency display unit 834 displays the line balance efficiency LBE together with the bar graph of the cycle time tc. In the display example of FIG. 5, "LBE = 96.5% (excluding No. 10)" is displayed, and the numerical value of the line balance efficiency LBE and the exclusion machine are shown.

If the tenth component mounting machine 2A is not excluded, the line balance efficiency LBE deteriorates to about 92%. It is difficult for the operator to evaluate the optimization result even if he / she sees the deteriorated line balance efficiency LBE. On the other hand, looking at the good line balance efficiency LBE96.5% when the 10th component mounting machine 2A is excluded, the operator can roughly equalize the cycle time tc of the 1st to 9th component mounting machines 21 to 29. It can be properly evaluated as being done.

(4. Function of operation efficiency processing unit 84)
The operation efficiency processing unit 84 calculates and displays the operation efficiency M of the first to tenth component mounting machines 21 to 2A, respectively, based on the optimization result obtained by the optimization processing unit 82. The operation efficiency processing unit 84 includes a cycle time calculation unit 841, a shortest time calculation unit 842, an operation efficiency calculation unit 843, and an operation efficiency display unit 844. The cycle time calculation unit 841 performs the same calculation processing as the cycle time calculation unit 831 of the line balance processing unit 83, and calculates the cycle time ct of each component mounting machine 21 to 2A.

On the other hand, the shortest time calculation unit 842 can mount the parts of the component types assigned to the component mounting machines 21 to 2A on one board K under the virtual mounting implementation conditions that maximize the mounting efficiency. The shortest cycle time tmin is calculated respectively. The virtual mounting execution condition means a condition in which component mounting can be completed in the shortest time without being restricted by the processing condition set by the optimization processing unit 82. Therefore, for example, the maximum allowable values of the transport speed and acceleration of the substrate K and the operating speed and acceleration of the suction nozzle are set as the mounting implementation conditions. Further, for example, under the virtual mounting implementation conditions, the types of suction nozzles that can be used for suctioning parts are expanded to the maximum, and the number of times the suction nozzles are replaced is minimized.

The operation efficiency calculation unit 843 calculates the operation efficiency M, which represents the degree to which the cycle time tc approaches the shortest cycle time tmin, for each component mounting machine 21 to 2A by the following equation 3.
M (%) = (tmin ÷ tk) × 100 ………… (Equation 3)

FIG. 6 is a diagram of a display example illustrating the processing result of the operation efficiency processing unit 84. As shown, the operation efficiency display unit 844 displays the cycle time ct, the shortest cycle time tmin, and the operation efficiency M of each component mounting machine 21 to 2A. The cycle time tc is shown by a white bar graph, the shortest cycle time tmin is shown by a hatched bar graph, and the operating efficiency M is shown by a line graph.

Both the cycle time tc and the shortest cycle time tmin are values obtained by simulation, but the operation efficiency M is still effective in evaluating the actual mounting operation of each component mounting machine 21 to 2A. When the operating efficiency M is close to 100%, the operator can expect the component mounting machine to exhibit the original device performance. On the contrary, when the operation efficiency M is low, the operator can review the optimization process. That is, the operator investigates the cause of the low operation efficiency M, and if there is improper setting of the processing condition or forgetting to set the processing condition, the operator corrects the processing condition and executes the optimization process again.

(5. Function of effective degree processing unit 85)
The effectiveness degree processing unit 85 calculates and displays the effectiveness degree of optimization of the set processing conditions after the optimization processing unit 82 performs the optimization processing. However, even before the optimization processing is performed, the effective degree processing unit 85 can operate after the processing conditions have been set by the operator. The effective degree processing unit 85 includes an effective degree calculation unit 851 and an effective degree display unit 852.

The effectiveness degree calculation unit 851 sets points individually for a plurality of processing conditions, calculates the effectiveness degree of optimization, and scores the results. The effective degree computation unit 851, the set value of the part of the processing conditions, such that the scored so that higher operation value when setting change from the default condition values, a low calculation value when not set change To score. The effective degree calculating unit 851, for some of the processing conditions, as set value is scored as a higher calculated value to come to be good, a low calculation value can not be good to grade. There are no special restrictions on the size of the points assigned to multiple processing conditions, the number of stages of calculated values, and the scoring method.

FIG. 7 is a diagram of a display example illustrating the processing result of the effective degree processing unit 85. The effective degree display unit 852 displays the processing result using, for example, a list display format. In the example of FIG. 7, the calculated calculated values and the points assigned to the 10 items of the processing conditions 1 to 10 are shown. The points assigned to each processing condition are 5 points or 10 points, and the total is a maximum of 70 points. The degree of effectiveness of optimization is indicated by the total score of the scored calculated values, which is 40 points in the example of FIG.

For example, the processing condition 6 sets the height H of the mounted component on the lower surface of the substrate K, and 10 points are assigned. If the height H is properly set according to the properties of the substrate K to be produced, the substrate K can be positioned in a short time, so that the score is given as a maximum of 10 points shown in the figure. If the height H is not changed from the default maximum height Hmax, it takes time to position the substrate K, so the score is 0. If the height H is set to be smaller than the height of the component to be actually mounted, there is a concern of interference when the substrate K is conveyed. At this time, the optimization processing unit 82 displays a setting error without starting the optimization processing, and prompts the operator to make correction settings.

Further, for example, the processing condition 7 sets an optimization time that can be spent in the optimization processing, and 10 points are assigned. If the optimization time is set to unlimited, the optimization process is performed without being interrupted in the middle, so the score is given as a maximum of 10 points. If the optimization time is set to a certain time due to restrictions on the production schedule, etc., it will be scored as 5 points. If the optimization time is not changed from the minimum time of the default value, there is a concern that sufficient optimization processing will not be performed, so the score is 0 in the figure.

The operator can comprehensively check the degree of effectiveness based on the total points of the calculated values and determine whether or not the optimization processing is performed under appropriate processing conditions. When the total score of the calculated values is low, the operator can check the calculated values of the individual processing conditions, correct the incorrect setting of the processing conditions or forgetting to set the cause, and perform the optimization process again.

As described above, when the processing selection unit 81 selects a plurality of the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85, the common display unit 86 functions. The common display unit 86 displays a plurality of items of the line balance efficiency LBE, the operation efficiency M, and the effective degree of optimization (total points of calculated values) together. As a result, the operator can accurately determine whether or not an excellent optimization result is obtained by comprehensively considering the displayed plurality of items.

For example, the operating efficiency M of each component mounting machine 21 to 2A may be low and the cycle time tc may be long. In this case, if the cycle time tc of each component mounting machine 21 to 2A is similarly long and balanced, the line balance efficiency LBE becomes a high value. However, such optimization results are not appropriate. As a measure to make this easy to see, the common display unit 86 displays the line balance efficiency LBE and the operation efficiency M of each component mounting machine 21 to 2A together on one screen. As a result, the operator can visually recognize both the line balance efficiency LBE and the operation efficiency M together, and can accurately determine that the optimization result is excellent only when both are high.

(6. Aspects and effects of the component mounting line optimization device 7 of the embodiment)
The optimization device 7 of the component mounting line 1 of the embodiment includes a substrate transfer device 3 that carries in, positions, and carries out the substrate K to the mounting implementation position, a component supply device 4 that sequentially supplies components, and components from the component supply device 4. The setting can be changed when the board K is produced on the component mounting line 1 in which a plurality of component mounting machines 2 including the component transfer device 5 for collecting and mounting the components on the positioned substrate K are arranged in series. This is a component mounting line optimization device 7 that performs production optimization processing based on processing conditions, and each component mounting machine 21 to 2A uses a single board K for components of the component type allocated by the optimization process. A cycle time calculation unit 831 that calculates the cycle time tc required to be mounted on the machine and an exclusion machine that sets a specific part of the component mounting machine (10th component mounting machine 2A) to be excluded from the subsequent calculation processing. The setting unit 832, the balance efficiency calculation unit 833 that calculates the line balance efficiency LBE indicating the degree to which the cycle times tc of the first to ninth component mounting machines 21 to 29 that are not excluded are equalized, and the line balance efficiency A balance efficiency display unit 834 that displays LBE is provided.

According to this, the line balance efficiency LBE is calculated and displayed after the specific component mounting machine (10th component mounting machine 2A), which tends to deteriorate the line balance efficiency LBE, is excluded from the arithmetic processing. .. Therefore, the line balance efficiency LBE is not deteriorated by the specific component mounting machine, and the operator can confirm the effective line balance efficiency LBE and appropriately evaluate the result of the optimization process. When the line balance efficiency LBE is not good, the operator changes the processing conditions and re-executes the optimization process to obtain excellent optimization results and utilize the original device performance of the component mounting line 1. be able to.

Further, some specific component mounting machines excluded by the exclusion machine setting unit 832 include component mounting machines having a shorter cycle time tc, component mounting machines having a smaller number of types of parts or parts assigned than others, and parts mounting machines having a smaller number of parts. , A component mounting machine in which at least one structure of the component supply device 4A and the component transfer device 5 is different from the others and components of a specific component type are assigned. According to this, the component mounting machine (10th component mounting machine 2A) that deteriorates the line balance efficiency LBE can be reliably excluded, and the highly effective line balance efficiency LBE can be accurately calculated.

Further, in the optimization device 7 of the component mounting line 1 of the embodiment, the cycle time tc required for each component mounting machine 21 to 2A to mount the component of the component type allocated by the optimization process on one board K. The cycle time calculation unit 841 that calculates each of the above and the parts of the part type allocated by each component mounting machine 21 to 2A by the optimization process are mounted on one board K under the virtual mounting implementation conditions that maximize the mounting efficiency. The shortest time calculation unit 842 that calculates the shortest cycle time tmin that can be mounted on the machine, and the operation efficiency calculation unit that calculates the operation efficiency M that indicates the degree to which the cycle time tc approaches the shortest cycle time tmin for each component mounting machine 21 to 2A. 843 and an operation efficiency display unit 844 that displays the operation efficiency M may be provided.

According to this, the operation efficiency M indicating the degree to which the cycle time tc approaches the shortest cycle time tmin for each component mounting machine 21 to 2A is calculated and displayed. Therefore, the operator can confirm the operation efficiency M of each component mounting machine 21 to 2A and appropriately evaluate the result of the optimization process. Further, when the operation efficiency M is low, the operator corrects the improper setting of the processing condition or forgetting to set the processing condition, performs the optimization process again, obtains an excellent optimization result, and obtains an excellent optimization result. The original device performance can be utilized.

Further, the optimization device 7 of the component mounting line 1 of the embodiment has an effectiveness degree calculation unit 851 for calculating the optimization effectiveness degree of the processing conditions set for executing the optimization processing, and an optimization effectiveness degree May be provided with an effective degree display unit 852 for displaying.

According to this, the effective degree of optimization of the set processing conditions (total points of calculated values) is calculated and displayed. Therefore, the operator can check the degree of effectiveness and determine whether or not the optimization processing is performed under appropriate processing conditions. In addition, when the effective degree (total score of calculated values) is low, the operator corrects the improper setting of the processing condition or forgetting to set the cause, and re-executes the optimization process to obtain an excellent optimization result. , The original device performance of the component mounting line 1 can be utilized.

Further, the effective degree calculation unit 851 depends on the calculation method of changing the calculation value of the effective degree of optimization depending on whether or not the set value of the processing condition is changed from the default condition value , and the quality of the set value. The calculation method that changes the calculation value of the effective degree of optimization is used. According to this, since the degree of effectiveness of optimization can be known for each of a plurality of processing conditions, the operator can easily correct improper setting of processing conditions or forgetting to set, which causes a decrease in the degree of effectiveness.

Further, the optimization device 7 of the component mounting line 1 of the embodiment is a common display that displays a plurality of items together among the line balance efficiency LBE, the operation efficiency M, and the effectiveness degree of optimization (total points of calculated values). A unit 86 is further provided. According to this, the operator can accurately determine whether or not the optimization result is excellent by comprehensively considering the displayed plurality of items.

Each aspect of the optimization device 7 of the component mounting line 1 of the above-described embodiment can be implemented as an optimization method of the component mounting line 1. The optimization method of the component mounting line 1 of the embodiment can be realized by replacing at least one function of the optimization processing unit 82, the line balance processing unit 83, and the operation efficiency processing unit 84 with a plurality of processing steps. The effect of the optimization method of the component mounting line 1 of the embodiment is the same as the effect of the optimization device 7.

(7. Application and modification of the embodiment)
In the embodiment, the optimization device 7 includes, but is not limited to, a line balance processing unit 83, an operation efficiency processing unit 84, and an effective degree processing unit 85. That is, the minimum configuration of the optimization device 7 may include any one of the line balance processing unit 83, the operation efficiency processing unit 84, the effective degree processing unit 85, and the optimization processing unit 82.

Furthermore, the line balance efficiency LBE, which indicates the degree to which the cycle time tc of the component mounting machine is equalized, may be defined differently from that of Equation 1 and Equation 2 and may be applied to a different calculation method. Further, the effective degree calculation unit 851 scores the set values for 10 items of the processing conditions 1 to 10 and obtains the calculated value, but the calculation value is not limited to this. For example, depending on the operating conditions such as the properties of and the component mounting machine 2 models substrate K, to set or to omit or add processing conditions, can be increased or decreased from the 10 items. The present invention can be applied and modified in various other ways.

1: Parts mounting line 2: Parts mounting machines 21 to 2A: 1st to 10th parts mounting machines 3: Board transfer device 4: Parts supply device 4A: Parts supply device consisting of tray device 5: Parts transfer device 7: Parts Mounting line optimization device 71: Computer device 81: Processing selection unit 82: Optimization processing unit 83: Line balance processing unit 831: Cycle time calculation unit 832: Exclusion machine setting unit 833: Balance efficiency calculation unit 834: Balance efficiency display Unit 84: Operation efficiency processing unit 841: Cycle time calculation unit 842: Shortest time calculation unit 843: Operation efficiency calculation unit 844: Operation efficiency display unit 85: Effective degree processing unit 851: Effective degree calculation unit 852: Effective degree display unit 86 : Common display

Claims (5)

A board transfer device that carries in, positions, and carries out a board to a mounting implementation position, a component supply device that sequentially supplies parts, and a component transfer device that collects the component from the component supply device and mounts the component on the positioned board. When the board is produced on a component mounting line in which a plurality of component mounting machines equipped with the above are arranged in series, one of a plurality of setting values that can be changed for each of a plurality of processing conditions is set for production. It is an optimization device for the component mounting line that performs the optimization process for
An effective degree calculation unit that individually calculates the effective degree of optimization of the set value of each of the plurality of processing conditions set to perform the optimization process and obtains a scored calculation result.
An effective degree display unit that individually displays the calculation result of each of the plurality of processing conditions, and
A component mounting line optimizer equipped with. The effective degree calculation unit obtains sets the allotted points individually for each of the plurality of the processing conditions, the calculated value corresponding to the calculation result was scored in the range of the allocated points,
The effective degree display unit individually displays the calculated value of each of the plurality of processing conditions, and also displays the total points of the plurality of the calculated values.
The optimization device for the component mounting line according to claim 1. The effective degree calculation section calculating how the set value of the processing condition is higher the calculated value when it is set changes from the initial set default condition values so as not to cause trouble in the production irrespective of the board type and, at least one of them is used, the optimization apparatus of the component mounting line according to claim 2 of the calculation method of the set value of the processing condition is higher the calculated value when it is good. A board transfer device that carries the board to the mounting implementation position, positions it, and carries it out, a parts supply device that sequentially supplies parts, and a component transfer device that collects the parts from the parts supply device and mounts them on the positioned board. When the board is produced on a component mounting line in which a plurality of component mounting machines equipped with the above are arranged in series, one of a plurality of setting values that can be changed for each of a plurality of processing conditions is set for production. It is an optimization device for the component mounting line that performs the optimization process for
An effective degree calculation unit that individually calculates the effective degree of optimization of the set value of each of the plurality of processing conditions set to perform the optimization process and obtains a scored calculation result.
An effective degree display unit for individually displaying the calculation result of each of the plurality of processing conditions is provided.
The treatment conditions with configurable plurality of the set value comprises at least one condition handling conditions handling condition and the part of the substrate, the optimization apparatus parts products mounting line. A board transfer device that carries the board to the mounting implementation position, positions it, and carries it out, a parts supply device that sequentially supplies parts, and a component transfer device that collects the parts from the parts supply device and mounts them on the positioned board. When the board is produced on a component mounting line in which a plurality of component mounting machines equipped with the above are arranged in series, one of a plurality of setting values that can be changed for each of a plurality of processing conditions is set for production. It is an optimization method of the component mounting line that performs the optimization process for
An effective degree calculation step for individually calculating the effective degree of optimization of the set value of each of the plurality of the processing conditions set for carrying out the optimization process and acquiring a scored calculation result.
An effective degree display step for individually displaying the calculation result of each of the plurality of processing conditions, and
How to optimize the component mounting line.

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