JP6623113B2 - Electronic equipment manufacturing equipment - Google Patents

Description

  Embodiments described herein relate generally to an electronic device manufacturing apparatus that can mount an electronic component fixed with a conductive adhesive with high positional accuracy.

  2. Description of the Related Art A suspension of a hard disk device equipped with a microactuator that drives a magnetic head with high precision and a small amount is known. Unlike electronic components such as capacitors, the positional accuracy of microactuators affects dynamic characteristics such as stroke variation and resonance characteristics. Long-term bonding reliability is also affected. Therefore, in mounting the microactuator, not only highly reliable electrical connection but also very high position accuracy is required.

  The piezoelectric element that constitutes the microactuator must be mounted at a temperature equal to or lower than the Curie temperature because it loses its natural polarization and loses its piezoelectricity at high temperatures. For bonding electronic components that are vulnerable to high temperatures such as microactuators, a conductive adhesive in which a conductive filler is dispersed in the main agent is used instead of solder (for example, Patent Document 1 and Patent Document 2). For example, when a conductive adhesive is subjected to vibration or time passes after application and before curing, the conductive filler is biased in the main agent, and it may not be possible to secure the conductivity of the joint after curing. Therefore, after applying the conductive adhesive, it is desirable to cure the conductive adhesive with as little time as possible.

  However, in order to cure the conductive adhesive, it is necessary to put the workpiece into a heating furnace and heat it for about 1 hour. Since it takes time as compared with other steps, it is difficult from the tact surface to harden the conductive adhesive by a continuous method, and the charging to the heating furnace is performed by a batch method.

  Therefore, in the waiting time until the heat curing step, as soon as the conductive element is applied and the piezoelectric element is positioned, the conductive adhesive is preheated by spraying a high-temperature inert gas locally for a short time. It is conceivable that gel is left uncured to prevent the conductive filler from being biased. However, the microactuator mounted on the suspension of the hard disk device is extremely small. If the volume of the inert gas to be blown is large, the microactuator positioned with great effort will move. When the volume of the inert gas blown is small, the temperature of the inert gas becomes non-uniform. In particular, when a plurality of heaters are arranged to heat the inert gas, the temperature of the inert gas decreases between two adjacent heaters. We want to stabilize the temperature of the inert gas with a weak wind that does not adversely affect the position accuracy of the microactuator.

JP 2001-217499 A JP-A-7-106749

  An object of the present invention is to provide an electronic device manufacturing apparatus capable of mounting an electronic component fixed with a conductive adhesive such as a microactuator mounted on a suspension of a hard disk device with high positional accuracy.

  An electronic device manufacturing apparatus according to an embodiment manufactures an electronic device including an electronic component fixed with a conductive adhesive. The electronic device manufacturing apparatus includes a conveyor, a plurality of heaters, a gas supply source, a bottleneck section, and a plurality of guide sections. The conveyor conveys a workpiece coated with an uncured conductive adhesive. The plurality of heaters face the conveyor and are arranged at intervals. The gas supply source supplies an inert gas to each heater. The bottleneck portion is disposed between the heater and the conveyor, and joins the inert gas that has passed through the heater. The bottleneck part has a bottleneck formed along the trajectory through which the conductive adhesive passes. Each guide part connects between each heater and a bottleneck part, guides the inert gas which passed the heater, and joins a bottleneck. Each guide unit includes a gas dispersion member that accumulates heat of the heater and disperses the inert gas that has passed through the heater.

It is a top view which shows an example of the electronic device manufactured with the electronic device manufacturing apparatus of this embodiment. It is a top view which shows an example of the workpiece | work processed by the electronic device manufacturing apparatus of this embodiment. It is a figure which shows an example of a series of processes which mount a piezoelectric element in a workpiece | work. It is a perspective view which shows an example of the electronic device manufacturing apparatus of one Embodiment. It is a front view which shows an example of the preheating apparatus shown by FIG. FIG. 5 is a right side view of the preheating device shown in FIG. 4 with a part cut away. It is a perspective view which shows an example of the gas dispersion member shown by FIG. It is a figure which shows the time-dependent change of the surface temperature of the workpiece | work which passes a preheating apparatus. It is a figure which shows the time-dependent change of the surface temperature of a workpiece | work in a 1st reference example. It is a figure which shows the time-dependent change of the surface temperature of a workpiece | work in a 2nd reference example. It is a figure which shows the time-dependent change of the surface temperature of a workpiece | work in a 3rd reference example. It is a figure which shows the time-dependent change of the surface temperature of a workpiece | work in a 4th reference example. It is a figure which shows the time-dependent change of the surface temperature of a workpiece | work in a 5th reference example. It is a figure which shows the time-dependent change of the surface temperature of a workpiece | work in a 6th reference example.

Hereinafter, an electronic device manufacturing apparatus according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 shows a suspension 1 of a hard disk device (HDD) manufactured by an electronic device manufacturing apparatus (suspension manufacturing apparatus) 20 of this embodiment. The hard disk device includes a magnetic disk that rotates about a spindle, and a carriage that rotates about a pivot shaft. A suspension 1 shown in FIG. 1 is provided on the arm of the carriage. The suspension 1 includes a base plate 2 fixed to the arm, a load beam 3 that can be flexibly elastically, and a flexure 4 with wiring that is arranged on the load beam 3.

  The wiring flexure 4 includes a metal base 5 made of a thin stainless steel plate and a wiring 6 formed on the metal base 5. A gimbal portion 7 is formed in the vicinity of the tip 4A of the flexure 4 with wiring. A slider 8 is mounted on a tongue portion at the center of the gimbal portion 7. A magnetic head provided on the slider 8 accesses the recording surface of the magnetic disk to read and write data. A head gimbal assembly (HGA) is configured by the slider 8, the flexure with wiring 4, the load beam 3, and the like.

  The suspension manufactured according to the present embodiment is, for example, a dual stage actuator type suspension (DSA suspension). In order to position the magnetic head with higher accuracy relative to the recording surface of the hard disk, in addition to a voice coil motor that rotates the carriage, a microactuator 9 that finely drives only the magnetic head with high accuracy is used in combination.

  The microactuators 9 (9A, 9B) are mounted on the gimbal portion 7 of the wiring flexure 4 and are respectively disposed on both sides of the tongue portion on which the slider 8 is mounted. It can be mounted on a part different from the gimbal part 7. One end and the other end of the microactuator 9 are respectively joined to the electrodes provided on the gimbal portion 7 by the conductive adhesive 10, and are electrically connected and physically fixed. The electrode to which the microactuator 9 is joined is electrically connected to the wiring 6 extending toward the base end 4B of the flexure 4 with wiring. The microactuator 9 is an example of an electronic component fixed with a conductive adhesive. The suspension 1 is an example of an electronic device including an electronic component fixed with a conductive adhesive.

  The microactuator 9 is composed of a piezoelectric element obtained by processing a piezoelectric body such as PZT (lead zirconate titanate). An example of the illustrated piezoelectric element is processed to have a length of 0.8 mm, a width of 0.2 mm, and a thickness of 0.08 mm. The Curie temperature (Tc) at which the piezoelectric element of the microactuator 9 loses its polarization due to loss of polarization is, for example, 300 to 350 ° C.

  The conductive adhesive 10 is obtained by dispersing a conductive filler in a main agent (binder). The main agent of the conductive adhesive 10 is, for example, a thermosetting resin that is thermoset at a temperature lower than the Curie temperature of the piezoelectric element constituting the microactuator 9. An example of such a conductive adhesive 10 is a silver paste. The silver paste is obtained by dispersing silver powder in a main agent such as an epoxy resin. For example, if the silver paste is heated at 150 to 250 ° C. for about 1 hour, it can be thermally cured (mainly cured). The conductive adhesive 10 is not limited to the above example, and may be other conductive adhesive as long as it is cured at a temperature lower than that of the solder.

  FIG. 2 is an example of a workpiece W processed by the electronic device manufacturing apparatus 20 of this embodiment. The workpiece W is, for example, a flexure chain sheet in which a plurality of flexure elements 4W are chained.

  The workpiece W is formed by processing a single stainless steel plate (metal base 5) by etching or the like, and includes a large number (tens to hundreds) of flexure elements 4W having the same shape. Each flexure element 4W has the same configuration as that of the flexure 4 with wiring, and the flexure 4 with wiring can be obtained by dividing into individual pieces. The workpiece W further includes a frame 11 that fixes the flexure element 4W. A plurality of positioning holes 12 are formed in the frame 11. Positioning pins of a work carrier 21 </ b> W (shown in FIG. 4) that accommodates the work W are inserted into the positioning holes 12.

  FIG. 3 shows an example of a series of steps for mounting the microactuator 9 on a workpiece. In the example shown in FIG. 3, first, the work in the previous stage of the work W shown in FIG. 2 is carried into the production line.

  The conductive adhesive 10 is applied to the electrode position of the gimbal portion 7 of the flexure element 4W of the work flowing through the conveyor by a dispenser or the like (ST1). A piezoelectric element constituting the microactuator 9 is placed on the applied conductive adhesive 10 to obtain the workpiece W shown in FIG. 2 (ST2).

  The conductive adhesive 10 is preheated by spraying a hot inert gas to gel the conductive adhesive 10 (ST3). The temperature of the inert gas is about 160 ° C., for example. The heating time is, for example, 15 to 60 seconds.

  An in-line inspection is performed by an image processing apparatus or the like to confirm that the piezoelectric element is installed at the correct position (ST4). A coating agent that prevents the fine burrs from falling off is applied to the end surface of the metal base 5 of the workpiece W (ST5). The applied coating agent is irradiated with ultraviolet rays to be temporarily cured (ST6). The workpiece W is conveyed from the conveyor to a batch-type heating furnace and heated in the furnace for about 1 hour to fully cure the conductive adhesive 10 (ST7). Thereby, the mounting of the piezoelectric element is completed.

  Of these series of steps described as an example, the electronic device manufacturing apparatus 20 of the present embodiment gels the conductive adhesive 10 with a weak wind so as not to move the positioned electronic component in the step ST3, for example. Thus, the fluidity of the conductive adhesive 10 is lost.

  Since the electronic device manufacturing method according to the present embodiment includes the step ST3 of preheating the conductive adhesive 10, even if there is a waiting time before the step ST7 of fully curing the conductive adhesive 10, the method is not limited. It is possible to prevent the conductive filler from aggregating at the center of the main agent of the adhesive 10 and the conductive filler from sinking to the bottom of the main agent.

  In the work W, the uncured conductive adhesive 10 is applied to the electrodes provided on the gimbal portion 7 of the flexure element 4W in the step ST1, and the microactuator 9 (piezoelectric element) is applied on the conductive adhesive 10. In a state in which the electronic device manufacturing apparatus 20 according to the present embodiment is used, the process proceeds to ST3.

  FIG. 4 is a perspective view illustrating an example of an electronic device manufacturing apparatus according to an embodiment. As shown in FIG. 4, the electronic device manufacturing apparatus 20 includes a conveyor 21 and a preheating device 22 that preheats the workpiece W.

  The conveyor 21 conveys the work W sent from the step ST2 and sends it out to the step ST4. The workpieces W flowing through the process of ST3 are accommodated in workpiece carriers 21W attached to the conveyor 21, respectively. The conveyance direction X in which the conveyor 21 conveys the workpiece | work W is shown by the arrow, and the locus | trajectory Y of the conductive adhesive 10 which moves with the workpiece | work W conveyed is shown by a dashed-two dotted line.

The preheating device 22 includes a plurality of (for example, three) heaters 23 (23A, 23B, 23C), a gas supply source 24, and a nozzle unit 30.
The heaters 23 (23 </ b> A, 23 </ b> B, 23 </ b> C) face the conveyor 21 from above and are arranged at equal intervals in the transport direction X of the conveyor 21. The gas supply source 24 supplies an inert gas such as nitrogen to the heaters 23A, 23B, and 23C. For example, an inert gas of 6 L / min is supplied from the gas supply source 24 and is equally distributed to the plurality of heaters 23 (23A, 23B, 23C). The nozzle unit 30 is made of quartz glass or the like, and is attached to the heaters 23A, 23B, and 23C.

  The nozzle unit 30 includes a bottleneck portion 31, a plurality of (for example, three) guide portions 32 (32A, 32B, and 32C), and a plurality of (for example, three) base end portions 33 (33A, 33B, and 33C). Have.

  The bottleneck portion 31 is disposed between the heater 23 (23, 23B, 23C) and the conveyor 21. The bottleneck portion 31 has a bottleneck 34 that joins the inert gas that has passed through the heater 23. The narrow passage 34 is a flow path of an inert gas that vertically penetrates the narrow passage portion 31, and is formed in a narrow opening extending along the locus Y of the conductive adhesive 10. The lower end of the bottleneck portion 31 is opposed to the workpiece W conveyed to the conveyor 21 with a slight gap. An example of the gap between the bottleneck 31 and the workpiece W is 5 mm.

  The guide part 32 (32A, 32B, 32C) is disposed between the heater 23 (23, 23B, 23C) and the bottleneck part 31. The inert gas that has passed through the heaters 23A, 23B, and 23C flows into the guide portions 32A, 32B, and 32C, respectively. The guide portions 32A, 32B, and 32C connect the heaters 23A, 23B, and 23C and the narrow passage portion 31, respectively, and guide and join the inert gas that has passed through the heaters 23A, 23B, and 23C to the narrow passage 34.

  The base end portion 33 (33A, 33B, 33C) extends from the guide portion 32 (32A, 32B, 32C) toward the gas supply source 24, respectively. The base end portions 33A, 33B, and 33C are formed in, for example, a cylindrical shape, and accommodate the heaters 23, 23B, and 23C therein.

  The guide portions 32 (32A, 32B, 32C) are filled with gas dispersion members 40 (40A, 40B, 40C), respectively. The gas dispersion member 40 accumulates heat from the heater 23 and disperses the inert gas that has passed through the heater 23. The gas dispersion member 40 has a plurality of wire meshes stacked in the flow direction (the vertical direction in the example of FIG. 4) through which the inert gas flows.

  FIG. 5 is a front view showing an example of the preheating device 22. FIG. 6 is a right side view of the preheating device 22 shown in FIG. The preheating device 22 will be described in more detail with reference to FIGS.

  The heater 23 is a heating wire wound spirally, for example. In the illustrated example, a bracket 25 and a thermocouple 26 are respectively attached to the heater 23 (23A, 23B, 23C). The bracket 25 is disposed so as to surround the heater 23 and is formed in a cylindrical shape having an inner diameter slightly larger than the outer diameter of the base end portion 33 of the nozzle unit 30. The base end portion 33 is inserted between the heater 23 and the bracket 25.

  The nozzle unit 30 has a narrow path 34 formed along the locus Y of the conductive adhesive 10 passing through the vicinity of the heater 23 in the narrow path portion (tip portion) 31. The width of the narrow path 34 in the transport direction X is the first width L1 (shown in FIG. 5), the width of the narrow path 34 in the direction orthogonal to the transport direction X is the second width L2 (shown in FIG. 6), and the narrow path 34 in the vertical direction. Assuming that the length is the flow path length L3 (shown in FIG. 6), the second width L2 is formed narrower (bottle path) than the first width L1 and the flow path length L3. The first width L1 is, for example, 80 mm. The second width L2 is 2 mm, for example. The channel length L3 is, for example, 7 mm.

  The outer diameter of the heater 23 is, for example, 9 to 10 mm. The second width L <b> 2 is formed narrower than the outer diameter of the heater 23. The adjacent heaters 23 are separated from each other with a distance larger than the outer diameter of the heater 23 itself.

The guide portion 32 has the same cross section as the base end portion 33 on the base end portion 33 side. In the example shown in FIG. 6, it is formed in a cylindrical shape. The shape of the guide portion 32 on the side of the bottleneck portion 31 is tapered as the width in the direction orthogonal to the conveyance direction X goes toward the bottleneck portion 31, and becomes thicker as the width in the conveyance direction X goes to the bottleneck portion 31. Is formed. The guide unit 32 guides the inert gas that has passed through the heater 23 to the bottleneck 34.
The gas dispersion member 40 (40A, 40B, 40C) filled in the guide portion 32 is configured by laminating a plurality of wire meshes, for example.

  FIG. 7 is a perspective view showing an example of the gas dispersion member 40. In the illustrated example, the gas dispersion member 40 is configured by combining two types of wire meshes having different meshes. The two types of wire meshes are a first wire mesh 41 and a second wire mesh 42. The first wire mesh 41 has a coarser mesh than the second wire mesh 42 and is formed of a thick steel wire. An example of the first wire mesh 41 is a 30-mesh stainless wire mesh having a wire diameter of 0.29 mm, an aperture of 0.56 mm, and an aperture ratio of 43.4%. An example of the second wire mesh 42 is a 100-mesh stainless wire mesh having a wire diameter of 0.10 mm, an opening of 0.15 mm, and an aperture ratio of 36.0%. The gas dispersion member 40 may be configured by combining three or more types of wire mesh. You may comprise only one type of wire mesh.

  In the illustrated example, a single first wire mesh 41 is disposed in the lowermost layer. Thirty to thirty-five second wire meshes 42 are randomly stacked on the first wire mesh 41 without aligning the mesh directions. As described above, the guide portion 32 is formed so that the narrow passage portion 31 side is tapered in the direction orthogonal to the transport direction X. The first wire mesh 41 formed of a thick steel wire is in contact with the inner wall of the guide portion 32 and supports the second wire mesh 42 so that the second wire mesh 42 is not deformed and dropped off. If the second wire mesh 42 has sufficient rigidity, the first wire mesh 41 may be omitted.

  FIG. 8 is a diagram showing a change with time of the surface temperature of the workpiece W flowing through the step ST3. The surface temperature of the workpiece W was measured at the gimbal portion 7 of the leading flexure element 4W. The solid line in the figure shows the result of using the electronic device manufacturing apparatus 20 of this embodiment provided with the gas dispersion member 40 shown in FIG. The broken line in the figure shows the result of using the electronic device manufacturing apparatus in which the gas dispersion member 40 is omitted from the present embodiment.

  As a result of using the electronic device manufacturing apparatus in which the gas dispersion member 40 is omitted, the surface temperature of the workpiece W decreases when the measurement point passes between the heater 23A and the heater 23B and between the heater 23B and the heater 23C. There is a valley in the temperature profile. On the other hand, as a result of using this embodiment, a temperature profile in which the temperature is stable and the apexes are flat is obtained.

  Next, a first reference example to a sixth reference example will be described with reference to FIGS. 9 to 14. In the first reference example to the sixth reference example, the gas dispersion member 40 having various configurations was evaluated using an electronic apparatus manufacturing apparatus in which the heater 23 is simplified to one.

  Specifically, an electronic device manufacturing apparatus in which the heater 23B, the heater 23C, the guide portions 32B and 32C, the base end portions 33B and 33C, and the gas dispersion members 40B and 40C are omitted from the electronic device manufacturing apparatus 20 illustrated in FIG. Changes in the surface temperature of the workpiece W over time were compared by changing the configuration of the gas dispersion member 40 filled in the guide portion 32A.

  In the first reference example, the gas dispersion member 40 was not filled in the guide portion 32A. The results are shown in FIG. In the second reference example, as the gas dispersion member 40, steel wool having a thickness of 5 mm was filled in the guide portion 32A. The results are shown in FIG. In the third reference example, the guide portion 32A was filled with steel wool having a thickness of 10 mm. The results are shown in FIG.

  In the fourth reference example, a single first wire mesh 41 (medium coarse mesh) as the gas dispersion member 40 is filled in the guide portion 32A. The results are shown in FIG. In the fifth reference example, three first wire meshes 41 are stacked as the gas dispersion member 40 and filled in the guide portion 32A. The results are shown in FIG. In the sixth reference example, three second wire meshes 42 (fine mesh) are stacked on the first wire mesh 41 as the gas dispersion member 40 and filled in the guide portion 32A. The results are shown in FIG.

  As shown in FIG. 9, in the first reference example in which the gas dispersion member 40 is omitted, the temperature profile has a sharp apex. As shown in FIG. 10, in the second reference example in which the thin steel wool was used as the gas dispersion member 40, the temperature profile was more stable and the apex was slightly flatter than that in the first reference example. However, as shown in FIG. 11, in the third reference example in which the thick steel wool is used as the gas dispersion member 40, the temperature profile is not stable. Since it is difficult to prepare coarse and dense uniform steel wool with such a small size as in this embodiment, it is considered that the pressure loss varies.

  As shown in FIG. 12, in the fourth reference example in which the first wire mesh 41 is used as the gas dispersion member 40, the temperature profile is stable compared to the first reference example, but there is no significant difference from the second reference example. It was. As shown in FIG. 13, in the fifth reference example in which the three first wire nets 41 are overlapped to form the gas dispersion member 40, the temperature profile is more stable than the fourth embodiment, and the apex approaches flat. As shown in FIG. 14, in the sixth reference example in which three second wire meshes 42 are stacked on one first wire mesh 41 to form a gas dispersion member 40, the temperature profile is more stable than in the fifth embodiment. did. Thereafter, as the number of fine meshes increases, the apex of the temperature profile approaches flat from one end to the other end of the bottleneck 34. In the electronic device manufacturing apparatus 20 shown in FIG. The temperature profile was most stable when combined with a single fine mesh.

  The electronic device manufacturing apparatus 20 of the present embodiment configured as described above includes the gas supply source 24 and the heater 23 and can supply a high-temperature inert gas. In the process of ST3 immediately after the piezoelectric element is installed on the uncured conductive adhesive 10, a high-temperature inert gas is sprayed on the conductive adhesive 10 to leave the main agent of the conductive adhesive 10 uncured. It can be gelled. Since the fluidity of the conductive adhesive 10 can be lost before the conductive filler aggregates, the electrical reliability of the microactuator 9 can be ensured.

  The present embodiment includes a plurality of heaters 23 (23A, 23B, 23C) arranged in the conveyance direction X of the conveyor 21. By increasing / decreasing the number of heaters 23, the time for preheating the conductive adhesive 10 in the step ST3 can be adjusted without changing the feed speed of the conveyor 21 having a great influence on tact.

  In this embodiment, the bottleneck part (tip part) 31 has a bottleneck 34 that joins the inert gas that has passed through the plurality of heaters 23 separately. Since the inert gas can be mixed in the bottleneck 34, variations in the heaters 23 can be alleviated and the surface temperature of the workpiece W can be stabilized. Since the narrow path 34 is narrowly opened, the inert gas can be used without waste for preheating the conductive adhesive 10, and the amount of the inert gas used can be saved.

  If a large amount of inert gas is sprayed so that the inert gas hits a wide range, the microactuator 9 may move due to a strong wind from an oblique direction. In this embodiment, since the bottleneck 34 opposes the locus Y of the conductive adhesive 10, even a small amount of inert gas can be applied to the conductive adhesive 10. Since the conductive adhesive 10 can be preheated with a weak wind from directly above, the microactuator 9 can be mounted with high positional accuracy.

  In the present embodiment, a gas dispersion member 40 filled in the guide portion 32 is provided. Since the gas dispersion member 40 disperses the momentum of the inert gas that travels straight from the heater 23, the microactuator 9 can be prevented from being moved by a strong wind, and the microactuator 9 can be mounted with high positional accuracy.

  Since the gas dispersion member 40 disperses the inert gas that travels straight from the heater 23 in directions other than the straight traveling direction, the inert gas guided by the guide portion 32A reaches the boundary with the adjacent guide portion 32B. Similarly, the inert gas guided by the guide portion 32B reaches the boundary between the adjacent guide portions 32A and 32C. The inert gas guided by the guide part 32C reaches the boundary with the adjacent guide part 32B.

  Since the inert gas, which is a heating medium, is sufficiently supplied to the boundary between the adjacent guide portions 32A, 32B, and 32C, the temperature decrease of the boundary due to the decrease of the inert gas can be suppressed, and the surface temperature of the workpiece W can be stabilized. Can be made. Since the conductive adhesive 10 can be stably heated so as to lose fluidity, the electrical reliability of the microactuator 9 can be further improved.

  When the temperature of the inert gas is lower than that of the gas dispersion member 40, the gas dispersion member 40 increases the temperature by applying heat to the inert gas. When the temperature of the inert gas is higher than that of the gas dispersion member 40, the gas dispersion member 40 takes heat from the inert gas and lowers the temperature. Since the gas dispersion member 40 relaxes the fluctuation of the temperature of the inert gas, the surface temperature of the workpiece W can be stabilized.

  The present embodiment includes a gas dispersion member 40 in which a first wire mesh 41 and a plurality of second wire meshes 42 are combined. The inert metal can be uniformly dispersed by the fine second metal mesh 42. By increasing or decreasing the number of second wire meshes 42, the pressure loss of the gas dispersion member 40 can be adjusted in accordance with the first width L1 of the bottleneck. Even if the feeding speed of the conveyor 21 is not changed, the time for preheating the conductive adhesive 10 in the step ST3 can be adjusted.

  As the number of second wire meshes 42 increases, the second wire mesh 42 positioned below is gradually bent due to the weight of the second wire mesh 42 stacked thereon. When it becomes impossible to endure the weight, the second wire mesh 42 may fall off. In the present embodiment, a first wire mesh 41 formed of a steel wire thicker than the second wire mesh 42 is disposed in the lowermost layer, and supports the second wire mesh 42. Therefore, even if the number of the second wire mesh 42 is increased, the second wire mesh 42 can be prevented from falling off.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof.

  For example, a gas dispersion member may be formed by winding a belt-like wire mesh instead of stacking many wire meshes having the same shape, or a gas dispersion member may be formed by zigzag folding. In this case, it suffices to form at least a part of the guide portion in a rectangular tube shape in accordance with the gas dispersion member. The first wire mesh in the lowermost layer is not necessarily a wire mesh. A ring or the like inscribed in the guide portion may be used as long as the second wire mesh can be prevented from being deformed or dropped off. The first wire mesh may be omitted and a protrusion or the like may be provided on the inner wall of the guide portion.

  The present invention can be applied to mounting various electronic components that are fixed with a conductive adhesive and require high positional accuracy. In particular, it is suitable for manufacturing a suspension of a hard disk device. The electronic component related to the suspension of the hard disk device is not limited to the microactuator, and may be a light emitting element or the like used for the optical assist method. As an example of an electronic component, an actuator that is provided in a camera such as a smartphone and suppresses camera shake by minutely driving a lens can be given. As another example of the electronic component, there is an actuator of a variable focus lens used for a catheter or the like. This actuator is a piezoelectric element that deforms an elastic lens.

  DESCRIPTION OF SYMBOLS 1 ... Suspension (an example of an electronic device), 4W ... Flexure element, 9 ... Microactuator (an example of an electronic component fixed with a conductive adhesive), 10 ... Conductive adhesive, 20 ... Electronic device manufacturing apparatus, 21 ... Conveyor, 23 ... heater, 24 ... gas supply source, 31 ... bottleneck, 34 ... bottleneck, 32 ... guide, 40 ... gas dispersion member, 41 ... first wire mesh (an example of wire mesh), 42 ... second wire mesh (wire mesh) Example), W ... work (flexure chain sheet), Y ... trajectory.

Claims (4)

An electronic device manufacturing apparatus for manufacturing an electronic device including an electronic component fixed with a conductive adhesive,
A conveyor for transporting a workpiece coated with uncured conductive adhesive;
A plurality of heaters facing the conveyor and arranged at intervals from each other;
A gas supply source for supplying an inert gas to each of the heaters;
It has a bottleneck locally formed along the trajectory through which the conductive adhesive passes, and is disposed between the plurality of heaters and the conveyor, and merges the inert gas that has passed through the heaters. Kushiro,
A plurality of guide portions that connect between each of the heaters and the bottleneck part and guide the inert gas that has passed through the heaters to the bottleneck;
Comprising
Each of the guide portions includes a gas dispersion member that accumulates heat of the heater and disperses the inert gas that has passed through the heater, respectively. The electronic device is a suspension of a hard disk device including a microactuator fixed with the conductive adhesive,
2. The electronic device manufacturing according to claim 1, wherein the workpiece is a flexure chain sheet in which a plurality of flexure elements are chained and each of the flexure elements is coated with the uncured conductive adhesive. apparatus.   The electronic device manufacturing apparatus according to claim 1, wherein the gas dispersion member includes a plurality of wire meshes stacked in a direction in which the inert gas flows.   The electronic device manufacturing apparatus according to claim 3, wherein the plurality of wire meshes include two or more types of wire meshes having different roughness.

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