JP6489114B2 - Enclosure for electronic devices - Google Patents

Description

  The present invention relates to an electronic device casing.

  Metal, wood, resin, or the like is used as a material for the electronic device casing. In particular, wood is generally used for speakers from the viewpoint of acoustic characteristics. Furthermore, in the case of a speaker incorporating an amplifier, a resin operation panel is often provided in a wood case. The reason why resin is used is not only that it is a material that is easy to make to provide switches, terminals, etc. on the operation panel, but it may also be intended to improve design using a material different from the housing is there.

  The operation panel is fixed by being fitted into a fitting portion formed in the housing. In the case of using wood, it is necessary to provide a gap (clearance) on the surface of the housing between the housing and the operation panel in order to absorb the difference in the rate of dimensional change (hygroscopic expansion coefficient) due to drying and moisture absorption. Further, since the thermal expansion coefficient is different between the wood of the casing and the resin of the operation panel, it is necessary to provide a gap in order to absorb the dimensional difference due to the thermal expansion coefficient. Since this gap is visible from the outside, the design is often impaired. For this reason, attempts have been made to make the gap inconspicuous.

  FIG. 9A is a cross section when the gap 9 is not hidden. The cross section of the connection part vicinity of the housing | casing 1 formed with a timber and the components 3 (equivalent to an operation panel) formed with resin is shown. A sheet 2 is attached to the surface 8 of the housing 1 in order to improve design and to protect the surface of the wood. From the outside, the surface 8 of the housing 1 is not directly visible, and the sheet 2 can be seen. An insertion portion 15 for inserting the component 3 is formed in the housing 1. The fitting portion 15 is constituted by the side wall 5 and the placement portion 6 on which the component 3 is placed. Between the end surface 7 of the component 3 and the side wall 5 of the housing 1, a gap 9 for absorbing a difference in hygroscopic expansion coefficient or a difference in thermal expansion coefficient is provided.

  However, in this structure, the side wall 5 and a part of the mounting portion 6 are directly visible from the outside of the electronic device (upper side in FIG. 1). In many cases, the side wall 5 and the mounting portion 6 are not decorated, and have a problem that the appearance is poor and the design is impaired. In order to solve this problem, there is a method of sticking the sheet 2 to the side wall 5 and the mounting portion 6, but a technique such as vacuum bonding is required to neatly stick the sheet to the insertion portion 15 having a complicated shape. It was necessary, and special equipment was necessary. Further, even when the side wall 5 and the mounting portion 6 are used as decorative surfaces, the appearance of the side wall 5 and the mounting portion 6 through the gap 9 itself may impair the design. 9A, when the sheet 2 is pasted from the surface 8 to the part 3 across the gap 9, the gap 9 can be hidden, but the sheet 2 is wrinkled due to a difference in hygroscopic expansion coefficient or a difference in thermal expansion coefficient. There was a thing. In some cases, the sheet 2 may be cut.

  As a technique for forming a gap 9 that absorbs a difference in hygroscopic expansion coefficient and a difference in thermal expansion coefficient between the casing 1 and the part 3 and concealing the gap 9 from being visible from the outside, as shown in FIG. There is a method of providing the flange portion 70 on the component 3. By providing the flange portion 70, even if the gap 9 widens due to a dimensional difference due to a difference in hygroscopic expansion coefficient or thermal expansion coefficient between the housing 1 and the part 3, the flange portion 70 covers the side wall 5. The part 6 is not visible from the outside.

  Further, Patent Document 1 discloses a fixing means (26 between a mounting portion (mounting surface 24) and a component (panel 18) of a casing (the casing 4 of Patent Document 1, the same applies hereinafter in this paragraph). , 28), a technique for sandwiching a sheet (decorative sheet 30) is disclosed.

JP, 2014-230228, A

  However, in the background art described in FIG. 9B, since the flange portion 70 is thick, the component 3 protrudes from the surface 8 of the housing 1, which may impair the design. The technique described in Patent Document 1 has a complicated structure, requires a dedicated sheet and fixing means for concealing the gap, and has a drawback that the manufacturing process is complicated.

  The electronic device housing of the present invention is attached to the housing having a fitting portion on the surface, a part of the material different from the housing to be fitted into the fitting portion, and the fitting surface. An electronic device housing having an elastic sheet, wherein the insertion portion includes a side wall and a placement portion on which the component is placed, and the sheet extends from the surface toward the insertion portion. The extended portion has an extended portion, and the extended portion is bent toward the placement portion, and is disposed in a gap formed by the component placed on the placement portion and the side wall. It is characterized by.

  In the electronic device casing, the different material has a hygroscopic expansion coefficient different from that of the casing.

  In the electronic device casing, the different material has a thermal expansion coefficient different from that of the casing.

  In the electronic device casing, the side wall is an inclined surface along the bent extended portion.

  In the electronic device casing, an end surface of the component facing the side wall is an inclined surface along the bent extended portion.

  In the electronic device casing, the inclined surface of the side wall is stepped.

  In the electronic device casing, the inclined surface of the end surface is stepped.

  In the electronic device casing, the sheet has an adhesive surface on one side, and is adhered to the surface by the adhesive surface, and the adhesive surface of the extending portion is subjected to a process of weakening the adhesive force. It is characterized by that.

  In the electronic device casing, the extending portion does not have an adhesive force.

  The method for manufacturing a casing for an electronic device according to the present invention includes a casing having a fitting portion on a surface thereof, a part of the material different from the casing that is inserted into the fitting portion, and a paste on the surface having the fitting portion. An electronic device casing manufacturing method comprising: an elastic sheet to be worn, wherein the fitting portion includes a side wall and a placement portion on which the component is placed, and the sheet is the surface. The extension part extending in the direction of the insertion part, the step of inserting the part into the insertion part, and placing the part on the placement part, whereby the extension part is described above. A step of bending toward the placement portion and disposing in a gap formed by the component placed on the placement portion and the side wall.

  According to the present invention, there is provided a housing for an electronic device in which it is difficult to see a gap (clearance) provided to absorb a dimensional difference due to a hygroscopic expansion coefficient difference or a thermal expansion coefficient difference between the housing and a part fitted in the housing. It can be realized with simple structure, low cost and simple manufacturing process.

It is a figure which shows the cross section of the housing | casing for electronic devices which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the housing | casing for electronic devices which concerns on embodiment of this invention. It is a figure which shows the cross section of the housing | casing for electronic devices which concerns on embodiment of this invention. It is a figure which shows the cross section of the housing | casing for electronic devices which concerns on embodiment of this invention. It is a figure which shows the cross section of the housing | casing for electronic devices which concerns on embodiment of this invention. It is a figure which shows the cross section of the housing | casing for electronic devices which concerns on embodiment of this invention. It is a figure which shows the cross section of the housing | casing for electronic devices which concerns on embodiment of this invention. It is sectional drawing of the speaker with a built-in amplifier which concerns on embodiment of this invention. It is a figure which shows the cross section which concerns on the conventional housing | casing for electronic devices.

  In the present invention, the housing and the parts to be inserted into the housing are a combination of materials having different hygroscopic expansion coefficients or materials having different thermal expansion coefficients, and the hygroscopic expansion between the housing and the parts on the surface of the housing. The present invention can be applied to a case for an electronic device having a gap (clearance) for absorbing a difference in dimensional change due to a coefficient difference or a thermal expansion coefficient difference. The following description will be given by taking an amplifier built-in type speaker as an example. However, the present invention is not limited to this. Further, as an example, wood and resin (ABS resin) will be described as an example. However, the present invention is not limited to this combination, and the thermal expansion coefficient is different even in a combination of wood and other materials, or in a material that does not change in dimensions due to dry moisture absorption. It is possible to implement the invention when combining materials. In addition, since the dimensional change due to dry moisture absorption of wood is large, a combination of wood and other materials is preferable according to the present invention.

  FIG. 1 is a cross-sectional view of an electronic device casing according to a first embodiment of the present invention. FIG. 1 shows only a part of the housing 1, the component 3, the sheet 2, and the insertion portion 15 that inserts and fixes the component 3 into the housing 1 (the same applies hereinafter). A recess 15 formed in the surface 8 of the housing 1 or a fitting portion 15 which is a through hole is constituted by a side wall 5 and a placement portion 6. Since the fitting portion 15 is often formed by cutting the material of the housing 1, in this case, the side wall 5 and the placement portion 6 are not decorated decorative end surfaces (counterbore end surfaces).

  The part 3 to be inserted is an operation panel or the like, and is formed of, for example, ABS resin. The hygroscopic expansion coefficient of the wood constituting the housing 1 varies depending on the type of wood and the direction of the fibers, but is about 0.3%, for example. On the other hand, the ABS resin does not change greatly due to humidity. The thermal expansion coefficient of wood varies depending on the type and fiber direction, but is 3 to 60 × 10 −6 / ° C., for example. The thermal expansion coefficient of the ABS resin is, for example, 95 to 130 × 10 −6 / ° C. In this case, the dimensional change due to the humidity of the housing 1 is larger than that of the component 3, but the present invention is not limited to this, and the component 3 may be wood and the housing 1 may be resin. Further, although the thermal expansion coefficient of the component 3 is larger than that of the housing 1, the present invention is not limited to this. In order to absorb this dry moisture absorption dimensional difference and thermal expansion coefficient difference, it is necessary to provide a gap 9 (clearance) between the side wall 5 of the housing 1 and the end face 7 of the component 3.

  In FIG. 1A, the surface 8 of the housing 1 is covered with a sheet 2 of wood constituting the housing 1. The sheet 2 has a function of protecting and decorating the surface of wood, and the material is, for example, PVC (polyvinyl chloride), but is not limited thereto. The thickness is, for example, about 0.15 to 0.2 mm, and has elasticity. The sheet 3 has an adhesive surface on the back surface, and is attached to the front surface 8 of the housing 1.

  The sheet 2 extends from the surface 8 of the housing 1 toward the fitting portion 15. The extended portion 4 is bent from the edge constituted by the surface 8 and the side wall 5 to the placement portion 6 side. The extended portion 4 that is bent is disposed in the gap 9 between the side wall 5 and the end surface 7 of the component 3. The size of the gap 9 is determined from the thermal expansion coefficient, hygroscopic expansion coefficient, manufacturing tolerance, designability, etc. of the material used, and is about 1.2 mm in the case of a combination of wood and ABS resin. The extended portion 4 of the bent sheet 2 hides the side wall 5 and the placement portion 6 that are not covered with the sheet 2, so that it is difficult to see from the outside (upper side in FIG. 1), and the design is improved.

  When the expansion amount of the component 3 made of ABS resin becomes larger than the expansion amount of the case 1 made of wood due to shrinkage due to drying of the wood of the case 1 from the state of FIG. As shown in FIG. 1B, the gap 9 formed by the side wall 5 and the end 7 becomes narrow. When the gap 9 is narrowed, the elastic sheet 2 is bent more greatly.

  On the contrary, when the shrinkage amount of the component 3 made of ABS resin becomes larger than the shrinkage amount of the housing 1 made of wood due to the expansion of the wood of the housing 1 due to moisture absorption or the lowering of the ambient temperature, the shrinkage of the housing 1 made of wood is as shown in FIG. Similarly, the gap 9 formed by the side wall 5 and the end portion 7 is widened. Since the extending portion 4 disposed in the gap 9 has elasticity, the degree of bending is reduced so as to follow the contraction of the component 3, and the extension portion 4 is deformed so as to close the gap 9. Due to these movements, the side wall 5 and the mounting portion 6 are difficult to see from the outside even if the gap 9 has a dry moisture absorption of wood or a change in ambient temperature.

  In FIGS. 1A to 1C, the extended portion 4 of the sheet 2 is always in contact with the end surface 7 of the component 3, but it is not necessarily in contact. If it is in contact, it is more preferable because the insertion portion 15 is not visible from the outside, but it is more preferable if the extended portion 4 that is bent even if not in contact is disposed in the gap 9 obliquely with respect to the surface 8. Since the portion 15 is difficult to see from the outside and can be bent following the change in humidity or temperature, the object of the present invention can be achieved. Similarly, in the case of FIG. 1B, the extending portion 4 does not need to be in contact with the placement portion 6.

  As an example of the dimensions of each part in FIG. 1, for example, when the thickness of the component 3 is 3 mm using the above materials, the width of the gap 9 (direction parallel to the surface 8) is 1.2 mm, and the thickness of the sheet 2. Is 0.2 mm, and the length of the extended portion 4 is 3.2 mm. These numerical values are appropriately determined from the hygroscopic expansion coefficient, the thermal expansion coefficient of the material used, the thickness required for the component 3, and the like.

  FIG. 2 is a view showing a manufacturing method according to the first embodiment of the electronic device casing of the present invention. The steps are performed in the order of (a) to (e). FIG. 2A is a cross-sectional view of the housing 1 having the side wall 5 and the mounting portion 6 that constitute the fitting portion 15. The side wall 5 and the placement portion 6 are formed by cutting the wood that is the material of the casing 1 and are not decorated with a mouth end surface (counterbore end surface).

  FIG. 2B is a diagram in which a sheet 2 for protection and decoration is attached to the surface 8 of the housing 1. The back surface of the sheet 2 is an adhesive surface and is attached to the front surface 8 of the housing 1. At this time, the sheet 2 also covers the insertion portion 15. Since the insertion portion 15 is a depression or a through-hole formed in the surface of the housing 1 normally, the sheet 2 can be flatly attached so as to cover the insertion portion 15.

  Since the extended portion 4 is a part of the sheet 2, the back surface of the extended portion 4 also has an adhesive surface. If the adhesive force of the adhesive surface is left, the adhesive surface may stick to the side wall 5 or the mounting portion 6. Therefore, in the stage of FIG. 2B, a process for reducing the adhesive strength of the extended portion is performed. For example, the adhesive strength can be reduced by performing natural drying for about 48 hours. This drying step can also be used as the drying step for the portion where the sheet 2 is adhered to the surface 8 of the housing 1. In addition, the process of reducing an adhesive force may just reduce the adhesive force of the extension part 4, and may be performed until adhesive force is substantially lost.

  In FIG.2 (c), the unnecessary part of the sheet | seat 2 is excised. Thereby, the extended portion 4 is formed. In addition, you may perform the above-mentioned drying process after FIG.2 (c).

  In FIG. 2D, the component 3 is inserted into the insertion portion 15. At this time, the extending portion 4 of the sheet 2 is bent by the component 3. In addition, before performing this insertion process, you may put a hook so that the extension part 4 of the sheet | seat 2 may be bent to the insertion part 15 side with a hand or a jig | tool. In this way, the steps of FIGS. 2D to 2E can be performed more smoothly.

  In FIG. 2 (e), the component 3 is placed on the placement portion 6 of the insertion portion 15. As a result, the extended portion 4 of the sheet 2 is further bent and disposed in the gap 9 between the side wall 5 and the end portion 7. Under the present circumstances, since the adhesive force of the back surface of the extension part 4 has fallen by the drying process, it will not stick to the side wall 5 or the mounting part 6. FIG. The component 3 may be fixed to the mounting portion 6 by a boss structure as shown in FIG. 8 described later, or may be fixed by screwing or an adhesive.

  In the above-described embodiment, the unnecessary part of the sheet 2 has been cut away. However, a sheet having a shape in which the unnecessary part is cut in advance may be attached to the housing. Moreover, you may use the sheet | seat without the adhesive force of the extension part 4 previously. Moreover, since the insertion part 15 is a hollow or a through-hole, when it sees from the surface 8 side, although there exists a corner, since the sheet | seat 2 has elasticity, the extension part 4 can be bent in the same process. Note that the present invention can be carried out more smoothly if the corner has an arc having an appropriate radius of curvature.

  As described above, according to the present invention, without using an apparatus such as vacuum bonding, the gap in the case of combining materials with different hygroscopic expansion coefficients or materials with different thermal expansion coefficients at a low cost with a simple process. A structure that makes the (clearance) inconspicuous can be realized.

  Next, a second embodiment of the electronic device casing of the present invention will be described with reference to FIG. The difference from the first embodiment is that the side wall 5 of the housing 1 is inclined to form an inclined surface 10. Since the side wall 5 of the first embodiment is substantially orthogonal to the surface 8 of the housing 1, when the gap 9 becomes narrow due to changes in humidity or temperature, depending on the dimensional design and the elasticity of the sheet 2, the extended portion of the sheet 2 There was a risk that 4 was bent too much and could not be restored. In the second embodiment, since the side wall 5 is the inclined surface 10, it is possible to prevent the extended portion 4 of the sheet 2 from being bent too much and returning to its original state. Thereby, even if the humidity change and the temperature change are repeated, even if the size of the gap 9 expands and contracts, it is possible to maintain a state in which the insertion portion 15 (comprising the inclined surface 10 and the placement portion 6) is difficult to see from the outside. . Further, it is possible to prevent the extended portion 4 from being bent excessively during the assembly operation.

  This inclined surface 10 should just incline so that the extended part 4 of the sheet | seat 2 bent in general may be followed. As is apparent from FIG. 3, the inclination along the extended portion 4 is not limited to being parallel to the extended portion 4, and means that the inclined surface 10 is not inclined at an angle overhanging. To do.

  Next, a third embodiment of the electronic device casing of the present invention will be described with reference to FIG. The difference from the second embodiment is that the inclined surface 10 of the housing 1 has a stepped inclined surface 20 that is inclined stepwise. The movement of the extending portion 4 due to humidity change or temperature change is the same as in the second embodiment.

  In the present embodiment, the inclined surface of the fitting portion 15 (comprising the stepped inclined surface 20 and the mounting portion 6) is not linear but stepped. For this reason, the cutting process of the insertion part 15 becomes easy, and this invention can be implemented at lower cost. Further, as shown in FIG. 5 (a), the extended portion 4 is bent in two steps by the step-like inclined surface 20, so that the gap 9 can be formed narrower than a simple inclined surface. Thereby, the structure where the insertion part 15 is hard to see from the exterior is realizable. Furthermore, as shown in FIG. 5B, the side wall 5 may be a curved inclined surface 30 that is curved.

  As an example of the dimension of the stepped inclined surface 20, for example, when the thickness of the component 3 is 3 mm, the step on the side close to the surface 8 is 1 mm, and the step on the side close to the mounting surface 6 is 2 mm. The width of the step on the side close to the surface 8 is 0.5 mm. In the above-described embodiment, the stepped inclined surface 20 has been described as a two-step staircase shape. However, the present invention is not limited to this, and the same effect can be obtained even in three or more steps.

  Next, with reference to FIGS. 6A and 6B, a fourth embodiment of the electronic device casing of the present invention will be described. The point from which the end surface 7 of the components 3 becomes the taper-shaped end surface 40 which is a taper-shape differs from the above-mentioned embodiment. The angle of the tapered end surface 40 may be an angle substantially along the inclined surface 10 or the stepped inclined surface 20. However, this is not limited to the angle of the tapered end surface 40 being parallel to the inclined surface 10.

  Thereby, it becomes possible to narrow the width | variety of the gap | interval 9 visible from the outside, and can make the insertion part 15 hard to see more. Moreover, if it is set as the taper-shaped end surface 40, the extension part 4 visible from the outside will become only a part close | similar to the surface. For this reason, there is an effect that the depth of the gap 9 appears to be shallow. By adopting this structure, it is possible to realize a casing for an electronic device that is less conspicuous and has excellent design.

  FIG. 6C is a diagram in which the tip of the tapered end surface 40 is combined with the end of the step (upper step 45) on the side close to the surface 8 of the stepped inclined surface 20. When the gap 9 is the largest in the dimensional change of the material, when the tip of the tapered end surface 40 coincides with the end of the upper stage 45 or overlaps with the upper stage 45, the extended portion 4 visible from the outside is It is always a part on the surface 8 side from the upper stage 45. As described above, the distal end portion of the extending portion 4 bends so as to follow the component 3 in accordance with the dimensional change of the material. However, even when it is not sufficiently bent, the placement portion 6 can be seen from the outside. Can be prevented.

  Further, as shown in FIG. 7, the same effect can be obtained by using a stepped end face 41 in which the tapered end face of the component 3 is stepped. The number of steps of the stepped end face 41 is not limited to two, but may be three or more.

  Side wall 5, inclined surface 10, stepped inclined surface 20, curved inclined surface 30, end surface 7 of component 3, and casing 1 described in the first to fourth embodiments of the present invention described above. It goes without saying that the effects of the present invention can be obtained even if the tapered end surface 40 and the stepped end surface 41 are appropriately combined.

  Next, with reference to FIG. 8, an example in which the present invention is implemented in a speaker 60 with a built-in amplifier will be described. The amplifier built-in speaker 60 includes a housing 1, a sheet 2 that covers the housing 1, a speaker unit 65, a component 3 that is an operation panel, and an amplifier unit 62 that is connected to the component 3. The casing 1 is made of wood, and a PVC sheet 2 is attached to protect and decorate the surface 8. The housing 1 is provided with an opening 64, and the speaker unit 65 and the component 3 are fixed to each other. The component 3 is an ABS resin. It should be noted that the parts used for a normal speaker with built-in amplifier, such as buttons on the operation panel, a power cable, a wire connecting the amplifier unit 62 and the speaker unit 65, and a sound absorbing material disposed inside the housing 1, are omitted. Yes.

  The component 3 is fixed by fitting a boss 61 formed in the component 3 into a fitting hole 63 formed in the housing 1. This fixing may be performed by screwing or bonding. The end surface of the component 3 is a tapered end surface 40, and the fitting portion of the housing 1 is a stepped inclined surface 20. The sheet 2 adhered to the surface 8 of the housing 1 has an extending portion 4, is bent, and is disposed between the step-like inclined portion 20 of the housing 1 and the tapered end surface 40 of the component 3. Yes. Thereby, even if there is a dimensional difference due to a hygroscopic expansion coefficient difference or a thermal expansion coefficient difference between the housing 1 and the component 3, the gap can be made inconspicuous.

  In FIG. 8, the component 3 is provided on the top plate portion of the housing 1, but the present invention is not limited to this, and the component 3 may be disposed on the front plate, the back plate, the side plate, and the bottom plate. Since the present invention aims to make the gap between the housing 1 and the component 3 less noticeable, it is more effective when used on a front plate or a top plate that is easily noticeable by the user.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification. A housing is also included in the technical scope of the present invention.

  The present invention provides a housing for an electronic device in which a gap (clearance) provided to absorb a dimensional difference due to a hygroscopic expansion coefficient difference or a thermal expansion coefficient difference between the housing and a part fitted in the housing needs to be difficult to see. It can be suitably employed for the body.

  DESCRIPTION OF SYMBOLS 1 ... Housing | casing 2 ... Sheet | seat 3 ... Parts, 4 ... Extension part, 5 ... Side wall, 6 ... Mounting part, 7 ... End surface, 8 ... Surface, 9 ... Gap, 10 ... Inclined surface, 15 ... Insertion part , 20 ... stepped inclined surface, 30 ... curved shape inclined surface, 40 ... tapered end face, 41 ... stepped end face, 45 ... upper stage, 60 ... built-in amplifier speaker, 61 ... boss, 62 ... amplifier part, 63 ... fitting Joint hole, 64 ... opening, 65 ... speaker unit, 70 ... flange

Claims (10)

A housing having a fitting portion on the surface;
A part of a material different from that of the housing, which is inserted into the insertion part;
An elastic sheet adhered to the surface having the insertion portion;
A housing for an electronic device having
The insertion portion has a side wall and a placement portion for placing the component,
The sheet has an extending portion that extends from the surface in the insertion portion direction,
The extension part is bent toward the placement part, and is disposed in a gap formed by the part placed on the placement part and the side wall.   The electronic device casing according to claim 1, wherein the different material has a hygroscopic expansion coefficient different from that of the casing.   The electronic device casing according to claim 1, wherein the different material has a thermal expansion coefficient different from that of the casing.   4. The electronic device casing according to claim 1, wherein the side wall is an inclined surface along the bent extended portion. 5.   5. The electronic device casing according to claim 1, wherein an end surface of the component facing the side wall is an inclined surface along the bent extended portion. 6.   5. The electronic device casing according to claim 4, wherein the inclined surface of the side wall is stepped.   6. The electronic device casing according to claim 5, wherein the inclined surface of the end surface is stepped.   2. The sheet according to claim 1, wherein the sheet has an adhesive surface on one side, and is adhered to the surface by the adhesive surface, and the adhesive surface of the extending portion is subjected to a process of weakening adhesive force. 8. A housing for an electronic device according to claim 7.   The electronic device casing according to claim 1, wherein the extending portion does not have adhesive force. A housing having a fitting portion on the surface;
A part of a material different from that of the housing, which is inserted into the insertion part;
An elastic sheet adhered to the surface having the insertion portion;
A method for manufacturing a casing for an electronic device, comprising:
The insertion portion has a side wall and a placement portion for placing the component,
The sheet has an extending portion that extends from the surface in the insertion portion direction,
Inserting the component into the insertion portion;
By placing the component on the mounting portion, the extending portion is bent toward the mounting portion, and disposed in a gap formed by the component and the side wall placed on the mounting portion. And steps to
The manufacturing method of the housing | casing for electronic devices characterized by having.