JP6383651B2 - Composition for acoustic wave probe, silicone resin for acoustic wave probe using the same, acoustic wave probe and ultrasonic probe, acoustic wave measuring device, ultrasonic diagnostic device, photoacoustic wave measuring device, ultrasonic endoscope and acoustic wave Manufacturing method of silicone resin for probe - Google Patents

Description

  The present invention relates to a composition for an acoustic wave probe, a silicone resin for an acoustic wave probe using the same, an acoustic wave probe, and an ultrasonic probe. Furthermore, the present invention relates to an acoustic wave measuring device, an ultrasonic diagnostic device, a photoacoustic wave measuring device, and an ultrasonic endoscope. The present invention also relates to a method for producing a silicone resin for an acoustic wave probe.

  In the acoustic wave measuring apparatus, an acoustic wave probe that irradiates an object with an acoustic wave, receives the reflected wave (echo), and outputs a signal is used. By displaying as an image based on the electrical signal converted from the reflected wave received by the acoustic wave probe, the inside of the object is visualized and observed.

As the acoustic wave, an appropriate frequency is selected according to the test object, measurement conditions, etc., such as ultrasonic waves and photoacoustic waves.
For example, the ultrasonic diagnostic apparatus transmits an ultrasonic wave toward the inside of the subject, receives the ultrasonic wave reflected by the tissue inside the subject, and displays it as an image. The photoacoustic wave measuring apparatus receives an acoustic wave radiated from the inside of the subject by the photoacoustic effect and displays it as an image. The photoacoustic effect is an acoustic wave (typical) when an object is irradiated with an electromagnetic pulse such as visible light, near-infrared light, or microwave, and the object absorbs the electromagnetic wave to generate heat and thermally expands. Is a phenomenon in which ultrasonic waves are generated.
Since an acoustic wave measuring apparatus transmits and receives acoustic waves to and from a living body, the acoustic wave measuring apparatus is required to satisfy requirements such as consistency of acoustic impedance with a living body and low acoustic wave attenuation.

For example, a probe for an ultrasonic diagnostic apparatus (also referred to as an ultrasonic probe), which is a kind of acoustic wave probe, includes a piezoelectric element that transmits and receives ultrasonic waves and an acoustic lens that is a part that contacts a living body. The ultrasonic wave emitted from the piezoelectric element passes through the acoustic lens and enters the living body. If the difference between the acoustic impedance (density x speed of sound) of the acoustic lens and the acoustic impedance of the living body is large, the ultrasonic wave is reflected on the surface of the living body, so that it is not efficiently incident on the living body and it is difficult to obtain high resolution. is there. In order to transmit and receive ultrasonic waves with high sensitivity, it is desired that the acoustic lens has a small ultrasonic attenuation.
For this reason, a silicone resin that is close to the acoustic impedance (1.4 to 1.7 × 10 ⁶ kg / m ² / sec) of a living body and has a small ultrasonic attenuation is mainly used as a material for the acoustic lens.

  In addition, since the silicone resin is soft and low in mechanical strength alone, for the purpose of improving the hardness and mechanical strength, an inorganic filler such as silica (also referred to as an inorganic filler) is used while increasing the molecular weight of the vinyl silicone resin at both ends. ) And vinyl group-containing resins (also referred to as reinforcing agents). At this time, if an attempt is made to achieve the required mechanical strength, the amount of inorganic filler and vinyl group-containing resin added to the silicone resin inevitably increases, and conversely, the silicone resin has a large acoustic wave attenuation. There was a problem.

In order to solve this problem, for example, in Patent Document 1, as a composition for an acoustic lens that forms an acoustic lens that is close to the acoustic impedance of a living body and has a small amount of ultrasonic attenuation, a higher alkyl group or a polyether group is added to a silicone rubber compound. A composition containing an organopolysiloxane having a specific substituent introduced therein has been proposed.
In Patent Document 2, as a composition for an acoustic lens that forms an acoustic matching layer having high acoustic impedance and resin hardness, a silicone-modified organic resin or a silicone-modified organic resin terminated with an epoxy is mixed with organopolysiloxane. Compositions have been proposed.

Japanese Patent Laid-Open No. 08-305375 JP 2008-011494 A

However, it is difficult for conventional silicone resins to satisfy a high level of both low acoustic wave attenuation (that is, high acoustic wave sensitivity) and high mechanical strength (particularly resin hardness, tear strength, and bending fatigue resistance). Met.
Therefore, in the present invention, in view of the above circumstances, a composition for an acoustic wave probe capable of significantly improving the resin hardness, tear strength, and bending fatigue resistance of a silicone resin while maintaining high acoustic wave sensitivity, It is an object of the present invention to provide a silicone resin for an acoustic wave probe, an acoustic wave probe, an acoustic wave measuring device, an ultrasonic diagnostic apparatus, and a method for producing a silicone resin for an acoustic wave probe using the same.

  In addition, an ultrasonic probe using a capacitive micromachined ultrasonic transducer (cMUT) with insufficient sensitivity as an ultrasonic diagnostic transducer array, and the amount of ultrasonic waves generated by photoacoustic waves is small. Photoacoustic wave measurement device with low sensitivity and difficult to observe deep in human body, and signal line cable is longer than that for body surface, so sensitivity is low, and it is difficult to improve sensitivity due to structural, physical characteristics and process suitability Another object of the present invention is to provide a composition for an acoustic wave probe and a silicone resin for an acoustic wave probe capable of improving sensitivity in an ultrasonic endoscope.

  As a result of studies on silicone resins, the present inventors have found that the above problems can be solved by using a siloxane compound having a specific structure.

The above problem has been solved by the following means.
<1> The polysiloxane mixture contains at least a polysiloxane, an organic peroxide, a polysiloxane resin, and a siloxane compound,
The content of the siloxane compound in a total of 100 parts by weight of the polysiloxane mixture is 0.001 to 5 parts by weight,
The polysiloxane is a polysiloxane having a structure represented by the following general formula (A1) or (A2):
The polysiloxane resin is a polyorganosiloxane resin having at least two aliphatic unsaturated hydrocarbon groups in one molecule and having a network structure in at least a part of the skeleton,
The composition for acoustic wave probes in which the said siloxane compound has a structure represented by the following general formula (D2) or (D3) .

In the general formulas (A1) and (A2), R ^a1 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and R ^a2 and R ^a3 each independently represent a hydrogen atom, an alkyl, A group, a cycloalkyl group, an alkenyl group having 3 or more carbon atoms or an aryl group, and x1 and x2 each independently represents an integer of 1 or more. Here, a plurality of R ^a1 , a plurality of R ^a2 , and a plurality of R ^a3 may be the same as or different from each other, and each group of R ^{a1 to} R ^a3 may be further substituted with a substituent. R ¹ and R ⁴ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group or an aryl group, and R ² and R ³ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a carbon number 3 or more alkenyl groups or aryl groups are represented, m represents an integer of 1 or more, and n represents 0 or an integer of 1 to 5. Here, a plurality of R ¹ , a plurality of R ² , a plurality of R ³ , a plurality of R ⁴ and a plurality of m may be the same or different from each other, and each group of R ^{1 to} R ⁴ may further be a substituent. May be substituted.
In the general formulas (D2) and (D3) , R ^{d2 1} represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, R ^d22 represents an alkyl group, a cycloalkyl group, or an aryl group, and nd 2 is 1 or more Represents an integer. The plurality of R ^d22 may be the same as or different from each other. R ^d31 represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and nd3 represents an integer of 2 or more.
<2> The composition for an acoustic wave probe according to <1>, wherein the polysiloxane is a vinyl group-containing polysiloxane.
<3> The composition for an acoustic wave probe according to <1> or <2>, wherein the polysiloxane resin is a vinyl group-containing polysiloxane resin.
<4> The composition for an acoustic wave probe according to any one of <1> to <3>, in which the polysiloxane resin is represented by the following average composition formula (c).

In the average composition formula (c), R ^c1 represents an alkyl group, cycloalkyl group, aryl group or aralkyl group having no aliphatic unsaturated bond, and R ^c2 represents an aliphatic unsaturated hydrocarbon group. b, c and d each represent an independent integer.
<5> siloxane compound represented by the above following general formula (D2) <1> ~ acoustic wave probe composition according to any one of <4>.
< 6 > The composition for an acoustic wave probe according to any one of <1> to < 4 >, wherein the siloxane compound is a compound having a cyclic structure.
< 7 > The acoustic probe according to any one of <1> to < 6 >, wherein 0.1 to 30 parts by mass of silica having an average primary particle diameter of less than 12 nm is contained in 100 parts by mass of the polysiloxane mixture. Composition.
< 8 > The composition for an acoustic wave probe according to <2>, wherein the vinyl group-containing polysiloxane has a mass average molecular weight of 20,000 to 1,000,000.
< 9 > The composition for an acoustic wave probe according to <2>, wherein the vinyl group-containing polysiloxane has a mass average molecular weight of 40,000 to 300,000.
< 10 > A silicone resin for an acoustic wave probe obtained by curing the composition for an acoustic wave probe according to any one of <1> to < 9 >.
< 11 > An acoustic wave probe having an acoustic lens and / or an acoustic matching layer made of the silicone resin for acoustic wave probes according to < 10 >.
< 12 > A capacitive micromachine ultrasonic transducer as an ultrasonic transducer array, and an ultrasonic probe comprising an acoustic lens made of the silicone resin for acoustic wave probes according to < 10 >.
< 13 > An acoustic wave measuring device comprising the acoustic wave probe according to < 11 >.
< 14 > An ultrasonic diagnostic apparatus comprising the acoustic wave probe according to < 11 >.
< 15 > A photoacoustic wave measuring apparatus including an acoustic lens made of the silicone resin for an acoustic wave probe according to < 10 >.
< 16 > An ultrasonic endoscope comprising an acoustic lens made of the silicone resin for acoustic wave probes according to < 10 >.
< 17 > A method for producing a silicone resin for an acoustic wave probe,
The silicone resin for acoustic wave probes is the silicone resin for acoustic wave probes according to <10>,
Silicone resin for acoustic wave probe in which composition for acoustic wave probe is cured by adding organic peroxide to polysiloxane mixture containing at least polysiloxane, polysiloxane resin and siloxane compound, and then composition for acoustic wave probe is cured Manufacturing method.

Unless otherwise specified, in the general formulas in this specification, when there are a plurality of groups having the same sign, these may be the same or different from each other, and groups specified by each group (for example, The alkyl group and the like may be further substituted with a substituent.
Further, in the present specification, “to” is used in the sense of including numerical values described before and after it as a lower limit value and an upper limit value.
In addition, unless otherwise indicated, the mass average molecular weight in this specification is a measured value (polystyrene conversion) by gel permeation chromatography (GPC).

According to the present invention, there is provided a composition for an acoustic wave probe capable of obtaining a silicone resin having high resin hardness, tear strength and bending fatigue resistance while maintaining high acoustic wave (particularly preferably ultrasonic) sensitivity. It is possible to provide a silicone resin for an acoustic wave probe, an acoustic wave probe, an acoustic wave measuring device, an ultrasonic diagnostic device, and a method for producing an acoustic wave probe silicone resin.
In addition, it is possible to provide an ultrasonic probe, a photoacoustic wave measurement apparatus, and a silicone resin for an acoustic wave probe that can improve sensitivity in an ultrasonic endoscope using cMUT as an ultrasonic diagnostic transducer array.

  Such an effect is considered to increase by forming an appropriate cross-linked structure with the polysiloxane resin and the polyfunctional siloxane compound having a vinyl group in the side chain within a range in which good acoustic characteristics can be maintained.

It is a perspective transmission figure about a convex type ultrasonic probe which is one mode of an acoustic wave probe.

<< Composition for acoustic wave probe >>
The composition for an acoustic wave probe of the present invention (hereinafter also simply referred to as a composition) contains at least polysiloxane, an organic peroxide, a polysiloxane resin and a siloxane compound in a polysiloxane mixture, The composition for acoustic wave probes, wherein the content of the siloxane compound in the total 100 parts by mass of the polysiloxane mixture is 0.001 to 5 parts by mass, and the siloxane compound has a structure represented by the general formula (D) described later. It is.
In addition, when the composition for acoustic wave probes of this invention contains the below-mentioned silica particle (E), a silica particle (E) is also contained in a total of 100 mass parts of a polysiloxane mixture.

In the present invention, the polysiloxane, polysiloxane resin and siloxane compound contained in the polysiloxane mixture have the structure represented by the polyorganosiloxane (A), the polyorganosiloxane resin (C) and the general formula (D). Having an organosiloxane compound (D),
Therefore, in the present invention, the polyorganosiloxane mixture contains at least the polyorganosiloxane (A), the polyorganosiloxane resin (C), and the organosiloxane compound (D) having a structure represented by the general formula (D). It is preferable.

  In the following detailed description, preferred embodiments of polyorganosiloxane (A), polyorganosiloxane resin (C), and organosiloxane compound (D) having a structure represented by formula (D) will be described. However, the polysiloxane, polysiloxane resin and siloxane compound contained in the polysiloxane mixture are not limited to polyorganosiloxane, polyorganosiloxane resin and organosiloxane compound.

<Polyorganosiloxane (A)>
The polyorganosiloxane (A) in the present invention may be any polyorganosiloxane as long as it is a millable silicone that is crosslinked by a radical curing reaction with an organic peroxide (B).
Here, millable silicone is similar to unvulcanized compounded rubber of natural rubber or ordinary synthetic rubber in a state before curing, and can be plasticized and mixed with a kneading roll machine or a closed mixer. This is a general term for the material and is distinguished from the liquid silicone in which the state before curing is paste or liquid.

Hereinafter, specific millable silicone will be described by taking linear and branched polyorganosiloxanes as examples.
The polyorganosiloxane (A) is not limited to the polyorganosiloxane described below, and may be, for example, a linear polyorganosiloxane partially having a branched structure.

[Linear polyorganosiloxane]
Examples of the linear polyorganosiloxane include those represented by the following general formula (A1).

In general formula (A1), R ^a1 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group or an aryl group, and R ^a2 and R ^a3 each independently represent a hydrogen atom, an alkyl group, cycloalkyl Group, an alkenyl group having 3 or more carbon atoms or an aryl group. x1 and x2 each independently represents an integer of 1 or more. Here, the plurality of R ^a1 , the plurality of R ^a2, and the plurality of R ^a3 may be the same as or different from each other. Moreover, each group of R ^{a1 to} R ^a3 may be further substituted with a substituent.

1-10 are preferable, as for carbon number of the alkyl group in R ^{< a1} > -R <^a3> , 1-4 are more preferable, 1 or 2 is more preferable, and 1 is especially preferable. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-hexyl, n-octyl, 2-ethylhexyl and n-decyl.

3-10 are preferable, as for carbon number of the cycloalkyl group in R ^{< a1} > -R < ^a3 >, 5-10 are more preferable, and 5 or 6 is further more preferable. The cycloalkyl group is preferably a 3-membered ring, 5-membered ring or 6-membered ring, more preferably a 5-membered ring or 6-membered ring. Examples of the cycloalkyl group include cyclopropyl, cyclopentyl, and cyclohexyl.

2-10 are preferable, as for carbon number of the alkenyl group in R ^a1 , 2-4 are more preferable, and 2 is more preferable. Examples of the alkenyl group include vinyl, allyl, and butenyl.
3-10 are preferable and, as for carbon number of the alkenyl group in R ^{< a2>} and R ^<a3 >, 3 or 4 is more preferable. Examples of the alkenyl group include allyl and butenyl.

6-12 are preferable, as for carbon number of the aryl group in R ^{< a1} > -R < ^a3 >, 6-10 are more preferable, and 6-8 are more preferable. Examples of the aryl group include phenyl, tolyl, and naphthyl.

These alkyl group, cycloalkyl group, alkenyl group and aryl group may have a substituent. Examples of such a substituent include a halogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a silyl group, and a cyano group.
Examples of the group having a substituent include a halogenated alkyl group.

R ^a1 is preferably an alkyl group or an alkenyl group, more preferably an alkyl group having 1 to 4 carbon atoms or a vinyl group, still more preferably a methyl group or vinyl group, particularly preferably a vinyl group, and both R ^a1 are both vinyl groups. Most preferably.
R ^a2 and R ^a3 are preferably an alkyl group, an alkenyl group having 3 or more carbon atoms, or an aryl group, more preferably an alkyl group having 1 to 4 carbon atoms or a phenyl group, and even more preferably a methyl group.

x1 is preferably an integer of 200 to 3000, and more preferably an integer of 400 to 2000.
x2 is preferably an integer of 1-1000, more preferably an integer of 40-700.

In particular, the linear polyorganosiloxane preferably has one or more vinyl groups in the molecular chain, and more preferably has two or more vinyl groups in the molecular chain.
Of these, polyorganosiloxanes having vinyl groups at least at the molecular chain terminals are preferred, and polyorganosiloxanes having vinyl groups at least at both molecular chain terminals are more preferred.

  The degree of polymerization and specific gravity are not particularly limited. The degree of polymerization is preferably 200 to 3000, and preferably 400 to 2000 from the viewpoint of improvement in mechanical properties, hardness, chemical stability, etc. of the obtained silicone resin for acoustic wave probes (hereinafter also simply referred to as silicone resin). The specific gravity is preferably 0.9 to 1.1.

  The mass average molecular weight of the polyorganosiloxane (A) is preferably 20,000 to 1,000,000, and preferably 40,000 to 300,000 from the viewpoint of mechanical strength, hardness, bending fatigue resistance and ease of processing. 000 is more preferable, and 45,000 to 250,000 is more preferable.

  For example, GPC apparatus HLC-8220 (manufactured by Tosoh Corporation) is prepared, toluene (Shonan Wako Pure Chemical Industries, Ltd.) is used as the eluent, and TSKgel (registered trademark) G3000HXL + TSKgel (registered trademark) is used as the column. Using G2000HXL, measurement can be performed using an RI detector under conditions of a temperature of 23 ° C. and a flow rate of 1 mL / min.

Kinematic viscosity at 25 ° C. is preferably ^{1 × 10 -5 ~10m 2 / s} , more preferably ^{1 × 10 -4 ~1m 2 / s} , 1 × 10 -3 ~0.5m 2 / s is more preferable.

Polyorganosiloxane having vinyl groups at least at both ends of the molecular chain is, for example, a trade name, DMS series (for example, DMS-V31, DMS-V31S15, DMS-V33, DMS-V35, DMS-V35R, DMS, manufactured by Gelest). -V41, DMS-V42, DMS-V46, DMS-V51, DMS-V52), trade names made by Gelest, PDV series (for example, PDV-0341, PDV-0346, PDV-0535, PDV-0541, PDV- 01631, PDV-01635, PDV-01641, PDV-2335, PMV-9925, PVV-3522, FMV-4031, EDV-2022).
In addition, since DMS-V31S15 is previously blended with fumed silica, kneading with a special apparatus is unnecessary.
In particular, the use of a polysiloxane having a vinyl group at the end of a high molecular weight molecular chain greatly improves the tear strength of the silicone resin.

[Branched polyorganosiloxane]
Examples of the branched polyorganosiloxane include those represented by the following general formula (A2).

In General Formula (A2), R ¹ and R ⁴ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group. R ² and R ³ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group having 3 or more carbon atoms, or an aryl group. m represents an integer of 1 or more, and n represents 0 or an integer of 1 to 5. Here, a plurality of R ¹ , a plurality of R ² , a plurality of R ³ , a plurality of R ⁴ and a plurality of m may be the same as or different from each other, and each group of R ^{1 to} R ⁴ may further include It may be substituted with a substituent.

  In the general formula (A2), the polyorganosiloxane in which n is 0 can be represented by the following general formula (a2).

In the general formula (a2), R ¹ and R ⁴ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group. R ² and R ³ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group having 3 or more carbon atoms, or an aryl group. m represents an integer of 1 or more. Here, the plurality of R ² , the plurality of R ³ , the plurality of R ⁴ and the plurality of m may be the same or different from each other, and each group of R ^{1 to} R ⁴ is further substituted with a substituent. It may be.

In the general formulas (A2) and (a2), each of the groups in R ¹ and R ⁴ has the same meaning as the corresponding group in R ^a1 in the general formula (A1), and the preferred range is the same as the corresponding group. is there. Each group described above for ^{R 2} and ^{R 3} are as defined with the corresponding group in ^{R a2} and ^{R a3} in formula (A1), the preferred range is also the same as the corresponding group.
In addition, it is preferable that at least 2 or more of a plurality of R ¹ and R ⁴ is a vinyl group, and it is more preferable that at least 2 or more of the plurality of R ⁴ is a vinyl group.

In formulas (A2) and (a2), n, m, and mass average molecular weight are not particularly limited, and any millable silicone having a raw rubber-like kinematic viscosity at 25 ° C. may be used.
The specific value of kinematic viscosity is the same as the preferable range of kinematic viscosity described for the linear polyorganosiloxane.

The polyorganosiloxane (A) in the present invention is preferably a vinyl group-containing polysiloxane having one or more vinyl groups in the molecular chain.
The content of the vinyl group when the polyorganosiloxane (A) has a vinyl group is not particularly limited. In addition, from a viewpoint of forming sufficient network by an organic peroxide (B), it is 0.01-5 mol%, for example, Preferably it is 0.05-2 mol%.
Here, the vinyl group content is the mol% of the vinyl group-containing siloxane unit when all the units constituting the polyorganosiloxane (A) are 100 mol%, and is one vinyl group-containing siloxane unit. And one vinyl group.
In addition, a unit means the Si-O unit which comprises a principal chain, and terminal Si.

  The polyorganosiloxane (A) in the present invention may be used alone or in combination of two or more. In addition, 2 or less types are preferable and 1 type single is more preferable.

<Organic peroxide (B)>
The organic peroxide (B) in the present invention includes a hydroperoxide, a dialkyl peroxide, a peroxyester, a diacyl peroxide, a peroxydicarbonate, a peroxyketal and a ketone having an —O—O— bond in the molecule. Commonly used organic peroxides such as peroxides can be mentioned.

Specific examples include the following organic peroxides.
Hydroperoxide: p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, etc.

Dialkyl peroxide: bis (2,4-dichlorobenzoyl) peroxide, bis (4-chlorobenzoyl) peroxide, bis (2-methylbenzoyl) peroxide, bis (2-t-butylperoxyisopropyl) benzene, Dicumyl peroxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane, t-butylcumyl peroxide, di-t-hexyl peroxide, di-t-butyl peroxide and 2, 5-bis (t-butylperoxy) -2,5-dimethyl-3-hexyne, etc.

Peroxyester: t-butylperoxybenzoate, cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, t-hexylperoxyneodecanoate, t- Butyl peroxyneodecanoate, t-butyl peroxyneoheptanoate, t-hexyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5- Bis (2-ethylhexylperoxy) -2,5-dimethylhexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxymaleate, t-butylperoxy-3,5,5-trimethyl Hexanoate, t-butyl peroxylaurate, t-butyl peroxyisopropyl monocarbonate T-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-bis (benzoylperoxy) -2,5-dimethylhexane, t-butylperoxyacetate and t-butyl Peroxy-3-methylbenzoate, etc.

Diacyl peroxide: diisobutyryl peroxide, bis (3,5,5-trimethylhexanoyl) peroxide, dilauroyl peroxide, bis (3-carboxypropionyl) peroxide, bis (3-methylbenzoyl) peroxide, Benzoyl (3-methylbenzoyl) peroxide, dibenzoyl peroxide, bis (4-methylbenzoyl) peroxide, 1,6-hexanediol-bis (t-butylperoxycarbonate), etc.

Peroxydicarbonate: di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, bis (2-ethylhexyl) peroxydicarbonate and di-sec -Butyl peroxydicarbonate, etc.

Peroxyketal: 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-butyl Peroxy) -2-methylcyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, 2,2-bis (t-butylperoxy) butane, n-butyl 4,4-bis (t-butylper Oxy) valerate and 2,2-bis (4,4-bis (t-butylperoxy) cyclohexyl) propane

Ketone peroxide: methyl ethyl ketone peroxide, cyclohexanone peroxide, acetylacetone peroxide, etc.

Among these organic peroxides, those having a 10-hour half-life decomposition temperature of 100 ° C. to 120 ° C. are preferable because the half-life decomposition temperature matches the processing temperature. Specifically, dicumyl peroxide, 2 , 5-Dimethyl-2,5-bis (t-butylperoxy) hexane, t-butylcumyl peroxide, di-t-hexyl peroxide, bis (2-t-butylperoxyisopropyl) benzene, t-butyl Peroxybenzoate, 2,5-bis (benzoylperoxy) -2,5-dimethylhexane, t-butyl peroxyacetate, 2,2-bis (t-butylperoxy) butane or n-butyl 4,4 -Bis (t-butylperoxy) valerate is preferred.
In addition, an organic peroxide may use 1 type or may use 2 or more types together.

0.1-15 mass parts is preferable with respect to 100 mass parts of polysiloxane mixtures, and, as for the addition amount of an organic peroxide (B), 0.2-10 mass parts is more preferable.
When the addition amount is within the above range, the crosslinking reaction proceeds sufficiently, and deterioration of physical properties such as a decrease in hardness of the silicone resin, insufficient rubber strength, and an increase in compression set is suppressed. Moreover, it is economically preferable, and by suppressing the generation of decomposition products of the curing agent, deterioration of physical properties such as increased compression set and discoloration of the obtained silicone resin sheet are suppressed.

<Polyorganosiloxane resin (C)>
The polyorganosiloxane resin (C) in the present invention may be a polyorganosiloxane resin having at least two aliphatic unsaturated hydrocarbon groups in one molecule and having a network structure in at least a part of the skeleton. That's fine.
In addition, the content of the aliphatic unsaturated hydrocarbon group in one molecule is preferably 1 × 10 ⁻⁵ to 1 × 10 ⁻² mol / g, and preferably 1 × 10 ⁻⁴ to 2 × 10 ⁻³ mol / g. More preferred.

Examples of the polyorganosiloxane resin (C) include MQ resin, DT resin, and MDT resin. Of these, an MQ resin containing at least SiO _4/2 units (Q units) and R ^c1 ₂ R ^c2 SiO _1/2 units (M units) is preferable.

R ^c1 in the M unit represents an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group that does not have an aliphatic unsaturated bond. R ^c2 represents an aliphatic unsaturated hydrocarbon group, preferably an alkenyl group or an alkynyl group. Here, the plurality of R ^C1 may be the same as or different from each other. In addition, each group of R ^C1 may be further substituted with a substituent.

R number of carbon atoms in the alkyl group in ^c1 preferably 1 to 18, more preferably 1 to 10, preferably 1 to 4 further particularly preferably 1 or 2, and most preferably 1. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, pentyl, 2,2-dimethylpropyl, hexyl, n-octyl, n-nonyl and n-decyl. It is done. Of these, methyl is preferred.

The number of carbon atoms of the cycloalkyl group in R ^c1 is preferably 3 to 10, more preferably from 5 to 10, more preferably 5 or 6. The cycloalkyl group is preferably a 3-membered ring, 5-membered ring or 6-membered ring, more preferably a 5-membered ring or 6-membered ring. Examples of the cycloalkyl group include cyclopropyl, cyclopentyl, and cyclohexyl.

R number of carbon atoms of the aryl group in ^c1 preferably 6 to 18, more preferably 6 to 10, 6 to 8 is more preferred. Aryl groups include, for example, phenyl, tolyl, xylyl and naphthyl.
The number of carbon atoms of the aralkyl group in R ^c1 is preferably 7 to 18, 7 to 10 is more preferable. Examples of the aralkyl group include benzyl, phenylethyl, and phenylpropyl.

These alkyl group, cycloalkyl group, aryl group and aralkyl group may have a substituent. Such substituents include, for example, halogen atoms (fluorine, bromine, chlorine, etc.), alkyl groups, cycloalkyl groups, aryl groups, alkoxy groups, aryloxy groups, alkylthio groups, arylthio groups, silyl groups, and cyano groups. It is done.
Examples of the group having a substituent include chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, and cyanoethyl. Particularly preferred is a methyl group.

2-8 are preferable, as for carbon number of the alkenyl group in ^Rc2 , C2-C6 is more preferable, and 2 or 3 is further more preferable. Examples of the alkenyl group include vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl, and octenyl. Of these, vinyl is preferable.

The M unit / Q unit, which is the molar ratio of the R ^c1 ₂ R ^c2 SiO _1/2 unit (M unit) to the SiO _4/2 unit (Q unit), is 0. From the point that the silicone resin has good resin strength. 1-3.0 are preferred, 0.3-2.5 are more preferred, and 0.5-2.0 are even more preferred.
In addition, the polyorganosiloxane resin (C) in the present invention has R ^c1 ₂ SiO _2/2 units (D units) and / or R ^c1 SiO _{3 /} in the molecule as long as the properties of the silicone resin of the present invention are not impaired. _Two units (T units) may be included. R ^c1 has the same meaning as R ^c1 in the M unit, and the preferred range is also the same.

The polyorganosiloxane resin (C) in the present invention is a solid or viscous liquid at room temperature, and the mass average molecular weight is not particularly limited.
The kinematic viscosity of the 50 mass% xylene solution of the polyorganosiloxane resin (C) in the present invention is preferably 0.5 to 10 mm ² / s from the viewpoint of ease of processing of the composition for an acoustic wave probe of the present invention. 1.0-5.0 mm < ² > / s is more preferable.
The kinematic viscosity is a value measured at 25 ° C. using an Ubbelohde Ostwald viscometer.

The polyorganosiloxane resin (C) in the present invention more preferably has SiO _4/2 units, R ^c1 ₂ R ^c2 SiO _1/2 units and R ^c2 ₃ SiO _1/2 units.
^{Incidentally, R c1} and ^{R c2} are the same in ^{R c1} and ^{R c2} in the M units, and the preferred range is also the same.

  The polyorganosiloxane resin (C) in the present invention is preferably represented by the following average composition formula (c).

Average composition formula (c):
(SiO _4/2 ) _b (R ^c1 ₂ R ^c2 SiO _1/2 ) _c (R ^c1 ₃ SiO _1/2 ) _d

In formula (c), R ^c1 and R ^c2 have the same meaning as R ^c1 and R ^c2 described above, and preferred ranges are also the same. B, c and d each represent an independent positive number.
(c + d) / b, which is the sum of c and d with respect to b, is preferably 0.1 to 3.0, more preferably 0.3 to 2.5, and even more preferably 0.5 to 2.0.

The content of the polyorganosiloxane resin (C) in the total 100 parts by mass of the polysiloxane mixture is preferably 2 to 50 parts by mass, more preferably 10 to 40 parts by mass, and still more preferably 10 to 35 parts by mass.
When the content of the polyorganosiloxane resin (C) is within the above range, a silicone resin having good resin hardness, tear strength, and compression set can be obtained.

The polyorganosiloxane resin (C) in the present invention is preferably a vinyl group-containing polyorganosiloxane resin in which R ^c2 is vinyl.
A commercially available vinyl group-containing polyorganosiloxane resin can be obtained. For example, a vinyl group-containing vinyl Q resin dispersion (trade name: “VQM-135” (base) in which a vinyl group-containing polyorganosiloxane (Q resin) having Q units (SiO _4/2 units) is dispersed in a dispersion. DMS-V41), “VQM-146” (base is DMS-V46), “VQX-221” (base material is xylene), all manufactured by Gelest).

  The polyorganosiloxane resin (C) in the present invention may be used alone or in combination of two or more.

<Organosiloxane compound (D)>
The organosiloxane compound (D) in the present invention has a structure represented by the following general formula (D).

In the general formula (D), R ^d represents an alkyl group, a cycloalkyl group, an alkenyl group or an aryl group, and nd represents an integer of 1 or more. However, when nd is an integer of 2 or more, it may be cyclic.

The alkyl group, cycloalkyl group and aryl group in R ^{d have the same meanings as} the alkyl group, cycloalkyl group and aryl group in R ^a2 and R ^a3 , and the preferred ranges are also the same.
The number of carbon atoms of the alkenyl group for R ^d is preferably 2 to 10, 2 to 4 is more preferred. Examples of the alkenyl group include vinyl, allyl, and butenyl.

R ^d is preferably a methyl group.

  nd is preferably an integer of 1 to 20, and more preferably an integer of 2 to 15.

Here, “may be cyclic” means that a compound having a cyclic structure in which silicon atoms and oxygen atoms at both ends of nd structural units are bonded (hereinafter also referred to as a cyclic siloxane compound) may be used. .
That is, the organosiloxane compound (D) in the present invention may be a linear siloxane compound in which the structure represented by the general formula (D) is continuous in a linear form or a cyclic siloxane compound having a cyclic structure.
In addition, when the cyclic siloxane compound is used, an excellent tear strength can be obtained as compared with the case where the linear siloxane compound is used. Further, when a linear siloxane compound is used, superior resin hardness and bending fatigue resistance can be obtained as compared with the case where a cyclic siloxane compound is used.

In addition to the structure represented by the general formula (D), the organosiloxane compound (D) in the present invention may contain other structures as long as the properties of the silicone resin of the present invention are not impaired.
As another structure, the structure represented by the following general formula (D1) is mentioned, for example.

In General Formula (D1), R ^d1 represents an alkyl group, a cycloalkyl group, or an aryl group, and nd1 represents an integer of 2 or more. Here, several ^Rd1 may mutually be same or different. Further, each group of R ^d1 may be further substituted with a substituent.

The alkyl group, cycloalkyl group and aryl group in R ^{d1 have the same meanings as} the alkyl group, cycloalkyl group and aryl group in R ^d , and the preferred ranges are also the same.
R ^d1 is preferably a methyl group.

  These alkyl group, cycloalkyl group and aryl group may have a substituent. Such substituents include, for example, halogen atoms (fluorine, bromine, chlorine, etc.), alkyl groups, cycloalkyl groups, aryl groups, alkoxy groups, aryloxy groups, alkylthio groups, arylthio groups, silyl groups, and cyano groups. It is done.

  nd1 is preferably an integer of 1 to 500, and more preferably an integer of 1 to 200.

  The organosiloxane compound (D) in the present invention may contain two or more structures represented by the general formula (D1).

  The specific gravity is not particularly limited. The specific gravity is preferably 0.9 to 1.1 from the viewpoint of improving the mechanical properties, hardness, chemical stability, etc. of the silicone resin for acoustic wave probes obtained.

  The mass average molecular weight of the organosiloxane compound (D) is preferably 200 to 15,000, more preferably 200 to 10,000, from the viewpoint of mechanical strength, hardness, and ease of processing.

Kinematic viscosity at 25 ° C. is preferably from ^{1 × 10 -6 ~10m 2 / s} , more preferably ^{1 × 10 -6 ~1m 2 / s} , 1 × 10 -6 ~0.5m 2 / s is more preferable.
The kinematic viscosity is a value measured at 25 ° C. using an Ubbelohde Ostwald viscometer.

  Of the organosiloxane compound (D) in the present invention, the linear siloxane compound is preferably represented by the following general formula (D2).

In General Formula (D2), R ^d21 and R ^d22 each independently represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and nd2 represents an integer of 1 or more. The plurality of R ^d22 may be the same as or different from each other.

The alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^d21 and R ^{d22 have the same} meanings as the alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^d , and the preferred ranges are also the same.

Of these, R ^d21 and R ^d22 are preferably methyl groups.

  nd2 is preferably an integer of 1 to 20, and more preferably an integer of 2 to 10.

  Of the organosiloxane compound (D) in the present invention, the cyclic siloxane compound is preferably represented by the following general formula (D3).

In General Formula (D3), R ^d31 represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and nd3 represents an integer of 2 or more.

The alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^{d31 have the same} meanings as the alkyl group, cycloalkyl group, alkenyl group and aryl group in R ^d21 and R ^d22 , and the preferred ranges are also the same.

R ^d31 is particularly preferably a methyl group.

  nd3 is preferably an integer of 3 to 20, and more preferably an integer of 3 to 10.

  A commercially available organosiloxane compound (D) can be obtained. For example, a low molecular weight vinylmethylsiloxane homopolymer (trade name: “VMS-005 (cyclic)”, “VMS-T11 (linear)”, both manufactured by Gelest) can be used.

The content of the organosiloxane compound (D) in the total 100 parts by mass of the polysiloxane mixture is preferably 0.01 to 5 parts by mass, more preferably 0.1 to 4 parts by mass, and 0.2 to 3 parts by mass. Is more preferable.
When the content of the organosiloxane compound (D) is within the above range, a silicone resin having good resin hardness, tear strength, and bending fatigue resistance can be obtained.

  The organosiloxane compound (D) in this invention may be used individually by 1 type, and may be used in combination of 2 or more type.

<Silica (E) with an average primary particle size of less than 12 nm>
The polysiloxane mixture in the present invention preferably further contains silica (E) having an average primary particle diameter of less than 12 nm (hereinafter also simply referred to as silica particles (E)).
Silica particles are components added for the purpose of improving the hardness and mechanical strength of the resulting silicone resin, particularly for improving the tear strength.

By reducing the average primary particle diameter of the silica particles (E) to less than 12 nm, it is considered that the increase in acoustic wave attenuation is suppressed and the tear strength of the silicone resin can be improved.
That is, it is thought that the crack of the silicone resin due to mechanical stress is suppressed by the fine silica particles (E) functioning as a stopper. In particular, since the average primary particle size is small, the interparticle distance is small, so that the function as a stopper is exhibited more and the tear strength of the silicone resin is estimated to be greatly improved.

  Examples of the silica particles (E) include fumed silica, calcined silica, precipitated silica, and vinyl group-containing silicone resin. Silica particles (E) may be used alone or in combination of two or more.

  The average primary particle diameter of the silica particles (E) is less than 12 nm from the viewpoint of suppressing an increase in acoustic wave attenuation of the silicone resin and improving the tear strength, preferably more than 3 nm and less than 12 nm, more than 3 nm and more than 10 nm. Less than is more preferable. A smaller average primary particle size is preferable because the tear strength is higher.

  The average primary particle diameter is described in the catalog of the silica particle manufacturer. However, a product whose average primary particle size is not described in the catalog or a newly produced product can be obtained by averaging the particle size measured by a transmission electron microscope (TEM). That is, the short diameter and the long diameter are measured for one particle of an electron micrograph taken by TEM, and the average value is obtained as the particle diameter of one particle. In this specification, the particle diameters of 300 or more particles are averaged to obtain the average primary particle diameter.

Silica particles (E), from the viewpoint of improving the hardness and mechanical strength of the obtained silicone resin, the specific surface area is preferably ^{50~400m 2 / g, 100~400m 2 /} g is more preferable.

  The silica particles (E) are preferably silica particles whose surfaces are surface-treated. As the surface treatment, silica particles treated with saturated fatty acid or silane are preferable, and silica particles treated with silane are particularly preferable.

In the silane treatment, the surface of the silica particles is preferably treated with a silane coupling agent. From the viewpoint of improving the hardness and mechanical strength of the silicone resin, a silane coupling agent having a hydrolyzable group is preferred. The hydrolyzable group in the silane coupling agent is hydrolyzed with water to form a hydroxyl group, and this hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl group on the surface of the silica particle, whereby the surface modification of the silica particle is performed, and the resulting silicone resin Hardness and mechanical strength are improved. Examples of the hydrolyzable group include an alkoxy group, an acyloxy group, and a halogen atom.
In addition, when the surface of the silica particles is hydrophobically modified, the affinity between the silica particles (E) and the polyorganosiloxane (A), polyorganosiloxane resin (C) and siloxane compound (D) is good. Thus, the hardness and mechanical strength of the resulting silicone resin are improved, which is preferable.

Examples of the silane coupling agent having a hydrophobic group as a functional group include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, and n-propyltrisilane. Alkoxysilanes such as methoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane; methyltrichlorosilane, dimethyldichlorosilane (DDS), trimethylchlorosilane, phenyltrichlorosilane Chlorosilane; hexamethyldisilazane (HMDS).
Examples of the silane coupling agent having a vinyl group as a functional group include methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, and vinyltriethoxy. Examples thereof include alkoxysilanes such as silane, vinyltrimethoxysilane and vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane and vinylmethyldichlorosilane; divinyltetramethyldisilazane.

The silica particles (E) are preferably silica particles treated with a silane compound, more preferably silica particles treated with a trialkylsilylating agent, and even more preferably silica particles treated with a trimethylsilylating agent.
Examples of the silane compound include the above silane coupling agents and silane coupling agents in which functional groups in the silane coupling agent are substituted with alkyl groups.
Examples of the trimethylsilylating agent include trimethylchlorosilane and hexamethyldisilazane (HMDS) described in the above silane coupling agent and trimethylmethoxysilane which is a silane coupling agent in which a functional group is substituted with an alkyl group. It is done.

Examples of commercially available silane coupling agents include hexamethyldisilazane (HMDS) (trade name: HEXAMETHYLDISILAZAN (SIH6110.1), manufactured by Gelest).
Silanol groups (Si—OH groups) present on the surface of the silica particles are covered with trimethylsilyl groups by reaction with hexamethyldisilazane (HMDS), and the silica particle surface is modified to be hydrophobic.

  Examples of commercially available silica particles (E) include, for example, Aerosil (registered trademark) R812 (average primary particle size: 7 nm, HMDS surface treatment) and Aerosil (registered trademark), both of which are hydrophobic fumed silica manufactured by Nippon Aerosil Co., Ltd. ) R812S (average primary particle size 7 nm, HMDS surface treatment), Aerosil (registered trademark) RX300 (average primary particle size 7 nm, HMDS surface treatment), Aerosil (registered trademark) RX380S (average primary particle size 5 nm, HMDS surface treatment), Aerosil (registered trademark) R976S (average primary particle size: 7 nm, DDS surface treatment), Aerosil (registered trademark) 300 (average primary particle size: 7 nm), which is a hydrophilic fumed silica manufactured by Nippon Aerosil Co., Ltd., Aerosil (Registered trademark) 300CF (average primary particle diameter 7 nm), Aero Le (R) 380 (average primary particle diameter 7 nm) can be mentioned.

In addition, when the composition for acoustic wave probes of this invention contains a silica particle (E), a polyorganosiloxane (A) polyorganosiloxane resin (C) and a siloxane compound (D) are average primary particle diameters in the clearance gap. Since the small silica particles (E) are closely packed, the movement of the molecular chain is limited.
Further, since the radical curing reaction proceeds by the organic peroxide (B), the polyorganosiloxane having a vinyl group and / or the polyorganosiloxane having no vinyl group in the molecule and / or the polyorganosiloxane resin and / or It is preferable to use a polyorganosiloxane resin because a silicone resin having better mechanical strength can be obtained.
Among these, a polyorganosiloxane having a vinyl group at the molecular chain terminal is more preferable in terms of reactivity in a state in which the molecular chain motion of the polyorganosiloxane (A) is limited, and a high molecular weight vinyl group-containing polyorganosiloxane. Is more preferable in terms of mechanical strength and reactivity.

  When the composition for acoustic wave probes of this invention contains a silica particle (E), content of the silica whose average primary particle diameter is less than 12 nm in a total of 100 mass parts of a polysiloxane mixture is 0.1-30. Mass parts are preferred, 1 to 25 parts by mass are more preferred, and 5 to 20 parts by mass are even more preferred.

<Other materials>
The composition for an acoustic wave probe of the present invention comprises a polyorganosiloxane (A), an organic peroxide (B), a polyorganosiloxane resin (C), a siloxane compound (D), and silica having an average primary particle size of less than 12 nm ( In addition to E), a retarder, a solvent, a dispersant, a pigment, a dye, an antistatic agent, an antioxidant, a flame retardant, a thermal conductivity improver, and the like can be appropriately mixed. However, it is preferable not to add a platinum catalyst.

<Method for Producing Acoustic Wave Probe Composition and Silicone Resin for Acoustic Wave Probe>
The composition for acoustic wave probes of the present invention can be prepared by a known method.
For example, the components constituting the composition for acoustic wave probes can be obtained by kneading with a kneader, a pressure kneader, a Banbury mixer (continuous kneader), a two-roll kneader or the like.

From the viewpoint of obtaining a uniform composition for an acoustic wave probe, first, a polyorganosiloxane (A), a polyorganosiloxane resin (C) and an organosiloxane compound (D) are mixed, and then an organic peroxide ( B) is preferably added.
When the composition for an acoustic wave probe of the present invention contains silica (E) having an average primary particle size of less than 12 nm, and further other materials, polyorganosiloxane (A), polyorganosiloxane resin (C) and It is preferable to add the organic peroxide (B) after obtaining a mixture in which the silica particles (C) and other materials are dispersed in the organosiloxane compound (D).

The silicone resin for acoustic wave probes of the present invention is obtained by adding an organic peroxide (B) to a polysiloxane mixture containing at least a polyorganosiloxane (A), a polyorganosiloxane resin (C) and an organosiloxane compound (D). The composition for an acoustic wave probe of the present invention can be manufactured by curing the composition for an acoustic wave probe. Each component can be kneaded by the method described above.
Specifically, for example, the composition for an acoustic wave probe of the present invention obtained by the above-described method is heat-cured at 50 to 180 ° C. for 5 to 240 minutes, and further 1 at 100 to 220 ° C. as necessary. The silicone resin for acoustic wave probes can be obtained by performing secondary crosslinking for ˜5 hours.
In particular, since the organic peroxide (B) is used in the present invention, secondary crosslinking by reheating contributes to the heat removal of the decomposition product of the organic peroxide (B) and the stabilization of the silicone resin properties.

<Mechanical strength and acoustic wave characteristics of silicone resin>
Hereinafter, the mechanical strength and acoustic wave characteristics of the silicone resin will be described in detail.
Here, the acoustic wave characteristic describes the ultrasonic characteristic. However, the acoustic wave characteristic is not limited to the ultrasonic characteristic, but relates to the acoustic wave characteristic of an appropriate frequency selected according to the object to be examined, measurement conditions, and the like.

[hardness]
About a 2 mm-thick silicone resin sheet, according to JIS K6253-3 (2012), type A durometer hardness is measured using a rubber hardness meter (for example, "RH-201A" manufactured by Excel).
If it is too soft, it may be deformed when incorporated and used as a part of the acoustic wave probe. Therefore, the hardness is preferably 19 or more, more preferably 30 or more, and even more preferably 35 or more. The practical upper limit is 80 or less.

[Tear strength test]
A trouser type test piece is prepared according to JIS K6252 (2007) for a 2 mm thick silicone resin sheet, and the tear strength is measured.
The tear strength is preferably 17 N / cm or more, more preferably 20 N / cm or more, and even more preferably 30 N / cm or more. The realistic upper limit is 100 N / cm or less.

[Bending fatigue test]
For a silicone resin sheet having a thickness of 1 mm, the number of bendings at which a third-grade crack occurs is measured according to JIS K6260 (2010).
The number of bendings is preferably 200,000 times or more, and more preferably 250,000 times or more. The realistic upper limit is 5 million times or less.

[Acoustic impedance]
For a silicone resin sheet having a thickness of 2 mm, the density at 25 ° C. was determined according to the density measurement method of Method A (underwater substitution method) described in JIS K7112 (1999). 200L "). The sound velocity of the acoustic wave is measured at 25 ° C. using a sing-around sound velocity measuring device (for example, “UVM-2 type” manufactured by Ultrasonic Industry Co., Ltd.) according to JIS Z2353 (2003), and the measured density and sound velocity are measured. The acoustic impedance is obtained from the product of

[Acoustic wave (ultrasonic wave) attenuation, sensitivity]
Input a 5 MHz sine wave signal (1 wave) output from an ultrasonic oscillator (for example, function generator “FG-350” manufactured by Iwatsu Measurement Co., Ltd.) to an ultrasonic probe (for example, manufactured by Japan Probe Co., Ltd.). Then, an ultrasonic pulse wave having a center frequency of 5 MHz is generated from the ultrasonic probe in water. The amplitude of the generated ultrasonic wave before and after passing through the 2 mm-thick silicone resin sheet is measured with an ultrasonic receiver (for example, an oscilloscope “VP-5204A” manufactured by Matsushita Electric Industrial Co., Ltd.) with a water temperature of 25 The acoustic wave (ultrasonic wave) attenuation of each material is compared by measuring in an environment of ° C. and comparing the acoustic wave (ultrasonic wave) sensitivity.
The acoustic wave (ultrasonic wave) sensitivity means that an acoustic wave (ultrasonic wave) generated by an ultrasonic oscillator with respect to a voltage peak value Vin of an input wave such as a rectangular wave having a half width of 50 nsec or less or a spike wave is a sheet. The voltage value obtained when the ultrasonic oscillator receives the acoustic wave (ultrasonic wave) that passes through the sheet and is reflected from the facing surface of the sheet is Vs, and is a numerical value given by the following equation.

    Acoustic wave (ultrasound) sensitivity = 20 x Log (Vs / Vin)

  In the evaluation system of the present invention, the acoustic wave (ultrasonic wave) sensitivity is preferably −75 dB or more, more preferably −73 dB or more, and further preferably −72 dB or more.

The composition for an acoustic wave probe of the present invention is useful for a medical member, and can be preferably used for, for example, an acoustic wave probe or an acoustic wave measuring device. The acoustic wave measuring device of the present invention is not limited to an ultrasonic diagnostic device or a photoacoustic wave measuring device, but refers to a device that receives an acoustic wave reflected or generated by an object and displays it as an image or signal intensity.
In particular, the composition for an acoustic wave probe of the present invention is provided between an acoustic lens of an ultrasonic diagnostic apparatus or a piezoelectric element and an acoustic lens, and has a role of matching acoustic impedance between the piezoelectric element and the acoustic lens. Acoustic matching layer material, acoustic lens material in photoacoustic wave measuring device and ultrasonic endoscope, and acoustic in ultrasonic probe with capacitive micromachined ultrasonic transducer (cMUT) as ultrasonic transducer array It can be suitably used for a lens material or the like.
Specifically, the silicone resin for an acoustic wave probe of the present invention is, for example, an ultrasonic diagnostic apparatus described in JP-A-2005-253751, JP-A-2003-169802, or JP-A-2013-202050. , Preferably for acoustic wave measuring devices such as the photoacoustic wave measuring devices described in JP 2013-188465 A, JP 2013-180330 A, JP 2013-158435 A, JP 2013-154139 A, etc. Applied.

<< Acoustic wave probe (probe) >>
Hereinafter, the configuration of the acoustic wave probe of the present invention will be described in more detail based on the configuration of the ultrasonic probe in the ultrasonic diagnostic apparatus shown in FIG. In addition, an ultrasonic probe is a probe which uses an ultrasonic wave especially as an acoustic wave in an acoustic wave probe. Therefore, the basic structure of the ultrasonic probe is applied to the acoustic wave probe as it is.

− Ultrasonic probe −
The ultrasonic probe 10 is a main component of the ultrasonic diagnostic apparatus, and has a function of generating ultrasonic waves and transmitting / receiving ultrasonic beams. As shown in FIG. 1, the configuration of the ultrasonic probe 10 is provided in the order of an acoustic lens 1, an acoustic matching layer 2, a piezoelectric element layer 3, and a backing material 4 from the tip (surface in contact with a living body as a subject). Yes. In recent years, for the purpose of receiving high-order harmonics, a transmitting ultrasonic transducer (piezoelectric element) and a receiving ultrasonic transducer (piezoelectric element) are made of different materials to form a laminated structure. Has also been proposed.

<Piezoelectric element layer>
The piezoelectric element layer 3 is a part that generates ultrasonic waves, and electrodes are attached to both sides of the piezoelectric element. When a voltage is applied, the piezoelectric element repeatedly vibrates and expands and expands to generate ultrasonic waves. .

As a material constituting the piezoelectric element, a single crystal such as quartz, LiNbO ₃ , LiTaO ₃ , KNbO ₃ , a thin film such as ZnO or AlN, or a sintered body such as Pb (Zr, Ti) O ₃ system is subjected to polarization treatment. So-called ceramic inorganic piezoelectric materials are widely used. In general, piezoelectric ceramics such as PZT: lead zirconate titanate with high conversion efficiency are used.
In addition, a piezoelectric element that detects a received wave on the high frequency side needs sensitivity with a wider bandwidth. For this reason, an organic piezoelectric body using an organic polymer material such as polyvinylidene fluoride (PVDF) is used as a piezoelectric element suitable for a high frequency and a wide band.
Furthermore, Japanese Patent Application Laid-Open No. 2011-071842 uses MEMS (Micro Electro Mechanical Systems) technology that exhibits excellent short pulse characteristics and wide band characteristics, and that provides an array structure with excellent mass productivity and little variation in characteristics. cMUT is described.
In the present invention, any piezoelectric element material can be preferably used.

<Backing material>
The backing material 4 is provided on the back surface of the piezoelectric element layer 3, and reduces the pulse width of the ultrasonic wave by suppressing excessive vibration, thereby contributing to the improvement of the distance resolution in the ultrasonic diagnostic image.

<Acoustic matching layer>
The acoustic matching layer 2 is provided to reduce the difference in acoustic impedance between the piezoelectric element layer 3 and the subject and to efficiently transmit and receive ultrasonic waves.
The composition for an ultrasonic probe of the present invention is preferably used as a material for an acoustic matching layer because the difference from the acoustic impedance of a living body (1.4 to 1.7 × 10 ⁶ kg / m ² / sec) is small. Can do.

<Acoustic lens>
The acoustic lens 1 is provided to focus the ultrasonic wave in the slice direction using refraction and improve the resolution. In addition, the ultrasonic wave of the acoustic lens 1 itself is brought into close contact with the living body as the subject, and the ultrasonic wave is matched with the acoustic impedance (1.4 to 1.7 × 10 ⁶ kg / m ² / sec) of the living body. There is a demand for small attenuation.
That is, as the material of the acoustic lens 1, if the sound speed is sufficiently smaller than the sound speed of the human body, the attenuation of the ultrasonic wave is small, and the acoustic impedance is close to the value of the human skin, the transmission / reception sensitivity of the ultrasonic wave is improved.
The composition for ultrasonic probes of the present invention can be preferably used also as an acoustic lens material.

  The operation of the ultrasonic probe 10 having such a configuration will be described. A voltage is applied to the electrodes provided on both sides of the piezoelectric element to resonate the piezoelectric element layer 3, and an ultrasonic signal is transmitted from the acoustic lens to the subject. At the time of reception, the piezoelectric element layer 3 is vibrated by a reflected signal (echo signal) from the subject, and the vibration is electrically converted into a signal to obtain an image.

In particular, the acoustic lens obtained from the composition for an ultrasonic probe of the present invention can confirm a remarkable sensitivity improvement effect at an ultrasonic transmission frequency of about 5 MHz or more as a general medical ultrasonic transducer. Particularly significant sensitivity improvement effect can be expected at an ultrasonic transmission frequency of 10 MHz or more.
Hereinafter, an apparatus in which the acoustic lens obtained from the composition for an ultrasonic probe according to the present invention particularly functions will be described in detail.
In addition, the composition for ultrasonic probes of this invention shows the outstanding effect also with respect to apparatuses other than what is described below.

-Ultrasonic probe with cMUT (capacitive micromachined ultrasonic transducer)-
When the cMUT device described in JP 2006-157320 A, JP 2011-71842 A, or the like is used for a transducer array for ultrasonic diagnosis, it is generally compared with a transducer using general piezoelectric ceramics (PZT). Specifically, the sensitivity becomes low.
However, it is possible to compensate for the lack of sensitivity of cMUT by using an acoustic lens obtained from the composition for acoustic wave probes of the present invention. Thereby, the sensitivity of the cMUT can be brought close to the performance of the conventional transducer.
Since the cMUT device is manufactured by the MEMS technology, it is possible to provide an ultrasonic probe having a higher productivity and a lower cost than the piezoelectric ceramic probe to the market.

− Photoacoustic wave measurement device by photoacoustic imaging −
Photoacoustic imaging (PAI) described in Japanese Patent Application Laid-Open No. 2013-158435 or the like is a supersonic wave generated when a human body tissue is adiabatically expanded by irradiating light (electromagnetic waves) into the human body. Displays the image of the sound wave or the signal strength of the ultrasonic wave.
Here, since the sound pressure of the ultrasonic wave generated by light irradiation is very small, there is a problem that it is difficult to observe the deep part of the human body.
However, by using an acoustic lens obtained from the acoustic wave probe composition of the present invention, an effective effect on this problem can be exhibited.

− Ultrasound endoscope −
Since the ultrasonic wave in the ultrasonic endoscope described in Japanese Patent Application Laid-Open No. 2008-311700 is longer than the body surface transducer due to its structure, the improvement of the sensitivity of the transducer due to the cable loss is a problem. is there. Moreover, it is said that there is no effective sensitivity improvement means for this problem for the following reasons.

First, in the case of an ultrasonic diagnostic apparatus for the body surface, an amplifier circuit, an AD conversion IC, etc. can be installed at the tip of the transducer. On the other hand, since the ultrasonic endoscope is used by being inserted into the body, there is no installation space for the transducer and it is difficult to install it at the tip of the transducer.
Second, the piezoelectric single crystal employed in the transducer in the ultrasonic diagnostic apparatus for the body surface is difficult to apply to a transducer having an ultrasonic transmission frequency of 7 to 8 MHz or more due to its physical characteristics and process suitability. . However, since the ultrasonic waves for endoscopes are generally probes having an ultrasonic transmission frequency of 7 to 8 MHz or higher, it is difficult to improve the sensitivity with the piezoelectric single crystal material.

However, it is possible to improve the sensitivity of the endoscope ultrasonic transducer by using an acoustic lens obtained from the composition for acoustic wave probes of the present invention.
Even when the same ultrasonic transmission frequency (for example, 10 MHz) is used, the present invention is particularly effective when an acoustic lens obtained from the acoustic probe composition of the present invention is used in an ultrasonic transducer for an endoscope. Demonstrated.

  Hereinafter, the present invention will be described in more detail based on examples using ultrasonic waves as acoustic waves. Note that the present invention is not limited to ultrasonic waves, and an acoustic wave having an audible frequency may be used as long as an appropriate frequency is selected in accordance with an object to be examined and measurement conditions.

[Example 1]
Vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, mass average molecular weight 72,000), 69.4 parts by mass, vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) 30 parts by mass, 0.1 part by mass of vinylmethylsiloxane polymer (manufactured by Gelest, “VMS-T11”, mass average molecular weight 1,200) was kneaded using a 6-inch double roll kneader, and further 2 , 5-dimethyl-2,5-di- (t-butylperoxy) hexane (manufactured by NOF Corporation, “Perhexa 25B”) was roll-mixed to prepare a molding compound. This was press-molded at 165 ° C. for 10 minutes and further subjected to secondary crosslinking at 200 ° C. for 2 hours to obtain silicone resin sheets having a thickness of 1 mm and 2 mm, respectively.

[Example 2]
As the polyorganosiloxane, 69.2 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene) Solvent-removed product) Treated in the same manner as in Example 1 except that 30 parts by mass and 0.3 parts by mass of vinylmethylsiloxane polymer (manufactured by Gelest, “VMS-T11”, mass average molecular weight 1,200) as the siloxane compound were used. As a result, a predetermined silicone resin sheet was obtained.

[Example 3]
Vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, mass average molecular weight 72,000) 69.0 parts by mass, vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) 30 parts by mass, vinylmethylsiloxane polymer (manufactured by Gelest, “VMS-T11”, mass average molecular weight 1,200) Obtained.

[Example 4]
67.5 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene as polyorganosiloxane Solvent-removed product) 30 parts by mass, vinyl methyl siloxane polymer (manufactured by Gelest, “VMS-T11”, mass average molecular weight 1,200) 2 parts by mass was used as the siloxane compound in the same manner as in Example 1, A predetermined silicone resin sheet was obtained.

[Example 5]
65.5 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V42”, mass average molecular weight 72,000) as a polyorganosiloxane, vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene) Solvent-removed product) 30 parts by mass, vinyl methyl siloxane polymer (manufactured by Gelest, “VMS-T11”, mass average molecular weight 1,200) 4 parts by mass was used as the siloxane compound. A predetermined silicone resin sheet was obtained.

[Example 6]
As the polyorganosiloxane, 69.4 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene) Solvent-removed product) 30 parts by mass, cyclic vinylmethylsiloxane (2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, manufactured by Gelest, “VMS-005” as a siloxane compound ) A treatment was performed in the same manner as in Example 1 except that 0.1 part by mass was used to obtain a predetermined silicone resin sheet.

[Example 7]
As the polyorganosiloxane, 69.2 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene) Solvent-removed product) 30 parts by mass, cyclic vinylmethylsiloxane (2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, manufactured by Gelest, “VMS-005” as a siloxane compound ) The same silicone resin sheet was obtained as in Example 1 except that 0.3 parts by mass was used.

[Example 8]
69.0 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene) Solvent-removed product) 30 parts by mass, cyclic vinylmethylsiloxane (2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, manufactured by Gelest, “VMS-005” as a siloxane compound ) A treatment was performed in the same manner as in Example 1 except that 0.5 part by mass was used to obtain a predetermined silicone resin sheet.

[Example 9]
67.5 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene as polyorganosiloxane Solvent-removed product) 30 parts by mass, cyclic vinylmethylsiloxane (2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, manufactured by Gelest, “VMS-005” as a siloxane compound ) The same silicone resin sheet was obtained as in Example 1 except that 2 parts by mass were used.

[Example 10]
65.5 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V42”, mass average molecular weight 72,000) as a polyorganosiloxane, vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene) Solvent-removed product) 30 parts by mass, cyclic vinylmethylsiloxane (2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, manufactured by Gelest, “VMS-005” as a siloxane compound ) The same treatment as in Example 1 was carried out except that 4 parts by mass was used to obtain a predetermined silicone resin sheet.

[Example 11]
84.0 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, mass average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) The same silicone resin sheet was treated in the same manner as in Example 1 except that 15 parts by mass and 0.5 parts by mass of vinylmethylsiloxane polymer (Gelest, “VMS-T11”, mass average molecular weight 1,200) were used. Obtained.

[Example 12]
59.0 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, mass average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) 40 parts by mass, vinylmethylsiloxane polymer (Gelest, “VMS-T11”, mass average molecular weight 1,200) Obtained.

[Example 13]
The same treatment as in Example 3 was carried out except that 69.0 parts by mass of polydimethylsiloxane containing no vinyl group (“DMS-T41”, mass average molecular weight 60,000, manufactured by Gelest Co., Ltd.) was used as the polyorganosiloxane. The silicone resin sheet was obtained.

[Example 14]
The same treatment as in Example 3 was carried out except that 69.0 parts by mass of polydimethylsiloxane containing no vinyl group ("DMS-T46", mass average molecular weight 115,000, manufactured by Gelest Co.) was used as the polyorganosiloxane. The silicone resin sheet was obtained.

[Example 15]
The same treatment as in Example 3 was carried out except that 69.0 parts by mass of polydimethylsiloxane containing no vinyl group (“DMS-T61”, mass average molecular weight 230,000) manufactured by Gelest Co., Ltd. was used as the polyorganosiloxane. The silicone resin sheet was obtained.

[Example 16]
The same treatment as in Example 3 was carried out except that 69.0 parts by mass of polydimethylsiloxane containing no vinyl group ("DMS-T63", mass average molecular weight 300,000) manufactured by Gelest Co., Ltd.) was used as the polyorganosiloxane. The silicone resin sheet was obtained.

[Example 17]
The same treatment as in Example 3 was carried out except that 69.0 parts by mass of polydimethylsiloxane containing no vinyl group (“DMS-T72”, mass average molecular weight 500,000, manufactured by Gelest Co., Ltd.) was used as the polyorganosiloxane. The silicone resin sheet was obtained.

[Example 18]
The same treatment as in Example 3 was conducted except that 69.0 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V31”, weight average molecular weight 28,000) was used as the polyorganosiloxane. A sheet was obtained.

[Example 19]
The same treatment as in Example 3 was conducted except that 69.0 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V35”, mass average molecular weight 49,500) was used as the polyorganosiloxane, and a predetermined silicone resin was used. A sheet was obtained.

[Example 20]
The same treatment as in Example 3 was carried out except that 69.0 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V46”, mass average molecular weight 117,000) was used as the polyorganosiloxane, and a predetermined silicone resin was used. A sheet was obtained.

[Example 21]
The same treatment as in Example 3 was performed except that 69.0 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V52”, mass average molecular weight 155,000) was used as the polyorganosiloxane. A sheet was obtained.

[Example 22]
A predetermined silicone resin sheet was obtained in the same manner as in Example 3 except that 0.5 parts by mass of dicumyl peroxide (manufactured by NOF Corporation, “Park Mill D”) was used as the organic peroxide.

[Example 23]
A predetermined silicone resin sheet was obtained in the same manner as in Example 3 except that 0.5 parts by mass of t-butyl peroxybenzoate (manufactured by NOF Corporation, “Perbutyl Z”) was used as the organic peroxide. .

[Example 24]
25 parts by mass of vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (Aerosil RX300, average primary particle size 7 nm, hexamethyldisilazane as silica particles) (HMDS) Surface treatment) A predetermined silicone resin sheet was obtained in the same manner as in Example 3 except that 5 parts by mass were used.

[Example 25]
20 parts by mass of vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (Aerosil RX300, average primary particle diameter 7 nm, hexamethyldisilazane as silica particles) (HMDS) Surface treatment) A predetermined silicone resin sheet was obtained in the same manner as in Example 3 except that 10 parts by mass was used.

[Example 26]
15 parts by mass of vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (Aerosil RX300, average primary particle size 7 nm, hexamethyldisilazane) as silica particles (HMDS) Surface treatment) A predetermined silicone resin sheet was obtained in the same manner as in Example 3 except that 15 parts by mass were used.

[Example 27]
10 parts by mass of vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (Aerosil RX300, average primary particle diameter 7 nm, hexamethyldisilazane) as silica particles (HMDS) Surface treatment) A predetermined silicone resin sheet was obtained in the same manner as in Example 3 except that 20 parts by mass was used.

[Example 28]
15 parts by mass of vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (Nippon Aerosil Co., Ltd., “Aerosil (registered trademark) R976S” as silica particles The treatment was performed in the same manner as in Example 3 except that 15 parts by mass of an average primary particle diameter of 7 nm and dimethyldichlorosilane (DDS) surface treatment) was used, and a predetermined silicone resin sheet was obtained.

[Example 29]
15 parts by mass of vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (manufactured by Nippon Aerosil Co., Ltd., “Aerosil (registered trademark) 300” as silica particles The average primary particle diameter was 7 nm, no surface treatment was performed, and the treatment was performed in the same manner as in Example 3 except that 15 parts by mass was used to obtain a predetermined silicone resin sheet.

[Example 30]
15 parts by mass of vinyl group-containing silicone resin (manufactured by Gelest, “VQX-221”, xylene solvent-removed product) as polyorganosiloxane resin, fumed silica (manufactured by Nippon Aerosil Co., Ltd., “Aerosil (registered trademark) RX380S” as silica particles ”, Average primary particle diameter 5 nm, HMDS surface treatment) Except for using 15 parts by mass, the same treatment as in Example 3 was performed to obtain a predetermined silicone resin sheet.

[Comparative Example 1]
99 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, mass average molecular weight 72,000), vinylmethylsiloxane polymer (Gelest, “VMS-T11”, mass average molecular weight 1,200) 0 The same treatment as in Example 1 was performed except that the amount was changed to 5 parts by mass to obtain a predetermined silicone resin sheet.

[Comparative Example 2]
69.5 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, weight average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) A predetermined silicone resin sheet was obtained in the same manner as in Example 1 except that the amount was 30 parts by mass.

[Comparative Example 3]
A predetermined silicone resin sheet was obtained in the same manner as in Example 1 except that only 99.5 parts by mass of vinyl-terminated polydimethylsiloxane (manufactured by Gelest, “DMS-V42”, mass average molecular weight 72,000) was used. .

[Comparative Example 4]
61.5 parts by mass of vinyl-terminated polydimethylsiloxane (Gelest, “DMS-V42”, mass average molecular weight 72,000), vinyl group-containing silicone resin (Gelest, “VQX-221”, xylene solvent-removed product) 30 parts by mass, vinylmethylsiloxane polymer (manufactured by Gelest, “VMS-T11”, mass average molecular weight 1,200) was treated in the same manner as in Example 1 except that 8.0 parts by mass, and a predetermined silicone resin sheet was formed. Obtained.

<Evaluation of mechanical strength and ultrasonic characteristics>
The following evaluation was performed about the silicone resin sheet of Examples 1-30 and Comparative Examples 1-4.

[hardness]
About the obtained 2 mm-thick silicone resin sheet, according to JIS K6253-3 (2012), the type A durometer hardness was measured using the rubber hardness meter (the Excel company make, "RH-201A").

[Tear strength test]
About the obtained 2 mm-thick silicone resin sheet, a trouser type test piece was prepared according to JIS K6252 (2007), and tear strength was measured.

[Bending fatigue test]
The obtained silicone resin sheet having a thickness of 1 mm was measured for the number of bendings at which a third-grade crack was generated according to JIS K6260 (2010).

[Acoustic impedance]
For the obtained silicone resin sheet having a thickness of 2 mm, the density at 25 ° C. was determined according to the density measurement method of Method A (underwater substitution method) described in JIS K7112 (1999). -200L "). The ultrasonic sound velocity is measured at 25 ° C. using a sing-around sound velocity measuring device (manufactured by Ultrasonic Industry Co., Ltd., “UVM-2 type”) according to JIS Z2353 (2003), and from the product of the measured density and sound velocity. The acoustic impedance was determined.

[Acoustic wave (ultrasonic wave) sensitivity]
A 5 MHz sine wave signal (1 wave) output from an ultrasonic oscillator (Iwatsu Measurement Co., Ltd., function generator “FG-350”) is input to an ultrasonic probe (Japan Probe Co., Ltd.) An ultrasonic pulse wave having a center frequency of 5 MHz was generated from the probe in water. The amplitude of the generated ultrasonic wave before and after passing through the obtained silicone resin sheet with a thickness of 2 mm is measured with an ultrasonic receiver (Oscilloscope “VP-5204A”, manufactured by Matsushita Electric Industrial Co., Ltd.) The acoustic wave (ultrasonic wave) attenuation amount of each material was compared by measuring in an environment of 25 ° C. and comparing the acoustic wave (ultrasonic wave) sensitivity.
The acoustic wave (ultrasonic wave) sensitivity is such that the generated acoustic wave (ultrasonic wave) passes through the sheet with respect to the voltage peak value Vin of the input wave having a half-value width of 50 nsec or less by the ultrasonic oscillator, and from the opposite side of the sheet. The voltage value obtained when the ultrasonic wave (ultrasonic wave) reflected was received by the ultrasonic oscillator was defined as Vs, and was calculated from the following calculation formula.

    Acoustic wave (ultrasound) sensitivity = 20 x Log (Vs / Vin)

The obtained results are summarized and shown in Tables 1 to 3 below.
In Tables 1 to 3 below, polyorganosiloxane (A), organic peroxide (B), polyorganosiloxane resin (C), organosiloxane compound (D) and silica having an average primary particle size of less than 12 nm (E ) Are abbreviated as components (A) to (E), respectively, and the mass average molecular weight of the polyorganosiloxane (A) is simply described as the molecular weight.
In addition, the name of each material is described as a product name. The trade name of silica particles (E) is described with Aerosil (registered trademark) omitted.

As shown in Tables 1 to 3, the silicone resins for acoustic wave probes of Examples 1 to 30 all have high resin hardness, tear strength, and bending resistance while maintaining an acoustic wave (ultrasonic wave) sensitivity of −75 dB or more. We were able to get fatigue.
In contrast, the acoustic wave probe of Comparative Example 3 that does not contain the polyorganosiloxane resin (C) and the silicone resin for the acoustic wave probe of Comparative Example 1 and does not contain the polyorganosiloxane resin (C) and the organosiloxane compound (D) None of the silicone resins for use had sufficient resin hardness and tear strength. The silicone resin for acoustic wave probes of Comparative Example 2 that does not contain the organosiloxane compound (D) and the silicone resin for acoustic wave probes of Comparative Example 4 that contains a large amount of the organosiloxane compound (D) are both tear strength and Bending fatigue resistance was not sufficient.

  From this result, the composition for acoustic wave probes of this invention is useful for a medical member, and can be used suitably for the manufacturing method of the silicone resin of this invention. The silicone resin of the present invention can also be suitably used for an acoustic lens and / or acoustic matching layer of an acoustic wave probe, an acoustic wave measuring device, and an ultrasonic diagnostic device. In particular, the composition for acoustic wave probes and the silicone resin for acoustic wave probes are used for the purpose of improving sensitivity in ultrasonic probes, photoacoustic wave measuring apparatuses and ultrasonic endoscopes using cMUT as a transducer array for ultrasonic diagnosis. It can be used suitably.

DESCRIPTION OF SYMBOLS 1 Acoustic lens 2 Acoustic matching layer 3 Piezoelectric element layer 4 Backing material 7 Case 9 Code 10 Ultrasonic probe (probe)

Claims (17)

The polysiloxane mixture contains at least polysiloxane, organic peroxide, polysiloxane resin, and siloxane compound,
The content of the siloxane compound in a total of 100 parts by mass of the polysiloxane mixture is 0.001 to 5 parts by mass,
The polysiloxane is a polysiloxane having a structure represented by the following general formula (A1) or (A2):
The polysiloxane resin is a polyorganosiloxane resin having at least two aliphatic unsaturated hydrocarbon groups in one molecule and having a network structure in at least a part of the skeleton,
The composition for acoustic wave probes in which the siloxane compound has a structure represented by the following general formula (D2) or (D3) .

In the general formulas (A1) and (A2), R ^a1 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and R ^a2 and R ^a3 each independently represent a hydrogen atom, an alkyl, A group, a cycloalkyl group, an alkenyl group having 3 or more carbon atoms or an aryl group, and x1 and x2 each independently represents an integer of 1 or more. Here, a plurality of R ^a1 , a plurality of R ^a2 , and a plurality of R ^a3 may be the same as or different from each other, and each group of R ^{a1 to} R ^a3 may be further substituted with a substituent. R ¹ and R ⁴ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group or an aryl group, and R ² and R ³ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a carbon number 3 or more alkenyl groups or aryl groups are represented, m represents an integer of 1 or more, and n represents 0 or an integer of 1 to 5. Here, a plurality of R ¹ , a plurality of R ² , a plurality of R ³ , a plurality of R ⁴ and a plurality of m may be the same or different from each other, and each group of R ^{1 to} R ⁴ may further be a substituent. May be substituted.
In the general formulas (D2) and (D3) , R ^{d2 1} represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, R ^d22 represents an alkyl group, a cycloalkyl group, or an aryl group, and nd 2 is 1 or more Represents an integer. The plurality of R ^d22 may be the same as or different from each other. R ^d31 represents an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and nd3 represents an integer of 2 or more.   The composition for an acoustic wave probe according to claim 1, wherein the polysiloxane is a vinyl group-containing polysiloxane.   The composition for an acoustic wave probe according to claim 1, wherein the polysiloxane resin is a vinyl group-containing polysiloxane resin. The composition for acoustic wave probes according to any one of claims 1 to 3, wherein the polysiloxane resin is represented by the following average composition formula (c).

In the average composition formula (c), R ^c1 Represents an alkyl group having no aliphatic unsaturated bond, a cycloalkyl group, an aryl group or an aralkyl group; ^c2 Represents an aliphatic unsaturated hydrocarbon group. b, c and d each represent an independent integer. The siloxane compound is an acoustic wave probe composition according to any one of claims 1 to 4, represented in the previous following general formula (D2). The composition for an acoustic wave probe according to any one of claims 1 to 4 , wherein the siloxane compound is a compound having a cyclic structure. The composition for acoustic wave probes according to any one of claims 1 to 6 , wherein 0.1 to 30 parts by mass of silica having an average primary particle diameter of less than 12 nm is contained in 100 parts by mass of the polysiloxane mixture.   The composition for acoustic wave probes according to claim 2, wherein the vinyl group-containing polysiloxane has a mass average molecular weight of 20,000 to 1,000,000.   The composition for acoustic wave probes according to claim 2, wherein the vinyl group-containing polysiloxane has a mass average molecular weight of 40,000 to 300,000. Claim 1-9 any one acoustic wave probe silicone resin obtained by curing the acoustic wave probe composition according to. The acoustic wave probe which has an acoustic lens and / or an acoustic matching layer which consist of the silicone resin for acoustic wave probes of Claim 10 . An ultrasonic probe comprising a capacitive micromachine ultrasonic transducer as an ultrasonic transducer array, and an acoustic lens made of the silicone resin for an acoustic wave probe according to claim 10 . An acoustic wave measuring apparatus comprising the acoustic wave probe according to claim 11 . An ultrasonic diagnostic apparatus comprising the acoustic probe according to claim 11 . A photoacoustic wave measuring apparatus provided with the acoustic lens which consists of a silicone resin for acoustic wave probes of Claim 10 . An ultrasonic endoscope comprising an acoustic lens made of the silicone resin for an acoustic wave probe according to claim 10 . A method for producing a silicone resin for an acoustic wave probe,
The silicone resin for acoustic wave probes is the silicone resin for acoustic wave probes according to claim 10,
Silicone for acoustic wave probe, in which an organic peroxide is added to a polysiloxane mixture containing at least polysiloxane, a polysiloxane resin and a siloxane compound to form an acoustic wave probe composition, and then the acoustic wave probe composition is cured. Manufacturing method of resin.

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