JP6508446B1 - Photosensitive resin composition, resin film and electronic device - Google Patents

Abstract

A photosensitive resin composition comprising a silane compound having a specific structure (having a secondary amine structure and a specific silicon-containing structure at two ends of the molecule), an alkali-soluble resin, and a photosensitizer. Also, a resin film obtained by curing the photosensitive resin composition. Moreover, the electronic device provided with this resin film. Preferably, the alkali-soluble resin is a polyamide resin. The photosensitizer is preferably a diazoquinone compound.

Description

  The present invention relates to a photosensitive resin composition, a resin film and an electronic device.

Heretofore, in the field of photosensitive resin compositions, for the purpose of obtaining a cured film which is free from pattern peeling or floating during development and has good adhesion to the underlying substrate after thermosetting treatment or chemical treatment. Various technologies are being developed. Examples of this type of technology include the technology described in Patent Document 1.
According to Patent Document 1, it is described that peeling and soaking can be suppressed when the photosensitive resin composition is alkali-developed on a metal substrate by using a silane compound having a specific structure. Moreover, according to patent document 1, it is described that the cured film which carried out thermosetting of the photosensitive resin composition expresses favorable adhesiveness to a metal substrate.

International Publication No. 2013/146130

When the present inventor uses the photosensitive resin composition described in Patent Document 1 as a permanent film of an electronic device, an aluminum (Al) pad provided for input / output of a substrate of the electronic device and copper (Cu) which is an electric circuit The adhesion between the circuit and the permanent film was examined. In addition, with a permanent film, after performing prebaking, exposure and development with respect to the resin film formed with the photosensitive resin composition, patterning in a desired shape, and hardening a resin film by post-baking further. It is a cured film obtained.
As a result of the above examination, it was found that the photosensitive resin composition described in Patent Document 1 does not exhibit adhesion to an Al pad unless the temperature of prebaking is, for example, 120 ° C. or higher. This causes a disadvantage that the photosensitive resin composition peels off from the Al pad.
On the other hand, when the temperature of prebaking was high temperature, for example, 120 degreeC or more, it turned out that the adhesiveness of a copper circuit and the photosensitive resin composition of patent document 1 becomes too large before development. Thus, when the photosensitive resin composition is developed to form a via that exposes the Cu circuit, the photosensitive resin composition can not be completely removed by development, and residues of the photosensitive resin composition occur in the via. It will occur. Then, when the residue is generated, there is a problem that the electrical reliability of the electronic device is lowered.
From the above, it was found that the adhesion between the photosensitive resin composition and the Al pad after prebaking and the generation of the residue of the photosensitive resin composition at the time of development have a trade-off relationship depending on the temperature of the prebaking.

  Here, when the present inventor uses the photosensitive resin composition described in Patent Document 1 as a permanent film of an electronic device, a cured film of the photosensitive resin composition after post-baking, an Al pad, a copper circuit, etc. The adhesion to metal was examined. As a result, it turned out that the photosensitive resin composition of patent document 1 has inadequate adhesiveness to metals, such as Al pad and a copper circuit. Thereby, when the contact area of the cured film of the photosensitive resin composition and metal is extremely small by forming a fine relief pattern on the photosensitive resin composition, the cured film may be peeled off. was there.

The permanent film of the electronic device described above specifically includes an insulating film of the electronic device.
When using the photosensitive resin composition described in Patent Document 1 as an insulating film of an electronic device, the inventor examined the chemical resistance of the insulating film when forming a two-layer insulating film.
Here, an example of a method for forming a two-layer insulating film will be described. In the manufacturing process of the electronic device, after the first insulating film is formed, the interlayer insulating film is prebaked, exposed and developed to form a via, and after postbaking, a metal wiring is formed through the via . Then, a second insulating film is formed on the first insulating film and the metal wiring. Here, as a method of forming the second insulating film, a method of applying a varnish of a photosensitive resin composition is used. And the solvent of N- methyl pyrrolidone (NMP) etc. is contained in the varnish of the photosensitive resin composition.
As a result of the above examination, when the first insulating film is formed using the photosensitive resin composition described in Patent Document 1, when the second insulating film is formed, the first insulating film is formed by NMP. There is a disadvantage that it melts and cracks occur.

  As mentioned above, this invention makes it a subject to express balance improvement of the adhesiveness improvement of the photosensitive resin composition after prebaking and Al pad, and suppression of generation | occurrence | production of the residue of the photosensitive resin composition at the time of image development. Furthermore, the present invention improves the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as Al, and additionally, the chemical resistance of the photosensitive resin composition after post-baking The task is to improve.

The present inventors prebaked at a low temperature to exhibit well-balanced improvements in adhesion of the photosensitive resin composition and Al pad after prebaking and suppression of generation of residues of the photosensitive resin composition during development. The raw material component of the photosensitive resin composition which can improve adhesiveness with Al pad was also examined. As a result, it is revealed that adhesion between the photosensitive resin composition after prebaking and the Al pad can be improved by using a silane compound having a specific structure as a raw material component even when prebaking at a low temperature of 120 ° C. did.
Moreover, it turned out that the adhesiveness of the cured film of the photosensitive resin composition after post-baking and metals, such as Al, can be improved by using the silane compound of the said specific structure.
Furthermore, it turned out that the chemical resistance of the photosensitive resin composition after post-baking can be improved by using the silane compound of the said specific structure.
From the above, by the present inventor including a silane compound having a specific structure, adhesion improvement of the photosensitive resin composition and Al pad after prebaking and suppression of generation of a residue of the photosensitive resin composition at the time of development are suppressed. And the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as Al, and the chemical resistance of the photosensitive resin composition after post-baking. It has been found that the property can be improved, and the present invention has been completed.

According to the invention
A silane compound represented by the following general formula (1):
Alkali-soluble resin,
A photosensitive resin composition comprising: a photosensitive agent ;
The photosensitive resin composition is provided , wherein the alkali-soluble resin is at least one selected from the group consisting of phenol resin, hydroxystyrene resin, cyclic olefin resin, polyamide resin, polyimide resin and polybenzoxazole resin .
(This is also referred to as the "first invention").

（上記一般式（１）において、Ｒ^１は炭素数１以上３０以下のアルキレン基を表す。
Ｒ ^２ 及びＲ^３は、それぞれ独立して、炭素数１以上３０以下の有機基を表す。
Ａは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ａは互いに同一でもよく、互いに異なっていてもよい。Ａのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。
Ｂは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ｂは互いに同一でもよく、互いに異なっていてもよい。Ｂのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。）

(In the above general formula (1), R ¹ represents an alkylene group having 1 to 30 carbon atoms .
Each of R ² and R ³ independently represents an organic group having 1 to 30 carbon atoms.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

Moreover, according to the present invention,
A silane compound represented by the above general formula (1),
Alkali-soluble resin,
A photosensitive resin composition comprising: a photosensitive agent;
The R ¹ in the general formula (1) is an alkylene group having 1 to 30 carbon atoms,
The photosensitive resin composition is provided, wherein the photosensitizer is a diazoquinone compound.
(This is also referred to as "the second invention").
Further, according to the present invention, a resin film obtained by curing the photosensitive resin composition of the first or second invention is provided.

  Moreover, according to the present invention, an electronic device provided with the above-mentioned resin film is provided.

  The present invention achieves well-balanced improvement in adhesion of the photosensitive resin composition and Al pad after pre-baking and suppression of generation of residues of the photosensitive resin composition during development, and further, photosensitivity after post-baking Disclosed is a photosensitive resin composition that improves the adhesion between a cured film of a resin composition and a metal such as Al and additionally improves the chemical resistance of the photosensitive resin composition after post-baking.

  The objects described above, and other objects, features and advantages will become more apparent from the preferred embodiments described below and the following drawings associated therewith.

It is a sectional view showing an example of the electronic device concerning this embodiment.

Hereinafter, the present embodiment will be described using drawings as appropriate. In all the drawings, the same components are denoted by the same reference numerals and the description thereof will be omitted.
Further, in the present specification, the silane compound represented by the general formula (1) may be referred to as "a silane compound having a specific structure" or the like.

  The photosensitive resin composition which concerns on this embodiment contains the silane compound of specific structure, alkali-soluble resin, and a photosensitive agent.

The inventors of the present invention obtain a photosensitive resin composition that exhibits well-balanced improvement in adhesion of the photosensitive resin composition and Al pad after prebaking and generation of a residue of the photosensitive resin composition during development. Therefore, the raw material component of the photosensitive resin composition which can improve adhesiveness with Al pad even if prebaking at low temperature was examined. As a result, it is revealed that adhesion between the photosensitive resin composition after prebaking and the Al pad can be improved by using a silane compound having a specific structure as a raw material component even when prebaking at a low temperature of 120 ° C. did. The detailed mechanism is not clear, but the following reasons can be inferred.
First, the molecule of the silane compound having the above specific structure is provided with a group represented by —SiA ₃ or —SiB ₃ at each of two ends of the molecular structure. Then, it is presumed that a crosslinked structure is formed with an alkali-soluble resin which is a component of the photosensitive resin composition via these groups. Here, the silane compound having the above-described specific structure is considered to have two lone electron pairs derived from the nitrogen atom of the secondary amine, and to interact strongly with the Al atom as compared with the conventional silane compound. And the nitrogen atom of secondary amine is contained in the said crosslinked structure. Thereby, it is thought that the crosslinked structure containing the silane compound of the said specific structure strongly interacts with Al atom.
Therefore, even when the photosensitive resin composition according to the present embodiment is prebaked at a low temperature of less than 120 ° C., it is presumed that the adhesiveness with Al can be sufficiently improved.

Also, when using the photosensitive resin composition as a permanent film of an electronic device, the present inventors can improve the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as an Al pad. The raw material component of the photosensitive resin composition was examined. As a result, it was found that the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as an Al pad can be improved by using the silane compound having the specific structure as a raw material component. The detailed mechanism is not clear, but the reason is guessed as follows.
As described above, it is presumed that the silane compound having the above specific structure forms a crosslinked structure with the alkali-soluble resin. Here, the molecular structure of the specific silane compound is considered to behave as a flexible skeleton in the photosensitive resin composition. Thereby, it is thought that the said flexible frame | skeleton can relieve the internal stress of the photosensitive resin composition after post-baking. Therefore, it is thought that the destruction of the interface in the adhesion surface of the photosensitive resin composition and metal by the increase of the internal stress at the time of post-baking the photosensitive resin composition is suppressed.

Furthermore, the present inventors examined the raw material component of the photosensitive resin composition which can improve the chemical resistance of the photosensitive resin composition after post-baking. As a result, it turned out that the chemical resistance of the cured film of the photosensitive resin composition after post-baking can be improved by using the silane compound of the said specific structure as a raw material component. The detailed mechanism is not clear, but the reason is guessed as follows.
As described above, it is presumed that the silane compound having the above specific structure forms a crosslinked structure with the alkali-soluble resin. Thereby, it is thought that the crosslink density of the photosensitive resin composition can be improved, and the molecules of the drug can be prevented from intruding into the photosensitive resin composition.

As mentioned above, even if it is prebaked at low temperature less than 120 ° C by the photosensitive resin composition concerning this embodiment containing the silane compound of specific structure, adhesion of photosensitive resin composition after prebaking and Al pad It is estimated that the sex can be improved sufficiently. And since prebaking in low temperature less than 120 ° C is realizable, generation of a residue of photosensitive resin composition at the time of development can be controlled.
Furthermore, when the photosensitive resin composition according to the present embodiment contains a silane compound having a specific structure, adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as an Al pad is It is estimated that it can improve.
In addition, the chemical resistance of the photosensitive resin composition after post-baking can be improved by the photosensitive resin composition which concerns on this embodiment containing the silane compound of a specific structure.

  First, each raw material component of the photosensitive resin composition which concerns on this embodiment is demonstrated.

(Silane compound)
The silane compound is represented by the following general formula (1), and is preferably represented by the following general formula (2), for example, is represented by the following general formula (3) Is more preferred. Thereby, the silane compound is likely to form a crosslinked structure, and further, the internal stress can be relaxed appropriately. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved.

（上記一般式（１）において、Ｒ^１は炭素数１以上３０以下の有機基を表す。ただし、Ｒ^１のうち芳香環を含むものを除く。
Ｒ^２及びＲ^３は、それぞれ独立して、炭素数１以上３０以下の有機基を表す。
Ａは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ａは互いに同一でもよく、互いに異なっていてもよい。Ａのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。
Ｂは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ｂは互いに同一でもよく、互いに異なっていてもよい。Ｂのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。）

(In the above general formula (1), R ¹ represents an organic group having 1 or more and 30 or less carbon atoms. However, among R ¹ , those including an aromatic ring are excluded.
Each of R ² and R ³ independently represents an organic group having 1 to 30 carbon atoms.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

（上記一般式（２）において、Ｒ^１は炭素数１以上３０以下の有機基を表す。ただし、Ｒ^１のうち芳香環を含むものを除く。
Ｒ^２は、炭素数１以上３０以下の有機基を表す。
Ａは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ａは互いに同一でもよく、互いに異なっていてもよい。Ａのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。
Ｂは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ｂは互いに同一でもよく、互いに異なっていてもよい。Ｂのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。）

(In the above general formula (2), R ¹ represents an organic group having 1 or more and 30 or less carbon atoms, provided that R ¹ includes one containing an aromatic ring.
R ² represents an organic group having 1 to 30 carbon atoms.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

（上記一般式（３）において、Ｒ^１は炭素数１以上３０以下の有機基を表す。ただし、Ｒ^１のうち芳香環を含むものを除く。
Ａは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ａは互いに同一でもよく、互いに異なっていてもよい。Ａのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。
Ｂは、それぞれ独立してヒドロキシル基または炭素数１以上３０以下の有機基を表す。Ｂは互いに同一でもよく、互いに異なっていてもよい。Ｂのうち少なくとも１つは、ヒドロキシル基及び炭素数１以上３０以下のアルコキシ基から選択される１種である。）

(In the above general formula (3), R ¹ represents an organic group having 1 or more and 30 or less carbon atoms. However, among R ¹ , those including an aromatic ring are excluded.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

R ^{1 to} R ³ in the general formulas (1) to (3) are each an organic group having 1 to 30 carbon atoms, and for example, preferably an organic group having 1 to 10 carbon atoms, An organic group having 7 or more carbon atoms is more preferable, an organic group having 1 to 5 carbon atoms is more preferable, and an organic group having 1 to 3 carbon atoms is particularly preferable. Thereby, the crosslink density can be further improved. Therefore, the chemical resistance of the cured film of the photosensitive resin composition can be improved.

The organic groups constituting R ^{1 to} R ³ in the general formulas (1) to (3) may contain, for example, atoms other than hydrogen and carbon in the structure of the organic group.
Specifically as an atom other than hydrogen and carbon, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a fluorine atom, a chlorine atom etc. are mentioned. As atoms other than hydrogen and carbon, one or more of the above specific examples can be included.

Specific examples of R ¹ in the general formulas (1) to (3) include an alkylene group.
The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include methylene group, ethylene group, propylene group, butylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, nonylene group, decylene group, trimethylene group and tetramethylene group. And pentamethylene and hexamethylene groups. As the branched alkylene group, _{specifically, -C (CH 3) 2 -} , - CH (CH 3) -, - CH (CH 2 CH 3) -, - C (CH 3) ( Alkylmethylene groups such as CH ₂ CH ₃ )-, -C (CH ₃ ) (CH ₂ CH ₂ CH ₃ )-, -C (CH ₂ CH ₃ ) _2- and the like; -CH (CH ₃ ) CH ₂ -,- _{CH (CH 3) CH (CH} 3) -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 -CH 2 - , such as Alkyl ethylene group etc. are mentioned.
As R ¹ , for example, an alkylene group is preferable, and a linear alkylene group is more preferable. Thus, by R ¹ comprises a flexible structure, it can be properly relax the internal stress. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved. In addition, conformational restriction is reduced around the nitrogen atom derived from the secondary amine of the silane compound, and the nitrogen atom and the metal atom such as Al can more preferably interact. Therefore, even when prebaking at a low temperature of less than 120 ° C., adhesion between the photosensitive resin composition and the Al pad after prebaking can be sufficiently improved.

The general formula (1) - as ^{R 1} is in (3), except those containing an aromatic ring. As a result, the absence of an aromatic ring having a rigid structure can suppress the improvement of the internal stress at the time of post-baking. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved.
Specific examples of the aromatic ring include benzene rings; fused aromatic rings such as naphthalene rings, anthracene rings and pyrene rings; and heteroaromatic rings such as pyridine rings and pyrrole rings.

Specific examples of R ² in the general formulas (1) and (2) and R ³ in the general formula (1) include an alkylene group and an arylene group.
The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include methylene group, ethylene group, propylene group, butylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, nonylene group, decylene group, trimethylene group and tetramethylene group. And pentamethylene and hexamethylene groups. As the branched alkylene group, _{specifically, -C (CH 3) 2 -} , - CH (CH 3) -, - CH (CH 2 CH 3) -, - C (CH 3) (CH 2 An alkylmethylene group such as CH ₃ ) —, —C (CH ₃ ) (CH ₂ CH ₂ CH ₃ ) —, —C (CH ₂ CH ₃ ) ₂ —, and the like; —CH (CH ₃ ) CH ₂ —, —CH ( _{CH 3) CH (CH 3)} -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 -CH 2 - alkyl, such as ethylene Groups and the like.
Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthrylene group, and a group in which two or more arylene groups are bonded.
As R ² and R ³ , for example, an alkylene group is preferable. This can suppress the improvement of the internal stress at the time of post-baking. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved.

  The plurality of A in the general formulas (1) to (3) are each independently a hydroxyl group or an organic group having 1 to 30 carbon atoms, and a hydroxyl group or an organic group having 1 to 10 carbon atoms Is more preferably a hydroxyl group or an organic group having 1 to 3 carbon atoms, and more preferably a hydroxyl group or an organic group having 1 to 2 carbon atoms. It is considered that this makes it easier for the molecular chain of the silane compound to be incorporated into the crosslinked structure.

  As A in the general formulas (1) to (3), it is sufficient if at least one is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms, and two or more of A are hydroxyl groups. And one kind selected from an alkoxy group having 1 to 30 carbon atoms, and it is preferable that three of A be one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. preferable. Thus, it is presumed that molecular chains of the silane compound are bonded to each other to facilitate oligomerization. Therefore, flexible molecular chains of more appropriate shape can be formed.

  The plurality of A in the general formulas (1) to (3) may be identical to each other or different from each other. The plurality of A is preferably, for example, identical to each other. Thereby, the molecular chain of the silane compound is uniformly introduced into the crosslinked structure. Therefore, local concentration of internal stress can be suppressed.

  Specific examples of A other than the alkoxy group having 1 to 30 carbon atoms in the general formulas (1) to (3) include a methyl group, an ethyl group, an n-propyl group, an isopropyl group and an n-butyl group, Alkyl group such as isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group; alkenyl group such as allyl group, pentenyl group and vinyl group Alkynyl group such as ethynyl group; alkylidene group such as methylidene group, ethylidene group; aryl group such as tolyl group, xylyl group, phenyl group, naphthyl group, anthracenyl group; aralkyl group such as benzyl group and phenethyl group; adamantyl group Cycloalkyl groups such as cyclopentyl, cyclohexyl and cyclooctyl; tolyl , And the like alkaryl groups such as xylyl group.

  B in the general formulas (1) to (3) can be the same as A described above. In addition, several A may mutually be the same as A, and may mutually differ.

Specific examples of the silane compound represented by the above general formula (1) according to the present embodiment include N, N′-bis [3- (trimethoxysilyl) propyl] ethylenediamine, N, N′-bis- (3) -Triethoxysilylpropyl) ethylenediamine, N, N'-bis [3- (methyldimethoxysilyl) propyl] ethylenediamine, N, N'-bis [3- (methyldiethoxysilyl) propyl] ethylenediamine, N, N'- Bis [3- (dimethylmethoxysilyl) propyl] ethylenediamine, N- [3- (methyldimethoxysilyl) propyl] -N '-[3- (trimethoxysilyl) propyl] ethylenediamine, N, N'-bis [3- (Trimethoxysilyl) propyl] diaminopropane, N, N'-bis [3- (trimethoxysilyl) propyl] diaminomethane Sun, N, etc. N'- bis [3- (trimethoxysilyl) propyl] diethylenetriamine and the like.
Moreover, as a silane compound shown by the said General formula (1), the reaction product of 3-methacryloxypropyl trimethoxysilane and N-2- (aminoethyl) -3- aminopropyl trimethoxysilane can also be used. . Examples of commercial products of the reaction product include KBM-425 manufactured by Shin-Etsu Chemical Co., Ltd.

The lower limit value of the content of the silane compound in the photosensitive resin composition is, for example, preferably 0.01 parts by mass or more, and 1.0 parts by mass or more with respect to 100 parts by mass of an alkali-soluble resin described later. Some are more preferable, 2.0 parts by mass or more is further preferable, 2.5 parts by mass or more is further preferable, and 3.0 parts by mass or more is particularly preferable. Thus, the alkali-soluble resin can be appropriately crosslinked by the silane compound. Therefore, the adhesiveness of the photosensitive resin composition after pre-baking and Al pad can be improved, and also the chemical resistance of the photosensitive resin composition after post-baking can be improved.
In addition, the upper limit value of the content of the silane compound in the photosensitive resin composition is, for example, preferably 30 parts by mass or less, and more preferably 15 parts by mass or less with respect to 100 parts by mass of the alkali-soluble resin. Preferably, it is 10 parts by mass or less. Thereby, the mechanical strength of the resin film formed of the photosensitive resin composition is not impaired while causing the silane compound to behave flexibly. Therefore, the adhesion between the post-baked photosensitive resin composition and a metal such as Al can be improved.

(Alkali-soluble resin)
The alkali-soluble resin is not limited, and can be selected according to physical properties such as mechanical properties and optical properties required for the resin film. Specific examples of the alkali-soluble resin include phenol resin, hydroxystyrene resin, cyclic olefin resin, polyamide resin, polyimide resin, polybenzoxazole resin and the like. As the alkali-soluble resin, for example, it is preferable to use a polyamide resin or a polybenzoxazole resin, and it is more preferable to use a polyamide resin. Thereby, an alkali-soluble resin and a silane compound can form a crosslinked structure suitably.
The alkali-soluble resin can include one or more of the above specific examples.

  As the above-mentioned phenol resin, specifically, novolac type phenol resin such as phenol novolac resin, cresol novolac resin, bisphenol novolac resin, phenol-biphenyl novolac resin; novolac type phenol resin, resol type phenol resin, cresol novolac resin, etc. A reaction product of a phenol compound and an aldehyde compound; a reaction product of a phenol compound such as a phenol aralkyl resin and a dimethanol compound, and the like. In addition, as a phenol resin, 1 type (s) or 2 or more types can be included among the said specific examples.

The above-mentioned reaction product of a phenol compound and an aldehyde compound or the reaction product of a phenol compound and a dimethanol compound is not limited.
Specific examples of such phenolic compounds include cresols such as phenol, o-cresol, m-cresol, p-cresol and the like; 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2 , 6-xylenol, 3,4-xylenol, 3,5-xylenol and the like; x-lenols such as o-ethylphenol, m-ethylphenol and p-ethylphenol; isopropylphenol, butylphenol, p-tert- Alkylphenols such as butylphenol; Polyphenols such as resorcinol, catechol, hydroquinone, pyrogallol, phloroglucinol; and biphenyl type phenols such as 4,4'-biphenol. As a phenol compound, 1 type (s) or 2 or more types can be used among the said specific examples.

It will not be limited if it is a compound which has an aldehyde group as an aldehyde compound used for a reaction product of a phenol compound and an aldehyde compound mentioned above.
Specific examples of such aldehyde compounds include formaldehyde, paraformaldehyde, acetaldehyde, benzaldehyde and salicylaldehyde. As the aldehyde compound, one or more of the above specific examples can be used.

The dimethanol compound used for the reaction product of the phenol compound and the dimethanol compound described above is not limited.
As such a dimethanol compound, specifically, 1,4-benzenedimethanol, 1,3-benzenedimethanol, 4,4′-biphenyldimethanol, 3,4′-biphenyldimethanol, 3, Dimethanol compounds such as 3'-biphenyldimethanol, 2,6-naphthalenedimethanol, 2,6-bis (hydroxymethyl) -p-cresol; 1,4-bis (methoxymethyl) benzene, 1,3-bis (Methoxymethyl) benzene, 4,4'-bis (methoxymethyl) biphenyl, 3,4'-bis (methoxymethyl) biphenyl, 3,3'-bis (methoxymethyl) biphenyl, methyl 2,6-naphthalenedicarboxylate Etc., bis (alkoxymethyl) compounds, or 1,4-bis (chloromethyl) benzene, 1,3-bis (chloromethyl) Benzene, 1,4-bis (bromomethyl) benzene, 1,3-bis (bromomethyl) benzene, 4,4′-bis (chloromethyl) biphenyl, 3,4′-bis (chloromethyl) biphenyl, 3,3 ′ -Bis (halgenoalkyl) compounds such as bis (chloromethyl) biphenyl, 4,4'-bis (bromomethyl) biphenyl, 3,4'-bis (bromomethyl) biphenyl or 3,3'-bis (bromomethyl) biphenyl, Biphenylaralkyl compounds such as 4,4'-bis (methoxymethyl) biphenyl, 4,4'-bis (methoxymethyl) biphenyl and the like can be mentioned. As a dimethanol compound, 1 type (s) or 2 or more types can be used among the said specific examples.

  The above hydroxystyrene resin is not limited, and specifically, a polymerization reaction product obtained by polymerizing or copolymerizing one or two or more selected from the group consisting of hydroxystyrene, hydroxystyrene derivatives, styrene and styrene derivatives or Copolymerization products can be used.

The cyclic olefin resin is not particularly limited. For example, a polymerization reaction product or a copolymerization reaction product obtained by polymerizing or copolymerizing one or two or more selected from the group consisting of norbornene and norbornene derivative can be used. .
Here, as the norbornene derivative, specifically, norbornadiene, bicyclo [2.2.1] -hept-2-ene (conventional name: 2-norbornene), 5-methyl-2-norbornene, 5-ethyl- 2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-decyl-2-norbornene, 5-allyl-2-norbornene, 5- (2-propenyl) -2-norbornene, 5- (1-Methyl-4-pentenyl) -2-norbornene, 5-ethynyl-2-norbornene, 5-benzyl-2-norbornene, 5-phenethyl-2-norbornene, 2-acetyl-5-norbornene, 5-norbornene- Examples thereof include methyl 2-carboxylate, 5-norbornene-2,3-dicarboxylic acid anhydride and the like.
In addition, cyclic olefin resin may have structural units other than a cyclic olefin monomer (for example, the said norbornene derivative). For example, it may be a copolymer of a cyclic olefin monomer and maleic anhydride. By copolymerizing maleic anhydride with the cyclic olefin resin, alkali solubility can be significantly enhanced.

As the polyamide resin of the present embodiment, for example, an aromatic polyamide containing an aromatic ring in a structural unit of polyamide is preferably used, and one containing a structural unit represented by the following formula (PA1) is more preferable. As a result, the molecular chains of the polyamide resin form hydrogen bonds via an amide group to form a dense structure, and it is possible to suppress the molecules of the medicine from invading the photosensitive resin composition. Therefore, chemical resistance after post-baking can be improved.
In the present embodiment, the aromatic ring indicates a benzene ring; a fused aromatic ring such as a naphthalene ring, an anthracene ring, or a pyrene ring; or a heteroaromatic ring such as a pyridine ring or a pyrrole ring. The polyamide resin of the present embodiment preferably contains a benzene ring as an aromatic ring from the viewpoint of forming the above-described dense structure.

The polyamide resin containing the structural unit represented by the said Formula (PA1) is a precursor of polybenzoxazole resin. The polyamide resin containing the structural unit represented by the above formula (PA1) undergoes, for example, dehydration and ring closure by heat treatment under conditions of 150 ° C. or more and 380 ° C. or less for 30 minutes or more and 50 hours or less It can be a resin. Here, the structural unit of the above formula (PA1) becomes a structural unit represented by the following formula (PBO1) by dehydration ring closure.
In the case where the alkali-soluble resin according to the present embodiment is a polyamide resin including a structural unit represented by the above formula (PA1), for example, the photosensitive resin composition is subjected to the above heat treatment to perform dehydration ring closure, and a polybenzoxazole resin It may be That is, the photosensitive resin composition subjected to the heat treatment contains a polybenzoxazole resin which is an alkali-soluble resin.
In addition, when the alkali-soluble resin is a polyamide resin including a structural unit represented by the above formula (PA1), after the resin film described later and the electronic device are manufactured, the above heat treatment is performed to perform dehydration ring closure. It may be an oxazole resin. In the case of a polybenzoxazole resin, the tensile elongation at break can be increased. This is convenient from the viewpoint of improving the strength of the resin film and the electronic device.

Further, as the polyamide resin, for example, one containing a structural unit represented by the following general formula (PAM) may be used.
The polyamide resin containing the structural unit represented by the following general formula (PAM) is a precursor of a polyimide resin. A polyamide resin containing a structural unit represented by the following general formula (PAM) undergoes, for example, dehydration ring closure by heat treatment under conditions of 150 ° C. or more and 380 ° C. or less for 30 minutes or more and 50 hours or less It can be a resin. Here, the structural unit of the following formula (PAM) becomes a structural unit represented by the following formula (PI1) by dehydration ring closure.
In the case where the alkali-soluble resin is a polyamide resin containing a structural unit represented by the following formula (PAM), the photosensitive resin composition may be heat-treated to dehydrate and ring-close to form a polyimide resin. That is, the photosensitive resin composition subjected to the heat treatment may contain a polyimide resin which is an alkali soluble resin.
When the alkali-soluble resin is a polyamide resin containing a structural unit represented by the following formula (PAM), for example, after producing an electronic device to be described later, the ring is dehydrated and closed by heat treatment to form a polyimide resin. Good.

In general formula (PAM), R ^B and R ^C are each independently an organic group having 1 or more and 30 or less carbon atoms.

In the general formula (PI1), R ^B and R ^C are the same as the above general formula (PAM).

Specifically, as R ^B and R ^C in the general formula (PAM) and the general formula (PI1), an organic group having an aromatic ring is preferable.
Specifically as an organic group which has an aromatic ring, what contains a benzene ring, a naphthalene ring, or an anthracene ring is preferable, and what contains a benzene ring is more preferable.

The lower limit value of the content of the alkali-soluble resin in the photosensitive resin composition is preferably 30 parts by mass or more, for example, 40 parts by mass, when the total solid content of the photosensitive resin composition is 100 parts by mass. The above content is more preferable, 50 parts by mass or more is further preferable, 60 parts by mass or more is further preferable, and 70 parts by mass or more is particularly preferable. Thereby, the photosensitive resin composition can exhibit appropriate photosensitivity. Therefore, it can suppress that the residue of the photosensitive resin composition arises at the time of image development. Therefore, the adhesion improvement of the photosensitive resin composition and the Al pad after the physical baking and the suppression of the generation of the residue of the photosensitive resin composition at the time of development can be exhibited in a more balanced manner.
In addition, the upper limit value of the content of the alkali-soluble resin in the photosensitive resin composition is preferably 90 parts by mass or less, for example, when the total solid content of the photosensitive resin composition is 100 parts by mass, It is more preferable that it is a mass part or less, and it is still more preferable that it is 80 mass parts or less. Thereby, an alkali-soluble resin can form a crosslinked structure appropriately with a silane compound, and the chemical resistance of the photosensitive resin composition after post-baking can be improved.
In addition, in this embodiment, the total solid of the photosensitive resin composition shows the sum total of the component of the photosensitive resin composition except surfactant and a solvent.

(Method for producing polyamide resin)
The polyamide resin according to the present embodiment is, for example, polymerized as follows.
First, a polyamide is polymerized by polycondensing a diamine monomer and a dicarboxylic acid monomer in a polymerization step (S1). Next, the low molecular weight component is removed by the low molecular weight component removing step (S2) to obtain a polyamide resin containing polyamide as a main component.

(Polymerization step (S1))
In the polymerization step (S1), the diamine monomer and the dicarboxylic acid monomer are polycondensed. The method of polycondensation for polymerizing polyamide is not limited, and specific examples thereof include melt polycondensation, acid chloride method, direct polycondensation and the like.
In place of the dicarboxylic acid monomer, a compound selected from the group consisting of tetracarboxylic acid dianhydride, trimellitic acid anhydride, dicarboxylic acid dichloride or activated ester type dicarboxylic acid may be used. As a method of obtaining active ester type dicarboxylic acid, specifically, a method of reacting dicarboxylic acid with 1-hydroxy-1,2,3-benzotriazole or the like can be mentioned.

  The diamine monomer and the dicarboxylic acid monomer used for the polymerization of the polyamide resin will be described below. Each of the diamine monomer and the dicarboxylic acid monomer may be prepared singly or in combination of two or more.

The diamine monomer used for the polymerization is not limited, for example, it is preferable to use a diamine monomer containing an aromatic ring in the structure, and more preferably to use a diamine monomer containing a phenolic hydroxyl group in the structure. Here, as a diamine monomer containing a phenolic hydroxyl group in the structure, for example, a compound represented by the following general formula (DA1) is preferable. By producing a polyamide resin using such a diamine monomer as a raw material, the conformation of the polyamide resin can be controlled, and molecular chains of the polyamide resin can form a more dense structure. Therefore, it can suppress that the molecule | numerator of a chemical | medical agent penetrates into the photosensitive resin composition, and it can improve the chemical resistance after post-baking.
In addition, for example, when using the diamine monomer represented by following General formula (DA1), a polyamide resin contains the structural unit represented by following General formula (PA2). That is, the polyamide resin according to the present embodiment preferably contains, for example, a structural unit represented by the following general formula (PA2).

（上記一般式（ＤＡ１）において、Ｒ^４は、水素原子、炭素原子、酸素原子、窒素原子、硫黄原子、リン原子、ケイ素原子、塩素原子、フッ素原子、臭素原子からなる群より選択される１種または２種以上の原子によって形成される基である。Ｒ^５−Ｒ^１０は、それぞれ独立して、水素または炭素数１以上３０以下の有機基を表す。）

(In the above general formula (DA1), R ⁴ is selected from the group consisting of hydrogen atom, carbon atom, oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, silicon atom, chlorine atom, fluorine atom, bromine atom 1 And R ^{5 and} R ¹⁰ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms.

（上記一般式（ＰＡ２）において、Ｒ^４、Ｒ^５−Ｒ^１０は、上記一般式（ＤＡ１）と同様である。）

(In the above general formula (PA2), R ⁴ and R ⁵ -R ¹⁰ are the same as the above general formula (DA1).)

R ⁴ in the general formulas (DA1) and (PA2) is selected from the group consisting of hydrogen atom, carbon atom, oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, silicon atom, chlorine atom, fluorine atom and bromine atom A group formed by one or more atoms.
R ⁴ is a divalent group. Here, a bivalent group shows the thing of valence. That is, it indicates that there are two bonds where R 4 bonds to another atom.

When R ⁴ in the general formulas (DA1) and (PA2) contains a carbon atom, R ⁴ is, for example, a group having 1 to 30 carbon atoms, and preferably 1 to 10 carbon atoms, A group having 1 to 5 carbon atoms is more preferable, and a group having 1 to 3 carbon atoms is still more preferable.

Specifically, when R ⁴ in the general formulas (DA1) and (PA2) contains a carbon atom, an alkylene group, an arylene group, a halogen-substituted alkylene group, a halogen-substituted arylene group and the like can be mentioned as R ⁴ .
The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include methylene group, ethylene group, propylene group, butylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, nonylene group, decylene group, trimethylene group and tetramethylene group. And pentamethylene and hexamethylene groups. As the branched alkylene group, _{specifically, -C (CH 3) 2 -} , - CH (CH 3) -, - CH (CH 2 CH 3) -, - C (CH 3) (CH 2 An alkylmethylene group such as CH ₃ ) —, —C (CH ₃ ) (CH ₂ CH ₂ CH ₃ ) —, —C (CH ₂ CH ₃ ) ₂ —, and the like; —CH (CH ₃ ) CH ₂ —, —CH ( _{CH 3) CH (CH 3)} -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 -CH 2 - alkyl, such as ethylene Groups and the like.
Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthrylene group, and a group in which two or more arylene groups are bonded.
Specifically, as the halogen-substituted alkylene group and the halogen-substituted arylene group, those obtained by substituting the above-mentioned alkylene group and the hydrogen atom in the arylene group with a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom are used. Can. Among these, one using a hydrogen atom substituted by a fluorine atom is preferable.

When R ⁴ in the general formulas (DA 1) and (PA 2) does not contain a carbon atom, specifically, a group consisting of an oxygen atom or a sulfur atom can be mentioned as R ⁴

R ^{5 to} R ¹⁰ in the general formulas (DA1) and (PA2) are each independently hydrogen or an organic group having 1 to 30 carbon atoms, for example, hydrogen or an organic group having 1 to 10 carbon atoms It is preferably hydrogen or an organic group having 1 to 5 carbon atoms, more preferably hydrogen or an organic group having 1 to 3 carbon atoms, and hydrogen or 1 to 2 carbon atoms. It is more preferable that it is an organic group of This is advantageous in that the molecular chains of the polyamide resin form hydrogen bonds via an amide bond, and the molecules of the drug can be prevented from entering the photosensitive resin composition.

Specific examples of the organic group having 1 to 30 carbon atoms of R ^{5 to} R ¹⁰ in the general formulas (DA1) and (PA2) include a methyl group, an ethyl group, an n-propyl group, an isopropyl group and an n-butyl group Alkyl groups such as isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group and decyl group; alkenyl groups such as allyl group, pentenyl group and vinyl group Groups: Alkynyl groups such as ethynyl groups; Alkylidene groups such as methylidene groups, ethylidene groups; Aryl groups such as tolyl groups, xylyl groups, phenyl groups, naphthyl groups, anthracenyl groups; Aralkyl groups such as benzyl groups or phenethyl groups; And cycloalkyl groups such as cyclopentyl, cyclohexyl and cyclooctyl Tolyl group, and alkaryl groups, such as xylyl group.

Specific examples of the diamine monomer represented by the above general formula (DA1) include 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 4,4′-methylenebis (2-amino- 3,6 dimethylphenol), 4,4'-methylenebis (2-aminophenol), 1,1-bis (3-amino 4-hydroxyphenyl) ethane, 3,3'-diamino-4,4'-dihydroxydiphenyl ether Etc. By using these diamine monomers, the aromatic rings of the polyamide resin can be arranged densely. Therefore, it can suppress that the molecule | numerator of a chemical | medical agent penetrates into the photosensitive resin composition, and can improve chemical resistance. In addition, as a diamine monomer, it can use combining 1 type, or 2 or more types among the said specific examples.
The structural formulas of these diamine monomers are shown below.

It is not limited as a dicarboxylic acid monomer used for superposition | polymerization, For example, it is preferable to use the dicarboxylic acid monomer which contains an aromatic ring in a structure.
As a dicarboxylic acid monomer containing an aromatic ring, for example, it is preferable to use one represented by the following general formula (DC1).
In addition, for example, when using the dicarboxylic acid monomer represented by following General formula (DC1), a polyamide resin contains the structural unit represented by following General formula (PA3). That is, the polyamide resin according to the present embodiment preferably contains, for example, a structural unit represented by the following general formula (PA3).

（上記一般式（ＤＣ１）において、Ｒ^１１は、水素原子、炭素原子、酸素原子、窒素原子、硫黄原子、リン原子、ケイ素原子、塩素原子、フッ素原子、臭素原子からなる群より選択される１種または２種以上の原子によって形成される基である。Ｒ^１２−Ｒ^１９は、それぞれ独立して、水素または炭素数１以上３０以下の有機基を表す。）

(In the above general formula (DC1), R ¹¹ is selected from the group consisting of hydrogen atom, carbon atom, oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, silicon atom, chlorine atom, fluorine atom, bromine atom 1 And R ¹² -R ¹⁹ each independently represents hydrogen or an organic group having 1 to 30 carbon atoms.

（上記一般式（ＰＡ３）において、Ｒ^１１、Ｒ^１２−Ｒ^１９は、上記一般式（ＤＣ１）と同様である。）

(In the above general formula (PA3), R ¹¹ and R ¹² -R ¹⁹ are the same as the above general formula (DC1).)

R ¹¹ in the above general formula (DC1) is one or more selected from the group consisting of a hydrogen atom, a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a chlorine atom, a fluorine atom and a bromine atom It is a group formed by two or more types of atoms.
R ¹¹ is a divalent group. Here, a bivalent group shows the thing of valence. That is, it indicates that there are two bonds which R ¹¹ bonds to other atoms.

When R ¹¹ in the general formula (DC1) contains a carbon atom, R ¹¹ is, for example, a group having 1 to 30 carbon atoms, preferably 1 to 10 carbon atoms, and preferably 1 or more carbon atoms The group having 5 or less carbon atoms is more preferable, and the group having 1 to 3 carbon atoms is even more preferable.

When R ¹¹ in the above general formulas (DC1) and (PA3) contains a carbon atom, specifically, an alkylene group, an arylene group, a halogen-substituted alkylene group, a halogen-substituted arylene group and the like can be mentioned as R ¹¹ .
The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include methylene group, ethylene group, propylene group, butylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, nonylene group, decylene group, trimethylene group and tetramethylene group. And pentamethylene and hexamethylene groups. As the branched alkylene group, _{specifically, -C (CH 3) 2 -} , - CH (CH 3) -, - CH (CH 2 CH 3) -, - C (CH 3) (CH 2 An alkylmethylene group such as CH ₃ ) —, —C (CH ₃ ) (CH ₂ CH ₂ CH ₃ ) —, —C (CH ₂ CH ₃ ) ₂ —, and the like; —CH (CH ₃ ) CH ₂ —, —CH ( _{CH 3) CH (CH 3)} -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 -CH 2 - alkyl, such as ethylene Groups and the like.
Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthrylene group, and a group in which two or more arylene groups are bonded.
Specifically, as the halogen-substituted alkylene group and the halogen-substituted arylene group, those obtained by substituting the above-mentioned alkylene group and the hydrogen atom in the arylene group with a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom are used. Can. Among these, one using a hydrogen atom substituted by a fluorine atom is preferable.

When R ¹¹ in the general formulas (DC1) and (PA3) does not contain a carbon atom, specifically, examples of R ¹¹ include a group consisting of an oxygen atom or a sulfur atom.

R ^{12 to} R ¹⁹ in the general formulas (DC1) and (PA3) are each independently hydrogen or an organic group having 1 to 30 carbon atoms, and for example, hydrogen or an organic group having 1 to 10 carbon atoms It is preferably hydrogen or an organic group having 1 to 5 carbon atoms, more preferably hydrogen or an organic group having 1 to 3 carbon atoms, and still more preferably hydrogen.

Specific examples of the organic group having 1 to 30 carbon atoms of R ¹² -R ¹⁹ in the general formulas (DC1) and (PA3) include methyl group, ethyl group, n-propyl group, isopropyl group and n-butyl group Alkyl groups such as isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group and decyl group; alkenyl groups such as allyl group, pentenyl group and vinyl group Groups: Alkynyl groups such as ethynyl groups; Alkylidene groups such as methylidene groups, ethylidene groups; Aryl groups such as tolyl groups, xylyl groups, phenyl groups, naphthyl groups, anthracenyl groups; Aralkyl groups such as benzyl groups and phenethyl groups; Adamantyl groups And cycloalkyl such as cyclopentyl, cyclohexyl and cyclooctyl Tolyl group, and alkaryl groups, such as xylyl group.

  As the dicarboxylic acid monomer, specifically, diphenyl ether 4,4'-dicarboxylic acid, isophthalic acid, terephthalic acid, 4,4'-biphenyldicarboxylic acid and the like can be used. Among the above specific examples, as the dicarboxylic acid monomer, it is preferable to use diphenyl ether 4, 4'-dicarboxylic acid or isophthalic acid, and more preferable to use diphenyl ether 4, 4'-dicarboxylic acid.

In addition, it is preferable to modify the amino group present at the end of the polyamide resin simultaneously with the polymerization step (S1) or after the polymerization step (S1). The modification can be carried out, for example, by reacting a specific acid anhydride or a specific monocarboxylic acid with a diamine monomer or a polyamide resin. Therefore, in the polyamide resin according to the present embodiment, the terminal amino group is preferably modified with a specific acid anhydride or a specific monocarboxylic acid. In addition, the said specific acid anhydride and the said specific monocarboxylic acid have one or more types of functional groups which consist of a group which consists of an alkenyl group, an alkynyl group, and a hydroxyl group. Moreover, as said specific acid anhydride and a specific monocarboxylic acid, what contains a nitrogen atom, for example is preferable. Thereby, after prebaking, the adhesiveness of the photosensitive resin composition after postbaking and metals, such as Al, can be improved.
Specific examples of the above-mentioned specific acid anhydride include maleic anhydride, citraconic anhydride, 2,3-dimethylmaleic anhydride, 4-cyclohexene-1,2-dicarboxylic anhydride, exo-3 , 6-Epoxy-1,2,3,6-tetrahydrophthalic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, itaconic anhydride , Hetic anhydride, 4-ethynylphthalic anhydride, 4-phenylethynylphthalic anhydride, 4-hydroxyphthalic anhydride and the like. As a specific acid anhydride, it can be used combining 1 type, or 2 or more types among the said specific examples.
When the amino group present at the end of the polyamide resin is modified with a specific acid anhydride of ring shape, the specific acid anhydride of ring shape is ring-opened. Here, after modifying the polyamide resin, an imide ring may be formed by ring closure of a structural unit derived from a specific acid anhydride of ring shape. Examples of the method for ring closure include heat treatment.
Further, specific examples of the above-mentioned specific monocarboxylic acid include 5-norbornene-2-carboxylic acid, 4-hydroxybenzoic acid, 3-hydroxybenzoic acid and the like. As said specific monocarboxylic acid, it can be used combining 1 type, or 2 or more types among the said specific examples.

In addition, the carboxyl group present at the end of the polyamide resin may be modified simultaneously with the polymerization step (S1) or after the polymerization step (S1). The modification can be carried out, for example, by reacting a specific nitrogen atom-containing heteroaromatic compound with a dicarboxylic acid monomer or a polyamide resin. Therefore, in the polyamide resin according to the present embodiment, the terminal carboxyl group is preferably modified by a specific nitrogen atom-containing heteroaromatic compound. The above-mentioned specific nitrogen atom-containing heteroaromatic compounds include 1- (5- 1 H-triazolyl) methylamino group, 3- (1 H- pyrazolyl) amino group, 4- (1 H- pyrazolyl) amino group, 5- (1H-pyrazolyl) amino group, 1- (3-1H-pyrazolyl) methylamino group, 1- (4-1H-pyrazolyl) methylamino group, 1- (5- 1H-pyrazolyl) methylamino group, (1H- One or more functional groups consisting of tetrazol-5-yl) amino group, 1- (1H-tetrazol-5-yl) methyl-amino group and 3- (1H-tetrazol-5-yl) benz-amino group Having a group. Thereby, the number of lone electron pairs in the photosensitive resin composition can be increased. Therefore, after prebaking, the adhesiveness of the photosensitive resin composition after postbaking and metals, such as Al, can be improved.
Specifically as said specific nitrogen atom containing heteroaromatic compound, 5-amino tetrazole etc. are mentioned.

(Low molecular weight component removal process (S2))
After the polymerization step (S1), a low molecular weight component removing step (S2) is performed to remove the low molecular weight component, and a polyamide resin containing polyamide as a main component is obtained.
An organic layer containing a mixture of a low molecular weight component and a polyamide resin is concentrated by filtration or the like, and then redissolved in an organic solvent such as water / isopropanol. Thereby, a precipitate can be filtered off and the polyamide resin from which the low molecular weight component was removed can be obtained.

  As a polyamide resin, what is obtained by condensing the diamine monomer represented by the said General formula (DA1) and the dicarboxylic acid monomer represented by the said General formula (DC1), for example is preferable. That is, as a polyamide resin, what is provided with the structural unit of said general formula (PA2) and (PA3) is preferable, and what has the structural unit of said general formula (PA2) and (PA3) alternately is more preferable.

(Photosensitizer)
As the photosensitizer, a photoacid generator that generates an acid by absorbing light energy can be used.
Specific examples of the photoacid generator include diazoquinone compounds, diaryliodonium salts, 2-nitrobenzyl ester compounds, N-iminosulfonate compounds, imidosulfonate compounds, 2,6-bis (trichloromethyl) -1,3, 5-triazine compounds; dihydropyridine compounds and the like. Among these, it is preferable to use a diazoquinone compound. Thereby, the sensitivity of the photosensitive resin composition can be improved. Therefore, the accuracy of the pattern can be improved, and the appearance can be improved. In addition, as a photo-acid generator, 1 type (s) or 2 or more types can be included among the said specific examples.
When the photosensitive resin composition is a positive type, triarylsulfonium salts; onium salts such as sulfonium borate salts and the like may be used in combination with the above specific examples as photosensitizers. Thereby, the sensitivity of the photosensitive resin composition can be further improved.

  As said diazoquinone compound, 1 type, or 2 or more types of compounds can be used among what is shown below, for example.

（ｎは、１以上、５以下の整数である。）

(N is an integer of 1 or more and 5 or less)

In each of the above diazoquinone compounds, Q is a structure or hydrogen atom represented by the following formula (a), the following formula (b) and the following formula (c). However, at least one of Q of each diazoquinone compound is a structure represented by the following formula (a), the following formula (b) and the following formula (c).
The Q of the diazoquinone compound preferably contains the following formula (a) or the following formula (b). Thereby, the transparency of the photosensitive resin composition can be improved. Therefore, the appearance of the photosensitive resin composition can be improved.

The lower limit of the content of the photosensitizer in the photosensitive resin composition is, for example, preferably 1 part by mass or more, and more preferably 3 parts by mass or more, based on 100 parts by mass of the alkali-soluble resin. More preferably, it is 5 parts by mass or more. Thereby, the photosensitive resin composition can exhibit appropriate sensitivity.
The upper limit of the content of the photosensitizer in the photosensitive resin composition is, for example, preferably 30 parts by mass or less, and 20 parts by mass or less, based on 100 parts by mass of the alkali-soluble resin. More preferable. Thereby, the photosensitive resin composition is appropriately cured, and after pre-baking and post-baking, it is possible to develop adhesion to metals such as Al and Cu.

The photosensitive resin composition according to the present embodiment further includes additives such as adhesion assistant, silane coupling agent, solvent, thermal crosslinking agent, surfactant, antioxidant, dissolution accelerator, filler, sensitizer May be added.
The details of representative components are described below.

(Adhesive aid)
The photosensitive resin composition according to the present embodiment may contain, for example, a cohesion aid. Specifically, a triazole compound can be used as the adhesion assistant.
Specific examples of the triazole compound include 4-amino-1,2,4-triazole, 4H-1,2,4-triazole-3-amine, 4-amino-3,5-di-2-pyridyl- 4H-1,2,4-triazole, 3-amino-5-methyl-4H-1,2,4-triazole, 4-methyl-4H-1,2,4-triazol-3-amine, 3,4- Diamino-4H-1,2,4-triazole, 3,5-diamino-4H-1,2,4-triazole, 1,2,4-triazole-3,4,5-triamine, 3-pyridyl-4H- 1,2,4-triazole, 4H-1,2,4-triazole-3-carboxamide, 3,5-diamino-4-methyl-1,2,4-triazole, 3-pyridyl-4-methyl-1, 2,4-triazole, 4-methane It includes 1,2,4-triazole, such as Le-1,2,4-triazole-3-carboxamide. As a triazole compound, it can be used combining 1 type, or 2 or more types among the said specific examples.

  Moreover, it is also preferable to use the compound which has an imide structure as an adhesion | attachment adjuvant. The imide compounds which can be used are exemplified below.

(Silane coupling agent)
The photosensitive resin composition according to the present embodiment may contain, for example, a silane coupling agent. As a silane coupling agent, you may use together the silane coupling agent of the structure different from the silane compound mentioned above with the silane compound mentioned above.
Specifically, as a silane coupling agent having a structure different from that of the above-mentioned silane compound, a condensate of cyclohexene-1,2-dicarboxylic acid anhydride and 3-aminopropyltriethoxysilane, 3,3 ′, 4,4, Amidosilanes such as condensates of 4'-benzophenonetetracarboxylic acid dianhydride and 3-aminopropyltriethoxysilane; vinylsilanes such as vinyltrimethoxysilane, vinyltriethoxysilane; 2- (3,4-epoxycyclohexyl) ethyltriol Epoxysilanes such as methoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane; p- Styryl trimethoxysilane etc Styrylsilanes; methacryl silanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, etc .; Acrylic silanes such as methoxysilane; N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3 Aminosilanes such as -aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane; isocyanurate Lan; alkyl silane; ureido silane such as 3-ureidopropyltrialkoxysilane; mercaptosilane such as 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane; isocyanate silane such as 3-isocyanatopropyltriethoxysilane; titanium Aluminum compounds; aluminum chelates; aluminum / zirconium compounds and the like. As a silane coupling agent, 1 type (s) or 2 or more types can be mix | blended among the said specific examples.
When the photosensitive resin composition according to the present embodiment contains a silane coupling agent, the content is, for example, 0.1 parts by mass or more and 5 parts by mass or less, preferably 0.5 parts by mass with respect to 100 parts by mass of the alkali-soluble resin. More than 3 parts by weight.

(solvent)
The photosensitive resin composition according to the present embodiment can be used, for example, as a varnish in which raw material components other than the solvent are dissolved in the solvent.
The solvent is not limited, and specifically, N-methyl-2-pyrrolidone (NMP), 3-methoxy-N, N-dimethylpropanamide, N, N-dimethylformamide, N, N-dimethylpropionamide Amide solvents such as N, N-diethylacetamide, 3-butoxy-N, N-dimethylpropanamide, N, N-dibutylformamide; N, N-dimethylacetamide, tetramethylurea (TMU), 1,3- Dimethyl-2-imidazolidinone, tetrabutylurea, N, N'-dimethylpropyleneurea, 1,3-dimethoxy-1,3-dimethylurea, N, N'-diisopropyl-O-methylisourea, O, N, N '-Triisopropylisourea, O-tert-butyl-N, N'-diisopropylisourea, O-ethyl-N, N'-diiso Urea solvents such as ropirisourea, O-benzyl-N, N'-diisopropylisourea; propylene glycol monomethyl ether (PGME), propylene glycol monoethyl ether, ethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol Ether solvents such as ethylene glycol diethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, dipropylene glycol monomethyl ether, 1,3-butylene glycol 3-monomethyl ether; propylene glycol monomethyl ether acetate (PGMEA), methyl lactate, lactic acid Ethyl, butyl lactate, methyl 1,3-butylene glycol Acetate solvents such as toluene acetate; alcohol solvents such as tetrahydrofurfuryl alcohol, benzyl alcohol, 2-ethylhexanol, butanediol, isopropyl alcohol; ketone solvents such as cyclopentanone, cyclohexanone, diacetone alcohol, 2-heptanone; lactone solvents such as γ-butyrolactone (GBL) and γ-valerolactone; carbonate solvents such as ethylene carbonate and propylene carbonate; sulfone solvents such as dimethylsulfoxide (DMSO) and sulfolane; methyl pyruvate, ethyl pyruvate, Ester solvents such as methyl 3-methoxy propionate; aromatic hydrocarbon solvents such as mesitylene, toluene, xylene and the like. As a solvent, 1 type (s) or 2 or more types can be included among the said specific examples.
The solvent is used such that the solid content concentration of the photosensitive resin composition is, for example, 5 to 60% by mass, preferably 10 to 50% by mass.
Since the photosensitive resin composition according to the present embodiment has high chemical resistance, for example, even if a plurality of interlayer insulating films are produced using N-methyl-2-pyrrolidone as a solvent, no crack is generated. It is convenient from the viewpoint.

(Heat crosslinker)
The photosensitive resin composition according to the present embodiment may contain a thermal crosslinking agent that can react with the alkali-soluble resin by heat. Thereby, mechanical properties, such as tensile breaking elongation, can be improved about the hardened | cured material which post-baked the photosensitive resin composition.
Specific examples of the thermal crosslinking agent include 1,2-benzenedimethanol, 1,3-benzenedimethanol, 1,4-benzenedimethanol (p-xylene glycol), 1,3,5-benzenetrimethanol, Methylol groups such as 4,4-biphenyldimethanol, 2,6-pyridinedimethanol, 2,6-bis (hydroxymethyl) -p-cresol, 4,4'-methylenebis (2,6-dialkoxymethylphenol) Compounds having the formula; phenols such as phloroglucide; 1,4-bis (methoxymethyl) benzene, 1,3-bis (methoxymethyl) benzene, 4,4′-bis (methoxymethyl) biphenyl, 3,4′-bis (Methoxymethyl) biphenyl, 3,3′-bis (methoxymethyl) biphenyl, methyl 2,6-naphthalenedicarboxylate Compounds having an alkoxymethyl group such as 4,4′-methylenebis (2,6-dimethoxymethylphenol); methylolmelamine compounds represented by hexamethylolmelamine, hexabutanolmelamine etc .; alkoxymelamine compounds such as hexamethoxymelamine; Alkoxymethyl glycoluril compounds such as tetramethoxymethyl glycoluril; methylol benzoguanamine compounds, methylol urea compounds such as dimethylol ethylene urea; cyano compounds such as dicyanoaniline, dicyanophenol, cyanophenyl sulfonic acid; 1,4-phenylene diisocyanate An isocyanate compound such as 3,3'-dimethyldiphenylmethane-4,4'-diisocyanate; ethylene glycol diglycidyl ether, Epoxy group-containing compounds such as phenol A diglycidyl ether, triglycidyl isocyanurate, bisphenol A epoxy resin, bisphenol F epoxy resin, naphthalene epoxy resin, biphenyl epoxy resin, phenol novolac resin epoxy resin; N, N ' And maleimide compounds such as 1,3-phenylenedimaleimide and N, N′-methylenedimaleimide. As a thermal crosslinking agent, it can be used combining 1 type, or 2 or more types among the said specific examples.

The upper limit value of the content of the thermal crosslinking agent in the photosensitive resin composition is, for example, preferably 15 parts by mass or less, and 12 parts by mass, when the total solid content of the photosensitive resin composition is 100 parts by mass. The content is more preferably 10 parts by mass or less.
The lower limit of the content of the thermal crosslinking agent in the photosensitive resin composition is preferably, for example, 0.1 parts by mass or more, based on 100 parts by mass of the total solid content of the photosensitive resin composition. The amount is more preferably 1 part by mass or more, still more preferably 5 parts by mass or more, and still more preferably 7 parts by mass or more.

(Surfactant)
The photosensitive resin composition according to the present embodiment may further contain a surfactant.
The surfactant is not particularly limited. Specifically, polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, etc .; polyoxyethylene octyl phenyl ether, polyoxyethylene Nonionic surfactants such as polyoxyethylene aryl ethers such as nonyl phenyl ether; polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate, polyoxyethylene distearate; F top EF 301, F top EF 303, F top EF 352 (Made by Shin Akita Kasei), Megafuck F171, Megafuck F172, Megafuck F173, Megafuck F177, Megafuck F444, Megafuck F 70, Megafuck F471, Megafuck F475, Megafuck F482, Megafuck F477 (manufactured by DIC), Florard FC-430, Florard FC-431, Novec FC 4430, Nobec FC 442 (made by 3M Japan), Surfron S-381, SURFLON S-382, SURFLON S-383, SURFLON S-393, SURFLON SC-101, SURFLON SC-102, SURFLON SC-103, SURFLON SC-104, SURFLON SC-105, SURFLON SC-106, (AGC Seimi Chemical Co., Ltd.) Commercially available fluorochemical surfactants such as organosiloxane copolymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.); (meth) acrylic acid copolymer polyflow No. 4; 57, 95 (manufactured by Kyoeisha Chemical Co., Ltd.) and the like.
Among these, it is preferable to use a fluorine-based surfactant having a perfluoroalkyl group. As the fluorosurfactant having a perfluoroalkyl group, among the above specific examples, Megafuck F171, Megafuck F173, Megafuck F444, Megafuck F470, Megafuck F471, Megafuck F475, Megafuck F482, Megafuck F477 (manufactured by DIC), Surfron S-381, Surfron S-383, Surfron S-393 (manufactured by AGC Seimi Chemical Co., Ltd.), Nobec FC 4430 and Nobec FC 442 (manufactured by 3 M Japan Co., Ltd.) It is preferable to use

  Moreover, as surfactant, silicone type surfactant (for example, polyether modified | denatured dimethylsiloxane etc.) can also be used preferably. Specific examples of silicone surfactants include SH series, SD series and ST series of Toray Dow Corning, BYK series of BIC Chemie Japan, KP series of Shin-Etsu Chemical Co., Ltd. Registered trademark), TSF series of Toshiba Silicone Co., Ltd., and the like.

  When the photosensitive resin composition which concerns on this embodiment contains surfactant, the quantity is suitably adjusted in 1 ppm or more and 1000 ppm or less with respect to the whole composition, preferably 1 ppm or more and 100 ppm or less.

(Antioxidant)
The photosensitive resin composition according to the present embodiment may further contain an antioxidant. As an antioxidant, 1 or more types selected from phenol type antioxidant, phosphorus type antioxidant, and thioether type antioxidant can be used. The antioxidant can suppress the oxidation of the resin film formed by the photosensitive resin composition.
As a phenolic antioxidant, pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 3,9-bis {2- [3- (3) -T-Butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl} 2,4,8,10-tetraoxaspiro [5,5] undecane, octadecyl-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, 1,6-hexanediol-bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, 2,6-di-t-butyl-4-methylphenol, 2,6-di- -Butyl-4-ethylphenol, 2,6-diphenyl-4-octadecyloxyphenol, stearyl (3,5-di-t-butyl-4-hydroxyphenyl) propionate, distearyl (3,5-di-t) -Butyl-4-hydroxybenzyl) phosphonate, thiodiethylene glycol bis [(3,5-di-t-butyl-4-hydroxyphenyl) propionate], 4,4'-thiobis (6-t-butyl-m-cresol) , 2-octylthio-4,6-di (3,5-di-t-butyl-4-hydroxyphenoxy) -s-triazine, 2,2'-methylenebis (4-methyl-6-t-butyl-6-) Butylphenol), 2, -2′-methylenebis (4-ethyl-6-t-butylphenol), bis [3,3-bis (4-hydroxy-3-) -Butylphenyl) butyric acid] glycol ester, 4,4'-butylidenebis (6-t-butyl-m-cresol), 2,2'-ethylidene bis (4,6-di-t-butylphenol), 2, 2'-Ethylidene bis (4-s-butyl-6-t-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-t-butylphenyl) butane, bis [2-t- Butyl-4-methyl-6- (2-hydroxy-3-t-butyl-5-methylbenzyl) phenyl] terephthalate, 1,3,5-tris (2,6-dimethyl-3-hydroxy-4-t-) Butylbenzyl) isocyanurate, 1,3,5-tris (3,5-di-t-butyl-4-hydroxybenzyl) -2,4,6-trimethylbenzene, 1,3,5-tris [(3 5-di-tert-butyl-4-hydroxyphenyl) propionyloxyethyl] isocyanurate, tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane, 2-t -Butyl-4-methyl-6- (2-acryloyloxy-3-t-butyl-5-methylbenzyl) phenol, 3,9-bis (1,1-dimethyl-2-hydroxyethyl) -2,4- 8,10-Tetraoxaspiro [5,5] undecane-bis [β- (3-t-butyl-4-hydroxy-5-methylphenyl) propionate], triethylene glycol bis [β- (3-t- Butyl-4-hydroxy-5-methylphenyl) propionate], 1,1′-bis (4-hydroxyphenyl) cyclohexane, 2,2′-methylene (4-Methyl-6-t-butylphenol), 2,2'-methylenebis (4-ethyl-6-t-butylphenol), 2,2'-methylenebis (6- (1-methylcyclohexyl) -4-methyl Phenol), 4,4′-butylidenebis (3-methyl-6-t-butylphenol), 3,9-bis (2- (3-t-butyl-4-hydroxy-5-methylphenylpropionyloxy) 1,1 -Dimethylethyl) -2,4,8,10-tetraoxaspiro (5,5) undecane, 4,4'-thiobis (3-methyl-6-t-butylphenol), 4,4'-bis (3,3, 5-di-t-butyl-4-hydroxybenzyl) sulfide, 4,4'-thiobis (6-t-butyl-2-methylphenol), 2,5-di-t-butylhydroquinone, 2,5-di t-amyl hydroquinone, 2-t-butyl-6- (3-t-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl acrylate, 2,4-dimethyl-6- (1-methylcyclohexyl, And styrene phenol, 2,4-bis ((octylthio) methyl) -5-methylphenol, and the like.
As phosphorus-based antioxidants, bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite, tris (2,4-di-t-butylphenyl phosphite), tetrakis (2) , 4-Di-tert-butyl-5-methylphenyl) -4,4'-biphenylenediphosphonite, 3,5-di-tert-butyl-4-hydroxybenzylphosphonate-diethyl ester, bis- (2,6 -Dicumylphenyl) pentaerythritol diphosphite, 2,2-methylenebis (4,6-di-t-butylphenyl) octyl phosphite, tris (mixed mono and di-nonylphenyl phosphite), bis (2,2, 4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methoxycal) Bonylethyl-phenyl) pentaerythritol diphosphite, bis (2,6-di-t-butyl-4-octadecyloxycarbonylethylphenyl) pentaerythritol diphosphite and the like.
Examples of thioether antioxidants include dilauryl-3,3′-thiodipropionate and bis (2-methyl-4- (3-n-dodecyl) thiopropionyloxy) -5-t-butylphenyl) sulfide And distearyl-3,3'-thiodipropionate, pentaerythritol-tetrakis (3-lauryl) thiopropionate and the like.

(Filler)
The photosensitive resin composition according to the present embodiment may contain, for example, a filler. As the filler, an appropriate filler can be selected according to the mechanical properties and thermal properties required of the resin film made of the photosensitive resin composition.
Specific examples of the filler include inorganic fillers and organic fillers.
Specific examples of the inorganic filler include fused and crushed silica, fused spherical silica, crystalline silica, secondary aggregated silica, and silica such as fine powder silica; alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, silicon carbide And metal compounds such as aluminum hydroxide, magnesium hydroxide and titanium white; talc; clay; mica; glass fibers and the like. As an inorganic filler, it can be used combining 1 type, or 2 or more types among the said specific examples.
Specific examples of the organic filler include organosilicone powder and polyethylene powder. As an organic filler, it can be used combining 1 type, or 2 or more types among the said specific examples.

(Preparation of photosensitive resin composition)
The method for preparing the photosensitive resin composition in the present embodiment is not limited, and known methods can be used depending on the components contained in the photosensitive resin composition.
For example, the above components can be prepared by mixing and dissolving in a solvent. Thereby, the photosensitive resin composition made into the varnish can be obtained.

(Use)
The photosensitive resin composition of the present embodiment is used to form a resin film for an electronic device such as a permanent film or a resist. Among these, from the viewpoint of achieving well-balanced development of adhesion of the photosensitive resin composition and Al pad after pre-baking and generation of residues of the photosensitive resin composition during development, photosensitive resin after post-baking From the viewpoint of improving the adhesion between the cured film of the composition and the metal, as well as from the viewpoint of improving the chemical resistance of the photosensitive resin composition after post-baking, it is preferable to be used for applications using a permanent film .
In the present embodiment, the resin film is a dried film or a cured film of the photosensitive resin composition. That is, the resin film according to the present embodiment is formed by drying or curing the photosensitive resin composition.

The permanent film is composed of a resin film obtained by prebaking, exposing and developing the photosensitive resin composition, patterning it into a desired shape, and curing it by post-baking. The permanent film can be used as a protective film of an electronic device, an interlayer film, a dam material or the like.
In addition, when producing the said permanent film, it can be set as heat processing for 3 minutes or more and 1 hour or less, for example as temperature of 90 degreeC or more and 130 degrees C or less as conditions of prebaking. Further, as the post-baking conditions, for example, heat treatment can be performed at a temperature of 150 ° C. or more and 350 ° C. or less for 45 minutes or more and 2 hours or less.

  The above-mentioned resist is applied to an object to be masked by the resist, for example, by a method such as spin coating, roll coating, flow coating, dip coating, spray coating or doctor coating, and the photosensitive resin composition is applied. The resin film is obtained by removing the solvent from

An example of the electronic device according to the present embodiment is shown in FIG.
The electronic device 100 according to the present embodiment can be an electronic device provided with the resin film. Specifically, in the electronic device 100, one or more of the group consisting of the passivation film 32, the insulating layer 42, and the insulating layer 44 can be used as a resin film. Here, the resin film is preferably the permanent film described above.

  Electronic device 100 is, for example, a semiconductor chip. In this case, a semiconductor package can be obtained, for example, by mounting the electronic device 100 on the wiring substrate via the bumps 52. The electronic device 100 includes a semiconductor substrate provided with a semiconductor element such as a transistor, and a multilayer wiring layer (not shown) provided on the semiconductor substrate. An interlayer insulating film 30 and an uppermost layer wiring 34 provided on the interlayer insulating film 30 are provided on the uppermost layer of the multilayer wiring layers. The uppermost layer wiring 34 is made of, for example, aluminum (Al). Further, a passivation film 32 is provided on the interlayer insulating film 30 and the uppermost layer wiring 34. An opening for exposing the uppermost layer wiring 34 is provided in a part of the passivation film 32.

  A rewiring layer 40 is provided on the passivation film 32. The rewiring layer 40 includes an insulating layer 42 provided on the passivation film 32, a rewiring 46 provided on the insulating layer 42, and an insulating layer 44 provided on the insulating layer 42 and on the rewiring 46; Have. In the insulating layer 42, an opening connected to the uppermost layer wiring 34 is formed. The rewiring 46 is formed in the opening provided on the insulating layer 42 and in the insulating layer 42, and is connected to the uppermost layer wiring 34. The insulating layer 44 is provided with an opening connected to the rewiring 46.

  In the opening provided in the insulating layer 44, a bump 52 is formed, for example, via a UBM (Under Bump Metallurgy) layer 50. Electronic device 100 is connected to a wiring board or the like through bumps 52, for example.

Note that the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like as long as the object of the present invention can be achieved are included in the present invention.
Hereinafter, an example of a reference form is added.
1.
A silane compound represented by the above general formula (1),
Alkali-soluble resin,
Photosensitive resin composition containing a photosensitive agent.
(In General Formula (1), R ¹ represents an organic group having 1 to 30 carbon atoms, provided that R ¹ includes one containing an aromatic ring.
Each of R ² and R ³ independently represents an organic group having 1 to 30 carbon atoms.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )
2.
1. The photosensitive resin composition according to
Wherein R ¹ in the general formula (1) is an alkylene group having 1 to 30 carbon atoms, a photosensitive resin composition.
3.
1. Or 2. The photosensitive resin composition according to
The photosensitive resin composition, wherein the alkali-soluble resin is one or more selected from the group consisting of phenol resin, hydroxystyrene resin, cyclic olefin resin, polyamide resin, polyimide resin and polybenzoxazole resin.
4.
3. The photosensitive resin composition according to
The alkali soluble resin comprises the polyamide resin,
The said polyamide resin is a photosensitive resin composition containing the structural unit shown by the above-mentioned Formula (PA1).
5.
1. To 4. The photosensitive resin composition according to any one of
The photosensitive resin composition whose content of the said silane compound is 0.01 mass part or more and 30 mass parts or less with respect to 100 mass parts of said alkali-soluble resin.
6.
1. To 5. The photosensitive resin composition according to any one of
The photosensitive resin composition whose said photosensitive agent is a diazoquinone compound.
7.
1. To 6. The photosensitive resin composition according to any one of
The photosensitive resin composition used in order to form the permanent film used as an interlayer film, a surface protective film, or a dam material.
8.
1. To 7. The resin film which hardens the photosensitive resin composition as described in any one of these.
9.
8. The electronic device provided with the resin film as described in-.

  Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to the description of these examples.

  First, the raw materials used in Examples and Comparative Examples will be described in detail.

<Silane compound>
First, the details of the silane compound used in the examples will be described.

(Silane compound 1)
As the silane compound 1, N, N'-bis [3- (trimethoxysilyl) propyl] ethylenediamine (X-12-5263HP manufactured by Shin-Etsu Chemical Co., Ltd.) represented by the following formula (S1) was prepared.

<Silane coupling agent>
The details of the silane coupling agent having a structure different from that of the silane compound described in this embodiment will be described.

(Silane coupling agent 1)
The silane coupling agent 1 which is a condensation product of cyclohexene-1,2-dicarboxylic acid anhydride and 3-aminopropyltriethoxysilane was synthesized by the following method. The details of the synthesis method will be described.
In an appropriately sized reaction vessel equipped with a stirrer and a condenser, cyclohexene-1,2-dicarboxylic acid anhydride (45.6 g, 300 mmol) is dissolved in N-methyl-2-pyrrolidone (970 g) Adjusted to 30.degree. Then, 3-aminopropyltriethoxysilane (62 g, 280 mmol) was charged into the dropping funnel and added dropwise to the solution over 60 minutes. After completion of the dropwise addition, stirring was performed under conditions of 30 ° C. for 18 hours to obtain a silane coupling agent 1 represented by the following formula (S2).

(Silane coupling agent 2)
The silane coupling agent 2 which is a condensation product of 3,3 ', 4,4'-benzophenonetetracarboxylic acid dianhydride and 3-aminopropyltriethoxysilane was synthesized by the following method. The details of the synthesis method will be described.
In a suitably sized reaction vessel equipped with a stirrer and condenser, 3,3 ', 4,4'-benzophenonetetracarboxylic acid dianhydride (32.2 g, 100 mmol) in N-methyl-2-pyrrolidone (669 g) ) And adjusted to 30 ° C. in a thermostat. Next, 3-aminopropyltriethoxysilane (42.1 g, 190 mmol) was charged into the dropping funnel and added dropwise to the solution over 60 minutes. After completion of the dropwise addition, stirring was performed at 30 ° C. for 18 hours to obtain a compound represented by the following formula (S3) as a silane coupling agent 2.

<Alkali-soluble resin>
Next, details of the alkali-soluble resin used in each example and comparative example will be described.

(Alkali-soluble resin 1)
The following procedure was used to prepare an alkali-soluble resin 1 which is a polyamide resin.
In a four-neck glass separable flask equipped with a thermometer, a stirrer, a raw material inlet and a dry nitrogen gas inlet, 206.58 g of diphenyl ether-4,4'-dicarboxylic acid represented by the following formula (DC2) A mixture of dicarboxylic acid derivatives obtained by reacting (0.800 mol) with 216.19 g (1.600 mol) of 1-hydroxy-1,2,3-benzotriazole monohydrate (170.20 g (0 .346 mol), 4.01 g (0.047 mol) of 5-aminotetrazole, and 45.22 g (0.196 mol) of 4,4'-methylenebis (2-aminophenol) represented by the following formula (DA2): 56.24 g (0.196 mol) of 4,4′-methylenebis (2-amino-3,6 dimethylphenol) represented by the following formula (DA3): It was. Thereafter, 578.3 g of N-methyl-2-pyrrolidone was added to the separable flask to dissolve each raw material component. Next, it was made to react at 90 ° C. for 5 hours using an oil bath. Next, 24.34 g (0.141 mol) of 4-ethynylphthalic anhydride and 121.7 g of N-methyl-2-pyrrolidone are added to the separable flask and reacted with stirring at 90 ° C. for 2 hours. After the reaction, the reaction was terminated by cooling to 23.degree.
The filtrate obtained by filtering the reaction mixture in the separable flask was poured into a solution of water / isopropanol = 7/4 (volume ratio). Thereafter, the precipitate was separated by filtration, thoroughly washed with water, and dried under vacuum to obtain the target alkali-soluble resin 1. The weight average molecular weight Mw of the obtained alkali soluble resin 1 was 18081.

<Photosensitizer>
Next, the photosensitizers used in the respective examples and comparative examples will be described in detail.

(Photosensitizer 1)
Photosensitizer 1 which is a diazoquinone compound was synthesized by the following procedure.
11.04 g (0.026 mol) of phenol represented by the following formula (P-1) in a four-neck separable flask equipped with a thermometer, a stirrer, a raw material inlet, and a dry nitrogen gas inlet pipe; 18.81 g (0.070 mol) of 2-naphthoquinone-2-diazide-5-sulfonyl chloride and 170 g of acetone were added and stirred for dissolution.
Then, while cooling the flask with a water bath so that the temperature of the reaction solution does not exceed 35 ° C., a mixed solution of 7.78 g (0.077 mol) of triethylamine and 5.5 g of acetone was slowly dropped. The reaction was allowed to proceed for 3 hours at room temperature, 1.05 g (0.017 mol) of acetic acid was added, and the reaction was allowed to proceed for another 30 minutes. The reaction mixture was then filtered, and the filtrate was poured into a mixed solution of water / acetic acid (990 mL / 10 mL). The precipitate was then collected by filtration, washed thoroughly with water and then dried under vacuum. Thereby, the photosensitive agent 1 represented by the structure of following formula (Q-1) was obtained.

<Thermal crosslinker>
The following thermal crosslinking agent 1 was used as a thermal crosslinking agent.
Thermal cross-linking agent 1: para-xylene glycol (Ihara Nikkei, PXG)

<Surfactant>
The following surfactant 1 was used as a surfactant.
Surfactant 1: Fluorinated surfactant (FC4430 manufactured by 3M Japan Co., Ltd.)

<Solvent>
The following mixed solvent 1 was used as a solvent.
· Mixed solvent 1: N-methylpyrrolidone (NMP) / γ-butyrolactone (GBL) = 6/4 (mass ratio)

(Preparation of photosensitive resin composition of each example and comparative example)
The photosensitive resin compositions of the respective examples and comparative examples were prepared as follows.
First, the mixed solvent 1 described above and each raw material component other than the solvent were prepared. Next, each raw material is added to the mixed solvent 1 according to the mixing ratio shown in Table 1 below, stirred, and then filtered through a PTFE membrane filter with a pore diameter of 0.2 μm, to thereby obtain photosensitivity of each example The varnish of the resin composition was obtained.
In addition, the compounding ratio of each raw material shown to following Table 1 describes a silane compound, a silane coupling agent, alkali-soluble resin, a photosensitive agent, and a thermal crosslinking agent by a mass part. The mixed solvent 1 used 108 parts by mass of N-methylpyrrolidone (NMP) and 72 parts by mass of γ-butyrolactone (GBL) with respect to 100 parts by mass of the alkali-soluble resin. Furthermore, surfactant is the density | concentration (ppm) with respect to the whole varnish of the photosensitive resin composition containing a solvent.

  The following evaluation was performed with respect to the photosensitive resin composition of each Example and Comparative Example.

(Adhesiveness after pre-baking)
The adhesiveness of the photosensitive resin composition after prebaking and Al pad was evaluated as follows using the photosensitive resin composition of each Example and a comparative example.
First, an Al substrate was prepared as a base material. Subsequently, the varnish of the photosensitive resin composition was coated on the Al substrate using a spin coater. Next, after prebaking at a temperature of 105 ° C. for 4 minutes using a hot plate, a 10.9 μm prebaked photosensitive resin composition was obtained. Then, pattern masking is performed on the prebaked photosensitive resin composition, and broadband exposure is performed using a broadband mask aligner (MA8, manufactured by SUSS MicroTec), and then 2.38% tetramethyl at a temperature of 23 ° C. as a developer. Using an ammonium hydroxide aqueous solution, paddle development was performed twice by adjusting the development time so that the difference between the film thickness after prebaking and the film thickness after development was 3.0 μm, and the pattern masking was removed. In addition, the mask (The mask made by letterpress printing company, test chart No. 1) in which the residual pattern of 0.88 micrometers-50 micrometers in width and the cutting pattern are drawn was used for pattern masking. Then, here, it was visually observed whether the photosensitive resin composition patterned could have formed the desired pattern, and the following evaluation criteria evaluated.
((Good): The desired patterning was performed as the pattern masking.
X (defect): A part of the patterned photosensitive resin composition was peeled from the Al substrate, and desired patterning was not performed.
Moreover, also about the temperature of 110 degreeC and 115 degreeC, the temperature of prebaking was evaluated also about each photosensitive resin composition of each Example and a comparative example. The evaluation results are shown in Table 1 below.

(Generation of residue during development)
Using the photosensitive resin compositions of the examples and comparative examples, generation of residues of the photosensitive resin composition during development was evaluated for the photosensitive resin composition after prebaking as follows.
First, a Cu substrate was prepared as a base material. Subsequently, the varnish of the photosensitive resin composition was coated on the Cu substrate using a spin coater. Next, after prebaking at a temperature of 105 ° C. for 4 minutes using a hot plate, a 10.9 μm prebaked photosensitive resin composition was obtained. Then, pattern masking is performed on the prebaked photosensitive resin composition, and broadband exposure is performed using a broadband mask aligner (MA8, manufactured by SUSS MicroTec), and then 2.38% tetramethyl at a temperature of 23 ° C. as a developer. Using an ammonium hydroxide aqueous solution, paddle development was performed twice by adjusting the development time so that the difference between the film thickness after prebaking and the film thickness after development was 3.0 μm, and the pattern masking was removed. In addition, the mask for WLP by Mitani Micronics Mask company was used for pattern masking. Subsequently, it was visually observed whether the residue of the developed photosensitive resin composition has generate | occur | produced on Cu board | substrate shape, and the following evaluation criteria evaluated.
○ (Good): No residue of the photosensitive resin composition was generated on the exposed and developed portions on the Cu substrate.
X (defect): The residue of the photosensitive resin composition has generate | occur | produced in the location on the exposure and development on Cu base material, and desired patterning was not completed.
Moreover, also about the temperature of 110 degreeC and 115 degreeC, the temperature of prebaking was evaluated also about each photosensitive resin composition of each Example and a comparative example. The evaluation results are shown in Table 1 below.

(Adhesion after post-baking)
Using the photosensitive resin compositions of the examples and comparative examples, the adhesion of the photosensitive resin composition after post-baking and aluminum (Al) was evaluated by two methods as follows.
First, the first method will be described. The first method uses a cutter as a method of singulating Al and the photosensitive resin composition. First, a silicon wafer was prepared as a substrate. Next, titanium (Ti) is coated on the substrate to a thickness of 0.03 μm (300 Å), Al is sputtered on Ti to a thickness of 0.3 μm (3000 Å), and then Al The varnish of the photosensitive resin composition was coated on the above using a spin coater. Next, after prebaking at a temperature of 120 ° C. for 4 minutes using a hot plate, it was further post baked at a temperature of 220 ° C. for 1 hour in a nitrogen atmosphere using an oven to obtain a 7 μm thick cured film. Here, the cured film is in close contact with Al. That is, the laminated structure which a base material, Ti, Al, and a cured film laminate in this order was obtained. The adhesion was evaluated based on JIS D 0202 using this laminated structure. Specifically, the cured film and Al were scratched and singulated so that 100 squares of 1 mm square could be formed from the side where the cured film exists in the laminated structure. Then, cellophane adhesive tape was attached to the cured film. One minute after adhesion, the cellophane adhesive tape was peeled off from the cured film. After peeling, among the 100 squares, the number of squares in which the cured film and Al remained without peeling and the number of squares peeled were counted, and this was taken as the evaluation result in the absence of the PCT process. The evaluation results are shown in Table 1 below. Table 1 shows the number of peeled squares.
In the above, after the cellophane adhesive tape was attached to the cured film, the cellophane adhesive tape was peeled from the cured film after being left for 24 hours at a temperature of 125 ° C., a humidity of 100% and an atmospheric pressure of 2.3 atm. After peeling, the number of squares in which the cured film and Al remained without peeling and the number of peeled squares were counted among 100 squares, and this was taken as the evaluation result in the presence of the PCT process. The evaluation results are shown in Table 1 below. Table 1 shows the number of peeled squares.
Furthermore, the second method will be described. The second method uses a pattern as a method of singulating the photosensitive resin composition. First, a silicon wafer was prepared as a substrate. After coating titanium (Ti) on the substrate to a thickness of 0.05 μm (500 Å), sputter Al onto Ti to a thickness of 0.3 μm (3000 Å), then over Al The varnish of the photosensitive resin composition was applied using a spin coater. Next, after prebaking at a temperature of 120 ° C. for 4 minutes using a hot plate, the photosensitive resin composition is pattern-masked, broadband exposure is performed using a broadband mask aligner (MAUS manufactured by SUSS MicroTec), and then the temperature is Paddle development was performed at 23 ° C. using a 2.38% aqueous solution of tetramethylammonium hydroxide as a developer. Then, the pattern masking was removed, and further post-baked in a nitrogen atmosphere at a temperature of 220 ° C. for 1 hour using an oven to obtain a singulated cured film having a thickness of 7 μm. Here, the cured film is in close contact with Al. That is, a substrate, Al, and a cured film were laminated in this order to obtain a laminate structure in which the laminate portion of the cured film was divided into 100 pieces into 1 mm square squares. Next, on this laminate, based on JIS D 0202, the above-mentioned method of singulating Al was evaluated in the same manner as in the case of the cutter, and the adhesion was evaluated.
In addition, the thing using a cutter as a method of separating into pieces can evaluate a higher degree of adhesiveness compared with the thing using a pattern. The evaluation results are shown in Table 1 below for each of the cases without the PCT process and with the PCT process.
The evaluation results of the adhesion show that the smaller the value, that is, the smaller the number of squares peeled, the higher the adhesion between the cured film and the Al.
The PCT process is intended for an accelerated test, and was performed to evaluate the long-term adhesion between the post-baked photosensitive resin composition and Al.

(Chemical resistance after post bake)
The chemical resistance of the photosensitive resin composition after post-baking was evaluated as follows using the photosensitive resin composition of each Example and a comparative example.
First, a silicon wafer was prepared as a substrate. Subsequently, the varnish of the photosensitive resin composition was coated using the spin coater on the base material. Subsequently, the photosensitive resin composition was prebaked at a temperature of 120 ° C. for 4 minutes, and further post-baked at 220 ° C. for 60 minutes to obtain a cured film of the photosensitive resin composition. Here, the thickness of the cured film was 7 μm. Subsequently, the photosensitive resin composition was coated on the said cured film. Next, it was prebaked at a temperature of 120 ° C. for 4 minutes to form a dried film on the cured film. Here, the cured film of the photosensitive resin composition was observed in the dark field using an optical microscope (MX50 manufactured by OLYMPUS Co., Ltd.) for cracks, and evaluated according to the following evaluation criteria. The evaluation results are shown in Table 1 below.
◎ (very good): No cracks were observed in the cured film.
○ (Good): Cracks were observed in the cured film, but the number of cracks was extremely small, and since the cracks were extremely short, there was no problem in practical use.
X (defect): Cracks were observed in the cured film.

  As shown in Table 1 above, compared with the photosensitive resin composition of Comparative Example 1, the photosensitive resin composition of the example is improved in adhesion of the photosensitive resin composition and Al pad after prebaking, and at the time of development. It was confirmed that the suppression of the generation of the residue of the photosensitive resin composition was exhibited in a well-balanced manner. Furthermore, compared with the photosensitive resin composition of Comparative Example 1, the photosensitive resin composition of the example improves the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as Al. In addition, it was confirmed that the chemical resistance of the photosensitive resin composition after post-baking can be improved.

  This application claims priority based on Japanese Patent Application No. 2017-129668 filed on Jun. 30, 2017, the entire disclosure of which is incorporated herein.

Claims (9)

A silane compound represented by the following general formula (1):
Alkali-soluble resin,
A photosensitive resin composition comprising: a photosensitive agent ;
The photosensitive resin composition, wherein the alkali-soluble resin is one or more selected from the group consisting of phenol resin, hydroxystyrene resin, cyclic olefin resin, polyamide resin, polyimide resin and polybenzoxazole resin .

(In the above general formula (1), R ¹ represents an alkylene group having 1 to 30 carbon atoms .
Each of R ² and R ³ independently represents an organic group having 1 to 30 carbon atoms.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. ) A silane compound represented by the following general formula (1):
Alkali-soluble resin,
A photosensitive resin composition comprising: a photosensitive agent;
The photosensitive resin composition whose said photosensitive agent is a diazoquinone compound .

(In the above general formula (1), R ¹ represents an alkylene group having 1 to 30 carbon atoms.
Each of R ² and R ³ independently represents an organic group having 1 to 30 carbon atoms.
A each independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be identical to each other or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.
Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be identical to each other or may be different from each other. At least one of B is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. ) The photosensitive resin composition according to claim 2 , wherein
The photosensitive resin composition, wherein the alkali-soluble resin is one or more selected from the group consisting of phenol resin, hydroxystyrene resin, cyclic olefin resin, polyamide resin, polyimide resin and polybenzoxazole resin. It is the photosensitive resin composition of Claim 1 or 3, Comprising:
The alkali soluble resin comprises the polyamide resin,
The said polyamide resin is a photosensitive resin composition containing the structural unit shown by following formula (PA1).

It is the photosensitive resin composition of any one of Claim 1 to 4, Comprising:
The photosensitive resin composition whose content of the said silane compound is 0.01 to 30 mass parts with respect to 100 mass parts of said alkali-soluble resin. The photosensitive resin composition according to claim 1 , wherein
The photosensitive resin composition whose said photosensitive agent is a diazoquinone compound. The photosensitive resin composition according to any one of claims 1 to 6, wherein
The photosensitive resin composition used in order to form the permanent film used as an interlayer film, a surface protective film, or a dam material.   A resin film obtained by curing the photosensitive resin composition according to any one of claims 1 to 7.   An electronic device comprising the resin film according to claim 8.

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