JP6577947B2 - ワークピースにドーパントを注入する方法 - Google Patents
ワークピースにドーパントを注入する方法 Download PDFInfo
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- JP6577947B2 JP6577947B2 JP2016527114A JP2016527114A JP6577947B2 JP 6577947 B2 JP6577947 B2 JP 6577947B2 JP 2016527114 A JP2016527114 A JP 2016527114A JP 2016527114 A JP2016527114 A JP 2016527114A JP 6577947 B2 JP6577947 B2 JP 6577947B2
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- 238000000034 method Methods 0.000 title claims description 27
- 239000007789 gas Substances 0.000 claims description 147
- 150000002500 ions Chemical class 0.000 claims description 66
- 239000012895 dilution Substances 0.000 claims description 54
- 238000010790 dilution Methods 0.000 claims description 54
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- 239000001257 hydrogen Substances 0.000 claims description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 16
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 15
- 229910052796 boron Inorganic materials 0.000 claims description 15
- 229910052731 fluorine Inorganic materials 0.000 claims description 13
- 239000011737 fluorine Substances 0.000 claims description 13
- 239000003085 diluting agent Substances 0.000 claims description 12
- 239000013626 chemical specie Substances 0.000 claims description 11
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910021478 group 5 element Inorganic materials 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 2
- 239000000356 contaminant Substances 0.000 description 16
- 238000010884 ion-beam technique Methods 0.000 description 14
- 239000012535 impurity Substances 0.000 description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 7
- -1 Fluorine ions Chemical class 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910000078 germane Inorganic materials 0.000 description 2
- 229910021480 group 4 element Inorganic materials 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
- Plasma & Fusion (AREA)
Description
本願は、2013年7月18日に出願した米国仮特許出願第61/847,776号の優先権を主張する。この米国仮特許出願の内容は参照により本明細書に組み込まれるものとする。
Claims (14)
- ワークピースにドーパントを注入する方法であって、
イオン源のチャンバ内に供給ガス及び希釈ガスを導入するステップであって、該供給ガスが、第3族元素又は第5族元素を含むドーパントとフッ化物とを含む分子を含み、該希釈ガスが、水素とゲルマニウムとを含む分子、又は水素と前記ドーパントとは反対の導電性を有する化学種とを含む分子を含み、導入されるガスの総体積の3%〜40%が前記希釈ガスを含む、ステップと、
前記チャンバ内の前記供給ガス及び前記希釈ガスをイオン化するステップと、
前記チャンバからイオンを引き出し、該イオンを前記ワークピースに向けて加速するステップと、を含む方法。 - 前記希釈ガスは、水素とゲルマニウムとを含む分子を含む請求項1に記載の方法。
- 前記ドーパントは、第3族元素を含み、前記希釈ガスは、水素と第5族元素とを含有する分子を含む請求項1に記載の方法。
- 前記第3族元素はホウ素を含む請求項3に記載の方法。
- 前記第5族元素は、リン又はヒ素を含む請求項4に記載の方法。
- 前記ドーパントはホウ素を含む請求項1に記載の方法。
- 引き出された前記イオンは、質量分析を経ずに前記ワークピースに注入される請求項1に記載の方法。
- 前記導入されるガスの総体積の3〜20%は、前記希釈ガスを含む請求項1に記載の方法。
- ワークピースにホウ素を注入する方法であって、
イオン源のチャンバ内に供給ガス及び希釈ガスを導入するステップであって、該供給ガスが、ホウ素とフッ素とを含有する分子を含み、該希釈ガスが、水素と第5族元素とを含有する分子を含み、導入されるガスの総体積の3%〜20%が前記希釈ガスを含む、ステップと、
前記チャンバ内の前記供給ガス及び前記希釈ガスをイオン化するステップと、
前記チャンバからイオンを引き出し、該イオンを前記ワークピースに向けて加速するステップと、を含み、
引き出された前記イオンは、質量分析を経ずに前記ワークピースに注入される方法。 - 前記供給ガスはBF3又はB2F4を含む請求項9に記載の方法。
- 前記希釈ガスはPH3又はAsH3を含む請求項9に記載の方法。
- ワークピースにホウ素を注入する方法であって、
イオン源のチャンバ内に供給ガス及び希釈ガスを導入するステップであって、該供給ガスが、ホウ素とフッ素とを含有する分子を含み、該希釈ガスが、水素とゲルマニウムとを含有する分子を含み、導入されるガスの総体積の10%〜20%が前記希釈ガスを含む、ステップと、
前記チャンバ内の前記供給ガス及び前記希釈ガスをイオン化するステップと、
前記チャンバからイオンを引き出し、該イオンを前記ワークピースに向けて加速するステップと、を含み、
引き出された前記イオンは、質量分析を経ずに前記ワークピースに注入され、
ゲルマニウムは前記チャンバの壁を被覆する方法。 - 前記供給ガスはBF3を含む請求項12に記載の方法。
- 前記供給ガスはB2F4を含む請求項12に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361847776P | 2013-07-18 | 2013-07-18 | |
US61/847,776 | 2013-07-18 | ||
US14/089,916 US9524849B2 (en) | 2013-07-18 | 2013-11-26 | Method of improving ion beam quality in an implant system |
US14/089,916 | 2013-11-26 | ||
PCT/US2014/047103 WO2015009975A1 (en) | 2013-07-18 | 2014-07-17 | Method of improving ion beam quality in an implant system |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016529704A JP2016529704A (ja) | 2016-09-23 |
JP2016529704A5 JP2016529704A5 (ja) | 2017-07-20 |
JP6577947B2 true JP6577947B2 (ja) | 2019-09-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016527114A Expired - Fee Related JP6577947B2 (ja) | 2013-07-18 | 2014-07-17 | ワークピースにドーパントを注入する方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US9524849B2 (ja) |
JP (1) | JP6577947B2 (ja) |
KR (1) | KR101820421B1 (ja) |
CN (1) | CN105378896B (ja) |
TW (3) | TWI615881B (ja) |
WO (1) | WO2015009975A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US9524849B2 (en) | 2013-07-18 | 2016-12-20 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in an implant system |
US9887067B2 (en) | 2014-12-03 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Boron implanting using a co-gas |
SG10201910772PA (en) * | 2016-03-28 | 2020-01-30 | Entegris Inc | Hydrogenated isotopically enriched boron trifluoride dopant source gas composition |
US10460941B2 (en) * | 2016-11-08 | 2019-10-29 | Varian Semiconductor Equipment Associates, Inc. | Plasma doping using a solid dopant source |
CN113261073A (zh) * | 2018-12-15 | 2021-08-13 | 恩特格里斯公司 | 利用非钨材料的氟离子植入系统和其使用方法 |
CN114256045A (zh) * | 2021-12-16 | 2022-03-29 | 华虹半导体(无锡)有限公司 | 改善离子注入机金属污染的方法 |
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JPS58164134A (ja) | 1982-03-24 | 1983-09-29 | Hitachi Ltd | 半導体装置の製造方法 |
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US6348764B1 (en) * | 2000-08-17 | 2002-02-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Indirect hot cathode (IHC) ion source |
US7421973B2 (en) | 2003-11-06 | 2008-09-09 | Axcelis Technologies, Inc. | System and method for performing SIMOX implants using an ion shower |
US20050260354A1 (en) * | 2004-05-20 | 2005-11-24 | Varian Semiconductor Equipment Associates, Inc. | In-situ process chamber preparation methods for plasma ion implantation systems |
JP5591470B2 (ja) | 2005-08-30 | 2014-09-17 | アドバンスト テクノロジー マテリアルズ,インコーポレイテッド | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
US7608521B2 (en) * | 2006-05-31 | 2009-10-27 | Corning Incorporated | Producing SOI structure using high-purity ion shower |
US7732309B2 (en) * | 2006-12-08 | 2010-06-08 | Applied Materials, Inc. | Plasma immersed ion implantation process |
US7586109B2 (en) | 2007-01-25 | 2009-09-08 | Varian Semiconductor Equipment Associates, Inc. | Technique for improving the performance and extending the lifetime of an ion source with gas dilution |
US7655931B2 (en) * | 2007-03-29 | 2010-02-02 | Varian Semiconductor Equipment Associates, Inc. | Techniques for improving the performance and extending the lifetime of an ion source with gas mixing |
US20110017127A1 (en) * | 2007-08-17 | 2011-01-27 | Epispeed Sa | Apparatus and method for producing epitaxial layers |
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TWI689467B (zh) * | 2010-02-26 | 2020-04-01 | 美商恩特葛瑞斯股份有限公司 | 用以增進離子植入系統中之離子源的壽命及性能之方法與設備 |
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US9524849B2 (en) | 2013-07-18 | 2016-12-20 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in an implant system |
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2013
- 2013-11-26 US US14/089,916 patent/US9524849B2/en active Active
-
2014
- 2014-07-16 TW TW103124336A patent/TWI615881B/zh not_active IP Right Cessation
- 2014-07-16 TW TW107138901A patent/TWI720361B/zh not_active IP Right Cessation
- 2014-07-16 TW TW106142830A patent/TWI644339B/zh active
- 2014-07-17 WO PCT/US2014/047103 patent/WO2015009975A1/en active Application Filing
- 2014-07-17 JP JP2016527114A patent/JP6577947B2/ja not_active Expired - Fee Related
- 2014-07-17 CN CN201480039222.2A patent/CN105378896B/zh active Active
- 2014-07-17 KR KR1020167003947A patent/KR101820421B1/ko active IP Right Grant
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2016
- 2016-11-14 US US15/350,685 patent/US10804075B2/en active Active
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2018
- 2018-09-21 US US16/137,803 patent/US10825653B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105378896B (zh) | 2018-06-15 |
US20170062182A1 (en) | 2017-03-02 |
TW201807737A (zh) | 2018-03-01 |
US10804075B2 (en) | 2020-10-13 |
TW201511071A (zh) | 2015-03-16 |
US20150024579A1 (en) | 2015-01-22 |
TW201903815A (zh) | 2019-01-16 |
KR101820421B1 (ko) | 2018-01-19 |
WO2015009975A1 (en) | 2015-01-22 |
CN105378896A (zh) | 2016-03-02 |
TWI644339B (zh) | 2018-12-11 |
TWI615881B (zh) | 2018-02-21 |
US20190027341A1 (en) | 2019-01-24 |
US10825653B2 (en) | 2020-11-03 |
KR20160033168A (ko) | 2016-03-25 |
TWI720361B (zh) | 2021-03-01 |
JP2016529704A (ja) | 2016-09-23 |
US9524849B2 (en) | 2016-12-20 |
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