JP6537100B2 - Multi-stage substrate connection structure and electrical connection box - Google Patents

Multi-stage substrate connection structure and electrical connection box Download PDF

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JP6537100B2
JP6537100B2 JP2015083027A JP2015083027A JP6537100B2 JP 6537100 B2 JP6537100 B2 JP 6537100B2 JP 2015083027 A JP2015083027 A JP 2015083027A JP 2015083027 A JP2015083027 A JP 2015083027A JP 6537100 B2 JP6537100 B2 JP 6537100B2
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substrate
terminal
male
connection structure
flexible circuit
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JP2016207259A (en
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英生 高橋
英生 高橋
佐藤 幸喜
幸喜 佐藤
篤 河村
篤 河村
真佐夫 柴田
真佐夫 柴田
慎史 大下
慎史 大下
省吾 関沢
省吾 関沢
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Yazaki Corp
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Description

本発明は、少なくとも第一基板と第二基板とを板厚方向に間隔をあけて多段に配置し且つ電気的に接続するための多段基板接続構造と、この多段基板接続構造を採用してなる電気接続箱とに関する。   The present invention adopts a multistage substrate connection structure for arranging at least a first substrate and a second substrate in a multistage manner at intervals in the thickness direction and electrically connecting the multistage substrate connection structure. It relates to the electrical connection box.

自動車等の車両に搭載される電気機器として、例えば電気接続箱が挙げられる。電気接続箱は、リレーボックスやヒューズボックス、或いはジャンクションブロックや電子制御ユニットボックス、電源ボックス等を総称するものとして知られる。下記特許文献1には、電気接続箱に関する技術が開示される。以下、図面を参照しながら簡単に説明をする。   As an electric device mounted in vehicles, such as a car, an electric connection box is mentioned, for example. The electrical connection box is known as a generic term for relay boxes, fuse boxes, junction blocks, electronic control unit boxes, power supply boxes and the like. Patent Document 1 below discloses a technique related to an electrical connection box. A brief description will be given below with reference to the drawings.

図5において、電気接続箱1のケース2の内部には、第一プリント基板3と第二プリント基板4とが板厚方向に間隔をあけて多段に配置される。尚、図5は電気接続箱1におけるリレー装着部5の部分を示したものである。リレー装着部5には、複数のリレー6が装着される。そのため、リレー装着部5には、導電性の端子金具7が複数並んで配置される。端子金具7は、リレー6の端子8を挟持接続するための端子接続部9と、この端子接続部9が上端に連続する平板状の本体10と、本体10の下端に連続する一対のプレスフィット端子部11とを有する。プレスフィット端子部11は、第一プリント基板3と第二プリント基板4とを貫通して電気的な接続が行えるように形成される。   In FIG. 5, inside the case 2 of the electrical connection box 1, the first printed circuit board 3 and the second printed circuit board 4 are arranged in multiple stages at intervals in the thickness direction. FIG. 5 shows the portion of the relay mounting portion 5 in the electrical connection box 1. A plurality of relays 6 are mounted on the relay mounting portion 5. Therefore, a plurality of conductive terminal fittings 7 are arranged side by side in the relay mounting portion 5. The terminal fitting 7 includes a terminal connection portion 9 for sandwiching and connecting the terminal 8 of the relay 6, a flat plate-like main body 10 in which the terminal connection portion 9 is continuous at the upper end, and a pair of press fits continuous in the lower end of the main body 10 And a terminal portion 11. The press-fit terminal portion 11 is formed to penetrate the first printed circuit board 3 and the second printed circuit board 4 so as to allow an electrical connection.

リレー装着部5の部分では、少なくとも端子金具6の数分だけ、第一プリント基板3と第二プリント基板4との電気的な接続が行われる。別な言い方をすれば、一対のプレスフィット端子部11の数分だけ、第一プリント基板3と第二プリント基板4との、貫通による電気的な接続が行われる。   In the portion of the relay mounting portion 5, the electrical connection between the first printed circuit board 3 and the second printed circuit board 4 is performed by at least the number of the terminal fittings 6. In other words, the first printed circuit board 3 and the second printed circuit board 4 are electrically connected to each other by penetration for several minutes of the pair of press-fit terminal portions 11.

特開2005−26052号公報Unexamined-Japanese-Patent No. 2005-26052

上記従来技術にあっては、第一プリント基板3と第二プリント基板4との電気的な接続に関し、端子の貫通箇所が多く、また、構造がシンプルでないという問題点を有する。そのため、電気的な接続に係る品質低下が懸念される。   In the above-mentioned prior art, the electrical connection between the first printed circuit board 3 and the second printed circuit board 4 has a problem that the number of penetrating points of the terminal is large and the structure is not simple. Therefore, there is a concern that the quality of the electrical connection may deteriorate.

本発明は、上記した事情に鑑みてなされたもので、端子の貫通箇所を減らすことが可能な、また、電気的な接続品質の向上を図ることも可能な、多段基板接続構造と電気接続箱とを提供することを課題とする。   The present invention has been made in view of the above-described circumstances, and it is possible to reduce the number of penetrations of terminals and also to improve the quality of electrical connection, multistage substrate connection structure and electrical connection box And to provide.

上記課題を解決するためになされた請求項1に記載の本発明の多段基板接続構造は、少なくとも第一基板と第二基板とを板厚方向に間隔をあけて多段に配置し且つ電気的に接続するための多段基板接続構造において、前記第一基板には、該第一基板から突出する金属製の雄形貫通端子を設け、前記第二基板には、前記雄形貫通端子に合わせた凹みになる端子貫通部を設け、前記第一基板と前記第二基板には、一端が前記第一基板に電気的に接続され且つ他端が前記第二基板に電気的に接続される曲げ可能な柔軟回路を設け、さらに、該柔軟回路を曲げるようにして前記第二基板を前記第一基板の端子配設面に対向させると、前記雄形貫通端子が前記端子貫通部に貫通して電気的に接続される状態に、前記雄形貫通端子と前記端子貫通部と前記柔軟回路とを配置形成し、さらに、第三基板を備え、該第三基板には、前記雄形貫通端子に合わせた凹みになる第三基板用端子貫通部を設け、前記第一基板又は前記第二基板と前記第三基板には、一端が前記第一基板又は前記第二基板に電気的に接続され且つ他端が前記第三基板に電気的に接続される曲げ可能な第三基板用柔軟回路を設け、さらに、該第三基板用柔軟回路を曲げるようにして前記第三基板を前記第二基板に対向させると、前記端子貫通部に貫通した前記雄形貫通端子が前記第三基板用端子貫通部にも貫通して電気的に接続される状態に、前記雄形貫通端子と前記端子貫通部と前記柔軟回路とを配置形成、且つ、前記第三基板用端子貫通部と前記第三基板用柔軟回路とを配置形成することを特徴とする。
The multi-stage substrate connection structure of the present invention according to claim 1 made to solve the above-mentioned problems comprises arranging at least a first substrate and a second substrate in multiple stages at intervals in the thickness direction and electrically In the multistage substrate connection structure for connection, the first substrate is provided with a metal male through terminal projecting from the first substrate, and the second substrate is a recess that is aligned with the male through terminal. The first substrate and the second substrate are bendable such that one end is electrically connected to the first substrate and the other end is electrically connected to the second substrate. When a flexible circuit is provided and the second substrate is made to face the terminal disposition surface of the first substrate so as to bend the flexible circuit, the male through terminal penetrates the terminal through portion to be electrically The male through terminal, the terminal through portion, and the And軟回path arranged forming further comprises a third substrate, the said third substrate, the third substrate terminal penetrating section including the mating indentations in the male-type feedthrough terminal provided, the first substrate or the For a bendable third substrate, one end of the second substrate and the third substrate is electrically connected to the first substrate or the second substrate and the other end is electrically connected to the third substrate When the flexible circuit is provided and the third substrate is made to face the second substrate so as to bend the flexible circuit for the third substrate, the male through terminal penetrating through the terminal through portion is the third substrate. The male through terminal, the terminal through portion, and the flexible circuit are disposed and formed in a state where they are also electrically connected to the through portion for the terminal, and the third through electrode terminal through portion and the third A flexible circuit for three substrates is disposed and formed .

このような特徴を有する本発明によれば、金属製の雄形貫通端子と端子貫通部による電気的な接続、及び、曲げ可能な柔軟回路による電気的な接続に分けて、第一基板と第二基板との電気的な接続を行えるようにする。これにより、端子の貫通箇所を減らすことが可能になる。また、端子の貫通箇所を減らすことで構造をシンプルにすることも可能になる。さらに、シンプルな構造であれば電気的な接続品質を向上させることも可能になる。
また、本発明によれば、金属製の雄形貫通端子と第三基板用端子貫通部による電気的な接続、及び、曲げ可能な第三基板用柔軟回路による電気的な接続に分けるような構成を追加することから、基板が三枚になった場合でも端子の貫通箇所を減らすことが可能になる。
尚、基板を四枚にする必要がある場合は、請求項1の特徴を応用すればよい。すなわち、「第四基板を備え、該第四基板には、前記雄形貫通端子に合わせた凹みになる第四基板用端子貫通部を設け、前記第一基板又は前記第二基板、或いは前記第三基板と、前記第四基板には、一端が前記第一基板又は前記第二基板、或いは前記第三基板に電気的に接続され且つ他端が前記第四基板に電気的に接続される曲げ可能な第四基板用柔軟回路を設け、さらに、該第四基板用柔軟回路を曲げるようにして前記第四基板を前記第三基板に対向させると、前記端子貫通部及び前記第三基板用端子貫通部に貫通した前記雄形貫通端子が前記第四基板用端子貫通部にも貫通して電気的に接続される状態に、前記雄形貫通端子と前記端子貫通部と前記柔軟回路とを配置形成、且つ、前記第三基板用端子貫通部と前記第三基板用柔軟回路とを配置形成、且つ、前記第四基板用端子貫通部と前記第四基板用柔軟回路とを配置形成する」とすればよい。
According to the present invention having such characteristics, the first substrate and the first substrate are divided into an electrical connection by the metal male through terminal and the terminal through portion and an electrical connection by the bendable flexible circuit. Enable electrical connection with two substrates. This makes it possible to reduce the penetration points of the terminals. In addition, the structure can be simplified by reducing the number of penetrations of the terminals. Furthermore, the simple structure can also improve the quality of electrical connection.
Further, according to the present invention, the electric connection by the metal male through terminal and the terminal through portion for the third substrate and the electric connection by the flexible circuit for the third substrate which can be bent are divided. Therefore, even when the number of substrates is three, it is possible to reduce the number of penetrations of the terminals.
When the number of substrates needs to be four, the features of claim 1 may be applied. That is, “a fourth substrate is provided, and the fourth substrate is provided with a fourth substrate terminal through portion that is recessed corresponding to the male through terminal, and the first substrate or the second substrate, or the Three substrates and the fourth substrate have one end electrically connected to the first substrate or the second substrate or the third substrate, and the other end electrically connected to the fourth substrate By providing the fourth flexible circuit for the fourth substrate, and bending the fourth flexible circuit for the fourth substrate to make the fourth substrate face the third substrate, the terminal penetrating portion and the terminal for the third substrate The male through terminal, the terminal through portion, and the flexible circuit are disposed in a state where the male through terminal through the through portion is electrically connected to the fourth substrate terminal through portion. Forming the third substrate terminal penetrating portion and the third substrate flexible circuit Location formation, and, the said fourth board terminals through portion and the fourth substrate for flexible circuit may be an arrangement formed ".

請求項2に記載の本発明は、請求項1に記載の多段基板接続構造において、前記第二基板には、導電性を有する金属製の雌端子金具を設け、該雌端子金具には、前記端子貫通部に相当する部分を形成することを特徴とする。   According to a second aspect of the present invention, in the multi-stage substrate connection structure according to the first aspect, the second substrate is provided with a female metallic terminal fitting having conductivity, and the female terminal fitting is provided with the female terminal fitting. A portion corresponding to the terminal penetration portion is formed.

このような特徴を有する本発明によれば、第一基板の雄形貫通端子を貫通させるために、端子貫通部に相当する部分として金属製の雌端子金具を採用する。そして、この雌端子金具を第二基板に設けることから、電気的な接続状態を安定させることが可能になる。すなわち、電気的な接続品質を更に向上させることが可能になる。   According to the present invention having such a feature, in order to allow the male through terminal of the first substrate to penetrate, a metallic female terminal fitting is adopted as a portion corresponding to the terminal through portion. And since this female terminal fitting is provided on the second substrate, the electrical connection can be stabilized. That is, it is possible to further improve the quality of electrical connection.

請求項に記載の本発明は、請求項1又は2に記載の多段基板接続構造において、前記第三基板には、導電性を有する金属製の第三基板用雌端子金具を設け、該第三基板用雌端子金具には、前記第三基板用端子貫通部に相当する部分を形成することを特徴とする。
According to a third aspect of the present invention, in the multistage substrate connection structure according to the first or second aspect , the third substrate is provided with a female metal terminal fitting for a third substrate having conductivity, The three-substrate female terminal fitting is characterized in that a portion corresponding to the third-substrate terminal penetrating portion is formed.

このような特徴を有する本発明によれば、第一基板の雄形貫通端子を貫通させるために、第三基板用端子貫通部に相当する部分として金属製の第三基板用雌端子金具を採用する。そして、この第三基板用雌端子金具を第三基板に設けることから、電気的な接続状態を安定させることが可能になる。すなわち、電気的な接続品質を更に向上させることが可能になる。   According to the present invention having such a feature, in order to allow the male through terminal of the first substrate to pass through, the female terminal fitting for metal third substrate is adopted as a portion corresponding to the terminal through portion for the third substrate. Do. And since this 3rd board | substrate female terminal metal fitting is provided in a 3rd board | substrate, it becomes possible to stabilize an electrical connection state. That is, it is possible to further improve the quality of electrical connection.

請求項に記載の本発明は、請求項1、2又は3に記載の多段基板接続構造において、前記雄形貫通端子を板状の電源入力部分として形成することを特徴とする。
According to a fourth aspect of the present invention, in the multistage substrate connecting structure according to the first, second or third aspect, the male through terminal is formed as a plate-like power input portion.

このような特徴を有する本発明によれば、電源入力部分として雄形貫通端子を使うとともに、残りの回路を柔軟回路や第三基板用柔軟回路で構成することになる。これにより、端子の貫通箇所を更に減らすことが可能になる。また、本発明によれば、帯板状(バスバー状)に雄形貫通端子が形成されることから、複数の基板を多段に配置しても雄形貫通端子の貫通が容易になるのは勿論のこと、接触面が大きくなって接続状態を安定させることも可能になる。   According to the present invention having such a feature, a male through terminal is used as the power supply input portion, and the remaining circuit is configured by the flexible circuit and the flexible circuit for the third substrate. This makes it possible to further reduce the penetration points of the terminal. Further, according to the present invention, since the male through terminals are formed in a band plate shape (bus bar shape), it goes without saying that the male through terminals can be easily penetrated even if a plurality of substrates are arranged in multiple stages. In addition, the contact surface can be enlarged to stabilize the connection.

また、上記課題を解決するためになされた請求項に記載の本発明の電気接続箱は、複数の基板と、該複数の基板を収容するケースとを備え、前記複数の基板を前記ケース内で多段に配置して電気的に接続するために、請求項1、2、3又は4に記載の多段基板接続構造を採用してなることを特徴とする。
The electrical connection box of the present invention according to claim 5 made to solve the above-mentioned problems comprises a plurality of substrates and a case for accommodating the plurality of substrates, and the plurality of substrates in the case The multistage substrate connection structure according to claim 1, 2, 3 or 4 is adopted in order to arrange in multiple stages and electrically connect.

このような特徴を有する本発明によれば、多段基板接続構造を採用してなる電気接続箱であることから、このケース内で複数の基板を多段に配置し且つ電気的に接続することが可能になる。   According to the present invention having such a feature, since it is an electrical connection box employing a multi-stage substrate connection structure, it is possible to arrange and electrically connect a plurality of substrates in multi-stage in this case. become.

請求項1に記載された本発明によれば、少なくとも第一基板と第二基板との電気的な接続に関し、従来例よりも端子の貫通箇所を減らすことができるという効果を奏する。また、本発明によれば、端子の貫通箇所を減らすことで構造をシンプルにし、結果、電気的な接続品質の向上を図ることができるという効果も奏する。
また、本発明によれば、基板を三枚、多段に配置した場合であって端子の貫通箇所を減らすことがすることができるという効果を奏する。
According to the first aspect of the present invention, at least the electrical connection between the first substrate and the second substrate has an effect that the number of penetration points of the terminal can be reduced as compared with the conventional example. Further, according to the present invention, the structure can be simplified by reducing the number of penetrations of the terminal, and as a result, the electrical connection quality can be improved.
Further, according to the present invention, three or more substrates are disposed in multiple stages, and it is possible to reduce the number of penetrations of the terminal.

請求項2に記載された本発明によれば、電気的な接続状態を安定させることができ、結果、接続品質を更に向上させることができるという効果を奏する。   According to the second aspect of the present invention, the electrical connection state can be stabilized, and as a result, the connection quality can be further improved.

請求項に記載された本発明によれば、電気的な接続状態を安定させることができ、結果、接続品質を更に向上させることができるという効果を奏する。
According to the third aspect of the present invention, the electrical connection state can be stabilized, and as a result, the connection quality can be further improved.

請求項に記載された本発明によれば、電源入力とこれ以外とに分けて接続を行うことができ、結果、端子の貫通箇所を電源入力の分まで減らすことができるという効果を奏する。また、本発明によれば、雄形貫通端子の貫通をし易くすることができるという効果や、接続状態を安定させることができるという効果も奏する。
According to the fourth aspect of the present invention, the connection can be performed separately for the power supply input and the other, and as a result, it is possible to reduce the penetration portion of the terminal to the part of the power supply input. Further, according to the present invention, it is also possible to facilitate the penetration of the male through terminal and to stabilize the connection state.

請求項に記載された本発明によれば、請求項1、2、3又は4に記載の多段基板接続構造を採用してなる電気接続箱であることから、このケース内で複数の基板を多段に配置し且つ電気的に接続することができるという効果を奏する。
According to the fifth aspect of the present invention, since it is an electrical connection box employing the multistage substrate connection structure according to the first, second, third or fourth aspect , a plurality of substrates can be provided in this case. The effect of being able to be arranged in multiple stages and electrically connected can be achieved.

本発明の多段基板接続構造及び電気接続箱の要部を示す拡大斜視図である(実施例1)。BRIEF DESCRIPTION OF THE DRAWINGS It is an expansion perspective view which shows the multistage board | substrate connection structure of this invention, and the principal part of an electrical connection box (Example 1). 図1の多段基板接続構造による電気的な接続の完了前の状態を示す展開図である(実施例1)。It is an expanded view which shows the state before the completion of the electrical connection by the multistage board | substrate connection structure of FIG. 1 (Example 1). 他の例となる多段基板接続構造の一部を示す構成図である(実施例2)。It is a block diagram which shows a part of multistage board | substrate connection structure which becomes another example (Example 2). 図3の多段基板接続構造による電気的な接続の完了後の状態を示す斜視図である(実施例2)。It is a perspective view which shows the state after completion of the electrical connection by the multistage board | substrate connection structure of FIG. 3 (Example 2). 従来例の電気接続箱におけるリレー装着部の部分を示す断面図である。It is sectional drawing which shows the part of the relay mounting part in the electrical connection box of a prior art example.

多段基板接続構造は、少なくとも第一基板と第二基板とを板厚方向に間隔をあけて多段に配置し且つ電気的に接続するための構造である。第一基板には、この第一基板から突出する金属製の雄形貫通端子を設け、第二基板には、雄形貫通端子に合わせた凹みを有する雌端子金具を設ける。また、第一基板と第二基板には、一端が第一基板に電気的に接続され且つ他端が第二基板に電気的に接続される曲げ可能な柔軟回路を設ける。このような構成の多段基板接続構造は、柔軟回路を曲げるようにして第二基板を第一基板の端子配設面に対向させると、雄形貫通端子が雌端子金具に貫通して電気的に接続される。第一基板と第二基板は、雄形貫通端子と雌端子金具と柔軟回路とにより電気的に接続される。   The multistage substrate connection structure is a structure for arranging and electrically connecting at least the first substrate and the second substrate in multiple stages with a space in the thickness direction. The first substrate is provided with a metal male through terminal projecting from the first substrate, and the second substrate is provided with a female terminal fitting having a recess matched to the male through terminal. The first substrate and the second substrate are provided with a bendable flexible circuit whose one end is electrically connected to the first substrate and the other end is electrically connected to the second substrate. In such a multistage substrate connection structure, when the flexible circuit is bent to make the second substrate face the terminal disposition surface of the first substrate, the male through terminal penetrates the female terminal fitting and electrically Connected The first substrate and the second substrate are electrically connected by the male through terminal, the female terminal fitting, and the flexible circuit.

以下、図面を参照しながら実施例1を説明する。図1は本発明の多段基板接続構造及び電気接続箱の要部を示す拡大斜視図である。また、図2は図1の多段基板接続構造による電気的な接続の完了前の状態を示す展開図である。尚、図1中の矢印Pは上下方向、矢印Qは左右方向を示すものとする。   Hereinafter, Example 1 will be described with reference to the drawings. FIG. 1 is an enlarged perspective view showing the main part of the multistage substrate connection structure and the electrical connection box of the present invention. FIG. 2 is a development view showing a state before the completion of electrical connection by the multi-stage substrate connection structure of FIG. The arrow P in FIG. 1 indicates the vertical direction, and the arrow Q indicates the horizontal direction.

<電気接続箱21について>
図1において、引用符号21は自動車の所定位置に搭載される本発明の電気接続箱を示す。電気接続箱21は、例えば電源ボックスであって、ケース22と、このケース22内に収容される配線基板ユニット23とを含んで構成される。配線基板ユニット23は、本発明の多段基板接続構造24が採用されて、その構造により図示のような状態に形成される。すなわち、複数の基板が板厚方向に間隔をあけて多段に配置され且つ電気的に接続された状態に形成される。
<About Electrical Connection Box 21>
In FIG. 1, reference numeral 21 denotes an electrical connection box of the present invention mounted at a predetermined position of a car. The electrical connection box 21 is, for example, a power supply box, and includes a case 22 and a wiring board unit 23 housed in the case 22. The wiring board unit 23 adopts the multistage board connecting structure 24 of the present invention, and is formed in the state as shown by the structure. That is, a plurality of substrates are formed in a state of being arranged in multiple stages at intervals in the thickness direction and electrically connected.

多段基板接続構造24は、以下の説明で分かるようになるが、従来例よりも端子の貫通箇所を減らすることができ、また、端子の貫通箇所を減らすことで構造をシンプルにすることもでき、さらには、シンプルな構造にすることで電気的な接続品質を向上させることもできるという効果が得られる構造である。   As will be understood from the following description, the multistage substrate connection structure 24 can reduce the penetration points of the terminals more than the conventional example, and can also simplify the structure by reducing the penetration points of the terminals. Furthermore, the structure is such that the effect of being able to improve the quality of electrical connection can be obtained by making the structure simple.

<ケース22について>
ケース22は、ロアケース25とアッパーケース26とを備えて構成される。ロアケース25は、下側に配置される底壁27と、この底壁27の縁部から上向きに形成される側壁28とを有する。ロアケース25は、有底で上面が開口する箱形状に形成される。一方、アッパーケース26は、上側に配置される天井壁29と、この天井壁29の縁部から下向きに形成される側壁30とを有する。アッパーケース26は、ロアケース25の上面開口を覆うことができるような箱形状に形成される。
<About Case 22>
The case 22 includes a lower case 25 and an upper case 26. Lower case 25 has a bottom wall 27 disposed on the lower side, and a side wall 28 formed upward from the edge of bottom wall 27. The lower case 25 is formed in a box shape having a bottom and an upper surface opening. On the other hand, the upper case 26 has a ceiling wall 29 disposed on the upper side, and a side wall 30 formed downward from the edge of the ceiling wall 29. The upper case 26 is formed in a box shape that can cover the top opening of the lower case 25.

ロアケース25の側壁28の一部及び/又はアッパーケース26の側壁30の一部には、コネクタ接続用の開口部(図示省略)が形成される。この開口部は、後述する基板コネクタ34〜37に対して外部からコネクタを接続するための部分として形成される。尚、ケース22は、配線基板ユニット23を収容することができれば本実施例に限定されないものとする。   An opening (not shown) for connector connection is formed in part of the side wall 28 of the lower case 25 and / or part of the side wall 30 of the upper case 26. The opening is formed as a portion for connecting a connector from the outside to a substrate connector 34 to 37 described later. The case 22 is not limited to the present embodiment as long as it can accommodate the wiring board unit 23.

<配線基板ユニット23について>
図1及び図2において、配線基板ユニット23は、電気接続箱21としての機能部分であって、上段配線基板ユニット31と、下段配線基板ユニット32とを備えて構成される。このような構成の配線基板ユニット23は、上段配線基板ユニット31の基板と下段配線基板ユニット32の基板とを上下方向に多段に配置し且つ電気的に接続するための多段基板接続構造24が採用されて図示形状に形成される。
<About the wiring board unit 23>
In FIG. 1 and FIG. 2, the wiring board unit 23 is a functional part as the electric connection box 21 and is configured to include an upper wiring board unit 31 and a lower wiring board unit 32. The wiring board unit 23 having such a configuration adopts a multistage board connection structure 24 for arranging the board of the upper wiring board unit 31 and the board of the lower wiring board unit 32 in multiple stages in the vertical direction and electrically connecting them. It is formed in the illustrated shape.

<上段配線基板ユニット31について>
上段配線基板ユニット31は、公知のPCBにて形成される第一基板33と、この第一基板33の上面(表面)に実装される複数の基板コネクタ34〜37と、同じく第一基板33の上面に実装されるヒューズホルダ38及びリレー39と、第一基板33に所望のパターンで形成される図示しない回路と、第一基板33の下面(裏面)に設けられる導電性の雄形貫通端子40とを備えて構成される。
<About the upper wiring board unit 31>
The upper wiring board unit 31 includes a first substrate 33 formed of a known PCB, a plurality of substrate connectors 34 to 37 mounted on the upper surface (surface) of the first substrate 33, and the first substrate 33. A fuse holder 38 and a relay 39 mounted on the upper surface, a circuit (not shown) formed on the first substrate 33 in a desired pattern, and a conductive male through terminal 40 provided on the lower surface (rear surface) of the first substrate 33 And is configured.

<下段配線基板ユニット32について>
下段配線基板ユニット32は、公知のPCBにて形成される第二基板41と、この第二基板41に所望のパターンで形成される図示しない回路と、第二基板41の下面(裏面。図2参照)に実装される導電性の雌端子金具42とを備えて構成される。
<About lower wiring board unit 32>
The lower wiring board unit 32 includes a second substrate 41 formed of a known PCB, a circuit (not shown) formed on the second substrate 41 in a desired pattern, and a lower surface (rear surface of the second substrate 41). And a conductive female terminal fitting 42 mounted on the connector.

<多段基板接続構造24について>
多段基板接続構造24は、上述の如く、上段配線基板ユニット31の第一基板33と、下段配線基板ユニット32の第二基板41とを上下方向に(基板板厚方向に)間隔をあけて多段に配置し且つ電気的に接続するための構造であって、上段配線基板ユニット31の雄形貫通端子40と、下段配線基板ユニット32の雌端子金具42と、曲げ可能な柔軟回路43とを備えて構成される。
<Regarding multistage substrate connection structure 24>
As described above, in the multistage board connection structure 24, the first board 33 of the upper wiring board unit 31 and the second board 41 of the lower wiring board unit 32 are vertically separated (in the board thickness direction) in a multistage manner. Of the upper wiring board unit 31, the female terminal fitting 42 of the lower wiring board unit 32, and the bendable flexible circuit 43. Is configured.

<雄形貫通端子40について>
雄形貫通端子40は、第一基板33の下面から真下に突出する金属製の雄形の端子金具であって、帯板状(バスバー状)に形成される。雄形貫通端子40は、雌端子金具42との電気的な接続に必要な長さ分だけ突出するように形成される(後述する実施例2のような形状であってもよいものとする)。雄形貫通端子40は、この側部が段付きになる形状に形成される。すなわち、第一基板33の下面側が幅が広く且つ突出先端側が若干幅狭になるような段付き形状に形成される。
<About male through terminal 40>
The male through terminal 40 is a metallic male terminal fitting that protrudes directly below the lower surface of the first substrate 33, and is formed in a band plate shape (bus bar shape). The male through terminal 40 is formed to project by a length necessary for electrical connection with the female terminal fitting 42 (it may be shaped as in Example 2 described later) . The male through terminal 40 is formed to be stepped on the side. That is, the lower surface side of the first substrate 33 is formed in a stepped shape such that the width is wide and the protruding tip side is slightly narrow.

尚、雄形貫通端子40の形状は、断面長方形の厚板になるバスバー状に限らず、例えばピン状であってもよいものとする。また、本実施例のような上下二段だけの場合は、雄形貫通端子40の配置を以下で説明する雌端子金具42の配置と替えてもよいものとする。   In addition, the shape of the male through terminal 40 is not limited to a bus bar shape which is a thick plate having a rectangular cross section, and may be, for example, a pin shape. Further, in the case of only the upper and lower two stages as in this embodiment, the arrangement of the male through terminal 40 may be replaced with the arrangement of the female terminal fitting 42 described below.

雄形貫通端子40は、下段配線基板ユニット32への電源入力部分として用いられる(特に限定するものでないが、本実施例では、電源入力専用の回路部分として雄形貫通端子40が用いられる)。尚、電源入力以外の残りの回路に関しては、以下で説明する柔軟回路43が用いられる。   The male through terminal 40 is used as a power input portion to the lower wiring board unit 32 (in the present embodiment, the male through terminal 40 is used as a circuit portion dedicated to power input, though not particularly limited thereto). The flexible circuit 43 described below is used for the remaining circuits other than the power supply input.

<雌端子金具42について>
雌端子金具42は、第二基板41の下面(裏面。図2参照)に実装される雌形の端子金具であって、外観形状が箱形になるとともに雄形貫通端子40の断面形状に合わせた凹み(端子貫通部)を有するように形成される。雌端子金具42は、上記の凹みに雄形貫通端子40が貫通し、そして、電気的な接続を行うことができるように形成される。また、例えばバネ片等を有して安定的な電気接続を行うことができるようにも形成される。雌端子金具42は、雄形貫通端子40の位置に合わせて配設される。
<About female terminal fitting 42>
The female terminal fitting 42 is a female terminal fitting mounted on the lower surface (back surface, see FIG. 2) of the second substrate 41 and has a box-like appearance and conforms to the cross-sectional shape of the male through terminal 40. It is formed to have a depression (a terminal through portion). The female terminal fitting 42 is formed such that the male through terminal 40 penetrates the above-mentioned recess and can be electrically connected. In addition, for example, it is formed to have a spring piece or the like so that stable electrical connection can be made. The female terminal fitting 42 is disposed in alignment with the position of the male through terminal 40.

尚、雌端子金具42に限らず、雄形貫通端子40の断面形状に合わせた貫通孔を第二基板41に形成し、そして、この貫通孔の縁部に雄形貫通端子40との接触部を設けて対応してもよいものとする。   Not only the female terminal fitting 42 but also a through hole conforming to the cross sectional shape of the male through terminal 40 is formed in the second substrate 41, and a contact portion with the male through terminal 40 at the edge of the through hole. Shall be provided to respond.

<柔軟回路43について>
柔軟回路43は、柔軟性を有する曲げ可能な回路であって、本実施例では公知のFPCが採用される。柔軟回路43は、第一基板33と第二基板41とを電気的に接続するための回路であって、雄形貫通端子40による電源入力以外の残りの回路を集約することができるように形成される。柔軟回路43は、この一端が第一基板33の図示しない回路に対し電気的に接続される。また、他端が第二基板41の図示しない回路に電気的に接続される。柔軟回路43は、第二基板41の下面を第一基板33の下面に対向させるため、略U字状に曲げることができるような長さに形成される。
<About flexible circuit 43>
The flexible circuit 43 is a bendable circuit having flexibility, and a well-known FPC is adopted in this embodiment. The flexible circuit 43 is a circuit for electrically connecting the first substrate 33 and the second substrate 41, and is formed so that the remaining circuits other than the power input by the male through terminal 40 can be integrated. Be done. The flexible circuit 43 is electrically connected to a circuit (not shown) of the first substrate 33 at one end. Also, the other end is electrically connected to a circuit (not shown) of the second substrate 41. The flexible circuit 43 is formed to have a length that can be bent into a substantially U shape in order to make the lower surface of the second substrate 41 face the lower surface of the first substrate 33.

<多段基板接続構造24による電気的な接続について>
図2に示す如く、上段配線基板ユニット31の第一基板33と、下段配線基板ユニット32の第二基板41とを同一平面上に配置することができるように、第一基板33と第二基板41とを柔軟回路43にて接続し、この後に図1に示す如く、柔軟回路43を略U字状に曲げるようにして第二基板41を第一基板33に対向させると(端子配設面同士を対向させると)、雄形貫通端子40が雌端子金具42に貫通して電気的な接続が完了する。電気的な接続が完了すると、配線基板ユニット23がケース22に対し収容可能な状態に形成される。
<About electrical connection by multistage substrate connection structure 24>
As shown in FIG. 2, the first substrate 33 and the second substrate are arranged such that the first substrate 33 of the upper wiring substrate unit 31 and the second substrate 41 of the lower wiring substrate unit 32 can be arranged on the same plane. When the second circuit board 41 is made to face the first board 33 by bending the flexible circuit 43 in a substantially U shape as shown in FIG. When facing each other), the male through terminal 40 penetrates the female terminal fitting 42 to complete the electrical connection. When the electrical connection is completed, the wiring board unit 23 is formed to be able to be accommodated in the case 22.

<本発明の効果>
以上、図1及び図2を参照しながら説明してきたように、本発明の多段基板接続構造24によれば、雄形貫通端子40と雌端子金具42による電気的な接続、及び、曲げ可能な柔軟回路43による電気的な接続に分けて、第一基板33と第二基板41との電気的な接続を行えるようにする。これにより、従来例よりも格段に端子の貫通箇所を減らすことができるという効果を奏する。また、端子の貫通箇所を減らすことで従来例よりも構造をシンプルにすることができるという効果も奏する。さらに、シンプルな構造であれば電気的な接続品質を向上させることができるという効果も奏する。
<Effect of the present invention>
As described above with reference to FIGS. 1 and 2, according to the multistage substrate connection structure 24 of the present invention, electrical connection by the male through terminal 40 and the female terminal fitting 42 and bending are possible. The electrical connection by the flexible circuit 43 is divided so that the first substrate 33 and the second substrate 41 can be electrically connected. As a result, it is possible to significantly reduce the number of penetrations of the terminal compared to the conventional example. In addition, by reducing the number of penetrations of the terminal, the structure can be simplified as compared with the conventional example. Furthermore, the effect of improving the quality of electrical connection can be achieved with a simple structure.

以下、図面を参照しながら実施例2を説明する。図3は他の例となる多段基板接続構造の一部を示す構成図である。また、図4は図3の多段基板接続構造による電気的な接続の完了後の状態を示す斜視図である。尚、上記実施例1と基本的に同じ構成部材には同一の符号を付して詳細な説明を省略する。   Example 2 will be described below with reference to the drawings. FIG. 3 is a block diagram showing a part of another example multistage substrate connection structure. 4 is a perspective view showing a state after completion of electrical connection by the multi-stage substrate connection structure of FIG. The same reference numerals as in the first embodiment denote the same parts as in the first embodiment, and a detailed description thereof will be omitted.

<多段基板接続構造24について>
図4及び図5において、実施例2は、実施例1に対し第三基板44及び第四基板45を増やした場合でも(更に多段になった場合でも)対応することができるような多段基板接続構造24の例である。
<Regarding multistage substrate connection structure 24>
In FIG. 4 and FIG. 5, Example 2 is a multistage board connection which can cope with the case where the third substrate 44 and the fourth substrate 45 are increased as compared with Example 1 (even when there are more stages). It is an example of structure 24.

図中の雄形貫通端子40は、第一基板33(図1及び図2参照)に設けられる。雄形貫通端子40は、ここでは実施例1よりも長く、且つ、側部が複数の段付き形状に形成される。第二基板41には、雌端子金具42が設けられる。第一基板33と第二基板41には、これらを電気的に接続するための柔軟回路43(図1及び図2参照)が設けられる。   The male through terminal 40 in the figure is provided on the first substrate 33 (see FIGS. 1 and 2). Here, the male through terminal 40 is longer than that of the first embodiment, and the side is formed in a plurality of stepped shapes. A female terminal fitting 42 is provided on the second substrate 41. A flexible circuit 43 (see FIGS. 1 and 2) for electrically connecting the first substrate 33 and the second substrate 41 is provided.

第三基板44には、導電性を有する金属製の第三基板用雌端子金具46が設けられる。この第三基板用雌端子金具46は、第二基板41の雌端子金具42と同じ機能のものであって、雌端子金具42の位置に合わせて配設される。また、第三基板44には、曲げ可能な第三基板用柔軟回路(図示省略。FPCを使用)も設けられる。図示しない第三基板用柔軟回路は、この一端が第一基板33(図1及び図2参照)又は第二基板41に電気的に接続される。   The third substrate 44 is provided with a metallic third substrate female terminal fitting 46 having conductivity. The third substrate female terminal fitting 46 has the same function as the female terminal fitting 42 of the second substrate 41, and is disposed in alignment with the position of the female terminal fitting 42. Further, the third substrate 44 is also provided with a bendable third substrate flexible circuit (not shown, using an FPC). The flexible circuit for the third substrate (not shown) is electrically connected to the first substrate 33 (see FIGS. 1 and 2) or the second substrate 41 at one end.

第四基板45には、導電性を有する金属製の第四基板用雌端子金具47が設けられる。この第四基板用雌端子金具47は、第二基板41の雌端子金具42と同じ機能のものであって、雌端子金具42及び第三基板用雌端子金具46の位置に合わせて配設される。また、第四基板45には、曲げ可能な第四基板用柔軟回路(図示省略。FPCを使用)も設けられる。図示しない第四基板用柔軟回路は、この一端が第一基板33(図1及び図2参照)又は第二基板41、或いは第三基板44に電気的に接続される。   The fourth substrate 45 is provided with a fourth substrate female terminal fitting 47 made of a conductive metal. The fourth substrate female terminal fitting 47 has the same function as the female terminal fitting 42 of the second substrate 41, and is disposed in alignment with the positions of the female terminal fitting 42 and the third substrate female terminal fitting 46. Ru. The fourth substrate 45 is also provided with a bendable fourth substrate flexible circuit (not shown, using an FPC). The flexible circuit for the fourth substrate (not shown) is electrically connected to the first substrate 33 (see FIGS. 1 and 2) or the second substrate 41 or the third substrate 44 at one end.

<多段基板接続構造24による電気的な接続について>
実施例1と同様に、第二基板41を第一基板33に対向させ、また、第三基板44を第二基板41に対向させ、さらには、第四基板45を第三基板44に対向させると、長い雄形貫通端子40が雌端子金具42、第三基板用雌端子金具46、及び第四基板用雌端子金具47に貫通して(第二基板41及び第三基板44にも貫通する)電気的な接続が完了する。
<About electrical connection by multistage substrate connection structure 24>
As in the first embodiment, the second substrate 41 is opposed to the first substrate 33, the third substrate 44 is opposed to the second substrate 41, and the fourth substrate 45 is opposed to the third substrate 44. And a long male through terminal 40 penetrates through the female terminal fitting 42, the third terminal socket 46 for the third substrate, and the fourth terminal socket for the fourth substrate (also penetrates the second substrate 41 and the third substrate 44) ) Electrical connection is complete.

<本発明の効果>
以上、図3及び図4を参照しながら説明してきたように、実施例2も実施例1と同様の効果を奏するのは勿論である。すなわち、従来例よりも格段に端子の貫通箇所を減らすことができるという効果を奏する。また、端子の貫通箇所を減らすことで従来例よりも構造をシンプルにすることができるという効果も奏する。さらに、シンプルな構造であれば電気的な接続品質を向上させることができるという効果も奏する。
<Effect of the present invention>
As described above with reference to FIGS. 3 and 4, it goes without saying that the second embodiment exhibits the same effect as the first embodiment. That is, the effect of being able to reduce the penetration part of a terminal remarkably compared with a prior art example is show | played. In addition, by reducing the number of penetrations of the terminal, the structure can be simplified as compared with the conventional example. Furthermore, the effect of improving the quality of electrical connection can be achieved with a simple structure.

この他、本発明は本発明の主旨を変えない範囲で種々変更実施可能なことは勿論である。   Besides the above, it goes without saying that the present invention can be variously modified without departing from the scope of the present invention.

21…電気接続箱、 22…ケース、 23…配線基板ユニット、 24…多段基板接続構造、 25…ロアケース、 26…アッパーケース、 27…底壁、 28…側壁、 29…天井壁、 30…側壁、 31…上段配線基板ユニット、 32…下段配線基板ユニット、 33…第一基板、 34〜37…基板コネクタ、 38…ヒューズホルダ、 39…リレー、 40…雄形貫通端子、 41…第二基板、 42…雌端子金具(端子貫通部)、 43…柔軟回路、 44…第三基板、 45…第四基板、 46…第三基板用雌端子金具(第三基板用端子貫通部)、 47…第四基板用雌端子金具(第四基板用端子貫通部)   DESCRIPTION OF SYMBOLS 21 ... Electrical connection box, 22 ... Case, 23 ... Wiring board unit, 24 ... Multistage board connection structure, 25 ... Lower case, 26 ... Upper case, 27 ... Bottom wall, 28 ... Side wall, 29 ... Ceiling wall, 30 ... Side wall, 31: upper wiring board unit, 32: lower wiring board unit, 33: first board, 34 to 37: board connector, 38: fuse holder, 39: relay, 40: male through terminal, 41: second board, 42 ... Female terminal fitting (terminal penetrating portion), 43 Flexible circuit, 44 ... Third substrate, 45 ... Fourth substrate, 46 ... Female terminal fitting for third substrate (terminal penetrating portion for third substrate), 47 ... Fourth Female terminal fitting for board (4th board terminal penetration part)

Claims (5)

少なくとも第一基板と第二基板とを板厚方向に間隔をあけて多段に配置し且つ電気的に接続するための多段基板接続構造において、
前記第一基板には、該第一基板から突出する金属製の雄形貫通端子を設け、前記第二基板には、前記雄形貫通端子に合わせた凹みになる端子貫通部を設け、前記第一基板と前記第二基板には、一端が前記第一基板に電気的に接続され且つ他端が前記第二基板に電気的に接続される曲げ可能な柔軟回路を設け、さらに、該柔軟回路を曲げるようにして前記第二基板を前記第一基板の端子配設面に対向させると、前記雄形貫通端子が前記端子貫通部に貫通して電気的に接続される状態に、前記雄形貫通端子と前記端子貫通部と前記柔軟回路とを配置形成し、
さらに、第三基板を備え、該第三基板には、前記雄形貫通端子に合わせた凹みになる第三基板用端子貫通部を設け、前記第一基板又は前記第二基板と前記第三基板には、一端が前記第一基板又は前記第二基板に電気的に接続され且つ他端が前記第三基板に電気的に接続される曲げ可能な第三基板用柔軟回路を設け、さらに、該第三基板用柔軟回路を曲げるようにして前記第三基板を前記第二基板に対向させると、前記端子貫通部に貫通した前記雄形貫通端子が前記第三基板用端子貫通部にも貫通して電気的に接続される状態に、前記雄形貫通端子と前記端子貫通部と前記柔軟回路とを配置形成、且つ、前記第三基板用端子貫通部と前記第三基板用柔軟回路とを配置形成する
ことを特徴とする多段基板接続構造。
In a multistage substrate connection structure for arranging at least a first substrate and a second substrate in multiple stages at intervals in the thickness direction and electrically connecting them,
The first substrate is provided with a metal male through terminal projecting from the first substrate, and the second substrate is provided with a terminal through portion which becomes a recess matched to the male through terminal; One substrate and the second substrate are provided with a bendable flexible circuit having one end electrically connected to the first substrate and the other end electrically connected to the second substrate, and the flexible circuit And the male through terminal is electrically connected to the terminal through portion when the second substrate is made to face the terminal arrangement surface of the first substrate so that the second substrate is bent. Arranging and forming a through terminal, the terminal through portion, and the flexible circuit ;
Furthermore, a third substrate is provided, and the third substrate is provided with a through hole for a third substrate terminal that is recessed corresponding to the male through terminal, and the first substrate or the second substrate and the third substrate are provided. And a bendable third substrate flexible circuit having one end electrically connected to the first substrate or the second substrate and the other end electrically connected to the third substrate, When the third substrate is made to face the second substrate so as to bend the flexible circuit for the third substrate, the male through terminal penetrating through the terminal through portion also penetrates through the third substrate terminal through portion. In the state of being electrically connected, the male through terminal, the terminal through portion, and the flexible circuit are disposed and formed, and the third substrate terminal through portion and the third substrate flexible circuit are disposed. Multi-stage substrate connection structure characterized by forming .
請求項1に記載の多段基板接続構造において、
前記第二基板には、導電性を有する金属製の雌端子金具を設け、該雌端子金具には、前記端子貫通部に相当する部分を形成する
ことを特徴とする多段基板接続構造。
In the multistage substrate connection structure according to claim 1,
The second substrate is provided with a conductive female metal terminal fitting, and the female terminal metal fitting is formed with a portion corresponding to the terminal penetrating portion.
請求項1又は2に記載の多段基板接続構造において、
前記第三基板には、導電性を有する金属製の第三基板用雌端子金具を設け、該第三基板用雌端子金具には、前記第三基板用端子貫通部に相当する部分を形成する
ことを特徴とする多段基板接続構造。
In the multistage substrate connection structure according to claim 1 or 2,
Wherein the third substrate, the female terminal fitting metal third substrate having conductivity is provided, the said third substrate female terminal fitting, to form a portion corresponding to the terminal through portion for the third substrate Multi-stage substrate connection structure characterized by
請求項1、2又は3に記載の多段基板接続構造において、
前記雄形貫通端子を板状の電源入力部分として形成する
ことを特徴とする多段基板接続構造。
In the multistage substrate connection structure according to claim 1, 2 or 3,
A multistage substrate connection structure, wherein the male through terminal is formed as a plate-like power input portion .
複数の基板と、該複数の基板を収容するケースとを備え、前記複数の基板を前記ケース内で多段に配置して電気的に接続するために、請求項1、2、3又は4に記載の多段基板接続構造を採用してなる
ことを特徴とする電気接続箱。
A plurality of substrates and a case for containing the plurality of substrates, wherein the plurality of substrates are arranged in multiple stages in the case and electrically connected, are described in claim 1, 2, 3 or 4 An electrical connection box characterized by employing a multi-stage substrate connection structure of
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