JP6374696B2 - Method for producing surface-modified inorganic oxide particles and organic-inorganic composite particles - Google Patents
Method for producing surface-modified inorganic oxide particles and organic-inorganic composite particles Download PDFInfo
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- JP6374696B2 JP6374696B2 JP2014094445A JP2014094445A JP6374696B2 JP 6374696 B2 JP6374696 B2 JP 6374696B2 JP 2014094445 A JP2014094445 A JP 2014094445A JP 2014094445 A JP2014094445 A JP 2014094445A JP 6374696 B2 JP6374696 B2 JP 6374696B2
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- inorganic oxide
- oxide particles
- organosilicon
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- modified inorganic
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- 239000002245 particle Substances 0.000 title claims description 156
- 229910052809 inorganic oxide Inorganic materials 0.000 title claims description 136
- 239000011246 composite particle Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000006116 polymerization reaction Methods 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 31
- 239000003054 catalyst Substances 0.000 claims description 22
- 239000000178 monomer Substances 0.000 claims description 22
- 239000002904 solvent Substances 0.000 claims description 21
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 125000005843 halogen group Chemical group 0.000 claims description 16
- 230000004048 modification Effects 0.000 claims description 15
- 238000012986 modification Methods 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000004220 aggregation Methods 0.000 claims description 8
- 230000002776 aggregation Effects 0.000 claims description 8
- 150000003440 styrenes Chemical class 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 3
- 229910052740 iodine Inorganic materials 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
- 230000000977 initiatory effect Effects 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 14
- -1 3- (dichloromethylsilyl) propyl Chemical group 0.000 description 13
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 235000019260 propionic acid Nutrition 0.000 description 6
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 101710141544 Allatotropin-related peptide Proteins 0.000 description 4
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
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- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010954 inorganic particle Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- AQRLNPVMDITEJU-UHFFFAOYSA-N triethylsilane Chemical compound CC[SiH](CC)CC AQRLNPVMDITEJU-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 2
- OMNHRTSJVBKLEU-UHFFFAOYSA-N 2-bromo-6-[ethoxy(dimethyl)silyl]-2-methylhexan-3-one Chemical compound CCO[Si](C)(C)CCCC(=O)C(C)(C)Br OMNHRTSJVBKLEU-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- DXMOVYUDYQDMBC-UHFFFAOYSA-N 3-[chloro(dimethyl)silyl]propyl 2-bromo-2-methylpropanoate Chemical compound CC(C)(Br)C(=O)OCCC[Si](C)(C)Cl DXMOVYUDYQDMBC-UHFFFAOYSA-N 0.000 description 2
- PBHIWZGFSZBQJV-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-bromo-2-methylpropanoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)(C)Br PBHIWZGFSZBQJV-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
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- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- XCOBLONWWXQEBS-KPKJPENVSA-N N,O-bis(trimethylsilyl)trifluoroacetamide Chemical compound C[Si](C)(C)O\C(C(F)(F)F)=N\[Si](C)(C)C XCOBLONWWXQEBS-KPKJPENVSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
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- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 238000005119 centrifugation Methods 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 2
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 2
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- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 2
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
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- 229910052760 oxygen Inorganic materials 0.000 description 2
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- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
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- 229910052723 transition metal Inorganic materials 0.000 description 2
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- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- HYWCXWRMUZYRPH-UHFFFAOYSA-N trimethyl(prop-2-enyl)silane Chemical compound C[Si](C)(C)CC=C HYWCXWRMUZYRPH-UHFFFAOYSA-N 0.000 description 2
- FTVLMFQEYACZNP-UHFFFAOYSA-N trimethylsilyl trifluoromethanesulfonate Chemical compound C[Si](C)(C)OS(=O)(=O)C(F)(F)F FTVLMFQEYACZNP-UHFFFAOYSA-N 0.000 description 2
- CWMFRHBXRUITQE-UHFFFAOYSA-N trimethylsilylacetylene Chemical group C[Si](C)(C)C#C CWMFRHBXRUITQE-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- DCXZWVLJCYXHDV-UHFFFAOYSA-N (4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-heptadecafluoro-2-hydroxyundecyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F DCXZWVLJCYXHDV-UHFFFAOYSA-N 0.000 description 1
- GEEMGMOJBUUPBY-UHFFFAOYSA-N (4,4,5,5,6,6,7,7,8,8,9,9,9-tridecafluoro-2-hydroxynonyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F GEEMGMOJBUUPBY-UHFFFAOYSA-N 0.000 description 1
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 1
- QERNPKXJOBLNFM-UHFFFAOYSA-N 1,1,2,2,3,3,4,4-octafluoropentane Chemical compound CC(F)(F)C(F)(F)C(F)(F)C(F)F QERNPKXJOBLNFM-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
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- MASDFXZJIDNRTR-UHFFFAOYSA-N 1,3-bis(trimethylsilyl)urea Chemical compound C[Si](C)(C)NC(=O)N[Si](C)(C)C MASDFXZJIDNRTR-UHFFFAOYSA-N 0.000 description 1
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- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
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- RSVZYSKAPMBSMY-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)C(F)F RSVZYSKAPMBSMY-UHFFFAOYSA-N 0.000 description 1
- VHJHZYSXJKREEE-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropyl prop-2-enoate Chemical compound FC(F)C(F)(F)COC(=O)C=C VHJHZYSXJKREEE-UHFFFAOYSA-N 0.000 description 1
- DFVPUWGVOPDJTC-UHFFFAOYSA-N 2,2,3,4,4,4-hexafluorobutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)C(F)C(F)(F)F DFVPUWGVOPDJTC-UHFFFAOYSA-N 0.000 description 1
- LMVLEDTVXAGBJV-UHFFFAOYSA-N 2,2,3,4,4,4-hexafluorobutyl prop-2-enoate Chemical compound FC(F)(F)C(F)C(F)(F)COC(=O)C=C LMVLEDTVXAGBJV-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical group CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
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- GPQMJVVKCWBTQL-UHFFFAOYSA-N 2-bromo-6-triethoxysilylhexan-3-one Chemical compound CCO[Si](CCCC(=O)C(C)Br)(OCC)OCC GPQMJVVKCWBTQL-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
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- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
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Landscapes
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、表面改質無機酸化物粒子、該表面改質無機酸化物粒子を用いた有機無機複合粒子の製造方法に関する。 The present invention relates to surface-modified inorganic oxide particles and a method for producing organic-inorganic composite particles using the surface-modified inorganic oxide particles.
従来、無機微粒子をポリマーと複合化することにより、光学特性の向上及び屈折率を制御する試みがなされている。この無機微粒子とポリマーとを複合させる方法としては、無機酸化物とポリマーとを混合する方法が一般的である(特許文献1参照)。一方、特許文献2には、無機化合物粒子に重合開始基を結合させて、該重合開始基からポリマーを重合させた有機無機複合体の製造方法が開示されている。 Conventionally, attempts have been made to improve optical characteristics and control the refractive index by combining inorganic fine particles with a polymer. As a method of combining the inorganic fine particles and the polymer, a method of mixing an inorganic oxide and a polymer is generally used (see Patent Document 1). On the other hand, Patent Document 2 discloses a method for producing an organic-inorganic composite in which a polymerization initiating group is bonded to inorganic compound particles and a polymer is polymerized from the polymerization initiating group.
しかしながら、特許文献1の方法では、無機微粒子がポリマー中に分散した状態であり、このコーティング剤を基材に塗布、乾燥する際に無機微粒子とポリマーとが不均一になり、無機酸化物とポリマーとの比率によっては、無機微粒子が凝集して濁る等の不具合が生じるため、目的とする複合体が得られないことがある。 However, in the method of Patent Document 1, the inorganic fine particles are dispersed in the polymer, and when the coating agent is applied to the substrate and dried, the inorganic fine particles and the polymer become non-uniform, and the inorganic oxide and the polymer Depending on the ratio, a problem such as aggregation and turbidity of the inorganic fine particles may occur, and the target composite may not be obtained.
引用文献2の方法で得られる有機無機複合体を溶媒等に分散させて用いようとした場合、十分な分散性が得られないことがある。 When the organic-inorganic composite obtained by the method of Cited Document 2 is dispersed in a solvent or the like and used, sufficient dispersibility may not be obtained.
そこで、本発明は、分散性に優れる表面改質無機酸化物粒子、及び、該無機酸化物粒子を用いた有機無機複合粒子の製造方法を提供することを目的とする。 Accordingly, an object of the present invention is to provide surface-modified inorganic oxide particles having excellent dispersibility and a method for producing organic-inorganic composite particles using the inorganic oxide particles.
本発明は、以下のものに関する。
[1]無機酸化物粒子の表面に、下記一般式(1)で表される有機ケイ素基と、下記一般式(2)で表される有機ケイ素基とを有する、表面改質無機酸化物粒子。
[式(1)中、R1及びR2はそれぞれ独立に、無機酸化物粒子の表面と結合する単結合、水素原子又は炭素数1〜5のアルキル基を示し、R3は−CH2−、−O−、−NH−、−NCH3−又−NC6H5−を示し、R4及びR5はそれぞれ独立に、水素原子、炭素数1〜5のアルキル基又は炭素数6〜12のアリール基を示し、Xはハロゲン原子を示し、nは1〜10の整数を示す。]
[式(2)中、R6は、前記一般式(1)で表される有機ケイ素基とは異なる有機ケイ素基を示し、ハロゲン原子を含んでいてもよい。]
[2]R6が下記一般式(3)で表される有機ケイ素基である、[1]に記載の表面改質無機酸化物粒子。
[式(3)中、R7、R8及びR9は各々独立に水素原子又は炭素数1〜5のアルキル基を示し、R7、R8及びR9はのうち少なくとも一つは炭素数1〜5のアルキル基である。]
[3]無機酸化物粒子の単位面積当たりの一般式(1)で表される有機ケイ素基の修飾量が、0.001〜0.5本/nm2であり、一般式(2)で表される有機ケイ素基の修飾量が、1.5本/nm2〜10本/nm2である、[1]又は[2]に記載の表面改質無機酸化物粒子。
[4]R1及びR2が、それぞれ独立に水素又は炭素数1〜5のアルキル基である、[1]〜[3]のいずれかに記載の表面改質無機酸化物粒子。
[5]無機酸化物粒子の粒径が1〜200nmである、[1]〜[4]のいずれかに記載の表面改質無機酸化物粒子。
[6]無機酸化物粒子が、酸化ケイ素、酸化チタン及び酸化ジルコニウムからなる群より選ばれる少なくとも1種を含む、[1]〜[5]のいずれかに記載の表面改質無機酸化物粒子。
[7]一般式(1)のXが、臭素原子、塩素原子又はヨウ素原子である、[1]〜[6]のいずれかに記載の表面改質無機酸化物粒子。
[8]凝集度が5以下である、[1]〜[7]のいずれかに記載の表面改質無機酸化物粒子。
[9][1]〜[8]のいずれかに記載の表面改質無機酸化物粒子と、重合性モノマーとを、触媒の存在下で重合する重合工程を備える、有機無機複合粒子の製造方法。
[10]重合工程を溶媒の存在下で行う、[9]に記載の方法。
[11]触媒が銅触媒である、[9]又は[10]に記載の方法。
[12]重合性モノマーが、アクリル酸エステル、メタクリル酸エステル及びスチレン類からなる群より選ばれる少なくとも1種を含む、[9]〜[11]のいずれかに記載の方法。
[13][1]〜[8]のいずれかに記載の表面改質無機酸化物粒子と、[9]〜[12]のいずれかに記載の方法により得られる有機無機複合粒子とを含む組成物。
The present invention relates to the following.
[1] Surface-modified inorganic oxide particles having an organosilicon group represented by the following general formula (1) and an organosilicon group represented by the following general formula (2) on the surface of the inorganic oxide particles .
[In Formula (1), R 1 and R 2 each independently represent a single bond, a hydrogen atom or an alkyl group having 1 to 5 carbon atoms bonded to the surface of the inorganic oxide particle, and R 3 represents —CH 2 —. , —O—, —NH—, —NCH 3 — or —NC 6 H 5 —, wherein R 4 and R 5 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or 6 to 12 carbon atoms. X represents a halogen atom, and n represents an integer of 1 to 10. ]
[In Formula (2), R 6 represents an organosilicon group different from the organosilicon group represented by Formula (1), and may contain a halogen atom. ]
[2] The surface-modified inorganic oxide particles according to [1], wherein R 6 is an organosilicon group represented by the following general formula (3).
[In the formula (3), R 7 , R 8 and R 9 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and at least one of R 7 , R 8 and R 9 is the number of carbon atoms. 1 to 5 alkyl groups. ]
[3] The modification amount of the organosilicon group represented by the general formula (1) per unit area of the inorganic oxide particles is 0.001 to 0.5 / nm 2 , and is represented by the general formula (2). The surface-modified inorganic oxide particles according to [1] or [2], wherein the modified amount of the organosilicon group is 1.5 / nm 2 to 10 / nm 2 .
[4] The surface-modified inorganic oxide particles according to any one of [1] to [3], wherein R 1 and R 2 are each independently hydrogen or an alkyl group having 1 to 5 carbon atoms.
[5] The surface-modified inorganic oxide particles according to any one of [1] to [4], wherein the inorganic oxide particles have a particle size of 1 to 200 nm.
[6] The surface-modified inorganic oxide particles according to any one of [1] to [5], wherein the inorganic oxide particles include at least one selected from the group consisting of silicon oxide, titanium oxide, and zirconium oxide.
[7] The surface-modified inorganic oxide particle according to any one of [1] to [6], wherein X in the general formula (1) is a bromine atom, a chlorine atom, or an iodine atom.
[8] The surface-modified inorganic oxide particles according to any one of [1] to [7], wherein the degree of aggregation is 5 or less.
[9] A method for producing organic-inorganic composite particles, comprising a polymerization step of polymerizing the surface-modified inorganic oxide particles according to any one of [1] to [8] and a polymerizable monomer in the presence of a catalyst. .
[10] The method according to [9], wherein the polymerization step is performed in the presence of a solvent.
[11] The method according to [9] or [10], wherein the catalyst is a copper catalyst.
[12] The method according to any one of [9] to [11], wherein the polymerizable monomer includes at least one selected from the group consisting of acrylic acid esters, methacrylic acid esters, and styrenes.
[13] A composition comprising the surface-modified inorganic oxide particles according to any one of [1] to [8] and the organic-inorganic composite particles obtained by the method according to any one of [9] to [12]. object.
本発明によれば、分散性に優れる無機酸化物粒子、及び、該無機酸化物粒子を用いた有機無機複合粒子の製造方法を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the organic-inorganic composite particle | grains using the inorganic oxide particle which is excellent in the dispersibility, and this inorganic oxide particle can be provided.
以下、本発明を実施するための形態(以下、本実施の形態)について詳細に説明する。なお、本発明は、本実施の形態に限定されるものではなく、その要旨の範囲内で種々変形して実施することができる。また、本明細書において使用される用語は、特に言及しない限り、当該分野で通常用いられる意味で用いられることが理解されるべきである。 Hereinafter, a mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be described in detail. In addition, this invention is not limited to this Embodiment, It can implement by changing variously within the range of the summary. In addition, it is to be understood that the terms used in the present specification are used in the meaning normally used in the art unless otherwise specified.
<表面改質無機酸化物粒子>
本実施形態の表面改質無機粒子は、無機酸化物粒子の表面に、下記一般式(1)で表される有機ケイ素基及び下記一般式(2)で表される有機ケイ素基を有する。
<Surface modified inorganic oxide particles>
The surface-modified inorganic particles of the present embodiment have an organosilicon group represented by the following general formula (1) and an organosilicon group represented by the following general formula (2) on the surface of the inorganic oxide particles.
式(1)中、R1及びR2は無機酸化物粒子表面と結合していてもよく、結合していなくてもよい。R1及びR2が無機酸化物粒子の表面と結合している場合、単結合を示し、無機酸化物粒子表面と結合していない場合、それぞれ独立に、水素原子又は炭素数1〜5のアルキル基を示す。R3は−CH2−、−O−、−NH−、−NCH3−又−NC6H5−を示し、R4及びR5はそれぞれ独立に、水素原子、炭素数1〜5のアルキル基又は炭素数6〜12のアリール基を示す。Xはハロゲン原子を示し、ハロゲン原子としては、臭素原子、塩素原子及びヨウ素原子が挙げられる。nは1〜10の整数を示す。
In formula (1), R 1 and R 2 may be bonded to the surface of the inorganic oxide particles or may not be bonded. When R 1 and R 2 are bonded to the surface of the inorganic oxide particles, they represent a single bond, and when not bonded to the surface of the inorganic oxide particles, each independently represents a hydrogen atom or an alkyl having 1 to 5 carbon atoms. Indicates a group. R 3 represents —CH 2 —, —O—, —NH—, —NCH 3 — or —NC 6 H 5 —, wherein R 4 and R 5 each independently represent a hydrogen atom or an alkyl having 1 to 5 carbon atoms. Group or an aryl group having 6 to 12 carbon atoms. X represents a halogen atom, and examples of the halogen atom include a bromine atom, a chlorine atom, and an iodine atom. n shows the integer of 1-10.
式(2)中、R6は、一般式(1)で表される有機ケイ素基とは異なる有機ケイ素基を示し、ハロゲン原子を含んでいてもよい。R6は、下記一般式(3)で表される有機ケイ素基であることが好ましい。
In the formula (2), R 6 represents an organosilicon group different from the organosilicon group represented by the general formula (1), and may contain a halogen atom. R 6 is preferably an organosilicon group represented by the following general formula (3).
式(3)中、R7、R8及びR9は各々独立に水素原子又は炭素数1〜5のアルキル基を示す、ただし、R7、R8及びR9はのうち少なくとも一つは炭素数1〜5のアルキル基であり、炭素数1〜3のアルキル基であることが好ましい。また、アルキル基を構成する水素原子はハロゲン原子に置換されておいてもよい。
In formula (3), R 7 , R 8 and R 9 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, provided that at least one of R 7 , R 8 and R 9 is carbon. It is a C1-C5 alkyl group, and it is preferable that it is a C1-C3 alkyl group. Moreover, the hydrogen atom which comprises an alkyl group may be substituted by the halogen atom.
(有機ケイ素基)
本実施形態において、有機ケイ素基は、有機物とケイ素から構成される結合基であり、無機酸化物粒子表面に存在するものである。有機ケイ素基が結合される前の無機酸化物粒子の表面は、無機酸化物そのものから形成されていてもよいし、表面処理されていてもよい。ここでいう表面処理とは、化学反応、熱処理、光照射、プラズマ照射、放射線照射等により、無機酸化物粒子表面を官能基により修飾することである。
(Organosilicon base)
In this embodiment, the organosilicon group is a bonding group composed of an organic substance and silicon, and is present on the surface of the inorganic oxide particles. The surface of the inorganic oxide particle before the organosilicon group is bonded may be formed from the inorganic oxide itself or may be surface-treated. The surface treatment here is to modify the surface of the inorganic oxide particles with a functional group by chemical reaction, heat treatment, light irradiation, plasma irradiation, radiation irradiation or the like.
有機ケイ素基を無機酸化物粒子表面に結合させる方法としては、特に限定されるものではないが、例えば、無機酸化物粒子表面の水酸基と有機ケイ素化合物とを反応させる方法、又は無機酸化物粒子表面の表面処理により導入された官能基と有機ケイ素化合物とを反応させる方法がある。無機酸化物粒子に結合した有機ケイ素基に、更に有機ケイ素化合物を反応させて、複数の有機ケイ素基を連結することも可能である。また、有機ケイ素化合物の種類によっては、水や触媒を併用してもよい。 The method for bonding the organic silicon group to the surface of the inorganic oxide particle is not particularly limited. For example, the method of reacting the hydroxyl group on the surface of the inorganic oxide particle with the organic silicon compound, or the surface of the inorganic oxide particle There is a method of reacting a functional group introduced by the surface treatment with an organosilicon compound. It is also possible to link a plurality of organosilicon groups by further reacting an organosilicon compound with the organosilicon groups bonded to the inorganic oxide particles. Further, depending on the type of the organosilicon compound, water or a catalyst may be used in combination.
有機ケイ素化合物が無機酸化物粒子表面と結合する官能基の数は、特に限定されるものではないが、好ましくは1官能である。官能基が2個以上存在すると、有機ケイ素化合物の縮合物(副生物)が生成し、その除去が困難になる傾向にある。また、表面改質無機酸化物粒子を用いた有機無機複合粒子を膜状に成形する場合、有機無機複合粒子中に未反応の有機ケイ素化合物の官能基が残存するため、加熱乾燥、加熱加工する工程等によってはアルコール、水等の低沸点成分を生成し、膜が発泡する傾向にある。また、無機酸化物粒子が凝集する要因にもなりうる。 The number of functional groups that the organosilicon compound binds to the surface of the inorganic oxide particles is not particularly limited, but is preferably monofunctional. When two or more functional groups are present, a condensate (by-product) of the organosilicon compound is generated and tends to be difficult to remove. In addition, when the organic-inorganic composite particles using the surface-modified inorganic oxide particles are formed into a film shape, the functional groups of the unreacted organosilicon compound remain in the organic-inorganic composite particles, so heat drying and heat processing are performed. Depending on the process and the like, low-boiling components such as alcohol and water are generated, and the film tends to foam. Moreover, it can also become a factor which inorganic oxide particle aggregates.
有機ケイ素基は、重合開始基を有していることが好ましい。有機ケイ素基が有する重合開始基は、重合開始能を有する官能基であれば、特に限定されるものではない。例えば、ハロゲン原子を含む結合基が挙げられる。有機ハロゲン化合物を重合ラジカル開始剤とし、遷移金属錯体を触媒とする重合法を原子移動ラジカル重合(以下、「ATRP」)という。有機ケイ素基中ハロゲン原子の結合解離エネルギーは、低いことが好ましい。重合開始基は、例えば、3級炭素原子に結合したハロゲン原子、ビニル基、ビニリデン基及びフェニル基等の不飽和炭素−炭素結合に隣接する炭素原子に結合したハロゲン原子、カルボニル基、シアノ基及びスルホニル基等のヘテロ原子含有共役性基に直接結合するか又はこれらに隣接する原子に結合したハロゲン原子、が導入された基が、好ましい構造として挙げられる。より具体的には、下記一般式(4)で表される有機ハロゲン化物基が重合開始基として好適である。 The organosilicon group preferably has a polymerization initiating group. The polymerization initiating group possessed by the organosilicon group is not particularly limited as long as it is a functional group having polymerization initiating ability. For example, the coupling group containing a halogen atom is mentioned. A polymerization method using an organic halogen compound as a polymerization radical initiator and a transition metal complex as a catalyst is referred to as atom transfer radical polymerization (hereinafter referred to as “ATRP”). The bond dissociation energy of the halogen atom in the organosilicon group is preferably low. The polymerization initiating group includes, for example, a halogen atom bonded to a tertiary carbon atom, a halogen atom bonded to a carbon atom adjacent to an unsaturated carbon-carbon bond such as a vinyl group, a vinylidene group, and a phenyl group, a carbonyl group, a cyano group, and A group in which a halogen atom bonded directly to a hetero atom-containing conjugated group such as a sulfonyl group or bonded to an atom adjacent thereto is introduced as a preferable structure. More specifically, an organic halide group represented by the following general formula (4) is suitable as the polymerization initiating group.
式(4)中、R4、R5及びXは一般式(1)中のR4、R5及びXと同義である。
Wherein (4), R 4, R 5 and X are as in formula (1) the same meaning as R 4, R 5 and X in.
一般式(4)で示される重合開始基の具体例を下記化学式に示す。
すなわち、本実施形態に係る一般式(1)で表される有機ケイ素基は、重合開始基として一般式(4)で表される有機ハロゲン化物基を有する。 That is, the organosilicon group represented by the general formula (1) according to the present embodiment has an organic halide group represented by the general formula (4) as a polymerization initiating group.
一般式(1)で表される有機ケイ素基を有する有機ケイ素化合物の具体例としては、以下のようなシラン化合物がある。
・3−(2−ブロモイソブチロキシ)プロピルジメチルクロロシラン(Cas番号:370870−81−8)
・プロピオン酸,2−ブロモ−2−メチル−,3−(ジクロロメチルシリル)プロピル エステル(Cas番号:1057260−39−5)
・プロピオン酸,2−ブロモ−2−メチル−,3−(トリクロロシリル)プロピル エステル(Cas番号:688359−84−4)
・3−(メトキシジメチルシリルプロピル)−2−ブロモ−2−メチルプロピオネート(Cas番号:531505−27−8)
・3−(ジメトキシメチルシリルプロピル)−2−ブロモ−2−メチルプロピオネート(Cas番号:1186667−60−6)
・3−(トリメトキシシリルプロピル)−2−ブロモ−2−メチルプロピオネート(Cas番号:314021−97−1)
・(3−(2−ブロモイソブチリル)プロピル)ジメチルエトキシシラン(Cas番号:265119−86−6)
・(3−(2−ブロモイソブチリル)プロピル)メチルジエトキシシラン(Cas番号:1186667−65−1)
・プロピオン酸,2−ブロモ−2−メチル−,3−(トリエトキシシリル)プロピル エステル(Cas番号:880339−31−1)
・プロピオン酸,2−ブロモ−,3−(クロロジメチルシリル)プロピル エステル(Cas番号:438001−36−6)
・プロピオン酸,2−ブロモ−,3−(トリクロロシリル)プロピル エステル(Cas番号:663174−64−9)
・プロピオン酸,2−ブロモ−,3−(メトキシジメチルシリル)プロピル エステル(Cas番号:861807−46−7)
・(3−(2−ブロモプロピオニル)プロピル)ジメチルエトキシシラン(Cas番号:265119−85−5)
・(3−(2−ブロモプロピオニル)プロピル)トリエトキシシラン(Cas番号:1233513−06−8)
Specific examples of the organosilicon compound having an organosilicon group represented by the general formula (1) include the following silane compounds.
3- (2-Bromoisobutyroxy) propyldimethylchlorosilane (Cas number: 370870-81-8)
Propionic acid, 2-bromo-2-methyl-, 3- (dichloromethylsilyl) propyl ester (Cas number: 1057260-39-5)
Propionic acid, 2-bromo-2-methyl-, 3- (trichlorosilyl) propyl ester (Cas number: 688359-84-4)
3- (methoxydimethylsilylpropyl) -2-bromo-2-methylpropionate (Cas number: 531505-27-8)
3- (Dimethoxymethylsilylpropyl) -2-bromo-2-methylpropionate (Cas number: 1186667-60-6)
3- (Trimethoxysilylpropyl) -2-bromo-2-methylpropionate (Cas number: 314021-97-1)
(3- (2-Bromoisobutyryl) propyl) dimethylethoxysilane (Cas number: 265119-86-6)
(3- (2-Bromoisobutyryl) propyl) methyldiethoxysilane (Cas number: 11866667-65-1)
Propionic acid, 2-bromo-2-methyl-, 3- (triethoxysilyl) propyl ester (Cas number: 880339-31-1)
Propionic acid, 2-bromo-, 3- (chlorodimethylsilyl) propyl ester (Cas number: 438001-36-6)
Propionic acid, 2-bromo-, 3- (trichlorosilyl) propyl ester (Cas number: 663174-64-9)
Propionic acid, 2-bromo-, 3- (methoxydimethylsilyl) propyl ester (Cas number: 861807-46-7)
(3- (2-Bromopropionyl) propyl) dimethylethoxysilane (Cas number: 265119-85-5)
(3- (2-Bromopropionyl) propyl) triethoxysilane (Cas number: 1233513-06-8)
一般式(2)で表される有機ケイ素基を無機酸化物粒子の表面に形成できる有機ケイ素化合物として、一般式(3)で表される有機ケイ素基を有する化合物が挙げられ、具体例としては、以下のようなシラン化合物がある。
・ヘキサメチルジシラザン(Cas番号:999−97−3)
・N,N−ビス(トリメチルシリル)ウレア(Cas番号:18297−63−7)
・N,O−ビス(トリメチルシリル)トリフロロアセトアミド(Cas番号:25561−30−2)
・トリメチルシリルトリフロロメタンスルホネート(Cas番号:27607−77−8)
・トリエチルシラン(Cas番号:617−86−7)
・トリメチルシリルアセチレン(Cas番号:1066−54−2)
・ヘキサメチルジシラン(Cas番号:1450−14−2)
・アリルトリメチルシラン(Cas番号:762−72−1)
・トリメチルビニルシラン(Cas番号:754−05−2)
・メチルトリメトキシシラン(Cas番号:1185−55−3)
・ジメチルジメトキシシラン(Cas番号:1112−39−6)
・フェニルトリメトキシシラン(Cas番号:2996−92−1)
・メチルトリエトキシシラン(Cas番号:2031−67−6)
・ジメチルジエトキシシラン(Cas番号:78−62−6)
・フェニルトリエトキシシラン(Cas番号:780−69−8)
・ヘキシルトリメトキシシラン(Cas番号:3069−19−0)
・ヘキシルトリエトキシシラン(Cas番号:18166−37−5)
・デシルトリメトキシシラン(Cas番号:5575−48−4)
Examples of the organosilicon compound that can form the organosilicon group represented by the general formula (2) on the surface of the inorganic oxide particles include compounds having the organosilicon group represented by the general formula (3). There are the following silane compounds.
Hexamethyldisilazane (Cas number: 999-97-3)
N, N-bis (trimethylsilyl) urea (Cas number: 18297-63-7)
N, O-bis (trimethylsilyl) trifluoroacetamide (Cas number: 25561-30-2)
Trimethylsilyl trifluoromethanesulfonate (Cas number: 27607-77-8)
Triethylsilane (Cas number: 617-86-7)
Trimethylsilyl acetylene (Cas number: 1066-54-2)
Hexamethyldisilane (Cas number: 1450-14-2)
Allyltrimethylsilane (Cas number: 762-72-1)
Trimethylvinylsilane (Cas number: 754-05-2)
・ Methyltrimethoxysilane (Cas number: 1185-55-3)
Dimethyldimethoxysilane (Cas number: 1112-39-6)
Phenyltrimethoxysilane (Cas number: 2996-92-1)
・ Methyltriethoxysilane (Cas number: 2031-67-6)
Dimethyldiethoxysilane (Cas number: 78-62-6)
Phenyltriethoxysilane (Cas number: 780-69-8)
・ Hexyltrimethoxysilane (Cas number: 3069-19-0)
-Hexyltriethoxysilane (Cas number: 18166-37-5)
Decyltrimethoxysilane (Cas number: 5575-48-4)
表面改質無機酸化物粒子における一般式(1)で表される有機ケイ素基の修飾量は、無機酸化物粒子の単位面積当たり0.001〜0.5本/nm2であることが好ましく、0.005〜0.3本/nm2であることがより好ましく、0.01〜0.1本/nm2であることが更に好ましい。一般式(1)で表される有機ケイ素基の修飾量が上記範囲にあると、表面改質無機酸化物粒子の分散性が向上し、粒子の凝集が起こりにくくなる。 The modification amount of the organosilicon group represented by the general formula (1) in the surface-modified inorganic oxide particles is preferably 0.001 to 0.5 / nm 2 per unit area of the inorganic oxide particles, More preferably, it is 0.005 to 0.3 / nm 2 , and still more preferably 0.01 to 0.1 / nm 2 . When the modification amount of the organosilicon group represented by the general formula (1) is within the above range, the dispersibility of the surface-modified inorganic oxide particles is improved, and the particles are less likely to aggregate.
表面改質無機酸化物粒子における一般式(2)で表される有機ケイ素基の修飾量は、無機酸化物粒子の単位面積当たり1.5〜10本/nm2であることが好ましく、1.5〜7本/nm2であることがより好ましく、1.5〜5本/nm2であることが更に好ましい。一般式(2)で表される有機ケイ素基の修飾量が上記範囲にあると、表面改質無機酸化物粒子の分散性が向上し、粒子の凝集が起こりにくくなる。 The modification amount of the organosilicon group represented by the general formula (2) in the surface-modified inorganic oxide particles is preferably 1.5 to 10 / nm 2 per unit area of the inorganic oxide particles. It is more preferably 5-7 lines / nm 2 , and further preferably 1.5-5 lines / nm 2 . When the modification amount of the organosilicon group represented by the general formula (2) is in the above range, the dispersibility of the surface-modified inorganic oxide particles is improved, and the particles are less likely to aggregate.
一般式(1)又は(2)で表される有機ケイ素基がハロゲン原子を含む場合、有機ケイ素基の修飾量は、元素分析、後述する蛍光X線分析(XFR)等の方法によりハロゲン原子の含有量を測定することで算出することができる。一方、一般式(1)又は(2)で表される有機ケイ素基がハロゲン原子を含まない場合、有機ケイ素基の修飾量は、後述するX線電子分光分析(XPS)等の方法により表面改質無機酸化物粒子中の炭素の含有量を測定することで算出することができる。 When the organosilicon group represented by the general formula (1) or (2) contains a halogen atom, the modification amount of the organosilicon group is determined by the method of elemental analysis, fluorescent X-ray analysis (XFR) described later, or the like. It can be calculated by measuring the content. On the other hand, when the organosilicon group represented by the general formula (1) or (2) does not contain a halogen atom, the modification amount of the organosilicon group is modified by a method such as X-ray electron spectroscopy (XPS) described later. It can be calculated by measuring the carbon content in the porous inorganic oxide particles.
一般式(1)及び(2)で表される有機ケイ素基の修飾量は、無機酸化物粒子と有機ケイ素化合物とを反応させる際の有機ケイ素化合物の配合量、反応条件等により、適宜調整することができる。 The modification amount of the organosilicon group represented by the general formulas (1) and (2) is appropriately adjusted depending on the blending amount of the organosilicon compound, reaction conditions, and the like when the inorganic oxide particles and the organosilicon compound are reacted. be able to.
(無機酸化物粒子)
本明細書において、無機酸化物とは、1種類の無機成分及び酸素からなる酸化物、又は、2種類以上の無機成分及び酸素からなる複合酸化物である。複数種の元素は、粒子中に均一に存在していても、偏在していてもよく、ある元素の表面が別の元素の化合物によって被覆されていてもよい。また、無機成分とは、1族のアルカリ金属、2族のアルカリ土類金属、3〜12族の遷移金属、13〜15族の典型金属及びホウ素、ケイ素、ゲルマニウム等の半金属である。さらに2種以上の無機成分を含む複合酸化物においては、例えば、硫黄、リン、塩素等の非金属成分が含まれていてもよい。本実施形態に係る無機酸化物粒子としては、無機酸化物から形成された粒子であれば、特に限定されるものではないが、入手のし易さの観点から、酸化ケイ素、酸化チタン又は酸化ジルコニウムが好ましく、酸化ケイ素が特に好ましい。
(Inorganic oxide particles)
In this specification, an inorganic oxide is an oxide composed of one kind of inorganic component and oxygen, or a composite oxide composed of two or more kinds of inorganic components and oxygen. Plural kinds of elements may be present uniformly or unevenly in the particle, and the surface of one element may be covered with a compound of another element. The inorganic component is a group 1 alkali metal, a group 2 alkaline earth metal, a group 3-12 transition metal, a group 13-15 typical metal, and a semimetal such as boron, silicon, germanium, and the like. Furthermore, in the composite oxide containing two or more kinds of inorganic components, for example, nonmetallic components such as sulfur, phosphorus, and chlorine may be contained. The inorganic oxide particle according to the present embodiment is not particularly limited as long as it is a particle formed from an inorganic oxide, but from the viewpoint of easy availability, silicon oxide, titanium oxide, or zirconium oxide. Are preferred, and silicon oxide is particularly preferred.
無機酸化物粒子の形状や結晶形は、特に限定されるものではなく、例えば、球状、結晶状、鱗片状、柱状、管状、繊維状、中空状、多孔質状、数珠状等、様々な形状であってよい。中でも、市販されている中空状、数珠状又は球状の無機酸化物粒子を好適に使用できる。 The shape and crystal form of the inorganic oxide particles are not particularly limited. For example, various shapes such as spherical, crystalline, scale-like, columnar, tubular, fibrous, hollow, porous, beaded, etc. It may be. Among these, commercially available hollow, beaded, or spherical inorganic oxide particles can be suitably used.
無機酸化物粒子の粒径は、特に限定されるものではないが、1〜200nmが好ましい。本明細書において、粒径とは、粒子の外径の平均値をいう。光学材料用途として用いる場合、無機酸化物粒子の粒径が200nm以下であると、光の散乱などの問題が起こりにくく、粒径が1nm以上であると、無機酸化物粒子を構成する物質固有の特性を発揮できる。光学材料用途として、無機酸化物粒子の粒径は、より好ましくは1〜150nm、更に好ましくは10〜100nmである。特に、成膜性の高い有機無機複粒子、及びそれを利用したコーティング膜、成形体、光学材料等に透明性が要求される場合には、粒子の大きさがレイリー散乱領域に入る必要があるため、無機酸化物粒子の平均粒径は、10〜70nmであることがより一層好ましく、10〜60nmであることが特に好ましい。無機酸化物粒子の平均粒径の測定方法は、後述の実施例において詳細に説明される。 The particle size of the inorganic oxide particles is not particularly limited, but is preferably 1 to 200 nm. In the present specification, the particle diameter means an average value of the outer diameters of the particles. When used as an optical material application, when the particle size of the inorganic oxide particles is 200 nm or less, problems such as light scattering hardly occur, and when the particle size is 1 nm or more, it is specific to the substance constituting the inorganic oxide particles. The characteristics can be demonstrated. As an optical material application, the particle size of the inorganic oxide particles is more preferably 1 to 150 nm, and still more preferably 10 to 100 nm. In particular, when transparency is required for organic / inorganic double particles having high film formability, and coating films, molded products, optical materials and the like using the same, the size of the particles needs to be in the Rayleigh scattering region. Therefore, the average particle size of the inorganic oxide particles is more preferably 10 to 70 nm, and particularly preferably 10 to 60 nm. A method for measuring the average particle diameter of the inorganic oxide particles will be described in detail in Examples described later.
(表面改質無機酸化物粒子の製造方法)
本実施形態に係る表面改質無機酸化物粒子の製造方法は、特に限定されるものではないが、表面改質無機酸化物粒子は、例えば、無機酸化物粒子の表面に、重合開始基を有する有機ケイ素化合物及び重合開始基を有しない有機ケイ素化合物を結合させる工程により得ることができる。
(Method for producing surface-modified inorganic oxide particles)
The method for producing the surface-modified inorganic oxide particles according to the present embodiment is not particularly limited, but the surface-modified inorganic oxide particles have, for example, a polymerization initiating group on the surface of the inorganic oxide particles. It can be obtained by a step of bonding an organosilicon compound and an organosilicon compound having no polymerization initiating group.
無機酸化物粒子と特定の有機ケイ素化合物とを反応させることで、無機酸化物粒子の表面に一般式(1)及び(2)で表される有機ケイ素基が導入された表面改質無機酸化物粒子が得られる。無機酸化物粒子と特定の有機ケイ素化合物との反応は、これらが分散又は溶解する反応液中で行うことができ、加熱しながら反応を行ってもよい。 Surface-modified inorganic oxide in which organic silicon groups represented by general formulas (1) and (2) are introduced on the surface of inorganic oxide particles by reacting inorganic oxide particles with a specific organosilicon compound Particles are obtained. The reaction between the inorganic oxide particles and the specific organosilicon compound can be performed in a reaction liquid in which they are dispersed or dissolved, and the reaction may be performed while heating.
表面改質無機酸化物粒子は、以下のようにして作製してもよい。
(a)無機酸化物粒子の分散液に、重合開始基を有する有機ケイ素化合物を加え、所定の温度で反応させた後、重合開始基を有しない有機ケイ素化合物を加えて反応させて、表面改質無機酸化物粒子の分散液を得る。
(b)上記分散液を室温まで冷却した後、所定の溶媒で洗浄し、遠心分離等で固形分を分離・乾燥し、表面改質無機酸化物粒子を単離する。
The surface-modified inorganic oxide particles may be produced as follows.
(A) An organic silicon compound having a polymerization initiating group is added to the dispersion of inorganic oxide particles and reacted at a predetermined temperature, and then an organosilicon compound having no polymerization initiating group is added and reacted to cause surface modification. A dispersion of porous inorganic oxide particles is obtained.
(B) After cooling the dispersion to room temperature, it is washed with a predetermined solvent, and the solid content is separated and dried by centrifugation or the like to isolate the surface-modified inorganic oxide particles.
重合開始基を有する有機ケイ素化合物としては、一般式(4)で表される基を有する有機ケイ素化合物が挙げられ、重合開始基を有しない有機ケイ素化合物としては、一般式(3)で表される基を有する有機ケイ素化合物が挙げられる。 The organosilicon compound having a polymerization initiating group includes an organosilicon compound having a group represented by the general formula (4), and the organosilicon compound having no polymerization initiating group is represented by the general formula (3). And an organosilicon compound having a group.
無機酸化物粒子に対する有機ケイ素化合物の配合量は、特に限定されないが、一般式(1)で表される有機ケイ素基を有する有機ケイ素化合物の配合量は、無機酸化物粒子量100gに対して、0.0005mol〜1molが好ましく、0.0005mol〜0.5molがより好ましく、0.001mol〜0.2molが更に好ましい。一般式(1)で表される有機ケイ素基を有する有機ケイ素化合物の配合量が0.0005mol以上であれば、無機酸化物粒子の表面と効率よく反応しやすく、1mol以下であれば、反応液からの未反応の有機ケイ素化合物の除去が容易となる。 The compounding amount of the organosilicon compound with respect to the inorganic oxide particles is not particularly limited, but the compounding amount of the organosilicon compound having an organosilicon group represented by the general formula (1) is 100 g of the inorganic oxide particle amount, 0.0005 mol-1 mol is preferable, 0.0005 mol-0.5 mol is more preferable, 0.001 mol-0.2 mol is still more preferable. If the compounding amount of the organosilicon compound having an organosilicon group represented by the general formula (1) is 0.0005 mol or more, it easily reacts efficiently with the surface of the inorganic oxide particles. It becomes easy to remove the unreacted organosilicon compound from.
一般式(2)で表される有機ケイ素基を無機酸化物粒子の表面に形成できる有機ケイ素化合物の配合量は、特に限定されないが、無機酸化物粒子量100gに対して、0.01mol〜5molが好ましく、0.01mol〜2molがより好ましく、0.01mol〜1molが更に好ましい。一般式(2)で表される有機ケイ素基を無機酸化物粒子の表面に形成できる有機ケイ素化合物の配合量が0.001mol以上であれば、無機酸化物粒子の表面と効率よく反応しやすく、5mol以下であれば、未反応の有機ケイ素化合物が残留しにくくなる。 Although the compounding quantity of the organosilicon compound which can form the organosilicon group represented by General formula (2) on the surface of an inorganic oxide particle is not specifically limited, 0.01 mol-5 mol with respect to 100 g of inorganic oxide particle amounts Is preferable, 0.01 mol to 2 mol is more preferable, and 0.01 mol to 1 mol is still more preferable. If the compounding amount of the organosilicon compound capable of forming the organosilicon group represented by the general formula (2) on the surface of the inorganic oxide particles is 0.001 mol or more, it easily reacts efficiently with the surface of the inorganic oxide particles, If it is 5 mol or less, an unreacted organosilicon compound will hardly remain.
無機酸化物粒子と有機ケイ素化合物との反応温度は、常温でも反応が進むが、効率化の観点から、40℃〜90℃が好ましく、50℃〜90℃がより好ましく、60℃〜85℃が更に好ましい。 Although the reaction proceeds between the inorganic oxide particles and the organosilicon compound at room temperature, the reaction proceeds, but from the viewpoint of efficiency, 40 ° C to 90 ° C is preferable, 50 ° C to 90 ° C is more preferable, and 60 ° C to 85 ° C is more preferable. Further preferred.
表面改質無機酸化物粒子の凝集度は、5以下であることが好ましい。凝集度は、表面改質無機酸化物粒子の溶媒への再分散性を示し、無機酸化物粒子を有機無機複合化に用いる際に分散性の観点から、4以下がより好ましく、3以下が更に好ましい。 The aggregation degree of the surface-modified inorganic oxide particles is preferably 5 or less. The degree of aggregation indicates the redispersibility of the surface-modified inorganic oxide particles in the solvent, and is preferably 4 or less, more preferably 3 or less, from the viewpoint of dispersibility when the inorganic oxide particles are used for organic-inorganic composite. preferable.
<有機無機複合粒子の製造方法>
本実施形態に係る有機無機複合粒子は、上記表面改質無機酸化物粒子と、重合性モノマーとを触媒の存在下で重合する重合工程を備える方法により製造することができる。
<Method for producing organic-inorganic composite particles>
The organic-inorganic composite particles according to the present embodiment can be produced by a method including a polymerization step in which the surface-modified inorganic oxide particles and the polymerizable monomer are polymerized in the presence of a catalyst.
より具体的には、表面改質無機酸化物粒子を溶媒に分散させた後、重合性モノマー及び触媒を加え、所定の条件で重合反応を行い、上記重合開始基により開始される重合性モノマーのリビングラジカル重合により、無機酸化物粒子に結合しているポリマーを形成させ、有機無機複合粒子を得られる。 More specifically, after the surface-modified inorganic oxide particles are dispersed in a solvent, a polymerizable monomer and a catalyst are added, a polymerization reaction is performed under a predetermined condition, and the polymerizable monomer initiated by the polymerization initiating group is Organic radical composite particles can be obtained by forming a polymer bonded to inorganic oxide particles by living radical polymerization.
(重合性モノマー)
重合性モノマーは、特に限定されるものではないが、ATRPで重合可能であることが好ましい。モノマーは、1種を単独で又は2種以上の異なるものを用いてもよい。
(Polymerizable monomer)
The polymerizable monomer is not particularly limited, but is preferably polymerizable by ATRP. A single monomer may be used alone, or two or more different monomers may be used.
上記モノマーとしては、例えば、エチレン、「ブタ−1,3−ジエン、2−メチルブタ−1,3−ジエン、2−クロロブタ−1,3−ジエンのようなジエン類」、「スチレン、α−メチルスチレン、4−メチルスチレン、4−ヒドロキシスチレン、アセトキシスチレン、4−クロロメチルスチレン2,3,4,5,6−ペンタフルオロスチレン、4−アミノスチレンなどのスチレン類」、「アクリル酸メチル、アクリル酸エチル、アクリル酸n−ブチル、アクリル酸tert−ブチル、アクリル酸イソブチル、アクリル酸2−エチルヘキシル、アクリル酸オクチル、アクリル酸オクタデシル、アクリル酸シクロヘキシル、アクリル酸ベンジル、アクリル酸トリメチルシリル、アクリル酸アミド、アクリル酸2−(ジメチルアミノ)エチル、アクリル酸2,2,2−トリフルオロエチル、アクリル酸2,2,3,3,−テトラフルオロプロピル、アクリル酸1,1,1,3,3,3−ヘキサフルオロイソプロピル、アクリル酸1H,1H,2H,2H−ヘプタデカフルオロデシル、アクリル酸1H,1H,3H−ヘキサフルオロブチル、アクリル酸1H,1H,5H−オクタフルオロペンチル、アクリル酸1H,1H−ヘプタフルオロブチル、アクリル酸2−イソシアナトエチル、1,1−(ビスアクリロイルオキシメチル)エチルイソシアネートなどのアクリル酸エステル類」、「メタクリル酸メチル、メタクリル酸エチル、メタクリル酸n−ブチル、メタクリル酸tert−ブチル、メタクリル酸イソブチル、メタクリル酸2−エチルヘキシル、メタクリル酸オクチル、メタクリル酸オクタデシル、メタクリル酸シクロヘキシル、メタクリル酸ベンジル、メタクリル酸トリメチルシリル、メタクリル酸アミド、メタクリル酸2−(ジメチルアミノ)エチル、メタクリル酸2−(ジエチルアミノ)エチル、メタクリル酸2,2,2−トリフルオロエチル、メタクリル酸1H,1H,2H,2H−ヘプタデカフルオロデシル、メタクリル酸1H,1H,3H−ヘキサフルオロブチル、メタクリル酸2,2,3,3,−テトラフルオロプロピル、メタクリル酸1H,1H,5H−オクタフルオロペンチル、メタクリル酸1H,1H,7H−ドデカフルオロペンチル、メタクリル酸2−イソシアナトエチル、メタクリル酸2−(0−[1’−メチルプロピリデンアミノ]カルボキシアミノ)エチル、2−[(3,5−ジメチルピラゾリル)カルボニルアミノ]エチルメタクリレートなどのメタクリル酸エステル類」、「アクリル酸2−ヒドロキシエチル、アクリル酸2−ヒドロキシプロピル、アクリル酸3−ヒドロキシプロピル、アクリル酸2−ヒドロキシブチル、アクリル酸3−ヒドロキシブチル、アクリル酸4−ヒドロキシブチル、アクリル酸2−ヒドロキシヘキシル、アクリル酸6−ヒドロキシヘキシル、アクリル酸3−パーフルオロブチル−2−ヒドロキシプロピル、アクリル酸3−パーフルオロヘキシル−2−ヒドロキシプロピル、アクリル酸3−パーフルオロオクチル−2−ヒドロキシプロピル、メタクリル酸2−ヒドロキシエチル、メタクリル酸2−ヒドロキシプロピル、メタクリル酸3−ヒドロキシプロピル、メタクリル酸2−ヒドロキシブチル、メタクリル酸3−ヒドロキシブチル、メタクリル酸4−ヒドロキシブチル、メタクリル酸6−ヒドロキシヘキシル、メタクリル酸シクロヘキシル、メタクリル酸3−パーフルオロブチル−2−ヒドロキシプロピル、メタクリル酸3−パーフルオロヘキシル−2−ヒドロキシプロピル、メタクリル酸3−パーフルオロオクチル−2−ヒドロキシプロピル、アクリルアミド、メタクリルアミド、N−シクロプロピルアクリルアミド、N,N−ジメチルアクリルアミド、N−ヒドロキシメチルアクリルアミド、N−イソプロピルアクリルアミド、アクリロニトリル、メタクリロニトリルなどの(メタ)アクリル酸誘導体」、「酢酸ビニル、プロピオン酸ビニル、安息香酸ビニル、酪酸ビニルのようなビニルエステル類」、「ビニルメチルエーテル、ビニルエチルエーテルなどのビニルエーテル類」、「ビニルメチルケトン、ビニルヘキシルケトン、ビニルケトン類、N−ビニルピロール、N−ビニルカルバゾル、N−ビニルインドール、N−ビニルピロリドンなどのN−ビニル化合物」、「アリルアルコール、塩化アリル、酢酸アリル、塩化ビニル、塩化ビニリデンのようなアリル化合物」、「フッ化ビニル、フッ化ビニリデンなどのフッ素アルキル基を有する化合物」、「アクリル酸グリシジル、メタクリル酸グリシジル、4−グリシジルスチレン等の官能性モノマー類」、「アクリル酸アリル、メタクリル酸アリル、ジアクリル酸無水物、ジアクリル酸1,2−エタンジイル、トリアクリル酸ペンタエリスリトール、テトラアクリル酸ペンタエリスリトール、ジビニルベンゼンなどの反応性二重結合を二つ以上有する化合物」などが挙げられる。中でも、コーティング膜や成形体の透明性を特に重視する場合は、スチレン類、アクリル酸エステル又はメタクリル酸エステルを選択することが好ましい。 Examples of the monomer include ethylene, “dienes such as buta-1,3-diene, 2-methylbuta-1,3-diene, 2-chlorobuta-1,3-diene”, “styrene, α-methyl. Styrenes such as styrene, 4-methylstyrene, 4-hydroxystyrene, acetoxystyrene, 4-chloromethylstyrene 2,3,4,5,6-pentafluorostyrene, 4-aminostyrene "," methyl acrylate, acrylic Ethyl acid, n-butyl acrylate, tert-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, octadecyl acrylate, cyclohexyl acrylate, benzyl acrylate, trimethylsilyl acrylate, amide acrylate, acrylic Acid 2- (dimethylamino) ethyl, 2,2,2-trifluoroethyl laurate, 2,2,3,3-tetrafluoropropyl acrylate, 1,1,1,3,3,3-hexafluoroisopropyl acrylate, 1H, 1H acrylic acid , 2H, 2H-heptadecafluorodecyl, 1H, 1H, 3H-hexafluorobutyl acrylate, 1H, 1H, 5H-octafluoropentyl acrylate, 1H, 1H-heptafluorobutyl acrylate, 2-isocyanato acrylate Acrylic esters such as ethyl, 1,1- (bisacryloyloxymethyl) ethyl isocyanate ”,“ methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, tert-butyl methacrylate, isobutyl methacrylate, methacrylic acid 2 ” -Ethylhexyl, octyl methacrylate, methacryl Octadecyl acid, cyclohexyl methacrylate, benzyl methacrylate, trimethylsilyl methacrylate, methacrylic acid amide, 2- (dimethylamino) ethyl methacrylate, 2- (diethylamino) ethyl methacrylate, 2,2,2-trifluoroethyl methacrylate, 1H, 1H, 2H, 2H-heptadecafluorodecyl methacrylate, 1H, 1H, 3H-hexafluorobutyl methacrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 1H, 1H, 5H methacrylate Octafluoropentyl, 1H, 1H, 7H-dodecafluoropentyl methacrylate, 2-isocyanatoethyl methacrylate, 2- (0- [1′-methylpropylideneamino] carboxyamino) ethyl methacrylate, 2-[(3 , 5-Dimethylpyra Methacrylic acid esters such as “(yl) carbonylamino] ethyl methacrylate”, “2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 3-hydroxybutyl acrylate” 4-hydroxybutyl acrylate, 2-hydroxyhexyl acrylate, 6-hydroxyhexyl acrylate, 3-perfluorobutyl-2-hydroxypropyl acrylate, 3-perfluorohexyl-2-hydroxypropyl acrylate, acrylic acid 3-perfluorooctyl-2-hydroxypropyl, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, meta 3-hydroxybutyl toluate, 4-hydroxybutyl methacrylate, 6-hydroxyhexyl methacrylate, cyclohexyl methacrylate, 3-perfluorobutyl-2-hydroxypropyl methacrylate, 3-perfluorohexyl-2-hydroxypropyl methacrylate , 3-perfluorooctyl-2-hydroxypropyl methacrylate, acrylamide, methacrylamide, N-cyclopropylacrylamide, N, N-dimethylacrylamide, N-hydroxymethylacrylamide, N-isopropylacrylamide, acrylonitrile, methacrylonitrile, etc. (Meth) acrylic acid derivatives ”,“ vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate ”,“ vinyl methyl ether, vinyl Vinyl ethers such as ethyl ether ”,“ N-vinyl compounds such as vinyl methyl ketone, vinyl hexyl ketone, vinyl ketones, N-vinyl pyrrole, N-vinyl carbazole, N-vinyl indole, N-vinyl pyrrolidone ”,“ allyl ” "Allyl compounds such as alcohol, allyl chloride, allyl acetate, vinyl chloride, vinylidene chloride", "compounds having a fluorine alkyl group such as vinyl fluoride, vinylidene fluoride", "glycidyl acrylate, glycidyl methacrylate, 4-glycidyl Functional monomers such as styrene ”,“ reactivity of allyl acrylate, allyl methacrylate, diacrylic anhydride, 1,2-ethanediyl diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, divinylbenzene, etc. Compounds having a double bond two or more ", and the like. Among these, when importance is attached to the transparency of the coating film or the molded product, it is preferable to select styrenes, acrylic esters or methacrylic esters.
以下に、好ましい重合性モノマーの具体例を化学式で示す。 Specific examples of preferable polymerizable monomers are shown below by chemical formulas.
メタクリル酸エステル
Methacrylic acid ester
アクリル酸エステル
Acrylic ester
スチレン類
Styrenes
上記モノマーの重合形態は、特に限定されるものではないが、例えば、ホモ重合、ブロック共重合、ランダム共重合、グラジエント共重合、テーパード共重合又はグラフト共重合が挙げられる。中でも、Tgや屈折率等の物性制御の観点から、共重合が好ましく、より好ましくはグラフト共重合である。 The polymerization form of the monomer is not particularly limited, and examples thereof include homopolymerization, block copolymerization, random copolymerization, gradient copolymerization, tapered copolymerization, and graft copolymerization. Among these, from the viewpoint of controlling physical properties such as Tg and refractive index, copolymerization is preferable, and graft copolymerization is more preferable.
ラジカル重合の方式は特に限定されず、例えば、塊状重合法又は溶液重合法を選択できる。更に、生産性や安全性の観点から、懸濁重合、乳化重合、分散重合、シード重合等の方式を採用してもよい。 The method of radical polymerization is not particularly limited, and for example, a bulk polymerization method or a solution polymerization method can be selected. Furthermore, from the viewpoint of productivity and safety, methods such as suspension polymerization, emulsion polymerization, dispersion polymerization, and seed polymerization may be employed.
重合温度は、特に限定されるものではなく、重合方法やモノマー種に応じ、適宜、選択することができる。例えばATRPの場合、重合温度は好ましくは−50℃〜200℃、より好ましくは0℃〜150℃、更に好ましくは20℃〜130℃である。モノマーがアクリル酸エステル及び/又はメタクリル酸エステルを含む場合、40〜130℃で重合を行うと、比較的短時間で精密重合することができる。 The polymerization temperature is not particularly limited and can be appropriately selected according to the polymerization method and the monomer type. For example, in the case of ATRP, the polymerization temperature is preferably -50 ° C to 200 ° C, more preferably 0 ° C to 150 ° C, still more preferably 20 ° C to 130 ° C. When the monomer contains an acrylic ester and / or a methacrylic ester, when polymerization is carried out at 40 to 130 ° C., precise polymerization can be carried out in a relatively short time.
重合時間は、特に制限されるものではなく、重合方法やモノマー種に応じ、適宜、選択することができるが、例えば、1〜32時間とすることができる。重合時間がこの範囲内にあると、有機無機複合粒子における無機酸化物粒子の含有量が好ましいものとなる。同様の観点から、重合時間は、1.5〜24時間とすることがより好ましい。 The polymerization time is not particularly limited and can be appropriately selected depending on the polymerization method and the monomer type, and can be, for example, 1 to 32 hours. When the polymerization time is within this range, the content of the inorganic oxide particles in the organic-inorganic composite particles becomes preferable. From the same viewpoint, the polymerization time is more preferably 1.5 to 24 hours.
重合反応は、無溶媒で行っても、溶媒存在下で行ってもよい。溶媒を使用する場合、表面改質無機酸化物粒子の分散性と、重合触媒の溶解性とが良好な溶媒が好ましい。溶媒は単独で用いても、複数種を組み合わせて使用してもよい。 The polymerization reaction may be performed without a solvent or in the presence of a solvent. When using a solvent, a solvent having good dispersibility of the surface-modified inorganic oxide particles and solubility of the polymerization catalyst is preferable. A solvent may be used independently or may be used in combination of multiple types.
溶媒の種類は、特に限定されるものではないが、例えば、アセトン、メチルイソブチルケトン(MIBK)、メチルエチルケトン(MEK)、アニソール、トルエン、キシレン、テトラヒドロフラン(THF)、1−プロパノール、2−プロパノール、メタノール、エタノール、1−ブタノール、t−ブタノール、アセトニトリル、ジメチルホルムアミド(DMF)、ジメチルアセトアミド、ジメチルスルホキシド(DMSO)、N−メチルピロリドン、1,4−ジオキサン、水等が挙げられる。 The type of the solvent is not particularly limited. For example, acetone, methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), anisole, toluene, xylene, tetrahydrofuran (THF), 1-propanol, 2-propanol, methanol , Ethanol, 1-butanol, t-butanol, acetonitrile, dimethylformamide (DMF), dimethylacetamide, dimethyl sulfoxide (DMSO), N-methylpyrrolidone, 1,4-dioxane, water and the like.
溶媒の使用量は、特に限定されるものではないが、例えば、モノマー100質量部に対し、0〜2000質量部が好ましく、より好ましくは0〜1000質量部である。溶媒量が少ないと、反応速度が大きい傾向にあり有利であるが、モノマー種や重合条件によっては、重合溶液粘度が高くなる傾向にある。また、溶媒量が多いと、重合溶液粘度が低くなるが、反応速度が低下するため、適宜、配合比率を調整するのが好ましい。 Although the usage-amount of a solvent is not specifically limited, For example, 0-2000 mass parts is preferable with respect to 100 mass parts of monomers, More preferably, it is 0-1000 mass parts. If the amount of the solvent is small, the reaction rate tends to be large, which is advantageous, but depending on the monomer species and the polymerization conditions, the viscosity of the polymerization solution tends to increase. In addition, when the amount of the solvent is large, the viscosity of the polymerization solution is lowered, but the reaction rate is lowered.
重合反応は、無触媒で行っても、触媒を使用して行ってもよいが、生産性の観点から、触媒を使用することが好ましい。触媒の種類は、特に限定されるものではないが、重合方法やモノマー種等により、任意の触媒を適宜、使用すればよい。例えば、ATRPの場合、触媒の種類は、一般的に知られている各種のものの中から、重合方式等に応じて適宜選択すればよい。具体的には、例えば、Cu(0)、Cu+、Cu2+、Fe+、Fe2+、Fe3+、Ru2+又はRu3+を含む金属触媒を使用できる。中でも、分子量や分子量分布の高度な制御を達成するためには、特にCu+を含む1価の銅化合物及び0価の銅が好ましい。その具体例としては、Cu(0)、CuCl、CuBr、CuBr2、Cu2O等の銅触媒が挙げられる。これらは、単独で使用しても、複数を組み合わせて使用してもよい。触媒の使用量は、重合開始基1モルに対して、通常0.01〜100モル、好ましくは0.01〜50モル、更に好ましくは0.01〜10モルである。 The polymerization reaction may be performed without a catalyst or using a catalyst, but it is preferable to use a catalyst from the viewpoint of productivity. The type of the catalyst is not particularly limited, but any catalyst may be appropriately used depending on the polymerization method, the monomer type, and the like. For example, in the case of ATRP, the type of catalyst may be appropriately selected from various commonly known types according to the polymerization method and the like. Specifically, for example, a metal catalyst containing Cu (0), Cu + , Cu 2+ , Fe + , Fe 2+ , Fe 3+ , Ru 2+ or Ru 3+ can be used. Among these, in order to achieve a high degree of control of molecular weight and molecular weight distribution, a monovalent copper compound containing Cu + and zero-valent copper are particularly preferable. Specific examples thereof include copper catalysts such as Cu (0), CuCl, CuBr, CuBr 2 , and Cu 2 O. These may be used alone or in combination. The usage-amount of a catalyst is 0.01-100 mol normally with respect to 1 mol of polymerization start groups, Preferably it is 0.01-50 mol, More preferably, it is 0.01-10 mol.
<組成物>
本実施形態の組成物は、表面改質無機粒子及び有機無機複合粒子を含む混合物であり、他の樹脂に分散していてもよいし、また、溶媒中に分散していてもよいし、他の樹脂又は溶媒に溶解していてもよい。
<Composition>
The composition of the present embodiment is a mixture containing surface-modified inorganic particles and organic-inorganic composite particles, and may be dispersed in another resin, or may be dispersed in a solvent. It may be dissolved in the resin or solvent.
本実施形態の組成物中の表面改質無機粒子又は有機無機複合粒子が樹脂又は溶媒に溶解している場合、組成物中の均一性の点で好ましい。また、組成物は粉末状であってもよい。組成物が粉末状の場合、保存安定性の点で好ましい。 When the surface-modified inorganic particles or organic-inorganic composite particles in the composition of the present embodiment are dissolved in a resin or a solvent, it is preferable in terms of uniformity in the composition. The composition may be in the form of a powder. When the composition is in a powder form, it is preferable in terms of storage stability.
以下に本実施形態をより具体的に説明した実施例を例示する。ただし、本発明はその要旨を超えない限りにおいて以下の実施例に限定されるものではない。 Examples of the present embodiment will be described below more specifically. However, the present invention is not limited to the following examples as long as the gist thereof is not exceeded.
<原材料>
参考例、実施例及び比較例で使用した原材料の内容を(1)〜(2)に示す。
<Raw materials>
The contents of the raw materials used in the reference examples, examples and comparative examples are shown in (1) to (2).
(1)無機酸化物粒子溶液
20nm球状シリカ溶液:日産化学工業株式会社製、商品名「MEK−ST」、SiO2含有量30質量%、比表面積220m2/g(窒素吸着によるBET法で測定)
(1) Inorganic oxide particle solution 20 nm spherical silica solution: manufactured by Nissan Chemical Industries, Ltd., trade name “MEK-ST”, SiO 2 content 30 mass%, specific surface area 220 m 2 / g (measured by BET method by nitrogen adsorption) )
(2)有機ケイ素化合物
(2−1)(3−(2−ブロモイソブチリル)プロピル)ジメチルエトキシシラン(以下、BIDSという。)
公知の方法(特開−2006−257308号)に従って、下記化学式(5)で表されるBIDSを合成した。
BIDS represented by the following chemical formula (5) was synthesized according to a known method (Japanese Patent Laid-Open No. 2006-257308).
(2−2)1,1,1,3,3,3−ヘキサメチルジシラザン(以下、HMDSという。):東京化成工業株式会社製。 (2-2) 1,1,1,3,3,3-hexamethyldisilazane (hereinafter referred to as HMDS): manufactured by Tokyo Chemical Industry Co., Ltd.
[表面改質無機酸化物粒子の合成]
(参考例1)
冷却管を接続し、回転子を入れた二口フラスコの内部を、窒素置換した。窒素下で、フラスコ内に20nm球状シリカ溶液を500g導入し、更に、2.9mLのBIDSを導入し、攪拌を開始した。フラスコを80℃のオイルバスに浸し、攪拌しながら2時間反応を行った。反応液を室温まで冷却した後、窒素下で43.0mLのHMDSを導入した。室温で2時間攪拌後、80℃で3時間攪拌して反応を行い、反応液を室温まで冷却した。反応液をヘキサンに投入後、遠沈管に移し、遠心分離機(株式会社久保田製作所製、型式:7700)を用いて、10000rpm、10℃で、30分間、遠心分離を行った。遠沈管内の沈殿物を少量のTHFで溶解させて、更にヘキサンに投入後、遠心分離を行なった。遠沈管内の沈殿物を、真空乾燥機(アドバンテック社製 DRV320DA)を用いて真空下(5kPa以下)、60℃で24時間乾燥させて、粉末状の表面改質無機酸化物粒子を得た。
[Synthesis of surface modified inorganic oxide particles]
( Reference Example 1)
A condenser tube was connected, and the inside of the two-necked flask containing the rotor was purged with nitrogen. Under nitrogen, 500 g of a 20 nm spherical silica solution was introduced into the flask, and 2.9 mL of BIDS was further introduced, and stirring was started. The flask was immersed in an 80 ° C. oil bath and reacted for 2 hours with stirring. After the reaction was cooled to room temperature, 43.0 mL of HMDS was introduced under nitrogen. After stirring at room temperature for 2 hours, the reaction was performed by stirring at 80 ° C. for 3 hours, and the reaction solution was cooled to room temperature. The reaction solution was poured into hexane, transferred to a centrifuge tube, and centrifuged at 10,000 rpm, 10 ° C. for 30 minutes using a centrifuge (Model: 7700, manufactured by Kubota Corporation). The precipitate in the centrifuge tube was dissolved in a small amount of THF, and further poured into hexane, followed by centrifugation. The precipitate in the centrifuge tube was dried under vacuum (5 kPa or less) at 60 ° C. for 24 hours using a vacuum dryer (Advantech DRV320DA) to obtain powdery surface-modified inorganic oxide particles.
(参考例5、実施例2〜4,6〜7、比較例1)
表1に示す組成に変更した以外は、参考例1と同様の方法で表面改質無機酸化物粒子を得た。
( Reference Example 5, Examples 2 to 4, 6 to 7, Comparative Example 1)
Surface-modified inorganic oxide particles were obtained in the same manner as in Reference Example 1 except that the composition was changed to the composition shown in Table 1.
表面改質無機酸化物粒子の物性の評価は以下の手順で行った。 The physical properties of the surface modified inorganic oxide particles were evaluated by the following procedure.
<表面改質無機酸化物粒子の分析>
(一般式(1)で表される有機ケイ素基の修飾量)
表面改質無機酸化物粒子中のハロゲン原子の量(質量%)を蛍光X線分析(XRF)装置(株式会社リガク製、商品名「ZSX」)を用いて測定し、無機酸化物粒子単位表面積当たりの一般式(1)で表される有機ケイ素基の修飾量を、以下の式より算出した。
(1)一般式(1)で表される有機ケイ素基の修飾量(本)=表面改質酸化物粒子量(g)×(表面改質無機酸化物粒子中のBr量(質量%)÷100÷79.9+表面改質無機酸化物粒子中のCl量(質量%)÷100÷35.5)×6.022×1023
(2)無機酸化物粒子の表面積(nm2)=無機酸化物粒子量(g)×無機酸化物粒子の比表面積(m2/g)×1018
(3)無機酸化物粒子単位表面積当たりの一般式(1)で表される有機ケイ素基の修飾量(本/nm2)=(1)÷(2)
<Analysis of surface-modified inorganic oxide particles>
(Modification amount of organosilicon group represented by general formula (1))
The amount (% by mass) of halogen atoms in the surface-modified inorganic oxide particles was measured using a fluorescent X-ray analysis (XRF) apparatus (trade name “ZSX” manufactured by Rigaku Corporation), and the unit surface area of the inorganic oxide particles The amount of modification of the organosilicon group represented by the general formula (1) per hit was calculated from the following formula.
(1) Modification amount of the organosilicon group represented by the general formula (1) (present) = surface modified oxide particle amount (g) × (Br content in surface modified inorganic oxide particles (mass%) ÷ 100 ÷ 79.9 + Cl amount (mass%) in the surface-modified inorganic oxide particles ÷ 100 ÷ 35.5) × 6.022 × 10 23
(2) Surface area of inorganic oxide particles (nm 2 ) = Amount of inorganic oxide particles (g) × Specific surface area of inorganic oxide particles (m 2 / g) × 10 18
(3) Modification amount of the organosilicon group represented by the general formula (1) per unit surface area of the inorganic oxide particles (lines / nm 2 ) = (1) ÷ (2)
(一般式(2)で表される有機ケイ素基の修飾量)
表面改質無機酸化物粒子中のC量をX線光電子分光分析(XPS)装置(サーモフィッシャーサイエンティフィック株式会社、商品名「ESCALAB250」)を用いて測定し、無機酸化物粒子単位表面積当たりの一般式(2)で表される有機ケイ素基の数(本/nm2)を以下の式より算出した。
(1)一般式(2)で表される有機ケイ素基由来のC量(質量%)=表面改質無機酸化物粒子中の全C量(質量%)−一般式(1)で表される有機ケイ素基由来のC量(質量%)
(2)表面改質無機酸化物粒子単位表面積当たりの一般式(2)で表される有機ケイ素基の数(本)=表面改質無機酸化物粒子量(g)×(1)÷100÷12÷3×6.022×1023
(3)無機酸化物粒子の表面積(nm2)=無機酸化物粒子量(g)×無機酸化物粒子の比表面積(m2/g)×1018
(4)無機酸化物粒子単位表面積当たりの一般式(2)で表される有機ケイ素基の数(本/nm2)=(2)÷(3)
(Modification amount of organosilicon group represented by general formula (2))
The amount of C in the surface-modified inorganic oxide particles was measured using an X-ray photoelectron spectroscopic analysis (XPS) apparatus (Thermo Fisher Scientific Co., Ltd., trade name “ESCALAB250”). The number of organosilicon groups (lines / nm 2 ) represented by the general formula (2) was calculated from the following formula.
(1) The amount of C derived from the organosilicon group represented by the general formula (2) (% by mass) = the total amount of C in the surface-modified inorganic oxide particles (% by mass) −the general formula (1) C amount derived from organosilicon group (mass%)
(2) Surface-modified inorganic oxide particles Number of organosilicon groups represented by general formula (2) per unit surface area (number) = surface-modified inorganic oxide particle amount (g) × (1) ÷ 100 ÷ 12 ÷ 3 × 6.022 × 10 23
(3) Surface area of inorganic oxide particles (nm 2 ) = Amount of inorganic oxide particles (g) × Specific surface area of inorganic oxide particles (m 2 / g) × 10 18
(4) Number of organosilicon groups represented by the general formula (2) per unit surface area of the inorganic oxide particles (lines / nm 2 ) = (2) ÷ (3)
(分散粒子径)
ガラス製の20cc小瓶中で、表面改質無機酸化物粒子1gをメチルエチルケトン5.6gに添加し、マグネチックスターラーで30分間混合した後、動的光散乱法(濃厚系粒径アナライザーFPAR−1000)により表面改質無機酸化物粒子の分散粒子径を測定した。
(Dispersed particle size)
In a 20 cc glass bottle, 1 g of surface-modified inorganic oxide particles are added to 5.6 g of methyl ethyl ketone, mixed for 30 minutes with a magnetic stirrer, and then subjected to dynamic light scattering (concentrated particle size analyzer FPAR-1000). Was used to measure the dispersed particle size of the surface-modified inorganic oxide particles.
(凝集度)
上述のようにして表面改質無機酸化物粒子の分散粒子径(A)を測定した後、一度、60℃で24時間真空乾燥させた表面改質無機酸化物粒子を再びメチルエチルケトン5.6gに再分散させた後の分散粒子径(B)を測定した。凝集度は、分散粒子径(B)を分散粒子径(A)で割った値である。
(Degree of aggregation)
After measuring the dispersed particle diameter (A) of the surface-modified inorganic oxide particles as described above, the surface-modified inorganic oxide particles once vacuum-dried at 60 ° C. for 24 hours were again converted to 5.6 g of methyl ethyl ketone. The dispersed particle diameter (B) after the dispersion was measured. The degree of aggregation is a value obtained by dividing the dispersed particle size (B) by the dispersed particle size (A).
(溶媒分散性)
あらかじめ重さを測定したガラス製の20cc小瓶中で、表面改質無機酸化物粒子0.5gをメチルエチルケトン2.0gに添加し、マグネッチックスターラーで30分間混合した後、1時間静置し、沈殿物の有無を評価した。沈殿が生じた場合、パスツールピペットで上澄み液を除去し、沈殿物が残ったままのガラス製の20cc小瓶を60℃で1時間真空乾燥させた後、小瓶の重さを測定し、事前に測定した小瓶の重さから差し引くことで沈殿物の重さを求めた。溶媒中に沈殿物がない場合を○、沈殿物があり沈殿物の重さが0.15g以下の場合を△、沈殿物の重さが0.15gより重い場合を×とした。
(Solvent dispersibility)
In a 20 cc glass bottle weighed in advance, 0.5 g of surface-modified inorganic oxide particles were added to 2.0 g of methyl ethyl ketone, mixed for 30 minutes with a magnetic stirrer, allowed to stand for 1 hour, and precipitated. The presence or absence of objects was evaluated. If precipitation occurs, remove the supernatant with a Pasteur pipette, dry the glass 20cc vial with the precipitate remaining at 60 ° C for 1 hour, then weigh the vial. The weight of the precipitate was determined by subtracting from the measured weight of the vial. The case where there was no precipitate in the solvent was marked as ◯, the case where there was a precipitate and the weight of the precipitate being 0.15 g or less, Δ, and the case where the weight of the precipitate was heavier than 0.15 g, was marked as x.
[有機無機複合粒子の作製]
溶媒としてアセトンを、重合性モノマーとしてメタクリル酸メチル(以下、MMA)を、触媒としてCuBrを準備し、有機無機複合粒子を以下の手順で作製した。
(1)回転子を入れたシュレンクフラスコに、29mgのCuBrを加え、フラスコ内部を真空処理してから窒素置換する操作を3回繰り返して、フラスコ内を脱酸素した後、アセトンを100mL窒素下で導入し、攪拌した。
(2)(1)の溶液に、30mgのN,N,N’,N'',N''−ペンタメチルジエチレントリアミン(PMDETA、Aldrich社製)を加え、攪拌したものを触媒溶液とした。
(3)回転子を入れた別のシュレンクフラスコに、表面改質無機酸化物粒子を5.0g投入した後、フラスコ内部を真空処理してから窒素置換する操作を3回繰り返して、フラスコ内を脱酸素した。
(4)(3)のフラスコに、窒素下でアセトンを10mL導入し、更にMMAを8mL導入し、50℃のオイルバスで加熱しながら攪拌した後、(2)で調製した触媒溶液10mLを窒素下で導入し、反応液を攪拌し重合反応を行った。
(5)1時間後に反応液中の組成分析をGC測定より行い、MMAが消費されているかを確認し、重合が進行し、有機無機複合粒子の作製を判断した。
表面改質無機酸化物粒子の分散性が良好なままMMAの重合が進行したものを○、MMAの重合が進行するものの、重合に伴い表面改質無機酸化物粒子の分散性が悪くなるものを△、MMAの重合が進行しないものを×とした。
[Production of organic-inorganic composite particles]
Acetone as a solvent, methyl methacrylate (hereinafter referred to as MMA) as a polymerizable monomer, and CuBr as a catalyst were prepared, and organic-inorganic composite particles were produced by the following procedure.
(1) Add 29 mg of CuBr to a Schlenk flask containing a rotor, vacuum the inside of the flask, and then replace with nitrogen three times to deoxygenate the flask, and then add acetone to 100 mL of nitrogen. Introduced and stirred.
(2) To the solution of (1), 30 mg of N, N, N ′, N ″, N ″ -pentamethyldiethylenetriamine (PMDETA, manufactured by Aldrich) was added and stirred to obtain a catalyst solution.
(3) Into another Schlenk flask containing a rotor, 5.0 g of surface-modified inorganic oxide particles were added, and then the inside of the flask was vacuumed and then purged with nitrogen three times. Deoxygenated.
(4) Into the flask in (3), 10 mL of acetone was introduced under nitrogen, and further 8 mL of MMA was introduced and stirred while heating in an oil bath at 50 ° C. Then, 10 mL of the catalyst solution prepared in (2) was added to nitrogen. The reaction solution was stirred and the polymerization reaction was carried out.
(5) After 1 hour, composition analysis in the reaction solution was performed by GC measurement to confirm whether MMA was consumed, polymerization proceeded, and preparation of organic-inorganic composite particles was judged.
MMA where the polymerization of MMA has progressed while the dispersibility of the surface-modified inorganic oxide particles is good, while the polymerization of MMA progresses, but the dispersibility of the surface-modified inorganic oxide particles becomes worse with polymerization Δ, where MMA polymerization did not proceed was marked as x.
参考例、実施例及び比較例で作製した表面改質無機酸化物粒子の評価結果を表2に示す。
Table 2 shows the evaluation results of the surface-modified inorganic oxide particles prepared in Reference Examples, Examples and Comparative Examples.
表2より、本発明の表面改質無機酸化物粒子は、凝集度が低く、分散性に優れることが確認できる。 From Table 2, it can be confirmed that the surface-modified inorganic oxide particles of the present invention have a low degree of aggregation and excellent dispersibility.
本発明によれば、分散性に優れた表面改質無機酸化物粒子が得られ、該表面改質無機酸化物粒子にポリマーが結合した有機無機複合粒子を作製することができる。また、有機無機複合粒子は、将来ナノ光学材料として有望なフォトニック結晶を構築することが可能となる。 According to the present invention, surface-modified inorganic oxide particles having excellent dispersibility can be obtained, and organic-inorganic composite particles in which a polymer is bonded to the surface-modified inorganic oxide particles can be produced. Moreover, the organic-inorganic composite particles can construct a photonic crystal that is promising as a nano-optical material in the future.
Claims (11)
前記無機酸化物粒子の単位面積当たりの前記一般式(1)で表される有機ケイ素基の修飾量が、0.001〜0.045本/nm2であり、前記一般式(2)で表される有機ケイ素基の修飾量が、1.5本/nm2〜10本/nm2である、表面改質無機酸化物粒子。
[式(1)中、R1及びR2はそれぞれ独立に、無機酸化物粒子の表面と結合する単結合、水素原子又は炭素数1〜5のアルキル基を示し、R3は−CH2−、−O−、−NH−、−NCH3−又−NC6H5−を示し、R4及びR5はそれぞれ独立に、水素原子、炭素数1〜5のアルキル基又は炭素数6〜12のアリール基を示し、Xはハロゲン原子を示し、nは1〜10の整数を示す。]
[式(2)中、R6は、前記一般式(1)で表される有機ケイ素基とは異なる有機ケイ素基を示し、ハロゲン原子を含んでいてもよい。] The surface of the inorganic oxide particles has an organosilicon group represented by the following general formula (1) and an organosilicon group represented by the following general formula (2),
The modification amount of the organosilicon group represented by the general formula (1) per unit area of the inorganic oxide particles is 0.001 to 0.045 / nm 2 and is represented by the general formula (2). Surface-modified inorganic oxide particles in which the amount of the modified organosilicon group is 1.5 / nm 2 to 10 / nm 2 .
[In Formula (1), R 1 and R 2 each independently represent a single bond, a hydrogen atom or an alkyl group having 1 to 5 carbon atoms bonded to the surface of the inorganic oxide particle, and R 3 represents —CH 2 —. , —O—, —NH—, —NCH 3 — or —NC 6 H 5 —, wherein R 4 and R 5 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or 6 to 12 carbon atoms. X represents a halogen atom, and n represents an integer of 1 to 10. ]
[In Formula (2), R 6 represents an organosilicon group different from the organosilicon group represented by Formula (1), and may contain a halogen atom. ]
[式(3)中、R7、R8及びR9は各々独立に水素原子又は炭素数1〜5のアルキル基を示し、R7、R8及びR9はのうち少なくとも一つは炭素数1〜5のアルキル基である。] The surface-modified inorganic oxide particles according to claim 1, wherein R 6 is an organosilicon group represented by the following general formula (3).
[In the formula (3), R 7 , R 8 and R 9 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and at least one of R 7 , R 8 and R 9 is the number of carbon atoms. 1 to 5 alkyl groups. ]
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