JP6556158B2 - Unsaturated polyester resin composition and encapsulated motor - Google Patents
Unsaturated polyester resin composition and encapsulated motor Download PDFInfo
- Publication number
- JP6556158B2 JP6556158B2 JP2016555121A JP2016555121A JP6556158B2 JP 6556158 B2 JP6556158 B2 JP 6556158B2 JP 2016555121 A JP2016555121 A JP 2016555121A JP 2016555121 A JP2016555121 A JP 2016555121A JP 6556158 B2 JP6556158 B2 JP 6556158B2
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- JP
- Japan
- Prior art keywords
- unsaturated polyester
- polyester resin
- resin composition
- component
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920006337 unsaturated polyester resin Polymers 0.000 title claims description 95
- 239000000203 mixture Substances 0.000 title claims description 78
- 229920001577 copolymer Polymers 0.000 claims description 23
- 229920000178 Acrylic resin Polymers 0.000 claims description 18
- 239000004925 Acrylic resin Substances 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 17
- 239000003365 glass fiber Substances 0.000 claims description 17
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 229920006305 unsaturated polyester Polymers 0.000 claims description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 8
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 45
- 239000000047 product Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- 239000004793 Polystyrene Substances 0.000 description 10
- 229920002223 polystyrene Polymers 0.000 description 10
- 230000014759 maintenance of location Effects 0.000 description 9
- 239000000178 monomer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229920000459 Nitrile rubber Polymers 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005886 esterification reaction Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000007561 laser diffraction method Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 238000000790 scattering method Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- -1 etc.) Chemical compound 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- 229940031723 1,2-octanediol Drugs 0.000 description 1
- OQBLGYCUQGDOOR-UHFFFAOYSA-L 1,3,2$l^{2}-dioxastannolane-4,5-dione Chemical compound O=C1O[Sn]OC1=O OQBLGYCUQGDOOR-UHFFFAOYSA-L 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
- ZWNMRZQYWRLGMM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diol Chemical compound CC(C)(O)CCC(C)(C)O ZWNMRZQYWRLGMM-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- MWCBGWLCXSUTHK-UHFFFAOYSA-N 2-methylbutane-1,4-diol Chemical compound OCC(C)CCO MWCBGWLCXSUTHK-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- CXJAFLQWMOMYOW-UHFFFAOYSA-N 3-chlorofuran-2,5-dione Chemical compound ClC1=CC(=O)OC1=O CXJAFLQWMOMYOW-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- YVPZFPKENDZQEJ-UHFFFAOYSA-N 4-propylcyclohexan-1-ol Chemical compound CCCC1CCC(O)CC1 YVPZFPKENDZQEJ-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- CKLYHZZUXMRRRF-UHFFFAOYSA-N CC(CCO)CCO.C(CCCCO)O Chemical compound CC(CCO)CCO.C(CCCCO)O CKLYHZZUXMRRRF-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XDODWINGEHBYRT-UHFFFAOYSA-N [2-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCCC1CO XDODWINGEHBYRT-UHFFFAOYSA-N 0.000 description 1
- LUSFFPXRDZKBMF-UHFFFAOYSA-N [3-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCC(CO)C1 LUSFFPXRDZKBMF-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- UPIWXMRIPODGLE-UHFFFAOYSA-N butyl benzenecarboperoxoate Chemical compound CCCCOOC(=O)C1=CC=CC=C1 UPIWXMRIPODGLE-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- LJZULWUXNKDPCG-UHFFFAOYSA-N nonane-1,2-diol Chemical compound CCCCCCCC(O)CO LJZULWUXNKDPCG-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- AEIJTFQOBWATKX-UHFFFAOYSA-N octane-1,2-diol Chemical compound CCCCCCC(O)CO AEIJTFQOBWATKX-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
本発明は、不飽和ポリエステル樹脂組成物及び封入モータに関する。詳細には、本発明は、電気・電子部品を封入するために用いられる不飽和ポリエステル樹脂組成物、及び封入モータに関する。 The present invention relates to an unsaturated polyester resin composition and an encapsulated motor. Specifically, the present invention relates to an unsaturated polyester resin composition used for encapsulating electrical / electronic components, and an encapsulated motor.
各種装置における静寂性の向上、組み込み易さの向上などを目的として、電気・電子部品を樹脂組成物などの封入材料で封入硬化することが行われている。例えば、コイル、回転子、固定子、軸受などのモータ構成部品を樹脂組成物で封入硬化した封入モータが一般に知られている。封入モータは、電気自動車、ハイブリッド電気自動車、空気調和器、冷蔵庫などの各種用途で使用されている。 For the purpose of improving quietness and ease of incorporation in various apparatuses, it is performed to encapsulate and harden electric / electronic parts with an encapsulating material such as a resin composition. For example, an encapsulated motor in which motor components such as a coil, a rotor, a stator, and a bearing are encapsulated and cured with a resin composition is generally known. Enclosed motors are used in various applications such as electric vehicles, hybrid electric vehicles, air conditioners, and refrigerators.
近年、封入モータなどの封入製品には、エネルギー利用の更なる効率化の観点から、小型化及び高出力化が要求されている。これらの要求により、封入される電気・電子部品の発熱量が増加しているため、耐熱性に優れた硬化物を与える封入材料が要求されている。さらに、封入製品の小型化によって電気・電子部品の形状が複雑化していることから、封入材料は、電気・電子部品を確実に封入するため、成形時の流動性が高く且つ成形時の収縮率が小さくなければならない。 In recent years, encapsulated products such as encapsulated motors are required to be smaller and have higher output from the viewpoint of further efficiency in energy use. Due to these demands, the amount of heat generated by the encapsulated electrical / electronic components is increasing, and therefore encapsulating materials that give a cured product with excellent heat resistance are required. In addition, since the shape of electrical and electronic components has become complicated due to the miniaturization of encapsulated products, the encapsulating material has high fluidity during molding and the shrinkage rate during molding in order to securely enclose electrical and electronic components. Must be small.
従来の封入材料としては、不飽和ポリエステル樹脂と、無機充填材と、水酸化アルミニウムと、ガラス繊維と、低収縮剤とを特定の割合で含む不飽和ポリエステル樹脂組成物が提案されている(特許文献1参照)。
他方、耐熱性に優れた硬化物を与える不飽和ポリエステル樹脂組成物として、不飽和ポリエステルと、ジアリルフタレートのモノマー又はプレポリマーと、ジアリルフタレートモノマー以外のラジカル重合性不飽和単量体からなる架橋剤と、ポリスチレン、アクリルポリマー、並びにスチレン−ジエンブロック共重合体及び/又はその水添物若しくは変性物からなる低収縮剤とを特定の割合で含む不飽和ポリエステル樹脂組成物が提案されている(特許文献2参照)。As a conventional encapsulating material, an unsaturated polyester resin composition containing an unsaturated polyester resin, an inorganic filler, aluminum hydroxide, glass fiber, and a low shrinkage agent in a specific ratio has been proposed (patent) Reference 1).
On the other hand, as an unsaturated polyester resin composition that gives a cured product excellent in heat resistance, a crosslinking agent comprising an unsaturated polyester, a diallyl phthalate monomer or prepolymer, and a radically polymerizable unsaturated monomer other than diallyl phthalate monomer And a low-shrinkage agent composed of polystyrene, acrylic polymer, and styrene-diene block copolymer and / or a hydrogenated product or a modified product thereof in a specific ratio has been proposed (patent) Reference 2).
しかしながら、特許文献1の不飽和ポリエステル樹脂組成物は、成形時の流動性は高いものの、水酸化アルミニウムを含有しているため、耐熱性に優れた硬化物を得ることができない。
また、特許文献2の不飽和ポリエステル樹脂組成物は、ランプリフレクター用基材の製造に用いられるものであるため、電気・電子部品の封入材料に適した流動性を有していない。実際、特許文献2の不飽和ポリエステル樹脂組成物を電気・電子部品の封入に用いると、成形時の流動性が十分でないため、電気・電子部品を確実に封入することができない。
このように従来の不飽和ポリエステル樹脂組成物では、電気・電子部品の封入に要求される成形時の流動性と硬化物の耐熱性とが両立されていないのが実情である。However, although the unsaturated polyester resin composition of Patent Document 1 has high fluidity at the time of molding, it contains aluminum hydroxide, and thus cannot obtain a cured product having excellent heat resistance.
Moreover, since the unsaturated polyester resin composition of patent document 2 is used for manufacture of the base material for lamp reflectors, it does not have fluidity suitable for encapsulating materials for electric and electronic parts. In fact, when the unsaturated polyester resin composition of Patent Document 2 is used for encapsulating electric / electronic parts, the fluidity at the time of molding is not sufficient, so that the electric / electronic parts cannot be encapsulated reliably.
As described above, in the conventional unsaturated polyester resin composition, the fluidity during molding and the heat resistance of the cured product, both of which are required for encapsulating electric / electronic parts, are in reality.
本発明は、上記のような問題を解決するためになされたものであり、成形時の流動性が高いと共に、成形収縮率が小さく且つ耐熱性に優れた硬化物を与える不飽和ポリエステル樹脂組成物を提供することを目的とする。また、本発明は、上記の特性を有する不飽和ポリエステル樹脂組成物でモータ構成部品が堅固に封入硬化された封入モータを提供することを目的とする。 The present invention has been made in order to solve the above-described problems, and is an unsaturated polyester resin composition that provides a cured product having high flowability during molding, low molding shrinkage, and excellent heat resistance. The purpose is to provide. Another object of the present invention is to provide an encapsulated motor in which motor components are firmly encapsulated and cured with an unsaturated polyester resin composition having the above-described characteristics.
本発明者らは、上記の問題を解決すべく鋭意検討を行った結果、不飽和ポリエステル樹脂、アクリル樹脂、スチレン−ジエン共重合体、繊維長が5mm以下のガラス繊維、及び無機充填材を特定の割合で組み合わせることで、電気・電子部品の封入材料に適した特性が得られることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the present inventors have identified an unsaturated polyester resin, an acrylic resin, a styrene-diene copolymer, a glass fiber having a fiber length of 5 mm or less, and an inorganic filler. It has been found that characteristics suitable for encapsulating materials for electric and electronic parts can be obtained by combining at a ratio of ## EQU2 ## and the present invention has been completed.
すなわち、本発明は、以下の[1]〜[6]である。
[1](a)不飽和ポリエステル樹脂、(b)アクリル樹脂、(c)スチレン−ジエン共重合体、(d)繊維長が5mm以下のガラス繊維、及び(e)無機充填材を含む不飽和ポリエステル樹脂組成物であって、
(a)成分100質量部に対して、(b)成分及び(c)成分の合計が10質量部〜20質量部、(d)成分が30質量部〜55質量部、及び(e)成分が300質量部〜550質量部であり、且つ(b)成分と(c)成分との質量比が1:2〜2:1であることを特徴とする不飽和ポリエステル樹脂組成物。That is, the present invention includes the following [1] to [6].
[1] Unsaturation containing (a) unsaturated polyester resin, (b) acrylic resin, (c) styrene-diene copolymer, (d) glass fiber having a fiber length of 5 mm or less, and (e) inorganic filler. A polyester resin composition comprising:
(A) With respect to 100 parts by mass of the component, the total of the (b) component and the (c) component is 10 to 20 parts by mass, the (d) component is 30 to 55 parts by mass, and the (e) component is 300 mass parts-550 mass parts, and the mass ratio of (b) component and (c) component is 1: 2-2: 1, The unsaturated polyester resin composition characterized by the above-mentioned.
[2]前記(c)スチレン−ジエン共重合体が、SBS系熱可塑性エラストマー及びSIS系熱可塑性エラストマーからなる群から選択される少なくとも1種であることを特徴とする[1]に記載の不飽和ポリエステル樹脂組成物。
[3]前記(e)無機充填材が炭酸カルシウムであることを特徴とする[1]又は[2]に記載の不飽和ポリエステル樹脂組成物。
[4]電気・電子部品の封入に用いられることを特徴とする[1]〜[3]のいずれか一つに記載の不飽和ポリエステル樹脂組成物。
[5]前記電気・電子部品が、モータ構成部品であることを特徴とする[4]に記載の不飽和ポリエステル樹脂組成物。
[6][1]〜[5]のいずれか一つに記載の不飽和ポリエステル樹脂組成物でモータ構成部品を封入硬化してなることを特徴とする封入モータ。[2] The defect according to [1], wherein (c) the styrene-diene copolymer is at least one selected from the group consisting of SBS thermoplastic elastomers and SIS thermoplastic elastomers. Saturated polyester resin composition.
[3] The unsaturated polyester resin composition according to [1] or [2], wherein the (e) inorganic filler is calcium carbonate.
[4] The unsaturated polyester resin composition according to any one of [1] to [3], wherein the unsaturated polyester resin composition is used for enclosing electric / electronic parts.
[5] The unsaturated polyester resin composition according to [4], wherein the electric / electronic component is a motor component.
[6] An encapsulated motor obtained by encapsulating and curing a motor component with the unsaturated polyester resin composition according to any one of [1] to [5].
本発明によれば、成形時の流動性が高いと共に、成形収縮率が小さく且つ耐熱性に優れた硬化物を与える不飽和ポリエステル樹脂組成物を提供することができる。また、本発明によれば、上記の特性を有する不飽和ポリエステル樹脂組成物でモータ構成部品が堅固に封入硬化された封入モータを提供することができる。 According to the present invention, it is possible to provide an unsaturated polyester resin composition that provides a cured product having high fluidity during molding, a small molding shrinkage ratio, and excellent heat resistance. In addition, according to the present invention, it is possible to provide an encapsulated motor in which motor component parts are firmly encapsulated and cured with an unsaturated polyester resin composition having the above characteristics.
本発明の不飽和ポリエステル樹脂組成物は、(a)不飽和ポリエステル樹脂、(b)アクリル樹脂、(c)スチレン−ジエン共重合体、(d)繊維長が5mm以下のガラス繊維、及び(e)無機充填材を含む。本発明において好ましい不飽和ポリエステル樹脂組成物は、(a)成分〜(e)成分から本質的になる。ここで、本明細書において「本質的になる」とは、(a)成分〜(e)成分を必須成分として含み、本発明の効果を阻害しない範囲において必須成分以外の任意成分を含むことができることを意味する。 The unsaturated polyester resin composition of the present invention comprises (a) an unsaturated polyester resin, (b) an acrylic resin, (c) a styrene-diene copolymer, (d) a glass fiber having a fiber length of 5 mm or less, and (e ) Contains inorganic filler. The unsaturated polyester resin composition preferred in the present invention consists essentially of the components (a) to (e). Here, “essentially” in the present specification includes the components (a) to (e) as essential components and includes optional components other than the essential components within a range not inhibiting the effects of the present invention. Means you can.
本発明の不飽和ポリエステル樹脂組成物に用いられる(a)不飽和ポリエステル樹脂としては、特に限定されず、当該技術分野において公知のものを用いることができる。(a)不飽和ポリエステル樹脂は、一般に、多価アルコールと不飽和多塩基酸及び任意の飽和多塩基酸とのエステル化反応による縮合生成物(不飽和ポリエステル)を、架橋剤(「反応性希釈剤」ともいう。)に溶解したものである。このような不飽和ポリエステル樹脂は、当該技術分野において一般に公知であり、例えば、「ポリエステル樹脂ハンドブック」(日刊工業新聞社、1988年発行)、「塗料用語辞典」(色材協会編、1993年発行)などに記載されている。 The (a) unsaturated polyester resin used in the unsaturated polyester resin composition of the present invention is not particularly limited, and those known in the technical field can be used. (A) An unsaturated polyester resin generally comprises a condensation product (unsaturated polyester) obtained by an esterification reaction of a polyhydric alcohol, an unsaturated polybasic acid and an arbitrary saturated polybasic acid with a crosslinking agent (“reactive dilution”). It is also referred to as “agent”. Such unsaturated polyester resins are generally known in the art, and include, for example, “Polyester Resin Handbook” (Nikkan Kogyo Shimbun, published in 1988), “Paint Glossary of Terms” (edited by Color Material Association, published in 1993). ) Etc.
不飽和ポリエステルの合成に用いられる多価アルコールとしては、特に限定されず、当該技術分野において公知のものを用いることができる。多価アルコールの例としては、エチレングリコール、ジエチレングリコール、プロピレングリコール、ジプロピレングリコール、2−メチル−1,3−プロパンジオール、2,2−ジメチル−1,3−プロパンジオール(「ネオペンチルグリコール」とも称される)、1,2−ブタンジオール、1,3−ブタンジオール、1,4−ブタンジオール、2,3−ブタンジオール、2−メチル−1,4−ブタンジオール、1,5−ペンタンジオール、3−メチル−1,5−ペンタンジオール、2,4−ジエチル−1,5−ペンタンジオール、1,6−ヘキサンジオール、2−エチル−1,3−ヘキサンジオール、2,5−ジメチル−2,5−ヘキサンジオール、1,2−オクタンジオール、1,2−ノナンジオール、1,4−シクロヘキサンジオール、1,8−オクタンジオール、1,9−ノナンジオール、1,2−シクロヘキサンジメタノール、1,3−シクロヘキサンジメタノール、1,4−シクロヘキサンジメタノール、ビスフェノールA、ビスフェノールF、ビスフェノールS、2,2−ジ(4−ヒドロキシシクロヘキシル)プロパン(「水素化ビスフェノールA」とも称される)、ポリエチレングリコール、ポリプロピレングリコール、グリセリン、トリメチロールエタン、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトールなどが挙げられる。これらの成分は、単独の成分又は2種以上の成分を組み合わせて用いることができる。 The polyhydric alcohol used for the synthesis of the unsaturated polyester is not particularly limited, and those known in the technical field can be used. Examples of polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 2-methyl-1,3-propanediol, 2,2-dimethyl-1,3-propanediol (also referred to as “neopentyl glycol”). 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2-methyl-1,4-butanediol, 1,5-pentanediol 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5-pentanediol, 1,6-hexanediol, 2-ethyl-1,3-hexanediol, 2,5-dimethyl-2 , 5-hexanediol, 1,2-octanediol, 1,2-nonanediol, 1,4-cyclohexanedioe 1,8-octanediol, 1,9-nonanediol, 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, bisphenol A, bisphenol F, bisphenol S, 2, Examples include 2-di (4-hydroxycyclohexyl) propane (also referred to as “hydrogenated bisphenol A”), polyethylene glycol, polypropylene glycol, glycerin, trimethylolethane, trimethylolpropane, pentaerythritol, dipentaerythritol, and the like. These components can be used alone or in combination of two or more components.
不飽和ポリエステルの合成に用いられる不飽和多塩基酸としては、特に限定されず、当該技術分野において公知のものを用いることができる。不飽和多塩基酸の例としては、α、β−不飽和多価カルボン酸及びその誘導体が挙げられる。α、β−不飽和多価カルボン酸の例としては、マレイン酸、フマル酸、イタコン酸、シトラコン酸、クロロマレイン酸などが挙げられる。また、α、β−不飽和多価カルボン酸の誘導体の例としては、無水マレイン酸、無水イタコン酸、無水クロロマレイン酸などの酸無水物、上記不飽和多価カルボン酸の低級アルキルエステルなどが挙げられる。これらの成分は、単独の成分又は2種以上の成分を組み合わせて用いることができる。 It does not specifically limit as unsaturated polybasic acid used for the synthesis | combination of unsaturated polyester, A well-known thing can be used in the said technical field. Examples of unsaturated polybasic acids include α, β-unsaturated polycarboxylic acids and derivatives thereof. Examples of the α, β-unsaturated polyvalent carboxylic acid include maleic acid, fumaric acid, itaconic acid, citraconic acid, chloromaleic acid and the like. Examples of α, β-unsaturated polyvalent carboxylic acid derivatives include acid anhydrides such as maleic anhydride, itaconic anhydride and chloromaleic anhydride, and lower alkyl esters of the above unsaturated polyvalent carboxylic acids. Can be mentioned. These components can be used alone or in combination of two or more components.
不飽和ポリエステルの合成に用いられる飽和多塩基酸としては、特に限定されず、当該技術分野において公知のものを用いることができる。飽和多塩基酸の例としては、琥珀酸、アジピン酸、セバシン酸、テトラヒドロフタル酸、エンドメチレンテトラヒドロフタル酸、ヘキサヒドロフタル酸(例えば、1,2−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジカルボン酸など)、オルソフタル酸、イソフタル酸、テレフタル酸、ナフタレンジカルボン酸、トリメリット酸、ピロメリット酸、クロレンディック酸、ヘット酸、テトラブロモフタル酸、無水フタル酸、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、エンドメチレンテトラヒドロ無水フタル酸、無水琥珀酸、無水クロレンディク酸、無水トリメリット酸、無水ピロメリット酸、ジメチルオルソフタレート、ジメチルイソフタレート、ジメチルテレフタレートなどが挙げられる。これらの成分は、単独の成分又は2種以上の成分を組み合わせて用いることができる。 It does not specifically limit as a saturated polybasic acid used for the synthesis | combination of unsaturated polyester, A well-known thing can be used in the said technical field. Examples of saturated polybasic acids include succinic acid, adipic acid, sebacic acid, tetrahydrophthalic acid, endomethylenetetrahydrophthalic acid, hexahydrophthalic acid (eg, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid , 1,4-cyclohexanedicarboxylic acid, etc.), orthophthalic acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, trimellitic acid, pyromellitic acid, chlorendic acid, het acid, tetrabromophthalic acid, phthalic anhydride, tetrahydro Phthalic anhydride, hexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, succinic anhydride, chlorendic anhydride, trimellitic anhydride, pyromellitic anhydride, dimethyl orthophthalate, dimethyl isophthalate, dimethyl terephthalate And the like. These components can be used alone or in combination of two or more components.
不飽和ポリエステルは、上記のような原料を用いて公知の方法で合成することができる。この合成における各種条件は、使用する原料やその量に応じて適宜設定する必要があるが、一般的に、窒素ガスなどの不活性ガス気流中、140℃〜230℃の温度にて加圧又は減圧下でエステル化させればよい。このエステル化反応では、必要に応じてエステル化触媒を使用することができる。触媒の例としては、酢酸マンガン、ジブチル錫オキサイド、シュウ酸第一錫、酢酸亜鉛、及び酢酸コバルトなどの公知の触媒が挙げられる。これらの触媒は、単独の成分又は2種以上の成分を組み合わせて用いることができる。 Unsaturated polyester is compoundable by a well-known method using the above raw materials. Various conditions in this synthesis need to be set as appropriate according to the raw materials to be used and the amount thereof, but are generally pressurized or heated at a temperature of 140 ° C. to 230 ° C. in an inert gas stream such as nitrogen gas. What is necessary is just to esterify under reduced pressure. In this esterification reaction, an esterification catalyst can be used as needed. Examples of the catalyst include known catalysts such as manganese acetate, dibutyltin oxide, stannous oxalate, zinc acetate, and cobalt acetate. These catalysts can be used alone or in combination of two or more components.
不飽和ポリエステルの重量平均分子量(MW)は、特に限定されないが、好ましくは3,000〜50,000、より好ましくは5,000〜30,000である。なお、本明細書において「重量平均分子量」とは、ゲルパーミエーションクロマトグラフィー(昭和電工株式会社製Shodex GPC−101)を用いて下記条件にて常温(23℃)で測定し、標準ポリスチレン検量線を用いて求めた値のことを意味する。
カラム:昭和電工製LF−804
カラム温度:40℃
試料:共重合体の0.2質量%テトラヒドロフラン溶液
流量:1mL/分
溶離液:テトラヒドロフラン
検出器:RI−71SAlthough the weight average molecular weight (MW) of unsaturated polyester is not specifically limited, Preferably it is 3,000-50,000, More preferably, it is 5,000-30,000. In this specification, the “weight average molecular weight” is measured at normal temperature (23 ° C.) under the following conditions using gel permeation chromatography (Shodex GPC-101, Showa Denko KK), and is a standard polystyrene calibration curve. It means the value obtained using.
Column: Showa Denko LF-804
Column temperature: 40 ° C
Sample: 0.2% by mass tetrahydrofuran solution of copolymer Flow rate: 1 mL / min Eluent: Tetrahydrofuran Detector: RI-71S
(a)不飽和ポリエステル樹脂に用いられる架橋剤としては、不飽和ポリエステルと重合可能なエチレン性二重結合を有しているものであれば特に限定されず、当該技術分野において公知のものを用いることができる。架橋剤の例としては、スチレンモノマー、ジアリルフタレートモノマー、ジアリルフタレートプレポリマー、メタクリル酸メチル、トリアリルイソシアヌレート等が挙げられる。単独の成分又は2種以上の成分を組み合わせて用いることができる。
(a)不飽和ポリエステル樹脂における架橋剤の配合量は、特に限定されないが、作業性、重合性、成形体の収縮性及び量調整の自由度の観点から、好ましくは25質量%〜85質量%、より好ましくは30質量%〜80質量%、最も好ましくは40質量%〜70質量%である。
なお、本発明の不飽和ポリエステル樹脂組成物に特定の特性を付与する観点から、本発明の効果を阻害しない範囲において、(a)不飽和ポリエステル樹脂の一部をビニルエステル樹脂としてもよい。(A) The crosslinking agent used in the unsaturated polyester resin is not particularly limited as long as it has an ethylenic double bond polymerizable with the unsaturated polyester, and those known in the technical field are used. be able to. Examples of the crosslinking agent include styrene monomer, diallyl phthalate monomer, diallyl phthalate prepolymer, methyl methacrylate, triallyl isocyanurate and the like. A single component or a combination of two or more components can be used.
(A) Although the compounding quantity of the crosslinking agent in unsaturated polyester resin is not specifically limited, From a viewpoint of workability | operativity, polymerizability, the shrinkability of a molded object, and the freedom degree of quantity adjustment, Preferably it is 25 mass%-85 mass%. More preferably, it is 30 mass%-80 mass%, Most preferably, it is 40 mass%-70 mass%.
In addition, from the viewpoint of imparting specific characteristics to the unsaturated polyester resin composition of the present invention, a part of the unsaturated polyester resin (a) may be a vinyl ester resin as long as the effects of the present invention are not impaired.
本発明の不飽和ポリエステル樹脂組成物に用いられる(b)アクリル樹脂としては、特に限定されず、当該技術分野において公知のものを用いることができる。その中でも本発明において好ましい(b)アクリル樹脂は、アクリルモノマーを主成分とする単独重合体又は共重合体である。アクリルモノマーの例としては、メチルアクリレート、n−ブチルアクリレート、エチルアクリレート、プロピルアクリレート、ブチルアクリレート、2−エチル−ヘキシルアクリレートなどのアクリル酸エステル類;メチルメタアクリレート、エチルメタアクリレート、プロピルメタアクリレート、ブチルメタアクリレートなどのメタクリル酸エステル類などが挙げられる。 The (b) acrylic resin used in the unsaturated polyester resin composition of the present invention is not particularly limited, and those known in the technical field can be used. Among them, the (b) acrylic resin preferable in the present invention is a homopolymer or copolymer having an acrylic monomer as a main component. Examples of acrylic monomers include acrylic acid esters such as methyl acrylate, n-butyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethyl-hexyl acrylate; methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl And methacrylates such as methacrylate.
(b)アクリル樹脂は、アクリルモノマーを重合させることによって製造することができる。重合条件は、特に限定されず、使用するアクリルモノマーの種類及びその量に応じて適宜設定すればよい。
また、(b)アクリル樹脂として、市販品を用いることもできる。市販品の例としては、東亞合成株式会社製の「ARUFON(商標)シリーズ」、三菱レイヨン株式会社製の「ダイヤナール(商標)シリーズ」、旭化成ケミカルズ株式会社製の「デルペット(商標)シリーズ」などが挙げられる。具体的には、東亞合成株式会社製のARUFON(商標)UH−3910、UC−3920、三菱レイヨン株式会社製のダイヤナール(商標)BR−50、BR−52、BR−60、BR−73、BR−77、BR−83、BR−96、BR−113、MB−2389、MB−7033、BR−2389、積水化学工業株式会社製のテクノポリマーMB、日本ゼオン株式会社製のF320、旭化成ケミカルズ株式会社製のデルペット(商標)560F、60N及び80NBなどを用いることができる。(B) The acrylic resin can be produced by polymerizing an acrylic monomer. The polymerization conditions are not particularly limited, and may be set as appropriate according to the type and amount of the acrylic monomer used.
Moreover, a commercial item can also be used as (b) acrylic resin. Examples of commercially available products include “ARUFON (trademark) series” manufactured by Toagosei Co., Ltd., “Dianar (trademark) series” manufactured by Mitsubishi Rayon Co., Ltd., and “Delpet (trademark) series” manufactured by Asahi Kasei Chemicals Corporation. Etc. Specifically, ARUFON (trademark) UH-3910, UC-3920, manufactured by Toagosei Co., Ltd., Dialnal (trademark) BR-50, BR-52, BR-60, BR-73, manufactured by Mitsubishi Rayon Co., Ltd., BR-77, BR-83, BR-96, BR-113, MB-2389, MB-7033, BR-2389, Techno Polymer MB manufactured by Sekisui Chemical Co., Ltd., F320 manufactured by Nippon Zeon Co., Ltd., Asahi Kasei Chemicals Corporation Delpet (trademark) 560F, 60N, and 80NB manufactured by the company can be used.
(b)アクリル樹脂の重量平均分子量(MW)は、特に限定されないが、好ましくは3,000〜1,000,000、より好ましくは10,000〜500,000である。
また、(b)アクリル樹脂は、単独の成分又は2種以上の成分を組み合わせて用いることができる。(B) Although the weight average molecular weight (MW) of an acrylic resin is not specifically limited, Preferably it is 3,000-1,000,000, More preferably, it is 10,000-500,000.
Moreover, (b) acrylic resin can be used combining a single component or 2 or more types of components.
本発明の不飽和ポリエステル樹脂組成物に用いられる(c)スチレン−ジエン共重合体としては、特に限定されず、当該技術分野において公知のものを用いることができる。その中でも本発明において好ましい(c)スチレン−ジエン共重合体は、成形収縮率の観点から、ハードセグメントとしてポリスチレン及びソフトセグメントとしてポリブタジエンを有するSBS系熱可塑性エラストマー、又はハードセグメントとしてポリスチレン及びソフトセグメントとしてポリイソプレンを有するSIS系熱可塑性エラストマーである。
(c)スチレン−ジエン共重合体を構成する繰り返し単位(ポリスチレン部分及びジエンポリマー部分)の配列様式は、特に限定されず、リニアタイプ及びラジアルタイプのいずれであってもよい。
(c)スチレン−ジエン共重合体におけるポリスチレン部分とジエンポリマー部分との割合は、特に限定されないが、ポリスチレン部分が全体の10質量%〜50質量%であることが好ましい。ポリスチレン部分の割合が10質量%未満又は50質量%を超えると、所望の成形収縮率を有する硬化物が得られないことがある。The (c) styrene-diene copolymer used in the unsaturated polyester resin composition of the present invention is not particularly limited, and those known in the technical field can be used. Among them, the (c) styrene-diene copolymer preferable in the present invention is an SBS thermoplastic elastomer having polystyrene as a hard segment and polybutadiene as a soft segment, or polystyrene and a soft segment as a hard segment, from the viewpoint of molding shrinkage. It is a SIS thermoplastic elastomer having polyisoprene.
(C) The arrangement pattern of the repeating units (polystyrene part and diene polymer part) constituting the styrene-diene copolymer is not particularly limited, and may be either a linear type or a radial type.
(C) Although the ratio of the polystyrene part and diene polymer part in a styrene-diene copolymer is not specifically limited, It is preferable that a polystyrene part is 10 mass%-50 mass% of the whole. When the ratio of the polystyrene part is less than 10% by mass or more than 50% by mass, a cured product having a desired molding shrinkage rate may not be obtained.
上記のような特徴を有する(c)スチレン−ジエン共重合体は市販されている。市販品の例としては、旭化成ケミカルズ株式会社製の「タフプレン(商標)シリーズ」及び「アサプレン(商標)シリーズ」、JSR株式会社製の「JSR SISシリーズ」、日本ゼオン株式会社製の「Nipol(商標)シリーズ」などが挙げられる。具体的には、旭化成ケミカルズ株式会社製のタフプレン(商標)A、125、126S、T−411、T−432、T−437、T−438、T−439、JSR株式会社製のJSR SIS5002、SIS5200、SIS5250、SIS5405、SIS5505、日本ゼオン株式会社製のNipol(商標)1502、1723及び1739などを用いることができる。 (C) Styrene-diene copolymers having the above-described characteristics are commercially available. Examples of commercially available products include “Tufprene (trademark) series” and “Asaprene (trademark) series” manufactured by Asahi Kasei Chemicals Corporation, “JSR SIS series” manufactured by JSR Corporation, and “Nipol (trademark) manufactured by Nippon Zeon Corporation. ) Series ”. Specifically, TUFPRENE (trademark) A, 125, 126S, T-411, T-432, T-437, T-438, T-439 manufactured by Asahi Kasei Chemicals Corporation, JSR SIS5002, SIS5200 manufactured by JSR Corporation. , SIS5250, SIS5405, SIS5505, Nipol (trademark) 1502, 1723 and 1739 manufactured by ZEON CORPORATION can be used.
(c)スチレン−ジエン共重合体の重量平均分子量(MW)は、特に限定されないが、好ましくは10,000〜1,000,000、より好ましくは100,000〜800,000である。
また、(c)スチレン−ジエン共重合体は、単独の成分又は2種以上の成分を組み合わせて用いることができる。(C) Although the weight average molecular weight (MW) of a styrene-diene copolymer is not specifically limited, Preferably it is 10,000-1,000,000, More preferably, it is 100,000-800,000.
Moreover, (c) a styrene-diene copolymer can be used in combination of a single component or two or more components.
本発明の不飽和ポリエステル樹脂組成物における(b)アクリル樹脂及び(c)スチレン−ジエン共重合体の配合割合は、(a)不飽和ポリエステル樹脂100質量部に対して、(b)アクリル樹脂及び(c)スチレン−ジエン共重合体の合計が10質量部〜20質量部、好ましくは11質量部〜19質量部、より好ましくは12質量部〜18質量部である。(b)アクリル樹脂及び(c)スチレン−ジエン共重合体の合計が10質量部未満であると、成形収縮率が低下する。一方、(b)アクリル樹脂及び(c)スチレン−ジエン共重合体の合計が20質量部を超えると、成形時の流動性及び硬化物の耐熱性が低下する。 The blending ratio of (b) acrylic resin and (c) styrene-diene copolymer in the unsaturated polyester resin composition of the present invention is (b) acrylic resin and 100 parts by mass of unsaturated polyester resin. (C) The total of the styrene-diene copolymer is 10 to 20 parts by mass, preferably 11 to 19 parts by mass, more preferably 12 to 18 parts by mass. When the total of (b) the acrylic resin and (c) the styrene-diene copolymer is less than 10 parts by mass, the molding shrinkage decreases. On the other hand, when the sum total of (b) acrylic resin and (c) styrene-diene copolymer exceeds 20 mass parts, the fluidity | liquidity at the time of shaping | molding and the heat resistance of hardened | cured material will fall.
本発明の不飽和ポリエステル樹脂組成物における(b)アクリル樹脂と(c)スチレン−ジエン共重合体との割合は、1:2〜2:1、好ましくは1:1.8〜1.8:1、より好ましくは1:1.5〜1.5:1である。(c)スチレン−ジエン共重合体に対する(b)アクリル樹脂の割合が高過ぎると、成形時の流動性及び成形収縮率が低下する。一方、(b)アクリル樹脂に対する(c)スチレン−ジエン共重合体の割合が高過ぎると、硬化物の耐熱性が低下する。 The ratio of (b) acrylic resin and (c) styrene-diene copolymer in the unsaturated polyester resin composition of the present invention is 1: 2 to 2: 1, preferably 1: 1.8 to 1.8: 1, more preferably 1: 1.5 to 1.5: 1. (C) When the ratio of the (b) acrylic resin with respect to the styrene-diene copolymer is too high, the fluidity and molding shrinkage during molding are lowered. On the other hand, if the ratio of (c) styrene-diene copolymer to (b) acrylic resin is too high, the heat resistance of the cured product is lowered.
本発明の不飽和ポリエステル樹脂組成物に用いられる(d)繊維長が5mm以下のガラス繊維としては、特に限定されず、当該技術分野において公知のものを用いることができる。ガラス繊維の例としては、ガラスチョップドストランド、ミルドガラスファイバーなどが挙げられる。ガラス繊維の繊維長が5mmを超えると、成形時の流動性が低下する。ガラス繊維の繊維長は、好ましくは3mm以下、より好ましくは1.5mm以下である。また、ガラス繊維の繊維径は、好ましくは3μm〜25μmである。 The glass fiber having a fiber length of 5 mm or less used in the unsaturated polyester resin composition of the present invention is not particularly limited, and those known in the technical field can be used. Examples of glass fibers include glass chopped strands and milled glass fibers. When the fiber length of glass fiber exceeds 5 mm, the fluidity at the time of shaping | molding will fall. The fiber length of the glass fiber is preferably 3 mm or less, more preferably 1.5 mm or less. The fiber diameter of the glass fiber is preferably 3 μm to 25 μm.
本発明の不飽和ポリエステル樹脂組成物における(d)繊維長が5mm以下のガラス繊維の配合割合は、(a)不飽和ポリエステル樹脂100質量部に対して30質量部〜55質量部、好ましくは32質量部〜53質量部、より好ましくは35質量部〜50質量部である。(d)繊維長が5mm以下のガラス繊維の配合割合が30質量部未満であると、硬化物の耐熱性が低下する。一方、d)繊維長が5mm以下のガラス繊維の配合割合が55質量部を超えると、成形時の流動性が低下する。 In the unsaturated polyester resin composition of the present invention, the blending ratio of (d) glass fiber having a fiber length of 5 mm or less is 30 to 55 parts by mass, preferably 32 to 100 parts by mass of (a) unsaturated polyester resin. It is 35 mass parts-53 mass parts, More preferably, it is 35 mass parts-50 mass parts. (D) The heat resistance of hardened | cured material falls that the mixture ratio of glass fiber whose fiber length is 5 mm or less is less than 30 mass parts. On the other hand, d) When the blending ratio of the glass fiber having a fiber length of 5 mm or less exceeds 55 parts by mass, the fluidity at the time of molding is lowered.
本発明の不飽和ポリエステル樹脂組成物に用いられる(e)無機充填材としては、特に限定されず、当該技術分野において公知のものを用いることができる。本発明において好ましい(e)無機充填材は、耐熱性の低下の原因となる水酸化アルミニウム以外の無機充填材である。(e)無機充填材の例としては、炭酸カルシウム、球状又は不定形アルミナ、酸化マグネシウム、酸化ベリリウム、窒化アルミニウム、窒化ホウ素、窒化チタン、炭化ホウ素、炭化チタン、ホウ化チタン、クレー、マイカなどが挙げられる。これらは、単独の成分又は2種以上の成分を組み合わせて用いることができる。また、これらの中でも、成形時の流動性及び硬化物の耐熱性の観点から、炭酸カルシウムが好ましい。 The inorganic filler (e) used in the unsaturated polyester resin composition of the present invention is not particularly limited, and those known in the technical field can be used. In the present invention, the preferred (e) inorganic filler is an inorganic filler other than aluminum hydroxide that causes a decrease in heat resistance. (E) Examples of inorganic fillers include calcium carbonate, spherical or amorphous alumina, magnesium oxide, beryllium oxide, aluminum nitride, boron nitride, titanium nitride, boron carbide, titanium carbide, titanium boride, clay, mica, etc. Can be mentioned. These can be used alone or in combination of two or more components. Of these, calcium carbonate is preferred from the viewpoint of fluidity during molding and heat resistance of the cured product.
(e)無機充填材の平均粒子径は、特に限定されないが、成形時の流動性の観点から、好ましくは0.5μm〜30μm、より好ましくは1μm〜20μmである。ここで、本明細書において「平均粒子径」とは、レーザー回折・散乱法、コールターカウンター法などにより測定される平均粒子径を意味するが、レーザー回折・散乱法により測定される平均粒子径であることが好ましい。また、レーザー回折・散乱法、コールターカウンター法などにより測定される平均粒子径とは、これらの方法によって得られた粒度分布(数分布)における積算値50%での粒子径を意味する。 (E) Although the average particle diameter of an inorganic filler is not specifically limited, From a fluid viewpoint at the time of shaping | molding, Preferably it is 0.5 micrometer-30 micrometers, More preferably, it is 1 micrometer-20 micrometers. Here, the “average particle diameter” in this specification means an average particle diameter measured by a laser diffraction / scattering method, a Coulter counter method, etc., but is an average particle diameter measured by a laser diffraction / scattering method. Preferably there is. The average particle size measured by the laser diffraction / scattering method, the Coulter counter method, or the like means the particle size at an integrated value of 50% in the particle size distribution (number distribution) obtained by these methods.
本発明の不飽和ポリエステル樹脂組成物における(e)無機充填材の配合割合は、成形時の流動性と硬化物の耐熱性とを両立させる観点から、(a)不飽和ポリエステル樹脂100質量部に対して300質量部〜550質量部、好ましくは330質量部〜420質量部、より好ましくは350質量部〜450質量部である。(e)無機充填材の配合割合が300質量部未満であると、硬化物の耐熱性が低下する。一方、(e)無機充填材の配合割合が550質量部を超えると、成形時の流動性が低下する。
The blending ratio of the (e) inorganic filler in the unsaturated polyester resin composition of the present invention is (a) 100 parts by weight of the unsaturated polyester resin from the viewpoint of achieving both the fluidity during molding and the heat resistance of the cured product. On the other hand, it is 300 to 550 parts by mass, preferably 330 to 420 parts by mass, more preferably 350 to 450 parts by mass. (E) If the proportion of the inorganic filler is less than 3 0 0 parts by weight, heat resistance of the cured product is reduced. On the other hand, if the blending ratio of (e) the inorganic filler exceeds 550 parts by mass, the fluidity at the time of molding is lowered.
本発明の不飽和ポリエステル樹脂組成物は、本発明の効果を阻害しない範囲において、各種物性を改良する観点から、硬化剤、離型剤、増粘剤、顔料などの任意成分を必要に応じて含有することができる。
硬化剤としては、特に限定されず、当該技術分野において公知の熱重合開始剤を用いることができる。硬化剤の例としては、t−ブチルパーオキシオクトエート、ベンゾイルパーオキサイド、1,1,−ジ−t−ブチルパーオキシ−3,3,5−トリメチルシクロヘキサン、t−ブチルパーオキシイソプロピルカーボネート、t−ブチルパーオキシベンゾエート、ジクミルパーオキサイド、ジ−t−ブチルパーオキサイドなどの過酸化物が挙げられる。これらの成分は、単独の成分又は2種以上の成分を組み合わせて用いることができる。From the viewpoint of improving various physical properties, the unsaturated polyester resin composition of the present invention contains optional components such as a curing agent, a mold release agent, a thickener, and a pigment as necessary. Can be contained.
It does not specifically limit as a hardening | curing agent, A well-known thermal polymerization initiator can be used in the said technical field. Examples of curing agents include t-butyl peroxy octoate, benzoyl peroxide, 1,1, -di-t-butyl peroxy-3,3,5-trimethylcyclohexane, t-butyl peroxyisopropyl carbonate, t -Peroxides such as butyl peroxybenzoate, dicumyl peroxide, and di-t-butyl peroxide. These components can be used alone or in combination of two or more components.
本発明の不飽和ポリエステル樹脂組成物における硬化剤の配合割合は、特に限定されないが、(a)不飽和ポリエステル樹脂100質量部に対して好ましくは0.1質量部〜10質量部、より好ましくは2質量部〜6質量部である。硬化剤の配合量が0.1質量部未満であると、硬化時間が長くなるか、又は十分に硬化しないことがある。一方、硬化剤の配合量が10質量部を超えると、貯蔵安定性が低下してしまうことがある。 The blending ratio of the curing agent in the unsaturated polyester resin composition of the present invention is not particularly limited, but (a) is preferably 0.1 parts by mass to 10 parts by mass, more preferably 100 parts by mass of the unsaturated polyester resin. 2 parts by mass to 6 parts by mass. When the blending amount of the curing agent is less than 0.1 parts by mass, the curing time may be long or may not be sufficiently cured. On the other hand, when the compounding quantity of a hardening | curing agent exceeds 10 mass parts, storage stability may fall.
離型剤としては、特に限定されず、当該技術分野において公知のものを用いることができる。離型剤の例としては、ステアリン酸、ステアリン酸亜鉛、ステアリン酸カルシウム、ステアリン酸アルミニウム、ステアリン酸マグネシウム、カルナバワックスなどが挙げられる。これらの成分は、単独の成分又は2種以上の成分を組み合わせて用いることができる。
本発明の不飽和ポリエステル樹脂組成物における離型剤の配合割合は、特に限定されず、使用する離型剤の種類に応じて、本発明の効果を阻害しない範囲で適宜調整すればよい。The release agent is not particularly limited, and those known in the technical field can be used. Examples of the mold release agent include stearic acid, zinc stearate, calcium stearate, aluminum stearate, magnesium stearate, carnauba wax and the like. These components can be used alone or in combination of two or more components.
The blending ratio of the release agent in the unsaturated polyester resin composition of the present invention is not particularly limited, and may be appropriately adjusted within a range that does not impair the effects of the present invention, depending on the type of the release agent used.
増粘剤としては、特に限定されず、当該技術分野において公知のものを用いることができる。増粘剤の例としては、水酸化マグネシウム、水酸化カルシウム、酸化カルシウム、イソシアネート化合物などが挙げられる。これらの成分は、単独の成分又は2種以上の成分を組み合わせて用いることができる。
本発明の不飽和ポリエステル樹脂組成物における増粘剤の配合割合は、特に限定されず、使用する増粘剤の種類に応じて、本発明の効果を阻害しない範囲で適宜調整すればよい。The thickener is not particularly limited, and those known in the technical field can be used. Examples of thickeners include magnesium hydroxide, calcium hydroxide, calcium oxide, isocyanate compounds and the like. These components can be used alone or in combination of two or more components.
The blending ratio of the thickener in the unsaturated polyester resin composition of the present invention is not particularly limited, and may be appropriately adjusted within a range that does not impair the effects of the present invention, depending on the type of the thickener used.
本発明の不飽和ポリエステル樹脂組成物は、上記のような所定量の各成分を、常法により配合・混練することにより製造することができる。例えば、所定量の各成分をニーダ等に投入して混合することにより不飽和ポリエステル樹脂組成物を得ることができる。また、均質な不飽和ポリエステル樹脂組成物を製造する観点からは、(d)繊維長が5mm以下のガラス繊維を除いた各成分を双碗型ニーダにて混練した後、(d)繊維長が5mm以下のガラス繊維を加えて更に混練することが好ましい。
上記のようにして得られる本発明の不飽和ポリエステル樹脂組成物は、成形時の流動性が高いと共に、成形収縮率が小さく且つ耐熱性に優れた硬化物を与えることができるため、各種用途において用いることができる。その中でも、本発明の不飽和ポリエステル樹脂組成物は、電気・電子部品、特に、コイル、回転子、固定子、軸受などのモータ構成部品の封入材料に最適である。本発明の不飽和ポリエステル樹脂組成物でモータ構成部品を封入硬化することにより、堅固に封入硬化された封入モータを得ることができる。The unsaturated polyester resin composition of the present invention can be produced by blending and kneading the above-mentioned predetermined amounts of each component by a conventional method. For example, an unsaturated polyester resin composition can be obtained by adding a predetermined amount of each component to a kneader and mixing them. Moreover, from the viewpoint of producing a homogeneous unsaturated polyester resin composition, (d) after kneading each component excluding glass fibers having a fiber length of 5 mm or less with a double-type kneader, (d) the fiber length is It is preferable to add a glass fiber of 5 mm or less and further knead.
The unsaturated polyester resin composition of the present invention obtained as described above has high fluidity at the time of molding, and can give a cured product having a small molding shrinkage ratio and excellent heat resistance. Can be used. Among them, the unsaturated polyester resin composition of the present invention is most suitable as an encapsulating material for electric / electronic parts, particularly motor components such as coils, rotors, stators and bearings. By encapsulating and curing the motor component with the unsaturated polyester resin composition of the present invention, it is possible to obtain an encapsulated motor that is firmly encapsulated and cured.
本発明の不飽和ポリエステル樹脂組成物を電気・電子部品の封入材料として用いる場合、電気・電子部品の封入方法は、特に限定されず、当該技術分野において公知の方法を用いることができる。例えば、本発明の不飽和ポリエステル樹脂組成物で電気・電子部品を封入成形した後、本発明の不飽和ポリエステル樹脂組成物を硬化させればよい。封入成形は、電気・電子部品が収容された型内に、圧縮成形、トランスファー成形、射出成形などの各種成形方法によって本発明の不飽和ポリエステル樹脂組成物を導入して成形すればよい。また、本発明の不飽和ポリエステル樹脂組成物の硬化は、所定の温度に加熱することによって行うことができる。硬化条件は、本発明の不飽和ポリエステル樹脂組成物に用いる成分の種類に応じて適宜設定すればよいが、一般的に、硬化温度が110℃〜180℃、硬化時間が1分〜30分、成形圧力が2MPa〜10MPaである。 When the unsaturated polyester resin composition of the present invention is used as an encapsulating material for electric / electronic parts, the method for enclosing the electric / electronic parts is not particularly limited, and methods known in the art can be used. For example, after the electrical / electronic component is encapsulated with the unsaturated polyester resin composition of the present invention, the unsaturated polyester resin composition of the present invention may be cured. Encapsulation molding may be performed by introducing the unsaturated polyester resin composition of the present invention into a mold containing electrical / electronic components by various molding methods such as compression molding, transfer molding, and injection molding. Moreover, hardening of the unsaturated polyester resin composition of this invention can be performed by heating to predetermined temperature. Curing conditions may be appropriately set according to the type of components used in the unsaturated polyester resin composition of the present invention, but generally, the curing temperature is 110 ° C. to 180 ° C., the curing time is 1 minute to 30 minutes, The molding pressure is 2 MPa to 10 MPa.
以下、実施例及び比較例により本発明を詳細に説明するが、これらによって本発明が限定されるものではない。
下記の実施例及び比較例で作製した不飽和ポリエステル樹脂組成物及びその硬化物における各種物性は、次のようにして評価した。EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention in detail, this invention is not limited by these.
Various physical properties of the unsaturated polyester resin composition and its cured product prepared in the following examples and comparative examples were evaluated as follows.
(1)成形収縮率
JIS K6911に規定される収縮円盤を、成形温度150℃、成形圧力10MPa、成形時間3分で圧縮成形を行うことによって作製し、JIS K6911に準じて成形収縮率を算出した。
ここで、成形収縮率は、電気・電子部品の形状及び過酷な環境下での使用などを考慮すると、−0.03%〜0.03%の範囲であることが望ましい。(1) Molding Shrinkage A shrinkage disk defined in JIS K6911 was produced by compression molding at a molding temperature of 150 ° C., a molding pressure of 10 MPa, and a molding time of 3 minutes, and the molding shrinkage was calculated according to JIS K6911. .
Here, it is desirable that the molding shrinkage is in the range of -0.03% to 0.03% in consideration of the shape of the electric / electronic component and use under a harsh environment.
(2)耐熱性
耐熱性は、加熱処理前の硬化物の曲げ強度に対する加熱処理後の硬化物の曲げ強度の保持率(以下、「強度保持率」と略す。)によって評価した。
曲げ強度は、成形温度140℃、成形圧力10MPa、成形時間3分で圧縮成形を行うことによって試験片(80mm×10mm×4mm)を作製し、JIS K6911に準じて曲げ強度を測定した。
試験片の加熱処理は、乾燥機において、210℃で1000時間加熱することによって行った。
ここで、強度保持率は、過酷な環境下での使用を考慮すると、70%以上であることが望ましい。(2) Heat resistance The heat resistance was evaluated by the retention rate of the bending strength of the cured product after the heat treatment relative to the bending strength of the cured product before the heat treatment (hereinafter abbreviated as “strength retention rate”).
For the bending strength, a test piece (80 mm × 10 mm × 4 mm) was produced by compression molding at a molding temperature of 140 ° C., a molding pressure of 10 MPa, and a molding time of 3 minutes, and the bending strength was measured according to JIS K6911.
The heat treatment of the test piece was performed by heating at 210 ° C. for 1000 hours in a dryer.
Here, the strength retention is desirably 70% or more in consideration of use in a harsh environment.
(3)流動性
台形断面の渦巻き曲線状の溝(溝幅:上底6mm、下底8mm、厚み2mm、長さ120cm)が設けられたスパイラルフロー試験用金型を70tトランスファー成形機に取り付け、成形温度(金型温度)140℃、注入圧力5MPa、硬化時間130秒、注入量50gの条件で不飽和ポリエステル樹脂組成物を注入し、スパイラルフロー長さ(SF値)を測定した。
ここで、SF値は、電気・電子部品の形状を考慮すると、70cm以上であることが望ましい。(3) Fluidity A spiral flow test mold provided with a spiral curved groove having a trapezoidal cross section (groove width: upper base 6 mm, lower base 8 mm, thickness 2 mm, length 120 cm) is attached to a 70 t transfer molding machine. The unsaturated polyester resin composition was injected under the conditions of molding temperature (mold temperature) 140 ° C., injection pressure 5 MPa, curing time 130 seconds, injection amount 50 g, and the spiral flow length (SF value) was measured.
Here, the SF value is desirably 70 cm or more in consideration of the shape of the electric / electronic component.
(4)総合評価
上記(1)〜(3)の評価において、上記の全ての評価基準を達成したものを○、いずれかの評価基準を達成できなかったものを×として表した。(4) Comprehensive evaluation In evaluation of said (1)-(3), what achieved said evaluation criteria was represented as (circle), and what failed to achieve any evaluation criteria was represented as x.
<(a)不飽和ポリエステル樹脂の合成>
温度計、攪拌機、窒素ガス導入管及び還流冷却器を備えた四口フラスコに、100モルのフマル酸、80モルのプロピレングリコール及び20モルの水素化ビスフェノールAを入れ、窒素気流下で加熱撹拌しながら200℃まで昇温して、常法に従いエステル化反応を行なうことによって不飽和ポリエステルを得た。その後、不飽和ポリエステルにスチレンモノマーを添加して不飽和ポリエステル樹脂を得た。ここで、スチレンモノマーは、不飽和ポリエステル樹脂中で50質量%となるように添加した。また、不飽和ポリエステルの重量平均分子量(MW)を上記の条件にて測定したところ、12,000であった。<Synthesis of (a) unsaturated polyester resin>
In a four-necked flask equipped with a thermometer, stirrer, nitrogen gas inlet tube and reflux condenser, 100 moles of fumaric acid, 80 moles of propylene glycol and 20 moles of hydrogenated bisphenol A are placed and heated and stirred under a nitrogen stream. While raising the temperature to 200 ° C., an unsaturated polyester was obtained by carrying out an esterification reaction according to a conventional method. Thereafter, a styrene monomer was added to the unsaturated polyester to obtain an unsaturated polyester resin. Here, the styrene monomer was added so that it might become 50 mass% in unsaturated polyester resin. Moreover, it was 12,000 when the weight average molecular weight (MW) of unsaturated polyester was measured on said conditions.
<その他の成分>
(b)アクリル樹脂には、三菱レイヨン社製ダイヤナール(商標)BR−77(MW:65,000)を用いた。
(c)スチレン−ジエン共重合体には、ハードセグメントとしてポリスチレン及びソフトセグメントとしてポリブタジエンを有するSBS系熱可塑性エラストマー(旭化成ケミカルズ株式会社製アサプレン(商標)T−411、MW:430,000、SBS系熱可塑性エラストマー中のポリスチレン部分の割合30質量%)を用いた。
(d)ガラス繊維には、繊維径が13μm、繊維長が3mm、6mm又は9mmのガラスチョップドストランドを用いた。
(e)無機充填材には、炭酸カルシウム(平均粒子径1.9μm)又はアルミナ(平均粒子径0.9μm)を用いた。<Other ingredients>
(B) Dianal (trademark) BR-77 (MW: 65,000) manufactured by Mitsubishi Rayon Co., Ltd. was used as the acrylic resin.
(C) The styrene-diene copolymer includes an SBS thermoplastic elastomer having polystyrene as a hard segment and polybutadiene as a soft segment (Asaprene (trademark) T-411 manufactured by Asahi Kasei Chemicals Corporation, MW: 430,000, SBS system). The proportion of polystyrene part in the thermoplastic elastomer was 30% by mass).
(D) A glass chopped strand having a fiber diameter of 13 μm and a fiber length of 3 mm, 6 mm, or 9 mm was used as the glass fiber.
(E) As the inorganic filler, calcium carbonate (average particle size 1.9 μm) or alumina (average particle size 0.9 μm) was used.
<実施例1〜6及び比較例1〜12の不飽和ポリエステル樹脂組成物の調製>
表1に示す配合割合で上記の各成分を仕込み、双碗型ニーダを用いて混練することによって不飽和ポリエステル樹脂組成物を得た。なお、表1の配合割合の単位は、質量部である。また、使用した不飽和ポリエステル樹脂中のスチレンモノマーの含有量は50質量%である。
このようにして得られた不飽和ポリエステル樹脂組成物について、上記(1)〜(4)の評価を行った。その結果を表1及び2に示す。<Preparation of unsaturated polyester resin compositions of Examples 1 to 6 and Comparative Examples 1 to 12>
Each of the above components was charged at a blending ratio shown in Table 1, and kneaded using a double-type kneader to obtain an unsaturated polyester resin composition. In addition, the unit of the mixture ratio of Table 1 is a mass part. Moreover, content of the styrene monomer in the used unsaturated polyester resin is 50 mass%.
The unsaturated polyester resin composition thus obtained was evaluated in the above (1) to (4). The results are shown in Tables 1 and 2.
表1に示されているように、実施例1〜6の不飽和ポリエステル樹脂組成物は、成形収縮率が小さいと共に強度保持率及びSF値が大きく、良好な総合評価を得ることができた。
これに対して、表2に示されているように、比較例1の不飽和ポリエステル樹脂組成物は、(b)成分及び(c)成分の合計量が少なすぎたため、成形収縮率が大きくなった。比較例2の不飽和ポリエステル樹脂組成物は、(d)成分の含有量が多すぎたため、SF値が小さくなった。比較例3の不飽和ポリエステル樹脂組成物は、(b)成分と(c)成分との質量比が所定の範囲になかったため、成形収縮率が大きくなった。比較例4の不飽和ポリエステル樹脂組成物は、(d)成分の含有量が少なすぎたため、強度保持率が小さくなった。比較例5の不飽和ポリエステル樹脂組成物は、(e)成分の含有量が少なすぎたため、成形収縮率が大きくなると共に強度保持率が小さくなった。比較例6の不飽和ポリエステル樹脂組成物は、(b)成分及び(c)成分の合計量が多すぎたため、成形収縮率が大きくなると共に強度保持率及びSF値が小さくなった。比較例7の不飽和ポリエステル樹脂組成物は、(b)成分及び(c)成分の合計量が多すぎ、且つ(b)成分と(c)成分との質量比が所定の範囲になかったため、成形収縮率が大きくなると共に強度保持率及びSF値が小さくなった。比較例8の不飽和ポリエステル樹脂組成物は、(b)成分と(c)成分との質量比が所定の範囲になかったため、成形収縮率が大きくなると共に強度保持率が小さくなった。比較例9及び10の不飽和ポリエステル樹脂組成物は、(d)成分の繊維長が長すぎたため、SF値が小さくなった。比較例11の不飽和ポリエステル樹脂組成物は、(b)成分と(c)成分との質量比が所定の範囲になく、且つ(d)成分の繊維長が長すぎたため、SF値が小さくなった。比較例12の不飽和ポリエステル樹脂組成物は、(e)成分の含有量が多すぎたため、SF値が小さくなった。As shown in Table 1, the unsaturated polyester resin compositions of Examples 1 to 6 had a small molding shrinkage ratio and a large strength retention and SF value, and were able to obtain a good comprehensive evaluation.
On the other hand, as shown in Table 2, the unsaturated polyester resin composition of Comparative Example 1 had a large molding shrinkage because the total amount of the component (b) and the component (c) was too small. It was. Since the unsaturated polyester resin composition of Comparative Example 2 contained too much component (d), the SF value was small. The unsaturated polyester resin composition of Comparative Example 3 had a large molding shrinkage because the mass ratio of the component (b) to the component (c) was not within a predetermined range. The unsaturated polyester resin composition of Comparative Example 4 had a low strength retention because the content of the component (d) was too small. In the unsaturated polyester resin composition of Comparative Example 5, since the content of the component (e) was too small, the molding shrinkage ratio increased and the strength retention ratio decreased. In the unsaturated polyester resin composition of Comparative Example 6, since the total amount of the component (b) and the component (c) was too much, the molding shrinkage ratio was increased and the strength retention ratio and the SF value were decreased. In the unsaturated polyester resin composition of Comparative Example 7, the total amount of the component (b) and the component (c) was too large, and the mass ratio of the component (b) to the component (c) was not within a predetermined range. As the molding shrinkage ratio increased, the strength retention ratio and SF value decreased. In the unsaturated polyester resin composition of Comparative Example 8, since the mass ratio of the component (b) and the component (c) was not within a predetermined range, the molding shrinkage ratio increased and the strength retention ratio decreased. In the unsaturated polyester resin compositions of Comparative Examples 9 and 10, the SF value was small because the fiber length of the component (d) was too long. In the unsaturated polyester resin composition of Comparative Example 11, since the mass ratio of the component (b) and the component (c) is not within a predetermined range, and the fiber length of the component (d) is too long, the SF value becomes small. It was. Since the unsaturated polyester resin composition of Comparative Example 12 contained too much component (e), the SF value was small.
以上の結果からわかるように、本発明によれば、成形時の流動性が高いと共に、成形収縮率が小さく且つ耐熱性に優れた硬化物を与える不飽和ポリエステル樹脂組成物を提供することができる。また、このような特徴を有する不飽和ポリエステル樹脂組成物でモータ構成部品を封入硬化することにより、モータ構成部品が堅固に封入された封入モータを提供することができる。 As can be seen from the above results, according to the present invention, it is possible to provide an unsaturated polyester resin composition that gives a cured product that has high fluidity during molding, a small molding shrinkage ratio, and excellent heat resistance. . Further, by encapsulating and curing the motor component with the unsaturated polyester resin composition having such characteristics, it is possible to provide an encapsulated motor in which the motor component is firmly encapsulated.
なお、本国際出願は、2014年10月20日に出願した日本国特許出願第2014−213739号に基づく優先権を主張するものであり、この日本国特許出願の全内容を本国際出願に援用する。 Note that this international application claims priority based on Japanese Patent Application No. 2014-213739 filed on October 20, 2014, and the entire contents of this Japanese patent application are incorporated herein by reference. To do.
Claims (6)
(a)成分100質量部に対して、(b)成分及び(c)成分の合計が10質量部〜20質量部、(d)成分が30質量部〜55質量部、及び(e)成分が300質量部〜550質量部であり、且つ(b)成分と(c)成分との質量比が1:2〜2:1であり、
前記(a)不飽和ポリエステル樹脂は不飽和ポリエステル及び架橋剤を含み、前記(a)不飽和ポリエステル樹脂における前記架橋剤の配合量は25質量%〜85質量%であり、
前記(e)無機充填材の平均粒子径は0.5μm〜30μmである
ことを特徴とする不飽和ポリエステル樹脂組成物。 (A) unsaturated polyester resin, (b) acrylic resin, (c) styrene-diene copolymer, (d) glass fiber having a fiber length of 5 mm or less, and (e) an unsaturated polyester resin composition containing an inorganic filler A thing,
(A) With respect to 100 parts by mass of the component, the total of the (b) component and the (c) component is 10 to 20 parts by mass, the (d) component is 30 to 55 parts by mass, and the (e) component is a 300 parts by weight to 550 parts by weight, and (b) weight ratio of the component and the component (c) is 1: 2 to 2: Ri 1 der,
The (a) unsaturated polyester resin contains an unsaturated polyester and a crosslinking agent, and the amount of the crosslinking agent in the (a) unsaturated polyester resin is 25% by mass to 85% by mass,
The unsaturated polyester resin composition according to (e), wherein the inorganic filler has an average particle size of 0.5 m to 30 m .
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