JP6678345B2 - Convex stamper and molding method using the same - Google Patents

Convex stamper and molding method using the same Download PDF

Info

Publication number
JP6678345B2
JP6678345B2 JP2016210105A JP2016210105A JP6678345B2 JP 6678345 B2 JP6678345 B2 JP 6678345B2 JP 2016210105 A JP2016210105 A JP 2016210105A JP 2016210105 A JP2016210105 A JP 2016210105A JP 6678345 B2 JP6678345 B2 JP 6678345B2
Authority
JP
Japan
Prior art keywords
mold
core
resin material
stamper
electrodeposition layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016210105A
Other languages
Japanese (ja)
Other versions
JP2018069506A (en
Inventor
晋二 角陸
晋二 角陸
龍馬 村瀬
龍馬 村瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2016210105A priority Critical patent/JP6678345B2/en
Publication of JP2018069506A publication Critical patent/JP2018069506A/en
Application granted granted Critical
Publication of JP6678345B2 publication Critical patent/JP6678345B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Description

本発明は射出成形装置で使用するスタンパに関するものである。   The present invention relates to a stamper used in an injection molding device.

成形される成形品の厚さ方向に型開き可能な第1金型と第2金型にて形成されるキャビティに、樹脂材が射出されて前記成形品を成形する成形装置において、表面に凹凸が形成されたスタンパを前記第2金型に装着して、前記スタンパの凹凸を前記キャビティに注入された樹脂材に転写することが行われている。成形品の具体例としては、プリズムの凹凸が形成された導光板、情報を記録した凹凸が形成された光ディスクを挙げることができる。   In a molding apparatus for molding a molded article by injecting a resin material into a cavity formed by a first mold and a second mold that can be opened in a thickness direction of the molded article to be molded, the surface of the molded article has irregularities. Is mounted on the second mold, and the irregularities of the stamper are transferred to the resin material injected into the cavity. Specific examples of the molded article include a light guide plate on which irregularities of a prism are formed, and an optical disk on which irregularities on which information is recorded are formed.

特許文献1には、光ディスク成形装置が開示されている。一般的なスタンパは、前記成形品の仕上がり厚さ以上の厚肉のNi膜を、金型原盤の表面に電鋳処理によって形成し、これを機械加工した後に金型原盤から離型して、金型入れ子になるスタンパが作成されている。   Patent Document 1 discloses an optical disk molding device. A general stamper forms a thick Ni film having a thickness equal to or greater than the finished thickness of the molded product on the surface of the mold master by electroforming, and after machining the mold, releases the mold from the mold master. A stamper to be nested in the mold has been created.

特開平10−302328号公報JP-A-10-302328

このスタンパの作成は、導光板の作成に使用するスタンパも同じである。図8(a)〜(d)は、導光板の作成に使用するスタンパ1の一般的な製造工程を示す。   This stamper is manufactured in the same manner as the stamper used for manufacturing the light guide plate. FIGS. 8A to 8D show a general manufacturing process of the stamper 1 used for producing the light guide plate.

図8(a)は金型原盤5の断面を示している。金型原盤5の凹部の内面6に微小凹凸(図示せず)が形成されている。   FIG. 8A shows a cross section of the mold master 5. Fine irregularities (not shown) are formed on the inner surface 6 of the concave portion of the mold master 5.

図8(b)では、金型原盤5の表面にNi膜の厚肉の電着層23を電鋳処理によって作成する。成形品の仕上がり厚さが10mmの場合には、電着層23の肉厚としては12mm程度以上の形成が必要であって、この厚肉の電鋳処理には120日程度の多大な時間を必要とする。   In FIG. 8B, a thick electrodeposited layer 23 of a Ni film is formed on the surface of the mold master 5 by electroforming. When the finished thickness of the molded product is 10 mm, it is necessary to form the electrodeposited layer 23 with a thickness of about 12 mm or more, and the electroforming process of this thick wall requires a long time of about 120 days. I need.

図8(c)では、金型原盤5の上面5Aの電着層23だけを機械加工で除去する。   In FIG. 8C, only the electrodeposition layer 23 on the upper surface 5A of the mold master 5 is removed by machining.

図8(d)では、金型原盤5の凹部6に残った厚肉の電着層23の塊を金型原盤5から離型してスタンパ1Bが完成する。   In FIG. 8D, the mass of the thick electrodeposition layer 23 remaining in the concave portion 6 of the mold master 5 is released from the mold master 5 to complete the stamper 1B.

図9はこのスタンパ1Bを第2金型12にセットした成形装置を示す。   FIG. 9 shows a molding apparatus in which the stamper 1B is set in the second mold 12.

第1金型11と第2金型12との間にキャビティ13が形成されている。図10はこの成形装置を運転して得られる成形品17の大まかな外観を示している。導光板の成形品17は、中央が外周よりも突出した帽子形の凸形状であって、内面17Aにプリズム用の微小凹凸(図示せず)が転写される。   A cavity 13 is formed between the first mold 11 and the second mold 12. FIG. 10 shows a rough appearance of a molded article 17 obtained by operating this molding apparatus. The molded product 17 of the light guide plate has a hat-shaped convex shape in which the center protrudes from the outer periphery, and minute irregularities (not shown) for a prism are transferred to the inner surface 17A.

しかし、成形運転を30000ショット程度繰り返すと、スタンパ1Bと第2金型12との接触面での摩擦が原因で発生したと思われる粉体がスタンパ1Bと第2金型12の間で移動し、その粉体をスタンパ1Bと第2金型12との間に挟みこんだ状態でスタンパ1Bに成形圧力が加わることにより、スタンパ1Bが部分的に膨れ上がり、スタンパ1B上にバンプと呼ばれる凸形状が発生し、成形品17にその凸形状が転写する成形不良が発生する。そのため、所定回数の成形毎にスタンパ1Bが必要である。   However, when the molding operation is repeated for about 30,000 shots, powder which seems to be generated due to friction at the contact surface between the stamper 1B and the second mold 12 moves between the stamper 1B and the second mold 12. When the molding pressure is applied to the stamper 1B while the powder is sandwiched between the stamper 1B and the second mold 12, the stamper 1B partially swells, and a convex shape called a bump is formed on the stamper 1B. Is generated, and a molding defect in which the convex shape is transferred to the molded product 17 occurs. Therefore, the stamper 1B is required for every predetermined number of moldings.

本発明は、厚肉の電鋳処理が不要で短時間に作成でき、しかも長寿命のスタンパを提供することを目的とする。   An object of the present invention is to provide a stamper which can be produced in a short time without requiring a thick electroforming process and has a long life.

本発明の凸形スタンパは、中央が外周よりも突出した形状の熱伝導性のコアと、表面に凹凸形状が形成され前記コアの表面に配置された電着層とを設け、前記電着層の外周が前記コアに固定されていることを特徴とする。   The convex stamper according to the present invention is provided with a heat conductive core having a shape in which the center protrudes from the outer periphery, and an electrodeposition layer having an uneven surface formed on the surface and disposed on the surface of the core. Is fixed to the core.

また、本発明の成形方法は、成形される成形品の厚さ方向に型開き可能な第1金型と第2金型にて形成されるキャビティに、樹脂材を射出して成形するに際し、中央が外周よりも突出した形状の熱伝導性のコアの前記第1金型の側の表面に、転写すべき凹凸形状が形成され外周が前記コアの下部に固定された電着層を配置した凸形スタンパを前記第2金型に装着し、第1金型と第2金型を型閉めして前記キャビティに前記凸形スタンパを挿入し、第1金型の凹部と前記凸形スタンパの前記電着層の間に溶融した前記樹脂材を射出して前記キャビティの内部圧力が高くなるまでの期間には、前記樹脂材の熱によって前記電着層が膨張して前記コアと前記電着層の間に隙間を発生させ、前記樹脂材を射出して前記キャビティの内部圧力が高くなる期間には、前記電着層が射出中の前記樹脂材によって押圧されて前記隙間が小さくなって前記樹脂材の熱が前記コアを介して放熱させることを特徴とする。   Further, the molding method of the present invention is characterized in that a resin material is injected into a cavity formed by a first mold and a second mold that can be opened in a thickness direction of a molded product to be molded. An electrodeposition layer in which a concave / convex shape to be transferred is formed and the outer periphery is fixed to a lower portion of the core is disposed on a surface of the heat conductive core having a shape in which the center protrudes from the outer periphery on the first mold side. A convex stamper is mounted on the second mold, the first mold and the second mold are closed, and the convex stamper is inserted into the cavity. During the period from injecting the molten resin material between the electrodeposition layers and increasing the internal pressure of the cavity, the heat of the resin material causes the electrodeposition layer to expand and the core and the electrodeposition layer to expand. A gap is generated between the layers, and the resin material is injected to increase the internal pressure of the cavity. Between the heat of the resin material becomes smaller pressed by the gap the electrodeposited layer by the resin material during the injection, characterized in that the dissipating through the core.

この構成によると、本発明の凸形スタンパは、コアと電着層との2層構造であるため、電着層は薄肉で済み、従来のような厚肉の電鋳が必要なスタンパに比べて短時間で作成できる構造である。   According to this configuration, since the convex stamper of the present invention has a two-layer structure of the core and the electrodeposition layer, the electrodeposition layer can be made thinner, and compared with a conventional stamper that requires thick electroforming. And can be created in a short time.

さらに、前記電着層の外周がコアの下部に接続されている。成形装置のキャビティの内部圧力が高くなるまでの射出の初期には、樹脂材の熱によって電着層が膨張してコアと電着層の間に隙間が発生する。この隙間が断熱層として作用するため、前記樹脂材の温度低下が低減されて前記キャビティの末端にまで迅速に前記樹脂材が拡がる。   Further, the outer periphery of the electrodeposition layer is connected to a lower portion of the core. In the initial stage of injection until the internal pressure of the cavity of the molding device becomes high, the electrodeposited layer expands due to the heat of the resin material, and a gap is generated between the core and the electrodeposited layer. Since this gap acts as a heat insulating layer, the temperature drop of the resin material is reduced, and the resin material quickly spreads to the end of the cavity.

前記キャビティの前記樹脂材の内圧が高くなる前記射出の後期には、前記電着層が射出中の前記樹脂材によって押圧されて前記隙間が小さくなって前記樹脂材の熱が前記コアを介して放熱されて、前記電着層に記録されている凹凸形状が正確に転写できて転写率が向上する。   In the latter stage of the injection in which the internal pressure of the resin material in the cavity is increased, the electrodeposition layer is pressed by the resin material being injected, the gap is reduced, and the heat of the resin material passes through the core. The heat is dissipated, and the irregularities recorded on the electrodeposited layer can be accurately transferred, and the transfer rate is improved.

本発明の実施の形態のスタンパの(a)斜視図と(b)断面図(A) Perspective view and (b) sectional view of a stamper according to an embodiment of the present invention. (a)同スタンパの底面図および(b)別の実施の形態のスタンパの底面図(A) A bottom view of the stamper and (b) a bottom view of a stamper of another embodiment. (a)〜(f)同スタンパの製造工程図(A)-(f) Manufacturing process diagram of the stamper (a)(b)要部の拡大図(A) (b) Enlarged view of main parts 同スタンパを装着した成形装置の断面図Sectional view of a molding machine equipped with the stamper (a)〜(c)成形装置の成形工程図(A)-(c) Molding process diagram of molding device (a)実施例の転写状態を示す拡大断面図と(b)比較例の転写状態を示す拡大断面図(A) An enlarged sectional view showing a transfer state of an example and (b) an enlarged sectional view showing a transfer state of a comparative example. (a)〜(d)従来のスタンパの製造工程図(A) to (d) Manufacturing process diagrams of a conventional stamper 従来のスタンパを装着した成形装置の断面図Sectional view of a molding device equipped with a conventional stamper 成形品の斜視図Perspective view of molded product

以下、本発明の実施の形態を図1〜図7に基づいて説明する。   Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

(実施の形態1)
図1(a)(b)は本発明のスタンパ1を示す。ここでは、図10に示した凸形状の導光板の作成に使用するスタンパを示している。光学用部品の一例が導光板である。
(Embodiment 1)
1A and 1B show a stamper 1 according to the present invention. Here, a stamper used to create the convex light guide plate shown in FIG. 10 is shown. One example of the optical component is a light guide plate.

コア2の表面に電着層3が配置され、電着層3の端はコア2の下部の例えば図2(a)に示したように底部で全周がコア2に接続して固定されている。コア2は、例えば鋼材製で、例えばステンレス鋼である。電着層3は、例えばNi膜である。電着層3は0.5〜2.0mm程度の薄肉である。電着層3とコア2との接続固定の具体例としては、溶接を挙げることができる。図1(b)と図2(a)における符号4が電着層3とコア2との接合部を示す。   The electrodeposition layer 3 is disposed on the surface of the core 2, and the entire periphery of the end of the electrodeposition layer 3 is connected to the core 2 at the bottom as shown in FIG. I have. The core 2 is made of, for example, a steel material, and is, for example, stainless steel. The electrodeposition layer 3 is, for example, a Ni film. The electrodeposition layer 3 is as thin as about 0.5 to 2.0 mm. As a specific example of the connection and fixing between the electrodeposition layer 3 and the core 2, welding can be given. Reference numeral 4 in FIG. 1B and FIG. 2A indicates a joint between the electrodeposition layer 3 and the core 2.

図3(a)〜(f)はスタンパ1の製造工程を示す。   FIGS. 3A to 3F show a manufacturing process of the stamper 1.

図3(a)は金型原盤5の断面を示している。金型原盤5の材質は、鋼材またはアクリル樹脂(PMMAなど)である。金型原盤5の凹部6の内面に微小凹凸(図示せず)が形成されている。この微小凹凸は、例えばピッチ0.07mm,深さ0.007mmである。   FIG. 3A shows a cross section of the mold master 5. The material of the mold master 5 is a steel material or an acrylic resin (PMMA or the like). Fine irregularities (not shown) are formed on the inner surface of the concave portion 6 of the mold master 5. The fine irregularities have, for example, a pitch of 0.07 mm and a depth of 0.007 mm.

図3(b)では、金型原盤5の表面に1.1mmの薄肉の電着層3Aを、金型原盤5の材質が鋼材製の場合には、電鋳処理によって作成する。金型原盤5の材質がアクリル樹脂製の場合には、電着層3を無電解メッキによって作成する。   In FIG. 3B, a 1.1 mm thin electrodeposited layer 3A is formed on the surface of the mold master 5 by electroforming when the material of the mold master 5 is steel. When the material of the mold master 5 is made of an acrylic resin, the electrodeposition layer 3 is formed by electroless plating.

図3(c)では、先ず、金型原盤5の上面5Aおよび凹部6に形成された電着層3Aの一部を除去して1.0mmの膜厚に機械加工して電着層3Bとする。さらに、凹部6にコア2を挿入して図3(d)のようにコア2を内面の電着層3Bに押し当てる。そして、コア2の底面2Aと電着層3Bとの境界7に開先8を形成する。図4(a)に拡大図を示す。   In FIG. 3C, first, a part of the electrodeposited layer 3A formed on the upper surface 5A of the mold master 5 and the concave portion 6 is removed and machined to a thickness of 1.0 mm to form an electrodeposited layer 3B. I do. Further, the core 2 is inserted into the concave portion 6, and the core 2 is pressed against the inner electrodeposition layer 3B as shown in FIG. Then, a groove 8 is formed at the boundary 7 between the bottom surface 2A of the core 2 and the electrodeposition layer 3B. FIG. 4A shows an enlarged view.

図3(e)では、電着層3の全周を開先8の部分でコア2に接合部4で溶接して、コア2の上面2Aの電着層3Bを除去する。図4(b)に拡大図を示す。   In FIG. 3E, the entire periphery of the electrodeposition layer 3 is welded to the core 2 at the groove 8 at the joint 4 to remove the electrodeposition layer 3B on the upper surface 2A of the core 2. FIG. 4B shows an enlarged view.

図3(f)では、金型原盤5の上面5Aに残った電着層3Bを除去し、金型原盤5の凹部6からスタンパ1を離型する。   In FIG. 3F, the electrodeposited layer 3B remaining on the upper surface 5A of the mold master 5 is removed, and the stamper 1 is released from the recess 6 of the mold master 5.

このスタンパ1を、図5に示すように第1金型11と第2金型12で構成される成形装置10の第2金型12に装着する。図6(a)は樹脂材15をキャビティ13に注入する前の状態を示す。ここではキャビティ13の中央に樹脂材15を入れるスプル14が、第1金型11に形成されている。   The stamper 1 is mounted on a second mold 12 of a molding apparatus 10 including a first mold 11 and a second mold 12 as shown in FIG. FIG. 6A shows a state before the resin material 15 is injected into the cavity 13. Here, a sprue 14 for putting a resin material 15 in the center of the cavity 13 is formed in the first mold 11.

第1金型11のスプル14からキャビティ13に270〜300℃の樹脂材15の注入を開始してキャビティ13の内部圧力が高くなるまでの期間には、図6(b)に示したように、高温の樹脂材15がスタンパ1の電着層3に接触することで電着層3が膨張する。   As shown in FIG. 6B, during the period from the start of the injection of the resin material 15 at 270 to 300 ° C. from the sprue 14 of the first mold 11 into the cavity 13 until the internal pressure of the cavity 13 increases. When the hot resin material 15 contacts the electrodeposited layer 3 of the stamper 1, the electrodeposited layer 3 expands.

この実施例では、電着層3の外周がコア2に接続固定されているため、電着層3が膨張するとコア2との間に隙間16が生じる。   In this embodiment, since the outer periphery of the electrodeposition layer 3 is fixedly connected to the core 2, a gap 16 is generated between the electrodeposition layer 3 and the core 2 when the electrodeposition layer 3 expands.

そして、前記射出の後期に近付いてキャビティ13の内圧が50MPa〜1000MPaに高くなってくると、樹脂材15の圧力によって隙間16の厚さが小さくなって、遂には、図6(c)に示したように電着層3の全部がコア2に密着する。これによって樹脂材15の熱がコア2に放熱されて温度が低下する。樹脂材15が固化した後に型開きすることによって成形品17を得ることができる。   Then, when the internal pressure of the cavity 13 increases to 50 MPa to 1000 MPa as approaching the latter stage of the injection, the thickness of the gap 16 decreases due to the pressure of the resin material 15, and finally, as shown in FIG. As described above, the entire electrodeposition layer 3 is in close contact with the core 2. As a result, the heat of the resin material 15 is radiated to the core 2 to lower the temperature. The molded article 17 can be obtained by opening the mold after the resin material 15 is solidified.

この成形工程において、樹脂材15の射出を開始した直後に電着層3が膨張して隙間16が生じるため、樹脂材15の射出によって発生するスタンパ1と第2金型12との間の擦れを低減でき、成形運転を30000ショット程度繰り返し実施しても、スタンパ1と第2金型12との接触面での摩擦が原因で発生する粉体の発生が、従来のスタンパ1Bを使用した場合と比べて極端に少なく、長期間にわたって成形運転を繰り返し実施できる。そのため、単一のスタンパ1を長期間にわたって繰り返し使用でき、スタンパ1の交換回数を低減できる。   In this molding step, the electrodeposition layer 3 expands immediately after the injection of the resin material 15 is started to form a gap 16, so that the friction between the stamper 1 and the second mold 12 generated by the injection of the resin material 15 is caused. Even when the molding operation is repeated about 30,000 shots, powder generated due to friction at the contact surface between the stamper 1 and the second mold 12 is generated using the conventional stamper 1B. And the molding operation can be repeatedly performed over a long period of time. Therefore, the single stamper 1 can be used repeatedly over a long period of time, and the number of times of replacement of the stamper 1 can be reduced.

また、スタンパ1の作成の際の電着層3の膜厚が1mm程度と、薄肉であるため、従来のように厚肉の電着層23の形成が必要なものに比べて短時間で作成できる。   Further, since the thickness of the electrodeposited layer 3 at the time of forming the stamper 1 is as thin as about 1 mm, the electrodeposited layer 3 is formed in a shorter time as compared with the conventional one requiring the formation of the thick electrodeposited layer 23. it can.

また、溶融樹脂の注入の途中に生じた隙間16が断熱層として作用するため、樹脂材15の熱がコア2へ伝わる放熱が低減される。これによって温度低下が少ない樹脂材15は、高温度を維持した状態でキャビティ13の末端に向かって迅速に拡がり、樹脂材15の射出の後期に、樹脂内圧が高圧になることにより電着層3がコア2に密着して、電着層3の表面に形成されている微小凹凸が正確に成形中の成形品17に接触し、この状態で樹脂材15の熱が電着層3を介してコア2に迅速に放熱されて樹脂材15の温度が急激に低下して硬化する。   In addition, since the gap 16 generated during the injection of the molten resin acts as a heat insulating layer, the heat radiation of the heat of the resin material 15 transmitted to the core 2 is reduced. As a result, the resin material 15 having a small temperature drop spreads rapidly toward the end of the cavity 13 while maintaining the high temperature, and the resin internal pressure becomes high at a later stage of the injection of the resin material 15 so that the electrodeposition layer 3 is increased. Closely adheres to the core 2, and the minute irregularities formed on the surface of the electrodeposition layer 3 accurately contact the molded article 17 being formed. In this state, the heat of the resin material 15 is transferred through the electrodeposition layer 3. The heat is quickly radiated to the core 2 and the temperature of the resin material 15 is rapidly lowered and hardened.

図7(a)は実施例の転写結果を示す。得られた成形品17には微小凹凸のプリズム18を正確に転写できた。ここではプリズム18の一方の角度が50°もう一方の角度が80°であった。成形品17の端面17Bからの入射光P1は、成形品17の内部を導光され、プリズム18で反射して成形品17の外周面17Cから出射光P2が出射する。   FIG. 7A shows the transfer result of the example. The prism 18 having minute irregularities could be accurately transferred to the obtained molded article 17. Here, one angle of the prism 18 was 50 ° and the other angle was 80 °. The incident light P1 from the end face 17B of the molded product 17 is guided inside the molded product 17, reflected by the prism 18, and emitted light P2 is emitted from the outer peripheral surface 17C of the molded product 17.

図7(b)は比較例の転写状態を示す。この比較例は、樹脂材の射出開始の直後からコア2に放熱させた場合の転写結果を示しており、図示した50°,80°に転写されるべき角部19,20の転写状態が実線で示す角部19B,20Bのように緩やかになる転写不良が発生した。このような転写不良が発生した場合には、成形品17の外周面17Cからの正常な出射光P2を期待できない。   FIG. 7B shows a transfer state of the comparative example. This comparative example shows a transfer result when heat is radiated to the core 2 immediately after the start of injection of the resin material, and the transfer state of the corners 19 and 20 to be transferred at 50 ° and 80 ° shown in the drawing is a solid line. As shown by the corners 19B and 20B shown in FIG. When such transfer failure occurs, normal emission light P2 from the outer peripheral surface 17C of the molded product 17 cannot be expected.

なお、上記の実施の形態では電着層3の全周を、図2(a)のようにコア2に固定したが、図2(b)のように電着層3の外周の複数個所を均一なピッチでコア2の下部の例えば底部に接続固定することによっても同様の効果を期待できる。   In the above embodiment, the entire circumference of the electrodeposition layer 3 is fixed to the core 2 as shown in FIG. 2A, but a plurality of locations on the outer circumference of the electrodeposition layer 3 are fixed as shown in FIG. Similar effects can be expected by connecting and fixing the lower part of the core 2 at a uniform pitch, for example, at the bottom.

なお、上記の実施の形態では電着層3の全周を、図2(a)のようにコア2の下部の底部に溶接によって固定したが、電着層3の外周の複数個所を、図2(b)のように溶接による接合によって固定しても同様の効果を期待できる。   In the above-described embodiment, the entire circumference of the electrodeposition layer 3 is fixed to the bottom of the lower part of the core 2 by welding as shown in FIG. 2 (a). The same effect can be expected even if it is fixed by welding as shown in FIG.

なお、上記の各実施の形態では電着層3とコア2とを溶接による接合部4で接続固定したが、電着層3とコア2との電着による接合、または電着層3とコア2との接着剤による接合、または電着層3をネジによってコア2にねじ留めすることによって、電着層3とコア2とを接続固定して実施することもできる。   In each of the above embodiments, the electrodeposition layer 3 and the core 2 are connected and fixed at the joint 4 by welding. However, the electrodeposition layer 3 and the core 2 are bonded by electrodeposition, or the electrodeposition layer 3 and the core 2 are connected to each other. Alternatively, the electrodeposition layer 3 and the core 2 may be connected and fixed by bonding with an adhesive to the core 2 or screwing the electrodeposition layer 3 to the core 2 with a screw.

上記の実施の形態のコア2は、第1金型11の側のコア2の表面が、外周から中央に向かって次第に高くなる単一の凸形状であったが、複数の凸部を有する形状、または単数または複数の凸部とその一部に平面を有する凸形状であっても同様である。   The core 2 of the above embodiment has a single convex shape in which the surface of the core 2 on the side of the first mold 11 gradually increases from the outer periphery toward the center, but has a plurality of convex portions. The same applies to a convex shape having a single or a plurality of convex portions and a flat surface in a part thereof.

本発明は微小凹凸形状を高精度に転写することが必要な成形装置の高性能化に寄与する。   The present invention contributes to the high performance of a molding apparatus that needs to transfer a fine uneven shape with high accuracy.

1 スタンパ
2 コア
3 電着層
4 接合部
5 金型原盤
6 金型原盤の凹部
8 開先
10 成形装置
11 第1金型
12 第2金型
13 キャビティ
14 スプル
15 樹脂材
16 隙間
17 成形品
17A 成形品の内面
17B 成形品の端面
17C 成形品の外周面
18 プリズム
P1 入射光
P2 出射光
REFERENCE SIGNS LIST 1 stamper 2 core 3 electrodeposition layer 4 bonding portion 5 mold master 6 recess of mold master 8 groove 10 forming device 11 first mold 12 second mold 13 cavity 14 sprue 15 resin material 16 gap 17 molded product 17A Inner surface of molded product 17B End surface of molded product 17C Outer peripheral surface of molded product 18 Prism P1 Incident light P2 Emitted light

Claims (5)

中央が外周よりも突出した形状の熱伝導性のコアと、
表面に凹凸形状が形成され前記コアの表面に配置された電着層とを設け、前記電着層の外周が前記コアに固定されている、
凸形スタンパ。
A heat conductive core whose center is protruded from the outer periphery,
An electrodeposition layer disposed on the surface of the core, the surface having an uneven shape formed thereon, and the outer periphery of the electrodeposition layer is fixed to the core;
Convex stamper.
前記コアが鋼材製、前記電着層がNiである、
請求項1記載の凸形スタンパ。
The core is made of steel, and the electrodeposition layer is made of Ni;
The convex stamper according to claim 1.
電着層の全周または複数個所が前記コアの下部に固定されている、
請求項1記載の凸形スタンパ。
The entire circumference or a plurality of locations of the electrodeposition layer is fixed to the lower portion of the core,
The convex stamper according to claim 1.
成形される成形品の厚さ方向に型開き可能な第1金型と第2金型にて形成されるキャビティに、樹脂材を射出して成形するに際し、
中央が外周よりも突出した形状の熱伝導性のコアの前記第1金型の側の表面に、転写すべき凹凸形状が形成され外周が前記コアの下部に固定された電着層を配置した凸形スタンパを前記第2金型に装着し、
第1金型と第2金型を型閉めして前記キャビティに前記凸形スタンパを挿入し、
第1金型の凹部と前記凸形スタンパの前記電着層の間に溶融した前記樹脂材を射出して前記キャビティの内部圧力が高くなるまでの期間には、前記樹脂材の熱によって前記電着層が膨張して前記コアと前記電着層の間に隙間を発生させ、
前記樹脂材を射出して前記キャビティの内部圧力が高くなる期間には、前記電着層が射出中の前記樹脂材によって押圧されて前記隙間が小さくなって前記樹脂材の熱を、前記コアを介して放熱させる、
成形方法。
When a resin material is injected into a cavity formed by a first mold and a second mold that can be opened in the thickness direction of a molded product to be molded,
An electrodeposition layer in which a concave / convex shape to be transferred was formed and the outer periphery was fixed to a lower portion of the core was disposed on the surface of the heat conductive core having a shape in which the center protruded from the outer periphery on the first mold side. Attach a convex stamper to the second mold,
Closing the first mold and the second mold, inserting the convex stamper into the cavity,
During a period until the internal pressure of the cavity is increased by injecting the melted resin material between the concave portion of the first mold and the electrodeposited layer of the convex stamper, the heat of the resin material increases The adhesion layer expands to generate a gap between the core and the electrodeposition layer,
During the period when the internal pressure of the cavity is increased by injecting the resin material, the electrodeposition layer is pressed by the resin material during injection, the gap is reduced, and the heat of the resin material is reduced by the core. To dissipate heat,
Molding method.
成形される成形品の厚さ方向に型開き可能な第1金型と第2金型にて形成されるキャビティに、樹脂材を射出して成形する成形装置において、前記第2金型に請求項1記載のスタンパを装着した、成形装置。   In a molding apparatus for injecting a resin material into a cavity formed by a first mold and a second mold that can be opened in a thickness direction of a molded product to be molded, the second mold is charged. A molding apparatus equipped with the stamper according to item 1.
JP2016210105A 2016-10-27 2016-10-27 Convex stamper and molding method using the same Active JP6678345B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016210105A JP6678345B2 (en) 2016-10-27 2016-10-27 Convex stamper and molding method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016210105A JP6678345B2 (en) 2016-10-27 2016-10-27 Convex stamper and molding method using the same

Publications (2)

Publication Number Publication Date
JP2018069506A JP2018069506A (en) 2018-05-10
JP6678345B2 true JP6678345B2 (en) 2020-04-08

Family

ID=62112028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016210105A Active JP6678345B2 (en) 2016-10-27 2016-10-27 Convex stamper and molding method using the same

Country Status (1)

Country Link
JP (1) JP6678345B2 (en)

Also Published As

Publication number Publication date
JP2018069506A (en) 2018-05-10

Similar Documents

Publication Publication Date Title
JP6678345B2 (en) Convex stamper and molding method using the same
KR100634055B1 (en) Mold apparatus for forming optical disk substrate
TW200407882A (en) Intermediate for optical recording medium, mold, and molding machine and manufacturing method of optical recording medium
TW201332771A (en) Method of fabricating in-mold film and casing including such in-mold film
JP2008033997A (en) Disc substrate, forming die for the same, blu-ray disc (r) manufactured using disc substrate, and manufacturing method of blu-ray disc
JP2007237407A (en) Disk substrate molding method and blue lay disk
JP2006315260A (en) Disk substrate molding die, mirror surface plate of disk substrate molding die and disk
JPWO2004045822A1 (en) Mold for molding, molding method, disk substrate and molding machine
JP2020183121A (en) Mold, ejector structure thereof and manufacturing method of fan
JPH1128727A (en) Molding die, insert molding thereof, and molding method
JP2021130213A (en) Molding mold and molding method
JP3690740B2 (en) Stamper for optical disc
JP2014162012A (en) Microstructure molding method and microstructure molding die
JP2000263615A (en) Mold for optical information recording medium substrate
JP3042977B2 (en) Laminated disk, method of manufacturing the same, and disk forming apparatus
JPWO2006126435A1 (en) DISC MOLDING DIE, Mirror Surface Plate, AND METHOD FOR MANUFACTURING DISC MOLD
JP2001334534A (en) Method and apparatus for manufacturing heat insulating mold
JPH10323865A (en) Disk molding die
JP2006297639A (en) Stamper for molding optical disk substrate
JPH10302328A (en) Optical disk molding device, stamper disposed at optical disk molding device and optical disk molded by optical disk molding device
JP4098592B2 (en) Optical recording medium, molding die for optical recording medium, and substrate for optical recording medium
JP4083446B2 (en) Laminated optical recording medium
JP4093686B2 (en) Disc substrate molding die and molding apparatus
WO2005095082A1 (en) Disc molding die, mirror-surface plate and molded object
JP3074137B2 (en) Mold for disk substrate and disk substrate

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190314

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200303

R151 Written notification of patent or utility model registration

Ref document number: 6678345

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151