JP6431971B2 - Semiconductor device - Google Patents

Description

The present invention relates to an object, a method, or a manufacturing method. Or this invention relates to a process, a machine, a manufacture, or a composition (composition of matter). In particular, one embodiment of the present invention relates to a semiconductor device, a display device, a light-emitting device, a lighting device, a driving method thereof, or a manufacturing method thereof. In particular, one embodiment of the present invention relates to a display, a light-emitting device, a semiconductor device, an electronic device, an information processing device, and the like, and relates to a structure, a manufacturing method, a usage method, and the like.

The development of portable devices is actively underway. As a portable device, a display device having a flexible panel and having a support portion at one end of the flexible display panel is known (Patent Document 1).

JP 2010-282183 A

The display device described in Patent Document 1 has been designed to reduce the breakage of the drive circuit when handling a flexible panel. However, at least the following points remain to be examined.

(About the folded form)
In the said patent document 1, the bending part C and the non-folding part D are demonstrated using FIG. 7, FIG. However, in the said patent document 1, there was no description of the form folded concretely.

In the above-mentioned Patent Document 1, it is described that there are a plurality of bent portions C in FIG. 8B and the like, but there is no specific description about the form in which the plurality of bent portions C are bent.

Thus, one embodiment of the present invention provides a foldable device. Alternatively, according to one embodiment of the present invention, the display portion can be used in a folded state. Alternatively, one embodiment of the present invention provides a novel device. Note that the description of these problems does not disturb the existence of other problems.
Note that one embodiment of the present invention does not have to solve all of these problems. In addition,
Issues other than these will be apparent from the description of the specification, drawings, claims, etc., and it is possible to extract other issues from the description of the specification, drawings, claims, etc. .

One embodiment of the present invention is a display portion that can be folded;
A first housing capable of holding the display unit;
A second housing capable of holding the display unit;
The first casing is separated from the second casing when the display unit is open,
The first housing is a semiconductor device characterized in that the first housing can be in contact with the second housing when the display portion is folded.

One embodiment of the present invention is a display portion that can be folded;
A circuit unit capable of driving the display unit;
A first housing capable of holding the display unit;
A second housing capable of holding the display unit;
The first casing is separated from the second casing when the display unit is open,
The first casing can contact the second casing when the display unit is folded,
The circuit portion is a semiconductor device provided in contact with the first housing or the second housing.

According to one embodiment of the present invention, a foldable device can be provided. The device can be a display, a light emitting device, a semiconductor device, an electronic device, or an information processing device. Note that one embodiment of the present invention is not limited to these effects. For example, one embodiment of the present invention may have effects other than these effects depending on circumstances or circumstances. Alternatively, for example, one embodiment of the present invention may not have these effects depending on circumstances or circumstances.

8A and 8B illustrate a structure of a semiconductor device according to an embodiment. 8A and 8B illustrate a structure of a semiconductor device according to an embodiment. 8A and 8B illustrate a structure of a semiconductor device according to an embodiment. 8A and 8B illustrate a structure of a semiconductor device according to an embodiment. 4A and 4B illustrate a structure of a light-emitting panel according to an embodiment. The perspective view of a light-emitting device. Illustration of electronic equipment.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated.

(Embodiment 1)
In this embodiment, a structure of a semiconductor device of one embodiment of the present invention is described with reference to drawings.

1A and 1B illustrate a semiconductor device of one embodiment of the present invention.
) Will be used to explain the folded form.

The semiconductor device 100 includes a display unit 101. The display portion 101 can be folded. The semiconductor device 100 includes a first housing 111 that holds the display unit 101 and a second housing 112. The first housing 111 has a second display portion 101 because the display portion 101 is folded.
It can be in contact with the housing 112. In order to maintain the folded configuration, the first housing 1
11, the first housing 111 has a first fitting portion 113, and the second housing 112 has a second fitting portion. 114. In the second region 122 where the first casing 111 and the second casing are in contact with each other, the first casing 111 has a third fitting portion 123, and the second casing 112 is A fourth fitting portion 124 is provided. For example, the first
The fitting part 113 and the second fitting part 114 can be configured by a hooking part having a claw part such as a side release buckle or a front release buckle. Third fitting portion 123 and fourth
The fitting portion 124 can be constituted by a side release buckle, a front release buckle, or the like. In this case, the first fitting portion 113 or the third fitting portion 123 is a socket (claw concave portion), and the second fitting portion 114 or the fourth fitting portion 124 is a plug (claw convex portion). It is good to do.

The display portion 101 can be used even in a folded form. Therefore, the display unit 1
Fold it so that part of 01 faces the front. In this state, the first casing 111 and the display unit 101
In a region 118 where and overlap, the first housing 111 has a transparent region 111a. The display unit 101 can be in contact with the transparent region 111a. The transparent region 111a is displayed on the display unit 101.
May not be present on the entire surface, and may have a frame shape.

In order for a part of the display unit 101 to face the front side, for example, the display unit 101 may have an even number of bent regions and bend so that the bending direction of the bent region is reversed. FIG.
Shows a form in which two bent regions (128, 129) are provided and a part of the display unit 101 faces front. If the folding direction of the region 128 is opposite to that of the region 129, that is, if the region 128 is a mountain fold, the region 129 is a valley fold. In the bent region, in the case of an active type panel, the display unit 101 preferably has a radius of curvature of 4 mm or more in consideration of the bending strength of the transistor. Of course, the flexible display portion 101 can have a curved surface other than the bent region.

The internal thickness 119 of the semiconductor device 100 formed by the first housing 111 and the second housing 112 has 2 to 5 times the curvature radius of the display unit 101. The first casing 111 or the second casing 112 may have a curved surface that matches the curvature of the display unit 101. As a result, the first
The space between the housing 111 and the second housing 112 and the display unit 101 can be reduced. As a result, the thickness 120 of the semiconductor device 100 can be further reduced. This thickness 120 is preferably not more than twice the internal thickness 119 in consideration of the refinement of the design.

FIG. 1B shows a state in which the display portion 101 is expanded from a folded state. The first fitting portion 113 to the fourth fitting portion 124 are set in a non-fitted state, and the first casing 111 is separated from the second casing 112. A part of the display unit 101 is fixed to a region including the transparent region 111 a of the first casing 111, and another part of the display unit 101 is fixed to a part of the second casing 112.

2A and 2B show a state in which the display portion 101 is expanded. 2A is a cross-sectional view, and FIG. 2B is a top view. As illustrated in FIGS. 2A and 2B, the display portion 101 includes a region 146 that overlaps with the first housing 111, a region 148 that overlaps with the second housing 112, and a region 147 that does not overlap with either. Since the area 147 does not contact any housing, the area 146,
Compared with 148, flexibility is high. The region 147 can have a larger area than the region 146. The region 147 can have a larger area than the region 148.

The area 146 becomes a displayable area when the display portion 101 is folded as shown in FIG. Therefore, the region 146 can have a larger area than the region 148.

In the case where the visibility of the display unit 101 is made equal between such regions 146 to 148, FIG.
As shown in (A), the back side of the display unit 101 (the surface of the display unit 101 in contact with the housing 112)
A black film 145 is disposed on the surface. The film 145 includes an organic material, and the display unit 101
A film having a thinner thickness is used. As a result, it is possible to bend following the display unit 101. The film 145 is preferably a high-strength and high-elasticity material so that it can withstand repeated bending and stretching, as well as reinforcement. Based on these, examples of the material of the film 145 include aramid and polyarylate super fibers.

As shown in FIG. 2B, the display portion 101 that is spread can be used by having the first housing 111 and the second housing 112. Of course, the display unit 101 may be used by holding only the first housing 111. Alternatively, the display unit 101 may be used with only the second housing 112.

Since the first casing 111 is a handle, the hardness may be changed to make it easier to grip. The region 111b of the first housing 111 that hits the side surface of the semiconductor device 100 may have a harder material than the other regions, while the other regions may have a soft material. Second housing 1
12, similarly, the region 112 a that corresponds to the side surface of the semiconductor device 100 may have a harder material than the other regions, while the other regions may have a soft material.

The first housing 111 may include an input device. The second housing 112 may include an input device.

When the 3rd fitting part 123 and the 4th fitting part 124 overlap with the display part 101, and visibility falls, the 3rd fitting part 123 and the 4th fitting part 124 have translucency. It is good to have the material which has. In addition, as shown in FIG. 2B, these fitting portions are preferably arranged at the end portion of the display portion 101 in consideration of visibility, but may be arranged up to the central portion of the display portion 101. On the other hand, the first fitting portion 113 and the second fitting portion 114 may be of any type that can fit and remove the housing 111 and the housing 112.

In the case where the portion from the fitting portion 114 to the region 112a corresponding to the side surface of the semiconductor device 100 is formed of a light-transmitting portion, a region where display can be confirmed with the display portion 101 folded is preferable. The display unit 101 corresponding to this area may be used to receive a simple signal (email or incoming / outgoing) such as blinking / lighting of a lamp.

If the display unit 101 is a dual emission type, the first fitting unit 113 is used.
It is preferable that the second fitting portion 114 and the portion of the casing 111 bonded to the display portion 101 also have translucency. In this case, the film 145 has translucency. Housing 111 and housing 112
May have translucency.

The bent region 129 is provided between the region 146 and the region 147, and the bent region 128 is provided between the region 147 and the region 148.

In addition, a touch panel may be mounted as an input device arranged to overlap the display unit 101. Examples of the touch panel include an optical touch panel and a capacitive touch panel. Since the display unit 101 is flexible, an optical touch panel is preferable.

  In this way, a foldable device can be provided.

As shown in FIG. 3, the first buffer material 131 may be disposed between the first housing 111 and the display unit 101. Similarly, the second cushioning material 132 is attached to the second housing 112 and the display unit 101.
You may arrange | position between. The first housing 111 and the second housing 112 have a harder material than the display unit 101 in order to hold the display unit 101. When the first housing 111 and the display unit 101 and the second housing 112 and the display unit 101 are in contact with each other in a state where the display unit 101 is folded,
The display unit 101 is susceptible to impact. Therefore, as shown in FIG.
The impact on the display unit 101 can be reduced by the first and second cushioning members 132.

FIG. 4A illustrates the semiconductor device 100 including the external circuit region 150. The display portion 101 including a pixel portion may include a scan line driver circuit or a signal line driver circuit on the same plane as the pixel portion. However, since the display portion 101 includes the bent regions 128 and 129, the scan line driver circuit and the signal line driver circuit are preferably provided in the external circuit region 150. In other words, the external circuit area 150 is provided with a circuit portion. As a result of providing the circuit portion in the external circuit region 150, the flexibility of the display portion 101 can be enhanced. The wiring of the display unit 101 can be electrically connected to the drive circuit in the external circuit region 150 via a flexible printed circuit board (FPC, not shown). In order to maintain the miniaturization of the semiconductor device 100, the external circuit region 150 is
It may be arranged so as to overlap with the display portion 101. For example, it can be disposed outside the second housing 112. In addition to the drive circuit, a battery or the like may be disposed in the external circuit region 150.

FIG. 4B illustrates a semiconductor device provided with external circuit regions 150a and 150b. FIG.
The location of the external circuit area 150 is different from that in A). The external circuit region 150 a may be provided in contact with the first housing 111, and the external circuit region 150 b may be provided in contact with the second housing 112. 4A, the thickness of the entire semiconductor device 100 can be reduced.

  In this way, a foldable semiconductor device can be provided.

(Embodiment 2)
In this embodiment, a structure of a light-emitting panel that is an embodiment of the present invention and can be bent will be described with reference to FIGS. Note that the light-emitting device including the foldable light-emitting panel described in this embodiment can be used as a foldable display device or an input / output device of an information processing device.

Note that the light-emitting panel described in this embodiment includes a light-emitting element and an imaging element and functions not only as a display panel that displays image information but also as information input means.

  FIG. 5A is a top view illustrating a structure of a light-emitting panel that can be applied to one embodiment of the present invention.

  FIG. 5B is a cross-sectional view taken along a cutting line AB and a cutting line CD in FIG.

  FIG. 5C is a cross-sectional view taken along a cutting line EF in FIG.

<< Explanation of top view >>
The light-emitting panel 300 illustrated in this embodiment includes a display portion 301 (see FIG. 5A).
.

The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. Imaging pixel 308
Can detect a finger or the like touching the display unit 301. Accordingly, a touch sensor can be configured using the imaging pixel 308.

The pixel 302 includes a plurality of subpixels (for example, the subpixel 302R). One imaging pixel 30
8 is provided corresponding to a plurality of sub-pixels, for example, three sub-pixels. The subpixel includes a light emitting element and a pixel circuit that can supply power for driving the light emitting element.

The pixel circuit is electrically connected to a wiring that can supply a selection signal and a wiring that can supply an image signal.

The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

The imaging pixel circuit is electrically connected to a wiring that can supply a control signal and a wiring that can supply a power supply potential.

As the control signal, for example, a signal that can select an imaging pixel circuit that reads a recorded imaging signal, a signal that can initialize the imaging pixel circuit, and a time during which the imaging pixel circuit detects light are determined. Signals that can be used.

In the display portion 301 in FIG. 5A, the region 395 can be used even in a folded state.

<< Explanation of sectional view >>
The light-emitting panel 300 includes a substrate 310 and a counter substrate 370 facing the substrate 310 (see FIG. 5B).

The substrate 310 includes a flexible substrate 310b, a barrier film 310a that prevents unintended diffusion of impurities into the light-emitting element, and an adhesive layer 31 that bonds the substrate 310b and the barrier film 310a together.
It is a laminated body in which 0c is laminated.

The counter substrate 370 is a stacked body of a flexible substrate 370b, a barrier film 370a that prevents unintentional diffusion of impurities into the light-emitting element, and an adhesive layer 370c that bonds the substrate 370b and the barrier film 370a (FIG. 5B )reference).

The display portion 301 including the flexible substrates 310b and 370b can be bent. In the case where the driver circuit is not arranged on the display portion 301, the driver circuit does not overlap with the bent region. The drive circuit is not broken. The display unit 301 is easily bent.

The sealing material 360 bonds the counter substrate 370 and the substrate 310 together. Also, the sealing material 360
Has a higher refractive index than air and doubles as an optical bonding layer. The pixel circuit and the light-emitting element (eg, the first light-emitting element 350R) are between the substrate 310 and the counter substrate 370.

<Pixel configuration>
The pixel 302 includes a sub-pixel 302R, a sub-pixel 302G, and a sub-pixel 302B (FIG. 5).
(See (C)). The subpixel 302R includes a light emitting structure 380R, the subpixel 302G includes a light emitting structure 380G, and the subpixel 302B includes a light emitting structure 380B.

For example, the sub-pixel 302R includes a pixel circuit including a first light-emitting element 350R and a transistor 302t that can supply power to the first light-emitting element 350R (see FIG. 5B). In addition, the light emitting structure 380R includes a first light emitting element 350R and an optical element (for example, a colored layer 367R).

The light-emitting element 350R includes a first lower electrode 351R, an upper electrode 352, and a layer 353 containing a light-emitting organic compound between the lower electrode 351R and the upper electrode 352 (see FIG. 5C).

The layer 353 containing a light-emitting organic compound includes a light-emitting unit 353a and a light-emitting unit 353b.
An intermediate layer 354 is provided between the light emitting unit 353a and the light emitting unit 353b. The light emission from the light emitting unit 353a and the light emission from the light emitting unit 353b are overlapped to produce white light emission.

The light emitting structure 380R includes the first colored layer 367R on the counter substrate 370. The colored layer may be any layer that transmits light having a specific wavelength. For example, a layer that selectively transmits light exhibiting red, green, blue, or the like can be used. Or you may provide the area | region which permeate | transmits the light which a light emitting element emits as it is.

For example, the light-emitting structure 380R includes the sealing material 360 that is in contact with the first light-emitting element 350R and the first colored layer 367R.

The first colored layer 367R is positioned so as to overlap with the first light-emitting element 350R. Thus, part of the light emitted from the light emitting element 350R passes through the sealing material 360 that also serves as the optical bonding layer and the first colored layer 367R, and is emitted to the outside as indicated by arrows in the drawing. First colored layer 367
If the color of R is red, red is emitted to the outside.

<Display panel configuration>
The light-emitting panel 300 includes the light-blocking layer 367BM on the counter substrate 370. Shading layer 367BM
Is provided so as to surround a colored layer (for example, the first colored layer 367R).

The light emitting panel 300 includes an antireflection layer 367p at a position overlapping the display portion 301. For example, a circularly polarizing plate can be used as the antireflection layer 367p.

The light emitting panel 300 includes an insulating film 321. The insulating film 321 covers the transistor 302t. Note that the insulating film 321 can be used as a layer for planarizing unevenness caused by the pixel circuit. Further, an insulating film in which a layer capable of suppressing diffusion of impurities into the transistor 302t and the like is stacked can be applied to the insulating film 321.

The light-emitting panel 300 includes a light-emitting element (eg, the first light-emitting element 350R) over the insulating film 321.

In the light-emitting panel 300, the partition 328 that overlaps the end portion of the first lower electrode 351R is provided with the insulating film 32.
1 (see FIG. 5C). In addition, a spacer 329 for controlling the distance between the substrate 310 and the counter substrate 370 is provided over the partition 328.

<Configuration of imaging pixels>
The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit for detecting light irradiated on the photoelectric conversion element 308p. The imaging pixel circuit includes a transistor 308t.
including.

  For example, a pin-type photodiode can be used for the photoelectric conversion element 308p.

The above transistor includes an oxide semiconductor film or a silicon semiconductor film. When an oxide semiconductor film is used for a channel formation region, it is thinner than a silicon semiconductor film.
The transistor is not easily damaged when the display portion 301 is bent.

<Other configuration>
Between the display portion 301 and the FPC 309 (1), the transistor 3 that does not contribute to display
03a can be provided. This is a so-called dummy area 303d.

The light-emitting panel 300 includes a wiring 311 that can supply a signal, and a terminal 319 is provided in the wiring 311. Note that an FPC 309 (1) that can supply a signal such as an image signal and a synchronization signal is electrically connected to the terminal 319.

Note that a printed wiring board (PWB) may be attached to the FPC 309 (1).

Note that an example in which a light-emitting element is used as a display element has been described; however, one embodiment of the present invention is not limited to this.

For example, in this specification and the like, a display element, a display device that is a device including a display element, a light-emitting element, and a light-emitting device that is a device including a light-emitting element have various forms or have various elements. I can do it. As an example of a display element, a display device, a light-emitting element, or a light-emitting device, an EL (electroluminescence) element (an EL element including an organic substance and an inorganic substance, organic E)
L element, inorganic EL element), LED (white LED, red LED, green LED, blue LED, etc.), transistor (transistor that emits light in response to current), electron emission element, liquid crystal element,
Electronic ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), MEMS (micro electro mechanical system), digital micro mirror device (DMD), DMS (digital micro shutter), MI
RASOL (registered trademark), IMOD (interference modulation) element,
Electrowetting element, piezoelectric ceramic display, carbon nanotube,
Some have a display medium whose contrast, brightness, reflectance, transmittance, and the like change due to an electromagnetic action. An example of a display device using an EL element is an EL display. As an example of a display device using an electron-emitting device, a field emission display (FED) or a SED type flat display (SED: Surface-c)
an ED (Electron-Emitter Display).
As an example of a display device using a liquid crystal element, there is a liquid crystal display (a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct view liquid crystal display, a projection liquid crystal display) and the like. An example of a display device using electronic ink or an electrophoretic element is electronic paper.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 3)
In this embodiment mode, display modules and electronic devices are described. The display module and the electronic device are configured using the contents described in the other embodiments.

<Appearance of light emitting device>
FIG. 6 is a perspective view illustrating an example of an appearance of a light-emitting device (display module) according to one embodiment of the present invention. The light-emitting device illustrated in FIG. 6 includes a panel 1601, a circuit board 1602 provided with a controller, a power supply circuit, an image processing circuit, an image memory, a CPU, and the like, and a connection portion 1603. The panel 1601 includes a pixel portion 1604 provided with a plurality of pixels, a drive circuit 1605 that selects a plurality of pixels for each row, and a drive circuit 1606 that controls input of an image signal Sig to the pixels in the selected row. Have.

Various signals and the potential of the power supply are input to the panel 1601 from the circuit board 1602 through the connection portion 1603. The connection portion 1603 includes an FPC (Flexible Print).
ed Circuit) or the like can be used. When a COF tape is used for the connection portion 1603, a part of the circuit in the circuit board 1602, or the driving circuit 1605 and part of the driving circuit 1606 included in the panel 1601 are formed on a separately prepared chip.
The chip may be connected to the COF tape using an F (Chip On Film) method.

Note that a touch sensor may be provided over the panel 1601. The touch sensor may be configured using a substrate different from the panel 1601, but may be provided on a substrate included in the panel 1601.

<Example configuration of electronic equipment>
A light-emitting device according to one embodiment of the present invention includes a display device, a laptop personal computer, and an image reproducing device including a recording medium (typically, a DVD: Digital Versatile).
It can be used for a device having a display capable of reproducing a recording medium such as a disc and displaying the image. In addition, as an electronic device in which the light-emitting device according to one embodiment of the present invention can be used, a mobile phone, a portable game machine, a portable information terminal, an electronic book, a video camera, a digital still camera, or a camera, a goggle-type display ( Head mounted display), navigation system, sound reproduction device (car audio, digital audio player, etc.), copying machine, facsimile, printer, printer multifunction device, automatic teller machine (ATM), vending machine, and the like. Specific examples of these electronic devices are shown in FIGS.

FIG. 7A illustrates a display device, which includes a housing 5001, a display portion 5002, a support base 5003, and the like. The light-emitting device according to one embodiment of the present invention can be used for the display portion 5002. In addition,
The display device includes all information display devices for personal computers, TV broadcast reception, advertisement display, and the like.

FIG. 7B illustrates a portable information terminal, which includes a housing 5101, a display portion 5102, and operation keys 5103.
Etc. The light-emitting device according to one embodiment of the present invention can be used for the display portion 5102.

FIG. 7C illustrates a display device including a housing 5701 having a curved surface, a display portion 5702, and the like. By using a flexible substrate for the light-emitting device of one embodiment of the present invention, the light-emitting device can be used for the display portion 5702 supported by the housing 5701 having a curved surface, which is flexible, light, and easy to use. A good display device can be provided.

FIG. 7D illustrates a portable game machine including a housing 5301, a housing 5302, a display portion 5303,
A display portion 5304, a microphone 5305, a speaker 5306, operation keys 5307, a stylus 5308, and the like are included. The light-emitting device according to one embodiment of the present invention can be used for the display portion 5303 or the display portion 5304. With the use of the light-emitting device according to one embodiment of the present invention for the display portion 5303 or the display portion 5304, a portable game machine that has an excellent usability and is unlikely to deteriorate in quality can be provided. Note that the portable game machine illustrated in FIG. 7D includes two display portions 5303 and 5304; however, the number of display portions included in the portable game device is not limited thereto.

FIG. 7E illustrates an e-book reader which includes a housing 5601, a display portion 5602, and the like. The light-emitting device according to one embodiment of the present invention can be used for the display portion 5602. By using a flexible substrate, the light-emitting device can be flexible, so that an electronic book that is flexible, light, and easy to use can be provided.

FIG. 7F illustrates a cellular phone, which includes a housing 5901 provided with a display portion 5902, a microphone 5907, a speaker 5904, a camera 5903, an external connection portion 5906, and operation buttons 5905. The light-emitting device according to one embodiment of the present invention can be used for the display portion 5902.
In the case where the light-emitting device according to one embodiment of the present invention is formed over a flexible substrate, FIG.
The light emitting device can be applied to the display portion 5902 having a curved surface as shown in FIG.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

100 Semiconductor device 101 Display unit 102 Region 111 Case 111a Transparent region 111b Region 112 Case 112a Region 113 Fitting portion 114 Fitting portion 118 Region 122 Region 123 Fitting portion 124 Fitting portion 128 Bending region 129 Bending region 131 Buffer material 132 Buffer material 145 Film 146 Region 147 Region 148 Region 150 External circuit region 150a External circuit region 150b External circuit region 300 Light emitting panel 301 Display unit 302 Pixel 302B Subpixel 302G Subpixel 302R Subpixel 302t Transistor 303a Transistor 303d Dummy region 308 Imaging pixel 308p Photoelectric conversion element 308t Transistor 309 FPC
310 Substrate 310a Barrier film 310b Adhesive layer 311 Wiring 319 Terminal 321 Insulating film 328 Partition 329 Spacer 350R Light emitting element 351R Lower electrode 352 Upper electrode 353 Layer 353a Light emitting unit 353b Light emitting unit 354 Intermediate layer 360 Sealing material 367BM Light shielding layer 367p Reflection Prevention layer 367R Colored layer 370 Counter substrate 370a Barrier film 370b Substrate 370c Adhesive layer 380B Light emitting structure 380G Light emitting structure 380R Light emitting structure 395 Area 1601 Panel 1602 Circuit board 1603 Connection portion 1604 Pixel portion 1605 Driving circuit 1606 Driving circuit 5001 Housing 5002 Display unit 5003 Support base 5101 Case 5102 Display unit 5103 Operation key 5301 Case 5302 Case 5303 Display unit 5304 Display unit 5305 Microphone 5306 speaker 5307 operation key 5308 stylus 5601 housing 5602 display unit 5701 housing 5702 display unit 5901 housing 5902 display unit 5903 camera 5904 speaker 5905 button 5906 external connection portion 5907 microphone

Claims (2)

A display that can be folded;
A first housing capable of holding the display unit and partially including a transparent region;
A second housing capable of holding the display unit,
The area of the display unit that is not held by the first casing and the second casing has a flexible area,
The first casing is separated from the second casing when the display unit is open,
The first casing can contact the second casing when the display unit is folded,
When the display unit is folded, the display unit in contact with the transparent region can be visually confirmed,
When the display unit is folded, the first bent region of the display unit is inside the first casing, and the second bent region of the display unit is the second casing. A semiconductor device characterized by being inside the body. A display that can be folded;
A circuit unit capable of driving the display unit;
A first housing capable of holding the display unit and partially including a transparent region;
A second housing capable of holding the display unit,
The area of the display unit that is not held by the first casing and the second casing has a flexible area,
The first casing is separated from the second casing when the display unit is open,
The first casing can contact the second casing when the display unit is folded,
When the display unit is folded, the display unit in contact with the transparent region can be visually confirmed,
When the display unit is folded, the first bent region of the display unit is inside the first casing, and the second bent region of the display unit is the second casing. Inside the body,
The semiconductor device is characterized in that the circuit portion is provided in contact with the first housing or the second housing.

Images