JP6445504B2 - Ball screw nut polishing equipment - Google Patents
Ball screw nut polishing equipment Download PDFInfo
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- JP6445504B2 JP6445504B2 JP2016196629A JP2016196629A JP6445504B2 JP 6445504 B2 JP6445504 B2 JP 6445504B2 JP 2016196629 A JP2016196629 A JP 2016196629A JP 2016196629 A JP2016196629 A JP 2016196629A JP 6445504 B2 JP6445504 B2 JP 6445504B2
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- tape
- polishing
- nut
- ball groove
- guide
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- 238000005498 polishing Methods 0.000 title claims description 168
- 230000007246 mechanism Effects 0.000 claims description 132
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000004804 winding Methods 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 6
- 230000007723 transport mechanism Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明はボールねじ用のナットのボール溝を研磨テープで研磨する際に用いられるボールねじ用ナット研磨装置に関するものである。 The present invention relates to a ball screw nut polishing apparatus used when polishing a ball groove of a ball screw nut with a polishing tape.
従来、この種のボールねじ用ナット研磨装置として、ねじ軸、ナット及びボールの各要素からなるボールねじ用のナットのボール溝を砥石により研削を行う構造のものが知られている。 2. Description of the Related Art Conventionally, as this type of ball screw nut polishing apparatus, there is known a structure in which a ball groove of a ball screw nut comprising a screw shaft, a nut and a ball is ground with a grindstone.
しかしながら上記従来構造の場合、ボールねじ用のナットのボール溝はボールが転走する溝であるにもかかわらず、必ずしも、良好な仕上面を得ることができないことがあるという不都合を有している。 However, in the case of the above-described conventional structure, the ball groove of the ball screw nut has a disadvantage that a good finish may not always be obtained even though the ball groove is a groove on which the ball rolls. .
本発明はこのような不都合を解決することを目的とするもので、本発明のうち、請求項１記載の発明は、ボールねじ用のナットを回転自在に保持する保持機構と、該ナットを該軸線を中心として回転させる回転機構と、研磨テープを連続的又は間欠的に移送させるテープ移送機構と、該研磨テープを行戻移送案内する行案内部及び戻案内部を有すると共に行戻移送案内される研磨テープの折返部分を側方に迂回案内可能な迂回案内部を有し、該迂回案内部には上記研磨テープの行側部分及び戻側部分のうちの行側部分を行案内部から側方に折り返すと共に戻側部分を側方から戻案内部に折り返す二つの折返面部及び該両折返面部により側方に折り返された研磨テープを迂回案内すると共に研磨圧力を受ける圧接ロールが設けられ、該圧接ロールにより側方に迂回案内された研磨テープの側方迂回部分を上記ナットのボール溝を研磨可能な迂回研磨部とするテープ折返研磨機構と、該研磨テープの該迂回研磨部を該圧接ロールの外周面で該ナットのボール溝に圧接させるテープ圧接機構と、該圧接ロールの回転軸線を該ボール溝のリード角に対応して傾斜配置させる傾斜機構と、該研磨テープを該ナットの軸線方向に移動させるテープ移動機構と、該ナットの回転速度と該研磨テープの移動速度とを該ボール溝のリードに対応して同期させる速度同期手段とからなり、上記テープ圧接機構に上記研磨テープの上記迂回研磨部を上記圧接ロールの外周面で上記ナットのボール溝に圧接させる圧接台が圧接移動自在に設けられ、かつ、上記テープ折返研磨機構に研磨テープを行戻移送案内する行案内部及び戻案内部を有すると共に行戻移送案内される研磨テープの折返部分を側方に迂回案内可能な迂回案内部を有する案内部材が設けられ、上記傾斜機構として、上記テープ圧接機構の圧接台に上記テープ折返研磨機構の案内部材を支点ピンにより水平旋回自在に設け、該案内部材を位置固定する位置調節固定機構を設けて構成したことを特徴とするボールねじ用ナット研磨装置にある。 SUMMARY OF THE INVENTION The present invention aims to solve such disadvantages, and among the present inventions, the invention according to claim 1 comprises a holding mechanism for rotatably holding a nut for a ball screw, and the nut. A rotation mechanism that rotates about an axis, a tape transfer mechanism that transfers the polishing tape continuously or intermittently, and a line guide portion and a return guide portion that guide the return movement of the polishing tape, and the return transfer guide is provided. A detour guide portion capable of detouring the folded portion of the polishing tape to the side, and the detour guide portion on the row side portion of the row side portion and the return side portion of the polishing tape from the line guide portion. Two folding surface portions that are folded back and the return side portion is folded back from the side to the return guide portion, and a pressure contact roll that detours the polishing tape folded back to the side by the both folding surface portions and receives polishing pressure are provided, Pressure welding low A tape turn-back polishing mechanism in which the side bypass portion of the polishing tape guided by the side by the bypass is a bypass polishing portion capable of polishing the ball groove of the nut, and the bypass polishing portion of the polishing tape is the outer periphery of the press roll A tape pressure contact mechanism that presses the ball groove of the nut on the surface, a tilt mechanism that tilts and arranges the rotation axis of the pressure roll according to the lead angle of the ball groove, and moves the polishing tape in the axial direction of the nut And a speed synchronization means for synchronizing the rotation speed of the nut and the movement speed of the polishing tape in correspondence with the lead of the ball groove, and the detour polishing of the polishing tape to the tape pressure contact mechanism. A pressure contact base that presses the portion to the ball groove of the nut on the outer peripheral surface of the pressure contact roll is provided so as to be able to move in pressure contact, and the polishing tape is returned to the tape folding polishing mechanism. And a guide member having a detour guide portion capable of detouring the folded portion of the polishing tape to be guided back and forth to the side, and the tape pressure contact mechanism as the tilt mechanism. A ball screw nut polishing apparatus characterized in that a guide member of the tape folding polishing mechanism is provided on a pressure contact table of the tape turntable by a fulcrum pin so as to be horizontally rotatable and a position adjustment fixing mechanism for fixing the position of the guide member is provided. is there.
又、請求項２記載の発明は、上記テープ移送機構、上記テープ折返研磨機構、上記テープ圧接機構、及び上記傾斜機構を上記ナットの軸線方向と交差する方向に移動させるテープ待避機構を備えてなることを特徴とするものであり、又、請求項３記載の発明は、上記速度同期手段として、上記ナットを回転させる回転用制御モータ、上記研磨テープを移動させる移動用制御モータ、及び該回転用制御モータの回転速度と該移動用制御モータの回転速度とを同期制御する同期制御部からなることを特徴とするものである。 According to a second aspect of the present invention, there is provided a tape retracting mechanism for moving the tape transport mechanism, the tape folding polishing mechanism, the tape pressure contact mechanism, and the tilt mechanism in a direction intersecting the axial direction of the nut. In the invention according to claim 3, as the speed synchronization means, a rotation control motor for rotating the nut, a movement control motor for moving the polishing tape, and the rotation It is characterized by comprising a synchronous control unit for synchronously controlling the rotational speed of the control motor and the rotational speed of the moving control motor.
本発明は上述の如く、請求項１記載の発明にあっては、ボールねじ用のナットを保持機構により回転自在に保持し、ナットを回転機構により軸線を中心として回転させ、上記研磨テープをテープ移送機構により連続的又は間欠的に移送させ、テープ折返研磨機構により研磨テープを行案内部及び戻案内部により行戻移送案内すると共に行戻移送案内される研磨テープの折返部分を迂回案内部により側方に迂回し、迂回案内部の二つの折返面部により研磨テープの行側部分及び戻側部分のうちの行側部分を行案内部から側方に折り返すと共に戻側部分を側方から戻案内部に折り返し、両折返面部により側方に折り返された研磨テープを圧接ロールにより迂回案内し、圧接ロールにより側方に迂回案内された研磨テープの側方迂回部分を上記ナットのボール溝を研磨可能な迂回研磨部とし、テープ圧接機構により研磨テープの側方迂回部分としての迂回研磨部を圧接ロールの外周面でナットのボール溝に圧接させ、圧接ロールにより研磨圧力を受け、傾斜機構により圧接ロールの回転軸線をボール溝のリード角に対応して傾斜配置させ、テープ移動機構により研磨テープをナットの軸線方向に移動させ、速度同期手段によりナットの回転速度と研磨テープの移動速度とをボール溝のリードに対応して同期させ、ナットの回転と、研磨テープの上記移送と、ナットの回転速度に同期した研磨テープの移動との複合動作によりボール溝を研磨テープで研磨することができ、上記テープ圧接機構に上記研磨テープの上記迂回研磨部を上記圧接ロールの外周面で上記ナットのボール溝に圧接させる圧接台が圧接移動自在に設けられ、かつ、上記テープ折返研磨機構に研磨テープを行戻移送案内する行案内部及び戻案内部を有すると共に行戻移送案内される研磨テープの折返部分を側方に迂回案内可能な迂回案内部を有する案内部材が設けられ、上記傾斜機構として、上記テープ圧接機構の圧接台に上記テープ折返研磨機構の案内部材を支点ピンにより水平旋回自在に設け、案内部材を位置固定する位置調節固定機構を設けて構成され、圧接ロールの回転軸線はボール溝のリード角に対応して傾斜配置されると共にナットの回転速度に同期した研磨テープの移動により研磨テープはボール溝のリードに合致して移動して研磨テープはボール溝に確実に圧接され、研磨テープでボール溝を確実に研磨することができ、研磨精度を向上することができ、ボール溝の表面あらさを向上することができ、ボール溝の研磨作業性を向上することができる。 As described above, according to the present invention, the ball screw nut is rotatably held by the holding mechanism, the nut is rotated about the axis by the rotating mechanism, and the polishing tape is taped. The transfer tape is continuously or intermittently transferred by the transfer mechanism, and the polishing tape is returned and guided by the line guide portion and the return guide portion by the tape return polishing mechanism, and the return portion of the polishing tape to be returned and transferred is guided by the detour guide portion. It detours to the side, and the line side part of the line side part and the return side part of the polishing tape is folded back from the line guide part to the side and the return side part is returned from the side by the two folding surface parts of the detour guide part. The polishing tape folded back to the side and detoured sideways by both folded surface portions is detoured by the pressure contact roll, and the side detour portion of the polishing tape detoured sideways by the pressure contact roll is The ball groove of the grinding tape is made a detourable polishing part, and the detouring polishing part as the side detouring part of the polishing tape is pressed against the ball groove of the nut on the outer peripheral surface of the pressing roll by the tape pressing mechanism, and the polishing pressure is received by the pressing roll. The rotation axis of the pressure contact roll is inclined and arranged according to the lead angle of the ball groove by the inclination mechanism, the polishing tape is moved in the axial direction of the nut by the tape moving mechanism, and the rotation speed of the nut and the polishing tape are The movement speed is synchronized with the lead of the ball groove, and the ball groove is polished with the polishing tape by a combined operation of the rotation of the nut, the above-mentioned transfer of the polishing tape, and the movement of the polishing tape in synchronization with the rotation speed of the nut. it is possible to, the bypass polishing section of the polishing tape is pressed against the ball groove of the nut on the outer peripheral surface of the pressure roll in the tape pressing mechanism A pressure contact base is provided so as to be able to press and move, and the tape folding polishing mechanism has a line guide portion for returning and guiding the polishing tape and a return guide portion, and the folding portion of the polishing tape to be guided to return movement is laterally provided. A guide member having a detour guide portion capable of detour guidance is provided, and as the tilt mechanism, the guide member of the tape folding polishing mechanism is provided on the press contact base of the tape press contact mechanism by a fulcrum pin so as to be pivotable horizontally. The position adjustment fixing mechanism for fixing the position is provided, and the rotation axis of the pressure contact roll is inclined according to the lead angle of the ball groove, and the polishing tape is moved to the ball groove by the movement of the polishing tape in synchronization with the rotation speed of the nut. The polishing tape is securely pressed against the ball groove by moving in accordance with the lead of the ball, and the ball groove can be reliably polished with the polishing tape, improving the polishing accuracy. Thus, the surface roughness of the ball groove can be improved, and the polishing workability of the ball groove can be improved.
又、請求項２記載の発明にあっては、上記テープ移送機構、上記テープ折返研磨機構、上記テープ圧接機構、及び上記傾斜機構を上記ナットの軸線方向と交差する方向に移動させるテープ待避機構を備えてなるから、保持機構に対するナットの供給及び取出を容易に行うことができ、又、請求項３記載の発明にあっては、上記速度同期手段として、上記ナットを回転させる回転用制御モータ、上記研磨テープを移動させる移動用制御モータ、及び回転用制御モータの回転速度と移動用制御モータの回転速度とを同期制御する同期制御部からなるので、ナットの回転速度と研磨テープの移動速度とをボール溝のリードに対応して同期させることができ、研磨テープをボール溝のリードに合致して確実に接触移動させることができ、構造を簡素化することができると共に研磨精度を向上することができる。 According to a second aspect of the present invention, there is provided a tape retracting mechanism for moving the tape transfer mechanism, the tape folding polishing mechanism, the tape pressing mechanism, and the tilt mechanism in a direction intersecting the axial direction of the nut. Since it is provided, it is possible to easily supply and take out the nut from the holding mechanism, and in the invention according to claim 3, as the speed synchronization means, a rotation control motor for rotating the nut, Since it comprises a movement control motor for moving the polishing tape, and a synchronous control unit for synchronously controlling the rotation speed of the rotation control motor and the rotation speed of the movement control motor, the rotation speed of the nut and the movement speed of the polishing tape Can be synchronized with the lead of the ball groove, and the polishing tape can be surely moved in contact with the lead of the ball groove, simplifying the structure It is possible to improve the polishing precision it is Rukoto.
図１乃至図１３は本発明の実施の形態例であって、この場合、大別して、図１、図２、図３、図４、図５、図９、図１１、図１３の如く、ボールねじ用のナットＷを回転自在に保持する保持機構Ａと、ナットＷをその軸線Ｗ１を中心として正逆回転させる回転機構Ｂと、実巻リールＲＦから空リールＲＥへと研磨テープＴを連続的又は間欠的に移送Ｓさせるテープ移送機構Ｃと、研磨テープＴを行戻移送案内する行案内部Ｄ１及び戻案内部Ｄ２を有すると共に行戻移送案内される研磨テープＴの折返部分を側方に迂回案内可能な迂回案内部Ｄ３を有し、迂回案内部Ｄ３には上記研磨テープＴの行側部分Ｔ１及び戻側部分Ｔ２のうちの行側部分Ｔ１を行案内部Ｄ１から側方に折り返すと共に戻側部分Ｔ２を側方から戻案内部Ｄ２に折り返す二つの折返面部Ｄ４・Ｄ４及び両折返面部Ｄ４・Ｄ４により側方に折り返された研磨テープＴを迂回案内すると共に研磨圧力を受ける圧接ロールＤ５が設けられ、圧接ロールＤ５により側方に迂回案内された研磨テープＴの側方迂回部分Ｔ３を上記ナットＷのボール溝Ｋを研磨可能な迂回研磨部Ｄ６とするテープ折返研磨機構Ｄと、研磨テープＴの側方迂回部分Ｔ３としての迂回研磨部Ｄ６を圧接ロールＤ５の外周面でナットＷのボール溝Ｋに圧接Ｍさせるテープ圧接機構Ｅと、圧接ロールＤ５の回転軸線Ｏをボール溝Ｋのリード角θに対応して傾斜配置させる傾斜機構Ｆと、研磨テープＴをナットＷの軸線Ｗ１方向に移動させるテープ移動機構Ｇと、ナットＷの回転速度Ｑと研磨テープＴの移動速度Ｖとをボール溝ＫのリードＬ（ナットＷが一回転したときにナットＷが軸線Ｗ１方向に進む距離）に対応して同期させる速度同期手段Ｈとから構成されている。 FIG. 1 to FIG. 13 show an embodiment of the present invention. In this case, as shown in FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. a holding mechanism a for rotatably holding the nut W of screws, the abrasive tape T and the rotation mechanism B for forward and reverse rotation of the nut W about its axis W 1, the actual winding reel R F empty reel R E and a tape transport mechanism C for continuously or intermittently moved S, fold the abrasive tape T to be the line back movement guide and having a line guide portion D 1 and return the guide portion D 2 of the polishing tape T Gyomodo movement guide portions has a detour guidable detour guiding portion D 3 laterally, the bypass guide portion D 3 rows portion T 1 of the one row portion T 1 and Modogawa portion T 2 of the said abrasive tape T folding the line guide portion D 1 to the guide portion D 2 returns the Modogawa portion T 2 from the side with folded laterally Pressure roll D 5 for receiving a polishing pressure with the two fold surface D 4 · D 4 and Ryoorikae surface D 4 · D 4 The abrasive tape T is folded laterally bypass guide is provided to return, pressure roll D 5 a polishing mechanism D tape folding return to the side detour T 3 the nut W ball groove K polishable detour polishing section D 6 of the abrasive tape T which has been diverted guided laterally by lateral abrasive tape T a tape pressing mechanism E for pressing M to the ball groove K of the nut W detour polishing section D 6 as the outer peripheral surface of the press roll D 5 detour T 3, the lead of the rotary axis O of the ball groove K of the press roll D 5 An inclination mechanism F for inclining arrangement corresponding to the angle θ, a tape moving mechanism G for moving the polishing tape T in the direction of the axis W 1 of the nut W, a rotational speed Q of the nut W, and a moving speed V of the polishing tape T Ball groove K lead Is composed of a speed synchronization means H for synchronizing in response to (nut W is distance traveled in the axial W 1 direction when the nut W is one rotation).
この場合、さらに、図１の如く、上記テープ移送機構Ｃ、上記テープ折返研磨機構Ｄ、上記テープ圧接機構Ｅ、及び上記傾斜機構Ｆを上記ナットＷの軸線Ｗ１方向と交差する方向に移動させるテープ待避機構Ｉを備えて構成している。 In this case, further, as shown in FIG. 1, moving the tape transport mechanism C, the tape folding return polishing mechanism D, the tape pressing mechanism E, and the tilting mechanism F in a direction crossing the axial line W 1 direction of the nut W The tape retracting mechanism I is provided.
この場合、上記保持機構Ａ及び上記回転機構Ｂにあっては、図１、図２の如く、機台１に保持台２を立設し、保持台２にボールねじ用のナットＷの一方端部を着脱保持可能なチャック３を配設し、チャック３を回転用制御モータ４により回転させてナットＷを回転させるように構成している。 In this case, in the holding mechanism A and the rotating mechanism B, as shown in FIGS. 1 and 2, a holding base 2 is erected on the machine base 1, and one end of a ball screw nut W is placed on the holding base 2. A chuck 3 capable of detachably holding the part is provided, and the nut 3 is rotated by rotating the chuck 3 by a rotation control motor 4.
又、この場合、上記テープ移動機構Ｇにあっては、図１、図２、図３の如く、上記保持台２に移動台５を摺動部５ａ・５ａ及び案内レール２ａ・２ａによりナットＷの軸線Ｗ１方向に水平摺動自在に設け、移動台５をねじ軸６ａ、ナット部材６ｂ及び移動用制御モータ６ｃからなるボールねじ機構６により研磨テープＴをナットＷの軸線Ｗ１方向に移動させるように構成している。 In this case, in the tape moving mechanism G, as shown in FIGS. 1, 2 and 3, the moving table 5 is moved to the holding table 2 by the sliding portions 5a and 5a and the guide rails 2a and 2a. provided in the axial W 1 direction freely horizontally slidable, moving the moving table 5 the screw shaft 6a, the abrasive tape T in the axial W 1 direction of the nut W by a ball screw mechanism 6 consisting of the nut member 6b and movement control motor 6c It is configured to make it.
又、この場合、上記テープ待避機構Ｉにあっては、図１、図２、図３の如く、上記移動台５に取付基台７を摺動部７ａ・７ａ及び案内レール５ｂ・５ｂによりナットＷの軸線Ｗ１方向に水平摺動自在に設け、移動台５をねじ軸８ａ、ナット部材８ｂ及び退避用制御モータ８ｃからなるボールねじ機構８により上記テープ移送機構Ｃ、上記テープ折返研磨機構Ｄ、上記テープ圧接機構Ｅ、及び上記傾斜機構Ｆを上記ナットＷの軸線Ｗ１方向と交差する方向に移動させるように構成している。 In this case, in the tape retracting mechanism I, as shown in FIGS. 1, 2, and 3, the mounting base 7 is attached to the movable base 5 by the sliding portions 7a and 7a and the guide rails 5b and 5b. provided freely horizontally slide in the axial line W 1 direction is W, the moving table 5 the screw shaft 8a, a nut member 8b and the tape transport mechanism C by the ball screw mechanism 8 comprising a retraction control motor 8c, the tape folding return polishing mechanism D constitute the tape pressing mechanism E, and the tilt mechanism F to move in a direction crossing the axial line W 1 direction of the nut W.
又、上記テープ移送機構Ｃにあっては、図１の如く、上記取付基台７に上記研磨テープＴを巻回してなる実巻リールＲＦを支持軸９により回転自在に配置すると共に空リールＲＥを支持軸１０により回転自在に配置し、実巻リールＲＦから解いた研磨テープＴを上記テープ折返研磨機構Ｄを介して空リールＲＥに巻き付け、実巻リールＲＦは巻解用モータ１１により巻き解き回転すると共に空リールＲＥは巻取用モータ１２により巻き取り回転し、かつ、上記実巻リールＲＦとテープ折返研磨機構Ｄ及びテープ折返研磨機構Ｄと上記空リールＲＥとの間に移送用モータ１１ａ・１２ａにより送り回転する移送ロール１１ｂ・１２ｂ及び挟圧ロール１１ｃ・１２ｃを配設し、巻解用モータ１１、巻取用モータ１２、移送用モータ１１ａ・１２ａの協動により研磨テープＴを実巻リールＲＦからテープ折返研磨機構Ｄを介して空リールＲＥへと比較的低速で連続的又は間欠的に移送Ｓさせるように構成している。 Also, empty reel with in the above tape transport mechanism C, as shown in FIG. 1, arranged rotatably by a support shaft 9 the actual winding reel R F formed by winding the abrasive tape T to the mounting base 7 the R E rotatably disposed by the support shaft 10, the abrasive tape T solved from the real winding reel R F wound around the empty reel R E through the tape folding return polishing mechanism D, the actual winding reel R F for the winding solutions Check reel R E together with the rotating unwinding by the motor 11 rotates the take-up by the motor 12 for the winding, and the actual take-reel R F and the tape folding return polishing mechanism D and the tape folding return polishing mechanism D and the empty reel R E Are disposed between them, transfer rolls 11b and 12b and pinching rolls 11c and 12c that are rotated by transfer motors 11a and 12a, and unwinding motor 11, take-up motor 12, transfer motor 11a The cooperating by polishing tape T 2a from Jitsumaki reel R F through the tape folding return polishing mechanism D is configured so as to continuously or intermittently moved S at a relatively low speed into the sky reel R E.
ここに、研磨テープＴは、例えば、ポリエステルフィルム、メタル、クロス、発泡体フィルム、植毛布等の基材に酸化アルミニウム、酸化クロム、シリコンカーバイド、ダイヤモンド等の所定粒度の固定砥粒をコーティング又は結合してなるものが用いられている。尚、このような基材に固定砥粒を固着した構造の研磨テープＴを用いて潤滑剤を用いない乾式研磨構造や基材に固定砥粒を固着した構造の研磨テープＴを用いて潤滑剤を供給しつつ研磨する湿式研磨構造、或いは、固定砥粒を固着していない織布、不織布、発泡体フィルム、植毛布を研磨テープＴとして用いて遊離砥粒を含む研磨剤を供給する湿式研磨構造を採用することがあり、よって、ここでいう研磨テープＴは、固定砥粒を固着した構造の研磨テープＴや固定砥粒を固着していない構造の研磨テープＴをも含むものである。 Here, the polishing tape T is coated or bonded with a fixed abrasive particle of a predetermined particle size such as aluminum oxide, chromium oxide, silicon carbide, diamond on a base material such as polyester film, metal, cloth, foam film, and flocking cloth. What is formed is used. In addition, a lubricant using a polishing tape T having a structure in which fixed abrasive grains are fixed to a base material and a dry polishing structure in which no lubricant is used or a polishing tape T having a structure in which fixed abrasive grains are fixed to a base material is used. Wet polishing structure that polishes with supplying abrasive or wet polishing that supplies abrasive containing free abrasive using woven fabric, non-woven fabric, foam film, flocked fabric with fixed abrasive grains as polishing tape T Therefore, the polishing tape T here includes a polishing tape T having a structure in which fixed abrasive grains are fixed and a polishing tape T having a structure in which fixed abrasive grains are not fixed.
この場合、上記テープ折返研磨機構Ｄ、上記テープ圧接機構Ｅ及び上記傾斜機構Ｆにあっては、図４、図５、図６、図７の如く、上記テープ圧接機構Ｅとして、上記取付基台７に取付ベース１３を取り付け、取付ベース１３に上下ガイド台１４を立設し、上下ガイド台１４に圧接台１５を摺動部１４ａ及びガイドレール１５ａにより圧接移動自在に設け、圧接台１５を圧接用シリンダ１６により上下圧接動作自在に設けて構成している。 In this case, in the tape folding polishing mechanism D, the tape pressing mechanism E, and the tilting mechanism F, the mounting base is used as the tape pressing mechanism E as shown in FIGS. 4, 5, 6, and 7. 7, a mounting base 13 is installed, and an upper and lower guide table 14 is erected on the mounting base 13. The cylinder 16 is provided so as to be able to press up and down freely.
そして、上記傾斜機構Ｆとして、図４、図５、図６、図７の如く、上記圧接台１５に案内部材１７を支点ピン１８により水平旋回自在に設け、案内部材１７に取付ボルト１９ａ、長穴１９ｂ、調節ボルト１９ｃからなる位置調節固定機構１９を設け、しかして、案内部材１７を支点ピン１８を中心として水平旋回させ、これにより圧接ロールＤ５の回転軸線Ｏをボール溝Ｋのリード角θに対応して傾斜配置させ、位置調節固定機構１９により案内部材１７を位置固定するように構成している。 As the tilt mechanism F, as shown in FIGS. 4, 5, 6, and 7, a guide member 17 is provided on the pressure contact table 15 so as to be horizontally pivotable by a fulcrum pin 18, and the guide member 17 is provided with a mounting bolt 19a, a long length. hole 19b, the position adjustment fixing mechanism 19 consisting of the adjustment bolt 19c is provided, Thus, by horizontally turning the guide member 17 about the pivot pin 18, thereby the lead angle of the rotational axis O of the ball groove K of the press roll D 5 The guide member 17 is configured to be tilted in correspondence with θ and the position adjustment fixing mechanism 19 to fix the position of the guide member 17.
さらに、上記テープ折返研磨機構Ｄとして、図８、図９、図１０、図１１、図１２の如く、上記案内部材１７に研磨テープＴを行戻移送案内する細溝状の行案内部Ｄ１及び細溝状の戻案内部Ｄ２を有すると共に行戻移送案内される研磨テープＴの折返部分を側方に迂回案内可能な迂回案内部Ｄ３を有し、迂回案内部Ｄ３には上記研磨テープＴの行側部分Ｔ１及び戻側部分Ｔ２のうちの行側部分Ｔ１を行案内部Ｄ１から側方に折り返すと共に戻側部分Ｔ２を側方から戻案内部Ｄ２に折り返す４５度の二つの折返面部Ｄ４・Ｄ４及び両折返面部Ｄ４・Ｄ４により側方に折り返された研磨テープＴを迂回案内すると共に研磨圧力を受ける圧接ロールＤ５が設けられ、この場合、図８、図９、図１０の如く、案内部材１７の底面部に行案内部Ｄ１及び戻案内部Ｄ２を移送案内される研磨テープＴの行側部分Ｔ１及び戻側部分Ｔ２を案内する案内片２０を取り付け、案内部材１７の先端部に支持片２１を取り付け、支持片２１と案内部材１７の先端面との間に圧接ロールＤ５を回転自在に取り付け、圧接ロールＤ５により側方に迂回案内された研磨テープＴの側方迂回部分Ｔ３を上記ナットＷのボール溝Ｋを研磨可能な迂回研磨部Ｄ６として構成している。 Further, as the tape folding polishing mechanism D, as shown in FIGS. 8, 9, 10, 11, and 12, a narrow groove-shaped row guide portion D 1 for guiding the polishing tape T back to the guide member 17 as shown in FIG. and has a polishing tape T detour guidable detour guiding portion D 3 laterally to fold portions of which are rows returned movement guide and has a narrow groove-shaped back guide portion D 2, above the bypass guide portion D 3 Of the row side portion T 1 and the return side portion T 2 of the polishing tape T, the row side portion T 1 is folded back from the row guide portion D 1 and the return side portion T 2 is turned from the side to the return guide portion D 2 . by two fold surface portion 45 degree D 4 · D 4 and Ryoorikae surface D 4 · D 4 is pressed against roll D 5 for receiving a polishing pressure with a polishing tape T is folded laterally bypass guide provided folding, this In this case, as shown in FIG. 8, FIG. 9, and FIG. Install the guide piece 20 for guiding the D 1 and row-side portion of the abrasive tape T reversals guide portion D 2 is transported guided T 1 and Modogawa portion T 2, the support piece 21 attached to the distal end of the guide member 17, pressure roll D 5 a rotatably mounted, laterally diverted portion T 3 of the nut W abrasive tape T which has been diverted guided laterally by pressure roll D 5 between the front end surface of the support piece 21 and the guide member 17 constitute a ball groove K as polishable detour polishing section D 6.
又、上記速度同期手段Ｈは、図１の如く、上記ナットＷを回転させる回転用制御モータ４、上記研磨テープＴを移動させる移動用制御モータ６ｃ、及び回転用制御モータ４の回転速度Ｑと移動用制御モータ６ｃの回転速度とを同期制御する同期制御部Ｈ１からなり、同期制御部Ｈ１は、具体的な回路構成等は省略しているが、例えばパソコン等が用いられ、ナットＷの回転速度Ｑと研磨テープＴの移動速度Ｖとをボール溝ＫのリードＬに対応して同期させるように構成している。 Further, as shown in FIG. 1, the speed synchronizing means H includes a rotation control motor 4 for rotating the nut W, a movement control motor 6c for moving the polishing tape T, and a rotation speed Q of the rotation control motor 4. becomes a rotational speed of the transfer control motor 6c from the synchronization control unit H 1 for controlling synchronization, the synchronization control unit H 1 is specific circuit configuration or the like is omitted, for example, a personal computer or the like is used, a nut W The rotational speed Q and the moving speed V of the polishing tape T are synchronized with each other in correspondence with the lead L of the ball groove K.
この実施の形態例は上記構成であるから、図１、図２、図３、図４、図５、図９、図１１、図１３の如く、ボールねじ用のナットＷを保持機構Ａにより回転自在に保持し、ナットＷを回転機構Ｂにより軸線Ｗ１を中心として回転させ、上記研磨テープＴをテープ移送機構Ｃにより連続的又は間欠的に移送Ｓさせ、テープ折返研磨機構Ｄにより研磨テープＴを行案内部Ｄ１及び戻案内部Ｄ２により行戻移送案内すると共に行戻移送案内される研磨テープＴの折返部分を迂回案内部Ｄ３により側方に迂回し、迂回案内部Ｄ３の二つの折返面部Ｄ４・Ｄ４により研磨テープＴの行側部分Ｔ１及び戻側部分Ｔ２のうちの行側部分Ｔ１を行案内部Ｄ１から側方に折り返すと共に戻側部分Ｔ２を側方から戻案内部Ｄ２に折り返し、両折返面部Ｄ４・Ｄ４により側方に折り返された研磨テープＴを圧接ロールＤ５により迂回案内し、圧接ロールＤ５により側方に迂回案内された研磨テープＴの側方迂回部分Ｔ３を上記ナットＷのボール溝Ｋを研磨可能な迂回研磨部Ｄ６とし、テープ圧接機構Ｅにより研磨テープＴの側方迂回部分Ｔ３としての迂回研磨部Ｄ６を圧接ロールＤ５の外周面でナットＷのボール溝Ｋに圧接Ｍさせ、圧接ロールＤ５により研磨圧力を受け、傾斜機構Ｆにより圧接ロールＤ５の回転軸線Ｏをボール溝Ｋのリード角θに対応して傾斜配置させ、テープ移動機構Ｇにより研磨テープＴをナットＷの軸線Ｗ１方向に移動させ、速度同期手段ＨによりナットＷの回転速度Ｑと研磨テープＴの移動速度Ｖとをボール溝ＫのリードＬに対応して同期させ、ナットＷの回転と、研磨テープＴの上記移送Ｓと、ナットＷの回転速度Ｑに同期した研磨テープＴの移動Ｖとの複合動作によりボール溝Ｋを研磨テープＴで研磨することができ、上記テープ圧接機構Ｅに上記研磨テープＴの上記迂回研磨部Ｄ ６ を上記圧接ロールＤ ５ の外周面で上記ナットＷのボール溝Ｋに圧接させる圧接台１５が圧接移動自在に設けられ、かつ、上記テープ折返研磨機構Ｄに研磨テープＴを行戻移送案内する行案内部Ｄ １ 及び戻案内部Ｄ ２ を有すると共に行戻移送案内される研磨テープＴの折返部分を側方に迂回案内可能な迂回案内部Ｄ ３ を有する案内部材１７が設けられ、上記傾斜機構Ｆとして、上記テープ圧接機構Ｅの圧接台１５に上記テープ折返研磨機構Ｄの案内部材１７を支点ピン１８により水平旋回自在に設け、案内部材１７を位置固定する位置調節固定機構１９を設けて構成され、圧接ロールＤ５の回転軸線Ｏはボール溝Ｋのリード角θに対応して傾斜配置されると共にナットＷの回転速度Ｑに同期した研磨テープＴの移動Ｖにより研磨テープＴはボール溝ＫのリードＬに合致して移動して研磨テープＴはボール溝Ｋに確実に圧接Ｍされ、研磨テープＴでボール溝Ｋを確実に研磨することができ、研磨精度を向上することができ、ボール溝Ｋの表面あらさを向上することができ、ボール溝Ｋの研磨作業性を向上することができる。 Since this embodiment is configured as described above, the ball screw nut W is rotated by the holding mechanism A as shown in FIGS. 1, 2, 3, 4, 5, 9, 9, and 13. The nut W is rotated freely around the axis W 1 by the rotation mechanism B, the polishing tape T is transferred S continuously or intermittently by the tape transfer mechanism C, and the polishing tape T is rotated by the tape folding polishing mechanism D. the by-line guide portion D 1 and return guide section D 2 bypass guide portion D 3 a turnup portion of the abrasive tape T to be the line back movement guide with rows back movement guide by bypassing laterally detour guiding portion D 3 Modogawa portion T 2 together with the folding lines side portion T 1 of the one row portion T 1 and Modogawa portion T 2 of the polishing tape T by two fold surface D 4 · D 4 from the line guide portion D 1 laterally the return to the guide portion D 2 return from the side, Ryoorikae surface D By · D 4 The abrasive tape T is folded laterally bypassing guided by pressure roll D 5, a lateral bypass portion T 3 of the abrasive tape T which has been diverted guided laterally by pressure roll D 5 of the nut W the ball groove K and polishable detour polishing section D 6, the ball groove of the nut W detour polishing section D 6 as a side detour T 3 of the abrasive tape T by the tape pressing mechanism E with the outer peripheral surface of the press roll D 5 K to is pressed against M, subjected to polishing pressure by pressure rolls D 5, the rotational axis O of the press roll D 5 is inclined arranged corresponding to the lead angle θ of the ball groove K by tilting mechanism F, the polishing by the tape moving mechanism G The tape T is moved in the direction of the axis W 1 of the nut W, and the speed synchronization means H synchronizes the rotational speed Q of the nut W and the moving speed V of the polishing tape T corresponding to the lead L of the ball groove K. Rotation , And the transfer S of the polishing tape T, the ball groove K by the combined operation of the moving V of the polishing tape T synchronized with the rotation speed Q of the nut W can be polished by the polishing tape T, to the tape pressing mechanism E pressure board 15 for pressing the bypass polishing section D 6 of the abrasive tape T to the ball groove K of the nut W in the outer circumferential surface of the pressure roll D 5 is provided to be freely pressed against movement, and the tape folding return polishing mechanism D the line guide portion D 1 and return the guide portion abrasive tape T detour guidable detour guiding portion D 3 laterally to fold portions of which are rows returned movement guide which has a D 2 to Gyomodo movement guide the abrasive tape T A guide member 17 is provided, and as the tilt mechanism F, the guide member 17 of the tape folding polishing mechanism D is provided on the press contact base 15 of the tape press contact mechanism E by a fulcrum pin 18 so as to be pivotable horizontally. Is constituted by a position adjustment fixing mechanism 19 for position fixing is provided, abrasive tape synchronized with the rotation speed Q of the nut W with the rotational axis O of the press roll D 5 is arranged obliquely so as to correspond to the lead angle θ of the ball groove K The polishing tape T is moved in accordance with the lead L of the ball groove K by the movement V of T, and the polishing tape T is reliably pressed against the ball groove K, and the ball groove K can be reliably polished by the polishing tape T. In addition, the polishing accuracy can be improved, the surface roughness of the ball groove K can be improved, and the polishing workability of the ball groove K can be improved.
この場合、例えば、図１、図５の如く、ボールねじ用のナットＷを保持機構Ａにより回転自在に保持し、ナットＷを回転機構Ｂにより軸線Ｗ１を中心として実線で示す反時計回り方向に回転させ、研磨テープＴをテープ移送機構Ｃにより移送Ｓし、研磨テープＴをテープ移動機構ＧによりナットＷの軸線Ｗ１方向である実線で示す矢印方向に行き移動させ、テープ圧接機構Ｅにより研磨テープＴの側方迂回部分Ｔ３としての迂回研磨部Ｄ６を圧接ロールＤ５でナットＷのボール溝Ｋに圧接Ｍし、圧接ロールＤ５により研磨圧力を受け、ナットＷの回転速度Ｑと研磨テープＴの移動速度Ｖとをボール溝ＫのリードＬに対応して同期させ、ナットＷの回転と、研磨テープＴの上記移送Ｓと、ナットＷの回転速度Ｑに同期した研磨テープＴの移動Ｖとの複合動作によりボール溝Ｋを研磨テープＴで研磨することができ、又、これとは逆に、上記ナットＷを回転機構Ｂにより軸線Ｗ１を中心として破線で示す時計回り方向に回転させ、上記研磨テープＴをテープ移動機構ＧによりナットＷの軸線Ｗ１方向の破線で示す矢印方向に戻り移動させ、テープ圧接機構Ｅにより研磨テープＴの側方迂回部分Ｔ３としての迂回研磨部Ｄ６を圧接ロールＤ５でナットＷのボール溝Ｋに圧接Ｍし、圧接ロールＤ５により研磨圧力を受け、ナットＷの回転速度Ｑと研磨テープＴの移動速度Ｖとをボール溝ＫのリードＬに対応して同期させ、ナットＷの回転と、研磨テープＴの上記移送Ｓと、ナットＷの回転速度Ｑに同期した研磨テープＴの移動Ｖとの複合動作によりボール溝Ｋを研磨テープＴで研磨することができ、これにより研磨テープＴの往き又は戻りの往復移動においてボール溝Ｋを研磨することができ、研磨精度を向上することができ、ボール溝Ｋの表面あらさを向上することができ、ボール溝Ｋの研磨作業性を向上することができる。勿論、研磨テープＴの行き移動又は戻り移動のいずれか一方の移動時のみにおいて研磨を行うこともできる。 In this case, for example, FIG. 1, as shown in FIG. 5, and rotatably held by the holding mechanism A nut W for the ball screw, the counterclockwise direction indicated nut W about the axis W 1 by the solid line by the rotating mechanism B rotated, abrasive tape T transported S by the tape transport mechanism C, and the polishing tape T is moved to go in the direction of the arrow indicated by the solid line is an axial line W 1 direction of the nut W by the tape moving mechanism G, the tape pressing mechanism E the detour polishing section D 6 as a side detour T 3 of the abrasive tape T is pressed against M to the ball groove K of the nut W in pressure roll D 5, subjected to polishing pressure by pressure rolls D 5, the rotational speed Q of the nut W And the moving speed V of the polishing tape T are synchronized with the lead L of the ball groove K, and the polishing tape T is synchronized with the rotation of the nut W, the transfer S of the polishing tape T, and the rotation speed Q of the nut W. Transfer The combined operation of the V can be polished ball groove K by abrasive tape T, also, on the contrary, the rotation in the clockwise direction indicated by the broken line around the axis W 1 by a rotation mechanism B the nut W is allowed, the abrasive tape T is moved back in the direction of the arrow indicated by the broken line in the axial W 1 direction of the nut W by the tape moving mechanism G, bypassing the polishing unit of a lateral bypass portion T 3 of the abrasive tape T by the tape pressing mechanism E the D 6 pressed M to the ball groove K of the nut W in pressure roll D 5, subjected to polishing pressure by pressure rolls D 5, nut W rotational speed Q and the abrasive tape T moving speed V and the ball grooves K leads of The ball groove K is formed in the polishing tape T by a combined operation of the rotation of the nut W, the transfer S of the polishing tape T, and the movement V of the polishing tape T synchronized with the rotation speed Q of the nut W. Polished with Thus, the ball groove K can be polished in the forward and backward reciprocation of the polishing tape T, the polishing accuracy can be improved, and the surface roughness of the ball groove K can be improved. The polishing workability of the ball groove K can be improved. Of course, the polishing can be performed only when the polishing tape T moves either forward or backward.
又、この場合、図４、図５、図６、図７、図１３の如く、上記傾斜機構Ｆは上記テープ折返研磨機構Ｄを上記ボール溝Ｋのリード角θに対応して傾斜配置させる構造となっているから、傾斜機構Ｆの構造を簡素化することができ、又、この場合、図１、図２、図３の如く、上記テープ移送機構Ｃ、上記テープ折返研磨機構Ｄ、上記テープ圧接機構Ｅ、及び上記傾斜機構Ｆを上記ナットＷの軸線Ｗ１方向と交差する方向に移動させるテープ待避機構Ｉを備えてなるから、保持機構Ａに対するナットＷの供給及び取出を容易に行うことができ、又、この場合、図１の如く、上記速度同期手段Ｈとして、上記ナットＷを回転させる回転用制御モータ４、上記研磨テープＴを移動させる移動用制御モータ６ｃ、及び回転用制御モータ４の回転速度Ｑと移動用制御モータ６ｃの回転速度とを同期制御する同期制御部Ｈ１からなるので、ナットＷの回転速度Ｑと研磨テープＴの移動速度Ｖとをボール溝ＫのリードＬに対応して同期させることができ、研磨テープＴをボール溝ＫのリードＬに合致して確実に接触移動させることができ、構造を簡素化することができると共に研磨精度を向上することができる。 Also, in this case, as shown in FIGS. 4, 5, 6, 7, and 13, the tilt mechanism F has a structure in which the tape folding polishing mechanism D is tilted in accordance with the lead angle θ of the ball groove K. Therefore, the structure of the tilting mechanism F can be simplified. In this case, as shown in FIGS. 1, 2, and 3, the tape transfer mechanism C, the tape folding polishing mechanism D, and the tape pressing mechanism E, and the because the tilting mechanism F becomes comprise tape retraction mechanism I that moves in a direction crossing the axial line W 1 direction of the nut W, by performing the supply and removal of the nut W to the holding mechanism a readily In this case, as shown in FIG. 1, as the speed synchronization means H, the rotation control motor 4 for rotating the nut W, the movement control motor 6c for moving the polishing tape T, and the rotation control motor. 4 rotation speed Q Since the synchronization control unit H 1 synchronously controlling the rotation speed of the movement control motor 6c, to synchronize the movement velocity V of the rotational speed Q and the abrasive tape T nut W in correspondence with the lead L of the ball groove K Thus, the polishing tape T can be reliably contacted and moved in conformity with the lead L of the ball groove K, the structure can be simplified, and the polishing accuracy can be improved.
尚、本発明は上記実施の形態例に限られるものではなく、保持機構Ａ、回転機構Ｂ、テープ移送機構Ｃ、テープ折返研磨機構Ｄ、テープ圧接機構Ｅ、傾斜機構Ｆ、テープ移動機構Ｇ及び速度同期手段Ｈの構成等は適宜変更して設計されるものである。 Note that the present invention is not limited to the above-described embodiment, but includes a holding mechanism A, a rotation mechanism B, a tape transfer mechanism C, a tape folding polishing mechanism D, a tape pressure contact mechanism E, an inclination mechanism F, a tape moving mechanism G, and The configuration and the like of the speed synchronization means H are designed with appropriate changes.
又、例えば、上記実施の形態例においては、乾式研磨構造としているが、ナットＷのボール溝Ｋと研磨テープＴとの間に各種材質の遊離砥粒や化学剤を含む加工液体や潤滑剤を供給する所謂湿式研磨構造とすることもあり、又、速度同期手段Ｈとして旋盤の親ねじ機構に採用されている替歯車機構と同様な機械的な同期回転機構を採用することもあり、その他、ナットＷの種類や研磨条件により選択して設計される。 Further, for example, in the above-described embodiment, a dry polishing structure is used, but a processing liquid or a lubricant containing free abrasive grains or chemicals of various materials is provided between the ball groove K of the nut W and the polishing tape T. It may be a so-called wet polishing structure to be supplied, or a mechanical synchronous rotation mechanism similar to the replacement gear mechanism adopted in the lead screw mechanism of the lathe may be adopted as the speed synchronization means H, It is selected and designed according to the type of nut W and polishing conditions.
以上、所期の目的を充分達成することができる。 As described above, the intended purpose can be sufficiently achieved.
Ｗ ナット
Ｗ１ 軸線
Ｋ ボール溝
Ｔ 研磨テープ
Ｔ１ 行側部分
Ｔ２ 戻側部分
Ｔ３ 側方迂回部分
Ａ 保持機構
Ｂ 回転機構
Ｃ テープ移送機構
Ｄ テープ折返研磨機構
Ｄ１ 行案内部
Ｄ２ 戻案内部
Ｄ３ 迂回案内部
Ｄ４ 折返面部
Ｄ５ 圧接ロール
Ｄ６ 迂回研磨部
Ｅ テープ圧接機構
Ｆ 傾斜機構
Ｇ テープ移動機構
Ｈ 速度同期手段
Ｈ１ 同期制御部
Ｉ テープ待避機構
Ｌ リード
θ リード角
Ｏ 回転軸線
Ｑ 回転速度
Ｓ 移送
Ｖ 移動速度
Ｍ 圧接
４ 回転用制御モータ
６ｃ 移動用制御モータ
１５ 圧接台
１７ 案内部材
１８ 支点ピン
１９ 位置調節固定機構
W nut W 1 axis K ball groove T polishing tape T 1 row side portion T 2 return side portion T 3 side detour portion A holding mechanism B rotating mechanism C tape transfer mechanism D tape folding polishing mechanism D 1 row guide portion D 2 return Guide part D 3 Detour guide part D 4 Folding surface part D 5 Pressure contact roll D 6 Detour polishing part E Tape pressure contact mechanism F Inclination mechanism G Tape moving mechanism H Speed synchronization means H 1 Synchronization control part I Tape retracting mechanism L Lead θ Lead angle O Rotation axis Q Rotational speed S Transfer V Travel speed M Pressure contact 4 Rotation control motor 6c Movement control motor
15 pressure table
17 guide members
18 fulcrum pins
19 position adjustment fixing mechanism
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| JP2016196629A JP6445504B2 (en) | 2016-10-04 | 2016-10-04 | Ball screw nut polishing equipment |
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| JP2016196629A JP6445504B2 (en) | 2016-10-04 | 2016-10-04 | Ball screw nut polishing equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021146471A (en) * | 2020-03-19 | 2021-09-27 | 株式会社サンシン | Method for polishing rotor for electric motor and its device |
| JP2022179880A (en) * | 2021-05-24 | 2022-12-06 | 株式会社サンシン | Method of polishing rotary shaft of rotor and device of the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07299657A (en) * | 1994-05-06 | 1995-11-14 | Honda Motor Co Ltd | Grinding work method for nut screw groove |
| JP3764979B2 (en) * | 1996-04-15 | 2006-04-12 | 株式会社サンシン | Polishing method and apparatus |
| JPH1199459A (en) * | 1997-09-29 | 1999-04-13 | Sanshin:Kk | Plate-like member corner edge chamfering device |
| JP3888609B2 (en) * | 2001-04-27 | 2007-03-07 | オークマ株式会社 | Female thread grinding machine |
| JP6029216B2 (en) * | 2014-07-11 | 2016-11-24 | 株式会社サンシン | Ball screw nut polishing method and apparatus |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021146471A (en) * | 2020-03-19 | 2021-09-27 | 株式会社サンシン | Method for polishing rotor for electric motor and its device |
| JP7041184B2 (en) | 2020-03-19 | 2022-03-23 | 株式会社サンシン | Rotor polishing method for motors and their equipment |
| JP2022075785A (en) * | 2020-03-19 | 2022-05-18 | 株式会社サンシン | Method for polishing rotor for electric motor and device for the same |
| JP7381633B2 (en) | 2020-03-19 | 2023-11-15 | 株式会社サンシン | Rotor polishing equipment for electric motors |
| JP2022179880A (en) * | 2021-05-24 | 2022-12-06 | 株式会社サンシン | Method of polishing rotary shaft of rotor and device of the same |
| JP7319322B2 (en) | 2021-05-24 | 2023-08-01 | 株式会社サンシン | ROTOR ROTATING SHAFT Grinding METHOD AND APPARATUS THEREOF |
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