JP6754621B2 - How to cut out the film - Google Patents

How to cut out the film Download PDF

Info

Publication number
JP6754621B2
JP6754621B2 JP2016116147A JP2016116147A JP6754621B2 JP 6754621 B2 JP6754621 B2 JP 6754621B2 JP 2016116147 A JP2016116147 A JP 2016116147A JP 2016116147 A JP2016116147 A JP 2016116147A JP 6754621 B2 JP6754621 B2 JP 6754621B2
Authority
JP
Japan
Prior art keywords
polarizer
film
start point
cutting
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016116147A
Other languages
Japanese (ja)
Other versions
JP2017219800A (en
JP2017219800A5 (en
Inventor
宏太 仲井
宏太 仲井
直孝 樋口
直孝 樋口
勝則 高田
勝則 高田
岩本 正樹
正樹 岩本
雄基 大瀬
雄基 大瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2016116147A priority Critical patent/JP6754621B2/en
Priority to CN201780035504.9A priority patent/CN109313303B/en
Priority to PCT/JP2017/020377 priority patent/WO2017213009A1/en
Priority to KR1020187035530A priority patent/KR102328501B1/en
Priority to TW106119003A priority patent/TWI757301B/en
Publication of JP2017219800A publication Critical patent/JP2017219800A/en
Publication of JP2017219800A5 publication Critical patent/JP2017219800A5/ja
Application granted granted Critical
Publication of JP6754621B2 publication Critical patent/JP6754621B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Polarising Elements (AREA)
  • Laser Beam Processing (AREA)

Description

本発明は、フィルムの切り抜き方法に関する。より詳細には、本発明はレーザー光を用いたフィルムの切り抜き方法に関する。 The present invention relates to a method for cutting out a film. More specifically, the present invention relates to a method for cutting a film using laser light.

従来より、画像表示装置等には偏光板が用いられているが、近年、画像表示装置の用途の多様化に伴い、当該画像表示装置に用いられる偏光板の形状も多様化している。例えば、車載画像表示装置(例えば、インパネに用いられる画像表示装置)においては、所定形状に切り抜かれ、切り抜き部を有する偏光板等が用いられることがある。 Conventionally, a polarizing plate has been used in an image display device or the like, but in recent years, with the diversification of applications of the image display device, the shape of the polarizing plate used in the image display device has also diversified. For example, in an in-vehicle image display device (for example, an image display device used for an instrument panel), a polarizing plate or the like that is cut out into a predetermined shape and has a cut-out portion may be used.

一般に、フィルムを切り抜く手段の1つとして、レーザー光照射が知られている。しかしながら、延伸工程を経て得られた偏光子を含む偏光板においては、レーザー光照射の起点・終点を起点としてクラックが生じやすいという問題がある。 Generally, laser light irradiation is known as one of the means for cutting out a film. However, in the polarizing plate containing the polarizer obtained through the stretching step, there is a problem that cracks are likely to occur starting from the starting point and the ending point of laser light irradiation.

特開2005−326831号公報Japanese Unexamined Patent Publication No. 2005-326831

本発明は上記従来の課題を解決するためになされたものであり、その主たる目的は、フィルムのクラックを防止しつつ、レーザー光によりフィルムを切り抜く方法を提供することにある。 The present invention has been made to solve the above-mentioned conventional problems, and a main object thereof is to provide a method for cutting out a film by laser light while preventing cracks in the film.

本発明のフィルムの切り抜き方法は、レーザー光照射により、偏光子を含むフィルムを切り抜き、該フィルムに所定形状の切り抜き部を形成することを含み、該レーザー光照射による切り抜き開始点における切り抜き部の接線A、または該開始点を含む切り抜き部の辺Bと、偏光子の吸収軸とのなす角が、0°〜85°または95°〜180°である。
1つの実施形態においては、上記接線Aまたは辺Bと、偏光子の吸収軸とのなす角が、0°〜60°または120°〜180°である。
1つの実施形態、上記接線Aまたは辺Bと、偏光子の吸収軸とが、平行である。
The film cutting method of the present invention includes cutting out a film containing a polarizer by laser light irradiation to form a cutout portion having a predetermined shape in the film, and tangent the cutout portion at the cutting start point by the laser light irradiation. The angle formed by A or the side B of the cutout portion including the start point and the absorption axis of the polarizer is 0 ° to 85 ° or 95 ° to 180 °.
In one embodiment, the angle formed by the tangent line A or the side B and the absorption axis of the polarizer is 0 ° to 60 ° or 120 ° to 180 °.
In one embodiment, the tangent line A or side B is parallel to the absorption axis of the polarizer.

本発明によれば、レーザー光照射による切り抜き開始点を特定の位置とすることにより、フィルムのクラックを防止しつつ、レーザー光によりフィルムを切り抜くことができる。 According to the present invention, by setting the cutting start point by laser light irradiation at a specific position, the film can be cut out by laser light while preventing cracks in the film.

(a)および(b)は、本発明の1つの実施形態によるフィルムの切り抜き方法を説明する図である。(A) and (b) are diagrams illustrating a film cutting method according to one embodiment of the present invention. 本発明の別の実施形態によるフィルムの切り抜き方法を説明する図である。It is a figure explaining the method of cutting out a film by another embodiment of this invention.

本発明のフィルムの切り抜き方法は、レーザー光照射により偏光子を含むフィルムを切り抜き、該フィルムに所定形状の切り抜き部を形成することを含む。 The film cutting method of the present invention includes cutting out a film containing a polarizer by irradiating a laser beam and forming a cutout portion having a predetermined shape on the film.

偏光子を含むフィルムは、偏光子単体であってもよく、偏光子(好ましくは1枚の偏光子)とその他の層とを含むフィルムであってもよい。その他の層としては、偏光子を保護する保護層、任意の適切な光学フィルムから構成される層等が挙げられる。1つの実施形態においては、偏光子を含むフィルムとして偏光板が用いられる。偏光板は、偏光子と該偏光子の少なくとも片側に配置された保護層とを備え得る。また、偏光子を含むフィルムとして、偏光板と、表面保護フィルムおよび/またはセパレーターとの積層体を用いてもよい。表面保護フィルムまたはセパレーターは、任意の適切な粘着剤を介して偏光板に剥離可能に積層される。本明細書において「表面保護フィルム」とは偏光板を一時的に保護するフィルムであり、偏光板が備える保護層(偏光子を保護する層)とは異なるものである。 The film containing the polarizer may be a single polarizer, or may be a film containing a polarizer (preferably one polarizer) and another layer. Other layers include a protective layer that protects the polarizer, a layer composed of any suitable optical film, and the like. In one embodiment, a polarizing plate is used as the film containing the polarizer. The polarizing plate may include a polarizing element and a protective layer arranged on at least one side of the polarizer. Further, as the film containing the polarizer, a laminate of a polarizing plate and a surface protective film and / or a separator may be used. The surface protective film or separator is detachably laminated on the polarizing plate via any suitable adhesive. In the present specification, the "surface protective film" is a film that temporarily protects the polarizing plate, and is different from the protective layer (layer that protects the polarizer) included in the polarizing plate.

偏光子は、代表的には、樹脂フィルム(例えば、ポリビニルアルコール系樹脂フィルム)に膨潤処理、延伸処理、二色性物質(例えば、ヨウ素、有機染料等)による染色処理、架橋処理、洗浄処理、乾燥処理等の各種処理を施すことにより得られる。一般に、延伸処理を経て得られた偏光子はクラックが生じやすいという特性を有するが、本発明によれば、クラックを防止しつつ、フィルムを切り抜くことができる。 The polarizer is typically a resin film (for example, a polyvinyl alcohol-based resin film) that is swelled, stretched, dyed with a dichroic substance (for example, iodine, an organic dye, etc.), crosslinked, or washed. It is obtained by performing various treatments such as drying treatment. Generally, the polarizer obtained through the stretching treatment has a characteristic that cracks are likely to occur, but according to the present invention, the film can be cut out while preventing cracks.

偏光子を含むフィルムの厚みは、特に制限されず、目的に応じて適切な厚みが採用され得、例えば、20μm〜200μmである。偏光子の厚みもまた特に制限されず、目的に応じて適切な厚みが採用され得る。偏光子の厚みは、代表的には、1μm〜80μm程度であり、好ましくは3μm〜40μmである。 The thickness of the film containing the polarizer is not particularly limited, and an appropriate thickness can be adopted depending on the intended purpose, for example, 20 μm to 200 μm. The thickness of the polarizer is also not particularly limited, and an appropriate thickness can be adopted depending on the intended purpose. The thickness of the polarizer is typically about 1 μm to 80 μm, preferably 3 μm to 40 μm.

偏光子を含むフィルムのサイズは、特に制限されず、目的に応じて適切なサイズとされ得る。1つの実施形態においては、偏光子を含むフィルムは、偏光子の吸収軸と平行である辺を含む長方形状または正方形状であり、偏光子の吸収軸と平行である辺の長さが10mm〜400mmであり、その他の辺の長さが10mm〜500mmである。 The size of the film containing the polarizer is not particularly limited, and may be an appropriate size depending on the purpose. In one embodiment, the film containing the polarizer is rectangular or square with sides parallel to the absorber's absorption axis, with sides parallel to the polarizer's absorption axis having a length of from 10 mm to It is 400 mm and the length of the other side is 10 mm to 500 mm.

図1(a)および図1(b)は、本発明の1つの実施形態によるフィルムの切り抜き方法を説明する図である。図1(a)においては、レーザー光照射による切り抜きを開始する時点、すなわち、切り抜き開始点11にレーザー光を照射した時点における偏光子を含むフィルム100が示されている。図1(b)においては、レーザー光照射による切り抜きが終了した後のフィルム、すなわち切り抜き部10を有するフィルム110を示している。本実施形態においては、まず、切り抜き開始点11にレーザー光を照射し、次いで、該レーザー光を切り抜こうとする部分の外郭12に連続的に照射することにより、偏光子を含むフィルム100を切り抜き、該フィルムに略円形状の切り抜き部10を形成する。 1 (a) and 1 (b) are diagrams illustrating a film cutting method according to one embodiment of the present invention. FIG. 1A shows a film 100 containing a polarizer at the time when cutting by laser light irradiation is started, that is, at the time when the cutting start point 11 is irradiated with laser light. FIG. 1B shows a film after cutting out by laser irradiation, that is, a film 110 having a cutout portion 10. In the present embodiment, first, the cutting start point 11 is irradiated with laser light, and then the outer shell 12 of the portion where the laser light is to be cut out is continuously irradiated to obtain the film 100 containing the polarizer. Cut out, and a substantially circular cutout portion 10 is formed on the film.

切り抜き開始点11が曲線上にある場合(例えば、図1に示す実施形態の場合)、レーザー光照射による切り抜き開始点11における切り抜き部の接線Aと、偏光子の吸収軸Xとのなす角は、0°〜85°または95°〜180°であり、好ましくは0°〜60°または120°〜180°であり、より好ましくは0°〜45°または135°〜180°であり、特に好ましくは0°〜30°または150°〜180°である。最も好ましくは、接線Aと吸収軸Xとは、平行である。本明細書において、「平行である」とは、実質的に平行である場合を包含し、具体的には、2方向のなす角が0°〜5°である場合を包含する。また、本明細書において角度に言及するときは、特に明記しない限り、当該角度は時計回りおよび反時計回りの両方の方向の角度を包含する。 When the cutout start point 11 is on a curve (for example, in the case of the embodiment shown in FIG. 1), the angle formed by the tangent line A of the cutout portion at the cutout start point 11 by laser light irradiation and the absorption axis X of the polarizer is , 0 ° to 85 ° or 95 ° to 180 °, preferably 0 ° to 60 ° or 120 ° to 180 °, more preferably 0 ° to 45 ° or 135 ° to 180 °, particularly preferably. Is 0 ° to 30 ° or 150 ° to 180 °. Most preferably, the tangent line A and the absorption axis X are parallel. As used herein, the term "parallel" includes the case of being substantially parallel, and specifically includes the case where the angle formed by the two directions is 0 ° to 5 °. Also, when referring to an angle herein, the angle includes angles in both clockwise and counterclockwise directions, unless otherwise stated.

切り抜き部の形状が略円形状である場合、その直径は、フィルムの用途に応じて任意の適切な長さとすることができる。該直径は、例えば、2mm〜100mmである。本発明によれば、クラックを防止して小径の切り抜き部を切り抜くことも可能である。例えば、直径が2mm〜50mm(好ましくは2mm〜10mm)の略円形状切り抜き部を、クラックを防止して形成することができる。 When the shape of the cutout portion is substantially circular, the diameter thereof can be any appropriate length depending on the application of the film. The diameter is, for example, 2 mm to 100 mm. According to the present invention, it is also possible to prevent cracks and cut out a cutout portion having a small diameter. For example, a substantially circular cutout portion having a diameter of 2 mm to 50 mm (preferably 2 mm to 10 mm) can be formed to prevent cracks.

図2は、本発明の別の実施形態によるフィルムの切り抜き方法を説明する図である。図2においては、レーザー光照射による切り抜きを開始する時点、すなわち、切り抜き開始点11’にレーザー光を照射した時点における偏光子を含むフィルムが示されている。本実施形態においては、まず、切り抜き開始点11’にレーザー光を照射し、次いで、該レーザー光を切り抜こうとする部分の外郭12’に連続的に照射することにより、偏光子を含むフィルムを切り抜き、該フィルムに略長方形状の切り抜き部を形成する。図2に例示されるように、切り抜き開始点が直線上にある場合においては、切り抜き開始点11’を含む辺Bと、偏光子の吸収軸Xとのなす角は、0°〜85°または95°〜180°であり、好ましくは0°〜60°または120°〜180°であり、より好ましくは0°〜45°または135°〜180°であり、特に好ましくは0°〜30°または150°〜180°である。最も好ましくは、辺Bと吸収軸Xとは、平行である。切り抜き部の形状が略長方形状である場合、その短辺は、好ましくは2mm〜100mmであり、より好ましくは2mm〜50mmであり、さらに好ましくは2mm〜30mmであり、特に好ましくは2mm〜10mmである。また、長辺は、好ましくは5mm〜400mmであり、より好ましくは5mm〜200mmであり、さらに好ましくは5mm〜120mmであり、特に好ましくは5mm〜40mmである。 FIG. 2 is a diagram illustrating a method for cutting out a film according to another embodiment of the present invention. FIG. 2 shows a film containing a polarizer at the time when cutting by laser light irradiation is started, that is, at the time when the cutting start point 11'is irradiated with laser light. In the present embodiment, first, the cutting start point 11'is irradiated with a laser beam, and then the outer shell 12' of the portion where the laser beam is to be cut out is continuously irradiated, thereby forming a film containing a polarizer. Is cut out to form a substantially rectangular cutout portion in the film. As illustrated in FIG. 2, when the cutting start point is on a straight line, the angle formed by the side B including the cutting start point 11'and the absorption axis X of the polarizer is 0 ° to 85 ° or It is 95 ° to 180 °, preferably 0 ° to 60 ° or 120 ° to 180 °, more preferably 0 ° to 45 ° or 135 ° to 180 °, and particularly preferably 0 ° to 30 ° or. It is 150 ° to 180 °. Most preferably, the side B and the absorption axis X are parallel. When the shape of the cutout portion is substantially rectangular, the short side thereof is preferably 2 mm to 100 mm, more preferably 2 mm to 50 mm, further preferably 2 mm to 30 mm, and particularly preferably 2 mm to 10 mm. is there. The long side is preferably 5 mm to 400 mm, more preferably 5 mm to 200 mm, further preferably 5 mm to 120 mm, and particularly preferably 5 mm to 40 mm.

切り抜き部の形状は、図1および図2に示す形状に限定されない。切り抜き部の形状としては、略円形状、略長方形状の他、例えば、略正方形状、略楕円形状等挙げられる。また、切り抜き部の形状は、直線と曲線とを適宜組み合わせた形状、曲率の異なる複数の曲線から構成された形状であってもよい。切り抜き部の外郭が頂点および/または直線と曲線の連結点を有する場合、該頂点および該連結点を、切り抜き開始点としないことが好ましい。 The shape of the cutout portion is not limited to the shapes shown in FIGS. 1 and 2. Examples of the shape of the cutout portion include a substantially circular shape and a substantially rectangular shape, as well as a substantially square shape and a substantially elliptical shape. Further, the shape of the cutout portion may be a shape in which a straight line and a curved line are appropriately combined, or a shape composed of a plurality of curves having different curvatures. When the outer shell of the cutout portion has a connection point between a vertex and / or a straight line and a curve, it is preferable not to use the vertex and the connection point as the cutout start point.

切り抜き部の面積割合は、偏光子を含むフィルム(切り抜き前のフィルム)の面積に対して、例えば、10%〜50%である。 The area ratio of the cutout portion is, for example, 10% to 50% with respect to the area of the film containing the polarizer (film before cutting).

本発明においては、切り抜き開始点を上記のように特定の位置とすることにより、偏光子を含むフィルムのクラックを防止しつつ、レーザー光により該フィルムを切り抜くことができる。レーザー光により所定形状の切り抜き部を形成する場合、切り抜き開始点を起点としてレーザー光の照射を始め、切り抜き部を形成した後、レーザー光は切り抜き開始点に戻る。すなわち、レーザー光照射の起点と終点とは同じ箇所となる。そのため、レーザー光照射の起点および終点である切り抜き開始点において、切り抜き部は、図1(b)に示すように、微少ながらも凸部(切り抜き部を有するフィルム側に突出する凸部)を有することとなる。本発明においては、切り抜き開始点、すなわち、クラックのきっかけとなり得る上記凸部を、偏光子の吸収軸を基準に上記特定の位置とすることにより、フィルムのクラックが防止されると考えられる。本発明の方法により切り抜かれたフィルムは、過酷な温度変化(例えば、−40℃〜85℃のヒートサイクル)に対しても十分な耐久性を有し、クラックが生じ難い。 In the present invention, by setting the cutting start point at a specific position as described above, the film can be cut out by laser light while preventing cracks in the film containing a polarizer. When a cutout portion having a predetermined shape is formed by laser light, irradiation of laser light is started starting from the cutout start point, and after the cutout portion is formed, the laser light returns to the cutout start point. That is, the starting point and the ending point of the laser light irradiation are the same location. Therefore, as shown in FIG. 1 (b), the cut-out portion has a slight convex portion (a convex portion protruding toward the film having the cut-out portion) at the start point and the end point of the laser light irradiation. It will be. In the present invention, it is considered that cracks in the film are prevented by setting the cutting start point, that is, the convex portion that can trigger cracks, at the specific position with respect to the absorption axis of the polarizer. The film cut out by the method of the present invention has sufficient durability against severe temperature changes (for example, a heat cycle of −40 ° C. to 85 ° C.) and is less likely to crack.

上記レーザー光は、好ましくは、200nm〜11000nmの波長の光を含む。 The laser light preferably includes light having a wavelength of 200 nm to 11000 nm.

レーザー光照射に用いるレーザーとしては、任意の適切なレーザーが採用され得る。例えば、任意の適切なレーザーを採用し得る。具体例としては、COレーザー、エキシマレーザー等の気体レーザー;YAGレーザー等の固体レーザー;半導体レーザー等が挙げられる。 As the laser used for laser light irradiation, any suitable laser can be adopted. For example, any suitable laser may be employed. Specific examples include gas lasers such as CO 2 lasers and excimer lasers; solid-state lasers such as YAG lasers; and semiconductor lasers.

レーザー光の照射条件(出力条件、移動速度、回数)は、フィルムの材料、フィルムの厚み等に応じて任意の適切な条件を採用し得る。 As the laser light irradiation conditions (output conditions, moving speed, number of times), any appropriate conditions can be adopted depending on the film material, the film thickness, and the like.

以下、実施例によって本発明を具体的に説明するが、本発明はこれら実施例によって限定されるものではない。 Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples.

[実施例1]
レーザー光を照射して、72mm角の偏光子から、円形状(直径20mm)の切り抜き部を切り抜いた。切り抜き開始点における切り抜き部の接線と、偏光子の吸収軸とのなす角は、0°とした。また、偏光子の各辺と切り抜き部の中心との距離は、30mmとした。
なお、レーザー光の照射条件は、以下のとおりとした。
波長:9.4μm
パルス幅:8μs
出力:10V
周波数:12.5kHz
加工速度:400mm/sec
[Example 1]
A circular (diameter 20 mm) cutout portion was cut out from a 72 mm square polarizing element by irradiating with a laser beam. The angle formed by the tangent of the cutout portion at the cutout start point and the absorption axis of the polarizer was set to 0 °. The distance between each side of the polarizer and the center of the cutout portion was set to 30 mm.
The irradiation conditions of the laser beam were as follows.
Wavelength: 9.4 μm
Pulse width: 8 μs
Output: 10V
Frequency: 12.5kHz
Processing speed: 400 mm / sec

[実施例2]
切り抜き開始点における切り抜き部の接線と、偏光子の吸収軸とのなす角を、30°としたこと以外は、実施例1と同様にして、偏光子を切り抜いた。
[Example 2]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed by the tangent of the cutout portion at the cutout start point and the absorption axis of the polarizer was set to 30 °.

[実施例3]
切り抜き開始点における切り抜き部の接線と、偏光子の吸収軸とのなす角を、45°としたこと以外は、実施例1と同様にして、偏光子を切り抜いた。
[Example 3]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed by the tangent line of the cutout portion at the cutout start point and the absorption axis of the polarizer was set to 45 °.

[実施例4]
切り抜き開始点における切り抜き部の接線と、偏光子の吸収軸とのなす角を、60°としたこと以外は、実施例1と同様にして、偏光子を切り抜いた。
[Example 4]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed by the tangent line of the cutout portion at the cutout start point and the absorption axis of the polarizer was set to 60 °.

[比較例1]
切り抜き開始点における切り抜き部の接線と、偏光子の吸収軸とのなす角を、90°としたこと以外は、実施例1と同様にして、偏光子を切り抜いた。
[Comparative Example 1]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed by the tangent of the cutout portion at the cutout start point and the absorption axis of the polarizer was 90 °.

[評価]
実施例および比較例で得られた切り抜き部を有する偏光子を、ヒートショック試験に供した。ヒートショック試験においては、85℃の環境下で30分間置いた後に−40℃の環境下に30分間置くことを1サイクルとし、200サイクル後および300サイクル後の偏光子の外観を目視にて確認した。
当該ヒートショック試験を5枚のサンプルに対して行い、クラックの発生率(いずれのサンプルもクラックなしの場合:0%、5枚のサンプルにクラックが生じた場合:100%)を求めた。結果を表1に示す。
[Evaluation]
The polarizers having the cutouts obtained in Examples and Comparative Examples were subjected to a heat shock test. In the heat shock test, the appearance of the polarizer after 200 cycles and 300 cycles is visually confirmed by placing it in an environment of 85 ° C. for 30 minutes and then placing it in an environment of -40 ° C. for 30 minutes as one cycle. did.
The heat shock test was performed on 5 samples, and the crack occurrence rate (when none of the samples had cracks: 0%, when 5 samples had cracks: 100%) was determined. The results are shown in Table 1.

本発明のフィルムの切り抜き方法は、偏光子板等の光学フィルムを製造する際に好適に用いられる。 The film cutting method of the present invention is suitably used when manufacturing an optical film such as a polarizing plate.

10 切り抜き部
11、11’ 切り抜き開始点
100 フィルム
10 Cutouts 11, 11'Cut start point 100 Film

Claims (3)

レーザー光照射により、偏光子を含むフィルムを切り抜き、該フィルムに所定形状の切り抜き部を形成することを含み、
該レーザー光照射において、切り抜き開始点にレーザー光を照射し、次いで、該レーザー光を切り抜こうとする部分の外郭に連続的に照射し、
レーザー光照射による切り抜き開始点が曲線上にある場合において、該開始点における切り抜き部の接線Aと偏光子の吸収軸とのなす角が、0°〜85°または95°〜180°であり、
該開始点が直線上にある場合において、該開始点を含む切り抜き部の辺Bと、偏光子の吸収軸とのなす角が、0°〜85°または95°〜180°であり、
該切り抜き部を形成する際、該レーザー光による切り抜き開始点と終点とが同じ箇所となり、
該切り抜き部の外郭が頂点および/または直線と曲線の連結点を有する場合、該頂点および該連結点を、切り抜き開始点としない、
フィルムの切り抜き方法。
It includes cutting out a film containing a polarizer by irradiating a laser beam and forming a cutout portion having a predetermined shape on the film.
In the laser light irradiation, the cutting start point is irradiated with the laser light, and then the outer shell of the portion where the laser light is to be cut out is continuously irradiated.
When the cutting start point by laser irradiation is on a curve, the angle formed by the tangent line A of the cutting portion at the starting point and the absorption axis of the polarizer is 0 ° to 85 ° or 95 ° to 180 °.
When the start point is on a straight line, the angle formed by the side B of the cutout portion including the start point and the absorption axis of the polarizer is 0 ° to 85 ° or 95 ° to 180 °.
When forming the cutout portion, the cutout start point and end point of the laser beam are the same.
When the outer shell of the cutout portion has a connection point between a vertex and / or a straight line and a curve, the vertex and the connection point are not set as the cutout start point.
How to cut out the film.
前記接線Aまたは辺Bと、偏光子の吸収軸とのなす角が、0°〜60°または120°〜180°である、請求項1に記載のフィルムの切り抜き方法。 The method for cutting out a film according to claim 1, wherein the angle formed by the tangent line A or the side B and the absorption axis of the polarizer is 0 ° to 60 ° or 120 ° to 180 °. 前記接線Aまたは辺Bと、偏光子の吸収軸とが、平行である、請求項1または2に記載のフィルムの切り抜き方法。
The method for cutting out a film according to claim 1 or 2, wherein the tangent line A or the side B is parallel to the absorption axis of the polarizer.
JP2016116147A 2016-06-10 2016-06-10 How to cut out the film Active JP6754621B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016116147A JP6754621B2 (en) 2016-06-10 2016-06-10 How to cut out the film
CN201780035504.9A CN109313303B (en) 2016-06-10 2017-06-01 Film cutting method
PCT/JP2017/020377 WO2017213009A1 (en) 2016-06-10 2017-06-01 Film cutout method
KR1020187035530A KR102328501B1 (en) 2016-06-10 2017-06-01 How to cut a film
TW106119003A TWI757301B (en) 2016-06-10 2017-06-08 Film cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016116147A JP6754621B2 (en) 2016-06-10 2016-06-10 How to cut out the film

Publications (3)

Publication Number Publication Date
JP2017219800A JP2017219800A (en) 2017-12-14
JP2017219800A5 JP2017219800A5 (en) 2019-05-23
JP6754621B2 true JP6754621B2 (en) 2020-09-16

Family

ID=60578611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016116147A Active JP6754621B2 (en) 2016-06-10 2016-06-10 How to cut out the film

Country Status (5)

Country Link
JP (1) JP6754621B2 (en)
KR (1) KR102328501B1 (en)
CN (1) CN109313303B (en)
TW (1) TWI757301B (en)
WO (1) WO2017213009A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210126006A (en) * 2019-02-08 2021-10-19 닛토덴코 가부시키가이샤 Manufacturing method of optical film

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06269967A (en) * 1993-03-25 1994-09-27 Fanuc Ltd Method and device for laser beam machining
JP4233999B2 (en) * 2003-12-25 2009-03-04 日東電工株式会社 Laminated polarizing plate and manufacturing method thereof
JP2005326831A (en) 2004-04-13 2005-11-24 Nitto Denko Corp Optical member, method of manufacturing the same, and image display device applying the same
JP4732790B2 (en) * 2005-04-28 2011-07-27 日本合成化学工業株式会社 Production method of polyvinyl alcohol film, polyvinyl alcohol film and polarizing film, polarizing plate
JP2007319888A (en) * 2006-05-31 2007-12-13 Sharp Corp Laser beam fusion-cutting method of brittle member to be worked
JP4808106B2 (en) * 2006-08-23 2011-11-02 日東電工株式会社 Cutting method of optical film
KR101157444B1 (en) * 2007-07-06 2012-06-22 닛토덴코 가부시키가이샤 Polarization plate
JP5558026B2 (en) * 2008-05-07 2014-07-23 日東電工株式会社 Polarizing plate and manufacturing method thereof
JP2010017990A (en) * 2008-07-14 2010-01-28 Seiko Epson Corp Substrate dividing method
US8584490B2 (en) * 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
JP5824218B2 (en) * 2011-02-24 2015-11-25 伊藤光学工業株式会社 Anti-glare optical element
CN104854645B (en) * 2012-12-18 2017-05-24 住友化学株式会社 Manufacturing method for optical display device and manufacturing system for optical display device
JP2014182274A (en) * 2013-03-19 2014-09-29 Fujifilm Corp Polarizing plate, liquid crystal display device, and method for manufacturing liquid crystal display device
JP2014191051A (en) * 2013-03-26 2014-10-06 Nitto Denko Corp Laser processing method of polarizer
JP6127707B2 (en) * 2013-05-16 2017-05-17 住友化学株式会社 Optical display device production system and production method
JP6227279B2 (en) * 2013-05-17 2017-11-08 住友化学株式会社 Manufacturing apparatus and manufacturing method of optical member bonded body
JP2015108663A (en) * 2013-12-03 2015-06-11 住友化学株式会社 Apparatus for manufacturing optical member laminate
KR20160015160A (en) * 2014-07-30 2016-02-12 스미또모 가가꾸 가부시키가이샤 Anti-glare film
US20160033699A1 (en) * 2014-08-04 2016-02-04 Nitto Denko Corporation Polarizing plate
KR101817388B1 (en) * 2014-09-30 2018-01-10 주식회사 엘지화학 Cutting method for the polarizing plate, polarizing plate cut usuing the same

Also Published As

Publication number Publication date
JP2017219800A (en) 2017-12-14
CN109313303A (en) 2019-02-05
TWI757301B (en) 2022-03-11
WO2017213009A1 (en) 2017-12-14
CN109313303B (en) 2021-04-20
KR20190015290A (en) 2019-02-13
TW201801841A (en) 2018-01-16
KR102328501B1 (en) 2021-11-18

Similar Documents

Publication Publication Date Title
JP6823705B2 (en) Polarizer
CN105247395B (en) The method of polarization element of the manufacture containing local bleached area, the method for manufacturing the method for polarization element roller and manufacturing monolithic polarizing element
TWI588018B (en) Laminate, Stretch Laminate, Method for Producing Stretch Laminate, Method for Producing Such an Optical Film Laminate Comprising the Same, and Polarizing Film
JP6420747B2 (en) Polarizer, polarizing plate, and method for producing polarizer
KR20160006795A (en) Long polarizer, long polarizing plate, and image display device
JP2014081482A (en) Polarizer and image display device
WO2017099017A1 (en) Method for manufacturing polarizing film
JP2014164085A (en) Polarizer and image display device
JP2017199030A (en) Polarizing plate and image display unit
TW201721195A (en) Polarizer, polarizing plate, and image display apparatus
TWI726001B (en) Polarizer, polarizing plate, and method of producing polarizer
JP6754621B2 (en) How to cut out the film
CN115755265A (en) Method for manufacturing polarizing plate
JP2014164084A (en) Polarizer and image display device
KR20230093550A (en) Polarizing plate and method for producing same
WO2016167060A1 (en) Polarizer, polarizing plate, and method for producing polarizer
US20190086603A1 (en) Display device and method for manufacturing display panel
JP2017219800A5 (en)
CN115113320A (en) Polarizing plate and method for producing same
TW201539058A (en) Polarizing element and image display device
WO2015145657A1 (en) Polarizer and image display device
JP2020160455A (en) Optical laminate and method of manufacturing optical film piece using optical laminate
JP2015036780A (en) Intrinsic polarizer and method for manufacturing the same
Oyoshi MT Spence's Light the Sea
TW202104947A (en) Method for dividing composite material

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190412

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190412

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200512

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200804

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200824

R150 Certificate of patent or registration of utility model

Ref document number: 6754621

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250