JP6447523B2 - Blade for stripping flat wire - Google Patents

Description

  The present invention relates to a blade for stripping a flat conductive wire.

  Patent Document 1 discloses a blade for peeling a coating film of a rectangular conducting wire.

JP 2011-155724 A

  By the way, the inventor has conceived a peeling method in which the coating film of the flat conducting wire is peeled off using the upper blade and the lower blade. Specifically, in a state where the flat conducting wire is held by placing it on the upper end surface of the lower blade, the upper blade is pressed near the side surface of the flat conducting wire so as to pass through the lower blade. As a result, since a shear stress is applied to the coating in the vicinity of the side surface of the flat conductor, the coating is peeled off from the flat conductor.

  A lower blade has a flat part in an end surface, and the protrusion part provided in the both ends of an end surface adjacent to this flat part. The protruding portion protrudes from the end surface while being inclined toward the end side of the end surface. In a state where the flat conducting wire is held by being placed on the end face of the lower blade, the flat portion and the protruding portion are in contact with the flat conducting wire.

  In such a peeling method that peels the flat conductor film using the upper and lower blades, repeated peeling may cause fatigue failure at the boundary between the flat portion and the protruding portion. .

  Specifically, as shown in FIG. 6, the lower blade 91 includes a flat portion 91a, a protruding portion 91b, and a boundary portion 91c that is a boundary portion between the flat portion 91a and the protruding portion 91b. In the peeling method in which the flat conductive wire film is peeled using the upper blade and the lower blade 91, when the peeling is repeated, a crack C1 may occur in the boundary portion 91c.

  The lower blade for stripping a flat conductive wire according to the present invention has high durability.

The lower blade for stripping the coating of the flat wire according to the present invention is
In the state where the flat wire is held, using the upper blade, the lower blade for peeling the film of the flat wire for peeling the film of the flat wire,
A flat portion provided on the end surface; and a projecting portion provided on both end portions of the end surface and adjacent to the flat portion,
The protrusion has a tapered surface;
A recess is formed at the boundary between the flat portion and the protruding portion.
According to such a configuration, stress concentration at the boundary portion between the flat portion and the protruding portion can be suppressed. Therefore, even if the peeling process is repeated, fatigue failure hardly occurs. That is, it has high durability.

  The lower blade for stripping a flat conductive wire according to the present invention has high durability.

It is a schematic diagram which shows one process of the peeling method of the film of a flat conducting wire. FIG. 3 is a schematic diagram showing a main part of a lower blade according to Embodiment 1. It is a schematic diagram which shows one process of the peeling method of the film of a flat conducting wire. It is a schematic diagram which shows one process of the peeling method of the film of a flat conducting wire. It is a schematic diagram which shows one process of the peeling method of the film of a flat conducting wire. It is a schematic diagram which shows one process of the peeling method of the film of a flat conducting wire. It is a schematic diagram which shows one process of the peeling method of the film of a flat conducting wire. It is an image which shows the result of the stress analysis of an Example. It is a graph which shows the SN curve of an example of the material which comprises an Example. It is a schematic diagram which shows the principal part of a related lower blade. It is an image which shows the stress analysis result of a reference example.

Embodiment 1
The peeling lower blade is demonstrated with reference to FIG.1 and FIG.2. FIG. 1 is a schematic diagram showing one step of a method for peeling a flat conductive wire film. FIG. 2 is a schematic diagram illustrating a main part of the peeling lower blade according to the first embodiment.

  As shown in FIG.1 and FIG.2, the lower blade 1 contains the flat part 1a, the protrusion part 1b, and the hollow part 1c in an end surface. The flat part 1a is provided in the center part of the end surface. The protruding portion 1b is provided at both end portions of the end face and is adjacent to the flat portion 1a. The protrusion 1b has a tapered surface 1d that is inclined from the end 1e of the end surface toward the flat portion 1a. An angle α formed by the intersection of the tapered surface 1d and the flat portion 1a has a predetermined size. The angle α is, for example, a predetermined value in a range of 15 ° to 75 °. The lower blade 1 is made of a material generally used as a blade, for example, high-speed tool steel. The length t and the angle α from the flat portion 1a of the lower blade 1 to the tip of the protruding portion 1b may be values that can easily hold the flat conducting wire W1 (described later).

The hollow portion 1c is provided between the flat portion 1a and the protruding portion 1b. The recessed portion 1c is recessed toward the inside of the lower blade 1, and the surface of the recessed portion 1c has a predetermined curvature R. For example, when the length t [mm] from the flat part 1a of the lower blade 1 to the tip of the protruding part 1b is 0.4 and the angle α [°] is 45, the curvature R [mm ⁻¹ ] is, for example, Preferably it is 0.10 or more, More preferably, it is 0.27 or more. As the angle α increases, the stress concentration on the depression 1c tends to advance, so it is preferable to increase the curvature R.

(Example of peeling method)
Next, a method for peeling the flat conductive wire film using the lower blade 1 will be described.

  First, the flat conducting wire W1 is placed on the end face of the lower blade 1 and is held by the lower blade 1 (flat conducting wire holding step ST1). Here, the axis of the flat conducting wire W1 is along the paper surface depth direction of FIG. 1 (here, the X-axis direction). The flat portion 1a and the protruding portion 1b are in contact with the flat conducting wire W1, and the flat conducting wire W1 is preferably in close contact with the lower blade 1. The flat conducting wire W1 includes a core wire W1a made of pure copper or a copper alloy, and a coating W1b that covers the outer peripheral surface of the core wire W1a and electrically insulates the core wire W1a.

  Subsequently, the clamp 2 is pressed against the flat conducting wire W1, and the flat conducting wire W1 is sandwiched between the clamp 2 and the lower blade 1 (clamp step ST2). The width of the clamp 2 may be the same as or slightly smaller than the rectangular conductive wire W1 and the lower blade 1.

  Finally, the film W1b is peeled off (film peeling step ST3). Specifically, the upper blade 3 is pushed from the clamp 2 side to the lower blade 1 side so as to pass the lower blade 1, and a shear stress is generated between the coating W1b of the flat wire W1 and the core wire W1a. With this shear stress, the coating W1b of the flat conducting wire W1 is peeled off from the core wire W1a. Here, stress concentrates on the boundary between the flat portion 1a of the lower blade 1 and the protruding portion 1b. However, since the surface of the recess 1c has a predetermined curvature R, the stress is dispersed in the recess 1c. Thereby, it is suppressed that stress concentrates on the boundary of the flat part 1a of the lower blade 1 and the protrusion part 1b.

  As mentioned above, according to the peeling lower blade which concerns on Embodiment 1, in order to suppress the stress concentration in the lower blade 1 and to suppress generation | occurrence | production of a crack, it has high durability.

(Another example of peeling method)
Note that the coating W1b of the flat conducting wire W1 can be peeled off by combining a plurality of steps shown in FIGS. 3A to 3E and the step shown in FIG. FIG. 3A to FIG. 3E are schematic views showing one step of a method for peeling a flat conductive wire film.

  As shown in FIG. 3A, a part of the coating W1b of the flat conducting wire W1 is peeled off. Then, the peeling surface W11 which is one part of the outer peripheral surface of the core wire W1a is exposed. Specifically, in the same manner as the method of peeling the flat conductor wire coating using the lower cutter (not shown), the upper cutter 3 is held in a state of being held by placing the flat conductor W1 on the end face of the lower cutter. Press near the side of the lead wire W1 and push it so as to pass the lower blade. In addition, the lower blade used here should just hold | maintain the flat conducting wire W1, and may have a shape different from the lower blade 1. FIG. The peeling surface W11 may be formed by peeling off the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.

  Subsequently, as shown in FIG. 3B, after holding the flat conductive wire W1 with the peeling surface W11 exposed so as to be rotated 90 ° clockwise toward the paper surface of FIG. 3A, A part of the coating W1b is peeled off. Then, the peeling surface W12 which is one part of the outer peripheral surface of the core wire W1a is exposed. A peeling method similar to that shown in FIG. 3A can be used. The peeling surface W12 may be formed by peeling the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.

  Subsequently, as shown in FIG. 3C, the flat conductive wire W1 with the peeled surface W12 exposed is held in a direction rotated 45 ° counterclockwise toward the paper surface of FIG. 3B, and then the flat conductive wire W1. The corner of the coating W1b is peeled off. Then, the peeling surface W13 is exposed. A peeling method similar to that shown in FIG. 3A can be used. The peeling surface W13 may be formed by peeling off the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.

  Subsequently, as shown in FIG. 3D, after holding the flat conducting wire W1 with the peeling surface W13 exposed so as to be rotated 90 ° clockwise toward the paper surface of FIG. 3C, The corners of the coating W1b are peeled off. Then, the peeling surface W14 is exposed. A peeling method similar to that shown in FIG. 3A can be used. The peeling surface W14 may be formed by peeling the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.

  Finally, the coating of the flat conducting wire W1 is peeled off using the lower blade 1 and the method of peeling off the flat conducting wire. Specifically, as shown in FIG. 3E, the flat wire W1 from which the peeling surface W14 is exposed is held in a direction rotated 45 ° counterclockwise toward the paper surface of FIG. The side surface of the coating W1b of the conducting wire W1 is peeled off. Then, the peeling surface W15 is exposed. The peeling surface W15 may be formed by peeling off the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a. A peeling method similar to that shown in FIG. 3A can be used. Since one of the peeling surfaces W13 and one of the peeling surfaces W14 are in contact with the two tapered surfaces 1d (see FIG. 2), the flat conductive wire W1 and the end surface of the lower blade 1 can be in close contact with each other. When the flat conducting wire W1 and the end face of the lower blade 1 are in close contact, the flat conducting wire W1 may be stably held by the lower blade 1. The tapered surface 1d may have a shape that can be in close contact with one of the peeling surfaces W13 and one of the peeling surfaces W14.

  By these, generation | occurrence | production of the burr | flash by peeling of a film can be suppressed. As a result, the occurrence of burr biting in the next step can be suppressed. Moreover, in the process shown to FIG. 1, FIG. 3A-FIG. 3E mentioned above, since the same kind of tool and apparatus can be used, installation cost can be suppressed.

(Calculation example)
Next, using the lower blade having the same configuration as the lower blade 1 (see FIGS. 1 and 2) as an example, the value of the stress generated on the end face of the lower blade 1 when the flat conductor film is peeled off is calculated. The results will be described. The result of the calculation is shown in FIG. As a reference example, the same stress value was calculated when a lower blade having the same configuration as the lower blade 91 (see FIG. 6) was used. Specifically, this calculation was performed using commercially available stress analysis software, and the Mises stress was calculated. The result of the calculation is shown in FIG. The calculation conditions of the example and the reference example are all the same except for the place having the recess 1c.

  As shown in FIG. 4, the maximum value of the stress in the dent 201c corresponding to the dent 1c (see FIG. 2) was 623 MPa. On the other hand, as shown in FIG. 7, the maximum value of stress at the boundary portion 901c corresponding to the boundary portion 91c (see FIG. 6) was 750 MPa. Therefore, the stress in the hollow portion 1c was lower than that in the boundary portion 91c and decreased by 17%.

  By the way, FIG. 5 shows an SN curve of an example of a material constituting the embodiment, here, an example of a high-speed tool steel. As shown in FIG. 5, when a lower blade having the same configuration as the lower blade 91 is used, the stress is 1150 MPa, and the fatigue limit is reached after 100,000 repetitions.

  On the other hand, from the calculation result described above, since the stress is reduced by 17%, it is considered that the value obtained by reducing the maximum value of the stress by 17% is applied to the depression 1c. Therefore, when the lower blade having the same configuration as the lower blade 1 is used, it is considered that the maximum value of stress is reduced by 17% to 955 MPa. Therefore, it is considered that the fatigue limit is not reached even when the number of repetitions exceeds 1.5 million. That is, it is considered that the lower blade having the same configuration as the lower blade 1 is less likely to reach the fatigue limit even when the coating of the flat conductive wire is repeatedly peeled many times as compared with the lower blade having the same configuration as the lower blade 91. That is, the lower blade having the same configuration as the lower blade 1 is considered to have higher durability than the lower blade having the same configuration as the lower blade 91.

  Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 Lower blade 1a Flat part 1b Protrusion part 1c Depression part 1d Tapered surface 1e End 3 Upper blade W1 Flat wire W1b Coating

Claims (1)

In the state where the flat wire is held, using the upper blade, the lower blade for peeling the film of the flat wire for peeling the film of the flat wire,
A flat portion provided on the end surface, and provided at both end portions of the end surface, and a protrusion adjacent to the flat portion,
The protrusion has a tapered surface;
A recess is formed at the boundary between the flat portion and the protruding portion.
Lower blade for stripping flat conductor wires.