JP6645086B2 - Fluid mixing device - Google Patents

Description

  The present invention relates to a fluid mixing device, and more particularly to a fluid mixing device that mixes fluid substances.

  As for a fluid mixing device for mixing fluid substances, for example, Patent Literature 1 discloses a technology related to a stacked non-motion type mixing device. The technique described in Patent Document 1 includes a plurality of biscuit-type members. Each of these biscuit-type members has a plurality of peripheral openings. In the technique described in Patent Document 1, the peripheral opening portions of these biscuit-type members are arranged so as to be staggered. Thus, in the technique described in Patent Document 1, the fluid is passed through the peripheral opening of each biscuit-type member, and separation and merging of the fluid substance are repeated to mix the fluid substance.

JP-A-01-317533

  However, in the technique described in Patent Document 1, as described above, since the peripheral openings are staggered, the passage area of the fluid substance is reduced. For this reason, the technology described in Patent Document 1 described above reduces the ability of the fluid material to flow down. Particularly, when the fluid material is a highly viscous fluid material such as a solder paste, the ability to flow down is significantly reduced. I will.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a fluid mixing apparatus that can mix a fluid substance having a high viscosity such as a solder paste without significantly lowering the flowing ability.

  In order to achieve the above object, a fluid mixing device according to the present invention is provided with a pipe through which a fluid substance passes, and a pipe provided in the pipe along the axial direction thereof, and a plurality of flow areas in the pipe. A first and a second partition section for partitioning into a road, wherein each of the first and second partition sections has a predetermined thickness on a surface for receiving the fluid substance passing through the inside of the pipe. And causing the fluid substance to flow down in a plurality of different directions on the surface thereof, wherein at least one of the flow paths of the first partition is at least one of the flow paths of the second partition. , And are provided so as to communicate with at least two flow paths.

  ADVANTAGE OF THE INVENTION According to this invention, even if it is a highly viscous fluid substance like a solder paste, this fluid substance can be mixed, without remarkably lowering the flow-down ability.

It is a perspective view and a top view of a plurality of pipes of a fluid mixing device concerning one embodiment (first embodiment) of the present invention. FIG. 9 is a perspective view of a fluid mixing device according to another embodiment (second embodiment) of the present invention. FIG. 3 is a sectional view showing a line II ′ in FIG. 2. It is the perspective view and top view of the pipe | tube of the fluid mixing device which concerns on another embodiment (2nd Embodiment) of this invention. It is sectional drawing of the 1st pipe of the pipe | tube of the fluid mixing device which concerns on another embodiment (2nd embodiment) of this invention. It is a conceptual diagram showing operation of a fluid mixing device concerning other embodiments (a 2nd embodiment) of the present invention. It is a top view showing the modification of the pipe of the fluid mixing device concerning other embodiments (a 2nd embodiment) of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
One embodiment (first embodiment) of the present invention will be described with reference to FIG. FIG. 1 is a perspective view and a plan view of a plurality of tubes 140 and 150 of a fluid mixing device 100 according to the present embodiment (first embodiment).

  The fluid mixing device 100 includes a pipe 140 that allows a fluid substance to pass through the pipe, and a first partition 141 that is disposed in the pipe 140 along the axial direction thereof and that partitions the entire area of the pipe into a plurality of flow paths. And a second partition 151. Since the fluid material is allowed to pass through all the regions other than the partition 141 and the partition 151, a region through which the fluid material passes is secured. Thereby, for example, even if the fluid substance is a highly viscous substance, clogging in the pipe is suppressed.

  Each of the first partition 141 and the second partition 151 is formed to have a predetermined thickness on a surface that receives a fluid substance passing through the inside of the pipe 140. Here, the surface receiving the fluid substance refers to the upper surfaces of the first partition 141 and the second partition 151. The predetermined thickness may be any thickness that allows the fluid substance to be diverted on the upper surface, and for example, refers to a thickness of about 1 mm to 2 mm. The first partition 141 and the second partition 151 allow the fluid substance to flow down on the surface thereof in a plurality of different directions. As described above, the first partition 141 and the second partition 151 allow the fluid substance flowing in the pipe to flow down in a plurality of different directions depending on the thickness of the plate on the surface receiving the fluid substance. The fluid substance is caused to flow in all directions in the pipe.

  In addition, each flow path of the first partition 141 is disposed so as to communicate with at least two of the flow paths of the second partition 151. As a result, in the pipe, the branching and joining of the fluid substance are repeated, and the fluid substance is mixed.

  Therefore, according to the fluid mixing device 100 of the present embodiment, even with a highly viscous fluid substance such as a solder paste, the fluid substance can be mixed without significantly lowering the flow-down ability.

(Second embodiment)
Another embodiment (second embodiment) of the present invention will be described with reference to FIGS. First, the configuration of the fluid mixing device 200 will be described with reference to FIGS. FIG. 2 is a perspective view of a fluid mixing device 200 according to the present embodiment (second embodiment). FIG. 3 is a sectional view showing a line II ′ in FIG. 2. The fluid mixing device 200 includes a container 210, a disk-shaped member 220, and a tube 230.

  The container 210 is formed in a cylindrical shape, and houses the disk-shaped member 220 and the pipe 230 inside. The container 210 contains the solder paste 209. Here, the solder paste 209 is accommodated between the top cover 211 of the container 210 and the disk-shaped member 220. Accordingly, when the container 210 is moved to the disk-shaped member 220 side by a pressing mechanism (not shown), the solder paste 209 is compressed by the top cover 211 and the disk-shaped member 220 and inserted into the disk-shaped member 220. Into the pipe 230 which is open.

  The disk-shaped member 220 has an outer diameter substantially equal to the diameter of the inner peripheral surface of the container 210. The disk-shaped member 220 is formed using a resin material. A circular hole is formed in the disk-shaped member 220, and the tube 230 is inserted through the hole. As described above, the fluid mixing device 200 allows the pipe 230 to pass through the hole of the disc-shaped member 220, and inserts the pipe 230 into the space between the top cover 211 of the vessel 210 and the disc-shaped member 220 in the vessel 210. Is communicated to. That is, in the fluid mixing device 200, the container 210 and the disk-shaped member 220 constitute, for example, an injection cylinder (syringe) of a syringe. As a result, the fluid mixing device 200 compresses the solder 209 between the top cover 211 of the container 210 and the disk-shaped member 220, and causes the solder 209 to flow into the tube 230, as described above.

  Next, the configuration of the pipe 230 of the fluid mixing device 200 will be described with reference to FIGS. FIG. 4 is a perspective view and a plan view of a first pipe 240 of the pipe 230 of the fluid mixing device 200 according to the present embodiment (second embodiment). FIG. 5 is a cross-sectional view of the first pipe 240 of the pipe 230 of the fluid mixing device 200 according to the present embodiment (second embodiment).

  In the present embodiment, the tube 230 has a first tube 240, a second tube 250, and a third tube 260. The tube 230 has the first tube 240, the second tube 250, and the third tube 260 arranged along the axis thereof. The first pipe 240, the second pipe 250, and the third pipe 260 are arranged such that the flow paths 242, 252, and 262 are shifted from each other. Thereby, the solder paste 209 is passed through the flow paths 242, 252, and 262 of the first tube 240, the second tube 250, and the third tube 260, and the branching and joining of the solder paste 209 are repeated. The solder paste 209 can be mixed.

  In addition, in this embodiment, although the pipe | tube 230 is comprised from three pipe | tubes, if it consists of several pipe | tubes, the number will not be limited. Further, since the first tube 240, the second tube 250, and the third tube 260 have the same configuration, the first tube 240 will be described, and the second tube 250 and the third tube 260 will be described. The description of is omitted.

  The first tube 240 is formed in a cylindrical shape. The first tube 240 has a partition 241. The partition part 241 is configured using a plate-shaped member having a predetermined resistance value at the inflow port and having a predetermined resistance value with respect to the solder paste 209 that passes through the inside of the first tube 240. The partition 241 partitions the entire area other than the area of the partition 241 in the pipe into a plurality of flow paths 242. In the present embodiment, the partition 241 is arranged in a cross shape when the partition 241 is viewed in plan. As a result, a flow path 242 divided into four sections is formed in the entire area other than the area of the partition section 241 in the first pipe 240. Here, the thickness of the plate when the partition 241 is viewed in a plan view may be any thickness that can change the flow of the fluid substance on the surface, and for example, refers to a thickness of about 1 mm to 2 mm.

  As described above, the partition portion 241 changes the flow of the solder paste 209 by the thickness of the plate with respect to the solder paste 209 flowing in the first tube 240, and divides the flow into the respective flow paths 242. In the present embodiment, the solder paste 209 is allowed to pass through the entire area of the first tube 240 other than the partition 241, and the area through which the solder paste 209 passes is secured. It suppresses a decrease in flow capacity.

  Further, the first tube 240 has an uneven portion 243. This uneven portion 243 is located on the inner peripheral wall surface of the first tube 240. Accordingly, when the solder paste 209 passes through the first tube 240, the flow of the solder paste 209 is directed to the partition 241 side, and the fluidity of the solder paste 209 can be increased in the tube. .

  As described above, the first tube 240, the second tube 250, and the third tube 260 flow down the solder paste 209 in a plurality of different directions depending on the thickness of the plate on the surface that receives the solder paste 209. Then, the solder paste 209 is caused to flow in all directions in the tube. In addition, since the solder paste 209 is allowed to pass through the entire area other than the partition part 241 in the first tube 240, an area through which the solder paste 209 passes is secured. Thereby, clogging of a highly viscous substance such as the solder paste 209 is suppressed.

  The first pipe 240, the second pipe 250, and the third pipe 260 are arranged such that the flow paths 242, 252, and 262 are shifted from each other. Thereby, the solder paste 209 is passed through the flow paths 242, 252, and 262 of the first tube 240, the second tube 250, and the third tube 260, and the branching and joining of the solder paste 209 are repeated. The solder paste 209 can be mixed.

  Therefore, according to the fluid mixing device 200 of the present embodiment, even with a highly viscous fluid substance such as the solder paste 209, the solder paste 209 can be mixed without significantly lowering the flowing ability.

(motion)
Next, the operation of the fluid mixing device 200 will be described with reference to FIG. FIG. 6 is a conceptual diagram showing the operation of the fluid mixing device 200 according to the present embodiment (second embodiment).

  When pressure is applied to the container 210 from above by a pressure mechanism (not shown), the container 210 is lowered. At this time, the solder paste 209 in the container 210 is compressed by the upper cover 211 of the container 210 and the disk-shaped member 220 and flows into the tube 230.

  Here, the pipe 230 has the first pipe 240, the second pipe 250, and the third pipe 260 as described above, and the flow paths 242, 252, and 262 of these pipes are arranged to be shifted from each other. are doing. Thereby, the solder paste 209 is mixed more efficiently by repeating the mixed flow in the tube.

  Further, each tube has the uneven portion 243 as described above. Accordingly, when the solder paste 209 passes through each tube, the fluidity of the solder paste 209 can be increased in the tubes, and the solder paste 209 can be mixed.

  Therefore, according to the fluid mixing device 200 of the present embodiment, even with a highly viscous fluid substance such as the solder paste 209, the solder paste 209 can be mixed without significantly lowering the flowing ability.

(Modification)
Next, a modification of the fluid mixing device 200 will be described with reference to FIG. FIG. 7 is a plan view showing a modified example of the pipe 230 of the fluid mixing device 200 according to the present embodiment (second embodiment). In this modification, the shape of the section of the tube is triangular in plan view, corrugated in plan view, or a combination of cross shape in plan view, triangular shape in plan view, and wave shape in plan view.

  Thus, the effect of mixing the solder paste 209 can be enhanced by changing various shapes and combinations. By changing the combination, the viscosity can be adjusted.

Reference Signs List 100 fluid mixing device 140 pipe 141, 151 partition

Claims (6)

A pipe through which the fluid substance passes,
A first and a second partition portion disposed in the pipe of the pipe along the axial direction thereof, and partitioning the entire area of the pipe into a plurality of flow paths;
Each of the first and second partitions is
On the surface receiving the fluid substance passing through the inside of the pipe, a predetermined thickness is formed, and the fluid substance is caused to flow down in a plurality of different directions on the surface,
At least one channel among the channels of the first partition portion is
Among the respective flow paths of the second partition, the communication section is disposed so as to communicate with at least two flow paths ,
At least one of the first partition and the second partition is formed such that an orthogonal projection to a plane perpendicular to the axial direction of the tube is formed in a cross shape. apparatus. A pipe through which the fluid substance passes,
A first and a second partition portion disposed in the pipe of the pipe along the axial direction thereof, and partitioning the entire area of the pipe into a plurality of flow paths;
Each of the first and second partitions is
On the surface receiving the fluid substance passing through the inside of the pipe, a predetermined thickness is formed, and the fluid substance is caused to flow down in a plurality of different directions on the surface,
At least one channel among the channels of the first partition portion is
Of the respective flow paths of the second partition portion, disposed in communication with at least two flow paths ,
At least one of the first partition and the second partition is formed such that an orthogonal projection to a plane perpendicular to the axial direction of the tube is formed in a triangular shape. apparatus. A pipe through which the fluid substance passes,
A first and a second partition portion disposed in the pipe of the pipe along the axial direction thereof, and partitioning the entire area of the pipe into a plurality of flow paths;
Each of the first and second partitions is
On the surface receiving the fluid substance passing through the inside of the pipe, a predetermined thickness is formed, and the fluid substance is caused to flow down in a plurality of different directions on the surface,
At least one channel among the channels of the first partition portion is
Among the respective flow paths of the second partition, the communication section is disposed so as to communicate with at least two flow paths ,
A fluid mixing device , wherein at least one of the first partition and the second partition is formed such that an orthographic projection onto a plane perpendicular to the axial direction of the tube is formed in a wavy shape. . An uneven portion is formed on the inner peripheral wall surface of the tube,
The fluid mixing device according to any one of claims 1 to 3, wherein: The first partition and the second partition have a cross shape, a triangular shape, or a wavy shape, and are formed in different shapes.
The fluid mixing device according to any one of claims 1 to 4, wherein: An uneven portion is formed on at least one wall surface of the first partition portion and the second partition portion ,
The fluid mixing device according to any one of claims 1 to 5, wherein:

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