JP6511773B2 - Au-Sn alloy solder paste, method of manufacturing Au-Sn alloy solder paste, method of manufacturing Au-Sn alloy solder layer - Google Patents

Description

The present invention relates to Au-Sn alloy solder paste, Au-Sn alloy The method of manufacturing solder paste, Au-Sn alloy solder paste production how the Au-Sn alloy solder layer using.

In the background art of Patent Document 1, an Au-20 mass% Sn alloy solder paste containing Au-20 mass% Sn having a melting point of 278 ° C. as Au—Sn alloy solder, or Au having an melting point of 217 ° C. An Au-90 wt% Sn alloy solder paste is disclosed which comprises -90 wt% Sn.
Among the above-mentioned solder pastes, an Au-20 mass% Sn alloy solder paste having a high melting point is used, for example, in a high temperature environment.

JP, 2011-167761, A

  By the way, in recent years, as an Au-Sn alloy solder used by electronic parts used under high temperature environment, what can be used under high temperature environment of 300 ° C or more is desired. For example, in a power semiconductor for power control used in an electric car etc., a large amount of heat is applied because a large current is applied, and furthermore, it is used in a high temperature environment such as an engine room, etc. Solder that can be used in a temperature environment is desired.

However, since the melting point of Au-20 mass% Sn alloy solder which is a conventional high melting point solder is 278 ° C., it has been difficult to use in a high temperature environment of 300 ° C. or higher.
In addition, the Au-20 mass% Sn alloy solder paste used when forming the Au-20 mass% Sn alloy solder has a problem that the cost increases because the ratio of Au is as high as 80 mass%. .

Therefore, according to the present invention, an Au-Sn alloy solder paste which can be used under a high temperature environment of 300 ° C. or higher and can reduce the cost, a method of producing an Au-Sn alloy solder paste, an Au-Sn alloy solder and to provide a manufacturing how layers.

In order to solve the above problems, according to one aspect of the present invention, it is an Au-Sn alloy solder paste in which Sn: 38 mass% or more and 54 mass% or less, the balance is Au and unavoidable impurities, and Sn: 18 mass% A first Au-Sn powder containing 24% by mass or less, the balance being Au and unavoidable impurities, and a second Au-Sn powder consisting of Sn: 80% by mass to 92% by mass, the balance being Au and unavoidable impurities , mixed with powder are mixed, and a flux to be mixed with the mixed powder, only containing alloy components of Au-Sn alloy, the first Au-Sn powder and the second Au-Sn powder only The Au--Sn alloy solder paste is characterized in that the second Au--Sn powder has an average particle diameter in the range of 0.1 to 7 .mu.m .

According to the present invention, Sn: 18% by mass to 24% by mass, the first Au-Sn powder consisting of Au and unavoidable impurities with the balance, Sn: 80% by mass to 92% by mass, the balance with Au and the inevitable Sn: 38 mass% or more and 54 mass% or less formed by an Au—Sn alloy solder paste containing a second Au—Sn powder consisting of impurities; the melting point of an Au—Sn alloy solder consisting of Au and unavoidable impurities Can be made higher than 300.degree.
Thereby, Sn: 38 mass% or more and 54 mass% or less formed using said Au-Sn alloy solder paste, Au-Sn alloy solder which remainder becomes from Au and an unavoidable impurity in high temperature environment of 300 degreeC or more Can be used in

  In addition, the ratio of expensive Au can be reduced to 46% by mass or more and 62% by mass or less as compared with the Au ratio of Au-20% by mass Sn alloy solder which is a conventional high melting point solder. Thereby, the cost of the Au-Sn alloy solder paste can be reduced compared to the Au-20 mass% Sn alloy solder paste.

  In the Au-Sn alloy solder paste, the content of the mixed powder is 60% by mass to 95% by mass of the whole paste, and the content of the flux is 5% by mass to 40% by mass of the whole paste It may be

If the content of the flux (content of the flux when the total amount of Au-Sn alloy solder paste is 100% by mass) is less than 5% by mass, the viscosity of the Au-Sn alloy solder paste becomes too high. It may be difficult to print the Au-Sn alloy solder paste using the method.
On the other hand, when the content of the flux exceeds 40% by mass, printing sag tends to occur during printing of the Au-Sn alloy solder paste, and the aggregation of the first and second Au-Sn powders is insufficient when performing the reflow process. May occur.

  Therefore, by setting the content of the mixed powder and the flux within the above numerical range, generation of printing sag and generation of insufficient aggregation of the first and second Au-Sn powders can be suppressed, and the Au-Sn alloy can be obtained. Solder paste can be easily printed.

In the Au-Sn alloy solder paste, the average particle diameter of the first Au-Sn powder may be in the range of 0.1 to 30 μm.

If the average particle diameter of the first Au-Sn powder is smaller than 0.1 μm, it may be difficult to melt the first Au-Sn powder when performing reflow processing after printing the Au-Sn alloy solder paste. There is.
On the other hand, when the average particle diameter of the first Au-Sn powder is larger than 30 μm, the printability of the Au-Sn alloy solder paste may be deteriorated and the flux and the first Au-Sn powder may be separated. .

Therefore, separation of the flux and the first Au-Sn powder can be suppressed by setting the average particle diameter of the first Au-Sn powder in the range of 0.1 to 30 μm, and The reduction in printability can be suppressed, and furthermore, the first Au-Sn powder can be easily melted at the time of the reflow process.

In order to solve the above problems, according to another aspect of the present invention, an Au--Sn alloy solder used for preparing an Au--Sn alloy solder in which Sn: 38 mass% or more and 54 mass% or less, the balance being Au and unavoidable impurities A method for producing a Sn alloy solder paste, wherein Sn: 18% by mass to 24% by mass, a first Au-Sn powder composed of Au and unavoidable impurities with the balance, Sn: 80% by mass to 92% by mass, a step of balance produces a second Au-Sn powder and mixed powder by mixing of Au and unavoidable impurities, a step of mixing the mixed powder and flux, only including, the Au-Sn alloy The alloy component is prepared only with the first Au-Sn powder and the second Au-Sn powder, and the average particle diameter of the second Au-Sn powder is in the range of 0.1 to 7 μm. this has been the Method for producing a Au-Sn alloy solder paste, characterized in, is provided.

  According to the present invention, it is possible to form an Au-Sn alloy solder which comprises Sn: 38 mass% or more and 54 mass% or less, the balance being Au and unavoidable impurities under high temperature environment of 300 ° C. or more The cost of the Au—Sn alloy solder paste can be reduced as compared to the mass% Sn alloy solder paste.

  Also, by mixing the low melting point first Au-Sn powder and the second Au-Sn powder, an Au-Sn alloy comprising Sn: 38% by mass or more and 54% by mass or less, with the balance being Au and unavoidable impurities Reflow of an Au—Sn alloy solder composed of mixed powder and flux can be performed below the liquidus temperature of the solder.

  In order to solve the above problems, according to another aspect of the present invention, the Au-Sn alloy solder paste according to any one of claims 1 to 3 is used as Au to constitute the Au-Sn alloy solder paste. There is provided a method of producing an Au-Sn alloy solder layer, characterized in that it is melted at a temperature between a solidus line and a liquidus line of a Sn alloy.

According to the present invention, the solder layer is formed by melting the Au-Sn alloy solder paste at a temperature between the solid line and the liquidus of the Au-Sn alloy constituting the Au-Sn alloy solder paste. Since it melts at a temperature of 309 ° C. or higher, it can be used in a high temperature environment of 300 ° C. or higher.
Moreover, Sn: 38 mass% or more and 54 mass% or less which uses Au-Sn alloy solder paste as a base material, and Au-Sn alloy solder whose remainder consists of Au and unavoidable impurities is Au-20 mass which is the conventional high melting point solder. The cost can be reduced because the content of Au, which is more expensive than Sn alloy solder, is lower.

  According to the present invention, it is possible to obtain an Au-Sn alloy solder layer usable in a high temperature environment of 300 ° C. or higher, and to reduce the cost of the Au-Sn alloy solder layer.

It is a phase diagram of Au-Sn alloy. It is a photograph of the surface when the Au-Sn alloy solder paste of Example 3 is heat-melted.

  Hereinafter, an embodiment to which the present invention is applied will be described in detail with reference to the drawings.

<Au-Sn alloy solder paste>
The Au-Sn alloy solder paste of the present embodiment is an Au-Sn alloy solder paste used when producing an Au-Sn alloy solder in which the content of Sn is 38 mass% or more and 54 mass% or less, and the balance is Au and unavoidable impurities. Sn: 18 mass% or more and 24 mass% or less, the first Au-Sn powder composed of the balance of Au and unavoidable impurities, Sn: 80 mass% or more and 92 mass% or less, the balance of Au and unavoidable impurities And a second mixed powder of Au-Sn powder, and a flux mixed with the mixed powder.

In the Au-Sn alloy solder paste, the content of the mixed powder is 60% by mass or more and 95% by mass or less of the entire Au-Sn alloy solder paste, and the content of the flux is 5% of the entire Au-Sn alloy solder paste. It is said that it is mass% or more and 40 mass% or less.
As the flux, for example, a general flux (for example, a flux containing rosin, an activator, a solvent, a thickener, and the like) can be used. As the flux, it is preferable to use, for example, a weakly active (RMA) type flux or an active (RA) type flux from the viewpoint of the wettability of the Au-Sn alloy solder paste.
In the Au-Sn alloy solder paste, the average particle diameter of the first and second Au-Sn powders can be, for example, in the range of 0.1 to 30 μm.
The Au--Sn alloy solder paste of the present embodiment is not limited to use only in the printing method. The Au-Sn alloy solder paste may be used, for example, in a dispensing method or a pin transfer method.

<Method of Manufacturing Au-Sn Alloy Solder Paste>
Next, a method of manufacturing the Au-Sn alloy solder paste will be briefly described.
First, first and second Au--Sn powders having the above-described composition and average particle diameter are prepared.
Specifically, for example, the first and second Au-Sn powders having the above-described composition and average particle diameter are prepared by performing the following treatment.

The first and second Au-Sn powders can be formed, for example, by gas atomization. In this case, the first Au-Sn powder has, for example, an Au-Sn alloy having a predetermined composition (Sn: 18 mass% or more and 24 mass% or less, and the remainder is a predetermined composition within the range of Au and unavoidable impurities). The molten metal obtained by melting is maintained at a predetermined temperature (for example, 450 to 1000 ° C.), and the molten metal is pressurized (for example, pressure) while stirring (for example, mechanically stirring) or after stirring. It forms by spraying using an inert gas from a small diameter nozzle (diameter 1-2 mm), 300 to 800 kPa.
As conditions for the above-mentioned spraying, for example, the spraying pressure can be 5000 to 8000 kPa, and the nozzle gap can be 0.3 or less.

The second Au-Sn powder uses an Au-Sn alloy having a predetermined composition (Sn: 80 mass% or more and 92 mass% or less, and the remaining composition is a predetermined composition within the range of Au and unavoidable impurities) , And the first Au-Sn powder can be formed by the same method.
Next, the first and second Au-Sn powders are classified by a known method to obtain the first and second Au-Sn powders having the average particle diameter. For example, an air classification method can be used as a classification method at this time.

Next, the first Au-Sn powder and the second Au-Sn powder are mixed to form a mixed powder. As a mixing method at this time, methods, such as a paint shaker method, a ball mill method, a sand mill method, can be used, for example.
Then, the mixed powder and the flux are mixed to produce an Au-Sn alloy solder paste. As a mixing method at this time, for example, it can be performed by planetary stirring.

<Au-Sn alloy solder layer>
FIG. 1 is a phase diagram of an Au-Sn alloy.
The Au--Sn alloy solder layer is formed by printing the above-mentioned Au--Sn alloy solder paste by a printing method and then between the solidus and liquidus of the Au--Sn alloy constituting the Au--Sn alloy solder paste. Sn: 38 mass% or more and 54 mass% or less obtained by reflow at temperature, and the balance is an Au-Sn alloy solder layer which consists of Au and an unavoidable impurity.

Referring to FIG. 1, when the content of Sn contained in the Au-Sn alloy is less than 38% by mass and more than 20% by mass, the temperature of the solidus line is 278 ° C., and the Sn contained in the Au-Sn alloy Is more than 54% by mass and less than 70% by mass, the solidus temperature is 258 ° C. And when Sn contained in Au-Sn alloy will be 38 mass% or more and 54 mass% or less, temperature of a solidus line will be 309 ° C higher than 278 ° C.
In other words, by setting the composition of the Au-Sn alloy solder layer to Sn: 38 mass% or more and 54 mass% or less, and the balance being Au and an unavoidable impurity, the temperature of the solidus line where the Au-Sn alloy solder layer melts is 300 ° C It can be more than.

In the Au-Sn alloy solder paste, when the content of the flux (the ratio of the flux when the total amount of the Au-Sn alloy solder paste is 100 mass%) is less than 5 mass%, Because the viscosity is too high, it may be difficult to print the Au-Sn alloy solder paste using a printing method.
On the other hand, when the content of the flux exceeds 40% by mass, printing sag tends to occur during printing of the Au-Sn alloy solder paste, and the aggregation of the first and second Au-Sn powders is insufficient when performing the reflow process. May occur.

  Therefore, by setting the content of the mixed powder and the flux in the above range, generation of printing sag and generation of insufficient aggregation of the first and second Au-Sn powders are suppressed, and then the Au-Sn alloy solder is produced. The paste can be printed easily.

In the Au-Sn alloy solder paste, when the average particle diameter of the first and second Au-Sn powders is smaller than 0.1 μm, the reflow (melting) process after printing the Au-Sn alloy solder paste, There is a risk that the first and second Au-Sn powders will be difficult to melt.
On the other hand, when the average particle diameter of the first and second Au-Sn powders is larger than 30 μm, the printability of the Au-Sn alloy solder paste is deteriorated, and the flux and the first and second Au-Sn powders are used. May be separated.

  Therefore, separation of the flux and the first and second Au-Sn powders can be suppressed by setting the average particle diameter of the first and second Au-Sn powders in the range of 0.1 to 30 μm, and Au -The fall of the printability of Sn alloy solder paste can be suppressed, and also it can be made easy to fuse the 1st and 2nd Au-Sn powder at the time of reflow processing.

According to the Au-Sn alloy solder paste of the present embodiment, the method of manufacturing the Au-Sn alloy solder paste, the method of manufacturing the Au-Sn alloy solder layer, and the Au-Sn alloy solder layer, Sn: 18 mass% or more A first Au-Sn powder composed of not more than mass%, the balance being Au and unavoidable impurities, and a second Au-Sn powder composed of Sn: 80% by mass to 92% by mass, the balance being Au and unavoidable impurities Containing 38% by mass to 54% by mass of Sn formed from the Au-Sn alloy solder paste, and the remainder being Au and an unavoidable impurity, the melting point of the Au-Sn alloy solder is 309 ° C. higher than 300 ° C. (Sn: 38 It becomes possible to make it the temperature of the solidus line of the Au-Sn alloy in which the remainder is Au and unavoidable impurities by mass% or more and 54 mass% or less.
Thereby, Sn: 38 mass% or more and 54 mass% or less formed using said Au-Sn alloy solder paste, Au-Sn alloy solder which remainder becomes from Au and an unavoidable impurity in high temperature environment of 300 degreeC or more Can be used in

  In addition, the ratio of expensive Au can be reduced to 46% by mass or more and 62% by mass or less as compared with the Au ratio of Au-20% by mass Sn alloy solder which is a conventional high melting point solder. Thereby, the cost of the Au-Sn alloy solder paste can be reduced compared to the Au-20 mass% Sn alloy solder paste.

Also, by mixing the low melting point first Au-Sn powder and the second Au-Sn powder, an Au-Sn alloy comprising Sn: 38% by mass or more and 54% by mass or less, with the balance being Au and unavoidable impurities The reflow process of the Au-Sn alloy solder which consists of mixed powder and flux can be performed below the liquidus temperature of a solder.
As said reflow process, the reflow process performed under normal inert gas atmosphere can be used, for example. If the reflow temperature is too high, there is a possibility that the cleaning performance of the flux may be affected. For this reason, it is preferable to make reflow temperature below the liquidus temperature of Au-Sn alloy solder.
As the reflow process, for example, a reflow process performed in a vacuum atmosphere may be used. In this case, since the cleaning property of the flux does not easily deteriorate, the reflow process may be performed at a temperature about 20 ° C. to 30 ° C. higher than the liquidus temperature of the Au—Sn alloy solder.

  Although the preferred embodiments of the present invention have been described above in detail, the present invention is not limited to such specific embodiments, and is within the scope of the present invention as described in the claims. Various modifications and changes are possible.

  Hereinafter, although an example is described, the present invention is not limited to the following example.

<Production of Au-Sn alloy solder paste>
Au-Sn alloy solder pastes P1 to P16 of Examples 1 to 16 were produced by the above-described method under the conditions shown in Table 1.

Specifically, Au-Sn alloy solder pastes P1 to P16 were produced using the following method.
First, the first Au-Sn powder and the second Au-Sn powder were mixed by a known method to form a mixed powder.
Subsequently, Au-Sn alloy solder paste P1-P16 was produced by mixing the said mixed powder and RA type flux with a well-known method.

<Evaluation test of printability>
First, a Ni plating layer with a thickness of 5 μm and an Au plating layer with a thickness of 0.1 μm are sequentially formed on the surface of a Kovar plate (length 30 mm × width 20 mm) by electrolytic plating. A substrate for evaluation was produced.
Next, in order to form an Au-Sn alloy solder frame of package size 1610 (length 1.6 mm × width 1.0 mm), 100 frame-shaped through grooves with a width of 60 μm are provided, and the thickness is 15 μm. The prepared stencil mask for printing was prepared.

Next, an Au-Sn alloy paste was printed on the evaluation substrate using a printing stencil mask. Next, the printing stencil mask was removed from the evaluation substrate.
Thereafter, 100 frame-shaped Au-Sn alloy solder pastes (hereinafter referred to as "frame-shaped solder paste") formed on the evaluation substrate are observed using an optical microscope, and a frame of a stencil mask for printing The case where the number of frame-like solder pastes made into the same shape as the through-grooves was 90 or more was judged as ○, and the case of 80 or more and less than 90 was judged as △.
In addition, the frame-like solder paste made into the same shape as a frame-like penetration groove | channel means the thing of the frame-like solder paste which a frame-like solder paste does not interrupt and there is no chipping in a frame-like solder paste.

<Evaluation test of meltability>
Using the evaluation substrate used in the evaluation test of printability (specifically, the evaluation substrate from which the stencil mask for printing was removed and 100 frame-shaped solder pastes were formed), the following method was used. .
First, the frame-shaped solder paste was subjected to a reflow process by heating the evaluation substrate on which 100 frame-shaped solder pastes were formed in a nitrogen atmosphere. At this time, the peak temperature was 320 ° C., and the reflow processing time was 3 minutes.

  Thereafter, 100 frame-shaped solder pastes subjected to reflow processing are observed using the above-mentioned optical microscope, and when the number of frame-shaped solder pastes having unmelted is 2 or less, it is judged as ○ and melted. When the number of remaining frame-shaped solder pastes was 3 or more and 5 or less, it was determined as Δ. At this time, it was determined that there were unmelted powder when unagglomerated powder was present.

<Summary of evaluation test results>
Referring to Table 1, from the evaluation results, in order to make both the printability and the meltability good results, Sn: 18% by mass to 24% by mass, with the balance being Au and the first Au consisting of unavoidable impurities The composition of an Au-Sn alloy solder (in other words, the entire composition) using Sn powder, Sn: 80% by mass to 92% by mass, and the second Au-Sn powder consisting of Au and unavoidable impurities with the balance being Au and Sn It has been confirmed that it is preferable that the composition be Sn: 40% by mass to 53% by mass and the balance be Au and an unavoidable impurity.

  Also, from the evaluation results of Examples 1 to 16, the powder mixing ratio is set to the first Au-Sn powder: the second Au-Sn powder = 55 to 70:30 to 45, and the printability and the meltability It could be confirmed that both results of are good results (specifically, ○).

From the evaluation results of the average particle size and the meltability of Examples 7 and 13, the average particle size of the first and second Au-Sn powders is smaller than 0.1 μm (0.05 μm in Example 7, Example 13) In this case, it was confirmed that the meltability was deteriorated to 0.03 μm).
On the other hand, according to the average particle diameter and meltability evaluation results of Examples 9 and 14, when the average particle diameter of the first and second Au-Sn powders is larger than 30 μm (32 μm in Example 14), the printability is It has been confirmed that it gets worse.
From the above results, the average particle diameter of the first and second Au-Sn powders is preferably in the range of 0.1 μm to 30 μm. By setting the average particle diameter in this range, the decrease in printability and meltability is suppressed. It has been confirmed that it is possible.

From the ratio (content) of the flux in Examples 3, 10 and 15 and the evaluation result of the printability, the printability is deteriorated when the ratio of Fux is less than 5% by mass (3% by mass in Example 15) Was confirmed.
On the other hand, from the evaluation results of the ratio of the flux and the printability in Examples 11, 12 and 16, when the ratio of Fux is more than 40% by mass (45% by mass in Example 12 and 48% by mass in Example 16) It has been confirmed that the printability is deteriorated.
From the above results, the ratio (content) of the flux is preferably in the range of 5% by mass to 40% by mass, and it can be confirmed that the decrease in printability can be suppressed by setting the ratio in this range.

<Observation of molten state of Au-Sn alloy solder paste of Example 3>
Here, the first and third substrates for evaluation of Example 3 in which the stencil mask for printing was removed and 100 frame-shaped solder pastes were formed were heated from room temperature (without heating) to 473 ° C. It observed about the molten state of 2nd Au-Sn powder.
At this time, it observed using the optical microscope mentioned above. Further, the temperature of the frame-shaped solder paste is room temperature, 218 ° C. (a temperature close to the melting point 217 ° C. of Au-90 mass% Sn alloy solder), 278 ° C. (a melting point of Au-22 mass% Sn alloy solder) 340 ° C. At 437 ° C., the surface of the Au—Sn alloy solder paste P3 of Example 3 was imaged. The results are shown in FIG.
FIG. 2 is a photograph of the surface when the Au-Sn alloy solder paste of Example 3 is heated and melted.

Referring to the photograph at room temperature (25 ° C.) shown in FIG. 2, the first and second Au-- contained in the Au--Sn alloy solder paste P3 (Au--53 mass% Sn alloy solder paste) The Sn powder was found to be uniformly dispersed.
In the photograph at room temperature in FIG. 2, the first and second Au—Sn powders are white and glossy, and the other portion is the flux.

Referring to the photograph at a temperature of 218 ° C. , it can be confirmed that the proportion of the powder is further reduced as compared to the photograph at room temperature .
This is because the temperature of the Au-Sn alloy solder paste P3 becomes 218 ° C., and the melting of the Au-90 mass% Sn powder (second Au-Sn powder) contained in the Au-Sn alloy solder paste P3 starts It is assumed that it is because it was done.

Referring to the photograph at a temperature of 278 ° C., it can be confirmed that the proportion of white particles is further reduced and many white particles are melted as compared with the photograph at 218 ° C.
This is because the temperature of the Au-Sn alloy solder paste P3 becomes 278 ° C., and the melting of the Au-22 mass% Sn powder (first Au-Sn powder) contained in the Au-Sn alloy solder paste P3 starts It is assumed that it is because it was done.

Solidus temperature 309 ° C and liquidus temperature 360 ° C of Au-53 mass% Sn alloy solder
Referring to the photograph at 340 ° C., which is the temperature between, it was found that the solid portion decreased and the melt increased rapidly as compared to the photograph at 278 ° C.

Referring to the photograph at 437 ° C higher than the temperature 360 ° C of the liquidus of the Au-53 mass% Sn alloy solder, the Au-90 mass% Sn powder and the Au-22 mass% Sn powder are completely melted Was confirmed.
From the plurality of photographs shown in FIG. 2 above, the melt of the Au-Sn alloy solder paste P3 rapidly increases at a temperature lower than the temperature 360 ° C. of the liquidus of the Au-53 mass% Sn alloy solder (liquefaction To be confirmed).

Claims (5)

Sn: an Au-Sn alloy solder paste comprising 38% by mass or more and 54% by mass or less, with the balance being Au and unavoidable impurities,
Sn: 18% by mass or more and 24% by mass or less, the first Au-Sn powder consisting of Au and unavoidable impurities with the balance, Sn: 80% by mass or more and 92% by mass or less, the second with a balance of Au and unavoidable impurities Mixed powder obtained by mixing Au-Sn powder;
A flux mixed with the mixed powder;
Only including,
The alloy component of the Au-Sn alloy is prepared only with the first Au-Sn powder and the second Au-Sn powder,
The Au-Sn alloy solder paste, wherein an average particle diameter of the second Au-Sn powder is in a range of 0.1 to 7 μm . The content of the mixed powder is 60% by mass or more and 95% by mass or less of the whole paste,
The Au-Sn alloy solder paste according to claim 1, wherein a content of the flux is 5% by mass or more and 40% by mass or less of the whole paste. The Au-Sn alloy solder paste according to claim 1, wherein an average particle diameter of the first Au-Sn powder is in a range of 0.1 to 30 μm. Sn: 38 mass% or more and 54 mass% or less The manufacturing method of the Au-Sn alloy solder paste used when producing the Au-Sn alloy solder which remainder becomes from Au and an unavoidable impurity,
Sn: 18% by mass or more and 24% by mass or less, the first Au-Sn powder consisting of Au and unavoidable impurities with the balance, Sn: 80% by mass or more and 92% by mass or less, the second with a balance of Au and unavoidable impurities Mixing the Au-Sn powder to form a mixed powder;
Mixing the mixed powder with a flux;
Only including,
The alloy component of the Au-Sn alloy is configured to be adjusted only with the first Au-Sn powder and the second Au-Sn powder,
The average particle diameter of said 2nd Au-Sn powder is made into the range of 0.1-7 micrometers, The manufacturing method of the Au-Sn alloy solder paste characterized by the above-mentioned.   The Au-Sn alloy solder paste according to any one of claims 1 to 3 is a temperature between a solidus line and a liquidus line of an Au-Sn alloy constituting the Au-Sn alloy solder paste. The manufacturing method of the Au-Sn alloy solder layer characterized by making it fuse | melt.