JP6576342B2 - 欠陥を分類するための方法およびウエハ検査ツール - Google Patents

欠陥を分類するための方法およびウエハ検査ツール Download PDF

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Publication number
JP6576342B2
JP6576342B2 JP2016528142A JP2016528142A JP6576342B2 JP 6576342 B2 JP6576342 B2 JP 6576342B2 JP 2016528142 A JP2016528142 A JP 2016528142A JP 2016528142 A JP2016528142 A JP 2016528142A JP 6576342 B2 JP6576342 B2 JP 6576342B2
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floating
defect
trees
tree
floating trees
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JP2017502500A5 (OSRAM
JP2017502500A (ja
Inventor
チエン−フェイ アダム チェン
チエン−フェイ アダム チェン
クリストファー マーハー
クリストファー マーハー
パトリック ヒュエット
パトリック ヒュエット
タイ−カン エヌジー
タイ−カン エヌジー
ジョン アール サード ジョーダン
ジョン アール サード ジョーダン
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KLA Corp
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KLA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G06F18/24323—Tree-organised classifiers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/245—Classification techniques relating to the decision surface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Evolutionary Biology (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2016528142A 2013-11-03 2014-11-03 欠陥を分類するための方法およびウエハ検査ツール Active JP6576342B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361899220P 2013-11-03 2013-11-03
US61/899,220 2013-11-03
US201461972418P 2014-03-31 2014-03-31
US61/972,418 2014-03-31
US14/257,921 2014-04-21
US14/257,921 US9489599B2 (en) 2013-11-03 2014-04-21 Decision tree construction for automatic classification of defects on semiconductor wafers
PCT/US2014/063668 WO2015066602A1 (en) 2013-11-03 2014-11-03 Decision tree construction for automatic classification of defects on semiconductor wafers

Publications (3)

Publication Number Publication Date
JP2017502500A JP2017502500A (ja) 2017-01-19
JP2017502500A5 JP2017502500A5 (OSRAM) 2017-12-21
JP6576342B2 true JP6576342B2 (ja) 2019-09-18

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Family Applications (1)

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JP2016528142A Active JP6576342B2 (ja) 2013-11-03 2014-11-03 欠陥を分類するための方法およびウエハ検査ツール

Country Status (5)

Country Link
US (1) US9489599B2 (OSRAM)
JP (1) JP6576342B2 (OSRAM)
KR (1) KR102373941B1 (OSRAM)
TW (1) TWI617799B (OSRAM)
WO (1) WO2015066602A1 (OSRAM)

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WO2017022041A1 (ja) * 2015-07-31 2017-02-09 楽天株式会社 木構造データ編集装置、木構造データ編集方法、及びプログラム
US9947596B2 (en) * 2015-08-05 2018-04-17 Kla-Tencor Corporation Range-based real-time scanning electron microscope non-visual binner
TWI797699B (zh) 2015-12-22 2023-04-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US10204290B2 (en) * 2016-10-14 2019-02-12 Kla-Tencor Corporation Defect review sampling and normalization based on defect and design attributes
CA2989617A1 (en) * 2016-12-19 2018-06-19 Capital One Services, Llc Systems and methods for providing data quality management
TWI660322B (zh) 2018-05-17 2019-05-21 國立成功大學 考慮機台交互作用之辨識良率損失原因的系統與方法
US11321633B2 (en) * 2018-12-20 2022-05-03 Applied Materials Israel Ltd. Method of classifying defects in a specimen semiconductor examination and system thereof
TW202119232A (zh) * 2019-10-14 2021-05-16 美商Ｐｄｆ對策公司 用於半導體應用的協作學習模型
CN113298166A (zh) * 2021-06-01 2021-08-24 中科晶源微电子技术（北京）有限公司 缺陷分类器和缺陷分类方法、装置、设备及存储介质
WO2023166585A1 (ja) * 2022-03-02 2023-09-07 株式会社アドバンテスト 半導体試験結果分析装置、半導体試験結果分析方法およびコンピュータプログラム
EP4489059A4 (en) * 2022-03-02 2025-12-31 Advantest Corp Device for analyzing the results of semiconductor tests, method for analyzing the results of semiconductor tests, and computer program
US20250117915A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Optical inspection-based automatic defect classification

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6148099A (en) 1997-07-03 2000-11-14 Neopath, Inc. Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification
US6922482B1 (en) * 1999-06-15 2005-07-26 Applied Materials, Inc. Hybrid invariant adaptive automatic defect classification
JP4118703B2 (ja) * 2002-05-23 2008-07-16 株式会社日立ハイテクノロジーズ 欠陥分類装置及び欠陥自動分類方法並びに欠陥検査方法及び処理装置
US7602962B2 (en) 2003-02-25 2009-10-13 Hitachi High-Technologies Corporation Method of classifying defects using multiple inspection machines
JP4908995B2 (ja) 2006-09-27 2012-04-04 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置並びに欠陥検査装置
JP4616864B2 (ja) 2007-06-20 2011-01-19 株式会社日立ハイテクノロジーズ 外観検査方法及びその装置および画像処理評価システム
JP5022174B2 (ja) * 2007-10-22 2012-09-12 株式会社日立製作所 欠陥分類方法及びその装置
US8233494B2 (en) 2008-01-22 2012-07-31 International Business Machines Corporation Hierarchical and incremental multivariate analysis for process control
US8315453B2 (en) 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
JP5342606B2 (ja) * 2011-06-27 2013-11-13 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置
US8502146B2 (en) 2011-10-03 2013-08-06 Kla-Tencor Corporation Methods and apparatus for classification of defects using surface height attributes
TWI574136B (zh) * 2012-02-03 2017-03-11 應用材料以色列公司 基於設計之缺陷分類之方法及系統
TW201339572A (zh) * 2012-03-21 2013-10-01 Optivu Vision System Corp 元件內部缺陷之檢測裝置及方法
US8948494B2 (en) 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples

Also Published As

Publication number Publication date
KR102373941B1 (ko) 2022-03-11
US20150125064A1 (en) 2015-05-07
US9489599B2 (en) 2016-11-08
TWI617799B (zh) 2018-03-11
KR20160083055A (ko) 2016-07-11
JP2017502500A (ja) 2017-01-19
TW201525450A (zh) 2015-07-01
WO2015066602A1 (en) 2015-05-07

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