JP6618649B1 - Radio frequency power amplifier module, radio portable device, and method for reducing intermodulation of radio frequency output signals - Google Patents

Abstract

Disclosed are systems and methods for reducing intermodulation products in radio frequency output signals. By matching the impedance of the power amplifier to the impedance of the antenna and, in parallel, blocking the signal having the second fundamental frequency that the antenna receives when transmitting on the antenna, the first and second fundamentals due to re-radiation from the antenna Frequency intermodulation products are suppressed. Matching and blocking are performed in parallel by a single circuit having combined matching and blocking functions. [Selection] Figure 2

Description

  Embodiments of the invention relate to electronic systems, and more particularly, to radio frequency (RF) electronics.

INCORPORATION BY REFERENCE OF PRIORITY APPLICATIONS Any or all applications for which a foreign or national priority claim is identified in the application data sheet filed with this application are hereby incorporated by reference under 37 CFR 3737 (37 CFR 1.57) Incorporated by reference.

  Radio frequency (RF) power amplifiers can be used to boost the power of RF signals having relatively low power. The boosted RF signal can then be used for a variety of purposes, including driving the antenna of the transmitter.

  A power amplifier may be included in the portable device to amplify the RF signal for transmission by the antenna. The RF circuit typically uses impedance matching for the purpose of maximizing power transfer from the amplified RF signal to the antenna, which may also be characterized by minimizing signal reflection from the antenna to the amplified RF signal. is there. Maximum signal power is delivered to the antenna when the impedance of the antenna is equal to the impedance of the power amplifier.

  In addition, RF circuits typically use filters that pass the desired frequencies through the circuit while blocking unwanted frequencies. That is, power amplifiers, such as those used in portable devices, are optimized to block output matching networks (OMN) optimized to match the impedance of the antenna and signals of frequencies that are not intended for transmission or reception by the antenna. Often associated with a filtered filter.

  According to a certain number of implementations, the present disclosure is configured to provide a first terminal configured to receive a radio frequency (RF) input signal and provide an amplified RF signal to a first antenna for transmission. A power amplifier die including a second terminal, an amplifier circuit configured to amplify the RF input signal, and an input pad electrically connected to the first terminal, the power excluding the output matching network The amplifier die, the output impedance of the power amplifier is converted to the input impedance of the antenna, and the signal block received by the first antenna during transmission of the first antenna is configured in parallel. A filter die including a parallel body of the output matching network and the filter circuit, and an input of the parallel body of the output matching network and the filter circuit of the amplifier circuit. Electrically connected to the force, and, for the module and a plurality of interconnects configured to output the parallel of the output matching network and the filter circuit electrically connected to the second terminal.

  In some embodiments, the RF input signal has a first fundamental frequency and the blocked signal has a second fundamental frequency. In other embodiments, the blocked signal is transmitted by a second antenna in close physical proximity to the first antenna. In a further embodiment, the parallel body of the output matching network and the filter circuit blocks the first and second due to re-radiation from the first antenna by blocking the signal having the second fundamental frequency from traveling to the amplifier circuit. Configured to prevent fundamental frequency intermodulation products. In one embodiment, a wireless portable device includes the module.

  In some implementations, the present disclosure includes an antenna configured to receive and transmit a radio frequency (RF) signal and a power amplifier configured to amplify the RF input signal and receive the RF input signal. A power amplifier including an input configured to transmit and an output configured to provide an amplified RF signal, and a transmit / receive switch configured to pass the amplified RF signal to the antenna for transmission And an output matching network and a filter circuit that are electrically connected between the output of the power amplifier and the antenna and have a parallel function. Here, when the transmission / reception switch is configured for transmission, the output matching network and the filter circuit convert the output impedance of the power amplifier into the input impedance of the antenna, and block the signal received by the antenna in parallel with it. Configured to do.

  In some embodiments, the output matching network and filter circuit are implemented on a first die and the power amplifier is implemented on a second die. In other embodiments, the passive components of the output matching network and the filter circuit are implemented using integrated passive device (IPD) technology. In a further embodiment, the impedance matching function is excluded from circuitry on the power amplifier die. In a still further embodiment, the second die is fabricated using silicon germanium (SiGe) technology.

  According to some implementations, the present disclosure includes a first inductor and a first capacitor connected in parallel to form a first parallel combination including a first terminal and a common terminal, and a second terminal connected in parallel. And a device including a second inductor and a second capacitor forming a second parallel combination including the common terminal. Here, the first parallel combination is connected in series with the second parallel combination at the common terminal. The apparatus further includes a third capacitor connected in series with the third inductor, a fourth inductor connected between the first terminal of the first parallel combination and ground, and a second terminal of the second parallel combination. And a fifth inductor connected between and ground. Here, the series combination of the third capacitor and the third inductor is coupled between the common terminal and the ground.

  In some embodiments, the first and second capacitors and the first, second, third, fourth and fifth inductors form a combined impedance matching network and filter having parallel functions. In another embodiment, the impedance matching network and filter combination converts the output impedance at the first terminal to the input impedance at the second terminal and propagates in parallel from the second terminal to the first terminal. It is configured to filter the second signal. In a further embodiment, the impedance matching network and filter combination transforms the output impedance of the power amplifier to match the input impedance of an antenna configured to transmit the amplified radio frequency signal.

  In some embodiments, the radio frequency signal has a first fundamental frequency and the second signal has a second fundamental frequency and is received by the antenna during transmission of the radio frequency signal of the antenna. In other embodiments, the first and second capacitors and the first, second, third, fourth and fifth inductors are implemented using integrated passive device (IPD) technology. In one embodiment, a wireless portable device includes the apparatus.

  In certain teachings, the present disclosure relates to a method for reducing intermodulation products in a radio frequency (RF) output signal. The method receives an RF signal having a first fundamental frequency in the operating frequency band at an input to a power amplifier circuit along a radio frequency (RF) path, amplifies the RF signal, and an amplified RF signal. In parallel with the impedance of the power amplifier matched to the impedance of the antenna, and the antenna has a second fundamental frequency received when transmitting the antenna Blocking the signal and suppressing intermodulation products of the first and second fundamental frequencies due to re-radiation from the antenna. Here, matching and blocking is done in parallel by a single circuit having combined matching and blocking functions. In some embodiments, matching the impedance includes converting the output impedance of the power amplifier to the input impedance of the antenna, and blocking the signal along an RF path from the antenna to the power amplifier. Filtering the propagated signal.

  In some implementations, the present disclosure includes a first terminal configured to receive a radio frequency (RF) input signal and a second terminal configured to provide an amplified RF signal to an antenna for transmission. An amplifier circuit configured to amplify the RF input signal, a first die including an input pad electrically connected to the first terminal, and an output configured to convert the output impedance of the amplifier circuit A second die including a matching network, and a plurality configured to electrically connect an input of the output matching network to an output of the amplifier circuit and electrically connect an output of the output matching network to the second terminal And a module including the interconnection unit.

  In some embodiments, the output matching network comprises an output matching network and a filter circuit configured to perform in parallel the output impedance transformation of the amplifier circuit and the block of signals that the antenna receives during transmission of the antenna. Includes parallel bodies. In other embodiments, the amplifier circuit includes a power amplifier circuit. In a further embodiment, the passive component of the output matching network is implemented using integrated passive device (IPD) technology. In yet a further embodiment, the first die is fabricated using silicon germanium (SiGe) technology.

  According to some implementations, the present disclosure provides an antenna configured to receive and transmit a radio frequency (RF) signal and a transmission configured to pass the amplified RF signal to the antenna for transmission. A first terminal configured to receive the RF input signal, an amplifier circuit configured to amplify the RF input signal, and an input pad electrically connected to the first terminal. A second die including an output matching network configured to convert the output impedance of the amplifier circuit, a second terminal configured to provide an amplified RF signal to the transmit / receive switch, and the output Configured to electrically connect an input of the matching network to an output of the amplifier circuit and to electrically connect an output of the output matching network to the second terminal. And a wireless mobile device and a module including a plurality of interconnects.

  In some embodiments, the output matching network is configured to perform an output impedance transformation of the amplifier circuit and a block of signals received by the antenna in parallel when the transmit / receive switch is configured for transmission. Includes a parallel body of matching network and filter circuit. In other embodiments, the amplifier circuit includes a power amplifier circuit. In a further embodiment, the passive component of the output matching network is implemented using integrated passive device (IPD) technology. In yet a further embodiment, the first die is fabricated using silicon germanium (SiGe) technology.

  In certain implementations, the present disclosure provides a first terminal configured to receive a radio frequency (RF) input signal, a second terminal that provides an amplified RF signal to a first antenna for transmission, and the RF An amplifier circuit configured to amplify an input signal; an input pad electrically connected to the first terminal and an input of the amplifier circuit; and an output impedance of the amplifier circuit during transmission of the first antenna. A parallel body of an output matching network and a filter circuit configured to perform conversion and a block of a signal received by the first antenna in parallel, and an input of the parallel body of the output matching network and the filter circuit A plurality of outputs configured to electrically connect to the output and to electrically connect the output of the parallel body of the output matching network and the filter circuit to the second terminal; For the module including the interconnections unit.

  In some embodiments, the first die includes an amplifier circuit but does not include an output matching network, and the second die includes a parallel body of an output matching network and a filter circuit. In other embodiments, the amplifier circuit includes a power amplifier circuit. In a further embodiment, the output matching network and the passive components of the filter circuit are implemented using integrated passive device (IPD) technology. In a still further embodiment, the RF input signal has a first fundamental frequency and the blocked signal has a second fundamental frequency.

  In some embodiments, the blocked signal is transmitted by a second antenna that is in close physical proximity to the first antenna. In another embodiment, the parallel body of the output matching network and the filter circuit blocks the signal having the second fundamental frequency from traveling to the amplifier circuit, and the first and second fundamental frequencies due to re-radiation from the first antenna. Are configured to prevent intermodulation products.

  According to a certain number of implementations, the present disclosure provides an input terminal configured to receive an RF input signal, an output terminal configured to provide an amplified version of the RF input signal, and the RF input signal. A first semiconductor die including an amplifier circuit configured to amplify, and an electrical connection between the first semiconductor die and the output terminal to convert the output impedance of the amplifier circuit to an input impedance of the antenna And a first circuit separate from the first semiconductor die configured to perform in parallel the antenna reflection block received at the second terminal.

  In one embodiment, the first circuit includes a plurality of integrated passive devices included in a common package. In other embodiments, the first circuit includes a plurality of surface mount devices. In a further embodiment, the first circuit is mounted on a second semiconductor die that is separate from the first semiconductor die. In still further embodiments, the first semiconductor die does not include an output matching network.

  In one embodiment, the first circuit performs in parallel the transformation of the output impedance of the amplifier circuit from approximately 6 ohms to approximately 50 ohms and the antenna reflection block received at the second terminal. A parallel arrangement of output matching networks and filters configured accordingly. In another embodiment, the first semiconductor die includes a first output matching network configured to convert the output impedance of the amplifier circuit from approximately 6 ohms to approximately 12 ohms. In a further embodiment, the first circuit parallels the transformation of the output impedance of the first output matching network from approximately 12 ohms to approximately 50 ohms and the block of antenna reflection received at the second terminal. An output matching network and a parallel arrangement of filter circuits configured to do so.

  In one embodiment, the first circuit is connected in parallel with a first inductor and a first capacitor connected in parallel to form a first parallel combination between an input of the first circuit and a common terminal. A second inductor and a second capacitor forming a second parallel combination between the output of the first circuit and the common terminal, wherein the first parallel combination includes the second parallel combination at the common terminal; Connected in series with the combination. In another embodiment, the first circuit further includes a third capacitor connected in series with the third inductor, and the series combination of the third capacitor and the third inductor is coupled between the common terminal and ground. . In a further embodiment, the first circuit further includes a fourth inductor connected between the input of the first circuit and ground, and a fifth inductor connected between the output of the first circuit and ground. including.

  In some implementations, the present disclosure includes an antenna configured to receive and transmit an RF signal, a transmit / receive switch configured to pass an RF output signal to the antenna for transmission, and an RF input signal. An input terminal configured to receive the output, an output terminal configured to provide an amplified version of the RF input signal, a first semiconductor die including an amplifier circuit configured to amplify the RF input signal, and A first circuit separate from the first semiconductor die, electrically connected between the first semiconductor die and the output terminal, and the amplifier when the transmission / reception switch is configured for transmission RF power amplification including a first circuit configured to perform in parallel the conversion of the output impedance of the circuit and the antenna reflection block received at the second terminal A wireless mobile device and a module.

  In one embodiment, the first circuit includes a plurality of integrated passive devices included in a common package. In other embodiments, the first semiconductor die does not include an output matching network. In a further embodiment, the first circuit performs in parallel the transformation of the output impedance of the amplifier circuit from approximately 6 ohms to approximately 50 ohms and the block of antenna reflection received at the second terminal. A parallel arrangement of output matching network and filter circuit configured accordingly. In a still further embodiment, the first semiconductor die includes a first output matching network configured to convert the output impedance of the amplifier circuit from approximately 6 ohms to approximately 12 ohms. In another embodiment, the first circuit parallels the transformation of the output impedance of the first output matching network from approximately 12 ohms to approximately 50 ohms and the block of antenna reflection received at the second terminal. An output matching network and a parallel arrangement of filter circuits configured to do so.

  According to some implementations, the present disclosure relates to a method for reducing intermodulation in an RF output signal. A method receives an RF input signal having a first fundamental frequency in an operating frequency band at an input to a power amplifier circuit along an RF path, amplifies the RF signal, and amplifies the RF input signal. In parallel with giving the version for transmission by the antenna in the RF path and converting the output impedance of the power amplifier circuit to approximate the input impedance of the antenna, the antenna receives when transmitting the antenna. Blocking the signal having the second fundamental frequency to suppress intermodulation of the first and second fundamental frequencies due to re-radiation from the antenna. Here, the conversion and blocking is performed by a single circuit having a parallel conversion and blocking function that is separate from the power amplifier circuit configured to amplify the RF signal.

  In one embodiment, the power amplifier circuit is mounted on the first semiconductor die and the single circuit is not mounted on the first semiconductor die. In other embodiments, the single circuit is mounted on a second semiconductor die that is separate from the first semiconductor die.

  According to a certain number of implementations, the present disclosure provides an input terminal configured to receive an RF input signal, an output terminal configured to provide an amplified version of the RF input signal, and the RF input signal. An RF power amplifier module that includes a first semiconductor die that includes an amplifier circuit configured to amplify and an OMN that includes a first partial OMN and a second partial OMN. Here, the first portion OMN is placed on the first semiconductor die and configured to match the output impedance of the amplifier circuit to the input impedance of the second portion OMN, and the second portion OMN is connected to the first semiconductor die. It is electrically connected between the output terminals and configured to match the output impedance of the first portion OMN with the input impedance of the downstream component.

  In one embodiment, the second partial OMN includes a plurality of integrated passive devices included in a common package. In other embodiments, the second partial OMN includes a plurality of surface mount devices. In a further embodiment, the second portion OMN is mounted on a second semiconductor die that is separate from the first semiconductor die. In a further embodiment, the downstream component is a portable device antenna.

  In one embodiment, the second partial OMN is configured to perform both matching the output impedance of the first OMN to the input impedance of the downstream component and filtering antenna reflections received at the output terminal in parallel. Part of a parallel body of output matching network and filter circuit. In another embodiment, the first partial OMN steps up the output impedance of the power amplifier circuit from an initial value to a step up value that is approximately between 10% and 50% of the input impedance of the downstream component. Configured. In a further embodiment, the initial value is approximately 6 ohms and the step-up value is approximately 12 ohms. In a still further embodiment, the downstream component input impedance is approximately 50 ohms.

  In one embodiment, the module is further a filter circuit separate from the first die, electrically connected between the first die and the output terminal, and blocking antenna reflections received at the output terminal. Including a filter circuit configured to do so. In other embodiments, the second portion OMN and the filter circuit are mounted on a second semiconductor die that is separate from the first semiconductor die.

  In some implementations, the present disclosure includes an antenna configured to receive and transmit an RF signal, a transmit / receive switch configured to pass an RF output signal to the antenna for transmission, and an RF input signal. An input terminal configured to receive the output, an output terminal configured to provide an amplified version of the RF input signal, a first semiconductor die including an amplifier circuit configured to amplify the RF input signal, and The present invention relates to a wireless portable device including an RF power amplifier module including an OMN including a first partial OMN and a second partial OMN. Here, the first portion OMN is placed on the first semiconductor die and configured to match the output impedance of the amplifier circuit to the input impedance of the second portion OMN, and the second portion OMN is connected to the first semiconductor die. Electrically connected between the output terminals and configured to match the output impedance of the first portion OMN to the input impedance of the downstream component.

  In one embodiment, the second partial OMN is mounted on a second semiconductor die that is separate from the first semiconductor die. In other embodiments, the second partial OMN is configured to perform both the matching of the output impedance of the first OMN to the input impedance of the downstream component and the filtering of the antenna reflection received at the output terminal in parallel. Of the output matching network and filter circuit in parallel. In a further embodiment, the first partial OMN steps up the output impedance of the power amplifier circuit from an initial value to a step up value that is approximately between 10% and 50% of the input impedance of the downstream component. Configured.

  In still further embodiments, the RF power amplifier module is further a filter circuit that is separate from the first die and is electrically connected between the first die and the output terminal and received at the output terminal. Including a filter circuit configured to block antenna reflections. In one embodiment, the second portion OMN and the filter circuit are mounted on a second semiconductor die that is separate from the first semiconductor die.

  According to some implementations, the present disclosure relates to a method for reducing intermodulation in an RF output signal. A method receives an RF input signal having a first fundamental frequency in an operating frequency band at an input to a power amplifier circuit along an RF path, amplifies the RF signal, and amplifies the RF input signal. Providing a version for transmission by an antenna in the RF path, wherein an amplifier circuit mounted on the first semiconductor die is configured to amplify the RF signal, and the output impedance of the power amplifier circuit Matching the input impedance of a downstream component having an OMN that includes a first portion OMN and a second portion OMN, wherein the first portion OMN is mounted on the first semiconductor die and the matching is Matching the output impedance of the amplifier circuit to the input impedance of the second portion OMN; The output impedance of the portion OMN and a be matched to the input impedance of the downstream components.

  In one embodiment, the method further blocks a signal having a second fundamental frequency that the antenna receives during transmission of the antenna and suppresses intermodulation of the first and second fundamental frequencies due to re-radiation from the antenna. Including doing. In other embodiments, blocking is done in parallel with matching the output impedance of the first portion OMN to the input impedance of the downstream component.

FIG. 4 is an exemplary block diagram of multiple transmission paths in a device according to certain embodiments. FIG. 3 is an exemplary block diagram of an RF transmission path according to certain embodiments. 1 is a circuit diagram of an exemplary output matching network according to certain embodiments. FIG. 1 is a circuit diagram of a typical filter circuit according to a predetermined embodiment. FIG. 4 is an exemplary block diagram of an RF transmit path including one embodiment of a combined output matching network and filter with parallel functionality, according to certain embodiments. FIG. 4 is an exemplary block diagram of an RF transmit path including one embodiment of a combined output matching network and filter with parallel functionality, according to certain embodiments. FIG. 2 is an exemplary block diagram of an RF transmit path including one embodiment of an output matching network and filter located remotely from a power amplifier die, according to certain embodiments. FIG. 3 is an exemplary schematic diagram of a combined output matching network and filter having parallel functionality, according to certain embodiments. FIG. 3 is an exemplary schematic diagram of a combined output matching network and filter having parallel functionality, according to certain embodiments. 1 is an exemplary schematic diagram of a partial output matching network for implementation on a power amplifier die, in accordance with certain embodiments. FIG. FIG. 3 is an exemplary schematic diagram of a partial output matching network and filter with parallel functionality for mounting away from a power amplifier die, according to certain embodiments. 6B is an exemplary layout of the circuit of FIG. 6A according to certain embodiments. FIG. 4 is an exemplary block diagram of an RF transmit path including another embodiment of a combined output matching network and filter with parallel functionality, according to certain embodiments. FIG. 4 is an exemplary block diagram of a parallel semiconductor die of an output matching network and a filter including an embodiment of a parallel body of an output matching network and a filter circuit, according to certain embodiments. FIG. 10 is an exemplary block diagram of a multi-mode signal processing module including the output matching network of FIG. 9 and a parallel semiconductor die of filters, according to certain embodiments. FIG. 2 is an exemplary block diagram illustrating a simple portable transceiver including one embodiment of a combined output matching network and filter with parallel functionality, according to certain embodiments.

  Features of the system and method are described below with reference to the above summarized drawings. Throughout the drawings, reference numbers are re-used to indicate correspondence between reference elements. The drawings, related descriptions, and specific implementations are provided to illustrate embodiments of the invention, but are not intended to limit the scope of the disclosure.

  FIG. 1 is an exemplary block diagram of multiple transmission paths in device 100. Device 100 may include, for example, a multi-band portable device that operates in more than one frequency band. Such a device includes a separate transmission path for transmission in each frequency band. In another example, device 100 has a transmission path for transmission over the frequency band of the cellular network, and a separate transmission path for transmission to a local network operating at a different frequency than the cellular network. It may include a cellular device such as a smartphone with.

  The device 100 includes a first transmission path 115 and a second transmission path 125. Other embodiments may include more or fewer transmission paths 115, 125 than two. The first transmission path 115 includes the first transmitter 102, the filter 104, the first power amplifier 106, the filter 108, and the first antenna 110, and the second transmission path 125 includes the second transmitter 112 and the second power amplifier 116. And the second antenna 120.

  The first transmitter 102 generates a first transmission signal at a first frequency or over a first frequency band. This is filtered by the filter 104 and amplified by the first power amplifier 106. The amplified signal from the first power amplifier 106 is filtered by the filter 108 and sent to the first antenna 110 for transmission.

  Similarly, the second transmitter 112 generates a second transmission signal at the second frequency or over the second frequency band. This is amplified by the second power amplifier 116 and sent to the second antenna 120 for transmission. In one embodiment, the first and second frequencies are different and the first and second frequency bands are different and do not overlap.

  Portable devices, cell phones, smartphones, etc. are typically small devices. Within the packaging of these devices, components are often arranged closely together. In one embodiment, the first transmission path 115 and the second transmission path 125 may be arranged together in the device 100, and the first antenna 110 and the second antenna 120 may be both closely arranged. In one embodiment, the first and second antennas 110, 120 may be located within a few centimeters of each other.

  When the antennas 110, 120 are physically dense, the signal having the first frequency transmitted by the first antenna 110 is coupled to the second antenna 120 in certain embodiments. The closer the antennas 110 and 120 are arranged to each other, the stronger the coupling. Once the signal having the first frequency is received by the second antenna 120, it proceeds to the second power amplifier 116 where it is mixed with the second transmission signal having the second frequency. The mixing of the first signal and the second signal is, for example, the frequency of (± f1 ± f2), (± f1 ± 2f2), (± 2f1 ± f2), (± 2f1 ± 2f2), (± mf1 ± nf2). Resulting in an intermodulation product. The intermodulation signal can then be re-radiated via one or more of the first antenna 110 and the second antenna 120, causing interference at other frequencies.

  FIG. 2 is an exemplary block diagram of an RF transmit path 200 that includes a filter 206 configured to block signals from an external antenna. The RF transmit path 200 includes a power amplifier integrated circuit (IC) 202, an input tuning circuit 204, a filter 206, an output tuning circuit 208, a switch / low noise amplifier (LNA) circuit 210, and an antenna 212. In one embodiment, the module 201, such as a front end module, includes, for example, a power amplifier integrated circuit (IC) 202, an input tuning circuit 204, a filter 206, an output tuning circuit 208, and a switch / low noise amplifier (LNA) circuit 210. . In one embodiment, the external antenna includes an antenna that is external to the RF transmission path 200, such as an antenna from a common transmission path located together within the device 100. This provides signal coupling to the antenna 212 during transmission of the RF transmit signal. In one embodiment, the signal from the external antenna that reaches antenna 212 during transmission of the RF transmit signal includes an external block signal.

  The power amplifier integrated circuit (IC) 202 includes a power amplifier 214 and an output matching network (OMN) 216 integrated on a power amplifier die. The power amplifier 214 includes one or more amplifier stages and is configured to amplify the RF transmit signal.

  The OMN 216 converts the output impedance of the power amplifier 214 into the input impedance of the antenna 212. In one embodiment, the output impedance of the power amplifier 214 is approximately 6 ohms, the input impedance of the antenna is approximately 50 ohms, and the OMN 216 has an impedance from approximately 6 ohms to approximately 50 ohms. Convert.

  In one embodiment, power amplifier IC 202 includes active devices such as power amplifier 214 and passive devices such as components of OMN 216. The power amplifier 214 is typically on a lossy integrated circuit substrate such as silicon germanium (SiGe), complementary metal oxide semiconductor (CMOS), gallium arsenide (GaAs), silicon carbide (SiC), or other semiconductor materials. To be implemented. Passive components also suffer significant losses associated with the lossy integrated circuit board when mounted on the lossy integrated circuit board.

  FIG. 3 is a circuit diagram of an exemplary output matching network 300 that includes a plurality of inductors and a plurality of capacitors. OMN 300 is an example of an output matching network that is typically implemented as OMN 216 on power amplifier IC 202. Other embodiments may include more or fewer components than OMN 300, as known to those skilled in the art from the disclosure herein.

  Referring to FIG. 2, the input impedance of the filter 206 is approximately 50 ohms, and in one embodiment, the external block signal that reaches the antenna 212 from the external antenna passes through the transmission path 200 to the power amplifier 214 in the reverse direction. To propagate to. In one embodiment, filter 206 includes a high pass filter.

  FIG. 4 is a circuit diagram of an exemplary high pass filter circuit 402 including capacitors and resistors. In other embodiments, the filter 206 may include a low pass filter, a band pass filter, or a band rejection filter. In other embodiments, the filter 206 may include more than two components or fewer than two components, as known to those skilled in the art from the disclosure herein. In one embodiment, the filters 206, 402 are implemented as discrete devices using low temperature co-fired ceramic (LTCC) passive components, external discrete lumped component components, etc., or integrated passive devices (IPD), etc. . Filter 206 implemented as a separate circuit introduces signal loss using significant board area. This leads to an increase in power consumption.

  In one embodiment, the impedance of the filter 206 is not exactly 50 ohms, and matching components are used at the input and output of the filter 206 to tune the impedance. Input tuning circuit 204 includes a matching component at the input of filter 206, and output tuning circuit 208 includes a matching component at the output of filter 206. In one embodiment, input tuning circuit 206 includes at least two passive components and output tuning circuit includes at least two passive components.

  The switch / LNA circuit 210 has an input impedance of approximately 50 ohms, and includes a low noise amplifier (LNA) 218 and a switch 220 configured to switch between the transmission mode and the reception mode of the device 100. When the switch 220 is configured in the reception mode, a signal received by the antenna 212 passes through the LNA 218 to the reception path. When switch 220 is configured in transmission mode, the RF transmission signal in transmission path 200 is passed to antenna 212 for transmission after amplification, filtering and tuning is complete.

  While the filter 206 blocks the signal reaching the antenna 212 from the co-located transmission path, it uses additional tuning circuitry, which is bulky and can be expensive to implement on a circuit board. is there. In addition, the power amplifier and OMN integrated circuit 202 utilizes technology to implement the power amplifier 214, but adds additional signal loss when used to implement passive components of the OMN 216.

  FIG. 5A is an exemplary block diagram of an RF transmit path 500 that includes a power amplifier IC 502, an input tuning circuit 504, a filter 506, an output tuning circuit 508, a switch / LNA circuit 210 and an antenna 212. The power amplifier IC 502 includes a power amplifier 514. The power amplifier 514 includes one or more amplifier stages and is configured to amplify the RF transmit signal.

  In one embodiment, a module 501, such as a front end module, includes a power amplifier IC 502, an input tuning circuit 504, a filter 506, an output tuning circuit 508, and a switch / LNA circuit 210. In other embodiments, the module 501 includes a power amplifier IC 502, an input tuning circuit 504, a filter 506 and an output tuning circuit 508. In a further embodiment, module 501 includes power amplifier IC 502, input tuning circuit 504, and filter 506. In a further embodiment, module 501 includes a power amplifier IC 502 and a filter 506.

  A filter 506 is a signal received from an external antenna to transform the impedance of the RF transmission path 500 as it propagates along the RF transmission path 500 from the power amplifier 514 to the antenna 212 and in parallel therewith. Is configured to block travel from the antenna 212 to the power amplifier 514 along the RF transmit path 500.

  The input to the power amplifier IC 502 receives the RF transmission signal from the RF transmitter. The output of power amplifier IC 502 is electrically coupled to the input of filter 506 via input tuning circuit 504. The output of filter 506 is electrically coupled to the input of switch / LNA 210. When switch 220 is in transmit mode, the output of switch / LNA 210 is electrically coupled to antenna 212, and the amplified and filtered RF transmit signal is transmitted by antenna 212.

  The power amplifier integrated circuit (IC) 502 includes a power amplifier 514 integrated on a power amplifier die. The power amplifier 514 is mounted on a lossy integrated circuit substrate such as, for example, SiGe, CMOS, GaAs, SiC, or other semiconductor material. In contrast to power amplifier IC 202, the OMN is moved from the power amplifier die and implemented in filter 506. The output impedance of the power amplifier IC 502 is approximately 6 ohms. Advantageously, the power amplifier die with the OMN removed is smaller and less expensive than the power amplifier die that includes the OMN.

  The filter 506 is referred to as a parallel body of OMN and filter, and includes a combination of a matching network and a filter having a parallel function. The OMN and filter parallel 506 is configured to implement impedance matching and filtering in parallel. Note that the OMN and filter parallel body 506 is not a series OMN followed by a filter. The filter and OMN are combined so that the components function in parallel as matching components and filtering components. With the filter becoming part of the OMN and the OMN becoming part of the filter, the overall signal loss is less than the loss that would occur if the OMN and filter were implemented separately. Furthermore, the size of the parallel OMN and filter 506 is smaller than the combined size of the separately implemented OMN and filter.

  In one embodiment, OMN and filter parallel 506 is configured to implement 6 ohm to 50 ohm impedance matching and high pass filtering in parallel. In other embodiments, the OMN and filter parallel 506 is a source and load impedance of approximately less than 6 ohms, approximately greater than 6 ohms, approximately less than 50 ohms, or approximately greater than 50 ohms. Implement impedance matching and parallel filtering or signal conditioning. Here, the parallel body 506 of the OMN and the filter may include a high pass filter, a low pass filter, a band pass filter, or a band rejection filter.

  In one embodiment, the OMN and filter 506 includes a first stage and a second stage. The first stage is configured to convert approximately 6 ohm impedance to approximately 12 ohm impedance and includes a first portion of a low pass filter. The second stage is configured to convert approximately 12 ohm impedance to approximately 50 ohm impedance and includes a second portion of the low pass filter. As a result, the OMN and filter 506 convert the signal impedance from approximately 6 ohms to approximately 50 ohms and perform low-pass filtering of the signals.

  In one embodiment, each stage is preferably such that the first portion OMN has an output impedance of the power amplifier circuit that is approximately between 10% and 50% of the input impedance of the downstream component from the initial value. Form a partial OMN configured to step up to an up value. In other embodiments, the step-up value is 5% to 95%, 10% to 80%, 15% to 75%, 20% to 60%, 30% to 40%, etc. of the downstream component input impedance. In other embodiments, other ranges can be used for the step-up value. In one embodiment, the second partial OMN is configured to step up the output impedance of the first partial OMN to the impedance of the downstream component. In one embodiment, the downstream component is an antenna.

  In one embodiment, OMN and filter 506 are implemented using integrated passive device (IPD) technology. IPD technology allows passive devices such as capacitors, resistors and high Q inductors to be implemented in, for example, silicon. IPDs are generally fabricated using standard wafer fabrication techniques such as thin film and photolithography processes. The IPD can be designed as a component capable of flip chip mounting or wire bonding, and the substrate for the IPD is, for example, silicon, alumina and glass. The IPD component is less lossy than the passive components integrated in the power amplifier and OMN integrated circuit 202.

  In another embodiment, the OMN and filter parallel 506 is implemented using a ceramic component, such as an LTCC component. In a further embodiment, the OMN and filter parallel 506 is implemented as an external discrete filter using passive components such as external inductors and capacitors. In another embodiment, the parallel OMN and filter 506 is implemented using surface mount devices such as surface mount inductors and capacitors.

  The input tuning circuit 504 includes a matching component at the input to the OMN and filter parallel 506 and the output tuning circuit 508 outputs the output of the OMN and filter parallel 506 to further tune the OMN and filter parallel 506. Includes alignment components. In one embodiment, tuning circuits 504, 508 each include a single passive component to allow great flexibility in circuit design.

  For example, input and output tuning circuits 504, 508 tune the board to handle printed circuit board (PCB) parasitic elements that can affect the impedance of the transmission line from the power amplifier 514 to the switch / LNA circuit 210. Used as needed. In other words, since the impedance at the output of the power amplifier 514 is approximately 6 ohms, the impedance of the transmission line that electrically connects the output of the power amplifier 514 to the parallel OMN and filter 506 is also approximately 6 Must be ohms. The input tuning circuit 504 can also be used to tune the 6 ohm impedance of the transmission line. Similarly, since the impedance at the input to the switch / LNA circuit 210 is approximately 50 ohms, the impedance of the transmission line electrically connected to the output of the OMN and filter parallel 506 should be approximately 50 ohms. There is. For example, if the impedance at the input to the switch / LNA circuit 210 is not exactly 50 ohms, the output tuning circuit 508 can be used to tune a 50 ohm transmission line.

  By using the input and output tuning circuits 504, 508 in the transmission path 500, the number of external components is reduced compared to the transmission path 200 including the input and output tuning circuits 504, 508. In other embodiments, the input and output tuning circuits 504, 508 may be eliminated from the transmission path 500 to further reduce the number of external components.

  As described above, the switch / LNA circuit 210 includes a switch 220 having an input impedance of approximately 50 ohms and configured to switch between a transmit mode and a receive mode, and a low noise amplifier (LNA) 218. . When the switch 220 is configured in the reception mode, a signal received by the antenna 212 passes through the LNA 218 to the reception path. When switch 220 is configured for transmission mode, the RF transmission signal in transmission path 500 is passed to antenna 212 for transmission after amplification, filtering and tuning is complete.

  FIG. 6A is an exemplary circuit 600 of a combined output matching network and filter having parallel functions, including inductors L1, L2, L3, L4, L5 and capacitors C2, C3, C4. The first terminal TERMINAL 1 of the circuit 600 is electrically coupled to the output of the power amplifier IC 502 via the input tuning circuit 504.

  The first terminal TERMINAL1 of the circuit 600 is further coupled to the first end of the inductor L2, the first end of the capacitor C2, and the first end of the inductor L1. The inductor L2 and the capacitor C2 are connected in parallel. A second end of inductor L2 and a second end of capacitor C2 are electrically coupled to a first end of capacitor C3, a first end of capacitor C4, and a first end of inductor L4. A second end of capacitor C3 is electrically coupled to a first end of inductor L3. Capacitor C4 and inductor L4 are connected in parallel. A second end of capacitor C4, a second end of inductor L4, and a first end of inductor L5 are electrically coupled to second terminal TERMINAL2 of circuit 600. A second end of inductor L1, a second end of inductor L3, and a second end of inductor L5 are electrically coupled to ground GND.

  The second terminal TERMINAL 2 of the circuit 600 is further electrically coupled to the input of the switch / LNA circuit 210 via the output tuning circuit 508.

  Circuit 600 is configured to filter out block signals that travel from antenna 212 to power amplifier 502 when switch / LNA circuit 210 is in the transmit mode. In parallel or simultaneously, circuit 600 is configured to convert the power amplifier output impedance to the input impedance of antenna 212 and optimize the power of the transmitted signal transmitted to antenna 212. In one embodiment, circuit 600 converts a power amplifier output impedance of approximately 6 ohms to an antenna input impedance of approximately 50 ohms. In other embodiments, the circuit 600 is further configured to filter nth harmonics, such as second, third and / or fourth harmonics, of the RF transmit signal generated by the power amplifier 514. . In the embodiment of the parallel OMN and filter 600 illustrated in FIG. 6A, components L1-L2 and C2-C4 perform block function, impedance matching function, and harmonic filtering function simultaneously or approximately simultaneously.

  In one embodiment, L1 and L5 perform impedance transformation in the main frequency band. L2 / C2, L3 / C3, and L4 / C4 also perform impedance transformations in the main frequency band, harmonics generated by power amplifier 514, or interference in other frequency bands that enter the transmission path via antenna 212 Perform signal filtering / blocking. In other embodiments, L1 and L5 can be converted to an appropriate topology to perform additional filtering functions.

  FIG. 7 is an exemplary layout 700 of the circuit 600.

  FIG. 6B illustrates an exemplary circuit 650 of another embodiment of an output matching network and filter combination having a parallel function including inductors L6, L7, L8, L9 and capacitors C6, C7, C8, C9, C10, C11. It is. A first terminal TERMINAL 1 of circuit 650 is electrically coupled to the output of power amplifier IC 502 via input tuning circuit 504.

  The first terminal TERMINAL1 of the circuit 650 is further coupled to the first end of the inductor L6, the first end of the capacitor C6, and the first end of the capacitor C8. The inductor L6 and the capacitor C6 are connected in parallel. A second end of inductor L6 and a second end of capacitor C6 are electrically coupled to ground GND. A second end of capacitor C8 is electrically coupled to a first end of capacitor C10 and a first end of inductor L7. A second end of inductor L7 is electrically coupled to a first end of capacitor C7, and a second end of capacitor C7 is electrically coupled to ground GND. A second end of capacitor C10 is electrically coupled to a first end of inductor L8, a first end of inductor L9, and a first end of capacitor C9. Capacitor C9 and inductor L9 are connected in parallel. The second end of capacitor C9, the second end of inductor L9, and the first end of capacitor C11 are electrically coupled to second terminal TERMINAL2 of circuit 650. A second end of inductor L8 and a second end of capacitor C11 are electrically coupled to ground GND.

  The second terminal TERMINAL 2 of the circuit 650 is further electrically coupled to the input of the switch / LNA circuit 210 via the output tuning circuit 508.

  Circuit 650 is configured to filter out block signals that travel from antenna 212 to power amplifier 502 when switch / LNA circuit 210 is in the transmit mode. In parallel or simultaneously, circuit 650 is configured to convert the power amplifier output impedance to the input impedance of antenna 212 and optimize the power of the transmitted signal transmitted to antenna 212. In one embodiment, circuit 650 converts a power amplifier output impedance of approximately 6 ohms to an antenna input impedance of approximately 50 ohms. In other embodiments, the circuit 650 is further configured to filter nth harmonics, such as second, third and / or fourth harmonics, of the RF transmit signal generated by the power amplifier 514. . In the embodiment of the parallel OMN and filter 650 illustrated in FIG. 6B, the components L6-L9 and C6-C11 perform block function, impedance matching function, and harmonic filtering function simultaneously or approximately simultaneously.

  FIG. 5B is an exemplary block diagram of an RF transmit path 550 that includes a power amplifier IC 503, an input tuning circuit 504, a filter 507, an output tuning circuit 508, a switch / LNA circuit 210, and an antenna 212. The power amplifier IC 503 includes a power amplifier and a partial output matching network circuit 515. The power amplifier portion of circuit 515 is configured to amplify the RF transmit signal including one or more amplifier stages. A partial output matching network portion of circuit 515 includes an impedance matching circuit configured to convert the impedance of the circuit from approximately 6 ohms to approximately 12 ohms, such as a power amplifier.

  In one embodiment, a module 551, such as a front end module, includes a power amplifier IC 503, an input tuning circuit 504, a filter 507, an output tuning circuit 508, and a switch / LNA circuit 210. In other embodiments, module 551 includes power amplifier IC 503, input tuning circuit 504, filter 507, and output tuning circuit 508. In a further embodiment, module 551 includes power amplifier IC 503, input tuning circuit 504, and filter 507. In a further embodiment, module 551 includes power amplifier IC 503 and filter 507.

  As mentioned above, amplifier IC 503 includes an amplifier and an impedance matching circuit configured to convert approximately 6 ohm impedance to approximately 12 ohm impedance. Filter 507 receives a signal from power amplifier IC 503 having an impedance of approximately 12 ohms, converts the impedance of approximately 12 ohms to approximately 50 ohms, and in parallel therewith. , Configured to block the signal received from the external antenna from traveling along the RF transmission path 550 from the antenna 212 to the power amplifier circuit 515.

  An input to the power amplifier IC 503 receives the RF transmission signal from the RF transmitter. The output of power amplifier IC 503 is electrically coupled to the input of filter 507 via input tuning circuit 504. The output of filter 507 is electrically coupled to the input of switch / LNA 210. When switch 220 is in transmit mode, the output of switch / LNA 210 is electrically coupled to antenna 212 and an amplified, impedance matched, and filtered RF transmit signal is transmitted by antenna 212.

  A power amplifier integrated circuit (IC) 503 includes a power amplifier and a partial output matching network circuit 515 integrated on a power amplifier die. The power amplifier 515 is mounted on a lossy integrated circuit substrate such as, for example, SiGe, CMOS, GaAs, SiC, or other semiconductor material. In contrast to power amplifier IC 202, a portion of the OMN is moved from the power amplifier die and implemented in filter 507. In contrast to the OMN and filter parallel 506, a portion of the OMN is moved to the power amplifier die 503 and the remaining portion of the OMN is implemented in the filter 507.

  In one embodiment, the power amplifier and partial OMN circuit 515 are configured to implement amplification and impedance matching from 6 ohms to 12 ohms. In other embodiments, the power amplifier and partial OMN circuit 507 may amplify and source impedance and load of approximately less than 6 ohms, approximately greater than 6 ohms, approximately less than 12 ohms, or approximately greater than 12 ohms. Implement impedance matching with impedance.

  The filter 507 is referred to in part as a parallel body of OMN and filter, and includes a combination of a matching network and a filter having a parallel function. Partial OMN and filter 507 is configured to implement impedance matching and filtering in parallel, similar to OMN and filter parallel 506.

  In one embodiment, the power amplifier and partial OMN circuit 515 preferably has the output impedance of the power amplifier circuit between an initial value and approximately 10% to 50% of the input impedance of the downstream component. Configured to step up to an up value. In other embodiments, the step-up value is 5% to 95%, 10% to 80%, 15% to 75%, 20% to 60%, 30% to 40%, etc. of the downstream component input impedance. In other embodiments, other ranges can be used for the step-up value. In one embodiment, the partial OMN and filter parallel 507 is configured to step up the output impedance of the power amplifier and partial OMN circuit 515 to the impedance of the downstream component. In one embodiment, the downstream component is an antenna.

  The parallel body 507 of the partial OMN and the filter is not a serial OMN followed by a filter. The filter and OMN are combined so that the components function in parallel as matching components and filtering components. With the filter becoming part of the OMN and the OMN becoming part of the filter, the overall signal loss is less than the loss that would occur if the OMN and filter were implemented separately. Furthermore, the size of the partial OMN and filter parallel 507 is smaller than the combined size of the separately implemented OMN and filter.

  In one embodiment, the partial OMN and filter parallel 507 is implemented using integrated passive device (IPD) technology. In other embodiments, the partial OMN and filter parallel 507 is implemented using a ceramic component, such as an LTCC component. In a further embodiment, the partial OMN and filter parallel 507 is implemented as an external discrete filter using passive components such as external inductors and capacitors. In another embodiment, the partial OMN and filter parallel 507 is implemented using surface mounted devices such as surface mounted inductors and capacitors.

  The input tuning circuit 504 includes a matching component at the input to the partial OMN and filter parallel 507, and the output tuning circuit 508 is a partial OMN and filter parallel to further tune the partial OMN and filter parallel 507. Includes matching components at 507 output. In one embodiment, the tuning circuits 504, 508 each include a single passive component that allows great flexibility in circuit design as described above.

  FIG. 6C is an exemplary circuit 670 of a partial output matching network for implementation on the power amplifier die 503. The circuit 670 includes inductors L11 and L12 and a capacitor C12. A first terminal TERMINAL 1 of circuit 670 is electrically coupled to the output of the power amplifier on power amplifier IC 503.

  The first terminal TERMINAL1 of the circuit 670 is further coupled to the first end of the inductor L12 and the first end of the capacitor C12. The inductor L12 and the capacitor C12 are connected in parallel. A second end of inductor L12 and a second end of capacitor C12 are electrically coupled to a first end of inductor L11 and a second terminal TERMINAL2 of circuit 670. A second end of inductor L11 is electrically coupled to ground GND.

  The second terminal TERMINAL2 of the circuit 670 is further electrically coupled to the input of the parallel OMN and filter parallel body 507. In one embodiment, the second terminal TERMINAL2 of circuit 670 is electrically coupled to the input of the parallel body of part OMN and filter 507 via input tuning circuit 504.

  The circuit 670 is configured to convert the power amplifier output impedance to the input impedance of the parallel OMN and filter parallel 507. In one embodiment, circuit 670 converts a power amplifier output impedance of approximately 6 ohms to an impedance of approximately 12 ohms.

  FIG. 6D is an exemplary circuit 680 of a partial output matching network and filter with parallel functionality for implementation away from the power amplifier die 503. The circuit 670 includes inductors L13, L14, L15 and capacitors C13, C14. A first terminal TERMINAL1 of circuit 680 is electrically coupled to the output of a portion OMN on power amplifier IC503. In one embodiment, the first terminal TERMINAL1 of the circuit 680 is electrically coupled to the second terminal TERMINAL2 of the circuit 670 via the input tuning circuit 504.

  The first terminal TERMINAL1 of the circuit 680 is further electrically coupled to the first terminal of the capacitor 13, the first terminal of the inductor L13, and the first terminal of the inductor L15. The capacitor C13 and the inductor L13 are configured in parallel. A second end of capacitor C13 and a second end of inductor L13 are electrically coupled to a first end of capacitor C14 and a second terminal TERMINAL2 of circuit 680. A second end of capacitor C14 is electrically coupled to a first end of inductor L14. A second end of inductor L15 and a second end of inductor L15 are electrically coupled to ground GND.

  The second terminal TERMINAL 2 of the circuit 680 is further electrically coupled to the input of the switch / LNA circuit 210 via the output tuning circuit 508.

  Circuit 680 is configured to filter out block signals going from antenna 212 to power amplifier 503 when switch / LNA circuit 210 is in transmit mode. In parallel or simultaneously, circuit 680 is configured to convert the output impedance of power amplifier IC 503 into the input impedance of antenna 212 and optimize the power of the transmitted signal transmitted to antenna 212. In one embodiment, circuit 680 converts the approximately 12 ohm output impedance of power amplifier IC 503 to an approximately 50 ohm antenna input impedance. In other embodiments, the circuit 680 is further configured to filter nth harmonics, such as second, third and / or fourth harmonics, of the RF transmit signal generated by the power amplifier 503. . In the embodiment of the partial OMN and filter parallel 680 illustrated in FIG. 6D, the components L13, L14, L15, C13 and C14 perform block function, impedance matching function, and harmonic filtering function simultaneously or approximately simultaneously. Do.

  In one embodiment, the parallel OMN and filter parallel bodies 507, 680 with parallel functionality are implemented as IPDs, and the partial OMN 670 is implemented on a silicon die 503 with a power amplifier. The quality factor Q of the inductors L13, L14, L15 on the IPD is considerably higher than on the silicon die 503. In a further embodiment, a large inductor is preferably implemented in the IPD instead of the silicon die 503.

  FIG. 5C is an exemplary block diagram of an RF transmit path 570 that includes a power amplifier IC 574, input tuning circuit 504, OMN 576, filter 580, output tuning circuit 508, switch / LNA circuit 210, and antenna 212. The power amplifier 574 includes one or more amplifier stages and is configured to amplify the RF transmit signal.

  In one embodiment, module 571, such as a front end module, includes power amplifier IC 574, input tuning circuit 504, OMN 576, filter 578, output tuning circuit 508 and switch / LNA circuit 210. In other embodiments, module 571 includes power amplifier IC 574, input tuning circuit 504, OMN 576, filter 578, and output tuning circuit 508. In a further embodiment, module 571 includes power amplifier IC 574, input tuning circuit 504, OMN 576 and filter 578. In a further embodiment, module 501 includes power amplifier IC 574, OMN 576 and filter 578.

  OMN 576 is configured to convert the impedance of RF transmission path 570 from power amplifier 514 to antenna 212. OMN 576 converts the output impedance of the power amplifier, approximately 6 ohms, to the input impedance of antenna 212, approximately 50 ohms. Filter 578 is configured to block signals received from the external antenna from traveling along RF transmission path 570 from antenna 212 to power amplifier 574. OMN 576 and filter 580 are located away from power amplifier die 574. OMN 576 and filter 580 can be implemented as IPDs, individual components, surface mount components, and the like.

  In other embodiments, the power amplifier IC further includes a first portion OMN 572, such as circuit 670, and OMN 576 includes a second portion OMN, such as circuit 680, with the combined function of the first and second portions OMN, The approximately 6 ohm output impedance of the power amplifier is converted to an approximately 50 ohm input impedance of the antenna 212.

  FIG. 8 is an exemplary block diagram of an RF transmit path 800 that includes another embodiment of an OMN and filter parallel 806. The OMN and filter parallel 806 is configured to combine the output matching network and filter with parallel functionality, and is further configured to include input tuning and output tuning components.

  In one embodiment, a module 801, such as a front end module, includes a power amplifier IC 502, an OMN and filter parallel 806, and a switch / LNA circuit 210. In other embodiments, the module 501 includes a power amplifier IC 502 and an OMN and filter parallel 806.

  In other embodiments, the OMN and filter parallels 502, 600, 650, 806 further include an input matching network (IMN) associated with the receive path of the device 100. In a further embodiment, a combination of input IMN and filter can be used in the receive path. For example, the LNA frequently uses matching at that input to achieve the lowest possible noise figure. The IMN and filter combination includes an IPD that functions in parallel as an IMN and filter to match the input impedance of the LNA and to filter the received signal.

  Although the OMN and filter parallels 506, 600, 650, 806 are described herein for performing impedance transformation and a block of mixing of the amplified output of the tone power amplifier 514 in parallel, And other parallel embodiments of filters 506, 600, 650, 806 perform impedance matching and filtering or signal conditioning in parallel. In one embodiment, OMN and filter parallels 506, 600, 650, 806 provide bi-directional parallel impedance matching and signal conditioning. In a further embodiment, the OMN and filter parallels 506, 600, 650, 806 can be configured to combine the output matching function and any type of signal conditioning. Other embodiments of OMN and filter parallel bodies 506, 600, 650, 806 that affect the output matching network and filter combination with parallel capabilities are different and different passives known to those skilled in the art from this disclosure. It can be configured to have components.

  The parallel bodies 506, 600, and 650 of the OMN and the filter reduce power loss and use less space compared to other configurations of the transmission path. For comparison purposes, a −30 dB EVM power was simulated for the three configurations. For a transmission path implemented with a power amplifier IC including an on-die OMN and an external LTCC filter, the EVM power of -30 dB was approximately 19.3 dBm. For a power amplifier IC excluding OMN, off-die individual OMN, and transmission path implemented with external LTCC filtering, the EVM power of -30 dB was approximately 19.3 dBm. For the power amplifier IC excluding the OMN and the transmission path in which the parallel bodies 506, 600, and 806 of the OMN and the filter are mounted, the EVM power of −30 dB is approximately 21.3 dBM. The use of OMN and filter parallels 506, 600, 650 provides at least a 2 dB improvement.

The effect on size is also advantageous. For comparison purposes, the printed circuit board area was determined for two functionally comparable configurations. The substrate area for the power amplifier IC including the on-die OMN, four matching components, and the external LTCC filter is approximately 3 mm ² , while the power amplifier IC excluding the OMN and the parallel body of the OMN and the filter 506, 600, 650 The substrate area is approximately 2.4 mm ² . The use of OMN and filter parallels 506, 600, 650 results in approximately 20% substrate space reduction.

  FIG. 9 is an exemplary block diagram of an output matching network and filter parallel semiconductor die 900 including one embodiment of a parallel body 902 of output matching network and filter circuitry. In one embodiment, circuit 902 includes a parallel body 506 of output matching networks and filters. In other embodiments, the circuit 902 includes an output matching network and filter parallel 806 that further includes input tuning and output tuning functionality. In other embodiments, the circuit 902 includes a parallel body 600, 650 of output matching networks and filter circuits. In a further embodiment, the circuit 902 includes a partial OMN and filter parallel 507.

  In one embodiment, die 900 includes a silicon (Si) die. In one embodiment, the Si die includes a SiCMOS die, a SiGeBiCMOS die, and the like. In other embodiments, the die 900 may include a gallium arsenide (GaAs) die, a pseudo-lattice matched high electron mobility transistor (pHEMT) die, or the like. In one embodiment, the die 900 implements IPD technology for the components of the parallel OMN and filter circuit 506, 600, 650, 806.

  FIG. 10 is an exemplary block diagram of a module that includes the output matching network and filter parallel semiconductor die 900 of FIG. 9 and a power amplifier integrated circuit 502, 503, or 574. Module 1000 further includes a connection 1002 that provides signal interconnections, as known to those skilled in the art of semiconductor fabrication in light of the disclosure herein, and a packaging 1004, such as a package substrate, for circuit packaging. And other circuit dies 1006 such as amplifiers, pre-filters, post-filters, modulators, demodulators, down converters, and the like. In one embodiment, module 1000 includes a front end module. In one embodiment, module 1000 further includes a switch / LNA circuit 210.

  FIG. 11 illustrates a simple portable transceiver 1100 that includes one embodiment of an output matching network and filter combination 506, 507, 600, 650, 700, or 806 with parallel functionality, or one embodiment of OMN 576 and filter 578. FIG. 3 is an exemplary block diagram illustrating the example.

  The portable transceiver 1100 includes a speaker 1102, a display 1104, a keyboard 1106 and a microphone 1108, all of which are connected to the baseband subsystem 1110. A power source 1142, which can be a direct current (DC) battery or other power source, is connected to the baseband subsystem 1110 to provide power to the portable transceiver 1100. In particular embodiments, the portable transceiver 1100 can be, but is not limited to, a portable communication device such as, for example, a portable cellular phone. Speaker 1102 and display 1104 receive signals from baseband subsystem 1110 as is known to those skilled in the art. Similarly, keyboard 1106 and microphone 1108 provide signals to baseband subsystem 1110.

  The baseband subsystem 1110 includes a microprocessor (μP) 1120, a memory 1122, an analog circuit 1124 and a digital signal processor (DSP) 1126 that communicate via a bus 1128. Although bus 1128 is shown as a single bus, it can also be implemented using multiple buses that are connected as needed between subsystems within baseband subsystem 1110. Baseband subsystem 1110 may also include one or more of application specific integrated circuit (ASIC) 1132 and field programmable gate array (FPGA) 1130.

  Microprocessor 1120 and memory 1122 provide signal timing, processing and storage functions to portable transceiver 1100. Analog circuit 1124 provides an analog processing function for signals within baseband subsystem 1110. Baseband subsystem 1110 provides control signals to, for example, transmitter 1150, receiver 1170 and power amplifier 1180.

  For simplicity, only basic components of the portable transceiver 1100 are illustrated here. Control signals provided by the baseband subsystem 1110 control various components within the portable transceiver 1100. Further, the functionality of transmitter 1150 and receiver 1170 can be integrated into a transceiver.

  The baseband subsystem 1110 also includes an analog / digital converter (ADC) 1134 and digital / analog converters (DACs) 1136 and 1138. In this example, DAC 1136 generates in-phase (I) and quadrature (Q) signals 1140 that are applied to modulator 1152. The ADC 1134, DAC 1136, and DAC 1138 also communicate with the microprocessor 1120, memory 1122, analog circuit 1124, and DSP 1126 via the bus 1128. The DAC 1136 converts the digital communication information in the baseband subsystem 1110 into an analog signal for transmission to the modulator 1152 via the connection unit 1140. Connection 1140, shown as two directional arrows, includes information to be transmitted by transmitter 1150 after conversion from the digital domain to the analog domain.

  The transmitter 1150 includes a modulator 1152. Modulator 1152 modulates analog information at connection 1140 and provides a modulated signal to upconverter 1154. Upconverter 1154 converts the modulated signal to an appropriate transmission frequency and provides the upconverted signal to power amplifier 1180. The power amplifier 1180 amplifies the signal to a power level appropriate for the system designed to operate the portable transceiver 1100.

  Details of modulator 1152 and upconverter 1154 will be omitted as they will be understood by those skilled in the art. For example, data at connection 1140 is typically formatted by baseband subsystem 1110 into in-phase (I) and quadrature (Q) components. The I and Q components take different forms and can be formatted differently depending on the communication standard used.

  Front end module 1162 includes a power amplifier circuit 1180 and a switch / low noise amplifier circuit 1172. In one embodiment, the switch / low noise amplifier circuit 1172 includes an antenna system interface that may include, for example, a diplexer with filter pairs that allow simultaneous transmission of both transmitted and received signals, as known to those skilled in the art. .

  In one embodiment, the front end module further includes an output matching network and filter combination 1190 having parallel functionality. This includes one embodiment of a parallel body of output matching networks and filter circuits 506, 507, 600, 650, 700, 806, or OMN 574 and filter 576. The power amplifier 1180 includes an output matching network and a filter having a parallel function of filtering the amplified transmission signal and matching or approximating the impedance to the impedance of the antenna 1160. Supply to combined body 1190. In addition, the output matching network and filter combination 1190 with parallel functionality blocks the signal received by the antenna 1160 from the external antenna when the switch is in transmit mode. When the switch is in the transmission mode, the transmission signal is supplied from the front end module 1162 to the antenna 1160.

  In one embodiment, the front end module 1162 includes a module 1000 that includes a matching network and filter die 900. In one embodiment, an output matching network and filter combination 1190 having parallel functionality includes a module 1000 that includes a matching network and filter die 900.

  The signal received by antenna 1160 is directed from switch / low noise amplifier 1172 of front end module 1162 to receiver 1170 when the switch is in receive mode. The low noise amplifier circuit 1172 amplifies the received signal.

  When downconverter 1174 is implemented using a direct conversion receiver (DCR), it can amplify the received signal from an RF level to a baseband level (DC) or near baseband level (approximately 100 kHz). Convert. Alternatively, the amplified received RF signal is downconverted to an intermediate frequency (IF) signal depending on the application. The down-converted signal is transmitted to filter 1176. Filter 1176 includes at least one filter stage that filters the downconverted received signal, as is known in the art.

  The filtered signal is transmitted from filter 1176 to demodulator 1178. The demodulator 1178 recovers the transmitted analog information and supplies a signal representing this information to the ADC 1134 via the connection unit 1186. The ADC 1134 converts the analog signal into a digital signal at the baseband frequency and transmits the signal to the DSP 1126 via the bus 1128 for further processing.

  Glossary

  Some of the embodiments described above provide examples related to mobile phones. However, the principles and advantages of this embodiment can be used for any other system or device required for a power amplifier system.

  Such a system or apparatus can be implemented in various electronic devices. Examples of electronic devices may include, but are not limited to, household appliances, household appliance parts, electronic test equipment, and the like. Examples of electronic devices include, but are not limited to, memory chips, memory modules, optical network or other communication network circuits, and disk driver circuits. Household electrical products include mobile phones such as smartphones, telephones, televisions, computer monitors, computers, handheld computers, laptop computers, tablet computers, personal digital assistants (PDAs), PC cards, microwave ovens, refrigerators, automobiles, stereos System, cassette recorder or player, DVD player, CD player, VCR, MP3 player, radio, video camera, camera, digital camera, portable memory chip, washing machine, dryer, washing machine / dryer, copy machine, facsimile machine, This may include, but is not limited to, a scanner, a multifunction peripheral device, a wrist watch, a clock, and the like. Furthermore, the electronic device may also include unfinished products.

  Throughout the specification and claims, unless the context clearly indicates otherwise, a term such as “comprising” has an inclusive meaning opposite to the exclusive or exhaustive meaning, ie, “including”. Should be interpreted as meaning "not limited to these". The term “coupled” as generally used herein refers to two or more elements that can be either directly connected or connected via one or more intermediate elements. Similarly, the term “connection” as generally used herein refers to two or more elements that can be either directly connected or connected via one or more intermediate elements. In addition, the terms “here,” “above,” “below,” and like terms when used in this application refer to the entire application and not to any particular part of the application. Where the context allows, terms in the above detailed description using the singular or plural number may also include the plural or singular number. For the terms “or” and “or” referring to a list of two or more items, the term covers all of the following interpretations. That is, an arbitrary item of the list, all items of the list, and an arbitrary combination of items of the list.

  Unless specifically stated otherwise, conditional languages as used herein, such as “can”, “may”, “may do”, “can”, “for example”, etc., or Unless otherwise understood in the context of use, it is generally interpreted to convey that a given embodiment includes a given feature, element, and / or condition, but no other embodiment. That is, such a conditional language requires that features, elements and / or states are in any manner necessary for one or more embodiments, or that one or more embodiments are necessarily input or prompted by the author, It is not generally intended to imply that these features, elements and / or states are included in any particular embodiment or include logic to determine whether or not to do so.

  The above detailed description of embodiments of the invention is not intended to be exhaustive or to limit the invention to the precise form disclosed above. While particular embodiments of the present invention and its examples have been described above for purposes of illustration, as will be appreciated by those skilled in the art, various equivalent modifications are possible within the scope of the present invention. For example, processes or blocks are presented in a given order, but alternative embodiments can perform routines with steps in a different order or use a system with blocks, with some processes or blocks removed , Move, add, subdivide, combine and / or modify. Each of these processes or blocks can be implemented in a variety of different ways. Also, although processes or blocks may be shown to be performed in series, these processes or blocks may alternatively be performed in parallel or at different times.

  The teachings of the invention provided herein are not necessarily limited to the system described above, and can be applied to other systems. The various embodiment elements and acts described above can be combined to provide further embodiments.

While certain embodiments of the invention have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the present disclosure. Indeed, the novel methods, apparatus and systems described herein can be embodied in various other forms. Further, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the present disclosure. It is intended that the appended claims and their equivalents cover such forms or modifications that fall within the scope and spirit of this disclosure.

Claims (22)

A radio frequency power amplifier module used in a multi-band wireless portable device comprising:
A first semiconductor die including an amplifier circuit configured to amplify a radio frequency input signal received at an input terminal of the module for transmission by a first antenna associated with a first transmission path of the portable device; ,
An input tuning circuit including at least a first capacitor in communication with the first semiconductor die;
An output tuning circuit including at least a first inductor in communication with an output terminal of the module;
A first circuit connected in series between the input tuning circuit and the output tuning circuit;
The first circuit includes at least a second inductor and a second capacitor connected in parallel and configured to convert an output impedance of the amplifier circuit to an input impedance of the first antenna;
The second inductor and the second capacitor further receive a signal radiated from a second antenna associated with a second transmission path of the portable device and received at the output terminal to the first transmission path to the amplifier circuit. A module that is configured to block from proceeding in the opposite direction along. The module of claim 1, wherein the first circuit includes a plurality of integrated passive devices included in a common package. The module of claim 1, wherein the first circuit includes a plurality of surface mount devices. The module of claim 1, wherein the first circuit is mounted on a second semiconductor die separate from the first semiconductor die. The module of claim 1, wherein the first semiconductor die does not include an output matching network. The first circuit converts the output impedance of the amplifier circuit from approximately 6 ohms to approximately 50 ohms, and converts the signal received at the output terminal from the second antenna to the first transmission path. The module of claim 1 including a parallel body of an output matching network and a filter circuit configured to perform in parallel blocking from propagating through the output matching network. The module of claim 1, wherein the first circuit includes a first impedance matching network configured to convert the output impedance of the amplifier circuit from approximately 6 ohms to approximately 12 ohms. The first circuit further converts the output impedance of the first impedance matching network from approximately 12 ohms to approximately 50 ohms, and receives a signal received at the output terminal from the second antenna, Including a parallel body of an output matching network and a filter circuit configured to perform in parallel blocking from propagating backward through the first transmission path;
The module of claim 7, wherein the first impedance matching network is separate from a parallel body of the output matching network and a filter circuit. The first circuit further includes a third inductor and a third capacitor connected in series,
The module according to claim 1, wherein the parallel combination of the second inductor and the second capacitor and the parallel combination of the third inductor and the third capacitor are connected in series and have a common terminal. The first circuit further includes a fourth capacitor connected in series with a fourth inductor;
The module of claim 9, wherein a series combination of the fourth capacitor and the fourth inductor is coupled between the common terminal and ground. The first circuit further includes a fifth inductor connected between the input of the first circuit and the ground, and a sixth inductor connected between the output of the first circuit and the ground. The module of claim 10. The first circuit has functions of impedance matching and filtering,
The first circuit is configured to function as both an output matching network and at least one filter;
The signal loss associated with the first circuit is less than the signal loss associated with the separately implemented output matching network and the at least one filter, and the size of the first circuit is implemented separately. The module of claim 1, wherein the module is smaller than a size of the output matching network and the at least one filter. A multi-band wireless portable device,
A first antenna and a second antenna, each associated with a first radio frequency transmission path and a second radio frequency transmission path;
A transmit / receive switch configured to pass a radio frequency output signal to the first antenna for transmission purposes;
A radio frequency power amplifier module including a first semiconductor die;
The first semiconductor die includes an amplifier circuit configured to amplify a radio frequency input signal for transmission by the first antenna; and an input tuning circuit including at least a first capacitor in communication with the first semiconductor die; An output tuning circuit including at least a first inductor; and a first circuit connected in series between the input tuning circuit and the output tuning circuit;
The first circuit includes at least a second inductor and a second capacitor connected in parallel and configured to convert an output impedance of the amplifier circuit to an input impedance of the first antenna;
The second inductor and the second capacitor further transmit a signal radiated from a second antenna associated with the second radio frequency transmission path to the amplifier circuit when the transmission / reception switch is configured for transmission. A wireless handheld device configured to block from traveling in the reverse direction along the first radio frequency transmission path of the device. The wireless portable device of claim 13, wherein the first circuit includes a plurality of integrated passive devices included in a common package. The wireless portable device of claim 13, wherein the first semiconductor die does not include any impedance matching function. The first circuit converts the output impedance of the amplifier circuit from approximately 6 ohms to approximately 50 ohms, and transmits a signal received from the second antenna through the first radio frequency transmission path. 14. The wireless handheld device of claim 13, comprising a parallel body of an output matching network and a filter circuit configured to perform blocking from propagating backwards in parallel. 14. The wireless handheld device of claim 13, wherein the first circuit includes a first impedance matching network configured to convert the output impedance of the amplifier circuit from approximately 6 ohms to approximately 12 ohms. The first circuit converts an output impedance of the first impedance matching network from approximately 12 ohms to approximately 50 ohms, and transmits a signal received from the second antenna to the first radio frequency transmission. Including a parallel body of an output matching network and a filter circuit configured to perform in parallel blocking from propagating backward through the path;
The wireless portable device of claim 17, wherein the first impedance matching network is separate from a parallel body of the output matching network and a filter circuit. A method for reducing intermodulation of a radio frequency output signal in a multi-band wireless portable device comprising:
Amplifying a radio frequency input signal by a power amplifier circuit mounted on a first semiconductor die for the purpose of transmission by a first antenna in a first radio frequency path, and providing an amplified radio frequency signal, The power amplifier circuit is connected to an input tuning circuit that includes at least a first capacitor and communicates with the first semiconductor die;
The output impedance of the power amplifier circuit is converted to approximate the input impedance of the first antenna by a first circuit connected in series between the input tuning circuit and an output tuning circuit including at least a first inductor. The first circuit includes at least a second capacitor and a second inductor;
In parallel with the conversion, a signal radiated from a second antenna associated with a second radio frequency path is reversed by the first circuit to the power amplifier circuit along the first radio frequency path. Block from moving forward,
Tuning the input impedance of the first circuit by the input tuning circuit;
Tuning the output impedance of the first circuit with the output tuning circuit. The power amplifier circuit is mounted on the first semiconductor die;
The method of claim 19, wherein the first circuit is not mounted on the first semiconductor die. 21. The method of claim 20, wherein the first circuit is mounted on a second semiconductor die that is separate from the first semiconductor die. The first circuit is configured to function as both an output matching network and at least one filter;
The signal loss associated with the first circuit is less than the signal loss associated with the separately implemented output matching network and the at least one filter, and the size of the first circuit is implemented separately. 21. The method of claim 20, wherein the method is smaller than a size of the output matching network and the at least one filter.

Images