JP6650807B2 - Test head turning mechanism and inspection device - Google Patents

Description

  The present invention relates to a test head turning mechanism and an inspection device using the same.

  2. Description of the Related Art In a semiconductor device manufacturing process, a probe device is used as an inspection device for performing an electrical inspection of an IC chip formed on a semiconductor wafer.

  In general, a probe device is a probe that constitutes an inspection unit for electrically inspecting IC chips on a semiconductor wafer, which is an object to be inspected, one by one or a plurality of IC chips on a semiconductor wafer, or collectively for IC chips on a semiconductor wafer. An apparatus main body, a test head rotatably provided on the probe apparatus main body, a test head turning mechanism for turning the test head, and one semiconductor wafer as an object to be inspected carried in and out of each cassette. And a loader unit for transporting the probe unit to the probe device main body.

  The probe device main body includes a mounting table on which a semiconductor wafer is mounted, and a probe card disposed above the mounting table, and the probe card and the tester are electrically relayed by a test head.

  The test head turning mechanism can turn the test head, for example, by 180 ° between the inspection position mounted on the probe device main body and the maintenance area.

  The test head is a heavy object on which a large number of electronic components required for electrical inspection of a semiconductor wafer to be inspected are mounted, and a test head which currently reaches 300 kg is used.

  Conventionally, as a test head turning mechanism, a shaft serving as a turning axis for turning the test head, two support arms connecting the test head and the shaft, and a position protruding outside one of the support arms on one side of the shaft. There is a known drive system having a mounted drive system having a structure in which a motor and a speed reducer are integrated, and transmitting the power of the drive system to a support arm as turning power via a shaft (for example, Patent Document 1). 1).

JP-A-9-298224

  However, in the test head turning mechanism disclosed in Patent Document 1, since the drive system is provided at a position deviated from the center of the turning axis, even if the test head is large and heavy and has high rigidity, it is not supported. There is stress concentration on one side of the arm, and the torsion increases. Further, since the turning power is transmitted via the shaft, when the test head, which is a heavy object, is turned, a loss of the turning power and a turning position loss due to torsion easily occur between the driving power and the actual turning portion. . In addition, since the size of the drive system is large and the drive system protrudes outside one of the support arms, the footprint is increased accordingly.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a test head swivel mechanism capable of reducing a stress concentration, a power transmission loss and a swiveling position loss, and having a small footprint and a small size, and an inspection apparatus using the same.

  In order to solve the above problem, a first aspect of the present invention is a test head turning mechanism for turning a test head around a turning axis in an inspection device for inspecting electrical characteristics of a substrate, wherein the test head turning mechanism is provided in a direction orthogonal to the turning axis. A motor that outputs power to the motor, two support arms provided on both sides of the motor, and rotatably supporting the test head, and a gear unit having a gear that transmits the power of the motor to the two support arms. A test head turning mechanism is provided.

In the test head turning mechanism according to the first aspect, it is preferable that the two support arms are arranged at positions symmetrical with respect to the motor. In addition, a gear having a worm gear can be used as the gear.

  It is possible to further include two rear reduction gears provided between the gear portion and the two support arms. In this case, it is preferable that the two rear reduction gears are arranged at positions symmetrical with respect to the motor. The latter-stage speed reducer may include a planetary gear type reducer, and a cyclo reducer may be used as the planetary gear type reducer.

  The test apparatus further includes a control unit that controls turning of the test head, the control unit includes a main control unit that controls driving of the motor, and an input unit that inputs a turning mode, and the main control unit includes: By an operation of the input unit, an automatic mode in which the test head automatically turns up to a set turning angle, and a manual mode in which the test head is turned and stopped manually and the test head is stopped at an arbitrary position. While controlling to operate, when switching to the manual mode in the middle of controlling the test head to rotate to a set angle in the automatic mode, the automatic mode is stopped and the test head is stopped. Before turning to the set angle, control may be performed to switch to the manual mode.

  The test head turning mechanism according to the first aspect may further include an elevating mechanism for elevating the test head.

  According to a second aspect of the present invention, there is provided an inspection apparatus main body for measuring an electrical characteristic of an inspection object, a test head having an electronic component for inspecting the inspection object, and And a test head turning mechanism that turns between a test area and a maintenance area separated from the test position, wherein the test head turning mechanism has a configuration according to the first aspect. An inspection apparatus is provided.

  In the inspection device according to the second aspect, the inspection device main body may include a housing, a probe card provided in the housing, and having a probe needle that contacts a device to be inspected, and a probe card below the probe card in the housing. A configuration may be provided that includes a support member that movably supports the test object at a position, and a connection member that connects the probe card and the test head.

  According to the present invention, a motor, two support arms provided on both sides of the motor and supporting the test head in a rotatable manner, and a gear portion having a gear for transmitting the power of the motor to the two support arms are provided. With this configuration, the drive system including the motor can be positioned at the center of the turning shaft. For this reason, the drive system can be made small and lightweight, and the stress is uniform and the twist is small. In addition, since a shaft for transmitting power is not required, a loss of turning power and a turning position loss due to twisting between the driving power and the actual turning portion are small. Further, the drive system including the motor can be reduced, and the motor and the like are arranged in the dead space between the support arms, so that the footprint can be reduced and the size can be reduced.

It is a front view showing the probe device provided with the test head turning mechanism concerning one embodiment of the present invention. It is a perspective view which shows the principal part of the probe device of FIG. FIG. 2 is a block diagram illustrating a control unit of the probe device of FIG. 1. FIG. 2 is a perspective view showing a test head turning mechanism according to one embodiment of the present invention. FIG. 3 is a front view showing a drive system of the test head turning mechanism according to the embodiment of the present invention. FIG. 2 is an exploded perspective view showing a main part of a test head turning mechanism according to one embodiment of the present invention. FIG. 5 is a plan view for comparing and explaining a conventional test head turning mechanism and a test head turning mechanism according to an embodiment of the present invention. Regarding the test head turning mechanism of the conventional example and the test head turning mechanism of the example of the present invention in Experimental Example 1, two support arms (front and rear) with and without the test head load at the position where the turning angle is 0 °. FIG. 9 is a diagram for explaining the measurement positions of the displacement of the arm and the rear arm) and the tip of the head, and a diagram showing the results of measuring the displacement at those measurement positions. Results of comparison of the displacement amount in the X direction at the time of 180 ° rotation at the front arm and rear arm positions of the test head turning mechanism of the conventional example and the test head turning mechanism of the present invention in Experimental Example 2, and the test head of the conventional example It is a figure which shows the amount of displacement of the X direction in each rotation angle in the front arm and the rear arm position of the rotation mechanism and the test head rotation mechanism of this invention example, and the reproducibility when the rotation angle returns to 0 degree. It is a perspective view showing a modification of a test head turning mechanism.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<Probe device>
First, an entire probe device, which is an inspection device provided with a test head turning mechanism according to an embodiment of the present invention, will be described.
FIG. 1 is a front view showing a probe device provided with a test head turning mechanism according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a main part thereof.

  The probe device 100 is provided with a probe device main body 1 constituting an inspection unit for performing an electrical inspection of an object to be inspected, for example, a semiconductor wafer (hereinafter, simply referred to as a wafer) W, and is rotatably provided on the probe device main body 1. It has a test head 2, a test head turning mechanism 3 for turning the test head 2, a loader unit 4 for transferring wafers loaded and unloaded in cassette units one by one to the probe device main body, and a control unit 5. Note that the control unit 5 is partially cut away in FIG. 1, and the loader unit is not illustrated in FIG. 2.

  As shown in FIG. 1, the probe device main body 1 includes a housing 11, a top plate of the housing 11, a head plate 12 having a circular hole 12 a formed in the center, and a hole 12 a of the head plate 12. It has a probe card 13 having a probe needle (contact) 13 a attached to a corresponding position, and a mounting table 14 on which a wafer W is mounted below the probe card 13.

  The mounting table 14 can be moved in the X, Y, Z, and θ directions by an XY table mechanism, a Z-direction moving mechanism, and a θ-direction moving mechanism (all not shown), and the wafer W is inspected in a predetermined manner. The position is determined.

  The probe needles (contacts) 13a of the probe card 13 are connected to terminals of IC chips on the wafer W. When the test head 2 is located at the inspection position immediately above the probe device main body 1, a connection terminal (not shown) on the upper surface of the probe card 13 is connected to the test head 2 via the connection ring 15. ing.

  The test head 2 electrically relays between the probe card 13 and a tester (not shown in FIGS. 1 and 2). The test head 2 is configured by mounting a large number of electronic components for inspection of a wafer W to be inspected, for example, constitutes a heavy object of about 300 kg, and is formed of a frame made of a highly rigid material. 21 and is attached to the frame 21. The test head turning mechanism 3 turns the test head 2 through the frame 21. If the test head 2 has sufficient rigidity, the test head 2 may be turned directly without passing through the frame 21. The test head turning mechanism 3 turns the test head 2 between an inspection position on the probe device main body 1 and a maintenance area 6 separated from the inspection position, and is capable of turning at a maximum of 180 °. I have. The details of the test head turning mechanism 3 will be described later.

  As shown in FIG. 3, the control unit 5 controls each component of the probe device 100, that is, the CPU that controls the probe device main body 1, the test head turning mechanism 3, the loader unit 4, and the tester 7 (only FIG. 3 is shown). A main control unit 51 having an input unit 52 such as a keyboard, a mouse, and a remote controller, an output unit 53 such as a printer, a display unit 54 such as a display, and a storage unit 55 for storing information necessary for control. are doing. In the inspection mode, the main control unit 51 sets a storage medium in which the processing recipe is stored in the storage unit 55, and causes the probe device 100 to perform a predetermined inspection processing operation based on the processing recipe called from the storage medium. Let it run. Further, as described later, in the maintenance mode, the main control unit 51 controls the test head turning mechanism 3 by operating the input unit 52, for example, a remote controller, to turn the test head 2 to a predetermined angle up to 180 °. .

  In the probe device 100 configured as described above, the wafer W is transferred from the loader unit 4 to the probe device main body 1 and is mounted on the mounting table 14 and fixed by suction. Then, the probe card 13 of the probe device main body 1 and the test head 2 are electrically connected via the connection ring 15 while the test head 2 is located at the inspection position immediately above the probe device main body 1. In this state, the mounting table 14 is moved to X, Y and θ to position the terminals of the wafer W with respect to the probe needles 13 a of the probe card 13. Thereafter, when the mounting table 14 is overdriven in the Z direction, the probe needles 13a and the terminals of the IC chips on the wafer W come into electrical contact, and the IC chips are electrically inspected.

  After such an operation is repeatedly performed to complete the electrical inspection of one wafer W, the wafers are replaced and the electrical inspection is continuously performed on a predetermined number of wafers stored in the cassette.

  When maintenance of the probe device 100 is performed, the test head 2 is rotated by a predetermined angle up to 180 ° by the test head rotation mechanism 3 to be positioned in the maintenance area 6. FIG. 1 shows a state where the test head 2 is turned 90 ° and a state where the test head 2 is turned 180 °.

<Test head swivel mechanism>
Next, the test head turning mechanism 3 will be described more specifically.
4 is a perspective view showing the test head turning mechanism 3, FIG. 5 is a front view showing a drive system of the test head turning mechanism 3, and FIG. 6 is an exploded perspective view showing a main part of the test head turning mechanism 3.

  As shown in FIG. 4, the test head swivel mechanism 3 swivels the test head 2 around a swivel axis O. The test head swivel mechanism 3 includes two support arms 31 for rotatably supporting the test head 2 and a support arm 31. And a drive unit 32 that drives the test head 2 to rotate via the pedestal 39. As described above, the test head 2 is attached to the frame 21 while being housed in the frame 21, and the support arm 31 is connected to the frame 21 and the test head 2 is However, the test head 2 may be directly supported.

  The drive unit 32 has a motor 33 and a gear unit 34 provided in a housing 36, and the two support arms 31 are arranged on both sides of the motor 33 at positions symmetrical to the motor 33. Have been. The motor 33 is composed of, for example, a servomotor, and outputs power in a direction orthogonal to the turning axis O. The gear section 34 has a gear for transmitting the power of the motor 33 to the two support arms 31.

  In detail, the output shaft of the motor 33 extends vertically upward (Z direction) (Z-direction mounting), and the gear unit 34 rotates the output shaft of the motor 33 around a rotation axis O orthogonal to the gear by a gear. The rotation is converted and transmitted to the support arm 31. The gear portion 34 functions as a pre-stage reduction gear of the motor 33, and is configured as a reduction gear with a worm gear having a worm gear, for example.

  The drive section 32 further has two rear-stage speed reducers 35 provided between the gear section 34 and the two support arms 31 respectively. That is, the output shaft of the gear unit 34 protrudes outward from the two side plates 37 of the housing 36, and the two rear-stage speed reducers 35 are fixed to the respective side plates 37 and are connected to the output shaft of the gear unit 34. It is connected. The support arm 31 is fixed to the output shaft of the rear-stage speed reducer 35, and the output of the rear-stage speed reducer 35 causes the support arm 31 to rotate around the revolving axis O, and the test head Turn 2 The rear-stage speed reducer 35 has a function of further reducing the rotation shaft speed reduced by the gear portion 34 and transmitting the reduced speed to the support arm 31, and is configured by, for example, a planetary gear type speed reducer. As the planetary gear type reduction gear, a cyclo reduction gear can be mentioned. The two rear reduction gears 35 are also disposed at positions symmetrical with respect to the motor 33.

  A motor 33 and a housing 36 are mounted on the upper surface of the pedestal 39, and two mechanical stoppers 38 are mounted so as to correspond to the two rear reduction gears 35, respectively. In FIG. 4, reference numeral 40 denotes an electric box.

  The test head turning mechanism 3 is controlled by the control unit 5 as described above. For example, by operating an input unit 52, for example, a remote controller, a drive signal is output from the main control unit 51 to the motor 33, and the test head 2 is turned at a predetermined angle up to 180 °. The control at this time is to set an appropriate turning angle and turn on the turning switch, so that the test head 2 turns to the set turning angle in an automatic mode. For example, the turning switch is kept ON. As a result, the test head 2 keeps turning, and by turning off the turning switch, the test head 2 can be turned in two modes of the manual mode in which the turning of the test head 2 is stopped at an arbitrary position. Also, by turning on the manual mode switch while the test head 2 is controlled to rotate to the set angle in the automatic mode, the automatic mode of the test head 2 is stopped, and the test head 2 is set to the set angle. It is controlled so that it switches to the manual mode before turning.

  In the test head turning mechanism 3 configured as described above, in the maintenance mode, by operating the input unit 52 of the control unit 5 as described above, a turning command is issued from the main control unit 51 to the test head turning mechanism 3. The test head 2 is turned to a predetermined angle up to 180 ° shown in FIG. Note that FIG. 1 shows positions at a turning angle of 0 ° (the test head 2 is located on the probe device main body 1), 90 °, and 180 °.

  At this time, as shown in FIG. 7 (a), the conventional test head turning mechanism 3 'includes a shaft 61 serving as a turning shaft for turning the test head, and a shaft 2 connecting the frame 21 of the test head 2 and the shaft 61. And a drive system 63 attached to one side of the shaft 61 and disposed outside the one support arm 62 and having a structure in which a motor and a speed reducer are integrated. Then, the power of the drive system 63 is transmitted to the support arm 62 via the shaft 61 as turning power.

  In this case, the conventional test head turning mechanism 3 ′ has the support arm even if the test head 2 is large and heavy and has high rigidity because the drive system 63 is on one side and not at the center of the turning axis. 62 has a stress concentration on one side and transmits the turning power via the shaft 61. Therefore, when turning the test head 2 which is a heavy object, the driving power and the actual turning portion generate the turning power. Turning position loss due to loss and torsion is likely to occur. In addition, since the size of the drive system 63 is large and the drive system 63 protrudes outside one of the support arms, the footprint is increased accordingly.

  On the other hand, as shown in FIG. 7B, the test head turning mechanism 3 of the present embodiment has two support members connected to the frame 21 of the test head 2 as shown in FIG. 7B. The arms 31 are provided on both sides of the motor 33, and the rotation axis of the motor 33 is in the Z direction, and its power is transmitted to the support arm 31 via the gear unit 34. Therefore, the drive system including the motor 33 can be positioned at the center of the turning shaft, so that the drive system can be reduced in size and weight, and the stress is uniform and the twist is small. In addition, since a shaft for transmitting power is not required, a loss of turning power and a turning position loss due to twisting between the driving power and the actual turning portion are small. At this time, by providing the support arms 31 on both sides of the motor 33 so as to be symmetrical with respect to the motor 33, the stress can be made more uniform. In addition, the drive unit 32 including the motor 33 can be reduced in size, and the motor 33 and the like are arranged in the dead space between the support arms 31, so that the footprint can be reduced and the size can be reduced.

  Further, since the power of the motor 33 is transmitted to the support arm 31 via the gear portion 34, the gear portion 34 functions as a speed reducer, and when the motor 33 is stopped, the test head 2 is moved to an accurate position. The vehicle can be stopped, and the stop position can be maintained at a predetermined position. In particular, by using a speed reducer with a worm gear having a worm gear as the gear portion 34, the deceleration performance and the brake performance are high, the test head 2 can be stopped at an extremely accurate position, and the stop position is maintained at a predetermined position. Is extremely high. Therefore, it is possible to effectively prevent the test head 2 from dropping, and it is possible to effectively prevent damage to the tester and human damage with high safety.

  Further, by providing the rear-stage speed reducer 35 between the gear portion 34 as the front-stage speed reducer and the two support arms 31, the stopping performance of the test head 2 when the motor 33 is stopped can be further improved. . In particular, by using a planetary gear type reduction gear such as a cyclo reduction gear as the rear reduction gear 35, the reduction performance can be enhanced. Further, by providing the two rear-stage speed reducers 35 symmetrically with respect to the motor 33, the uniformity of stress can be further improved.

  Furthermore, by operating the input unit 52 of the control unit 5, for example, the remote controller, the test head 2 is turned to the predetermined turning angle when the test head 2 is controlled to turn to a predetermined angle up to 180 °. Since the test mode can be performed in two modes, an automatic mode and a manual mode in which the test head 2 turns and stops manually, the maintenance property is good. Further, since the mode can be switched to the manual mode while the test head 2 is rotating in the automatic mode, the angle set in the automatic mode can be changed when the stop position of the test head 2 is changed during the automatic mode. There is no need to wait until the test head 2 reaches the position.

<Example of experiment>
Next, an experimental example will be described.
(Experimental example 1)
Here, regarding the test head turning mechanism of the conventional example and the test head turning mechanism of the present invention, two support arms (front arm and The displacement of the rear arm) and the tip of the head were measured.

  FIG. 8 is a diagram showing the displacement measurement position (plane position) and the measurement result at this time. FIG. 8A shows a plane position of a displacement measuring unit in a conventional test head turning mechanism and a displacement measurement result, and FIG. 8B shows a plane position of the displacement measuring unit in the test head turning mechanism of the present invention. And the results of the displacement measurements The displacement of the head tip is a result of measuring the displacement of the lower surface at the center of the tip of the frame, and the displacement of the front arm and the rear arm is a result of measuring the displacement of the base end of the front arm and the rear arm. As shown, the right side is the front side (FS) and the left side is the rear side (RS). In the X direction, the tip side of the test head is +, the opposite side is-, the Y direction is + toward the front side, the-direction is toward the rear side, and the Z direction is + in the downward direction and-in the upward direction. . The head tip displacement is a downward displacement.

  As shown in FIG. 8, the displacement of the two support arms and the displacement of the tip of the head when the load of the test head is applied are smaller in the example of the present invention than in the conventional example, and the rigidity of the example of the present invention is lower. It was confirmed that it was high.

(Experimental example 2)
Here, the displacement amount of the support arm when the test head was turned was measured for the conventional test head turning mechanism and the test head turning mechanism of the present invention.

  First, the displacement amounts in the X direction at the time of 180 ° turning at the front arm and rear arm positions of the test head turning mechanism of the conventional example and the test head turning mechanism of the present invention were compared. FIG. 9A shows the result. FIG. 9A plots the displacement amount of the front arm position and the displacement amount of the rear arm position in the conventional example and the present invention example by taking the position in the direction of the pivot axis on the horizontal axis and the displacement amount on the vertical axis. A straight line connecting the plots of the respective front arm positions and the plots of the rear arm positions is drawn, and the displacement amounts of the conventional example and the present invention are compared at the front arm position and the rear arm position of the conventional example. This is to eliminate a difference in displacement due to a difference in the position of the front arm and the rear arm between the conventional example and the present invention. The displacement of the front arm position and the rear arm position is a displacement in the X direction.

  As shown in FIG. 9A, in the example of the present invention, as a result of calculating the displacement amount extrapolated to the front arm position and the rear arm position of the conventional example, the displacement amount was 810 μm at the front arm position and 701 μm at the rear arm position, Was 109 μm, but in the conventional example, the displacement amount of the front arm position was 327 μm, the displacement amount of the rear arm position was 1628 μm, and the displacement difference was 1301 μm. As described above, in the example of the present invention, the displacement difference between the front arm position and the rear arm position was smaller than in the conventional example, and it was confirmed that the rigidity balance of the example of the present invention was better. Also, the maximum displacement was smaller in the example of the present invention than in the conventional example, and it was confirmed that the test head turning mechanism of the present example had higher rigidity than the test head turning mechanism of the conventional example.

  FIGS. 9B and 9C show that the displacement amount in the X direction and the turning angle at each turning angle at the front arm and rear arm positions of the test head turning mechanism of the conventional example and the test head turning mechanism of the present invention are 0. FIG. 9 is a diagram showing reproducibility when the temperature returns to °. The displacement amounts of the front arm and the rear arm of the present invention at the turning angles of 90 ° and 180 ° are values extrapolated to the positions of the front arm and the rear arm of the conventional example, as shown in FIG. is there. As shown in FIGS. 9B and 9C, the displacement difference between the front arm position and the rear arm position is smaller and the maximum displacement amount is smaller in the example of the present invention regardless of the turning angle. In addition, the displacement amount when the turning angle returned to 0 ° was almost 0 in both the conventional example and the present invention example, and the 0 ° reproducibility was good in each case.

<Other applications>
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the concept of the present invention. For example, in the above-described embodiment, an example in which the test head turning mechanism performs only the turning drive of the test head has been described. May be provided. The lifting mechanism 70 is not particularly limited, and may be a ball screw mechanism using a motor or the like, or may be a cylinder mechanism.

  Further, in the above-described embodiment, an example in which the two-stage speed reducer including the gear unit 34 functioning as the first-stage speed reducer and the second-stage speed reducer 35 is used. It may be.

  Further, the inspection device to which the test head turning mechanism of the present invention is applied is not limited to the probe device of the above-described embodiment, but may have various configurations.

DESCRIPTION OF SYMBOLS 1; Probe apparatus main body 2; Test head 3; Test head turning mechanism 4; Loader part 5; Control part 6; Maintenance area 11; Housing 13; Probe card 14; Mounting table 15; Arm 32; drive unit 33; motor 34; gear unit 35; rear-stage reducer 51; main control unit 52; input unit 53; output unit 54; display unit 55; storage unit 70;

Claims (12)

A test head turning mechanism for turning a test head around a turning axis in an inspection device for inspecting electrical characteristics of a substrate,
A motor that outputs power in a direction orthogonal to the turning axis,
Two support arms provided on both sides of the motor for pivotally supporting the test head;
A gear portion having a gear for transmitting the power of the motor to the two support arms. The test head turning mechanism according to claim 1, wherein the two support arms are arranged at positions symmetrical with respect to the motor.   The test head turning mechanism according to claim 1, wherein the gear unit includes a worm gear.   4. The test head turning mechanism according to claim 1, further comprising two rear-stage speed reducers provided between the gear portion and the two support arms. 5. .   The test head turning mechanism according to claim 4, wherein the two rear reduction gears are arranged at positions symmetrical with respect to the motor.   The test head turning mechanism according to claim 4, wherein the second-stage speed reducer includes a planetary gear type speed reducer.   7. The test head turning mechanism according to claim 6, wherein a cyclo reducer is used as the planetary gear reducer.   8. The apparatus according to claim 1, wherein the test head is housed in a frame, and the support arm supports the test head via the frame. 9. Test head swivel mechanism.   The test apparatus further includes a control unit that controls turning of the test head, the control unit includes a main control unit that controls driving of the motor, and an input unit that inputs a turning mode, and the main control unit includes: By an operation of the input unit, an automatic mode in which the test head automatically turns up to a set turning angle, and a manual mode in which the test head is turned and stopped manually and the test head is stopped at an arbitrary position. While controlling to operate, when switching to the manual mode in the middle of controlling the test head to rotate to a set angle in the automatic mode, the automatic mode is stopped and the test head is stopped. The method according to any one of claims 1 to 8, wherein control is performed so as to switch to the manual mode before the vehicle turns to a set angle. Head turning mechanism.   The test head turning mechanism according to any one of claims 1 to 9, further comprising a lifting mechanism that raises and lowers the test head. An inspection device main body for measuring the electrical characteristics of the device under test,
A test head having an electronic component for inspection of the inspection object,
A test head turning mechanism that turns the test head between an inspection position on the inspection device main body and a maintenance area separated from the inspection position,
An inspection apparatus, wherein the test head turning mechanism has a configuration according to any one of claims 1 to 10. The inspection device body,
A housing,
A probe card provided in the housing and having a probe needle that comes into contact with the test object,
A support member that movably supports the device under test at a position below the probe card in the housing,
The inspection apparatus according to claim 11, further comprising a connection member that connects the probe card and the test head.

Images