JP6544058B2 - Physical quantity sensor, electronic device and mobile - Google Patents

Physical quantity sensor, electronic device and mobile Download PDF

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JP6544058B2
JP6544058B2 JP2015114928A JP2015114928A JP6544058B2 JP 6544058 B2 JP6544058 B2 JP 6544058B2 JP 2015114928 A JP2015114928 A JP 2015114928A JP 2015114928 A JP2015114928 A JP 2015114928A JP 6544058 B2 JP6544058 B2 JP 6544058B2
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portion
electrode
fixed electrode
physical quantity
quantity sensor
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JP2016045190A (en
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田中 悟
悟 田中
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セイコーエプソン株式会社
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Priority claimed from US14/822,041 external-priority patent/US9810712B2/en
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Description

  The present invention relates to a physical quantity sensor, an electronic device, and a mobile body.

  BACKGROUND In recent years, physical quantity sensors that detect physical quantities such as acceleration have been developed using, for example, silicon MEMS (Micro Electro Mechanical Systems) technology.

  The physical quantity sensor includes a large plate portion and a small plate portion, and the movable electrode supported by the insulating layer so that these can swing like a seesaw, and the insulating layer facing the large plate portion There is known one having a fixed electrode to be provided and a fixed electrode to be provided on the insulating layer so as to face the small plate portion (for example, see Patent Document 1).

  In the physical quantity sensor described in Patent Document 1, when the structure (Si structure) including the movable electrode is anodically bonded to the glass substrate, the electrostatic force generated is large when the glass exposed surface facing the structure is large. Therefore, there is a problem that sticking (sticking) to a glass substrate of a structure occurs.

  In order to solve such a problem, an attempt has been made to provide a counter electrode (dummy electrode) having the same potential as the movable electrode to suppress sticking of the movable body to the substrate (for example, Patent Document 2) reference).

  However, in the physical quantity sensor of Patent Document 2, although the occurrence of sticking of the movable electrode can be reduced by the dummy electrode, a difference in capacitance (capacitance offset) between each fixed electrode and the movable electrode is generated. Depending on the variation, the yield may be deteriorated beyond the adjustment range of the IC (integrated circuit). Also, the capacitance offset affects the entire sensor (see, for example, Patent Document 3).

Unexamined-Japanese-Patent No. 2007-298405 JP, 2013-160554, A JP 2002-202320 A

  An object of the present invention is to provide a physical quantity sensor capable of preventing the occurrence of sticking and reducing a capacity offset, and an electronic device and a mobile including the physical quantity sensor.

  The present invention has been made to solve at least a part of the above-described problems, and can be realized as the following modes or application examples.

Application Example 1
The physical quantity sensor of this application example includes a substrate,
A support fixed to the substrate;
A movable portion connected to the support portion via a connection portion and capable of swinging with respect to the support portion;
And a fixed electrode disposed on the substrate so as to face the movable portion,
The movable portion includes a first mass portion provided on one side with respect to the connection portion, and a second mass portion provided on the other side and having a mass larger than the first mass portion.
The fixed electrode faces a first fixed electrode disposed facing the first mass portion, a second fixed electrode disposed facing the second mass portion, and the movable portion, and A dummy electrode disposed so as not to be in contact with the first fixed electrode and the second fixed electrode and having the same potential as the movable portion;
When the axial direction in which the movable part is swung is the Y-axis direction,
At least one of the width in the Y-axis direction of the dummy electrode arranged side by side with the first fixed electrode and the width in the Y-axis direction of the first fixed electrode is the width of the second fixed electrode. It is characterized in that it is larger than the width in the Y-axis direction.
Thereby, the occurrence of sticking can be prevented, and the capacity offset can be reduced.

Application Example 2
In the physical quantity sensor of this application example, it is preferable that the dummy electrode has a first portion disposed to face the first fixed electrode in the Y-axis direction.
This allows the capacitance offset to be easily reduced.

Application Example 3
In the physical quantity sensor of this application example, it is preferable that the first portion be provided in a pair so as to be located on both sides in the Y-axis direction of the first fixed electrode.
This allows the capacitance offset to be more easily reduced.

Application Example 4
In the physical quantity sensor according to the application example, the dummy electrode is a first dummy electrode provided between the first fixed electrode and the second fixed electrode, and the first dummy electrode of the first fixed electrode. A second dummy electrode provided on the opposite side, and a third dummy electrode provided on the side opposite to the first dummy electrode of the second fixed electrode;
Preferably, at least one of the first dummy electrode and the second dummy electrode has the first portion.
As a result, it is possible to more effectively prevent the occurrence of sticking while reducing the capacity offset.

Application Example 5
In the physical quantity sensor according to this application example, the first fixed electrode preferably includes a second portion which is disposed to face the dummy electrode in the Y-axis direction.
This allows the capacitance offset to be easily reduced.

Application Example 6
In the physical quantity sensor of this application example, it is preferable that the second portion be provided in a pair so as to be located on both sides of the dummy electrode in the Y-axis direction.
This allows the capacitance offset to be more easily reduced.

Application Example 7
In the physical quantity sensor according to the application example, the dummy electrode is a first dummy electrode provided between the first fixed electrode and the second fixed electrode, and the first dummy electrode of the first fixed electrode. A second dummy electrode provided on the opposite side, and a third dummy electrode provided on the side opposite to the first dummy electrode of the second fixed electrode;
It is preferable that the second portion be disposed to face the second dummy electrode in the Y-axis direction.
As a result, it is possible to more effectively prevent the occurrence of sticking while reducing the capacity offset.

Application Example 8
In the physical quantity sensor of this application example, the substrate is preferably a glass substrate.
Thus, the movable portion and the substrate can be easily electrically isolated from each other, and the sensor structure can be simplified.

Application Example 9
The electronic device of this application example is characterized by including the physical quantity sensor of the present invention.
Such an electronic device can have high reliability because it includes the physical quantity sensor according to the application example.

Application Example 10
The mobile object of this application example is characterized by including the physical quantity sensor of the present invention.
Such a mobile unit can have high reliability because it includes the physical quantity sensor according to the application example.

FIG. 1 is a plan view schematically showing a physical quantity sensor according to a preferred embodiment of the present invention. It is the II-II sectional view taken on the line of FIG. 1 which shows the physical quantity sensor of FIG. 1 typically. It is the III-III sectional view taken on the line of FIG. 1 which shows the physical quantity sensor of FIG. 1 typically. It is the IV-IV sectional view taken on the line of FIG. 1 which shows the physical quantity sensor of FIG. 1 typically. It is sectional drawing which shows typically the manufacturing process of the physical quantity sensor of FIG. It is sectional drawing which shows typically the manufacturing process of the physical quantity sensor of FIG. It is sectional drawing which shows typically the manufacturing process of the physical quantity sensor of FIG. It is a top view which shows typically the physical quantity sensor concerning a 1st modification. It is a top view which shows the physical quantity sensor concerning a 2nd modification typically. It is a top view which shows the physical quantity sensor concerning a 3rd modification typically. It is a top view which shows typically the physical quantity sensor which concerns on a 4th modification. It is a perspective view showing composition of a mobile type (or note type) personal computer to which an electronic device of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (including PHS) which applied the electronic device of this invention. FIG. 1 is a perspective view showing a configuration of a digital still camera to which an electronic device of the present invention is applied. It is a perspective view showing composition of a car which is an example of a mobile of the present invention.

  Hereinafter, preferred embodiments of a physical quantity sensor, an electronic device, and a mobile body according to the present invention will be described with reference to the attached drawings.

Physical quantity sensor
First, the physical quantity sensor of FIG. 1 will be described with reference to the drawings.

  FIG. 1 is a plan view schematically showing a physical quantity sensor 100 according to a preferred embodiment of the present invention, and FIG. 2 is a sectional view taken along the line II-II of FIG. 1 schematically showing the physical quantity sensor 100 of FIG. 3 is a cross-sectional view taken along the line III-III of FIG. 1 schematically showing the physical quantity sensor 100 of FIG. 1, and FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 1 schematically showing the physical quantity sensor 100 of FIG. .

  In addition, for convenience, in FIG. 1, the lid 80 is seen through. Moreover, in FIG. 3 and FIG. 4, the cover body 80 is abbreviate | omitted and shown in figure. Further, in FIGS. 1 to 4, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  As shown in FIGS. 1 to 4, the physical quantity sensor 100 includes a substrate 10, a movable portion 20, connection portions 30 and 32, a support portion 40, fixed electrodes 50 and 52, and dummy electrodes 53, 54 and 55. , Wires 60, 64, 66, pads 70, 72, 74, and a lid 80.

  In the present embodiment, an example will be described in which the physical quantity sensor 100 is an acceleration sensor (capacitive MEMS acceleration sensor) that detects acceleration in the vertical direction (Z-axis direction).

Hereinafter, each part constituting the physical quantity sensor 100 will be sequentially described in detail.
The material of the substrate 10 is, for example, an insulating material such as glass. For example, when the substrate 10 is made of an insulating material such as glass and the movable portion 20 is made of a semiconductor material such as silicon, both can be easily electrically insulated, and the sensor structure can be simplified. When the substrate 10 is made of glass, a more sensitive physical quantity sensor can be provided.

  A recess 11 is formed in the substrate 10. The movable portion 20 and the connecting portions 30 and 32 are provided above the recess 11 with a gap. In the example shown in FIG. 1, the planar shape (the shape seen from the Z-axis direction) of the recessed part 11 is a rectangle. A post portion 13 is provided on the bottom surface 12 of the recess 11 (the surface of the substrate 10 defining the recess 11).

  In the example shown in FIGS. 2 to 4, the post portion 13 is provided integrally with the substrate 10. The post portion 13 protrudes above the bottom surface 12 (in the + Z-axis direction).

  As shown in FIGS. 3 and 4, in the present embodiment, the height of the post portion 13 (the distance between the top surface 14 and the bottom surface 12 of the post portion 13) and the depth of the recess 11 are configured to be equal. ing.

  The upper surface 14 of the post 13 is joined to the support 40. A recess 15 is formed on the upper surface 14 of the post 13. A first wiring 60 is provided on the bottom surface 16 of the recess 15 (the surface of the post 13 defining the recess 15).

  In the example shown in FIGS. 2 to 4, the side surface of the recess 11 (the side surface of the substrate 10 defining the recess 11) and the side surface of the post portion 13 are perpendicular to the bottom surface 12 of the recess 11. It may be inclined with respect to

  The movable portion 20 is displaceable around the support shaft (first axis) Q. Specifically, when acceleration in the vertical direction (Z-axis direction) is applied to the movable portion 20, the seesaw swings with the support shaft Q determined by the connecting portions 30, 32 as a rotation axis (swinging axis). The support axis Q is, for example, parallel to the Y axis. In the illustrated example, the planar shape of the movable portion 20 is rectangular. The thickness (the size in the Z-axis direction) of the movable portion 20 is, for example, constant.

The movable portion 20 has a first mass portion 20a and a second mass portion 20b.
The first mass portion 20a is one of two portions of the movable portion 20 divided by the support axis Q (in FIG. 1, a portion positioned on the right side) in a plan view.

  The second mass portion 20 b is the other of the two parts of the movable part 20 partitioned by the support axis Q (in FIG. 1, the part located on the left side) in plan view.

  When acceleration (for example, gravitational acceleration) in the vertical direction is applied to the movable portion 20, a rotational moment (a moment of force) is generated in each of the first mass portion 20a and the second mass portion 20b. Here, when the rotational moment of the first mass portion 20 a (for example, clockwise rotational moment) and the rotational moment of the second mass portion 20 b (for example, counterclockwise rotational moment) are balanced, the inclination of the movable portion 20 is No change occurs and acceleration can not be detected. Therefore, when acceleration in the vertical direction is applied, the movable moment of the first mass unit 20a and the rotational moment of the second mass unit 20b are not balanced, and the movable unit 20 has a predetermined inclination. 20 are designed.

  In the physical quantity sensor 100, by arranging the support axis Q at a position deviated from the center (center of gravity) of the movable part 20 (by making the distances from the support axis Q to the tips of the respective mass parts 20a and 20b different) The mass parts 20a, 20b have mutually different masses. That is, the movable portion 20 has different masses on one side (the first mass portion 20a) and the other side (the second mass portion 20b) with the support axis Q as a boundary. In the illustrated example, the distance from the support axis Q to the end face 23 of the first mass unit 20a is smaller than the distance from the support axis Q to the end face 24 of the second mass unit 20b. Moreover, the thickness of the 1st mass part 20a and the thickness of the 2nd mass part 20b are equal. Therefore, the mass of the first mass unit 20a is smaller than the mass of the second mass unit 20b. Thus, when the accelerations in the vertical direction are applied, the mass moment 20a and the mass moment 20b have different masses so that the rotational moment of the first mass portion 20a and the rotational moment of the second mass portion 20b are balanced. You can not let it go. Therefore, when acceleration in the vertical direction is applied, the movable portion 20 can be caused to have a predetermined inclination.

  The movable portion 20 is provided apart from the substrate 10. The movable portion 20 is provided above the recess 11. In the illustrated example, a gap is provided between the movable portion 20 and the substrate 10. Further, the movable portion 20 is provided apart from the support portion 40 by the connecting portions 30 and 32. Thereby, the movable portion 20 can rock on the seesaw.

  The movable portion 20 includes a first movable electrode 21 and a second movable electrode 22 provided with the support shaft Q as a boundary. The first movable electrode 21 is provided on the first mass unit 20 a. The second movable electrode 22 is provided on the second mass unit 20 b.

  The first movable electrode 21 is a portion of the movable portion 20 overlapping the first fixed electrode 50 in a plan view. The first movable electrode 21 forms a capacitance C 1 between itself and the first fixed electrode 50. That is, the capacitance C1 is formed by the first movable electrode 21 and the first fixed electrode 50.

  The second movable electrode 22 is a portion of the movable portion 20 overlapping the second fixed electrode 52 in a plan view. The second movable electrode 22 forms a capacitance C 2 between itself and the second fixed electrode 52. That is, the electrostatic capacitance C2 is formed by the second movable electrode 22 and the second fixed electrode 52. In the physical quantity sensor 100, the movable electrodes 21 and 22 are provided by the movable portion 20 being made of a conductive material (silicon doped with an impurity). That is, the first mass unit 20 a functions as the first movable electrode 21, and the second mass unit 20 b functions as the second movable electrode 22.

  The capacitance C1 and the capacitance C2 are configured to be equal to each other, for example, when the movable portion 20 shown in FIG. 2 is in a horizontal state. The positions of the movable electrodes 21 and 22 change according to the movement of the movable portion 20. The electrostatic capacitances C1 and C2 change according to the positions of the movable electrodes 21 and 22. The movable portion 20 is given a predetermined potential via the connecting portions 30 and 32 and the support portion 40.

  In the movable portion 20, a through hole 25 which penetrates the movable portion 20 is formed. Thereby, the influence of the air (the resistance of the air) when the movable part 20 swings can be reduced. For example, a plurality of through holes 25 are formed. In the illustrated example, the planar shape of the through hole 25 is rectangular.

  The movable portion 20 is provided with an opening 26 penetrating the movable portion 20. The opening 26 is provided on the support shaft Q in plan view. The opening portion 26 is provided with connection portions 30 and 32 and a support portion 40. In the illustrated example, the planar shape of the opening 26 is rectangular. The movable portion 20 is connected to the support portion 40 via the coupling portions 30 and 32.

  The connecting portions 30 and 32 connect the movable portion 20 and the support portion 40. The connection portions 30, 32 function as a torsion spring (torsion spring). Thereby, the connection parts 30 and 32 can have strong restoring force with respect to the torsional deformation which arises in the connection parts 30 and 32 because the movable part 20 rock | fluctuates in a seesaw.

  The coupling portions 30, 32 are disposed on the support shaft Q in a plan view. The connecting portions 30, 32 extend along the support shaft Q. The connecting portion 30 extends from the supporting portion 40 in the + Y axis direction. The connection portion 32 extends from the support portion 40 in the −Y axis direction.

  The support 40 is disposed at the opening 26. The support portion 40 is provided on the support shaft Q in plan view. A portion of the support portion 40 is joined (connected) to the upper surface 14 of the post portion 13. The support portion 40 supports the movable portion 20 via the connection portions 30 and 32. The supporting portion 40 is provided with a connecting region 46 to which the connecting portions 30 and 32 are connected and provided along the support axis Q, and a first provided on the outside of the connecting region 46 in plan view and provided on the substrate. A contact region 63 electrically connected to the interconnection 60 is provided.

  The support portion 40 has a first portion 41 and second portions 42, 43, 44, 45. In the support portion 40, the first portion 41 extends along the second axis R intersecting (specifically, orthogonally) with the support axis Q, and from the end of the first portion 41 to the second portions 42, 43, 44, 45 is a shape which protrudes. The second axis R is an axis parallel to the X axis.

  The first portion 41 of the support portion 40 extends so as to intersect (specifically, orthogonally) the support axis Q. The connecting portions 30 and 32 are joined to the first portion 41. The first portion 41 is provided on the support shaft Q in plan view and is separated from the substrate 10. That is, the portion on the support shaft Q of the support portion 40 is separated from the substrate 10. In the example shown in FIG. 1, the planar shape of the first portion 41 is rectangular. The first portion 41 extends along the second axis R.

  A connection area 46 is provided in the first portion 41 of the support portion 40. In the example illustrated in FIG. 1, the connection region 46 is a region sandwiched by the connecting portions 30 and 32 of the support portion 40 in plan view. In the illustrated example, the planar shape of the connection area 46 is rectangular. At least a portion of the connection region 46 is not fixed to the substrate 10.

  The second portions 42, 43, 44, 45 of the support portion 40 project (extend) from the end of the first portion 41. In the example shown in FIG. 1, the planar shape of the second portions 42, 43, 44, 45 is rectangular. A contact region 63 is provided in each of the second portions 42, 43, 44, 45.

  The second portions 42 and 43 of the support portion 40 extend in opposite directions along the support axis Q from one end (specifically, the end in the −X axis direction) of the first portion 41. In the illustrated example, the second portion 42 extends from the one end of the first portion 41 in the + Y axis direction. The second portion 43 extends from one end of the first portion 41 in the −Y axis direction. A portion of the second portion 42 and a portion of the second portion 43 are joined to the post portion 13.

  The second portions 44 and 45 of the support portion 40 extend from the other end (specifically, the end in the + X-axis direction) of the first portion 41 in opposite directions along the support axis Q. In the illustrated example, the second portion 44 extends in the + Y-axis direction from the other end of the first portion 41. The second portion 45 extends from the other end of the first portion 41 in the −Y axis direction. A portion of the second portion 44 and a portion of the second portion 45 are joined to the post portion 13.

  The support portion 40 has an H-shaped (substantially H-shaped) planar shape by including the portions 41, 42, 43, 44, 45 as described above. That is, the first portion 41 constitutes an H-shaped horizontal bar. The second portions 42, 43, 44, 45 constitute an H-shaped vertical bar.

  The movable portion 20, the coupling portions 30, 32, and the support portion 40 are integrally provided. In the illustrated example, the movable portion 20, the coupling portions 30, 32, and the support portion 40 constitute one structure (silicon structure) 2. The movable portion 20, the coupling portions 30, 32, and the support portion 40 are integrally provided by patterning one substrate (silicon substrate). The material of the movable portion 20, the coupling portions 30, 32, and the support portion 40 is, for example, silicon to which conductivity is imparted by doping an impurity such as phosphorus or boron. When the material of the substrate 10 is glass and the material of the movable portion 20, the coupling portions 30, 32, and the support portion 40 is silicon, the substrate 10 and the support portion 40 are bonded by, for example, anodic bonding.

  In the physical quantity sensor 100, the structure 2 is fixed to the substrate 10 by one support 40. That is, the structural body 2 is fixed to the substrate 10 at one point (one support portion 40). Therefore, for example, the stress generated by the difference between the thermal expansion coefficient of the substrate 10 and the thermal expansion coefficient of the structure 2 as compared with the configuration in which the structure is fixed to the substrate at two points (two supporting portions) The stress or the like applied to the device at the time of mounting can reduce the influence exerted on the connecting portions 30 and 32.

  The fixed electrodes 50 and 52 are provided on the substrate 10. In the illustrated example, the fixed electrodes 50 and 52 are provided on the bottom surface 12 of the recess 11. The first fixed electrode 50 is disposed to face the first movable electrode 21. The first movable electrode 21 is located above the first fixed electrode 50 with a gap. The second fixed electrode 52 is disposed to face the second movable electrode 22. The second movable electrode 22 is located above the second fixed electrode 52 via a gap. The area of the first fixed electrode 50 and the area of the second fixed electrode 52 are configured to be equal. Further, the planar shape of the first fixed electrode 50 and the planar shape of the second fixed electrode 52 are configured to be symmetrical with respect to the support axis Q.

  The dummy electrodes 53, 54, 55 are provided on the substrate 10 so that the movable portion 20 does not contact the fixed electrodes 50, 52. The dummy electrodes 53, 54, 55 are configured to have the same potential as the movable portion 20. By arranging such dummy electrodes 53, 54, 55, the exposed glass surface facing the structure 2 can be made smaller, so the electrostatic force generated at the time of anodic bonding can be made smaller. Adhesion to the substrate 10 can be effectively suppressed.

  The first dummy electrode 53 is provided between the first fixed electrode 50 and the second fixed electrode 52. Further, the second dummy electrode 54 is provided on the opposite side of the first dummy electrode 53 of the first fixed electrode 50. Further, the third dummy electrode 55 is provided on the opposite side of the second fixed electrode 52 to the first dummy electrode 53.

  Generally, when the fixed electrode and the dummy electrode have the same width in the Y-axis direction, the capacitance C6 between the first fixed electrode 50 and the second dummy electrode 54, the second fixed electrode 52, and the third dummy electrode 55 And C6 <C7, and hence the capacitance formed by the movable portion 20-first fixed electrode 50 and the movable portion 20-second fixed electrode 52 Taking the difference from the capacitance, a capacitance offset occurs due to the difference between C6 and C7.

  On the other hand, in the present embodiment, the width (the width in the Y-axis direction) of the second dummy electrode 54 is configured to be larger than the width (the width in the Y-axis direction) of the second fixed electrode 52. With such a configuration, C6 can be increased. As a result, the difference between C6 and C7 can be effectively reduced, and the capacitance offset can be reduced.

  In particular, as shown in FIG. 1, the second dummy electrode 54 has a shape that wraps around both end sides of the first fixed electrode 50 in the width direction. Specifically, the second dummy electrode 54 is located on the + X axis side of the first fixed electrode 50, and is located on the base 541 extending in the Y axis direction and the + Y axis side of the first fixed electrode 50, and the base A protrusion (first portion) 542 that protrudes from the end on the + Y axis side of 541 to the −X axis side and the −Y axis side of the first fixed electrode 50, and an end on the −Y axis side of the base 541 And a projecting portion (first portion) 543 projecting in the −X-axis direction from the portion. The projecting portions 542 and 543 are provided side by side (oppositely) with the first fixed electrode 50 in the Y-axis direction, and are arranged to face each other via the first fixed electrode 50.

  With such a shape, the portion of the second dummy electrode 54 opposed to the first fixed electrode 50 is increased, so the capacitance C6 between the first fixed electrode 50 and the second dummy electrode 54 is more effective. And the difference between C6 and C7 can be made smaller. As a result, the capacitance offset can be further reduced.

  The material of the fixed electrodes 50 and 52 and the dummy electrodes 53, 54 and 55 is, for example, aluminum, gold, or ITO (Indium Tin Oxide). The material of the fixed electrodes 50 and 52 and the dummy electrodes 53, 54 and 55 is preferably a transparent electrode material such as ITO. When the substrate 10 is a transparent substrate (glass substrate) by using a transparent electrode material as the fixed electrodes 50, 52 and the dummy electrodes 53, 54, 55, the fixed electrodes 50, 52, the dummy electrodes 53, 54, 55 are formed. Foreign objects and the like present in the image can be easily viewed.

  The first wiring 60 is provided on the substrate 10. The first wiring 60 has a wiring layer portion 61 and a bump portion 62.

  The wiring layer portion 61 of the first wiring 60 connects the first pad 70 and the bump portion 62. In the illustrated example, the wiring layer portion 61 extends from the first pad 70 to the bump portion 62 through the first groove portion 17 formed in the substrate 10, the concave portion 11 and the concave portion 15. The portion provided in the recess 15 of the wiring layer 61 overlaps the support 40 in a plan view. In the illustrated example, the planar shape of the portion provided in the recess 15 of the wiring layer 61 is H-shaped (substantially H-shaped). The material of the wiring layer portion 61 is, for example, the same as the material of the fixed electrodes 50 and 52.

  The bump portion 62 of the first wiring 60 is provided on the wiring layer portion 61. The bump portion 62 connects the wiring layer portion 61 and the support portion 40 in the contact region 63. That is, the contact region 63 is a region where the first wire 60 and the support portion 40 are connected (contacted). More specifically, the contact region 63 is a region (contact surface) in contact with the support portion 40 of the bump portion 62. The material of the bump portion 62 is, for example, aluminum, gold, or platinum.

  The contact region 63 is arranged to avoid on the support shaft Q. That is, the contact region 63 is disposed apart from the support shaft Q. At least one contact region 63 is provided on one side (specifically, the + X axis direction side) and the other side (specifically, the −X axis direction side) with the support axis Q as a boundary in plan view. ing. The contact regions 63 are provided on both sides of the connection region 46 with the support axis Q as a boundary in plan view. In the illustrated example, four contact regions 63 are provided, and are provided so as to overlap the second portions 42, 43, 44, 45 of the support portion 40 in a plan view. That is, the contact region 63 is provided so as to overlap with each of the end portions of the vertical bars of the support portion 40 having an H-shaped (substantially H-shaped) shape in plan view. In the illustrated example, the planar shape of the contact region 63 is rectangular.

  As shown in FIGS. 3 and 4, the contact region 63 is located above the upper surface 14 (the joint surface between the post 13 and the support 40) of the post 13. Specifically, when the silicon substrate is bonded to the substrate 10 (details will be described later), the silicon substrate is pushed and depressed by the bump portion 62 of the first wiring 60, and the contact region 63 is the upper surface 14 of the post portion 13. It is located above. For example, when the support portion 40 is pushed by the bump portion 62 (the silicon substrate), stress is generated in the support portion 40.

  Although not illustrated, if the first wire 60 and the support portion 40 are in contact, the support portion 40 is not recessed, and the contact region 63 and the upper surface 14 of the post portion 13 are the same in the Z axis direction. It may be in position. That is, the contact region 63 and the top surface 14 may have the same height. Also in such a configuration, stress is generated in the support portion 40 by the contact between the first wiring 60 and the support portion 40.

  Further, although not shown, the dummy electrodes 53, 54, 55 are connected to the first wiring 60, and thus have the same potential as the movable portion 20.

  The second wiring 64 is provided on the substrate 10. The second wiring 64 connects the second pad 72 and the second fixed electrode 52. In the illustrated example, the second wiring 64 extends from the second pad 72 to the second fixed electrode 52 through the second groove 18 and the recess 11. The material of the second wiring 64 is, for example, the same as the material of the fixed electrodes 50 and 52.

  The third wiring 66 is provided on the substrate 10. The third wiring 66 connects the third pad 74 and the first fixed electrode 50. In the illustrated example, the third wiring 66 extends from the third pad 74 to the first fixed electrode 50 through the third groove 19 and the recess 11. The material of the third wiring 66 is, for example, the same as the material of the fixed electrodes 50 and 52.

  The pads 70, 72, 74 are provided on the substrate 10. In the illustrated example, the pads 70, 72, 74 are provided in the grooves 17, 18, 19 respectively and connected to the wires 60, 64, 66. The pads 70, 72, 74 are provided at positions not overlapping the lid 80 in plan view. Thereby, even in a state where the movable portion 20 is accommodated in the substrate 10 and the lid 80, the capacitances C1, C2 can be detected by the pads 70, 72, 74. The material of the pads 70, 72, 74 is, for example, the same as that of the fixed electrodes 50, 52.

  The lid 80 is provided on the substrate 10. The lid 80 is bonded to the substrate 10. The lid 80 and the substrate 10 form a cavity 82 that accommodates the movable portion 20. The cavity 82 is, for example, an inert gas (for example, nitrogen gas) atmosphere. The material of the lid 80 is, for example, silicon. When the material of the lid 80 is silicon and the material of the substrate 10 is glass, the substrate 10 and the lid 80 are bonded, for example, by anodic bonding.

Next, the operation of the physical quantity sensor 100 will be described.
In the physical quantity sensor 100, the movable part 20 swings around the support axis Q according to physical quantities such as acceleration and angular velocity. Along with the movement of the movable portion 20, the distance between the first movable electrode 21 and the first fixed electrode 50 and the distance between the second movable electrode 22 and the second fixed electrode 52 change. Specifically, for example, when acceleration in the vertically upward direction (+ Z axis direction) is applied to the physical quantity sensor 100, the movable portion 20 rotates counterclockwise, and the distance between the first movable electrode 21 and the first fixed electrode 50 Becomes smaller, and the distance between the second movable electrode 22 and the second fixed electrode 52 becomes larger. As a result, the capacitance C1 increases and the capacitance C2 decreases. Also, for example, when acceleration downward in the vertical direction (−Z-axis direction) is applied to the physical quantity sensor 100, the movable portion 20 rotates clockwise, and the distance between the first movable electrode 21 and the first fixed electrode 50 increases. The distance between the second movable electrode 22 and the second fixed electrode 52 is reduced. As a result, the capacitance C1 decreases and the capacitance C2 increases.

  In the physical quantity sensor 100, the electrostatic capacitance C1 is detected using the pads 70 and 72, and the electrostatic capacitance C2 is detected using the pads 70 and 74. Then, based on the difference between the electrostatic capacitance C1 and the electrostatic capacitance C2 (by a so-called differential detection method), it is possible to detect a physical quantity such as the direction or magnitude of the acceleration or angular velocity.

  As described above, the physical quantity sensor 100 can be used as an inertial sensor such as an acceleration sensor or a gyro sensor, and specifically, for example, a capacitance for measuring acceleration in the vertical direction (Z-axis direction) It can be used as an acceleration sensor.

[Method of manufacturing physical quantity sensor]
Next, a method of manufacturing the physical quantity sensor of FIG. 1 will be described with reference to the drawings. 5 to 7 are cross-sectional views schematically showing the manufacturing process of the physical quantity sensor 100 of FIG. 1, corresponding to FIG.

  As shown in FIG. 5, for example, a glass substrate is patterned to form the post portion 13 in which the recess 11, the recess 15 are formed, and the groove portions 17, 18 and 19 (see FIG. 1). The patterning is performed by, for example, photolithography and etching. By this process, it is possible to obtain the substrate 10 in which the concave portion 11, the post portion 13, and the groove portions 17, 18 and 19 are formed.

  Next, the fixed electrodes 50 and 52 and the dummy electrodes 53, 54 and 55 are formed on the bottom surface 12 of the recess 11. Next, the wiring layer portion 61 and the wirings 64 and 66 are formed on the substrate 10 (see FIG. 1). The wires 64, 66 are formed to be connected to the fixed electrodes 50, 52. Next, bump portions 62 are formed on the wiring layer portion 61 (see FIGS. 3 and 4). Thereby, the first wiring 60 can be formed. The bump portion 62 is formed such that the upper surface thereof is located above the upper surface 14 of the post portion 13. Next, pads 70, 72, 74 are formed to be connected to the interconnections 60, 64, 66, respectively (see FIG. 1).

  The fixed electrodes 50 and 52, the wires 60, 64 and 66, and the pads 70, 72 and 74 are formed, for example, by film formation and patterning by sputtering or chemical vapor deposition (CVD). The patterning is performed by, for example, photolithography and etching.

  As shown in FIG. 6, for example, a silicon substrate 102 is bonded to the substrate 10. Bonding between the substrate 10 and the silicon substrate 102 is performed, for example, by anodic bonding. Thus, the substrate 10 and the silicon substrate 102 can be firmly bonded. In anodic bonding, since the silicon substrate 102 and the dummy electrodes 53, 54, 55 have the same potential, sticking (sticking) of the silicon substrate 102 to the substrate 10 is effectively suppressed. In addition, when the silicon substrate 102 is bonded to the substrate 10, the silicon substrate 102 is pushed and depressed by, for example, the bump portion 62 of the first wiring 60 (see FIGS. 3 and 4). Thereby, stress is generated in the silicon substrate 102.

  As shown in FIG. 7, the silicon substrate 102 is ground and thinned by, for example, a grinder, and then patterned into a predetermined shape to integrally integrate the movable portion 20, the coupling portions 30 and 32, and the support portion 40. Form. The patterning is performed by photolithography and etching (dry etching), and Bosch can be used as a more specific etching technique.

As shown in FIG. 2, the lid 80 is bonded to the substrate 10, and the movable portion 20 and the like are accommodated in a cavity 82 formed by the substrate 10 and the lid 80. Bonding between the substrate 10 and the lid 80 is performed, for example, by anodic bonding. Thereby, the substrate 10 and the lid 80 can be firmly joined. By performing this step in an inert gas atmosphere, the cavity 82 can be filled with the inert gas.
The physical quantity sensor 100 can be manufactured by the above process.

[First Modification of Physical Quantity Sensor]
Next, a physical quantity sensor according to a first modification of the physical quantity sensor will be described with reference to the drawings. FIG. 8 is a plan view schematically showing the physical quantity sensor 200 according to the first modification. For the sake of convenience, FIG. 8 shows the lid 80 in a transparent manner. Further, in FIG. 8, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  Hereinafter, in the physical quantity sensor 200 according to the modification, members having the same functions as the constituent members of the physical quantity sensor 100 in FIG. 1 are denoted by the same reference numerals, and the detailed description thereof is omitted.

  In the physical quantity sensor 100, as shown in FIG. 1, the second dummy electrode 54 has a shape in which the second dummy electrode 54 wraps around both end sides in the width direction of the first fixed electrode 50. On the other hand, in the physical quantity sensor 200, as shown in FIG. 8, the second dummy electrode 54 is shaped so as to wrap around only one end side in the width direction of the first fixed electrode 50. Specifically, the second dummy electrode 54 is located on the + X axis side of the first fixed electrode 50, and is located on the base 541 extending in the Y axis direction and the + Y axis side of the first fixed electrode 50, and the base It has an L shape having a protrusion (first portion) 542 protruding in the −X axis direction from the end on the + Y axis side of 541.

  Similar to the physical quantity sensor 100, the physical quantity sensor 200 can reduce the capacitance offset and can have high reliability.

[Second Modification of Physical Quantity Sensor]
Next, a physical quantity sensor according to a second modification of the physical quantity sensor will be described with reference to the drawings. FIG. 9 is a plan view schematically showing a physical quantity sensor 300 according to a second modification. In addition, for convenience, in FIG. 9, the lid 80 is seen through. Further, in FIG. 9, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  Hereinafter, in the physical quantity sensor 300 according to the modification, members having the same functions as the constituent members of the physical quantity sensor 100 of FIG. 1 are denoted by the same reference numerals, and the detailed description thereof is omitted.

  In the physical quantity sensor 100, as shown in FIG. 1, the second dummy electrode 54 has a shape in which the second dummy electrode 54 wraps around both end sides in the width direction of the first fixed electrode 50. On the other hand, in the physical quantity sensor 300, as shown in FIG. 9, the first dummy electrode 53 is shaped so as to wrap around both end sides in the width direction of the first fixed electrode 50. Specifically, the first dummy electrode 53 is located on the −X axis side of the first fixed electrode 50, and is located on the base 531 extending in the Y axis direction and the + Y axis side of the first fixed electrode 50, A protrusion (first portion) 532 protruding from the end on the + Y-axis side of the base 531 to the + X-axis side and the −Y-axis side of the first fixed electrode 50, and an end on the −Y-axis side of the base 531 And a protrusion (first portion) 533 protruding from the portion in the + X axis direction. The protruding portions 532 and 533 are provided side by side (oppositely) with the first fixed electrode 50 in the Y-axis direction, and are arranged to face each other via the first fixed electrode 50.

  With such a configuration, (electrostatic capacitance C6 between the first fixed electrode 50 and the second dummy electrode 54) <(electrostatic capacitance between the second fixed electrode 52 and the third dummy electrode 55) Even in the case of C7), the capacitance C4 between the first fixed electrode 50 and the first dummy electrode 53 is larger than the capacitance C5 between the second fixed electrode 52 and the first dummy electrode 53. can do. As a result, the difference between the capacitance formed by the movable portion 20-the first fixed electrode 50 and the capacitance formed by the movable portion 20-the second fixed electrode 52 can be reduced, and the capacitance offset can be reduced. it can.

[Third Modification of Physical Quantity Sensor]
Next, a physical quantity sensor according to a third modification of the physical quantity sensor will be described with reference to the drawings. FIG. 10 is a plan view schematically showing a physical quantity sensor 400 according to a third modification. In addition, for convenience, in FIG. 10, the lid 80 is seen through. Further, in FIG. 10, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  Hereinafter, in the physical quantity sensor 400 according to the modification, members having the same functions as the constituent members of the physical quantity sensor 300 in FIG. 9 are denoted with the same reference numerals, and the detailed description thereof is omitted.

  In the physical quantity sensor 300, as shown in FIG. 9, the first dummy electrode 53 has a shape in which the first dummy electrode 53 wraps around both ends in the width direction of the first fixed electrode 50. On the other hand, in the physical quantity sensor 400, the first dummy electrode 53 has a shape in which the first dummy electrode 53 can be wound around only one end of the first fixed electrode 50 in the width direction. Specifically, the first dummy electrode 53 is located on the −X axis side of the first fixed electrode 50, and is located on the base 531 extending in the Y axis direction and the + Y axis side of the first fixed electrode 50, The base 531 is L-shaped having a protrusion (first portion) 532 protruding from the end on the + Y axis side of the base 531 to the + X axis side.

  In the physical quantity sensor 400, as in the physical quantity sensors 100 and 300, the capacity offset can be reduced and high reliability can be provided.

[Fourth modified example of physical quantity sensor]
Next, a physical quantity sensor according to a fourth modification of the physical quantity sensor will be described with reference to the drawings. FIG. 11 is a plan view schematically showing a physical quantity sensor 500 according to a fourth modification. In addition, for convenience, in FIG. 11, the lid 80 is seen through. Further, in FIG. 11, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  Hereinafter, in the physical quantity sensor 500 according to the modification, members having the same functions as the constituent members of the physical quantity sensor 100 of FIG. 1 are denoted by the same reference numerals, and the detailed description thereof is omitted.

  In the physical quantity sensor 100, as shown in FIG. 1, the second dummy electrode 54 has a shape in which the second dummy electrode 54 wraps around both end sides in the width direction of the first fixed electrode 50. On the other hand, in the physical quantity sensor 500, as shown in FIG. 11, the first fixed electrode 50 has a shape in which the first dummy electrode 50 wraps around both ends in the width direction of the second dummy electrode 54. Specifically, the first fixed electrode 50 is located on the base 501 located on the −X axis side of the second dummy electrode 54 and on the + Y axis side of the second dummy electrode 54, and the end on the + Y axis side of the base 501 And a protrusion (second portion) 502 protruding from the portion to the + X axis side, and the −Y axis side of the second dummy electrode 54, and protrudes in the + X axis direction from an end of the base 501 on the −Y axis side And a protrusion (second portion) 503, and has a C shape. The protrusions 502 and 503 are provided side by side (oppositely) with the second dummy electrode 54 in the Y-axis direction, and are disposed opposite to each other via the second dummy electrode 54.

  In the physical quantity sensor 500, similarly to the physical quantity sensor 100, the capacity offset can be reduced and high reliability can be provided.

[Electronics]
Next, the electronic device of the present invention will be described.

  FIG. 12 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of the present invention is applied.

  As shown in FIG. 12, the personal computer 1100 includes a main unit 1104 having a keyboard 1102 and a display unit 1106 having a display unit 1108. The display unit 1106 has a hinge structure to the main unit 1104. It is rotatably supported via the support.

  The physical quantity sensor 100 is built in such a personal computer 1100.

  FIG. 13 is a perspective view showing the configuration of a mobile phone (including PHS) to which the electronic device of the present invention is applied.

As shown in FIG. 13, the mobile phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and a display unit 1208 is disposed between the operation button 1202 and the earpiece 1204. .
The physical quantity sensor 100 is built in such a mobile phone 1200.

  FIG. 14 is a perspective view showing the configuration of a digital still camera to which the electronic device of the present invention is applied. Note that in this figure, the connection to an external device is also shown in a simplified manner.

  Here, while a normal camera sensitizes a silver halide photographic film with a light image of a subject, the digital still camera 1300 photoelectrically converts the light image of the subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal by a CCD, and the display unit 1310 displays an object as an electronic image. It functions as a finder.

  A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the rear side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and depresses the shutter button 1306, an imaging signal of the CCD at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side of the case 1302. A television monitor 1430 is connected to the video signal output terminal 1312, and a personal computer 1440 is connected to the data communication input / output terminal 1314 as necessary. Furthermore, the imaging signal stored in the memory 1308 is configured to be output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  The physical quantity sensor 100 is built in such a digital still camera 1300.

  The electronic devices 1100, 1200, and 1300 as described above can have high reliability because they include the physical quantity sensor 100.

  In addition to the personal computer (mobile personal computer) shown in FIG. 12, the mobile phone shown in FIG. 13, and the digital still camera shown in FIG. , Watch, inkjet discharge device (eg, inkjet printer), laptop personal computer, television, video camera, video tape recorder, various navigation devices, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic Game devices, head mounted displays, word processors, workstations, video phones, television monitors for crime prevention, electronic binoculars, POS terminals, medical devices (such as electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiogram measuring devices, super Application to wave diagnostic equipment, electronic endoscopes), fish finders, various measuring instruments, instruments (for example, instruments of vehicles, aircraft, rockets, ships), attitude control of robots and human bodies, flight simulators, etc. Can.

[Mobile body]
FIG. 15 is a perspective view showing the configuration of an automobile which is an example of the mobile object of the present invention.

  The physical quantity sensor 100 is built in the automobile 1500. Specifically, as shown in FIG. 15, an electronic control unit (ECU: Electronic Control Unit) that controls the output of the engine by incorporating a physical quantity sensor 100 that detects the acceleration of the automobile 1500 in the vehicle body 1502 of the automobile 1500. The 1504 is loaded. In addition, the physical quantity sensor 100 can be widely applied to a vehicle body posture control unit, an antilock brake system (ABS), an air bag, and a tire pressure monitoring system (TPMS). .

  The automobile 1500 can have high reliability because it includes the physical quantity sensor 100.

  The above-mentioned embodiment and modification are an example, and are not necessarily limited to these. For example, it is also possible to combine each embodiment and each modification suitably.

  The present invention includes configurations substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and effect). Further, the present invention includes a configuration in which a nonessential part of the configuration described in the embodiment is replaced. The present invention also includes configurations that can achieve the same effects or the same objects as the configurations described in the embodiments. Further, the present invention includes a configuration in which a known technology is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 2 Structure 10 Substrate 102 Silicon substrate 11 Recess 12 Bottom surface 13 Post portion 14 Top surface 15 Recessed portion 16 Bottom surface 17 First groove portion 18 Second groove portion 19 Third groove portion 20 Movable portion DESCRIPTION OF SYMBOLS 20a ... 1st mass part 20b ... 2nd mass part 21 ... 1st movable electrode 22 ... 2nd movable electrode 23, 24 ... End surface 25 ... Through-hole 26 ... Opening part 30 ... Connection part 32 ... Connection part 40 ... Support part 41 ... 1st part 42 ... 2nd part 43 ... 2nd part 44 ... 2nd part 46 ... 2nd connection area 50 ... 1st fixed electrode 501 ... base 502, 503 ... projection part 52 ... 2nd fixed electrode 53 ... 1st dummy electrode 531 ... base 532 and 533 ... projection part 54 ... 2nd dummy electrode 541 ... base 542 and 543 ... projection part 55 ... 3rd dummy electrode 60 ... 1st wiring 61 ... wiring layer part 62 ... bump part 63 ... Contact area 64 Second wiring 66 Third wiring 70 First pad 72 Second pad 74 Third pad 80 Lid 82 Cavity 100, 200, 300, 400, 500 Physical quantity sensor 1100 Personal Computer 1102 Keyboard 1104 Body 1106 Display Unit 1108 Display Unit 1200 Mobile Phone 1202 Operation Button 1204 Earpiece 1206 Mouthpiece 1208 Display Unit 1300 Digital Still Camera 1302 Case 1304 Light Receiving Unit 1306 ... Shutter button 1308 ... Memory 1310 ... Display section 1312 ... Video signal output terminal 1314 ... I / O terminal 1430 ... Television monitor 1440 ... Personal computer 1500 ... Automobile 1502 ... Car body 1504 ... Electronic Control unit Q ... Support axis R ... Second axis

Claims (9)

  1. A substrate,
    A support fixed to the substrate;
    A movable portion connected to the support portion via a connection portion and capable of swinging with respect to the support portion;
    And a fixed electrode disposed on the substrate so as to face the movable portion,
    The movable portion includes a first mass portion provided on one side with respect to the connection portion, and a second mass portion provided on the other side and having a mass larger than the first mass portion.
    The fixed electrode faces a first fixed electrode disposed facing the first mass portion, a second fixed electrode disposed facing the second mass portion, and the movable portion, and A dummy electrode disposed so as not to be in contact with the first fixed electrode and the second fixed electrode and having the same potential as the movable portion;
    When the axial direction in which the movable part is swung is the Y-axis direction,
    At least one of the width in the Y-axis direction of the dummy electrode arranged side by side with the first fixed electrode and the width in the Y-axis direction of the first fixed electrode is the width of the second fixed electrode. much larger than the width in the Y-axis direction,
    The physical quantity sensor , wherein the dummy electrode has a first portion disposed to face the first fixed electrode in the Y-axis direction .
  2. It said first portion, the physical quantity sensor according to claim 1 is provided a pair so as to be positioned on the opposite sides of the Y-axis direction of the first fixed electrode.
  3. The dummy electrode is a first dummy electrode provided between the first fixed electrode and the second fixed electrode, and a second dummy electrode provided on the opposite side of the first dummy electrode of the first fixed electrode. A dummy electrode; and a third dummy electrode provided on the side opposite to the first dummy electrode of the second fixed electrode;
    Said first portion, said physical quantity sensor according to claim 1 or 2, at least one has a first dummy electrode and said second dummy electrode.
  4. A substrate,
    A support fixed to the substrate;
    A movable portion connected to the support portion via a connection portion and capable of swinging with respect to the support portion;
    And a fixed electrode disposed on the substrate so as to face the movable portion,
    The movable portion includes a first mass portion provided on one side with respect to the connection portion, and a second mass portion provided on the other side and having a mass larger than the first mass portion.
    The fixed electrode faces a first fixed electrode disposed facing the first mass portion, a second fixed electrode disposed facing the second mass portion, and the movable portion, and A dummy electrode disposed so as not to be in contact with the first fixed electrode and the second fixed electrode and having the same potential as the movable portion;
    When the axial direction in which the movable part is swung is the Y-axis direction,
    At least one of the width in the Y-axis direction of the dummy electrode arranged side by side with the first fixed electrode and the width in the Y-axis direction of the first fixed electrode is the width of the second fixed electrode. much larger than the width in the Y-axis direction,
    The physical quantity sensor, wherein the first fixed electrode has a second portion disposed to face the dummy electrode in the Y-axis direction .
  5. The physical quantity sensor according to claim 4 , wherein the second portion is provided in a pair so as to be located on both sides of the dummy electrode in the Y-axis direction.
  6. The dummy electrode is a first dummy electrode provided between the first fixed electrode and the second fixed electrode, and a second dummy electrode provided on the opposite side of the first dummy electrode of the first fixed electrode. A dummy electrode; and a third dummy electrode provided on the side opposite to the first dummy electrode of the second fixed electrode;
    The second portion, the physical quantity sensor according to claim 4 or 5 is disposed so as to face the Y-axis direction and the second dummy electrode.
  7. The physical quantity sensor according to any one of claims 1 to 6 , wherein the substrate is a glass substrate.
  8. An electronic device comprising the physical quantity sensor according to any one of claims 1 to 7 .
  9. A mobile unit comprising the physical quantity sensor according to any one of claims 1 to 7 .
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US14/822,041 US9810712B2 (en) 2014-08-15 2015-08-10 Physical quantity sensor, physical quantity sensor device, electronic equipment, and moving body
CN201510494373.3A CN105372451B (en) 2014-08-15 2015-08-12 Physical quantity sensor, physical quantity sensor device, electronic apparatus, and moving object
US15/723,726 US20180038888A1 (en) 2014-08-15 2017-10-03 Physical quantity sensor, physical quantity sensor device, electronic equipment, and moving body

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US7121141B2 (en) * 2005-01-28 2006-10-17 Freescale Semiconductor, Inc. Z-axis accelerometer with at least two gap sizes and travel stops disposed outside an active capacitor area
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