JP6535779B1 - Measuring machine arrangement position determining device, measuring machine arrangement position determining method and program - Google Patents

Abstract

To reduce the processing time for determining the placement positions of measuring instruments, and to determine the number of placement positions for measuring instruments that can be measured over a wide range. According to one embodiment, a measuring apparatus placement position determining apparatus is visible when a measured object is viewed from a candidate position among a plurality of planes included in a base model such as a measured object generated by SfM, and A surface selection process (S7) for selecting the surface corresponding to the designated measurement part as the selected surface, and one of the plurality of determined candidate positions for which the number of the selected surface to be measured is the largest The above-mentioned candidate position is calculated using mathematical programming, and the arrangement position determination processing (S8) and the like to determine the calculated candidate position as a measuring machine arrangement position is performed. Based on the developed image of the model, a surface that is visible when the object to be measured is viewed from the candidate position is identified. [Selected figure] Figure 2

Description

  The present invention relates to a measuring instrument placement position determining apparatus, a measuring instrument placement position determining method, and a measuring instrument placement position determination apparatus for determining a position where the measuring instrument is disposed around the measurement subject when measuring the measurement subject by a measuring instrument such as a laser scanner. About the program.

  Working efficiency can be improved by utilizing such three-dimensional models of facilities, machines, buildings, etc. in designing or constructing facilities, machines, buildings, etc., such as air conditioning, water supply and drainage, telecommunications, etc. For example, when performing the repair work of the air conditioning equipment, by utilizing the three-dimensional model of the existing equipment, it is possible to grasp the current state of the existing equipment easily and accurately, and the planning of the construction plan, the design of replacement parts, ordering etc. Can be done efficiently.

  For generation of a three-dimensional model, a three-dimensional measuring machine which has high measurement accuracy and can be installed on the ground and can perform three-dimensional measurement of an object to be measured is used. Specifically, a ground-based three-dimensional laser scanner is used to generate a three-dimensional model. In order to generate a three-dimensional model, it is necessary to measure (scan) an object to be measured from various angles. Therefore, when generating a three-dimensional model of equipment and the like, a plurality of positions (measuring machine arranging positions) at which the measuring machines are arranged around the equipment and the like are determined, and one of the determined measuring machine arranging positions is determined. An operation of arranging a measuring machine at a measuring machine arrangement position and measuring equipment etc. Thereafter, arranging a measuring machine at another measuring machine arrangement position among a plurality of determined measuring machine arrangement positions and measuring the equipment etc. repeat. A three-dimensional model such as equipment is generated by combining measurement data obtained at each measuring machine arrangement position in this manner.

  Conventionally, the determination of the arrangement position of the measuring instrument is performed by the operator visually observing the drawing of the facility or the like by visual observation in advance of the measurement, or visually observing the actual facility or the like at the measurement site. The equipment is a three-dimensional structure in which many parts having complex shapes are closely combined. Therefore, when the facility is viewed from a certain place around the facility, a large number of states (occlusions) can occur where the far side of the facility is hidden behind the near side. The operator determines a plurality of different measuring machine arrangement positions so that the laser beam from the measuring machine also reaches the far side of such equipment and the measurement of the relevant area is performed without any leak.

  The task of determining the placement position of the measuring instrument is not easy, and it takes a lot of skill and experience to perform this task quickly or efficiently. If the skills and experience of the workers are not sufficient, the efficiency of measurement work and 3D model generation work may deteriorate. For example, when the measuring instrument arrangement position is insufficient, sufficient measurement data can not be obtained by one measurement operation, and as a result, the measurement operation has to be performed again, and the efficiency of the measurement operation may be deteriorated. . In addition, when the measuring instrument arrangement position is excessive, the amount of measurement data obtained by the measurement becomes enormous, and as a result, the time for generation processing of the three-dimensional model becomes long, and the efficiency of the three-dimensional model generation operation deteriorates. There is something to do.

  In view of such a conventional situation, the inventor of the present application generates an SfM (Structure from Motion) model of equipment etc. before measuring the equipment etc. with a measuring machine, and measures the equipment based on this SfM model. We have proposed an optimal placement planning method for measuring machines that determines the placement position almost automatically (see Non-Patent Document 1 below). The specific contents of this method are as follows. First, a rough 3D model (SfM model) to be measured is generated from a group of photographs obtained by photographing the space to be measured with a camera. Next, the measurement target space is divided into voxels, and the divided voxels are classified according to the space occupancy state. Next, based on the space occupancy state of each voxel, the floor surface voxel that can be arranged by the measuring machine is specified, and the set of voxels located at a predetermined height from the floor surface voxel is determined as the measuring machine position candidate voxel set . Next, a view frustum is defined from the camera position at the time of SfM model generation, ray tracing is performed on voxels in the view frustum from the camera position, and a measurement target voxel satisfying a predetermined condition is specified. Next, using the greedy method, which is an approximation optimization method, is a set of measuring machine positions that are observable from measuring machine placement candidate voxels, satisfy some constraints, and maximize the number of measurement target voxels. Estimate. According to this optimal arrangement planning method, it is possible to obtain a smaller number of measuring machine arranging positions capable of measuring a wide range as compared with a method in which the operator visually observes and determines the measuring machine arranging position it can. In addition, according to this optimal layout planning method, even if the worker has insufficient skills or experience, the measuring machine placement position can be easily determined.

Wakasaka Hideki, 2 others, "Optimal scanner layout plan for air-conditioning as-built 3D model construction with difficulty measurement department (second report), 2017 Proceedings of the Spring Conference of the Precision Engineering Society 2017" , H07, p. 553-554

  By the way, as it describes in the said nonpatent literature 1, the processing time which determines a measuring machine arrangement position using the optimal arrangement | positioning plan method of a measuring machine mentioned above is 26.7 minutes, for example. It is desirable to further shorten the processing time for determining the measuring machine arrangement position and to improve the efficiency of the measuring machine arrangement position determining operation.

  Further, in the above-described optimal arrangement planning method for measuring machines, the greedy method is used to determine the measuring machine arrangement position. For this reason, there is a tendency that the number (number of scans) of the meter arrangement positions to be determined tends to increase. Therefore, it is desirable to be able to measure a wide range with fewer measuring instrument disposition positions, and to improve the efficiency of the measuring operation of equipment using a three-dimensional measuring instrument.

  Therefore, a first object of the present invention is to provide a measuring device placement position determining device, a measuring device placement position determining method, and a program capable of shortening the processing time for determining the measuring device placement position. The second object of the present invention is to provide a measuring device placement position determining device, measuring device placement position determining method and program capable of determining a smaller number of measuring device placement positions capable of measuring a wide range. It is to do.

  In order to solve the above-mentioned subject, in order to measure a position, shape, or other attribute of a thing to be measured with a measuring machine which irradiates a laser beam and performs three-dimensional measurement, the measuring machine arrangement position determination device of the present invention A measuring instrument placement position determining apparatus for determining a measuring machine placement position for placing a measuring instrument around an object to be measured, which can be obtained by photographing an object to be measured and its surroundings while changing its position or direction with a camera. An object to be measured which is generated using a plurality of images and represented by a set of a plurality of surfaces and a base model which is a three-dimensional model of the periphery thereof; Among them, a measuring part designating unit for specifying a measuring part to be measured by a measuring machine, and a support for supporting the measuring machine and the measuring machine on a floor surface on which an object to be measured in the base model is placed. Candidate position determination unit that recognizes a plurality of possible parts and determines the measurement reference position of the measurement machine when the measurement machine and the support are placed in each of the recognized parts as a candidate position, and included in the base model Among the plurality of surface portions, a surface portion selecting portion that is visible when viewed from the candidate position and selects the surface portion corresponding to the measurement portion designated by the measurement portion designation portion as the selected surface portion, and the candidate position determination Of the plurality of candidate positions determined by the unit, one or more candidate positions at which the number of selected surface portions to be measured is the largest is calculated using mathematical programming, and the calculated candidate positions are arranged at the measuring machine arrangement positions And the surface selection unit generates a developed image of the base model viewed from the candidate position, and is drawn in the developed image among the plurality of surfaces included in the base model. A candidate position And identifies as a surface component which is the visible when viewed from.

  In the measuring device placement position determining apparatus of the present invention, a developed image of the base model viewed from the candidate position is generated, and among the plurality of surfaces included in the base model, the surface drawn in the developed image is a candidate Identify as a surface that is visible when viewed from the position. As a result, it is possible to shorten the time required for the process of determining the measuring instrument arrangement position. Therefore, it is possible to improve the efficiency of the determination work of the measuring machine arrangement position.

  Further, in the measuring device placement position determining apparatus of the present invention, the surface selection unit assigns unique color information for each surface to a plurality of surfaces included in the base model, and then a base viewed from the candidate position. A developed image of the model is generated, and among the plurality of surfaces included in the base model, the surface to which the color information possessed by each pixel of the developed image is assigned is selected as the surface visible from the candidate position You may do it. Thereby, it is possible to easily identify the surface that is visible when viewed from the candidate position. In addition, it is possible to shorten the time required for the process of specifying the surface that is visible when viewed from the candidate position.

  Further, in the measuring instrument placement position determination apparatus of the present invention, the placement position determination unit determines that the number of candidate positions to be calculated is equal to or less than the set upper limit, and a plurality of candidates determined by the candidate position determination unit. Of the positions, the optimal candidate position where the number of selected surface portions measured from one or more candidate positions is the largest is calculated using the exact solution method of the linear integer optimization problem which is one of mathematical programming methods. The calculated optimal candidate position may be determined as the measuring machine arrangement position. Furthermore, the branch and bound method may be selected as an exact solution method for the above linear integer optimization problem. This makes it possible to determine a smaller number of measuring machine placement positions that can measure a wide range. Therefore, it is possible to improve the efficiency of the measurement operation of equipment and the like using the three-dimensional measurement machine.

  Further, in the measuring apparatus placement position determining apparatus of the present invention, the measuring part specifying unit specifies at least high level or low level importance in a measuring part to be measured by the measuring machine in the object in the base model. Among the plurality of planes included in the base model, the minute selecting unit is visible when viewed from the candidate position, corresponds to the measuring unit for which the high level importance is specified by the measuring unit specifying unit, and is high The surface satisfying the level measurement condition is selected as the high level selected surface, or among the plurality of surfaces included in the base model, it is visible when viewed from the candidate position, and the measurement part specification unit determines low level importance An area corresponding to the measurement part for which the degree is specified and which satisfies the low level measurement condition is selected as the low level selection area, and the arrangement position determination unit determines the plurality of candidate positions determined by the candidate position determination unit. Among them, one or more candidate positions at which the number of high level selection surfaces to be measured is the largest is calculated using mathematical programming, and the calculated candidate positions are determined as the measuring machine arrangement positions for high accuracy measurement. Or, among the plurality of candidate positions determined by the candidate position determination unit, one or more candidate positions at which the number of measured low level selection surfaces is largest is calculated using mathematical programming, and the calculation The determined candidate position is determined as the measuring machine arrangement position for low accuracy measurement, and the high level measurement condition is such that the incident angle at which the laser light emitted from the measuring machine is incident on the surface included in the base model has a first angle range The low level measurement condition includes that the laser light emitted from the measurement device is incident on the surface portion included in the base model at a second angle range, and the second angle range is included. Is from the first angle range It may be greater. With this configuration, it is possible to quickly measure the measuring instrument arrangement position capable of accurately measuring a portion of high importance in the object to be measured and the portion of low importance in the object to be measured with reduced accuracy. The measuring machine arrangement positions can be determined respectively. As a result, while maintaining the required measurement quality, the working time of the three-dimensional measurement can be shortened, and the efficiency of the three-dimensional measuring operation can be improved overall.

  Further, in the measuring device placement position determining apparatus of the present invention, the high level measurement condition includes that the distance between the measuring device and the surface included in the base model is a first distance range, and the low level measurement is performed. The condition may include that the distance between the measuring instrument and the surface included in the base model is a second distance range, and the second distance range may be larger than the first distance range. With this configuration as well, it is possible to quickly measure the measuring instrument arrangement position which can measure the high importance part of the object to be measured with high accuracy, and the low importance part of the object to be measured with reduced accuracy. It is possible to determine each of the possible meter arrangement positions.

  Moreover, in order to solve the above-mentioned subject, the measuring machine arrangement position determining method of the present invention is to measure the position, shape or other attribute of the object to be measured by a measuring machine which performs three-dimensional measurement by irradiating laser light. A measuring instrument arrangement position determining method for determining a measuring machine arrangement position for arranging a measuring instrument around the object to be measured, and photographing the object to be measured and its surroundings while changing its position or direction with a camera And a base model acquiring step of acquiring a base model which is a three-dimensional model of an object to be measured which is generated by using a plurality of images obtained by The measuring machine and measuring machine are supported on the measurement part specification step of specifying the measuring part to be measured by the measuring machine among the measured objects and the floor surface on which the object to be measured in the base model is placed. Candidate position determining step of recognizing as a candidate position the measuring reference position of the measuring machine when the measuring machine and the supporting tool are placed on each of the recognized parts, And a surface selection step of selecting a surface corresponding to the measurement portion designated in the measurement portion designation step among the plurality of surface portions included in the model as the selected surface. Among the plurality of candidate positions determined in the candidate position determining step, one or more candidate positions at which the number of measured selected surface portions is largest is calculated using mathematical programming, and the calculated candidate positions And an arrangement position determination step of determining the measurement unit arrangement position, and in the surface portion selection step, a developed image of the base model viewed from the candidate position is generated, and a plurality of surface portions included in the base model are displayed. The surface region drawn on the image, and identifies as a surface region that is visible when viewed from the candidate positions. According to the measuring machine arrangement position determination method of the present invention, the same function and effect as the measuring machine arrangement position determining apparatus of the present invention can be obtained.

  Further, in order to solve the above problems, the program of the present invention is an object to be measured in order to measure the position, shape or other attributes of the object to be measured by a measuring device that performs three-dimensional measurement by irradiating laser light. Is a program for causing a computer to execute a measuring instrument placement position determining method for determining a measuring instrument placement position where a measuring instrument is placed around the area, the measuring instrument placement position determining method changing the position or direction with a camera An object to be measured which is generated by using a plurality of images obtained by photographing the object to be measured and the periphery thereof and is represented by a set of a plurality of surfaces, and a base model which is a three-dimensional model of the periphery thereof A base model acquisition process, a measurement part specification process for specifying a measurement part to be measured by a measuring machine in an object to be measured in the base model, On the floor on which the object is placed, the measuring machine and the supporting part for supporting the measuring machine can be recognized, and when the measuring machine and the supporting tool are placed on each of the recognized parts, the measuring machine Of the candidate position determination step of determining the measurement reference position of the target as a candidate position and the measurement portion which is visible when viewed from the candidate position among the plurality of surface portions included in the base model and designated in the measurement portion specification step Surface selection step of selecting a surface portion corresponding to the selected surface portion, and one or more candidates for which the number of selected surface portions to be measured is the largest among a plurality of candidate positions determined in the candidate position determination step Calculating the position using mathematical programming and determining the calculated candidate position as the measuring machine position, and the planar part selecting step generates a developed image of the base model viewed from the candidate position. And, among the plurality of faces component contained in the base model, the surface region drawn on the expanded image, and identifies as a surface region that is visible when viewed from the candidate positions. According to the program of the present invention, it is possible to obtain the same effects as those of the measuring instrument placement position determining apparatus of the present invention.

  According to the present invention, it is possible to shorten the processing time for determining the meter arrangement position. Further, according to the present invention, it is possible to determine a smaller number of measuring machine disposition positions capable of measuring a wide range.

It is a block diagram which shows the structure of the measuring machine arrangement position determination apparatus of embodiment of this invention. It is a flowchart which shows the flow of the preparatory work for determining a measuring machine arrangement position, and the process in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is explanatory drawing which looked at the air-conditioning equipment which is an example of to-be-measured object from upper direction. It is explanatory drawing which looked at a part of air conditioning installation in FIG. 3 from the side. It is an explanatory view showing a base model typically. It is explanatory drawing which shows designation | designated process of a measurement part and importance in the measuring device arrangement position determination apparatus of embodiment of this invention. It is a flowchart which shows the voxel model production | generation process in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is explanatory drawing which shows the concept of a voxel model. It is explanatory drawing which shows the position of a camera, and the view frustum of a camera. It is explanatory drawing which shows the production | generation method of the voxel model in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is a flowchart which shows the candidate position determination process in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is explanatory drawing which shows the recognition method of a floor surface voxel. It is an explanatory view showing a measuring instrument model. It is explanatory drawing which shows the area | region where the candidate position determined by the measuring device arrangement position determination apparatus of embodiment of this invention exists. It is a flowchart which shows the surface part selection process in the measuring device arrangement position determination apparatus of embodiment of this invention. It is explanatory drawing which shows an example of the expansion | deployment image of a base model. FIG. 7 is an explanatory view showing a part of a developed image in an enlarged manner. It is explanatory drawing which shows the method of selecting the visible surface part which satisfies measurement conditions. It is a flowchart which shows the main routine of the arrangement position determination processing in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is a flowchart which shows the high level arrangement position determination process in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is a graph which shows a relation between the upper limit value of the number of high level placement positions and the total number of high level selection surfaces measured by placing the measuring instrument at the high level placement position. It is a flowchart which shows the low level arrangement position determination process in the measuring machine arrangement position determination apparatus of embodiment of this invention. It is explanatory drawing which shows an example of the measuring machine arrangement position determined by the measuring machine arrangement position determination apparatus of embodiment of this invention.

(Measurement machine placement position determination device)
FIG. 1 shows the configuration of a measuring instrument placement position determining apparatus 1 according to an embodiment of the present invention. In FIG. 1, when measuring a measurement object by the measurement device, the measurement device placement position determination device 1 is a device that determines the position (measurement device placement position) where the measurement device is disposed around the measurement object.

  The measuring instrument is a terrestrial three-dimensional laser scanner. This measuring instrument can generate point cloud data indicating the position of each part of the measured object in the three-dimensional space by irradiating the laser light, whereby the position, shape, and other attributes of the measured object Can be measured. In addition, the measuring instrument can change the irradiation direction of the laser light, for example, 180 degrees in the horizontal plane, and can change it, for example, 360 degrees in the vertical plane. Also, when measuring an object to be measured, the measuring instrument is placed on the ground or floor surface using a support such as a tripod.

  The measuring instrument placement position determining apparatus 1 includes an arithmetic processing unit 2, a storage unit 3, an operation unit 4, a display unit 5, and a data input / output unit 6. The measuring instrument placement position determination apparatus 1 can be realized by causing a computer such as a personal computer to read and execute a computer program that causes a computer to function as the measuring instrument placement position determination apparatus. In this case, the processing unit 2 is a CPU (central processing unit) and a GPU (graphics processing unit) provided in the computer. The storage unit 3 is a storage device provided in the computer. The operation unit 4 is a keyboard and a pointing device connected to the computer, and the display unit 5 is a display device connected to the computer. The data input / output unit 6 may be a disk drive provided in a computer, a data input / output device for inputting / outputting data to / from an external storage device such as a USB (universal serial bus) memory, or a computer network Communication device etc. which communicate with other computers via

  The arithmetic processing unit 2 further includes a base model reading unit 11, a measurement part specification unit 12, a voxel model generation unit 13, a candidate position determination unit 14, a surface part selection unit 15, and an arrangement position determination unit 16. These parts in the arithmetic processing unit 2 are realized by the arithmetic processing unit 2 executing the computer program.

  The base model reading unit 11 performs processing for reading into the storage unit 3 an object to be measured generated by camera photographing and SfM and a three-dimensional model (hereinafter, referred to as “base model”) around the object. The base model is a representation of the object to be measured and the periphery thereof as a set (mesh) of surface portions. The base model reading unit 11 is a specific example of a base model acquisition unit.

  The measurement part specification unit 12 performs a process of specifying the importance of the part to be measured and the part to be measured in the measurement object according to the input by the operator.

  The voxel model generation unit 13 divides the base model into voxels (volume elements). Hereinafter, a base model divided by voxels is referred to as a "voxel model".

  The candidate position determination unit 14 performs a process of determining a position (hereinafter, referred to as a “candidate position”) which is a candidate of the measuring machine arrangement position based on the voxel model.

  Of the plurality of surfaces included in the base model, the surface selection unit 15 is visible when viewed from each candidate position, corresponds to the measurement portion designated by the operator, and satisfies the measurement conditions described later. Perform processing to select.

  The arrangement position determination unit 16 determines, as a measurement machine arrangement position, an optimum position for measuring each surface portion selected by the surface portion selection unit 15 among the candidate positions determined by the candidate position determination unit 14. Do the processing.

  FIG. 2 shows the flow of processing in the preparatory work for determining the measuring machine arrangement position and the measuring machine arrangement position determination apparatus 1. Hereinafter, operations and processes from the start of the preparation work for determining the measuring machine arrangement position to the determination of the measuring machine arrangement position by the measuring machine arrangement position determination device 1 will be described.

  Moreover, in the following description, the case where an object to be measured is an air conditioner as shown in FIG. 3 and FIG. 4 is taken as an example. FIG. 3 is a view of the air conditioning system from above, and FIG. 4 is a view of a part of the air conditioning system in FIG. 3 from the side. As shown in FIG. 3, the air conditioning equipment includes a plurality of boilers 21, an oil tank 22, a heat exchanger 23, a return water tank 24, a duct 25, a plurality of pipes 26, a plurality of valves 27 and the like. Each boiler 21 is installed on the floor surface 29 of the equipment room 28, as shown in FIG. The oil tank 22, the heat exchanger 23, and the return water tank 24 are also installed on the floor surface 29 of the equipment room 28 as with the boilers 21. The duct 25 is disposed near the ceiling of the equipment room 28. Each pipe 26 is mainly disposed near the ceiling or near the side wall of the equipment room 28. Each valve 27 is also disposed mainly near the ceiling or near the side wall of the equipment chamber 28.

(Shooting and generation of base model)
First, as shown in step S1 in FIG. 2, as a preparatory work when determining the measuring machine arrangement position using the measuring machine arrangement position determination device 1, the operator photographs the air conditioning facility and its surroundings with a camera A plurality of two-dimensional images obtained by photographing are used to generate a base model of the air conditioner and its surroundings.

  That is, the worker photographs the air conditioner and the surrounding area using, for example, a digital still camera or a digital video camera. The operator photographs the air conditioner and its surroundings while changing the position or direction of the camera. For example, the operator photographs so as to include not only the boiler 21 and the piping 26 in the equipment room 28 and the valve 27 but also the floor surface 29 on which each boiler 21 is installed. Photographing provides a large number of two-dimensional images of the air conditioner and its surroundings viewed from various locations and directions.

  Furthermore, the worker uses SfM software to generate a base model which is a three-dimensional model of the air conditioner and its surroundings based on these two-dimensional images. FIG. 5 schematically shows a base model. As shown in FIG. 5, the base model is a representation of the air conditioner and its periphery as a set (mesh) of triangular surface portions 51. The data of the base model includes the position of the vertex of each surface 51, the color information of each surface 51, and the information of the camera position and direction (shooting position and shooting direction). The position of the vertex of each surface 51 included in the data of the base model is expressed as coordinate values of an orthogonal coordinate system in a three-dimensional space. The base model is rough data having a low degree of shape reproducibility as compared with a three-dimensional point cloud model (final three-dimensional model) generated by measuring an air conditioner with a three-dimensional laser scanner.

(Read base model data)
Next, as shown in step S2 in FIG. 2, the operator causes the measuring instrument placement position determination device 1 to read data of the air conditioning facility and the base model around it. That is, the worker operates the computer to start a computer program that causes the computer to function as the measuring instrument placement position determination apparatus 1. As a result, the computer becomes the measuring instrument placement position determination device 1. The operator operates the operation unit 4 of the measuring instrument placement position determination device 1 to cause the measuring instrument placement position determination device 1 to read data of the base model. As a storage location of data of the base model generated by the SfM software, for example, a storage device of the computer operating as the measuring device placement position determination device 1, an external storage device such as a USB memory, etc., the measurement device placement position determination device 1 The storage device etc. of the other computer connected via the computer network with the said computer currently operating as is conceivable. The base model reading unit 11 of the measuring instrument placement position determination apparatus 1 reads data of the base model from such a storage location according to the operation of the operator, and stores the data in the storage unit 3.

  Further, after storing data of the base model in the storage unit 3, the base model reading unit 11 assigns identification numbers to the respective planes included in the base model. Hereinafter, this identification number is referred to as a "face-to-face ID". The surface part ID is a value that is different for each surface part included in the base model.

(Specification of measurement part and importance)
Next, as shown in step S3 in FIG. 2, the operator designates the importance of the part (measurement part) to be measured by the measuring machine and the measurement part of the air conditioning equipment. That is, the operator inputs an instruction to perform processing of specifying the measurement part and the importance level to the measuring instrument placement position determination device 1. In response to this, the measurement part designating unit 12 of the measuring instrument placement position determining apparatus 1 displays the air conditioner and the base model around it on the screen of the display unit 5. Here, FIG. 6 shows the base model displayed on the screen of the display unit 5. The operator operates the operation unit 4 while looking at the base model displayed on the screen of the display unit 5 to designate the measurement part and the importance. For example, in FIG. 6, a portion surrounded by a thick solid line is a measurement portion with high importance. In addition, a portion surrounded by a thick two-dot chain line is a measurement portion with a low level of importance. The measurement part specification unit 12 specifies a surface part ID corresponding to a measurement part with a high level of importance and a surface part corresponding to a measurement part with a low level of importance specified by the operator in the base model. The measurement partial data indicating the surface part ID is generated and stored in the storage unit 3.

  In the measurement part specification unit 12, for example, (1) the angle or size of the base model displayed on the screen of the display unit 5 as a function related to the user interface for the operator to specify the measurement parts and their importance. The function of changing the size, (2) the function of attaching different colors to the measurement portions designated by the operator for display in the base model displayed on the screen of the display unit 5, and (3) the importance There may be provided a function of specifying a high-level measurement part and a measurement part of low importance degree by inputting coordinate values.

(Input of measuring instrument information and measurement condition information)
Next, as shown in step S4 in FIG. 2, the operator operates the operation unit 4 to input the measuring instrument information and the measuring condition information to the measuring instrument placement position determining apparatus 1. The measuring instrument information is a numerical value indicating the total length, width and height of the supporting tool for supporting the measuring instrument and the measuring instrument, and the position where the laser beam is emitted in the measuring instrument (laser light emission position It is a numerical value showing. The support for supporting the measuring instrument is, for example, a tripod (including a pan head). In this case, the total length, width, and height of the combined support for supporting the measuring instrument and the measuring instrument is the total length of the combined tripod and measuring instrument when the measuring instrument is attached to the tripod, Means width and height. Further, the numerical value indicating the laser beam emission position in the measuring instrument is, for example, the laser beam emitting for the intersection point of the rotation axis in the rotation mechanism for rotating the measuring instrument in the horizontal plane and the upper surface of the measuring instrument It is an offset value of the position, and is a three-dimensional coordinate value based on the intersection point. For example, when the laser beam emitting position is 100 mm just below the intersection point, the numerical values (x, y, z) indicating the laser beam emitting position are (0, 0, -100). The laser beam emission position is a specific example of the measurement reference position.

  Moreover, measurement condition information is information which shows the measurement conditions of the to-be-measured object by a measuring device. The measurement conditions are (1) the incident angle of the laser beam, and (2) the distance between the measuring device and the object to be measured. Strictly speaking, the incident angle of the laser beam is the angle between the laser beam emitted from the measuring instrument and the normal to the portion of the object to be measured to which the laser beam is incident. Further, the distance between the measuring device and the object to be measured is the distance between the measuring device and the portion of the object to be measured on which the laser light emitted from the measuring device is incident.

  The operator can arbitrarily set the measurement conditions for each degree of importance. For example, the operator uses the incident angle of the laser beam for measuring a portion of the air conditioning facility with a high level of importance and the distance between the measuring device and the object to be measured as the “high level measurement condition”. The angle of incidence of the laser beam for measuring the low importance part of the air conditioning equipment, and the distance between the measuring instrument and the object to be measured It can be input to the measuring instrument placement position determining apparatus 1 and set as the level measuring condition. The measuring device information and the measurement conditions input by the operator are stored in the storage unit 3.

  The above-mentioned reading of base model data, designation of measurement part and importance, and input of measuring instrument information and measuring conditions are interactive such that measuring instrument placement position determining apparatus 1 performs processing as needed according to the input operation of the operator. Although the processing is performed, the voxel model generation processing, the candidate position determination processing, the surface part selection processing, and the arrangement position determination processing which are subsequent to this are processings automatically performed by the measuring instrument arrangement position determination apparatus 1 alone. For example, when the operator inputs an instruction to determine the measuring machine arrangement position to the measuring machine arrangement position determining apparatus 1, according to this, the measuring machine arrangement position determining apparatus 1 performs voxel model generation processing, candidate position determination Processing, surface selection processing and placement position determination processing are continuously executed.

(Voxel model generation processing)
Next, as shown in step S5 in FIG. 2, the voxel model generation unit 14 of the measuring device placement position determining apparatus 1 performs voxel model generation processing. The voxel model generation process is a process of dividing a base model into voxels to generate a voxel model of an object to be measured and its surroundings.

  FIG. 7 shows the contents of voxel model generation processing. FIG. 8 shows the concept of a voxel model. FIG. 9 shows the position of the camera and the view frustum of the camera. FIG. 10 shows a method of generating a voxel model.

  In the voxel model generation process shown in FIG. 7, the voxel model generation unit 14 first forms an AABB (Axis-Aligned Bouncing Box) of the air conditioning facility and the surrounding base model read by the base model reading unit 11. Subsequently, as shown in FIG. 8, the voxel model generation unit 14 divides AABB of the base model into a plurality of voxels 31 (step S11).

  Subsequently, the voxel model generation unit 14 designates occupied voxels in a plurality of voxels 31 included in AABB of the base model (step S12). An occupied voxel is a voxel in which an object is present.

  The voxel model generation unit 14 specifies the occupied voxels, for example, as follows. That is, the voxel model generation unit 14 determines whether or not all or part of the surface 51 of the base model is included in the voxel 31 for each voxel 31 included in the AABB of the base model. Then, when all or part of the surface 51 of the base model is included in the voxel 31, the voxel model generation unit 14 designates the voxel 31 as an occupied voxel.

  Subsequently, the voxel model generation unit 14 designates unoccupied voxels and unknown voxels in a plurality of voxels 31 included in AABB of the base model (step S13). Unoccupied voxels are voxels in which no object exists. An unknown voxel is a voxel whose unknownness is unknown.

  The voxel model generation unit 14 designates unoccupied voxels and unknown voxels, for example, as follows. First, as shown in FIG. 9, the voxel model generation unit 14 recognizes one combination of the position Q and the direction of the camera at the time of shooting based on the data of the base model, and then recognizes the combination of the recognized position Q and the direction. Recognize the view frustum 33 of the camera. Next, the voxel model generation unit 14 recognizes the center of gravity of the voxel 31 on the AABB boundary surface included in the view frustum 33. Next, as shown in FIG. 10, the voxel model generation unit 14 assumes a position L of the recognized camera as a starting point C, and a ray L having an end point D as a center of gravity of one voxel 31 on the recognized AABB boundary surface as virtual points. Set and recognize one voxel 31 intersecting this ray L. Next, the voxel model generation unit 14 determines whether there is an occupied voxel between the recognized one voxel 31 and the start point C, and between the recognized one voxel 31 and the start point C. When an occupied voxel is present, the one recognized voxel 31 is designated as an unknown voxel. On the other hand, when there is no occupied voxel between the recognized one voxel 31 and the start point C, the voxel model generation unit 14 next determines whether an object exists inside the recognized one voxel 31 It is determined whether or not there is an object inside the recognized one voxel 31, and it is confirmed that the recognized one voxel 31 is an occupied voxel, while the recognized one voxel 31 When there is no object in the inside, the recognized one voxel 31 is designated as an unoccupied voxel. The voxel model generation unit 14 sets the position Q of the camera in the view frustum as the start point C in each of the plurality of view frustums recognized by a plurality of combinations of the position and direction of the camera at the time of shooting. The process is repeated for a plurality of voxels that intersect with each of the plurality of light rays L whose end point D is the centroid of the voxels on the AABB interface included in the viewing frustum.

  Through the above-described processing from step S11 to step S13, a voxel model of the air conditioner and its surroundings is generated.

(Candidate position determination processing)
Next, as shown in step S6 in FIG. 2, the candidate position determination unit 14 of the measuring instrument placement position determining apparatus 1 performs a candidate position determination process. The candidate position determination process is a process of determining a candidate position (candidate of measuring machine arrangement position) based on a voxel model. FIG. 11 shows the contents of the candidate position determination process.

  In the candidate position determination process shown in FIG. 11, the candidate position determination unit 14 first recognizes a floor voxel in the voxel model (step S21). FIG. 12 shows a method of recognizing floor voxels. The candidate position determination unit 14 recognizes floor surface voxels, for example, as follows. That is, as shown in FIG. 12, the candidate position determination unit 14 selects one of the occupied voxels 31A included in the voxel model, and the surface division 51 in which a part or all is included in the selected occupied voxels 31A. The normal line N is recognized, and it is determined whether or not the direction of the recognized normal line N is vertically upward. Then, in the case where the direction of the recognized normal N is vertically upward, the selected occupied voxel 31A is recognized as a floor voxel. In addition, when there are a plurality of surface portions 51 including a part or all of the selected occupied voxels 31A, it is determined whether or not the direction of the vector combining the normals N of the surface portions 51 is vertically upward. Do. Then, when the direction of the synthesized vector is vertically upward, the selected occupied voxel 31A is recognized as a floor voxel. The candidate position determination unit 14 performs such processing for all occupied voxels 31A included in the voxel model, and recognizes all floor surface voxels included in the voxel model. Whether the normal N of the surface 51 included in the occupied voxel 31A or the combined vector of the normals N of a plurality of surface 51 included in the occupied voxel 31A is vertically upward is determined to some extent gently. That is, it may be determined whether the normal N or the combined vector is substantially vertically upward.

  Subsequently, the candidate position determination unit 14 forms a measuring instrument model 37 (step S22). FIG. 13 shows a measuring instrument model. The measuring instrument model 37 is a cylindrical model corresponding to the shape and size of the space occupied by the whole of the measuring instrument 38 and the support 39 for supporting the measuring instrument 38, as shown in FIG. . For example, when the support 39 for supporting the measuring instrument 38 is a tripod, the measuring instrument model 37 has a shape of a space occupied by the entire measuring instrument 38 combined with the tripod when the measuring instrument 38 is attached to the tripod. And a cylindrical model corresponding to the size. The radius R of the measuring instrument model 37 is equal to one half of the total length and width of the measuring instrument 38 and the support 39, whichever is larger. Further, the height H of the measuring instrument model 37 is equal to the total height of the measuring instrument 38 and the support 39. Moreover, the measuring device model 37 only indicates the range of space occupied by the entire combination of the measuring device 38 and the support 39, and the inside of the measuring device model 37 is empty. The candidate position determination unit 14 reads from the storage unit 3 the measuring device information input by the operator in step S4 in FIG. 2, and forms the measuring device model 37 based on the measuring device information.

  Further, the candidate position determination unit 14 sets the laser light emission position EP in the measuring instrument model 37 (step S23). Specifically, the measurement device information includes a numerical value indicating the laser light emission position EP. As described above, the numerical value indicating the laser beam emission position EP is the offset value (three-dimensional coordinate value) of the laser beam emission position with respect to the intersection point of the rotation axis in the rotation mechanism that rotates the measuring instrument in the horizontal plane and the upper surface of the measuring instrument. ). The candidate position determination unit 14 arranges the intersection of the rotation axis and the upper surface of the measuring instrument at the central point CP of the upper surface of the cylindrical measuring instrument model 37, and the offset value when the central point CP is used as a reference Is set as the laser beam emission position EP in the measuring instrument model 37. For example, when the numerical value (x, y, x) indicating the laser beam emission position EP in the measurement device information is (0, 0, -100), the laser light emission position EP in the measurement device model 37 is the measurement device model 37 Is set to a position 100 mm away from the center point CP of the upper surface of

  Subsequently, the candidate position determination unit 14 selects one unselected floor voxel from the plurality of floor voxels in the voxel model (step S24 in FIG. 11). In addition, at the stage before step S24 is performed for the first time, all floor surface voxels recognized in step S21 are in the unselected state.

  Subsequently, the candidate position determination unit 14 determines whether or not the measuring instrument model 37 can be placed on the selected floor voxel (step S25). The candidate position determination unit 14 makes this determination, for example, as follows. First, the candidate position determining unit 14 places the measuring instrument model 37 in the voxel model such that the center of the lower surface of the measuring instrument model 37 contacts the selected floor voxel. Next, the candidate position determination unit 14 determines whether or not an occupied voxel in the voxel model is present inside the measuring instrument model 37 thus placed in the voxel model. If there is no occupied voxel in the voxel model inside the measuring device model 37, the candidate position determining unit 14 determines that the measuring device model 37 can be placed on the selected floor voxel. On the other hand, if there is an occupied voxel in the voxel model inside the measuring device model 37, the candidate position determining unit 14 determines that the measuring device model 37 can not be placed on the selected floor voxel.

  If the measuring machine model 37 can be placed on the selected floor voxel (step S 25: YES), the candidate position determining unit 14 is placed on the currently selected floor voxel in the voxel model. The laser beam emission position EP of the measuring instrument model 37 is determined as one candidate position, and the coordinate value of the candidate position is stored in the storage unit 3 (step S26). On the other hand, when the measuring instrument model 37 can not be placed on the selected floor voxel (step S25: NO), the process skips step S26 and shifts to step S27.

  Next, the candidate position determination unit 14 determines whether the processing from step S24 to step S26 has been completed for all floor voxels in the voxel model (step S27). Then, when the processing from step S24 to step S26 is not completed for all floor surface voxels in the voxel model (step S27: NO), the candidate position determination unit 14 returns the processing to step S24, and the voxel model The processes from step S24 to step S26 are performed for the other floor surface voxels not selected yet. On the other hand, when the processing from step S24 to step S26 is completed for all floor surface voxels in the voxel model (step S27: YES), the candidate position determination unit 14 ends the arrangement position candidate designation processing.

  A plurality of candidate positions are determined by the above candidate position determination process. Here, FIG. 14 schematically shows a state where the equipment room 28 of the air conditioning equipment shown in FIG. 3 is viewed from above. As shown in FIG. 14, for example, a hatched portion in the equipment room 28 is a portion in which a plurality of candidate positions determined by the candidate position determination process exist.

(Side selection process)
Next, as shown in step S7 in FIG. 2, the surface selection unit 15 of the measuring apparatus placement position determining apparatus 1 performs surface selection processing. The surface part selection process is visible from each candidate position among a plurality of surface parts included in the base model, corresponds to a measurement part with high or low level of importance, and measurement conditions described later. It is a process to select the area to be filled. FIG. 15 shows the contents of surface selection processing.

  In the surface selection process shown in FIG. 15, the surface selection unit 15 first erases color information at the time of base model generation for each surface 51 included in the base model. Unique color information is newly assigned every minute 51 (step S31). The color information is, for example, RGB information combining values of three primary colors of red, green and blue, and each of red, green and blue has any value from 0 to 255. The color information assigned to each surface is different for each surface 51.

  Subsequently, the surface selection unit 15 indicates color assignment data indicating, for each surface 51, the correspondence between the surface ID of each surface 51 included in the base model and the color information assigned to the surface 51. Is generated, and the color assignment data is stored in the storage unit 3 (step S32).

Subsequently, the surface portion selection unit 15 generates a matrix (two-dimensional array) including rows of the number of candidate positions determined in the candidate position determination process and columns of the number of surface portions 51 included in the base model. Is generated for each importance of the measurement part in the air conditioning equipment (step S33). In the present embodiment, a case where a high level and a low level are designated as the importance of the measurement part in the air conditioning equipment will be described as an example. In this case, the surface selection unit 15 generates two of the above matrices. Hereinafter, these matrices are referred to as “surface subdivision matrix A” and “surface subdivision matrix B”, the components of the surface _subdivision matrix A are represented as a _jf, and the components of the surface _subdivision matrix B are represented as b _j f. “J” indicates each candidate position determined in the candidate position determination process, and “f” indicates each surface 51 included in the base model. Furthermore, the surface component selection unit 15, in step S33, each component _{a jf} surface submatrix A, and the components _{b jf} surface partial matrix B respectively initialized to "0".

  Subsequently, the surface selection unit 15 selects one unselected candidate position from among the plurality of candidate positions determined in the candidate position determination process (step S34). Hereinafter, one candidate position selected in step S34 is referred to as "a candidate position under selection".

  Subsequently, the surface part selecting unit 15 sets the origin of the base model at the candidate position under selection, and the coordinate values of the vertices of each surface 51 included in the base model with the candidate position under selection as the origin. Is converted from coordinate values (x, y, z) of the orthogonal coordinate system to coordinate values (r, φ, θ) of the polar coordinate system (step S35). Here, r is the distance from the origin, φ is the azimuth angle, and θ is the elevation angle.

  The surface part selection unit 15 sets the coordinate of the polar coordinate system of each vertex of each surface part 51 included in the base model to the horizontal axis as φ (0 degrees ≦ φ <360 degrees) and the vertical axis as θ (−90 degrees) By arranging the base model on a plane where ≦ φ ≦ 90 degrees), the azimuth angle φ is 0 degrees or more and less than 360 degrees from the candidate position under selection, and the elevation angle θ is −90 degrees or more and 90 An expanded image of the base model viewed from all directions within a range which is less than the degree is generated (step S36). When generating a developed image, the surface selection unit 15 performs processing (back face culling) to remove a portion to be a back surface in the base model when the base model is viewed from the candidate position being selected (back face culling), and A process (a hidden surface removal) is performed to remove the hidden part hidden behind the hidden part. Note that such a development image can be generated using OpenGL, etc., which is widely spread at present.

  Here, FIG. 16 illustrates an example of a developed image of the base model generated in step S36. FIG. 17 shows a part of the developed image on an enlarged scale so that each pixel 52 can be identified. As shown in FIG. 16, the expanded image of the base model generated in step S36 is a plane that becomes visible when the base model is viewed from the candidate position being selected among all the surface fractions 51 included in the base model. Only a minute (hereinafter, this will be referred to as a "visible surface" and denoted by reference numeral 51A) is an image drawn on a plane. Further, as shown in FIG. 17, the color information assigned to each surface 51 in step S31 is also reflected in this developed image. That is, in this developed image, each pixel 52 corresponding to each visible area 51A when the base model is viewed from the candidate position being selected has color information (for example, RGB information) assigned to the area in step S31. Have.

  Subsequently, the surface part selecting unit 15 scans the generated developed image, reads color information possessed by each pixel 52 in the developed image, and performs visible surface part 51A corresponding to the color information of each pixel 52 read. It specifies based on the color assignment data generated in S32 (step S37).

  Subsequently, the surface selection unit 15 selects the visible surface corresponding to the measurement portion with the high level of importance among the identified visible surface 51A and satisfying the high level measurement condition (step S38). Specifically, in step S38, the surface selection unit 15 first selects the visible surface corresponding to the measurement portion having the high level of importance among the visible surface 51A. As described above, in step S3 in FIG. 2, the measurement part specification unit 12 indicates the surface part ID of the surface part corresponding to the measurement part of high level of importance designated by the operator in the base model Data is generated and stored in the storage unit 3. Based on the measurement partial data, the surface selection unit 15 selects a visible surface corresponding to the measurement portion with a high level of importance specified by the operator from the visible surface 51A.

  Next, in step S38, the surface selection unit 15 selects a visible surface 51A that satisfies the high-level measurement condition from among the visible surface 51A corresponding to the measurement portion of high importance. The high level measurement condition is a measurement condition for measuring a measurement part of high importance in the air conditioning equipment with a measuring machine. In order to measure the measurement part with high importance in the air conditioning equipment with high accuracy (for example, accuracy within plus or minus 1 mm to 5 mm) by the measurement device, the incident angle of the laser light emitted from the measurement device to the measurement portion is For example, it is preferable that it is -45 degree or more and 45 degree or less, and the distance between a measuring device and a measurement part is 0.3 m or more and 5 m or less. Therefore, the high-level measurement conditions include, for example, (1) the incident angle of the laser beam emitted from the measuring device to the measuring portion is -45 degrees to 45 degrees, and (2) the measuring device and the measuring portion The distance between the two is 0.3 m or more and 5 m or less. The high level measurement condition can be arbitrarily set by the operator as described above.

  Here, FIG. 18 shows an example of a method of selecting the visible surface portion 51A which satisfies the high level measurement condition. As shown in FIG. 18, the surface selection unit 15 determines, for example, an angle K between a straight line E passing through both the candidate position Pj being selected and the center of gravity G of the visible surface 51A and the normal W of the visible surface 51A. Is −45 degrees or more and 45 degrees or less, and the distance M between the candidate position Pj being selected and the center of gravity G of the visible surface portion 51A is, for example, 0.3 m or more and 5 m or less; The minute 51A is selected as a visible surface that satisfies the high level measurement condition.

Subsequently, in the surface separation matrix A, the surface selection unit 15 corresponds to the visible surface 51A selected in step S38, that is, the visible surface corresponding to the measurement portion of high importance and satisfying the high-level measurement conditions. The component a _jf corresponding to 51A is set to "1" (step S39).

  Subsequently, the surface selection unit 15 selects the visible surface corresponding to the measurement portion having the low level of importance among the visible surface 51A specified in step S37 and meeting the low level measurement condition (step S40). ). This process is the same as the process of step S38 described above except that the setting contents of the measurement conditions are different.

  The low level measurement condition is a measurement condition for measuring a measurement part having a low level of importance in the air conditioning equipment by a measuring machine. In order to measure with low accuracy (for example, accuracy within plus or minus 15 mm to 20 mm) the measurement part with low importance in the air conditioning equipment, the incident angle of the laser light irradiated from the measurement machine to the measurement part For example, it is preferable that the angle is greater than -90 degrees and less than 90 degrees, and the distance between the measuring instrument and the measuring portion is 0.3 m or more and 20 m or less. Therefore, the low level measurement conditions are, for example, (1) the incident angle of the laser light emitted from the measuring device to the measuring part is greater than -90 degrees and less than 90 degrees, and (2) the measuring device and the measurement The distance between the parts is 0.3 m or more and 20 m or less. The operator can arbitrarily set the low level measurement condition as well as the high level measurement condition.

Subsequently, in the surface separation matrix B, the surface selection unit 15 corresponds to the visible surface 51A selected in step S40, that is, the visible surface corresponding to the measurement portion having a low level of importance and meeting the low level measurement conditions. The component b _jf corresponding to 51A is set to "1" (step S41).

  Subsequently, the surface selection unit 15 determines whether or not the processing from step S34 to step S41 is completed for all the candidate positions determined in the candidate position determination process (step S42). Then, when the processing from step S34 to step S41 is not completed for all candidate positions determined in the candidate position determination process (step S42: NO), the surface selection unit 15 sets the process to step S34. Then, the process from step S34 to step S41 is performed for the other candidate position not selected. On the other hand, when the processing from step S34 to step S41 is completed for all candidate positions determined in the candidate position determination processing (step S42: YES), the surface selection unit 15 ends the surface selection processing.

In the surface separation matrix A after the above-described surface selection processing, the component a _jf set to “1” is such that the surface portion f is visible when viewed from the candidate position j, and the importance is high It corresponds to the measurement part, and indicates that the high level measurement condition is satisfied when the measurement device is arranged at the candidate position j. On the other hand, the component a _jf set to “0” does not correspond to the measurement part where the surface part f is invisible when viewed from the candidate position j and has a high degree of importance, or the measuring machine is a candidate position When placed in j, it indicates that the high level measurement condition is not satisfied. Further, in the surface separation matrix B after the surface selection processing, the component b _jf set to “1” is such that the surface portion f is visible when viewed from the candidate position j and the importance is low It corresponds to the measurement part, and indicates that the low level measurement condition is satisfied when the measurement device is arranged at the candidate position j. On the other hand, the component b _jf set to “0” does not correspond to the measurement part where the surface part f is invisible when viewed from the candidate position j and the importance is low, or the measuring machine is a candidate position When placed in j, it indicates that the low level measurement condition is not satisfied. These surface separation matrices A and B are stored in the storage unit 3.

(Placement determination process)
Next, as shown in step S8 in FIG. 2, the arrangement position determination unit 16 of the measuring machine arrangement position determination device 1 performs an arrangement position determination process. In the arrangement position determination process, a position optimum for measuring each surface portion finally selected by the surface portion selection unit 15 from among the candidate positions determined by the candidate position determination unit 14. It is a process determined as In the arrangement position determination process, mathematical programming is used to determine the optimum measuring machine arrangement position. The problem of determining the optimum meter placement position can be considered to correspond to the linear integer optimization problem among the combinatorial optimization problems. In the placement position determination process, an optimum solution placement position is determined using an exact solution method of the linear integer optimization problem in the combinatorial optimization problem. Specifically, in the arrangement position determination process, the optimum measuring machine arrangement position is determined using the branch and bound method.

FIG. 19 shows the contents of the arrangement position determination process. As shown in FIG. 19, in the placement position determination process according to the present embodiment, first, among the candidate positions determined by the candidate position determination unit 14, high-level measurement corresponds to the measurement portion of high level of importance. A high level arrangement position determination process is performed to determine the optimum position for measuring the visible area 51A satisfying the condition as the "high level arrangement position" (step S51). Hereinafter, the visible surface portion 51A that corresponds to the measurement portion of high level of importance and satisfies the high level measurement condition is referred to as "high level selection surface portion". The high level selection surface is a surface separation f in which the component a _jf is set to “1” in the surface separation matrix A after the surface selection processing has been completed. Further, the high level arrangement position is a specific example of the measuring machine arrangement position for high precision measurement.

Subsequently, from among the candidate positions determined by the candidate position determination unit 14, an optimal position for measuring the visible surface portion 51A that corresponds to the measurement portion of low level and satisfies the low level measurement conditions is selected. The low level placement position processing to be determined as the "low level placement position" is performed (step S52). Hereinafter, the visible surface portion 51A which corresponds to the measurement portion of low level of importance and satisfies the low level measurement condition is referred to as "low level selection surface portion". The low level selection surface is a surface separation f in which the component b _jf is set to “1” in the surface separation matrix B after the surface selection processing has been completed. Also, the low level arrangement position is a specific example of the measuring machine arrangement position for low accuracy measurement.

  Finally, the high level arrangement position determined by the high level arrangement position determination process and the low level arrangement position determined by the low level arrangement position determination process are output, for example, to the display unit 5 (step S53).

  FIG. 20 shows the contents of the high level placement position determination process. In the high level placement position determination process shown in FIG. 20, the placement position determination unit 16 first sets the upper limit value T of the number of high level placement positions to an initial value (step S61). This initial value is 1, for example. The initial value can be set arbitrarily by the operator.

Subsequently, the placement position determination unit 16 performs optimization calculation for determining the high level placement position using the surface separation matrix A generated in the surface selection process (step S62). In the optimization calculation performed here, the number of candidate positions calculated in the optimization calculation is equal to or less than the upper limit T, and one or more candidate positions among a plurality of candidate positions determined in the candidate position determination process Calculate the optimal position that maximizes the number of high-level selected surfaces measured from. The optimum position calculated by this optimization calculation is the high level arrangement position. The problem of determining the high level placement position is formulated as follows.
here,
J: A set of candidate positions j F: A set of high level selection plane parts f _j = 0: A measuring instrument is not arranged at a candidate position j z _j = 1: A measuring instrument is arranged at a candidate position j x _f = 0: The high level selection surface fraction f is not measured x _f = 1: The high level selection surface fraction f is measured T: The upper limit value of the number of high level arrangement positions.

  Then, the placement position determination unit 16 stores the high level placement position calculated by the optimization calculation and the total number m of high level selection planes measured by placing a measuring instrument at the high level placement position. Remember to The high level arrangement position is stored, for example, in the storage unit 3 as a coordinate value in the orthogonal coordinate system of the three-dimensional space of the base model.

  Subsequently, the arrangement position determination unit 16 calculates this optimization calculation with respect to the total number m of high level selection planes measured by arranging the measuring machine at the high level arrangement position calculated by the previous optimization calculation. The rate of increase of the total number m of high-level selected surfaces measured by placing a measuring instrument at the high-level placement position thus calculated is calculated (step S63).

  Subsequently, the placement position determining unit 16 determines whether the increase rate of the total number m is less than or equal to the increase rate reference value (step S64). The rising rate reference value is, for example, 1%. The rate of increase reference value can be set arbitrarily by the operator.

  If the increase rate of the total number m is not equal to or less than the increase rate reference value (step S64: NO), the arrangement position determining unit 16 increases the upper limit T of the number of high level arrangement positions by 1 (step S65), The process returns to step S62.

  On the other hand, if the increase rate of the total number m is less than or equal to the increase rate reference value (step S64: YES), the placement position determination unit 16 ends the high level placement position determination process.

  Here, FIG. 21 shows an example of the relationship between the upper limit value T of the number of high level placement positions and the total number m of high level selection surfaces measured by placing the measuring device at the high level placement position. . In FIG. 21, m2 is a high level selection in which a measuring machine is placed at a high level placement position obtained by performing optimization calculation by setting the upper limit value T of the number of high level placement positions to 2 and measurement is performed It is the total number m of faces. Also, m3 is a high-level selected surface area measured by placing a measuring instrument at the high level placement position obtained by performing optimization calculation with setting the upper limit value T of the number of high level placement positions to 3 and performing optimization calculation The total number of is m. Similarly, m8 is a high-level selection surface measured by placing a measuring instrument at the high level placement position obtained by performing optimization calculation by setting the upper limit value T of the number of high level placement positions to 8 and performing optimization calculation The total number of minutes is m. Also, m9 is a high-level selected surface area measured by placing a measuring instrument at the high level placement position obtained by performing optimization calculation by setting the upper limit value T of the number of high level placement positions to 9 and performing optimization calculation The total number of is m. As can be seen from FIG. 21, the increase rate (m3 / m2) of the total number m by increasing the upper limit value T of the number of high level arrangement positions from 2 to 3 and the upper limit value T of the number of high level arrangement positions The former is larger than the latter in comparison with the rate of increase (m9 / m8) of the total number m by increasing from 8 to 9. Thus, when the upper limit value T of the number of high-level placement positions is increased, the rate of increase of the total number m is decreased. When the increase rate of the total number m becomes a very small value, it is no longer necessary to increase the upper limit T of the number of high level placement positions, but to place the measuring machine in the high level placement position and measure the high level It means that the face has hardly changed. Therefore, when the increase rate of the total number m becomes a very small value, there is no merit to repeat the optimization calculation by further increasing the upper limit value T of the number of high level arrangement positions. Therefore, as shown in FIG. 20, when the increase rate of the total number m becomes equal to or less than the increase rate reference value, the arrangement position determination unit 16 ends the high level arrangement position determination process.

  FIG. 22 shows the contents of the low level placement position determination process. The low level placement position determination process (steps S71 to S75) is the same as the high level placement position determination process described above except for the following point. (1) In the high level arrangement position determination process described above, the upper limit value T of the number of high level arrangement positions is used, but in the low level arrangement position determination process, the upper limit value U of the number of low level arrangement positions is used. (2) In the high-level placement position determination process described above, optimization calculation for determining the high-level placement position is performed using the surface separation matrix A generated in the surface selection process, but the low-level placement position determination In the processing, an optimization calculation for determining a low level arrangement position is performed using the surface separation matrix B generated in the surface selection processing. Specifically, in the optimization calculation performed in the low level placement position determination process, the number of candidate positions calculated in the optimization calculation is equal to or less than the upper limit value U, and a plurality of candidates determined in the candidate position determination process Among the positions, an optimal position is calculated which maximizes the number of low-level selected surfaces measured from one or more candidate positions. The optimum position calculated by this optimization calculation is the low level arrangement position. (3) The increase rate reference value used in the low level arrangement position determination process may be different from the increase rate reference value used in the high level arrangement position determination process. The operator can arbitrarily set the rising rate reference value used in the high level placement position determination process and the low level placement position determination process. The respective rising rate reference values may be different or may be the same.

  After the end of the high level placement position determination process, the high level placement position calculated by the optimization calculation last performed in the high level placement position determination process is stored in the storage unit 3. Further, after the low level placement position determination processing is completed, the low level placement position calculated by the optimization calculation last performed in the low level placement position determination processing is stored in the storage unit 3. The arrangement position determination unit 16 reads the high level arrangement position and the low level arrangement position from the storage unit 3 and outputs the read high level arrangement position and the low level arrangement position to the display unit 5 or the like (step S53 in FIG. 19). ). Here, the low level arrangement position read out from the storage unit 3 may include the same position as the high level arrangement position read out from the storage unit 3. In that case, when the low level placement position is output to the display unit 5 by the placement position determination unit 16, the same position as the high level placement position may be excluded from the low level placement position.

  FIG. 23 shows an example of measuring device arrangement positions (high level arrangement position and low level arrangement position) in the equipment room 28 determined by the measuring device arrangement position determination apparatus 1. In this example, seven measuring instrument arrangement positions P1 to P7 in the equipment room 28 are determined by the measuring instrument arrangement position determination device 1. The operator arranges the measuring machines sequentially at each of the measuring machine arrangement positions P1 to P7 to perform three-dimensional measurement, and generates a final three-dimensional model of the air conditioner using the measurement data obtained by the three-dimensional measurement. can do.

  As described above, in the measuring device placement position determining apparatus 1 according to the embodiment of the present invention, in the surface area selecting process, the expanded image of the base model viewed from the candidate position is generated, and the plurality of surface areas included in the base model are generated. Among them, the surface drawn in the developed image is specified as a visible surface 51A viewed from the candidate position (see steps S35 to S37 in FIG. 15). As a result, the time taken for the process of determining the measuring machine arrangement position can be significantly shortened in the measuring machine arrangement position determination device 1 as compared with the prior art described in the non-patent document 1. Therefore, it is possible to improve the efficiency of the determination work of the measuring machine arrangement position.

  We will examine this specifically. In the prior art described in the above-mentioned nonpatent literature 1, processing which specifies measurement object voxel which is observable from measurement machine arrangement candidate voxel is performed. This process corresponds to the process of specifying the visible area 51A viewed from the candidate position in the measuring device placement position determining apparatus according to the embodiment of the present invention. In the prior art, the number of measuring machine arrangement candidate voxels is na, the number of measurement object voxels is nb, and the measurement object voxels that are observable from one measurement machine arrangement candidate voxel are specified from among nb measurement object voxels Assuming that the time taken for the process Pr to be performed is t, the time taken for performing the process Pr on all na measuring instrument arrangement candidate voxels is na × nb × t. On the other hand, in the measuring machine placement position determining apparatus 1 according to the embodiment of the present invention, the number of candidate positions is ma, the number of planes included in the base model is mb, and a base model viewed from one candidate position. The time taken for the process Qr for forming a developed image and specifying the surface drawn in the developed image among the mb surfaces contained in the base model as the visible surface 51A viewed from the one candidate position Assuming that u, the time taken to perform the process Qr for all the ma candidate positions is ma × u. Here, temporarily, the number of measuring machine placement candidate voxels and the number of candidate positions are equal to each other, and the time taken to perform the process Pr for one measuring machine placement candidate voxel and the process Qr for one candidate position are performed. Assuming that this time is equal to each other, the time taken to perform the process Qr for all ma candidate positions is nb minutes of the time taken to perform the process Pr for all na meter location candidate voxels. It is 1. When the volume of the object to be measured is large such as in an air conditioning facility, the number of voxels to be measured is enormous, often exceeding one thousand, and sometimes exceeding ten thousand. Therefore, in this case, the time taken to perform the process Qr for all ma candidate positions is less than one-thousandth of the time taken to perform the process Pr for all na measuring instrument placement candidate voxels, Or less than 10,000 parts. Although this is a rough examination method, based on this examination, the time taken for the process of specifying the visible surface portion 51A viewed from the candidate position in the measuring machine placement position determining apparatus 1 of the embodiment of the present invention It is obvious that the time taken for the process of specifying the measurement target voxel which is observable from the candidate voxels is orders of magnitude shorter. As described above, the time taken for processing for specifying the visible area 51A viewed from the candidate position in the measuring device placement position determining apparatus 1 according to the embodiment of the present invention Since the time required for the process of determining the arrangement position of the measurement device can be significantly shortened in the measurement device arrangement position determination device 1 as compared with the above-described conventional technique because the time required for the process of specifying the object voxel can be significantly shortened. Can be shortened to

Actually, with regard to the air conditioning equipment (heat source machine room) having an area of 180 m ² and a ceiling height of 4.6 m, when processing for determining the arrangement of measuring instruments was performed according to the above-mentioned prior art, it took that processing The time was 24.1 minutes. Moreover, when the process which determines a measuring machine arrangement position was performed with the measuring machine arrangement position apparatus 1 of embodiment of this invention about the same air conditioning installation, the time concerning the process was 1.9 minutes. As a result, it was actually confirmed that the time taken for the process of determining the measuring machine arrangement position is much shorter in the measuring machine arranging and positioning device 1 according to the embodiment of the present invention than in the prior art.

  Further, in the measuring device placement position determining apparatus 1 according to the embodiment of the present invention, in the surface area selecting process, after assigning unique color information for each surface area to a plurality of surface areas included in the base model, A developed image of the viewed base model is generated, and among the plurality of planes included in the base model, a plane to which color information possessed by each pixel of the developed image is assigned is a visible plane 51A viewed from the candidate position Choose as. This makes it possible to easily identify the visible surface portion 51A. Further, the processing method of specifying the visible surface portion 51A from the developed image by the color information contributes to shortening of the processing time for specifying the visible surface portion 51A.

  Further, in the measuring instrument placement position determining apparatus 1 according to the embodiment of the present invention, the number of candidate positions calculated in the high level placement position determining process is equal to or less than the upper limit value T of the number of high level placement positions, and Of the plurality of candidate positions determined by the position determination unit 14, an optimal candidate position at which the number of high-level selection planes measured from one or more candidate positions is the largest is calculated using the branch and bound method. The calculated optimal candidate position is determined as a measuring machine arrangement position (high level arrangement position). According to this measuring device arrangement position determination apparatus 1, a smaller number of measuring device arrangement positions capable of measuring a wide range can be determined as compared with the above-mentioned prior art in which the measuring device arrangement position is determined using the greed method. can do. Therefore, it is possible to improve the efficiency of the measurement operation of equipment and the like using the three-dimensional measurement machine. Also, in the low-level placement position determination processing in the measurement instrument placement position determination device 1, as in the high-level placement position determination processing, the method is wider than the above-described conventional technology in which the measurement instrument placement position is determined using greed method. It is possible to determine a smaller number of measuring machine placement positions (low level placement positions) where range measurement is possible.

Actually, with regard to an air conditioning facility (heat source machine room) having an area of 180 m ² and a ceiling height of 4.6 m, when processing for determining the arrangement of measuring instruments was performed according to the above-mentioned prior art, it is important in the air conditioning facility Ten meter placement positions were determined that could measure approximately 87.9% of the range of the measurement part where the degree is high. Moreover, when processing which determines a measuring instrument arrangement position was performed by the measuring instrument arrangement position apparatus 1 of embodiment of this invention about the same air conditioning installation, the range of the measurement part whose importance is a high level in the said air conditioning installation Seven measuring machine placement positions were determined that could measure about 88.2%. Thereby, according to the measuring instrument placement position apparatus 1 of the embodiment of the present invention, it is actually confirmed that the number of measuring instrument placement positions at which substantially the same range is measured can be reduced as compared with the prior art. The

  Further, in the measuring apparatus placement position determining apparatus 1 according to the embodiment of the present invention, at least the high level or the low level of importance is designated in the measurement portion of the object to be measured in the base model. In addition, the incident angle range of the laser beam in the high level measurement condition becomes smaller than the incident angle range of the laser beam in the low level measurement condition, and the distance between the measuring instrument and the surface of the base model in the high level measurement condition is The high level measurement condition and the low level measurement condition are set so as to be smaller than the distance between the measuring machine and the surface of the base model under the low level measurement condition. Then, among a plurality of planes included in the base model, a plane that corresponds to a measurement portion that is visible when viewed from the candidate position and that has a high level of importance and that meets high-level measurement conditions is set to a high level Among a plurality of candidate positions selected as selected surfaces and determined by the candidate position determination unit 14, one or more candidate positions at which the number of high level selected surfaces to be measured is the largest is used a branch and bound method Calculation, and the calculated candidate position is determined as the high level arrangement position. In addition, among a plurality of planes included in the base model, a plane that corresponds to a measurement portion that is visible when viewed from the candidate position and that has a low level of importance and that meets the low level measurement conditions is a low level Among a plurality of candidate positions selected as selected surfaces and determined by the candidate position determination unit 14, one or more candidate positions at which the number of low-level selected surfaces to be measured is the largest is used a branch and bound method Calculation, and the calculated candidate position is determined as the low level arrangement position. With this configuration, a measuring instrument arrangement position capable of accurately measuring a portion with high degree of importance in an air conditioner and a measuring machine capable of rapidly measuring a portion with low degree of importance in an air conditioner with reduced accuracy. The arrangement position can be determined respectively. As a result, while maintaining the required measurement quality, the working time of the three-dimensional measurement can be shortened, and the efficiency of the three-dimensional measuring operation can be improved overall.

  In the above embodiment, the case where the measuring machine arrangement position is determined using the branch and bound method is taken as an example, but the measuring machine arrangement position is determined using another exact solution method of the linear integer optimization problem. It may be done. Further, the determination of the measuring machine arrangement position may be performed using an approximate solution method of the linear integer optimization problem. Even in the case where the determination of the measuring machine arrangement position is performed by the approximate solution method of the linear integer optimization problem, the effect of shortening the processing time for determining the measuring machine arrangement position can be exhibited.

  In the above embodiment, each of the high level measurement condition and the low level measurement condition includes the incident angle to the measurement portion of the laser beam emitted from the measurement device and the distance between the measurement device and the measurement portion. The case is taken as an example. However, only the incident angle to the measurement portion of the laser beam emitted from the measuring instrument may be included in each of the high level measurement condition and the low level measurement condition, or the high level measurement condition and the low level measurement condition may be included. Each may include only the distance between the measuring instrument and the measuring part.

  Also, in the above embodiment, when specifying two high and low levels of importance as the importance of the measurement part, and determining the high level arrangement position and the low level arrangement position corresponding to these two importance levels For example, three or more types of measuring machines corresponding to the three or more importance levels shall be specified by specifying three or more importance levels of the measurement part, such as high level, middle level, and low level. The arrangement position may be determined. Also, the importance of the measurement part may not be specified, and one type of measuring machine arrangement position may be determined.

  Moreover, in the said embodiment, although the shape of the surface part of a base model is a triangle, the shape of a surface part is not restricted to a triangle.

  Further, in the above embodiment, the air conditioning equipment was taken as an example of the object to be measured, but the present invention is not limited to the air conditioning equipment, but various objects to be measured such as water supply and drainage, facilities such as telecommunications, machines, buildings, etc. It can be used to determine the measuring machine arrangement position for measuring with a measuring machine.

  In addition, step S2 in FIG. 2 is a specific example of the base model acquisition step, step S3 is a specific example of the measurement part specification step, and steps S5 and S6 are specific examples of the candidate position determination step. Further, step S7 is a specific example of the surface part selection step, and step S8 is a specific example of the arrangement position determination step.

  Moreover, the present invention can be suitably changed in the range which does not violate the gist or concept of the invention which can be read from a claim and the whole specification, and a measuring machine arrangement position determining device with such a change, measuring machine arrangement The positioning method and program are also included in the technical concept of the present invention.

1 measuring instrument arrangement position determination device 11 base model reading unit (base model acquisition unit)
12 Measurement Part Designation Unit 13 Voxel Model Generation Unit 14 Candidate Position Determination Unit 15 Surface Selection Unit 16 Placement Position Determination Unit 51 Surface 51A Visual Surface

Claims (8)

In order to measure the position, shape or other attributes of the object to be measured by a measuring device that performs three-dimensional measurement by irradiating a laser beam, the measuring device arrangement position where the measuring device is arranged around the object to be measured is determined Measuring device placement position determining device,
The object to be measured which is generated by using a plurality of images obtained by photographing the object to be measured and its surroundings while changing its position or direction with a camera, and represented by a set of a plurality of surface portions and its periphery A base model acquisition unit that acquires a base model that is a three-dimensional model of
A measurement part specification unit that specifies a measurement part to be measured by the measurement device in the object in the base model;
In the floor surface on which the object to be measured is placed in the base model, a plurality of parts on which the measuring machine and a support for supporting the measuring machine can be placed are recognized, and in each recognized part the measuring machine and A candidate position determination unit that determines the measurement reference position of the measuring machine when the support is placed as a candidate position;
Among the plurality of surface portions included in the base model, a surface portion which is visible when viewed from the candidate position and which corresponds to the measurement portion designated by the measurement portion designation unit is selected as a selection surface portion A surface selection unit,
Among the plurality of candidate positions determined by the candidate position determination unit, one or more candidate positions at which the number of the selected surface portions to be measured is the largest is calculated using mathematical programming, and the calculated candidates An arrangement position determination unit which determines a position as the measurement machine arrangement position;
The surface part selection unit generates a developed image of the base model viewed from the candidate position, and among a plurality of surface parts included in the base model, the surface part drawn in the developed image is the candidate What is claimed is: 1. A measuring instrument placement position determining apparatus characterized by specifying it as a surface that is visible when viewed from a position.   The surface selection unit allocates unique color information for each surface to a plurality of surfaces included in the base model, and then generates a developed image of the base model viewed from the candidate position, and the base is selected. Among the plurality of planes included in the model, a plane to which color information possessed by each pixel of the expanded image is assigned is selected as a plane that is visible when viewed from the candidate position. The measuring machine arrangement position determination apparatus of claim 1.   The arrangement position determination unit is configured to calculate the number of candidate positions to be calculated is equal to or less than a set upper limit value, and at least one candidate position among the plurality of candidate positions determined by the candidate position determination unit. The optimal candidate position at which the number of selected surface portions to be measured is the largest is calculated using an exact solution method of a linear integer optimization problem, and the calculated optimal candidate position is determined as the measuring machine arrangement position. The measuring machine arrangement | positioning determination apparatus of Claim 1 or 2 characterized by the above-mentioned.   The arrangement position determination unit is configured to calculate the number of candidate positions to be calculated is equal to or less than a set upper limit value, and at least one candidate position among the plurality of candidate positions determined by the candidate position determination unit. The optimal candidate position at which the number of selected surface portions to be measured is the largest is calculated using the branch and bound method, and the calculated optimal candidate position is determined as the measuring machine arrangement position. The measuring machine arrangement position determination apparatus of claim 1 or 2. The measurement part specification unit specifies at least a high level or a low level of importance in a measurement part to be measured by the measuring device in the object in the base model,
The surface selection unit is visible when viewed from the candidate position among the plurality of surfaces included in the base model, and the measurement with the high level of importance specified by the measurement part specification unit It is visible when viewed from the candidate position among the plurality of planes included in the base model, which corresponds to the area and which satisfies the high level measurement condition is selected as the high level selected plane, The surface corresponding to the measurement part for which the low level importance is specified by the measurement part specification unit and which satisfies the low level measurement condition is selected as the low level selection surface,
The arrangement position determination unit performs mathematical programming on one or more candidate positions at which the number of high level selection surfaces to be measured is the largest among the plurality of candidate positions determined by the candidate position determination unit. The low level selection surface to be calculated using the calculated candidate position as the measuring machine arrangement position for high accuracy measurement, or measured among the plurality of candidate positions determined by the candidate position determining unit At least one candidate position at which the number of minutes is maximized is calculated using mathematical programming, and the calculated candidate position is determined as a measuring machine arrangement position for low accuracy measurement,
The high level measurement condition includes that the incident angle at which the laser beam emitted from the measurement device is incident on the surface portion included in the base model is a first angle range, and the low level measurement condition is It is included that the incident angle which the laser beam irradiated from a measuring instrument injects into the surface part contained in the said base model is the 2nd angle range, and the 2nd angle range is larger than the 1st angle range The measuring instrument arrangement position determining apparatus according to any one of claims 1 to 4, characterized in that:   The high level measurement condition includes that the distance between the measurement machine and the surface portion included in the base model is a first distance range, and the low level measurement condition includes the measurement machine and the base model The measurement according to claim 5, characterized in that the distance between the surface portion included in the second portion is a second distance range, and the second distance range is larger than the first distance range. Machine arrangement position determination device. In order to measure the position, shape or other attributes of the object to be measured by a measuring device that performs three-dimensional measurement by irradiating a laser beam, the measuring device arrangement position where the measuring device is arranged around the object to be measured is determined Measuring device placement position determination method,
The object to be measured which is generated by using a plurality of images obtained by photographing the object to be measured and its surroundings while changing its position or direction with a camera, and represented by a set of a plurality of surface portions and its periphery A base model acquisition step of acquiring a base model that is a three-dimensional model of
A measurement part specification step of specifying a measurement part to be measured by the measuring machine among the objects in the base model;
In the floor surface on which the object to be measured is placed in the base model, a plurality of parts on which the measuring machine and a support for supporting the measuring machine can be placed are recognized, and in each recognized part the measuring machine and A candidate position determination step of determining the measurement reference position of the measuring machine when the support is placed as a candidate position;
Among the plurality of surfaces included in the base model, a surface which is visible when viewed from the candidate position and which corresponds to the measurement portion designated in the measurement portion designation step is selected as a selection surface portion Surface selection process,
Among the plurality of candidate positions determined in the candidate position determination step, one or more candidate positions at which the number of the selected surface portions to be measured is the largest is calculated using mathematical programming, and the calculated candidates Providing an arrangement position determining step of determining a position as the measuring machine arrangement position;
In the surface portion selecting step, a developed image of the base model viewed from the candidate position is generated, and among the plurality of surfaces included in the base model, the surface portion drawn in the developed image is the candidate A measuring machine arrangement position determining method characterized by specifying it as a surface that is visible when viewed from a position. In order to measure the position, shape or other attributes of the object to be measured by a measuring device that performs three-dimensional measurement by irradiating a laser beam, the measuring device arrangement position where the measuring device is arranged around the object to be measured is determined A program for causing a computer to execute a measuring instrument placement position determination method,
The measuring machine arrangement position determination method is
The object to be measured which is generated by using a plurality of images obtained by photographing the object to be measured and its surroundings while changing its position or direction with a camera, and represented by a set of a plurality of surface portions and its periphery A base model acquisition step of acquiring a base model that is a three-dimensional model of
A measurement part specification step of specifying a measurement part to be measured by the measuring machine among the objects in the base model;
In the floor surface on which the object to be measured is placed in the base model, a plurality of parts on which the measuring machine and a support for supporting the measuring machine can be placed are recognized, and in each recognized part the measuring machine and A candidate position determination step of determining the measurement reference position of the measuring machine when the support is placed as a candidate position;
Among the plurality of surfaces included in the base model, a surface which is visible when viewed from the candidate position and which corresponds to the measurement portion designated in the measurement portion designation step is selected as a selection surface portion Surface selection process,
Among the plurality of candidate positions determined in the candidate position determination step, one or more candidate positions at which the number of the selected surface portions to be measured is the largest is calculated using mathematical programming, and the calculated candidates Providing an arrangement position determining step of determining a position as the measuring machine arrangement position;
In the surface portion selecting step, a developed image of the base model viewed from the candidate position is generated, and among the plurality of surfaces included in the base model, the surface portion drawn in the developed image is the candidate A program characterized by specifying it as an area that is visible when viewed from a position.