JP6628129B2 - Method for manufacturing pattern-formed substrate, substrate for break-in, and combination of substrates - Google Patents

Description

  The present invention relates to a method of manufacturing a pattern-formed substrate manufactured by performing an imprint method, and a break-in substrate used in a break-in imprint process performed in a process of manufacturing a pattern-formed substrate manufactured by performing an imprint method. As well as a combination of substrates.

  In the imprint method, for example, a mold (template) having a fine uneven pattern formed on a surface thereof is pressed (imprinted) onto a substrate such as a wafer on which a material such as a resin material is applied. This is a technique of mechanically deforming and transferring a pattern to a molding material.

  The template used in the imprint method, once manufactured, can repeatedly produce a molded body on which a fine concavo-convex pattern is transferred, so that high throughput is obtained and economical, and the emission of harmful waste is reduced. Can be suppressed. For this reason, in recent years, applications have been advanced in various fields.

  The template used in such an imprint method is generally manufactured by an electron beam lithography method. According to the electron beam lithography method, an electron beam resist is applied to the surface of the template substrate, an electron beam is drawn on the electron beam resist to form a resist pattern, and the template substrate is etched using the resist pattern as an etching mask. Thus, an uneven pattern can be formed.

  The template manufactured by the electron beam lithography method as described above is manufactured by performing drawing for a long time using an expensive electron beam drawing apparatus, and thus has a problem that the manufacturing cost is extremely high. Therefore, when a template manufactured by an electron beam lithography method is actually used in an imprint method, if the template is damaged immediately and cannot be reused, a very large loss occurs.

  Therefore, in the imprint method, a template manufactured by the electron beam lithography method is treated as a master template (master template), a replica template is manufactured from the master template by the imprint method, and the replica template is manufactured by the imprint method from the replica template. A method of manufacturing an article such as a substrate to be manufactured is generally adopted.

  According to the method of manufacturing a replica template from a master template in this way, a large number of replica templates can be manufactured at low cost. Therefore, even if the replica template is damaged, the manufacturing cost can be suppressed, and the replica template can be immediately replaced with a stock replica template, so that a decrease in productivity can be suppressed.

  By the way, a typical manufacturing procedure by the imprint method is, as a general rule, a step of applying a molding material to a base material before the molding material is applied, and a step of bringing the molding material into contact with a template to form the molding material. And a step of curing the material to be molded and releasing the template from the cured material to be molded and the template. The manufacturing procedure by such an imprint method is basically the same even when the replica template is manufactured from the master template as described above, or when the article to be manufactured is manufactured from the replica template. It is. In the case where a replica template is manufactured from a master template, it is common to etch the base material after release from the mold, using the molding material having the transferred and cured pattern as a mask.

  By the way, conventionally, various techniques for efficiently performing the above-described various steps in the imprint method have been proposed.

  For example, in Patent Document 1, a replica template substrate (hereinafter, referred to as a base material) that constitutes a replica template by being transferred after a pattern is transferred by being brought into contact with an uneven pattern of a master template via a molding material and then etched. , A substrate to be transferred). The transferred substrate has a convex step structure provided at the center and in which a pattern region to be contacted with the concavo-convex pattern of the master template is positioned higher than the periphery. According to the transferred substrate having such a step structure, when the molding material applied to the pattern region is brought into contact with the concave and convex pattern of the master template, the region around the pattern region and the region outside the concave and convex pattern of the master template are removed. Can be prevented from contacting with each other, so that the contact area between the molding material and the master template can be reduced. Thereby, mold release can be facilitated.

  Patent Document 2 discloses that a material containing a surfactant or the like as a release agent is used as a material to be pressed against a template.

JP 2013-175661 A JP 2007-523249 A

  By the way, when a replica template is manufactured from a master template, the master template and the replica template substrate, that is, separate from the transfer substrate in order to facilitate release from the molding material applied to the transfer substrate. Before preparing a replica template by performing an imprint method by preparing a substrate (hereinafter referred to as a break-in substrate), applying a molding material containing a release agent (surfactant) to the break-in substrate And imprinting using a master template (hereinafter, referred to as a break-in imprinting step).

  However, conventionally, when the break-in imprinting step is performed, the molding material may adhere to the outer periphery of the concave / convex pattern of the master template and may remain on the master template. In this case, the adhered molding material (hereinafter, referred to as a residual resin) may interfere with a part of the substrate to be subsequently imprinted, and the yield of the replica template may be reduced. In such a break-in imprint, the thickness of the material to be supplied to the substrate for break-in may be set to be larger than the thickness of the material to be applied to the substrate to be transferred. In this case, since the amount of the molding material increases, the amount of the molding material that protrudes from the concave and convex pattern of the master template during imprinting increases, and this is likely to remain on the master template. Tends to occur.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to allow a material to be molded supplied to a substrate to be transferred to properly contact a template, and a pattern is transferred by the template. An object of the present invention is to provide a method of manufacturing a pattern-formed substrate and a substrate for break-in, which can improve the yield of a pattern-formed substrate obtained from a material to be formed and a transferred substrate.

  The present invention is a method of manufacturing a pattern-formed substrate using a template having a concavo-convex pattern, comprising a substrate main body and a break-in substrate having a step structure provided with a pattern region on the surface while projecting from the substrate main body. Preparing a break-in substrate, preparing a break-in substrate, supplying a first forming material to the pattern region of the break-in substrate, and supplying the first forming material supplied to the pattern region of the break-in substrate A material, a break-in imprinting step of contacting the concavo-convex pattern of the template, and a first release step of releasing the template from the first molding material and the template in contact with the concavo-convex pattern of the template, A substrate to be transferred having a substrate body and a step structure protruding from the substrate body and having a pattern area on the surface is prepared. A transfer substrate preparing step, a second supply step of supplying a second molding material to the pattern area of the transfer substrate, and the second molding material supplied to the pattern area of the transfer substrate; A production imprinting step of contacting the concavo-convex pattern of the template, a second release step of releasing the template from the second molding material in contact with the concavo-convex pattern of the template, and the concavo-convex pattern A finishing step of obtaining a pattern-formed substrate from the second molding material to which the pattern has been transferred and the transferred substrate, wherein the step structure of the break-in substrate is a plan view, and the step structure of the transferred substrate is A method of manufacturing a pattern-formed substrate, which is larger than a step structure.

  The first molding material may contain a release agent.

  A chromium layer may be formed in the pattern area of the break-in substrate.

  The first molding material and the second molding material may each contain a photocurable resin.

  The photocurable resin of the first molding material and the photocurable resin of the second molding material may be the same material.

  The method for manufacturing a pattern-formed substrate includes a substrate main body, and a step structure protruding from the substrate main body and having a pattern region provided on a surface thereof. Preparing a second transfer substrate smaller than the structure, a third supply step of supplying a third molding material to the pattern area of the second transfer substrate, and forming the pattern of the second transfer substrate A second actual imprinting step of contacting the third molding material supplied to the region with the concavo-convex pattern of the template, and the third molding material and the template contacting the concavo-convex pattern of the template And a third release step of releasing the mold.

  The film thickness of the first molding material may be larger than the film thickness of the second molding material.

  Further, the present invention provides a substrate to be transferred having a substrate main body and a step structure which is projected from the substrate main body and has a stepped area provided on the surface thereof. Contacting the molding material supplied to the region, a break-in substrate used before transferring a pattern to the molding material, a substrate body, a pattern region on the surface while projecting from the substrate body. And a step structure provided, wherein the step structure is larger than the step structure of the transferred substrate in plan view, and the molding material supplied to the pattern region of the transferred substrate is Before transferring the pattern, a molding material is supplied to the pattern area, and is brought into contact with the concave-convex pattern of the template. It is.

  Further, the present invention is a combination of a substrate having a break-in substrate and a substrate to be transferred, wherein the break-in substrate has a first substrate body, a surface projecting from the first substrate body, and And a first step structure provided with a first pattern region, wherein the transferred substrate protrudes from the second substrate body and has a second pattern region on a surface thereof. And the second step structure of the break-in substrate is larger than the second step structure of the substrate to be transferred in plan view. It is a combination of characteristic substrates.

Further, the present invention uses a template having a concavo-convex pattern, forms a pattern on a substrate to be transferred having a mesa portion or a material to be molded disposed on the substrate to be transferred, and forms a pattern-forming substrate for manufacturing a pattern-forming substrate. In a manufacturing method, a substrate having a mesa portion which is larger in plan view than a mesa portion of the transferred substrate is prepared, and a first molding material containing a release agent is supplied to the mesa portion of the substrate; A step of bringing the template into contact with a first molding material, then releasing the mold, and adhering a release agent contained in the first molding material to the template; Supplying a second molding material, contacting the template with a release agent attached to the second molding material, and then releasing the mold to form a pattern on the second molding material; With putter A method of manufacturing a patterned substrate, characterized in that to obtain a patterned substrate from the second the molded material and the transfer substrate but formed a.
The manufacturing method may further include a step of etching the transfer substrate using the second molding material on which a pattern is formed as a mask, and the pattern formation substrate may be obtained by etching the transfer substrate. .

  According to the present invention, the molding material supplied to the transfer substrate and the template can be appropriately pressed, and the yield of the molding material having the pattern transferred by the template and the pattern formation substrate obtained from the transfer substrate can be reduced. Can be improved.

1 is a schematic diagram of an imprint processing apparatus used in a method for manufacturing a pattern forming substrate according to an embodiment of the present invention. FIG. 2 is a bottom view of a master template mounted on the imprint processing apparatus shown in FIG. 1. 1A shows a substrate used in a method for manufacturing a pattern-formed substrate according to an embodiment of the present invention, and FIG. 1A is a side view of a transferred substrate, which is a substrate before a pattern is formed by supplying a molding material. Yes, (B) is a plan view of the substrate to be transferred, (C) is a side view of the break-in substrate used in the break-in imprint process, and (D) is a plan view of the break-in substrate. . FIG. 4 is a process chart illustrating a method for manufacturing a pattern-formed substrate according to an embodiment of the present invention. FIG. 4 is a process chart illustrating a method for manufacturing a pattern-formed substrate according to an embodiment of the present invention. FIG. 4 is a process chart illustrating a method for manufacturing a pattern-formed substrate according to an embodiment of the present invention. FIG. 4 is a diagram showing a state in which a molding material adheres to a master template in a break-in imprint process in the method of manufacturing a pattern-formed substrate according to the embodiment of the present invention. FIG. 4 is a diagram showing a state in which a molding material adheres to a master template in a break-in imprint process in the method of manufacturing a pattern-formed substrate according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are exemplary, and features may be exaggerated for explanation purposes and may differ from actual products. In the following drawings, the same portions are denoted by the same reference numerals, and a detailed description thereof may be partially omitted.

(Imprint processing device)
FIG. 1 is a diagram showing a schematic configuration of an imprint processing apparatus 100 used in a method of manufacturing a pattern forming substrate according to an embodiment of the present invention. In the present embodiment, an example will be described in which a replica template as a pattern forming substrate is manufactured using the master template 110 mounted on the imprint processing apparatus 100. Note that the pattern-formed substrate means a substrate having a pattern.

  As shown in FIG. 1, the imprint processing apparatus 100 is arranged above a substrate 101 that holds a substrate such as a wafer and positions the substrate at a predetermined position while holding the substrate, and is disposed above the substrate held by the stage 101. And a chuck 102 that supports the master template 110.

  In FIG. 1, the substrate held by the stage 101 is indicated by a two-dot chain line. The stage 101 moves the substrate to a predetermined position by horizontally moving the substrate to be held as shown by an arrow H in the figure.

  FIG. 2 is a bottom view of the master template 110. As shown in FIGS. 1 and 2, the master template 110 has a rectangular outer shape, and a fine uneven pattern 111 is formed in a central region on a lower surface thereof. Here, the bottom surface and the lower surface are surfaces of the master template 110 that are in contact with the later-described break-in substrate 20 or the transferred substrate 10, and are the lower surfaces in FIG. The uneven pattern 111 is formed by an electron beam lithography method. That is, the master template 110 applies an electron beam resist to the surface of the template substrate, draws an electron beam on the electron beam resist to form a resist pattern, and etches the template substrate using the resist pattern as an etching mask. It is manufactured by forming the uneven pattern 111.

  Although the concavo-convex pattern 111 is schematically shown in the drawing, the height (depth of the concave portion), pitch, number, and arrangement area of the protruding portions of the concavo-convex pattern 111 (the concavo-convex pattern of the The occupied area) and the shape (line shape, dot shape (moth-eye shape, etc.)) are not particularly limited, and may be appropriately set according to the pattern forming substrate to be manufactured. The size of the concavo-convex pattern 111 is not particularly limited. For example, the width of the convex portion is 40 nm or less, preferably 10 to 30 nm, and the interval between adjacent convex portions is 40 nm or less, preferably 10 nm or less. ３０30 nm. In the present embodiment, the outer shape of the master template 110 is rectangular, but the outer shape of the master template 110 may be, for example, a circular shape.

  Further, the chuck 102 moves the master template 110 in the vertical direction as shown by the arrow V in the figure, thereby forming the uneven pattern 111 of the master template 110 and the molding material supplied to the substrate held on the stage 101. Is to be contacted. In the present embodiment, a composition containing a liquid photocurable resin is used as a molding material.

  Although not shown, the imprint processing apparatus 100 includes a dispenser head that supplies a material to be molded from above the substrate held on the stage 101, and a dispenser head that is disposed above the master template 110 and disposed on the stage 101. And a light source for irradiating the substrate with light such as ultraviolet light. The light source emits light to cure a molding material containing a photocurable resin. When the light source is disposed above the master template 110, the master template 110 is formed of, for example, a quartz substrate capable of transmitting light so that light passes through the master template 110.

  In the present embodiment, a transfer substrate 10 (see FIGS. 3A and 3B) and a break-in substrate 20 (see FIGS. 3C and 3D) which will be described later are arranged on the stage 101. The material to be molded is supplied to the substrate from the dispenser head. Thereafter, by moving the master template 110 by the chuck 102, the concavo-convex pattern 111 is pressed against the molding material on the substrate. That is, in the present embodiment, the optical imprint method is employed as the imprint method.

  Note that, as the imprint processing apparatus 100 described above, a conventionally known imprint apparatus can be typically used.

(Transfer substrate and break-in substrate)
Next, the transfer substrate 10 and the break-in substrate 20 used in the above-described embodiment will be described. 3A and 3B show a side view and a plan view of the transfer-receiving substrate 10, and FIGS. 3C and 3D show a side view and a plan view of the break-in substrate 20. It is shown.

Transferred substrate First, as shown in FIGS. 3A and 3B, a transferred substrate 10 has a substrate body 11 having a pair of main surfaces opposed to each other, and a pattern area on the surface protruding from the substrate body 11. And a step structure 13 (mesa portion) provided with the reference numeral 12. The pattern region 12 is provided over the entire surface of the step structure 13, that is, over the entire upper surface in the drawing. The transferred substrate 10 is contacted with the concave / convex pattern 111 of the master template 110 via the material to be molded (a second material to be described later 45) to transfer the pattern, and then etched in the present embodiment. This is the substrate that constitutes the replica template. As another embodiment, a pattern forming substrate may be formed by forming a material to be formed by imprinting, without etching the substrate, and having a pattern made of the material to be formed.

  In the transfer target substrate 10, the molding material is supplied to the entire pattern region 12. By providing the step structure 13, the molding material supplied to the pattern region 12 is supplied to the master template 110. When making contact with the concavo-convex pattern 111, it is possible to prevent the periphery of the pattern region 12 (the portion outside the pattern region 12) from coming into contact with the master template 110. Accordingly, the contact area between the material to be molded and the master template 110 can be suppressed to be small, so that the release after the contact can be facilitated.

  The substrate main body 11 and the step structure 13 (pattern region 12) of the present embodiment are formed in a rectangular shape in plan view, and the step structure 13 is formed in a central region of one main surface of the substrate main body 11. I have. The step structure 13 is formed in a shape that allows the whole of the uneven pattern 111 to be contained inside when the step structure 13 is superimposed on the uneven pattern 111 of the master template 110. In the present embodiment, the substrate body 11 and the step structure 13 are formed in a rectangular shape in plan view, but the substrate body 11 and the step structure 13 may be formed in a circular shape or the like, for example. Further, the shapes of the substrate main body 11 and the step structure 13 may be different from each other. For example, a mode in which the substrate main body 11 is formed in a rectangular shape and the step structure 13 is formed in a circular shape may be used. .

  As the substrate 10 to be transferred, for example, glass such as quartz glass, silicate glass, calcium fluoride, magnesium fluoride, and acrylic glass; resin such as polycarbonate, polypropylene, polyethylene, and polyethylene; or an arbitrary laminated material thereof A transparent substrate made of, for example, can be used. Further, as the substrate 10 to be transferred, a metal substrate such as nickel, titanium, and aluminum, and a semiconductor substrate such as silicon and gallium nitride can be used.

  Further, a hard mask layer may be formed on the entire main surface including the pattern region 12 on the main surface on which the step structure 13 (pattern region 12) is formed. As a material forming the hard mask layer, a metal material such as Cr, Ti, Ta, or Al, or a silicon oxide can be used. The hard mask layer can be formed by an evaporation method, a sputtering method, a CVD method, or the like.

  In addition, the concave portion may be formed on the transfer-receiving substrate 10 on the main surface side opposite to the one main surface on which the step structure 13 is formed. In this case, it is preferable that the size of the concave portion in plan view is larger than the step structure 13 (pattern region 12). In the case where such a recessed portion is formed, the mold release can be facilitated by allowing the transfer target substrate 10 to be deformed to some extent when the mold is released from the master template 110.

Break-In Substrate Next, as shown in FIGS. 3C and 3D, the break-in substrate 20 includes a substrate main body 21 having a pair of main surfaces facing each other, and a pattern area formed on the surface thereof. And a step structure 23 (mesa portion) provided with a step 22. The pattern region 22 is provided over the entire surface of the step structure 23, that is, over the entire upper surface in the drawing.

  The break-in board 20 is a board used in a break-in imprint process. Although details will be described later, in the break-in imprinting step, the break-in substrate 20 is brought into contact with the concavo-convex pattern 111 of the master template 110 via a forming material (a first forming material 40 described later). At this time, a release agent contained in the molding material is supplied to the uneven pattern 111.

  In the break-in substrate 20, the molding material is supplied to the entire pattern region 22, and as the molding material, the molding material containing the release agent (surfactant) as described above is used. Supplied. The molding material also contains a photocurable resin. The molding material containing the release agent supplied to the break-in substrate 20 and the molding material supplied to the transfer substrate 10 may be the same or different. In the present embodiment, the material to be supplied to the break-in substrate 20 and the material to be supplied to the substrate to be transferred 10 are the same, as described in a manufacturing method described later. In order to improve the manufacturing efficiency, the photocurable resin of the molding material supplied to the break-in substrate 20 and the photocurable resin of the molding material supplied to the transfer substrate 10 are made of the same material. Preferably, there is.

  Further, in the break-in substrate 20, similarly to the transfer substrate 10, the step structure 23 is provided, so that when the molding material supplied to the pattern region 22 is brought into contact with the uneven pattern 111 of the master template 110, The periphery of the pattern region 22 (the portion outside the pattern region 22) and the master template 110 can be prevented from coming into contact with each other. Accordingly, the contact area between the material to be molded and the master template 110 can be suppressed to be small, so that the release after the contact can be facilitated.

  In addition, the substrate main body 21 and the step structure 23 (pattern region 22) of this embodiment are formed in a rectangular shape in plan view, and the step structure 23 is formed in the central region of one main surface of the substrate main body 21. Have been. The step structure 23 is formed in such a shape that the whole of the uneven pattern 111 can be included inside when the step structure 23 is superimposed on the uneven pattern 111 of the master template 110. In the present embodiment, the substrate body 21 and the step structure 23 are formed in a rectangular shape in plan view, but the substrate body 21 and the step structure 23 may be formed in a circular shape, for example. Further, the shapes of the substrate main body 21 and the step structure 23 may be different from each other. For example, the substrate main body 21 may be formed in a rectangular shape, and the step structure 23 may be formed in a circular shape. .

  Further, as is apparent from a comparison between FIGS. 3A and 3B and FIGS. 3C and 3D, the step structure 23 of the break-in board 20 of the present embodiment is shown in plan view. It is larger than the step structure 13 of the transferred substrate 10. More specifically, the step structure 23 is formed in such a shape that the whole of the step structure 13 can be contained inside when the step structure 23 is overlapped so as to face the step structure 13. In the present embodiment, the step structure 23 and the step structure 13 are both rectangular and similar. However, when the step structure 23 is overlapped so as to face the step structure 13, if the entire step structure 13 is formed in a shape that can be contained inside the step structure 13, the step structure 23 and the step structure 13 are not combined. May have different shapes. For example, the step structure 23 may be formed in a circular shape, and the step structure 13 may be formed in a rectangular shape.

  Examples of such a break-in substrate 20 include, for example, glass such as quartz glass, silicate glass, calcium fluoride, magnesium fluoride, and acrylic glass, polycarbonate, polypropylene, polyethylene, polyethylene, and the like, similarly to the transfer-receiving substrate 10. Or a transparent substrate made of any of these laminated materials. Further, as the break-in substrate 20, a metal substrate of nickel, titanium, aluminum, or the like, a semiconductor substrate of silicon, gallium nitride, or the like can be used.

  Further, a hard mask layer may be formed on the entire main surface including the pattern region 22 on the main surface of the main substrate 20 on which the step structure 23 (pattern region 22) is formed. As a material forming the hard mask layer, a metal material such as Cr, Ti, Ta, or Al, or a silicon oxide can be used. The hard mask layer can be formed by an evaporation method, a sputtering method, a CVD method, or the like.

  Further, similarly to the transferred substrate 10, the break-in portion of the break-in substrate 20 may be formed on the main surface opposite to the one main surface on which the step structure 23 is formed. In this case, it is preferable that the size of the concave portion in plan view is larger than the step structure 23 (pattern region 22). When such a depression is formed, the mold release can be facilitated by allowing the break-in substrate 20 to deform to some extent during release from the master template 110.

  In the present embodiment, before the pattern is transferred by bringing the pattern region 12 of the transferred substrate 10 into contact with the uneven pattern 111 of the master template 110 via the material to be formed, the pattern of the break-in substrate 20 described above is transferred. A break-in imprint process is performed in which the material to be molded is supplied to the region 22 and is brought into contact with the uneven pattern 111 of the master template 110. In the break-in imprinting step, a release agent contained in the material to be molded is supplied to the uneven pattern 111. Thereby, it is possible to facilitate the release after performing the actual imprinting step of transferring the pattern to the transfer-receiving substrate 10. The break-in substrate 20 is not etched after the break-in imprint process, and can be reused by peeling off the molding material. Hereinafter, a method of manufacturing a replica template as a pattern forming substrate according to the present embodiment, including a break-in imprint process, will be described in detail.

(Method of manufacturing replica template (pattern-formed substrate))
4 to 6 are views showing steps of a method for manufacturing a replica template as a pattern forming substrate according to the present embodiment. FIG. 4 mainly shows steps related to break-in imprinting, FIG. 5 mainly shows steps related to actual imprinting, and FIG. 6 mainly shows finishing steps.

Steps Related to Run-in Imprint In the method of manufacturing a replica template as a pattern forming substrate according to the present embodiment, first, as shown in FIG. 4A, the above-described break-in substrate 20 is prepared (the break-in substrate preparing step). ). Then, the break-in substrate 20 is held on the stage 101 of the imprint processing apparatus 100.

  Next, as shown in FIG. 4B, a first molding material 40 (first molding material) containing a release agent and a photocurable resin is supplied to the pattern region 22 of the break-in substrate 20. (First supply step). The first molding material 40 is supplied from a dispenser head in the imprint processing apparatus 100 described above.

  In the first supply step according to the present embodiment, the first molding material 40 is supplied such that the film thickness of the first molding material 40 becomes T1. In addition, the first molding material 40 may be supplied from the dispenser head by an ink-jet method, or after the first molding material 40 is supplied from the dispenser head, the film thickness is fixed by a spin coating method. You may make it become. When the first molding material 40 is supplied by the ink jet method, a large number of droplets may be scattered. In this case, the thickness of the droplet corresponds to the film thickness T1.

  The film thickness T1 of the first molding material 40 is determined by the first molding material 40 during a later-described imprinting step of bringing the first molding material 40 into contact with the uneven pattern 111 of the master template 110. The release agent contained therein is drawn to the master template 110 side, and is set to such a thickness that the release agent is sufficiently supplied to the uneven pattern 111.

  After that, the break-in substrate 20 is arranged below the master template 110. Specifically, the break-in substrate 20 is moved by the stage 101 so that the first molding material 40 on the pattern region 22 faces the concave and convex pattern 111 of the master template 110 as shown in FIG. Positioned.

  Next, as shown in FIG. 4C, the first molding material 40 supplied to the pattern region 22 of the break-in substrate 20 is brought into contact with the concavo-convex pattern 111 of the master template 110 (a break-in imprint process). Priming step). At this time, the release agent contained in the first molding material 40 is attracted to the master template 110 side and supplied (adhered) to the concave / convex pattern 111. At this time, a hard mask layer of Cr or the like is formed on the main surface of the break-in substrate 20 on which the pattern region 22 is formed, and a difference is generated in the surface free energy between the hard template layer and the master template 110. If so, the release agent can be efficiently drawn to the master template 110 side, so that a hard mask layer such as Cr may be formed on the main surface of the break-in substrate 20 where the pattern region 22 is formed. preferable. Specifically, in the present embodiment, the chromium layer is formed as a hard mask layer on the main surface of the break-in substrate 20 where the pattern region 22 is formed.

  Next, as shown in FIG. 4D, the first molding material 40 is cured by irradiating light. The light is emitted from the light source in the imprint processing apparatus 100 described above.

  Next, as shown in FIG. 4 (E), the first molding material 40 and the master template 110 that are in contact with the uneven pattern 111 are released (first release step). Thereafter, as shown in FIG. 4F, the break-in substrate 20 is removed from the stage 110.

  Through the above steps, the release agent contained in the first molding material 40 is supplied to the concave / convex pattern 111, and the release after the actual imprinting step described below can be facilitated.

Step Related to Production Imprint Subsequently, in a step related to production imprint, first, as shown in FIG. 5A, the above-described transfer substrate 10 is prepared (transfer substrate preparation step). Then, the transfer target substrate 10 is held on the stage 101 in the imprint processing apparatus 100.

  Next, as shown in FIG. 5B, in the pattern region 12 of the substrate 10 to be transferred, in this example, a second molding material 45 (a second molding material) containing a release agent and a photocurable resin is used. Material) (second supply step). The second molding material 45 is supplied from the dispenser head of the imprint processing apparatus 100 described above. Further, in this example, the second molding material 45 supplied to the pattern region 12 of the transfer substrate 10 is the same as the first molding material 40 supplied to the pattern region 22 of the break-in substrate 20. . However, as described above, the second molding material 45 and the first molding material 40 may be different.

  In the second supply step according to the present embodiment, the second molding material 45 is supplied such that the film thickness of the second molding material 45 becomes T2. In addition, the second molding material 45 may be supplied from the dispenser head by an ink jet method, or after the second molding material 45 is supplied from the dispenser head, the film thickness is fixed by a spin coating method. You may make it become. When the second molding material 45 is supplied by an ink jet method, there may be a case where many droplets are scattered. In this case, the thickness of the droplet corresponds to the film thickness T2.

  The film thickness T2 of the second molding material 45 is set so that the second molding material 45 is in contact with the concave-convex pattern 111 of the master template 110 in a later-described production imprinting step. It is set so as not to protrude to the outer peripheral side of the uneven pattern 111. Here, in the present embodiment, the film thickness T1 of the first molding material 40 supplied to the pattern area 22 of the break-in substrate 20 in the above-described first supply step is the same as the film thickness T1 in the second supply step. The thickness is set to be larger than the film thickness T2 of the molding material 45. Thus, in the present embodiment, when the first molding material 40 supplied to the pattern region 22 of the break-in substrate 20 comes into contact with the concave / convex pattern 111, the separation contained in the first molding material 40 is performed. It is intended that the mold agent is sufficiently supplied to the uneven pattern 111. On the other hand, in the break-in imprint, since the film thickness T1 is set to be large, the amount of the molding material 40 increases, so that the molding material 40 that protrudes from the uneven pattern 111 of the master template 110 during imprinting. Is increased, and this tends to remain on the master template 110, and in particular, the residual resin tends to be easily generated.

  After that, the transferred substrate 10 is arranged below the master template 110. More specifically, the transfer substrate 10 is moved by the stage 110 so that the second molding material 45 on the pattern region 12 faces the uneven pattern 111 of the master template 110 as shown in FIG. Positioned.

  Next, as shown in FIG. 5C, the second molding material 45 supplied to the pattern region 12 of the transfer substrate 10 is brought into contact with the concavo-convex pattern 111 of the master template 110 (production imprint process). ).

  Next, as shown in FIG. 5D, the second molding material 45 is cured by irradiating light. The light is emitted from the light source in the imprint processing apparatus 100 described above.

  Next, as shown in FIG. 5E, the second molding material 45 in contact with the concavo-convex pattern 111 and the master template 110 are released (second release step). At this time, since the release agent is supplied to the concavo-convex pattern 111 by the above-described break-in imprinting step, the release between the second molding material 45 and the master template 110 in the second release step is performed. Can be done easily.

  Through the above steps, the molded body 50 (see FIG. 5F) made of the second molding material 45 to which the pattern corresponding to the uneven pattern 111 has been transferred, and the transferred substrate 10 holding the molded body 50 can get.

Finishing Step Subsequently, in the present embodiment, a finishing step of processing the replica template 120 from the molded body 50 made of the second molding material 45 to which the pattern has been transferred and the transferred substrate 10 holding the molded body 50 I do. In the present embodiment, as shown in FIG. 6A, a thin portion of the second molding material 45 corresponding to the projections of the concavo-convex pattern 111 is left on the transfer substrate 10 holding the molding 50. Remains as a film.

In the finishing step of the present embodiment, first, as shown in FIG. 6B, the thin residual film is removed by ion etching using an oxygen gas or the like, and the molded body 50 having projections scattered thereon is formed. Get. Next, the transferred substrate 10 is dry-etched using the molded body 50 having the projections dotted thereon as a mask and using CF ₄ gas or the like. Thereby, as shown in FIG. 6C, the replica template 120 to which the concave / convex pattern is transferred is manufactured.

  According to the present embodiment described above, the step structure 23 of the break-in substrate 20 used in the break-in imprinting process is larger than the step structure 13 of the transfer-receiving substrate 10 in plan view. More specifically, when the step structure 23 is overlapped so as to face the step structure 13, the step structure 13 is formed in a shape that can include the entire step structure 13 inside. In this case, at the time of release after the break-in imprinting step, the first molding material 40 supplied to the pattern region 22 of the break-in substrate 20 is, as shown in FIG. Even when it adheres to the outer periphery of the uneven pattern 111, when the pattern area 12 of the transferred substrate 10 is brought into contact with the uneven pattern 111 of the master template 110, the outer side of the step structure 13 (pattern area 12). Then, the first molding material 40 attached to the outer periphery of the uneven pattern 111 is located. This makes it possible to easily prevent the pattern region 12 from interfering with the first molding material 40 attached to the outer periphery of the concave-convex pattern 111 at the time of contact with the concave-convex pattern 111. In FIG. 7, a region indicated by a broken line indicates the outer shape of the step structure 13 (pattern region 12) of the transfer-receiving substrate 10. FIG. 5 also shows the first molding material 40 attached to the outer periphery of the uneven pattern 111. In particular, as shown in FIG. 5C, it is possible to prevent the pattern region 12 from interfering with the first molding material 40 attached to the outer periphery of the uneven pattern 111.

  On the other hand, as a comparative example, when the same substrate is used as the transferred substrate and the break-in substrate, during the break-in imprint process, the material to be formed easily adheres to the outer periphery of the uneven pattern of the master template. I will. If the material to be molded (residual resin) adheres to the outer periphery of the master template, in a subsequent imprinting step on the substrate to be transferred, the edge of the pattern region of the substrate to be transferred interferes with the residual resin, and It is difficult to properly contact the molding material applied to the master template with the master template, and as a result, the yield of the replica template may be reduced.

  On the other hand, according to the present embodiment, the second molding material 45 supplied to the transfer substrate 10 can be brought into proper contact with the master template 110, so that the pattern is transferred by the master template 110. The yield of the replica template 120 as a pattern forming substrate obtained from the second material to be molded 45 and the transferred substrate 10 thus obtained can be improved.

FIG. 8 shows a case where the first molding material 40 adheres to the outer periphery of the uneven pattern 111 of the master template 110 at the time of release after the break-in imprinting step. A state 41 is shown in which a part 41 of 40 protrudes in the form of a string toward the uneven pattern 111 side. Even when such a situation occurs, it is preferable that the magnitude relation between the step structure 23 and the step structure 13 is determined so that the step structure 13 can be prevented from interfering with the photocurable resin 40.
For example, in the present embodiment, when the step structure 13 has a short side of about 25 mm and a long side of about 35 mm, in the break-in imprint process, the width of the first molding material 40 that can protrude is about 1 to 10 μm, In addition, the alignment accuracy of the apparatus is 1 to 10 μm, which is high. In this case, in consideration of the width of the first molding material 40 that can protrude and the alignment accuracy, the separation width between the step structure 23 and the step structure 13 is preferably 10 μm or more.
Furthermore, as shown in FIG. 8, it is preferable to further widen the separation width in consideration of the occurrence of a strip-like peeling phenomenon. When the phenomenon of peeling in the form of a string occurs, the first molding material 40 that has been peeled in the form of a string may have a length of up to about 1 to 3 mm, and is directed toward the center of the pattern by peeling charging at the time of release. Tend to grow. In consideration of this, in order to prevent the step structure 13 of the transfer-receiving substrate 10 from interfering with the first molding material 40 that can be peeled in a string shape, the step structure 23 is overlapped so that the step structure 23 includes the step structure 13 inside thereof. In this case, for example, the distance (separation width) from the contour of the step structure 13 to the contour of the step structure 23 is preferably set to 2 to 4 mm. On the other hand, in this case, since the release force tends to increase by about 5 to 10%, it is necessary to set the width so as not to hinder the imprint.

  In this embodiment, a chromium layer is formed in the pattern area 22 of the break-in substrate 20. According to this, a release agent can be efficiently drawn to the master template 110 side by generating a difference in surface free energy between the pattern region 22 of the break-in substrate 20 and the master template 110. Thereby, the releasability can be improved.

  In this embodiment, the photocurable resin of the first molding material 40 supplied to the break-in substrate 20 and the photocurable resin of the second molding material 45 supplied to the transfer substrate 10 are used. The same material is used. According to this, manufacturing efficiency can be improved. The transfer material supplied to the break-in substrate 20 and the transfer substrate 10 each contain a photocurable resin. When performing imprinting with a photocurable resin, imprinting can be performed at room temperature with a small contact pressure. For this reason, productivity can be improved.

(Modification)
In the present embodiment, an example in which the present invention is applied to the case where the replica template 120 is manufactured has been described. However, when manufacturing a substrate to be manufactured (corresponding to a pattern forming substrate) from the replica template 120, a break-in process is performed. The present invention can be applied to a case where a pudding process is performed. Further, in the above-described embodiment, the example in which the optical imprint is adopted has been described. However, the present invention is applicable even when the thermal imprint method is adopted.

  Further, it has a substrate main body and a step structure protruding from the substrate main body and having a pattern region provided on the surface, and the step structure is smaller than the step structure 13 of the transferred substrate 10 in plan view. A third supply step of preparing a transfer substrate and supplying a third molding material to the pattern area of the second transfer substrate after the release of the transfer substrate 10 described above; A second actual imprinting step of contacting the third molding material supplied to the pattern region of the substrate with the concavo-convex pattern 111 of the master template 110; and the third production imprinting step of contacting the concavo-convex pattern 111 of the master template 110 A third release step of releasing the molding material and the master template 110 may be performed. In this case, even if the transferred substrate 10 becomes a break-in substrate of the second transferred substrate and the resin adheres to the outer periphery of the concave / convex pattern 111 due to the contact between the transferred substrate 10 and the concave / convex pattern 111, the second The transfer target substrate and the concavo-convex pattern 111 can be appropriately brought into contact with each other, and mold release is facilitated. For this reason, a pattern formation substrate can be suitably manufactured from the second transfer substrate.

Reference Signs List 10 transferred substrate 11 substrate body 12 pattern area 13 step structure (mesa portion)
DESCRIPTION OF SYMBOLS 20 Break-in imprint board 21 Substrate body 22 Pattern area 23 Step structure 40 First molding material 45 Second molding material 50 Molded body 100 Imprint processing apparatus 101 Stage 102 Chuck 110 Master template 120 Replica template

Claims (9)

A method for manufacturing a pattern-formed substrate using a template having an uneven pattern,
Substrate body, and a break-in substrate preparation step of preparing a break-in substrate having a step structure having a pattern region provided on the surface while projecting from the substrate body,
A first supply step of supplying a first molding material to the pattern area of the break-in substrate;
A break-in imprinting step of contacting the first molding material supplied to the pattern area of the break-in substrate with the concavo-convex pattern of the template,
A first release step of releasing the template from the first molding material and the template that have contacted the concavo-convex pattern of the template;
Substrate body, and a transferred substrate preparing step of preparing a transferred substrate having a stepped structure having a pattern region provided on the surface while projecting from the substrate body,
A second supply step of supplying a second molding material to the pattern area of the transfer substrate;
A production imprinting step of contacting the second molding material supplied to the pattern area of the transferred substrate with the concave / convex pattern of the template,
A second release step of releasing the template from the second molding material and the template that are in contact with the concavo-convex pattern of the template;
A finishing step of obtaining a pattern-formed substrate from the second molding material to which a pattern has been transferred by the concave-convex pattern and the transferred substrate;
With
The method of manufacturing a pattern forming substrate, wherein the step structure of the break-in substrate is larger in plan view than the step structure of the transferred substrate. The method according to claim 1, wherein the first molding material contains a release agent. 3. The method according to claim 1, wherein a chromium layer is formed in the pattern area of the break-in substrate. 4. 4. The method according to claim 1, wherein the first molding material and the second molding material each contain a photocurable resin. 5. 5. The method according to claim 4, wherein the photocurable resin of the first molding material and the photocurable resin of the second molding material are the same material. 6. A second transfer substrate having a substrate main body and a step structure projecting from the substrate main body and having a pattern area provided on a surface thereof, the step structure being smaller in plan view than the step structure of the transfer target substrate; The step of preparing
A third supply step of supplying a third molding material to the pattern area of the second transfer substrate;
A second production imprint step of contacting the third molding material supplied to the pattern region of the second transfer substrate with the concave-convex pattern of the template;
A third release step of releasing the third molding material and the template that have come into contact with the concavo-convex pattern of the template,
The method for manufacturing a pattern-formed substrate according to claim 1, wherein: The method according to any one of claims 1 to 6, wherein a film thickness of the first molding material is larger than a film thickness of the second molding material. Using a template having a concavo-convex pattern, forming a pattern on a transferred substrate having a mesa portion or a molding material disposed on the transferred substrate, a method for manufacturing a pattern-formed substrate for manufacturing a pattern-formed substrate,
A substrate having a mesa portion larger in plan view than the mesa portion of the transferred substrate is prepared, a first molding material containing a release agent is supplied to the mesa portion of the substrate, and the first molding material is supplied to the substrate. Contacting the template, then releasing the mold, and attaching a release agent contained in the first molding material to the template,
A second molding material is supplied to a mesa portion of the substrate to be transferred, and the template having a release agent attached thereto is brought into contact with the second molding material. Forming a pattern on the material,
A method for manufacturing a pattern-formed substrate, comprising: obtaining a pattern-formed substrate from the second molding material having a pattern formed thereon and the transfer-receiving substrate. The method further includes a step of etching the transfer-receiving substrate using the pattern-formed second molding material as a mask,
The method according to claim 8 , wherein the pattern transfer substrate is obtained by etching the transfer target substrate.

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