JP6558154B2 - Bonding method, bonding state determination method, bonding apparatus, and bonding state determination apparatus - Google Patents

Description

  The present invention relates to a bonding method, a bonding state determination method, a bonding apparatus, and a bonding state determination apparatus.

  Conventionally, there is a technique for joining a joining member and a member to be joined by laser light irradiation. At this time, when the joining surfaces of the joining member and the member to be joined are both flat and the joining member and the member to be joined are not placed on the fixed member and are in an unstable state. In general, a method is used in which a joining member and a member to be joined are pressure-bonded and fixed by fixing means such as a clip in order to maintain contact between the joining surfaces. And a joining member and a to-be-joined member are joined by irradiation of a laser beam in the state where contact of joining surfaces was maintained with a clip. In addition, Patent Documents 1 and 2 include techniques for joining two members (a joining member and a member to be joined) by irradiating a laser beam.

JP-A-10-328862 JP 2004-209549 A

  However, normally, in joining of a joining member and a member to be joined using fixing means such as a clip, the attachment and removal processes of the clip and the like increase, and the cost increases. Further, a space for attaching a clip used only at the time of joining is required around the joining member and the joined member, which may increase the size of the final product.

  The present invention has been made in view of such circumstances, and in joining a joining member and a member to be joined by laser light, a joining method and a joining state determination that can be easily joined without using a fixing means such as a clip. It is an object to provide a method, a joining device, and a joining state determination device.

  The joining method according to claim 1 of the present invention is a joining method in which a joining member and a member to be joined are joined by laser light irradiation, and a tip side of the joining member is brought into contact with the member to be joined, The proximal end side of the joining member is in a state having a gap with respect to the joined member, and the joining member is bent and deformed by pressing the distal end side of the joining member by a reaction force from the joined member. A bending step of bending the bending target part by irradiating the bending target part of the joining member with a first laser beam, and a gap between the tip of the joining member and the bending target part. A joining step of joining the member to be joined and the joining member by irradiating a predetermined joining portion with a second laser beam.

  By the above-described joining method, the joining member that has been deformed and fixed before joining is irradiated with the first laser beam in the bending process, and the bending deformation is eliminated when the bending target part is bent. As a result, the portion to be bent of the joining member approaches the member to be joined, and as a result, any portion between the tip of the joining member and the portion to be bent comes into contact with the member to be joined, and this contact state is maintained. To do. For this reason, the joining member and the member to be joined can be joined without using a fixing means such as a clip. Accordingly, the attaching and detaching steps of the fixing means such as the clip are not necessary, and the manufacturing cost is suppressed. In addition, since a space for attaching a fixing means such as a clip used only for joining is not required, the space around the joining member and the joined member can be reduced, which can contribute to downsizing of the final product. .

It is a joining apparatus which concerns on 1st embodiment, and is a figure after the 1st terminal (joining member) and the 2nd terminal (joined member) are joined before a terminal is attached to a housing. It is a figure explaining the attachment method of the 1st terminal to a housing. It is an enlarged view of the 1st terminal in FIG. 1, and a 2nd terminal, and is a figure explaining irradiation of the 1st laser beam to the bending | flexion object site | part of a 1st terminal. It is a figure explaining the state of the 1st terminal bent by irradiation to the bending object part by the 1st laser beam. It is a figure explaining irradiation to the junction part of the 1st terminal by the 2nd laser beam. It is a flowchart of a joining method. It is a figure of the joining apparatus explaining the modification 1. FIG. It is a figure explaining the case where the presence or absence of the contact with the 2nd terminal in the area exceeding a predetermined amount is determined with another parameter | index (displacement amount of a 1st terminal). It is a figure of the joining apparatus explaining the modification 2.

<First embodiment>
A joining apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of the joining apparatus 10. In FIG. 1, a joining apparatus 10 is an apparatus that joins a first terminal 50 and a second terminal 60 by welding by irradiating a first terminal 50 with laser light. In addition, the 1st terminal 50 is corresponded to a joining member, and the 2nd terminal 60 used as the other party member of the 1st terminal 50 in joining is equivalent to a to-be-joined member.

  For convenience of description of the bonding apparatus 10, first, the first terminal 50 and the second terminal 60 to be bonded will be described. In the following description, the upper side of FIG. 1 will be described as the upper side, and the lower side as the lower side. In the present embodiment, the first terminal 50 and the second terminal 60 are both made of copper. However, copper is only an example and is not limited to copper. The material of the first terminal 50 and the second terminal 60 may be any material as long as it can be joined by laser light irradiation.

  As shown in FIG. 1, in the present embodiment, the first terminal 50 is, for example, a lead wire extending from the semiconductor element T. The first terminal 50 (joining member) is a long member, and preferably includes a free end. As the semiconductor element T, for example, a semiconductor element called MOS (Metal Oxide Semiconductor) is applied. The second terminal 60 is, for example, a bus bar having a predetermined conductivity. Since these are all well-known, detailed description is abbreviate | omitted. In the present embodiment, the first terminal 50 is formed in a shape that is relatively easily elastically deformed with respect to the second terminal 60. In the following description, the joining member is referred to as the first terminal 50 and the joined member is referred to as the second terminal 60. However, the relationship between the first terminal 50 and the second terminal 60 may be appropriately reversed and read.

  As shown in FIG. 1, the semiconductor element T is fixed to the mounting surface 5 a of the housing 5 by bolts B. The second terminal 60 is arranged as shown in FIG. The second terminal 60 is fixed to, for example, a motor (not shown) different from the housing 5, and the relative positional relationship with the housing 5 is maintained. In addition, the state shown in FIG. 1 is a state where the first terminal 50 and the second terminal 60 to be joined are ready for joining. It is assumed that the shape of the second terminal 60 does not change much before and after joining by laser light irradiation.

  In a state before the semiconductor element T is fixed to the housing 5, the first terminal 50 has a solid line shape shown in FIG. For this reason, after fixing the first terminal 50 to the housing 5, first, the tip 51 of the first terminal 50 is contacted with the upper end of the second terminal 60 in FIG. Make contact. Further, in the semiconductor element T, the corner portion on the housing 5 side of the surface Tb opposite to the surface Ta to which the base end 52 of the first terminal 50 is fixed is brought into contact with the housing 5. From such a state, the semiconductor element T and the first terminal 50 around the fulcrum Q apply a rotational force to the semiconductor element T so as to rotate in the directions of arrows Ar1 and Ar2 in FIG. Thereby, in the 1st terminal 50, the front-end | tip 51 side which is the free end of the 1st terminal 50 which is the state shown in FIG. 1 is contact | abutted to the 2nd terminal 60, and the base end 52 side of the 1st terminal 50 is made 2nd. The terminal 60 has a gap C. Moreover, the tip 51 side of the first terminal 50 is pressed by the reaction force Ar3 of the arrow Ar1 by the second terminal 60 so that the first terminal 50 is bent and deformed (the solid line in FIG. 1 and the two in FIG. 2). (See dotted line). In this way, the first terminal 50 is set so as to be in the state shown in FIG.

  In the above, the housing 5 functions as a heat spreader that radiates heat generated in the semiconductor element T. Moreover, in this embodiment, since the 2nd terminal 60 has a shape which is hard to deform | transform with respect to the 1st terminal 50, in the state shown in FIG. There is no major deformation.

(1. Configuration of joining device 10)
Next, the bonding apparatus 10 will be described. As shown in FIG. 1, the bonding apparatus 10 includes a first laser light source So1, a second laser light source So2, and a control device 20.
As shown in FIGS. 1 and 3, the first laser light source So1 irradiates a first laser beam L1 generated by a laser oscillator, a laser head, or the like toward a bending target portion 53 that is a predetermined position. Since an apparatus related to laser generation, such as a laser oscillator, is well known, the drawings and detailed description thereof are omitted. The first laser light L1 emitted by the first laser light source So1 is a laser that raises the temperature of the bending target portion 53 of the irradiated first terminal 50 and softens the bending target portion 53.

  The bending target portion 53 is a portion set in the back surface 50 b facing the joint surface 50 a of the first terminal 50 facing the second terminal 60. The position of the bending target portion 53 is set so that, for example, the first terminal 50 is deformed into a desired shape when the first laser light L1 is irradiated to the bending target portion 53 of the bent first terminal 50. . That is, when bent at the bending target portion 53, the surface having at least a predetermined area between the tip 51 and the bending target portion 53 on the joint surface 50 a of the first terminal 50 approaches the second terminal 60. And a position that allows contact with the joint surface 60 a of the second terminal 60. The position is arbitrarily set based on experiments or the like in advance.

  As shown in FIG. 1 and FIG. 5, the second laser light source So2 irradiates a predetermined joining portion 54 between the tip 51 of the first terminal 50 and the bending target portion 53 with the second laser light L2. The second terminal 60 and the first terminal 50 are joined. As shown in FIG. 5, in the present embodiment, the predetermined joining portion 54 is located closer to the tip 51 side of the first terminal 50 than the bending target portion 53. The second laser light L2 irradiated by the second laser light source So2 is a laser that raises the temperature of the irradiated bonding portion 54 of the first terminal 50 and melts it to bond the first terminal 50 and the second terminal 60 together.

  The first laser light source So1 and the second laser light source So2 may be the same or different. In the present embodiment, the first laser light source So1 and the second laser light source So2 are the same. When the irradiation of the first laser light L1 to the bending target portion 53 by the first laser light source So1 is completed, the control device 20 operates an unillustrated actuator provided in the first laser light source So1, and the first laser light source So1. Is moved to a position where the second laser light source So2 is disposed and used as the second laser light source So2. When used as the second laser light source So2, the output of the first laser light L1 irradiated by the first laser light source So1 is switched to the output for the second laser light L2 irradiated by the second laser light source So2. The first laser light source So1 and the second laser light source So2 are not limited to this mode, and may be provided with a laser oscillator, a laser head, and the like.

  The control device 20 includes a first laser light irradiation control unit 21, a second laser light irradiation control unit 22, and a contact state determination unit 23. The contact state determination unit 23 is connected to an infrared temperature sensor 23 a that measures the temperature of the second terminal 60. And the contact state determination part 23 acquires suitably the temperature of the 2nd terminal 60 detected by the infrared temperature sensor 23a.

  The first laser light irradiation control unit 21 controls irradiation of the first laser light L1 emitted from the first laser light source So1. Specifically, the ON / OFF of the irradiation of the first laser light L1 irradiated from the first laser light source So1, the irradiation time t1, and the like are controlled. The irradiation time t <b> 1 is set by previously deriving experimentally the time during which the first terminal 50 is bent well at the bending target portion 53 when the bending target portion 53 of the first terminal 50 is irradiated with the first laser light L <b> 1. The

  The second laser light irradiation control unit 22 controls the irradiation of the second laser light L2 emitted from the second laser light source So2. Specifically, the ON / OFF of the irradiation of the second laser light L2 irradiated from the second laser light source So2 and the irradiation time t2 are controlled. The irradiation time t2 is such that when the second laser beam L2 is applied to the predetermined bonding portion 54 between the tip 51 of the first terminal 50 and the bending target portion 53, the bonding portion 54 is heated and the heat is applied to the second time. The time during which the second terminal 60 and the first terminal 50 can be joined by transmitting to the terminal 60 is derived and set in advance by experiments.

  The contact state determination unit 23 is configured so that the bending target portion 53 of the first terminal 50 is bent by the irradiation of the first laser light L1 controlled by the first laser light irradiation control unit 21, and then the tip 51 side of the first terminal 50 It is determined whether or not there is a contact with the second terminal 60 in an area exceeding a predetermined amount from the bending target portion 53 to the bending target portion 53. At this time, the index of determination is the temperature change amount of the second terminal 60. The temperature change amount of the second terminal 60 refers to the temperature Temp1 of the second terminal 60 before the bending target portion 53 is irradiated with the first laser light L1, and the first laser for the bending target portion 53 for a predetermined time. The difference (Temp2−Temp1) between the temperature Temp2 of the second terminal 60 after the light L1 is irradiated and the first terminal 50 is bent.

  The contact area between the first terminal 50 and the second terminal 60 is such that the amount of heat of the first terminal 50 that has risen in temperature due to irradiation with the first laser light L1 is transmitted to the second terminal 60 through the contact surface. It is proportional to the amount of heat. Thereby, the size of the contact area between the first terminal 50 and the second terminal 60 can be determined by detecting the temperature change amount of the second terminal 60. Therefore, when the temperature of the second terminal 60 changes more than a predetermined value, it can be said that the first terminal 50 and the second terminal 60 are in contact with each other in an area exceeding a predetermined amount. In order to make the above determination, the contact state determination unit 23 determines in advance the relationship among the temperature of the first terminal 50, the contact area between the first terminal 50 and the second terminal 60, and the temperature of the second terminal 60. And stored in a storage unit (not shown).

  When the contact state determination unit 23 determines that the first terminal 50 has contacted the second terminal 60 in an area exceeding a predetermined amount, the second laser light irradiation control unit 22 of the control device 20 has a high output. The irradiation of the second laser light L2 by the two laser light sources So2 is controlled. As a result, the second laser beam L2 is applied to a predetermined bonding portion 54 provided at an arbitrary position between the tip 51 of the first terminal 50 and the bending target portion 53, and the second terminal 60, the first terminal 50, Join. As described above, the position of the second laser light source So2 and the output of the second laser light L2 are different from the position of the first laser light source So1 and the output of the first laser light L1. Therefore, when the contact state determination unit 23 determines that the first terminal 50 has contacted the second terminal 60 with an area exceeding a predetermined amount, the control device 20 controls the actuator (not shown) and performs the first laser light source So1. Is moved to the position of the second laser light source So2 to obtain a second laser light source So2. Also, the output is switched to obtain the second laser beam L2.

(2. Joining method)
Next, a joining method will be described based on the flowcharts of FIGS. The joining method according to the present embodiment includes a pressing step S1, a bending step S2, a contact state determining step S3, and a joining step S4.
In the pressing step S <b> 1, as shown in FIGS. 1 and 2, the tip 51 side of the first terminal 50 is brought into contact with the upper end of the second terminal 60. Then, the first terminal 50 is pressed by causing the proximal end 52 side of the first terminal 50 to have a gap C with respect to the second terminal 60, and the distal end 51 side of the first terminal 50 is pressed by the second terminal 60. 50 is bent and deformed. Then, the semiconductor element T to which the base end 52 of the first terminal 50 is fixed is fixed to the mounting surface 5 a of the housing 5 so that such a state can be maintained. Thus, the preparation for laser bonding according to the present invention is completed (see FIGS. 1 and 3).

  In the bending step S2, the first laser light irradiation control unit 21 of the control device 20 controls the irradiation of the first laser light L1 emitted from the first laser light source So1, as shown in FIG. And the 1st laser beam L1 is irradiated to the bending | flexion object site | part 53 provided in the back surface 50b of the 1st terminal 50. FIG. Thereby, as shown in FIG. 4, the bending target portion 53 is bent by a predetermined amount. Specifically, the bending target portion 53 is heated and softened by irradiation of the bending target portion 53 with the first laser light L1. For this reason, the bending deformation of the first terminal 50 is eliminated. Then, with the bending target part 53 as a boundary, the part M on the distal end 51 side and the part N on the proximal end 52 side are linear, and the bending target part 53 and the part M on the distal end 51 side approach the second terminal 60 and come into contact with each other. (See FIG. 4). Thus, even if the 1st terminal 50 and the 2nd terminal 60 are not crimped | bonded using a jig, the crimping state (contact state) with the 1st terminal 50 and the 2nd terminal 60 can be created.

  In the contact state determination step S <b> 3, has the first terminal 50 contacted the second terminal 60 with an area exceeding a predetermined amount between the tip 51 side of the first terminal 50 and the bending target portion 53 by the contact state determination unit 23? Determine whether or not. In the contact state determination step S3, the determination is made after the bending target portion 53 of the first terminal 50 is bent by the irradiation of the first laser light L1 in the bending step S2. At this time, the determination index is the temperature change amount of the second terminal 60 as described above, and the details are as described above. And when it determines with the 1st terminal 50 having contacted the 2nd terminal 60 in the area exceeding predetermined amount by contact state determination process S3, the 2nd terminal 60 and the 1st terminal 50 will be joined by joining process S4. .

  As shown in FIG. 5, in the joining step S4, the second laser light irradiation control unit 22 provided in the control device 20 controls the irradiation of the second laser light L2 emitted from the second laser light source So2. The second laser light irradiation control unit 22 heats the bonding portion 54 by irradiating the predetermined bonding portion 54 between the tip 51 of the first terminal 50 and the bending target portion 53 with the second laser light L2. The second terminal 60 and the first terminal 50 are joined. In the present embodiment, the predetermined joining portion 54 irradiated with the second laser beam L2 is located on the tip 51 side of the first terminal 50 from the bending target portion 53, unlike the position of the bending target portion 53. For this reason, in the joining part 54, possibility that the 1st terminal 50 and the 2nd terminal 60 are contacting is high, and this can perform favorable joining.

<Modification 1>
In the first embodiment, the bonding apparatus 10 includes the first laser light source So1, the second laser light source So2, and the control device 20. The control device 20 includes a first laser light irradiation control unit 21, a second laser light irradiation control unit 22, and a contact state determination unit 23. Thereby, when it determines with the 1st terminal 50 having contacted the 2nd terminal 60 in the area exceeding predetermined amount by the contact state determination part 23, the 2nd laser beam irradiation control part 22 will be 2nd in joining process S4. The terminal 60 and the first terminal 50 are joined. However, it is not limited to this aspect. As shown in FIG. 7, as a first modification, the bonding apparatus 101 includes a first laser light source So1, a second laser light source So2, and a control apparatus 20, and the control apparatus 20 controls the first laser light irradiation control. It is only necessary to include the unit 21 and the second laser light irradiation control unit 22. That is, the joining apparatus 10 does not include the contact state determination unit 23 in the control device 20 and does not include the infrared temperature sensor 23a. According to this aspect, even when the first terminal 50 is not in good contact with the second terminal 60 in an area exceeding a predetermined amount, the first laser beam L2 is irradiated to the first terminal 50. The effect is obtained. In addition, about a joining method, the effect similar to said joining apparatus 101 can be acquired by the joining method provided with press process S1, bending process S2, and joining process S4.

(3. Effects of the embodiment)
According to the joining method according to the first modification of the first embodiment, the distal end 51 side of the first terminal 50 is brought into contact with the second terminal 60, and the proximal end 52 side of the first terminal 50 is brought into contact with the second terminal 60. On the other hand, a gap is provided. At the same time, the second terminal 60 presses the tip 51 side of the first terminal 50 so that the first terminal 50 is bent and deformed, and the first terminal 50 is bent to the bending target portion 53. By irradiating the laser beam L 1, the second laser beam L 2 is irradiated to a predetermined bonding portion 54 among the bending step S 2 for bending the bending target portion 53 and between the tip 51 of the first terminal 50 and the bending target portion 53. By doing so, the joining process S4 which joins the 2nd terminal 60 and the 1st terminal 50 is provided.

  Thereby, the bending deformation of the first terminal 50 which is bent and deformed and fixed in the pressing step S1 before joining is eliminated when the bending target portion 53 is bent in the bending step S2. And the bending | flexion object site | part 53 of the 1st terminal 50 approaches the 2nd terminal 60, and by extension, any site | part between the front-end | tip 51 of the 1st terminal 50 and the bending object site | part 53 is 2nd terminal. 60, and this contact state is maintained. For this reason, the first terminal 50 and the second terminal 60 can be joined without using a fixing means such as a clip. Accordingly, the attaching and detaching steps of the fixing means such as the clip are not necessary, and the manufacturing cost is suppressed. Further, since a space for attaching a fixing means such as a clip used only at the time of joining is not required, the space around the terminal and the mating member can be reduced, which can contribute to downsizing of the final product.

  Further, according to the joining method of the first embodiment and the first modification, in the joining step S4, the joining part 54 irradiated with the second laser light L2 is closer to the tip 51 side of the first terminal 50 than the bending target part 53. Located in. Thereby, it is easy to join in the position where the 1st terminal 50 and the 2nd terminal 60 are contacting, and the reliability of joining improves.

  Further, according to the joining method of the first embodiment, after the bending target portion 53 of the first terminal 50 is bent by the irradiation of the first laser light L1 in the bending step S2, the first terminal 50 is A contact state determination step S <b> 3 for determining whether or not the second terminal 60 is contacted with an area exceeding a predetermined amount from the tip 51 side of the one terminal 50 to the bending target portion 53 is provided. And when it determines with the 1st terminal 50 having contacted the 2nd terminal 60 in the area exceeding predetermined amount by contact state determination process S3, the 2nd terminal 60 and the 1st terminal 50 will be joined by joining process S4. .

  Thereby, when the 1st terminal 50 and the 2nd terminal 60 between the front-end | tip 51 side of the 1st terminal 50 and the bending object site | part 53 are not contacting in the area exceeding predetermined amount, it is 2nd in joining process S4. Generation of useless work of irradiating the laser beam L2 can be avoided, which is efficient.

Further, according to the joining method of the first embodiment, the contact state determination step S3 includes the second terminal 60 in an area exceeding a predetermined amount between the tip 51 side of the first terminal 50 and the bending target portion 53. The presence or absence of contact with the second terminal 60 is detected based on the temperature change amount of the second terminal 60.
Since it is possible to determine the presence or absence of contact with the second terminal 60 in an area exceeding the predetermined amount of the first terminal 50 by such a simple and low-cost method of detecting the temperature change amount of the second terminal 60, the efficiency is improved. Is.

  Moreover, according to the joining apparatus 101 which concerns on the modification 1 of the said 1st embodiment, the front-end | tip 51 side of the 1st terminal 50 is made to contact | abut to the 2nd terminal 60. FIG. Then, the first terminal 50 is pressed by causing the proximal end 52 side of the first terminal 50 to have a gap C with respect to the second terminal 60, and the distal end 51 side of the first terminal 50 is pressed by the second terminal 60. 50 is in a state of being bent and deformed. The first laser beam L1 is irradiated to the bending target portion 53 of the first terminal 50 in such a state. As a result, the second laser is applied to the first laser light source So1 that bends the bending target portion 53 and approaches the second terminal 60, and the predetermined bonding portion 54 between the tip 51 of the first terminal 50 and the bending target portion 53. By irradiating the light L2, the second laser light source So2 that joins the second terminal 60 and the first terminal 50 and the irradiation of the first laser light L1 emitted from the first laser light source So1 are controlled, and the first And a control device 20 that controls the irradiation of the second laser light L2 emitted from the two laser light sources So2. According to this joining apparatus 10, the same effect as the joining method including the pressing step S1, the bending step S2, and the joining step S4 can be obtained.

Moreover, according to the joining apparatus 10 of said 1st embodiment, the bending | flexion object site | part 53 of the 1st terminal 50 is bent by irradiation of the 1st laser beam L1 controlled by the 1st laser beam irradiation control part 21 of the control apparatus 20. After that, the contact state determination unit that determines whether or not the first terminal 50 has contacted the second terminal 60 with an area exceeding a predetermined amount between the tip 51 side of the first terminal 50 and the bending target portion 53. 23. When the contact state determination unit 23 determines that the first terminal 50 has contacted the second terminal 60 with an area exceeding a predetermined amount, the second laser light irradiation control unit 22 of the control device 20 performs the second laser light. The second terminal 60 and the first terminal 50 are joined by controlling the irradiation of L2.
Thereby, when the first terminal 50 and the second terminal 60 between the tip 51 side of the first terminal 50 and the bending target portion 53 are not in contact with each other in an area exceeding a predetermined amount, the control device 20 (second Generation of useless work of irradiating the second laser beam L2 can be avoided by the control of the laser beam irradiation control unit 22), which is efficient.

  Moreover, in the said embodiment, the joining site | part 54 where the 2nd laser beam L2 is irradiated was a position different from the bending | flexion object site | part 53 in joining process S4. However, it is not limited to this aspect. The bonding part 54 irradiated with the second laser beam L2 may be at the same position as the bending target part 53. Thereby, it is not necessary to move the first laser light source So1, and it is efficient.

  In the first embodiment, the joining device 10 determines a predetermined amount between the distal end 51 side of the first terminal 50 and the bending target portion 53 in the contact state determination step S3 (contact state determination unit 23). Presence / absence of contact with the mating member in an exceeding area was detected by the temperature change amount of the second terminal 60. However, it is not limited to this aspect. The presence or absence of contact with the second terminal 60 in an area exceeding a predetermined amount between the tip 51 side of the first terminal 50 and the bending target portion 53 is determined by the first terminal 50 before and after the bending target portion 53 is bent. You may detect by displacement amount (alpha) (refer FIG. 8) approaching the 2nd terminal 60. FIG. As described above, since the actual displacement amount α of the first terminal 50 is detected and the presence or absence of contact with the second terminal 60 in the area exceeding the predetermined amount of the first terminal 50 is determined, a highly accurate determination result. Can be obtained. Moreover, you may detect directly from the imaging results, such as a camera, that the clearance gap C between the 1st terminal 50 in FIG. 1 and the 2nd terminal 60 was lose | eliminated.

<Modification 2>
In the first embodiment, the bonding apparatus 10 includes the first laser light source So1, the second laser light source So2, and the control device 20. The control device 20 includes a first laser light irradiation control unit 21, a second laser light irradiation control unit 22, and a contact state determination unit 23. And when it determines with the 1st terminal 50 having contacted the 2nd terminal 60 in the area exceeding predetermined amount by the contact state determination part 23, the 2nd laser beam irradiation control part 22 will be the 2nd terminal in joining process S4. 60 and the first terminal 50 were joined. However, it is not limited to this aspect.
As a second modification, the bonding apparatus 102 includes a first laser light source So1 and a control apparatus 20, and the control apparatus 20 includes only a first laser light irradiation control unit 21 and a contact state determination unit 23. Alternatively, see FIG. That is, the joining device does not join the first terminal 50 and the second terminal 60, and whether or not the first terminal 50 contacts the second terminal 60 in an area exceeding a predetermined amount by the contact state determination unit 23. It is good also as an apparatus (equivalent to the contact state determination apparatus of this invention) which only determines this. Thereby, it can be grasped | ascertained favorably whether the 1st terminal 50 contacted the 2nd terminal 60 in the area exceeding predetermined amount.

  Similarly to the above, the contact state determination method in Modification 2 is such that the distal end 51 side of the first terminal 50 is brought into contact with the second terminal 60 and the proximal end 52 side of the first terminal 50 is brought into contact with the second terminal 60. A pressing step S1 in which the first terminal 50 is bent and deformed by pressing the tip 51 side of the first terminal 50 by the second terminal 60; Exceeding a predetermined amount between the bending step S2 for bending the bending target part 53 by irradiating the bending target part 53 with the first laser light L1 and the bending target part 53 from the tip 51 side of the first terminal 50. A contact state determination step S <b> 3 for determining whether or not the second terminal 60 is touched in terms of area. By the contact state determination step S3 in this joining method, the contact state between the first terminal 50 and the second terminal 60 in which the bending target portion 53 is bent in the bending step S2 can be grasped.

<Modification 3>
Moreover, in the said embodiment, the 1st terminal was demonstrated as the terminal of an electronic component and the 2nd terminal was demonstrated as a bus bar as an illustration of joining of a 1st terminal and a 2nd terminal. However, the present invention is not limited to this mode, and as a third modification, the joining of the first terminal and the second terminal may be a joining of a planar motor coil wire and a bus bar. Furthermore, the joining according to the present invention may be applied to joining sheet metals such as automobile bodies. Moreover, you may apply to joining of a battery case in a lithium ion battery etc., and joining of a terminal.

  In the above embodiment, the joining member and the joined member have been described as terminals (first terminal 50, second terminal 60). However, it is not limited to this aspect. The joining member and the member to be joined may be an elastic member containing a metal piece or a resin, and can be applied to these joinings.

  DESCRIPTION OF SYMBOLS 5 ... Housing, 10 ... Joining device, 20 ... Control device, 21 ... First laser light irradiation control part, 22 ... Second laser light irradiation control part, 23 ... Contact state Determination part, 23a ... Infrared temperature sensor, 50 ... First terminal (joining member), 50a ... Joining surface, 50b ... Back surface, 51 ... Tip, 52 ... Base end 53 ... bending target part, 54 ... joining part, 60 ... second terminal (member to be joined), 60a ... joining surface, 101 ... joining device, Ar1, Ar2, Ar3 ...・ Arrow, L1 ... first laser light, L2 ... second laser light, S1 ... pressing step, So1 ... first laser light source, So2 ... second laser light source, S2 ... Bending process, S3 ... Contact state determining process, S4 ... Joining process Temp1, Temp2 ··· temperature, α ··· amount of displacement.

Claims (10)

A joining method for joining a joining member and a member to be joined by laser light irradiation,
The distal end side of the joining member is brought into contact with the joined member, the proximal end side of the joining member is in a state having a gap with respect to the joined member, and the distal end of the joining member is formed by the joined member. A pressing step in which the joining member is bent and deformed by pressing the side; and
A bending step of bending the bending target portion by irradiating the bending target portion of the bonding member with a first laser beam;
A joining step of joining the member to be joined and the joining member by irradiating a predetermined joining part between the tip of the joining member and the bending target part;
A joining method. In the joining step,
The joining method according to claim 1, wherein the joining portion irradiated with the second laser light is located on a distal end side of the joining member with respect to the bending target portion. In the joining step,
The bonding method according to claim 1, wherein the bonding portion irradiated with the second laser light is at the same position as the bending target portion. In the bonding method, after the bending target portion of the bonding member is bent by the irradiation of the first laser light in the bending step, the bonding member extends from the distal end side of the bonding member to the bending target portion. Comprising a contact state determination step of determining whether or not the member to be joined has been contacted with an area exceeding a predetermined amount during,
The said joining process joins the said to-be-joined member and the said joining member, when it determines with the said joining member having contacted the said to-be-joined member in the area exceeding the said predetermined amount by the said contact state determination process. The joining method according to any one of 1 to 3. The contact state determination step includes
The presence or absence of contact with the member to be joined in an area exceeding the predetermined amount between the distal end side of the joining member and the bending target portion is detected based on a temperature change amount of the member to be joined. 4. The joining method according to 4. The contact state determination step includes
The presence / absence of contact with the member to be joined in an area exceeding the predetermined amount between the distal end side of the joining member and the portion to be bent is determined based on whether the joining member before and after the bending in the bending step. The joining method according to claim 4, wherein detection is performed based on an amount of displacement approaching the member to be joined. A contact state determination method for determining a contact state between the bonding member and the member to be bonded in a bonding method of bonding the bonding member and the member to be bonded by laser light irradiation,
The distal end side of the joining member is brought into contact with the joined member, the proximal end side of the joining member is in a state having a gap with respect to the joined member, and the distal end of the joining member is formed by the joined member. A pressing step in which the joining member is bent and deformed by pressing the side; and
A bending step of bending the bending target portion by irradiating the bending target portion of the bonding member with a first laser beam;
A contact state determination step for determining whether or not the bonded member is contacted with an area exceeding a predetermined amount between the distal end side of the bonded member and the bending target portion;
A contact state determination method in a joining method. A joining device that joins a joining member and a member to be joined by laser light irradiation,
The distal end side of the joining member is brought into contact with the joined member, the proximal end side of the joining member is in a state having a gap with respect to the joined member, and the distal end of the joining member is formed by the joined member. A first laser light source that bends the bending target portion by irradiating the bending target portion of the bonding member in a state where the bonding member is bent and deformed by pressing the side;
A second laser light source that joins the member to be joined and the joining member by irradiating a predetermined joining part between the tip of the joining member and the bending target part;
A control device for controlling the irradiation of the first laser light emitted from the first laser light source and for controlling the irradiation of the second laser light emitted from the second laser light source;
A joining apparatus comprising: The joining device includes:
After the bending target portion of the bonding member is bent by the irradiation of the first laser light controlled by the control device, the bonding member is between the distal end side of the bonding member and the bending target portion. A contact state determination unit that determines whether or not the member to be bonded is in contact with an area exceeding a predetermined amount;
When it is determined by the contact state determination unit that the bonding member has contacted the bonded member in an area exceeding the predetermined amount, the control device controls the irradiation of the second laser beam and the bonded member. The joining apparatus of Claim 8 which joins the said joining member. A contact state determination device that determines a contact state between the bonding member and the member to be bonded, which is included in a bonding device that bonds the bonding member and the member to be bonded by irradiation of laser light,
The distal end side of the joining member is brought into contact with the joined member, the proximal end side of the joining member is in a state having a gap with respect to the joined member, and the distal end of the joining member is formed by the joined member. A first laser light source that bends the bending target portion by irradiating the bending target portion of the bonding member in a state where the bonding member is bent and deformed by pressing the side;
After the bending target portion of the bonding member is bent by the irradiation of the first laser light controlled by the control device, the bonding member is between the distal end side of the bonding member and the bending target portion. A contact state determination device for a bonding apparatus, comprising: a contact state determination unit that determines whether or not the member to be bonded is in contact with an area exceeding a predetermined amount.

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