JP6464721B2 - Cyanate ester compound, cyanate ester resin, method for producing cyanate ester compound, curable resin composition, cured product thereof, build-up adhesive film, semiconductor sealing material, prepreg, and circuit board - Google Patents

Description

  The present invention is a cyanate ester compound, a cyanate ester resin, a method for producing a cyanate ester compound, and a curing, which has a low dielectric constant and dielectric loss tangent in the obtained cured product and is excellent in heat resistance, heat decomposition resistance, and flame retardancy. The present invention relates to a conductive resin composition, a cured product thereof, a build-up adhesive film, a semiconductor sealing material, a prepreg, and a circuit board.

  In recent years, frequencies used in fields such as the electronics industry, communications, and computers are becoming high frequency regions such as the gigahertz band. A material having a low dielectric constant and a low dielectric loss tangent is required for an insulating layer such as an electrical laminate used in such a high frequency region. For this reason, various low dielectric constant and low dielectric loss tangent resins have been developed.

  Among them, cyanate ester compounds are known to have excellent dielectric constants after curing and dielectric loss tangent. Patent Document 1 describes a bisphenol A-type cyanate ester compound which is a 2,2-bis (4-hydroxyphenyl) propane (bisphenol A) derivative as a representative cyanate ester compound. However, conventional cyanate ester resin compositions containing the above compounds are epoxy resin compositions, polyester resin compositions, phenol resin compositions, polyimide resin compositions, etc. that are generally used as matrix resins for electronic circuit boards. Compared to the above, the dielectric properties in the high frequency region, particularly in the gigahertz band, are excellent, but the dielectric properties have not been able to meet market demands.

  In addition, in recent years, high melting point solder that does not use lead has become mainstream due to environmental regulations and the like, and this lead-free solder has a use temperature of about 20 to 40 ° C. higher than conventional eutectic solder. In addition, due to environmental considerations and disaster prevention reasons, when the cyanate ester resin composition is used for electronic materials, the cured product exhibits higher heat resistance, heat decomposition resistance, and flame retardancy than ever before. It is requested.

JP 2002-69156 A

  Accordingly, the problem to be solved by the present invention is a cyanate ester compound, cyanate ester resin, cyanide having a low dielectric constant and dielectric loss tangent in the obtained cured product, and excellent in heat resistance, heat decomposition resistance, and flame retardancy. It is in providing the manufacturing method of an acid ester compound, curable resin composition, its hardened | cured material, the adhesive film for buildup, a semiconductor sealing material, a prepreg, and a circuit board.

  As a result of intensive studies to solve the above problems, the present inventors have a diarylene [b, d] furan structure, and at least one of the two arylene groups forming the diarylene [b, d] furan structure is naphthylene. A cyanate ester compound having a skeleton and having both a cyanate group on the aromatic ring of the two arylene groups has a low dielectric constant and dielectric loss tangent in the resulting cured product, and has heat resistance and heat decomposition. The present invention has been completed by finding that it has excellent properties and flame retardancy.

  That is, the present invention has a diarylene [b, d] furan structure, and at least one of the two arylene groups forming the diarylene [b, d] furan structure has a naphthylene skeleton, and Each of the two arylene groups relates to a cyanate ester compound having a cyanate group on the aromatic ring.

  The present invention further relates to a cyanate ester resin containing the cyanate ester compound.

  The present invention comprises a step of obtaining a phenol compound by reacting a compound (Q) having a quinone structure in the molecular structure with a compound (P) having a phenolic hydroxyl group in the molecular structure in the presence of an acid catalyst; And a step of reacting the phenol compound obtained in step 1 with cyanogen halide, wherein at least one of the compound (Q) having the quinone structure or the compound (P) having a phenolic hydroxyl group in the molecular structure is intramolecular The present invention relates to a method for producing a cyanate ester compound having a naphthalene ring.

  The present invention further relates to a curable resin composition containing the cyanate ester compound or the cyanate ester resin and a curing accelerator as essential components.

  The present invention further relates to a cured product obtained by curing reaction of the curable resin composition.

  The present invention further relates to a build-up adhesive film obtained by applying the curable resin composition onto a support film and drying it.

  The present invention further includes the curable resin composition and an inorganic filler, and the content of the inorganic filler is in the range of 30 to 95 parts by mass per 100 parts by mass of the curable resin composition. Regarding materials.

  The present invention further relates to a prepreg obtained by semi-curing an impregnated substrate obtained by impregnating a reinforcing substrate with a varnished curable resin composition.

  The present invention further relates to a circuit board obtained by laminating a varnish obtained by diluting the curable resin composition in an organic solvent into a plate shape and laminating it with a copper foil, followed by heating and pressing.

  According to the present invention, the resulting cured product has a low dielectric constant and dielectric loss tangent, and is excellent in heat resistance, heat decomposition resistance, and flame retardancy, and a method for producing a cyanate ester resin and a cyanate ester compound A curable resin composition, a cured product thereof, a build-up adhesive film, a semiconductor sealing material, a prepreg, and a circuit board can be provided.

1 is a GPC chart of a phenol resin (A-1) obtained in Example 1. 2 is a GPC chart of a phenol resin (B-1) obtained in Example 2. 2 is a GPC chart of a phenol resin (C-1) obtained in Example 3.

Hereinafter, the present invention will be described in detail.
The cyanate ester compound of the present invention has a diarylene [b, d] furan structure, and at least one of the arylene groups forming the diarylene [b, d] furan structure has a naphthylene skeleton. In addition, each of the two arylene groups has a cyanate group on the aromatic ring.

  As described above, since the cyanate ester compound of the present invention has a diarylene [b, d] furan structure in the molecular structure, the molecular structure is rigid and has a feature that the aromatic ring concentration is high. As described above, the cyanate ester compound of the present invention has the characteristics that the molecular structure is rigid, the molecular motion is suppressed, and the dielectric constant and dielectric constant of the cured product are low. Furthermore, since the cyanate ester compound of the present invention has a characteristic of high aromatic ring concentration and cyanate group concentration in addition to a rigid molecular structure, it has heat resistance, heat decomposition resistance, and flame retardancy in a cured product. It has excellent characteristics.

  In general, in order to improve the heat resistance of a cured product, a method of polyfunctionalizing an aromatic ring with a nodule group such as formaldehyde is known. However, a compound polyfunctionalized by such a method is aromatic. Since the rings are knotted by only one knot group, the knot group is easily cleaved during combustion, and the flame retardancy is low. On the other hand, the cyanate ester compound of the present invention has a diarylene [b, d] furan structure in which aromatic rings are fixed by two bonds of an ether bond and a direct bond. These bonds that bind to each other are not easily cleaved and exhibit high flame retardancy in the cured product. Furthermore, since at least one of the two arylene groups has a naphthalene skeleton, the aromatic ring concentration is further increased, and the resulting cured product exhibits extremely excellent flame retardancy.

  The cyanate ester compound of the present invention is further excellent in reactivity and excellent in heat resistance, heat decomposition resistance, and flame retardancy in a cured product, and thus has a diarylene [b, d] furan structure, and the diarylene [ b, d] at least one of the two arylene groups forming the furan structure has a naphthylene skeleton, each of the two arylene groups has a cyanate group on its aromatic ring, and Of the two arylene groups, at least one arylene group preferably has a cyanate group at the para position of the carbon atom to which the oxygen atom forming the furan ring is bonded.

  Examples of such a cyanate ester compound include compounds having a molecular structure represented by the following structural formula (I) or the following structural formula (II).

  In formulas (I) and (II), each R1 is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group. It is. Ar1 is a structural moiety represented by the following structural formula (i), and Ar2 is a structural moiety represented by the following structural formula (i) or (ii).

  In formulas (i) and (ii), each R2 is independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group, m is an integer of 0 to 4, and n is an integer of 0 to 3. When m or n is 2 or more, R2 may be the same or different. x and y each represent a bonding point with the naphthalene ring and represent that they are bonded to adjacent carbon atoms of the naphthalene ring so as to form a furan ring with the oxygen atom. In formula (i), R2 and the cyanato group bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring.

  The cyanate ester compounds represented by the structural formulas (I) and (II) include, for example, a compound (Q) having a quinone structure in the molecular structure and a compound (P) having a phenolic hydroxyl group in the molecular structure. In a temperature range of 40 to 180 ° C. under non-catalytic or acid-catalyzed conditions to obtain a phenol compound or phenol resin, and reacting the phenol compound or phenol resin obtained in the above step with cyanogen halide And at least one of the compound (Q) having the quinone structure or the compound (P) having a phenolic hydroxyl group in the molecular structure is a compound having a naphthalene ring in the molecule. It is manufactured by a certain manufacturing method. When the cyanate ester compound of the present invention is produced by such a method, an arbitrary component is selectively produced depending on the reaction conditions, or it is produced as a cyanate ester resin that is a mixture of plural kinds of cyanate ester compounds. I can do it. Moreover, you may isolate and use only arbitrary components from the cyanate ester resin which is a mixture.

  Examples of the compound (Q) having a quinone structure include compounds represented by the following structural formula (Q1) or (Q2).

  In formula (Q1) or (Q2), each R1 is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group. It is.

  Specific examples of the compound represented by the structural formula (Q1) or (Q2) include parabenzoquinone, 2-methylbenzoquinone, 2,3,5-trimethyl-benzoquinone, naphthoquinone, and these benzoquinones and naphthoquinones. Examples thereof include compounds in which one or more alkyl groups having 1 to 4 carbon atoms, alkoxy groups having 1 to 4 carbon atoms, aryl groups, and aralkyl groups are substituted. These may be used alone or in combination of two or more. Among these, naphthoquinone is preferably used because a cyanate ester compound or a cyanate ester resin excellent in heat resistance, heat decomposition resistance, and flame retardancy in the cured product can be obtained.

  Examples of the compound (P) having a phenolic hydroxyl group include compounds represented by the following structural formula (P1) or (P2).

  In formula (P1) or (P2), each R2 is independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group, m Is an integer of 0 to 4, n is an integer of 0 to 3, and p and q are integers of 2 or more. When m or n is 2 or more, R2 may be the same or different. In the formula (P2), the OH group bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring.

  Specific examples of the compound represented by the structural formula (P1) or (P2) include 1,2-dihydroxybenzene, 1,3-dihydroxybenzene, 1,4-dihydroxybenzene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, and these dihydroxybenzenes, alkyl groups having 1 to 4 carbon atoms, carbon atoms Examples include compounds in which one to four alkoxy groups, aryl groups, and aralkyl groups are substituted. These may be used alone or in combination of two or more. Among them, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2, because a cyanate ester compound having excellent heat resistance, heat decomposition resistance, and flame retardancy in a cured product can be obtained. Either 6-dihydroxynaphthalene or 2,7-dihydroxynaphthalene is preferable, and 2,7-dihydroxynaphthalene is particularly preferable.

  The reaction between the compound (Q) having a quinone structure and the compound (P) having a phenolic hydroxyl group proceeds under non-catalytic conditions because of its high reactivity, but is preferably performed using an acid catalyst as appropriate. . Examples of the acid catalyst used here include inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid, organic acids such as methanesulfonic acid, p-toluenesulfonic acid, and oxalic acid, boron trifluoride, anhydrous aluminum chloride, and zinc chloride. And Lewis acid. When these acid catalysts are used, they should be used in an amount of 5.0% by mass or less based on the total mass of the compound (Q) having the quinone structure and the compound (P) having a phenolic hydroxyl group in the molecular structure. Is preferred.

  The reaction is preferably performed under solvent-free conditions, but may be performed in an organic solvent as necessary. Examples of the organic solvent used here include methyl cellosolve, isopropyl alcohol, ethyl cellosolve, toluene, xylene, and methyl isobutyl ketone. When these organic solvents are used, since the reaction efficiency is improved, the organic solvent is used for 100 parts by mass in total of the compound (Q) having a quinone structure and the compound (P) having a phenolic hydroxyl group in the molecular structure. It is preferable to use it in the ratio which becomes the range of 50-200 mass parts.

  After completion of the reaction between the compound (Q) having a quinone structure in the molecular structure and the compound (P) having a phenolic hydroxyl group in the molecular structure, a phenol compound or a phenol resin can be obtained by drying under reduced pressure. I can do it.

  As a phenol compound contained in such a phenol compound or a phenol resin, the compound etc. which are represented with the following structures can be mentioned, for example.

In formulas (a1) to (a4), each R ² is independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group, m is an integer of 0 to 4, and n is an integer of 0 to 3. When m or n is 2 or more, R ² may be the same or different from each other. x and y each represent a bonding point with the naphthalene ring and represent that they are bonded to adjacent carbon atoms of the naphthalene ring so as to form a furan ring with the oxygen atom. In formulas (a1) to (a3), the R ² and OH groups bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring.

  In the reaction, in addition to the compounds represented by the structural formulas (a1) to (a4), for example, compounds represented by the following structural formulas (a1-1) to (a4-1) are generated.

  In formulas (a1-1) to (a4-1), k and i each represent an integer of 1 to 2. x and y each represent a bonding point with the naphthalene ring and represent bonding to adjacent carbons so as to form a furan ring.

  In Structural Formula (a1-1), (a3-1), or (a4-1), k is an integer of 1 to 2. Here, a compound corresponding to the case where the value of k is 1 (hereinafter abbreviated as “binuclear compound (α1)”) reacts with cyanogen halide, whereby the cured product has heat resistance and heat decomposition resistance. And a cyanate ester compound having excellent flame retardancy and dielectric properties. On the other hand, in the compound represented by the structural formula (a1-1), (a3-1), or (a4-1), a compound corresponding to the case where the value of k is 2 (hereinafter referred to as “trinuclear compound (α2 ")" Is abbreviated as "." Since the rigidity of the molecular skeleton is higher and the aromatic ring concentration is higher, it reacts with cyanogen halide to give a cyanate ester compound that is more excellent in heat resistance in the cured product.

  In addition, when a phenol resin contains the binuclear compound (α1) or the trinuclear compound (α2) represented by the structure as described above, the binuclear compound (α1) or the trinuclear compound (α2) In the subsequent cyanate ester resin, the content of the binuclear cyanate ester compound (β1) and the trinuclear cyanate ester compound β2), Approximately the same. Therefore, when it is desired to obtain a cyanate ester resin having excellent heat resistance, heat decomposition resistance, flame retardancy and dielectric properties in a cured product, a dinuclear compound (α1) or a trinuclear compound (α2) contained in a phenol resin. ) Content is important.

  Next, examples of the cyanogen halide to be reacted with the obtained phenol compound or phenol resin include cyanogen chloride and cyanogen bromide. Further, this reaction is preferable because the reaction is promoted by carrying out the reaction under basic catalyst conditions. The basic catalyst used here is, for example, a tertiary amine such as triethylamine or trimethylamine, sodium hydroxide, potassium hydroxide, or the like. And alkali metal hydroxides.

  Specifically, the reaction between the phenol compound or the phenol resin and the cyanogen halide is performed under the condition that the cyanogen halide is excessive with respect to the hydroxyl group contained in the phenol compound or the phenol resin in order to efficiently promote cyanatonation. It is preferable to make it react, specifically, it is preferable to make it react in the ratio from which cyanogen halide will be 1.05-2.5 mol with respect to 1 mol of hydroxyl groups which a phenol compound or a phenol resin contains.

  The reaction of the phenol compound or phenol resin with cyanogen halide is preferably performed by dissolving each raw material component in an organic solvent. Examples of the organic solvent used here include aromatic substances such as benzene, toluene, and xylene. Group compound solvents and ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone.

  After completion of the reaction, an appropriate amount of water is added to the reaction solution to dissolve the produced salt, and washing with water is repeated to remove the produced salt in the system. Subsequently, further purification is performed by dehydration or filtration, and the organic solvent is removed by distillation, whereby a target cyanate ester compound or a cyanate ester resin containing the cyanate ester compound can be obtained.

  Note that the cyanate ester compound of the present invention has a dielectric constant, in any case, as long as it has a structure represented by the general formulas (I) and (II). It has the characteristics of low dielectric loss tangent and excellent heat resistance, heat decomposition resistance, and flame retardancy. Below, the more preferable aspect of the cyanate ester compound which has a structure represented by the said general formula (I) and (II) is demonstrated.

  Specific examples of the cyanate ester compounds represented by the structural formulas (I) and (II) include those having a molecular structure represented by any of the following structural formulas (1) to (4). .

  In formulas (1) to (4), each R2 is independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group, m Is an integer from 0 to 4, and n is an integer from 0 to 3. When m or n is 2 or more, R2 may be the same or different. x and y each represent a bonding point with the naphthalene ring and represent that they are bonded to adjacent carbon atoms of the naphthalene ring so as to form a furan ring with the oxygen atom. In formulas (1) to (3), R2 and the cyanate group bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring.

  Specific examples of the cyanate ester compound represented by the structural formula (1) include cyanate ester compounds represented by the following structural formulas (1-1) to (1-9).

  The cyanate ester compound represented by (1) represented by the structural formulas (1-1) to (1-9) is, for example, parabenzoquinone as the compound (Q) having a quinone structure in the molecular structure. Can be produced by the above-mentioned method using various dihydroxynaphthalenes as the compound (P) having a phenolic hydroxyl group in the molecular structure. At this time, since the reaction ratio of parabenzoquinone and dihydroxynaphthalene can produce the compound represented by the structural formula (1) with high efficiency, the amount of dihydroxynaphthalene is 0.1 to 10.0 mol per 1 mol of parabenzoquinone. It is preferable that it is the ratio used as a range.

  Among the cyanate ester compounds represented by any of the structural formulas (1-1) to (1-9), the structural formula is superior in heat resistance, heat decomposition resistance, and flame retardancy in a cured product. The compound represented by (1-8) or (1-9) is preferred. That is, a cyanate ester compound obtained by using 2,7-dihydroxynaphthalene as the compound (P) having a phenolic hydroxyl group in the molecular structure is preferable.

  The cyanate ester resin containing the cyanate ester compound represented by the structural formula (1) may further contain other cyanate ester compounds. Among these, it is preferable to contain a polyfunctional compound represented by the following structural formula (1 ′) because it becomes a cyanate ester resin having high heat resistance.

  In the formula (1 ′), k is an integer of 1 to 2. Moreover, the cyanate group couple | bonded with a naphthalene ring may be couple | bonded with any aromatic ring among the aromatic rings which comprise a naphthalene ring.

  In this case, the content of each component in the cyanate ester resin is such that the content of the dinaphtho [b, d] furan compound represented by the structural formula (1) is in the range of 5 to 60% in terms of area ratio in GPC measurement. And the content of the polyfunctional compound represented by the structural formula (1 ′) is preferably in the range of 10 to 70% in terms of area ratio in GPC measurement.

In the present invention, the content of each component in the cyanate ester resin is the ratio of the peak area of each component to the total peak area of the cyanate ester resin, calculated from GPC measurement data under the following conditions. is there.
<GPC measurement conditions>
Measuring device: “HLC-8220 GPC” manufactured by Tosoh Corporation
Column: Guard column “HXL-L” manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ Tosoh Corporation “TSK-GEL G3000HXL”
+ Tosoh Corporation “TSK-GEL G4000HXL”
Detector: RI (differential refractometer)
Data processing: “GPC-8020 Model II version 4.10” manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40 ° C
Developing solvent Tetrahydrofuran
Flow rate: 1.0 ml / min Standard: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of “GPC-8020 Model II version 4.10”.
(Used polystyrene)
“A-500” manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
“F-1” manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
“F-4” manufactured by Tosoh Corporation
“F-10” manufactured by Tosoh Corporation
“F-20” manufactured by Tosoh Corporation
“F-40” manufactured by Tosoh Corporation
“F-80” manufactured by Tosoh Corporation
“F-128” manufactured by Tosoh Corporation
Sample: A 1.0 mass% tetrahydrofuran solution filtered in terms of resin solids and filtered through a microfilter (50 μl).

  More specifically, examples of the cyanate ester compound represented by the structural formula (2) include a cyanate ester compound represented by any one of the following structural formulas (2-1) to (2-9). It is done.

  The cyanate ester compound represented by the structural formula (2) represented by the structural formulas (2-1) to (2-9) is, for example, as the compound (Q) having a quinone structure in the molecular structure. 2,3,5-Trimethyl-parabenzoquinone can be produced by the above-described method using various dihydroxynaphthalenes as the compound (P) having a phenolic hydroxyl group in the molecular structure. At this time, since the reaction ratio of 2,3,5-trimethyl-parabenzoquinone and dihydroxynaphthalene can produce the compound represented by the structural formula (2) with high efficiency, 2,3,5-trimethyl-parabenzoquinone 1 It is preferable that the ratio of dihydroxynaphthalene is in the range of 0.1 to 10.0 moles per mole.

  Among the cyanate ester compounds represented by any of the structural formulas (2-1) to (2-9), the structural formula is superior in heat resistance, thermal decomposition resistance, and flame retardancy in a cured product. The compound represented by (2-8) or (2-9) is preferred. That is, a cyanate ester compound obtained by using 2,7-dihydroxynaphthalene as the compound (P) having a phenolic hydroxyl group in the molecular structure is preferable.

  The cyanate ester resin containing the cyanate ester compound represented by the structural formula (2) may further contain other cyanate ester compounds. Especially, since it becomes cyanate ester resin with high heat resistance, it is preferable to contain the polyfunctional compound represented by following Structural formula (2 ').

  In formula (2 ′), the cyanate group bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring.

  In this case, the content of each component in the cyanate ester resin is such that the content of the dinaphtho [b, d] furan compound represented by the structural formula (2) is in the range of 50 to 95% in terms of area ratio in GPC measurement. And the content of the polyfunctional compound represented by the structural formula (2 ′) is preferably in the range of 1 to 50% in terms of area ratio in GPC measurement.

  More specifically, the cyanate ester compound represented by the structural formula (3) includes a cyanate ester compound represented by any one of the following structural formulas (3-1) to (3-9). It is done.

  The cyanate ester compound represented by the structural formula (3) represented by the structural formulas (3-1) to (3-9) is, for example, as the compound (Q) having a quinone structure in the molecular structure. 1,4-Naphthoquinone can be produced by the above-described method using various dihydroxynaphthalenes as the compound (P) having a phenolic hydroxyl group in the molecular structure. At this time, since the reaction rate of 1,4-naphthoquinone and dihydroxynaphthalene can produce the compound represented by the structural formula (1) with high efficiency, the amount of dihydroxynaphthalene is 0.1 with respect to 1 mol of 1,4-naphthoquinone. The ratio is preferably in the range of ˜10.0 mol.

  Among the cyanate ester compounds represented by any one of the structural formulas (3-1) to (3-9), the structural formula is superior in heat resistance, thermal decomposition resistance, and flame retardancy in a cured product. The compound represented by (3-8) or (3-9) is preferable. That is, a cyanate ester compound obtained by using 2,7-dihydroxynaphthalene as the compound (P) having a phenolic hydroxyl group in the molecular structure is preferable.

  The cyanate ester resin containing the cyanate ester compound represented by the structural formula (3) may contain other cyanate ester compounds other than these. When the cyanate ester resin contains other cyanate ester compounds other than the dinaphtho [b, d] furan compound represented by the structural formula (3), it is represented by the structural formula (3) in the cyanate ester resin. The content of the dinaphtho [b, d] furan compound is preferably in the range of 5 to 70% in terms of area ratio in GPC measurement.

  Specific examples of other cyanate ester compounds are preferably polyfunctional compounds represented by the following structural formula (3 ′) or (3 ″) because they are cyanate ester resins having high heat resistance.

  In the formulas (3 ′) to (3 ″), k is an integer of 1 to 2. In the formula (3 ″), x and y represent points of attachment to the naphthalene ring, and are mutually connected to form a furan ring. Bond to adjacent carbon.

  When the cyanate ester resin contains the polyfunctional compound represented by the structural formula (3 ′), the content is preferably in the range of 2 to 60% in terms of area ratio in GPC measurement. Moreover, when the cyanate ester resin contains the polyfunctional compound represented by the structural formula (3 ″), the content is preferably in the range of 2 to 40% in terms of area ratio in GPC measurement.

  More specifically, the cyanate ester compound represented by the structural formula (4) includes a cyanate ester compound represented by any one of the following structural formulas (4-1) to (4-4). It is done.

  The cyanate ester compound represented by the structural formula (4) represented by the structural formulas (4-1) to (4-9) is, for example, as the compound (Q) having a quinone structure in the molecular structure. 1,4-Naphthoquinone can be produced by the above-described method using various dihydroxybenzenes as the compound (P) having a phenolic hydroxyl group in the molecular structure. At this time, since the reaction rate of 1,4-naphthoquinone and dihydroxybenzene can produce the compound represented by the structural formula (1) with high efficiency, the amount of dihydroxybenzene is 0.1 per mol of 1,4-naphthoquinone. The ratio is preferably in the range of ˜10.0 mol.

  Among the cyanate ester compounds represented by any one of the structural formulas (4-1) to (4-4), the structural formula is superior in heat resistance, thermal decomposition resistance, and flame retardancy in a cured product. The compound represented by (4-2) or (4-3) is preferable. That is, a cyanate ester compound obtained by using 1,3-dihydroxybenzene as the compound (P) having a phenolic hydroxyl group in the molecular structure is preferable.

  The cyanate ester resin containing the cyanate ester compound represented by the structural formula (4) may further contain other cyanate ester compounds. Especially, since it becomes cyanate ester resin with high heat resistance, it is preferable to contain the polyfunctional compound represented by following Structural formula (4 ').

  In formula (4 '), k and i are each an integer of 1 to 2.

  In this case, the content of each component in the cyanate ester resin is such that the content of the dinaphtho [b, d] furan compound represented by the structural formula (4) is in the range of 5 to 70% in terms of area ratio in GPC measurement. And the content of the polyfunctional compound represented by the structural formula (4 ′) is preferably in the range of 1 to 60% in terms of area ratio in GPC measurement.

  Among these exemplified cyanate ester compounds, cyanate represented by any one of the structural formulas (1) to (3) has excellent balance between heat resistance, heat decomposition resistance, and flame retardancy in a cured product. An ester compound is preferable, and a cyanate ester compound represented by the structural formula (3) is particularly preferable.

  Since the cyanate ester resin containing the cyanate ester compound of the present invention is excellent in curability, the cyanate group equivalent is preferably in the range of 120 to 300 g / eq.

  Next, the curable resin composition of the present invention will be described. The curable resin composition of the present invention comprises the cyanate ester compound or cyanate ester resin detailed above and a curing accelerator as essential components.

  Specific examples of the curing accelerator used here include phenol compounds, amine compounds, Lewis acids, tertiary sulfonium salts, quaternary ammonium salts, quaternary phosphonium salts, and epoxy group-containing compounds. Among these, nonylphenol, 2,4,6-tris (dimethylaminomethyl) phenol, benzyldimethylamine, copper, lead, tin are highly compatible with cyanate ester resins and the reaction proceeds smoothly. , Manganese, Nickel, Iron, Zinc, Cobalt and other carboxylates, Titanium tetra-n-butoxide and its polymer, Copper, Nickel, Cobalt and other pentadionate salts, Tetrabutylammonium bromide, Tetrabutylphosphonium chloride, Octyl Zinc acid is preferred. Moreover, an epoxy group-containing compound is particularly preferable because the reaction rate is further increased.

  The amount of the curing accelerator used is preferably in the range of 0.001 to 1 part by mass with respect to 100 parts by mass of the cyanate ester resin, for example, since the ability to accelerate curing is sufficiently exhibited.

  Moreover, the curable resin composition of this invention is preferable from the further that the solubility to an organic solvent and a moldability become better by containing an epoxy resin in addition to the said hardening accelerator.

  Examples of the epoxy resin used here include bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins; biphenyl type epoxy resins such as biphenyl type epoxy resins and tetramethylbiphenyl type epoxy resins; and phenol novolac type epoxy resins. , Cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, epoxidized product of condensation product of phenol compound and aromatic aldehyde having phenolic hydroxyl group, novolac type epoxy resin such as biphenyl novolac type epoxy resin; triphenylmethane type epoxy Resin; Tetraphenylethane type epoxy resin; Dicyclopentadiene-phenol addition reaction type epoxy resin; Phenol aralkyl type epoxy resin; Naphthol novola Type epoxy resin, naphthol aralkyl type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, diglycidyloxynaphthalene, 1,1-bis (2,7-diglycidyloxy- An epoxy resin having a naphthalene skeleton in a molecular structure such as 1-naphthyl) alkane; a phosphorus atom-containing epoxy resin, and the like.

  Among these, since a cured product having higher heat resistance can be obtained, a phenol aralkyl type epoxy resin, a biphenyl novolac type epoxy resin, a naphthol novolak type epoxy resin containing a naphthalene skeleton, a naphthol aralkyl type epoxy resin, a naphthol-phenol Co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, crystalline biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, xanthene type epoxy resin, alkoxy group-containing aromatic ring-modified novolak type epoxy resin ( A compound in which a glycidyl group-containing aromatic ring and an alkoxy group-containing aromatic ring are linked with formaldehyde is preferable.

  When using the said epoxy resin, it is preferable that the usage-amount is the range of 10-50 mass% in the curable resin composition of this invention.

  When using the said epoxy resin, you may use together the hardening | curing agent for epoxy resins. The epoxy resin curing agent used here is, for example, an amine compound such as diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF3-amine complex, guanidine derivative, etc .; dicyandiamide Amide compounds such as polyamide resin synthesized from dimer of linolenic acid and ethylenediamine; phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, Acid anhydrides such as methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride; modified phenol novolac resin, cresol novolac resin, aromatic hydrocarbon formaldehyde resin Enol resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin (Xylok resin), naphthol aralkyl resin, trimethylol methane resin, tetraphenylol ethane resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co Condensed novolac resin, biphenyl-modified phenol resin (polyhydric phenol compound in which phenol nucleus is linked by bismethylene group), biphenyl-modified naphthol resin (polyvalent naphthol compound in which phenol nucleus is linked by bismethylene group), aminotriazine-modified phenol resin ( Polyphenolic compounds in which phenol nuclei are linked with melamine, benzoguanamine, etc.) and alkoxy group-containing aromatic ring-modified novolak resins (formaldehyde with phenol) Nuclear and alkoxy groups polyhydric phenol compound-containing aromatic ring are connected) polyhydric phenol compound of the like. These may be used alone or in combination of two or more.

  Moreover, when using together the said epoxy resin, you may use together suitably the hardening accelerator for epoxy resins as needed. Various curing accelerators can be used, and examples thereof include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, and amine complex salts. In particular, when used as a semiconductor encapsulating material, it is excellent in curability, heat resistance, electrical characteristics, moisture resistance reliability, etc., so that triphenylphosphine is used for phosphorus compounds and 1,8-diazabicyclo is used for tertiary amines. -[5.4.0] -undecene (DBU) is preferred.

  The curable resin composition of the present invention may further contain a bismaleimide compound in addition to the cyanate ester resin of the present invention and the curing accelerator. The bismaleimide compound used here is not particularly limited as long as it is a compound having two or more maleimide groups in one molecule. Specifically, N-cyclohexylmaleimide, N-methylmaleimide, Nn -N-aliphatic maleimides such as butylmaleimide, N-hexylmaleimide, N-tert-butylmaleimide; N-aromatic maleimides such as N-phenylmaleimide, N- (P-methylphenyl) maleimide, N-benzylmaleimide; 4,4′-diphenylmethane bismaleimide, 4,4′-diphenylsulfone bismaleimide, m-phenylene bismaleimide, bis (3-methyl-4-maleimidophenyl) methane, bis (3-ethyl-4-maleimidophenyl) methane Bis (3,5-dimethyl-4-maleimidophenyl) meta , Bis (3-ethyl-5-methyl-4-maleimide phenyl) methane, bis (3,5-diethyl-4-maleimide phenyl) bismaleimide compounds such methane and the like.

  Among these, since the heat resistance of the cured product is particularly good, 4,4′-diphenylmethane bismaleimide, bis (3,5-dimethyl-4-maleimidophenyl) methane, bis (3-ethyl-5 -Methyl-4-maleimidophenyl) methane and bis (3,5-diethyl-4-maleimidophenyl) methane are preferred.

  When using the said bismaleimide compound together, you may use together a hardening accelerator suitably as needed. Examples of the curing accelerator used here include amine compounds, phenol compounds, acid anhydrides, imidazole compounds, and organic metal salts.

  In the case where the curable resin composition of the present invention described in detail above is used as a varnish for a printed wiring board, it is preferable to add an organic solvent in addition to the above components. Examples of the organic solvent used here include methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, methoxypropanol, cyclohexanone, methyl cellosolve, ethyl diglycol acetate, propylene glycol monomethyl ether acetate and the like. The type and appropriate amount of organic solvent can be appropriately selected depending on the application, but for example, in printed wiring board applications, it is preferable to use a polar solvent having a boiling point of 160 ° C. or lower, such as methyl ethyl ketone, acetone, dimethylformamide, It is preferable to use it in the ratio which becomes 40-80 mass% of non volatile matters. On the other hand, in build-up adhesive film applications, ketone solvents such as acetone, methyl ethyl ketone, cyclohexanone, etc., acetate solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, carbitol acetate, cellosolve, butyl carbitol, etc. Carbitol solvent, aromatic hydrocarbon solvent such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like are preferably used, and the nonvolatile content is preferably 30 to 60% by mass.

  Further, the curable resin composition is made of a non-halogen flame retardant that substantially does not contain a halogen atom, for example, in the field of printed wiring boards, in order to exhibit flame retardancy, as long as reliability is not lowered. You may mix | blend.

  Examples of the non-halogen flame retardants include phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, inorganic flame retardants, and organic metal salt flame retardants. The flame retardants may be used alone or in combination, and a plurality of flame retardants of the same system may be used, or different types of flame retardants may be used in combination.

  As the phosphorus flame retardant, either inorganic or organic can be used. Examples of the inorganic compounds include red phosphorus, monoammonium phosphate, diammonium phosphate, triammonium phosphate, ammonium phosphates such as ammonium polyphosphate, and inorganic nitrogen-containing phosphorus compounds such as phosphate amide. .

  The red phosphorus is preferably subjected to a surface treatment for the purpose of preventing hydrolysis and the like. Examples of the surface treatment method include (i) magnesium hydroxide, aluminum hydroxide, zinc hydroxide, water A method of coating with an inorganic compound such as titanium oxide, bismuth oxide, bismuth hydroxide, bismuth nitrate or a mixture thereof; (ii) an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide; and A method of coating with a mixture of a thermosetting resin such as a phenol resin, (iii) thermosetting of a phenol resin or the like on a coating of an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, or titanium hydroxide For example, a method of double coating with a resin may be used.

  Examples of the organic phosphorus compound include, for example, general-purpose organic phosphorus compounds such as phosphate ester compounds, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, phosphorane compounds, organic nitrogen-containing phosphorus compounds, and 9,10- Dihydro-9-oxa-10-phosphaphenanthrene = 10-oxide, 10- (2,5-dihydrooxyphenyl) -10H-9-oxa-10-phosphaphenanthrene = 10-oxide, 10- (2,7 -Dihydrooxynaphthyl) -10H-9-oxa-10-phosphaphenanthrene = 10-oxide and other cyclic organic phosphorus compounds, and derivatives obtained by reacting them with compounds such as epoxy resins and phenol resins.

  The blending amount thereof is appropriately selected depending on the type of the phosphorus-based flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. In 100 parts by mass of curable resin composition containing all of halogen-based flame retardant and other fillers and additives, 0.1 to 2.0 parts by mass of red phosphorus is used as a non-halogen flame retardant. It is preferable to mix in the range, and when using an organophosphorus compound, it is preferably mixed in the range of 0.1 to 10.0 parts by mass, particularly in the range of 0.5 to 6.0 parts by mass. It is preferable to do.

  In addition, when using the phosphorous flame retardant, the phosphorous flame retardant may be used in combination with hydrotalcite, magnesium hydroxide, boric compound, zirconium oxide, black dye, calcium carbonate, zeolite, zinc molybdate, activated carbon, etc. Good.

  Examples of the nitrogen-based flame retardant include triazine compounds, cyanuric acid compounds, isocyanuric acid compounds, phenothiazines, and the like, and triazine compounds, cyanuric acid compounds, and isocyanuric acid compounds are preferable.

  Examples of the triazine compound include melamine, acetoguanamine, benzoguanamine, melon, melam, succinoguanamine, ethylene dimelamine, melamine polyphosphate, triguanamine, and the like, for example, (i) guanylmelamine sulfate, melem sulfate, sulfate (Iii) co-condensates of phenols such as phenol, cresol, xylenol, butylphenol and nonylphenol with melamines such as melamine, benzoguanamine, acetoguanamine and formguanamine and formaldehyde, (iii) (Ii) a mixture of a co-condensate of (ii) and a phenolic resin such as a phenol formaldehyde condensate, (iv) those obtained by further modifying (ii) and (iii) with tung oil, isomerized linseed oil, etc It is.

  Specific examples of the cyanuric acid compound include cyanuric acid and cyanuric acid melamine.

  The compounding amount of the nitrogen-based flame retardant is appropriately selected according to the type of the nitrogen-based flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. For example, an epoxy resin, It is preferable to mix in the range of 0.05 to 10 parts by mass in 100 parts by mass of the curable resin composition containing all of the curing agent, non-halogen flame retardant and other fillers and additives. It is preferable to mix | blend in the range of 1-5 mass parts.

  Moreover, when using the said nitrogen-type flame retardant, you may use together a metal hydroxide, a molybdenum compound, etc.

  The silicone flame retardant is not particularly limited as long as it is an organic compound containing a silicon atom, and examples thereof include silicone oil, silicone rubber, and silicone resin.

  The amount of the silicone-based flame retardant is appropriately selected depending on the type of the silicone-based flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. For example, an epoxy resin, It is preferable to mix in the range of 0.05 to 20 parts by mass in 100 parts by mass of the curable resin composition containing all of the curing agent, non-halogen flame retardant and other fillers and additives. Moreover, when using the said silicone type flame retardant, you may use a molybdenum compound, an alumina, etc. together.

  Examples of the inorganic flame retardant include metal hydroxide, metal oxide, metal carbonate compound, metal powder, boron compound, and low melting point glass.

  Specific examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, zirconium hydroxide and the like.

  Specific examples of the metal oxide include, for example, zinc molybdate, molybdenum trioxide, zinc stannate, tin oxide, aluminum oxide, iron oxide, titanium oxide, manganese oxide, zirconium oxide, zinc oxide, molybdenum oxide, and cobalt oxide. Bismuth oxide, chromium oxide, nickel oxide, copper oxide, tungsten oxide and the like.

  Specific examples of the metal carbonate compound include zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, basic magnesium carbonate, aluminum carbonate, iron carbonate, cobalt carbonate, and titanium carbonate.

  Specific examples of the metal powder include aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, and tin.

  Specific examples of the boron compound include zinc borate, zinc metaborate, barium metaborate, boric acid, and borax.

  Specific examples of the low-melting-point glass include, for example, Shipley (Bokusui Brown), hydrated glass SiO2-MgO-H2O, PbO-B2O3 series, ZnO-P2O5-MgO series, P2O5-B2O3-PbO-MgO series Examples thereof include glassy compounds such as P—Sn—O—F, PbO—V 2 O 5 —TeO 2, Al 2 O 3 —H 2 O, and lead borosilicate.

  The amount of the inorganic flame retardant is appropriately selected depending on the type of the inorganic flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. For example, an epoxy resin, It is preferable to mix in the range of 0.05 to 20 parts by mass in 100 parts by mass of the curable resin composition containing all of the curing agent, non-halogen flame retardant and other fillers and additives. It is preferable to mix | blend in 5-15 mass parts.

  Examples of the organic metal salt flame retardant include ferrocene, acetylacetonate metal complex, organic metal carbonyl compound, organic cobalt salt compound, organic sulfonic acid metal salt, metal atom and aromatic compound or heterocyclic compound or an ionic bond or Examples thereof include a coordinated compound.

  The amount of the organic metal salt flame retardant is appropriately selected depending on the type of the organic metal salt flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. In 100 parts by mass of the curable resin composition in which all of epoxy resin, curing agent, non-halogen flame retardant and other fillers and additives are blended, it is preferably blended in the range of 0.005 to 10 parts by mass. .

  An inorganic filler can be mix | blended with the curable resin composition of this invention as needed. Examples of the inorganic filler include fused silica, crystalline silica, alumina, silicon nitride, and aluminum hydroxide. When particularly increasing the blending amount of the inorganic filler, it is preferable to use fused silica. The fused silica can be used in either a crushed shape or a spherical shape. However, in order to increase the blending amount of the fused silica and suppress an increase in the melt viscosity of the molding material, it is preferable to mainly use a spherical shape. In order to further increase the blending amount of the spherical silica, it is preferable to appropriately adjust the particle size distribution of the spherical silica. The filling rate is preferably higher in consideration of flame retardancy, and particularly preferably 20% by mass or more with respect to the total amount of the curable resin composition. Moreover, when using for uses, such as an electrically conductive paste, electroconductive fillers, such as silver powder and copper powder, can be used.

  Various compounding agents, such as a silane coupling agent, a mold release agent, a pigment, an emulsifier, can be added to the curable resin composition of this invention as needed.

  The curable resin composition of the present invention can be obtained by uniformly mixing the above-described components and can be easily cured by heating to obtain a cured product. Specifically, it is obtained by uniformly mixing the above-described components, and is easily cured by heating the curable resin composition at a temperature of about 100 ° C. or higher, preferably 20 to 300 ° C. It can be. Examples of the cured product thus obtained include molded cured products such as laminates, cast products, adhesive layers, coating films, and films.

  Applications in which the curable resin composition of the present invention is used include semiconductor sealing materials, circuit board materials, resin casting materials, adhesives, build-up board interlayer insulating materials, build-up adhesive films, and the like. Among these various applications, in printed circuit boards, insulating materials for electronic circuit boards, and adhesive films for build-up, passive parts such as capacitors and active parts such as IC chips are embedded in so-called electronic parts. It can be used as an insulating material for a substrate. Among these, it is preferable to use for the printed wiring board material and the adhesive film for buildup from the characteristics, such as high heat resistance, low thermal expansibility, and solvent solubility.

  In order to adjust the semiconductor sealing material from the curable resin composition of the present invention, a compounding agent such as a cyanate ester resin, a curing accelerator, and an inorganic filler may be added to an extruder, a kneader, a low roller as necessary. And a method of sufficiently melt-mixing until uniform using a slurry. At that time, fused silica is usually used as the inorganic filler, but when used as a high thermal conductive semiconductor encapsulant for power transistors and power ICs, crystalline silica, alumina, nitridation having higher thermal conductivity than fused silica. High filling such as silicon, or fused silica, crystalline silica, alumina, silicon nitride, or the like may be used. The content of the inorganic filler is preferably in the range of 30 to 95 parts by mass per 100 parts by mass of the curable resin composition, and among them, improvement in flame retardancy, moisture resistance and solder crack resistance, and linear expansion In order to reduce the coefficient, the amount is more preferably 70 to 95 parts by mass, and still more preferably 80 to 95 parts by mass.

  In order to produce a circuit board from the curable resin composition of the present invention, a varnish obtained by diluting the curable resin composition in an organic solvent is obtained, and the varnish shaped into a plate shape is laminated with a copper foil and heated. It is good to press-mold. Specifically, for example, to produce a hard printed wiring board, the varnish-like curable resin composition containing the organic solvent is further varnished by adding an organic solvent, and this is impregnated into a reinforcing base material. A method of obtaining the prepreg of the present invention produced by semi-curing, and laminating a copper foil on the prepreg and heating and press-bonding may be mentioned. Examples of the reinforcing substrate that can be used here include paper, glass cloth, glass nonwoven fabric, aramid paper, aramid cloth, glass mat, and glass roving cloth. If this method is described in further detail, first, the varnish-like curable resin composition is heated at a heating temperature corresponding to the solvent type used, preferably 50 to 170 ° C., thereby being a prepreg which is a cured product. Get. At this time, the mass ratio of the curable resin composition to be used and the reinforcing substrate is not particularly limited, but it is usually preferable that the resin content in the prepreg is 20 to 60% by mass. Next, the prepreg obtained as described above is laminated by a conventional method, and a copper foil is appropriately stacked, and then subjected to thermocompression bonding at 170 to 250 ° C. for 10 minutes to 3 hours under a pressure of 1 to 10 MPa, A target circuit board can be obtained.

  In order to produce a flexible wiring board from the curable resin composition of the present invention, the cyanate ester resin, a curing accelerator, and an organic solvent are blended, and using a coating machine such as a reverse roll coater or a comma coater, Apply to electrically insulating film. Subsequently, it heats at 60-170 degreeC for 1 to 15 minutes using a heating machine, volatilizes a solvent, and B-stages an adhesive composition. Next, the metal foil is thermocompression bonded to the adhesive using a heating roll or the like. At that time, the pressure is preferably 2 to 200 N / cm 2 and the pressure is 40 to 200 ° C. If sufficient adhesive performance can be obtained, the process may be completed here. However, when complete curing is required, it is preferably post-cured at 100 to 200 ° C. for 1 to 24 hours. The thickness of the adhesive composition film after finally curing is preferably in the range of 5 to 100 μm.

  As a method for obtaining an interlayer insulating material for a build-up substrate from the curable resin composition of the present invention, for example, the curable resin composition appropriately blended with rubber, filler, etc., spray coating method on a wiring board on which a circuit is formed, After applying using a curtain coating method or the like, it is cured. Then, after drilling a predetermined through-hole part etc. as needed, it treats with a roughening agent, forms the unevenness | corrugation by washing the surface with hot water, and metal-treats, such as copper. As the plating method, electroless plating or electrolytic plating treatment is preferable, and examples of the roughening agent include an oxidizing agent, an alkali, and an organic solvent. Such operations are sequentially repeated as desired, and a build-up base can be obtained by alternately building up and forming the resin insulating layer and the conductor layer having a predetermined circuit pattern. However, the through-hole portion is formed after the outermost resin insulating layer is formed. Further, a copper foil with resin obtained by semi-curing the resin composition on the copper foil is thermocompression-bonded at 170 to 300 ° C. on a wiring board on which a circuit is formed, thereby forming a roughened surface and plating treatment. It is also possible to produce a build-up substrate by omitting the process.

  When the curable resin composition of the present invention is used as a conductive paste, for example, a method of dispersing fine conductive particles in the curable resin composition to obtain a composition for anisotropic conductive film, liquid at room temperature And a paste resin composition for circuit connection and an anisotropic conductive adhesive.

  The method for producing an adhesive film for buildup from the curable resin composition of the present invention includes, for example, applying the curable resin composition of the present invention on a support film and then drying the curable resin composition. The method of forming the resin composition layer on a support film and making it the adhesive film for multilayer printed wiring boards is mentioned.

  When the curable resin composition of the present invention is used for an adhesive film for buildup, the film is softened under the lamination temperature condition (usually 70 ° C. to 140 ° C.) in the vacuum laminating method, and at the same time as laminating the circuit board, It is important to show fluidity (resin flow) capable of filling a resin in the via hole or through hole existing in the substrate, and it is preferable to blend the above-described components so as to exhibit such characteristics.

  Here, the diameter of the through hole of the multilayer printed wiring board is usually 0.1 to 0.5 mm, and the depth is usually 0.1 to 1.2 mm. It is usually preferable to allow resin filling in this range. When laminating both surfaces of the circuit board, it is desirable to fill about 1/2 of the through hole.

  Specifically, the method for producing the adhesive film described above is, after preparing the varnish-like curable resin composition of the present invention, coating the varnish-like composition on the surface of the support film (Y), Further, it can be produced by drying the organic solvent by heating or blowing hot air to form the layer (X) of the curable resin composition.

  The thickness of the formed layer (X) is usually not less than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the thickness of the resin composition layer is preferably 10 to 100 μm.

  In addition, the layer (X) in this invention may be protected with the protective film mentioned later. By protecting with a protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches.

  The above-mentioned support film and protective film are made of polyolefin such as polyethylene, polypropylene and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyester such as polyethylene naphthalate, polycarbonate, polyimide, and further. Examples thereof include metal foil such as pattern paper, copper foil, and aluminum foil. In addition, the support film and the protective film may be subjected to a release treatment in addition to the mud treatment and the corona treatment.

  Although the thickness of a support film is not specifically limited, Usually, it is 10-150 micrometers, Preferably it is used in 25-50 micrometers. Moreover, it is preferable that the thickness of a protective film shall be 1-40 micrometers.

  The support film (Y) described above is peeled off after being laminated on a circuit board or after forming an insulating layer by heat curing. If the support film (Y) is peeled after the adhesive film is heat-cured, adhesion of dust and the like in the curing process can be prevented. In the case of peeling after curing, the support film is usually subjected to a release treatment in advance.

  Next, the method for producing a multilayer printed wiring board using the adhesive film obtained as described above is, for example, when the layer (X) is protected with a protective film, after peeling these layers ( X) is laminated on one side or both sides of the circuit board so as to be in direct contact with the circuit board, for example, by a vacuum laminating method. The laminating method may be a batch method or a continuous method using a roll. Further, the adhesive film and the circuit board may be heated (preheated) as necessary before lamination.

  The lamination conditions are such that the pressure bonding temperature (laminating temperature) is preferably 70 to 140 ° C., the pressure bonding pressure is preferably 1 to 11 kgf / cm 2 (9.8 × 10 4 to 107.9 × 104 N / m 2), and the air pressure is 20 mmHg (26 It is preferable to laminate under a reduced pressure of 0.7 hPa or less.

  Next, the present invention will be specifically described with reference to Examples and Comparative Examples. In the following, “parts” and “%” are based on mass unless otherwise specified. GPC and IR were measured under the following conditions.

GPC: Measurement conditions are as follows.
Measuring device: “HLC-8220 GPC” manufactured by Tosoh Corporation
Column: Guard column “HXL-L” manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ Tosoh Corporation “TSK-GEL G3000HXL”
+ Tosoh Corporation “TSK-GEL G4000HXL”
Detector: RI (differential refractometer)
Data processing: “GPC-8020 Model II version 4.10” manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40 ° C
Developing solvent Tetrahydrofuran
Flow rate: 1.0 ml / min Standard: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of “GPC-8020 Model II version 4.10”.
(Used polystyrene)
“A-500” manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
“F-1” manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
“F-4” manufactured by Tosoh Corporation
“F-10” manufactured by Tosoh Corporation
“F-20” manufactured by Tosoh Corporation
“F-40” manufactured by Tosoh Corporation
“F-80” manufactured by Tosoh Corporation
“F-128” manufactured by Tosoh Corporation
Sample: A 1.0 mass% tetrahydrofuran solution filtered in terms of resin solids and filtered through a microfilter (50 μl).

<IR measurement device>
The following apparatus was used as an IR measurement apparatus.
Equipment: “FT / IR-550” manufactured by JASCO Corporation

Example 1 Production of cyanate ester resin (A-1) 160 g (1.0 mol) of 2,7-dihydroxynaphthalene was added to a flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube and a stirrer. , 4-naphthoquinone (158 g, 1.0 mol), paratoluenesulfonic acid (6 g) and methyl isobutyl ketone (318 g) were charged, and the temperature was raised from room temperature to 120 ° C. with stirring. After reaching 120 ° C., the reaction was allowed to stir for 3 hours. After completion of the reaction, the reaction mixture was neutralized and washed 3 times with 200 g of water. Then, it heated to 150 degreeC and dried under reduced pressure, and obtained 300 g of phenol resins (A). The GPC chart of the obtained phenol resin (A) is shown in FIG. The hydroxyl equivalent of the phenol resin (A) was 137 g / eq. The content of the component corresponding to the dinaphtho [b, d] furan compound calculated from the GPC chart and represented by the following structural formula (a) is 55.3%, represented by the following structural formula (b) and k The content of the component corresponding to the compound corresponding to the binuclear compound having a value of 1 is 9.7%, and the content of the component corresponding to the trinuclear compound represented by the following structural formula (c) is 22. 0%.

  Subsequently, 68.5 g (0.5 mol) of the phenol resin (A) obtained above was allowed to flow through a four-necked flask equipped with a thermometer, a dropping funnel, a cooling tube, a fractionating tube, and a stirrer. ) And 106 g (1.0 mol) of cyanogen bromide were dissolved in 1000 g of acetone, and then cooled to −3 ° C. Next, 111 g (1.1 mol) of triethylamine was charged into the dropping funnel and added dropwise at a rate such that the temperature inside the flask did not exceed 10 ° C. while stirring. After completion of the dropwise addition, the mixture was stirred at a temperature of 10 ° C. or lower for 2 hours. This was extracted with methylene chloride and washed with water to obtain 80 g of a cyanate ester resin. The functional group equivalent of this cyanate ester resin was 163 g / eq from the charge ratio. Further, this resin showed absorption of 2264 cm −1 (cyanato group) in the IR spectrum and did not show absorption of hydroxyl group, so that it was confirmed to be the objective cyanate ester resin (A-1). .

Example 2 Production of Cyanate Ester Resin (B-1) 160 g (1.0 mol) of 2,7-dihydroxynaphthalene was added to a flask equipped with a thermometer, dropping funnel, condenser, fractionator, and stirrer. , 4-naphthoquinone (158 g, 1.0 mol), p-toluenesulfonic acid (6 g) and isopropyl alcohol (333 g) were charged, and the temperature was raised from room temperature to 80 ° C. with stirring. After reaching 80 ° C., the reaction was allowed to stir for 3 hours. After completion of the reaction, the reaction mixture was neutralized and washed 3 times with 200 g of water. Then, it heated to 150 degreeC and dried under reduced pressure, and obtained 295g of phenol resins (B). The GPC chart of the obtained phenol resin (B) is shown in FIG. The hydroxyl equivalent of the phenol resin (B) was 119 g / eq. The content of the component corresponding to the dinaphtho [b, d] furan compound calculated from the GPC chart and represented by the structural formula (a) is 50.2%, represented by the structural formula (b) and k The content of the component corresponding to the compound corresponding to the binuclear compound having a value of 1 is 14.8%, and the content of the component corresponding to the trinuclear compound represented by the structural formula (c) is 24. 2%.

  Subsequently, 59.5 g (0.5 mol) of the phenol resin (B) obtained above was allowed to flow through a four-necked flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube, and a stirrer. ) And 106 g (1.0 mol) of cyanogen bromide were dissolved in 1000 g of acetone, and then cooled to −3 ° C. Next, 111 g (1.1 mol) of triethylamine was charged into the dropping funnel and added dropwise at a rate such that the temperature inside the flask did not exceed 10 ° C. while stirring. After completion of the dropwise addition, the mixture was stirred at a temperature of 10 ° C. or lower for 2 hours, and the resulting precipitate was removed by filtration, and then poured into a large amount of water and reprecipitated. This was extracted with methylene chloride and washed with water to obtain 70 g of a cyanate ester resin. The functional group equivalent of this cyanate ester resin was 144 g / eq from the charge ratio. Further, this resin showed absorption of 2264 cm −1 (cyanato group) and no hydroxyl group absorption in the IR spectrum, and thus was confirmed to be the intended cyanate ester resin (B-1). .

Example 3 Production of cyanate ester resin (C-1) 160 g (1.0 mol) of 2,7-dihydroxynaphthalene was added to a flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube and a stirrer. , 3,5-trimethyl-parabenzoquinone (150 g, 1.0 mol), 6 g of paratoluenesulfonic acid, and 310 g of methyl isobutyl ketone were charged and the temperature was raised from room temperature to 120 ° C. with stirring. After reaching 120 ° C., the reaction was allowed to stir for 3 hours. After completion of the reaction, the reaction mixture was neutralized and the precipitated crystals were washed with 200 g of water three times and dried under reduced pressure to obtain 290 g of a phenol resin (C). The GPC chart of the obtained phenol resin (C) is shown in FIG. The hydroxyl equivalent of the phenol resin (C) was 148 g / eq. The content of the component corresponding to the diarylene [b, d] furan compound calculated from the GPC chart and represented by the structural formula (2) was 100%.

  Subsequently, while flowing nitrogen gas through a four-necked flask equipped with a thermometer, a dropping funnel, a cooling tube, a fractionating tube, and a stirrer, 74 g (0.5 mol) of the phenol resin (C) obtained above and 106 g (1.0 mol) of cyanogen bromide was charged and dissolved in 1000 g of acetone, and then cooled to -3 ° C. Next, 111 g (1.1 mol) of triethylamine was charged into the dropping funnel and added dropwise at a rate such that the temperature inside the flask did not exceed 10 ° C. while stirring. After completion of the dropwise addition, the mixture was stirred at a temperature of 10 ° C. or lower for 2 hours, and the resulting precipitate was removed by filtration, and then poured into a large amount of water and reprecipitated. This was extracted with methylene chloride and washed with water to obtain 85 g of a cyanate ester resin. The functional group equivalent of this cyanate ester resin was 173 g / eq from the charging ratio. Further, this resin showed absorption of 2264 cm-1 (cyanato group) in the IR spectrum and did not show absorption of hydroxyl group, and thus was confirmed to be the intended cyanate ester resin (C-1). .

Examples 4-6, Comparative Example 1
As cyanate ester resins, cyanate ester resins (A-1), (B-1) and (C-1) obtained in Examples 1 to 3 and BA-200 (bisphenol A type cyanate ester resin made by LONZA) ), Zinc octylate as a curing accelerator, blended in the composition shown in Table 1, and molded by a press at a temperature of 200 ° C. for 10 minutes, then post-cured at a temperature of 200 ° C. for 5 hours to obtain a cured product (test) Piece 1) was prepared. The heat resistance, heat decomposition resistance, flame retardancy, dielectric constant and dielectric loss tangent of the test piece 1 obtained above were measured by the following methods. The results are shown in Table 1.

<Measurement of heat resistance>
Using a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device RSAII manufactured by Rheometric, rectangular tension method; frequency 1 Hz, heating rate 3 ° C./min), the elastic modulus change is maximized twice under the following temperature conditions. The test piece 1 was measured for the temperature (Tg) at which

<Measurement of thermal decomposition resistance>
A specimen obtained by cutting the test piece 1 into a cured product having a thickness of 0.8 mm and having a width of 5 mm and a length of 54 mm was held at 250 ° C. for 72 hours, and then the mass reduction rate when compared with the initial mass was measured.

<Measurement of flame retardancy>
In accordance with the UL-94 test method, flame retardancy was measured using five test pieces 1.

<Measurement of dielectric constant and dissipation factor>
In accordance with JIS-C-6481, the impedance material analyzer “HP4291B” manufactured by Agilent Technologies, Inc. is used to dry the test piece 1 at 1 GHz after being stored in a room at 23 ° C. and a humidity of 50% for 24 hours. The dielectric constant and dielectric loss tangent were measured.

Claims (11)

  A diarylene [b, d] furan structure, at least one of the two arylene groups forming the diarylene [b, d] furan structure has a naphthylene skeleton, and the two arylene groups are Both are cyanate ester compounds having a cyanate group on the aromatic ring.   The cyanate ester compound according to claim 1, wherein at least one of the two arylene groups has the cyanate group at the para position of the carbon atom to which the oxygen atom forming the furan ring is bonded. The cyanate ester compound according to claim 2, which has a molecular structure represented by the following structural formula (I) or the following structural formula (II).

[In formulas (I) and (II), each R ¹ independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group. Either. Ar ¹ is a structural moiety represented by the following structural formula (i), and Ar ² is a structural moiety represented by the following structural formula (i) or (ii). ]

[In the formulas (i) and (ii), each R ² is independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group. m is an integer of 0 to 4, and n is an integer of 0 to 3. When m or n is 2 or more, R ² may be the same or different from each other. x and y each represent a bonding point with the naphthalene ring and represent that they are bonded to adjacent carbon atoms of the naphthalene ring so as to form a furan ring with the oxygen atom. In formula (i), R ² and the cyanate group bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring. ] The cyanate ester compound according to claim 3, which has a molecular structure represented by any one of the following structural formulas (1) to (4).

[In the formulas (1) to (4), each R ² is independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group. , M is an integer from 0 to 4, and n is an integer from 0 to 3. When m or n is 2 or more, R ² may be the same or different from each other. x and y each represent a bonding point with the naphthalene ring and represent that they are bonded to adjacent carbon atoms of the naphthalene ring so as to form a furan ring with the oxygen atom. In formulas (1) to (3), R ² and the cyanate group bonded to the naphthalene ring may be bonded to any aromatic ring among the aromatic rings constituting the naphthalene ring. ]   The cyanate ester resin containing the cyanate ester compound as described in any one of Claims 1-4.   A curable resin composition comprising the cyanate ester compound according to any one of claims 1 to 4 or the cyanate ester resin according to any one of claims 5 and a curing accelerator as essential components. A cured product obtained by curing the curable resin composition according to claim 6 . The adhesive film for buildup formed by apply | coating the curable resin composition of Claim 6 on a support film, and drying. A semiconductor sealing material comprising the curable resin composition according to claim 6 and an inorganic filler, wherein the content of the inorganic filler is in the range of 30 to 95 parts by mass per 100 parts by mass of the curable resin composition. . A prepreg obtained by semi-curing an impregnated base material obtained by impregnating a reinforcing base material with a varnished curable resin composition according to claim 6 . A circuit board obtained by laminating a varnish obtained by diluting the curable resin composition according to claim 6 in an organic solvent into a plate shape and laminating it with a copper foil, followed by heating and pressing.

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