JP6478733B2 - Cooling unit - Google Patents

Description

  The present invention relates to a cooling unit provided with a refrigerant circuit including a compressor, an evaporator and the like, in particular, an apparatus having an improved ability to process condensed water generated in the evaporator.

  A conventional seed cooling unit includes a compressor, a condenser (or a radiator), a throttling means such as an expansion valve, and a refrigerant circuit in which an evaporator is pipe-connected in a ring, and the refrigerant generated in the evaporator It is configured to exert a cooling capacity by the endothermic action of At this time, since the moisture in the heat-exchanged air condenses and adheres to the evaporator, an evaporation pan (drain pan) is provided in the machine room, and the condensed water (drain water) produced by the evaporator is It is led to an evaporation dish by a hose), and it is made to evaporate and process in this evaporation dish (for example, refer to patent documents 1).

  In this case, conventionally, a refrigerant pipe in which a high temperature refrigerant in the refrigerant circuit flows is disposed on the bottom of the evaporation dish, or inserted into the evaporation dish to heat the condensation water to evaporate the condensed water. According to Patent Document 1, in order to improve the ability to process condensed water in the evaporating dish, a water absorbing evaporation member is provided in the evaporating dish, and the condensed water is circulated to the drain pipe by the drain circulation pump, Heat is exchanged with the high temperature refrigerant in the refrigerant circuit to raise the temperature.

JP 2001-27473 A

  However, when heating the evaporating dish and the condensed water inside the evaporating dish with the refrigerant pipe through which the high-temperature refrigerant flows as described above, the refrigerant pipe leading to the evaporating dish becomes long and complicated. It becomes difficult to store a refrigerant pipe for heating the evaporating dish in the machine room.

  On the other hand, even if the evaporation member is disposed in the evaporation dish as in Patent Document 1 and the temperature of the condensation water is raised by the drain circulation pump, the condensed water immediately after flowing into the evaporation dish is low. In an environment where the amount of water is large, the processing capacity is insufficient, and condensed water overflows from the evaporation pan and contaminates the surroundings. For this reason, conventionally, a hose for discharging the condensed water which can not be treated with the evaporation dish to the outside has been attached. However, when attaching a cooling unit to the opening and closing panel from the outside, for example, Since the cooling unit is also moved when carrying out, there is a problem that the arrangement of the hose for discharging the condensed water to the outside becomes extremely troublesome.

  The present invention has been made to solve such conventional technical problems, and it is a non-drain type cooling unit which can be treated without discharging the condensed water generated in the evaporator to the outside. Intended to be provided.

  The cooling unit according to the present invention comprises a refrigerant circuit in which a compressor, a radiator, throttling means, and an evaporator are sequentially annularly connected by piping, and the evaporation temperature of the refrigerant in the evaporator is higher than the freezing point, Heat exchange between the discharge pipe and the discharge pipe from the compressor to the radiator, and an evaporation dish for receiving condensed water generated by the cooling vessel and a drainage pipe for guiding the condensed water from the evaporator to the evaporation dish It features.

  The cooling unit according to the invention of claim 2 is characterized in that, in the above-mentioned invention, the cooling unit is provided in the evaporation pan and has an evaporation member having a water absorbing action by capillary action.

  The cooling unit of the invention of claim 3 is characterized in that, in the invention described above, the drainage pipe causes condensed water to flow out from above the evaporation member.

  The cooling unit according to the invention of claim 4 is characterized in that, in each of the above-mentioned inventions, the drainage pipe is formed of a metal pipe, and the drainage pipe and the discharge pipe are closely attached by soldering.

  The cooling unit of the invention according to claim 5 comprises, in each of the above-mentioned inventions, a compressor, a radiator, and a machine room in which an evaporation dish is installed, the evaporation dish is disposed on one side of the machine room, and the drainage pipe is And a straight pipe portion extending from the other side to the one side of the machine room, and the straight pipe portion and the discharge pipe are disposed in a heat exchange relationship.

  In the cooling unit according to the invention of claim 6, in each of the inventions described above, the flow of condensed water flowing in the drainage pipe is opposed to the flow of refrigerant flowing in the discharge piping at a location where the discharge piping exchanges heat with the drainage pipe. It is characterized by having a style.

  The cooling unit of the invention according to claim 7 comprises the radiator fan and the radiator fan for air cooling by ventilating outside air to air-cool the radiator according to the above respective inventions, and the evaporator and the compressor against the flow of air by the radiator fan. It is characterized in that it is disposed downstream of the

  The cooling unit according to the invention of claim 8 is, in each of the above inventions, attached from the outside to the open / close panel of the device having the open / close panel, and the air in the device is circulated and ventilated to the evaporator By cooling the inside of the device.

  The cooling unit according to the invention of claim 9 is characterized in that carbon dioxide is used as the refrigerant of the refrigerant circuit in the above respective inventions.

  According to the present invention, the compressor, the radiator, the throttling means, and the refrigerant circuit in which the evaporator is sequentially and annularly pipe-connected, and the evaporation temperature of the refrigerant in the evaporator is higher than the freezing point in the cooling unit It is equipped with an evaporation pan for receiving the generated condensed water, and a drainage pipe that leads the condensed water from the evaporator to the evaporation pan, so that heat exchange is performed between the discharge piping from the compressor to the radiator and the drainage pipe. Therefore, the high temperature refrigerant discharged from the compressor can heat the condensed water flowing in the drainage pipe toward the evaporating dish and raise the temperature of the condensed water flowing out from the drainage pipe to the evaporating dish .

  That is, since the temperature of the condensed water is raised in the process of flowing through the drainage pipe before flowing into the evaporation dish, the amount of evaporation of the condensed water flowing out of the drainage pipe is effectively increased. It is possible to eliminate the need to discharge the water into a non-drain type cooling unit. Thus, for example, according to the invention of claim 8, the cooling unit is attached from the outside to the open / close panel of the apparatus having the open / close panel, and the air in the apparatus is circulated and ventilated to the evaporator from the communication portion formed in the open / close panel. By doing this, when it is used to cool the inside of the device, there is no need to run the conventional drainage hose, which is extremely suitable.

  On the other hand, since the refrigerant discharged from the compressor is cooled in advance by condensed water before flowing into the radiator and the temperature is lowered, the refrigeration capacity can also be improved. In this case, since it is not necessary to extend the refrigerant pipe to the evaporating dish as in the prior art, it is possible to realize space saving. In particular, when carbon dioxide is used as the refrigerant of the refrigerant circuit as in the invention of claim 9, the discharge refrigerant temperature of the compressor becomes high, so the condensed water is heated more effectively, and the refrigeration capacity is also improved. It will be possible to

  Further, according to the invention of claim 2, in addition to the above-mentioned invention, since the evaporation member having the water absorbing action by the capillary phenomenon is provided in the evaporation dish, the evaporation area is expanded by the condensed water penetrating into the evaporation member. The evaporation capacity will be further improved.

  At this time, if the drain pipe causes the condensed water to flow out from above the evaporation member as in the invention of claim 3, the condensed water is sprinkled directly on the evaporation member. Since the condensed water sprinkled at this time is water whose temperature has risen, it spreads to the evaporation member in the process of flowing down, and is quickly evaporated. This makes it possible to evaporate almost all the condensed water before accumulating in the evaporation pan, and it is possible to reliably prevent the spilling to the outside.

  Further, as in the invention of claim 4, if the drainage pipe is formed of a metal pipe and the drainage pipe and the discharge pipe are closely attached by soldering, the high temperature refrigerant and the condensed water discharged from the compressor are further increased. It will be possible to exchange heat more effectively.

  According to the invention of claim 5, the evaporating dish is disposed on one side of the machine room in which the compressor, the radiator, and the evaporating dish are installed, and the drainage pipe is directly connected to the one side from the other side of the machine room. By providing a pipe portion and arranging the straight pipe portion and the discharge pipe in a heat exchange relationship, a distance between the high temperature refrigerant and the condensed water is exchanged with a simple configuration in a limited space inside the machine room. Will be able to

  According to the sixth aspect of the present invention, at the portion where the discharge pipe and the drain pipe exchange heat, the flow of the condensed water flowing in the drain pipe and the flow of the refrigerant flowing in the discharge pipe are made to be opposite flows. From the upstream to the downstream of each of the high temperature refrigerant and the condensed water, it is possible to secure the temperature difference between the two and improve the heat exchange efficiency.

  According to a seventh aspect of the present invention, the radiator is provided with a radiator fan for ventilating the outside air and air cooling, and the evaporation plate is disposed downstream of the radiator and the compressor with respect to the flow of air by the radiator fan. As a result, the radiator and the compressor can be air-cooled to ventilate the air whose temperature has risen to the evaporating dish and the evaporating member, and the condensed water can be evaporated more efficiently.

It is the perspective view which looked at the cooling unit of one Example of this invention of the state which removed the exterior panel from the bottom. It is an enlarged perspective view of the location where the discharge piping and drainage pipe of the cooling unit of FIG. 1 heat-exchange. It is the perspective view which expanded the location where condensed water flows out from the drainage pipe of the cooling unit of FIG. It is a figure which shows the refrigerant circuit and drainage path of a cooling unit of FIG. It is a perspective view of the switchboard as an example of the apparatus with which the cooling unit of FIG. 1 is attached. It is a figure explaining the attachment state of the switchboard of FIG. 5, and the cooling unit of this invention.

  Hereinafter, an embodiment of the present invention will be described in detail based on the drawings. The cooling unit 1 of the embodiment is attached to the factory switchboard 2 (embodiment of the device) as shown in FIG. 5 and used to cool the inside. The cooling unit 1 is in the form of a case where the exterior panel 4 shown in FIG. 5 is attached to the frame 3 as shown in FIG. 1, and the compressor 6, the radiator (gas cooler) 7, and the throttling means The expansion valve 8 (FIG. 4 or capillary tube), the evaporator 9, the radiator blower 11 (FIG. 4), the cold air circulation blower 12 and the like are housed and integrated.

  The compressor 6, the radiator 7, the expansion valve 8 and the evaporator 9 are sequentially annularly connected by a refrigerant pipe (copper pipe) as shown in FIG. 4 as shown in FIG. 4, and a known refrigerant circuit R is configured. In the example, a predetermined amount of carbon dioxide is enclosed in the refrigerant circuit R as a refrigerant. In this case, the inside of the cooling unit 1 is vertically divided by the partition wall 13, and the lower side of the partition wall 13 is a machine room 14 and the upper side is a cooling room 16 (FIG. 1).

  The evaporator 9, the expansion valve 8 and the blower 12 for circulating cold air are installed in the upper cooling chamber 16, and the compressor 6, the radiator 7 and the blower 11 for radiator are installed in the lower machine chamber 14. There is. Further, an evaporation pan 17 is provided on one side in the machine room 14, and an evaporation member 18 is placed in the evaporation pan 17. The evaporation member 18 is a member that exerts a water absorbing action by capillary action, and in the embodiment, evaporation paper is used.

  In this case, the radiator blower 11 is operated to suck outside air and spray it on the radiator 7 and the compressor 6. The evaporation tray 17 is disposed downstream of the radiator 7 and the compressor 6 with respect to the flow of air by the radiator blower 11, and the air having passed through the radiator 7 and the compressor 6 is then transferred to the evaporation tray 17 and the evaporator 6. It will be ventilated to the evaporation member 18 (FIG. 4).

  On the other hand, a drain pan 19 (FIG. 4) is disposed on the lower side of the evaporator 9 in the cooling chamber 16, and the inside of the cooling chamber 16 is thereby provided with an upper suction side 16A and a lower blowout side 16B. It is divided. A drain pipe 21 is connected to the drain pan 19, and the drain pipe 21 is drawn out from one side into the machine room 14. In the embodiment, the drainage pipe 21 is composed of a copper pipe (an embodiment of a metal pipe), and after the upper part in the machine room 14 is directed from one side to the other side, it is U-turned from the other side to one side The outlet 21A has an opening shape directly above the evaporation member 18 (FIG. 3). The drainage pipes 21 in the machine chamber 14 in the part extending from one side to the other side and in the part extending from the other side to the one side are straight pipe portions 21B and 21C, respectively.

  On the other hand, the discharge piping 22 (copper pipe) extending from the compressor 6 to the radiator 7 also has a straight pipe portion 22A extending from one side to the other side in the upper part in the machine chamber 14. The straight pipe portion 22A is held together with the straight pipe portion 21C of the drainage pipe 21 extending from the other side to the one side in the machine room 14 and is closely attached by soldering (FIG. 2).

  The cooling unit 1 having such a configuration is attached to the switch panel 23 of the switchboard 2 from the outside. In this case, as shown in FIG. 6, a rectangular communication portion 24 (through hole) is formed in the pivoting (open-door) opening / closing panel 23, and the cooling chamber 16 corresponds to the communication portion 24. The cooling unit 1 is attached to the opening and closing panel 23 in a closed form. Since the opening and closing panel 23 is opened and closed for inspection of the electric components stored inside, the cooling unit 1 is also moved (rotated) together with the opening and closing panel 23 at that time.

  Next, the operation of the cooling unit 1 of the embodiment having the above configuration will be described. When the compressor 6 and the blowers 11 and 12 are operated, the carbon dioxide refrigerant compressed by the compressor 6 and brought into a supercritical state is discharged to the discharge pipe 22. The refrigerant at this time is a high temperature refrigerant whose temperature has risen to about + 80.degree. The refrigerant discharged to the discharge pipe 22 enters the straight pipe portion 22A, flows from one side to the other side in the machine chamber 14, and then enters the radiator 7. The refrigerant flowing into the radiator 7 is air-cooled by the outside air drawn by the radiator blower 11, but is still in the supercritical state.

  The refrigerant in the supercritical state, which is air-cooled by the radiator 7, flows into the expansion valve 8 and is decompressed, and in the process, it shifts to the liquid phase. Then, the air flows into the evaporator 9, evaporates, and the air inside the switchboard 2 ventilated by the cold air circulation fan 12 is cooled by the heat absorption function at this time. That is, the air in the switchboard 2 is sucked by the cold air circulation fan 12, passes through the communication portion 24, enters the suction side 16A, passes through the evaporator 9 and is cooled, and then passes through the communication portion 24 again from the blowout side 16B. It is blown out into the switchboard 2. Thus, the air in the switchboard 2 is circulated and ventilated to the evaporator 9 of the cooling unit 1, whereby the inside of the switchboard 2 is cooled and the overheat of the electrical components accommodated therein is prevented.

  The evaporation temperature of the refrigerant in the evaporator 9 is controlled to be higher than the freezing point, that is, + 5 ° C. in the embodiment. Then, the refrigerant evaporated by the evaporator 9 is sucked into the compressor 6 again.

  The moisture in the air in the switchboard 2 condenses on the surface of the evaporator 9 by such a cooling action by evaporation of the refrigerant, and adheres as condensed water. The condensed water drips from the evaporator 9 and is received by the drain pan 19. At this time, the temperature of the condensed water is about + 25 ° C. and is generated almost always during operation. The condensed water received by the drain pan 19 enters the drainage pipe 21, flows into the straight pipe portion 21B, flows from the inside of the machine room 14 from one side to the other side, and then makes a U-turn and enters the straight pipe portion 21C. . Then, after flowing in the straight pipe portion 21C from the other side in the machine chamber 14 toward one side, it flows out from the outlet 21A.

  As described above, in the embodiment, the drainage pipe 21 is formed of a copper tube having high thermal conductivity, and after the upper part in the machine room 14 is directed from one side to the other side, it is U-turned to make one side from the other side. In the process of flowing through the straight pipe portion 21B, the condensed water is warmed by the air in the upper part in the machine room 14 whose temperature is increased by the heat radiation from the compressor 6 and the radiator 7 become.

  Furthermore, since the straight pipe portion 21C of the drainage pipe 21 is held together with the straight pipe portion 22A of the discharge pipe 22 as described above and closely adhered by soldering, it exits the straight pipe portion 21B and enters the straight pipe portion 21C. The condensed water that has entered the heat exchanger exchanges heat with the high temperature refrigerant flowing in the discharge pipe 22 in the process of flowing in the straight pipe portion 21C. As a result, the condensed water is further heated, and the refrigerant is cooled in reverse.

  Further, the condensed water flowing in the straight pipe portion 21C flows from the other side toward the one side in the machine chamber 14, and the high temperature refrigerant flowing in the straight pipe portion 22A moves from the one side to the other side in the machine chamber 14. Since it flows toward the direction, the high temperature refrigerant and the condensed water flow in opposite directions at the portion where the discharge piping 22 and the drainage pipe 21 exchange heat (the straight pipe portion 22A and the straight pipe portion 21C). Therefore, the temperature difference between the two (the refrigerant is in the supercritical state) is secured substantially in the entire region of the straight pipe portions 21C and 22A, and the heat exchange efficiency becomes extremely good.

  The heat exchange with such a high temperature refrigerant raises the temperature of the condensed water to about + 50 ° C. and flows out from the outlet 21A. As described above, the outlet 21A of the drain pipe 21 is opened immediately above the evaporation member 18, so the condensed water (+ 50 ° C.) flowing out from the outlet 21A falls on the evaporation member 18 from above, and from above to below As it flows, it will spread throughout the evaporation member 18.

  In addition, since the air whose temperature has risen through the radiator 7 and the compressor 6 is ventilated to the evaporation pan 17 and the evaporation member 18 by the operation of the radiator blower 11 as described above, the air drips onto the evaporation member 18 and the area is reduced. The high temperature (+ 50.degree. C.) condensed water which has spread will evaporate quickly, and in most cases it will be in a situation where it evaporates before it reaches the evaporation pan 17. That is, in the case of this embodiment, the evaporation pan 17 is for receiving the condensed water which has not been evaporated by the evaporation member 18 due to the environmental conditions (high temperature and humidity etc.).

  As described above, in the cooling unit 1 according to the present invention, the discharge pipe 22 from the compressor 6 to the radiator 7 and the drain pipe 21 are subjected to heat exchange, so the high temperature refrigerant discharged from the compressor 6 makes the drain pipe As a result, it is possible to heat the condensed water flowing in the flow direction 21 toward the evaporating dish 17 and to raise the temperature of the condensed water flowing out from the drainage pipe 21 to the evaporating dish 17.

  That is, since the temperature of the condensed water is raised in the process of flowing through the drainage pipe 21 before flowing into the evaporation dish 17, the evaporation amount of the condensed water flowing out of the drainage pipe 21 is effectively increased to evaporate It is possible to eliminate the need for discharging from the tray 17 to the outside, and to obtain a non-drain type cooling unit 1.

  That is, since it is not necessary to attach the hose for drainage conventionally required conventionally, the cooling unit 1 is attached from the outside to the opening and closing panel 23 of the switchboard 2 as in the embodiment, and the communication part formed in the opening and closing panel 23 By circulating and ventilating the air in the switchboard 2 from the air conditioner 24 to the evaporator 9 from 24 it is not necessary to route the drainage hose when it is used to cool the inside of the switchboard 2, which is extremely preferable. .

  On the other hand, since the high temperature refrigerant discharged from the compressor 6 is cooled by the condensed water in advance before flowing into the radiator 7, the temperature is lowered, so that the refrigeration capacity can be improved. In this case, since it is not necessary to extend the refrigerant pipe to the evaporation pan 17 as in the prior art, space saving of the machine room 14 can also be realized. In particular, when carbon dioxide is used as the refrigerant of the refrigerant circuit R as in the embodiment, since the temperature of the refrigerant discharged from the compressor 6 becomes high, the condensed water can be heated more effectively to improve the refrigeration capacity. Will be able to

  Further, in the embodiment, since the evaporation member 18 having a water absorption effect by capillary action is provided in the evaporation dish 17, the condensed water penetrates the evaporation member 18 to expand the evaporation area, and the evaporation processing capacity is further increased. It will improve.

  At this time, in the embodiment, the outlet 21A of the drainage pipe 21 is disposed directly above the evaporation member 18, and the condensed water is made to flow out from above the evaporation member 18, so that the condensed water is sprinkled directly on the evaporation member 18. become. Since the condensed water sprinkled at this time is water whose temperature has risen, the condensed water spreads to the evaporation member 18 in the process of flowing down, and is quickly evaporated. As a result, it is possible to evaporate almost all the condensed water before accumulating in the evaporation pan 17, and it is possible to reliably prevent the overflow to the outside.

  Further, in the embodiment, since the drain pipe 21 is formed of a copper pipe (metal pipe) and the drain pipe 21 and the discharge pipe 22 are closely attached by soldering, the high temperature refrigerant discharged from the compressor 6 and Heat exchange with condensed water can be performed more effectively.

  In particular, the evaporation plate 17 is disposed on one side of the machine chamber 14 in which the compressor 6 and the radiator 7 are installed, and the drain pipe 21 is a straight pipe portion 21C extending from the other side of the machine chamber 14 to one side. Since the straight pipe portion 21C and the straight pipe portion 22A of the discharge pipe 22 are disposed in a heat exchange relationship, for example, the drainage pipe 21 and the discharge pipe 22 are held together in a limited space in the machine room 14 or The distance between the high temperature refrigerant and the condensed water can be secured with a simple configuration without winding in a coil shape in a double pipe state, etc.

  Further, in the straight pipe portions 22A and 21C where the discharge piping 22 and the drainage pipe 21 exchange heat, the flow of condensed water flowing in the drainage pipe 21 and the flow of refrigerant flowing in the discharge piping 22 become opposite flows. As a result, the temperature difference between the high temperature refrigerant and the condensed water can be secured from the upstream to the downstream, and the heat exchange efficiency can be improved.

  Furthermore, since the evaporation dish is disposed downstream of the radiator 7 and the compressor 6 with respect to the flow of air by the radiator blower 11 which ventilates the outside air to the radiator 7 to cool the air, the radiator 7 and the compressor 6 are compressed. By air-cooling the machine 6, the temperature rising air is ventilated to the evaporating dish 17 and the evaporating member 18, and condensed water can be evaporated more efficiently.

  The device to which the cooling unit 1 of the present invention is attached is not limited to the switchboard 2 as in the embodiment, but may be a panel of a computer server, a window of a house, a window of a house, a door of a house, a door of a delivery truck, a door of a transport container, etc. It is also effective when attached. The invention other than claim 8 is not limited to such a device, and may be an ordinary household air conditioner, and is effective also when it is used to cool the inside of a showcase for business use.

  Furthermore, although the drain pipe 21 is comprised by the copper pipe (metal pipe) in the Example, you may use normal resin-made hoses in invention except Claim 4. However, if it can be made of a metal pipe and soldered to the discharge pipe 22 as in the embodiment, further heat exchange performance can be obtained.

  Furthermore, although carbon dioxide is used as the refrigerant in the embodiment, the invention is not limited to the invention except for the ninth aspect, and the present invention is effective to a cooling unit provided with a refrigerant circuit R using various refrigerants.

1 Cooling unit 2 Switchboard 6 Compressor 7 Radiator 8 Expansion valve (throttling means)
9 evaporator 11 radiator blower 12 cold air circulation blower 14 machine room 17 evaporation plate 18 evaporation member 19 drain pan 21 drainage pipe 21A outlet 21C straight pipe portion 22 discharge piping 21A straight pipe portion R refrigerant circuit

Claims (9)

In a cooling unit including a refrigerant circuit in which a compressor, a radiator, throttling means, and an evaporator are sequentially and annularly connected by piping, and the evaporation temperature of the refrigerant in the evaporator is higher than the freezing point,
An evaporating dish for receiving condensed water generated by the evaporator;
And a drain pipe for guiding condensed water from the evaporator to the evaporation pan.
A cooling unit characterized in that heat exchange is performed between a discharge pipe extending from the compressor to the radiator and the drainage pipe.   The cooling unit according to claim 1, further comprising an evaporation member provided in the evaporation dish and having a water absorption effect by capillary action.   The cooling unit according to claim 2, wherein the drainage pipe causes condensed water to flow out from above the evaporation member.   The cooling unit according to any one of claims 1 to 3, wherein the drain pipe is formed of a metal pipe, and the drain pipe and the discharge pipe are closely attached by soldering. A machine room in which the compressor, the radiator, and the evaporation dish are installed;
The evaporating dish is disposed at one side of the machine room.
The drainage pipe has a straight pipe portion extending from the other side to the one side of the machine chamber, and the straight pipe portion and the discharge pipe are arranged in a heat exchange relationship. The cooling unit according to any one of 4.   At a portion where the discharge pipe and the drainage pipe exchange heat, the flow of condensed water flowing in the drainage pipe and the flow of refrigerant flowing in the discharge pipe are made to be opposite flows. The cooling unit according to any one of claims 5. The radiator is provided with a blower for radiator that ventilates the air and cools the air.
The cooling according to any one of claims 1 to 6, wherein the evaporating dish is disposed downstream of the radiator and the compressor with respect to the flow of air by the radiator fan. unit.   It is attached from the outside to the opening and closing panel of the device having the opening and closing panel, and the air in the device is circulated and ventilated to the evaporator from the communication part formed in the opening and closing panel to cool the inside of the device. The cooling unit according to any one of claims 1 to 7, wherein:   The cooling unit according to any one of claims 1 to 8, wherein carbon dioxide is used as the refrigerant of the refrigerant circuit.

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