JP6676793B2 - Display device - Google Patents

Description

  Embodiments described herein relate generally to a display device.

  For example, a liquid crystal display panel is known as a display panel. 2. Description of the Related Art Liquid crystal display panels are used in the field of information equipment, mainly computers, and in the field of video equipment, mainly television receivers. Generally, a liquid crystal display panel has an array substrate, a counter substrate, and a liquid crystal layer sandwiched between these two substrates. The array substrate has an organic insulating film and the like.

  The array substrate and the counter substrate have a display area. For example, a plurality of columnar spacers are arranged between the array substrate and the counter substrate as a plurality of spacers, and a gap between the two substrates is kept constant. The array substrate and the opposing substrate are joined by a rectangular frame-shaped sealing material provided in a frame region outside a display region of both substrates.

JP 2001-337334 A

  By the way, the organic insulating film of the array substrate has a property of permeating moisture. Therefore, the organic insulating film outside the wiring in the frame region of the array substrate is removed over the entire circumference with a width of 200 to 300 μm, and the sealing material is formed in the removed region. Since the sealing material has a property of blocking moisture, it can block penetration of moisture into the wiring inside the liquid crystal display panel. Thereby, the concern that the wiring is corroded can be eliminated.

When the organic insulating film is removed as described above, narrowing of the frame is prevented. Therefore, in order to narrow the frame, it is conceivable to remove not the organic insulating film on the wiring in the frame region but the organic insulating film on the wiring in the frame region. However, in this case, the wiring in the frame region is exposed without being protected by the organic insulating film. For this reason, there is a high possibility that static electricity may enter the wiring and destroy peripheral circuits of the wiring. That is, the ESD (Electro Static Discharge) withstand voltage is reduced, and the possibility that the insulating film is destroyed by ESD increases.
The present invention has been made in view of the above points, and an object of the present invention is to provide a display device capable of suppressing electrostatic breakdown of a driving circuit.

The display device according to one embodiment includes:
A display region, a peripheral region surrounding the display region, an inorganic insulating film provided in the display region and the peripheral region, and a wiring provided on the inorganic insulating film in the peripheral region; An array substrate having an organic insulating film in contact with a film and the wiring and provided in the display region and the peripheral region; a counter substrate disposed to face the array substrate; A sealant for bonding to a substrate, wherein the wiring is electrically connected to a pad located in the peripheral area, and the organic insulating film is located in the display area, and at least a part thereof is viewed in plan. A first area overlapping the peripheral area, a second area spaced from the first area and located in the peripheral area, and located in the peripheral area and between the first area and the second area; And the third area In a first gap between the first region and the third region, and in a second gap between the third region and the second region, the sealing material is The display region includes a spacer that is located between the array substrate and the counter substrate in the display region, and the spacer is located between the array substrate and the counter substrate on a side of the peripheral region where the pad is located. located in, has a protrusion formed in the spacer the same material, in a plan view, the projection, the overlap with the second region of the organic insulating film, before Symbol first gap and the second At least one of the gaps is formed in a frame shape surrounding the display area, and has a width of 10 μm or more.

FIG. 1 is a perspective view showing the liquid crystal display panel according to the first embodiment. FIG. 2 is a schematic sectional view showing the liquid crystal display panel. FIG. 3 is a schematic plan view showing the liquid crystal display panel, and is a diagram showing a wiring structure. FIG. 4 is a schematic plan view showing a part of the array substrate shown in FIGS. FIG. 5 is an enlarged plan view showing the array substrate, and is a diagram showing a wiring structure of the array substrate. FIG. 6 is an enlarged cross-sectional view illustrating the liquid crystal display panel, and is a diagram illustrating a structure of the liquid crystal display panel. FIG. 7 is an enlarged cross-sectional view schematically showing a peripheral portion of the liquid crystal display panel along a line VII-VII in FIG. FIG. 8 is a schematic plan view showing the liquid crystal display panel, showing the structure of the slit. FIG. 9 is a plan view showing a state in which an array pattern is formed on mother glass in a process of manufacturing the liquid crystal display panel. FIG. 10 is a plan view showing a state in which a receiving pattern and the like are formed on the mother glass and six array substrates are formed, following FIG. FIG. 11 is a plan view showing a state where six opposing substrates are formed on mother glass in the manufacturing process of the liquid crystal display panel. FIG. 12 is a plan view showing a state where the sealing material is applied to the mother glass, following FIG. FIG. 13 is a plan view showing a state in which the two mother glasses shown in FIGS. 11 and 12 are bonded via a sealing material. FIG. 14 is a cross-sectional view showing a state in which the two mother glasses are bonded via a sealing material along a line XIV-XIV in FIG. FIG. 15 is a schematic plan view illustrating the liquid crystal display panel according to the second embodiment, and is a diagram illustrating a structure of a slit. FIG. 16 is an enlarged cross-sectional view schematically showing a peripheral portion of the liquid crystal display panel along a line XVI-XVI in FIG. FIG. 17 is an enlarged cross-sectional view schematically illustrating a peripheral portion of the liquid crystal display panel according to the third embodiment. FIG. 18 is an enlarged cross-sectional view schematically illustrating a peripheral portion of the liquid crystal display panel according to the fourth embodiment.

  Hereinafter, a liquid crystal display panel and a method for manufacturing the liquid crystal display panel according to the first embodiment will be described in detail with reference to the drawings. First, the configuration of the liquid crystal display panel will be described. In this embodiment, the liquid crystal display panel is a counter CF type, and a color filter is formed on the counter substrate side.

  As shown in FIGS. 1 to 6, the liquid crystal display panel includes an array substrate 1, a counter substrate 2 facing the array substrate with a predetermined gap therebetween, and a liquid crystal layer 3 sandwiched between the two substrates. , A color filter 4. Polarizing plates (not shown) are arranged on the outer surfaces of the array substrate 1 and the opposing substrate 2, respectively. A backlight unit (not shown) is arranged on the outer surface side of the array substrate 1. The array substrate 1 and the counter substrate 2 have a rectangular display region R1. The color filter 4 is provided in the display region R1 of the array substrate 1.

  The array substrate 1 has a glass substrate 11 as a transparent insulating substrate. In the display region R1, on the glass substrate 11, a plurality of scanning lines 15 extending in the row direction X and arranged at intervals in a column direction Y orthogonal to the row direction X, and intersecting with the plurality of scanning lines 15 A plurality of signal lines 21 extending in the column direction Y and arranged at intervals in the row direction X are arranged in a grid.

  On the glass substrate 11, a plurality of auxiliary capacitance lines 24, which constitute an auxiliary capacitance element 24, extend in the row direction X crossing the plurality of signal lines 21 and are arranged at intervals in the column direction Y Are formed. The storage capacitance line 17 extends in parallel with the scanning line 15.

  Here, the array substrate 1 and the opposing substrate 2 have a plurality of pixels 20 in a matrix provided so as to overlap a region surrounded by the plurality of signal lines 21 and the plurality of auxiliary capacitance lines 17. That is, each pixel 20 is provided so as to overlap a region surrounded by two adjacent signal lines 21 and two adjacent storage capacitor lines 17. Each of the pixels 20 of the array substrate 1 is provided with a TFT (thin film transistor) 19 as a switching element. More specifically, the TFT 19 is provided near each intersection between the scanning line 15 and the signal line 21.

  The TFT 19 has a semiconductor layer 12 made of amorphous silicon (a-Si) or polysilicon (p-Si) as a semiconductor, and a gate electrode 16 extending a part of the scanning line 15. In the present embodiment, the semiconductor layer 12 and an auxiliary capacitance electrode 13 described later are formed of p-Si.

  More specifically, in the display region R1, a semiconductor layer 12 and an auxiliary capacitance electrode 13 are formed on the glass substrate 11, and a gate insulating film 14 is formed on the glass substrate including the semiconductor layer and the auxiliary capacitance electrode. Is filmed. The scanning line 15, the gate electrode 16, and the auxiliary capacitance line 17 are provided on the gate insulating film 14. The auxiliary capacitance line 17 and the auxiliary capacitance electrode 13 are opposed to each other with the gate insulating film 14 interposed therebetween. An interlayer insulating film 18 is formed on the gate insulating film 14 including the scanning lines 15, the gate electrodes 16, and the auxiliary capacitance lines 17. In this embodiment, the interlayer insulating film 18 is an inorganic insulating film.

  A signal line 21 and a contact electrode 22 are formed on the interlayer insulating film 18. Each contact electrode 22 is connected to a drain region of the semiconductor layer 12 and a pixel electrode 26 to be described later through contact holes formed in the gate insulating film 14 and the interlayer insulating film 18, respectively. Further, the contact electrode 22 is connected to the auxiliary capacitance electrode 13 through another contact hole formed in the gate insulating film 14 and the interlayer insulating film 18. Here, the auxiliary capacitance line 17 is formed except for a connection portion between the auxiliary capacitance electrode 13 and the contact electrode 22.

  The signal line 21 is connected to a source region of the semiconductor layer 12 through a contact hole formed in the gate insulating film 14 and the interlayer insulating film 18. A protective insulating film 23 is formed on the interlayer insulating film 18, the signal line 21, and the contact electrode 22. The protective insulating film 23 also plays a role as a flattening film for flattening irregularities caused by wiring and the like on the substrate. In this embodiment, the protective insulating film 23 is an organic insulating film. The protective insulating film 23 covers not only the display region R1 but also a frame region R2 surrounding the display region R1.

  On the protective insulating film 23, the pixel electrodes 26 are respectively formed by a transparent conductive film such as ITO (indium tin oxide). A plurality of contact holes 25 are formed in the protective insulating film 23 and the colored layers 30R, 30G, and 30B overlapping the auxiliary capacitance line 17. These contact holes 25 are provided in the plurality of pixels 20.

  Each pixel electrode 26 is connected to the contact electrode 22 through the contact hole 25. The periphery of each pixel electrode 26 overlaps with the auxiliary capacitance line 17 and the signal line 21. The pixel electrodes 26 form the pixels 20 respectively.

  As described above, the array pattern 1p is formed on the glass substrate 11. In the display region R1, the array pattern 1p is stacked between the glass substrate 11 and the pixel electrode 26. A plurality of columnar spacers 27 as a plurality of spacers are formed on the array pattern 1p. An alignment film 28 is formed on the array pattern 1p (the pixel electrode 26 and the like) on which the column spacer 27 is formed.

  On the other hand, as shown in FIGS. 3 and 7, in the frame region R2, the array pattern 1p and the receiving pattern 60 are formed on the glass substrate 11. In the frame region R2, the array pattern 1p includes the driving circuits 6a and 6b, the gate insulating film 14, the interlayer insulating film 18, the wirings w1, w2, w3, w4, w7, w8, and the protective insulating film 23. Have.

  The drive circuits 6a and 6b are arranged to face each other in the row direction X with the display region R1 interposed therebetween. The drive circuits 6a and 6b are simultaneously formed of the same material when forming the TFT 19 and the like. The driving circuits 6a and 6b are Y drivers connected to the scanning lines 15 and the auxiliary capacitance lines 17.

  The wirings w1, w2, w3, w4, w7, w8 are provided on the left and right sides of the frame region R2, respectively, and form the driving circuits 6a, 6b. The wirings w1, w2, w3, w4, w7, w8 extend in the column direction Y and are provided at intervals in the row direction X. The wirings w1, w2, w3, w4, w7, w8 are formed on the interlayer insulating film 18 and covered with the protective insulating film 23. The wirings w1, w2, w3, and w4 are extended to the ends of the glass substrate 11 and connected to pads for outer lead bonding.

  The wirings w1 and w2 are control signal wirings as first wirings, and the wirings w3 and w4 are power supply wirings as second wirings. The start pulse signal ST is supplied to the wiring w1 via a pad. The clock signal CLK is supplied to the wiring w2 via a pad. A voltage V1 (VDD) is applied to the wiring w3 from a high-potential power supply (not shown) via a pad. A voltage V2 (VSS) is applied to the wiring w4 from a low-potential power supply (not shown) via a pad. The wiring w3 and the wiring w4 are power wirings having different potentials. For example, the voltage V1 is + 10V and the voltage V2 is -5V.

  The wirings w5 and w6 are connection wirings and extend in a direction crossing a slit 23h1 described later. In this embodiment, the wirings w5 and w6 extend in the row direction X. The wirings w5 and w6 are formed at least on the gate insulating film 14 in the frame region R2. The wirings w5 and w6 are covered with the interlayer insulating film 18. In this embodiment, the wirings w5 and w6 are formed to extend to the display region R1. In the frame region R2, the interlayer insulating film 18 has a through hole facing the wiring w5 and a through hole facing the wiring w6. The wiring w3 is electrically connected to the wiring w5 through the through hole, and the wiring w4 is electrically connected to the wiring w6 through the through hole.

  As shown in FIGS. 3, 7, and 8, the protective insulating film 23 has a slit 23h1. The slit 23h1 is formed to penetrate. The slit 23h1 is formed so that the wiring is not exposed, and is formed so that the interlayer insulating film 18 is exposed. The slit 23h1 is formed in a frame shape, and here is formed continuously in a rectangular frame shape. On the left or right side of the frame region R2, the slit 23h1 is formed to extend along the direction in which the wiring w2 and the wiring w3 extend. Here, the slit 23h1 has a width of 5 to 10 μm.

  The wirings w1 and w2 are located on the outer edge side of the array substrate 1 with respect to the slit 23h1. The wirings w3, w4, w7, w8 are located closer to the display region R1 than the slit 23h1. Note that the slit 23h1 is located at the top of the array pattern 1p. The slit is filled with a moisture-proof member 29 a and is in contact with the interlayer insulating film 18.

  As shown in FIGS. 3 and 7, the receiving pattern 60 is provided on at least one of the array substrate 1 and the opposing substrate 2 at a portion corresponding to the resin film located at an interval on the periphery of the display region R <b> 1. At least one of the substrate 1 and the counter substrate 2 has a wall-shaped projection formed with a gap.

  In this embodiment, the receiving pattern 60 is provided on the array substrate 1 at intervals on the periphery of the display region R1, and has wall-shaped projections 61 and 62 formed with a gap on the opposing substrate 2. I have.

  The protrusions 61 and 62 are formed on the protective insulating film 23. The protrusions 61 and 62 extend in the column direction Y. The protrusion 61 is located on the opposite side of the display region R1 with respect to the drive circuit 6a and is spaced from the periphery of the array substrate 1 and the counter substrate 2 at intervals. The protrusion 62 is located on the opposite side of the display region R1 with respect to the drive circuit 6b and is spaced from the periphery of the array substrate 1 and the counter substrate 2 at intervals.

  The protrusions 61 and 62 are for suppressing the later-described sealing material 51 from spreading to the peripheral edges of the array substrate 1 and the counter substrate 2. The protrusions 61 and 62 are simultaneously formed on the array substrate 1 with the same material as the columnar spacer 27. The protrusions 61 and 62 are formed lower than the columnar spacer 27. However, the protrusions 61 and 62 may have the same height as the columnar spacer 27. The receiving pattern 60 is formed except for a region facing a liquid crystal injection port 52 described later.

  As shown in FIGS. 1, 2, 3, 6, and 7, the counter substrate 2 includes a glass substrate 41 as a transparent insulating substrate. The color filter 4 is provided on the glass substrate 41. The color filter 4 has a light shielding part 31, a peripheral light shielding part 32, and a plurality of coloring layers. The plurality of colored layers include, for example, a red colored layer 30R, a green colored layer 30G, and a blue colored layer 30B.

  The light shielding part 31 is formed in a lattice shape. The light shielding portion 31 is formed to face the auxiliary capacitance line 17 and the signal line 21. The peripheral light-shielding portion 32 is formed in a rectangular frame shape, and is formed over the entire frame region R2. The peripheral light-shielding portion 32 contributes to light-shielding of light (backlight) leaking from the outside of the display region R1.

The coloring layers 30R, 30G, and 30B are formed on the glass substrate 41 and the light shielding portion 31. The coloring layers 30R, 30G, and 30B extend in a strip shape along the column direction Y. The coloring layers 30R, 30G, and 30B are adjacent to each other in the row direction X and are alternately arranged. The peripheral portions of the colored layers 30R, 30G, and 30B overlap the light-shielding portions 31.
Note that an overcoat layer (not shown) may be disposed on the color filter 4. Thereby, the influence of the unevenness on the surface of the light shielding portion 31 and the color filter 4 can be reduced.

  On the color filter 4 (overcoat layer), a counter electrode 42 is formed of a transparent conductive film such as ITO. An alignment film 43 is formed on the counter electrode 42. As described above, the opposing pattern 2p is formed on the glass substrate 41. The opposing pattern 2p includes the color filter 4, the opposing electrode 42, and the alignment film 43. The facing pattern 2p may further have an overcoat layer.

  The array substrate 1 and the opposing substrate 2 are opposingly arranged with a predetermined gap by a plurality of columnar spacers 27. The sealing material 51 is provided between the array substrate 1 and the opposing substrate 2 so as to face the frame region R2, and is located between the periphery of the display region R1 and the projections 61 and 62, and is formed continuously in a rectangular frame shape. . The sealing material 51 is located at intervals around the periphery of the array substrate 1 and the counter substrate 2 over the entire periphery of the array substrate 1 and the counter substrate 2.

  The array substrate 1 and the counter substrate 2 are joined to each other by a sealing material 51. The sealing material 51 is formed on the moisture-proof member 29a. In this embodiment, the moisture-proof member 29a is formed of a part of the sealing material 51 filled in the slit 23h1 and in contact with the interlayer insulating film 18. The sealing material 51 has a property of blocking moisture. The sealing material 51 can be formed using a resin such as acrylic. For this reason, it is possible to block moisture from penetrating the protective insulating film 23 or the surface (interface) of the protective insulating film 23 to the wirings w3, w4, w7, w8, and the like on the display region R1 side from the slit 23h1.

  The seal member 51 covers the entire drive circuits 6a and 6b. The projections 61 and 62 (reception pattern 60) of the sealing material 51 prevent the array substrate 1 and the opposing substrate 2 from spreading toward the periphery (spreading in the row direction X). The protrusions 61 and 62 are in contact with the side surface of the sealing material 51. However, since the protrusions 61 and 62 are for suppressing the spread of the sealing material 51, the protrusions 61 and 62 are not necessarily in contact in all places and may be partially contacted. In some cases, the shapes may be in contact with each other.

The liquid crystal layer 3 is formed in a space surrounded by the array substrate 1, the counter substrate 2, and the sealing material 51.
The liquid crystal display panel is formed as described above.

Next, a more detailed configuration of the liquid crystal display panel will be described together with a method of manufacturing the same.
As shown in FIGS. 1 to 8 and 9, first, a mother glass 101 as a first mother substrate having a size larger than that of the array substrate 1 is prepared as a transparent insulating substrate. According to this embodiment, the mother glass 101 has six rectangular array substrate forming regions R6 for forming the array substrate 1, and a non-effective region R7 deviating from the array substrate forming region R6. The mother glass 101 has a first dividing line e1 overlapping the periphery of the array substrate forming region R6.

  An array pattern including the TFT 19, the auxiliary capacitance element 24, the drive circuits 6a and 6b, the protective insulating film 23 having the slit 23h1, and the like is formed on the prepared mother glass 101 by a normal manufacturing process such as repeating film formation and patterning. 1p is formed.

  Next, using a spinner, for example, a photosensitive acrylic transparent resin is applied to the entire surface of the mother glass 101. Subsequently, the transparent resin is dried. Next, using a predetermined photomask, patterning is exposed on the transparent resin. Next, after developing the exposed transparent resin, it is baked and cured.

  Thus, as shown in FIGS. 1 to 8 and FIG. 10, the columnar spacer 27 and the projections 61 and 62 are simultaneously formed. Since the projections 61 and 62 and the columnar spacer 27 can be formed at the same time, they can be formed without increasing the number of manufacturing steps.

Thereafter, an alignment film material is applied on the entire surface of the mother glass 101 including the display region R1, and is patterned to form the alignment film 28. The alignment film 28 is subjected to a predetermined alignment process (rubbing) as necessary.
Thereby, six array substrates 1 are completed with one mother glass 101.

  As shown in FIGS. 1, 2, 3, 6, 7, 8, and 11, on the other hand, in the method of manufacturing the opposing substrate 2, first, the size of the opposing substrate 2 is set as a transparent insulating substrate. A mother glass 102 is prepared as a second mother substrate having a large size. According to this embodiment, the mother glass 102 has six rectangular opposing substrate forming regions R8 for forming the opposing substrate 2 and an ineffective region R9 deviating from the opposing substrate forming region R8. The mother glass 102 has a second scheduled dividing line e2 overlapping the periphery of the counter substrate formation region R8.

On the prepared mother glass 102, an opposing pattern 2p is formed by a normal manufacturing process. The alignment film 43 is subjected to a predetermined alignment process (rubbing) as necessary.
Thereby, six opposing substrates 2 are completed with one mother glass 102.

  Next, as shown in FIG. 7, FIG. 8 and FIG. 12, for example, an ultraviolet curing resin is applied as a material for forming the sealing material 51 over the entire frame region R2 of the array substrate 1 by a printing method. . Thereby, the frame-shaped sealing material 51 is formed. When forming the seal material 51, an electrode transfer material for applying a voltage from the array substrate 1 to the counter substrate 2 can be formed on an electrode transfer electrode (not shown) around the seal material 51.

  Thereafter, as shown in FIGS. 11 to 14, a liquid crystal material is dropped on a region surrounded by the sealant 51. Subsequently, the mother glass 101 and the mother glass 102 are arranged to face each other such that the alignment film 28 and the alignment film 43 face each other, and the array substrate 1 and the counter substrate 2 are arranged to face each other while maintaining a predetermined gap by a plurality of columnar spacers 27. Then, the peripheral edges of the array substrate 1 and the opposing substrate 2 are bonded to each other with a sealing material 51. At this time, the sealing material 51 is filled in the slit 23h1. In addition, the projections 61 and 62 suppress the spread of the sealing material 51.

  Next, the sealing material 51 is cured by irradiating the sealing material 51 with ultraviolet rays from the outside. Thereby, the mother glass 101 and the mother glass 102 are joined via the sealing material 51.

Subsequently, the mother glass 101 is divided along the first planned dividing line e1, and the mother glass 102 is divided along the second planned dividing line e2. At the time of division, for example, a scribe line is drawn along the first planned division line e1 and the second planned division line e2 to perform division. Thus, the array substrate 1 is cut out from the mother glass 101, and the opposing substrate 2 is cut out from the mother glass 102.
Thus, as shown in FIG. 3, six sets of liquid crystal display panels are taken out of the divided mother glass 101 and mother glass 102. Then, each of the six liquid crystal display panels is completed.

  According to the liquid crystal display panel and the method of manufacturing the liquid crystal display panel according to the first embodiment configured as described above, the liquid crystal display panel includes an array substrate 1, a counter substrate 2, a liquid crystal layer 3, and a sealing material 51. And The array substrate 1 has wirings w1 to w8, an interlayer insulating film 18, a protective insulating film 23, and a moisture-proof member 29a. The protective insulating film 23 is formed on the display region R1 and the frame region R2, and covers the wirings w1 to w4, w7, and w8. The protective insulating film 23 has a slit 23h1 formed to penetrate between the wiring w2 and the wiring w3. The moisture-proof member 29a is formed of a part of the sealing material 51 filled in the slit 23h1 and in contact with the interlayer insulating film 18.

  The sealing material 51 has a property of blocking moisture. For this reason, the moisture that travels along the interface between the protective insulating film 23, which is an organic insulating film, and the interface between the protective insulating film 23 and the interlayer insulating film 18, is blocked from entering the display region R1 by the slit 23h1 and the moisture-proof member 29a. The interlayer insulating film (inorganic insulating film) 18 has a property of blocking moisture. In this embodiment, it is possible to block the entry of moisture into the wirings w3, w4, w7, w8 and the like. In particular, when the slit 23h1 and the moisture-proof member 29a are arranged between the wirings having a large potential difference from the adjacent wiring, corrosion of the wiring due to moisture and the potential difference can be prevented. In the present embodiment, it is possible to block the entry of moisture into the wirings w3 and w4 where corrosion is likely to occur. Thereby, the concern that the wirings w3, w4, w7, w8, etc. corrode can be eliminated.

  In this embodiment, since the slit 23h1 is formed in a frame shape and the entire area of the slit 23h1 is filled with the sealing material 51, the intrusion of moisture into the inside of the liquid crystal display panel can be further blocked. The adverse effect of moisture can be further eliminated.

  The slit 23h1 has a width of 5 to 10 μm. Thereby, the slit 23h1 can be formed in a vacant space (unused space such as wiring). Note that the width of the slit 23h1 may be less than 5 μm as long as the patterning of the protective insulating film 23 is possible. Also in this case, the above moisture-proof effect can be obtained. If there is room in the unused space such as the wiring, the width of the slit 23h1 may be 10 μm or more. Further, a slit 23h1 may be formed between the wirings along the wiring. For example, a slit 23h1 may be formed in parallel along at least one of the wirings between a wiring having a common potential and a power supply wiring providing a High level potential.

  The slit 23h1 can be formed between the wiring w2 and the wiring w3. The protective insulating film 23 on the outer edge side of the array substrate 1 with the width of 200 to 300 μm is removed from the wirings w1 to w4, w7, and w8 over the entire circumference, so that there is no need to form a sealing material in the removed space. Therefore, the frame can be narrowed.

Since the width of the slit 23h1 is narrow, the slit 23h1 can be formed without exposing the wirings w1 to w4, w7, w8, and the like. Since the intrusion of static electricity into the wirings w1 to w4, w7 and w8 can be prevented, destruction of the peripheral circuits (drive circuits 6a and 6b) of the wirings can be prevented. For this reason, it is possible to prevent a decrease in ESD (Electro Static Discharge) withstand voltage.
Since the slit 23h1 can be formed at the same time as the formation of the contact hole 25, it can be formed without increasing the number of manufacturing steps.

  The projections 61 and 62 are provided on the array substrate 1 at intervals on the periphery of the display region R1, and are formed on the opposing substrate 2 with a gap. The sealing material 51 is located between the periphery of the display region R1 and the protrusion 61, and between the periphery of the display region R1 and the protrusion 62. The spread of the sealing material 51 toward the peripheral edge of the array substrate 1 and the counter substrate 2 is suppressed by the protrusions 61 and 62.

  The sealing material 51 can be applied to a region near the periphery of the array substrate 1 (opposite substrate 2). Therefore, even in the liquid crystal display panel having a narrow frame width, the spread of the sealing material 51 into the display region R1 can be suppressed, and display abnormalities can be prevented. The spreading of the sealing material 51 to the peripheral side of the array substrate 1 and the counter substrate 2 is suppressed by the protrusions 61 and 62, and spreads until the sealing material 51 overlaps the first scheduled cutting line e1 (second scheduled cutting line e2). Therefore, the array substrate 1 and the counter substrate 2 can be satisfactorily separated from the mother glasses 101 and 102.

  When the liquid crystal display panel is cut out from the mother glasses 101 and 102, the blade for cutting the glass hits between the projections 61 and 62, that is, the cut lines e1 and e2. When the blade comes into contact with the glass surface, the wall-shaped projections 61 and 62 support the glass, so that the blade pressure applied to the glass surface is evenly distributed on the glass surface. Therefore, the glass can be cut without causing defects such as chipping or breaking when the glass is cut.

In the present embodiment, the projections 61 and 62 are arranged on the left and right sides around the display area R1 of the liquid crystal display panel. That is, the protrusions 61 and 62 are arranged along an end perpendicular to the end where the outer lead bonding pad is arranged. Similarly, a slit 23h1 and a moisture-proof member 29a are arranged along an edge perpendicular to an edge where the pad is arranged. Further, the protrusions may be arranged on the upper and / or lower sides of the display area R1, that is, on the side of the side where the pad is disposed and the side of the side opposite to this side.
By arranging the receiving pattern 60 in this manner, it becomes possible to cut the glass satisfactorily without causing a problem such as chipping of the glass when cutting the glass as described above.
From the above description, it is possible to obtain a liquid crystal display panel and a method for manufacturing a liquid crystal display device which can achieve a narrower frame and a high product yield.

  Next, a liquid crystal display panel according to a second embodiment will be described. The liquid crystal display panel according to the present embodiment can be formed using the same method as the method of manufacturing the liquid crystal display panel according to the first embodiment. In the present embodiment, the same functional portions as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIGS. 3, 15, and 16, the protective insulating film 23 has a slit 23h2, a slit 23h2, and a slit 23h3 in addition to the slit 23h1. Similarly to the slit 23h1, the slit 23h2 and the slit 23h3 are also formed penetrating the protective insulating film 23. The slits 23h2 and 23h3 are formed so that the wiring is not exposed, and are formed so that the interlayer insulating film 18 is exposed. The slits 23h2 and 23h3 are formed in a band shape, and are formed to extend in a column direction Y in a frame shape. The slits 23h2 and 23h3 are formed to extend along the extending directions of the wiring w3 and the wiring w4, respectively. Each of the slits 23h2 and 23h3 has, for example, a width of 5 to 10 μm.

  On the left side of the frame region R2, the slit 23h2 is formed between the wiring w3 and the wiring w4. On the right side of the frame region R2, the slit 23h3 is formed between the wiring w3 and the wiring w4. The slits 23h1, 23h2, 23h3 are located at the top of the array pattern 1p. The slit 23h1 is filled with a moisture-proof member 29a and is in contact with the interlayer insulating film 18. The slit 23h2 is filled with a moisture-proof member 29b and is in contact with the interlayer insulating film 18. The slit 23h3 is filled with a moisture-proof member 29c and is in contact with the interlayer insulating film 18. The sealing material 51 is formed on the moisture-proof members 29a, 29b, 29c. In this embodiment, the moisture-proof members 29a, 29b, and 29c are formed by filling the slits 23h1, 23h2, and 23h3 with a part of the sealing material 51, respectively.

  According to the liquid crystal display panel and the method of manufacturing the liquid crystal display panel according to the second embodiment configured as described above, the liquid crystal display panel includes an array substrate 1, a counter substrate 2, a liquid crystal layer 3, and a sealing material 51. And The protective insulating film 23 has slits 23h2 and 23h3 formed to penetrate between the wiring w3 and the wiring w4. That is, the slits are formed doubly. Each of the slits 23h2 and 23h3 is filled with a part of the sealing material 51 and is in contact with the interlayer insulating film 18 to form moisture-proof members 29b and 29c.

  In this embodiment, moisture can be prevented from entering the wirings w3, w4, w7, w8, and the like by the moisture-proof member 29a (sealant 51) formed in the slit 23h1, and the moisture-proof formed in the slits 23h2, 23h3. The members 29b and 29c (seal material 51) can further prevent moisture from entering the wirings w4, w7, w8 and the like. Thereby, the concern that the wirings w3, w4, w7, w8, etc. corrode can be eliminated. As described above, the penetration of moisture into the wiring w4 can be further blocked, so that the corrosion of the wirings w3 and w4 having a large potential difference between adjacent wirings can be further reduced.

The slits 23h2 and 23h3 can be formed between the wiring w3 and the wiring w4. Similarly to the slit 23h1, the slits 23h2 and 23h3 can be formed in an empty space (unused space for wiring or the like), so that the frame can be narrowed. In addition, the same effects as those of the first embodiment can be obtained.
From the above description, it is possible to obtain a liquid crystal display panel and a method for manufacturing a liquid crystal display device which can achieve a narrower frame and a high product yield.

  Next, a liquid crystal display panel according to a third embodiment will be described. The liquid crystal display panel according to the present embodiment can be formed using the same method as the method of manufacturing the liquid crystal display panel according to the first embodiment. In the present embodiment, the same functional portions as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIG. 17, the alignment film 28 is formed of an inorganic material having a lower moisture permeability than the protective insulating film 23. The alignment film 28 has a property of blocking moisture. The moisture-proof member 29a is formed of the same material as the alignment film 28. The alignment film 28 is formed to extend to a position facing the slit 23h1 in the frame region R2. Preferably, the alignment film 28 is formed to extend to a position beyond the slit 23h1 in the frame region R2. The moisture-proof member 29a is formed of a part of the alignment film 28 that is filled in the slit 23h1 and is in contact with the interlayer insulating film 18. As described above, in the present embodiment, the alignment film 28 of the display region R1 and the moisture-proof member 29a are formed integrally, but the moisture-proof member 29a is formed separately from the alignment film 28 of the display region R1. Is also good.

  According to the liquid crystal display panel and the method of manufacturing the liquid crystal display panel according to the third embodiment configured as described above, the liquid crystal display panel includes an array substrate 1, a counter substrate 2, a liquid crystal layer 3, and a sealing material 51. And The protective insulating film 23 has a wiring w2 and a slit 23h1 formed to penetrate between the wiring w2. When the alignment film 28 has a property of blocking moisture, a part of the alignment film 28 may be filled in the slit 23h1 to form the moisture-proof member 29a.

  In this embodiment, the infiltration of moisture into the wirings w3, w4, w7, w8, etc. can be blocked by the moisture-proof member 29a formed in the slit 23h1. Thereby, the concern that the wirings w3, w4, w7, w8, etc. corrode can be eliminated. As described above, the infiltration of moisture into the wiring w4 can be further blocked, so that the corrosion of the wirings w3 and w4 having a large potential difference between adjacent wirings can be further reduced.

  Note that the above effects can be obtained if the material for forming the alignment film 28 can be filled in the slit 23h1. If the width of the slit 23h1 is 5 to 10 μm, the material for forming the alignment film 28 can be filled in the slit 23h1. As long as the material for forming the alignment film 28 can be filled in the slit 23h1, the width of the slit 23h1 may exceed 10 μm.

In addition, the same effects as those of the first embodiment can be obtained.
From the above description, it is possible to obtain a liquid crystal display panel and a method for manufacturing a liquid crystal display device which can achieve a narrower frame and a high product yield.

  Next, a liquid crystal display panel according to a fourth embodiment will be described. The liquid crystal display panel according to the present embodiment can be formed using the same method as the method of manufacturing the liquid crystal display panel according to the first embodiment. In the present embodiment, the same functional portions as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIG. 18, the columnar spacer 27 is formed of a material having a lower moisture permeability than the protective insulating film 23. The material forming the columnar spacer 27 has a property of blocking moisture. The moisture-proof member 29a is formed of the same material as the columnar spacer 27. The material forming the columnar spacer 27 is filled in the slit 23h1 and is in contact with the interlayer insulating film 18 to form the moisture-proof member 29a. The columnar spacer 27, the protrusions 61 and 62, and the moisture-proof member 29a are simultaneously formed of the same material.

  According to the liquid crystal display panel and the method of manufacturing the liquid crystal display panel according to the fourth embodiment configured as described above, the liquid crystal display panel includes an array substrate 1, a counter substrate 2, a liquid crystal layer 3, and a sealing material 51. And The protective insulating film 23 has a wiring w2 and a slit 23h1 formed to penetrate between the wiring w2. When the material forming the columnar spacer 27 has a property of blocking moisture, the material forming the columnar spacer 27 may be filled in the slit 23h1 to form the moisture-proof member 29a.

In this embodiment, the infiltration of moisture into the wirings w3, w4, w7, w8, etc. can be blocked by the moisture-proof member 29a formed in the slit 23h1. Thereby, the concern that the wirings w3, w4, w7, w8, etc. corrode can be eliminated. As described above, the penetration of moisture into the wiring w4 can be further blocked, so that the corrosion of the wirings w3 and w4 having a large potential difference between the adjacent wirings can be further reduced. In addition, the same effects as those of the first embodiment can be obtained.
From the above description, it is possible to obtain a liquid crystal display panel and a method for manufacturing a liquid crystal display device which can achieve a narrower frame and a high product yield.

  Although several embodiments of the present invention have been described, these embodiments are provided by way of example and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and their equivalents.

  For example, among the plurality of wirings, the wiring located closest to the outer edge of the array substrate 1 is defined as the outermost wiring. Then, the outermost wiring may be located closer to the display region R1 than the slit. Accordingly, it is possible to further prevent moisture from entering into a plurality of wirings including the outermost wiring.

  The moisture-proof members 29a, 29b, and 29c may be formed of a material other than the material forming the sealing material 51, the material forming the alignment film 28, and the material forming the columnar spacer 27. The material forming the moisture-proof members 29a, 29b, 29c is not limited to an inorganic material, and the above-described effects can be obtained as long as the material has lower moisture permeability than the protective insulating film 23 (organic insulating film). Can be.

  The technology of the above-described embodiment is not limited to the above-described liquid crystal display panel, but can be applied to various liquid crystal display panels. The liquid crystal injection method is not limited to the use of the drop injection method, but may be a vacuum injection method. Further, the technology of the above-described embodiment can be applied to display panels other than the liquid crystal display panel.

Hereinafter, the invention described in the original application of the present application will be additionally described.
[1] An inorganic insulating film formed on a substrate and located in a display region and a frame region surrounding the display region; a first wiring formed on the inorganic insulating film at intervals and located in the frame region; A second wiring, an organic insulating film formed on the inorganic insulating film and located in the display area and the frame area and covering the first wiring and the second wiring, and the organic insulating film between the first wiring and the second wiring. An array substrate having a slit formed through the film and a moisture-proof member filled in the slit and in contact with the inorganic insulating film,
A display panel, comprising: a counter substrate facing the array substrate with a gap therebetween.
[2] The display panel according to [1], wherein the first wiring and the second wiring are wirings having different potentials from each other.
[3] The first wiring is a power supply wiring located closer to the display area than the slit,
The display panel according to [1], wherein the second wiring is a control signal wiring located on the outer edge side of the array substrate with respect to the slit.
[4] further comprising a connection wiring covered with the inorganic insulating film formed at least on a frame region of the substrate and intersecting with the slit,
The first wiring is located closer to the display area than the slit,
The display panel according to [1], wherein the second wiring is located on an outer edge side of the array substrate with respect to the slit, and is electrically connected to the connection wiring.
[5] The display panel according to [1], wherein the slit is formed to extend along a direction in which the first wiring and the second wiring extend.
[6] The organic insulating film is located closer to the outer edge of the array substrate than the first wiring and the second wiring, and has another frame-shaped slit formed therethrough,
The display panel according to [1], wherein the array substrate has another moisture-proof member filled in the other slit and in contact with the inorganic insulating film.
[7] an inorganic insulating film formed on the substrate and located in a display region and a frame region surrounding the display region; an outermost wiring formed on the inorganic insulating film at intervals and positioned in the frame region; An organic insulating film formed on the inorganic insulating film and covering the outermost wiring located in the display region and the frame region; a slit formed through the organic insulating film; and the inorganic insulating film filled in the slit. An array substrate having a moisture-proof member in contact with the film,
And a counter substrate disposed to face the array substrate with a gap,
The display panel, wherein the outermost wiring is located closer to the display area than the slit.
[8] The display panel according to [7], wherein the slit is formed to extend along a direction in which the outermost peripheral wiring extends.
[9] The display panel according to [7], wherein the slit is formed in a frame shape.
[10] a sealing material that faces the frame region and joins the array substrate and the counter substrate,
The display panel according to [1] or [7], wherein the moisture-proof member is formed of a part of the sealing material filled in the slit.
[11] a sealing material that faces the frame region, joins the array substrate and the counter substrate, and is in contact with the moisture-proof member;
The display panel according to [1] or [7], wherein the moisture-proof member is formed of a material different from the sealing material.
[12] The liquid crystal display further includes a liquid crystal layer formed in a space surrounded by the array substrate, the counter substrate, and a sealing material.
The array substrate further includes an inorganic alignment film formed at least in the display region and extending to a position facing the slit in the frame region,
The display panel according to [11], wherein the moisture-proof member is formed by a part of the alignment film filled in the slit.
[13] The array substrate further includes a columnar spacer that holds the gap between the array substrate and the counter substrate,
The display panel according to [11], wherein the moisture-proof member is formed of a material forming the columnar spacer.
[14] The display panel according to [1] or [7], wherein the slit has a width of 5 to 10 μm.

  DESCRIPTION OF SYMBOLS 1 ... Array substrate, 2 ... Counter substrate, 3 ... Liquid crystal layer, 6a, 6b ... Drive circuit, 11 ... Glass substrate, 18 ... Interlayer insulating film, 23 ... Protective insulating film, 23h1, 23h2, 23h3 ... Slit, 27 ... Column shape Spacer, 28: alignment film, 29a, 29b, 29c: moisture-proof member, 51: sealing material, w1, w2, w3, w4, w5, w6, w7, w8: wiring, R1: display area, R2: frame area, X ... row direction, Y ... column direction.

Claims (13)

A display area;
A peripheral area surrounding the display area;
An inorganic insulating film provided in the display region and the peripheral region,
In the peripheral region, a wiring provided on the inorganic insulating film,
An array substrate having an organic insulating film provided in the display region and the peripheral region in contact with the inorganic insulating film and the wiring;
A counter substrate disposed to face the array substrate,
A sealing material for joining the array substrate and the counter substrate,
The wiring is electrically connected to a pad located in the peripheral region,
The organic insulating film is located in the display area, at least a portion of the first area overlaps with the peripheral area in a plan view, a second area separated from the first area and located in the peripheral area, A third region located in a peripheral region and located between the first region and the second region;
In a first gap between the first region and the third region, and in a second gap between the third region and the second region, the sealing material contacts the inorganic insulating film;
In the display region, a spacer is provided between the array substrate and the counter substrate,
On the side of the peripheral area where the pad is located, between the array substrate and the counter substrate, and has a protrusion formed of the same material as the spacer ,
In a plan view, the protrusion overlaps with the second region of the organic insulating film,
At least one of the first gap and the second gap is formed in a frame shape surrounding the display area, and has a width of 10 μm or more. The wiring has a first wiring extending in a first direction from the pad, and a second wiring extending in a direction intersecting with the first wiring.
The display device according to claim 1, wherein on a side where the pad is located, the first wiring intersects at least one of the first gap and the second gap. Further, the inorganic insulating film has a first inorganic insulating film, and a second inorganic insulating film provided on the first inorganic insulating film,
The second wiring is located between the first inorganic insulating film and the second inorganic insulating film,
The display device according to claim 2, wherein the first wiring is located on the second inorganic insulating film.   The display device according to claim 3, wherein the second wiring is connected to the first wiring via a through hole formed in the second inorganic insulating film.   The display device according to claim 1, wherein the first gap is located closer to the display area than the second gap.   The display device according to claim 1, wherein the seal member is a moisture-proof member. Further comprising a liquid crystal layer formed in a space surrounded by the sealing material,
The array substrate further has an alignment film formed at least in the display area,
The display device according to claim 1, wherein a part of the alignment film is formed up to at least one of the first gap and the second gap.   The display device according to claim 7, wherein the alignment film is a moisture-proof member. A third wiring that is adjacent to the first wiring and extends from the pad different from the first wiring in the first direction;
The display device according to claim 2, wherein at least one of the first gap and the second gap is formed between the first wiring and the third wiring.   The display device according to claim 9, wherein one of the first wiring and the third wiring is a power supply wiring that supplies a High-level potential.   The display device according to claim 10, wherein the other of the first wiring and the third wiring is a wiring that supplies a common potential.   The display device according to claim 1, wherein the protrusion is located between an end of the counter substrate on a side where the pad is located and the sealing material.   The display device according to claim 12, wherein a part of the protrusion is in contact with the sealing material.

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