JP6447523B2 - Blade for stripping flat wire - Google Patents
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- JP6447523B2 JP6447523B2 JP2016003516A JP2016003516A JP6447523B2 JP 6447523 B2 JP6447523 B2 JP 6447523B2 JP 2016003516 A JP2016003516 A JP 2016003516A JP 2016003516 A JP2016003516 A JP 2016003516A JP 6447523 B2 JP6447523 B2 JP 6447523B2
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Description
本発明は平角導線の被膜剥離用の刃に関する。 The present invention relates to a blade for stripping a flat conductive wire.
特許文献1には、平角導線の被膜を剥離するための刃が開示されている。 Patent Document 1 discloses a blade for peeling a coating film of a rectangular conducting wire.
ところで、上刃と下刃とを用いて平角導線の被膜を剥離する剥離方法を、発明者は想起した。具体的には、平角導線を下刃の上側端面に置くことによって保持させた状態で、上刃を平角導線の側面近傍に押し付けて、下刃とすれ違うように押し切る。これによって平角導線の側面近傍における被膜には、せん断応力がかかるため、被膜が平角導線から剥離される。 By the way, the inventor has conceived a peeling method in which the coating film of the flat conducting wire is peeled off using the upper blade and the lower blade. Specifically, in a state where the flat conducting wire is held by placing it on the upper end surface of the lower blade, the upper blade is pressed near the side surface of the flat conducting wire so as to pass through the lower blade. As a result, since a shear stress is applied to the coating in the vicinity of the side surface of the flat conductor, the coating is peeled off from the flat conductor.
下刃は、端面において、平坦部と、この平坦部に隣接しつつ端面の両端部に設けられる突出部とを有する。突出部は、端面の端側に向かって傾斜しつつ端面から突き出る。平角導線を下刃の端面に置くことによって保持させた状態において、平坦部と突出部は、平角導線に接触している。 A lower blade has a flat part in an end surface, and the protrusion part provided in the both ends of an end surface adjacent to this flat part. The protruding portion protrudes from the end surface while being inclined toward the end side of the end surface. In a state where the flat conducting wire is held by being placed on the end face of the lower blade, the flat portion and the protruding portion are in contact with the flat conducting wire.
このような上刃と下刃とを用いて、平角導線の被膜を剥離する剥離方法では、剥離を繰り返すと、平坦部と突出部との境界部には、疲労破壊が生じることが有った。 In such a peeling method that peels the flat conductor film using the upper and lower blades, repeated peeling may cause fatigue failure at the boundary between the flat portion and the protruding portion. .
具体的には、図6に示すように、下刃91は、平坦部91aと、突出部91bと、平坦部91aと突出部91bとの境界部である境界部91cとを有する。上刃と下刃91を用いて、平角導線の被膜を剥離する剥離方法では、剥離を繰り返したとき、割れC1が境界部91cに生じることが有った。 Specifically, as shown in FIG. 6, the lower blade 91 includes a flat portion 91a, a protruding portion 91b, and a boundary portion 91c that is a boundary portion between the flat portion 91a and the protruding portion 91b. In the peeling method in which the flat conductive wire film is peeled using the upper blade and the lower blade 91, when the peeling is repeated, a crack C1 may occur in the boundary portion 91c.
本発明に係る平角導線の被膜剥離用の下刃は、高い耐久性を有するものである。 The lower blade for stripping a flat conductive wire according to the present invention has high durability.
本発明に係る平角導線の被膜剥離用の下刃は、
平角導線を保持した状態で、上刃を用いて、当該平角導線の被膜を剥離させるための平角導線の被膜剥離用の下刃であって、
前記端面に設けられている平坦部と、前記端面の両端部に設けられており、前記平坦部に隣接する突出部と、を備え、
前記突出部は、テーパ面を有し、
前記平坦部と前記突出部との境界部には、窪み部が形成されている。
このような構成によれば、平坦部と突出部との境界部における応力集中を抑制することができる。そのため、剥離加工を繰り返しても、疲労破壊が発生し難い。すなわち、高い耐久性を有する。
The lower blade for stripping the coating of the flat wire according to the present invention is
In the state where the flat wire is held, using the upper blade, the lower blade for peeling the film of the flat wire for peeling the film of the flat wire,
A flat portion provided on the end surface; and a projecting portion provided on both end portions of the end surface and adjacent to the flat portion,
The protrusion has a tapered surface;
A recess is formed at the boundary between the flat portion and the protruding portion.
According to such a configuration, stress concentration at the boundary portion between the flat portion and the protruding portion can be suppressed. Therefore, even if the peeling process is repeated, fatigue failure hardly occurs. That is, it has high durability.
本発明に係る平角導線の被膜剥離用の下刃は、高い耐久性を有する。 The lower blade for stripping a flat conductive wire according to the present invention has high durability.
実施の形態1
図1及び図2を参照して、剥離下刃について説明する。図1は、平角導線の被膜の剥離方法の一工程を示す模式図である。図2は、実施の形態1に係る剥離下刃の要部を示す模式図である。
Embodiment 1
The peeling lower blade is demonstrated with reference to FIG.1 and FIG.2. FIG. 1 is a schematic diagram showing one step of a method for peeling a flat conductive wire film. FIG. 2 is a schematic diagram illustrating a main part of the peeling lower blade according to the first embodiment.
図1及び図2に示すように、下刃1は、端面において、平坦部1aと、突出部1bと、窪み部1cとを含む。平坦部1aは、端面の中央部に設けられている。突出部1bは、端面の両端部に設けられており、平坦部1aに隣接する。突出部1bは、端面の端1eから平坦部1aに向かって傾斜するテーパ面1dを有する。テーパ面1dと平坦部1aとが交差して成る角度αは、所定の大きさを有する。角度αは、例えば、15°以上75°以下の範囲の所定の値である。下刃1は、一般的に刃物として用いられる材料、例えば、高速度工具鋼からなる。下刃1の平坦部1aから突出部1bの先端までの長さt、角度αは、平角導線W1(後述)を保持しやすいような値であればよい。 As shown in FIG.1 and FIG.2, the lower blade 1 contains the flat part 1a, the protrusion part 1b, and the hollow part 1c in an end surface. The flat part 1a is provided in the center part of the end surface. The protruding portion 1b is provided at both end portions of the end face and is adjacent to the flat portion 1a. The protrusion 1b has a tapered surface 1d that is inclined from the end 1e of the end surface toward the flat portion 1a. An angle α formed by the intersection of the tapered surface 1d and the flat portion 1a has a predetermined size. The angle α is, for example, a predetermined value in a range of 15 ° to 75 °. The lower blade 1 is made of a material generally used as a blade, for example, high-speed tool steel. The length t and the angle α from the flat portion 1a of the lower blade 1 to the tip of the protruding portion 1b may be values that can easily hold the flat conducting wire W1 (described later).
窪み部1cは、平坦部1aと突出部1bとの間に設けられている。窪み部1cは、下刃1の内部に向かって窪み、窪み部1cの面は、所定の曲率Rを有する。例えば、下刃1の平坦部1aから突出部1bの先端までの長さt[mm]が0.4、角度α[°]が45であるとき、曲率R[mm−1]は、例えば、0.10以上であると好ましく、さらに好ましくは0.27以上である。角度αが大きくなると、窪み部1cにかかる応力集中が進む傾向にあるため、曲率Rも増大させると好ましい。 The hollow portion 1c is provided between the flat portion 1a and the protruding portion 1b. The recessed portion 1c is recessed toward the inside of the lower blade 1, and the surface of the recessed portion 1c has a predetermined curvature R. For example, when the length t [mm] from the flat part 1a of the lower blade 1 to the tip of the protruding part 1b is 0.4 and the angle α [°] is 45, the curvature R [mm −1 ] is, for example, Preferably it is 0.10 or more, More preferably, it is 0.27 or more. As the angle α increases, the stress concentration on the depression 1c tends to advance, so it is preferable to increase the curvature R.
(剥離方法の一例)
次に、下刃1を用いて、平角導線の被膜を剥離する方法について説明する。
(Example of peeling method)
Next, a method for peeling the flat conductive wire film using the lower blade 1 will be described.
まず、平角導線W1を下刃1の端面に置いて、下刃1に保持させる(平角導線保持ステップST1)。ここで、平角導線W1の軸は、図1の紙面奥行き方向(ここでは、X軸方向)に沿っている。平坦部1aと突出部1bとは、平角導線W1に接触しており、平角導線W1は下刃1と密着していると好ましい。平角導線W1は、純銅又は銅合金からなる芯線W1aと、芯線W1aの外周面を覆いつつ芯線W1aを電気的に絶縁する被膜W1bとを含む。 First, the flat conducting wire W1 is placed on the end face of the lower blade 1 and is held by the lower blade 1 (flat conducting wire holding step ST1). Here, the axis of the flat conducting wire W1 is along the paper surface depth direction of FIG. 1 (here, the X-axis direction). The flat portion 1a and the protruding portion 1b are in contact with the flat conducting wire W1, and the flat conducting wire W1 is preferably in close contact with the lower blade 1. The flat conducting wire W1 includes a core wire W1a made of pure copper or a copper alloy, and a coating W1b that covers the outer peripheral surface of the core wire W1a and electrically insulates the core wire W1a.
続いて、クランプ2を平角導線W1に押し付けて、平角導線W1をクランプ2と下刃1との間に挟み込む(クランプステップST2)。クランプ2の幅は、平角導線W1と下刃1と同じ又はわずかに小さいとよい。 Subsequently, the clamp 2 is pressed against the flat conducting wire W1, and the flat conducting wire W1 is sandwiched between the clamp 2 and the lower blade 1 (clamp step ST2). The width of the clamp 2 may be the same as or slightly smaller than the rectangular conductive wire W1 and the lower blade 1.
最後に、被膜W1bを剥離させる(被膜剥離ステップST3)。具体的には、上刃3を下刃1とすれちがうようにクランプ2側から下刃1側へ押し出して、平角導線W1の被膜W1bと芯線W1aとの間にせん断応力を生じさせる。このせん断応力によって、平角導線W1の被膜W1bを芯線W1aから剥離させる。ここで、下刃1の平坦部1aと、突出部1bとの境界には、応力が集中する。しかし、窪み部1cの面が所定の曲率Rを有するため、応力が、窪み部1cに分散する。これによって、応力が、下刃1の平坦部1aと、突出部1bとの境界に集中することを抑制する。 Finally, the film W1b is peeled off (film peeling step ST3). Specifically, the upper blade 3 is pushed from the clamp 2 side to the lower blade 1 side so as to pass the lower blade 1, and a shear stress is generated between the coating W1b of the flat wire W1 and the core wire W1a. With this shear stress, the coating W1b of the flat conducting wire W1 is peeled off from the core wire W1a. Here, stress concentrates on the boundary between the flat portion 1a of the lower blade 1 and the protruding portion 1b. However, since the surface of the recess 1c has a predetermined curvature R, the stress is dispersed in the recess 1c. Thereby, it is suppressed that stress concentrates on the boundary of the flat part 1a of the lower blade 1 and the protrusion part 1b.
以上、実施の形態1に係る剥離下刃によれば、下刃1における応力集中を抑制し、割れの発生を抑えるため、高い耐久性を有する。 As mentioned above, according to the peeling lower blade which concerns on Embodiment 1, in order to suppress the stress concentration in the lower blade 1 and to suppress generation | occurrence | production of a crack, it has high durability.
(剥離方法の他の一例)
なお、図3A〜図3Eに示す複数の工程と、図1に示す工程とを組み合わせて、平角導線W1の被膜W1bの剥離を行なうことができる。図3A〜図3Eは、平角導線の被膜の剥離方法の一工程を示す模式図である。
(Another example of peeling method)
Note that the coating W1b of the flat conducting wire W1 can be peeled off by combining a plurality of steps shown in FIGS. 3A to 3E and the step shown in FIG. FIG. 3A to FIG. 3E are schematic views showing one step of a method for peeling a flat conductive wire film.
図3Aに示すように、平角導線W1の被膜W1bの一部を剥離する。すると、芯線W1aの外周面の一部位である剥離面W11が露出する。具体的には、下刃(図示略)を用いて、平角導線の被膜を剥離する方法と同様に、平角導線W1を下刃の端面に置くことによって保持させた状態で、上刃3を平角導線W1の側面近傍に押し付けて、下刃とすれ違うように押し切る。なお、ここで用いる下刃は、平角導線W1を保持できればよく、下刃1と異なる形状を有してもよい。剥離面W11は、被膜W1bを剥離するとともに、芯線W1aの外周面の一部を削ることで、形成してもよい。 As shown in FIG. 3A, a part of the coating W1b of the flat conducting wire W1 is peeled off. Then, the peeling surface W11 which is one part of the outer peripheral surface of the core wire W1a is exposed. Specifically, in the same manner as the method of peeling the flat conductor wire coating using the lower cutter (not shown), the upper cutter 3 is held in a state of being held by placing the flat conductor W1 on the end face of the lower cutter. Press near the side of the lead wire W1 and push it so as to pass the lower blade. In addition, the lower blade used here should just hold | maintain the flat conducting wire W1, and may have a shape different from the lower blade 1. FIG. The peeling surface W11 may be formed by peeling off the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.
続いて、図3Bに示すように、剥離面W11が露出した平角導線W1を、図3Aの紙面に向かって時計回りに90°回転させた向きとなるように保持した後で、平角導線W1の被膜W1bの一部を剥離する。すると、芯線W1aの外周面の一部位である剥離面W12が露出する。図3Aに示す工程と同様の剥離方法を用いることができる。剥離面W12は、被膜W1bを剥離するとともに、芯線W1aの外周面の一部を削ることで、形成してもよい。 Subsequently, as shown in FIG. 3B, after holding the flat conductive wire W1 with the peeling surface W11 exposed so as to be rotated 90 ° clockwise toward the paper surface of FIG. 3A, A part of the coating W1b is peeled off. Then, the peeling surface W12 which is one part of the outer peripheral surface of the core wire W1a is exposed. A peeling method similar to that shown in FIG. 3A can be used. The peeling surface W12 may be formed by peeling the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.
続いて、図3Cに示すように、剥離面W12が露出した平角導線W1を、図3Bの紙面に向かって反対時計回りに45°回転させた向きとなるように保持した後で、平角導線W1の被膜W1bの角部を剥離する。すると、剥離面W13が露出する。図3Aに示す工程と同様の剥離方法を用いることができる。剥離面W13は、被膜W1bを剥離するとともに、芯線W1aの外周面の一部を削ることで、形成してもよい。 Subsequently, as shown in FIG. 3C, the flat conductive wire W1 with the peeled surface W12 exposed is held in a direction rotated 45 ° counterclockwise toward the paper surface of FIG. 3B, and then the flat conductive wire W1. The corner of the coating W1b is peeled off. Then, the peeling surface W13 is exposed. A peeling method similar to that shown in FIG. 3A can be used. The peeling surface W13 may be formed by peeling off the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.
続いて、図3Dに示すように、剥離面W13が露出した平角導線W1を、図3Cの紙面に向かって時計回りに90°回転させた向きとなるように保持した後で、平角導線W1の被膜W1bの角部を剥離する。すると、剥離面W14が露出する。図3Aに示す工程と同様の剥離方法を用いることができる。剥離面W14は、被膜W1bを剥離するとともに、芯線W1aの外周面の一部を削ることで、形成してもよい。 Subsequently, as shown in FIG. 3D, after holding the flat conducting wire W1 with the peeling surface W13 exposed so as to be rotated 90 ° clockwise toward the paper surface of FIG. 3C, The corners of the coating W1b are peeled off. Then, the peeling surface W14 is exposed. A peeling method similar to that shown in FIG. 3A can be used. The peeling surface W14 may be formed by peeling the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a.
最後に、下刃1を用いて、平角導線の被膜を剥離する方法を用いて、平角導線W1の被膜を剥離する。具体的には、図3Eに示すように、剥離面W14が露出した平角導線W1を、図3Dの紙面に向かって反時計回りに45°回転させた向きとなるように保持した後で、平角導線W1の被膜W1bの側面を剥離する。すると、剥離面W15が露出する。剥離面W15は、被膜W1bを剥離するとともに、芯線W1aの外周面の一部を削ることで、形成してもよい。図3Aに示す工程と同様の剥離方法を用いることができる。剥離面W13の一方、及び剥離面W14の一方が2つのテーパ面1d(図2参照)とそれぞれ接触するため、平角導線W1と下刃1の端面が密着し得る。平角導線W1と下刃1の端面が密着すると、平角導線W1が下刃1に安定的に保持されてよい。テーパ面1dは、剥離面W13の一方、及び剥離面W14の一方と密着し得るような形状を有するとよい。 Finally, the coating of the flat conducting wire W1 is peeled off using the lower blade 1 and the method of peeling off the flat conducting wire. Specifically, as shown in FIG. 3E, the flat wire W1 from which the peeling surface W14 is exposed is held in a direction rotated 45 ° counterclockwise toward the paper surface of FIG. The side surface of the coating W1b of the conducting wire W1 is peeled off. Then, the peeling surface W15 is exposed. The peeling surface W15 may be formed by peeling off the coating W1b and scraping a part of the outer peripheral surface of the core wire W1a. A peeling method similar to that shown in FIG. 3A can be used. Since one of the peeling surfaces W13 and one of the peeling surfaces W14 are in contact with the two tapered surfaces 1d (see FIG. 2), the flat conductive wire W1 and the end surface of the lower blade 1 can be in close contact with each other. When the flat conducting wire W1 and the end face of the lower blade 1 are in close contact, the flat conducting wire W1 may be stably held by the lower blade 1. The tapered surface 1d may have a shape that can be in close contact with one of the peeling surfaces W13 and one of the peeling surfaces W14.
これらによって、被膜の剥離によるバリの発生を抑制することができる。その結果、次工程におけるバリの噛み込みの発生を抑制することができる。また、上記した図1、図3A〜図3Eに示す工程では、同じ種類の工具や装置を使用し得るため、設備コストを抑制し得る。 By these, generation | occurrence | production of the burr | flash by peeling of a film can be suppressed. As a result, the occurrence of burr biting in the next step can be suppressed. Moreover, in the process shown to FIG. 1, FIG. 3A-FIG. 3E mentioned above, since the same kind of tool and apparatus can be used, installation cost can be suppressed.
(計算例)
次に、実施例として下刃1(図1及び2参照)と同じ構成を有する下刃を用いて、平角導線の被膜を剥離したときの、下刃1の端面に発生する応力の値を計算した結果について説明する。その計算の結果を図4に示した。なお、参考例として、下刃91(図6参照)と同じ構成を有する下刃を用いたときの、同様の応力の値を計算した。具体的には、本計算は、市販の応力解析ソフトウェアを用いて行い、ミーゼス応力を計算した。その計算の結果を図7に示した。実施例と参考例との計算条件は、窪み部1cを有するところを除いて、全て同じである。
(Calculation example)
Next, using the lower blade having the same configuration as the lower blade 1 (see FIGS. 1 and 2) as an example, the value of the stress generated on the end face of the lower blade 1 when the flat conductor film is peeled off is calculated. The results will be described. The result of the calculation is shown in FIG. As a reference example, the same stress value was calculated when a lower blade having the same configuration as the lower blade 91 (see FIG. 6) was used. Specifically, this calculation was performed using commercially available stress analysis software, and the Mises stress was calculated. The result of the calculation is shown in FIG. The calculation conditions of the example and the reference example are all the same except for the place having the recess 1c.
図4に示すように、窪み部1c(図2参照)に相当する窪み部201cにおける応力の最大値は、623MPaであった。一方、図7に示すように、境界部91c(図6参照)に相当する境界部901cにおける応力の最大値は、750MPaであった。したがって、窪み部1cにおける応力は、境界部91cにおける応力と比較して低く、17%減少した。 As shown in FIG. 4, the maximum value of the stress in the dent 201c corresponding to the dent 1c (see FIG. 2) was 623 MPa. On the other hand, as shown in FIG. 7, the maximum value of stress at the boundary portion 901c corresponding to the boundary portion 91c (see FIG. 6) was 750 MPa. Therefore, the stress in the hollow portion 1c was lower than that in the boundary portion 91c and decreased by 17%.
ところで、実施例を構成する材料の一例、ここでは、高速度工具鋼の一例のSN曲線を図5に示した。図5に示すように、下刃91と同じ構成を有する下刃を用いた場合、応力が1150MPaであり、繰り返し回数10万回で疲労限度に到達する。 By the way, FIG. 5 shows an SN curve of an example of a material constituting the embodiment, here, an example of a high-speed tool steel. As shown in FIG. 5, when a lower blade having the same configuration as the lower blade 91 is used, the stress is 1150 MPa, and the fatigue limit is reached after 100,000 repetitions.
一方、上記した計算結果から、応力が17%減少していることから、応力の最大値を17%減少させた値が、窪み部1cにかかると考えられる。したがって、下刃1と同じ構成の下刃を用いた場合、応力の最大値が17%減少して、955MPaとなると考えられる。そのため、繰り返し回数は150万回を超えても疲労限度に到達しないと考えられる。すなわち、下刃1と同じ構成の下刃は、下刃91と同じ構成の下刃と比較して、平角導線の被膜の剥離を多数回繰り返しても、疲労限度に到達しにくいと考えられる。つまり、下刃1と同じ構成の下刃は、下刃91と同じ構成の下刃と比較して、高い耐久性を有すると考えられる。 On the other hand, from the calculation result described above, since the stress is reduced by 17%, it is considered that the value obtained by reducing the maximum value of the stress by 17% is applied to the depression 1c. Therefore, when the lower blade having the same configuration as the lower blade 1 is used, it is considered that the maximum value of stress is reduced by 17% to 955 MPa. Therefore, it is considered that the fatigue limit is not reached even when the number of repetitions exceeds 1.5 million. That is, it is considered that the lower blade having the same configuration as the lower blade 1 is less likely to reach the fatigue limit even when the coating of the flat conductive wire is repeatedly peeled many times as compared with the lower blade having the same configuration as the lower blade 91. That is, the lower blade having the same configuration as the lower blade 1 is considered to have higher durability than the lower blade having the same configuration as the lower blade 91.
なお、本発明は上記実施の形態に限られたものではなく、趣旨を逸脱しない範囲で適宜変更することが可能である。 Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention.
1 下刃
1a 平坦部 1b 突出部
1c 窪み部 1d テーパ面
1e 端
3 上刃
W1 平角導線
W1b 被膜
DESCRIPTION OF SYMBOLS 1 Lower blade 1a Flat part 1b Protrusion part 1c Depression part 1d Tapered surface 1e End 3 Upper blade W1 Flat wire W1b Coating
Claims (1)
端面に設けられている平坦部と、前記端面の両端部に設けられており、前記平坦部に隣接する突出部と、を備え、
前記突出部は、テーパ面を有し、
前記平坦部と前記突出部との境界部には、窪み部が形成されている、
平角導線の被膜剥離用の下刃。 In the state where the flat wire is held, using the upper blade, the lower blade for peeling the film of the flat wire for peeling the film of the flat wire,
A flat portion provided on the end surface, and provided at both end portions of the end surface, and a protrusion adjacent to the flat portion,
The protrusion has a tapered surface;
A recess is formed at the boundary between the flat portion and the protruding portion.
Lower blade for stripping flat conductor wires.
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JP6697787B1 (en) * | 2018-11-26 | 2020-05-27 | 三菱電機株式会社 | Insulating film cutting device for conductor wire and insulating film cutting method |
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