JP6469392B2 - Endoscope device - Google Patents

Description

  One embodiment of the present invention relates to an endoscope apparatus. In particular, the present invention relates to an endoscope apparatus including a light emitting device.

  Note that one embodiment of the present invention is not limited to the above technical field. One embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. One aspect of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, the technical field of one embodiment of the present invention disclosed in this specification more specifically includes a semiconductor device, a display device, a light-emitting device, a lighting device, a driving method thereof, or a manufacturing method thereof as an example. Can be mentioned.

  Note that in this specification, a light-emitting device refers to all devices including a light-emitting element, and includes a light source (including a lighting device).

  An endoscope apparatus is known as means for observing the inside of an object to be inspected. The endoscope apparatus includes an elongated and bendable insertion portion. As an observation means, there are a fiberscope using an optical fiber, an electronic endoscope apparatus using a CCD (Charge Coupled Device) camera, and the like.

  In the endoscope apparatus, illumination for illuminating the inside of the object to be inspected is provided on the distal end surface of the insertion portion. Illumination configurations include a system in which a light source such as a xenon lamp is provided outside and light is propagated to the distal end surface of the insertion portion by an optical fiber, and an LED (Light Emitting Diode) element is provided on the distal end surface of the insertion portion. . For example, Patent Document 1 discloses a configuration in which a light source device that supplies light to an endoscope is provided and a light guide that propagates light from the light source device to a distal end portion is built in the insertion portion.

International Publication No. 2011/145392 Pamphlet

  When a light source such as a xenon lamp is used as illumination for illuminating the inside of the object to be inspected, the scale of the endoscope apparatus becomes large. In addition, in the configuration using the LED element, the device configuration of the endoscope apparatus can be simplified, but it is difficult to improve the color rendering property of the illumination light, and it becomes difficult to observe the inside of the inspected object in detail. End up. In addition, when such a light source is used, a light emitting area is extremely small and light having high directivity is emitted. Therefore, an area that cannot be observed is generated due to the shade generated when the inside of the inspection object is irradiated.

  An object of one embodiment of the present invention is to provide an endoscope apparatus that can observe the inside of an object to be examined in detail. Another object is to simplify the configuration of an endoscope apparatus. Another object is to provide an endoscope apparatus that is difficult to shade. Another object is to provide an endoscope apparatus that facilitates stereoscopic observation. Another object is to provide an endoscope apparatus that can control the light emission direction of a light source. Another object is to provide a novel endoscope apparatus. Another object is to provide a novel light-emitting device.

  Note that the description of these problems does not disturb the existence of other problems. Note that one embodiment of the present invention does not have to solve all of these problems. Issues other than these will be apparent from the description of the specification, drawings, claims, etc., and other issues can be extracted from the descriptions of the specification, drawings, claims, etc. It is.

  One embodiment of the present invention is an endoscope apparatus having a tube-like insertion portion including a distal end portion, and the distal end portion includes a light emitting device and an optical device. The optical device is disposed on the distal end surface of the distal end portion, and the light emitting device is provided along the side surface of the distal end portion.

  The light emitting device preferably emits surface light.

  The optical device is preferably an image sensor or an optical fiber.

  Further, the light emitting device is preferably provided so as to emit light outward from the side surface of the tip portion. In this case, in particular, the light emitting device is preferably provided so as to cover a part of the distal end surface of the distal end portion.

  Alternatively, the light emitting device is provided so as to emit light inward from the side surface of the tip portion, and a reflecting member that reflects light is provided inside the tip portion so as to emit light from the tip surface. preferable. At this time, it is particularly preferable that the light emitting device exhibits double-sided light emission, and the light from the light emitting device is provided so as to emit light from the side surface of the tip portion to the inside and outside.

The image obtained via the optical device has a first mode for observing a moving image and a second mode for photographing a still image. In the first mode, the light emitting device continuously the light emission luminance is less than 100 cd / cm ² or more 10000 cd / cm ² light, or intermittently emitted, the second mode, light emission luminance from a light-emitting device 10000 cd / cm ² or more 500000cd / cm ² or less of It is preferable that light is emitted in synchronization with the shutter speed.

  The light-emitting device preferably includes a light-emitting element including a light-emitting organic compound. In this case, in particular, it is preferable to further include a display unit that displays an image obtained through the optical device, and the display unit includes a light emitting element including a light emitting organic compound in the pixel.

  According to one aspect of the present invention, it is possible to provide an endoscope apparatus capable of observing the inside of a subject to be examined in detail. Alternatively, the configuration of the endoscope apparatus can be simplified. Alternatively, it is possible to provide an endoscope apparatus that is difficult to be shaded. Alternatively, it is possible to provide an endoscope apparatus that facilitates stereoscopic observation. Or the endoscope apparatus which can control the light emission direction of a light source can be provided. Note that one embodiment of the present invention is not limited to these effects. For example, according to circumstances, one embodiment of the present invention may have effects other than these effects or may not have these effects.

The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The figure explaining the control method example of the endoscope apparatus based on Embodiment. The structural example of the light emission panel based on Embodiment. The structural example of the light emission panel based on Embodiment. The structural example of the light emission panel based on Embodiment. 3A and 3B illustrate a light-emitting element. The structural example of the light emission panel based on an Example. The structural example of the light emission panel based on an Example. The figure which shows the voltage-luminance characteristic of the light emission panel based on an Example. The figure which shows the emission spectrum of the light emission panel based on an Example. The structural example of the light emission panel based on an Example. The figure which shows the voltage-luminance characteristic of the light emission panel based on an Example. The figure which shows the emission spectrum of the light emission panel based on an Example. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment. The structural example of the endoscope apparatus based on embodiment.

  Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

  Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated. In addition, in the case where the same function is indicated, the hatch pattern is the same, and there is a case where no reference numeral is given.

  Note that in each drawing described in this specification, the size, the layer thickness, or the region of each component is exaggerated for simplicity in some cases. Therefore, it is not necessarily limited to the scale.

(Embodiment 1)
In this embodiment, an example of an endoscope apparatus of one embodiment of the present invention will be described with reference to drawings.

[Configuration example]
FIG. 1A illustrates an endoscope apparatus 10 illustrated in this embodiment. The endoscope apparatus 10 includes an operation unit 11 that can be gripped. Further, the operation unit 11 is provided with an operation dial 12, an operation button 14, a forceps port 15, and the like. The operation unit 11 is connected to a connector 13 and an insertion unit 101. Further, the distal end portion 110 is provided at the distal end of the insertion portion 101.

  The insertion portion 101 has a tube shape that can be bent. Moreover, it is preferable that at least a part of the distal end portion 110 of the insertion portion 101 (for example, a distal end surface 122 described below and the vicinity thereof) is hard. By operating the operation dial 12 provided in the operation unit 11, a part of the insertion unit 101 is curved, and the direction of the distal end portion 110 can be freely moved.

  The operation button 14 provided in the operation unit 11 is a function of performing an operation of sending a liquid such as water or a gas such as air to a through hole provided in the distal end portion 110, or performing an operation such as suction through the through hole. Have In addition, the forceps port 15 passes through a through hole provided in the distal end portion 110, and treatment can be performed by inserting forceps or the like from the forceps port 15. A tube (catheter or the like) may be inserted into the forceps port 15 to perform suction, air supply, water supply, or the like.

  The connector 13 connected to the operation unit 11 is connected to a control device or the like (not shown), and in addition to wiring for transmitting a video signal from the tip portion 110 and wiring for supplying power to the light emitting device 111 provided in the tip portion 110. In addition, a hole for supplying the liquid or air may be provided. In addition to the wiring and holes similar to those of the connector 13, the insertion unit 101 includes a hole that communicates with the forceps opening 15.

  Note that the endoscope apparatus of one embodiment of the present invention assumes a human body as an object to be inspected, and may be used as a medical application for the purpose of inspection, observation, or treatment. Assuming equipment, etc., these may be used for inspection purposes for the purpose of inspection, observation or repair.

  For example, in the case of an endoscope apparatus specialized for observation and inspection, the operation unit 11 may include at least the operation dial 12, and the operation button 14, the forceps port 15, and the like may not be provided.

  Moreover, it is good also as a structure which provides the operation stick 22, the operation button 24, the display part 25, etc. in the operation part 21 like the endoscope apparatus 20 shown in FIG. Since the endoscope apparatus 20 does not require a control device or the like, it is an endoscope apparatus that is excellent in portability. Note that the endoscope apparatus 20 may have a battery mounted on the operation unit 21 or may be configured to connect a cable or the like for supplying power to the operation unit 21.

[Configuration example of tip]
Subsequently, a configuration example of the distal end portion 110 of the insertion portion 101 will be described.

[Configuration example 1]
FIG. 1B is a perspective view of the distal end portion 110 shown in this configuration example. FIG. 1C is a schematic cross-sectional view taken along a cross section AB in FIG.

  The tip portion 110 has a cylindrical exterior member 121. An optical device 112, a hole 114, and the like are provided on the distal end surface 122 of the exterior member 121. Further, inside the exterior member 121, a belt-like light emitting device 111, a transmission path 113 connected to the optical device 112, and the like are provided.

  Note that, here, a configuration in which one hole 114 is provided in the distal end surface 122 is shown; however, a configuration in which the hole 114 is not provided as shown in FIG. As shown in FIG. 2, two or more holes 114 may be provided. FIG. 3B shows an example in which two holes 114 having different sizes are provided.

  Although the cylindrical shape is shown here as the exterior member 121, the shape is not limited to this, and a cross-sectional shape perpendicular to the extending direction may be a columnar shape such as a polygon or an ellipse, or a weight shape. . As an example, FIGS. 25A, 25B, and 25C show examples in which the cross-sectional shape perpendicular to the stretching direction is a quadrangle.

  The light emitting device 111 has a strip shape that is long in the extending direction of the exterior member 121, and is provided along the side surface of the exterior member 121. As shown in FIG. 1C, light 120 from the light emitting device 111 is emitted from the inside of the exterior member 121 toward the outside.

  When the insertion unit 101 is inserted into the inspection object, the light emitting device 111 can illuminate the inner wall of the inspection object. The light applied to the inner wall of the object to be inspected is reflected and scattered by the inner wall, and can illuminate the front of the front end surface 122 indirectly. At this time, the light that illuminates the front is reflected light (scattered light) from the inner wall around the distal end portion 110 and has low directivity. Therefore, for example, compared to a case where a point light source (LED, optical fiber, or the like) is provided on the front end surface 122 to illuminate the front, shadows are less likely to be generated inside the object to be inspected. Is possible. In particular, when the inside of the object to be inspected has a undulating shape, or when inspecting the inside of a machine in which many parts such as gears are intricate, it is possible to observe details in the depth direction in detail.

  Here, the light emitting device 111 may have a configuration in which, for example, a plurality of point light sources (for example, LEDs) are arranged in a planar shape along the side surface of the exterior member 121. In particular, a light emitting device that emits surface light is preferable. By applying the light emitting device 111 that emits surface light, the inner wall of the object to be inspected can be illuminated uniformly, and the directivity of reflected light (scattered light) from the inner wall can be further reduced.

  The light-emitting device 111 is preferably a light-emitting device including a light-emitting element (organic EL (Electro Luminescence) element) containing a light-emitting organic compound. In particular, a light-emitting device including a light-emitting element that exhibits white light is preferably used. Since the white organic EL element has higher color rendering properties than an LED or the like, it is possible to detect a slight difference in color inside the object to be inspected. In particular, the organic EL element can improve the color rendering property on the long wavelength side as compared with the LED or the like. For example, there is a slight difference in color between normal tissues in the living body and degenerated tissues (such as cancer cells). Especially in the initial stage, it is not possible to detect denatured sites when using LEDs or the like. Have difficulty. However, by using the light emitting device 111 to which an organic EL element having a high color rendering property on the long wavelength side is used, it is possible to easily detect a denatured site in an initial stage.

  Note that one embodiment of the present invention is not limited to this. In some cases, another light source of the organic EL element may be additionally provided. Alternatively, an LED may be provided in addition to the organic EL element.

  As the light-emitting device 111, a flexible light-emitting panel is preferably used. For example, an extremely thin light-emitting panel in which a light-emitting element is provided over a flexible substrate is used. As described above, since the light emitting device 111 has flexibility, the light emitting device 111 can be easily deformed into a shape along the curved surface inside the exterior member 121. Further, when a flexible material such as an elastic body is used as the exterior member 121, the exterior member 121 is curved or the exterior member 121 is deformed by an external force depending on the deformation of the exterior member 121. The light emitting device 111 can also be modified. For example, when the insertion portion 101 is inserted into the object to be inspected, the distal end portion 110 easily deforms when the distal end portion 110 comes into contact with the inner wall of the object to be inspected, thereby damaging the inner wall of the object to be inspected. Can be suppressed.

  Note that one embodiment of the present invention is not limited to this. For example, a light-emitting panel provided on a glass substrate may be provided in addition to a flexible light-emitting panel, or may be provided instead of a flexible light-emitting panel.

  In FIG. 1, four light emitting devices 111 are provided along the extending direction of the exterior member 121, but the number is not limited to this, and one or more light emitting devices may be arranged. In the case where a plurality of light emitting devices 111 are provided, it is preferable to arrange them at equal intervals along the outer periphery of the exterior member 121 because the uniformity of light is increased. When a plurality of light emitting devices 111 are provided, they may emit light with the same brightness, or the light emission brightness may be individually controlled. For example, the brightness before the tip surface 122 is optimized by individually controlling the light emission luminance of the plurality of light emitting devices 111 according to the positional relationship and distance between the tip portion 110 and the inner wall of the object to be inspected. Can be.

  As the exterior member 121, a translucent member is used at least in a region where light from the light emitting device 111 is emitted. In addition, a light extraction member such as a microlens array or a light diffusion sheet may be provided on at least one of the inner surface and the outer surface of the exterior member 121, or fine unevenness is provided on the surface of the exterior member 121 itself to improve the light extraction efficiency. It is good also as a structure to raise.

  As the optical device 112, for example, an image sensor such as a CCD image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor, or a fiber scope using an optical fiber can be used. In particular, it is preferable to use a CCD image sensor from the viewpoints of resolution and color reproducibility.

  When an image sensor is used as the optical device 112, the transmission path 113 corresponds to a signal line connected to the image sensor or a wiring such as a power supply line. In addition, when a fiberscope is used as the optical device 112, the transmission path 113 and the optical device 112 are not distinguished, and each corresponds to a plurality of bundled optical fibers.

  Note that one embodiment of the present invention is not limited to this, and for example, the transmission path 113 may not be provided, and information may be transmitted wirelessly instead.

  The endoscope apparatus 10 including the insertion portion 101 having the distal end portion 110 exemplified in this configuration example includes a light source that irradiates the inside of the inspected object in the distal end portion 110, for example, when a xenon lamp is used as the light source. Since it is not necessary to provide a relatively large light source outside, the device configuration of the endoscope apparatus can be simplified. Furthermore, it is possible to make the shadow less likely to occur by irradiating light from the side surface of the distal end portion 110 of the insertion portion 101 and illuminating the inner wall of the object to be inspected, so that the inside of the object to be inspected can be observed in detail. A mirror device can be realized. In particular, by using the light emitting device 111 in which an organic EL element is applied to the distal end portion 110, it is possible to realize an endoscope device that can detect even a slight color difference.

  The above is the description of the configuration example 1.

[Modification 1]
Below, the structural example of the front-end | tip part 110 different from the said structural example 1 is demonstrated. In addition, description is abbreviate | omitted about the part which overlaps with the above, and a difference is demonstrated in detail.

  In the configuration example 1, the belt-like light emitting device 111 is provided along the extending direction of the exterior member 121. However, the present invention is not limited to this, and for example, the light emitting device 111 can be provided as follows.

  In the configuration shown in FIG. 4A, the strip-shaped light emitting device 111 is provided along the circumferential direction of the side surface of the cylindrical exterior member 121. FIG. 4A illustrates a structure in which a plurality of band-shaped light-emitting devices 111 are provided; By providing a plurality of light emitting devices 111 in parallel, the light emitting area can be increased. Further, in this way, by providing a plurality of strip-shaped light emitting devices 111 apart from each other, stress applied to the light emitting device 111 is relieved even when the tip 110 is curved, and the light emitting device 111 is destroyed. Can be suppressed.

  Further, as described above, the plurality of light emitting devices 111 may emit light with the same luminance, or the luminance of light emitted from the plurality of light emitting devices 111 may be individually controlled.

  In the configuration shown in FIG. 4B, the strip-shaped light emitting device 111 is provided in a spiral shape along the side surface of the cylindrical exterior member 121. With such a structure, stress applied to the light-emitting device 111 due to the deformation of the distal end portion 110 can be reduced as in the structure illustrated in FIG. Furthermore, the number of parts can be reduced by arranging one long belt-like light emitting device in a spiral manner.

  In FIG. 4C, the light emitting device 111 having a mesh shape is provided along the side surface of the exterior member 121. As described above, the light emitting device 111 having a mesh shape not only improves the in-plane uniformity of light emission of the light emitting device 111, but also has elasticity in the extending direction of the tip portion 110. Therefore, the stress applied when the exterior member 121 is deformed can be reduced.

  In addition, the front-end | tip part 110 may have flexibility by using the exterior member 121 which has flexibility. FIG. 23A shows a side view of FIG. 4A. Next, FIG. 23B illustrates a case where a part of the tip portion 110 is bent. It is preferable that the state of FIG. 23 (A) can be arbitrarily changed from the state of FIG. 23 (B). As a result, the emission direction of the light 120 can be changed. That is, the light emission direction of the light source can be controlled. As a result, since the light 120 can be irradiated from an appropriate direction, it is possible to make it difficult for shadows to occur.

  Further, only the light emitting device 111 may be arbitrarily modified. For example, FIG. 26A shows a view of FIG. 25A viewed from the side. Here, FIG. 26B illustrates an example where only the light-emitting device 111 is deformed. A part of the light emitting device 111 that is far from the front end surface 122 is supported, and a part near the front end surface 122 is curved outward from the exterior member 121 so as to be separated from the exterior member 121. The rear surface (the surface that contacts the exterior member 121 before deformation) is deformed so that it can be seen from the front end surface 122 side. As described above, the curvature of the portion where the light emitting device 111 curves outward from the exterior member 121 can be changed as needed. As a result, only the light emitting device 111 can be deformed without the exterior member 121 and the optical device 112 therein being deformed. Therefore, only the emission direction of the light 120 can be changed. As a result, for example, when there is a projection or the like inside the object to be inspected, it is possible to change only the emission direction of the light 120 without changing the position of the optical device 112, so that the uneven shape and the undulation can be observed in more detail. . That is, three-dimensional observation is facilitated.

  Note that when the light emitting device 111 is moved, it is preferable to apply a double-sided light emitting device that emits light to both sides of the light emitting device 111. Alternatively, it is desirable to emit light from both sides by overlapping the two light emitting devices 111. As a result, as shown in FIG. 26B, not only the light 120 but also the light 120A is emitted, so that the illumination state can be controlled more appropriately. Note that when the light 120A is irradiated, the light 120 is not necessarily irradiated.

  Note that although the example in which the light-emitting device 111 is provided in the distal end portion 110 has been described, one embodiment of the present invention is not limited thereto. You may provide only in places other than the front-end | tip part 110, and you may provide in both the front-end | tip part 110 and other places. 24A and 24B show an example in which the light emitting device 111 is provided in a region other than the distal end portion 110 of the insertion portion 101. FIG. By providing the light emitting device 111 in the insertion portion 101 in the vicinity of the distal end portion 110, it is possible to make it difficult for the shade to occur. In the case where the insertion portion 101 has flexibility, the emission direction of the light 120 can be changed by the light emitting device 111 having flexibility. That is, the light emission direction of the light source can be controlled. As a result, since the light 120 can be irradiated from an appropriate direction, it is possible to make shadows less likely to occur.

  The above is the description of the modified example.

[Configuration example 2]
Below, the structural example of the front-end | tip part 110 which can emit light not only from the side surface of the front-end | tip part 110 but ahead of the front-end | tip surface of the front-end | tip part 110 is demonstrated.

  5A includes a light emitting unit 116 and a transmission path 117 connected to the light emitting unit 116 on the front end surface 122 in addition to the configuration shown in FIG.

  As the light emitting unit 116, a light emitting element such as an LED element or an organic EL element, or an optical fiber that propagates light from a light source such as a xenon lamp can be used. In particular, when an organic EL element is used, it is preferable from the viewpoint of color rendering properties of light and simplification of the apparatus.

  In the case where a light emitting element is applied as the light emitting unit 116, the transmission path 117 corresponds to a signal for driving this and a wiring for transmitting electric power. Further, when an optical fiber or the like is used for the light emitting unit 116, the light emitting unit 116 and the transmission path 117 are not distinguished, and both correspond to optical fibers.

  Thus, by simultaneously providing the light emitting device 111 that emits light from the side surface of the tip portion 110 and the light emitting portion 116 that emits light ahead of the tip surface 122, the front side is brightly illuminated by the light from the light emitting portion 116, Since the shadow that can be generated at this time can be illuminated with the reflected light from the inner wall of the object to be inspected, the inside of the object to be inspected can be observed in detail.

  5B is different from the configuration shown in FIG. 4A in that the shape in the vicinity of the tip surface 122 is different. Specifically, it has a front end surface 122 having a diameter smaller than the outer diameter of the exterior member 121, has a surface shape that gently slopes from the front end surface 122 to the side surface of the exterior member 121, and along the inclined portion. A light emitting device 111 is arranged. Therefore, a part of the light emitted from the light emitting device 111 is emitted forward from the front end surface 122, so that the front can be illuminated brightly.

  In the configuration of the distal end portion 110 illustrated in FIG. 6A, a belt-like light emitting device 111 is provided to cover the side surface of the exterior member 121 and a partial region of the distal end surface 122. 6B, a cross-shaped light emitting device 111 is provided so as to cover a side surface of the exterior member 121 and a partial region of the front end surface 122. In the configuration shown in FIGS. 6A and 6B, the light emitting device 111 has an opening in a region overlapping the hole 114 and the optical device 112 provided in the front end surface 122.

  As described above, the light emitting device 111 is provided so as to cover a part of the front end surface 122, so that light can be simultaneously emitted to the side surface of the front end portion 110 and the front side of the front end surface 122. While illuminating, the shadow that can be generated at this time can be illuminated with the reflected light from the inner wall of the object to be inspected, so that the inside of the object to be inspected can be observed in detail.

  In addition, as shown in FIGS. 6A and 6B, the number of components can be reduced by providing one continuous light emitting device 111 so as to cover the side surface of the exterior member 121 and a part of the front end surface 122. it can.

  The above is the description of the configuration example 2.

[Configuration example 3]
Below, the structural example of the front-end | tip part 110 from which a part of structure differs from the above is demonstrated.

  FIG. 7A is a schematic perspective view of the distal end portion 110 shown in this configuration example. FIGS. 7B and 7C are schematic cross-sectional views taken along section planes CD and EF shown in FIG. 7A, respectively.

  The tip portion 110 shown in FIG. 7 differs from the tip portion configuration shown in FIG. 1 in that the tip surface 122 has a different configuration, a reflecting member 123, and the light emitting device 111 emits light in different directions. It is mainly different in point.

  The light emitting device 111 is provided along the side surface of the exterior member 121 and emits light from the side surface of the exterior member 121 toward the inside.

  The reflection member 123 provided inside the exterior member 121 reflects light at least on the surface facing the light emitting device 111. As shown in FIG. 7C, the reflecting member 123 is disposed so as to be inclined with respect to the extending direction of the distal end portion 110 so that the distance from the light emitting device 111 increases as the distance from the distal end surface 122 increases. Therefore, the light 120 emitted from the light emitting device 111 is reflected by the reflecting member 123, and a part of the light 120 is emitted forward from the front end surface 122.

  The angle between the reflecting member 123 and the light emitting device 111 is preferably closer to 45 degrees. On the other hand, the smaller the angle between the reflecting member 123 and the light emitting device 111 is, the larger the light emitting area of the light emitting device 111 can be increased. The brightness of light emitted from the front end surface 122 can be increased. The angle between the reflecting member 123 and the light emitting device 111 is in the range of 1 to 45 degrees in consideration of the inner diameter of the exterior member 121, the thickness of the light emitting device 111 and the reflecting member 123, and other spatial limitations. What is necessary is just to set suitably.

  A region 125 between the reflecting member 123 and the light emitting device 111 is filled with a light-transmitting material. Here, when a material having a high refractive index is used for the region 125 between the reflecting member 123 and the light emitting device 111, total reflection is likely to occur between the light emitting device 111 and the region 125, and the light emitting device 111 and the reflecting member are formed. The light can be confined in the region 125 by repeating reflection with the region 123. As a result, the brightness of the light emitted from the tip surface 122 can be increased.

  Further, a concave lens 124 is provided in a region where light is emitted on the front end surface 122. Since the light emitted from the front end surface 122 can be diffused by the concave lens 124, the front side of the front end surface 122 can be observed over a wider range. Further, as shown in FIGS. 8A and 8B, a convex lens 126 may be provided instead of the concave lens 124. By disposing the convex lens 126 on the front end surface 122, the light emitted from the front end surface 122 can be condensed and the luminance can be increased.

  Note that the thickness of the lens can be reduced by using a Fresnel lens as the concave lens 124 and the convex lens 126. Further, instead of the concave lens 124 and the convex lens 126, a cylindrical lens or a toroidal lens may be provided on the front end surface 122, or a light extraction member such as a microlens array or a light diffusion sheet may be provided on the front end surface 122. By providing the lens and the light extraction member, it is possible to improve the light extraction efficiency and increase the luminance of the light emitted from the tip surface. In addition, if such a lens and a light extraction member are unnecessary, it is not necessary to provide them.

  In the configuration of the distal end portion 110 illustrated in FIGS. 7 and 8, almost the entire region of the distal end surface 122 other than the region where the optical device 112 and the hole 114 are provided can be used as the light emitting region. That is, planar light emission can be performed from the front end surface 122 toward the front. Therefore, for example, compared to a case where a point light source (such as an LED or an optical fiber) is provided on the distal end surface 122 to illuminate the front, shadows are less likely to be generated inside the object to be inspected. Can do.

  In addition, by using a light emitting device that emits surface light as the light emitting device 111 provided in the exterior member 121, the light emitting area of the light emitting device 111 becomes extremely large as compared with the case where a point light source such as an LED is used. Therefore, by collecting the light from the light emitting device 111 that emits surface light and emitting it from the front end surface 122, it is possible to emit light with extremely high luminance ahead of the front end surface 122.

[Modification 2]
Below, the structural example of the tip part 110 from which a part of structural example 3 differs is demonstrated.

  FIG. 9A shows a schematic perspective view of the tip 110 shown below. FIGS. 9B and 9C are cross-sectional schematic views taken along the cutting planes GH and IJ shown in FIG. 9A, respectively.

  The tip 110 shown in FIG. 9 is mainly different from the configuration example 3 in that a light emitting device 131 is provided instead of the light emitting device 111. The light emitting device 131 is a double-sided light emitting device that emits light on both sides thereof.

  As shown in FIGS. 9B and 9C, the light emitting device 131 emits light 120 from the side surface of the exterior member 121 toward the inside, and emits light 120 from the side surface of the exterior member toward the outside.

  The light 120 traveling inward from the side surface of the exterior member 121 is reflected by the reflecting member 123, and a part of the light 120 is emitted forward from the front end surface 122. Further, the light 120 traveling outward from the side surface of the exterior member 121 can illuminate the inner wall of the object to be inspected.

  By using the tip portion 110 having such a configuration, it is possible to illuminate the front of the tip portion 110 brightly, and at the same time, illuminate the genital region generated by the indirect light reflected from the inner wall of the object to be inspected. This makes it possible to observe the inside of the inspection object in more detail.

  The above is the description of the configuration example of the tip portion.

  In the configuration of the tip portion shown in Configuration Example 2, Configuration Example 3 and Modification Example 2, the shape of the light emitting device provided on the side surface of the tip portion is the shape of the light emitting device shown in Configuration Example 1 and Modification Example 1. They can be combined as appropriate. In the configuration example and the modification example described above, a light emitting element such as an LED element or an organic EL element, or an optical fiber that propagates light from a light source such as a xenon lamp may be appropriately provided on the front end surface.

[Example of control method]
Hereinafter, a configuration example and a control method example for controlling the endoscope apparatus exemplified in the above configuration example and the like will be described.

  FIG. 10 is a block diagram showing main parts of an endoscope apparatus 50 exemplified below. The endoscope apparatus 50 includes a display unit 51, a control unit 52, a storage device 53, an operation unit 54, and an insertion unit 101. The insertion unit 101 has a distal end portion 110 including a light emitting device 111 and an optical device 112.

  The structure described above can be used as appropriate for the insertion portion 101, the distal end portion 110, the light emitting device 111, the optical device 112, and the like.

  The control unit 52 is electrically connected to the light emitting device 111 and the optical device 112 via the operation unit 54 and wiring provided in the insertion unit 101, and can control driving thereof. For example, the light emission brightness, the light emission time, and the timing of the light emitting device 111 are controlled. In addition, the control unit 52 can drive the optical device 112 in accordance with the shooting conditions of the optical device 112 (for example, shutter speed, aperture value, focus, etc.), and cause the optical device 112 to take a moving image or a still image. Further, the video signal photographed by the optical device 112 is sent to the control unit 52. Further, the control unit 52 may be configured to appropriately control the light emission luminance of the light emitting device 111 based on the video obtained from the optical device 112.

  The control unit 52 can convert the video signal input from the optical device 112 into a signal for displaying a video on the display unit 51 and display the video on the display unit 51. In addition, the video can be converted into data and stored in the storage device 53.

  Here, the display unit 51 preferably includes a light-emitting element (organic EL element) including a light-emitting organic substance in the pixel. Since the display unit 51 including the organic EL element in the pixel has high color reproducibility and contrast, the image obtained by the optical device 112 can be displayed with high reproducibility. In particular, it is preferable that the display unit 51 has a high resolution such as FHD (1920 × 1080), 4K2K (3840 × 2048 or 4096 × 2180), or 8K4K (7680 × 4320).

  In particular, in the case where the light emitting device 111 provided in the tip portion 110 also has a similar organic EL element, a display unit including a pixel including the same organic EL element is displayed on an image obtained by light emission from the organic EL element. By displaying at 51, it is possible to faithfully reproduce and display the obtained video. In particular, since a slight difference in color detectable by the light emitting device 111 including an organic EL element can be faithfully reproduced on the display unit 51, it can be suitably used for medical diagnosis.

  Next, an example of control operations of the light emitting device 111 and the optical device 112 of the control unit 52 in the endoscope device 50 will be described with reference to FIG. FIG. 11 is a flowchart relating to control of the light emitting device 111 and the optical device 112 by the control unit 52.

  First, a photographing operation is started (step S0).

  Subsequently, a mode is set (step S1). As the mode set here, one of a first mode for observing or photographing a moving image and a second mode for photographing a still image is selected. Here, the mode can be set as required by the user using a user interface, for example.

  In step S2, when the selected mode is the first mode, the process proceeds to step S3. When it is not in the first mode, that is, in the second mode, the process proceeds to step S4.

In step S3, the control unit 52, the light emitting device emission luminance from 111 100 cd / cm ² or more 10000 cd / cm less than ^2, preferably to emit light below 500 cd / cm ² or more 10000 cd / cm ² continuously, or The light emitting device 111 is controlled so that it flickers intermittently (flashes continuously) so that the flicker of the image is not recognized. Thereafter, the process proceeds to step S6. Here, when light is emitted intermittently, it is preferable to emit light at a frequency of, for example, 30 Hz or more, preferably 60 Hz or more, or 120 Hz or more because flickering of an image is not recognized.

In step S4, the second mode is defined, and the process proceeds to step S5. In step S <b> 5, the control unit 52 controls the light emitting device 111 such that light having a light emission luminance of 10,000 cd / cm ² or more and 500,000 cd / cm ² or less is emitted from the light emitting device 111 in synchronization with the shutter speed of the optical device 112. . Thereafter, the process proceeds to step S6.

In step S6, a moving image is shot. At this time, as set in step S3, 10000 cd / cm less than ² emission luminance 100 cd / cm ² or more from the light emitting device 111, preferably 500 cd / cm ² or more 10000 cd / cm ² less than the light is emitted continuously . Alternatively, the light is emitted intermittently.

In step S7, a still image is taken. At this time, light having a light emission luminance of 10,000 cd / cm ² or more and 500000 cd / cm ² or less is emitted from the light emitting device 111 in synchronization with the shutter speed of the optical device 112. For example, in synchronization with the shutter speed of the optical device 112, pulsed light emission of 1 / 10,000 second or more and 10 seconds or less is emitted from the light emitting device 111.

  In step S6 or step S7, an end process is performed at the stage where shooting is completed (step S8).

  As described above, it is preferable to change the light emission luminance and the light emission operation from the light emitting device 111 between the moving image shooting and the still image shooting. When capturing moving images, continuous light emission with reduced emission brightness is used to suppress deterioration of the light emitting elements of the light emitting device 111, suppress heat generation from the light emitting device 111, and reduce the burden on the object to be inspected. However, observation over a long time can be facilitated. Further, at the time of shooting a still image, it is possible to obtain a still image with higher image quality by increasing the light emission luminance from the light emitting device 111. In particular, when the emission luminance is low, it is necessary to reduce the resolution in order to increase the sensitivity of the optical device 112. However, by obtaining light emission with extremely high luminance as described above from the light emitting device 111, the resolution is increased. Therefore, it is possible to obtain a still image with a higher resolution.

  The above is the description of the control method example.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 2)
In this embodiment, a structure of a light-emitting panel that can be used for the light-emitting device is described with reference to drawings.

  In one embodiment of the present invention, a light-emitting element that is a surface light source is used for the light-emitting panel. For example, when an organic EL element is used, an element having a small thickness and a large area can be easily formed. In the case of emitting the same light amount, the surface light source can reduce the light amount per unit area or the light emission time compared to the point light source or the line light source. Thereby, the emitted-heat amount per unit area can be reduced. Moreover, since the light emission area is large, it is easy to radiate heat. Therefore, deterioration due to local heat generation of the light-emitting panel can be suppressed. Compared with the case where a light-emitting diode or the like using an inorganic material is used, a light-emitting device with less deterioration of the light-emitting panel and high reliability can be provided.

  In addition, when an organic EL element is used for the light-emitting panel, the light-emitting panel can be made thinner and lighter than when a conventional xenon lamp or the like is used. Further, since heat generated by light emission is dispersed over a wide area of the light-emitting panel, heat is efficiently radiated. Thereby, the heat storage to a light emission panel is suppressed and deterioration of a light emission panel is suppressed.

  By selecting and using a light-emitting organic compound, the light-emitting panel can be configured to emit white light. For example, a plurality of light-emitting organic compounds that emit complementary colors can be used. Alternatively, a light-emitting organic compound exhibiting red, green, and blue can be used. In addition, various emission spectra can be selected from various organic compounds. Thereby, the light-emitting device excellent in white balance can be obtained.

  When a light-emitting organic compound is used, an emission spectrum that is wider than that of a light-emitting diode using an inorganic material can be obtained. Light having a broad emission spectrum is close to natural light and is suitable for taking photographs.

  Below, the structural example of the light emission panel using an organic EL element as a light emitting element is demonstrated.

[Configuration example 1]
12A is a plan view of a light-emitting panel of one embodiment of the present invention, and FIGS. 12B and 12C are taken along cutting lines X1-Y1 and X2-Y2 in FIG. 12A, respectively. FIG. Note that in FIG. 12A, some components (for example, the partition wall 1205) are not explicitly illustrated for clarity.

  In the light-emitting panel shown in FIG. 12, a light-emitting element 1250 is provided over a supporting substrate 1220 with an insulating film 1224 interposed therebetween. An auxiliary wiring 1206 is provided over the insulating film 1224 and is electrically connected to the first electrode 1201. A part of the auxiliary wiring 1206 is exposed and functions as a terminal. The conductive layer 1210 is electrically connected to the second electrode 1203 and part of the conductive layer 1210 is exposed and functions as a terminal. An end portion of the first electrode 1201 and an end portion of the conductive layer 1210 are covered with a partition wall 1205. A partition wall 1205 is provided to cover the auxiliary wiring 1206 with the first electrode 1201 interposed therebetween. The light-emitting element 1250 is sealed with a support substrate 1220, a sealing substrate 1228, and a sealing material 1227. A light extraction structure 1209 is attached to the surface of the support substrate 1220. By using flexible substrates for the supporting substrate 1220 and the sealing substrate 1228, a flexible light-emitting panel can be realized.

  The light-emitting element 1250 is an organic EL element having a bottom emission structure. Specifically, the light-emitting element 1250 includes a first electrode 1201 that transmits visible light over a supporting substrate 1220 and an EL layer 1202 over the first electrode 1201. The EL layer 1202 includes a second electrode 1203 that reflects visible light.

  As the light extraction structure 1209, for example, a hemispherical lens, a microlens array, a film with a concavo-convex structure, a light diffusion film, or the like can be used. For example, the light extraction structure 1209 can be formed by adhering the lens or film on the support substrate 1220 using the support substrate 1220 or an adhesive having a refractive index similar to that of the lens or film. .

  Here, when a light-emitting panel having flexibility is manufactured, a method for forming a light-emitting element over a flexible substrate is, for example, a method in which a light-emitting element is directly formed over a flexible substrate. After the light-emitting element is formed over a substrate having high heat resistance (hereinafter referred to as a manufacturing substrate) that is different from the method 1 and the flexible substrate, the manufacturing substrate and the light-emitting element are peeled off to be flexible. And a second method of transferring the light emitting element to the substrate having

  For example, when a substrate having heat resistance with respect to a temperature applied in a manufacturing process of a light-emitting element, such as a glass substrate thin enough to have flexibility, the process is performed using the first method. This is preferable because it is simplified.

  In addition, by applying the second method, an insulating film having low water permeability formed over a manufacturing substrate can be transferred to a flexible substrate. Therefore, even when an organic resin or the like with high water permeability and low heat resistance is used as a material for a flexible substrate, a light-emitting panel having flexibility and high reliability can be manufactured.

[Configuration example 2]
13A is a plan view of a light-emitting panel of one embodiment of the present invention, and FIGS. 13B and 13C are cross-sectional schematic views taken along a cutting line X3-Y3 in FIG. is there. Note that in FIG. 13A, some components (for example, the partition wall 1205) are not explicitly illustrated for clarity.

  The light-emitting panel illustrated in FIG. 13 is different from Configuration Example 1 in that an opening is provided in part. Here, the differences will be described in detail, and the configuration example 2 will be referred to for the common points.

  As shown in FIGS. 13B and 13C, the light-emitting panel preferably includes a sealing material 1226 so that the electrode and the EL layer are not exposed in the opening. Specifically, after a part of the light-emitting panel is opened, a sealing material 1226 may be formed so as to cover at least the exposed electrode and the EL layer. A material similar to that of the sealing material 1227 can be used for the sealing material 1226, and the same material or different materials may be used.

  FIG. 13B illustrates an example in which a position where the partition wall 1205 is not formed is opened, and FIG. 13C illustrates an example in which a position where the partition wall 1205 is formed is opened.

  A light extraction structure may be provided on the surface of the substrate.

  By manufacturing such a light-emitting panel and providing the opening at a position overlapping with the optical device 112 and the hole 114 exemplified in Embodiment 1, the endoscope apparatus having the distal end portion 110 exemplified in FIG. Applicable. In addition, by changing the shape or the like of the opening, a light-emitting device having a mesh shape as illustrated in FIG. 4C can be realized.

[Configuration example 3]
FIG. 14A is a cross-sectional view of a light-emitting panel exemplified below. The light-emitting panel illustrated in FIG. 14A is a top-emission type light-emitting panel.

  14A includes a flexible substrate 420, an adhesive layer 422, an insulating film 424, a conductive layer 408, an insulating film 405, an organic EL element 450 (a first electrode 401, an EL layer 402, and a first electrode 2 403), a conductive layer 410, an adhesive layer 407, a flexible substrate 428, and a light extraction structure 409. The second electrode 403, the adhesive layer 407, the flexible substrate 428, and the light extraction structure 409 transmit visible light.

  An organic EL element 450 is provided over the flexible substrate 420 with an adhesive layer 422 and an insulating film 424 interposed therebetween. The organic EL element 450 is sealed with the flexible substrate 420, the adhesive layer 407, and the flexible substrate 428. The organic EL element 450 includes a first electrode 401, an EL layer 402 on the first electrode 401, and a second electrode 403 on the EL layer 402. The first electrode 401 preferably reflects visible light. A light extraction structure 409 is bonded to the surface of the flexible substrate 428.

  End portions of the first electrode 401 and the conductive layer 410 are covered with an insulating film 405. The conductive layer 410 can be formed using the same process and material as the first electrode 401 and is electrically connected to the second electrode 403.

  The conductive layer 408 over the insulating film 405 functions as an auxiliary wiring and is electrically connected to the second electrode 403. The conductive layer 408 may be provided over the second electrode 403. Further, similarly to the structure example 1, an auxiliary wiring which is electrically connected to the first electrode 401 may be provided.

[Configuration Example 4]
FIG. 14B is a cross-sectional view of a light-emitting panel exemplified below. The light-emitting panel illustrated in FIG. 14B is a double-sided light-emitting panel.

  The light-emitting panel illustrated in FIG. 14B is mainly different from the above structural example 3 in that it includes a conductive layer 419 and a light extraction structure 409 is provided on a flexible substrate 420. Is different. In addition to the above, the first electrode 401, the insulating film 424, the adhesive layer 422, and the flexible substrate 420 transmit visible light.

  The conductive layer 419 is provided over the first electrode 401. The conductive layer 410 can be formed using the same process and the same material as the conductive layer 419. The conductive layer 419 functions as an auxiliary wiring and is electrically connected to the first electrode 401. As shown in FIG. 14B, it is preferable to provide the conductive layer 419 so as to overlap with the insulating film 405 because reduction of the light-emitting area can be suppressed.

[Light-emitting panel materials]
Examples of materials that can be used for the light-emitting panel of one embodiment of the present invention are described below.

〔substrate〕
For the substrate from which light from the light-emitting element is extracted, a material that transmits the light is used. For example, materials such as glass, quartz, ceramic, sapphire, and organic resin can be used.

  By using a thin substrate, the light-emitting panel can be reduced in weight and thickness. In addition, a flexible light-emitting panel can be realized by using a substrate having a thickness that has flexibility.

  As the glass, for example, alkali-free glass, barium borosilicate glass, alumino borosilicate glass, or the like can be used.

  Examples of the material having flexibility and transparency to visible light include, for example, glass having a thickness having flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and polyacrylonitrile resin. , Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin and the like. In particular, it is preferable to use a material having a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, or the like can be suitably used. Further, a substrate in which glass fiber is impregnated with an organic resin, or a substrate in which an inorganic filler is mixed with an organic resin to reduce the thermal expansion coefficient can be used. Since a substrate using such a material is light in weight, a light-emitting panel using the substrate can also be reduced in weight.

  Further, since the substrate on the side from which light emission is not extracted does not have to be light-transmitting, a metal substrate using a metal material or an alloy material can be used in addition to the above-described substrates. Metal materials and alloy materials are preferable because they have high thermal conductivity and can easily conduct heat to the entire sealing substrate, which can suppress a local temperature increase of the light-emitting panel. In order to obtain flexibility and bendability, the thickness of the metal substrate is preferably 10 μm to 200 μm, and more preferably 20 μm to 50 μm.

  Although there is no limitation in particular as a material which comprises a metal substrate, For example, aluminum, copper, nickel, metal alloys, such as aluminum alloy or stainless steel, etc. can be used suitably.

  Alternatively, a substrate that has been subjected to an insulation treatment by oxidizing the surface of the conductive substrate or forming an insulating film on the surface may be used. For example, the insulating film may be formed by using a coating method such as a spin coating method or a dip method, an electrodeposition method, a vapor deposition method, or a sputtering method, or it is left in an oxygen atmosphere or heated, or an anodic oxidation method. For example, an oxide film may be formed on the surface of the substrate.

  As a flexible substrate, a layer using the above material is a hard coat layer (for example, a silicon nitride layer) that protects the surface of the light-emitting panel from scratches, or a layer of a material that can disperse pressure (for example, An aramid resin layer etc.) etc. may be laminated | stacked and comprised. In order to suppress a decrease in the lifetime of the light-emitting element due to moisture or the like, water permeability such as a film containing nitrogen and silicon such as a silicon nitride film or a silicon oxynitride film, or a film containing nitrogen and aluminum such as an aluminum nitride film An insulating film with low property may be included.

  The substrate can be used by stacking a plurality of layers. In particular, when the glass layer is used, the barrier property against water and oxygen can be improved and a highly reliable light-emitting panel can be obtained.

  For example, a substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side close to the light-emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. The glass layer having such a thickness can simultaneously realize a high barrier property and flexibility against water and oxygen. The thickness of the organic resin layer is 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer outside the glass layer, it is possible to suppress breakage and cracking of the glass layer and improve mechanical strength. By applying such a composite material of a glass material and an organic resin to a substrate, a highly reliable flexible light-emitting panel can be obtained.

[Insulating film]
An insulating film may be formed between the support substrate and the light emitting element. As the insulating film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a silicon nitride oxide film can be used. In particular, an insulating film with low water permeability such as a silicon oxide film, a silicon nitride film, or an aluminum oxide film is preferably used in order to suppress moisture and the like from entering the light-emitting element. An insulating film that covers the light-emitting element may be provided for the same purpose or material.

[Partition wall]
An organic resin or an inorganic insulating material can be used for the partition wall. As the organic resin, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, phenol resin, or the like can be used. As the inorganic insulating material, silicon oxide, silicon oxynitride, or the like can be used. In particular, a photosensitive resin is preferably used because the partition wall can be easily manufactured.

  The method for forming the partition wall is not particularly limited, and for example, a photolithography method, a sputtering method, a vapor deposition method, a droplet discharge method (inkjet method or the like), a printing method (screen printing, offset printing, or the like) may be used.

[Auxiliary wiring]
The auxiliary wiring is not necessarily provided, but is preferably provided because a voltage drop caused by the resistance of the electrode can be suppressed.

  Auxiliary wiring materials are copper (Cu), titanium (Ti), tantalum (Ta), tungsten (W), molybdenum (Mo), chromium (Cr), neodymium (Nd), scandium (Sc), nickel (Ni) , Or an alloy material containing these as a main component, and a single layer or a stacked layer. In addition, aluminum can be used as a material for the auxiliary wiring. In that case, a laminated structure may be used so as not to cause a corrosion problem, and aluminum may be used for a layer that is not in contact with ITO or the like. The thickness of the auxiliary wiring can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.5 μm or less.

(Encapsulant)
The sealing method of the light emitting panel is not limited, and may be solid sealing or hollow sealing, for example. For example, a glass material such as a glass frit, a resin material such as a two-component mixed resin, a curable resin that cures at room temperature, a photocurable resin, or a thermosetting resin can be used. The light-emitting panel may be filled with an inert gas such as nitrogen or argon. PVC (polyvinyl chloride) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB (polyvinyl butyral) resin, EVA ( It may be filled with a resin such as (ethylene vinyl acetate) resin. Moreover, the desiccant may be contained in resin.

  The above is the description of the material of the light-emitting panel.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 3)
In this embodiment, a light-emitting element that can be used for the light-emitting device of one embodiment of the present invention will be described with reference to FIGS.

[Configuration example of light emitting element]
A light-emitting element illustrated in FIG. 15A includes an EL layer 203 between the first electrode 201 and the second electrode 205. In this embodiment mode, the first electrode 201 functions as an anode and the second electrode 205 functions as a cathode.

  When a voltage higher than the threshold voltage of the light-emitting element is applied between the first electrode 201 and the second electrode 205, holes are injected from the first electrode 201 side into the EL layer 203, and the second electrode 205 side From which electrons are injected. The injected electrons and holes are recombined in the EL layer 203, and the light-emitting substance contained in the EL layer 203 emits light.

  The EL layer 203 includes at least a light-emitting layer 303 containing a light-emitting substance.

  The EL layer 203 is a layer other than the light-emitting layer, such as a substance having a high hole-injecting property, a substance having a high hole-transporting property, a substance having a high electron-transporting property, a substance having a high electron-injecting property, or a bipolar substance ( A layer including a substance having a high electron transporting property and a high hole transporting property may be further included. Either a low molecular compound or a high molecular compound can be used for the EL layer 203, and an inorganic compound may be included.

  A light-emitting element illustrated in FIG. 15B includes an EL layer 203 between a first electrode 201 and a second electrode 205. The EL layer 203 includes a hole-injection layer 301, a hole-transport layer 302, The light emitting layer 303, the electron transport layer 304, and the electron injection layer 305 are stacked in this order from the first electrode 201 side.

  As in the light-emitting element illustrated in FIGS. 15C and 15D, a plurality of EL layers may be stacked between the first electrode 201 and the second electrode 205. In this case, an intermediate layer 207 is preferably provided between the stacked EL layers. The intermediate layer 207 has at least a charge generation region.

  For example, the light-emitting element illustrated in FIG. 15C includes the intermediate layer 207 between the first EL layer 203a and the second EL layer 203b. In addition, the light-emitting element illustrated in FIG. 15D includes n EL layers (n is a natural number of 2 or more), and includes an intermediate layer 207 between the EL layers.

  The behavior of electrons and holes in the intermediate layer 207 provided between the EL layer 203 (m) and the EL layer 203 (m + 1) will be described. When a voltage higher than the threshold voltage of the light-emitting element is applied between the first electrode 201 and the second electrode 205, holes and electrons are generated in the intermediate layer 207, and the holes are provided on the second electrode 205 side. The electron moves to the EL layer 203 (m + 1), and the electrons move to the EL layer 203 (m) provided on the first electrode 201 side. The holes injected into the EL layer 203 (m + 1) recombine with electrons injected from the second electrode 205 side, and the light-emitting substance contained in the EL layer 203 (m + 1) emits light. Further, electrons injected into the EL layer 203 (m) recombine with holes injected from the first electrode 201 side, so that a light-emitting substance contained in the EL layer 203 (m) emits light. Accordingly, holes and electrons generated in the intermediate layer 207 emit light in different EL layers.

  When the same structure as the intermediate layer is formed between the EL layers in contact with each other, the EL layers can be provided in contact with each other without using the intermediate layer. For example, in the case where a charge generation region is formed on one surface of the EL layer, the EL layer can be provided in contact with the surface.

  Further, by making the emission colors of the respective EL layers different, light emission of a desired color can be obtained as the entire light emitting element. For example, in a light-emitting element having two EL layers, a light-emitting element that emits white light as a whole of the light-emitting element by making the light emission color of the first EL layer and the light emission color of the second EL layer complementary colors It is also possible to obtain The same applies to a light-emitting element having three or more EL layers.

[Material of light-emitting element]
Examples of materials that can be used for each layer are shown below. Each layer is not limited to a single layer, and two or more layers may be stacked.

〔anode〕
The electrode functioning as the anode (first electrode 201) can be formed using one or more kinds of conductive metals, alloys, conductive compounds, and the like. In particular, it is preferable to use a material having a large work function (4.0 eV or more). For example, indium tin oxide (ITO), indium tin oxide containing silicon or silicon oxide, indium zinc oxide, indium oxide containing tungsten oxide and zinc oxide, graphene, gold, platinum, nickel, Tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, a nitride of a metal material (for example, titanium nitride), or the like can be given.

  Note that when the anode is in contact with the charge generation region, various conductive materials can be used without considering the magnitude of the work function. For example, aluminum, silver, an alloy containing aluminum, or the like can also be used. .

〔cathode〕
The electrode functioning as the cathode (second electrode 205) can be formed using one or more kinds of conductive metals, alloys, conductive compounds, and the like. In particular, it is preferable to use a material having a small work function (3.8 eV or less). For example, elements belonging to Group 1 or Group 2 of the periodic table (for example, alkali metals such as lithium and cesium, alkaline earth metals such as calcium and strontium, magnesium, etc.), alloys containing these elements (for example, Mg -Ag, Al-Li), rare earth metals such as europium and ytterbium, alloys containing these rare earth metals, aluminum, silver, and the like can be used.

  Note that when the cathode is in contact with the charge generation region, various conductive materials can be used without considering the magnitude of the work function. For example, indium tin oxide containing ITO, silicon, or silicon oxide can be used.

  The electrodes may be formed using a vacuum deposition method or a sputtering method, respectively. In addition, when silver paste or the like is used, a coating method or an ink jet method may be used.

[Hole Injection Layer 301]
The hole injection layer 301 is a layer including a substance having a high hole injection property.

Examples of the substance having a high hole-injecting property include metal oxides such as molybdenum oxide, vanadium oxide, ruthenium oxide, tungsten oxide, and manganese oxide, phthalocyanine (abbreviation: H ₂ Pc), copper (II) A phthalocyanine-based compound such as phthalocyanine (abbreviation: CuPc) can be used.

  In addition, polymer compounds such as poly (N-vinylcarbazole) (abbreviation: PVK) and poly (4-vinyltriphenylamine) (abbreviation: PVTPA), poly (3,4-ethylenedioxythiophene) / poly ( A polymer compound to which an acid such as styrene sulfonic acid (PEDOT / PSS) is added can be used.

  The hole injection layer 301 may be used as a charge generation region. When the hole injection layer 301 in contact with the anode is a charge generation region, various conductive materials can be used for the anode without considering the work function. The material constituting the charge generation region will be described later.

[Hole transport layer 302]
The hole-transport layer 302 is a layer that contains a substance having a high hole-transport property.

The substance having a high hole transporting property may be a substance having a hole transporting property higher than that of electrons, and is particularly preferably a substance having a hole mobility of 10 ⁻⁶ cm ² / Vs or more. For example, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (abbreviation: NPB or α-NPD), 4-phenyl-4 ′-(9-phenylfluoren-9-yl) Aromatic amine compounds such as triphenylamine (abbreviation: BPAFLP), 4,4′-di (N-carbazolyl) biphenyl (abbreviation: CBP), 9- [4- (10-phenyl-9-anthryl) phenyl]- Carbazole derivatives such as 9H-carbazole (abbreviation: CzPA), 9-phenyl-3- [4- (10-phenyl-9-anthryl) phenyl] -9H-carbazole (abbreviation: PCzPA), 2-tert-butyl-9 , 10-di (2-naphthyl) anthracene (abbreviation: t-BuDNA), 9,10-di (2-naphthyl) anthracene (abbreviation: DNA), 9,10- Phenyl anthracene (abbreviation: DPAnth) aromatic such as hydrocarbon compounds, PVK, polymer compounds such as PVTPA like, can be used various compounds.

[Light emitting layer 303]
The light-emitting layer 303 can be formed using a fluorescent compound that emits fluorescence or a phosphorescent compound that emits phosphorescence.

  As a fluorescent compound that can be used for the light-emitting layer 303, for example, N, N′-bis [4- (9H-carbazol-9-yl) phenyl] -N, N′-diphenylstilbene-4,4′- Examples include diamine (abbreviation: YGA2S), N- (9,10-diphenyl-2-anthryl) -N, 9-diphenyl-9H-carbazol-3-amine (abbreviation: 2PCAPA), rubrene, and the like.

As a phosphorescent compound that can be used for the light-emitting layer 303, for example, bis [2- (4 ′, 6′-difluorophenyl) pyridinato-N, C ^{2 ′} ] iridium (III) picolinate (abbreviation: FIrpic) , Tris (2-phenylpyridinato-N, C ^{2 ′} ) iridium (III) (abbreviation: Ir (ppy) ₃ ), (acetylacetonato) bis (3,5-dimethyl-2-phenylpyrazinato) And organometallic complexes such as iridium (III) (abbreviation: Ir (mppr-Me) ₂ (acac)).

  Note that the light-emitting layer 303 may have a structure in which the above-described light-emitting organic compound (light-emitting substance or guest material) is dispersed in another substance (host material). Various host materials can be used, and it is preferable to use a substance having a lowest lowest orbital level (LUMO level) and a lower highest occupied orbital level (HOMO level) than the guest material. .

  With the structure in which the guest material is dispersed in the host material, crystallization of the light-emitting layer 303 can be suppressed. Further, concentration quenching due to the high concentration of the guest material can be suppressed.

  As the host material, the above-described substance having a high hole transporting property (for example, an aromatic amine compound or a carbazole derivative), a substance having a high electron transporting property described later (for example, a metal complex having a quinoline skeleton or a benzoquinoline skeleton, A metal complex having an oxazole-based ligand or a thiazole-based ligand) can be used. Specifically, metals such as tris (8-quinolinolato) aluminum (III) (abbreviation: Alq), bis (2-methyl-8-quinolinolato) (4-phenylphenolato) aluminum (III) (abbreviation: BAlq) Complex, 3- (4-biphenylyl) -4-phenyl-5- (4-tert-butylphenyl) -1,2,4-triazole (abbreviation: TAZ), bathophenanthroline (abbreviation: BPhen), bathocuproin (abbreviation: Heterocyclic compounds such as BCP), condensed aromatic compounds such as CzPA, DNA, t-BuDNA, and DPAnth, aromatic amine compounds such as NPB, and the like can be used.

  A plurality of types of host materials can be used. For example, a substance that suppresses crystallization, such as rubrene, may be further added to suppress crystallization. Further, NPB, Alq, or the like may be further added in order to perform energy transfer to the guest material more efficiently.

  In addition, by providing a plurality of light-emitting layers and making each layer have a different emission color, light emission of a desired color can be obtained as the entire light-emitting element. For example, in a light-emitting element having two light-emitting layers, a light-emitting element that emits white light as a whole of the light-emitting element by making the light emission color of the first light-emitting layer and the light emission color of the second light-emitting layer have a complementary relationship It is also possible to obtain The same applies to a light-emitting element having three or more light-emitting layers.

[Electron transport layer 304]
The electron transport layer 304 is a layer containing a substance having a high electron transport property.

The substance having a high electron transporting property may be an organic compound having a higher electron transporting property than holes, and is particularly preferably a substance having an electron mobility of 10 ⁻⁶ cm ² / Vs or more.

As a substance having a high electron transporting property, for example, Alq, BAlq, or a metal complex having a quinoline skeleton or a benzoquinoline skeleton, bis [2- (2-hydroxyphenyl) benzoxazolate] zinc (abbreviation: Zn ( BOX) ₂ ), bis [2- (2-hydroxyphenyl) benzothiazolate] zinc (abbreviation: Zn (BTZ) ₂ ) and other metal complexes having an oxazole-based or thiazole-based ligand can be used. Also, TAZ, BPhen, BCP, etc. can be used.

[Electron injection layer 305]
The electron injection layer 305 is a layer containing a substance having a high electron injection property.

  As a substance having a high electron-injecting property, for example, an alkali metal such as lithium, cesium, calcium, lithium fluoride, cesium fluoride, calcium fluoride, or lithium oxide, or an alkaline earth metal, or a compound thereof is used. Can do. Alternatively, a rare earth metal compound such as erbium fluoride can be used. In addition, a substance constituting the electron transport layer 304 described above can be used.

[Charge generation area]
The charge generation region has a structure in which an electron acceptor (acceptor) is added to an organic compound having a high hole transporting property, and an electron donor (donor) is added to an organic compound having a high electron transporting property. There may be. Moreover, both these structures may be laminated | stacked.

  Examples of the organic compound having a high hole-transport property include materials that can be used for the above-described hole-transport layer. Examples of the organic compound having a high electron-transport property include, for example, the above-described electron-transport layer. Possible materials are listed.

  Examples of the electron acceptor include 7,7,8,8-tetracyano-2,3,5,6-tetrafluoroquinodimethane (abbreviation: F4-TCNQ), chloranil, and the like. Moreover, a transition metal oxide can be mentioned. In addition, oxides of metals belonging to Groups 4 to 8 in the periodic table can be given. Specifically, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, molybdenum oxide, tungsten oxide, manganese oxide, and rhenium oxide are preferable because of their high electron accepting properties. Among these, molybdenum oxide is especially preferable because it is stable in the air, has a low hygroscopic property, and is easy to handle.

  As the electron donor, an alkali metal, an alkaline earth metal, a rare earth metal, a metal belonging to Group 13 of the periodic table, or an oxide or carbonate thereof can be used. Specifically, lithium, cesium, magnesium, calcium, ytterbium, indium, lithium oxide, cesium carbonate, or the like is preferably used. An organic compound such as tetrathianaphthacene may be used as an electron donor.

  Note that the above-described layers constituting the EL layer 203 and the intermediate layer 207 can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an ink jet method, or a coating method.

  The above is the description on the material of the light-emitting element.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

  In this example, a light-emitting panel of one embodiment of the present invention was manufactured.

  FIG. 16A is a plan view of the light-emitting panel manufactured in this example, and FIG. 17 is a cross-sectional view taken along the dashed-dotted line X1-Y1 in FIG. Note that in FIG. 16A, part of the structure of the light-emitting panel is omitted.

  As shown in FIG. 17, in the light-emitting panel of this example, a light-emitting element 1250 is provided on a support substrate 1229 having a light extraction structure with an insulating film 1224 interposed therebetween. An auxiliary wiring 1206 is provided over the insulating film 1224 and is electrically connected to the first electrode 1201. A part of the auxiliary wiring 1206 is exposed and functions as a terminal. The conductive layer 1210 is electrically connected to the second electrode 1203. An end portion of the first electrode 1201 and an end portion of the conductive layer 1210 are covered with a partition wall 1205. A partition wall 1205 is provided to cover the auxiliary wiring 1206 with the first electrode 1201 interposed therebetween. The light-emitting element 1250 is sealed with a support substrate 1229, a sealing substrate 1228, and a sealing material 1227.

  In the light-emitting panel of this example, a polyester resin diffusion film was used as the support substrate 1229, and a substrate having a thin glass layer and a polyethylene terephthalate (PET) layer was used as the sealing substrate 1228. These substrates have flexibility, and the light-emitting panel of this embodiment is a flexible light-emitting panel. Further, the area of the light emitting region in the light emitting panel of this example is 56 mm × 42 mm.

  The light-emitting element 1250 is an organic EL element having a bottom emission structure. Specifically, the light-emitting element 1250 includes a first electrode 1201 that transmits visible light over a supporting substrate 1229 and an EL layer 1202 over the first electrode 1201. The EL layer 1202 includes a second electrode 1203 that reflects visible light.

  A method for manufacturing the light-emitting panel of this example will be described.

  First, a base film, a peeling layer (tungsten film), and a layer to be peeled were formed in this order on a glass substrate which is a manufacturing substrate. In this embodiment, the layer to be peeled includes an insulating film 1224, an auxiliary wiring 1206, a first electrode 1201, and a partition wall 1205.

  A total of seven auxiliary wirings 1206 were formed on the insulating film 1224. At this time, the pitch of the auxiliary wiring 1206 was set to 5.3 mm, and the width L2 was set to 322 μm. As the first electrode 1201, an indium tin oxide (ITSO) film containing silicon oxide was formed. A total of seven partition walls 1205 covering the auxiliary wiring 1206 were formed so that the width L1 was 330 μm.

  Next, the temporary support substrate and the first electrode 1201 were bonded using a peeling adhesive, and the layer to be peeled was peeled from the manufacturing substrate using a peeling layer. Thereby, the layer to be peeled is provided on the temporary support substrate side.

  Subsequently, a support substrate 1229 was attached to the layer to be peeled off from the manufacturing substrate and the insulating film 1224 was exposed using an ultraviolet light curable adhesive. As the support substrate 1229, as described above, a diffusion film of polyester resin was used. Thereafter, the temporary support substrate was peeled off, and the first electrode 1201 was exposed on the support substrate 1229.

  Next, an EL layer 1202 and a second electrode 1203 were formed over the first electrode 1201. The EL layer 1202 includes, from the first electrode 1201 side, a first EL layer having a light emitting layer containing a fluorescent compound that emits blue light, an intermediate layer, and a light emitting layer containing a phosphorescent compound that emits green light. And the 2nd EL layer which has a light emitting layer containing the phosphorescent compound which exhibits red light emission was laminated | stacked in this order. Silver was used for the second electrode 1203.

  Next, a photocurable resin containing zeolite as the sealing material 1227 was applied and cured by irradiation with ultraviolet light. Then, a support substrate 1229 and a substrate having a thin glass layer and a polyethylene terephthalate (PET) layer, which are sealing substrates 1228, were bonded to each other using an ultraviolet light curable adhesive.

  The operating characteristics of the light-emitting panel obtained as described above were measured. The voltage-luminance characteristics of the light-emitting panel at this time are shown as “initial” in the legend of FIG. Further, FIG. 19 shows an emission spectrum of the light-emitting panel. As shown in FIG. 19, the light-emitting panel of this example includes all of light derived from a fluorescent compound that emits blue light, a phosphorescent compound that emits green light, and a phosphorescent compound that emits red light. It was found to show an emission spectrum.

Thereafter, a reliability test of a light-emitting device using the light-emitting panel was performed. As a reliability test, the light emitting panel was made to emit light 3000 times or 10,000 times at intervals. For each light emission, a current of 2 A was passed through the light-emitting panel for 50 milliseconds (ms). The current density of the light emitting element at this time corresponds to 90 mA / cm ² . Further, the light emission interval (non-light emission time) was 10 seconds.

  FIG. 18 shows voltage-luminance characteristics of the light-emitting panel after emitting light 3000 times and after emitting light 10,000 times.

  From FIG. 18, the voltage-luminance characteristics of the light-emitting panel remained almost the same as before the reliability test even after emitting light 10,000 times, and no deterioration of the light-emitting panel was observed. From this, the high reliability of the light emitting panel of this example was shown.

  In this example, it was examined how much current can be passed through an organic EL element that emits white light. The light emitting area of the used organic EL element is 2 mm × 2 mm. For each light emission, a current was passed through the organic EL element for 50 milliseconds (ms).

As a result, a current of 60 mA could be passed through the organic EL element (corresponding to a current density of 1500 mA / cm ² ). However, when a current of 68 mA was passed (corresponding to a current density of 1700 mA / cm ² ), the organic EL element was short-circuited.

This suggests that in the light-emitting device of one embodiment of the present invention to which an organic EL element is applied, the amount of light can be adjusted in a range where the current density is less than 1700 mA / cm ² . From this, it is considered that a large current can be passed through the organic EL element as compared with a light emitting diode using an inorganic material.

  In this example, a light-emitting device of one embodiment of the present invention was manufactured.

  A plan view of the light-emitting panel manufactured in this example is shown in FIG. 16B, a cross-sectional view taken along the alternate long and short dash line X2-Y2 in FIG. 16B is shown in FIG. A cross-sectional view of FIG. Note that in FIG. 16B, part of the structure of the light-emitting panel is omitted.

  In the light-emitting panel of this example, a light-emitting element 1250 is provided over a supporting substrate 1220 with an insulating film 1224 interposed therebetween. An auxiliary wiring 1206 is provided over the insulating film 1224 and is electrically connected to the first electrode 1201. A part of the auxiliary wiring 1206 is exposed and functions as a terminal. An end portion of the first electrode 1201 and an end portion of the conductive layer 1210 are covered with a partition wall 1205. A partition wall 1205 is provided to cover the auxiliary wiring 1206 with the first electrode 1201 interposed therebetween. The light-emitting element 1250 is sealed with a support substrate 1220, a sealing substrate 1228, and a sealing material 1227.

  In the light-emitting panel of this example, a polyester resin diffusion film was used as the support substrate 1220, and a substrate having a thin glass layer and a polyethylene terephthalate (PET) layer was used as the sealing substrate 1228. These substrates have flexibility, and the light-emitting panel of this embodiment is a flexible light-emitting panel. Note that it can be said that the support substrate 1220 of this example has a light extraction structure.

  The light emitting area in the light emitting panel of this example is an area excluding a circular non-light emitting area having a diameter of 20 mm out of 50 mm × 52.9 mm. The non-light emitting region includes an opening of the light emitting panel. The non-light-emitting region does not include the auxiliary wiring 1206 and the first electrode 1201 (see FIG. 20A). Accordingly, when the opening is provided, the first electrode 1201 or the auxiliary wiring 1206 of the light-emitting element 1250 can be prevented from being in contact with the second electrode 1203 and short-circuited.

  The light-emitting element 1250 is an organic EL element having a bottom emission structure. Specifically, the light-emitting element 1250 includes a first electrode 1201 that transmits visible light over a supporting substrate 1220 and an EL layer 1202 over the first electrode 1201. The EL layer 1202 includes a second electrode 1203 that reflects visible light.

  A method for manufacturing the light-emitting panel of this example will be described.

  First, a base film, a peeling layer (tungsten film), and a layer to be peeled were formed in this order on a glass substrate which is a manufacturing substrate. In this embodiment, the layer to be peeled includes an insulating film 1224, an auxiliary wiring 1206, a first electrode 1201, and a partition wall 1205.

  A total of 125 auxiliary wirings 1206 were formed on the insulating film 1224. At this time, the pitch of the auxiliary wiring 1206 was set to 420 μm, and the width L2 was set to 3 μm. As the first electrode 1201, an indium tin oxide (ITSO) film containing silicon oxide was formed. A total of 125 partition walls 1205 covering the auxiliary wiring 1206 were formed so that the width L1 was 6 μm. Since the width of the auxiliary wiring is as thin as 3 μm, the auxiliary wiring is difficult to be visually recognized in the light emitting panel of this embodiment at the time of light emission.

  Next, the temporary support substrate and the first electrode 1201 were bonded using a peeling adhesive, and the layer to be peeled was peeled from the manufacturing substrate using a peeling layer. Thereby, the layer to be peeled is provided on the temporary support substrate side.

  Subsequently, a supporting substrate 1220 was attached to the layer to be peeled off from the manufacturing substrate and the insulating film 1224 was exposed using an ultraviolet light curable adhesive. As the support substrate 1220, as described above, a diffusion film of polyester resin was used. Thereafter, the temporary support substrate was peeled off, and the first electrode 1201 was exposed on the support substrate 1229.

  Next, an EL layer 1202 and a second electrode 1203 were formed over the first electrode 1201. The EL layer 1202 includes, from the first electrode 1201 side, a first EL layer having a light emitting layer containing a fluorescent compound that emits blue light, an intermediate layer, and a light emitting layer containing a phosphorescent compound that emits green light. And a second EL layer having a light-emitting layer containing a phosphorescent compound that emits orange light was stacked in this order. Silver was used for the second electrode 1203.

  Next, an ultraviolet light curable resin containing zeolite as the sealing material 1227 was applied and cured by irradiation with ultraviolet light. Then, a support substrate 1220 and a substrate having a thin glass layer and a polyethylene terephthalate (PET) layer, which are sealing substrates 1228, were bonded to each other using an ultraviolet light curable adhesive.

  Then, a circular opening was provided so as to overlap the non-light emitting region surrounded by the light emitting region. In this example, a part of the light-emitting panel was opened using a laser having a wavelength in the ultraviolet region (UV laser). The means for providing the opening includes not only a laser but also a punch. In the case of opening with a punch or the like, film peeling (particularly film peeling of the EL layer 1202 or the like) may occur when the light-emitting panel is pressurized. Opening with a laser is preferable because film peeling can be suppressed and a highly reliable light-emitting panel can be manufactured.

  And the edge part of the light emission panel exposed by providing an opening part was covered using the ultraviolet light hardening-type adhesive agent, and the sealing material 1226 was provided.

  The operating characteristics of the light-emitting panel obtained as described above were measured. The voltage-luminance characteristics of the light emitting panel at this time are shown as “initial” in the legend of FIG. Further, FIG. 22 shows an emission spectrum of the light-emitting panel. As shown in FIG. 22, the light-emitting panel of this example includes light derived from a fluorescent compound that emits blue light, a phosphorescent compound that emits green light, and a phosphorescent compound that emits orange light. It was found to show an emission spectrum.

Note that the light-emitting panel emits light with a luminance of approximately 100,000 cd / m ^{2 when} a current of 2 A is supplied.

Thereafter, a reliability test of a light-emitting device using the light-emitting panel was performed. As a reliability test, the light emitting panel was made to emit light 50,000 times at intervals. For each light emission, a current of 2 A was passed through the light-emitting panel for 50 milliseconds (ms). At this time, the current density of the light-emitting element corresponds to 87 mA / cm ² . The light emission interval (non-light emission time) was 0.5 seconds (s).

  FIG. 21 shows voltage-luminance characteristics of the light-emitting panel after emitting light for 50,000 times.

  From FIG. 21, the voltage-luminance characteristics of the light-emitting panel remained almost the same as before the reliability test even after emitting light for 50,000 times, and no deterioration of the light-emitting panel was observed. Even if the light-emitting panel blinks 50,000 times at a length of 50 milliseconds and at intervals of 0.5 seconds, the light-emitting panel is actually lit for only about 40 minutes, and the heat generated by light emission is emitted. It was shown that there was little influence on the panel.

  This embodiment can be implemented in combination with any of the embodiments described in this specification as appropriate.

DESCRIPTION OF SYMBOLS 10 Endoscope apparatus 11 Operation part 12 Operation dial 13 Connector 14 Operation button 15 Forceps port 20 Endoscope apparatus 21 Operation part 22 Operation stick 24 Operation button 25 Display part 50 Endoscope apparatus 51 Display part 52 Control part 53 Memory | storage device 54 Operation part 101 Insertion part 110 Tip part 111 Light-emitting device 112 Optical device 113 Transmission path 114 Hole 116 Light-emitting part 117 Transmission path 120 Light 121 Exterior member 122 Tip surface 123 Reflective member 124 Concave lens 125 Area 126 Convex lens 131 Light-emitting device 201 Electrode 203 EL Layer 203a EL layer 203b EL layer 205 Electrode 207 Intermediate layer 301 Hole injection layer 302 Hole transport layer 303 Light emitting layer 304 Electron transport layer 305 Electron injection layer 401 Electrode 402 EL layer 403 Electrode 405 Insulating film 407 Adhesive layer 408 Conductive layer 409 Structure 410 conductive layer 19 conductive layer 420 flexible substrate 422 adhesive layer 424 insulating film 428 flexible substrate 450 organic EL element 1201 electrode 1202 EL layer 1203 electrode 1205 partition 1206 auxiliary wiring 1209 light extraction structure 1210 conductive layer 1220 supporting substrate 1224 insulating film 1226 sealing Stop material 1227 Seal material 1228 Seal substrate 1229 Support substrate 1250 Light emitting element

Claims (6)

An endoscope apparatus having a tube-like insertion portion with a distal end portion,
The tip portion includes a light emitting device and an optical device,
The optical device is disposed on a distal end surface of the distal end portion,
The tip has a light emitting region and a non-light emitting region,
The light emitting device is disposed in the light emitting region;
The light emitting region is provided along the side surface of the tip portion, extending in the extending direction of a tube-like insertion portion provided with the tip portion,
The non-light-emitting region is provided along the side surface of the tip portion, extending in the extending direction of the tube-like insertion portion including the tip portion,
The non-light-emitting region is adjacent to the light-emitting region in the circumferential direction of a tube-shaped insertion portion provided with the tip.
Endoscopic device. In claim 1,
The light emitting device emits surface light;
Endoscopic device. In claim 1 or claim 2,
The optical device is an image sensor or an optical fiber.
Endoscopic device. In any one of Claim 1 thru | or 3,
The light emitting device is provided so as to cover a part of the tip surface of the tip part.
Endoscopic device. In any one of Claims 1 thru | or 4,
A first mode for observing a moving image and a second mode for capturing a still image with respect to an image obtained via the optical device;
When the first mode, the continuous light emission luminance is less than 100 cd / cm ² or more 10000 cd / cm ² light from a light emitting device, or intermittently emitted,
When in the second mode, the light emitting device emits light having a light emission luminance of 10,000 cd / cm ² or more and 500000 cd / cm ² or less in synchronization with the shutter speed.
Endoscopic device. In any one of Claims 1 thru | or 5,
The light emitting device includes a light emitting element including a light emitting organic compound.
Endoscopic device.

Images