JP6680321B2 - Light emitting device - Google Patents

Description

  Embodiments of the present invention relate to a light emitting device.

  For example, a light emitting device using an LED is manufactured by mounting the LED on a resin molded body in which positive and negative leads are embedded and covering the LED with a translucent resin. In such a light emitting device, a lead frame having positive and negative leads is loaded in a mold, and a resin is flown into a cavity formed corresponding to each light emitting device to be cured, and then the individual light emitting device is cured. It is produced by separating each. A lead frame used for manufacturing this light emitting device is formed by repeatedly arranging unit regions each including positive and negative leads in order to collectively mold a plurality of light emitting devices. Here, in the present specification, the unit area refers to an area corresponding to each light emitting device. Further, in the present specification, a plate-shaped member in which a plurality of unit regions are repeatedly arranged is referred to as a lead frame or a connected lead frame.

In the lead frame, since it is necessary to hold a plurality of leads in an aggregated state across a plurality of unit areas, the leads are connected between adjacent unit areas, and the connecting portion is cut after molding. Various structures have been conventionally proposed as the lead frame, and Patent Document 1 discloses a lead frame in which leads between adjacent unit regions are connected by hanging pins.
Further, Patent Document 2 discloses a lead frame in which one unit area is provided with six leads, and the six leads are connected to a connecting portion surrounding the unit area with the six leads respectively by a plurality of suspension pins. There is.

JP2012-89547A JP2011-176264A

  However, the resin molded body produced using the conventional lead frame has a problem that the resin molded body is cracked when the connecting portion is cut.

  In order to solve the above problems, a light emitting device according to an embodiment of the present invention includes first and second light emitting elements, a plurality of leads for individually driving the first and second light emitting elements, and the plurality of leads. A light emitting device including a resin molded body having a substantially rectangular shape in a top view formed integrally with the lead, wherein the plurality of leads includes a first lead connected to the first light emitting element by a wire, It includes a second lead connected to the second light emitting element by a wire and a third lead on which the first and second light emitting elements are mounted, and the first lead is the resin molded body in a top view. A first exposed portion that is disposed in the vicinity of the first corner portion and that is exposed from the one side surface side of the two side surfaces that share the first corner portion, and the resin is provided on the other side surface side. The second lead is embedded in a molded body, and the second lead is A second exposed portion that is arranged near the second corner of the fat-molded article and that is exposed from the one side of two side surfaces that share the second corner, and the other side of the side surface is provided. In the above, it is embedded in the resin molded body.

Furthermore, in the method for manufacturing a light emitting device according to the embodiment of the present invention, the first and second light emitting elements, a plurality of leads for individually driving the first and second light emitting elements, and the plurality of leads are provided. A method of manufacturing a light emitting device, comprising: a resin molded body that is integrally molded and has a substantially rectangular shape in a top view, wherein a plurality of unit regions each including a first lead, a second lead, and a third lead are the units. A step of preparing a lead frame connected by suspending pins connecting the areas and a resin molded body integrally molded with the lead frame; and a first and a second light emitting element on the upper surface of the third lead. A step of mounting, a step of connecting the first light emitting element and the first lead with a wire, a step of connecting the second light emitting element and the second lead with a wire, and the resin molded body A piece for each unit area The first lead and the second lead are respectively disposed in the vicinity of the corners of the resin molded body after being singulated in a top view, and the first lead and the second lead. The second lead and the second lead are each connected to the hanging pin by one extending portion, and the step of dividing into pieces is characterized in that the resin molded body is cut together with the hanging pin.

  According to the light emitting device of the present invention configured as described above, it is possible to suppress cracks and breaks in the resin molded body, and it is possible to obtain a highly reliable light emitting device.

It is a top view of the lead frame which comprises the light-emitting device which concerns on embodiment of this invention. FIG. 2 is a top view of a lead frame including a resin molded body that is integrally molded with the lead frame of FIG. 1. 1 is a schematic perspective view for explaining a light emitting device according to an embodiment of the present invention. It is a top view for explaining the light-emitting device concerning the embodiment of the present invention. It is a bottom view for explaining the light-emitting device concerning the embodiment of the present invention. FIG. 4B is a schematic cross-sectional view taken along the line AA of the light emitting device of FIG. 4A. It is a top view of the lead frame which comprises the light-emitting device which concerns on the 2nd Embodiment of this invention. FIG. 7 is a top view of a lead frame including a resin molded body that is integrally molded with the lead frame of FIG. 6. It is a schematic perspective view for explaining the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a top view for explaining the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a bottom view for explaining the light-emitting device concerning the 2nd embodiment of the present invention. FIG. 4B is a schematic cross-sectional view taken along the line AA of the light emitting device of FIG. 4A.

[Light emitting device 100 according to the embodiment of the present invention]
As shown in FIG. 3, a light emitting device 100 according to an embodiment of the present invention includes first and second light emitting elements, a plurality of leads for individually driving the first and second light emitting elements, and a plurality of leads. And a resin molded body having a substantially rectangular shape in a top view integrally molded with the light emitting device. The plurality of leads included in the light emitting device 100 include a first lead 11 connected to the first light emitting element 21 by a wire, a second lead 12 connected to the second light emitting element 22 by a wire, a first lead, and a first lead. And a third lead 13 on which the second light emitting element is mounted. The first lead 11 is arranged in the vicinity of the first corner portion of the resin molded body 31 in a top view, and on one side surface side of the two side surfaces sharing the first corner portion, the first lead 11 is exposed from the side surface. The exposed portion 51 is provided and is embedded in the resin molded body on the other side surface side. The second lead 12 is disposed in the vicinity of the second corner portion of the resin molded body in a top view, and on one side surface side of the two side surfaces sharing the second corner portion, a second exposed portion exposed from the side surface. 52, and is embedded in the resin molded body on the other side surface side.

  With such a configuration, particularly, the resistance to the stress applied to the vicinity of the lead exposed portion on the side surface of the resin molded body at the time of singulation can be increased, and cracks, breakage, and peeling of the resin molded body can be suppressed, and reliability can be improved. It is possible to obtain a light emitting device having high properties.

  Hereinafter, they will be described in order.

(Light emitting element)
The light emitting element is usually a semiconductor light emitting element, and may be any element as long as it is a so-called light emitting diode element. At least two light emitting elements are mounted, and the two or more light emitting elements are individually driven. As the two or more light emitting elements, light emitting elements that emit the same color may be used, or light emitting elements that emit different colors may be used.

  As shown in FIG. 4A, the light emitting device 100 according to the embodiment of the present invention includes a first light emitting element 21 and a second light emitting element 22. Light emitting elements that emit different colors can be used for the first light emitting element 21 and the second light emitting element 22. In the present embodiment, a third light emitting element 23 is further mounted in addition to the first light emitting element 21 and the second light emitting element 22, and the first light emitting element, the third light emitting element, and the second light emitting element are mounted. The light emitting elements are mounted in a line on the third lead in this order. As the first light emitting element 21, the second light emitting element 22, and the third light emitting element 23, light emitting elements having different emission wavelengths can be selected. In particular, a light emitting device used for a full-color display device is preferably combined with three types of light emitting elements that emit red, green, and blue light, and thereby color reproducibility can be improved. The light emitting elements are preferably arranged in a line in a predetermined direction. When combining three types of red-based, green-based, and blue-based light-emitting elements, the green-based light-emitting elements with the highest brightness are arranged in a row near the center of the light-emitting device so that each light-emission can be achieved. This is preferable because the color mixture of light emitted from the device is improved.

The light emitting element can be selected to have any wavelength according to the application. For example, as a blue (light having a wavelength of 430 nm to 490 nm) and green (light having a wavelength of 490 nm to 570 nm) light emitting element, ZnSe, a nitride-based semiconductor (In _X Al _Y Ga _1-X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), a semiconductor layer using GaP or the like, and a red (light having a wavelength of 620 nm to 750 nm) light emitting element includes a semiconductor layer using GaAlAs, AlInGaP or the like. Further, in addition to visible light emitting elements such as those having intermediate colors, infrared light emitting elements, ultraviolet light emitting elements and the like can be used.

The light emitting element is usually formed by stacking semiconductor layers on a growth substrate (for example, a sapphire substrate). The substrate may have unevenness on the bonding surface with the semiconductor layer. This allows the light emitted from the semiconductor layer to intentionally change the critical angle at which it strikes the substrate, so that the light can be easily extracted to the outside of the substrate.
The semiconductor element may be either one having a pair of positive and negative electrodes on the same surface side with respect to the active layer, or one having a positive and negative electrodes respectively on different sides with respect to the active layer.

  As shown in FIG. 4A, the first light emitting element 21 and the second light emitting element 22 are mounted on the third lead 13. Further, the first light emitting element 21 is connected to the first lead 11 by a wire, and the second light emitting element 22 is connected to the second lead 12 by a wire. The first light emitting element 21 and the second light emitting element 22 can be individually driven. Further, the light emitting device 100 includes a third light emitting element 23. Like the first light emitting element 21 and the second light emitting element 22, the third light emitting element 23 is preferably placed on the third lead 13. In this case, it is preferable that the light emitting device 100 further includes a pair of positive and negative leads that are connected to the third light emitting element 23 by a wire and can drive the third light emitting element 23 independently.

  The light emitting element is usually mounted on a lead, for which a joining member is used. For example, in the case of a light emitting element that emits blue and green light and is formed by growing a nitride-based semiconductor layer on a sapphire substrate, epoxy resin, silicone, or the like can be used. Also, in consideration of deterioration due to light or heat from the light emitting element, the rear surface of the light emitting element may be plated with Al, or solder such as Au—Sn eutectic or a low melting point metal may be used without using resin. You may use a material. Further, in the case of a light emitting element which is made of GaAs or the like and has electrodes formed on both surfaces such as a light emitting element which emits red light, it may be die-bonded by a conductive paste such as silver, gold or palladium.

  Furthermore, the light emitting device according to the embodiment of the present invention may be equipped with a protection element. The number of protective elements may be one or may be two or more. Here, the protective element is not particularly limited, and may be any known element mounted on the light emitting device. Specific examples include a protection circuit against overheat, overvoltage, and overcurrent, an electrostatic protection element, and the like. The portion on which the protective element is placed may be in the vicinity of the light emitting element, or may be partially or entirely embedded in the resin molded body.

(Resin molding)
As shown in FIG. 4A, the resin molded body 31 has a substantially rectangular shape in a top view. Further, the resin molded body 31 is molded together with a plurality of leads to form a recess 32 that accommodates the light emitting element. Specifically, the bottom surface of the recess 32 is mainly composed of the top surfaces of the plurality of leads including the first, second, and third leads 11, 12, and 13 and the resin molded body 31 that fills the space between the plurality of leads. And a surface. In the present embodiment, the bottom surface of the recess is substantially flat, but a protrusion may be provided on the separated region, for example. In order to efficiently take out the light emitted from the light emitting element, it is preferable that the protrusion becomes wider toward the bottom surface of the recess. Further, this protrusion may be formed integrally with the resin molded body 31 or may be provided separately from the resin molded body 31. The sidewall surface of the recess is formed by the surface of the resin molded body 31. The side wall surface of the recess may be perpendicular to the bottom surface of the recess, but in order to efficiently extract the light emitted from the light emitting element, the opening is inclined so that the opening becomes narrower toward the bottom surface of the recess. Preferably. When the first and second light emitting elements are light emitting elements having different emission colors, in order to improve the light distribution variation of the emission colors, the recess side wall surfaces on the first light emitting element side and the second light emitting element side are formed. The inclination angle with respect to the bottom surface of the recess may be different. The recess, that is, the recess side wall may be omitted, and the resin molded body may be formed in a flat plate shape, for example.

The base material of the resin molded body is an aliphatic polyamide resin, a semi-aromatic polyamide resin, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, polycarbonate resin, syndiotactic polystyrene, polyphenylene ether, polyphenylene sulfide, polyether sulfone resin, polyether. Examples thereof include thermoplastic resins such as ketone resins and polyarylate resins, and thermosetting resins such as epoxy resins, epoxy-modified resins, silicone resins, silicone-modified resins, polybismaleimidetriazine resins, polyimide resins and polyurethane resins. Further, in these base materials, as a filler or a coloring pigment, glass, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, wollastonite, Mica, zinc oxide, barium titanate, potassium titanate, aluminum borate, aluminum oxide, zinc oxide, silicon carbide, antimony oxide, zinc stannate, zinc borate, iron oxide, chromium oxide, manganese oxide, carbon black, etc. Particles or fibers can be incorporated.
Thermosetting resins have resistance to heat and chemical influences, but after curing, many of them are harder than thermoplastic resins, and cracks and cracks are likely to occur. Therefore, the configuration of the embodiment of the present invention is particularly effective. Above all, an epoxy resin or an epoxy-modified resin is particularly suitable.

(Lead frame)
The light emitting device 100 according to the present embodiment includes a plurality of leads that individually drive the first light emitting element 21 and the second light emitting element 22. Specifically, the first lead 11 connected to the first light emitting element 21 by a wire, the second lead 12 connected to the second light emitting element 22 by a wire, and the first and second light emitting elements are connected. The third lead 13 to be placed is provided, and the first lead 11, the second lead 12, and the third lead 13 are integrally molded with the resin molded body 31 in a separated state. In other words, the first, second, and third leads 11, 12, and 13 are embedded in the resin molded body in a separated region that separates them from each other, and the separated region serves as an electrically insulating region and is integrated by the resin molded body 31. Retained

  The plurality of leads included in the light emitting device 100 are members for mounting the light emitting element, and also serve as an electrode electrically connected to the light emitting element and an external connection terminal of the light emitting device. Therefore, in the light emitting device 100, a part of the lower surface of the first lead 11 and the second lead 12 is exposed from the lower surface of the resin molded body 31 to form an external connection terminal of the light emitting device 100. Further, in the light emitting device 100, a part of the lower surface of the third lead 13 is exposed on the lower surface of the resin molded body 31. In this way, by making the region directly below the light emitting element mounted on the third lead function as the heat dissipation portion exposed from the lower surface of the resin molded body 31, the heat dissipation property of the light emitting device can be improved.

  The first lead 11 and the second lead 12 are arranged near the corners of the resin molded body 31 in a top view. Here, the term “leads are arranged in the vicinity of the corners” means, among the plurality of leads included in the light emitting device 100, the lead that is arranged at a position closest to the corners of the resin molded body 31 in a top view. . The resin molding 31 having a rectangular shape in top view has four corners in top view. These corners are formed by two adjacent side surfaces of the four side surfaces of the resin molded body. That is, it can be said that each corner has two side surfaces that share each corner.

  In the light emitting device 100 shown in FIG. 4A, the four leads arranged in the vicinity of the four corners are different leads as is apparent from FIG. The first lead 11 is arranged near the first corner portion 41 of the resin molded body in a top view. The first lead 11 includes a first exposed portion 51 exposed from one side surface of the two side surfaces sharing the first corner portion 41, and the resin molded body on the other side surface side. It is embedded in the resin molded body without being exposed from the side surface. The second lead 12 includes a second exposed portion 52 that is exposed from one of the two side surfaces sharing the second corner portion 42 on one side surface side, and the other side surface side includes the resin molded body. It is embedded in the resin molded body without being exposed from the side surface.

Here, as shown in FIGS. 1 and 2, the plurality of leads included in each unit area 101 are connected to the hanging pins 15 that connect the unit areas 101 in the connected lead frame 10. . The light emitting device 100 according to the present embodiment is provided with six leads in one unit region that constitutes the light emitting device 100, and these six leads have the extending portions 14 on the side surfaces of the respective leads. The lead frame 10 is configured by connecting the extending portions 14 to the hanging pins 15. The lead frame 10 thus configured is loaded into a mold, and a resin material for forming a resin molded body is injected into the mold and cured, whereby the lead frame 10 and the resin molded body 30 are separated from each other. It is integrally formed. The resin molded body 30 is divided into individual unit regions 101 by cutting the suspension pins that connect the unit regions together. At this time, the extending portion connected to the hanging pin is also cut together with the hanging pin. Then, the cut surface of the extending portion connected to the hanging pin is exposed as an exposed portion on the side surface of the resin molded body after being divided into individual pieces. The exposed portion exposed from the side surface of the resin molded body constitutes the outer side surface of the light emitting device together with the cut surface of the resin molded body. In such a light emitting device, since the cut surface of the lead does not protrude from the side surface of the resin molded body, the light emitting device itself can be downsized, and the damage failure of the light emitting device during the manufacturing process can be suppressed.

  In the case of a light emitting device in which a plurality of light emitting elements are individually driven like the light emitting device according to the present embodiment, the number of leads included in one unit area increases. When the number of leads embedded in the resin molded body increases, the resin molded body portion of the light emitting device is reinforced by the leads, so that the mechanical strength of the light emitting device increases. However, as the number of leads (exposed portions) exposed from the side surface of the resin molded body increases, cracks or splits may be more likely to occur on the side surface (cut surface) of the resin molded body at the time of cutting when dividing into individual pieces.

  In order to solve this problem, in the light emitting device 100 according to the present embodiment, the first lead 11 arranged in the vicinity of the first corner portion 41 has one of two side surfaces sharing the first corner portion 41. Although it has an exposed portion on the side surface side, it is not exposed from the other side surface. Similarly, the second lead 12 arranged near the second corner portion 42 has an exposed portion on one side surface side of the two side surfaces sharing the second corner portion 42, but the other side surface. Not exposed. In other words, the first lead 11 and the second lead 12 are each connected to the hanging pin by one extension part 14, and the cut surface of one extension part provided in each of the first lead and the second lead. Are exposed near the corners of the side surface of the resin molded body as the first exposed portion and the second exposed portion. With such a configuration, it is possible to reduce the load applied to the corners when cutting the hanging pin, suppress cracking, breakage, and peeling of the resin molded body 31, and obtain a highly reliable light emitting device.

  Specifically, the resin molded body 31 having a rectangular shape when viewed from above is diced from two directions, the X direction and the Y direction, at the time of individualization. Since the corner portion is a point where these two directions intersect, the load applied to the resin molded body during dicing is highest at the corner portion. In particular, when the stretched portions stretched from the same lead are arranged so as to sandwich the corner at a position close to the corner, the load applied to the lead at the time of dicing on one side surface, the stretch on the other side surface sandwiching the corner portion. It is considered that a stress is applied to the corners of the resin molded body so as to peel off the resin at the corners of the resin molded body. In particular, as the size of the light emitting device is reduced, the position of the extending portion connected to the hanging pin is closer to the corner portion, and thus the load applied to the resin at the corner portion increases. According to the light emitting device of the present embodiment, it is possible to suppress cracking, breakage, and peeling of the resin molded body while reducing the size of the light emitting device.

  In the light emitting device 100 as shown in FIGS. 1 to 3, it is preferable to perform dicing in the Y direction first and then in the X direction at the time of individualization. Usually, after cutting in one direction, the force for fixing the resin molded body is weakened, so that the resin molded body moves when cutting in the other direction, and it is considered that an extra load is applied. . When attempting to cut the connecting portion near the corner in such an unstable state, it is considered that a more excessive load is applied to the resin molded body and cracks and breaks are more likely to occur. For this reason, it is preferable to cut the connecting portion near the corner first.

  As shown in FIG. 2 and FIG. 4A, the third lead 13 on which the first light emitting element 21 and the second light emitting element 22 are mounted has the resin molded body 31 approximately at the center of the resin molded body 31 in a top view. It is arranged to run vertically. The first and second light emitting elements are arranged in a line in one direction on the third lead. In the light emitting device 100, three light emitting elements including the third light emitting element are arranged in a line on the third lead.

Further, the third lead is provided with third exposed portions 53 which are respectively exposed from the side surfaces of the resin molded body 31 which are opposed to each other in the arrangement direction of the first and second light emitting elements. The third exposed portion is formed by cutting the extending portion for connecting the third lead to the suspending pin when dividing the individual leads. The third lead is a lead on which a plurality of light emitting elements are mounted in a line, and is arranged at a substantially central portion of the resin molded body in a top view. For this reason, the third exposed portion is formed on the side surface of the resin molded body including the third exposed portion, at a substantially central portion of the side surface of the resin molded body.
In the light emitting device 100 according to the present embodiment, the third exposed portions 53 are exposed from the opposite side surfaces in the arrangement direction of the plurality of light emitting elements. In other words, the third lead is arranged through the resin molded body 31 so as to vertically cut the resin molded body 31 between the side surfaces facing each other in the arrangement direction of the light emitting elements. Thereby, the mechanical strength of the light emitting device itself can be improved.

  The third exposed portion forms the outer side surface of the light emitting device 100, similarly to the first and second exposed portions. Similar to the first and second exposed portions, the cut surface of the lead does not protrude from the side surface of the resin molded body, so that the light emitting device can be downsized and at the same time, the failure in damage of the light emitting device during the manufacturing process can be suppressed. .

  In the light emitting device 100 according to the present embodiment, the first exposed portion 51 and the second exposed portion 52 are arranged on a side surface different from the side surface including the third exposed portion 53. With such an arrangement, in the connected lead frames 10, the hanging pins between the third leads can be omitted between the adjacent unit regions 101 to shorten the distance between the adjacent unit regions 101. It is possible to increase the number of lead frames per lead frame.

  Like the light emitting device according to the present embodiment, a light emitting device that individually drives a first light emitting element and a second light emitting element having a pair of positive and negative electrodes is a first light emitting element 21 and a second light emitting element. Each of the first lead 11 and the second lead 12 electrically connected to the second lead 22 may include two sheets (a pair of positive and negative). Further, one of the two first leads of the pair that is electrically connected to the first light emitting element 21 can be integrated with the third lead.

In the light emitting device 100 according to the present embodiment, as shown in FIGS. 4A and 4B, the third lead 13 is formed in an inverted L shape in a top view, and is a direction perpendicular to the array direction of the light emitting elements in a top view. Has a portion arranged at. The lower surface of this portion can be exposed from the resin molded body to function as an external connection terminal of the light emitting device for driving the first light emitting element 21. Further, the third lead includes a plurality of lower surface exposed portions 55 exposed from the lower surface of the resin molded body 31. As shown in FIG. 5, in the light emitting device 100, the third lead includes two lower surface exposed portions 55. The two lower surface exposed portions 55 are a heat radiation portion that exposes a region directly below the light emitting element mounted on the third lead from the lower surface of the resin molded body 31, and an external connection terminal for driving the first light emitting element. Are exposed separately from the lower surface of the resin molded body.
When the third lead arranged so as to penetrate the resin molded body is integrated with the first lead and has a large upper area, by providing a plurality of lower surface exposed portions exposed from the lower surface of the resin molded body, By separating the exposed parts from each other, the flow of the resin material injected into the mold during resin molding becomes smoother than in the case of having one continuous exposed part, and the resin material is flowed to every corner in the mold. It will be easier. Therefore, molding defects of the resin molded body during the manufacturing process can be reduced. Furthermore, since the area where the leads and the resin molded body contact each other increases, the fixing force between the leads and the resin molded body can be increased. From the same viewpoint, the exposed lower surface portion (heat dissipation portion) immediately below the light emitting device may be further separated and separated.

  The light emitting device 100 according to the present embodiment includes upper and lower electrode type light emitting elements as the first light emitting element 21. The upper electrode of the first light emitting element 21 and the first lead 11 are connected by a wire, but the lower electrode of the first light emitting element 21 and the third lead 13 are electrically connected by using a conductive paste as a joining member. Connected. As described above, when the first light emitting element is the upper and lower electrode type light emitting element, the electrical connection to the lower electrode of the first light emitting element is facilitated, and thus the third lead is reversed as described above. It is preferably L-shaped. Although the drawing shows an inverted L-shape, it goes without saying that the same effect can be obtained with an L-shape.

  When the first light emitting element has positive and negative electrode pairs on the same surface side (upper surface), the first light emitting element and the first lead are connected by wires. In this case, two first leads separated from the third lead may be provided, or a first lead integrated with the third lead and a first lead separate from the third lead may be provided. The first lead integrated with the third lead can be easily formed by forming the third lead into an L-shape or an inverted L-shape as described above.

  When the third lead has an L shape or an inverted L shape in a top view, the third lead may further include a fourth exposed portion 54 exposed from a side surface different from the side surface including the third exposed portion. In this case, in the connected lead frame state, the third lead is connected to the hanging pin at the three extending portions. Since the third lead having a large upper area is connected and fixed to the hanging pin in three directions, the positional accuracy of the third lead 13 when the resin molded body 30 is integrally molded with the connected lead frame 10 is improved. It is possible to increase the mass productivity. Further, since the positional accuracy of the third lead is increased, the positional accuracy of the light emitting element when mounting the light emitting element on the third lead is also improved, that is, the light distribution as the light emitting device can be stabilized. At this time, the extending parts extending from the third lead are arranged so as to sandwich the corners. However, in the light emitting device 100 according to the embodiment, the third exposed part is the resin molded body including the third exposed part. Since it is arranged in the substantially central portion of the side surface, the burden on the corners is minimized.

(Wire)
The light emitting device 100 according to the first embodiment includes a wire that connects the light emitting element and the lead. A pair of electrodes formed on the light emitting device is electrically connected to the lead by a wire for supplying power to the light emitting device. The material and diameter of the wire are not particularly limited, and those normally used in the field can be used. In particular, it is preferable that it has good ohmic contact with the electrode of the light emitting element, good mechanical bondability, and good electrical conductivity and thermal conductivity.

  As the wire, for example, a wire made of a metal such as gold, silver, copper, platinum, aluminum, or an alloy thereof, a wire coated with silver or a silver alloy, or the like can be used. Among them, when selecting a material having high reflectance, silver, copper, lead, aluminum, platinum or alloys thereof are preferable, and silver or silver alloy is more preferable. The diameter of the wire is not particularly limited, but may be about 10 μm to 70 μm. It is preferably about 15 to 50 μm, more preferably about 18 to 30 μm.

(Sealing resin)
In the light emitting device 100 according to the embodiment of the present invention, the resin molded body 31 has a recess for housing the light emitting element, and the sealing resin 61 is filled in the recess. The sealing resin is a member that seals a part of the light emitting element, the wire, and the lead to protect them from dust, smoke, moisture, external force, and the like. The material of the sealing resin is preferably a material having an insulating property and capable of transmitting the light emitted from the light emitting element (preferably a transmittance of 70% or more). Specific examples include an epoxy resin, a silicone resin, a silicone-modified resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, or a hybrid resin containing one or more of these resins. Among them, silicone resin or epoxy resin is preferable.

The sealing resin may contain a diffusing agent or a phosphor. The diffusing material diffuses light, and can reduce the directivity from the light emitting element and increase the viewing angle. The phosphor can convert the wavelength of light emitted from the light emitting element.
As the diffusing material, those known in the art can be used. Specifically, silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, Examples thereof include manganese oxide, glass, carbon black and the like.
As the phosphor, those known in the art can be used. Specifically, yttrium aluminum garnet (YAG) activated with cerium, lutetium aluminum garnet (LAG) activated with cerium, nitrogen-containing calcium aluminosilicate (CaO-activated with europium and / or chromium). Al ₂ O ₃ —SiO ₂ ), europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ), and the like.
In addition, you may use 2 or more types of sealing resin as needed.

(Production method)
The method for manufacturing a light emitting device according to the embodiment of the present invention includes the following steps.
(I) A lead frame in which a plurality of unit regions each including a first lead, a second lead, and a third lead are connected by suspension pins that connect the unit regions, and a resin molding integrally formed with the lead frame. The process of preparing the body.
In the lead frame prepared in this step and the resin molded body integrally molded with the lead frame, the first lead and the second lead included in each unit area are the resin after being singulated in a top view. It is arranged so as to be arranged near the corners of the molded body. Further, each of the first lead and the second lead is connected to the hanging pin by one extending portion.
(Ii) A step of mounting the first and second light emitting elements on the upper surface of the third lead.
(Iii) A step of connecting the first light emitting element and the first lead, and the second light emitting element and the second lead by wires.
(Iv) A step of dividing the resin molded body into unit areas.
As a result, it is possible to suppress cracks and breaks in the resin molded body during individualization, and it is possible to obtain a highly reliable light emitting device.

[Light emitting device 200 according to the second embodiment of the present invention]
In the light emitting device 200 according to the second embodiment of the present invention, as shown in FIGS. 6 and 7, the first exposed portion and the second exposed portion have the third exposed portion on the side surface of the resin molded body. It is located on the same side as the side that it is equipped with. Further, the light emitting device 200 includes two third exposed portions, but one of the third exposed portions is arranged in the vicinity of a corner portion of the side surface of the resin molded body, not in the substantially central portion.

The light emitting device 200 of the second embodiment is different from the light emitting device 100 in that the number of extending portions connected to the hanging pins is smaller than that of the light emitting device 100 and that the fourth exposed portion is not included. Further, in the light emitting device 200, one of the third exposed portions is arranged near the corner of the side surface of the resin molded body. In other words, the extending portions are arranged at both ends of the inverted L shape. By such arrangement of the extending portions, the positional accuracy of the third lead formed in the inverted L shape is maintained.
Further, in the light emitting device 200 provided in each unit area of the lead frame 10, by reducing the number of extending portions, the flow of the resin material injected into the mold during resin molding becomes smoother, and the mold becomes easier. It becomes easy to flow to every corner inside, and it is possible to further reduce molding defects of the resin molded body during the manufacturing process.

  The embodiments have been described above, but these descriptions are examples and do not limit the configurations described in the claims.

  The light emitting device according to the embodiment of the present invention is applied to various illumination devices such as a light source for illumination, an LED display, a backlight light source such as a mobile phone, a traffic light, a lighting switch, an in-vehicle light source, an amusement, various sensors and various indicators. Can be used.

100, 200 Light emitting device 101, 201 Unit area 10, 70 Lead frame 11, 71 First lead 12, 72 Second lead 13, 73 Third lead 14 Extension part 15 Hanging pin 21 First light emitting element 22 Second light emission Element 23 Third light emitting element 30, 31 Resin molded body 32 Recessed portion 41 First corner portion 42 Second corner portion 51 First exposed portion 52 Second exposed portion 53 Third exposed portion 54 Fourth exposed portion 55 Lower exposed portion 61 Sealing resin

Claims (9)

With reed,
First and second light emitting elements,
A light emitting device having a recess for accommodating the first and second light emitting elements and including a resin molded body that is integrally molded with the lead and has a substantially rectangular shape in a top view,
Said lead, said a first light emitting element and the first lead that will be connected by wires, the second and the two second leads connected respectively emitting element and the wire, the first and second light emitting element Including a third lead for mounting
The first lead, the two second leads, and the third lead are arranged near the four corners of the rectangular resin molded body,
The first lead is disposed in the vicinity of the first corner portion of the resin molded body in a top view, and is provided on a portion of one side surface of the two side surfaces sharing the first corner portion, the portion facing the first lead. A first exposed portion exposing the first lead from the side surface, and the first lead, the two second leads and the third lead are exposed on a portion of the other side surface facing the first lead. Without an exposed part,
The third lead is provided with a heat radiating portion of the lower surface or et dew out of the resin molded body, heat dissipating unit is a light emitting device positioned immediately below the first and second light emitting elements. The second lead is disposed on the second corner adjacent the molded resin in a top view, one of the second lead of the two sides of the resin molded body that shares the second corner A second exposed portion exposing the second lead from the side surface, and a portion of the other side surface facing the second lead, the first lead, the two second leads, and the second lead portion. The light emitting device according to claim 1, wherein the light emitting device does not include an exposed portion where the three leads are exposed.   The light emitting device according to claim 1, wherein the third lead includes third exposed portions that are exposed from opposite side surfaces of the side surfaces of the resin molded body.   The light emitting device according to claim 1, wherein the first exposed portion is arranged on a side surface of the resin molded body that is different from a side surface including the third exposed portion.   The light emitting device according to claim 1, wherein the first exposed portion is arranged on a side surface of the resin molded body that is provided with the third exposed portion.   The third lead includes the third exposed portion at a substantially central portion of a side surface of the resin molded body, and further includes a fourth exposed portion exposed from a side surface different from a side surface on which the third exposed portion is exposed. The light-emitting device according to any one of 1 to 5. The third lead is exposed from the lower surface of the resin molded body and includes an external connection terminal for driving the first light emitting element,
The light emitting device according to claim 1, wherein the external connection terminal and the heat dissipation portion are separated from each other and are exposed from a lower surface of the resin molded body.   The light emitting device according to claim 1, wherein the first and second light emitting elements are light emitting elements having different emission wavelengths. The light emitting device according to claim 1, wherein the third lead has an L shape or an inverted L shape in a top view.

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