JP6585082B2 - 加熱エレメントのための支持システムおよび加熱システム - Google Patents
加熱エレメントのための支持システムおよび加熱システム Download PDFInfo
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- JP6585082B2 JP6585082B2 JP2016567140A JP2016567140A JP6585082B2 JP 6585082 B2 JP6585082 B2 JP 6585082B2 JP 2016567140 A JP2016567140 A JP 2016567140A JP 2016567140 A JP2016567140 A JP 2016567140A JP 6585082 B2 JP6585082 B2 JP 6585082B2
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- Prior art keywords
- heating element
- heating
- support
- load bearing
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/66—Supports or mountings for heaters on or in the wall or roof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
111、211、311 支持部材
112、212、312 遠位端部
113、213、313 近位端部
122、222、322 スプリングエレメント
122a、122b リーフ
225、325 レールガイド配列
450 加熱エレメント
460 熱シールドシステム
Claims (11)
- 加熱エレメント(450)を支持するための支持システム(100,201,301,400,401)であって、
高さ方向(z)が主延長方向であり、加熱エレメント(450)に適合される近位端部(113、213、313)と遠位端部(112、212、312)を有する支持部材(111、211、311)と、
前記支持部材(111,211,311)の遠位部分に係合されたスプリングエレメント(122、222、322)を有する耐力システムであって、前記遠位部分が前記近位端部(113、213、313)から離れた箇所に形成された耐力システムを備え、
前記耐力システムは、耐力方向(x)において前記支持部材に弾性力を提供し、剛性方向(y)において支持システムの動きを制限し、
前記耐力システムは、高さ方向(z)に前記遠位部分から前記近位端部(113、213、313)に向かって、少なくとも一部が延在し、
前記支持部材および前記スプリングエレメントが、前記耐力方向(x)または前記剛性方向(y)に配置されていることを特徴とする支持システム。 - 前記スプリングエレメント(122、222、322)が、前記耐力方向(x)に沿った主弾性方向を有することを特徴とする請求項1記載の支持システム。
- 前記スプリングエレメント(122、222、322)が、平行方向に配置された2又は3以上のリーフ(122a、122b)を有することを特徴とする請求項1または2記載の支持システム。
- さらに、前記耐力システムは、前記耐力方向(x)を向いており、かつ、前記支持部材の前記遠位端部が、直接的にまたは他の部材を介して間接的に噛み合わされたレールガイド配列(225、325)を有することを特徴とする請求項1または2記載の支持システム。
- 前記スプリングエレメントが、U字状スプリングによって形成されていることを特徴とする請求項4記載の支持システム。
- 前記支持部材および前記スプリングエレメントの少なくとも一方の材料が、高融点金属を少なくとも90重量%含むことを特徴とする請求項1〜5のいずれかに記載の支持システム。
- 前記高融点金属が、タングステン、モリブデン、タンタル、レニウム、ニオブおよびそれらの合金から選ばれることを特徴とする請求項6記載の支持システム。
- 少なくとも1つの加熱エレメントと、少なくとも2つの請求項1〜7のいずれかに記載された支持システム(100、201、301、400、401)を有することを特徴とする加熱システム。
- 前記支持システム(100、201、301、400、401)は、共通の中心点から各支持システムの耐力方向が方向付けられていることを特徴とする請求項8記載の加熱システム。
- 少なくとも1つの支持システムの前記スプリングエレメント(122、222、322)が、安定状態においてプリテンションがかけられていることを特徴とする請求項8または9記載の加熱システム。
- 前記加熱エレメント(450)の下方であって、前記スプリングエレメント(122、222、322)の上方に配置され、前記支持部材が膨張して通過できる開口を備えた熱シールドシステム(460)を有することを特徴とする請求項8〜10のいずれかに記載の加熱システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/170,771 US9497803B2 (en) | 2014-02-03 | 2014-02-03 | Supporting system for a heating element and heating system |
US14/170,771 | 2014-02-03 | ||
PCT/EP2015/000143 WO2015113753A1 (en) | 2014-02-03 | 2015-01-27 | Supporting system for a heating element |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017508264A JP2017508264A (ja) | 2017-03-23 |
JP2017508264A5 JP2017508264A5 (ja) | 2018-02-01 |
JP6585082B2 true JP6585082B2 (ja) | 2019-10-02 |
Family
ID=52573646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016567140A Active JP6585082B2 (ja) | 2014-02-03 | 2015-01-27 | 加熱エレメントのための支持システムおよび加熱システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US9497803B2 (ja) |
JP (1) | JP6585082B2 (ja) |
KR (1) | KR102275933B1 (ja) |
CN (1) | CN106165530B (ja) |
TW (1) | TWI698619B (ja) |
WO (1) | WO2015113753A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102453108B1 (ko) * | 2020-07-22 | 2022-10-07 | 세메스 주식회사 | 지지 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4860306A (en) | 1988-10-05 | 1989-08-22 | Vacuum Furnace Systems Corporation | Hot zone employing graphite heating elements |
JPH079036Y2 (ja) | 1990-11-13 | 1995-03-06 | 東京エレクトロン東北株式会社 | 縦型熱処理炉 |
JPH08145050A (ja) * | 1994-11-24 | 1996-06-04 | Toshiba Corp | ティルティングパッド式気体軸受装置 |
US6023487A (en) | 1998-02-23 | 2000-02-08 | Jones; William R. | Process for repairing heat treating furnaces and heating elements therefor |
US6582780B1 (en) * | 1999-08-30 | 2003-06-24 | Si Diamond Technology, Inc. | Substrate support for use in a hot filament chemical vapor deposition chamber |
WO2001091166A1 (fr) * | 2000-05-26 | 2001-11-29 | Ibiden Co., Ltd. | Dispositif de fabrication et de controle d'un semi-conducteur |
US9627244B2 (en) * | 2002-12-20 | 2017-04-18 | Mattson Technology, Inc. | Methods and systems for supporting a workpiece and for heat-treating the workpiece |
US7645342B2 (en) * | 2004-11-15 | 2010-01-12 | Cree, Inc. | Restricted radiated heating assembly for high temperature processing |
JP5684023B2 (ja) * | 2011-03-28 | 2015-03-11 | 株式会社小松製作所 | 加熱装置 |
US10136472B2 (en) * | 2012-08-07 | 2018-11-20 | Plansee Se | Terminal for mechanical support of a heating element |
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2014
- 2014-02-03 US US14/170,771 patent/US9497803B2/en active Active
-
2015
- 2015-01-21 TW TW104101882A patent/TWI698619B/zh active
- 2015-01-27 CN CN201580007028.0A patent/CN106165530B/zh active Active
- 2015-01-27 WO PCT/EP2015/000143 patent/WO2015113753A1/en active Application Filing
- 2015-01-27 KR KR1020167020976A patent/KR102275933B1/ko active IP Right Grant
- 2015-01-27 JP JP2016567140A patent/JP6585082B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN106165530A (zh) | 2016-11-23 |
US9497803B2 (en) | 2016-11-15 |
TW201541034A (zh) | 2015-11-01 |
KR20160117454A (ko) | 2016-10-10 |
WO2015113753A1 (en) | 2015-08-06 |
TWI698619B (zh) | 2020-07-11 |
JP2017508264A (ja) | 2017-03-23 |
KR102275933B1 (ko) | 2021-07-13 |
CN106165530B (zh) | 2020-03-13 |
US20150223291A1 (en) | 2015-08-06 |
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