JP6569323B2 - Electronic apparatus thermal analysis method and thermal analysis apparatus - Google Patents

Description

  The present invention relates to a thermal analysis method and a thermal analysis apparatus for electronic equipment.

  Conventionally, as a heat dissipation design of electronic equipment, a method of estimating the amount of heat generated by the entire chip by circuit simulation of the entire chip of the IC to be mounted has been adopted.

JP 2011-237249 A

  The thermal analysis simulation considering the heat distribution in the IC is ideal because the thermal analysis can be performed based on the accurate heat generation state, but the calculation amount is large and it is not completed within a realistic time. The thermal analysis simulation considering the heat distribution in the IC could not be adopted substantially. For this reason, the heat dissipation design is performed by estimating the heat generation amount of the IC as the maximum heat generation amount of the entire IC. However, since this design was based on experience, it was necessary to repeat prototypes of electronic equipment, resulting in significant costs, estimating the amount of heat generation as excessive uniform temperature, and selecting packages with excessive heat dissipation measures. It was forced to secure an excessive heat dissipation route.

  The present invention has been made in view of the above problems, and its purpose is to enable a detailed thermal simulation to be executed in a realistic calculation time and to design an optimum heat dissipation measure, And providing a thermal analysis apparatus.

The thermal analysis method for an electronic device according to claim 1 is a method for performing a thermal analysis on an IC mounting board on which an IC is mounted by a computer , wherein the circuit on the IC is divided into a group of circuit elements according to the function of the circuit. A plurality of sheets including any one of the blocks (A), a procedure for dividing the plurality of blocks, a procedure for calculating a calorific value for each block from a circuit simulation result, and the circuit elements laid out on the IC. To G), and a procedure for assigning a heat generation amount for each block to each of the plurality of sheets arranged on the IC and calculating a heat generation amount for each sheet.

  The thermal analysis device according to claim 2 is a thermal analysis device for an IC mounting board on which an IC is mounted, and the circuit on the IC is divided into a plurality of blocks for each circuit element grouped by the function of the circuit. Means for calculating a heating value for each block from a circuit simulation result, means for dividing the circuit element laid out on the IC into a plurality of sheets including any of the blocks, and the block And a means for assigning a calorific value for each sheet to each of the plurality of sheets arranged on the IC and calculating a calorific value for each sheet.

  According to this configuration, the thermal analysis is not performed in consideration of the heat generation amount of all the elements on the IC, but is performed based on the heat generation amount for each circuit element. For this reason, a detailed thermal simulation can be executed in a realistic calculation time, and an optimal heat dissipation measure can be designed.

The figure which shows an example of schematic structure of IC mounting substrate which mounts IC Flow chart schematically showing an example of circuit design procedure The flowchart which shows an example of the thermal analysis method which concerns on embodiment The flowchart which shows an example of the thermal analysis method which concerns on embodiment (A) And (b) is a figure for showing a block and a sheet | seat Table showing calorific value for each sheet Diagram showing schematic configuration of thermal analyzer

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the substantially same element in each embodiment, and description is abbreviate | omitted.
As shown in FIG. 1, the IC mounting substrate 100 includes a board 102, an IC 104 mounted on the board 102, and a wiring 106 formed on the board 102. A circuit (not shown) is laid out on the IC 104. In the present embodiment, thermal analysis of the IC mounting substrate 100 is performed.

  As shown in FIG. 2, when IC design is started, a circuit is first created (A1), then a circuit simulation is performed (A2), and the operation of the designed circuit is confirmed. Thereafter, the designed IC circuit is laid out (A3). The order of circuit simulation (A2) and IC circuit layout (A3) may be interchanged.

  Thereafter, although not shown, a mask is created based on the layout, a semiconductor chip is created by a known method, wiring and sealing are performed, and the IC 104 is completed. Next, the IC 104 is mounted on the board 102 to complete the IC mounting substrate 100.

  3 and 4 are flowcharts showing in detail the procedure of thermal analysis in the present embodiment. When the thermal analysis is started as shown in FIG. 3, first, CAD data of the entire configuration to be subjected to the thermal analysis is created (B1). In the present embodiment, the target for thermal analysis is the IC mounting substrate 100 including the board 102, the IC 104, and the wiring 106, and therefore CAD data of the IC mounting substrate 100 including these is created.

  Next, an IC part heat generation amount calculation process is performed (B2). In this embodiment, since the heat generating part is the IC 104, the heat generation state of the IC 104 is calculated by simulation. Here, the circuit operation simulation result performed in the circuit simulation (A2) is used to calculate the power consumption necessary for performing the circuit operation, and the heat generation amount of the IC 104 is calculated by regarding this as the heat generation amount.

  Next, thermal analysis calculation is performed (B3). Although details of the thermal analysis processing are not described in detail in the present embodiment, thermal analysis is performed on the entire IC mounting substrate 100 on which the board 102 and the ICs 104 and 106 are mounted, with the IC 104 as a heat generating portion.

  FIG. 4 shows the contents of the IC part heat generation amount calculation process (B2). As shown in FIG. 4, when the IC unit heat generation amount calculation process is started, first, the circuit of the IC is divided into a group of functions of the circuit, that is, into each circuit element, and this is used as each block ( C1). In this method, the designed circuit is divided into circuit elements grouped according to specific functions.

  Next, a sheet is generated so as to include at least one of the blocks (C2). The sheet corresponds to a region serving as a unit of heat generation used for thermal analysis performed later, and corresponds to a region that delimits a specific range on the IC 104. Next, the generated sheet is placed on the upper surface of the IC layout (C3). Subsequently, the calorific value of the corresponding block is added to each sheet and assigned (C4).

  FIGS. 5A and 5B are diagrams for illustrating block division and sheet generation. As shown in FIG. 5A, the division of the blocks is performed by dividing the circuit elements blocks 11 to 13, 21, 22, 31 to 34, 41, 42, 51, 52, 61 to 63, which are laid out on the surface of the IC 104. It is divided into 71-73. Next, as shown in FIGS. 5A and 5B, sheets A to G are generated so as to include at least one block.

  For example, the sheet may be generated so as to be composed of one block, or may be generated so as to include a plurality of blocks. In addition, when the calculation processing capability of the thermal analysis device 80 described later is high, the block may be regarded as a sheet as it is and placed on the upper surface of the IC layout to perform thermal analysis.

  FIG. 6 shows an example of the heat generation amount of the sheet. For example, the sheet A includes blocks 11 to 13 as shown in FIG. The amount of heat generated by the sheet A is the sum of the power consumption of the blocks 11 to 13 and is, for example, 1.0 W of power consumption. In addition, for example, the sheet C includes blocks 31 to 34, and the sum of the power consumption of the blocks 31 to 34 is 2.5W. Accordingly, the power consumption of the sheet C is 2.5 W.

  The power consumption is regarded as the heat generation amount. In this embodiment, for example, the heat analysis is performed with the heat generation amount of the sheet A being 1.0 W and the heat generation amount of the sheet C being 2.5 W. The same applies to the other sheets B, D, E, F, and G.

  FIG. 7 shows a schematic configuration of the thermal analysis device 80 according to the present embodiment, which is configured by a personal computer, for example. As shown in FIG. 7, the thermal analysis device 80 includes a control unit 82, a storage unit 92, an operation unit 94, and a display unit 96. The control unit 82 includes a CPU 84, a RAM 86, a ROM 88, an I / O 90, and the like.

  The thermal analysis process in the thermal analysis device 80 is executed by, for example, executing a program stored in the ROM 88 by the CPU 84. The thermal analysis device 80 performs the thermal analysis processing shown in FIGS. That is, the control unit 82 is a means for executing each process shown in FIGS.

  Since the IC design shown in FIG. 2 can also be realized by a personal computer, for example, it may be carried by the thermal analysis device 80 as a personal computer, or may be realized by a computer having another similar configuration. Also good.

The effects of the embodiment described above are summarized as follows.
In the thermal analysis processing of the entire IC mounting substrate 100 on which the IC 104 is mounted, the thermal analysis processing is performed using the calorific values of a plurality of sheets arranged in the IC 104 instead of calculating the IC 104 as one heating element. For this reason, an analysis result more consistent with the actual situation can be obtained. Therefore, since it is possible to design an optimal heat dissipation measure, such as a heat countermeasure such as a heat sink that can be concentrated on a necessary location, waste of the heat countermeasure can be avoided. In addition, it is possible to eliminate waste such as excessive heat radiation countermeasures where no heat radiation countermeasures are originally required.

  In addition, the heat calculation of the IC 104 is not performed for all the circuit elements on all the ICs 104, but the calorific value is calculated by dividing into blocks for each circuit element, and further, on the sheet provided on the IC 104 After assigning the amount of heat generation, heat calculation is performed on the entire IC mounting substrate 100 on which the IC 104 is mounted. For this reason, it is possible to execute a detailed thermal simulation in a realistic calculation time.

  The present invention is not limited to the above-described embodiments, and can be applied to various embodiments without departing from the scope of the invention. For example, the IC mounting substrate 100 in which one IC 104 is mounted on the board 102 has been described, but the present invention is not limited to this. The number of ICs 104 mounted on the board 102 is arbitrary, and can be applied to the IC mounting substrate 100 on which two or more ICs 104 are mounted. The order of the flowcharts shown in FIGS. 2 to 4 may be changed within a range not departing from the gist thereof.

    In the drawing, 100 is an IC mounting substrate (electronic device), 102 is a board, 104 is an IC, 11 to 13, 21, 22, 31 to 34, 41, 42, 51, 52, 61 to 63, and 71 to 73 are blocks. , A, B, C, D, E, F, and G are sheets, 80 is a thermal analysis device, and 82 is a control unit (each unit).

Claims (2)

A method of thermally analyzing an IC mounting substrate (100) mounted with an IC (104) by a computer ,
A plurality of blocks (11-13, 21, 22, 31-34, 41, 42, 51, 52, 61-63, 71-73) for each circuit element grouped by the function of the circuit. To split it into
A procedure for calculating the amount of heat generated for each block from the circuit simulation results;
Dividing the circuit elements laid out on the IC into a plurality of sheets (A to G) including any of the blocks;
A method of assigning a heat generation amount for each block to each of the plurality of sheets arranged on the IC, and calculating a heat generation amount for each sheet. A thermal analysis device for an IC mounting board on which an IC is mounted,
Means for dividing a circuit on the IC into a plurality of blocks for each circuit element grouped by a function of the circuit;
Means for calculating a heating value for each block from a circuit simulation result;
Means for dividing the circuit elements laid out on the IC into a plurality of sheets including any of the blocks;
Means for assigning the amount of heat generated for each block to each of the plurality of sheets arranged on the IC, and calculating the amount of heat generated for each sheet, (80) .

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