JP6569404B2 - Power supply device and method for manufacturing power supply device - Google Patents

Description

  The present invention relates to a power supply device and a method for manufacturing the power supply device.

  In an in-vehicle power supply device, a substrate on which electronic components such as a semiconductor element and a transformer are mounted or connected is accommodated in a housing. In general, electronic components and the like are two-dimensionally arranged on the mounting surface of the base plate of the housing, so that the power supply device increases in size as the number of components increases. In addition, when electronic components or the like are two-dimensionally arranged on the base plate, the wiring distance between the components becomes long and noise may occur. On the other hand, for the purpose of reducing the size of the power supply device and reducing the noise, various studies have been made on the arrangement of electronic components and boards inside the housing. For example, Patent Document 1 shows a configuration in which two types of electronic components (for example, a transformer and a semiconductor element) are stacked.

Japanese Patent Laying-Open No. 2015-53857

  In recent years, needs for downsizing are further increased, and further downsizing of power supply devices is desired. On the other hand, for example, if electronic components with high exothermicity are arranged close to each other for the purpose of downsizing, there may be a problem in heat dissipation.

  The present invention has been made in view of the above, and an object of the present invention is to provide a power supply device and a method of manufacturing the power supply device that can be reduced in size without degrading performance.

  In order to achieve the above object, a power supply device according to an aspect of the present invention includes a circuit board, an electronic component mounted on the circuit board, and a winding component connected to the circuit board or the electronic component. The winding component is disposed on the circuit board in a plan view, and is provided with a support member that supports the winding component in a state of being separated from the circuit board and the electronic component.

  According to the above power supply device, since the winding component is arranged on the circuit board in a plan view in a state of being separated from the circuit board and the electronic component by the support member, the apparatus can be reduced in size. In addition, since heat from the winding component is released through the support member, problems such as heat dissipation can be avoided. Therefore, a power supply device that can be reduced in size without degrading performance is provided.

  Here, as a configuration that effectively exhibits the above-described operation, for example, the support member may include a cover of the power supply device. The support member may be a bracket different from the cover of the power supply device.

  As described above, the support member may use the cover of the power supply device, or may use another member such as a bracket. Regardless of which support member is used, it is possible to reduce the size without degrading the performance of the power supply device.

  Further, the winding component may be a choke coil, and the electronic component may be a main transformer.

  Conventionally, it has been difficult to place the choke coil and the main transformer close to each other. On the other hand, by using a choke coil as the winding component and a main transformer as the electronic component, it is possible to arrange them close to each other and shorten the wiring in the power supply device. Therefore, it is possible to further suppress the performance degradation.

  At this time, the main transformer may include a pattern coil provided on the circuit board.

  In the case of the above configuration, it is possible to obtain a great effect of suppressing performance degradation by shortening the wiring in the power supply device.

  Moreover, the said cover can be set as the aspect provided with the recessed part which accommodates the said winding components.

  In the case of the above configuration, it is possible to avoid an increase in size of the power supply device for accommodating the winding components, which contributes to a reduction in size of the power supply device.

  A method for manufacturing a power supply device according to an aspect of the present invention includes a circuit board, an electronic component mounted on the circuit board, a housing that houses the circuit board and the electronic component, the circuit board, A winding component connected to an electronic component; and a cover that functions as a support member that supports the winding component on the circuit board in a plan view, in a state of being separated from the circuit board and the electronic component; The cover has an opening, the step of attaching the winding component to the cover, and the casing containing the circuit board and the electronic component A step of attaching a cover to which the winding component is attached, and a step of inserting a tool from the opening and connecting the circuit board or the electronic component and the winding component from the outside. And wherein the door.

  According to the above manufacturing method, a manufacturing method is used in which an opening is provided in the cover and the circuit board or the electronic component and the winding component are connected from the outside using the opening. Therefore, it is possible to connect the winding component attached to the cover side to the circuit board or the electronic component with a simpler operation, and to manufacture a power supply device that is downsized without degrading performance. it can.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the power supply device and power supply device which can implement | achieve size reduction are provided, without reducing performance.

It is a disassembled perspective view explaining schematic structure of the power supply device which concerns on embodiment. It is a top view of the power supply device of the state which removed the electronic component etc. which are attached to a cover and a cover. It is a disassembled perspective view of the power supply device of the state of FIG. It is a bottom view (figure from the housing | casing side) of the components attached to a cover and a cover. It is a disassembled perspective view of the components attached to a cover and a cover. It is a disassembled perspective view which shows schematic structure of the smooth component which is an electronic component attached to a cover. It is a disassembled perspective view of a smooth component. It is a figure explaining the position of the opening formed in a cover. It is a flowchart explaining the manufacturing method of a power supply device. It is a cross-sectional arrow view of a power supply device. It is a cross-sectional arrow view of a power supply device.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. In the drawings, the X axis, the Y axis, and the Z axis are described as necessary.

  FIG. 1 is an exploded perspective view illustrating a schematic configuration of a power supply device according to an embodiment of the present invention. The power supply apparatus described in the present embodiment is, for example, a switching power supply apparatus that performs voltage conversion (step-down) on a DC voltage input from a high-voltage battery connected to an input terminal to generate a desired DC output voltage. Although the power supply device 1 of this embodiment demonstrates the case where a secondary side is a synchronous rectification type DC-DC converter, it is not limited to this.

  In the power supply device 1, electronic components such as an input smoothing capacitor, a switching element, a transformer, a rectifier circuit, an output smoothing capacitor, and an inductor are connected to a main circuit board 20 (circuit board) and accommodated in a housing 10. . The power supply device 1 is configured to include a large number of electronic components in addition to the electronic components described above, but the description is omitted except for main electronic components in the power supply device 1 according to the present embodiment.

  The housing 10 constitutes a part of a metal case that houses the constituent members of the power supply device 1. The housing 10 includes a base plate 11 that forms the bottom surface of the housing 10 and a side wall 12 that surrounds the base plate 11. In the power supply device 1, the electronic component is accommodated in the housing 10 and then covered with the cover 14. The cover 14 has a substantially flat plate shape corresponding to the base plate 11. Although details will be described later, some of the electronic components connected to the main circuit board 20 are attached to the cover 14. The main circuit board 20 and electronic components are housed in a metal case formed by the housing 10 and the cover 14.

  Further, a heat radiation fin 13 extending in the Y-axis direction is attached to the rear surface side of the base plate 11 of the housing 10 (the lower side in FIG. 1: the surface opposite to the surface on which the elements and the substrate are fixed). The heat dissipating fins 13 provided on the back surface of the base plate 11 continue to the outside of the side walls 12A and 12B that extend along the X-axis direction of the side walls 12 that surround the four sides of the base plate 11 and face each other. The fin 13 for heat dissipation functions as a flow path when the air that cools the back side of the base plate 11 moves in the Y-axis direction outside the housing 10. Further, the side walls 12 </ b> A and 12 </ b> B function as flow paths when air moves in the Z-axis direction along the heat radiation fins 13 outside the housing 10. As the air moves between the heat dissipating fins 13, the heat dissipating fins 13 are air-cooled. Thereby, heat generated in each element of the power supply device 1 fixed to the front surface side of the base plate 11 is transferred to the base plate 11 and the side walls 12A and 12B, and is radiated to the outside from the back side of the base plate 11 and the outside of the side walls 12A and 12B. Is done. Thus, the base plate 11 and the side walls 12A and 12B also function as a heat sink having a heat dissipation function.

  In addition, the fin 13 for heat dissipation may be comprised from the member different from the baseplate 11 and side wall 12A, 12B, and may be comprised from the same member. Moreover, the fin 13 for heat dissipation attached to the base plate 11 and the side walls 12A and 12B may not be continuous as in the present embodiment. Further, in place of the configuration in which the fin 13 for heat radiation by air cooling is attached, a coolant flow path for water cooling is provided on the back surface side of the base plate 11, and the base plate 11 is water cooled, so that heat is radiated from the back surface side of the base plate 11 to the outside. It is good also as composition to do.

  An input terminal 15 and an output terminal 16 that electrically connect the inside and outside of the housing 10 are attached to the housing 10. A DC voltage is input from the input terminal 15, voltage-converted (step-down), and then output from the output terminal 16.

  The main circuit board 20 and the like housed in the housing 10 will be described. FIG. 2 is a plan view of the power supply device 1 in a state where the cover 14 and electronic parts attached to the cover 14 are removed (a state where the cover 14 is removed), and FIG. 3 is an exploded perspective view of FIG.

  The main circuit board 20 is formed, for example, by forming a circuit pattern made of a conductor on the front and back surfaces of a base plate made of an insulating material such as resin, and further covering the circuit pattern with an insulating material such as resin. In the present embodiment, the main circuit board 20 has a rectangular shape extending along the XY plane. As the main circuit board 20, a multilayer board in which insulating materials and circuit patterns (conductor layers) are alternately laminated may be used. The conductor of the circuit pattern is connected to an electronic component such as a semiconductor element connected to the main circuit board 20 to constitute a power supply circuit in the power supply device 1. The main circuit board 20 in this embodiment is also formed with a coil pattern in the winding component.

  The main circuit board 20 is placed on the base plate 11 of the housing 10. The size of the housing 10 in plan view corresponds to the shape of the main circuit board 20, and the side wall of the housing 10 is disposed close to the end of the main circuit board 20. Note that the proximity means that the end portion of the main circuit board 20 and the housing 10 are arranged with a minimum required electrical insulation distance. In the present embodiment, the proximity is a degree smaller than 1/3 of the length of the short side of the main circuit board 20.

  The main circuit board 20 and the electronic components attached to the main circuit board 20 will be further described. In the present embodiment, of the electronic components mounted on the main circuit board 20, only the electronic components related to the features of the present invention are extracted and shown.

  On the main circuit board 20, a pair of magnetic cores 31 constituting a main transformer 30 arranged between the primary side and the secondary side, and a pair constituting a resonant inductor 40 which is a choke coil on the primary side. The magnetic core 41 is mounted. Further, on the main circuit board 20, two primary side switching element groups 50 </ b> A and 50 </ b> B in which four semiconductor elements are arranged in a line at the end of the main circuit board 20, and three semiconductor elements are respectively the main circuit board. Two secondary-side rectifying element groups 60A and 60B arranged at the end of 20 are attached.

  The magnetic core 31 constituting the main transformer 30 constitutes a so-called EI type magnetic core. Specifically, the E-type core 31A is arranged on the upper side of the main circuit board 20 so that the Y-axis direction is the longitudinal direction, and the I-type core 31B (see FIGS. 10 and 11) is arranged on the lower side. . The main circuit board 20 is provided with three openings 21A, 21B, and 21C through which the legs of the E-type core 31A are inserted along the Y-axis direction. The three legs of the E-shaped core 31A are inserted into the openings 21A, 21B, and 21C, respectively. In the main circuit board 20, primary and secondary pattern coils 25 (see FIG. 3) are formed so as to wind around the central opening 21 </ b> B, and the upstream side of the pattern coil portion and A downstream circuit pattern (not shown) is formed. The number of turns of the coil in the pattern coil 25 is not particularly limited. The magnetic core 41 constituting the resonant inductor 40 is also a so-called EI type magnetic core similar to the main transformer 30 and is composed of an E type core 41A and an I type core 41B (see FIGS. 10 and 11). .

  A heat transfer member 35 (see FIGS. 1 and 3) connected to the side walls 12A and 12B is attached above the E-shaped core 31A of the main transformer 30. The heat transfer member 35 is thermally connected to the E-type core 31A and the side walls 12A and 12B, and transfers heat from the main transformer 30 including the E-type core 31A to the side walls 12A and 12B.

  Further, as shown in FIG. 3, the base plate 11 of the housing 10 on which the main circuit board 20 is placed can be thermally connected as much as possible to the back side of the main circuit board 20. In particular, the main circuit board 20 and the base plate 11 are thermally connected on the back side where the switching element groups 50A and 50B and the rectifying element groups 60A and 60B are mounted. Moreover, in the power supply device 1 of this embodiment, the recessed part 17 which can accommodate the I-type core 31B of the main transformer 30, and the recessed part 18 which can accommodate the I-type core 41B of the resonant inductor 40 are formed. Thereby, the back surface side of the main circuit board 20 and the surface of the base plate 11 are thermally connected by utilizing the step between the recesses 17 and 18. In order to thermally connect the back surface side of the main circuit board 20 and the base plate 11, a thermal compound or the like may be applied between the two.

  Next, the cover 14 and members attached to the cover 14 will be described. FIG. 4 is a bottom view of the cover 14 (showing the housing 10 side). FIG. 5 is an exploded perspective view of FIG. FIG. 6 is an exploded perspective view showing a schematic configuration of a smooth component 70 which is an electronic component attached to the cover 14, and FIG. 7 is an exploded perspective view of FIG. Further, FIG. 8 is a diagram for explaining the position of the opening formed in the cover 14.

  As shown in FIGS. 4 and 5, the substantially flat cover 14 has a recess 81 that protrudes in the + Z direction and has a recess shape when viewed from the bottom surface side. The concave portion 81 is an area that accommodates the smooth component 70 including the winding component attached to the cover 14. By providing the recess 81 for accommodating the smooth component 70, the power supply device 1 as a whole can be reduced in size.

  On the surface (upper surface) of the cover 14, a seal member 85 for closing openings 82 </ b> A to 82 </ b> C described later is provided. The openings 82A to 82C and the seal member 85 will be described later.

  A smooth component 70 and pressing support members 91 to 95 are attached to the back surface (lower surface) of the cover 14. The smoothing component 70 constitutes a smoothing circuit that smoothes the voltage from the rectifying circuit including the rectifying element groups 60 </ b> A and 60 </ b> B and outputs the voltage to the output terminal 16. The pressing support members 91 to 95 have a function as a bracket for pressing and supporting an electronic component or the like in order to prevent displacement due to vibration or the like. The pressing support members 91 to 95 are each made of an insulating member.

  Each of the pressing support members 91 includes a fixing portion 91A that is fixed to the back side of the cover 14, and a pressing portion 91B that has elasticity with respect to the fixing portion 91A and presses the object. Similarly, the pressing support members 92 to 95 each have a fixing portion and a pressing portion. The pressing support members 91 to 95 are attached to the cover 14 by the respective fixing portions being screwed to the cover 14. The pressing support members 91 and 92 have a function of pressing the switching elements 50A and 50B on the primary side toward the main circuit board 20 (−Z direction), respectively. Since each of the pressing support members 91 and 92 presses and supports four switching elements, a plurality of pressing portions are provided. The pressing support member 93 presses the magnetic core 41 (E-type core 41A) of the resonant inductor 40 toward the main circuit board 20 (−Z direction), and the heat transfer member 35 provided on the upper portion of the main transformer 30. Is pressed to the main circuit board 20 side (−Z direction). Further, the pressing support members 94 and 95 have a function of pressing the smooth component 70 toward the cover 14 (+ Z direction). The pressing support members 91 to 95 are all used for the purpose of maintaining the heat dissipation by pressing the parts to be pressed and suppressing vibrations and the like, and preventing the target parts from floating.

  The smooth component 70 includes a choke coil. Specifically, as shown in FIGS. 6 and 7, a coil portion 71, a bus bar 72 for connecting to the output terminal 16, a pair of magnetic cores 73 attached to the coil portion 71, and a magnetic core 73 A spacer 74 provided between the coil portion 71 and a ferrite core 75 for noise removal attached to the bus bar 72 is included. The coil portion 71, the magnetic core 73, and the spacer 74 form a choke coil that is a winding component.

  The coil portion 71 is a substantially annular shape, and is formed by connecting two end ring-shaped winding members 71A and 71B arranged in parallel with a space therebetween. The winding members 71A and 71B can be formed by bending a sheet metal, respectively. One end of the winding member 71A is connected to the electronic components of the main circuit board 20 by fixing using screws 76, as will be described later. The other end of the winding member 71A is connected to one end of the winding member 71B by fixing using a screw 77. The other end of the winding member 71B is connected to the bus bar 72 by fixing using a screw 78. As a result, the winding members 71A and 71B form a coil having two turns.

  The magnetic core 73 is a ferrite core and includes two E-type cores 73A and 73B. Each of the E-type cores 73A and 73B has three leg portions and is attached so that the three leg portions face each other. At the time of attachment, it is attached so that the central leg portion passes through the central opening of the winding members 71A and 71B. When attaching the E-type cores 73A and 73B, the winding members 71A and 71B are in a state of being integrally assembled with the spacer 74. Positioning of the E-type cores 73A and 73B with respect to the winding members 71A and 71B is performed using a guide portion provided in the spacer 74.

  As shown in FIGS. 6 and 7, the spacer 74 includes side walls 74a and 74b extending in the stacking direction (Z-axis direction) of the winding members 71A and 71B, and end portions on the upper side of the side walls 74a and 74b. An annular connecting portion 74c for connecting the respective portions, an annular connecting portion 74d for connecting the end portions on the lower side of the side walls 74a and 74b, and the connecting portions 74c and 74d, And an annular partition portion 74e connected to the portions 74a and 74b.

  A plurality of guide portions 74 f projecting outward are provided on the connecting portions 74 c and 74 d of the spacer 74. The guide portion 74f functions as a positioning member when the magnetic core 73 is attached, and prevents the magnetic core 73 from moving due to vibration or the like.

  The winding member 71A is inserted between the connecting portion 74d of the spacer 74 and the partition portion 74e. Further, the winding member 71B is inserted between the connecting portion 74c of the spacer 74 and the partition portion 74e. At this time, it inserts from the same direction so that the edge part of winding member 71A, 71B may become the same side. Thereafter, the winding members 71A and 71B and the spacer 74 are integrated by fixing the ends of the winding members 71A and 71B with screws 76. At this time, by positioning the magnetic core 73 along the guide portion 74f, positioning with respect to the coil portion 71 and the spacer 74 is facilitated. Thereafter, the E-type cores 73A and 73B are arranged so as to sandwich the integrated winding members 71A and 71B and the spacer 74 along the axis passing through the openings of the winding members 71A and 71B. Thereby, the coil part 71, the magnetic body core 73, and the spacer 74 are integrated.

  Further, the smooth part 70 is formed by connecting one end side of the bus bar 72 to which the noise removing ferrite core 75 is attached to the end portion of the winding member 71 </ b> B with a screw 78. The other end side of the bus bar 72 is connected to the output terminal 16 by a screw 79.

  The smooth component 70 is accommodated in the recess 81 of the cover 14. And the smooth component 70 will be in the state attached to the back surface (inner surface) side of the cover 14 by supporting in the state pressed with respect to the recessed part 81 by the press support members 94 and 95 attached to the cover 14. FIG. Further, the pressing support members 91 to 93 are attached to the back side of the cover 14 by screwing.

  The cover 14 is provided with openings 82 </ b> A to 82 </ b> C in the recess 81 in addition to screw holes for attaching the pressing support members 91 to 95. FIG. 8 is a diagram illustrating the attachment positions of the openings 82A to 82C provided in the cover 14. FIG. 8A is a plan view schematically showing each member other than the cover 14, and FIG. 8B is a plan view of the cover 14. As shown in FIG. 8B, the opening 82 </ b> A of the cover 14 is provided at a position corresponding to the screw 79. The opening 82B is provided at a position corresponding to the screw 78, and the opening 82C is provided at a position corresponding to the screw 76. These screws 76, 78, and 79 are the smooth component 70 attached to the cover 14 side, the output terminal 16 attached to the housing 10 side, and the main circuit board 20 or the main circuit board 20 housed in the housing 10. It is a part related to the connection with the upper electronic component. The screw 78 also has a function of fixing the smooth component 70 to the fixing portion 87 (see FIG. 11) on the housing 10 side. Therefore, after the housing 10 and the cover 14 are assembled, it is necessary to screw them with these screws 76, 78, and 79. Accordingly, the openings 82A to 82C are provided to tighten these screws 76, 78, 79 from the outside. On the other hand, when the power supply device 1 is actually used, dust and the like may enter the case if the openings 82A to 82C are provided. Therefore, at the end of the assembly of the power supply device 1, the openings 82A to 82C are closed from the outside by the seal member 85 (see FIG. 5).

  In addition, it can also confirm from FIG. 8 that the recessed part 81 of the cover 14 has a shape corresponding to the smooth component 70.

  The assembly method (manufacturing method) of the power supply device 1 will be described again with reference to FIG. First, the smooth component 70 is attached to the cover 14 (S01). The smooth part 70 itself is assembled before being attached to the cover 14. The smooth component 70 is fixed to the cover 14 by pressing support members 94 and 95. At the same time that the smooth part 70 is attached to the back side of the cover 14, the pressing support members 91 to 95 are also attached to the back side of the cover 14. For the alignment of the smooth component 70, for example, the positional relationship with the pressing support members 94 and 95 may be used, or the openings 82A to 82C of the cover 14 may be used.

  On the other hand, the main circuit board 20 to which electronic components such as the main transformer 30 are attached is accommodated in the housing 10 (S02). At the same time, members such as the input terminal 15 and the output terminal 16 are also attached to the housing 10. That is, parts other than the parts attached to the cover 14 are accommodated or attached to the housing 10 at this stage. In addition, the execution order of attachment of components to the cover 14 (S01) and accommodation or attachment of electronic components to the housing 10 (S02) can be changed.

  Next, the cover 14 to which the smooth component 70 and the like are attached is attached to the housing 10 in which the main circuit board 20 including electronic components is accommodated (S03). A tool or the like is inserted into the inside of the housing 10 from the openings 82A to 82C of the cover 14, the screws 76, 78, 79 are tightened from the outside, and the smooth component 70 is connected to the main circuit board 20 and the output terminal 16 on the housing 10 side. Connect (S04). Finally, the openings 82 </ b> A to 82 </ b> C of the cover 14 are closed by the seal member 85. Thereby, the power supply device 1 is completed.

  10 and 11 show cross-sectional views of the power supply device 1 after assembly. 10 is a cross-sectional view taken along a line extending in the X-axis direction through the center of the main transformer 30, and FIG. 11 is a cross-sectional view taken along a line extending in the X-axis direction through the centers of the output terminal 16 and the choke coil. is there.

  As shown in FIGS. 10 and 11, the choke coil (the coil portion 71, the magnetic core 73 and the spacer 74) of the smoothing component 70 that is a winding component is mounted on the main circuit board 20 and the main circuit board 20. The main transformer 30 and the resonant inductor 40 that are winding components, and the semiconductor elements that are electronic components attached to the main circuit board 20 (switching element groups 50A and 50B, rectifying element groups 60A and 60B) Thus, it is supported on the main circuit board 20 (at a position overlapping the main circuit board 20) in plan view. That is, the cover 14 and the pressing support members 94 and 95 function as a support member for the choke coil. With such an arrangement, the power supply device 1 can be reduced in size, particularly in plan view, as compared with the case where the choke coil is arranged beside the main circuit board 20 or the like. Conventionally, when a winding component using a sheet metal coil is accommodated in the housing 10, it is arranged at a position different from a circuit board such as a main circuit board in a plan view. The purpose of such a configuration is to sufficiently dissipate heat from the winding components. On the other hand, in order to achieve such an arrangement, it is necessary to determine the area of the base plate in the housing 10, that is, the size of the power supply device 1 in plan view, in consideration of the arrangement of the winding components. Therefore, there is a problem that the power supply device 1 is necessarily enlarged.

  On the other hand, in the power supply device 1 according to this embodiment, the cover 14 and the pressing support members 94 and 95 are used as support members, and a smooth component 70 including a choke coil that is a winding component is attached to the cover 14 side. The configuration in which the line components are arranged on the main circuit board 20 so as to be separated from the main circuit board 20 and the electronic components on the main circuit board 20 is realized. As a result, when determining the size of the power supply device 1 in a plan view, it is not necessary to consider the arrangement of the winding components, so that the power supply device 1 can be downsized.

  In terms of heat dissipation, heat generated in the smooth component 70 including the choke coil is transferred to the back side of the cover 14. Since the surface side of the cover 14 is exposed to the outside, it can be said that the cover 14 is cooled by air cooling. Therefore, heat dissipation can be ensured for the winding components provided on the main circuit board apart from the main circuit board 20.

  Further, when the winding component attached to the cover 14 side is a choke coil in the smoothing component 70, the proximity arrangement with the main transformer 30 can be realized as shown in FIGS. By arranging the choke coil and the main transformer 30 close to each other, the wiring connecting them can be shortened compared to the conventional configuration. By shortening the wiring, the efficiency of the power supply device 1 can be improved and noise can be reduced. Therefore, downsizing can be realized without reducing the performance as the power supply device 1.

  In particular, when the main transformer 30 has a configuration using the pattern coil 25 provided on the main circuit board 20, it is difficult to realize the proximity arrangement with the choke coil in the conventional configuration. When close arrangement is difficult, it is necessary to provide a bus bar or the like for connecting the two, and the number of parts tends to increase. Further, in order to realize the close arrangement, the work load and cost in the previous process are increased, such as changing the shape of the main circuit board 20. On the other hand, in the power supply device 1 according to the present embodiment, the choke coil is located above the pattern coil 25 included in the main transformer 30, so the choke coil is used by utilizing the space above the pattern coil 25. Since the smoothing part 70 including it can be arranged, it contributes to downsizing and the pattern coil 25 and the coil part 71 of the choke coil can be arranged close to each other. That is, even if the main transformer 30 includes the pattern coil 25 formed on the main circuit board 20, the choke coil can be disposed close to the main transformer 30 and the miniaturization can be realized.

  Moreover, the power supply device 1 needs to connect the smooth component 70 attached to the cover 14 side and the electronic component on the main circuit board 20 side as described above. In this regard, in the method of manufacturing the power supply device 1 according to the present embodiment, the cover 14 is provided with openings 82A to 82C, and the fixing work such as screwing from the outside using the openings 82A to 82C (ie, smoothing) A manufacturing method for closing the openings 82A to 82C after the operation of connecting the component 70 and another component) is performed is used. Accordingly, the smoothing component 70 attached to the cover 14 side and the electronic component etc. on the main circuit board 20 side can be connected by a simpler work, and the power supply device in which the miniaturization is realized without reducing the performance 1 can be manufactured.

  As described above, the power supply device and the method for manufacturing the power supply device according to the embodiment of the present invention have been described, but the present invention is not limited to the aspects of the above-described embodiment.

  For example, in the above-described embodiment, an example in which a choke coil that is a winding component is attached to the cover 14 has been described. However, it is not necessary to use the cover of the power supply device as a member for supporting the winding component in a state of being separated from the main circuit substrate 20 and the electronic component on the main circuit substrate 20. That is, a member different from the casing 10 and the cover 14 that are the case of the power supply device 1 may be used as a support member that supports the winding component on the main circuit board 20. For example, a bracket may be used as the support member. Even in this case, since the winding components can be arranged on the main circuit board 20, it is possible to realize downsizing without degrading the performance as the power supply device. In view of the increase in the number of parts and the cost of parts, it is preferable to use the cover 14 as a part of the support member.

  In the above embodiment, the case where the winding component attached to the cover 14 is a choke coil included in the smoothing component 70 has been described. However, the winding component is arranged away from the main circuit board 20 or the electronic components on the main circuit board 20. The winding parts that can be made are not limited to the above. Moreover, the winding components supported using the support member can be appropriately selected according to the outer shape and specifications required for the power supply device, the arrangement of the components, and the like.

DESCRIPTION OF SYMBOLS 1 ... Power supply device, 10 ... Housing, 11 ... Base plate, 12 ... Side wall, 14 ... Cover, 20 ... Main circuit board, 25 ... Pattern coil, 30 ... Main transformer, 40 ... Resonant inductor, 50A, 50B ... Switching element group , 60A, 60B ... rectifying element group, 70 ... smooth parts, 81 ... recess.

Claims (7)

A circuit board;
Electronic components mounted on the circuit board;
A winding component connected to the circuit board or the electronic component;
The winding component is disposed on the circuit board in a plan view, and a support member that supports the winding part in a state of being separated from the circuit board and the electronic component,
A cover,
Equipped with a,
The support member is a power supply device including the cover .   The winding component is a choke coil,
  The power supply device according to claim 1, wherein the electronic component is a main transformer.   A circuit board;
  Electronic components mounted on the circuit board;
  A winding component connected to the circuit board or the electronic component;
  The winding component is disposed on the circuit board in a plan view, and a support member that supports the winding part in a state of being separated from the circuit board and the electronic component,
  With
  The winding component is a choke coil,
  The electronic component is a power supply device that is a main transformer.   The power supply device according to claim 3, wherein the support member is a bracket different from a cover of the power supply device. The power supply apparatus according to claim 2, wherein the main transformer includes a pattern coil provided on the circuit board. A cover,
The power supply device according to any one of claims 3 to 5, wherein the cover includes a recess that accommodates the winding component. A circuit board; an electronic component mounted on the circuit board; a housing for housing the circuit board and the electronic component; a winding component connected to the circuit board or the electronic component; and the winding A cover that functions as a support member that supports components in a state of being separated from the circuit board and the electronic component on the circuit board in plan view,
The cover has an opening;
Attaching the winding component to the cover;
A step of attaching a cover to which the winding component is attached to the casing containing the circuit board and the electronic component;
Inserting a tool from the opening, and connecting the circuit board or the electronic component and the winding component from the outside;
A method of manufacturing a power supply device including:

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